JP2010129923A - Light-emitting member, light-emitting device, illumination device, backlight device and method for manufacturing light-emitting member - Google Patents
Light-emitting member, light-emitting device, illumination device, backlight device and method for manufacturing light-emitting member Download PDFInfo
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- JP2010129923A JP2010129923A JP2008305603A JP2008305603A JP2010129923A JP 2010129923 A JP2010129923 A JP 2010129923A JP 2008305603 A JP2008305603 A JP 2008305603A JP 2008305603 A JP2008305603 A JP 2008305603A JP 2010129923 A JP2010129923 A JP 2010129923A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
本発明は、発光素子を用いた発光部材、発光装置、照明装置、バックライト装置および発光部材の製造方法に関する。 The present invention relates to a light-emitting member, a light-emitting device, a lighting device, a backlight device, and a light-emitting member manufacturing method using a light-emitting element.
近年、電球や蛍光ランプに代わり、高効率・長寿命が期待される例えば発光ダイオード（Light Emitting Diode）などの発光素子を用いた発光部材が、照明器具や液晶ディスプレイのバックライトなどに利用されている。このような発光部材においては、一般に、発光素子や発光素子を保護するための保護部材などが発光素子に電力を供給するリードフレーム上に一体に構成され、小型化・薄型化が図られている。 In recent years, light-emitting members that use light-emitting elements such as light-emitting diodes that are expected to have high efficiency and long life instead of light bulbs and fluorescent lamps have been used in lighting fixtures and backlights for liquid crystal displays. Yes. In such a light emitting member, in general, a light emitting element, a protective member for protecting the light emitting element, and the like are integrally formed on a lead frame that supplies power to the light emitting element, thereby achieving a reduction in size and thickness. .
例えば特許文献１には、発光素子が配置される部分が段差状に折り曲げて形成されたリードフレームを用いるとともに、発光素子が配置された段差部分にリードフレームと一体にハウジングが形成された半導体発光装置が記載されている。 For example, Patent Literature 1 uses a lead frame in which a portion where a light emitting element is arranged is bent in a step shape, and a semiconductor light emitting device in which a housing is formed integrally with the lead frame in a step portion where the light emitting element is arranged. An apparatus is described.
ここで一般に、発光部材の薄型化を図るために発光素子を保護する保護部材をリードフレーム上にて薄層に形成すると、保護部材とリードフレームとの厚さ方向の結合面積が小さくなる。そのため、保護部材とリードフレームとの密着性が低下して、小さな衝撃でも保護部材がリードフレームから離脱し易くなる。その結果、発光素子が損傷等を受けて発光部材の光量が低下したり、複数の発光素子により生成される光の色度に変動が生じる場合がある。
本発明は、発光素子を保護するための保護部材とリードフレームとの密着性を高めることを目的とする。
Here, generally, when a protective member for protecting the light emitting element is formed on the lead frame in a thin layer in order to reduce the thickness of the light emitting member, the coupling area in the thickness direction between the protective member and the lead frame is reduced. Therefore, the adhesion between the protective member and the lead frame is reduced, and the protective member is easily detached from the lead frame even with a small impact. As a result, the light emitting element may be damaged, the light amount of the light emitting member may decrease, or the chromaticity of light generated by the plurality of light emitting elements may vary.
An object of this invention is to improve the adhesiveness of the protective member for protecting a light emitting element, and a lead frame.
かかる目的のもと、本発明が適用される発光部材は、発光素子と、発光素子を支持する支持面と支持面と対向する対向面とを有し、対向面の側縁部に対向面の面積を広げる方向に凸状部が形成された支持部材と、支持部材の凸状部が埋め込まれて支持部材に保持され、発光素子を保護する保護部材とを備えたことを特徴としている。 For this purpose, a light-emitting member to which the present invention is applied has a light-emitting element, a support surface that supports the light-emitting element, and an opposing surface that faces the support surface. It is characterized by comprising a support member having a convex portion formed in the direction of expanding the area, and a protective member that is embedded in the convex portion of the support member and is held by the support member and protects the light emitting element.
このような発光部材において、発光素子の一方の電極が接続される電極部材をさらに備え、支持部材は、発光素子の他方の電極が接続されるとともに、電極部材よりも厚さが厚く構成されたことを特徴とすることができる。また、発光素子の一方の電極が接続される電極部材をさらに備え、電極部材は、支持部材の支持面と同一面に位置する第１面と、第１面に対して段差を持った第２面とが形成されたことを特徴とすることができる。さらに、支持部材は、支持面の側縁部に支持面の面積を広げる方向に凸状部が形成され、保護部材は、支持面の側縁部に形成された凸状部にさらに倣って形成されたことを特徴とすることができる。 In such a light emitting member, the light emitting member further includes an electrode member to which one electrode of the light emitting element is connected, and the support member is configured to be connected to the other electrode of the light emitting element and to be thicker than the electrode member. Can be characterized. The electrode member further includes an electrode member to which one electrode of the light emitting element is connected. The electrode member includes a first surface located on the same plane as the support surface of the support member, and a second surface having a step with respect to the first surface. The surface may be formed. Further, the support member is formed with a convex portion in the direction of expanding the area of the support surface at the side edge portion of the support surface, and the protection member is formed by following the convex portion formed at the side edge portion of the support surface. It can be characterized by that.
さらに、他の観点から捉えると、本発明が適用される発光装置は、発光素子と、発光素子を支持する支持面と支持面と対向する対向面とを有し、対向面の側縁部に対向面の面積を広げる方向に凸状部が形成された支持部材と、支持部材の凸状部が埋め込まれて支持部材に保持され、発光素子を保護する保護部材とを有する発光部材と、複数の発光部材を電気的に接続して発光部材に電力を供給する回路が形成された回路部材とを備えたことを特徴としている。 Further, from another point of view, the light emitting device to which the present invention is applied has a light emitting element, a supporting surface that supports the light emitting element, and an opposing surface that faces the supporting surface, and is provided at a side edge of the opposing surface. A light emitting member having a support member formed with a convex portion in a direction to increase the area of the opposing surface, a protective member that is embedded in the convex portion of the support member and is held by the support member, and protects the light emitting element; And a circuit member formed with a circuit for supplying power to the light emitting member by electrically connecting the light emitting members.
さらにまた、他の観点から捉えると、本発明が適用される発光部材の製造方法は、発光素子が支持される支持面と対向する対向面の側縁部に対向面の面積を広げる方向に凸状部が形成されたフレーム板金に、凸状部が埋め込まれるように発光素子を保護する保持部材を形成する工程と、フレーム板金の支持面に発光素子を載せる工程と、発光素子を支持面に固定する工程とを含むことを特徴としている。 Furthermore, from another viewpoint, the method for manufacturing a light emitting member to which the present invention is applied projects in a direction in which the area of the facing surface is increased on the side edge of the facing surface that faces the supporting surface on which the light emitting element is supported. Forming a holding member that protects the light emitting element so that the convex portion is embedded in the frame sheet metal on which the shape part is formed, placing the light emitting element on the support surface of the frame sheet metal, and attaching the light emitting element to the support surface And a fixing step.
このような発光部材の製造方法において、フレーム板金の対向面に凸状部を形成する工程をさらに含むことを特徴とすることができる。また、保持部材を形成する工程は、発光素子の一方の電極が接続される領域が段差を持って形成されたフレーム板金に保持部材を形成することを特徴とすることができる。さらに、保持部材を形成する工程は、支持面の側縁部に支持面の面積を広げる方向に凸状部がさらに形成されたフレーム板金に保持部材を形成することを特徴とすることができる。加えて、保持部材を形成する工程は、支持面が発光素子の一方の電極が接続される領域よりも厚く形成されたフレーム板金に保持部材を形成することを特徴とすることができる。 Such a method of manufacturing a light emitting member may further include a step of forming a convex portion on the opposing surface of the frame sheet metal. Further, the step of forming the holding member can be characterized in that the holding member is formed on a frame metal plate in which a region to which one electrode of the light emitting element is connected is formed with a step. Furthermore, the step of forming the holding member can be characterized in that the holding member is formed on a frame metal plate in which convex portions are further formed in the direction of expanding the area of the support surface at the side edge portion of the support surface. In addition, the step of forming the holding member can be characterized in that the holding member is formed on a frame metal plate having a support surface formed thicker than a region where one electrode of the light emitting element is connected.
さらにまた、他の観点から捉えると、本発明が適用される照明装置は、基板と、基板の表面に取り付けられた前記発光装置と、凹字状の断面形状を有し凹部内側の底部に当該発光装置が取り付けられるように構成されたリフレクタとを備えたことを特徴としている。
また、他の観点から捉えると、本発明が適用されるバックライト装置は、バックライトフレームと、バックライトフレームに配置された前記発光装置とを設けたことを特徴としている。
Furthermore, from another point of view, the lighting device to which the present invention is applied includes the substrate, the light-emitting device attached to the surface of the substrate, and a concave cross-sectional shape at the bottom inside the recess. And a reflector configured to be attached with the light emitting device.
From another point of view, a backlight device to which the present invention is applied is characterized in that a backlight frame and the light emitting device arranged in the backlight frame are provided.
