JP4952126B2 - Manufacturing method of pre-molded part for light emitting diode package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pre-molding component for a light emitting diode package which has a structure where length of a wire can be shortened even if a heat sink is made high for improving heat dissipation, and to provide a manufacturing method for efficiently and inexpensively manufacturing the pre-molding component with the small number of processes and the light emitting diode package using the pre-molding component and having sufficient heat dissipation. <P>SOLUTION: A first lead 3 and a second lead 4 are formed of the same materials as the heat sink 2 whose cross section is a convex shape, and are bent and formed in such a way that they become the same height as an upper face of the heat sink 2. Main body resin molds 5 are embedded in gaps between the heat sink 2 and the first lead 3 and between the heat sink 2 and the second lead 4 so as to constitute the pre-molding component 9. A light emitting diode element 1 is mounted on the heat sink 2, and it is connected with the first lead 3 and the second lead 4 through the wires 7 and 8. They are covered with hemispherical transparent resin 6, and the light emitting diode package 10 is obtained. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a pre-molded part for a light-emitting diode package, a method for manufacturing the same, and a light-emitting diode package, and more particularly, to a pre-molded part for a light-emitting diode package having a structure capable of improving heat dissipation and shortening a wire length. The present invention relates to a manufacturing method capable of efficiently manufacturing a molded component at a low cost and with a small number of processes, and a light-emitting diode package having good heat dissipation using the pre-molded component.

  Light emitting diodes generate a large amount of heat when converting electricity into light. This heat generation lowers the conversion efficiency from electricity to light and falls into a vicious cycle of generating heat. Therefore, in order to increase the luminance of the light emitting diode, it is necessary to quickly diffuse the generated heat. For heat diffusion, a heat sink is provided under the light emitting diode element.

FIG. 8 shows an example of a conventional light emitting diode package.
The light emitting diode package 60 includes a light emitting diode element 61, a heat sink 62 for mounting the element 61, a first lead 63 and a second lead 64 connected to the element 61, a main body resin mold 65 for integrating the whole, and an element 61. And a transparent resin 66 that functions as a lens. The heat sink 62 is often made of copper having good thermal conductivity. In addition, a conical recess may be provided in the heat sink 62 so as to have a purpose of a reflecting plate that reflects light generated from the light emitting diode element 61 forward (see, for example, Patent Document 1).

FIG. 9 shows an outline of a process for manufacturing a premolded part for mounting a light emitting diode element in a conventional light emitting diode package (FIG. 8).
First, as shown in FIG. 9A, the pre-molded component separately includes a heat sink 62 for heat dissipation, and a first lead 63 and a second lead 64 for electrically connecting the light emitting diode elements. After forming and preparing and setting these in a metal mold, as shown in FIG. 9B, a resin is injected to form a main body resin mold 65, and the whole is manufactured integrally.

In addition, as shown in FIG. 10, there is a method for manufacturing a premolded part using a modified cross section 70 in which a heat sink part 71 and a lead part 72 are formed in advance.
Japanese Unexamined Patent Publication No. 2000-150967 (FIG. 1)

  However, in the method shown in FIG. 9, since it is necessary to prepare each component separately, the number of steps increases and the cost increases. In addition, there is a problem that the setting to the mold is complicated and it takes time to manufacture.

  On the other hand, in the method using one irregular cross section strip shown in FIG. 10, generally, the convex portion of the heat sink portion 71 is formed high in order to improve heat dissipation. Then, when a light emitting diode element is mounted on the heat sink part 71, the distance between the light emitting diode element and the lead part 72 is increased, and the wire for electrically joining the element and the lead part 72 becomes long. End up. For this reason, there is a problem that the possibility of wire breakage increases in the manufacturing process, and the cost increases due to the wire material.

  Accordingly, an object of the present invention is to solve the above-mentioned problems and to improve the heat dissipation, even if the heat sink portion is formed high, the wire length can be shortened, and the pre-molded part for the light emitting diode package, and An object of the present invention is to provide a manufacturing method capable of efficiently manufacturing a molded component with a low number of steps and a low cost, and a light emitting diode package with good heat dissipation using the premolded component.

