JP2012084810A - Lead frame substrate for led element and light emitting element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame substrate for an LED element and a light emitting element which suppress variations in film thickness of plating films and non plated parts and achieve high reliability and optical output.SOLUTION: An lead frame substrate for an LED element comprises: an Lead frame 1 including an LED chip mounting part 2 having a pad 2a on which an LED chip 10 is mounted and an electric connection area part 3 having a lead 3a electrically connecting to the LED chip 10; a resin package 4 covering parts of the lead frame 1, which exclude plating areas of the LED chip mounting part 2 and the electric connection area part 3; and a reflector part 5 formed in the resin package 4 so as to enclose the plating areas and reflecting light emitted from the LED chip 10 to the exterior. Grooves 2b and 3b are formed at positions of upper surfaces of the LED chip mounting part 2 and the electric connection area part 3, which face an inner peripheral part 5a of the reflector part 5. A resin layer 6 is formed by filling each groove with a resin which is the same material as the resin package.

Description

  The present invention relates to a lead frame substrate for an LED element that carries and mounts an LED (Light Emitting Diode) element, and a light emitting element using the same.

  In general, the lead frame on which the LED element is mounted is made of an iron-nickel alloy thin plate, a lead frame metal plate made of copper-nickel-tin alloy thin plate, ferric chloride, etc. from one or both sides. This is manufactured by photoetching using an etchant. In addition, the lead frame includes an LED chip mounting portion having a pad (island portion) for mounting the LED chip, and an inner portion electrically spaced from the LED chip mounting portion and electrically connected to the LED chip mounting portion. An electrical connection area having a lead and an outer lead is provided (see Patent Documents 1 to 3).

  The lead frame pad has a mounting portion (mounting surface) for mounting the LED element on the front surface side, and driving heat generated from the LED chip and heat due to environmental conditions around the LED chip on the back surface side. A heat dissipating part (heat dissipating plate) for dissipating is provided, and heat is released from the heat dissipating part on the back side of the pad to the outside so that heat is not accumulated in the LED chip.

As the configuration of the LED element package, an LED chip mounting portion having a pad on which the LED chip is mounted, and an electric circuit that is disposed apart from the LED chip mounting portion and has leads formed for electrical connection with the LED chip. A lead frame having a general connection area, and a reflector for efficiently emitting light emitted from the LED chip to the outside. The reflector portion is formed when the resin is filled when the lead frame is packaged. In addition, the reflector portion has a truncated inverted conical cylindrical shape in which the cross-sectional area in the direction orthogonal to the thickness direction of the reflector portion is increased from the lower surface to the upper surface of the reflector portion with the LED chip as the center. .
Such a reflector portion has a different configuration depending on a forming method. Moreover, in order to discharge | release much light emitted from the LED element to the exterior, there exist what applied the plating process to the reflective surface of the reflector part, and what applied the ceramic ink which has high reflectivity.

JP 2003-8071 A JP 2003-347600 A JP 2004-172160 A

  When a lead frame substrate for an LED element is configured as a composite of a metal lead frame and an insulating resin as described above, the optical characteristics and mounting reliability are added to the LED chip mounting portion having pads and the electrical connection area portion having leads. For this reason, it is necessary to form a plating film such as Ni / Ag, Ni / Au, Ni / Pd / Au.

The formation of the plating film on the LED chip mounting part having the pad and the electrical connection area part having the lead can be appropriately set before and after the resin filling, but after the resin filling, the adhesion between the plating film and the resin is taken into consideration. desirable.
However, the formation of the plating film on the LED chip mounting part and the electrical connection area part after filling with the resin effectively hinders the circulation of the plating solution by the reflector part that efficiently emits the light of the LED chip to the outside. The LED chip mounting part and the electrical connection area part of the part are not deposited on the plating film and the film thickness varies, and there is concern about the reliability after mounting the LED chip.

  The present invention has been made in view of the above problems, and suppresses unevenness and non-attachment of the thickness of the plating film to the plating region of the LED chip mounting portion and the electrical connection area portion, and has high reliability and light output. It is an object to provide a lead frame substrate for an LED element having both the above and a light emitting element using the same.

