TWI491075B - Led package structure for adjusting spatial color uniformity and light distribution curve - Google Patents

Description

Light-emitting diode package for adjusting spatial color uniformity and light distribution curve Structure

The invention relates to a light emitting diode package structure, in particular to a light emitting diode package structure for adjusting spatial color uniformity and light distribution curve.

According to the invention, the invention of the electric lamp can completely change the way of life of all human beings. If there is no electric light in our life, when the weather or the weather is not good, all the work will be stopped; if it is limited by lighting, it is very likely If the building style or the human lifestyle is completely changed, all human beings will not be able to make progress and continue to stay in a relatively backward era.

Compared with the traditional light source, the light-emitting diode (LED) has the advantages of small volume, power saving, good luminous efficiency, long life, fast reaction speed, and no pollution of toxic substances such as heat radiation and mercury. In recent years, the application of light-emitting diodes has been extremely extensive. In the past, the brightness of the light-emitting diodes could not replace the traditional illumination source. However, with the continuous improvement of the technical field, high-power light-emitting diodes with high illumination brightness have been developed, which is sufficient to replace the traditional illumination source. However, the spatial color uniformity and the light distribution curve that can be exhibited by the conventional LED package structure cannot be optimized and cannot be adjusted according to different needs. Therefore, how to obtain the desired spatial color uniformity and light distribution curve by the design of the structure has become an important issue for the business personnel to solve.

Embodiments of the present invention provide a light emitting diode package structure that can adjust a spatial color uniformity and a light distribution curve that can be presented through a non-equal thickness fluorescent colloid.

An embodiment of the present invention provides a light emitting diode package structure for adjusting spatial color uniformity and light distribution curve, comprising: a substrate unit, a light emitting unit, a transparent package unit, and a fluorescent package unit. A substrate unit includes at least one substrate body; the light emitting unit includes at least one light emitting element disposed on the substrate body and electrically connected to the substrate body, wherein the light emitting source generated by the light emitting element exhibits a specific light distribution curve. The transparent package unit comprises a transparent encapsulant formed on the substrate body and covering the light-emitting component, wherein the upper surface of the transparent encapsulant is a fixed arc surface, and the transparent encapsulant is a thickness-fixed transparent colloid. The light source generated by the light emitting element passes through the transparent encapsulant to form a passing light source, and a specific light distribution curve is presented through the light source. The fluorescent package unit comprises a fluorescent encapsulant formed on the substrate body and covering the transparent encapsulant, wherein the upper surface of the fluorescent encapsulant is adjusted according to the specific light distribution curve exhibited by the emission source or the light source. The curved surface can be adjusted, and the thickness of the fluorescent encapsulant is adjusted according to the height of the adjustable curved surface relative to the substrate body, so that the fluorescent encapsulant forms a non-equal thick fluorescent colloid. The emission light source generated by the light-emitting element sequentially passes through the transparent encapsulant and the fluorescent encapsulant to form a projection light source, and the spatial color uniformity and the light distribution curve of the projection light source are adjusted according to the non-equal thickness fluorescent colloid.

Another embodiment of the present invention provides a light emitting diode package structure for adjusting spatial color uniformity and light distribution curve, comprising: a substrate unit, a light emitting unit, a transparent package unit, and a fluorescent package unit. The substrate unit includes at least one substrate body. The light emitting unit includes at least one light emitting element disposed on the substrate body and electrically connected to the substrate body. The transparent package unit includes a surface formed on the substrate body and covering the light emitting element The encapsulating colloid, wherein the emitting light source generated by the illuminating element passes through the transparent encapsulant to form a passing light source, and the light source exhibits a specific light distribution curve, wherein the upper surface of the transparent encapsulant is based on the specific light distribution curve. The adjustable arc surface can be adjusted, and the transparent encapsulant is a thickness adjustable transparent colloid. The fluorescent package unit comprises a fluorescent encapsulant formed on the substrate body and covering the transparent encapsulant. The upper surface of the fluorescent encapsulant is a fixed arc surface, and the thickness of the fluorescent encapsulant is according to the transparent encapsulant. The height of the curved surface relative to the substrate body is adjusted to adjust so that the fluorescent encapsulant forms a non-equal thick phosphor colloid. The emission light source generated by the light-emitting element sequentially passes through the transparent encapsulant and the fluorescent encapsulant to form a projection light source, and the spatial color uniformity and the light distribution curve of the projection light source are adjusted according to the non-equal thickness fluorescent colloid.

