JP6314493B2 - Light emitting element mounting lead frame, light emitting element mounting resin molded body, surface mounted light emitting device, and method for manufacturing surface mounted light emitting device - Google Patents

Description

  The present invention relates to a light emitting element mounting lead frame, a light emitting element mounting resin molded body using the same, and a surface mounted light emitting device. And it is related with the manufacturing method of this surface mount type light-emitting device.

  An optical semiconductor device in which an optical semiconductor element such as a light emitting diode (LED) or a laser diode (LD) is mounted can emit high-luminance light with excellent visibility, and can be miniaturized and consumes power. Has many advantages such as low life and long life. For this reason, the optical semiconductor device is used as, for example, a lighting device such as a light bulb, a downlight, a base light, a streetlight, a traffic light, a backlight light source such as a liquid crystal display, and the use thereof is rapidly expanding.

  The optical semiconductor device is formed in, for example, a unit mounting area composed of first and second leads facing each other through a spatial slit extending substantially linearly, and at least a light emitting element mounting surface and a slit in the unit mounting area. A curable resin layer having a hole forming a recess in which the light emitting element mounting surface of the unit mounting area is exposed on the bottom surface, a light emitting element mounted on the light emitting element mounting surface of the unit mounting area on the bottom surface of the recess, and the light emitting element mounting And a transparent resin layer made of a transparent resin to be filled in the subsequent recess (for example, see Patent Documents 1 and 2). Also known is a flat plate type optical semiconductor device that does not have a curable resin layer called a reflector formed on a light emitting element mounting surface in a unit mounting region, and in which a curable resin layer is mainly formed in a slit portion. (For example, see Patent Document 3).

  In general, an optical semiconductor device includes an assembly of unit mounting regions in which a plurality of unit mounting regions are connected in a grid pattern vertically and horizontally by a plurality of connection pieces, and a frame body provided with a gap between the periphery of the assembly, Manufactured by resin molding using a lead frame that includes a unit mounting region disposed at a peripheral end of the assembly and the frame, and a support portion that supports the assembly inside the frame. The

  As the above resin molding method, a MAP (Mold Array Package) method is known (for example, see Patent Document 4). For MAP resin molding, a MAP type lead frame adapted to the MAP method is used. A molding die used in the MAP method is formed with cavities that accommodate the entire plurality of unit mounting regions formed in the MAP type lead frame. In MAP resin molding, a plurality of unit mounting areas formed on a MAP type lead frame are placed in a single cavity of the mold, and in the vicinity of the periphery of the lead frame frame in the mold. A curable resin is injected into the mold from the provided injection gate and thermally cured to produce a resin molded body for an optical semiconductor device in which a curable resin layer is integrally formed at a predetermined portion of the lead frame. A light emitting element is mounted at a predetermined position of each unit mounting region in the resin molded body, and each light emitting element is covered with a transparent resin layer to produce an optical semiconductor package, and the resin molded body on which the package is formed is cut. An optical semiconductor device is manufactured by cutting into pieces by cutting with a blade.

JP-A-11-307820 JP 2010-62272 A JP 2011-176256 A JP 2007-235085 A (FIG. 1)

  By the way, as described above, a MAP type lead frame is installed in a molding die, and resin is injected into the die from an injection gate provided in the vicinity of the peripheral portion of the frame of the lead frame in the die. When the resin layer is formed at a predetermined portion of the lead frame, the strength is lowered at a part of the resin layer, and there is a disadvantage that a crack occurs in the resin portion.

  An object of the present invention is to provide a light-emitting element mounting lead frame, a light-emitting element mounting resin molded body, a surface-mounted light-emitting device, and a method for manufacturing the surface-mounted light-emitting device that can reduce the possibility of cracks occurring in the resin portion. Is to provide.

  A light emitting element mounting lead frame according to the present invention includes a plurality of unit mounting regions each including a first lead and a second lead, which are separated from each other in the same plane and are arranged in a lateral direction. The areas are arranged in a matrix in the vertical and horizontal directions, and the leads of the first leads and the second leads are arranged separately from each other, and the leads of the unit mounting areas and the leads of the other unit mounting areas, A light emitting element mounting lead frame including a plurality of connecting pieces connecting the same in the same plane, and along the lateral direction of at least one of the first lead and the second lead in each unit mounting region. The lateral side extending is a connection prohibition region to which the connection piece is not connected, and at least a part of the plurality of connection pieces includes the first lead and the unit mounting region. Of the outer peripheral portion of the second lead from the connection area provided in the first region except for the connection prohibition region, and extends toward the lead of the other unit mounting region.

  When the lead frame for mounting the light emitting element is fixed in the mold and the resin is injected in the vertical direction, the resin goes around between the leads between two unit mounting regions adjacent in the vertical direction. In the wraparound region where the resin wraps around, the resin hardly flows and the resin wrapping around from both sides meets and collides. If the connection piece extends from the lead in this wrapping region, the flow of the resin is hindered, and the strength of the resin in the wrapping region is reduced, causing a crack in the resin. However, according to this configuration, the connecting piece is connected to the lateral side extending along the lateral direction of at least one of the first lead and the second lead in each unit mounting region, that is, the lateral side in the wrapping region. Is a connection prohibited area. Therefore, in the entrainment region, the possibility that the resin flow is hindered by the connecting piece extending from the lateral side and the strength of the resin is reduced is reduced. As a result, it is possible to reduce the possibility of cracks occurring in a resin molded body for light emitting element mounting using a light emitting element mounting lead frame or a resin portion of a surface mount type light emitting device.

  Further, it is preferable that the connection prohibition area is the horizontal side of the first lead and the second lead in each unit mounting area.

  According to this configuration, in both the first lead and the second lead, the connection piece does not extend from the lateral side in the wraparound region. As a result, the effect of reducing the risk of cracking in the resin increases.

  In addition, it is preferable that the connection region is provided in a second region which is a region facing the unit mounting region adjacent in the lateral direction in the first region in each unit mounting region.

  According to this configuration, the connection region is not provided in the third region, which is the region where the first lead and the second lead face each other in the first region in each unit mounting region. Accordingly, there is no connection piece extending from the side (side surface) of the lead facing the region sandwiched between the first lead and the second lead. As a result, when resin molding is performed using this lead frame, the resin is smoothly filled in the region sandwiched between the first lead and the second lead. The region sandwiched between the first lead and the second lead is a portion that stays in the package of the surface mount type light emitting device that is finally formed, and the resin is filled by smoothly filling the region with the resin. The possibility of forming defects such as unevenness and unfilling is reduced.

  In addition, at least one of the first lead and the second lead in each unit mounting region is adjacent to the vertical outer edge extending in the vertical direction and the extension line of the vertical outer edge in the second region. It is preferable to include a connection outer edge that connects the vertical outer edge and the horizontal side while moving away from a unit mounting area that fits, and the connection area is provided on the connection outer edge.

  According to this configuration, since the vertical outer edge and the connection outer edge are smoothly connected (for example, at an obtuse angle), the resin flowing along the vertical outer edge smoothly flows along the connection outer edge as it is. As a result, even when the connection piece is extended from the connection outer edge, a decrease in adhesion between the connection outer edge and the resin and a decrease in resin strength due to the connection piece are reduced.

  The connection area may be provided in a third area, which is an area where the first lead and the second lead face each other in the first area in each unit mounting area.

  The resin is filled between the first lead and the second lead in the resin molding process. Thereby, after resin molding, a resin layer extending in a strip shape is formed so as to cross the surface mount type light emitting device (light emitting element mounting resin molding). In this belt-shaped resin layer, the mechanical strength is lowered. Therefore, along this resin layer, the surface mount type light emitting device (resin molded body for mounting light emitting element) easily breaks. However, according to this configuration, each unit mounting region is cut and separated, so that a part of the connecting piece protrudes from the side of the third region facing the belt-shaped resin layer of the lead and It remains in the surface mount type light emitting device (resin molded body for mounting light emitting element). As a result, the mechanical strength around the belt-shaped resin layer is increased, and the possibility that the surface-mounted light-emitting device (light-emitting element mounting resin molding) is broken is reduced.

  In addition, at least one of the first lead and the second lead in each unit mounting region has a vertical outer edge extending in the vertical direction in the third region, and a vertical outer edge extending from the opposing lead. It is preferable to include a connection outer edge that connects the vertical outer edge and the horizontal side while being farther from the extension line, and the connection region is provided at the connection outer edge.

  According to this configuration, since the vertical outer edge and the connection outer edge are smoothly connected (for example, at an obtuse angle), the resin flowing along the vertical outer edge smoothly flows along the connection outer edge as it is. As a result, even when the connection piece is extended from the connection outer edge, a decrease in adhesion between the connection outer edge and the resin and a decrease in resin strength due to the connection piece are reduced.

  The connection region includes a second region that is a region facing the unit mounting region adjacent in the lateral direction in the first region in each unit mounting region, and the first region in each unit mounting region. Within the region, the first lead and the second lead may be provided in a third region, which is a region facing each other.

  According to this configuration, since the connection piece can be connected to the second region and the third region, the number of connection points between the connection piece and the lead can be easily increased. As a result, it is easy to increase the strength of the light emitting element mounting lead frame.

  In addition, at least one of the first lead and the second lead in each unit mounting area is a vertical extension extending in a vertical direction in at least one of the second area and the third area. An outer edge and a connection outer edge that connects the vertical outer edge and the horizontal side while being farther from the extension line of the vertical outer edge from the other lead facing at least one of the leads, and the connection region is connected to the connection outer edge. It is preferable to be provided.

  According to this configuration, since the vertical outer edge and the connection outer edge are smoothly connected (for example, at an obtuse angle), the resin flowing along the vertical outer edge smoothly flows along the connection outer edge as it is. As a result, even when the connection piece is extended from the connection outer edge, a decrease in adhesion between the connection outer edge and the resin and a decrease in resin strength due to the connection piece are reduced.

  Each unit mounting area can be separated into pieces by being separated from the other unit mounting areas along the horizontal direction and the vertical direction intersecting the horizontal direction, and at least a part of the unit mounting area is separated from the unit mounting area. The connecting piece further connects the first lead and the second lead of each unit mounting region, and the connection between the first lead and the second lead is disconnected when the disconnection is performed. In addition, it is preferable that a fourth region, which is a partial region of the connection piece, is disposed on a side farther from the connected first lead and second lead than a position where a cut surface is generated by the singulation. .

  In order to increase the strength of the lead frame for mounting the light emitting element, it is desirable to connect the first lead and the second lead with a connecting piece. However, since the first lead and the second lead are so-called leads of the electronic component, they need to be electrically insulated from each other. So, according to this structure, the 4th area | region which is a partial area | region of a connection piece is arrange | positioned in the side far from the 1st lead and 2nd lead connected from the position where a cut surface arises by individualization. . Therefore, after the light emitting element mounting lead frame is singulated, the connecting piece is cut at a position closer to the first lead and the second lead than the fourth region of the connecting piece. As a result, the connection between the first lead and the second lead is cut off, so that the first lead and the second lead are connected by a connecting piece, and finally the light emitting device mounting lead frame is increased in strength while being made. In the surface mounted light emitting device, the first lead and the second lead can be electrically insulated.

  Moreover, it is preferable that the fourth region is disposed in a region corresponding to a strip-shaped cutting region extending along the lateral direction that is removed in the separation.

  According to this configuration, even if the connection piece is configured to mutually connect the first lead and the second lead with respect to two unit mounting regions adjacent in the vertical direction, each unit mounting region is separated into pieces. In this process, it is easy to electrically insulate the first lead and the second lead in each unit mounting region.

