CN112151517A - Package body - Google Patents
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- CN112151517A CN112151517A CN201910580108.5A CN201910580108A CN112151517A CN 112151517 A CN112151517 A CN 112151517A CN 201910580108 A CN201910580108 A CN 201910580108A CN 112151517 A CN112151517 A CN 112151517A
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- light
- light emitting
- electrical contact
- package
- area
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- 239000010410 layer Substances 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000012790 adhesive layer Substances 0.000 claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
- 229910010272 inorganic material Inorganic materials 0.000 claims description 5
- 239000011147 inorganic material Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 9
- 238000005538 encapsulation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 4
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- -1 polysiloxanes Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The package body comprises a light-transmitting substrate, a light-transmitting adhesive layer, a plurality of light-emitting elements and a packaging layer. The light-transmitting substrate comprises a light-emitting surface, a mounting surface opposite to the light-emitting surface and a side surface connecting the light-emitting surface and the mounting surface. The light-transmitting adhesive layer is arranged on the mounting surface of the light-transmitting substrate. The light-emitting elements are arranged on the light-transmitting adhesive layer, each light-emitting element comprises an epitaxial layer, a first electrical contact and a second electrical contact, the first electrical contact and the second electrical contact are arranged on the epitaxial layer, and each first electrical contact and each second electrical contact comprise top surfaces. The packaging layer is arranged on the light-transmitting adhesive layer, surrounds the light-emitting element, and exposes the top surfaces of the first electrical contact and the second electrical contact.
Description
Technical Field
The invention relates to a package.
Background
With the progress of optoelectronic technology, the volume of many optoelectronic devices is gradually miniaturized. In recent years, due to the breakthrough of Light Emitting Diode (LED) in terms of manufacturing size, the miniaturization of LEDs is increasingly applied to micro LED display panels (micro LED display panels) on displays.
Micro light emitting diodes (micro LEDs) are a new generation of display technology. Advantages of micro-leds include low power consumption, high brightness, high resolution, and high color saturation. Therefore, a display panel composed of micro light emitting diodes is regarded as the mainstream of the display technology of the next generation.
Disclosure of Invention
According to an aspect of the present invention, the package includes a transparent substrate, a transparent adhesive layer, a plurality of light emitting devices and a package layer. The light-transmitting substrate comprises a light-emitting surface, a mounting surface opposite to the light-emitting surface and a side surface connecting the light-emitting surface and the mounting surface. The light-transmitting adhesive layer is arranged on the mounting surface of the light-transmitting substrate. The light-emitting elements are arranged on the light-transmitting adhesive layer, each light-emitting element comprises an epitaxial layer, a first electrical contact and a second electrical contact, the first electrical contact and the second electrical contact are arranged on the epitaxial layer, and each first electrical contact and each second electrical contact comprise top surfaces. The packaging layer is arranged on the light-transmitting adhesive layer, surrounds the light-emitting element, and exposes the top surfaces of the first electrical contact and the second electrical contact.
According to one or more embodiments of the present invention, the light emitting device includes a first light emitting device, a second light emitting device and a third light emitting device, and the first light emitting device, the second light emitting device and the third light emitting device respectively emit blue light, green light and red light.
According to one or more embodiments of the present invention, the first light emitting device includes a blue light emitting diode, the second light emitting device includes a green light emitting diode, and the third light emitting device includes a red light emitting diode.
According to one or more embodiments of the present invention, at least one of the light emitting elements further includes a wavelength conversion member configured to convert the wavelength of the light emitted from the epitaxial layer into the wavelength of the corresponding color light.
According to one or more embodiments of the present invention, the light-transmitting substrate includes an inorganic material.
According to one or more embodiments of the present invention, the package further includes a driving chip electrically connected to the light emitting device.
According to one or more embodiments of the present invention, the package further includes a plurality of first conductive pads and a plurality of second conductive pads, each of the first conductive pads is electrically connected to a corresponding first electrical contact, each of the second conductive pads is electrically connected to a corresponding second electrical contact, an area of each of the first conductive pads is larger than an area of each of the first electrical contacts, and an area of each of the second conductive pads is larger than an area of each of the second electrical contacts.
