JP2010145285A - Magnetic detection device and method of manufacturing the same - Google Patents

Magnetic detection device and method of manufacturing the same Download PDF

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Publication number
JP2010145285A
JP2010145285A JP2008324320A JP2008324320A JP2010145285A JP 2010145285 A JP2010145285 A JP 2010145285A JP 2008324320 A JP2008324320 A JP 2008324320A JP 2008324320 A JP2008324320 A JP 2008324320A JP 2010145285 A JP2010145285 A JP 2010145285A
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Japan
Prior art keywords
magnetic detection
magnetic
lead
detection device
magnet
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Granted
Application number
JP2008324320A
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Japanese (ja)
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JP5356793B2 (en
Inventor
Kazuhiko Imai
Katsuhisa Osada
Ryosuke Uchida
和彦 今井
亮介 内田
勝久 長田
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Alps Electric Co Ltd
アルプス電気株式会社
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Priority to JP2008324320A priority Critical patent/JP5356793B2/en
Publication of JP2010145285A publication Critical patent/JP2010145285A/en
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Publication of JP5356793B2 publication Critical patent/JP5356793B2/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

<P>PROBLEM TO BE SOLVED: To provide a magnetic detection device that is formed with improved working efficiency and further aligns sensor chips precisely, and to provide a method of manufacturing the magnetic detection device. <P>SOLUTION: The magnetic detection device includes: a magnet; and a magnetic sensor section that is disposed with an interval to the magnet and includes a magnetic detection element where electric characteristics vary by a change in an external magnetic field from the magnet. In the magnetic detection device, the magnetic sensor section includes a sensor chip having the magnetic detection element, a lead frame that includes a plurality of lead sections and is electrically connected to the magnetic detection element, a base section for installing the sensor chips, a resin body formed in the lead frame so that a connection region with the base region, an external connection terminal at a tip of each lead section, and the magnetic detection element is exposed, and a sealing material for sealing the sensor chip. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a magnetic detection device for detecting a change in an external magnetic field applied from a magnet, in which a magnetic sensor unit and a magnet are arranged at an interval.

  The magnetic detection device includes a magnetic sensor unit and a magnet. Conventionally, a magnetic sensor unit is formed by mounting a magnetic detection element on a printed board, sealing with resin, and crimping external connection terminals on the printed board.

The above configuration has a problem that the workability of the magnetic sensor unit is poor.
JP 2004-39666 A JP 2005-5360 A JP-A-2005-235507

  Patent Document 1 discloses a configuration in which the body portion 11 is outsert-molded with respect to the metal plate frame 100 ([0029] column of Patent Document 1, FIG. 5B).

  In addition, a lead insertion slit 15 is formed in the main body 11, and a lead 30 is inserted into the lead insertion slit 15 ([0031] column of Patent Document 1, FIG. 5C).

  Then, the IC bare chip 60 is bonded to the upper surface of the metal plate 20 with an adhesive ([0036] column of Patent Document 1, FIG. 8A), and then wire bonding and resin sealing are performed (Patent Document 1). [0037] column, [0038] column, FIGS. 8 and 9).

  However, in the invention described in Patent Document 1, the lead must be inserted into a lead insertion slit formed in the main body, and the workability is still poor. In the configurations of Patent Documents 1 and 2, Thinning could not be effectively promoted.

  In addition, none of the inventions described in Patent Documents 1 to 3 discloses a configuration of a magnetic detection device having a magnet and a magnetic sensor unit.

  In particular, in the magnetic detection device, the positioning accuracy of the sensor chip mounted on the magnetic sensor unit with respect to the magnet is important for improving the detection accuracy.

  In the magnetic detection device, the sensor chip constituting the magnetic sensor unit is sealed with resin, and in the conventional configuration, it is necessary to use the outer shape of the package itself constituting the magnetic sensor unit for alignment. . However, there is a problem that the positioning accuracy of the sensor chip with respect to the magnet deteriorates due to variations in positional accuracy between the package and the sensor chip and variations in the package external shape.

  Therefore, the present invention is to solve the above-described conventional problems, and in particular, to provide a magnetic detection device that can be formed with good workability and can align a sensor chip with high accuracy, and a method for manufacturing the same. .