本発明によれば、発光素子を保護するための保護部材とリードフレームとの密着性を高めることができる。
さらに、本発明の発光部材は、前記支持部材は、前記支持面の側縁部に当該支持面の面積を広げる方向に凸状部が形成され、前記保護部材は、当該支持面の側縁部に形成された当該凸状部にさらに倣って形成されたことにより、発光部材に作用する上下方向の力への抑制力を生み出す効果を有する。
ADVANTAGE OF THE INVENTION According to this invention, the adhesiveness of the protection member and lead frame for protecting a light emitting element can be improved.
Furthermore, in the light emitting member of the present invention, the support member is formed with a convex portion in a direction of expanding the area of the support surface at the side edge portion of the support surface, and the protection member is formed on the side edge portion of the support surface. Further, by forming in accordance with the convex portion formed in the above, there is an effect of generating a restraining force to the vertical force acting on the light emitting member.
以下、添付図面を参照して、本発明の実施の形態について詳細に説明する。
＜実施の形態１＞
図１は本実施の形態が適用される発光装置１１を備えた照明装置１０の全体構成の一例を説明する図である。ここで、図１（ａ）は照明装置１０を被照射側からみた正面図であり、（ｂ）は照明装置１０の側面図である。
図１に示した照明装置１０は、配線やスルーホール等が形成された基板５１と、基板５１の表面に取り付けられた発光部材の一例としての複数の発光チップ５２とを備えた発光装置１１と、凹字状の断面形状を有し、凹部内側の底部に発光装置１１が取り付けられるように構成されたリフレクタ１２とを備えている。また、照明装置１０は、発光装置１１の基板５１の裏面と、リフレクタ１２の凹部内側の底部との間に挟まれるように配置された放熱部材１３をさらに備えている。そして、発光装置１１および放熱部材１３は、金属製のねじ１４によってリフレクタ１２に取り付けられ、固定されている。このため、基板５１には、ねじ１４の取り付け位置に対応したねじ穴（不図示）が形成されている。なお、照明装置１０には、必要に応じて、発光チップ５２から出射される光を均一にするための拡散レンズ等を設けるように構成してもよい。
Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
<Embodiment 1>
FIG. 1 is a diagram illustrating an example of the overall configuration of a lighting device 10 including a light emitting device 11 to which the exemplary embodiment is applied. Here, FIG. 1A is a front view of the illumination device 10 as seen from the irradiated side, and FIG. 1B is a side view of the illumination device 10.
The lighting device 10 illustrated in FIG. 1 includes a light emitting device 11 including a substrate 51 on which wirings, through holes, and the like are formed, and a plurality of light emitting chips 52 as an example of a light emitting member attached to the surface of the substrate 51. And a reflector 12 having a concave cross-sectional shape and configured to attach the light emitting device 11 to the bottom inside the recess. The illumination device 10 further includes a heat dissipation member 13 disposed so as to be sandwiched between the back surface of the substrate 51 of the light emitting device 11 and the bottom portion inside the concave portion of the reflector 12. The light emitting device 11 and the heat radiating member 13 are fixed to the reflector 12 by metal screws 14. Therefore, screw holes (not shown) corresponding to the attachment positions of the screws 14 are formed in the substrate 51. In addition, you may comprise the illuminating device 10 so that the diffusion lens etc. for making the light radiate | emitted from the light emitting chip 52 uniform may be provided as needed.
基板５１は、例えばガラス布基材エポキシ樹脂銅張積層板（ガラエポ基板）等で構成され、長方形の形状を有している。そして、基板５１の内部には複数の発光チップ５２を電気的に接続するための配線が形成され、その表面には白色レジスト膜が塗布形成されている。また、基板５１は、放熱性を高めるために、表面、裏面ともにできる限り多くの面積部分に銅箔を残した配線が形成され、表面と裏面とはスルーホールを介して電気的・熱的に接続されている。なお、白色レジスト塗装膜に代えて、蒸着等により金属膜を形成するようにしてもよい。 The board | substrate 51 is comprised by the glass cloth base-material epoxy resin copper clad laminated board (glass epoxy board) etc., for example, and has a rectangular shape. Wiring for electrically connecting a plurality of light emitting chips 52 is formed inside the substrate 51, and a white resist film is applied and formed on the surface thereof. In addition, in order to improve heat dissipation, the substrate 51 is formed with wiring with copper foil remaining in as much area as possible on both the front and back surfaces, and the front and back surfaces are electrically and thermally connected through through holes. It is connected. Instead of the white resist coating film, a metal film may be formed by vapor deposition or the like.
発光チップ５２は、基板５１の表面に、基板５１の短手方向に３列、かつ長手方向に１４列の合計４２個が取り付けられている。
筐体および反射部材の一例としてのリフレクタ１２は、例えば折り曲げ加工された金属板で構成されており、その凹部内側は白色に塗装されている。そして、リフレクタ１２は、照明装置１０を構成した際に、電気的に接地される。なお、リフレクタ１２の凹部内側には、白色塗装膜に代えて、蒸着等により金属膜を形成するようにしてもよい。
The light emitting chips 52 are attached to the surface of the substrate 51 in a total of 42 rows of 3 rows in the short direction of the substrate 51 and 14 rows in the longitudinal direction.
The reflector 12 as an example of a housing and a reflecting member is made of, for example, a bent metal plate, and the inside of the concave portion is painted white. The reflector 12 is electrically grounded when the lighting device 10 is configured. Note that a metal film may be formed inside the concave portion of the reflector 12 by vapor deposition or the like instead of the white paint film.
次の図２は、放熱部材１３の構成を説明するための図である。ここで、図２（ａ）は放熱部材１３の上面図、（ｂ）は（ａ）のIＸ−IＸ断面図である。
放熱部材１３は、リフレクタ１２（図１参照）と接する側に設けられた第１放熱シート１３１と、第１放熱シート１３１上に設けられた導電シート１３２と、導電シート１３２上であって発光装置１１の基板５１（図１参照）の裏面と接する側に設けられた第２放熱シート１３３とを備えている。すなわち、放熱部材１３は、第１放熱シート１３１と第２放熱シート１３３とによって導電シート１３２を挟み込んだ構成を有している。そして、第１放熱シート１３１および第２放熱シート１３３が絶縁部材としても機能している。具体的には、第１放熱シート１３１および第２放熱シート１３３は、例えばシート状熱伝導ゲル（株式会社タイカ製、ＣＯＨ−４０００、厚さ１ｍｍ）など、熱伝導性が高く絶縁性も高い材料で構成されている。一方、導電シート１３２は、例えば銅箔やアルミ箔など、熱伝導性が高く導電性も高い材料で構成されている。
FIG. 2 is a diagram for explaining the configuration of the heat dissipation member 13. Here, FIG. 2A is a top view of the heat dissipation member 13, and FIG. 2B is a cross-sectional view taken along the line IX-IX of FIG.
The heat radiating member 13 includes a first heat radiating sheet 131 provided on the side in contact with the reflector 12 (see FIG. 1), a conductive sheet 132 provided on the first heat radiating sheet 131, and the conductive sheet 132 on the light emitting device. 11 and a second heat dissipating sheet 133 provided on the side in contact with the back surface of the substrate 51 (see FIG. 1). That is, the heat radiation member 13 has a configuration in which the conductive sheet 132 is sandwiched between the first heat radiation sheet 131 and the second heat radiation sheet 133. The first heat radiation sheet 131 and the second heat radiation sheet 133 also function as insulating members. Specifically, the first heat radiating sheet 131 and the second heat radiating sheet 133 are, for example, a sheet-like heat conductive gel (manufactured by Taika Co., Ltd., COH-4000, thickness 1 mm), and a material having high heat conductivity and high insulation. It consists of On the other hand, the conductive sheet 132 is made of a material having high thermal conductivity and high conductivity, such as copper foil or aluminum foil.
また、放熱部材１３には、対角の位置に２つの穿孔１３０が貫通するように形成されている。２つの穿孔１３０は、図１に示した発光装置１１および放熱部材１３をリフレクタ１２に取り付ける際に、ねじ１４が貫通する位置に形成されている。そして、穿孔１３０の直径はねじ１４の径よりも大きく形成されている。それにより、導電シート１３２にねじ１４が接触しない状態で、発光装置１１および放熱部材１３をリフレクタ１２に取り付けている。なお、穿孔１３０の内壁に、樹脂等を用いた絶縁保護層を形成してもよい。
それにより、放熱部材１３の導電シート１３２は、図１に示した照明装置１０を構成した際に、ねじ１４および接地されたリフレクタ１２と電気的に絶縁され、非接地状態におかれる。一方、発光装置１１の基板５１は、ねじ１４およびリフレクタ１２を介して接地される。
Further, the heat radiating member 13 is formed so that two perforations 130 pass through diagonally. The two perforations 130 are formed at positions where the screws 14 penetrate when the light emitting device 11 and the heat radiating member 13 shown in FIG. 1 are attached to the reflector 12. The diameter of the perforation 130 is formed larger than the diameter of the screw 14. Thereby, the light emitting device 11 and the heat radiating member 13 are attached to the reflector 12 in a state where the screw 14 is not in contact with the conductive sheet 132. An insulating protective layer using a resin or the like may be formed on the inner wall of the perforation 130.
Thereby, when the illuminating device 10 shown in FIG. 1 is configured, the conductive sheet 132 of the heat radiating member 13 is electrically insulated from the screw 14 and the grounded reflector 12 and placed in a non-grounded state. On the other hand, the substrate 51 of the light emitting device 11 is grounded via the screw 14 and the reflector 12.