In summary, the LED package structure provided by the embodiment of the present invention can transmit the "non-equal thickness of the phosphor colloid" to make the space color of the LED package structure of the present invention. The uniformity and light distribution curve can be arbitrarily adjusted with non-equal thickness phosphor colloids.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

[First Embodiment]

1A to 1C, FIG. 1A is a side cross-sectional view of a semi-finished product, FIG. 1B is a side cross-sectional view of the finished product, and FIG. 1C is a color space distribution diagram for displaying spatial color uniformity. 1D is a light distribution curve diagram for displaying a light distribution curve. First embodiment of the present invention A light emitting diode package structure Z for adjusting a spatial color uniformity and a light distribution curve includes: a substrate unit 1, a light emitting unit 2, a transparent package unit 3, and a fluorescent package unit 4.

First, the substrate unit 1 includes at least one substrate body 10. For example, the substrate body 10 can be a circuit substrate having a plurality of conductive lines (not shown) on its upper surface.

In addition, the light-emitting unit 2 includes at least one light-emitting element 20 disposed on the substrate body 10 and electrically connected to the substrate body 10. The light-emitting source L1 generated by the light-emitting element 20 can present a specific configuration. Light curve (this light distribution curve can display different luminous intensity (lm/sr or candela) corresponding to different illumination angles. Of course, according to different design requirements, the illumination unit 2 of the present invention may also include A plurality of light emitting elements 20 are simultaneously disposed on the substrate body 10 and electrically connected to the substrate body 10. For example, the light emitting element 20 can be a blue LED bare die and emit light. The component 20 can be electrically connected to the substrate body 10 by wire-bonding or flip-chip.

In addition, the transparent package unit 3 includes a transparent encapsulant 30 (shown in FIG. 1A ) formed on the substrate body 10 and covering the light-emitting component 20 , wherein the upper surface of the transparent encapsulant 30 is a fixed arc surface 300A and is transparently packaged. The colloid 30 is a thickness-fixed transparent colloid that does not require thickness adjustment. According to different design requirements, the transparent encapsulant 30 can be a transparent colloid formed by the silicone 30A or the epoxy 30B. For example, a liquid silicone resin or a liquid epoxy resin may be formed on the substrate body 10 by a stamper to cover the light-emitting element 20, and then the liquid silicone resin or the liquid epoxy resin may be cured by baking, and finally Can complete the above by silicone 30A Or a transparent encapsulant 30 formed by epoxy resin 30B.

In addition, the fluorescent package unit 4 includes a fluorescent encapsulant 40 (shown in FIG. 1B) formed on the substrate body 10 and covering the transparent encapsulant 30. The upper surface of the fluorescent encapsulant 40 is capable of being emitted according to the above. The adjustable arc surface 400A is adjusted by a specific light distribution curve represented by the light source L1, and the thickness of the fluorescent encapsulant 40 is adjusted according to the height of the adjustable curved surface 400A relative to the substrate body 10, so that the The light encapsulating colloid 40 can form a non-equal thick phosphor colloid. According to different design requirements, the fluorescent encapsulant 40 can be a phosphor colloid formed by mixing the silicone 40A and the plurality of fluorescent particles 40C or mixing the epoxy 40B and the plurality of fluorescent particles 40C with each other. For example, a liquid silicone or a liquid epoxy resin mixed with a plurality of fluorescent particles 40C may be formed on the substrate body 10 by a stamper to cover the transparent encapsulant 30, and then cured by baking. The liquid silicone or liquid epoxy resin mixed with the plurality of fluorescent particles 40C is finally mixed with the silicone 40A and the plurality of fluorescent particles 40C or the epoxy resin 40B and the plurality of fluorescent particles 40C are mutually mixed. The formed fluorescent encapsulant 40 is mixed.

