JP5111970B2 - Method and apparatus for producing preformed resin - Google Patents

Description

  The present invention relates to a technical field of a resin sealing device that compresses and seals a substrate on which a semiconductor chip or the like is mounted with resin.

  In recent years, as a device for sealing a product such as a semiconductor chip with a resin, a demand for a so-called compression type resin sealing device is increasing. As such a compression type resin sealing device, a resin sealing device disclosed in Patent Document 1 is known. The resin sealing device described in Patent Document 1 includes a compression mold including an upper mold and a lower mold. Further, a press is connected to the lower mold, and the lower mold can be brought into contact with and separated from the upper mold at a predetermined timing. The lower mold is configured to include a frame-shaped mold having a through hole and a compression mold that is fitted and disposed in the through hole, and a part of an opposing surface (upper mold side surface) of the lower mold The molded product is compression-sealed with resin in the cavity formed in the above.

  In a resin sealing device equipped with such a compression molding die, prior to charging into the compression molding die, a powdery or granular resin is preliminarily molded (pre-molding, tableting) according to the shape of the cavity. The above approach may be taken. The purpose of this is to minimize the flow of the resin during compression by matching the shape of the resin to be added in advance with the shape of the cavity. In addition, if the resin is in powder or granular form, heat may not be transferred to the inside or unevenness may occur.However, pre-molding makes the heat transfer uniform and quick as a whole when sealing the resin. This is because the resin can be melted.

  An apparatus and a method for performing such preforming are disclosed in Patent Document 2. The apparatus shown in Patent Document 2 is schematically shown in FIG. 10, and the configuration and operation will be briefly described.

  The pre-molding unit 200 is intended to preform in advance the resin 300 supplied from the resin supply mechanism 100 in accordance with the shape of the cavity of a resin sealing device (not shown). The pre-molding unit 200 includes a tableting press 202 provided with a heater (not shown), and a cooling unit 204 disposed adjacent to the tableting press 202. The film 206 is engaged with the first roller 208A, the second roller 208B, and the driving roller 210. The drive roller 210 is movable in the horizontal direction (left and right direction in FIG. 10). As a result, the driving roller 210 can enter between the tableting press 202 and the cooling unit 204 in a state where the mold is opened.

  As shown in FIG. 10A, a powdery or granular resin 300 is supplied onto the film 206 from the resin supply mechanism 100 via the shooter 112 (this resin 300 supplied on the film 206 first will be described. Therefore, the first resin 300A is used.) Thereafter, the drive roller 210 moves to the pre-molding unit 200 side (right side in FIG. 10). Thereby, as shown in FIG. 10B, the first resin 300A moves to the position of the tableting press 202, and the tableting press 202 has a predetermined shape (for example, the shape of the cavity of the resin sealing device). (Plate shape similar to the above) is compressed (preliminarily molded). During this time, another resin 300 is supplied onto the film 206 from the resin supply mechanism 100 (the resin 300 supplied here is referred to as a second resin 300B).

  Thereafter, as shown in FIGS. 10C to 10D, the first and second resins 300A and 300B are sequentially tableted and cooled while being covered up and down by the film 206. When the cooling of the second resin 300B is completed, the driving roller 210 horizontally moves again as shown in FIG. As a result, the envelope of the film 206 located above and below the first and second resins 300A and 300B is unwound and can be taken out. After that, as shown in FIGS. 10E to 10F, it is sequentially carried out by the transport mechanism 400. Thereafter, returning to FIG. 10A, the same operation is repeated. The pre-molded resin carried out by the transport mechanism is weighed for confirmation (weighing after pre-molding) again before being put into the resin sealing device (compression mold), and then transferred to the mold. It is thrown.

JP 2005-219297 A JP 2006-142673 A

  In recent years, compression-type resin sealing devices have been in a situation of being multi-pressed and speeded up in response to a request for improvement in productivity. That is, the resin sealing device (compression molding die) is in a situation where a large amount of preformed resin is required.