図３は、発光部材の一例としての発光チップ５２の構成を説明する図である。ここで、図３（ａ）は発光チップ５２の上面図、（ｂ）は（ａ）のＸＡ−ＸＡ断面図である。
図３に示した発光チップ５２は、凹部６１ａが形成された発光素子を保護する保護部材の一例としての筐体６１と、筐体６１が一体成型されたリードフレームに形成された５つのリード部、すなわち第１リード部６２と、第２リード部６３Ｒと、第３リード部６３Ｇ１と、第４リード部６３Ｂと、第５リード部６３Ｇ２とを備えている。さらに、発光チップ５２は、凹部６１ａの底面に取り付けられた発光素子の一例としての例えば４つのＬＥＤ（Light Emitting Diode）、すなわち例えば波長６４０ｎｍの赤色（Ｒ）を発光する赤色ＬＥＤ６６Ｒと、例えば波長５３０ｎｍの緑色（Ｇ）を発光する第１緑色ＬＥＤ６６Ｇ１および第２緑色ＬＥＤ６６Ｇ２と、例えば波長４５０ｎｍの青色（Ｂ）を発光する青色ＬＥＤ６６Ｂとを備えている。またさらに、発光チップ５２は、筐体６１の凹部６１ａを覆うように設けられた封止部６９を備えている。
なお、図３（ａ）においては、封止部６９の記載を省略している。また、図３（ａ）では、第１緑色ＬＥＤ６６Ｇ１と第２緑色ＬＥＤ６６Ｇ２とが対角に配置される構成を採用した場合を示している。
FIG. 3 is a diagram illustrating a configuration of a light emitting chip 52 as an example of a light emitting member. 3A is a top view of the light emitting chip 52, and FIG. 3B is a cross-sectional view taken along the line XA-XA in FIG.
The light-emitting chip 52 shown in FIG. 3 includes a housing 61 as an example of a protective member that protects the light-emitting element in which the recess 61a is formed, and five lead portions formed on a lead frame in which the housing 61 is integrally molded. That is, the first lead portion 62, the second lead portion 63R, the third lead portion 63G1, the fourth lead portion 63B, and the fifth lead portion 63G2 are provided. Further, the light emitting chip 52 includes, for example, four LEDs (Light Emitting Diodes) as an example of a light emitting element attached to the bottom surface of the recess 61a, that is, a red LED 66R that emits red (R) with a wavelength of 640 nm, and a wavelength of 530 nm, for example. The first green LED 66G1 and the second green LED 66G2 that emit green (G), and the blue LED 66B that emits blue (B) having a wavelength of 450 nm, for example. Furthermore, the light emitting chip 52 includes a sealing portion 69 provided so as to cover the recess 61 a of the housing 61.
In addition, description of the sealing part 69 is abbreviate | omitted in Fig.3 (a). FIG. 3A shows a case where a configuration in which the first green LED 66G1 and the second green LED 66G2 are arranged diagonally is employed.
筐体６１は、各リード部（第１リード部６２、第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、第５リード部６３Ｇ２）が形成されたリードフレームに白色の熱可塑性樹脂を射出成型することによって、リードフレームと一体に構成されている。
リードフレームに形成された各リード部は、０．１〜０．５ｍｍ程度の厚みをもつ金属板で構成されている。この金属板としては、例えば加工性、熱伝導性に優れた鉄／銅合金をベースとし、その上にめっき層としてニッケル、チタン、金、銀などを数μｍ積層して構成される。本実施の形態では、第１リード部６２を例えば０．３ｍｍ程度の厚みとし、例えば０．１５ｍｍ程度の厚みで形成された他の第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、および第５リード部６３Ｇ２よりも厚く形成している。加えて、第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、および第５リード部６３Ｇ２には段差が形成され、後述するように（図４参照）、発光チップ５２の薄型化を実現している。
また、各リード部それぞれの一部は、凹部６１ａの底面に露出するように形成されている。さらには、各リード部それぞれの一端部側は筐体６１の外側に露出するように形成されている。
The housing 61 is white thermoplastic on a lead frame in which each lead portion (first lead portion 62, second lead portion 63R, third lead portion 63G1, fourth lead portion 63B, fifth lead portion 63G2) is formed. The resin is integrally formed with the lead frame by injection molding.
Each lead portion formed on the lead frame is made of a metal plate having a thickness of about 0.1 to 0.5 mm. As this metal plate, for example, an iron / copper alloy having excellent workability and thermal conductivity is used as a base, and nickel, titanium, gold, silver, or the like is laminated thereon as a plating layer. In the present embodiment, the first lead portion 62 has a thickness of, for example, about 0.3 mm, and the second lead portion 63R, the third lead portion 63G1, and the fourth lead portion that are formed with a thickness of, for example, about 0.15 mm. It is formed thicker than 63B and the fifth lead portion 63G2. In addition, steps are formed in the second lead portion 63R, the third lead portion 63G1, the fourth lead portion 63B, and the fifth lead portion 63G2, and as will be described later (see FIG. 4), the light emitting chip 52 is made thinner. Is realized.
A part of each lead part is formed so as to be exposed on the bottom surface of the recess 61a. Furthermore, one end side of each lead portion is formed so as to be exposed to the outside of the housing 61.
リードフレームに形成された各リード部は、それぞれが筐体６１を構成する熱可塑性樹脂で埋められた間隙６４を隔てて相互に電気的に絶縁されている。また、第１リード部６２は凹部６１ａの底面の中央部に形成されている。そして、凹部６１ａの底面中央部に相当する第１リード部６２上の領域には、各ＬＥＤ（赤色ＬＥＤ６６Ｒ、第１緑色ＬＥＤ６６Ｇ１、第２緑色ＬＥＤ６６Ｇ２、青色ＬＥＤ６６Ｂ）が、例えば半田や樹脂接着剤等により、裏面（発光面とは反対側の面）を第１リード部６２表面（支持面）に密着させて固定されている。したがって、第１リード部６２および第１リード部６２を形成するリードフレームは、各ＬＥＤを支持する支持部材としても機能する。
また、各ＬＥＤは、各ＬＥＤの上面に設けられたカソード電極（−極）が、金線によって第１リード部６２に電気的に接続されている。一方、各ＬＥＤの上面に設けられたアノード電極（＋極）が、凹部６１ａの底面中央部に到達しない位置に形成された第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、および第５リード部６３Ｇ２それぞれに、金線によって電気的に接続されている。
そして、赤色ＬＥＤ６６Ｒには、第２リード部６３Ｒと第１リード部６２とから、例えば２５℃環境下における順方向電圧ＶＦとして＋２．１Ｖが印加される。また、第１緑色ＬＥＤ６６Ｇ１、第２緑色ＬＥＤ６６Ｇ２、および青色ＬＥＤ６６Ｂには、第３リード部６３Ｇ１、第５リード部６３Ｇ２、および第４リード部６３Ｂと、第１リード部６２とから、例えば２５℃環境下における順方向電圧ＶＦとして＋３．２Ｖが印加される。それにより、各ＬＥＤに順方向電流ＩＦを通電させて、発光チップ５２の中央部からＲ、Ｇ、Ｂ各色を混合させた白色光を出射させる。
The lead portions formed on the lead frame are electrically insulated from each other with a gap 64 filled with a thermoplastic resin constituting the housing 61. The first lead portion 62 is formed at the center of the bottom surface of the recess 61a. Each LED (red LED 66R, first green LED 66G1, second green LED 66G2, blue LED 66B) is provided in a region on the first lead 62 corresponding to the center of the bottom surface of the recess 61a, for example, solder, resin adhesive, or the like. Thus, the back surface (surface opposite to the light emitting surface) is fixed in contact with the surface of the first lead portion 62 (support surface). Therefore, the lead frame forming the first lead portion 62 and the first lead portion 62 also functions as a support member that supports each LED.
In each LED, a cathode electrode (-electrode) provided on the upper surface of each LED is electrically connected to the first lead portion 62 by a gold wire. On the other hand, the second lead portion 63R, the third lead portion 63G1, the fourth lead portion 63B, which are formed at positions where the anode electrode (+ electrode) provided on the upper surface of each LED does not reach the center of the bottom surface of the recess 61a, The fifth lead portion 63G2 is electrically connected to each other by a gold wire.
Then, the red LED66R, the second lead portion 63R and the first lead portion 62, for example, as a forward voltage V F under 25 ° C. environment + 2.1V is applied. In addition, the first green LED 66G1, the second green LED 66G2, and the blue LED 66B include, for example, a 25 ° C. environment from the third lead portion 63G1, the fifth lead portion 63G2, the fourth lead portion 63B, and the first lead portion 62. as the forward voltage V F under + 3.2 V is applied. Accordingly, a forward current IF is applied to each LED, and white light in which R, G, and B colors are mixed is emitted from the central portion of the light emitting chip 52.
また、図３（ｂ）に示したように、本実施の形態の発光チップ５２では、各ＬＥＤの裏面がリードフレームの第１リード部６２の表面（支持面）に密着するように固定されている。それにより、各ＬＥＤの裏面から第１リード部６２に熱が伝導するように構成され、各ＬＥＤの過度の昇温を抑制している。 Further, as shown in FIG. 3B, in the light emitting chip 52 of the present embodiment, the back surface of each LED is fixed so as to be in close contact with the surface (support surface) of the first lead portion 62 of the lead frame. Yes. Thereby, it is comprised so that heat may be conducted from the back surface of each LED to the 1st lead part 62, and the excessive temperature rise of each LED is controlled.