In order to achieve the above object, a method for manufacturing a pre-molded part for a light emitting diode package according to the present invention is to prepare a deformed cross section consisting of a plate-like body having a convex cross section and to form a slit at a predetermined location of the deformed cross section. A partition defining step for finally defining a first partition in which the heat sink is formed, and a second partition in which the first lead and the second lead are finally formed, and a plate shape in the second partition The body is bent toward the first section at a plurality of predetermined locations in the second section, and the top surfaces of the convex portions of the heat sink in the first section are connected to the tip portions of the first lead and the second lead. same height or located on the top than the convex upper surface, and as close to the protrusion upper surface of said heat sink and said heat sink, said first lead, a bending process of forming the second lead, before Heat sink, the first lead, and characterized in that it comprises a molding step of molding the gap resin between said second lead. Moreover, what has the height of the convex part changed in at least two steps can be used as the irregular shaped cross section.

  According to the pre-molded part for a light emitting diode package of the present invention, the distance between the light emitting diode element and the lead part is not increased even if the heat sink part is formed high in order to improve heat dissipation, and the wire length is shortened. it can. For this reason, the possibility of wire breakage is reduced and the cost due to the wire material can be suppressed.

  In addition, according to the method for manufacturing a pre-molded part for a light emitting diode package of the present invention, the above-mentioned pre-molded part can be manufactured efficiently and inexpensively from the same material with a small number of steps.

  Furthermore, according to the light emitting diode package of the present invention, the heat dissipation can be improved, so that the conversion efficiency from electricity to light can be maintained well and the luminance of the light emitting diode can be increased.

Embodiments of the present invention will be described below with reference to the drawings.
[First Embodiment]
(Overall structure of light emitting diode package)
FIG. 1 shows a cross-sectional structure of a light emitting diode package according to this embodiment.
In the light emitting diode package 10, the first lead 3 and the second lead 4 made of the same material as the heat sink 2 having a convex cross section made of a copper alloy plate are bent so as to be the same height as the upper surface of the heat sink 2, The main body resin mold 5 is embedded in the gap between the heat sink 2 and the first lead 3 and the second lead 4, so that they are integrally fixed to constitute a premolded part 9. The light-emitting diode element 1 is mounted on the heat sink 2 of the pre-molded component 9, and the light-emitting diode element 1 is connected to the first lead 3 and the second lead 4 via the wire 7 and the wire 8, respectively. It is covered with a hemispherical transparent resin 6.

(Pre-mold part manufacturing method)
FIG. 2 shows a perspective view of a modified cross-section strip which is a material of the premolded part 9 of FIG.
The deformed section strip 15 is formed of a plate-like body having a thick plate portion 15a and a thin plate portion 15b. As the material of the plate-like body, a copper alloy having excellent conductivity and thermal conductivity is preferably used.
FIG. 3 is a diagram in which a predetermined pattern is formed by forming the deformed cross-section strip 15 of FIG.
The deformed cross-section strip 20 is formed with slits 23 at predetermined locations, and finally the thick plate portion 21 and the thin plate portion 22 that are to be heat sinks, the thin plate portion 25 that is to be the first lead, and finally The second lead is divided into thin plate portions 26, which are connected to the lead frame 24 by unpunched portions 27.

FIG. 4 shows a method of forming the premolded part 9 using the modified cross-section strip 20.
First, the modified cross-section strip 20 shown in FIG. 3 is prepared (a), and the thin plate portion 25 and the thin plate portion 26 are bent by 90 ° toward the thick plate portion 21 at predetermined locations near the slit 23 (b). Further, the thin plate portion 25 and the thin plate portion 26 are bent at 90 ° toward the thick plate portion 21 at predetermined positions near the center, respectively, and adjusted so as to have the same height as the surface of the thick plate portion 21. 3 and the second lead 4 (c).

  Next, the thick plate portion 21 and the thin plate portion 22 forming the heat sink, the first lead 3 and the second lead 4 are set in a mold while being connected to the lead frame, and are molded with resin. At this time, the resin is prevented from flowing through the upper surface of the thick plate portion 21 to be a reflective portion and the portions of the upper surfaces of the first lead 3 and the second lead 4 where wire bonding is performed. As a result, the main body resin mold 5 is embedded in the gap between the heat sink 2 and the first lead 3 and the second lead 4, and the premold component 9 is integrally fixed.