Therefore, the light source L1 generated by the light-emitting element 20 sequentially passes through the transparent encapsulant 30 and the fluorescent encapsulant 40 to form a projection light source L3 (as shown in FIG. 1B), and the space of the light-projecting source L3. The color uniformity and the light distribution curve are adjusted according to the above-mentioned non-equal thickness fluorescent colloid. In other words, when the light source L1 generated by the light-emitting element 20 sequentially passes through the transparent encapsulant 30 and the fluorescent encapsulant 40, a projection light source that is projected outward from the adjustable arc surface 400A of the fluorescent encapsulant 40 can be generated. L3. In addition, since the thickness of the fluorescent encapsulant 40 can be adjusted according to the height of the adjustable curved surface 400A relative to the substrate body 10 Therefore, the designer can adjust the spatial color uniformity (shown in FIG. 1C) and the light distribution curve (as shown in FIG. 1D) of the projection light source L3 according to the above-mentioned non-equal thickness fluorescent colloid.

For example, first, the designer can electrically connect the light emitting element 20 to the substrate body 10 first. Then, a specific light distribution curve is obtained by the emission light source L1 generated by the light-emitting element 20. Next, the transparent encapsulant 30 covers the light emitting element 20, and the fluorescent encapsulant 40 covers the transparent encapsulant 30. Next, the thickness of the fluorescent encapsulant 40 can be adjusted according to the height of the adjustable cam surface 400A relative to the substrate body 10, so that the fluorescent encapsulant 40 forms a non-equal thick phosphor colloid. For example, as shown in FIG. 1B, the adjustable curved surface 400A of the fluorescent encapsulant 40 gradually moves away from the fixed arc surface 300A of the transparent encapsulant 30 from bottom to top, so that the thickness of the fluorescent encapsulant 40 is from bottom to top. Gradually thick. Finally, the projection light source L3 generated by sequentially passing the transparent encapsulant 30 and the fluorescent encapsulant 40 can present the spatial uniformity of the space desired by the designer according to the non-equal thickness of the phosphor colloid (as shown in FIG. 1B). ) and the light distribution curve (as shown in Figure 1C).

Of course, as shown in FIG. 1A, the light source L1 generated by the light-emitting element 20 can form a "light-passing source" L2 when passing through the transparent encapsulant 20, and a specific light distribution curve can be presented through the light source L. . Therefore, as shown in FIG. 1B, the upper surface of the fluorescent encapsulant 40 can also be an adjustable arc surface 400A adjusted according to a specific light distribution curve presented by the light source L2, and the fluorescent encapsulant 40 is The thickness is adjusted according to the height of the adjustable curved surface 400A relative to the substrate body 10 such that the fluorescent encapsulant 40 forms a non-equal thick phosphor colloid. Since the thickness of the fluorescent encapsulant 40 can be adjusted according to the adjustable arc surface 400A The adjustment is made with respect to the height of the substrate body 10, so the designer can also adjust the spatial color uniformity and the light distribution curve of the projection light source L3 according to the above-mentioned non-equal thickness fluorescent colloid. In other words, the adjustable curved surface 400A formed on the upper surface of the fluorescent encapsulant 40 can be selectively selected according to a specific light distribution curve exhibited by the emission light source L1 or according to a specific light distribution curve presented by the light source L2. Adjustment.

[Second embodiment]

Referring to FIG. 2, a second embodiment of the present invention provides a light emitting diode package structure Z for adjusting spatial color uniformity and light distribution curve. The comparison between FIG. 2 and FIG. 1 shows that the second embodiment differs greatly from the first embodiment in that, in the second embodiment, the light-emitting unit 2 includes at least two disposed on the substrate body 10 and electrically connected to the substrate. Light-emitting element 20 of body 10. The fluorescent encapsulant 40 can be divided into at least two symmetrical phosphor layers 40', and the intersection of the at least two phosphor layers 40' forms a first thickness D1, one end of each of the phosphor layers 40' The substrate body 10 is contacted to form a second thickness D2, and the first thickness D1 is smaller than the second thickness D2. Therefore, since the thickness of the fluorescent encapsulant 40 can be adjusted according to the height of the adjustable curved surface 400A relative to the substrate body 10, so that the fluorescent encapsulant 40 can form a non-equal thick fluorescent colloid, the designer also The spatial color uniformity and the light distribution curve of the projection light source L3 can be adjusted according to the above-mentioned non-equal thickness fluorescent colloid.