筐体６１の凹部６１ａを覆う封止部６９は、可視領域の波長において光透過率が高く、また屈折率が高い透明樹脂にて構成される。また、封止部６９の表面（白色光の出射面）は平坦面で形成されている。この封止部６９を構成する樹脂としては、高い耐熱性、耐候性、および機械的強度を有する例えばエポキシ樹脂やシリコン樹脂が用いられる。 The sealing portion 69 covering the recess 61a of the housing 61 is made of a transparent resin having a high light transmittance and a high refractive index at a wavelength in the visible region. The surface of the sealing portion 69 (white light emission surface) is a flat surface. For example, an epoxy resin or a silicon resin having high heat resistance, weather resistance, and mechanical strength is used as the resin constituting the sealing portion 69.
次に、発光チップ５２に形成された筐体６１とリードフレームとの結合について説明する。
図４は、発光チップ５２において筐体６１が形成された領域の断面図である。すなわち、図４は、図３（ａ）に示した発光チップ５２のＸＢ−ＸＢ断面図である。
図４に示したように、本実施の形態の発光チップ５２に用いられるリードフレームは、各ＬＥＤのアノード電極が接続される電極部材の一例としての第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、および第５リード部６３Ｇ２の一端部（外側端部：図４のｏｕｔｓｉｄｅ）と他端部（内側端部：図４のｉｎｓｉｄｅ）とが段差（ｓｔｅｐ）を形成するように、外側端部（ｏｕｔｓｉｄｅ）と内側端部（ｉｎｓｉｄｅ）との間が折り曲げて構成されている。なお、図４では、第４リード部６３Ｂおよび第５リード部６３Ｇ２だけが示されているが、第２リード部６３Ｒおよび第３リード部６３Ｇ１においても同様である。
Next, the coupling between the casing 61 formed on the light emitting chip 52 and the lead frame will be described.
FIG. 4 is a cross-sectional view of a region where the housing 61 is formed in the light emitting chip 52. That is, FIG. 4 is an XB-XB sectional view of the light emitting chip 52 shown in FIG.
As shown in FIG. 4, the lead frame used in the light emitting chip 52 of the present embodiment has a second lead portion 63R, a third lead portion 63G1, and an example of an electrode member to which the anode electrode of each LED is connected. One end portion (outer end portion: outside in FIG. 4) and the other end portion (inner end portion: inside in FIG. 4) of the fourth lead portion 63B and the fifth lead portion 63G2 form a step. The outer end (outside) and the inner end (inside) are bent. In FIG. 4, only the fourth lead portion 63B and the fifth lead portion 63G2 are shown, but the same applies to the second lead portion 63R and the third lead portion 63G1.
各リード部（第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、第５リード部６３Ｇ２）に段差が形成され、各リード部の外側端部（ｏｕｔｓｉｄｅ）が内側端部（ｉｎｓｉｄｅ）よりも一段低く形成されることで、各リード部の内側端部側には、筐体６１を一体成型してリードフレームに結合させる空間（ｓｐａｃｅ）が構成される。それにより、この空間（ｓｐａｃｅ）を埋めるように筐体６１を一体成型することで、筐体６１がリードフレームに結合される。またその際に、筐体６１の底面（ｂａｓｅ）と各リード部の外側端部側の底面（ｂａｓｅ）とが同一の平面内で平坦となるように形成することにより、リードフレームの段差分の厚さ（ｓｔｅｐ）の範囲内で、各リード部の外側端部（ｏｕｔｓｉｄｅ）側を筐体６１の外側に露出させることができる。 A step is formed in each lead portion (second lead portion 63R, third lead portion 63G1, fourth lead portion 63B, and fifth lead portion 63G2), and the outer end (outside) of each lead portion is the inner end (inside). ), A space (space) in which the casing 61 is integrally molded and coupled to the lead frame is formed on the inner end side of each lead portion. Accordingly, the casing 61 is integrally formed so as to fill this space, and the casing 61 is coupled to the lead frame. At that time, the bottom surface (base) of the casing 61 and the bottom surface (base) on the outer end side of each lead portion are formed so as to be flat in the same plane. Within the range of the thickness (step), the outside end (outside) side of each lead portion can be exposed to the outside of the housing 61.
このように、各リード部（第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、第５リード部６３Ｇ２）が設定される部分に段差が形成されたリードフレームを用いることで、各リード部に形成された段差分の厚さ空間（ｓｐａｃｅ）内で、筐体６１とリードフレームとの結合と、各リード部の外側端部（ｏｕｔｓｉｄｅ）の筐体６１外側への露出とを共に実現することができる。それによって、発光チップ５２が基板５１（図１参照）上に搭載される際には、発光チップ５２の厚さは、リードフレームの段差（ｓｔｅｐ）と封止部６９が形成される領域の厚さ分だけとなり、発光チップ５２の小型化・薄型化が図られる。 Thus, by using a lead frame in which a step is formed in a portion where each lead part (second lead part 63R, third lead part 63G1, fourth lead part 63B, fifth lead part 63G2) is set, In the thickness space corresponding to the level difference formed in each lead part, the connection between the casing 61 and the lead frame and the exposure of the outer end (outside) of each lead part to the outside of the casing 61 are performed. Both can be realized. Thus, when the light emitting chip 52 is mounted on the substrate 51 (see FIG. 1), the thickness of the light emitting chip 52 is the thickness of the region where the step of the lead frame and the sealing portion 69 are formed. Thus, the light emitting chip 52 can be reduced in size and thickness.
なお、ここでのリードフレームの段差（ｓｔｅｐ）とは、各リード部の内側端部（ｉｎｓｉｄｅ）の上面（第１面）と外側端部（ｏｕｔｓｉｄｅ）の下面との間の距離をいう。また、内側端部の上面（第１面）と段差を持った外側端部の上面を第２面と称する。 Here, the step of the lead frame means the distance between the upper surface (first surface) of the inner end (inside) and the lower surface of the outer end (outside) of each lead portion. Further, the upper surface (first surface) of the inner end portion and the upper surface of the outer end portion having a step are referred to as a second surface.
本実施の形態では、上記したように、第１リード部６２の厚さは、リードフレームの段差（ｓｔｅｐ）とほぼ同一となるように、第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、第５リード部６３Ｇ２よりも厚く形成されている。すなわち、第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、第５リード部６３Ｇ２の厚さが例えば０．１５ｍｍであるのに対して、第１リード部６２の厚さは例えば０．３ｍｍで構成されている。そしてこの場合に、リードフレームの段差（ｓｔｅｐ）を０．３ｍｍに構成すれば、筐体６１の底面（ｂａｓｅ）と、第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、および第５リード部６３Ｇ２の外側端部側の底面（ｂａｓｅ）と、第１リード部６２の底面（ｂａｓｅ）とは同一の平面で平坦に形成される。そのため、発光チップ５２が基板５１上に搭載される際には、各リード部は基板５１と同一の平面（ｂａｓｅ）で密着するので、基板５１上での半田等による電気的な接合が容易かつ確実となる。また、基板５１上にて発光チップ５２が安定的に保持される。
さらには、第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、第５リード部６３Ｇ２の内側端部の上面（第１面）は、第１リード部６２表面（支持面）と同一面に位置するように形成される。
In the present embodiment, as described above, the second lead portion 63R, the third lead portion 63G1, and the fourth lead portion 62R are formed so that the thickness of the first lead portion 62 is substantially the same as the step of the lead frame. It is formed thicker than the lead part 63B and the fifth lead part 63G2. That is, the thickness of the second lead portion 63R, the third lead portion 63G1, the fourth lead portion 63B, and the fifth lead portion 63G2 is 0.15 mm, for example, whereas the thickness of the first lead portion 62 is, for example, It is composed of 0.3 mm. In this case, if the lead frame step is configured to be 0.3 mm, the bottom of the housing 61, the second lead portion 63R, the third lead portion 63G1, the fourth lead portion 63B, and The bottom surface (base) on the outer end side of the fifth lead portion 63G2 and the bottom surface (base) of the first lead portion 62 are formed flat on the same plane. For this reason, when the light emitting chip 52 is mounted on the substrate 51, each lead portion is in close contact with the same plane as the substrate 51. Therefore, electrical bonding by solder or the like on the substrate 51 is easy and easy. It will be certain. Further, the light emitting chip 52 is stably held on the substrate 51.
Furthermore, the upper surface (first surface) of the inner end portion of the second lead portion 63R, the third lead portion 63G1, the fourth lead portion 63B, and the fifth lead portion 63G2 is the surface of the first lead portion 62 (support surface). It is formed so as to be located on the same plane.
また、第１リード部６２表面（支持面）には各ＬＥＤの裏面が密着するように固定される。それにより、各ＬＥＤの裏面から第１リード部６２に熱が伝導するが、その場合に第１リード部６２が厚く構成されているため、第１リード部６２の熱容量は大きい。そのため、各ＬＥＤにて発生した熱が第１リード部６２に伝導された際に、第１リード部６２内部にて熱が拡散され易いので、各ＬＥＤの冷却効果を高めることとなる。 Moreover, it fixes so that the back surface of each LED may closely_contact | adhere to the 1st lead part 62 surface (support surface). Thereby, heat is conducted from the back surface of each LED to the first lead portion 62. In this case, since the first lead portion 62 is thick, the heat capacity of the first lead portion 62 is large. Therefore, when the heat generated in each LED is conducted to the first lead portion 62, the heat is easily diffused inside the first lead portion 62, so that the cooling effect of each LED is enhanced.
