JP5336974B2 - Resin sealing device and resin sealing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve the speed-up of resin sealing work in a resin sealing device while maintaining resin sealing quality by provisionally molding a powder resin into a heat transferrable form. <P>SOLUTION: A resin sealing device 100 executes resin sealing of an article to be molded by a die 160 by using a powder resin 102. The device is equipped with: a hot plate 128 that softens the powder resin 102 on a release film 116 so as to form a semi-fused resin 104; and an air discharge mechanism 130 that provisionally molds a preliminarily fused resin 106 by pressurizing and shrinking the semi-fused resin 104 while having an air gap in-between the surface, on the opposite side of the release film, of the powder resin 102 without contacting with the surface. The preliminarily fused resin 106 is poured into the die 160 together with the release film 116. The release film 116 is also used in resin sealing. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a technical field of a resin sealing device and a resin sealing method for sealing a product to be molded with resin.

  In a resin sealing device for placing a substrate on which a semiconductor chip or the like, which is a molded product, is placed in a mold and sealing it with resin, when using a granular resin as the resin sealing material, the mold cavity When the resin is put into the powder, the powdery resin (granular resin) is likely to be scattered outside the cavity. Therefore, in the resin sealing device shown in Patent Document 1, while preventing the granular resin from scattering out of the cavity, etc., using a curtain provided in the resin supply mechanism for charging the granular resin. It has been proposed that the granular resin is uniformly supplied into the cavity.

JP 2006-120880 A

  However, in patent document 1, there exists a possibility that a granular resin may scatter when moving a resin supply mechanism to a metal mold | die. Further, the granular resin as used in Patent Document 1 is an air layer (hereinafter, the air layer does not have a hole shape) between the resin particles of the granular resin even after being put into the cavity. However, there is a problem that the temperature cannot be increased quickly, and the time for the resin sealing operation cannot be sufficiently shortened. On the other hand, it is conceivable to increase the temperature of the cavity itself. However, in this case, since the temperature management of the entire resin sealing operation is affected, the temperature management becomes complicated, and there is a possibility that the temperature of only the melted part of the granular resin is too high. For this reason, the quality of resin sealing may be lowered as a result, resulting in a decrease in yield.

  From this point of view, the present invention can speed up the resin sealing work in the resin sealing device while preserving the resin sealing quality by preliminarily molding the granular resin into a form in which heat is easily transmitted. It is an object of the present invention to provide a resin sealing device and a resin sealing method using the preliminary fusion resin to be temporarily formed.

The present invention is a resin sealing device for resin-molding a molded product with a mold using a granular resin, a heating means for softening the granular resin on a release film, in powder or granular material like resin state in which a gap without contacting the surface of the anti-release film side, a contactless for temporarily shaping the precautionary fused resin is contracted to softening the granular material like resin Shrinking means, the preliminary fusion resin together with the release film is put into the mold, the release film is also used for resin sealing , the non-contact shrinking means is the softening in Rukoto comprising a vibrating mechanism to vibrate the the powder or granular material like resin, is intended to solve the above problems. Alternatively, the present invention is a resin sealing device for sealing a molded product with a mold using a granular resin, and heating means for softening the granular resin on a release film And preliminarily molding the preliminarily fused resin by shrinking the softened granular resin in a state where a void is provided without contacting the surface of the granular resin on the side of the releasable film. Contact shrinking means, the preliminary fusion resin together with the release film is charged into the mold, the release film is also used for resin sealing, the non-contact shrinking means, The above problem is solved by providing an air discharge mechanism that blows compressed air onto the surface of the softened granular resin on the side of the releasable film. Alternatively, the present invention is a resin sealing device for sealing a molded product with a mold using a granular resin, and heating means for softening the granular resin on a release film And preliminarily molding the preliminarily fused resin by shrinking the softened granular resin in a state where a void is provided without contacting the surface of the granular resin on the side of the releasable film. Contact shrinking means, the preliminary fusion resin together with the release film is charged into the mold, the release film is also used for resin sealing, the non-contact shrinking means, What is provided is a sealing mechanism that seals the softened granular resin with a release film, and a pressure increase mechanism that increases the pressure in the space sealed by the sealing mechanism. It is.

  In the present invention, for the purpose of speeding up the resin sealing operation, a preliminary fusion resin in a form in which heat is easily transmitted is preliminarily formed from a granular resin in advance with a minimum number of steps. That is, the present invention uses a heating means to soften the resin particles of the granular resin so that the resin particles of the granular resin can be fused to each other. The preliminary fusion resin in which the resin particles are fused is temporarily formed by using means (non-contact shrinkage means) for shrinking the softened granular resin without contacting the surface on the side. . That is, by using the heating means and the non-contact shrinkage means, the resin particles of the particulate resin that can be fused can be reliably bonded and shrunk, so that pores serving as a heat insulating layer between the resin particles It is possible to improve the thermal conductivity by reducing the number and pore size. By improving the thermal conductivity, the temperature rise time until the molding temperature is reached in the resin sealing step is shortened, so that the productivity of the molded product can be improved.

  Further, the non-contact shrinkage means does not take the form of compressing the repulsion film side of the softened granular resin with the pressing means using the tangible material, and therefore accompanying the resin sticking at the time of shrinkage Time loss and resin loss can be prevented, and at the same time, use of a large number of members for preventing resin sticking can be omitted.

  In addition, since the release film is used for both the preliminary molding of the preliminary fusion resin and the sealing of the resin, compared to using separate release films, the use equipment and man-hours are reduced. It can be reduced, and the amount of expensive release film used can be reduced. For this reason, it is possible to promote the speeding up of the resin sealing work and the reduction in running cost with a simple configuration.