The present invention relates to a magnetic detection device including a magnet and a magnetic sensor unit that includes a magnetic detection element that is arranged with a gap between the magnets and has an electric characteristic that changes due to a change in an external magnetic field from the magnet.
The magnetic sensor unit includes a sensor chip including the magnetic detection element, a lead frame that includes a plurality of lead units and is electrically connected to the magnetic detection element, and a base unit for installing the sensor chip. A resin body molded on the lead frame so that a connection region between the base portion, the external connection terminal at the tip of each lead portion and the magnetic detection element is exposed; and a sealing material for sealing the sensor chip; , And is configured.

  Thereby, compared with the past, a magnetic sensor part can be formed with a simple structure, and it is possible to improve the manufacture workability | operativity of a magnetic sensor part. It can also contribute to thinning.

  In this invention, it is preferable that the said resin body is provided with the common positioning part with respect to the case which installs the said sensor chip and the said magnetic sensor part. Thereby, the positioning accuracy with respect to the case of the sensor chip, and hence the positioning accuracy with respect to the magnet, can be improved, and a magnetic detection device having excellent detection accuracy can be obtained. Moreover, the assembly workability | operativity with respect to the case of a magnetic sensor part can be improved.

  Moreover, in this invention, it is preferable that the said magnetic sensor part and the installation part of the said magnet are provided in the said common case. Thereby, the number of parts can be reduced and the positioning accuracy of the sensor chip with respect to the magnet can be more effectively improved.

  In the present invention, it is preferable that the resin body is formed in the same plane region of the lead frame, and the external connection terminal protrudes from a side surface of the resin body. Thereby, thinning can be effectively promoted.

The present invention also provides a method of manufacturing a magnetic detection device comprising a magnet and a magnetic sensor unit that includes a magnetic detection element that is disposed at an interval from the magnet and has an electric characteristic that changes due to a change in an external magnetic field from the magnet. In
(A) processing a metal plate to form a lead frame having a base portion and a plurality of lead portions for installing a sensor chip equipped with a magnetic detection element;
(B) forming a resin body on the lead frame so as to expose the base portion, the external connection portion at the tip of each lead portion, and the connection region electrically connected to the magnetic detection element;
(C) installing the sensor chip on the base and electrically connecting the magnetic detection element and the connection region;
(D) sealing the sensor chip with a sealing material;
And forming the magnetic sensor portion.

  Due to the above, the magnetic sensor part can be formed with a simple configuration as compared with the conventional case, the manufacturing workability of the magnetic sensor part can be improved, and the thinning can be promoted.

In the present invention, in the step (b), a positioning part is formed on the resin body,
In the step (c), the sensor chip is installed on the base portion with the positioning portion as a reference, and
After the step (d), it is preferable that the magnetic sensor unit is installed in the case with reference to the positioning unit common to the step (c). Thereby, the positioning accuracy with respect to the case of the sensor chip, and hence the positioning accuracy with respect to the magnet, can be improved, and a magnetic detection device having excellent detection accuracy can be manufactured. Moreover, the assembly workability | operativity with respect to the case of a magnetic sensor part can be improved.

  In the present invention, it is preferable that the case is provided with the magnetic sensor unit and the magnet installation unit, and the magnetic sensor unit and the magnet are installed in the common case. Thereby, the number of parts can be reduced and the positioning accuracy of the sensor chip with respect to the magnet can be more effectively improved.

  In the present invention, in the step (b), it is preferable that the resin body is molded in the same plane area of the lead frame, and the external connection terminal is projected from the side surface of the resin body. Thereby, thickness reduction can be promoted effectively.

  In the present invention, in the step (a), the metal plate is formed of a hoop material in which a plurality of the lead frames are connected. In the step (b), the resin body is formed for each lead frame. In addition, it is preferable to have a step of separating each lead frame after the step (d). Many magnetic sensor portions can be formed at a time, and the manufacturing efficiency can be improved.

  In the present invention, it is preferable that in the step (a), a connecting portion that connects adjacent lead portions is formed, and the connecting portion is cut between the step (b) and the step (c). .