加えて、本実施の形態の発光チップ５２においては、第１リード部６２の表面（支持面）と対向する対向面である図４の破線で示した底面（ｂａｓｅ）の側縁部に、第１リード部６２の側面Ｓ１の法線方向（図４のＸ１、Ｘ２等の方向）に向けた凸状部６２ａが形成されている。すなわち、第１リード部６２の底面（ｂａｓｅ）の面積を広げる方向に凸状部６２ａが形成されている。それにより、筐体６１は、第１リード部６２の底面（ｂａｓｅ）側縁部に形成された凸状部６２ａに倣って形成される。それによって、凸状部６２ａが筐体６１の内側に向けて埋め込まれるようにリードフレームに結合される。そのため、例えば発光チップ５２が下方向（Ｚ１方向）への衝撃が受けて、筐体６１に下方向の力が加わった場合に、筐体６１は、第１リード部６２の凸状部６２ａによりリードフレームからの離脱を抑制する力を受ける。それによって、筐体６１が下方向（Ｚ１方向）に力を受けた場合にも、筐体６１はリードフレームから離脱し難い構造が実現されている。 In addition, in the light-emitting chip 52 of the present embodiment, the first edge 62 is opposite to the surface (support surface) of the first lead portion 62, and the side edge of the bottom surface (base) indicated by the broken line in FIG. A convex portion 62a is formed in the normal direction of the side surface S1 of the one lead portion 62 (direction of X1, X2, etc. in FIG. 4). That is, the convex part 62a is formed in the direction in which the area of the bottom surface of the first lead part 62 is increased. Accordingly, the housing 61 is formed following the convex portion 62 a formed at the bottom side edge of the first lead portion 62. Accordingly, the convex portion 62a is coupled to the lead frame so as to be embedded toward the inside of the housing 61. Therefore, for example, when the light emitting chip 52 receives a downward impact (Z1 direction) and a downward force is applied to the housing 61, the housing 61 is moved by the convex portion 62 a of the first lead portion 62. Receives power to suppress separation from the lead frame. Thereby, even when the casing 61 receives a force in the downward direction (Z1 direction), a structure in which the casing 61 is difficult to be detached from the lead frame is realized.
他方、筐体６１が上方向（Ｚ２方向）に力を受けた場合には、筐体６１が結合される空間（ｓｐａｃｅ）の上部には第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、および第５リード部６３Ｇ２が位置している。それにより、筐体６１に上方向（Ｚ２方向）への力が加わった場合には、第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、および第５リード部６３Ｇ２が、筐体６１に対してリードフレームからの離脱を抑制する力を作用させる。それによって、筐体６１が上方向（Ｚ２方向）に力を受けた場合においても、筐体６１はリードフレームから離脱し難い構造が実現される。 On the other hand, when the casing 61 receives a force in the upward direction (Z2 direction), the second lead portion 63R, the third lead portion 63G1, and the fourth lead portion are formed in the upper portion of the space to which the casing 61 is coupled. The lead part 63B and the fifth lead part 63G2 are located. As a result, when an upward force (Z2 direction) is applied to the housing 61, the second lead portion 63R, the third lead portion 63G1, the fourth lead portion 63B, and the fifth lead portion 63G2 A force that suppresses detachment from the lead frame is applied to the body 61. Thereby, even when the casing 61 receives a force in the upward direction (Z2 direction), a structure in which the casing 61 is difficult to be detached from the lead frame is realized.
ここで、第１リード部６２の底面（ｂａｓｅ）側縁部に凸状部６２ａが形成されていない従来の構成を考察する。上記したように、筐体６１は、リードフレームに形成された段差分の厚さでリードフレームに結合されている。そのため、上下方（Ｚ１方向、Ｚ２方向）に関する筐体６１とリードフレームとの結合面は、図４に示したように、第１リード部６２の側面Ｓ１、および第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、第５リード部６３Ｇ２の側面Ｓ２,Ｓ３だけとなる（なお、図４では第４リード部６３Ｂおよび第５リード部６３Ｇ２だけを示している）。それにより、筐体６１に対して下方向（Ｚ１方向）に力が加わると、それに対抗して筐体６１に作用する抑制力は、第１リード部６２の側面Ｓ１や、第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、第５リード部６３Ｇ２の側面Ｓ２,Ｓ３での筐体６１とリードフレームとの結合力だけとなる。そのために、下方向（Ｚ１方向）の力に対して筐体６１はリードフレームから離脱し易い構造であったといえる。 Here, a conventional configuration in which the convex portion 62a is not formed on the bottom side edge portion of the first lead portion 62 will be considered. As described above, the housing 61 is coupled to the lead frame with a thickness corresponding to the level difference formed on the lead frame. Therefore, as shown in FIG. 4, the coupling surface between the casing 61 and the lead frame in the upper and lower directions (Z1 direction, Z2 direction) is the side surface S1 of the first lead portion 62, the second lead portion 63R, and the third Only the side surfaces S2 and S3 of the lead portion 63G1, the fourth lead portion 63B, and the fifth lead portion 63G2 are shown (only the fourth lead portion 63B and the fifth lead portion 63G2 are shown in FIG. 4). Accordingly, when a force is applied downward (Z1 direction) to the housing 61, the restraining force acting on the housing 61 against the force is applied to the side surface S1 of the first lead portion 62 and the second lead portion 63R. Only the coupling force between the casing 61 and the lead frame on the side surfaces S2 and S3 of the third lead portion 63G1, the fourth lead portion 63B, and the fifth lead portion 63G2 is obtained. Therefore, it can be said that the housing 61 has a structure that is easily detached from the lead frame with respect to a downward force (Z1 direction).
それに対して、本実施の形態の発光チップ５２においては、第１リード部６２の底面（ｂａｓｅ）側縁部に、第１リード部６２の側面Ｓ１の法線方向（図４のＸ１、Ｘ２方向等）に向けた凸状部６２ａを形成している。そのため、第１リード部６２の底面は、それ以外の第１リード部６２の側面部よりも面積が広く形成される。また、第１リード部６２の底面側縁部において筐体６１が第１リード部６２の凸状部６２ａに倣って形成され、凸状部６２ａが筐体６１に埋め込まれて構成される。それにより、第１リード部６２の底面側縁部の凸状部６２ａが筐体６１を下方向（Ｚ１方向）から支える構造が形成され、筐体６１に作用する下方向（Ｚ１方向）の力に対抗する力を生み出す。それにより、筐体６１が下方向（Ｚ１方向）の力を受けた場合にも、筐体６１がリードフレームから離脱し難い。 On the other hand, in the light emitting chip 52 of the present embodiment, the normal direction of the side surface S1 of the first lead portion 62 (the X1 and X2 directions in FIG. 4) is formed on the bottom side edge of the first lead portion 62. Etc.) is formed. Therefore, the bottom surface of the first lead portion 62 is formed to have a larger area than the other side surface portions of the first lead portion 62. Further, the casing 61 is formed at the bottom side edge of the first lead part 62 following the convex part 62 a of the first lead part 62, and the convex part 62 a is embedded in the casing 61. Accordingly, a structure is formed in which the convex portion 62a at the bottom edge of the first lead portion 62 supports the housing 61 from below (Z1 direction), and the downward force (Z1 direction) acting on the housing 61. Creates the power to counter Thereby, even when the casing 61 receives a downward force (Z1 direction), the casing 61 is unlikely to be detached from the lead frame.
ところで、第１リード部６２の底面（ｂａｓｅ）側縁部に形成される凸状部６２ａの断面形状（図３に示した発光チップ５２のＸＢ−ＸＢ断面）としては、筐体６１に埋め込まれて筐体６１に作用する下方（Ｚ１方向）の力に対抗する抑制力を生み出す形状であれば、三角形状、四角形状、楕円等の曲面を含む形状、くさび形状等といった何れの形状であってもよい。すなわち、底面側縁部の凸状部６２ａにより第１リード部６２の底面がそれ以外の第１リード部６２の側面部よりも面積が広く形成されれば、凸状部６２ａの断面形状は何れの形状であってもよい。 By the way, as a cross-sectional shape (XB-XB cross section of the light emitting chip 52 shown in FIG. 3) of the convex portion 62 a formed on the bottom side edge portion of the first lead portion 62, it is embedded in the housing 61. As long as it has a shape that generates a restraining force that opposes the downward (Z1 direction) force acting on the housing 61, any shape such as a triangular shape, a quadrangular shape, a shape including a curved surface such as an ellipse, a wedge shape, etc. Also good. In other words, if the bottom surface of the first lead 62 is formed to have a larger area than the side surface of the other first lead 62 due to the convex 62a at the bottom edge, the cross-sectional shape of the convex 62a is any. The shape may also be
続いて、発光チップ５２の製造方法について説明する。
発光チップ５２を製造するに際しては、まず第１工程として、リードフレームとなる部分がマトリクス状に複数配列されたフレーム板金２０を作製する。図５は、フレーム板金２０の一例を示した平面図である。図５に示したように、フレーム板金２０には、発光チップ５２での第１リード部６２や、第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、および第５リード部６３Ｇ２となる部分が形成されるリードフレームの周囲を打ち抜いた打ち抜き部２１が、マトリクス状に複数配列されている。また、フレーム板金２０には、第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、第５リード部６３Ｇ２部分に段差を形成する折り曲げ部Ｃ（図５中の破線部）が形成されている。この第１工程では、図５に例示したようなフレーム板金２０を作製する。
Next, a method for manufacturing the light emitting chip 52 will be described.