  In order to achieve the above object, the invention of claim 1 is characterized in that an LED chip mounting portion having a pad on which an LED chip is mounted, and an LED chip mounting portion spaced apart from the LED chip mounting portion and electrically connected to the LED chip. A lead frame having an electrical connection area having a lead, a pad in the LED chip mounting portion, a peripheral area of the pad, and a lead in the electrical connection area and a peripheral area of the lead. A plated plating area, a resin package that covers a portion of the lead frame around the plating area excluding the plating area, and the resin chip portion formed around the plating area and emitted from the LED chip A reflector portion for reflecting light toward the outside, and an inner circumference of the reflector portion located on the lead frame side Grooves are formed along the inner peripheral edge portions of the upper surface portions of the LED chip mounting portion and the electrical connection area portion facing the portion, respectively, and the grooves are filled with resin of the same material as the resin package. A resin layer is formed.

  According to a second aspect of the present invention, in the lead frame substrate for an LED element according to the first aspect, the resin of the resin package and the resin of the resin layer filled in the groove are connected to each other.

  According to a third aspect of the present invention, in the lead frame substrate for an LED element according to the first or second aspect, a filler having high reflection characteristics is added to the molded resin material of the resin package and the resin material filled in the groove. It is characterized by that.

  According to a fourth aspect of the present invention, in the lead frame substrate for an LED element according to any one of the first to third aspects, the depth and width of the groove is a maximum of the filler added to the resin material filled in the groove. It is characterized by having a particle size or more.

  According to a fifth aspect of the present invention, in the lead frame substrate for an LED element according to any one of the first to fourth aspects, the groove is formed by half etching.

  According to a sixth aspect of the present invention, in the lead frame substrate for an LED element according to the first aspect, the inside of the reflector portion is sealed by filling a transparent resin on the plating region.

  A seventh aspect of the present invention is a light emitting element comprising an LED chip and the lead frame substrate for an LED element according to any one of the first to sixth aspects.

  According to the lead frame substrate for an LED element and the light emitting element using the same according to the present invention, the LED chip mounting part and the electrical connection area part facing the inner peripheral part of the reflector part are arranged along the inner peripheral part on each upper surface portion. Since the resin layer is formed by filling the grooves with the same material as the resin package, the thickness of the plating film on the plating area of the LED chip mounting part and the electrical connection area part is not adhered or not adhered. And a highly reliable plating film can be formed.

  In addition, according to the present invention, the structure in which the molded resin material of the resin package and the resin material of the resin layer filled in the groove are connected to each other improves the adhesiveness of the resin layer without peeling off in each step. A resin layer can be formed.

  In addition, according to the present invention, since the filler having reflectivity is added to the molded resin material of the resin package and the resin material filled in the groove, a light-emitting element having high reflection characteristics can be obtained.

  Further, according to the present invention, since the groove is formed by half etching, the resin layer can be formed on the same plane as the LED chip mounting pad and lead.

  In addition, according to the present invention, since the depth and width of the groove are equal to or greater than the maximum particle size of the filler added to the filling resin material, the resin layer can be formed without causing poor filling of the resin material. Become.

  Moreover, according to this invention, since it was set as the structure which fills and seals a transparent resin in a reflector part, an LED chip can be protected from dust, a water | moisture content, etc.

It is a top view which shows an example of the lead frame board | substrate for LED elements in this invention. It is a bottom view which shows an example of the lead frame board for LED elements in this invention. It is sectional drawing which follows the XX line of the lead frame board | substrate for LED elements in FIG. It is sectional drawing which follows the YY line | wire of the lead frame board | substrate for LED elements in FIG. It is a top view which shows the modification of the lead frame board | substrate for LED elements using the technique of the lead frame for LED elements of this invention. It is a sectional side view explaining an example of the resin mold to the lead frame using a metal mold | die. It is a top view of the multi-faced state which connected the lead frame for LED elements in this invention with the tie bar. It is a top view of the lead frame substrate for light emitting elements in the multi-sided state which connected the lead frame for LED elements in this invention with the tie bar. It is the top view after separating the lead frame substrate for LED elements of the multi-faced state in this invention into the light emitting element single-piece | unit. It is a top view which shows the other example of the lead frame board | substrate for LED elements in this invention.

(Embodiment 1)
A first embodiment of a lead frame substrate for an LED element according to the present invention will be described in detail with reference to FIGS.