  When molding the resin body, fluttering of each lead portion can be suppressed, and the resin body can be appropriately molded on the lead frame.

  In the step (a), the tip of each lead portion is connected to the frame of the metal plate via a connecting portion, and the connecting portion is cut between the step (b) and the step (c). The lead portions are preferably separated from the frame body of the metal plate. When molding the resin body, fluttering of each lead portion can be suppressed, and the resin body can be appropriately molded on the lead frame.

  According to the present invention, it is possible to form the magnetic sensor portion with a simpler structure than in the prior art, and it is possible to improve the manufacturing workability of the magnetic sensor portion. Moreover, it can contribute to thickness reduction.

  Furthermore, the positioning accuracy of the sensor chip with respect to the case, and hence the positioning accuracy with respect to the magnet, can be improved, and a magnetic detection device with excellent detection accuracy can be manufactured. Moreover, the assembly workability | operativity with respect to the case of a magnetic sensor part can be improved.

  1 is a partially exploded perspective view of the magnetic detection device of the present embodiment, FIG. 2 is a plan view of the magnetic sensor unit of the present embodiment, and FIG. 3 is an arrow cut along the line AA shown in FIG. FIG. 4 is a partial enlarged plan view of the magnetic sensor unit (with the sealing resin removed), and FIG. 5 is a portion of the lead frame that constitutes the magnetic sensor unit. FIG.

  The magnetic detection device 1 shown in FIG. 1 includes a magnet 2, a case 3, and a magnetic sensor unit 4. In this embodiment, the magnet 2 is formed in a ring shape, is fixed to a bearing (not shown), and is rotatably supported. The magnet 2 may have a shape other than the ring shape, and the movement of the magnet 2 is not limited to rotation.

  A recess 5 for housing the magnet 2 is formed on the surface 3 a of the case 3. Further, the back surface of the case 3 serves as an installation portion 3 b for the magnetic sensor unit 4. That is, in the embodiment of FIG. 1, the common case 3 is provided with an installation part for the magnet 2 and the magnetic sensor part 4. There is a gap between the magnet 2 and the magnetic sensor unit 4, and the magnet 2 and the magnetic sensor unit 4 are not in contact with each other.

  The magnetic sensor 4 includes a sensor chip, a lead frame, a resin body, and a sealing material.

  As shown in FIG. 4, the sensor chip includes a first sensor chip 10 having magnetic detection elements 6 and 7 and a second sensor chip 11 having magnetic detection elements 8 and 9.

  Each of the magnetic detection elements 6 to 9 is an element whose electrical characteristics change due to a change in the external magnetic field from the magnet 2. The magnetic detection elements 6 to 9 are preferably magnetoresistive elements using the magnetoresistive effect (MR effect) of GMR elements, AMR elements, or TMR elements. However, depending on the positional relationship with the magnet 2, the magnetic detection elements 6 to 9 can be formed of Hall elements or the like.

  When the magnetic detection elements 6 to 9 are GMR elements or TMR elements, the laminated film includes a fixed magnetic layer whose magnetization is fixed. The fixed magnetization direction of the fixed magnetic layer is mounted on the first sensor chip 10. The magnetic detection elements 6 and 7 and the magnetic detection elements 8 and 9 mounted on the second sensor chip 11 are antiparallel.

  Further, the planar shape of the magnetic detection elements 6 and 7 is not particularly limited, but in the case of the GMR element described above, it is preferable that the magnetic detection elements 6 and 7 are formed in a meander shape in order to increase the electric resistance value.

  As the magnet 2 rotates, the external magnetic field acting on each of the magnetic detection elements 6 to 9 fluctuates. Therefore, when each of the magnetic detection elements 6 to 9 is a magnetoresistive effect element, the electricity of each of the magnetic detection elements 6 to 9 is changed. The resistance value changes. The magnetic detection elements 6 and 7 have the same electrical resistance change, and the magnetic detection elements 8 and 9 have the same electrical resistance change. However, the magnetic detection elements 6 and 7 and the magnetic detection elements 8 and 9 have the same electrical resistance change. This is the opposite electrical resistance change. That is, for example, when the magnetic detection elements 6 and 7 have the minimum resistance value, the magnetic detection elements 8 and 9 have the maximum resistance value, and when the magnetic detection elements 6 and 7 have the maximum resistance value, the magnetic detection elements 8 and 9 Is the minimum resistance value.