When manufacturing the light emitting chip 52, first, as a first step, a frame metal plate 20 in which a plurality of portions to be lead frames are arranged in a matrix is manufactured. FIG. 5 is a plan view showing an example of the frame metal plate 20. As shown in FIG. 5, the frame sheet metal 20 includes a first lead portion 62, a second lead portion 63R, a third lead portion 63G1, a fourth lead portion 63B, and a fifth lead portion 63G2 in the light emitting chip 52. A plurality of punched portions 21 punched around the lead frame where the portions to be formed are formed are arranged in a matrix. Further, the frame sheet metal 20 is formed with a bent portion C (broken line portion in FIG. 5) that forms a step in the second lead portion 63R, the third lead portion 63G1, the fourth lead portion 63B, and the fifth lead portion 63G2. Has been. In the first step, the frame sheet metal 20 illustrated in FIG. 5 is produced.
次の第２工程では、フレーム板金２０のリードフレームとなる部分の中で第１リード部６２を構成する部分の底面側縁部に、第１リード部６２の底面の面積を広げる方向に向けて凸状部６２ａを形成する。
図６は、第１リード部６２に凸状部６２ａを形成する工程の一例を示した断面図である。図６では、図５に示したフレーム板金２０のＸＩ−ＸＩ断面を用いて説明する。まず、図６（ａ）は、第１リード部６２に凸状部６２ａが形成される前の状態を示している。図６（ｂ）に示したように、この第２工程では、図６（ａ）に示した状態の第１リード部６２の上下面に対して上下方向から平板状の上金型１００と下金型１０１とによってプレス（加圧）加工する。その際に、下金型１０１を上下動させることで、図６（ｃ）に示したように、第１リード部６２の底面側縁部（破線領域）には、第１リード部６２の側面Ｓ１の法線方向（Ｘ１、Ｘ２方向等）に向けた凸状部６２ａが形成される。
ここでは下金型１０１を上下動させる方法を説明したが、その他に、下金型としてロール状の金型を回転させながらプレスする方法を用いてもよい。
In the next second step, the bottom surface side edge of the portion constituting the first lead portion 62 in the portion of the frame metal plate 20 that becomes the lead frame is directed toward the direction of increasing the area of the bottom surface of the first lead portion 62. Convex part 62a is formed.
FIG. 6 is a cross-sectional view illustrating an example of a process of forming the convex portion 62 a on the first lead portion 62. 6 will be described using the XI-XI cross section of the frame sheet metal 20 shown in FIG. First, FIG. 6A shows a state before the convex portion 62 a is formed on the first lead portion 62. As shown in FIG. 6 (b), in the second step, the flat plate-shaped upper mold 100 and the lower side from the upper and lower surfaces of the first lead portion 62 in the state shown in FIG. Press (pressurization) processing is performed with the mold 101. At that time, by moving the lower mold 101 up and down, as shown in FIG. 6C, the side surface of the first lead portion 62 is located on the bottom side edge portion (broken line region) of the first lead portion 62. A convex portion 62a is formed in the normal direction of S1 (X1, X2, etc.).
Although the method of moving the lower mold 101 up and down has been described here, a method of pressing while rotating a roll mold as the lower mold may be used.
なお、フレーム板金２０を作製する工程と、フレーム板金２０の第１リード部６２に凸状部６２ａを形成する工程とを発光チップ５２の製造工程とは別工程として設定してもよい。その場合には、次の第３工程の前に、第１リード部６２の底面側縁部に凸状部６２ａが形成されたフレーム板金２０が前もって用意されることとなる。 Note that the step of manufacturing the frame metal plate 20 and the step of forming the convex portion 62 a on the first lead portion 62 of the frame metal plate 20 may be set as separate steps from the manufacturing process of the light emitting chip 52. In that case, before the next third step, the frame sheet metal 20 in which the convex portion 62a is formed on the bottom surface side edge portion of the first lead portion 62 is prepared in advance.
次の第３工程では、図７に示したように、このフレーム板金２０にマトリクス状に複数配列されているリードフレームとなる部分に、それぞれ白色の熱可塑性樹脂を射出成型し、中央部に凹部６１ａを有する筐体６１を形成する。図７は、中央部に凹部６１ａを有する筐体６１がリードフレームとなる部分それぞれに成型されたフレーム板金２０の一例を示した平面図である。この第３工程では、第１リード部６２が形成される領域の底面側縁部において筐体６１が凸状部６２ａに倣って形成され、凸状部６２ａが筐体６１に埋め込まれて構成される。 In the next third step, as shown in FIG. 7, a white thermoplastic resin is injection-molded in each of the portions to be the lead frames arranged in a matrix on the frame metal plate 20, and a recess is formed in the central portion. A housing 61 having 61a is formed. FIG. 7 is a plan view showing an example of the frame metal plate 20 formed in each of the portions where the casing 61 having the recess 61a at the center becomes the lead frame. In the third step, the casing 61 is formed following the convex portion 62 a at the bottom side edge of the region where the first lead portion 62 is formed, and the convex portion 62 a is embedded in the casing 61. The
そして、次の第４工程では、フレーム板金２０に一体成型された筐体６１の凹部６１ａの中央部となる第１リード部６２上の位置（図３（ａ）参照）に、各ＬＥＤ（赤色ＬＥＤ６６Ｒ、第１緑色ＬＥＤ６６Ｇ１、第２緑色ＬＥＤ６６Ｇ２、青色ＬＥＤ６６Ｂ）をダイボンディングする。
各ＬＥＤを第１リード部６２表面にダイボンディングした後の第５工程では、各ＬＥＤの上面に設けられたカソード電極と第１リード部６２とのワイヤーボンディングと、各ＬＥＤの上面に設けられたアノード電極と第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、および第５リード部６３Ｇ２それぞれとのワイヤーボンディングとを行う。それにより、各ＬＥＤと第１リード部６２とが電気的に接続され、各ＬＥＤと第２リード部６３Ｒ、第３リード部６３Ｇ１、第４リード部６３Ｂ、第５リード部６３Ｇ２それぞれとが電気的に接続される。
Then, in the next fourth step, each LED (red color) is placed at a position on the first lead portion 62 (see FIG. 3A), which is the central portion of the concave portion 61a of the housing 61 integrally molded with the frame metal plate 20. LED66R, first green LED 66G1, second green LED 66G2, blue LED 66B) are die-bonded.
In the fifth step after each LED is die-bonded to the surface of the first lead portion 62, wire bonding between the cathode electrode provided on the upper surface of each LED and the first lead portion 62, and the upper surface of each LED is provided. Wire bonding of the anode electrode to each of the second lead portion 63R, the third lead portion 63G1, the fourth lead portion 63B, and the fifth lead portion 63G2 is performed. Thereby, each LED and the first lead portion 62 are electrically connected, and each LED and the second lead portion 63R, the third lead portion 63G1, the fourth lead portion 63B, and the fifth lead portion 63G2 are electrically connected. Connected to.
次の第６工程では、筐体６１の凹部６１ａを覆う封止部６９に透明樹脂を充填する。
そして最後の第７工程にて、フレーム板金２０を切断して、上記の図３に示した個々の発光チップ５２とする。
上記のような第１工程から第７工程までの製造工程を経ることによって、複数の発光チップ５２が一括して製造される。このような発光チップ５２では、第２工程において、第１リード部６２が形成される領域の底面側縁部に、第１リード部６２の底面の面積を広げる方向に向けて凸状部６２ａが形成される。そのため、第３工程において、第１リード部６２が形成される領域の底面側縁部において筐体６１が凸状部６２ａに倣って形成され、筐体６１には凸状部６２ａが埋め込まれて構成される。それにより、第１リード部６２の底面側縁部の凸状部６２ａが筐体６１を下方向（図４のＺ１方向）から支える構造が形成され、筐体６１に作用する下方向の力に対抗する力を生み出す。それにより、発光チップ５２は小型・薄型に構成されるとともに、筐体６１は下方向の力を受けた場合にもリードフレームから離脱し難い構造が実現される。
In the next sixth step, the sealing portion 69 covering the recess 61a of the housing 61 is filled with a transparent resin.
In the final seventh step, the frame sheet metal 20 is cut into individual light emitting chips 52 shown in FIG.
A plurality of light emitting chips 52 are manufactured collectively through the manufacturing processes from the first process to the seventh process as described above. In such a light emitting chip 52, in the second step, the convex portion 62a is formed on the bottom side edge of the region where the first lead portion 62 is formed toward the direction in which the area of the bottom surface of the first lead portion 62 is increased. It is formed. Therefore, in the third step, the housing 61 is formed following the convex portion 62a at the bottom edge of the region where the first lead portion 62 is formed, and the convex portion 62a is embedded in the housing 61. Composed. As a result, a structure is formed in which the convex portion 62a on the bottom side edge of the first lead portion 62 supports the housing 61 from below (Z1 direction in FIG. 4), and the downward force acting on the housing 61 is reduced. Create the power to counter. Thereby, the light emitting chip 52 is configured to be small and thin, and the housing 61 is configured to be difficult to be detached from the lead frame even when receiving a downward force.