According to one or more embodiments of the present invention, the package further includes a plurality of first conductive pads and a plurality of second conductive pads, each of the first conductive pads is electrically connected to a corresponding one of the first electrical contacts, each of the second conductive pads is electrically connected to a corresponding one of the second electrical contacts, an area of each of the first conductive pads is larger than an area of each of the first electrical contacts, and an area of each of the second conductive pads is larger than an area of each of the second electrical contacts.
According to one or more embodiments of the present invention, the total area of the first electrical contact and the second electrical contact is less than 10% of the area of the transparent substrate.
According to one or more embodiments of the present invention, the total area of the first electrical contact and the second electrical contact is 1% to 6% of the area of the transparent substrate.
Drawings
The present disclosure will be best understood from the following detailed description when read in conjunction with the accompanying drawings. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale and are used for illustrative purposes only. In fact, the dimensions of the features may be arbitrarily increased or reduced for clarity of discussion.
Fig. 1 shows a top view of a package 100 according to an embodiment of the invention;
fig. 2 shows a bottom view of the package 100 according to an embodiment of the invention;
fig. 3 illustrates a bottom view of the package 100a according to an embodiment of the invention;
fig. 4 is a schematic cross-sectional view of the package 100 along line AA' according to an embodiment of the invention;
fig. 5 is a schematic cross-sectional view of the package 100 along the line BB' according to an embodiment of the invention;
fig. 6 is a schematic cross-sectional view of a package 200 along line AA' according to an embodiment of the invention;
fig. 7 is a cross-sectional view of a package 300 along line AA' according to an embodiment of the invention.
[ notation ] to show
100. 100a, 200, 300: package body
110: light-transmitting substrate
111: side surface
112: light emitting surface
113: mounting surface
120: light-transmitting adhesive layer
130. 230: light emitting element
131: epitaxial layer
132: the first electrical contact
133: the second electrical contact
135. 235: first light emitting element
136. 236: second light emitting element
137. 237: third light emitting element
139: the top surface
140: encapsulation layer
141: side edge
142: bottom edge
150: driving chip
160: first conductive pad
161: connecting wire
170: second conductive pad
171: connecting wire
234: wavelength conversion member
AA ', BB': thread
Detailed Description
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these examples are merely examples and are not intended to be limiting. For example, in the following description, formation of a first feature over or on a second feature encompasses embodiments in which the first feature is in direct contact with the second feature, and embodiments in which the first feature is not in direct contact with the second feature are also encompassed.
Moreover, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Furthermore, the formation, connection, and/or coupling of a feature to another feature in the present disclosure may include embodiments in which the features are formed in direct contact, and may also include embodiments in which additional features are formed interposing the features, such that the features may not be in direct contact. Further, spatially relative terms, such as "under," "below," "lower," "above," "upper," and the like, may be used herein to describe one element or feature's relationship to another element (or elements) or feature (or features) as illustrated in the figures for ease of description. Spatially relative terms are intended to encompass different orientations of the elements in use or operation.
Fig. 1 is a top view of a package 100 according to an embodiment of the invention. Fig. 2 illustrates a bottom view of the package 100 according to an embodiment of the invention. Fig. 4 is a cross-sectional view of the package 100 along line AA' according to an embodiment of the invention.
Referring to fig. 4, the package 100 includes a transparent substrate 110, a transparent adhesive layer 120, a plurality of light emitting devices 130, and a package layer 140.
The transparent substrate includes a light-emitting surface 112, a mounting surface 113 opposite to the light-emitting surface 112, and a side surface 111 connecting the light-emitting surface 112 and the mounting surface 113. In some embodiments, the light-transmissive substrate 110 comprises an inorganic material. Since the light emitted from the light emitting device 130 is transmitted to the outside through the transparent substrate 110, the use of the transparent substrate 110 made of an inorganic material can greatly improve the service life of the transparent substrate 110. For example, since a general transparent substrate is made of a polymer material, it is likely to be deteriorated under long-term irradiation with light. In some embodiments, the transparent substrate 110 of the present invention is made of inorganic material, so that the above-mentioned deterioration caused by light irradiation is avoided.