  Preferably, the connection prohibition region further includes a region having a preset set length extending from the lateral side of each lead, which is an edge portion connected to the lateral side of each lead.

  According to this configuration, the connection piece is connected to the outer edge of each lead at a position separated from the above-described wrapping region by a set length or more. Thereby, the connection position to the lead | read | reed of a connection piece is kept away from a wraparound area | region. As a result, the influence of the connection piece in the vicinity of the wraparound region on the resin flow in the wraparound region is reduced.

  Preferably, the plurality of unit mounting regions are MAP type lead frames in which resin molding is integrally performed.

  In the MAP type lead frame, the above-described wraparound region is likely to occur, and cracks are likely to occur in the resin portion after resin molding. Therefore, this structure has a great effect of suppressing the occurrence of cracks by smoothing the resin flow in the entrainment region.

  Also, the resin molded body for mounting a light emitting element according to the present invention is formed integrally with the lead frame so that at least a part of each of the first and second lead surfaces is exposed. And a resin layer.

  According to this configuration, in the resin molded body for mounting a light emitting element, it is possible to reduce the possibility of cracking in the resin.

  The resin layer is preferably formed so as to cover the entire plurality of unit mounting regions.

  A resin molded body for mounting a light-emitting element in which a resin layer is formed so as to cover the entire plurality of unit mounting regions is a resin mold in a state where a plurality of unit mounting regions are accommodated in a single cavity of a mold during resin molding. To be formed. In this case, since a wraparound region occurs during resin formation, cracks are likely to occur in the resin part after resin molding. Therefore, this structure has a great effect of suppressing the occurrence of cracks by smoothing the resin flow in the entrainment region.

  A surface-mounted light-emitting device according to the present invention includes the above-described resin molded body for mounting a light-emitting element, and a light-emitting element that is mounted on at least a part of the surface of the first and second leads so as to be energized.

  According to this configuration, in the surface mount light emitting device, it is possible to reduce the possibility of cracks occurring in the resin package.

  The method for manufacturing a surface-mounted light-emitting device according to the present invention includes a mold-clamping process for fixing the above-described light-emitting element mounting lead frame in a predetermined mold in which a cavity is formed, and the light-emitting element mounting lead. By supplying resin into the cavity from one longitudinal end of the frame, it is integrated with the lead frame so that at least a part of the first and second lead surfaces in each unit mounting region is exposed. Forming a resin layer to form a resin molded body for mounting a light emitting element, and mounting a light emitting element so that the at least part of the exposed first and second lead surfaces can be energized. The light emitting element mounting resin molded body is cut between the unit mounting regions of the light emitting element mounting lead frame integrated with the light emitting element mounting resin molded body. A cutting step of cutting along the horizontal direction and the vertical direction so as to be separated from each other, and in the cutting step, a band-shaped cutting region extending along the horizontal direction and the vertical direction is formed as the resin molded body for mounting a light emitting element. The unit mounting regions are separated from each other by being removed, and the cutting region is set to include a region extending along the horizontal direction and a region extending along the vertical direction of each connection piece. ing.

  According to this method, it is possible to manufacture a surface-mounted light-emitting device in which the risk of cracks occurring in the resin package is reduced. Moreover, since the area | region extended along the horizontal direction and the area | region extended along the vertical direction of each connection piece are contained in a cutting | disconnection area | region, these area | regions of each connection piece are removed in a cutting process. As a result, since the connection pieces remaining in the surface-mounted light-emitting device are reduced, aged deterioration due to a thermal cycle occurs due to the difference in thermal contraction rate between the resin material and the connection pieces constituting the surface-mounted light-emitting device. The fear is reduced.

  The method for manufacturing a surface-mounted light-emitting device according to the present invention includes a mold-clamping process for fixing the above-described light-emitting element mounting lead frame in a predetermined mold in which a cavity is formed, and the light-emitting element mounting lead. By supplying resin into the cavity from one longitudinal end of the frame, it is integrated with the lead frame so that at least a part of the first and second lead surfaces in each unit mounting region is exposed. Forming a resin layer to form a resin molded body for mounting a light emitting element, and mounting a light emitting element so that the at least part of the exposed first and second lead surfaces can be energized. The light emitting element mounting resin molded body is cut between the unit mounting regions of the light emitting element mounting lead frame integrated with the light emitting element mounting resin molded body. A cutting step of cutting along the horizontal direction and the vertical direction so as to be separated from each other, and in the cutting step, a band-shaped cutting region extending along the horizontal direction and the vertical direction is formed as the resin molded body for mounting a light emitting element. The unit mounting areas are separated from each other by being removed, and the cutting area is set except for an area extending along the horizontal direction and an area extending along the vertical direction of each connection piece. Yes.

  According to this method, it is possible to manufacture a surface-mounted light-emitting device in which the risk of cracks occurring in the resin package is reduced. Further, since the cutting region is set except for the region extending along the horizontal direction and the region extending along the vertical direction of each connection piece, the amount of the connection piece cut by the cutting blade in the cutting step is set. Will be reduced. Thereby, in the cutting process, it becomes possible to reduce the consumption of the cutting blade.

  Also, in the method for manufacturing a surface-mounted light emitting device according to the present invention, a cavity is formed on a lead frame for mounting a light emitting element including a connection piece connecting the first lead and the second lead in each unit mounting region. A mold clamping step of fixing in a predetermined mold, and supplying the resin into the cavity from one end side in the vertical direction of the light emitting element mounting lead frame, whereby the first and A resin molded body forming step of forming a resin molded body for mounting a light emitting element by forming a resin layer integrated with the lead frame so that at least a part of the second lead surface is exposed; and at least a part of the exposure A mounting step of mounting a light emitting element on the surface of the first lead and the second lead so as to be energized; and the resin molded body for mounting the light emitting element is integrated with the resin molded body for mounting the light emitting element. A cutting step of cutting along the horizontal direction and the vertical direction so as to separate the unit mounting regions of the element mounting lead frame, and in the cutting step, the light emission in the cutting along the horizontal direction The cutting is performed so that a cutting surface is formed at a position closer to the connected first lead and the second lead than the fourth region in the light emitting element mounting lead frame integrated with the element mounting resin molding. Do.

  According to this method, the first lead and the second lead are electrically connected by the cutting process while using the light emitting element mounting lead frame having the strength increased by connecting the first lead and the second lead by the connecting piece. Can be insulated.

  Further, in the method for manufacturing the surface-mounted light emitting device according to the present invention, the cavity forms the lead frame for mounting the light emitting element disposed in the region corresponding to the cut region, which is removed when the fourth region is cut off. A mold-clamping step for fixing in the predetermined mold, and supplying the resin into the cavity from one end side in the vertical direction of the light-emitting element mounting lead frame, whereby the first in each unit mounting region. A resin molded body forming step of forming a resin molded body for mounting a light emitting element by forming a resin layer integrated with the lead frame so that at least a part of the second lead surface is exposed; and A mounting step of mounting the light emitting element so as to be able to energize the exposed first and second lead surfaces, and the resin molded body for mounting the light emitting element together with the resin molded body for mounting the light emitting element. Cutting along the horizontal direction and the vertical direction so as to separate the unit mounting regions in the light-emitting element mounting lead frame formed in the cutting step, in the cutting step, the horizontal direction and the The unit-mounting regions are separated from each other by removing a band-shaped cutting region extending along the vertical direction from the resin molded body for mounting a light emitting element, and the cutting region is set to include the fourth region. Yes.

  According to this configuration, even if the connecting piece is configured to mutually connect the first lead and the second lead with respect to two unit mounting regions adjacent in the vertical direction, each unit mounting is performed in the cutting process. The first lead and the second lead in the region can be electrically insulated.

  The lead frame for mounting light emitting elements, the resin molded body for mounting light emitting elements, the surface mounted light emitting device, and the method for manufacturing the surface mounted light emitting device can reduce the risk of cracking in the resin.

It is a top view which shows typically the whole structure of the lead frame for light emitting element mounting which concerns on one Embodiment of this invention. It is a conceptual explanatory drawing for demonstrating the flow of the resin in the case of resin molding. It is a conceptual explanatory drawing for demonstrating the flow of the resin in the case of resin molding. It is a conceptual explanatory drawing for demonstrating the cause for which resin intensity | strength falls. 1 is a top view schematically showing an example of a configuration of a lead frame according to a first embodiment of the present invention. 1 is a top view schematically showing an example of a configuration of a lead frame according to a first embodiment of the present invention. 1 is a top view schematically showing an example of a configuration of a lead frame according to a first embodiment of the present invention. 1 is a top view schematically showing an example of a configuration of a lead frame according to a first embodiment of the present invention. 1 is a top view schematically showing an example of a configuration of a lead frame according to a first embodiment of the present invention. 1 is a top view schematically showing an example of a configuration of a lead frame according to a first embodiment of the present invention. 1 is a top view schematically showing an example of a configuration of a lead frame according to a first embodiment of the present invention. 1 is a top view schematically showing an example of a configuration of a lead frame according to a first embodiment of the present invention. 1 is a top view schematically showing an example of a configuration of a lead frame according to a first embodiment of the present invention. 1 is a top view schematically showing an example of a configuration of a lead frame according to a first embodiment of the present invention. It is a flowchart for demonstrating the manufacturing method of the surface mount type light-emitting device which concerns on one Embodiment of this invention. It is a top view which shows typically an example of the external appearance of the resin molding for light emitting element mounting formed at a resin molding formation process. It is a perspective view which shows typically an example of a structure of the surface mount type light-emitting device obtained by dividing the resin molding for light emitting element mounting shown in FIG. 16 into pieces. It is explanatory drawing which shows typically another example of the resin molding for light emitting element mounting formed at a resin molding formation process. It is a perspective view which shows typically an example of a structure of the surface mount type light-emitting device obtained by individualizing the resin molding for light emitting element mounting shown in FIG. It is explanatory drawing for demonstrating the connection prohibition area | region, 1st area | region, 2nd area | region, and 3rd area | region provided in each unit mounting area | region. It is explanatory drawing for demonstrating another example of the connection prohibition area | region, 1st area | region, 2nd area | region, and 3rd area | region provided in each unit mounting area | region. It is explanatory drawing for demonstrating another example of the connection prohibition area | region, 1st area | region, 2nd area | region, and 3rd area | region provided in each unit mounting area | region. It is explanatory drawing for demonstrating another example of the connection prohibition area | region, 1st area | region, 2nd area | region, and 3rd area | region provided in each unit mounting area | region. It is a top view which shows typically an example of the structure of the lead frame which concerns on 2nd Embodiment of this invention. It is a top view which shows typically an example of the structure of the lead frame which concerns on 2nd Embodiment of this invention. It is a top view which shows typically an example of the structure of the lead frame which concerns on 2nd Embodiment of this invention. It is a top view which shows typically an example of the structure of the lead frame which concerns on 2nd Embodiment of this invention. It is explanatory drawing which shows an example of the lead frame, the resin layer, and the insulation part in the package of the surface mount type light-emitting device formed by dividing the lead frame into pieces. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is a top view which shows typically an example of a structure of the lead frame 1 which concerns on 3rd Embodiment of this invention. It is explanatory drawing for demonstrating a trim type lead frame.

  Embodiments according to the present invention will be described below with reference to the drawings. In each figure, the same numerals are given to the composition corresponding to each other, and the explanation is omitted. FIG. 1 is a top view schematically showing the overall configuration of a lead frame 1 (light emitting element mounting lead frame) according to an embodiment of the present invention. The lead frame 1 is formed by subjecting a thin plate-like substantially rectangular metal plate having conductivity to a processing such as etching or die cutting by pressing. Although the material of a metal plate is not specifically limited, For example, iron, copper, phosphor bronze, a copper alloy etc. can be used. Further, the entire surface of the lead frame 1 or a part of the surface may be plated.

