CN103904073A - LED and OLED integrated illuminating module - Google Patents
LED and OLED integrated illuminating module Download PDFInfo
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- CN103904073A CN103904073A CN201210587810.2A CN201210587810A CN103904073A CN 103904073 A CN103904073 A CN 103904073A CN 201210587810 A CN201210587810 A CN 201210587810A CN 103904073 A CN103904073 A CN 103904073A
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Abstract
The invention provides an LED and OLED integrated illuminating module which comprises a base body, an OLED and a packaging cover plate, wherein the OLED is composed of an anode, an organic functional layer and a negative electrode which are arranged on the base body in a stacked mode. An LED is arranged on the side face of the base body, light emitted by the LED is emitted into the base body from the side face of the base body, light emitted by the OLED in the base body and the light emitted by the LED are mixed and finally emitted out of the plane of the base body. The LED, the base body, and the anode, the organic functional layer and the negative electrode which form the OLED are packaged into a whole through the packaging cover plate. Compared with the prior art, the LED and the OLED are integrated, high quantum efficiency and high color rendering are simultaneously achieved, and control is simplified. According to the design, the advantages of the LED and the advantages of the OLED are brought into full play, and therefore high efficiency, high light quality, long service life and low cost of the illuminating module are achieved.
Description
Technical field
The present invention relates to a kind of semi-conductor illumination module and method for packing thereof, especially a kind of LED and OLED integrated lighting module and method for packing thereof that shares a substrate.
Background technology
Due to the inherent limitations on material, compare blue-ray LED, the luminous efficiency (quantum efficiency) of green glow and red-light LED is still very low, and with regard to single white light LEDs, its luminous color rendering is also lower, and LED is a kind of point-source of light of high brightness, human eye directly looks very uncomfortable, etc., these factors have all limited LED light fixture popularizing in illumination market.By contrast, OLED luminescent device has wide spectrum and adjustable, and therefore color rendering is very high, and in addition, the luminous efficiency (quantum efficiency) of green glow OLED device is very high, uses phosphor material, and internal quantum efficiency can reach 100% in theory.But with regard to OLED element itself, the OLED quantum efficiency of blue light is low, and device lifetime is short.In addition, if adopt multilayer device structure to manufacture white light OLED device, complex process, excitonic luminescence control ability is poor, and device cost is high, and the luminous efficiency of multilayer white light OLED is difficult to obtain larger raising, and is difficult under high electric current, keeps high efficiency.
Summary of the invention
The object of the invention is, in order to solve above-mentioned LED, OLED deficiency separately, provides a kind of LED and OLED integrated lighting module.
Technical scheme of the present invention is, a kind of LED and OLED integrated lighting module are provided, comprise: matrix, the anode of stacked setting on described matrix, the OLED that organic function layer and negative electrode form, encapsulation cover plate, it is characterized in that, described matrix side is provided with LED light-emitting component, the light that described LED light-emitting component sends is injected described matrix from the side of described matrix, and the light that OLED sends in matrix mixes with the light that described LED light-emitting component sends, final light penetrates from matrix plane, described encapsulation cover plate is by described LED light-emitting component, matrix, form the anode of OLED, organic function layer and negative electrode are encapsulated into one.
Further, described LED light-emitting component directly sticks on the side of matrix by surface-pasted mode.
Further, described matrix is placed on frame, and described LED light-emitting component is fixed on described frame, and the light-emitting area of described LED light-emitting component and an angle of described matrix surface existence.
Further, the angle between the light-emitting area of described LED light-emitting component and described matrix surface is 90 degree.
Further, described LED light-emitting component is different with the optical wavelength that described organic function layer sends.
Further, described LED light-emitting component at least comprise one can blue light-emitting LED luminous element, described organic function layer at least comprise one can green light luminescent layer.
Further, described LED light-emitting component also comprises and can send LED luminous element photochromic except blue light, green glow.
Further, described machine functional layer also comprises that can be sent a luminescent layer photochromic except blue light, green glow.