The light-transmitting adhesive layer 120 is disposed on the mounting surface 113 of the light-transmitting substrate 110. In some embodiments, the light-transmissive adhesive layer 120 is configured to attach the light-emitting device 130 to the light-transmissive substrate 110. The light-transmissive adhesive layer 120 may be made of a material that can transmit light emitted from the light emitting element 130. In some embodiments, the material of the light-transmissive adhesive layer 120 includes benzocyclobutene (BCB), silicone resin (polymerized silicones, polysiloxanes, or silicone), Polyimide (PI), epoxy resin (epoxy), polymethyl methacrylate (PMMA), or a combination thereof.
Fig. 5 is a schematic cross-sectional view of the package 100 along the line BB' according to an embodiment of the invention. Referring to fig. 4 and fig. 5, the light emitting device 130 is disposed on the transparent adhesive layer 120. Each light emitting device 130 includes an epitaxial layer 131, a first electrical contact 132 and a second electrical contact 133, wherein the first electrical contact 132 and the second electrical contact 133 are disposed on the epitaxial layer 131, and each first electrical contact 132 and each second electrical contact 133 include a top surface 139. In some embodiments, the top surface 139 of the first electrical contact 132 and the top surface 139 of the second electrical contact 133 are coplanar. In some embodiments, the material of the first electrical contact 132 and the second electrical contact 133 comprises a metal. In some embodiments, the total area of the top surfaces 139 of the first electrical contacts 132 and the second electrical contacts 133 is less than 10%, such as 9%, 8%, 7%, 6%, or 5%, of the area of the mounting surface 113 of the transparent substrate 110. In other embodiments, the total area of the top surfaces 139 of the first electrical contacts 132 and the second electrical contacts 133 is 1% to 6%, such as 2% to 5% or 3% to 4%, of the area of the mounting surface 113 of the transparent substrate 110. In some embodiments, the light emitting elements 130 are light emitting diodes.
The encapsulation layer 140 is disposed on the transparent adhesive layer 120 and surrounds the light emitting device 130, exposing the top surfaces 139 of the first electrical contacts 132 and the second electrical contacts 133. In detail, the encapsulation layer 140 is disposed on the other side of the transparent adhesive layer 120 opposite to the transparent substrate 110. The package layer 140 includes a bottom 142 and a side 141, wherein the bottom 142 is coplanar with the top 139 of each of the first electrical contacts 132 and each of the second electrical contacts 133, and the side 141 of the package layer 140 is aligned with the side 111 of the transparent substrate 110. In some embodiments, the total area coplanar with the bottom edge 142 and the top surface 139 is substantially equal to the area of the mounting surface 113 of the light-transmissive substrate 110. In some embodiments, the material of the encapsulation layer 140 includes benzocyclobutene (BCB), silicone resin (polymerized silicones, polysiloxanes, or silicone), Polyimide (PI), epoxy resin (epoxy), polymethyl methacrylate (PMMA), or a combination thereof. In some embodiments, the light transmissive adhesive layer 120 is the same material as the encapsulation layer 140. In other embodiments, the material of the light transmissive adhesive layer 120 is different from that of the encapsulation layer 140. No matter whether the materials of the transparent adhesive layer 120 and the packaging layer 140 are the same or not, an interface exists between the materials of the transparent adhesive layer 120 and the packaging layer 140.
In some embodiments, a plurality of packages 100 may constitute a display device. Therefore, the side 141 of the package layer 140 is aligned with the side 111 of the transparent substrate 110, so that the package bodies 100 can be easily assembled, which is beneficial to the subsequent assembly process.