  The lead frame 1 includes a plurality of unit mounting regions 10 arranged in a matrix in the vertical and horizontal directions. Each unit mounting region 10 includes a plate-like first lead 20 and second lead 21 that are separated from each other in the same plane and are arranged in the lateral direction. A slit 22 extending in the vertical direction is formed between the first lead 20 and the second lead 21. In addition, between the unit mounting regions 10, the first lead 20 and the second lead 21 of each unit mounting region 10 are between the first lead 20 and the second lead 21 of another adjacent unit mounting region 10. They are arranged at intervals. Hereinafter, a direction in which the first lead 20 and the second lead 21 are arranged is referred to as a horizontal direction (first direction), and a direction intersecting (substantially orthogonal, substantially orthogonal) with the horizontal direction is referred to as a vertical direction (second direction). . Further, the first lead 20 and the second lead 21 may be collectively referred to simply as “lead”.

  The first lead 20 and the second lead 21 have a substantially rectangular shape. The area of the first lead 20 is larger than that of the second lead 21. Thereby, the 1st lead | read | reed 20 serves as the die pad in which the light emitting element mentioned later is mounted. The second lead 21 may also serve as a die pad, and the area may be increased. The first lead 20 and the second lead 21 may not have different sizes, and may not serve as a die pad. Also good. Further, the first lead 20 and the second lead 21 may be formed with through holes such as so-called anchor holes.

  Around the assembly 11 of the plurality of unit mounting regions 10, a substantially rectangular frame 12 surrounding the assembly 11 with a space is provided. In the drawing, the frame body 12 includes a strip-shaped frame side 12a extending along the lateral direction below the aggregate 11, a strip-shaped frame side 12b extending along the lateral direction above the aggregate 11, and the aggregate 11 A strip-shaped frame side 12c extending along the vertical direction on the left side of the frame 11 and a strip-shaped frame side 12d extending along the vertical direction on the right side of the assembly 11 are connected to form a frame shape.

  Each of the first lead 20 and the second lead 21 is connected to the first lead 20 and the second lead 21 in the other unit mounting region 10 by a connection piece (not shown). The assembly 11 is connected to the frame 12 by a connection piece (not shown). Thereby, the plurality of unit mounting areas 10 and the frame body 12 are integrated as the lead frame 1 so that the unit mounting areas 10 are not separated.

  In the frame sides 12a and 12b of the frame body 12, a plurality of long holes 14 that are long in the vertical direction are formed at predetermined intervals in the horizontal direction. The long hole 14 indicates a dicing mark. In the cutting process described later, the lead frame 1 is cut into a strip shape along the vertical direction by using the long hole 14 as a mark or by inserting a dicing blade through the long hole 14. When the lead frame 1 cut into a strip shape is further cut along the horizontal direction, the unit mounting regions 10 are separated into pieces. In addition, although the example cut | disconnected along the vertical direction previously was demonstrated, you may cut | disconnect previously along a horizontal direction. The lead frame 1 is fixed in a mold having a cavity in a mold clamping process described later. At this time, for example, the edge of the cavity of the mold is disposed so as to cross the long hole 14 in the lateral direction as indicated by a one-dot chain line 15.

  A lead frame 1 shown in FIG. 1 is a so-called MAP (Mold Array Package) type lead frame. When the MAP type lead frame is integrally formed with the resin, a mold in which a single (continuous) cavity for accommodating the entire assembly 11 is formed is used. Thereby, for example, the entire region indicated by the alternate long and short dash line 15 in FIG. 1 is accommodated in the single cavity of the mold. In this state, resin is supplied into the cavity from one end of the cavity of the mold, and the cavity is filled with resin. In this way, the MAP type light-emitting element mounting resin molded body 5 is formed. In the MAP type resin molded body 5 for mounting a light emitting element, the entire assembly 11 is covered with resin. Then, the resin and the lead frame 1 are cut into a single piece to obtain a surface-mounted light emitting device 6.

  2 and 3 are conceptual explanatory views for explaining the flow of resin when the MAP type lead frame 1 is resin-molded. Arrows indicate resin flow. In FIG. 2, the flow of the resin will be described by taking as an example the case where the unit mounting regions 10 in which the first leads 20 and the second leads 21 are arranged in the horizontal direction are arranged in a matrix of 3 rows and 3 columns. In the MAP type lead frame 1, the entire assembly 11, that is, a plurality of unit mounting regions 10 are accommodated in a single cavity of a mold. Therefore, when resin is injected into the cavity from one end of the cavity, the resin flows beyond the boundary of each unit mounting area 10 and the resin wraps around all the unit mounting areas 10.

  Therefore, in the case of the MAP type, for example, as shown in FIG. 2, when the resin is injected into the cavity from the lower side of the figure and the resin is injected so as to flow along the vertical direction, , The gaps between the unit mounting regions 10 and the slits 22 between the first leads 20 and the second leads 21, so that there are a total of seven paths through which the resin flows.

  On the other hand, if the unit mounting regions 10 in which the first leads 20 and the second leads 21 are arranged in the horizontal direction are arranged in a matrix of 3 rows and 3 columns as shown in FIG. When injected so as to flow along the direction, it flows through the gaps between both sides of the assembly 11 and the unit mounting regions 10, so there are a total of four paths through which the resin flows.

  That is, in the lead frame 1 in which the unit mounting regions 10 in which the first leads 20 and the second leads 21 are arranged in the horizontal direction are arranged in a matrix, as shown in FIG. By injecting the resin in this manner, the resin can be smoothly injected into the mold cavity. Thus, it is suitable for the lead frame 1 to inject the resin in the longitudinal direction into the mold cavity when forming the resin.

  As described above, when resin molding is performed using the lead frame 1 in which the unit mounting regions 10 in which the first leads 20 and the second leads 21 are arranged in the horizontal direction are arranged in a matrix, the resin formed body is cut. As a result of diligent research conducted by the present inventors on the cause of cracks in the resin when singulated, the following findings were obtained. FIG. 4 is a conceptual explanatory diagram for explaining the cause of the decrease in resin strength.

  When the resin is supplied to the MAP type lead frame 1 in the longitudinal direction, which is a preferred resin supply direction, the resin flows through the gap between the first lead 20 and the second lead 21. Then, the resin that has reached between the two unit mounting regions 10 arranged in the vertical direction extends along the side extending from both sides of the first lead 20 and the second lead 21 in the horizontal direction. Go around between. Hereinafter, a side (side surface) extending along the horizontal direction is referred to as a horizontal side, and a side (side surface) extending along the vertical direction is referred to as a vertical side. Then, in the wrapping region X indicated by a broken line in FIG. 4, both resins that wrap around from both sides of the first lead 20 or the second lead 21 and flow along the horizontal side meet and collide with each other.

  In the wrap-around region X, the resin that has flowed along the flow path extending in the vertical direction needs to change the direction in the horizontal direction, so that the resin does not flow easily. Furthermore, in the entrainment region X, when the resin that has flowed from both sides of the lead along the lateral direction in a state where it is difficult to flow, the air between the resins needs to be pushed out.

  In the MAP type lead frame 1, in the wrapping region X in which the resin collides from both sides along the lateral direction in which the resin does not flow easily, the connecting piece C extends from the lateral side of the lead. When it is extended, the flow of the resin along the lateral side of the lead is hindered by the connecting piece C, the adhesion between the lateral side of the lead and the resin is reduced, or the strength of the resin after curing is reduced. I found out. The present inventors have found that resin cracks may occur due to the decrease in the adhesion of the resin and the decrease in strength.

  On the other hand, as a lead frame type, a trim type is known in addition to a MAP type. In the trim type lead frame, each unit mounting area is individually resin-molded independently of other unit mounting areas.

  FIG. 49 is an explanatory diagram for explaining the trim type lead frame 101. The trim type lead frame 101 is formed by surrounding a plurality of unit mounting regions 102 arranged in a matrix with a rectangular frame 103. Further, a reinforcing rod 105 is formed so as to be spanned between two opposite sides of the frame body 103. The trim type lead frame 101 is not resin-molded as a whole of the assembly 11 unlike the MAP type lead frame 1, but each unit mounting region 102 is individually resin-molded independently of the other unit mounting regions 102. Is done.

  Specifically, a plurality of cavities corresponding to the unit mounting regions 102 are formed in the trim type resin molding die. When resin molding is performed, the lead frame 101 is attached to the mold so that each unit mounting region 102 is accommodated in each cavity of the mold. In FIG. 49, each cavity 104 is indicated by a broken line when the lead frame 101 is attached to the mold.

  In the trim type lead frame 101, the reinforcing bar 105 is located outside the cavity 104. Accordingly, since the reinforcing rod 105 does not hinder the flow of the resin during resin molding, the reinforcing rod 105 is made thicker than the connection piece in order to increase the strength of the lead frame 101.

  As shown in FIG. 49, since the plurality of cavities 104 are individually formed in the trim type mold, the resin is injected into each cavity during resin molding. Therefore, when the trim type lead frame 101 is resin-molded, the resin that has reached between the two unit mounting regions 10 as in the case where the MAP type lead frame 1 is resin-molded (FIG. 4) There is no wraparound region X that wraps around between the two unit mounting regions 10.

  As described above, in the trim type lead frame 101, since the wraparound region X does not occur, the adhesiveness between the lateral side of the lead and the resin is lowered due to the resin that wraps around the wraparound region X due to the structure. And the strength of the cured resin does not decrease.

  In this way, the inventors of the present application have received a plurality of unit mounting regions 10 in a single cavity, as in the MAP type, due to a decrease in the strength of the resin layer and a crack in the resin caused by the entrainment region X. It has been found that it does not occur in a trim type lead frame that is generated by a resin molding method and in which unit mounting regions are accommodated in independent cavities and resin molded.

Hereinafter, specific embodiments of the present invention devised by the present inventors based on such knowledge will be described.
(First embodiment)

  5 to 14 are top views showing an example of the configuration of the lead frame 1 according to the first embodiment of the present invention in plan view. 5 to 14 show some (9) unit mounting regions 10 of the lead frame 1 shown in FIG. In each figure, the boundary of each unit mounting area 10 is indicated by a one-dot chain line. That is, the area surrounded by the alternate long and short dash line indicates each unit mounting area 10. Moreover, the dashed-dotted line has shown the cutting line cut | disconnected by the cutting process (step S5) shown in below-mentioned FIG. 20 to 27 and FIGS. 29 to 48 to be described later, the boundaries and cutting lines of the unit mounting regions 10 are indicated by alternate long and short dash lines.

  5 to 13 and FIGS. 20 to 27 and 29 to 48 to be described later, unit mounting adjacent to the left side of the unit mounting area 10a with reference to the central unit mounting area 10a among the unit mounting areas 10. The area is indicated by reference numeral 10b, the unit mounting area adjacent to the right side of the unit mounting area 10a is indicated by reference numeral 10c, the unit mounting area adjacent to the upper side of the unit mounting area 10a is indicated by reference numeral 10d, and the lower side of the unit mounting area 10a The unit mounting area adjacent to the unit mounting area 10a, the unit mounting area adjacent to the upper left of the unit mounting area 10a is indicated by reference numeral 10f, the unit mounting area adjacent to the upper right of the unit mounting area 10a is indicated by reference numeral 10g, A unit mounting area adjacent to the lower left of the unit mounting area 10a is denoted by reference numeral 10h, and a unit mounting area adjacent to the lower right of the unit mounting area 10a is denoted by reference numeral 10i. To have. In the following description, the unit mounting area 10a will be mainly described, but the other unit mounting areas 10 are configured in the same manner as the unit mounting area 10a. The connection area Ac is described in the unit mounting area 10a, and the description of the connection area Ac is omitted in the other unit mounting areas 10, but the connection area Ac is also connected to the other unit mounting areas 10 in the same manner as the unit mounting area 10a. Ac is arranged.