The LED element lead frame substrate A according to the first embodiment includes an LED element lead frame 1 formed by photo-etching an alloy plate such as copper-nickel-tin, and an LED chip 10 that is an LED element. A resin package 4 for packaging the lead frame 1 including
As shown in FIGS. 1 to 5, the lead frame 1 has an electrical connection between the LED chip 10 and the LED chip mounting portion 2 having pads 2 a formed at one or more places for mounting the LED chip 10. It has an electrical connection area portion 3 formed with leads 3a for performing.
In addition, a pad 2a of the LED chip mounting portion 2 and a peripheral region of the pad 2a and a lead 3a of the electrical connection area portion 3 and a plating region plated on the peripheral region of the lead 3a are configured.
The LED chip mounting portion 2 and the electrical connection area portion 3 are electrically and structurally separated by a packaging resin material 4a.

  As shown in FIGS. 1 to 4, the resin package 4 covers a portion of the lead frame 1 around the plating area excluding the plating area. The resin package 4 includes a periphery of the plating area. A reflector portion 5 is formed in the portion of the resin package 4 located at the position. The reflector portion 5 has a truncated inverted conical cylinder shape in which the cross-sectional area in the direction orthogonal to the thickness direction of the resin package 4 with the LED chip 10 as the center is enlarged from the lower surface to the upper surface of the resin package 4. Yes. Further, a plating film necessary after the formation of the reflector part 5 is formed in the plating region facing the inside of the reflector part 5, and the LED chip 10 is formed on the pad 2a and the lead 3a after the formation of the plating film. Implemented. Further, W shown in FIG. 3 denotes a bonding wire, which electrically connects between the electrode of the LED chip 10 mounted on the pad 2a and the lead 3a in the electrical connection area portion 3.

As shown in FIGS. 1 to 3, the lead frame 1 has through holes 7 formed by photoetching. The through hole 7 has a tapered shape or a stepped shape, and has different opening areas on the front and back surfaces. As a result, the resin package 4 can be held so as not to fall off the lead frame 1.
Further, in the LED element lead frame substrate A, as shown in FIGS. 1 to 3, tie bars 8 for connecting the lead frames are embedded. The area of the front and back surfaces of the tie bar 8 is different due to half etching on the lead frame. As a result, the resin package 4 can be held so as not to fall off the lead frame 1.

Further, as shown in FIGS. 1, 3 and 4, the LED element lead frame substrate A has an LED chip mounting portion 2 and an upper surface portion of the electrical connection area portion 3 facing the inner peripheral edge portion 5 a of the reflector portion 5. The resin layer 6 is provided. This resin layer 6 suppresses the non-deposition of the plating film on the boundary portion between the LED chip mounting portion 2 and the electrical connection area portion 3 and the reflector portion 5, and the variation in film thickness.
Such a resin layer 6 was formed by half-etching over the entire circumference of the inner peripheral edge portion 5a at the upper surface portion of the LED chip mounting portion 2 and the electrical connection area portion 3 facing the inner peripheral edge portion 5a of the reflector portion 5. Grooves 2b and 3b are provided, and the grooves 2b and 3b are formed by filling the same resin material as the resin package 4 during packaging.

The depth t2 of the grooves 2b and 3b is set to be 1.5 times or more the maximum particle size of the filler used for the filling resin in the grooves 2b and 3b, and if the lead frame thickness t1 or less, The depth t2 may be appropriately set as necessary.
Further, the width t3 of the grooves 2b and 3b is also set to be 1.5 times or more the maximum particle diameter of the filler used for the filling resin into the grooves 2b and 3b. Therefore, the LED chip 10 can be mounted on the pad 2a, and the range of the grooves 2b and 3b provided by half-etching can be appropriately set as long as the LED chip 10 and the lead 3a can be electrically connected by wire bonding. It is.

  The design of the grooves 2b and 3b formed in the LED chip mounting part 2 and the electrical connection area part 3 is designed to be less than 1.5 times the maximum particle size of the filler used in the filling resin, thereby suppressing filling defects. In addition, it is possible to suppress resin burrs that occur when the resin package 4 is filled during packaging. When the maximum particle size of the filler used in the resin package 4 is in the range of 1 to 1.5 times or less, poor filling is likely to occur, and resin burrs are generated in a wide range during filling. Therefore, it is desirable that the grooves 2b and 3b formed in the LED chip mounting portion 2 and the electrical connection area portion 3 have a depth and width that is 1.5 times or more that of the filler used for the filling resin.

  As shown in FIG. 5, if the lead 3 a for electrical connection with the pad 2 a and the LED chip 10 is within a range that can be electrically connected by mounting the LED chip 10 and wire bonding, the resin layer 6 is formed. The range may be entirely within the reflector portion 5.