  However, the above-described procedure (the procedure described in Patent Document 2) cannot always meet the request. That is, since there are many “standby times” in each part such as a tableting press and a cooling unit, it is not possible to “mold a preformed resin efficiently” to meet the requirement. Specifically, referring to FIG. 10, for example, at the time of FIG. 10B, the cooling unit 204 is in a standby state until the first resin 300 </ b> A is tableted by the tableting press 202. It has become. Further, at the time of FIG. 10D, until the cooling of the second resin 300B is completed by the cooling unit 204, the tableting press 202 does not contribute to the production of the preformed resin. Further, at any time point, the resin supply mechanism 100 and the transport mechanism 400 are in a standby state.

  On the other hand, a method as shown in FIG. 11 can be adopted to eliminate such standby states of the respective parts and improve the productivity of the preformed resin. Here, the films 206 covering the resin are separated into upper and lower parts, and each of the upper and lower films 206 is supplied from the wound film supply roll 210 and simultaneously wound and collected by the film collection roll 211. If the preformed resin is continuously manufactured in this way, it is possible to reduce the waiting time of the tableting press 202 and the cooling unit 204 and to efficiently manufacture the preformed resin. However, such a method increases the cost required for the film because the film cannot be reused. In addition, since the upper and lower films are handled separately, it is difficult to synchronize the upper and lower films. In some cases, the resin is encapsulated, resulting in “deviation”, and a highly accurate preformed resin can be manufactured. Have difficulty.

  The present invention has been made to solve these problems, and enables the reuse of the film to reduce the cost required for the film and to efficiently produce an accurate preformed resin. A method and apparatus for producing a preformed resin are provided.

The present invention is a method for producing a preformed resin in which a powdery or granular resin is preformed into a predetermined shape prior to injection into a compression mold, and the powdered or granular resin is encapsulated. A film fixing step for fixing a film cut into a predetermined shape to a support, a resin supply step for supplying the powdery or granular resin onto the film fixed to the support, and the film An encapsulating process for encapsulating the powdered or granular resin supplied to the heating process, and a heating process in which the encapsulated state of the powdered or granular resin is divided into a plurality of stages through the film The above-mentioned problem is solved by manufacturing a preformed resin through a preforming step of preforming into a predetermined shape by performing the above.

  By adopting such a method, the film can be reused, and the cost required for the film can be reduced. Moreover, since the film is fixed to the support, it is easy to handle the film. Furthermore, since the resin is encapsulated while the film is fixed to the support, there is no need to synchronize the film because there is no room for “deviation” in the film encapsulating the resin.

In addition, the preforming step further includes a cooling step of cooling the resin molded into a predetermined shape by the heating, and a plurality of the supports are prepared, whereby the film fixing step, It is also possible to employ a method in which at least two of the resin supply process, the covering process, the heating process, and the cooling process proceed simultaneously.

  By adopting such a method, it becomes possible to manufacture a preformed resin using a plurality of supports (and a film fixed to the support) at the same time, and it is possible to improve production efficiency. .

  The resin supply step includes a first resin supply step for supplying an approximate amount within a final required amount range, and a second resin supply step for supplying a difference between the required amount and the approximate amount. It is also possible to adopt a method including

  Thus, by dividing the resin supply process that can be a “bottleneck” in all processes into a plurality of steps, it is possible to improve the tact time of the preformed resin. Furthermore, an approximate amount can be supplied in the first resin supply step, and "difference" can be metered over time (to the extent that it does not become a bottleneck) in the second resin supply step. It is also possible to improve resin molding accuracy (molding accuracy from the viewpoint of the amount of resin).

In addition, the heating process divided into the plurality of stages includes a first heating process in which the powdery or granular resin is thermoformed into a first shape, and the resin in the first shape is a second It is also possible to employ a method that includes a second heating step of heat forming into a shape.

  Thus, by dividing the heating process that can be a “bottleneck” in all the processes into a plurality of steps, it is possible to improve the tact time of the preformed resin. Furthermore, it is possible to perform heat forming using “molds” that are different in stages, instead of simply performing heat forming by dividing into a plurality of times. For example, in the first heating process, heat molding is performed using a “mold” in which the central portion is raised so that heat is transmitted to the central portion, and then the flat “ It is also possible to perform heat molding using a “mold”.