  The first lead 20 and the second lead 21 have a relatively thick portion and a relatively thin portion, and the boundary between them is indicated by a broken line. The same applies to the following drawings. Inner regions 20a and 21a surrounded by broken lines are portions having a relatively large thickness, and outer regions 20b and 21b extending outward from the broken line are portions having a relatively small thickness. The outer regions 20b and 21b are thinned by a processing means such as half etching. The outer regions 20b and 21b also include a connecting piece C described later.

  Since the outer regions 20b and 21b are thinner than the inner regions 20a and 21a, the resin can easily spread over the entire area of the aggregate 11, and the resin can be efficiently and uniformly supplied to the aggregate 11. Further, the bonding between the first lead 20, the second lead 21, and the connection piece C and the resin becomes stronger, and the resin is difficult to peel from the first lead 20, the second lead 21, and the connection piece C.

  The first lead 20 and the second lead 21 may not have the outer regions 20b and 21b (thin portions), and only one of the first lead 20 and the second lead 21 is the outer region 20b. 21b (thin portion).

  20 to 23 are explanatory diagrams for explaining the connection prohibition area Ax, the first area A1, the second area A2, and the third area A3 provided in each unit mounting area 10. FIG. 20 to 23, the connection prohibition area Ax, the first area A1, the second area A2, and the third area A3 of the unit mounting area 10a are illustrated on behalf of each unit mounting area 10. The horizontal side 23 of the first lead 20 and the second lead 21 in the unit mounting area 10a (each unit mounting area 10) is a connection prohibition area Ax to which no connection piece is connected. In addition, among the outer peripheral portions of the first lead 20 and the second lead 21 in each unit mounting area 10, the area excluding the connection prohibition area Ax is defined as a first area A1. Further, a region facing the unit mounting regions 10b and 10c adjacent in the horizontal direction in the first region A1 is defined as a second region A2. The third area A3 will be described later.

  In the example shown in FIG. 20, the example in which the vertical sides (side surfaces) of the first lead 20 and the second lead 21 are directly used as the second region A2 is shown. However, for example, as shown in FIG. In the region A2, the vertical outer edge 24 extending in the vertical direction, and the vertical outer edge 24 and the horizontal side are gradually moved away from the adjacent unit mounting regions 10b and 10c as approaching the horizontal side from the extension line 24a of the vertical outer edge 24. A connecting outer edge 25 may be included. And it is good also as a structure by which the connection area | region Ac mentioned later is provided in the connection outer edge 25. FIG.

  Specifically, the connection outer edge 25 can be configured as a linear side (side surface) having an angle of, for example, approximately 45 degrees with respect to the extension line 24a. Note that the vertical outer edge 24 and the connection outer edge 25 do not necessarily have to be linear, may include a curved line (curved surface), and may be uneven.

  For example, as shown in FIG. 22, the connection prohibition area Ax is an edge portion that is continuous with the lateral side 23 of each lead, and has a preset set length L that extends from the end of the lateral side 23 of each lead. An area may be further included. Then, the first area A1, which is an area excluding the connection prohibition area Ax, is arranged at a position that is a set length L or more away from the lateral ends (lead corners) of the first lead 20 and the second lead 21. May be. Since the first area A1 is arranged at a position that is a set length L or more away from the lateral ends of the first lead 20 and the second lead 21, the second area A2, the third area A3, and the connection The region Ac is arranged at a position separated from the end portions of the horizontal sides of the first lead 20 and the second lead 21 by a set length L or more.

  In FIGS. 20 to 22 and FIG. 23 described later, an example in which the connection prohibition area Ax is provided in both the first lead 20 and the second lead 21 is shown. A configuration may be adopted in which only one of the first lead 20 and the second lead 21 is provided.

  As shown in FIGS. 5 to 13, in the lead frame 1 according to the first embodiment, a connection region Ac is provided in the second region A2. And the connection piece C is extended from the connection area Ac of the unit mounting area 10a toward the connection area Ac of the adjacent unit mounting areas 10b to 10i. Hereinafter, the connection region is indicated by reference character Ac, and the connection piece is indicated by reference character C. For ease of explanation, numerals Ac and C may be attached with numerals to indicate individual connection regions and connection pieces.

  Specifically, for example, in the example shown in FIGS. 5 and 6, the connection region Ac1 is connected near the upper end of the side corresponding to the second region A2 in the first lead 20 of each unit mounting region 10 and is connected near the lower end. A region Ac2 is provided. In the second lead 21 of each unit mounting area 10, a connection area Ac3 is provided near the upper end of the side corresponding to the second area A2, and a connection area Ac4 is provided near the lower end.

  The connection areas Ac1 to Ac4 of the unit mounting area 10a are connected to the connection areas Ac1 to Ac4 of the adjacent unit mounting areas 10b to 10i by the four connection pieces C1. Specifically, a connection piece C1 that connects the connection area Ac1 of the unit mounting area 10a, the connection area Ac2 of the unit mounting area 10d, the connection area Ac3 of the unit mounting area 10b, and the connection area Ac4 of the unit mounting area 10f to each other A connection piece C1 that connects the connection area Ac2 of the unit mounting area 10a, the connection area Ac1 of the unit mounting area 10e, the connection area Ac4 of the unit mounting area 10b, and the connection area Ac3 of the unit mounting area 10h, and the unit mounting area Connection area Ac3 of unit 10a, connection area Ac4 of unit mounting area 10d, connection area Ac1 of unit mounting area 10c, and connection piece C1 for connecting connection area Ac2 of unit mounting area 10g, and connection area of unit mounting area 10a Ac4, connection area Ac3 of unit mounting area 10e, connection area Ac2 of unit mounting area 10c, and unit mounting area 1 A connection piece C1 for connecting i of the connection region Ac1 to each other, are extended from the connection area Ac of the unit mounting region 10.

  The shape of the connection piece C1 is not particularly limited, but the example shown in FIG. 5 shows an example in which the connection piece C1 has a substantially H-shaped shape. In the example shown in FIG. 6, the connection piece C1 has a substantially rectangular frame shape. An example having a shape is shown.

  For example, as shown in FIG. 7, instead of the connection piece C1, a connection piece C2 having a rod-like shape extending along the vertical direction may be used. In the example shown in FIG. 7, the connection piece C2 that connects the connection region Ac1 of the unit mounting region 10a and the connection region Ac2 of the unit mounting region 10d, the connection region Ac2 of the unit mounting region 10a, and the connection region Ac1 of the unit mounting region 10e. The connection piece C2 connecting the connection area Ac3 of the unit mounting area 10a and the connection area Ac4 of the unit mounting area 10d, and the connection area Ac4 of the unit mounting area 10a and the connection of the unit mounting area 10e. A connection piece C2 that connects the region Ac3 extends from the connection region Ac of each unit mounting region 10.

  Further, in the example illustrated in FIG. 7, the connection region Ac <b> 5 is provided near the center of the side corresponding to the second region A <b> 2 in the first lead 20 of each unit mounting region 10. Further, a connection region Ac6 is provided in the second lead 21 of each unit mounting region 10 near the center of the side corresponding to the second region A2.

  The leads adjacent to each other in the horizontal direction are connected to each other by a connecting piece C3 having a bar-like shape extending in the horizontal direction. Specifically, the connection piece C3 that connects the connection area Ac5 of the unit mounting area 10a and the connection area Ac6 of the unit mounting area 10b, and the connection area Ac6 of the unit mounting area 10a and the connection area Ac5 of the unit mounting area 10c A connecting piece C3 to be connected is provided.

  Further, for example, as shown in FIG. 8, the connection regions Ac1 to Ac4 and the connection piece C2 are not provided in the example shown in FIG. 7, and the connection regions Ac5 and Ac6 of each unit mounting region 10 are diagonally adjacent to other examples. A connection piece C4 that connects the connection regions Ac6 and Ac5 of the unit mounting region 10 may be further provided. Although the shape of the connection piece C4 is not particularly limited, FIG. 8 shows an example in which the connection piece C4 has a substantially bar shape extending in an oblique direction.

  For example, as shown in FIG. 9, the connection regions Ac1 to Ac4 and the connection pieces C2 and C3 are not provided in the example shown in FIG. 7, and the connection regions Ac5 and Ac6 of each unit mounting region 10 are connected to each other. It is good also as a structure which provides piece C5. Although the shape of the connection piece C5 is not particularly limited, FIG. 9 shows an example in which the connection piece C5 has a substantially X-shape.

  Further, for example, as shown in FIG. 10, the connection regions Ac1 to Ac4 and the connection piece C2 are not provided in the example shown in FIG. 7, but a plurality of, for example, two connection pieces C3 are set as one set, and the connection piece for each set. It is good also as a structure which C3 extends along the horizontal direction at intervals and in parallel.

  In the example shown in FIG. 11, a connection piece C5 having an approximately X shape is used to connect between the unit mounting area 10a and another unit mounting area 10 adjacent to the unit mounting area 10a, similarly to the connecting piece C1 shown in FIG. Thus, the connection areas Ac1 to Ac4 are connected to each other. Further, as shown in FIG. 11, a plurality of connection regions Ac5 may be provided on the side corresponding to the second region A2 of the first lead 20 of each unit mounting region 10, and the second of each unit mounting region 10 may be provided. A plurality of connection regions Ac6 may be provided on the side of the lead 21 corresponding to the second region A2. And each connection area | region Ac5 and each connection area | region Ac6 may be connected with the connection piece C3, respectively.

  Further, as shown in FIG. 12, the connection areas Ac2 and Ac3 in FIG. 11 are not provided, and instead of the connection piece C5, the connection area Ac1 of the unit mounting area 10a and the unit mounting are formed by a rod-like connection piece C4 extending in an oblique direction. The connection area Ac4 in the area 10f and the connection area Ac4 in the unit mounting area 10a and the connection area Ac1 in the unit mounting area 10i may be connected.

  Further, for example, as shown in FIG. 13, a connection for connecting the connection areas Ac of the unit mounting areas 10 to each other in an area between each unit mounting area 10 and another unit mounting area 10 adjacent in the horizontal direction. A piece C6 may be provided. The connection piece C6 shown in FIG. 13 extends in a band shape along the vertical direction, and extends in a branch shape along the lateral direction from the trunk C6a, and the trunk C6a spanned between the frame side 12a and the frame side 12b. And a branch portion C6b connected to the connection region Ac of each unit mounting region 10.

  As described above, the lead frame 1 is cut along a cutting line indicated by a one-dot chain line in a cutting step (step S5) described later. When the dicing saw is used in the cutting process, the cutting region extending in a strip shape along the cutting line with a width h substantially corresponding to the thickness of the dicing saw is scraped off and removed. The width h is about 0.2 mm, for example.

  In FIG. 13, a cutting region extending along the vertical direction is indicated by a symbol Arv, and a cutting region extending along the horizontal direction is indicated by a symbol Arh. That is, the cutting regions Arv and Arh are regions that are scheduled to be removed in the cutting process. A side edge of the cutting area Arv on the unit mounting area 10a side is indicated by a symbol Lv1, and a side edge far from the unit mounting area 10a is indicated by a reference Lv2. Further, the side edge of the cutting area Arh on the unit mounting area 10a side is indicated by a symbol Lh1, and the side edge far from the unit mounting area 10a is indicated by a reference numeral Lh2. The side edges Lv1, Lv2, Lh1, and Lh2 correspond to positions that become the cut surfaces of the individual pieces when the unit mounting regions 10 are separated into pieces in a cutting step (step S5) described later.