  In addition, in the case of including a release film supply device for supplying the continuous release film to the mold, including the position where the heating means and the non-contact shrinking means are disposed, Since the steps from placing the resin on the release film to sealing the resin are performed with the same transfer function, there is no waste in transfer control and operation, and the speeding up of the resin sealing operation can be further promoted. At the same time, the release film after resin sealing can be easily collected, and the occupied space for it can be made compact. Further, since there is no work of cutting the release film, the generation of dust accompanying the cutting can be reduced.

  Further, when the heating means is disposed below the release film, the degree of softening of the resin particles of the granular resin on the release film side is large, so that the preliminary fusion resin The number of holes and the hole size on the release film side can be made smaller than those on the anti-release film side. For this reason, it can prevent efficiently that a void etc. generate | occur | produce at the time of shaping | molding.

Incidentally, before Symbol contactless shrinkage means, when provided with the air discharging mechanism for blowing compressed air to the surface of the anti-release film side of the softened granule-like resin, simply softened by blowing compressed air powder Since the granular resin is pressurized, the structure of the non-contact shrinking means can be simplified and a corresponding pressure / shrinkage effect can be obtained.

  Further, the non-contact shrinking means includes a sealing mechanism for sealing the softened granular resin with the release film, and a pressure raising mechanism for increasing the pressure in the space sealed by the sealing mechanism or the sealing And an air decompression mechanism that decompresses the space sealed by the mechanism, by increasing the pressure in the sealing mechanism (in the case of an air decompression mechanism, the pressure is increased by returning to atmospheric pressure after decompression) ), Pressurizing and shrinking the softened granular resin. Since this pressurization (or depressurization → pressurization) is constant as long as it is within the sealing mechanism, a homogeneous preliminary fused resin can be temporarily molded with good reproducibility.

  In addition, when the non-contact shrinkage means includes a vibration mechanism that vibrates the softened granular resin, the inertial force according to the acceleration due to vibration acts in the direction opposite to the vibration direction. By generating a shearing force inside the body-shaped resin, it is possible to promote void discharge (reduction in the number of holes and the hole size) and contribute to the shrinkage of the whole granular resin. For this reason, it is possible to temporarily mold a homogeneous preliminary fusion resin with a relatively simple configuration.

The present invention is a resin sealing method for resin-sealing a molded article using a granular resin, the step of softening the granular resin on a release film, and the powder in a state in which a gap without contact with the surface of the anti-release film side of the particle-like resin, a step of temporarily forming a precautionary fused resin is contracted by the vibration of softening the granular material like resin, And a step of introducing the preliminary fusion resin into a mold for sealing the resin in a state where the preliminary fusion resin is placed on the release film. Can also be understood.

  By applying the present invention, resin molding work in a resin sealing device while preserving the resin sealing quality by preliminarily molding the granular resin into a preliminarily fused resin that is a form in which heat is easily transmitted Can be speeded up.

The schematic diagram which shows an example of the resin sealing apparatus concerning 1st Embodiment of this invention. Schematic diagram showing the same air discharge mechanism Similarly, a schematic diagram showing a preliminary molding process of a preliminary fusion resin Similarly, a graph showing the relationship between the temperature and time of the preliminary fusion resin The schematic diagram which shows the temporary molding process of the preliminary fusion resin concerning 2nd Embodiment of this invention. The schematic diagram which shows the temporary molding process of the preliminary fusion resin concerning 3rd Embodiment of this invention. The schematic diagram which shows the temporary molding process of the preliminary fusion resin concerning 4th Embodiment of this invention. The schematic diagram which shows the temporary molding process of the preliminary fusion resin concerning 5th Embodiment of this invention The schematic diagram which shows an example of the resin sealing apparatus concerning 6th Embodiment of this invention.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  Initially, the structure of the resin sealing apparatus concerning 1st Embodiment of this invention is demonstrated below using FIG.

  The resin sealing device 100 includes a preliminary fusion part 112 for temporarily forming the granular resin 102 as a raw material into a flat preliminary fusion resin 106 and a mold 160 using the preliminary fusion resin 106. And a compression molding portion 114 for sealing the molded product with resin. The preliminary fused part 112 and the compression molding part 114 also serve as the release film 116.

  The release film 116 is supplied by a release film supply device 118. The release film supply device 118 includes a supply roll 120, a collection roll 122, and a plurality of rollers 124. The release film supply device 118 supplies a continuous release film 116 to the mold 160 including a predetermined position of the preliminary fusion part 112. In other words, the release film 116 is continuously supplied from the supply roll 120, and the direction and height are adjusted by the roller 124, so that the predetermined positions of the preliminary fusion portion 112 and the compression molding portion 114 are respectively determined. And continuously collected by the collection roll 122. The release film 116 is formed to an appropriate thickness with a material that has excellent heat resistance, good heat conduction, excellent stretchability, and easy shape recovery.

  In the preliminary fusion part 112, a raw material supplier 126, a hot plate 128 as a heating means, and an air discharge mechanism 130 as a non-contact shrinking means are arranged. The heating means is not limited to a hot plate, and an infrared heater, microwave, hot air, or the like may be used.

  The raw material feeder 126 drops the granular resin 102 onto a predetermined area on the release film 116 at a predetermined position of the preliminary fusion part 112 through which the release film 116 passes. As shown in FIG. 3A, the raw material supplier 126 includes a cylindrical frame 126B for restricting the granular resin 102 dropped from the supply port 126A of the raw material supplier 126 to a predetermined area. Yes. A frame-shaped structure (not shown) is arranged in the frame 126B, and the dropped granular resin 102 is uniformly dispersed within the predetermined area. A recess 126BB having a width and a height that does not fuse with the frame 126B when the granular resin 102 is heated is provided at the lowermost end of the frame 126B.

  In order to heat the granular resin 102 supplied onto the release film 116, the hot plate 128 faces the raw material supply device 126 at the lower side of the release film 116 in the preliminary fusion part 112. Be placed. The hot plate 128 is controlled by a control unit (not shown), and the resin particles of the granular resin 102 on the release film 116 are softened and can be fused to each other (softened granular resin 102. Or (referred to as semi-fused resin 104).