As shown in FIGS. 3 and 4, the resin layer 6 has a structure in which a part thereof is integrally connected to the lower end of the reflector portion 5. As a result, the resin layer 6 can be held so as not to fall off the lead frame 1.
In the present embodiment, since the maximum particle size of the filler used in the resin package 4 is 50 μm, the depth and width of the resin layer 6 are 75 μm or more which is 1.5 times the maximum particle size of the filler. Designing.

Examples of the resin package 4 used in the present embodiment include an epoxy resin, a modified epoxy resin, a silicone resin, an acrylic resin, a polycarbonate resin, an aromatic polyester resin (unsaturated polyester resin), and the like. One type of resin may be used, or a mixed resin obtained by mixing a plurality of resins may be used.
The additive used for the resin package 4 is fine particles such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , zirconium oxide, ceramic material, or a mixture, and the mixing ratio of the additive can be set. , High reflection characteristics of about 90 to 96% can be obtained.

  In the lead frame substrate for a light emitting element in the present embodiment, since the pads 2a and the leads 3a are formed by photoetching the same alloy plate, their surfaces have the same height in the thickness direction of the lead frame. It is on a plane. The lead 3a is connected to the LED chip 10 mounted on the LED chip mounting portion 2a by wire bonding or chip bonding.

  The plating on the LED chip mounting portion 2 and the electrical connection area portion 3 may be freely selected from silver plating, gold plating, palladium plating and the like according to the application. In addition, prior to performing silver plating, gold plating, palladium plating, etc., undercoating such as nickel plating having excellent thermal diffusibility may be performed.

  As shown in FIGS. 3 and 4, a transparent resin 9 is provided in the reflector portion 5 on the upper surface side of the LED chip mounting portion 2 including the pads 2 a and on the upper surface side of the electrical connection area portion 3 including the leads 3 a. Is filled. Thereby, the whole including the LED chip 10 is covered in a sealed state. In addition, in FIG. 3, although the upper surface layer of the transparent resin 9 is flat, not only this but the shape protruded in the dome shape may be sufficient.

  The lead frame in the present embodiment forms a resist pattern by applying a photoresist to the front and back surfaces of the lead frame metal plate and subjecting the photoresist to pattern exposure and development processing. Thereafter, by using an etchant such as ferric chloride from both the front and back surfaces and etching the resist non-formed portion, the LED chip mounting portion 2 and the electrical connection area portion 3 are not electrically connected. They are formed apart from each other.

Next, the manufacturing method of the lead frame for LED elements of this invention is demonstrated.
First, a photoresist is applied to the surface of a metal plate made of an alloy such as iron-nickel or a metal alloy such as copper-nickel-tin to form a photoresist layer. Next, the pattern is exposed to the photoresist layer through a photomask for pattern exposure having a predetermined pattern for forming the LED chip mounting portion 2 having the pads 2a and the electrical connection area portions 3 having the leads 3a, and then The photoresist layer is developed, and a hardening process is performed as necessary. As a result, the photoresist is developed and removed, leaving the LED chip mounting portion 2 on which the LED chip 10 is mounted and the electrical connection area 3 that is electrically connected to the LED chip 10. Thereby, the LED chip mounting part 2 having the pads 2a and the electrical connection area part 3 having the leads 3a are formed.
In the above process, a resist pattern for forming the grooves 2 b and 3 b for the resin layer 6 is also simultaneously formed on the upper surface portions of the LED chip mounting portion 2 and the electrical connection area portion 3.

  Next, a corrosion-resistant resin film is attached to the back surface of the metal plate material to be the lead frame, and the photoresist non-formed portion of the metal plate material is formed at a predetermined depth from the surface side (for example, FIG. 3 and FIG. Etching (half-etching treatment) using an etchant such as ferric chloride up to a thickness t2) of 4 is followed by cleaning and a corrosion-resistant resin film is adhered to the surface.

Next, the corrosion-resistant resin film adhered to the back surface of the metal plate material is peeled off, and the photoresist non-formed portion of the metal plate material is etched from the back surface side to a predetermined depth using an etchant such as ferric chloride. Processing is performed. Thereby, the through-hole 7 is each formed in the metal part in which the resist pattern of the surface of a metal plate material and a back surface is not formed. Further, the LED element mounting portion 2 having the pad 2a, the electrical connection area 3 having the lead 3a, and the LED element lead frame 1 having the grooves 2b and 3b for the resin layer 6 are formed.
In the above process, the through hole formed by the etching process is tapered in order to hold the resin package 4 filled at the time of molding. Next, a series of resin mold processing described in the following example is performed on the lead frame.