  Moreover, it is also possible to employ a method in which all the steps proceed simultaneously by preparing at least the number of steps of the support.

  By adopting such a method, work is always performed in all steps, and it becomes possible to maximize production efficiency.

In another aspect, the present invention is a preformed resin manufacturing apparatus that preforms a powdery or granular resin into a predetermined shape prior to being charged into a compression mold, and is cut into a predetermined shape. A film and a support capable of fixing the film, and encapsulating the powdery or granular resin with the film fixed to the support and performing heating divided into a plurality of stages it is also be understood as apparatus for producing a pre-molded resin, which comprises preformed by.

  By applying the present invention, it is possible to efficiently produce an accurate preformed resin while allowing reuse of the film.

Hereinafter, the manufacturing method of the preforming resin concerning the comparative example with respect to this invention is demonstrated in detail using an accompanying drawing. FIG. 1 is a diagram schematically illustrating a first manufacturing process example. FIG. 2 is a diagram showing the state of resin supply from the resin metering unit to the film. FIG. 3 is a schematic configuration diagram of the tray. FIG. 4A is a schematic configuration diagram of a tableting press, and FIG. 4B is a schematic configuration diagram of a cooling press.

  The manufacturing apparatus 1 measures and supplies a plurality of trays 10 as a support, a film cutter 20 that supplies a strip film 22 cut into a predetermined shape to the trays 10, and a powdery or granular resin. A possible resin metering unit 12 is provided. Further, a circulation mechanism (not shown) for appropriately circulating the tray 10 is provided.

In addition, as shown in FIG. 3, the tray (support body) 10 in the comparative example is configured such that two substantially quadrangular frames are engaged on one side. Further, the engaging portion can be turned around a fulcrum, and the tray is opened and closed by the turning.

  In the manufacturing apparatus 1, the tray (support) 10 is used in such a manner that it sequentially circulates, and a preformed resin is manufactured. According to the order of (1) to (6) shown in FIG. 1, the preformed resin is manufactured while the tray 10 circulates.

  (1) is a position corresponding to the preparation step of the tray 10, and the strip film 22 cut into a predetermined shape from the film cutter 20 is supplied and fixed to the opened tray 10. As this film, for example, a film made of a material such as PTFE is used. Of course, various other films can be used as long as they can be easily peeled off from the resin after preforming. Further, the means for fixing the strip film 22 to the tray 10 is not particularly limited.

  (2) is a position corresponding to the resin supply process, and a predetermined amount of the powdery resin 30 is supplied from the resin measurement supply unit 12 provided in the manufacturing apparatus 1. The resin 30 is supplied from the resin metering unit 12 as shown in FIG. That is, with the strip film 22 fixed to the tray 10 and with the tray 10 opened, the resin 30 measured by a predetermined amount is directly supplied from the resin measurement supply unit 12.

(3) is a position corresponding to a step in which the tray 10 is closed, and the powdered resin 30 is covered from above and below by the strip film 22 fixed to the tray 10 by the step. In the comparative example , the powder resin 30 is covered by the tray 10 that opens and closes. However, for example, the covering is realized by connecting and fixing separate physically separated trays 10 in the vertical direction. It is also possible to configure as described above.

  (4) is a position corresponding to the heating step, and the powdery resin 30 encapsulated in the strip film 22 by a tableting press (not shown in FIG. 1) is similar to a predetermined shape (for example, a cavity shape). To be shaped by heating.

  In addition, the tableting press 40 used in the said heating process is shown to FIG. 4 (A). This tableting press 40 has a heating die 42 that can be contacted / separated, and when the heating die 42 is separated, the tray 10 enters between the heating dies 42, and the heating die 42 further contacts the heating die 42. Heat-forming is performed through the strip film 22 by contacting.

  (5) is a position corresponding to a cooling process, and is a preformed resin 30P (here, already formed into a predetermined shape by thermoforming) that has been thermoformed in a heating process by a cooling press (not shown in FIG. 1). Cooling) is performed.