  As shown in FIG. 4, electrode pads 6a, 6b-9a, 9b are formed on both sides of each magnetic detection element 6-9.

  The lead frame 12 is formed by processing a metal plate, and includes a plurality of lead portions 13 to 16 as shown in FIG. All the lead portions 13 to 16 are formed in the same plane except for the external connection terminal portion. As shown in FIGS. 4 and 5, the first lead portion 13 is integrally formed with a base portion 17 for installing the first sensor chip 10 and the second sensor chip 11. That is, the base portion 17 is also made of metal. The external connection terminal 13a at the tip of the first lead portion 13 is a ground terminal (see FIGS. 1, 2, and 5). Therefore, the base portion 17 is also at the ground potential.

  The external connection terminal 14a at the tip of the second lead portion 14 is an input terminal (power supply terminal), and the external connection terminals 15a and 16a at the tip of the third lead portion 15 and the tip of the fourth lead portion 16 are output terminals, respectively. .

  The types of the external connection terminals 13a to 16a of the lead portions 13 to 16 may be other than those described above. For example, the external connection terminal 13a of the first lead portion 13 may be an input terminal, and the external connection terminal 14a of the second lead portion 14 may be a ground terminal.

  The first sensor chip 10 and the second sensor chip 11 are fixed to the base portion 17 with an adhesive. As shown in FIG. 4, the magnetic detection elements 6 to 9, the lead portions 13 to 16, and the base portion 17 are electrically connected by wire bonding. As shown in FIG. 4, the electrode pad 6 a of the magnetic detection element 6 and the base portion 17 are electrically connected via a wire 18. Since the base portion 17 is at the ground potential as described above, the base portion 17 can be used as the first lead portion 13 and can be connected to the base portion 17. Further, as shown in FIG. 4, the electrode pad 6 b of the magnetic detection element 6 and the third lead portion 15 are electrically connected via a wire 18. Further, as shown in FIG. 4, the electrode pad 7 a of the magnetic detection element 7 and the second lead portion 14 are electrically connected via a wire 18. Further, as shown in FIG. 4, the electrode pad 7 b of the magnetic detection element 7 and the fourth lead portion 16 are electrically connected via a wire 18. Further, as shown in FIG. 4, the electrode pad 8 a of the magnetic detection element 8 and the first lead portion 13 are electrically connected via a wire 18. As shown in FIG. 4, the electrode pad 8 b of the magnetic detection element 8 and the fourth lead portion 16 are electrically connected via a wire 18. Further, as shown in FIG. 4, the electrode pad 9 a of the magnetic detection element 9 and the second lead portion 14 are electrically connected via a wire 18. As shown in FIG. 4, the electrode pad 9 b of the magnetic detection element 9 and the third lead portion 15 are electrically connected via a wire 18.

  With the electrical wiring described above, a full bridge circuit can be configured by the magnetic detection elements 6 to 9, and a large differential output can be obtained.

  As shown in FIGS. 1 to 3, a resin body 20 is formed on the lead frame 12, and the space between the lead portions and the upper and lower surfaces of the lead portions are filled with the resin body 20.

  It is preferable that the resin body 20 is a thermoplastic resin because it is easy to obtain an outer shape accuracy by injection molding.

  As shown in FIGS. 1 to 4, the resin body 20 exposes the connection regions of the external connection terminals 13 a to 16 a, the base portion 17, and the magnetic detection elements 6 to 9 in the lead portions 13 to 16. The lead frame 12 is molded.

  The resin body 20 is formed in the same plane area of the lead frame 12, and the external connection terminals 13a to 16a protrude outward from the side surface of the resin body 20 (see FIGS. 2 and 3). .