  In order to manufacture the light emitting diode package 10 using the pre-molded component 9, the light emitting diode element 1 is joined to the upper surface of the heat sink 2 by soldering, and the anode electrode and the cathode electrode of the light emitting diode element 1 are wire-bonded to the first lead. 3. Electrically joined to the second lead 4 and sealed the light emitting diode element 1 with a transparent resin 6, and then separated from the lead frame. Thus, the light emitting diode package 10 shown in FIG. 1 is completed.

(Effects of the first embodiment)
(1) The upper surface of the heat sink 2 is formed by bending the thin plate portions 25 and 26 twice by using the deformed cross-section strip 20 having a step formed by the thick plate portion 21 and the thin plate portion 22, using the thick plate portion 21 as the heat sink 2. Since the role of the lead is provided close to the distance, the distance between the light emitting diode element 1 and the first lead 3 and the second lead 4 is not increased, and the lengths of the wires 7 and 8 can be shortened. For this reason, the possibility of wire breakage is reduced and the cost due to the wire material can be suppressed.
(2) Since the convex part of the heat sink 2 can be formed high and the heat dissipation area can be increased, the heat dissipation of the light emitting diode package can be improved.
(3) Since the heat sink 2, the first lead 3, and the second lead 4 can be molded together in the light emitting diode package manufacturing process, the number of processes can be reduced and the manufacturing cost can be greatly reduced.
(4) When molding the heat sink 2, the first lead 3, and the second lead 4 with resin, the heat sink 2 and the lead can be set in a resin mold so that the setting time can be greatly reduced. Can do.
(5) From the formation of the heat sink 2 to the bending of the first lead 3 and the second lead 4, a progressive die that can be processed while feeding the material in one press machine can be used, so the productivity is good and the manufacturing cost is reduced. can do.
(6) Even if the position of the slit 23 for electrically separating the thin plate portions 25 and 26 and the thick plate portion 21 is provided away from the thick plate portion 21, by bending the thin plate portions 25 and 26 twice, The end of the lead can be brought closer to the light emitting diode element 1. For this reason, by separating the position of the slit 23 from the thick plate portion 21, the surface area of the thin plate portion 22 thermally connected to the thick plate portion 21 is increased, and the heat dissipation area can be further improved by increasing the heat dissipation area. it can.

[Second Embodiment]
In FIG. 5, the manufacturing process of the premold component which concerns on 2nd Embodiment is shown.
In this embodiment, the modified cross-section strip 30 has a thickness varying in two stages, that is, a thick plate portion 31, a first thin plate portion 32, and second thin plate portions 35 and 36, and the slit 33 is formed at a location. The first bending stage (b), the first bending stage (b), and the first thin plate part 32 and the second thin plate parts 35 and 36 are the same as in the first embodiment, except that (a) is used. The first lead 37 and the second lead 38 are formed through two bending steps (c).

  The pre-molded component of this embodiment also has the same effect as that of the first embodiment. However, since the thickness of the heat sink is further increased, there is an advantage that heat dissipation is further improved.

[Third Embodiment]
FIG. 6 shows a modified cross-section strip used for a premolded part according to the third embodiment.
The deformed cross section 40 has a thick plate portion 41, a first thin plate portion 42, and a second thin plate portion 44, and the slit 43 is located at the boundary between the first thin plate portion 42 and the second thin plate portion 44. The first lead 45a and the second lead 45b are punched from the second thin plate portion 44, and the lead 45 is arranged on the upper surface of the thick plate portion 41 by bending twice. (B).

  Even if this deformed section 40 is used, a pre-molded part can be manufactured in the same manner as in the second embodiment, and the same effects as in the second embodiment can be obtained.

[Fourth Embodiment]
FIG. 7 shows a modified cross-section strip used for a premolded part according to the fourth embodiment.
The deformed cross section 50 includes a thick plate portion 51, a first thin plate portion 52, and a second thin plate portion 54, and the slit 53 is located at the boundary between the first thin plate portion 52 and the second thin plate portion 54. The first lead 55 and the second lead 56 are arranged on the upper surface of the thick plate portion 51 by bending the second thin plate portions 54 and 54 twice and forming the portions in a symmetrical manner.