  In addition, the cooling press 50 used in the said cooling process is shown in FIG.4 (B). The cooling press 50 has two cooling plates 52 that can be contacted and separated at a predetermined timing. When the cooling plate 52 is separated, the tray 10 is conveyed between the cooling plates 52, and the resin is cooled via the strip film 22 by the cooling plate 52 coming into contact therewith.

  (6) is a position corresponding to the step in which the tray 10 is opened, and the covering of the preformed resin 30P by the strip film 22 is released. Thereafter, the preforming resin 30P is transported to the compression mold by a transport mechanism (not shown) and is charged.

  Thereafter, by repeating the same procedure, the preformed resin 30P is sequentially manufactured. In the tray preparation step (1), the strip film 22 is supplied only when necessary. That is, the strip film 22 is used repeatedly as long as there is no damage (breaking, dirt, etc.).

Further, in the comparative example , at least six trays 10 are used, and the six trays 10 are connected to each process (tray preparation process, resin supply process, tray closing process, heating process, cooling process, tray opening process). It is always located in the process) and is circulating sequentially. That is, each process can proceed with its own process without waiting for the end of other processes. In addition, for example, a tray may be circulated in a so-called puzzle manner by providing a vacancy in one of the six steps (that is, circulating five trays). Of course, the efficiency is deteriorated, but it is possible to circulate four or less trays.

In the comparative example , the strip film 22 is fixed to the tray 10 as a support, and the tray 10 is opened and closed to enclose the resin from above and below. By adopting such a method, the film can be reused, and the cost required for the film can be reduced. Further, since the film 22 is fixed to the tray 10, the film can be easily handled. Further, since the resin 22 is encapsulated in a state where the film 22 is fixed to the tray 10, since there is no room for “deviation” in the film 22 encapsulating the resin 30, each process is circulated. At this time, it is not necessary to synchronize the film 22.

In contrast, in the embodiment according to the present invention, for example, it is possible to employ a method as shown in FIG.

  Here, each of the resin supply process and the heating process is performed in two stages. As a result, the tray 10 is circulated in eight stages (1) to (8). Among these, (2) and (3) are resin supply steps, and (5) and (6) are heating steps.

  The resin supply process includes a first resin supply process shown as (2) and a second resin supply process shown as (3). The first resin supply step is a step of supplying an approximate amount within the range of “finally required resin amount” by the first resin metering supply unit 12A. On the other hand, the second resin supply step is a step of supplying a “difference” between the “final required resin amount” and the approximate amount supplied in the first resin supply step.

  Thus, by dividing the resin supply process that can be a “bottleneck” in all processes into two stages, it is possible to improve the tact time of the preformed resin. In other words, by aligning the time required for each process, the tray 10 can be circulated at an earlier timing, which may occur in a process with a short required time. Time) ”can be reduced. Furthermore, an approximate amount can be supplied in the first resin supply step, and "difference" can be metered over time (to the extent that it does not become a bottleneck) in the second resin supply step. It is also possible to improve resin molding accuracy (molding accuracy from the viewpoint of the amount of resin).

  In addition, the heating process is divided into a first heating process and a second heating process. Thus, by dividing the heating process that can be a “bottleneck” in all the processes into a plurality of steps, it is possible to improve the tact time of the preformed resin. In other words, by aligning the time required for each process, the tray 10 can be circulated at an earlier timing, which may occur in a process with a short required time. Time) ”can be reduced. Furthermore, it is also possible to heat by using different “molds” step by step, instead of simply dividing into a plurality of times and performing heat molding. For example, as shown in FIG. 6, in the first heating step, heat molding is performed using a “mold” 42 </ b> A whose central portion is raised in a convex shape so that heat can be transferred to the central portion of the resin. It is also possible to heat-mold again using a flat “mold” 42B so as to heat the entire resin evenly. That is, it becomes possible to improve the molding accuracy of the preformed resin.

