JPS576714A - Apparatus for producing tablet of thermoplastic resin molding material - Google Patents

Apparatus for producing tablet of thermoplastic resin molding material

Info

Publication number
JPS576714A
JPS576714A JP8038480A JP8038480A JPS576714A JP S576714 A JPS576714 A JP S576714A JP 8038480 A JP8038480 A JP 8038480A JP 8038480 A JP8038480 A JP 8038480A JP S576714 A JPS576714 A JP S576714A
Authority
JP
Japan
Prior art keywords
mold
turn
tablet
injected
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8038480A
Other languages
Japanese (ja)
Inventor
Mamoru Toio
Tomio Takatsuka
Itsuo Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP8038480A priority Critical patent/JPS576714A/en
Publication of JPS576714A publication Critical patent/JPS576714A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

PURPOSE: To precisely control the weight of a tablet, by measuring the loaded amount of material injected into a mold by detecting the air pressure of a piston which applys back pressure to the injected material.
CONSTITUTION: The lower end of an injection cylinder 2 having a thermoplastic resin molding material feeding port 1 is tapered to form an injection nozzle 3 whose lower end surface engages slidably with the upper surface of a turn table 5. The turn-table 5 has a plurality of circulary arranged and equally spaced cylindrical molds 4 whose upper and lower ends are open. The piston 6 is inserted into each mold 4 to apply back pressure to the material injected from the nozzle 3, and is connected to an air cylinder arranged below the turn-table 5, and the amount of the tablet 8 injected into the mold is measured by detecting the air pressure within the air cylinder 7. A cylinder 9 is provided which can push down the tablet 8 in the mold 4 every time when the turn-table 5 is rotated stepwise.
COPYRIGHT: (C)1982,JPO&Japio
JP8038480A 1980-06-14 1980-06-14 Apparatus for producing tablet of thermoplastic resin molding material Pending JPS576714A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8038480A JPS576714A (en) 1980-06-14 1980-06-14 Apparatus for producing tablet of thermoplastic resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8038480A JPS576714A (en) 1980-06-14 1980-06-14 Apparatus for producing tablet of thermoplastic resin molding material

Publications (1)

Publication Number Publication Date
JPS576714A true JPS576714A (en) 1982-01-13

Family

ID=13716786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8038480A Pending JPS576714A (en) 1980-06-14 1980-06-14 Apparatus for producing tablet of thermoplastic resin molding material

Country Status (1)

Country Link
JP (1) JPS576714A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58145409A (en) * 1982-02-24 1983-08-30 Hitachi Ltd Resin tablet molder
JPS6135908A (en) * 1984-07-30 1986-02-20 Shin Etsu Chem Co Ltd Manufacture of resin tablet for sealing semiconductor
JPS61177210A (en) * 1985-02-01 1986-08-08 Shin Etsu Chem Co Ltd Manufacturing device of resin tablet for sealing semiconductor
JPH06104301A (en) * 1992-09-18 1994-04-15 Nitto Denko Corp Resin tablet for sealing semiconductor, its manufacture, and semiconductor sealing method
JP2009034887A (en) * 2007-08-01 2009-02-19 Sumitomo Heavy Ind Ltd Method and apparatus for producing preliminarily molded resin
KR101003762B1 (en) * 2010-03-05 2010-12-23 임성진 Manufacturing method of steel granule dioxidization materials and the manufacturing machine
JP2014083688A (en) * 2012-10-19 2014-05-12 Sato Seiki:Kk Resin molding apparatus and molding manufacturing equipment

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58145409A (en) * 1982-02-24 1983-08-30 Hitachi Ltd Resin tablet molder
JPS6135908A (en) * 1984-07-30 1986-02-20 Shin Etsu Chem Co Ltd Manufacture of resin tablet for sealing semiconductor
JPS61177210A (en) * 1985-02-01 1986-08-08 Shin Etsu Chem Co Ltd Manufacturing device of resin tablet for sealing semiconductor
JPH06104301A (en) * 1992-09-18 1994-04-15 Nitto Denko Corp Resin tablet for sealing semiconductor, its manufacture, and semiconductor sealing method
JP2009034887A (en) * 2007-08-01 2009-02-19 Sumitomo Heavy Ind Ltd Method and apparatus for producing preliminarily molded resin
KR101003762B1 (en) * 2010-03-05 2010-12-23 임성진 Manufacturing method of steel granule dioxidization materials and the manufacturing machine
JP2014083688A (en) * 2012-10-19 2014-05-12 Sato Seiki:Kk Resin molding apparatus and molding manufacturing equipment

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