Referring to fig. 2, in some embodiments, the package 100 further includes a driving chip 150, wherein the driving chip 150 is electrically connected to the light emitting device 130. The driving chip 150 may be disposed at any suitable position, such as on the transparent adhesive layer 120, but not limited thereto. In some embodiments, the driver IC 150 is surrounded by the package layer 140 and has an exposed surface coplanar with the bottom edge 142 of the package layer 140. In some embodiments, the exposed surface, the bottom edge 142 and the top surface 139 are coplanar, and the total area of the coplanar surfaces is substantially equal to the area of the mounting surface 113 of the transparent substrate 110. The driving chip 150 is used to control the light emitting device 130, so that the light emitting device 130 can operate as required.
Referring to fig. 2, fig. 4 and fig. 5, in some embodiments, the package 100 further includes a first conductive pad 160 and a second conductive pad 170. The first conductive pad 160 and the second conductive pad 170 are disposed on the package layer 140. In some embodiments, the package 100 further includes the connection lines 161 and the connection lines 171. The first conductive pad 160 is electrically connected to the first electrical contact 132 through a connection line 161, and the second conductive pad 170 is electrically connected to the second electrical contact 133 through a connection line 171. In some embodiments, the first conductive pad 160 and the second conductive pad 170 comprise metal.
In some embodiments, the package 100 includes a plurality of first conductive pads 160 and one second conductive pad 170. Each first conductive pad 160 is electrically connected to the corresponding first electrical contact 132, and the second conductive pad 170 is electrically connected to the second electrical contact 133. The area of each first conductive pad 160 is greater than the area of each first electrical contact 132, and the area of each second conductive pad 170 is greater than the area of each second electrical contact 133.
Referring to fig. 3, a bottom view of the package 100a according to an embodiment of the invention is shown. In other embodiments, the package 100 includes a plurality of first conductive pads 160 and a plurality of second conductive pads 170. Each first conductive pad 160 is electrically connected to the corresponding first electrical contact 132, and each second conductive pad 170 is electrically connected to the corresponding second electrical contact 133.
Since the areas of the first electrical contact 132 and the second electrical contact 133 are small, the process difficulty is high when the subsequent connection to the external circuit is performed. Therefore, the first conductive pad 160 and the second conductive pad 170 with larger areas are electrically connected to the first electrical contact 132 and the second electrical contact 133, respectively, so that the difficulty in the subsequent process of connecting the first conductive pad 160 and the second conductive pad 170 to an external circuit is reduced.
The number of the first conductive pads 160 and the second conductive pads 170 may be one or more according to practical requirements, and the embodiments shown in fig. 2 and 3 are merely exemplary and are not intended to limit the configuration and number of the first conductive pads 160 and the second conductive pads 170. In other words, a single first conductive pad 160 may be connected to one or more first electrical contacts 132, and a single second conductive pad 170 may also be connected to one or more second electrical contacts 133.
With reference to fig. 4, in some embodiments, the light emitting device 130 includes a first light emitting device 135, a second light emitting device 136 and a third light emitting device 137, wherein the first light emitting device 135, the second light emitting device 136 and the third light emitting device 137 respectively emit blue light, green light and red light. In other words, the first light emitting element 135, the second light emitting element 136 and the third light emitting element 137 can respectively display three primary colors of RGB in the display pixel. In some embodiments, the first light emitting element 135 includes a blue light emitting diode, the second light emitting element 136 includes a green light emitting diode, and the third light emitting element 137 includes a red light emitting diode, so that the epitaxial layers 131 of the first light emitting element 135, the second light emitting element 136, and the third light emitting element 137 are different from each other.
It is noted that, in some embodiments, the thicknesses of the light emitting elements 130 (e.g., the first light emitting element 135, the second light emitting element 136, and the third light emitting element 137) are the same. In some embodiments, the thickness of the epitaxial layer 131 of the first light emitting element 135 is smaller than the thickness of the epitaxial layer 131 of the second light emitting element 136, and the thickness of the epitaxial layer 131 of the second light emitting element 136 is smaller than the thickness of the epitaxial layer 131 of the third light emitting element 137. The thickness of the first electrical contact 132 of the first light emitting element 135 is greater than the thickness of the first electrical contact 132 of the second light emitting element 136, and the thickness of the first electrical contact 132 of the second light emitting element 136 is greater than the thickness of the first electrical contact 132 of the third light emitting element 137. The thickness of the second electrical contact 133 of the first light emitting element 135 is greater than the thickness of the second electrical contact 133 of the second light emitting element 136, and the thickness of the second electrical contact 133 of the second light emitting element 136 is greater than the thickness of the second electrical contact 133 of the third light emitting element 137.
