JPS5066170A - - Google Patents
Info
- Publication number
- JPS5066170A JPS5066170A JP48113915A JP11391573A JPS5066170A JP S5066170 A JPS5066170 A JP S5066170A JP 48113915 A JP48113915 A JP 48113915A JP 11391573 A JP11391573 A JP 11391573A JP S5066170 A JPS5066170 A JP S5066170A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48113915A JPS5066170A (en) | 1973-10-12 | 1973-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48113915A JPS5066170A (en) | 1973-10-12 | 1973-10-12 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56040343A Division JPS6012785B2 (en) | 1981-03-23 | 1981-03-23 | electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5066170A true JPS5066170A (en) | 1975-06-04 |
Family
ID=14624367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48113915A Pending JPS5066170A (en) | 1973-10-12 | 1973-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5066170A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52164451U (en) * | 1976-06-08 | 1977-12-13 | ||
| JPS53112376U (en) * | 1977-02-14 | 1978-09-07 | ||
| JPS5444869A (en) * | 1978-08-21 | 1979-04-09 | Hitachi Ltd | Transistor |
| JPS5869948U (en) * | 1981-11-04 | 1983-05-12 | 株式会社精工舎 | Printed board |
| JPH04113451U (en) * | 1991-03-22 | 1992-10-05 | サンケン電気株式会社 | Insulator coated electronic components |
| JP2008091864A (en) * | 2006-09-08 | 2008-04-17 | Nichia Chem Ind Ltd | Light emitting device |
| JP2011035334A (en) * | 2009-08-06 | 2011-02-17 | Panasonic Corp | Semiconductor device |
| JP2012084810A (en) * | 2010-10-14 | 2012-04-26 | Toppan Printing Co Ltd | Lead frame substrate for led element and light emitting element |
| TWI400778B (en) * | 2006-09-13 | 2013-07-01 | Shinetsu Chemical Co | Method for sealing microcomponent |
-
1973
- 1973-10-12 JP JP48113915A patent/JPS5066170A/ja active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52164451U (en) * | 1976-06-08 | 1977-12-13 | ||
| JPS5653551Y2 (en) * | 1976-06-08 | 1981-12-14 | ||
| JPS53112376U (en) * | 1977-02-14 | 1978-09-07 | ||
| JPS5713933Y2 (en) * | 1977-02-14 | 1982-03-20 | ||
| JPS5444869A (en) * | 1978-08-21 | 1979-04-09 | Hitachi Ltd | Transistor |
| JPS5869948U (en) * | 1981-11-04 | 1983-05-12 | 株式会社精工舎 | Printed board |
| JPH04113451U (en) * | 1991-03-22 | 1992-10-05 | サンケン電気株式会社 | Insulator coated electronic components |
| JP2008091864A (en) * | 2006-09-08 | 2008-04-17 | Nichia Chem Ind Ltd | Light emitting device |
| TWI400778B (en) * | 2006-09-13 | 2013-07-01 | Shinetsu Chemical Co | Method for sealing microcomponent |
| JP2011035334A (en) * | 2009-08-06 | 2011-02-17 | Panasonic Corp | Semiconductor device |
| JP2012084810A (en) * | 2010-10-14 | 2012-04-26 | Toppan Printing Co Ltd | Lead frame substrate for led element and light emitting element |