  The air discharge mechanism 130 is arranged in parallel with the raw material feeder 126 in the moving direction of the release film 116 and is disposed to face the hot plate 128 with the release film 116 interposed therebetween. And the air discharge mechanism 130 is arrange | positioned in the state (non-contact state) which provided the space | gap, without contacting the surface by the side of the reverse release film of the granular resin 102 on the release film 116. FIG. The air discharge mechanism 130 guides the compressed air from the compressor 132 to the holder 136 through a pipe 134 as shown in FIG. The holder 136 includes a discharge port 140 that is supported by the beam 138 and faces the release film 116. As shown in FIG. 2B, the discharge port 140 has a slit shape. The air discharge mechanism 130 functions as non-contact shrinkage means for temporarily molding the preliminary fusion resin 106 by blowing compressed air onto the surface of the releasable film side of the semi-fusion resin 104 to shrink its thickness. To do. The release film 116 is moved to the compression molding unit 114 side by the operation of the release film supply device 118, so that the predetermined area of the above-mentioned semi-fused resin 104 is reduced by the compressed air from the slit-shaped discharge port 140. Pressurize uniformly. At that time, fusion of many softened resin particles is promoted, and the semi-fused resin 104 is temporarily formed into a preliminary fused resin 106 having a small number of pores or a small pore size. Note that the holder 136 may be movable on the beam 138. In that case, the air discharge mechanism 130 can spray the compressed air uniformly onto the semi-fused resin 104 without restricting the pressurizing condition for the movement of the release film 116.

  The compression molding unit 114 includes a compression molding machine 150. The number of compression molding machines 150 is one in FIG. 1, but a plurality of compression molding machines 150 may be provided. The compression molding machine 150 includes a main body 152 and a fixed platen 156 supported by tie bars 154 that are a plurality of support columns erected on the main body 152. An upper mold 162 is attached to the lower surface of the fixed platen 156. The main body 152 includes a movable platen 158 that can move toward and away from the fixed platen 156. A lower mold 164 is attached to the upper surface of the movable platen 158. The lower mold 164 is provided with a suction mechanism (not shown) so that the release film 116 can be sucked and fixed. The lower mold 164 approaches and separates from the upper mold 162 attached to the fixed platen 156 as the movable platen 158 moves. That is, by moving the movable platen 158, the mold 160 composed of the upper mold 162 and the lower mold 164 can be clamped and opened.

  The cavity formed in the mold 160 is provided at a predetermined location of the compression molding portion 114 through which the release film 116 passes. For this reason, the release film 116 on which the preliminary fusion resin 106 is placed is adsorbed to the lower die 164, whereby the introduction of the preliminary fusion resin 106 into the mold 160 is completed.

  Next, FIG. 1 illustrates the operation of the resin sealing device 100 (also referred to as a temporary molding step of the preliminary fusion resin 106 in the preliminary fusion portion 112, a resin sealing step in the compression molding portion 114, and a resin sealing operation). This will be described with reference to FIG.

  First, the raw material supplier 126 is brought close to the release film 116 on the hot plate 128. Then, the granular resin 102 is dropped from the supply port 126A and placed on the release film 116 on the hot plate 128 (FIG. 3A). At this time, the frame 126B has a length that covers the position B at the lower end of the supply port 126A at the position U at the upper end and is disposed in the very vicinity of the release film 116 at the position D at the lower end of the frame 126B. The scattering of the granular resin 102 to the outside of the frame 126B can be prevented. At the same time, the granular resin 102 can be accurately dropped onto a predetermined area defined by the frame 126B of the release film 116. At this time, the granular resin 102 is deposited on the predetermined area with a uniform thickness by a frame-shaped structure (not shown) between the supply port 126A and the release film 116. For this reason, the uniformity of heating of the granular resin 102 and shortening of the heating time can be ensured, and the resin flow during compression molding can be reduced.

  The temperature of the hot plate 128 is raised to a temperature (about 100 degrees) at which the resin particles of the granular resin 102 are softened and can be fused to each other, and the raw material supply machine is passed through the release film 116. The granular resin 102 dropped from 126 is heated. At the position facing the raw material supply device 126, the dropped granular resin 102 is softened and heated to a state where it can be fused to each other (a state of the semi-fused resin 104) (FIG. 3B). The resin particles of the granular resin 102 are deformed by being softened by heating, and the mutual contact area is increased. For this reason, the void | hole size between resin particles becomes small, and the thickness of the semi-fusion resin 104 becomes smaller than the thickness immediately after dropping of the granular resin 102. At the same time, the softened resin particles are coupled with a change in viscosity due to temperature, and their binding force increases (because some fusion starts), making it difficult for them to move.

  Next, the raw material supplier 126 is separated from the release film 116 together with the frame 126B. The frame 126B is provided with a recess 126BB. For this reason, the shape of the semi-fused resin 104 does not collapse up to the concave portion 126BB, and the resin particles are not fused to the side surface of the frame 126B, so that the amount of the initially dropped granular resin 102 is changed. The frame 124B can be easily separated.