In the invention, the thicker first electrical contact 132 and the thicker second electrical contact 133 are fabricated in the manufacturing process, and can be used as a buffer for the epitaxial layers 131 with different thicknesses in the subsequent polishing process, so that the thicknesses of the light emitting elements 130 are the same. As described above, the thinner epitaxial layer 131 corresponds to the thicker first electrical contact 132 and the second electrical contact 133, and the thicker epitaxial layer 131 corresponds to the thinner first electrical contact 132 and the second electrical contact 133. Moreover, the top surfaces 139 of each of the first electrical contacts 132 and the second electrical contacts 133 are substantially coplanar.
Referring to fig. 6, a cross-sectional view of the package 200 along the line AA' according to an embodiment of the invention is shown. The package 200 includes a light emitting element 230. In some embodiments, the light emitting device 230 includes a first light emitting device 235, a second light emitting device 236, and a third light emitting device 237. In some embodiments, the epitaxial layers 131 of the first light emitting element 235, the second light emitting element 236 and the third light emitting element 237 are the same as each other. In an embodiment where the epitaxial layers 131 of the light emitting devices 230 are identical to each other, at least one of the light emitting devices 230 further includes a wavelength conversion member 234. The wavelength conversion member 234 is configured to convert the wavelength of the light emitted from the epitaxial layer 131 into the wavelength of the corresponding color light. For example, the epitaxial layers 131 of the first light emitting element 235, the second light emitting element 236, and the third light emitting element 237 emit blue light, wherein the second light emitting element 236 and the third light emitting element 237 include the wavelength converter 234, and the material of the wavelength converter 234 of the second light emitting element 236 is different from the material of the wavelength converter 234 of the third light emitting element 237. The wavelength conversion member 234 of the second light emitting element 236 is configured to convert the blue light emitted from the epitaxial layer 131 of the second light emitting element 236 into green light, and the wavelength conversion member 234 of the third light emitting element 237 is configured to convert the blue light emitted from the epitaxial layer 131 of the third light emitting element 237 into red light. The wavelength conversion member 234 may be arbitrarily configured as required so that each of the light emitting elements 230 emits a desired color light.
Referring to fig. 7, a cross-sectional view of a package 300 along line AA' according to an embodiment of the invention is shown. In some embodiments, the first light emitting element 235, the second light emitting element 236, and the third light emitting element 237 all include the wavelength converters 234, and the materials of the wavelength converters 234 are different from each other. The first light emitting element 235, the second light emitting element 236, and the third light emitting element 237 emit desired color light through the wavelength conversion member 234. It should be understood that the embodiments shown in fig. 6 and 7 are merely exemplary, and the configuration of the wavelength conversion element can be arbitrarily adjusted according to the requirement.
According to the package body provided by the invention, because the electrical contact of each light-emitting element is coplanar with the package layer, the difficulty of the subsequent wiring process can be reduced, and the process yield is increased. In addition, the invention also provides a conductive pad with a larger area for electrically connecting the electrical contact of the light-emitting element, so that the subsequent processing difficulty is greatly reduced.
The foregoing outlines features of several embodiments or examples so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
Claims (10)
1. A package, comprising:
the light-transmitting substrate comprises a light-emitting surface, a mounting surface opposite to the light-emitting surface and a side surface connecting the light-emitting surface and the mounting surface;
a light-transmitting adhesive layer arranged on the mounting surface of the light-transmitting substrate;
a plurality of light-emitting elements disposed on the light-transmissive adhesive layer, each light-emitting element including an epitaxial layer, a first electrical contact and a second electrical contact, the first electrical contact and the second electrical contact being disposed on the epitaxial layer, each of the first electrical contact and the second electrical contact including a top surface; and
and the packaging layer is arranged on the light-transmitting adhesive layer, surrounds the light-emitting elements and exposes the top surfaces of the first electric contacts and the second electric contacts, and comprises a bottom edge and a side edge, wherein the bottom edge and the top surfaces are coplanar, and the side edge is aligned with the side surface of the light-transmitting substrate.