That is, the lead frame is loaded into a concave portion of a mold having a concave internal shape suitable for accommodating the lead frame 1.
As shown in FIG. 6, the mold is loaded with an upper mold 40 serving as a lid, an injection port 42 for injecting a molten resin package 4, and a lead frame 1 (multi-sided lead frame) communicating with the injection port 42. The lower mold 41 having a possible recess 43 as an internal space is configured, and after the lead frame 1 (multi-faced lead frame) is loaded into the recess 43 of the lower mold 41, the upper mold 40 is replaced with the lower mold 41. Clamp it over 41.

  Next, a resin material heated and melted is injected into the recess 43 from the injection port 42, and the loaded lead frame 1 (multi-faced lead frame) is molded with the resin package 4. Thereby, the resin-molded lead frame 1 for LED elements is obtained. After molding, cool and remove the upper mold, and remove the lead frame from the lower mold. As a result, a lead frame substrate for an LED element in which the reflector portion and the lead frame are integrally molded is formed.

The tie bar 8 shown in FIG. 1 and FIG. 2 is for connecting the lead frames after the etching processing, and the lead shown in the present embodiment is cut by cutting the tie bar 8 after molding. A frame is obtained.
3 and 4, the tie bar 8 has a structure that fits in the resin package 4 by half etching in order to hold the resin package 4. The cutting time of the tie bar 8 may be after the mounting of the LED chip or after the resin molding, but may be appropriately set as necessary. In the above description, the etching process is performed once for each of the front and back surfaces, but the metal plate material may be etched by one etching performed simultaneously from the front and back surfaces.

  In the above process, the lead frame substrate for LED element is formed by molding the lead frame formed by the etching process. Next, after removing the resin burrs generated on the pads 2a of the LED chip mounting portion 2 and the leads 3a of the electrical connection area 3 by the molding process, a plating film is formed.

  Formation of the plating film on the LED chip mounting portion 2 having the pad 2a and the electrical connection area portion 3 having the lead 3a is performed by an electrolytic plating method or an electroless plating method. Ni, Ag, Pd, Au, etc. are used for the plating film material in this case. In forming the plating film, the LED chip mounting portion is provided by providing the resin layer 6 on the upper surface portion of the LED chip mounting portion 2 and the electrical connection area portion 3 facing the peripheral edge of the lower opening 5a of the reflector portion 5. 2 and the electrical connection area 3 can be formed with no plating film deposited or with no variation in film thickness.

Next, a lead frame for LED elements with multiple faces connected by tie bars will be described with reference to FIG.
The LED chip mounting portion 2 and the electrical connection area portion 3 of the lead frame shown in this embodiment are a single unit frame whose front and back surfaces are the same plane. This 1-unit frame is manufactured using a multi-sided lead frame molded body ML in which a plurality of 1-unit frames are arranged in a multi-sided manner in the vertical and horizontal directions on a sheet-like or strip-shaped metal plate.

  As shown in FIG. 7, in order to prevent the lead frame from being separated from the metal plate after the etching, for example, a grid-like frame portion called a tie bar 8 is formed. Therefore, the multi-sided lead frame molded body ML has a structure in which one unit frame is connected by being arranged in the vertical and horizontal directions by the tie bars 8 as frame portions.

  The tie bar 8 is similar to the case where the LED chip mounting portion 2 and the electrical connection area 3 are formed when the LED chip mounting portion 2 having the pads 2a and the electrical connection area portion 3 having the leads 3a are formed by etching. By this method, it forms in a metal plate material. Then, by cutting the tie bar 8, a lead frame for an LED element that is one unit frame is obtained.

  As shown in FIG. 7, a flat lead frame manufactured by photo-etching with multiple units of a single unit of a lead frame is placed in a mold for manufacturing a lead frame for an LED element, as described above. The resin package 4 is filled and injected into the recess (internal space) of the mold and filled. As a result, as shown in FIG. 8, the LED element lead frame substrate is formed in a multifaceted state.

When resin molding is performed on the LED element lead frames that are multifaceted, a filling resin is injected into a mold having a recess (internal space). In addition, when the filling resin is injected, the resin sequentially flows from one unit frame in the vicinity of the resin injection port to one unit frame in a part away from the injection port, and is resin-molded.
Thereafter, the LED element lead frame that is multi-faced is cut from the portion of the tie bar 8 for each unit. As a result, one unit frame separated as shown in FIG. 9 is obtained.
Note that the cutting timing of the LED element lead frame is not limited to after resin molding, and may be appropriately set after mounting the LED chip or after forming the transparent sealing resin.