  As shown in FIG. 4, a substantially circular space 20 a is formed in a substantially central region of the resin body 20. In this space 20 a, the base 17 and the magnetic detection elements 6 in the lead portions 13 to 16 are formed. The connection area | region with ~ 9 is exposed. Therefore, as shown in FIG. 4, the first sensor chip 10 and the second sensor chip 11 can be installed on the base portion 17 exposed in the space 20a of the resin body 20, and the electrode pads 6a, 6b to 9a, 9b and each lead part 13-16 and between the base parts 17 can be electrically connected.

  When the resin body 20 is molded, at the same time, the space between the lead portions 13 to 16 is filled with the resin layer 19 so that the surface of the resin layer 19 and the surfaces of the lead portions 13 to 16 are substantially flush with each other. (See FIG. 4).

  As shown in FIGS. 1 to 3, the space 20 a is sealed with a resin (sealing material) 22. The resin 22 is, for example, an epoxy resin. The resin 22 may be a thermoplastic resin or a thermosetting resin.

  When the sensor chips 10 and 11 are installed on the base portion 17, the positioning is performed on the basis of the positioning portion 21 formed on the resin body 20. As shown in FIGS. 1 and 2, four positioning portions 21 are provided, but it is not necessary to use all of them as positioning portions 21, and the number of positioning portions 21 can be arbitrarily set. In this embodiment, the positioning part 21 is formed by a hole.

  The positioning unit 21 is also used as a positioning unit when the magnetic sensor unit 4 is installed on the installation unit 3 b of the case 3. That is, the resin body 20 is provided with a common positioning portion 21 for the case 3 in which the sensor chips 10 and 11 and the magnetic sensor portion 4 are installed.

  A method for manufacturing the magnetic sensor unit 4 in the present embodiment will be described with reference to FIGS. Each figure is a plan view.

  In the process shown in FIG. 6, a hoop material 31 in which a plurality of lead frames 12 are connected from a metal plate 30 is formed.

  FIG. 7 is an enlarged plan view showing one lead frame 12 of FIG. 6 in an enlarged manner. As shown in FIG. 7, the four lead portions 13 to 16 constituting the lead frame 12 are formed at intervals, and the base portion 17 for installing the sensor chips 10 and 11 is formed as the first lead. It is formed integrally with the part 13. Further, as shown in FIG. 7, a connecting part 32 for connecting the adjacent first lead part 13 and the second lead part 14 and a connecting part 33 for connecting the third lead part 15 and the fourth lead part 16 are provided. Forming. Further, as shown in FIG. 7, a support portion 34 for supporting the lead frame 12 is formed on the frame 30 a of the metal plate 30. Moreover, as shown in FIG. 7, the front ends (portions that later become external connection terminals) 13a to 16a of the lead portions 13 to 16 are connected to the frame body 30a of the metal plate 30 via the connecting portions 13b to 16b. .

  Next, in the step shown in FIG. 8, the resin body 20 is molded for each lead frame 12. At this time, it is preferable to form the resin body 20 with a thermoplastic resin. The resin body 20 is formed in the same plane area of the lead frame 12. In the process shown in FIG. 8, a space 20 a is formed at a substantially central position of the resin body 20, and each lead portion 13 that is electrically connected to the base portion 17 and the magnetic detection elements 6 to 9 in the space 20 a. Expose ~ 16 connection areas. At the same time as the molding of the resin body 20, the space between the lead portions 13 to 16 is filled with the resin layer 19 so that the surface of the resin layer 19 and the surfaces of the lead portions 13 to 16 are almost flush with each other ( (See also FIG. 4). In the step of FIG. 8, the tips 13 c to 16 c of the lead portions 13 to 16 are protruded from the side surface of the resin body 20.

  Further, as shown in FIG. 8, a hole-shaped positioning portion 21 is formed in the resin body 20. Further, holes 35 and 36 are formed at positions where the positions of the connecting portions 32 and 33 of the lead portion are exposed.

  As described above, the first lead portion 13 and the second lead portion 14 and the third lead portion 15 and the fourth lead portion 16 are connected by the connecting portions 32 and 33, respectively. 16 are connected to the frame body 30a of the metal plate 30 via the connecting portions 13b to 16b. This allows the lead portions 13 to 16 to flutter when the resin body 20 is molded. The resin body 20 can be appropriately formed on the lead frame 12.