Further, the sheet material that described matrix is even thickness or the wedge shape of gradient thickness.
Further, described matrix surface has miniature topological structure.
Further, described matrix is rectangle, square, circle, ellipse or polygon.
Further, described LED light-emitting component is positioned at side of described planar light conversion layer or relative two sides or three with upper side.
Further, described matrix surface is also provided with light scattering or light-extraction layer.
The present invention, owing to having adopted technique scheme, makes it compared with prior art, and the present invention is integrated by LED and OLED are carried out, and realizes the object of high-quantum efficiency and high-color rendering simultaneously, and is simplified on controlling.Such design has utilized LED and OLED device advantage separately fully, realizes the high efficiency of lighting module, high light quality, long-life and low cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of a preferred embodiment of the present invention.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is OLED basic structure schematic diagram.
Fig. 4 is OLED basic structure schematic diagram.
Embodiment
The LED and the OLED integrated lighting module that the present invention are proposed below in conjunction with the drawings and specific embodiments are described in further detail.
Integrated by LED and OLED are carried out in the present embodiment, realize the object of high-quantum efficiency and high-color rendering simultaneously, and be simplified on controlling.Specifically, first, at transparency carrier (as glass, PC) upper, make green OLED element, then, blueness or red LED are combined by the luminous mode of side with transparency carrier, realize the luminous panelization of LED, and, realize light that light that LED sends and OLED send in substrate internal mix.By optimizing LED and the luminous ratio of OLED, can adjust flexibly the luminous characteristic of element, as wavelength, intensity, etc.
Concrete structure please refer to Fig. 1, on transparency carrier 5, prepares successively semitransparent electrode 6, hole transmission layer 7, OLED luminescent layer 8, electron transfer layer 9, negative electrode 10 according to OLED manufacturing process, and the opposite side of transparency carrier is provided with light-diffusing films 3.Can certainly replace light-diffusing films 3 with light diffusion layer, or the processing of making some surface roughenings obtaining different illumination effects, should be appreciated that be for optimized emission effect adding of light-diffusing films 3 simultaneously, is not limitation of the invention.In the both sides of transparency carrier, blue-ray LED luminous element 2 and red-light LED luminous element 4 are installed respectively, the fixed form of LED has two kinds, first method, LED can be fixed on the frame of placing substrate 5, and the light-emitting area of LED is facing to the side of substrate 5, the distance of the side of the light-emitting area of LED and substrate 5 can be adjusted within the specific limits, makes light that LED sends can as much as possiblely enter the side of substrate 5; Second method, directly directly sticks on LED by surface-pasted mode on the side of substrate 5, for example, paste by transparent silica gel, and the light-emitting area of LED is facing to the side of substrate 5, makes light that LED sends can as much as possiblely enter the side of substrate 5.LED luminous element is also connected with heat abstractor 1.Finally by encapsulation cover plate (not shown), above-mentioned component packages is become to a module.
Please refer to Fig. 2, in the present embodiment, adopted both green glow OLED of luminous efficiency best of breed, coordinate blue-ray LED, obtain white light thereby increase red-light LED simultaneously, layout, the light-emitting area of OLED is base plan, LED is luminous from the side, and both light emission directions have an angle, the substantially light-emitting area of the vertical OLED of LED light-emitting area, LED luminous element is arranged on two sides that substrate 5 is relative, blue light 2 and ruddiness 4 are alternately distributed, and the offside of blue light 2 layout ruddiness 4, to realize sufficient mixed light.
Certainly on OLED and LED photochromic, can adopt the assembly of other modes, the present invention also has multiple better implementation, as selected blue led to add that green OLED and red OLED realize mixed light in substrate; Also can select blue led and red LED and green OLED in substrate, to realize mixed light; Can also select blue led and green OLED or red OLED in substrate, to realize mixed light.Even only form module by two different colors.