[Third embodiment]

Referring to FIG. 3A and FIG. 3B, FIG. 3A is a side cross-sectional view of the semi-finished product, and FIG. 3B is a side cross-sectional view of the finished product. A third embodiment of the present invention provides a light emitting diode package structure Z for adjusting spatial color uniformity and light distribution curve. Comparing Figure 3A with Figure 1A and Figure 3B The comparison with FIG. 1B shows that the third embodiment is the most different from the first embodiment in that, in the third embodiment, the light source L1 generated by the light-emitting element 20 passes through the transparent encapsulant 30 to form a light source L2, and The light source L2 exhibits a specific light distribution curve, wherein the upper surface of the transparent encapsulant 30 is an adjustable arc surface 300B adjusted according to a specific light distribution curve presented by the light source L2, and the transparent encapsulant 30 is A thickness can adjust the transparent colloid. In addition, the upper surface of the fluorescent encapsulant 40 is a fixed arc surface 400B, and the thickness of the fluorescent encapsulant 40 is adjusted according to the height of the adjustable arc surface 300B of the transparent encapsulant 30 relative to the substrate body 10, so that The fluorescent encapsulant 40 forms a non-equal thick phosphor colloid. For example, the fluorescent encapsulant 40 can be divided into at least two symmetrical phosphor layers 40'. The intersection of the at least two phosphor layers 40' forms a first thickness D1, and each phosphor layer 40' One of the ends contacts the substrate body 10 to form a second thickness D2, and the first thickness D1 is greater than the second thickness D2.

Therefore, when the light source L1 generated by the light-emitting element 20 sequentially passes through the transparent encapsulant 30 and the fluorescent encapsulant 40 to form a projection light source L3 (as shown in FIG. 3B), the spatial color uniformity and distribution of the projection light source L3. The light curve can be adjusted according to the above-mentioned non-equal thickness fluorescent colloid.

[Possible effects of the examples]

In summary, the LED package structure provided by the embodiment of the present invention can transmit the "non-equal thickness of the phosphor colloid" to make the space color of the LED package structure of the present invention. The uniformity and light distribution curve can be arbitrarily adjusted with non-equal thickness phosphor colloids.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent of the present invention. Equivalent technical changes are included in the scope of the present invention.

Z‧‧‧Light Emitting Diode Structure

1‧‧‧Substrate unit

10‧‧‧Substrate body

2‧‧‧Lighting unit

20‧‧‧Lighting elements

L1‧‧‧ emitting light source

L2‧‧‧ passing light source

L3‧‧‧projection light source

3‧‧‧Transparent packaging unit

30‧‧‧Transparent encapsulant

300A‧‧‧Fixed curved surface

300B‧‧‧Adjustable curved surface

30A‧‧‧矽胶

30B‧‧‧Epoxy resin

4‧‧‧Fluorescent package unit

40‧‧‧Fluorescent encapsulant

40’‧‧‧Fluorescent layer

400A‧‧‧Adjustable curved surface

400B‧‧‧Fixed curved surface

40A‧‧‧矽胶

40B‧‧‧Epoxy resin

40C‧‧‧Fluorescent particles

D1‧‧‧first thickness

D2‧‧‧second thickness

1A is a side cross-sectional view showing a first embodiment of a light emitting diode package structure for adjusting a spatial color uniformity and a light distribution curve as a semi-finished product according to the present invention; FIG. 1B is a diagram for adjusting spatial color uniformity according to the present invention; 1 is a side cross-sectional view of a first embodiment of a light-emitting diode package structure in a finished product; FIG. 1C is a first embodiment of a light-emitting diode package structure for adjusting spatial color uniformity and light distribution curve of the present invention; The color space distribution diagram of the embodiment; FIG. 1D is a light distribution curve diagram of the first embodiment of the light emitting diode package structure for adjusting the spatial color uniformity and the light distribution curve of the present invention; FIG. 2 is used for the adjustment of the present invention. A side cross-sectional view of a second embodiment of a light-emitting diode package structure with spatial color uniformity and light distribution curve; and FIG. 3A is a light-emitting diode package structure for adjusting spatial color uniformity and light distribution curve of the present invention A side cross-sectional schematic view of a third embodiment in the case of a semi-finished product; and FIG. 3B is a third embodiment of the present invention for adjusting a spatial color uniformity and a light distribution curve of a light emitting diode package structure A side cross-sectional view of an embodiment.