  In the above-described embodiment, each process is performed while circulating the tray 10 in a planar manner. However, as shown in FIG. 7, it is also possible to circulate the tray by incorporating a circulation in the vertical direction. For example, as shown in FIG. 7, if the tray 10 can be circulated in the vertical direction by using an elevator mechanism in a part of the tray 10 circulation process, the installation area (footprint) of the manufacturing apparatus can be reduced. It becomes.

  In addition, as shown in FIG. 8, it is also possible to manufacture a preformed resin by connecting a plurality of trays 10 in a caterpillar shape (infinite track body shape) and sequentially rotating the connected trays 10.

  Further, as shown in FIG. 9, a plurality of trays 10 are appropriately arranged on one rotary table 60, and the rotary table 60 is rotated so that each process is performed at each position, and preformed resin. Can also be manufactured.

  In the above description, each process is performed at a different position (next stage), but there may be a process performed partially at the same position. That is, as long as excessive “standby time” is not generated in other processes, for example, a configuration in which “resin supply” and “tray closing” are performed at the same position is not excluded.

  In the above embodiment, the frame-like tray 10 is illustrated as being openable and closable as a support, but is not limited to such a configuration. As long as the strip film can be supported (for example, it can be supported to the extent that wrinkles do not occur), various configurations can be employed.

  The preformed resin can be efficiently supplied to a compression type resin sealing device (resin sealing mold) that compresses and seals a molded product on which a semiconductor chip is mounted with resin.

The figure which showed the 1st structural example of tray circulation Diagram showing the state of resin supply from the resin metering section to the film Schematic configuration diagram of the tray (A) is a schematic block diagram of a cooling press, (B) is a schematic block diagram of a tableting brace. The figure which showed the example of the 2nd manufacturing process roughly Overview of the two-stage press The figure which showed the example of the 3rd manufacturing process roughly The figure which showed the example of the 4th manufacturing process roughly The figure which showed the example of the 5th manufacturing process roughly Schematic configuration diagram of a preforming device described in Patent Document 2 Schematic configuration diagram of a preforming device using a film wound around a roll

Explanation of symbols

1 ... Production equipment (Preliminary resin production equipment)
DESCRIPTION OF SYMBOLS 10 ... Tray 12 ... Resin metering supply part 20 ... Film cutter 22 ... Strip film 30 ... Powdery resin 30P ... Preliminary molding resin 40 ... Tableting press (heating press)
50 ... Cooling press

Claims (6)

Prior to charging into a compression mold, a method for producing a preformed resin that preforms a powdery or granular resin into a predetermined shape,
A film fixing step of fixing a film cut into a predetermined shape to encapsulate the powdery or granular resin on a support;
A resin supplying step of supplying the powdery or granular resin on the film fixed to the support;
An enveloping step of encapsulating the powdery or granular resin supplied on the film;
A preforming step in which the powdered or granular resin is preformed into a predetermined shape by performing a heating process divided into a plurality of stages through the film in the encapsulated state. A method for producing a preformed resin. In claim 1,
The preforming step further comprises:
Cooling the resin molded into a predetermined shape by the heating, and
And,
By preparing a plurality of the supports, at least two or more steps among the film fixing step, the resin supplying step, the covering step, the heating step, and the cooling step are simultaneously performed. Manufacturing method of resin. In claim 1 or 2,
The resin supply step includes
A first resin supply step of supplying an approximate amount within the final required amount;
A second resin supply step for supplying a difference between the required amount and the approximate amount. A method for producing a preformed resin. In any one of claims 1 to 3,
The heating process divided into the plurality of stages ,
A first heating step of thermoforming the powdery or granular resin into a first shape;
And a second heating step of heat-molding the resin having the first shape into a second shape. A method for manufacturing a preformed resin. In any of claims 2 to 4,
By preparing at least the number of steps of the support, all the steps are proceeding simultaneously. A method for producing a preformed resin. Prior to charging into a compression mold, a preformed resin manufacturing apparatus that preforms a powdery or granular resin into a predetermined shape,
A film cut into a predetermined shape;
A support capable of fixing the film,
An apparatus for producing a preformed resin, wherein the powdery or granular resin is encapsulated by a film fixed to the support, and preformed by performing heating divided into a plurality of stages .

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