  The division of the LED element lead frame substrate that is multifaceted is performed using dicing or a cutting blade. In this case, the tie bar is cut with a cutting blade, but since the thickness is reduced, the burden on the cutting blade during cutting is reduced, and the life of the cutting blade can be extended.

(Embodiment 2)
Next, a second embodiment of the present invention will be described with reference to FIG.
In FIG. 10, the same reference numerals are given to the same components as those in FIG. 1, and the LED element lead frame substrate A shown in the second embodiment is obtained by photoetching a plate-like base material made of a metal alloy. A lead frame 1 for a light emitting element formed by processing and a resin package 4 for packaging the lead frame 1 including the light emitting element are provided.
The lead frame 1 has an LED chip mounting portion 2 having a pad 2a for mounting the LED chip 10 and an electrical connection area portion 3 in which leads 3a for electrical connection with the LED chip 10 are formed. Yes.

  The resin package 4 includes a pad 2a of the LED chip mounting portion 2 and a peripheral region of the pad 2a, and a lead 3a of the electrical connection area 3 and a peripheral region of the lead 3a as plating regions, and is positioned around the plating region. A reflector portion 5 is formed in the portion of the resin package 4 to be performed. The reflector portion 5 has a truncated inverted quadrangular cylinder shape in which the cross-sectional area in the direction orthogonal to the thickness direction of the resin package 4 with the LED chip 10 as the center is enlarged from the lower surface to the upper surface of the resin package 4. ing. Further, a resin layer 6 is formed on the upper surface portion of the LED chip mounting portion 2 and the electrical connection area portion 3 facing the periphery of the lower opening 5 a of the reflector portion 5.

  The second embodiment is different from FIG. 1 in that the reflector portion 5 is formed in the shape of a truncated inverted quadrangular pyramid, but the same effect as the LED element lead frame substrate shown in the first embodiment. Is obtained.

DESCRIPTION OF SYMBOLS 1 ... Lead frame for LED element 2 ... LED chip mounting part 2a ... Pad 2b ... Groove 3 ... Electrical connection area part 3a ... Lead 3a ... Groove 4 ... Resin package 5 ... Reflector part 5a …… Inner peripheral edge 6 …… Resin layer 7 …… Through hole 8 …… Tie bar 9 …… Transparent resin 10 …… LED chip 40 …… Upper die 41 …… Lower die 42 …… Inlet 43 …… Recess A …… Lead frame substrate for LED element ML …… Multi-sided lead frame molding W …… Bonding wire

Claims (7)

An LED chip mounting portion having a pad on which the LED chip is mounted; and an electrical connection area portion having a lead that is spaced apart from the LED chip mounting portion and electrically connected to the LED chip. A lead frame,
The pad of the LED chip mounting portion, the peripheral region of the pad, the lead of the electrical connection area portion, and a plating region plated on the peripheral region of the lead;
A resin package that covers a portion of the lead frame around the plating area excluding the plating area;
A reflector portion that is formed in the resin package portion located around the plating region and reflects light emitted from the LED chip to the outside;
Grooves are respectively formed along the inner peripheral edge portion in the upper surface portions of the LED chip mounting portion and the electrical connection area portion facing the inner peripheral edge portion of the reflector portion located on the lead frame side,
Filling each groove with the same material as the resin package to form a resin layer,
The lead frame substrate for LED elements characterized by the above-mentioned.   2. The lead frame substrate for an LED element according to claim 1, wherein the resin of the resin package and the resin of the resin layer filled in the groove are connected to each other.   3. The lead frame substrate for an LED element according to claim 1, wherein a filler having high reflection characteristics is added to a molded resin material of the resin package and a resin material filled in the groove.   The lead frame for an LED element according to any one of claims 1 to 3, wherein the depth and width of the groove are equal to or greater than a maximum particle diameter of a filler added to a resin material filled in the groove. substrate.   5. The lead frame substrate for an LED element according to claim 1, wherein the groove is formed by half etching.   The lead frame substrate for an LED element according to any one of claims 1 to 5, wherein an inner side of the reflector portion on the plating region is sealed by filling with a transparent resin. An LED chip;
A lead frame substrate for an LED element according to any one of claims 1 to 6,
A light-emitting element comprising:

Images