Z‧‧‧Light Emitting Diode Structure

1‧‧‧Substrate unit

10‧‧‧Substrate body

2‧‧‧Lighting unit

20‧‧‧Lighting elements

L1‧‧‧ emitting light source

L3‧‧‧projection light source

3‧‧‧Transparent packaging unit

30‧‧‧Transparent encapsulant

300A‧‧‧Fixed curved surface

30A‧‧‧矽胶

30B‧‧‧Epoxy resin

4‧‧‧Fluorescent package unit

40‧‧‧Fluorescent encapsulant

400A‧‧‧Adjustable curved surface

40A‧‧‧矽胶

40B‧‧‧Epoxy resin

40C‧‧‧Fluorescent particles

Claims (8)

A light emitting diode package structure for adjusting a spatial color uniformity and a light distribution curve, comprising: a substrate unit including at least one substrate body; and an illumination unit including at least one disposed on the at least one substrate body And electrically connecting to the light-emitting element of the at least one substrate body, wherein the at least one light-emitting element generates an emission light source exhibiting a specific light distribution curve; and a transparent package unit including a shape formed on the at least one substrate body a transparent encapsulant covering the at least one light-emitting component, wherein the transparent encapsulant has a fixed arc surface, and the transparent encapsulant is a thickness-fixed transparent colloid; and a fluorescent package unit includes a shape formed on the a fluorescent encapsulant on the substrate body and covering the transparent encapsulant, wherein the upper surface of the phosphor encapsulant is an adjustable arc surface adjusted according to the specific light distribution curve, and the fluorescent encapsulant is The thickness is adjusted according to the height of the adjustable curved surface relative to the at least one substrate body, so that The fluorescent encapsulant forms a non-equal thick phosphor colloid; wherein the emission light source generated by the at least one light-emitting component sequentially passes through the transparent encapsulant and the fluorescent encapsulant to form a projection light source, and the projection light source has a space The color uniformity and the light distribution curve are adjusted according to the non-equal thickness of the fluorescent colloid; wherein the adjustable arc surface of the fluorescent encapsulant gradually moves away from the bottom to the fixed arc of the transparent encapsulant, so that the The thickness of the fluorescent encapsulant gradually increases from bottom to top. The at least one substrate body is a circuit substrate, and the at least one illuminating element is a blue illuminating device, wherein the at least one substrate body is a circuit substrate, and the illuminating diode package structure for adjusting a spatial color uniformity and a light distribution curve according to the first aspect of the invention. Diode bare crystal. The light emitting diode package structure for adjusting spatial color uniformity and light distribution curve according to claim 1, wherein the transparent encapsulant is a transparent colloid formed of silicone or epoxy resin. The light emitting diode package structure for adjusting spatial color uniformity and light distribution curve according to claim 1, wherein the fluorescent encapsulant is a mixture of a silicone rubber and a plurality of fluorescent particles or a plurality of fluorescent particles. A phosphor colloid formed by mixing an epoxy resin and a plurality of fluorescent particles with each other. A light emitting diode package structure for adjusting a spatial color uniformity and a light distribution curve, comprising: a substrate unit including at least one substrate body; and an illumination unit including at least one disposed on the at least one substrate body And electrically connecting to the light-emitting element of the at least one substrate body, wherein the at least one light-emitting element generates an emission light source exhibiting a specific light distribution curve; and a transparent package unit including a shape formed on the at least one substrate body a transparent encapsulant covering the at least one light-emitting component, wherein the transparent encapsulant has a fixed arc surface, and the transparent encapsulant is a thickness-fixed transparent colloid; and a fluorescent package unit includes a shape formed on the a fluorescent encapsulant on the substrate body and covering the transparent encapsulant, wherein the upper surface of the phosphor encapsulant is an adjustable arc surface adjusted according to the specific light distribution curve, and the fluorescent encapsulant is Thickness basis The adjustable arc surface is adjusted relative to the height of the at least one substrate body such that the fluorescent encapsulant forms a non-equal thickness phosphor colloid; wherein the phosphor encapsulant is divided into at least two symmetrical phosphors a layer, a junction of the at least two phosphor layers forming a first thickness, one end of each of the phosphor layers contacting the at least one substrate body to form a second thickness, and the first thickness is less than the second thickness . A light emitting diode package structure for adjusting a spatial color uniformity and a light distribution curve, comprising: a substrate unit including at least one substrate body; and an illumination unit including at least one disposed on the at least one substrate body And a transparent package unit, comprising: a transparent