  Next, in the step shown in FIG. 9, the connecting portions 13 b to 16 b are cut from the frame body 30 a of the metal plate 30, and the tips 13 c to 16 c of the lead portions 13 to 16 are separated from the frame body 30 a of the metal plate 30. The tips of the separated lead portions 13 to 16 become external connection terminals 13a to 16a.

  Subsequently, the external connection terminals 13a to 16a are bent. In the step of FIG. 9, the connecting portions 32 and 33 exposed from the holes 35 and 36 are cut, and the lead portions 13 to 16 are electrically separated. The process of FIG. 9 may be completed before the electrical test performed after mounting the sensor chip. However, if the lead frame is cut after mounting the sensor chip, the influence of stress at the time of cutting is detected by the sensor. Since there is a possibility that the chip will receive, it is preferable to perform the process of FIG. 9 before mounting the sensor chip.

  Next, in the step of FIG. 10, the sensor chips 10 and 11 are mounted. FIG. 10 is a partially enlarged plan view showing the space 20a formed in the resin body 20 in an enlarged manner. As shown in FIG. 10, the first sensor chip 10 and the second sensor chip 11 are fixed on the base portion 17 via an adhesive (die bonding). At this time, the first sensor chip 10 and the second sensor chip 11 are installed based on the positioning portion 21 formed on the resin body 20 shown in FIG. Furthermore, the lead portions 13-16 exposed between the electrode pads 6a, 6b-9a, 9b (see FIG. 4) of the magnetic detection elements 6-9 mounted on the sensor chips 10, 11 and in the space portion 20a, and The base part 17 is electrically connected by wire bonding.

  Next, in the step of FIG. 11, the space 20 a formed in each resin body 20 is sealed with resin 22, and then the support portion of each lead frame 12 connected to the frame body 30 a of the metal plate 30. 34 is cut. Thereby, the several magnetic sensor part 4 can be manufactured simultaneously.

  The electrical test for the magnetic sensor unit 4 can be performed after being separated into individual magnetic sensors 1 as shown in FIG. 11, or a number of magnetic sensor units before cutting the support unit 34 are connected. It can also be performed continuously in a state (multiple state). Test efficiency can be improved by performing in a multiple state.

  Subsequently, the magnetic sensor unit 4 shown in FIG. 11 is installed on the installation unit 3b of the case 3 shown in FIG. At this time, the magnetic sensor unit 4 is installed in the case 3 with reference to the positioning unit 21 formed in the resin body 20. The case 3 is formed with a recess 5 for accommodating the magnet 2, and the magnet 2 is installed in the recess 5 of the case 3. The timing of installation of the magnet 2 is not particularly limited.

  As described above, in the present embodiment, the magnetic sensor has a simple configuration through simple steps such as formation of the lead frame 12, molding of the resin body 20, installation and electrical connection of the sensor chips 10 and 11, and sealing with the resin 22. Part 4 can be manufactured. In particular, by using the configuration of the present embodiment, it can be performed in a process directly connected from formation of the hoop material 31 to component assembly. Therefore, it is possible to improve manufacturing workability compared with the conventional case.

  In the present embodiment, the resin body 20 is molded in the same plane region of the lead frame 12, and the tips of the lead portions 13 to 16 protrude from the side surfaces of the resin body 20 as external connection terminals 13 a to 16 a. Therefore, as shown in FIG. 3, the thickness of the resin body 20 can be formed very thin, and the thinning can be effectively promoted.

  In particular, in the magnetic detection device 1 shown in FIG. 1, the alignment of the sensor chips 10 and 11 with respect to the case 3 and thus the magnet 2 is extremely important in order to obtain good detection accuracy. Since the sensor chips 10 and 11 are sealed with the resin 22, the sensor chips 10 and 11 cannot be directly aligned with the case 3 and the magnetic sensor unit 4 cannot be installed in the case 3. On the other hand, in the present embodiment, the common positioning portion 21 when the sensor chips 10 and 11 are installed on the base portion 17 and the magnetic sensor portion 4 is installed on the case 3 on the resin body 20 is provided. Is formed. Thereby, the positioning accuracy with respect to the case 3 of the sensor chips 10 and 11 and the positioning accuracy with respect to the magnet 2 can be improved, and the magnetic detection device 1 excellent in detection accuracy can be manufactured. Moreover, the assembly workability | operativity with respect to case 3 of the magnetic sensor part 4 can be improved. Further, the base portion 17 is formed as a part of the same plane area of the lead frame 12, and the sensor chips 10 and 11 are installed using the base portion 17 as a reference plane. Dimensional accuracy in the vertical direction is also easily obtained. Further, since the base portion 17 is formed integrally with one lead portion, the base portion 17 can be used as a lead portion, and the base portion 17 can be used as an electrical connection region with a magnetic detection element.