  Even if this deformed cross-section strip 50 is used, a pre-molded part can be manufactured in the same manner as in the second embodiment, and the same effect as in the second embodiment can be obtained.

[Other Embodiments]
In the above embodiment, the upper surface of the thick plate portion serving as the heat sink is flat. However, the depression serving as the reflection plate is formed in the thick plate portion with a die press to increase the light extraction efficiency of the light emitting diode element. You can also.

  Moreover, although the example which added the bending twice to the thin plate part was shown in the said embodiment, you may add bending more times to a thin plate part. What is important is that the lead portion is brought closer to the light emitting diode element on the upper surface of the heat sink, and the bent shape is not limited to the U-shape shown in the above embodiment, and various shapes such as a Z shape can be considered.

It is sectional drawing of the light emitting diode package which concerns on 1st Embodiment. FIG. 2 is a perspective view of a modified cross-section strip serving as a material for a pre-molded part constituting the light emitting diode package of FIG. 1. FIG. 3 is a plan view in which a predetermined pattern is formed on the deformed cross section in FIG. It is a side view which shows the manufacturing process of the premold component which concerns on 1st Embodiment, (a) is a side view of FIG. 3, (b) is a side view which shows a 1st bending step, (c) is 2nd. It is a side view which shows the bending stage. It is a side view which shows the manufacturing process of the premold component which concerns on 2nd Embodiment, (a) is a side view of the irregular cross-section which formed the predetermined pattern, (b) is a side view which shows the 1st bending step. (C) is a side view which shows a 2nd bending stage. It is a figure which shows the irregular cross-section used for the premold component which concerns on 3rd Embodiment, (a) is a side view, (b) is a front view. It is a side view which shows the irregular cross-section used for the premold component which concerns on 4th Embodiment. It is sectional drawing of the conventional light emitting diode package. It is the schematic which shows the process of manufacturing the conventional premold component. It is a perspective view which shows the irregular cross-section used for the conventional premold component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting diode element 2 Heat sink 3 1st lead 4 2nd lead 5 Main body resin mold 6 Transparent resin 7,8 Wire 9 Premolded part 10 Light emitting diode package 15 Deformed cross section 15a Thick board part 15b Thin board part (thin board body)
20, 30, 40, 50 Profile section 21, 31, 41, 51 Thick plate (first section)
22 Thin plate (first section)
23, 33, 43, 53 Slit 24 Lead frame 25 Thin plate portion (second section)
26 Thin plate (second section)
27 Unpunched portion 32 First thin plate portion (first section)
35 Second thin plate portion (second section)
36 2nd thin plate part (2nd division)
37 1st lead 38 2nd lead 42,52 1st thin plate part (1st division)
44, 54 Second thin plate portion (second section)
45 lead 45a first lead 45b second lead 55 first lead 56 second lead 60 light emitting diode package 61 light emitting diode element 62 heat sink 63 first lead 64 second lead 65 main body resin mold 66 transparent resin 70 deformed cross section 71 heat sink portion 72 Lead part

Claims (2)

First, a first section in which a heat sink is finally formed, and a first lead are formed by preparing a deformed section strip made of a plate-like body having a convex cross section, forming a slit at a predetermined position of the deformed section strip. And a compartment defining step for defining a second compartment in which the second lead is formed;
The plate-like body in the second section is bent toward the first section at a plurality of predetermined locations in the second section, and the first lead and the tip portion of the second lead are connected to the first section. The heat sink, the first lead, and the second lead are positioned at the same height as the upper surface of the convex portion of the heat sink in the section or above the upper surface of the convex portion and close to the upper surface of the convex portion of the heat sink. A bending step to be formed;
A method of manufacturing a pre-molded part for a light emitting diode package, comprising: a molding step of molding a resin in a gap between the heat sink, the first lead, and the second lead. Examples modified cross strip, light emitting diode manufacturing method of premolded component package according to claim 1, wherein the height of the convex portion is characterized by using what has changed in at least two stages.

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