本実施の形態の発光装置１１においては、上記の製造工程を経て製造された発光チップ５２が例えば４２個使用され、回路部材の一例としての基板５１の表面に配列される。そして、基板５１上に構成された回路により各発光チップ５２に電力が供給・制御され、照明装置１０の光源部として機能する。 In the light emitting device 11 of the present embodiment, for example, 42 light emitting chips 52 manufactured through the above manufacturing process are used and arranged on the surface of a substrate 51 as an example of a circuit member. Then, power is supplied and controlled to each light emitting chip 52 by a circuit configured on the substrate 51, and functions as a light source unit of the lighting device 10.
なお、本実施の形態では、赤色ＬＥＤ６６Ｒと、第１緑色ＬＥＤ６６Ｇ１および第２緑色ＬＥＤ６６Ｇ２と、青色ＬＥＤ６６Ｂとを並列に接続して構成した発光チップ５２について説明した。発光チップ５２の構成としては、本実施の形態で示したものの他に、例えば１つの青色ＬＥＤを配置した形態や、複数の青色ＬＥＤを直列に接続した形態等を用いることもできる。その場合には、封止部６９は、青色ＬＥＤから出射される青色光の一部を緑色光および赤色光に変換する蛍光体を含有させた透明樹脂で構成される。また、透明樹脂に含有させる蛍光体としては、青色光の一部を黄色光に変換する蛍光体、あるいは、青色光の一部を黄色光および赤色光に変換する蛍光体を用いてもよい。 In the present embodiment, the light emitting chip 52 configured by connecting the red LED 66R, the first green LED 66G1, the second green LED 66G2, and the blue LED 66B in parallel has been described. As a configuration of the light emitting chip 52, for example, a form in which one blue LED is arranged, a form in which a plurality of blue LEDs are connected in series, or the like can be used in addition to the structure shown in the present embodiment. In that case, the sealing part 69 is comprised with the transparent resin containing the fluorescent substance which converts a part of blue light radiate | emitted from blue LED into green light and red light. Moreover, as a fluorescent substance contained in transparent resin, you may use the fluorescent substance which converts a part of blue light into yellow light, or the fluorescent substance which converts a part of blue light into yellow light and red light.
以上説明したように、本実施の形態の発光装置１１では、第１リード部６２の底面側縁部に、第１リード部６２の底面の面積を広げる方向に向けて凸状部６２ａが形成される。そして、筐体６１の内側に向けて第１リード部６２の底面側縁部の凸状部６２ａが埋め込まれることで、第１リード部６２が凸状部６２ａにより筐体６１を下方向（図４のＺ１方向）から支える構造が形成され、筐体６１に作用する下方向の力に対抗する力を生み出す。それにより、発光チップ５２は小型・薄型に構成されるとともに、筐体６１は下方向の力を受けた場合にもリードフレームから離脱し難い構造が実現される。 As described above, in the light emitting device 11 according to the present embodiment, the convex portion 62a is formed on the bottom side edge of the first lead portion 62 toward the direction of increasing the area of the bottom surface of the first lead portion 62. The And the convex part 62a of the bottom side edge part of the 1st lead part 62 is embedded toward the inner side of the housing | casing 61, and the 1st lead part 62 moves down the housing | casing 61 by the convex part 62a (FIG. 4 (Z1 direction) is formed, and a force that opposes the downward force acting on the housing 61 is generated. Thereby, the light emitting chip 52 is configured to be small and thin, and the housing 61 is configured to be difficult to be detached from the lead frame even when receiving a downward force.
＜実施の形態２＞
本実施の形態の発光チップ５２では、第１リード部６２の上面の側縁部にも、第１リード部６２の側面Ｓ１の法線方向（図４のＸ１、Ｘ２方向等）に向けた凸部が形成された構成について説明する。なお、実施の形態１と同様な構成については同様な符号を用い、ここではその詳細な説明を省略する。
<Embodiment 2>
In the light emitting chip 52 of the present embodiment, the convex toward the normal direction (X1, X2, etc. in FIG. 4) of the side surface S1 of the first lead portion 62 also on the side edge portion of the upper surface of the first lead portion 62. The structure in which the part is formed will be described. In addition, the same code | symbol is used about the structure similar to Embodiment 1, and the detailed description is abbreviate | omitted here.
図８に示したように、本実施の形態の発光チップ５２においては、図８の破線で示した第１リード部６２の底面（ｂａｓｅ）の側縁部に加えて、同じく破線で示した第１リード部６２の上面（ｕｐｐｅｒ）の側縁部に第１リード部６２の側面Ｓ１の法線方向（図４のＸ１、Ｘ２等の方向）に向けた凸状部６２ｂが形成されている。それにより、筐体６１には、第１リード部６２の底面（ｂａｓｅ）側縁部に形成された凸状部６２ａと、上面（ｕｐｐｅｒ）側縁部に形成された凸状部６２ｂとが埋め込まれて構成される。そのため、筐体６１が下方向（Ｚ１方向）に力を受けた場合に、筐体６１は、第１リード部６２の凸状部６２ａによりリードフレームからの離脱を抑制する力を受ける。また、筐体６１が上方向（Ｚ２方向）に力を受けた場合に、筐体６１は、第１リード部６２の凸状部６２ｂによってもリードフレームからの離脱を抑制する力を受ける。それによって、筐体６１が下方向（Ｚ１方向）および上方向（Ｚ２方向）の何れの力を受けた場合にも、筐体６１は第１リード部６２から離脱を抑制する力を受け、リードフレームから離脱し難い構造が実現される。 As shown in FIG. 8, in the light-emitting chip 52 of the present embodiment, in addition to the side edge portion of the bottom surface (base) of the first lead portion 62 shown by the broken line in FIG. A convex portion 62 b is formed on the side edge of the upper surface (upper) of the first lead portion 62 so as to face the normal direction of the side surface S1 of the first lead portion 62 (the direction of X1, X2, etc. in FIG. 4). Thereby, the housing 61 is embedded with a convex portion 62a formed at the bottom side edge portion of the first lead portion 62 and a convex portion 62b formed at the upper side edge portion. Configured. Therefore, when the casing 61 receives a force in the downward direction (Z1 direction), the casing 61 receives a force that suppresses separation from the lead frame by the convex portion 62 a of the first lead portion 62. Further, when the casing 61 receives a force in the upward direction (Z2 direction), the casing 61 receives a force that suppresses the separation from the lead frame by the convex portion 62 b of the first lead portion 62. As a result, when the casing 61 receives any force in the downward direction (Z1 direction) or the upward direction (Z2 direction), the casing 61 receives a force that suppresses detachment from the first lead portion 62, and leads A structure that is difficult to separate from the frame is realized.
このように、本実施の形態の発光チップ５２では、第１リード部６２の底面側縁部および上面側縁部に、第１リード部６２の底面の面積を広げる方向に向けた凸状部６２ａと、上面の面積を広げる方向に向けた凸状部６２ｂとが形成されている。それにより、筐体６１が下方向（Ｚ１方向）および上方向（Ｚ２方向）の何れの力を受けた場合にも、筐体６１はリードフレームから離脱し難い構造が実現される。 As described above, in the light emitting chip 52 of the present embodiment, the convex portion 62a is directed to the bottom surface side edge portion and the top surface side edge portion of the first lead portion 62 in the direction in which the area of the bottom surface of the first lead portion 62 is increased. And the convex part 62b toward the direction which expands the area of an upper surface is formed. As a result, a structure is realized in which the casing 61 is not easily detached from the lead frame when the casing 61 receives any force in the downward direction (Z1 direction) and the upward direction (Z2 direction).
＜実施の形態３＞
実施の形態１では、発光装置１１を照明装置１０の光源部として用いる構成について説明した。本実施の形態では、発光装置１１を液晶表示装置のバックライト装置８０として用いる構成について説明する。なお、実施の形態１と同様な構成については同様な符号を用い、ここではその詳細な説明を省略する。
<Embodiment 3>
In the first embodiment, the configuration in which the light emitting device 11 is used as the light source unit of the lighting device 10 has been described. In this embodiment, a structure in which the light-emitting device 11 is used as the backlight device 80 of the liquid crystal display device will be described. In addition, the same code | symbol is used about the structure similar to Embodiment 1, and the detailed description is abbreviate | omitted here.
図９は、本実施の形態のバックライト装置８０の一部の構造を説明する図である。図９（ａ）は発光装置１１が装着されたバックライト装置８０の平面図であり、（ｂ）は（ａ）のＸＩＩ−ＸＩＩ断面図である。図９に示す例では、液晶表示装置の背面直下に発光装置１１を配置する直下型のバックライト構造を採用している。そして、このバックライト構造では、液晶表示装置の背面の全体にほぼ均等に発光部材が配列されている。 FIG. 9 is a diagram for explaining a partial structure of the backlight device 80 of the present embodiment. FIG. 9A is a plan view of the backlight device 80 to which the light emitting device 11 is mounted, and FIG. 9B is a cross-sectional view taken along the line XII-XII in FIG. In the example shown in FIG. 9, a direct-type backlight structure is employed in which the light-emitting device 11 is disposed directly below the back surface of the liquid crystal display device. In this backlight structure, the light emitting members are arranged almost evenly on the entire back surface of the liquid crystal display device.