  5 to 12 and FIGS. 14, 20 to 24, 27, and 29 to 48 described later, the cutting regions Arv and Arh are not shown. Similarly, cutting regions Arv and Arh are set along a cutting line indicated by a one-dot chain line.

  In the lead frame 1 shown in FIG. 13, a trunk C6a is formed in the cutting area Arv. Thereby, when each unit mounting region 10 is separated into pieces in the cutting step (step S5), the trunk C6a is removed so that the trunk C6a does not remain in the surface-mounted light-emitting device 6 finally formed. Has been.

  Since the connection piece C6 provided with the trunk C6a connects the frame side 12a and the frame side 12b in a columnar shape, the strength of the frame 12 can be increased. Therefore, according to the connection piece C6, the strength of the lead frame 1 can be increased. However, since the trunk C6a is a large metal piece, if the trunk C6a remains in the resin package of the surface-mounted light-emitting device 6 that has been separated after the resin molding, the resin of the package and the trunk C6a remaining in the package Due to the difference in thermal shrinkage, there is a risk that the aging of the package due to the thermal cycle may increase.

  Therefore, in the lead frame 1 shown in FIG. 13, a trunk C6a is formed in the cutting region Arv. As a result, the trunk C6a does not remain in the resin package of the surface-mounted light emitting device 6 that has been singulated after resin molding, thereby reducing the aging of the package due to thermal cycling.

  In the lead frame 1 shown in FIGS. 8 to 13, as shown in FIG. 22, the connection prohibition region Ax is an edge portion that is continuous with the lateral side 23 of each lead and extends from the end of the lateral side 23 of each lead. An example including a region having a preset length L is shown. According to the lead frame 1 shown in FIGS. 8 to 13, the connection piece C is not connected to a region having a preset set length L extending from the end of the lateral side 23 of each lead. Therefore, the connection piece C is connected to the outer edge of each lead at a position separated from the winding region X by a set length L or more.

  In the lead frame 1 shown in FIGS. 5 to 13, an example is shown in which the horizontal sides of the first lead 20 and the second lead 21 in each unit mounting area 10 are both the connection prohibited area Ax. As shown in FIG. 14, only one horizontal side of the first lead 20 and the second lead 21 may be the connection prohibited area Ax.

  In the example shown in FIG. 14, only the lateral side of the second lead 21 is the connection prohibited area Ax, and the lateral side of the first lead 20 is the first area A1. In the unit mounting region 10a, a connection region Ac7 is provided on the upper side of the first lead 20 in the drawing, and a connection region Ac8 is provided on the lower side of the first lead 20 in the drawing. A strip-shaped connection piece C7 is installed between the connection area Ac7 in the unit mounting area 10a and the connection area Ac8 in the unit mounting area 10d, and between the connection area Ac8 in the unit mounting area 10a and the connection area Ac7 in the unit mounting area 10e. A strip-shaped connection piece C7 is installed on the top.

  Next, a manufacturing method for manufacturing a resin molded body for mounting a light-emitting element and a surface-mounted light-emitting device using the lead frame 1 configured as described above will be described. FIG. 15 is a flowchart for explaining a method for manufacturing a surface-mounted light-emitting device according to an embodiment of the present invention. 16-19 is explanatory drawing for demonstrating the manufacturing method of the surface mount type light-emitting device shown in FIG. As such a production method, various resin molding methods can be used. For example, a transfer molding method can be preferably used.

  First, a mold clamping process is performed in which the lead frame 1 is fixed in a predetermined mold in which a cavity corresponding to the shape of the resin molded body for mounting a light emitting element to be produced is formed (step S1). The mold is composed of, for example, two mold blocks, and the assembly 11 shown in FIG. 1 is accommodated and fixed in the cavity of the mold by sandwiching the lead frame 1 between the two mold blocks. It has become so. The mold corresponds to the MAP method, and the entire assembly 11 can be accommodated in a single cavity.

  Next, a resin molded body forming step is performed in which resin is supplied from one longitudinal end side of the lead frame 1 into the mold cavity and a resin molded body for mounting light emitting elements is formed by the MAP method (step S2). . Various resins can be used for the resin molding, and for example, a thermosetting resin can be preferably used. When a thermosetting resin is used, the resin can be reliably cured by heating the resin filled in the mold cavity.

  In the resin molded body forming step, the mold shape in the cavity is set such that at least a part of the surface of the first lead 20 and the second lead 21 (for example, the inner regions 20a and 21a) in each unit mounting region 10 is exposed. Is set. As a result, a resin layer is formed integrally with the lead frame 1, and a light emitting element can be mounted on the exposed surface portions of the first lead 20 and the second lead 21.

  When the resin is supplied into the mold cavity in the resin molded body forming step, as shown in FIG. 4, the resin flows between the first leads 20 and the second leads 21 along the vertical direction. In addition, although illustration is abbreviate | omitted, resin flows also into the clearance gap (For example, the upper surface of the 1st lead 20 and the 2nd lead 21) between the 1st lead 20 and the 2nd lead 21, and a metal mold | die.

  Then, as described above, the resin that has reached between the two unit mounting regions 10 arranged in the vertical direction extends from both sides of the first lead 20 and the second lead 21 along the horizontal side thereof. Go around between. Then, in the wrapping region X shown in FIG. 4, both resins that wrap around from both sides of the lead and flow along the horizontal side meet and collide.

  Conventionally, also in the wrapping region X, connection pieces are extended from the lateral sides of the leads toward other leads. For this reason, as described above, a decrease in the adhesion between the lateral sides of the leads and the resin and a decrease in the strength of the resin may occur, which may cause cracks in the cured resin.

  On the other hand, according to the lead frame 1 described in FIG. 5 to FIG. 13, the lateral side of the lead facing the wrap-around area X is the connection prohibition area Ax. Therefore, there is no connection piece extending from the lateral side of the lead in the wraparound region X. As a result, it is possible to reduce the risk of cracking in the resin after curing, for example, in the step of cutting the resin molded body.

  As described above, in the trim type lead frame 101, the wraparound region X does not occur. Therefore, the effect of providing the connection prohibition area Ax cannot be expected. With the configuration in which the lead frame 1 is a MAP type, an effect of reducing the possibility of cracks occurring in the resin portion is obtained.

  In addition, when the connection piece C is extended from the connection outer edge 25 shown in FIG. 21, the present inventors, for example, resin molding after hardening rather than the case where the connection piece C is extended from the connection prohibition area | region Ax. It has been found that the occurrence of cracks in the resin is reduced in the step of cutting the body. While the vertical side and the horizontal side of each lead intersect at a substantially right angle, the vertical outer edge 24 and the connecting outer edge 25 are connected smoothly (for example, at an obtuse angle), so that the resin flowing along the vertical outer edge 24 is smooth as it is. Flows along the connecting outer edge 25. As a result, even when the connection piece C is extended from the connection outer edge 25, it is possible to reduce a decrease in adhesion between the connection outer edge 25 and the resin and a decrease in resin strength due to the connection piece C. Is done.

  Further, since the connection outer edge 25 and the lateral side 23 are connected smoothly (for example, at an obtuse angle), the resin flowing along the connection outer edge 25 smoothly flows along the lateral side 23 as it is and flows into the wrapping region X. . Thereby, the connection outer edge 25 is not provided, and the resin is supplied to the wrapping region X more smoothly than when the vertical outer edge 24 and the horizontal side 23 intersect at a right angle. As a result, in the wrapping region X, the possibility of a decrease in the adhesion between the side of the lead and the resin and a decrease in the strength of the resin are reduced.

  Further, according to the lead frame 1 described in FIGS. 5 to 13, the third region, which is the region where the first lead 20 and the second lead 21 face each other in the first region A1 in the unit mounting region 10 a. A connection piece C is not connected to A3 (see FIG. 20). The region sandwiched between the first lead 20 and the second lead 21 in the unit mounting region 10a is a portion that remains in the resin package of the surface-mounted light emitting device 6 that is finally formed.

  According to the lead frame 1 shown in FIGS. 5 to 13, since the connection piece C is not connected to the third region A <b> 3, it is sandwiched between the first lead 20 and the second lead 21 in the first region A <b> 1. There is no connection piece C extending from the side (side surface) of the lead facing the region (slit 22). Accordingly, the slit 22 is filled with the resin smoothly. As a result, when forming a resin package of the surface mount light emitting device 6 by a resin molding method such as a transfer mold molding method, the possibility of occurrence of molding defects such as uneven filling or unfilling of the resin is reduced.

  Further, as in the case of the lead frame 1 shown in FIGS. 8 to 13, when a lead frame is used in which the connection piece C is connected to the outer edge of each lead at a position separated from the wrapping region X by a set length L or more. The influence of the connecting piece C in the vicinity of the wrapping region X on the resin flow in the wrapping region X is reduced. As a result, the risk of cracks occurring in the cured resin can be reduced. The set length L is obtained, for example, by experimentally obtaining a length having a high resin crack suppression effect. As the set length L, for example, about 0.5 mm can be suitably used.

  In the lead frame 1 illustrated in FIG. 14, a connection piece C <b> 7 extending from the lateral side of the first lead 20 is provided. However, even in the lead frame 1 illustrated in FIG. 14, there is no connection piece extending from the lateral side of the second lead 21. As a result, it is possible to reduce the possibility of cracking in the cured resin as compared to the case where connection pieces extending from the lateral sides of both the first lead 20 and the second lead 21 are provided.

  In the resin molded body forming process, after the resin is filled into the mold cavity as described above, the resin is heated to cure the resin, and the lead frame 1 and the resin layer are integrally molded. A resin molded body for mounting is manufactured. As a result, a MAP type light-emitting element mounting resin molded body in which a resin layer is formed so as to collectively cover the entire plurality of unit mounting regions 10 (aggregate 11) is obtained.

  FIG. 16 is a top view schematically showing the appearance of the light-emitting element mounting resin molded body 5 which is an example of the light-emitting element mounting resin molded body formed in the resin molded body forming step.

  A resin molded body 5 for mounting a light emitting element shown in FIG. 16 is formed by integrally molding a resin layer 50 on a lead frame 1. On the surface of the lead frame 1, the front and back surfaces (upper and lower surfaces) of the inner regions 20a and 21a of the first lead 20 and the second lead 21 are exposed. The outer regions 20b and 21b in the first lead 20 and the second lead 21 are thinned by removing at least part of the front and back surfaces by half etching. Therefore, the resin layer 50 having the same thickness as the plate thickness of the inner regions 20a and 21 is integrally formed, leaving only the inner regions 20a and 21a. Thereby, the flat type resin molding 5 for light emitting element mounting is formed.

  FIG. 18 is an explanatory view schematically showing another example of the resin molded body 5 for mounting a light emitting element formed in the resin molded body forming step. FIG. 18A is a perspective view schematically showing the entire configuration of the resin molded body 5 for mounting a light emitting element. FIG. 18B is a plan view schematically showing the configuration of the main part of the resin molded body 5 for mounting a light emitting element. FIG. 18C is a perspective view schematically showing the configuration of the reflector 8 in which the light-emitting element mounting resin molding 5 is divided into pieces for each unit mounting region 10. FIG. 18D is a cross-sectional view of the reflector 8.

  A resin molded body 5 for mounting a light emitting element shown in FIG. 18 includes a lead frame 1, a resin layer 60 integrally formed on the surface of the lead frame 1, and inner regions 20a of the first and second lead portions on the bottom surface 62. It is a thin board provided with the recessed part 61 which 21a exposed. The resin layer 60 has a plurality of holes for forming the recesses 61, and is formed in the reflection part 63 that reflects light from the optical semiconductor element in a predetermined direction and the slit 22 between the first lead 20 and the second lead 21. And a filled insulating portion 64.