The shape of substrate 5 also can be selected flexibly, such as, rectangle, square, circle, triangle, hexagon, etc.The thickness of substrate can be uniformly or wedge shape, or on substrate with micro-topological structures such as various salient points, sawtooth, ripples, to realize the control to sending out direction of light.
LED can be monolateral in the layout of substrate side, or polygon layout, and polygon be arranged symmetrically with etc.
For the OLED of preparation, can adopt the most basic OLED structure to comprise as shown in Figure 3: substrate 107, positive electrode 106, hole transport become 105, the structure of luminescent layer 104, electron transfer layer 103, negative electrode 101.Also can there is more complicated layer structure as shown in Figure 4, between electron transfer layer 103 and negative electrode 101, also has one deck electron emission layer 102, and luminous one-tenth can be also sandwich construction, thus send two kinds photochromic, can certainly be the stepped construction of multiple monochromatic OLED.Wherein, the electrode of pressing close to substrate 107 is transparent, for example ITO, AZO; And another electrode can be transparency electrode, can be also non-transparent electrode, as gold, silver, aluminium, etc.And, if this electrode is transparent or semitransparent, can realize double-side, and adjust the bright dipping ratio of top and bottom by micro-structural, as shown in Figure 4.
Above description of the preferred embodiment of the present invention is in order to illustrate and to describe, not want limit of the present invention or be confined to disclosed concrete form, obviously, may make many modifications and variations, these modifications and variations may be obvious to those skilled in the art, within should being included in the scope of the present invention being defined by appended claims.
Claims (14)
1. a LED and OLED integrated lighting module, comprise: matrix, the anode of stacked setting on described matrix, the OLED that organic function layer and negative electrode form, encapsulation cover plate, it is characterized in that, described matrix side is provided with LED light-emitting component, the light that described LED light-emitting component sends is injected described matrix from the side of described matrix, and the light that OLED sends in matrix mixes with the light that described LED light-emitting component sends, final light penetrates from matrix plane, described encapsulation cover plate is by described LED light-emitting component, matrix, form the anode of OLED, organic function layer and negative electrode are encapsulated into one.
2. a kind of LED according to claim 1 and OLED integrated lighting module, is characterized in that described LED light-emitting component directly sticks on the side of matrix by surface-pasted mode.
3. a kind of LED according to claim 1 and OLED integrated lighting module, it is characterized in that described matrix is placed on frame, described LED light-emitting component is fixed on described frame, and the light-emitting area of described LED light-emitting component and an angle of described matrix surface existence.
4. a kind of LED according to claim 3 and OLED integrated lighting module, is characterized in that the angle between light-emitting area and the described matrix surface of described LED light-emitting component is 90 degree.
5. a kind of LED according to claim 1 and OLED integrated lighting module, is characterized in that described LED light-emitting component is different with the optical wavelength that described organic function layer sends.
6. a kind of LED according to claim 5 and OLED integrated lighting module, it is characterized in that described LED light-emitting component at least comprise one can blue light-emitting LED luminous element, described organic function layer at least comprise one can green light luminescent layer.
7. a kind of LED according to claim 6 and OLED integrated lighting module, is characterized in that described LED light-emitting component also comprises can send LED luminous element photochromic except blue light, green glow.
8. a kind of LED according to claim 6 and OLED integrated lighting module, is characterized in that described machine functional layer also comprises that can be sent a luminescent layer photochromic except blue light, green glow.
9. according to a kind of LED and OLED integrated lighting module described in any one of claim 1 to 8, it is characterized in that described matrix is the sheet material of even thickness or the wedge shape of gradient thickness.
10. according to a kind of LED and OLED integrated lighting module described in any one of claim 1 to 8, it is characterized in that described matrix surface has miniature topological structure.
11. according to a kind of LED and OLED integrated lighting module described in any one of claim 1 to 8, it is characterized in that described matrix is rectangle, square, circle, ellipse or polygon.
12. a kind of LED according to claim 11 and OLED integrated lighting module, is characterized in that described LED light-emitting component is positioned at side of described planar light conversion layer or relative two sides or three with upper side.