バックライト装置８０の基板であるバックライトフレーム８１は、例えばアルミニウムやマグネシウム、鉄、またはそれらを含む金属合金などで生成される筐体構造を形成している。そして、その筐体構造の内側に、例えば白色高反射の性能を有するポリエステルフィルムなどが貼られ、リフレクタとしても機能するように構成されている。この筐体構造としては、液晶表示装置の大きさに対応して設けられる背面部８１ａ、この背面部８１ａの四隅を囲う側面部８１ｂを備えている。そして、この背面部８１ａ上には放熱部材８８が配置される。 The backlight frame 81 that is a substrate of the backlight device 80 forms a housing structure that is made of, for example, aluminum, magnesium, iron, or a metal alloy containing them. And the polyester film etc. which have the performance of white high reflection, for example are affixed inside the housing | casing structure, and it is comprised so that it may function also as a reflector. The casing structure includes a back surface portion 81a provided corresponding to the size of the liquid crystal display device, and side surface portions 81b surrounding the four corners of the back surface portion 81a. And the heat radiating member 88 is arrange | positioned on this back surface part 81a.
図９に示したバックライト装置８０では、発光装置１１が複数（本実施の形態では８枚）設けられている。そして、各発光装置１１は、それぞれ複数 （本実施の形態では１枚の発光装置１１に対して２本）のネジ８７により、例えば上記の図２に示したものと同様な構造の放熱部材８８を介してバックライトフレーム８１に固定されている。
このバックライトフレーム８１に複数の発光装置１１が配置されることで、バックライト構造の全体として、各色を発光する発光チップ８３が均等に配置される。それにより、バックライトフレーム８１に存在する各発光チップ８３の全体を用いることで、輝度および色度の均一性を実現したバックライト装置８０が構成される。なお、図９に示したバックライト装置８０では、複数の発光装置１１が設けられているが、バックライトの光源として用いられるすべての発光チップ８３を１つの基板にまとめた単独の発光装置１１として構成してもよい。
In the backlight device 80 shown in FIG. 9, a plurality of light emitting devices 11 (eight in the present embodiment) are provided. Each of the light emitting devices 11 is provided with a plurality of screws 87 (two for each light emitting device 11 in this embodiment), for example, a heat dissipation member 88 having a structure similar to that shown in FIG. It is fixed to the backlight frame 81 via
By arranging the plurality of light emitting devices 11 on the backlight frame 81, the light emitting chips 83 for emitting each color are evenly arranged as a whole of the backlight structure. Thereby, by using the whole of each light emitting chip 83 present in the backlight frame 81, the backlight device 80 that realizes uniformity of luminance and chromaticity is configured. In the backlight device 80 shown in FIG. 9, a plurality of light emitting devices 11 are provided. However, as the single light emitting device 11 in which all the light emitting chips 83 used as the light source of the backlight are combined on one substrate. It may be configured.
この発光装置１１は、回路部材の一例としての配線基板８２と、この配線基板８２に実装される発光部材の一例としての複数の発光チップ８３とを備えている。本実施の形態の発光装置１１に備えられた各発光チップ８３は、実施の形態１で説明した図３の発光チップ５２と同様に構成されている。すなわち、上記の図３に示したように、第１リード部６２の底面側縁部に、第１リード部６２の底面の面積を広げる方向に向けて凸状部６２ａが形成される。そして、筐体６１の内側に向けて第１リード部６２の底面側縁部の凸状部６２ａが埋め込まれることで、第１リード部６２が凸状部６２ａにより筐体６１を下方向（図４のＺ１方向）から支える構造が形成され、筐体６１に作用する下方向の力に対抗する力を生み出す。それにより、発光チップ８３は小型・薄型に構成されるとともに、筐体６１は下方向の力を受けた場合にもリードフレームから離脱し難い構造が実現される。 The light emitting device 11 includes a wiring board 82 as an example of a circuit member, and a plurality of light emitting chips 83 as an example of a light emitting member mounted on the wiring board 82. Each light-emitting chip 83 provided in the light-emitting device 11 of the present embodiment is configured similarly to the light-emitting chip 52 of FIG. 3 described in the first embodiment. That is, as shown in FIG. 3, the convex portion 62 a is formed on the bottom side edge portion of the first lead portion 62 toward the direction of increasing the area of the bottom surface of the first lead portion 62. And the convex part 62a of the bottom side edge part of the 1st lead part 62 is embedded toward the inner side of the housing | casing 61, and the 1st lead part 62 moves down the housing | casing 61 by the convex part 62a (FIG. 4 (Z1 direction) is formed, and a force that opposes the downward force acting on the housing 61 is generated. Thereby, the light emitting chip 83 is configured to be small and thin, and the housing 61 is configured to be difficult to be detached from the lead frame even when receiving a downward force.
なお、本発明は、上述した実施の形態に限定されるものではなく、その要旨の範囲内で種々変形して実施することができる。 The present invention is not limited to the above-described embodiment, and can be implemented with various modifications within the scope of the gist.
１０…照明装置、１１…発光装置、１２…リフレクタ、１３…放熱部材、２０…フレーム板金、５１…基板、５２,８３…発光チップ、６１…筐体、６２…第１リード部、６２ａ,６２ｂ…凸状部、６３Ｒ…第２リード部、６３Ｇ１…第３リード部、６３Ｂ…第４リード部、６３Ｇ２…第５リード部、６６Ｒ…赤色ＬＥＤ、６６Ｇ１…第１緑色ＬＥＤ、６６Ｇ２…第２緑色ＬＥＤ、６６Ｂ…青色ＬＥＤ、６９…封止部、８０…バックライト装置 DESCRIPTION OF SYMBOLS 10 ... Illuminating device, 11 ... Light-emitting device, 12 ... Reflector, 13 ... Radiating member, 20 ... Frame sheet metal, 51 ... Substrate, 52, 83 ... Light-emitting chip, 61 ... Housing, 62 ... First lead part, 62a, 62b ... convex part, 63R ... second lead part, 63G1 ... third lead part, 63B ... fourth lead part, 63G2 ... fifth lead part, 66R ... red LED, 66G1 ... first green LED, 66G2 ... second green LED, 66B ... Blue LED, 69 ... Sealing part, 80 ... Backlight device
Claims (12)
前記発光素子を支持する支持面と当該支持面と対向する対向面とを有し、当該対向面の側縁部に当該対向面の面積を広げる方向に凸状部が形成された支持部材と、
前記支持部材の前記凸状部が埋め込まれて当該支持部材に保持され、前記発光素子を保護する保護部材と
を備えたことを特徴とする発光部材。 A light emitting element;
A support member having a support surface for supporting the light emitting element and an opposing surface facing the support surface, wherein a convex portion is formed in a direction of expanding an area of the opposing surface on a side edge of the opposing surface;
A light emitting member comprising: a protective member embedded in the convex portion of the support member and held by the support member to protect the light emitting element.
前記支持部材は、前記発光素子の他方の電極が接続されるとともに、前記電極部材よりも厚さが厚く構成されたことを特徴とする請求項１記載の発光部材。 An electrode member to which one electrode of the light emitting element is connected;
The light emitting member according to claim 1, wherein the support member is configured to be connected to the other electrode of the light emitting element and to be thicker than the electrode member.
前記電極部材は、前記支持部材の前記支持面と同一面に位置する第１面と、当該第１面に対して段差を持った第２面とが形成されたことを特徴とする請求項１記載の発光部材。 An electrode member to which one electrode of the light emitting element is connected;
The electrode member is formed with a first surface located on the same surface as the support surface of the support member, and a second surface having a step with respect to the first surface. The light emitting member as described.
複数の前記発光部材を電気的に接続して当該発光部材に電力を供給する回路が形成された回路部材と
を備えたことを特徴とする発光装置。 A light emitting element, a supporting surface that supports the light emitting element, and a facing surface that faces the supporting surface, and a convex portion is formed on a side edge portion of the facing surface in a direction that widens the area of the facing surface. A light emitting member having a support member and a protective member that is embedded in the convex portion of the support member and is held by the support member and protects the light emitting element;
A light emitting device comprising: a circuit member formed with a circuit that electrically connects a plurality of the light emitting members and supplies power to the light emitting members.
前記フレーム板金の前記支持面に発光素子を載せる工程と、
前記発光素子を前記支持面に固定する工程と
を含むことを特徴とする発光部材の製造方法。 The light emitting element is embedded in a frame sheet metal in which a convex part is formed in the direction of expanding the area of the opposing surface at the side edge of the opposing surface that faces the support surface on which the light emitting element is supported. Forming a holding member that protects,
Placing a light emitting element on the support surface of the frame sheet metal;
A step of fixing the light emitting element to the support surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008305603A JP2010129923A (en) | 2008-11-28 | 2008-11-28 | Light-emitting member, light-emitting device, illumination device, backlight device and method for manufacturing light-emitting member |
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| JP2014506398A (en) * | 2011-03-07 | 2014-03-13 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Optoelectronic component leadframe and optoelectronic component manufacturing method |
| JP2014203532A (en) * | 2013-04-01 | 2014-10-27 | 株式会社小糸製作所 | Vehicular lighting fixture |
| JP2015513220A (en) * | 2012-03-08 | 2015-04-30 | コーニンクレッカ フィリップス エヌ ヴェ | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD |
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| US10181718B2 (en) | 2015-01-22 | 2019-01-15 | Littelfuse, Inc. | Surface-mountable electrical circuit protection device |
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| US10274667B2 (en) | 2016-01-18 | 2019-04-30 | Nichia Corporation | Light-emitting device with two green light-emitting elements with different peak wavelengths and backlight including light-emitting device |
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