2. The package of claim 1, wherein the light emitting elements comprise a first light emitting element, a second light emitting element and a third light emitting element, and the first light emitting element, the second light emitting element and the third light emitting element respectively emit blue light, green light and red light.
3. The package of claim 2, wherein the first light emitting device comprises a blue light emitting diode, the second light emitting device comprises a green light emitting diode, and the third light emitting device comprises a red light emitting diode.
4. The package according to claim 2, wherein at least one of the light emitting elements further comprises a wavelength converter configured to convert the wavelength of the light emitted from the epitaxial layer into the wavelength of the corresponding color light.
5. The package of claim 1, wherein the transparent substrate comprises an inorganic material.
6. The package of claim 1, further comprising a driver die electrically connected to the light emitting devices.
7. The package according to claim 1, further comprising a plurality of first conductive pads and a plurality of second conductive pads, each of the first conductive pads being electrically connected to a corresponding one of the first electrical contacts, the second conductive pads being electrically connected to the second electrical contacts, an area of each of the first conductive pads being larger than an area of each of the first electrical contacts, and an area of each of the second conductive pads being larger than an area of each of the second electrical contacts.
8. The package according to claim 1, further comprising a plurality of first conductive pads and a plurality of second conductive pads, each of the first conductive pads being electrically connected to a corresponding one of the first electrical contacts, each of the second conductive pads being electrically connected to a corresponding one of the second electrical contacts, an area of each of the first conductive pads being larger than an area of each of the first electrical contacts, and an area of each of the second conductive pads being larger than an area of each of the second electrical contacts.
9. The package of claim 1, wherein a total area of the first electrical contacts and the second electrical contacts is less than 10% of an area of the transparent substrate.
10. The package of claim 9, wherein a total area of the first electrical contacts and the second electrical contacts is 1% -6% of an area of the transparent substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910580108.5A CN112151517B (en) | 2019-06-28 | 2019-06-28 | Package for display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910580108.5A CN112151517B (en) | 2019-06-28 | 2019-06-28 | Package for display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112151517A true CN112151517A (en) | 2020-12-29 |
| CN112151517B CN112151517B (en) | 2023-10-20 |
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| CN201910580108.5A Active CN112151517B (en) | 2019-06-28 | 2019-06-28 | Package for display |
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| US20180076365A1 (en) * | 2015-09-04 | 2018-03-15 | PlayNitride Inc. | Light emitting device and manufacturing method thereof |
| US20190189876A1 (en) * | 2017-12-14 | 2019-06-20 | Samsung Electronics Co., Ltd. | Light emitting device package and display device using the same |
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| CN1773703A (en) * | 2005-11-04 | 2006-05-17 | 友达光电股份有限公司 | White light emitting element and producing method thereof |
| CN105098027A (en) * | 2014-05-14 | 2015-11-25 | 新世纪光电股份有限公司 | Light emitting element packaging structure and manufacturing method thereof |
| CN103996788A (en) * | 2014-05-21 | 2014-08-20 | 广东威创视讯科技股份有限公司 | LED device for display screen and manufacturing method thereof |
| TWM496847U (en) * | 2014-11-21 | 2015-03-01 | Genesis Photonics Inc | Light emitting module |
| US20180076365A1 (en) * | 2015-09-04 | 2018-03-15 | PlayNitride Inc. | Light emitting device and manufacturing method thereof |
| US20190189876A1 (en) * | 2017-12-14 | 2019-06-20 | Samsung Electronics Co., Ltd. | Light emitting device package and display device using the same |
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| CN112151517B (en) | 2023-10-20 |
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