  Next, the release film 116 is moved to the compression molding portion side on the hot plate 128 by the release film supply device 118, and the semi-fused resin 104 is opposed to the air discharge mechanism 130 (FIG. 3C). Compressed air is blown onto the semi-fused resin 104 from the discharge port 140 to pressurize and contract the semi-fused resin 104. In this embodiment, since the discharge port 140 is fixed, the release film 116 is sent to the compression molding unit side at a constant speed by the release film supply device 118. For this reason, compressed air is uniformly sprayed from the slit-shaped discharge port 140 to the entire surface of the semi-fused resin 104. Since the resin particles constituting the semi-fused resin 104 have increased mutual binding force as described above, scattering of the resin particles is prevented even when compressed air is blown. By pressurizing the compressed air, the softened resin particles are crushed and the softened resin particles are reliably fused. For this reason, the semi-fused resin 104 originally in the form of a particle-shaped aggregate is shrunk in the thickness direction by the resin particles being crushed by the air discharge mechanism 130 to reduce the number of holes and the size of the holes. It is temporarily formed into the preliminary fusion resin 106 in the form. At this time, the hot plate 128 is disposed below the release film 116 to heat the granular resin 102 and the semi-fused resin 104 from below. For this reason, more resin particles are fused on the surface (lower surface) on the release film side of the preliminary fusion resin 106 than on the surface on the half release film side. The number of pores existing between them is reduced and the pore size is reduced.

  Next, without providing a cooling time (step), the preliminary fusion resin 106 is spared while the release film supply device 118 is moved and the preliminary fusion resin 106 is adhered to the release film 116. 3 is moved from a predetermined location of the static fusion portion 112 to a predetermined location of the compression molding portion 114 (FIG. 3D).

  Next, the portion of the release film 116 to which the preliminary fusion resin 106 is adhered is adsorbed and fixed to the lower die 164 as it is by the adsorption mechanism of the lower die 164 of the mold 160. Then, the preliminary fusion resin 106 is heated to a molding temperature suitable for resin sealing.

  Then, the lower mold 164 is brought closer to the upper mold 162 to which the product to be molded is attached. Also, the pressure reducing operation in the cavity is started. Then, the mold is clamped at a predetermined timing, and the molded product is compression-molded using the preliminary fusion resin 106 to perform resin sealing.

  As described above, since the resin put into the mold 160 at the time of resin sealing is the flat plate-shaped preliminary fusion resin 106, it is possible to prevent the resin particles from being scattered during conveyance to the mold 160.

  Further, since the cooling step is not required after the preliminary molding of the preliminary fusion resin 106, the preliminary fusion resin 106 can be put into the mold 160 for compression molding in a heated state. For this reason, compared with the case where the granular resin 102 is used as it is, the heating time (temperature rising time) of the preliminary fusion resin 106 in the resin sealing step can be shortened. Referring to FIG. 4, when the granular resin 102 is used as it is (graph of broken line C), when it is put into the mold 160 (TM1), the granular resin 102 is at room temperature TP1. In addition, since the heat conduction is not good, the temperature rise is slow, and time TM3 is required to reach the molding temperature TP3. In contrast, in the present embodiment, as shown in the solid line A graph, when the preliminary fusion resin 106 is introduced into the mold 160 (TM1), since the temperature TP2 is equal to or higher than the room temperature TP1, the time TM3 The resin temperature can be set to a molding temperature TP3 suitable for compression molding in a shorter time TM2.

  In addition, the graph of the dashed-dotted line B of FIG. 4 is the case of the preforming resin shape | molded using the compression process. In this case, the heat conduction is better than that of the preliminary fusion resin 106 of the present embodiment. However, the preformed resin is once returned to room temperature because the preformed resin is peeled off from the release film 116. Therefore, it will heat from room temperature TP1. For this reason, it is considered that there is not much difference between the heating time and the case of using the preliminary fusion resin 106 of the present embodiment, but the present embodiment does not have a cooling process or a peeling process, and therefore has a compression process. Compared with the case of the preformed resin to be molded, it is possible to accelerate the speed of the resin sealing operation including the step of temporarily molding the preliminary fusion resin 106.

  In the present embodiment, the resin particles of the granular resin 102 are softened using the hot plate 128 so that the resin particles can be fused with each other (a state of the semi-fused resin 104). Then, the air discharge mechanism 130 is used to press the semi-fusing resin 104 without causing contact with the surface of the particulate resin 102 on the side of the releasable film and to shrink the resin particles in the thickness direction. The preliminarily fused resin 106 applied is temporarily molded. That is, by using the hot plate 128 and the air discharge mechanism 130, the resin particles of the particulate resin 102 that can be fused can be reliably bonded and contracted, so that an empty layer serving as a heat insulating layer between the resin particles can be obtained. It is possible to improve the thermal conductivity by reducing the number of holes and the hole size. By improving the thermal conductivity, the temperature rise time until the molding temperature is reached in the resin sealing step is shortened, so that the productivity of the molded product can be improved.

  Further, since the preliminary fusion resin 106 is temporarily formed, the air discharge mechanism 130 does not take a form of compressing the releasable film side of the semi-fusion resin 104 with a pressing means using a tangible object. It is possible to prevent time loss and resin loss associated with resin sticking during shrinkage, and at the same time, use of a large number of members for preventing resin sticking can be omitted. Since the air discharge mechanism 130 is provided as the non-contact shrinking means, the semi-fused resin 104 is pressurized by simply blowing compressed air, so that the configuration of the non-contact shrinking means can be simplified and a corresponding addition can be made. A pressure / shrinkage effect can be obtained.

  Further, since the release film 116 is also used, it is not necessary to peel the preliminary fusion resin 106 from the release film 116. For this reason, even if the preliminary fusion resin 106 is thin, it is possible to prevent the resin from being cracked or chipped. In other words, even when the molding thickness of the molded product is reduced, it can be easily handled, and the measurement error of the resin can be minimized by the preliminary fused portion 112 and the compression molded portion 114. Is possible. At the same time, there is no cooling process or peeling process, and the apparatus used and man-hours can be reduced. At the same time, the amount of the expensive release film 116 used can be reduced, and the speed of the resin sealing operation and the reduction of the running cost can be promoted while having a simple configuration of the hot plate 128 and the air discharge mechanism 130. Can do.

