TWM496847U - Light emitting module - Google Patents

Description

Light module

The invention relates to a lighting module, in particular to a lighting module of a light emitting diode (LED).

Known light-emitting diode (LED) modules mainly include an LED chip formed with a p-n junction epitaxial structure, an electrode electrically connected to the LED wafer, and a package for packaging components such as an LED chip. The LED module is usually semi-spherical after being packaged, that is, each LED module forms a semi-spherical protrusion structure, which results in a larger volume after packaging each LED module. Moreover, when manufacturing a luminaire, it is necessary to arrange a plurality of LED modules on a light board, and a glass substrate through which the light of the LED module passes must be disposed, which makes the assembly of the LED module into a luminaire more troublesome. .

In addition, the pn junction epitaxial structure in the above LED chip may be actually provided in a plurality, and the epitaxial structures are connected to each other through the electrodes in series, and the rated voltage of an epitaxial structure is 3 volts as an example. When three connected in series, the overall rated voltage of the module is 9 volts. When nine are connected in series, the overall rated voltage of the module is 27 volts, thereby forming a high voltage LED module. However, the conventional high-voltage LED module also has the disadvantages of large volume and inconvenient assembly after the above-mentioned package, and therefore its structure needs to be improved.

Therefore, the purpose of the present invention is to provide a light-emitting module that is convenient for packaging, has a small package size, and can enhance product competitiveness.

Therefore, the novel light emitting module comprises: at least one light emitting unit, one encapsulant, a second transparent substrate, and a plurality of second guiding members.

The light emitting unit comprises a first transparent substrate, a plurality of epitaxial structures, and a plurality of first guiding members. The first transparent substrate has an epitaxial surface and a surface opposite to the epitaxial surface. The epitaxial structures are located on the epitaxial surface, and each epitaxial structure has an n-type cladding layer, a light-emitting layer, and a p-type cladding layer. The first guiding members connect the epitaxial structures in series, in parallel or in series and in parallel.

The encapsulant covers the first transparent substrate and the epitaxial structures from the surface of the first transparent substrate. The second transparent substrate is located on a side of the surface of the first transparent substrate and covers the encapsulant. The second guiding members are selectively electrically connected to the first guiding members corresponding thereto, and respectively form at least one electrode.

The illuminating unit is provided with the epitaxial structure, and is coupled to the second transparent substrate through the encapsulant, and the second transparent substrate is in the form of a thin plate, so that the novel package is integrally packaged. It is small in size and has the advantage of convenient production when it is subsequently made into a luminaire, which can enhance the competitiveness of the product.

1‧‧‧Lighting unit

11‧‧‧First transparent substrate

111‧‧‧Leading surface

112‧‧‧ surface

12‧‧‧ Epitaxial structure

121‧‧‧n type coating

122‧‧‧Lighting layer

123‧‧‧p type coating

13‧‧‧First guide

14‧‧‧Insulation

141‧‧‧First insulation

142‧‧‧Second insulation

2‧‧‧Package colloid

21‧‧‧Fluorescent materials

3‧‧‧Second transparent substrate

4‧‧‧Second guide

41‧‧‧Electrode

Other features and effects of the novel will be referred to the drawings. The embodiment is clearly shown in FIG. 1 is a cross-sectional view of a first embodiment of the present invention; and FIG. 2 is a cross-sectional view of a second embodiment of the novel lighting module.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 1 , a first embodiment of the novel light emitting module includes: a light emitting unit 1 , an encapsulant 2 , a second transparent substrate 3 , and a plurality of second guiding members 4 .

The light emitting unit 1 includes a first transparent substrate 11 , a plurality of epitaxial structures 12 , a plurality of first guiding members 13 , and an insulating layer 14 .

The first transparent substrate 11 has an epitaxial surface 111 and a surface 112 opposite to the epitaxial surface 111. The first transparent substrate 11 is, for example, a sapphire substrate.

The epitaxial structures 12 are spaced apart from each other on the epitaxial surface 111. Each of the epitaxial structures 12 has an n-type cladding layer 121 and a light-emitting layer 122 that are adjacent to and away from the epitaxial surface 111. A p-type cladding layer 123. Taking a gallium nitride-based light-emitting diode (LED) as an example, the n-type cladding layer 121 and the p-type cladding layer 123 may be n-type and p-type gallium nitride materials, respectively. The luminescent layer 122 is also referred to as an active layer and may be a multiple quantum well (MQW) structure. The luminescent layer 122 material may comprise gallium nitride, indium gallium nitride, aluminum gallium nitride, or the like. However, it is not necessary to specifically limit the epitaxial junctions during implementation. Structure 12 layers of material.

The first guiding members 13 are electrically conductive metals and are used to connect the epitaxial structures 12 in series, in parallel or in series and in parallel. Specifically, the first guiding member 13 located at the leftmost side of the embodiment contacts the p-type cladding layer 123 of the epitaxial structure 12 connected thereto. The first guiding member 13 located at the rightmost side contacts the n-type cladding layer 121 of the epitaxial structure 12 connected thereto. The two first guiding members 13 in the middle are simultaneously located on any two adjacent epitaxial structures 12, and each of the first guiding members 13 simultaneously contacts the n-type coating layer of one of the epitaxial structures 12. 121 and p-type cladding layer 123 of another epitaxial structure 12.