encapsulant formed on the at least one substrate body and covering the at least one light emitting component, wherein the upper surface of the transparent encapsulant Is a fixed arc surface, and the transparent encapsulant is a thickness-fixed transparent colloid, wherein the at least one illuminating element generates an emission source through the transparent encapsulant to form a passing light source, and the passing light source presents a specific light distribution And a fluorescent package unit, comprising: a fluorescent encapsulant formed on the at least one substrate body and covering the transparent encapsulant, wherein the upper surface of the phosphor encapsulant is a specific light distribution curve according to the above Adjusting the adjustable arc surface, and the thickness of the fluorescent encapsulant is adjusted according to the For the at least one surface of the substrate body height is adjusted, such that the encapsulant forms a fluorescent non-fluorescent colloid equal thickness; The emission light source generated by the at least one light-emitting element sequentially passes through the transparent encapsulant and the fluorescent encapsulant to form a projection light source, and the spatial color uniformity and the light distribution curve of the projection light source are based on the non-equal thickness. The phosphor colloid is adjusted; wherein the adjustable arc surface of the fluorescent encapsulant gradually moves away from the bottom to the fixed arc surface of the transparent encapsulant, so that the thickness of the phosphor encapsulant gradually increases from bottom to top. A light emitting diode package structure for adjusting a spatial color uniformity and a light distribution curve, comprising: a substrate unit including at least one substrate body; and an illumination unit including at least one disposed on the at least one substrate body And a transparent package unit, comprising: a transparent encapsulant formed on the at least one substrate body and covering the at least one light emitting component, wherein the upper surface of the transparent encapsulant Is a fixed arc surface, and the transparent encapsulant is a thickness-fixed transparent colloid, wherein the at least one illuminating element generates an emission source through the transparent encapsulant to form a passing light source, and the passing light source presents a specific light distribution And a fluorescent package unit, comprising: a fluorescent encapsulant formed on the at least one substrate body and covering the transparent encapsulant, wherein the upper surface of the phosphor encapsulant is a specific light distribution curve according to the above Adjusting the adjustable arc surface, and the thickness of the fluorescent encapsulant is adjusted according to the For the at least one surface of the substrate body height is adjusted, such that the encapsulant forms a fluorescent non-fluorescent colloid equal thickness; The fluorescent encapsulant is divided into at least two symmetrical phosphor layers, and the intersection of the at least two phosphor layers forms a first thickness, and one end of each of the phosphor layers contacts the at least one substrate body Forming a second thickness, and the first thickness is less than the second thickness. A light emitting diode package structure for adjusting a spatial color uniformity and a light distribution curve, comprising: a substrate unit including at least one substrate body; and an illumination unit including at least one disposed on the at least one substrate body And a transparent package unit comprising: a transparent encapsulation unit formed on the at least one substrate body and covering the at least one illuminating element, wherein the at least one illuminating element is generated The emitting light source passes through the transparent encapsulant to form a passing light source, and the passing light source exhibits a specific light distribution curve, wherein the upper surface of the transparent encapsulant is an adjustable curved surface adjusted according to the specific light distribution curve. And the transparent encapsulant is a thickness-adjustable transparent colloid; and a fluorescent package unit includes a fluorescent encapsulant formed on the at least one substrate body and covering the transparent encapsulant, wherein the fluorescent encapsulant The upper surface is a fixed arc surface, and the thickness of the fluorescent encapsulant is based on the transparency The adjustable arcuate surface of the colloid is adjusted relative to the height of the at least one substrate body such that the fluorescent encapsulant forms a non-equal thick phosphor colloid; wherein the emission light source generated by the at least one light emitting element passes sequentially The transparent encapsulant and the fluorescent encapsulant form a projection light source, and the spatial color uniformity and the light distribution curve of the projection light source are adjusted according to the non-equal thickness fluorescent colloid; The fluorescent encapsulant is divided into at least two symmetrical phosphor layers, and the intersection of the at least two phosphor layers forms a first thickness, and one end of each of the phosphor layers contacts the at least one substrate body Forming a second thickness, and the first thickness is greater than the second thickness.