  Further, a release film supply device 118 for supplying a continuous release film 116 to the mold 160 including a position where the hot plate 128 and the air discharge mechanism 130 of the preliminary fusion part 112 are disposed is provided. Therefore, the process from placing the granular resin 102 on the release film 116 to sealing the resin can be performed with the same transport function of feeding the release film 116 with the roller 124. For this reason, there is no waste in the conveyance control and operation, and the speeding up of the resin sealing work can be further promoted. At the same time, recovery of the release film 116 after resin sealing is easy because the recovery roll 122 is used, and the occupied space for it can be made compact. Further, since there is no work of cutting the release film 116, the generation of dust accompanying the cutting can be reduced, and the possibility of the dust being mixed can be reduced.

  Further, since the hot plate 128 is disposed below the release film 116, the degree of softening of the resin particles of the granular resin 102 on the release film side is large, so that the preliminary fusion resin 106 The number of holes and the hole size on the release film side can be reduced as compared with the reverse release film side. That is, many pores remain on the surface side (reverse release film side) of the preliminary fusion resin 106. For this reason, in the resin sealing step, air existing in the voids of the preliminary fusion resin 106 into the cavity space of the mold 160 can be easily escaped, and voids or the like are formed on the resin-sealed molded product. Can be efficiently prevented (improvement of yield and quality).

  In other words, according to the present embodiment, the granular resin 102 is preliminarily molded into the preliminary fusion resin 106 which is a form in which heat is easily transmitted, so that the resin sealing device 100 can maintain the resin sealing quality. It is possible to increase the speed of the resin sealing operation, in other words, to improve and improve the throughput of manufacturing a resin-sealed molded product.

  Next, a second embodiment of the present invention will be described with reference to FIG.

  This embodiment is different from the first embodiment in that two heating means are used, and the other parts are the same. Therefore, the last two digits are the same and the description is omitted.

  In this embodiment, in addition to the hot plate 228, an infrared heater 242 as a heating means is provided so as to surround the periphery of the discharge port 240 of the air discharge mechanism 230 on the side of the releasable film.

  Hereinafter, the preliminary molding process of the preliminary fusion resin will be described.

  First, the raw material feeder 226 is brought close to the release film 216 on the hot plate 228. Then, the granular resin 202 is dropped from the supply port 226A and placed on the release film 216 on the hot plate 228 (FIG. 5A).

  The temperature of the hot plate 228 is raised to a temperature (about 100 degrees) at which the resin particles of the granular resin 202 are softened and can be fused to each other. The granular resin 202 dropped from H.226 is heated. At the position facing the raw material feeder 226, the dropped granular resin 202 is softened and heated to a state where it can be fused to each other (a state of the semi-fused resin 204) (FIG. 5B).

  Next, the raw material supply machine 226 is separated from the release film 216 together with the frame 226B.

  Next, the release film 216 is moved to the compression molding unit side on the hot plate 228 by the release film supply device so that the semi-fused resin 204 is opposed to the air discharge mechanism 230 (FIG. 5C). At the same time, the infrared heater 242 disposed around the discharge port 240 of the air discharge mechanism 230 also faces the semi-fused resin 204. Compressed air is blown onto the semi-fused resin 204 from the discharge port 240 to pressurize and shrink the semi-fused resin 204. In the present embodiment, the surface of the semi-fusing resin 204 on the side of the releasable film is further heated by the infrared heater 242. For this reason, the resin particles on the side of the releasable film of the semi-fused resin 204 can also be in a sufficiently softened state, and many softened resin particles are crushed by the pressurization of compressed air, and the softened resin Ensure that the particles are fused together. That is, the semi-fused resin 204 originally in the form of a particle-shaped aggregate was shrunk in the thickness direction by the resin particles being crushed by the air discharge mechanism 230 to reduce the number of holes and the size of the holes. Temporarily molded into a preliminary fusing resin 206 in the form.

  Next, without providing a cooling time (step), the preliminary fusion resin 206 is preliminarily moved while the release film supply device is moved and the preliminary fusion resin 206 is adhered to the release film 216. It is moved from a predetermined location of the fused portion to a predetermined location of the compression molding portion (FIG. 5D).

  In this embodiment, the hot plate 228 and the infrared heater 242 which are heating means are respectively disposed on the lower side and the releasable film side of the release film 216, and the granular resin 202 is heated by the two heating means. Between both sides to heat both sides. For this reason, the preliminary fusion resin 206 can be temporarily formed as compared with the first embodiment. Further, since many resin particles are softened even on the surface of the semi-fusing resin 204 on the side of the releasable film, the resin can be fused, so that the number of pores and the pore size of the preliminary fusion resin 206 are further increased. Less heat conductivity can be improved. For this reason, the temperature rise of the preliminary fusion resin 206 can be further accelerated in the resin sealing step. That is, the resin sealing operation can be further speeded up as compared with the first embodiment.

  Note that the heating means used here is not limited to the infrared heater 242, and the compressed air itself blown from the microwave or the discharge port 240 may be hot air. Further, an infrared heater may be provided separately from the air discharge mechanism 230, and the infrared heater may be operated before the operation of the air discharge mechanism 230.

  In the first and second embodiments, the air discharge mechanisms 130 and 230 that are non-contact shrinking means are arranged in parallel to the raw material supply machines 126 and 226, but the present invention is not limited to this. For example, the air discharge mechanism may be moved to the position of the raw material supplier without moving the release film after the raw material supplier is separated from the release film. In that case, the width of the resin sealing device can be made compact because the air discharge mechanisms are not arranged in parallel.

  Next, a third embodiment of the present invention will be described with reference to FIG.

  This embodiment is different from the first and second embodiments by providing a sealing mechanism 344 and a pressure raising mechanism 345 as non-contact contraction means, and the other parts are the same, so the last two digits are the same. The description is omitted.

  In this embodiment, the pressure in the space sealed by the sealing mechanism 344 and the sealing mechanism 344 that seals the predetermined area where the granular resin 302 is dropped to the preliminary fused portion with the release film 316 is applied. And a pressure raising mechanism 345 for increasing the pressure. The sealing mechanism 344 is specifically a bell jar or the like having a bottomed cylinder upside down, and the pressure raising mechanism 345 is specifically a compressor or the like.