  On the back surface of the resin molded body 5 for mounting the light emitting element, the back surfaces of the inner regions 20 a and 21 a of the first lead 20 and the second lead 21 are exposed on the same plane as the back surface of the resin layer 60. The reflector 8 shown in FIGS. 18C and 18D includes one unit mounting region 10, a resin layer 60 formed on a part of the front surface (light emitting element mounting surface) and the back surface of the unit mounting region 10, The bottom surface 62 includes a recess 61 in which the inner regions 20a and 21a of the first lead 20 and the second lead 21 are exposed.

  Next, a mounting process for mounting the light emitting elements on the light emitting element mounting resin molded body 5 configured as described above is performed (step S3). As the light emitting element, various light emitting elements (chips) such as a light emitting diode (LED) can be used.

  Specifically, for example, the light emitting element is fixed on the first lead 20 of the resin molded body 5 for mounting the light emitting element shown in FIGS. 16 and 18, and one electrode of the light emitting element is formed by an electrical connection means such as wire bonding. Is connected to the inner region 20 a of the first lead 20, and the other electrode is connected to the inner region 21 a of the second lead 21. In the case of the resin molded body 5 for mounting a light emitting element shown in FIG. 18, the light emitting element is mounted on the resin molded body 5 for mounting a light emitting element while being accommodated in the recess 61.

  Next, a sealing step for sealing the light emitting element mounted on the light emitting element mounting resin molded body 5 with a translucent resin is performed (step S4). For example, in the case of the light-emitting element mounting resin molded body 5 shown in FIG. 16, a translucent resin layer is formed on the upper surface of the light-emitting element mounting resin molded body 5 so as to cover the entire assembly 11 on which the light-emitting elements are mounted. Thus, the light emitting element is sealed. For example, in the case of the resin molded body 5 for mounting a light emitting element shown in FIG. 18, the light emitting element is sealed by filling the concave portion 61 with a translucent resin.

  Next, the resin molded body 5 for mounting the light emitting element is arranged along the horizontal direction and the vertical direction so as to separate the unit mounting regions 10 in the lead frame 1 integrated with the resin molded body 5 for mounting the light emitting element. (Along the cutting line indicated by the alternate long and short dash line in FIGS. 5 to 14, 20 to 27, and 29 to 48), a cutting process for cutting is performed (step S <b> 5). By the cutting process, the surface-mounted light-emitting device 6 is singulated. Thereby, the surface mount type light emitting device 6 is obtained.

  In the cutting step, for example, dicing with a dicing saw is performed along the above-described cutting line, whereby the cutting regions Arh and Arv are removed. Accordingly, for example, when the resin molded body 5 for mounting a light emitting element using the lead frame 1 shown in FIG. 13 is cut in the cutting process, the trunk C6a does not remain in the finally formed surface mounted light emitting device 6. Can be. Thereby, as described above, the aging of the package due to the thermal cycle is reduced.

  Even if the lead frame 1 does not include the trunk portion C6a, a portion extending along the longitudinal direction of the connection piece C is disposed in the cutting region Arv, and a portion extending along the lateral direction of the connection piece C Is placed in the cutting region Arh, and cutting is performed so as to remove the cutting regions Arv and Arh in the cutting step (step S5), whereby the amount of metal remaining in the resin package can be reduced. As a result, aging of the package due to thermal cycling is reduced.

  By the way, in the cutting process (step S5), when the cutting areas Arv and Arh are cut with a cutting blade such as a dicing saw, the consumption of the dicing saw becomes more severe as the amount of metal contained in the cutting areas Arv and Arh increases. Accordingly, the portion extending along the vertical direction of the connecting piece C and the portion extending along the horizontal direction are arranged outside the cutting regions Arv and Arh, and in the cutting step (step S5), the vertical length of the connecting piece C is obtained with a dicing saw. By cutting (removing) avoiding the portion extending along the direction and the portion extending along the lateral direction, the consumption of the dicing saw can be reduced.

  In this way, depending on which one is prioritized by the aging of the package due to the thermal cycle and the consumption of the dicing saw, the arrangement of the portion extending along the vertical direction and the portion extending along the horizontal direction of the connection piece C is arranged. What is necessary is just to set suitably.

  Note that the cutting step is not necessarily limited to dicing with a dicing saw. As the cutting step, various cutting means such as die cutting with a press, cutting with laser light or water jet, scribing, etc. can be used.

  In the example shown in FIG. 15, the cutting process (step S5) is performed after the mounting process (step S3) and the sealing process (step S4). However, the mounting process is performed after the cutting process (step S5). It is good also as a structure by which a process (step S3) and a sealing process (step S4) are performed. Or it is good also as a structure performed in order of a mounting process (step S3), a cutting process (step S5), and a sealing process (step S4).

  FIG. 17 is a perspective view schematically showing an example of the configuration of the surface-mounted light-emitting device 6 obtained by dividing the light-emitting element mounting resin molded body 5 shown in FIG. 16 into pieces.

  The surface-mounted light-emitting device 6 shown in FIG. 17 includes a substrate 51 obtained by separating the resin molded body 5 for mounting a light-emitting element into individual unit mounting regions 10, and a first surface exposed on the surface of the substrate 51. The light emitting element 52 fixed to the inner area 20 a of the lead 20, the wire bonding 53 such as a gold wire for electrically connecting the inner area 20 a and the light emitting element 52, and the second exposed on the surface of the substrate 51. Wire bonding 54 that electrically connects the inner region 21a of the lead 21 and the light emitting element 52, and light transmission that seals the light emitting element 52 and the wire bondings 53 and 54 and the inner regions 20a and 21a with a light transmitting resin. And a functional resin layer 55.

  FIG. 19 is a perspective view schematically showing a configuration of the surface-mounted light-emitting device 6 obtained by dividing the light-emitting element mounting resin molded body 5 shown in FIG. 18 into pieces.

A surface-mounted light-emitting device 6 shown in FIG. 19 includes a single unit mounting region 10 obtained by dividing a light-emitting element mounting resin molding 5 (lead frame 1) into pieces, and the surface of the unit mounting region 10 ( A resin layer 60 formed on a part of the back surface of the light emitting element mounting surface), a recess 61 in which the inner regions 20a and 21a are exposed on the bottom surface 62, a light emitting element 52 fixed to the inner region 20a, and an inner region 20a. Wire bonding 53 that electrically connects the light emitting element 52 and wire bonding 54 that electrically connects the inner region 21 a and the light emitting element 52.
(Second Embodiment)

  Next, a lead frame 1 according to a second embodiment of the present invention will be described. In the second embodiment, the connection region Ac is arranged in the third region A3 shown in FIGS. The third area A3 is an area where the first lead 20 and the second lead 21 face each other in the first area A1, that is, an edge portion of each lead constituting the side wall of the slit 22.

  In the example illustrated in FIGS. 20 to 22, the vertical side (side surface) extending in the vertical direction of the first lead 20 and the second lead 21 is illustrated as the third region A <b> 3 as it is. As shown in FIG. 3, the third region A3 includes a vertical outer edge 26 extending in the vertical direction and a connecting outer edge 27 (27a, 27b) connecting the vertical outer edge 26 and the horizontal side while gradually moving away from adjacent leads as approaching the horizontal side. , 27c, 27d) may be included. The connection region Ac may be provided on the connection outer edge 27.

  Specifically, the connection outer edge 27 can be configured as a straight side (side surface) having an angle of, for example, about 45 degrees with respect to the extension line 26a. Note that the vertical outer edge 26 and the connection outer edge 27 do not necessarily have to be linear, and may include a curved line (curved surface) or may have irregularities.

  When the connection area Ac is arranged on the connection outer edge 27 and the connection piece C is extended from the connection outer edge 27, the connection outer edge is caused by the connection piece C as in the case where the connection piece C is extended from the connection outer edge 25 described above. The decrease in the adhesion between the resin 25 and the resin and the decrease in the strength of the resin are reduced. Further, as a result of the resin being smoothly supplied to the wrapping region X, the possibility that a decrease in the adhesion between the lateral sides of the leads and the resin and a decrease in the strength of the resin in the wrapping region X are reduced.

  In the example shown in FIG. 23, a connection outer edge 27a is formed above the third region A3 of the first lead 20 in the drawing, a connection outer edge 27b is formed below the third region A3 of the first lead 20 in the drawing, A connection outer edge 27c is formed above the third region A3 of the two leads 21 in the drawing, and a connection outer edge 27d is formed below the third region A3 of the second lead 21 in the drawing.

  24 to 27 are top views showing an example of the configuration of the lead frame 1 according to the second embodiment of the present invention in plan view. 24 to 27 show a part of the unit mounting area 10 in the lead frame 1 shown in FIG. 1, as in FIG. The first lead 20 and the second lead 21 shown in FIG. 24 to FIG. 27 show an example in which the connection region Ac is provided on the connection outer edge 27 of the third region A3, but in the third region A3 other than the connection outer edge 27 For example, the connection region Ac may be provided on the vertical side in the third region A3 of the first lead 20 and the second lead 21.

  Further, in the lead frame 1 shown in FIGS. 24 to 26, the connection prohibition area Ax is an edge portion that is continuous with the lateral side 23 of each lead and has a set length L that extends from the end of the lateral side 23 of each lead. An example further including a region is shown. According to the lead frame 1 shown in FIGS. 24 to 26, the connection piece C is not connected to a region having a preset set length L extending from the end of the lateral side 23 of each lead. Therefore, the connection piece C is connected to the outer edge of each lead at a position separated from the winding region X by a set length L or more.

  According to the lead frame 1 shown in FIGS. 24 to 26, since the connection piece C is connected to the outer edge of each lead at a position separated from the wrapping region X by a set length L or more, the above-described FIGS. Like the lead frame 1 shown, the risk of cracks occurring in the cured resin can be reduced.

  In the example shown in FIG. 24, the connection piece C21 extending from the connection outer edge 27a of the first lead 20 in the unit mounting area 10a and connected to the connection outer edge 27b of the first lead 20 in the unit mounting area 10d, and the unit mounting area 10a A connection piece C22 extending from the connection outer edge 27c of the second lead 21 and connected to the connection outer edge 27d of the second lead 21 in the unit mounting area 10d, and extending from the connection outer edge 27b of the first lead 20 in the unit mounting area 10a A connection piece C21 connected to the connection outer edge 27a of the first lead 20 in the mounting area 10e and a connection outer edge 27c of the second lead 21 in the unit mounting area 10e extending from the connection outer edge 27d of the second lead 21 in the unit mounting area 10a. And a connection piece C22 connected to the.

  In the example shown in FIG. 25, the connection outer edges 27a and 27c in the unit mounting area 10a and the connection outer edges 27b and 27d in the unit mounting area 10d are connected by the connection piece C23 having a substantially H-shape. The connection piece C23 has a shape in which a connecting portion B extending in the horizontal direction is provided between a substantially central portion of the connection piece C21 and a substantially central portion of the connection piece C22 shown in FIG. The connecting part B constitutes a fourth region A4 that connects the first lead 20 and the second lead 21 of the unit mounting region 10a.

  The shape of the connection piece C23 is not limited. For example, as shown in FIG. 26, the connection piece C23 may have an X-shape. In the connection piece C25 shown in FIG. 26, the intersecting region of the two arms intersecting in an X shape is a fourth region A4 that connects the first lead 20 and the second lead 21 of the unit mounting region 10a. Become.