The encapsulant 2 covers the first transparent substrate 11 and the epitaxial structures 12 from the surface 112 of the first transparent substrate 11 . The encapsulant 2 can be made of a material such as silicone, epoxy or the like which is permeable to light and suitable for encapsulation. Further, a fluorescent material 21 can be blended in the encapsulant 2, and the fluorescent material 21 can absorb the light of the epitaxial structure 12 and be excited, and the fluorescent material 21 can be excited to emit light. The light color of the crystal structure 12 is mixed. For example, the epitaxial structures 12 can emit blue light, and the phosphor material 21 can be excited to emit yellow light.

The insulating layer 14 includes a plurality of first insulating portions 141 respectively located between any two adjacent epitaxial structures 12, and a plurality of sides respectively located between the first guiding members 13 or the first guiding members 13 The second insulating portion 142. The first insulating portion 141 separates the epitaxial structures 12 to avoid short-circuiting between the epitaxial structures 12 . The second insulating portion 142 separates the first guiding members 13 and also prevents the second guiding members 4 from contacting the two first guiding members 13 located in the middle.

The second transparent substrate 3 is located on one side of the surface 112 of the first transparent substrate 11 and covers the encapsulant 2 . The second light-transmitting substrate 3 is, for example, a glass substrate.

The second guiding members 4 are selectively electrically connected to the first guiding members 13 corresponding thereto. The second guiding members 4 partially pass through the insulating layer 14 and contact the first guiding member 13 therein. The second guiding members 4 respectively form at least one electrode 41 externally, and can connect external power, so that external power can be transmitted to the epitaxial structure 12 via the second guiding members 4 and the first guiding members 13 to Crystal structure 12 converts electrical energy into light. The second connecting members 4 are electrically conductive metals and can be soldered to a switching substrate not shown, and can be applied to Flip Chip packaging technology.

In summary, the light-emitting unit 1 is provided with the epitaxial structures 12, and the first conductive members 13 can be connected in series and/or in parallel, so that the overall rated voltage of the light-emitting module of the present invention can be various. Different changes can be designed according to the needs of the use. The light-emitting unit 1 is bonded to the second transparent substrate 3 by the encapsulant 2, and the second transparent substrate 3 is in the form of a thin plate, which is small in size after being packaged as a whole, and belongs to a wafer level. Chip Scale Package (CSP). When the present invention is made into a luminaire, the second transparent substrate 3 can be used as a glass substrate which must be disposed in the luminaire, that is, the illuminating unit 1 of the present invention is directly combined with the glass substrate in the luminaire after being packaged. It has the advantage of convenient production in the subsequent production of lamps. Therefore, the novel innovative structure has the advantages of simplifying the packaging process and small size, and can enhance product competitiveness.

Referring to FIG. 2, a second embodiment of the novel lighting module, and the The structure of the first embodiment is substantially the same, except that the embodiment includes a plurality of light-emitting units 1 connected to each other through a plurality of second guide members 4; specifically, any two adjacent The light-emitting unit 1 is simultaneously connected to one of the second guide members 4, thereby making the light-emitting units 1 connected in series, in parallel or in series and in parallel. The encapsulant 2 covers the first transparent substrate 11 and the epitaxial structures 12 from the surface 112 of the first transparent substrate 11 of each of the light-emitting units 1 . The second transparent substrate 3 is located on one side of the surface 112 of the first transparent substrate 11 and simultaneously covers the corresponding light emitting unit 1.

In the embodiment, the plurality of light emitting units 1 are disposed on the second transparent substrate 3 . The advantage of forming the plurality of light-emitting units 1 at the same time is that the process is faster and more convenient, and in the subsequent application, for example, when the lamp is set as a lamp, the number of the light-emitting units 1 required by the lamp can be used in the second light-transmissive substrate 3 Cutting the appropriate position to cut the required number of the light-emitting units 1 so that when the lamps are made, the light-emitting units 1 are pre-arranged on the second transparent substrate 3, and the conventional necessity is eliminated. The individual LED modules are arranged one by one and fixed on a light board.

However, the above description is only for the embodiments of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent changes and modifications made by the present patent application scope and the contents of the patent specification are still It is within the scope of this new patent.

1‧‧‧Lighting unit

11‧‧‧First transparent substrate

111‧‧‧Leading surface

112‧‧‧ surface

12‧‧‧ Epitaxial structure

121‧‧‧n type coating

122‧‧‧Lighting layer

123‧‧‧p type coating

13‧‧‧First guide

14‧‧‧Insulation

141‧‧‧First insulation

142‧‧‧Second insulation

2‧‧‧Package colloid

21‧‧‧Fluorescent materials

3‧‧‧Second transparent substrate

4‧‧‧Second guide

41‧‧‧Electrode

Claims (4)

An illuminating module includes: at least one illuminating unit, the illuminating unit comprises: a first transparent substrate having an epitaxial surface and a surface opposite to the epitaxial surface; and a plurality of epitaxial structures located at the ray On the crystal plane, each epitaxial structure has an n-type cladding layer, a light-emitting layer, and a p-type cladding layer; and a plurality of first guiding members, the epitaxial structures are connected in series, in parallel or in series and in parallel a first colloidal substrate and the epitaxial structure are covered by the surface of the first transparent substrate; a second transparent substrate is located on a side of the surface of the first transparent substrate And covering the encapsulant; and the plurality of second guiding members are selectively electrically connected to the first guiding member corresponding thereto, and respectively forming at least one electrode. The lighting module of claim 1, wherein the second transparent substrate is a glass substrate. The lighting module of claim 1 or 2, wherein the encapsulant is blended with a fluorescent material. The illuminating module of claim 1 or 2, comprising a plurality of illuminating units, wherein the illuminating units are connected by the second guiding members, wherein the encapsulating colloid is used by the first transparent substrate of each illuminating unit The surface is coated with the first transparent substrate and the epitaxial structures.