  Further, as shown in FIG. 1, the installation portion for the magnetic sensor unit 4 and the magnet 2 is provided in a common case 3. Thereby, the number of parts can be reduced and the positioning accuracy of the sensor chips 10 and 11 with respect to the magnet 2 can be effectively improved.

Partially exploded perspective view of the magnetic detection device of the present embodiment, The top view of the magnetic sensor part of this embodiment, Sectional drawing of the magnetic sensor part cut | disconnected along the AA line shown in FIG. Partial enlarged plan view of the magnetic sensor unit (however, the sealing resin is removed), A partial plan view of a lead frame constituting the magnetic sensor unit; 1 process figure (plan view) which shows the manufacturing method of the magnetic sensor part of this embodiment, FIG. 7 is an enlarged plan view of one lead frame shown in FIG. One process diagram (plan view) performed next to FIG. One process diagram (plan view) performed after FIG. One process diagram (partial enlarged plan view) performed next to FIG. One process diagram (plan view) performed next to FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Magnetic detection apparatus 2 Magnet 3 Case 4 Magnetic sensor part 6-9 Magnetic detection element 10, 11 Sensor chip 12 Lead frame 13-16 Lead part 13a-16a External connection terminal 13b-16b, 32, 33 Connection part 17 Base part 20 Resin body 20a Space portion 21 Positioning portion 22 Resin 30 Metal plate 30a Frame body 31 Hoop material 34 Support portions 35 and 36 Holes

Claims (11)