  By using the lead frame 1 shown in FIGS. 24 to 26 and executing the method for manufacturing the surface-mounted light-emitting device shown in FIG. 15, the surface-mounted light-emitting device 6 is obtained. According to the lead frame 1 shown in FIGS. 24 to 26, the side of the lead facing the wrap-around area X is set as the connection prohibition area Ax, as in the lead frame 1 shown in FIGS. 5 to 13. Therefore, there is no connection piece extending from the lateral side of the lead in the wraparound region X. As a result, the risk of cracks occurring in the cured resin can be reduced.

  FIG. 27 is an explanatory diagram illustrating an example of the lead frame 1 in which the connection prohibition area Ax is provided only in one of the first lead 20 and the second lead 21. In the lead frame 1 shown in FIG. 27, a connection prohibition area Ax is provided in the first lead 20. In the lead frame 1 shown in FIG. 27, a connection piece C24 extending from the lateral side of the second lead 21 is provided. However, even in the lead frame 1 illustrated in FIG. 27, there is no connection piece extending from the lateral side of the first lead 20. As a result, as with the lead frame 1 shown in FIG. 14, there is a risk that cracks may occur in the cured resin as compared to the case where connection pieces extending from the lateral sides of both the first lead 20 and the second lead 21 are provided. Can be reduced.

  By the way, the slit 22 between the first lead 20 and the second lead 21 is filled with resin to form the insulating portion 64 of the surface-mounted light-emitting device 6 that is singulated (FIG. 17, FIG. 19). However, a metal member such as the first lead 20 and the second lead 21 does not exist in a region where the insulating portion 64 is extended in the thickness direction in the surface mount light emitting device 6. Therefore, a strip-shaped resin region in which only resin is present is formed so as to cross the surface-mounted light-emitting device 6 in the vertical direction. In the region where the lead exists, the lead functions as an aggregate, and the mechanical strength increases. However, the strength of the surface-mounted light-emitting device 6 is lower in the resin region where no lead is present than in the region where the lead is present.

  Accordingly, a belt-like, low-strength resin region sandwiched between high-strength regions is formed so as to cross the surface-mounted light-emitting device 6 (the light-emitting element mounting resin molded body 5). As a result, when mechanical stress is applied to the housing, the stress is concentrated on the belt-shaped resin region, and along this resin region, that is, the slit 22 (insulating portion 64), the surface mount type light emitting device 6 (light emitting element mounting). The resin molding 5) is easily broken.

  On the other hand, according to the lead frame 1 shown in FIGS. 24 to 27, when the lead frame 1 is cut along the horizontal direction in the cutting process of step S <b> 5, a part of the connection piece C is insulated from the lead. It remains in the package of the surface mount light emitting device 6 in a state of protruding from the side of the third region A3 facing the portion 64 (slit 22).

  FIG. 28 is an explanatory diagram showing an example of the lead frame 1, the resin layer 60, and the insulating portion 64 in the package of the surface mount light emitting device 6 formed by dividing the lead frame 1 into pieces. FIG. 28A shows the lead frame 1, the resin layer 60, and the insulating portion 64 in the package of the surface mount light emitting device 6 formed by dividing the lead frame 1 shown in FIG. 26, for example. . As shown in FIG. 28, when the connection piece C is cut in the cutting process and the cutting regions Arh and Arv are removed, a protruding piece P protruding from the side of the third region A3 of the lead is formed. The protruding piece P extends from one lead of the first lead 20 and the second lead 21 to the other lead within the insulating portion 64 (slit 22) or a region where the insulating portion 64 (slit 22) extends in the vertical direction. It extends so that it may stab in the resin layer so that it may approach. This increases the mechanical strength of the resin layer around the insulating portion 64 (slit 22). As a result, the possibility that the light emitting element mounting resin molded body 5 and the surface mounted light emitting device 6 are broken along the insulating portion 64 (slit 22) is reduced.

  As shown in FIG. 28B, the protruding piece P is shaped so as to extend from one lead to the side closer to the other lead beyond the central position 22a of the insulating portion 64 (slit 22). For example, the mechanical strength of the resin layer around the insulating portion 64 (slit 22) further increases. As a result, the possibility that the light emitting element mounting resin molded body 5 and the surface mounted light emitting device 6 are broken along the insulating portion 64 (slit 22) is further reduced. Therefore, it is preferable that the connecting piece C has a shape in which the protruding piece P having such a shape is formed.

  As described above, in the mounting process of step S3, since one electrode of the light emitting element is connected to the first lead 20 and the other electrode is connected to the second lead 21, a current is passed through the light emitting element. In order to emit light, the first lead 20 and the second lead 21 need to be insulated.

  However, in the lead frame 1 shown in FIGS. 25 and 26, the fourth region A4 is formed in the cutting region Arh. On the other hand, in the cutting step of step S5, the cutting region Arh is removed. Accordingly, the fourth region A4 is removed in the cutting step of step S5, and the first lead 20 and the second lead 21 are electrically insulated.

For example, when the connection piece connection pieces C23 and C25 shown in FIGS. 25 and 26 are not connected to at least one of the adjacent connection areas Ac22 and Ac24 with respect to the unit mounting area 10a, the fourth area A4 is used. May not necessarily be formed in the cutting region Arh. In such a case, the fourth area A4 only needs to be disposed at a position farther from the lead of the unit mounting area 10a than the side edge Lh1.
(Third embodiment)

  Next, a lead frame 1 according to a third embodiment of the present invention will be described. In 3rd Embodiment, connection area | region Ac is arrange | positioned in both 2nd area | region A2 and 3rd area | region A3 which are shown in FIGS.

  29 to 48 are top views showing an example of the configuration of the lead frame 1 according to the third embodiment of the present invention in plan view. 29 to 48 show a part of the unit mounting area 10 of the lead frame 1 shown in FIG. 1, as in FIG.

  In the lead frame 1 shown in FIG. 29, connection pieces C31 and C32 extending from the second region A2 are further provided with respect to the lead frame 1 shown in FIG. In the lead frame 1 shown in FIG. 30, the connection piece C22 is deleted from the lead frame 1 shown in FIG. 29, and further along the vertical direction between the connection piece C31 in the unit mounting area 10a and the connection piece C32 in the unit mounting area 10d. A connecting piece C33 extending is extended. Thereby, the connection piece C34 which consists of the connection pieces C31, C32, C33 is formed.

  31 to 48 show another example of the lead frame 1. The lead frame 1 can be variously modified as shown in FIGS.

  By using the lead frame 1 shown in FIGS. 29 to 48 and performing the method for manufacturing the surface-mounted light-emitting device shown in FIG. 15, the surface-mounted light-emitting device 6 is obtained. According to the lead frame 1 shown in FIG. 29 to FIG. 46, the side of the lead facing the wrap-around area X is connected to the connection prohibited area as in the lead frame 1 shown in FIG. 5 to FIG. 13 and FIG. Ax. Therefore, there is no connection piece extending from the lateral side of the lead in the wraparound region X. As a result, it is possible to reduce the risk of cracking in the resin after curing, for example, in the step of cutting the resin molded body.

  47 and 48 are explanatory diagrams illustrating an example of the lead frame 1 in which the connection prohibition area Ax is provided only in one of the first lead 20 and the second lead 21. FIG. In the lead frame 1 shown in FIG. 47, a connection prohibition area Ax is provided in the first lead 20. In the lead frame 1 shown in FIG. 47, a connecting piece C41 is further extended from the lateral side (first region A1) of the second lead 21 with respect to the lead frame 1 shown in FIG. In the lead frame 1 shown in FIG. 48, a part of the connection piece C extends from the lateral side (first region A1) of the second lead 21.

  However, even in the lead frame 1 shown in FIGS. 47 and 48, there is no connection piece extending from the lateral side of the first lead 20. As a result, similar to the lead frame 1 shown in FIGS. 14 and 27, after curing compared to the case where connection pieces extending from the lateral sides of both the first lead 20 and the second lead 21 are provided, for example, a resin molded body It is possible to reduce the risk of cracking in the resin in the step of cutting the resin.

  Further, according to the lead frame 1 shown in FIGS. 29 to 48, when the connection piece C is cut in the cutting step, as in the lead frame 1 shown in FIGS. 24 to 27, the side of the third region A3 of the lead is removed. A protruding protrusion P is formed. As a result, in the lead frame 1 shown in FIGS. 29 to 48, the mechanical strength of the resin layer around the insulating portion 64 (slit 22) increases as in the lead frame 1 shown in FIGS. As a result, the possibility that the light emitting element mounting resin molded body 5 and the surface mounted light emitting device 6 are broken along the insulating portion 64 (slit 22) is reduced.

  Furthermore, according to the lead frame 1 according to the third embodiment shown in FIG. 29 to FIG. 48, since the lead frame 1 according to the first and second embodiments has a wider area where the connection piece C can be connected to the lead. It is easy to increase the strength of the lead frame 1 by increasing the number of connection pieces C.

  The shape, size, thickness, and number of the connecting pieces C can be changed as appropriate. Similarly, the connection area Ac only needs to be arranged in the first area A1, and the arrangement, size (length), and number of the connection areas Ac can be changed as appropriate. Further, the configuration of each unit mounting area 10 included in the lead frame 1 is not necessarily the same. A plurality of types of unit mounting regions 10 having different shapes, sizes, thicknesses and numbers of connection pieces C, arrangements, sizes (lengths), and numbers of connection regions Ac are included in one lead frame 1. May be mixed.

  Further, for example, a frame may be formed in a lattice shape along a cutting line indicated by an alternate long and short dash line in each drawing, and a connection piece may be formed so as to connect the lattice frame and each lead. Further, when the lead frame 1 includes a trunk portion that is spanned between opposite sides of the frame body 12, for example, a trunk portion C <b> 6 a shown in FIG. 13, all such trunk portions are deleted by dicing. The configuration is preferable.

  Moreover, the lead frame 1 should just be comprised so that the several unit mounting area | region 10 may be accommodated in the single cavity of a metal mold | die, and is not necessarily MAP type. In addition, the resin molded body 5 for mounting the light emitting element is not necessarily limited to the MAP type as long as the entire assembly 11 is collectively resin-molded. In addition, the method for manufacturing the surface-mounted light-emitting device is not limited to an example in which a MAP resin molding method is employed as long as a resin molding method in which the entire assembly 11 is collectively resin-molded is used.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and can of course be implemented in various forms without departing from the gist of the present invention.