13. according to a kind of LED and OLED integrated lighting module described in any one of claim 1 to 8, it is characterized in that described matrix surface is also provided with light scattering or light-extraction layer.
14. according to a kind of LED and OLED integrated lighting module described in any one of claim 1 to 8, it is characterized in that described LED encapsulating structure also comprises heat abstractor, and described heat abstractor is directly connected to the back side of described LED light-emitting component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210587810.2A CN103904073A (en) | 2012-12-29 | 2012-12-29 | LED and OLED integrated illuminating module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210587810.2A CN103904073A (en) | 2012-12-29 | 2012-12-29 | LED and OLED integrated illuminating module |
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| CN103904073A true CN103904073A (en) | 2014-07-02 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019016730A1 (en) * | 2015-01-23 | 2019-01-24 | Vuereal Inc. | Micro device integration into system substrate |
| US10847571B2 (en) | 2015-01-23 | 2020-11-24 | Vuereal Inc. | Micro device integration into system substrate |
| US11476216B2 (en) | 2015-01-23 | 2022-10-18 | Vuereal Inc. | Selective micro device transfer to receiver substrate |
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| US20070188086A1 (en) * | 2006-02-15 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Light souce |
| CN101908531A (en) * | 2009-06-05 | 2010-12-08 | 清华大学 | Multilayer electroluminescent device |
| CN102392961A (en) * | 2011-11-17 | 2012-03-28 | 南京第壹有机光电有限公司 | LED (light emitting diode) and OLED (organic light emitting diode) composite surface luminescent device |
| US20120170303A1 (en) * | 2009-06-24 | 2012-07-05 | Noam Meir | Illumination apparatus with high conversion efficiency and methods of forming the same |
| CN203165896U (en) * | 2012-12-29 | 2013-08-28 | 欧普照明股份有限公司 | LED/OLED integrated lighting module |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20070188086A1 (en) * | 2006-02-15 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Light souce |
| CN101908531A (en) * | 2009-06-05 | 2010-12-08 | 清华大学 | Multilayer electroluminescent device |
| US20120170303A1 (en) * | 2009-06-24 | 2012-07-05 | Noam Meir | Illumination apparatus with high conversion efficiency and methods of forming the same |
| CN102392961A (en) * | 2011-11-17 | 2012-03-28 | 南京第壹有机光电有限公司 | LED (light emitting diode) and OLED (organic light emitting diode) composite surface luminescent device |
| CN203165896U (en) * | 2012-12-29 | 2013-08-28 | 欧普照明股份有限公司 | LED/OLED integrated lighting module |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019016730A1 (en) * | 2015-01-23 | 2019-01-24 | Vuereal Inc. | Micro device integration into system substrate |
| US10700120B2 (en) | 2015-01-23 | 2020-06-30 | Vuereal Inc. | Micro device integration into system substrate |
| US10847571B2 (en) | 2015-01-23 | 2020-11-24 | Vuereal Inc. | Micro device integration into system substrate |
| US11476216B2 (en) | 2015-01-23 | 2022-10-18 | Vuereal Inc. | Selective micro device transfer to receiver substrate |
| US11728302B2 (en) | 2015-01-23 | 2023-08-15 | Vuereal Inc. | Selective micro device transfer to receiver substrate |
| US11728306B2 (en) | 2015-01-23 | 2023-08-15 | Vuereal Inc. | Selective micro device transfer to receiver substrate |
| US11735545B2 (en) | 2015-01-23 | 2023-08-22 | Vuereal Inc. | Selective micro device transfer to receiver substrate |
| US11735623B2 (en) | 2015-01-23 | 2023-08-22 | Vuereal Inc. | Micro device integration into system substrate |
| US11735547B2 (en) | 2015-01-23 | 2023-08-22 | Vuereal Inc. | Selective micro device transfer to receiver substrate |
| US11735546B2 (en) | 2015-01-23 | 2023-08-22 | Vuereal Inc. | Selective micro device transfer to receiver substrate |
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