  Hereinafter, the preliminary molding process of the preliminary fusion resin will be described.

  First, the raw material supplier 326 is brought close to the release film 316 on the hot plate 328. Then, the granular resin 302 is dropped from the supply port 326A and placed on the release film 316 on the hot plate 328 (FIG. 6A).

  The temperature of the hot plate 328 is raised to a temperature (about 100 degrees) at which the resin particles of the granular resin 302 are softened and can be fused to each other. The granular resin 302 dropped from 326 is heated. At the position facing the raw material supply unit 326, the dropped granular resin 302 is softened and heated to a state where it can be fused to each other (a state of the semi-fused resin 304) (FIG. 6B).

  Next, the raw material supplier 326 is separated from the release film 316 together with the frame 326B.

  Next, the release film 316 is moved to the compression molding unit side on the hot plate 328 by the release film supply device. Then, the sealing mechanism 344 disposed opposite to the hot plate 328 is disposed in close contact with the release film 316 to seal the semi-fused resin 304 (FIG. 6C). A pressure raising mechanism 345 communicates with the sealing mechanism 344. Compressed air is sent from the pressure raising mechanism 345 into the sealing mechanism 344 to pressurize and contract the semi-fused resin 304. The method of sending the compressed air at this time may be pulsed or may be changed in an analog manner. Because of the sealing with the sealing mechanism 344, the movement of the release film 316 is stopped while the semi-fusion resin 304 on the release film 316 is sealed. The softened resin particles are crushed by pressurization of the compressed air, and the softened resin particles are reliably fused. For this reason, the semi-fused resin 304 originally in the form of a particle-shaped aggregate is crushed by the compressed air introduced into the sealing mechanism 344 by the pressure increase mechanism 345, and the number of holes and the size of the holes are reduced. Is reduced, and is preliminarily molded into the preliminary fusion resin 306 in a form contracted in the thickness direction.

  Next, the sealing mechanism 344 is separated from the release film 316. Then, without providing a cooling time (process), the preliminary fusion resin 306 is preliminarily melted while the release film supply device is moved and the preliminary fusion resin 306 is adhered to the release film 316. It is moved from a predetermined location of the landing portion to a predetermined location of the compression molding portion (FIG. 6D).

  In this embodiment, since the semi-fusing resin 304 is pressurized with compressed air from the pressure raising mechanism 345, the sealing quality by the sealing mechanism 344 is not necessarily high. For this reason, the sealing mechanism 344 can be configured simply. Further, since the pressurizing condition depends on the pressure of the compressed air, it can be easily adjusted.

  In the present embodiment, the semi-fusing resin 304 is pressurized and contracted by increasing the pressure in the sealing mechanism 344. Since this pressurization is a constant pressure within the sealing mechanism 344, a uniform preliminary fusing resin 306 can be preliminarily molded with good reproducibility in the direction of the release film, that is, the direction perpendicular to the thickness direction.

  Next, a fourth embodiment of the present invention will be described with reference to FIG.

  This embodiment differs from the third embodiment in that it is a non-contact contraction means that uses an air decompression mechanism 447 instead of the pressure increase mechanism 345, and the rest is the same, so the last two digits are the same. The description is omitted.

  In this embodiment, the pressure in the space sealed by the sealing mechanism 444 and the sealing mechanism 444 that seals a predetermined area where the granular resin 402 is dropped to the preliminary fused portion with the release film 416 is applied. And an air decompression mechanism 447 for decompressing. The sealing mechanism 444 is specifically a bell jar with a bottomed cylinder upside down, and the air decompression mechanism 447 is specifically a vacuum pump or the like.

  Hereinafter, the preliminary molding process of the preliminary fusion resin will be described.

  First, the raw material supplier 426 is brought close to the release film 416 on the hot plate 428. Then, the granular resin 402 is dropped from the supply port 426A and placed on the release film 416 on the hot plate 428 (FIG. 7A).

  The temperature of the hot plate 428 is raised to a temperature (about 100 degrees) at which the resin particles of the granular resin 402 are softened and can be fused to each other, and the raw material feeder is provided via the release film 416. The granular resin 402 dropped from 426 is heated. At the position facing the raw material supply unit 426, the dropped granular resin 402 is softened and heated to a state where it can be fused to each other (a state of the semi-fused resin 404) (FIG. 7B).

  Next, the raw material supply machine 426 is separated from the release film 416 together with the frame 426B.

  Next, the release film 416 is moved to the compression molding unit side on the hot plate 428 by the release film supply device. Then, the sealing mechanism 444 disposed opposite to the hot plate 428 is disposed in close contact with the release film 416 to seal the semi-fused resin 404 (FIG. 7C). An air decompression mechanism 447 communicates with the sealing mechanism 444. The inside of the sealing mechanism 444 is decompressed by the air decompression mechanism 447. Then, by returning the pressure from the reduced pressure state to the atmospheric pressure, the semi-fused resin 104 is pressurized and contracted (that is, the pressure difference between the pressure in the reduced pressure state and the atmospheric pressure becomes the pressurization amount). Due to the sealing with the sealing mechanism 444, the movement of the release film 416 is stopped while the semi-fused resin 404 on the release film 416 is sealed. The softened resin particles are crushed by the pressurization caused by the return to the atmospheric pressure, and the softened resin particles are reliably fused. For this reason, the semi-fused resin 404 originally in the form of a particle-shaped aggregate is reduced in the number of pores and the size of the pores by the resin particles being crushed by returning to the atmospheric pressure introduced into the sealing mechanism 444. Then, it is temporarily molded into the preliminary fusing resin 406 in a form contracted in the thickness direction.