1 Lead frame (Lead frame for mounting light-emitting elements)
5 Light Emitting Element Mounting Resin Molded Body 6 Surface Mount Type Light Emitting Device 8 Reflectors 10, 10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, 10i Unit Mounting Area 11 Assembly 12 Frames 12a, 12b, 12c, 12d Frame side 14 Long hole 20 First lead 20a Inner region 20b Outer region 21 Second lead 21a Inner region 22 Slit 22a Center position 23 Horizontal side 24 Vertical outer edge 24a Extension line 25 Connection outer edge 26 Vertical outer edge 26a Extension lines 27, 27a, 27b, 27c, 27d Connection outer edge 50, 60 Resin layer 51 Substrate 52 Light emitting element 53, 54 Wire bonding 55 Translucent resin layer 61 Recessed portion 62 Bottom surface 63 Reflecting portion 64 Insulating portion A1 First region A2 Second region A3 Third region A4 Fourth region Ac, Ac1 to Ac8, Ac22, Ac24 Connection region Arh, Arv Cutting region Area Ax Connection prohibition area B Connection part C, C1 to C7, C21 to C25, C31, C32, C41 Connection piece C6a, C6b Branch part h Width Lv1, Lv2, Lh1, Lh2 Side edge P Projection piece X Retraction area

Claims (18)

A plurality of unit mounting areas including a first lead and a second lead, which are separated from each other in the same plane and arranged in the horizontal direction, the plurality of unit mounting areas being arranged in a matrix in the vertical and horizontal directions, and Each lead of each first lead and each second lead is disposed separately from each other, and the leads of each unit mounting area have a space between the leads of the unit mounting area adjacent to each unit mounting area. disposed Te, wherein a plurality of light-emitting element mounting lead frame including a connection piece for connecting the leads of the lead and the other of the unit mounting region of each unit mounting region in the same plane,
Wherein said lateral extending along the horizontal side of the first lead and the second lead in each unit mounting region is a connection prohibition region in which the connecting piece is not connected,
At least a part of the plurality of connection pieces is from a connection region provided in a first region excluding the connection prohibition region in the outer periphery of the first lead and the second lead in each unit mounting region. A light emitting element mounting lead frame extending toward the leads of the other unit mounting area. A plurality of unit mounting areas including a first lead and a second lead, which are separated from each other in the same plane and arranged in the horizontal direction, the plurality of unit mounting areas being arranged in a matrix in the vertical and horizontal directions, and Each lead of each first lead and each second lead is arranged separately from each other, and a plurality of connection pieces for connecting the leads of each unit mounting area and the leads of other unit mounting areas in the same plane A lead frame for mounting a light emitting device including:
A lateral side extending along the lateral direction of at least one of the first lead and the second lead in each unit mounting region is a connection prohibition region where the connection piece is not connected,
At least a part of the plurality of connection pieces is from a connection region provided in a first region excluding the connection prohibition region in the outer periphery of the first lead and the second lead in each unit mounting region. , Extending toward the lead of the other unit mounting area ,
The connection region is provided in a second region which is a region facing the unit mounting region adjacent in the lateral direction in the first region in each unit mounting region,
At least one of the first lead and the second lead in each unit mounting region is adjacent to the vertical outer edge extending along the vertical direction and the extension line of the vertical outer edge in the second region. A connection outer edge connecting the vertical outer edge and the horizontal side while being away from the mounting area;
The connection region is a light emitting element mounting lead frame provided on the connection outer edge . A plurality of unit mounting areas including a first lead and a second lead, which are separated from each other in the same plane and arranged in the horizontal direction, the plurality of unit mounting areas being arranged in a matrix in the vertical and horizontal directions, and Each lead of each first lead and each second lead is arranged separately from each other, and a plurality of connection pieces for connecting the leads of each unit mounting area and the leads of other unit mounting areas in the same plane A lead frame for mounting a light emitting device including:
A lateral side extending along the lateral direction of at least one of the first lead and the second lead in each unit mounting region is a connection prohibition region where the connection piece is not connected,
At least a part of the plurality of connection pieces is from a connection region provided in a first region excluding the connection prohibition region in the outer periphery of the first lead and the second lead in each unit mounting region. , Extending toward the lead of the other unit mounting area,
The connection region is a light emitting element mounting lead frame provided in a third region in which the first lead and the second lead are opposed to each other in the first region in each unit mounting region. At least one of the first lead and the second lead in each unit mounting region has a longitudinal outer edge extending in the longitudinal direction in the third region, and an extension line of the longitudinal outer edge from the opposing lead. Including a connection outer edge connecting the vertical outer edge and the horizontal side while being further away from each other,
The light emitting element mounting lead frame according to claim 3 , wherein the connection region is provided on the connection outer edge. A plurality of unit mounting areas including a first lead and a second lead, which are separated from each other in the same plane and arranged in the horizontal direction, the plurality of unit mounting areas being arranged in a matrix in the vertical and horizontal directions, and Each lead of each first lead and each second lead is arranged separately from each other, and a plurality of connection pieces for connecting the leads of each unit mounting area and the leads of other unit mounting areas in the same plane A lead frame for mounting a light emitting device including:
A lateral side extending along the lateral direction of at least one of the first lead and the second lead in each unit mounting region is a connection prohibition region where the connection piece is not connected,
At least a part of the plurality of connection pieces is from a connection region provided in a first region excluding the connection prohibition region in the outer periphery of the first lead and the second lead in each unit mounting region. , Extending toward the lead of the other unit mounting area ,
The connection area is
A second region which is a region facing the unit mounting region adjacent in the lateral direction in the first region in each unit mounting region;
A light emitting element mounting lead frame provided in a third region, which is a region where the first lead and the second lead are opposed, in the first region in each unit mounting region. At least one of the first lead and the second lead in each unit mounting region has a longitudinal outer edge extending in the longitudinal direction in at least one region of the second region and the third region. A connection outer edge connecting the vertical outer edge and the horizontal side while being farther from the extension line of the vertical outer edge from the other lead facing at least one of the leads,
The light emitting element mounting lead frame according to claim 5 , wherein the connection region is provided on the connection outer edge. A plurality of unit mounting areas including a first lead and a second lead, which are separated from each other in the same plane and arranged in the horizontal direction, the plurality of unit mounting areas being arranged in a matrix in the vertical and horizontal directions, and Each lead of each first lead and each second lead is arranged separately from each other, and a plurality of connection pieces for connecting the leads of each unit mounting area and the leads of other unit mounting areas in the same plane A lead frame for mounting a light emitting device including:
A lateral side extending along the lateral direction of at least one of the first lead and the second lead in each unit mounting region is a connection prohibition region where the connection piece is not connected,
At least a part of the plurality of connection pieces is from a connection region provided in a first region excluding the connection prohibition region in the outer periphery of the first lead and the second lead in each unit mounting region. , Extending toward the lead of the other unit mounting area ,
Each unit mounting area can be separated into pieces by being separated from the other unit mounting areas along the horizontal direction and the vertical direction intersecting the horizontal direction.
The at least some of the connection pieces further connect the first lead and the second lead of each unit mounting region, and connect the first lead and the second lead when separated. The fourth region, which is a partial region of the connection piece, is arranged on the side far from the connected first lead and second lead from the position where the cut surface is generated by the singulation. the light-emitting element mounting lead frame you are. The light emitting element mounting lead frame according to claim 7 , wherein the fourth region is disposed in a region corresponding to a strip-shaped cutting region extending along the lateral direction to be removed at the time of separation. The connection prohibition region, said a rim portion continuous to the lateral sides of the leads, further claim 1 including the area of a preset length extending from the lateral sides of the leads 2. A lead frame for mounting a light emitting element according to item 1. The lead frame for mounting a light emitting element according to claim 1 , wherein the plurality of unit mounting regions are a MAP type lead frame in which resin molding is integrally performed. The light emitting element mounting lead frame according to any one of claims 2 to 10, wherein the connection prohibition region is the horizontal side of the first lead and the second lead in each unit mounting region. The lead frame for mounting a light emitting element according to any one of claims 1 to 11 ,
A resin molded body for mounting a light emitting element, comprising: a resin layer integrally formed with the lead frame so that at least a part of the surface of each of the first and second leads is exposed. The resin molded body for mounting a light emitting element according to claim 12 , wherein the resin layer is formed so as to cover the entire plurality of unit mounting regions. A resin molded body for mounting a light emitting element according to claim 12 or 13 ,
A surface-mounted light-emitting device comprising at least a part of the surface of the first and second leads and a light-emitting element mounted so as to be energized. A mold clamping step of fixing the light emitting element mounting lead frame according to any one of claims 1 to 11 in a predetermined mold in which a cavity is formed,
By supplying resin into the cavity from one end side in the vertical direction intersecting the horizontal direction of the lead frame for mounting the light emitting element, at least a part of the first and second lead surfaces in each unit mounting region is formed. A resin molded body forming step of forming a resin molded body for mounting a light emitting element by forming a resin layer integrated with the lead frame so as to be exposed;
A mounting step of mounting a light emitting element in such a manner that the at least part of the exposed first and second lead surfaces can be energized;
The light emitting element mounting resin molded body is arranged in the horizontal direction and the vertical direction so as to separate the unit mounting regions in the light emitting element mounting lead frame integrated with the light emitting element mounting resin molded body. A cutting step of cutting along,
In the cutting step, the unit mounting regions are separated from each other by removing the band-shaped cutting region extending along the horizontal direction and the vertical direction from the resin molded body for mounting a light emitting element,
The method of manufacturing a surface-mounted light-emitting device, wherein the cutting region is set so as to include a region extending along the horizontal direction and a region extending along the vertical direction of each connection piece. A mold clamping step of fixing the light emitting element mounting lead frame according to any one of claims 1 to 11 in a predetermined mold in which a cavity is formed,
By supplying resin into the cavity from one end side in the vertical direction intersecting the horizontal direction of the lead frame for mounting the light emitting element, at least a part of the first and second lead surfaces in each unit mounting region is formed. A resin molded body forming step of forming a resin molded body for mounting a light emitting element by forming a resin layer integrated with the lead frame so as to be exposed;
A mounting step of mounting a light emitting element in such a manner that the at least part of the exposed first and second lead surfaces can be energized;
The light emitting element mounting resin molded body is arranged in the horizontal direction and the vertical direction so as to separate the unit mounting regions in the light emitting element mounting lead frame integrated with the light emitting element mounting resin molded body. A cutting step of cutting along,
In the cutting step, the unit mounting regions are separated from each other by removing the band-shaped cutting region extending along the horizontal direction and the vertical direction from the resin molded body for mounting a light emitting element,
The cutting region, the located outside of the cutting region a region extending along the front Kiyoko direction extending along the lateral direction of each connecting piece, the said longitudinal direction extends along the region of the connecting piece A method for manufacturing a surface-mounted light-emitting device that is set to be disposed outside the cutting region extending along the vertical direction . A mold clamping step of fixing the light emitting element mounting lead frame according to claim 7 in a predetermined mold in which a cavity is formed,
The resin is supplied into the cavity from one end side in the longitudinal direction of the lead frame for mounting the light emitting element, so that at least a part of the first and second lead surfaces in each unit mounting region is exposed. A resin molded body forming step of forming a resin molded body for mounting a light emitting element by forming a resin layer integrated with the lead frame;
A mounting step of mounting a light emitting element in such a manner that the at least part of the exposed first and second lead surfaces can be energized;
The light emitting element mounting resin molded body is arranged in the horizontal direction and the vertical direction so as to separate the unit mounting regions in the light emitting element mounting lead frame integrated with the light emitting element mounting resin molded body. A cutting step of cutting along,
In the cutting step, in the cutting along the lateral direction, the first lead and the second connected to each other than the fourth region in the lead frame for mounting the light emitting element integrated with the resin molded body for mounting the light emitting element. A method for manufacturing a surface-mounted light-emitting device that performs the cutting so that a cut surface is formed at a position close to a lead. A mold clamping step of fixing the light emitting element mounting lead frame according to claim 8 in a predetermined mold in which a cavity is formed,
The resin is supplied into the cavity from one end side in the longitudinal direction of the lead frame for mounting the light emitting element, so that at least a part of the first and second lead surfaces in each unit mounting region is exposed. A resin molded body forming step of forming a resin molded body for mounting a light emitting element by forming a resin layer integrated with the lead frame;
A mounting step of mounting a light emitting element in such a manner that the at least part of the exposed first and second lead surfaces can be energized;
The light emitting element mounting resin molded body is arranged in the horizontal direction and the vertical direction so as to separate the unit mounting regions in the light emitting element mounting lead frame integrated with the light emitting element mounting resin molded body. A cutting step of cutting along,
In the cutting step, the unit mounting regions are separated from each other by removing the band-shaped cutting region extending along the horizontal direction and the vertical direction from the resin molded body for mounting a light emitting element,
The method for manufacturing a surface-mounted light-emitting device, wherein the cutting region is set to include the fourth region.

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