  1. In a magnetic detection device having a magnet and a magnetic sensor unit provided with a magnetic detection element that is arranged at an interval from the magnet and changes in electrical characteristics due to a change in an external magnetic field from the magnet,
    The magnetic sensor unit includes a sensor chip including the magnetic detection element, a lead frame that includes a plurality of lead units and is electrically connected to the magnetic detection element, and a base unit for installing the sensor chip. A resin body molded on the lead frame so that a connection region between the base portion, the external connection terminal at the tip of each lead portion and the magnetic detection element is exposed; and a sealing material for sealing the sensor chip; And a magnetic detection device.
  2.   The magnetic detection device according to claim 1, wherein the resin body is provided with a common positioning portion for the sensor chip and a case in which the magnetic sensor portion is installed.
  3.   The magnetic detection device according to claim 2, wherein the magnetic sensor unit and the magnet installation unit are provided in a common case.
  4.   4. The magnetic detection device according to claim 1, wherein the resin body is formed in the same plane region of the lead frame, and the external connection terminal protrudes from a side surface of the resin body. 5.
  5. In a method of manufacturing a magnetic detection device, comprising: a magnet; and a magnetic sensor unit including a magnetic detection element that is disposed at an interval from the magnet and has an electric characteristic that changes due to a change in an external magnetic field from the magnet.
    (A) processing a metal plate to form a lead frame having a base portion and a plurality of lead portions for installing a sensor chip equipped with a magnetic detection element;
    (B) a step of molding a resin body on the lead frame so as to expose a connection region electrically connected to the base portion, the external connection terminal at the tip of each lead portion, and the magnetic detection element;
    (C) installing the sensor chip on the base and electrically connecting the magnetic detection element and the connection region;
    (D) sealing the sensor chip with a sealing material;
    And forming the magnetic sensor unit.
  6. In the step (b), a positioning part is formed on the resin body,
    In the step (c), the sensor chip is installed on the base portion with the positioning portion as a reference, and
    The method of manufacturing the detection device according to claim 5, wherein after the step (d), the magnetic sensor unit is installed in a case with reference to the positioning unit common to the step (c).
  7.   The method of manufacturing a magnetic detection device according to claim 6, wherein the case is provided with the magnetic sensor unit and the magnet installation unit, and the magnetic sensor unit and the magnet are installed in the common case.
  8.   8. The magnetism according to claim 5, wherein in the step (b), the resin body is formed in the same plane region of the lead frame, and the external connection terminal is protruded from a side surface of the resin body. A method for manufacturing a detection device.
  9.   In the step (a), a hoop material in which a plurality of the lead frames are continuously provided is formed from the metal plate, and in the step (b), the resin body is molded with respect to each lead frame. The method for manufacturing a magnetic detection device according to claim 5, further comprising a step of separating each lead frame after the step d).
  10.   The said (a) process WHEREIN: The connection part which connects between adjacent lead parts is formed, The said connection part is cut | disconnected between the said (b) process and the said (c) process. 2. A method for manufacturing the magnetic detection device according to item 1.
  11.   In the step (a), the tip of each lead portion is connected to the frame of the metal plate via a connecting portion, and the connecting portion is cut between the step (b) and the step (c), The method of manufacturing a magnetic detection device according to claim 5, wherein each lead portion is divided from a frame body of the metal plate.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8816683B2 (en) 2012-03-05 2014-08-26 Industrial Technology Research Institute Magnetic field sensing methods and megnetic field sensing apparatuses using tunneling magneto-resistor devices
US9372243B2 (en) 2013-08-22 2016-06-21 Tdk Corporation Magnetic sensor
JP2016523008A (en) * 2013-04-01 2016-08-04 江▲蘇▼多▲維▼科技有限公司Multidimension Technology Co., Ltd. Push-pull flip chip half-bridge magnetoresistive switch
TWI644112B (en) * 2016-12-14 2018-12-11 旺玖科技股份有限公司 Sensor for sensing usage status of electrical device and its associated method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666906A (en) * 1992-08-18 1994-03-11 Fujitsu Ltd A magnetic sensor
JP2003007946A (en) * 2001-06-27 2003-01-10 Enomoto Co Ltd Lead frame for surface-mounting led and manufacturing method thereof
JP2004039666A (en) * 2002-06-28 2004-02-05 Fujitsu Component Ltd General-purpose package for semiconductor bare chip
JP2007218799A (en) * 2006-02-17 2007-08-30 Asahi Kasei Electronics Co Ltd Semiconductor magnetoresistive element and magnetic sensor module using the same
JP2008134083A (en) * 2006-11-27 2008-06-12 Tokai Rika Co Ltd Magnetometric sensor and method of manufacturing magnetometric sensor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666906A (en) * 1992-08-18 1994-03-11 Fujitsu Ltd A magnetic sensor
JP2003007946A (en) * 2001-06-27 2003-01-10 Enomoto Co Ltd Lead frame for surface-mounting led and manufacturing method thereof
JP2004039666A (en) * 2002-06-28 2004-02-05 Fujitsu Component Ltd General-purpose package for semiconductor bare chip
JP2007218799A (en) * 2006-02-17 2007-08-30 Asahi Kasei Electronics Co Ltd Semiconductor magnetoresistive element and magnetic sensor module using the same
JP2008134083A (en) * 2006-11-27 2008-06-12 Tokai Rika Co Ltd Magnetometric sensor and method of manufacturing magnetometric sensor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8816683B2 (en) 2012-03-05 2014-08-26 Industrial Technology Research Institute Magnetic field sensing methods and megnetic field sensing apparatuses using tunneling magneto-resistor devices
JP2016523008A (en) * 2013-04-01 2016-08-04 江▲蘇▼多▲維▼科技有限公司Multidimension Technology Co., Ltd. Push-pull flip chip half-bridge magnetoresistive switch
US9372243B2 (en) 2013-08-22 2016-06-21 Tdk Corporation Magnetic sensor
TWI644112B (en) * 2016-12-14 2018-12-11 旺玖科技股份有限公司 Sensor for sensing usage status of electrical device and its associated method

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JP5356793B2 (en) 2013-12-04

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