  Next, the sealing mechanism 444 is separated from the release film 416. Then, without providing a cooling time (process), the preliminary fusion resin 406 is preliminarily melted while the release film supply device is moved and the preliminary fusion resin 406 is adhered to the release film 416. It is moved from a predetermined location of the landing portion to a predetermined location of the compression molding portion (FIG. 7D).

  In the present embodiment, after the pressure inside the sealing mechanism 444 is reduced, the pressure is increased by returning the pressure to the atmospheric pressure, whereby the semi-fused resin 404 is pressurized and contracted. Similar to the third embodiment, this pressurization is a constant pressure within the sealing mechanism 444, so that the uniform preliminary fusion resin 406 is reproducible in the direction of the release film, that is, the direction perpendicular to the thickness direction. Temporary molding can be performed.

  In the third and fourth embodiments, the sealing mechanisms 344 and 444 are arranged after the material supply machines 326 and 426 are separated from each other, but the present invention is not limited to this. For example, the supply port and the frame of the raw material supplier may be incorporated into the sealing mechanism from the beginning.

  Next, a fifth embodiment of the present invention will be described with reference to FIG.

  This embodiment differs from the first to fourth embodiments in that the vibration mechanism 548 is arranged as a non-contact contracting means at the lower part of the hot plate 528, and other than that is the same. The description is omitted.

  Hereinafter, the preliminary molding process of the preliminary fusion resin will be described.

  First, the raw material feeder 526 is brought close to the release film 516 on the hot plate 528. Then, the granular resin 502 is dropped from the supply port 526A and placed on the release film 516 on the hot plate 528 (FIG. 8A).

  The temperature of the hot plate 528 is raised to a temperature (about 100 degrees) at which the resin particles of the granular resin 502 are softened and can be fused to each other. The granular resin 502 dropped from 526 is heated. At the position facing the raw material feeder 526, the dropped granular resin 502 is softened and heated to a state where it can be fused (a state of the semi-fused resin 504) (FIG. 8B).

  Next, the raw material supply machine 526 is separated from the release film 516 together with the frame 526B.

  Next, the vibration mechanism 548 disposed below the hot plate 528 is operated. The vibration generated by the vibration mechanism 548 is transmitted to the semi-fused resin 504 through the hot plate 528 and the release film 516. Since an inertial force corresponding to the acceleration due to the vibration acts in the direction opposite to the vibration direction, a shear force is generated inside the resin particles of the semi-fused resin 504. For this reason, the discharge | emission of the void | hole in the semi-fusion resin 504 (a reduction | decrease in the number of void | holes and a void | hole size) is promoted, and the softened resin particle is fuse | fused reliably. For this reason, the semi-fused resin 504 originally in the form of a particle-shaped aggregate is shrunk in the thickness direction due to the resin particles being crushed by the vibration of the vibration mechanism 548 to reduce the number of holes and the size of the holes. Temporary molding is performed on the preliminarily fused resin 506 in the formed form.

  Next, the vibration mechanism 548 is stopped, and without providing a cooling time (step), the release film supply device is moved and the preliminary fusion resin 506 is attached to the release film 516, and the preliminary The fusion resin 506 is moved from a predetermined location of the preliminary fusion portion to a predetermined location of the compression molding portion (FIG. 8D).

  In the present embodiment, the pressurizing condition can be easily adjusted by adjusting the vibration condition.

  Further, in the present embodiment, the vibration is uniformly applied to the entire release film 516, so that there is no attenuation. For this reason, by generating a shear force inside the semi-fusion resin 504, it is possible to promote the discharge of holes (reduction in the number of holes and the size of the holes) and contribute to the shrinkage of the entire semi-fusion resin 504. it can. That is, the uniform preliminary fusion resin 506 can be temporarily formed with a relatively simple configuration. Note that the vibration mechanism 548 may be operated before the state of the semi-fused resin 504 is reached. It is also possible to make the thickness of the dropped granular resin 502 even more uniform by adjusting the magnitude and timing of vibration. Although FIG. 8 shows horizontal and vertical vibrations, any vibration direction may be used.

  In the present embodiment, the vibration mechanism 548 is disposed below the hot plate 528, but the present invention is not limited to this. For example, the vibration mechanism may be arranged on the side of the hot plate and vibrated from the side via the hot plate, or the vibration mechanism may be brought into contact with the release film without using the hot plate. Alternatively, a vibration mechanism may be arranged above the release film to vibrate the semi-fused resin directly through the gap.

  In the third to fifth embodiments, the hot plates 328, 428, and 528, which are heating means, are disposed only below the release films 316, 416, and 516, but the present invention is not limited to this. For example, as shown in the second embodiment, a heating unit may be further provided on the side of the releasable film. In that case, as described in the second embodiment, a preliminary fusion resin having better thermal conductivity can be formed, and the resin sealing operation can be further speeded up.

  Further, the vibration mechanism 548 of the present embodiment may be combined with the non-contact shrinking means shown in the first to fourth embodiments. In that case, the resin sealing operation can be further speeded up.

  Next, a sixth embodiment of the present invention will be described with reference to FIG.

  The present embodiment is different from the first embodiment in that an individual release film 616 is used, and the other portions are the same. Therefore, the last two digits are the same, and the description is omitted.

  In this embodiment, the preliminarily fused part 612 and the compression molding part 614 are used in a state where the release film 616 is separated into pieces. For this reason, compared with the case of the release film supplied with a roll, a bigger freedom degree can be taken in arrangement | positioning with the preliminary fusion bonding part 612 and the compression molding part 614. FIG. In addition, it is easy to use a plurality of the preliminary fusion parts 612 and the compression molding parts 614. Furthermore, since it is possible to reduce the area on which the particulate resin or the like is not placed as compared with the case where the release film is supplied by a roll, the release film 616 can be used without waste. At the same time, the resin sealing device can be prevented from becoming large.

  In the present embodiment, the air discharge mechanism 630 is used as the non-contact contraction means. However, the present invention is not limited to this, and the non-contact contraction means shown in the second to fifth aspects can also be used.

  Although the present invention has been described with reference to the above embodiment, the present invention is not limited to the above embodiment. That is, it goes without saying that improvements and design changes can be made without departing from the scope of the present invention.

  For example, each of the above embodiments has been described as a separate invention. However, the present invention is not limited to this, and any component of the first to sixth embodiments can be combined as appropriate.

  Moreover, in the said embodiment, although it did not demonstrate in particular as a granular resin, the said resin may be a powder form, a granular form, and a small diameter tablet may be sufficient as it. Alternatively, a mixture thereof may be used.

  Moreover, in the said embodiment, although granular resin was heated from the bottom of a release film, this invention is not limited to this, A heating means is arrange | positioned at the reverse release film side and on a release film. You may heat from only on granular resin. In this case, since the number of pores can be reduced on the surface of the releasable film side of the preliminary fusing resin that hardly transfers heat even in the cavity, the preliminary fusing resin is quickly heated in the compression molding portion. be able to. At the same time, since the degree of softening of the resin particles of the granular resin on the side of the release film can be increased, more resin particles of the granular resin on the side of the release film can be fused. For this reason, even if the pressurization / shrinkage by the non-contact shrinking means is rapid, it is possible to effectively prevent the resin particles of the granular resin from scattering.

DESCRIPTION OF SYMBOLS 100 ... Resin sealing apparatus 102, 202, 302, 402, 502, 602 ... Granular resin 104, 204, 304, 404, 504, 604 ... Semi-fusion resin 106, 206, 306, 406, 506, 606 ... Preliminary fusion resin 112, 612 ... Preliminary fusion part 114, 614 ... Compression molding part 116, 216, 316, 416, 516, 616 ... Release film 118 ... Release film supply device 120 ... Supply roll 122 ... Collection roll 124 ... Rollers 126, 226, 326, 426, 526, 626 ... Raw material feeders 126A, 226A, 326A, 426A, 526A ... Supply ports 126B, 226B, 326B, 426B, 526B ... Frames 126BB, 226BB, 326BB, 426BB 526BB ... concave portion 128, 228, 328, 428, 5 8, 628 ... Hot plate 130, 230 ... Air discharge mechanism 132, 345 ... Compressor, pressure increase mechanism 140, 240 ... Discharge port 150, 650 ... Compression molding machine 152, 652 ... Main body 154, 654 ... Tie 156, 656 ... Fixed Platen 158, 658 ... Movable platen 160 ... Mold 162, 662 ... Upper die 164, 664 ... Lower die 242 ... Infrared heater 344, 444 ... Sealing mechanism 447 ... Vacuum pump 548 ... Vibration mechanism

Claims (9)

A resin sealing device for sealing a molded product with a mold using a granular resin,
Heating means for softening the granular resin on the release film;
Non-contact shrinkage in which a preliminary fusion resin is temporarily formed by shrinking the softened granular resin in a state where voids are provided without contacting the surface of the particulate resin on the side of the releasable film. Means, and
The preliminary fusion resin is put into the mold together with the release film, and the release film is also used for resin sealing,
The non-contact shrinking means includes a vibration mechanism for vibrating the softened granular resin. In claim 1, further comprising:
A resin sealing device, comprising: a release film supply device that supplies the continuous release film to the mold including a position where the heating unit and the non-contact shrinking unit are disposed. In claim 1 or 2,
The resin sealing device, wherein the heating means is disposed below the release film. In any one of Claims 1 thru | or 3,
The non-contact shrinking means includes an air discharge mechanism that blows compressed air onto the surface of the softened granular resin on the side of the releasable film. In any one of Claims 1 thru | or 3,
The non-contact shrinking means includes a sealing mechanism that seals the softened granular resin with the release film, and a pressure increase mechanism that increases the pressure in the space sealed by the sealing mechanism. A resin sealing device. In any one of Claims 1 thru | or 3,
The non-contact shrinking means includes a sealing mechanism that seals the softened granular resin with the release film, and an air decompression mechanism that decompresses the space sealed by the sealing mechanism. Resin sealing device. A resin sealing device for sealing a molded product with a mold using a granular resin,
  Heating means for softening the granular resin on the release film;
  Non-contact shrinkage in which a preliminary fusion resin is temporarily formed by shrinking the softened granular resin in a state where voids are provided without contacting the surface of the particulate resin on the side of the releasable film. Means, and
  The preliminary fusion resin is put into the mold together with the release film, and the release film is also used for resin sealing,
The non-contact shrinking means includes an air discharge mechanism for blowing compressed air onto the surface of the softened granular resin on the side of the releasable film.
  A resin sealing device characterized by that. A resin sealing device for sealing a molded product with a mold using a granular resin,
  Heating means for softening the granular resin on the release film;
  Non-contact shrinkage in which a preliminary fusion resin is temporarily formed by shrinking the softened granular resin in a state where voids are provided without contacting the surface of the particulate resin on the side of the releasable film. Means, and
  The preliminary fusion resin is put into the mold together with the release film, and the release film is also used for resin sealing,
  The non-contact shrinking means includes a sealing mechanism that seals the softened granular resin with the release film, and a pressure increase mechanism that increases the pressure in the space sealed by the sealing mechanism.
  A resin sealing device characterized by that. A resin sealing method for resin-sealing a molded product using a granular resin,
A step of softening the granular resin on a release film;
In powder or granular material like state in which a gap without contacting the surface of the anti-release film side of the resin, is preliminarily molded the precautionary fused resin is contracted by the vibration of softening the granular material like resin Process,
In a state where the preliminary fusion resin is placed on the release film, the step of introducing the preliminary fusion resin into a mold for sealing the resin;
A resin sealing method comprising:

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