JP2011224911A - Compression-molding device and compression-molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve productivity while minimizing increase of footprint of a compression-molding device without complicating.SOLUTION: The compression molding device 100 includes a first upper mold 130A, a second upper mold 130B, a first lower mold 144A and a second lower mold 144B, which can approach and depart relatively each other, and compresses and seals a first article 102A to be molded and a second article 102B to be molded, which are disposed in two cavities formed respectively between the paired first upper mold 130A and first lower mold 144A, and the paired second upper mold 130B and second lower mold 144B, with a first resin 104A and a second resin 104B, respectively. The first upper mold 130A and the first lower mold 144A, and the second upper mold 130B and the second lower mold 144B are disposed in a direction allowing approaching and departing, and thereby, two cavities are tandemly provided in a direction allowing approaching and departing. Servo motors 112A, 112B are respectively coupled to the first upper mold 130A and the second lower mold 144B.

Description

  The present invention relates to a compression molding apparatus and a compression molding method.

  Patent Documents 1 and 2 describe a compression molding apparatus that performs compression sealing using two cavities (Patent Document 1 shows FIGS. 8A and 8B, and Patent Document 2 shows FIG. 8C). ) Respectively). In any compression molding apparatus, two cavities are provided side by side on the lower molds 44 and 94. For this reason, when one substrate is compression-sealed with one cavity, a plurality of substrates can be compression-sealed almost simultaneously. That is, in Patent Documents 1 and 2, higher productivity can be realized as compared with a compression molding apparatus including one cavity.

JP 2007-307766 A JP 2009-1224012 A

  However, in Patent Documents 1 and 2, a plurality of cavities are planar, that is, arranged side by side. For this reason, the size of the movable platen for moving the lower molds 44 and 94 forming the cavity also increases, and the area occupied by the compression molding apparatus increases.

  In addition, due to substrate thickness error and resin amount error (when the substrate is different for each cavity), if two substrates are molded at the same time, a sealing pressure error occurs in each substrate, and the package thickness and quality after compression sealing (wire (Deformation) and the like, which may cause a compression seal failure. In order to eliminate such a phenomenon, an isobaric mechanism is required, but in that case, the compression molding apparatus becomes complicated.

  Accordingly, the present invention has been made to solve the above-described problems, and a compression molding apparatus and a compression molding capable of improving productivity without minimizing an increase in the occupation area of the compression molding apparatus and without complicating the area. It is an object to provide a method.

  The present invention has an upper mold and a lower mold that are relatively close to and away from each other, and a molded article placed in a cavity formed between the pair of the upper mold and the lower mold is used as a resin. In the compression molding apparatus that compresses and seals, a plurality of the upper mold and the lower mold are arranged in the approachable / separable direction so that a plurality of the cavities are provided in series in the approachable / separable direction. The problem is solved by connecting a drive source that moves the one in the approachable / separable direction to at least one of the upper mold and the lower mold for each cavity. Is.

  In the present invention, a plurality of pairs of upper molds and lower molds are arranged in the approachable / separable direction so that a plurality of cavities are provided in series in the approachable / separable direction. That is, the plurality of cavities are not arranged side by side (in parallel), but overlap in series in the approachable / separable direction. For this reason, compression sealing can be performed in each cavity without increasing the size of the upper mold and the lower mold. At the same time, since the cavities are not arranged in parallel, the sealing quality can be maintained while eliminating the need for an isobaric mechanism. Furthermore, a drive source is connected to only one of the upper mold and the lower mold for each cavity. That is, only one drive source is used even when both the upper and lower molds are movable in a direction in which they can approach and leave in one cavity. For this reason, compared with the case where two drive sources are used, an increase in size and a complicated control can be avoided, and a reduction in cost can be realized. That is, productivity can be improved without increasing the occupation area and without complicating the apparatus.

  Further, the compression sealing in each cavity is performed independently on one axis in a so-called approachable / separable direction. For this reason, even if a compression seal failure occurs due to a change in the amount of resin in one cavity, it can be avoided that the compression seal failure adversely affects the compression seal of other cavities.

  In addition, when two or more upper molds or lower molds constituting the cavities are driven by one drive source, the number of component parts is higher than that for each cavity. Reduction in size can realize downsizing and cost reduction.

  The upper mold includes a first upper mold and a second upper mold, the lower mold includes a first lower mold and a second lower mold, and a pair of the first upper mold and the first lower mold, and Two cavities are formed by a pair of the second upper mold and the second lower mold arranged adjacent to the lower side of the first lower mold, and the two of the first upper mold and the second lower mold are One is fixed, and the drive source is connected to the other of the first upper mold and the second lower mold, and the other directly presses the first lower mold or the second upper mold. When the first lower mold and the second upper mold are integrated and movable in the approachable / separable direction, a pressing force for compression sealing is obtained while the number of drive sources is one, It can be the same as in the case of one cavity and can be evenly applied to the two cavities. That is, since the pressing force is not increased while improving the productivity, it is possible to avoid an increase in the size of the compression molding apparatus for increasing the pressing force.

  The upper mold includes a first upper mold and a second upper mold, the lower mold includes a first lower mold and a second lower mold, and a pair of the first upper mold and the first lower mold, and Two cavities are formed by a pair of the second upper mold and the second lower mold arranged adjacent to the lower side of the first lower mold, and the first upper mold and the second lower mold are fixed. And when the first lower mold and the second upper mold are movable in directions opposite to each other in the approaching / separating direction, the second mold disposed between the cavities is arranged. The mutual reaction force can be used for the movement of the first lower mold and the second upper mold. For this reason, it is possible not to increase the pressing force while improving productivity. That is, since the pressing force can be reduced, an increase in the size of the compression molding apparatus for increasing the pressing force can be avoided. At the same time, since the two cavities do not add errors related to the movable part, compression sealing with high dimensional accuracy can be achieved.

  When all the tie bars that support two or more of the first upper mold, the first lower mold, the second upper mold, and the second lower mold are movable in the approachable / separable directions. Therefore, it is possible to avoid an increase in the size of the apparatus as compared with the case where tie bars are separately provided. Further, by increasing the diameter of the tie bar, the rigidity of the tie bar is increased, and the first upper mold, the first lower mold, the second upper mold, and the second lower mold can be moved with high accuracy.

  The upper mold includes a first upper mold and a second upper mold, the lower mold includes a first lower mold and a second lower mold, and a pair of the first upper mold and the first lower mold, and Two cavities are formed by a pair of the second upper mold and the second lower mold disposed adjacent to the lower side of the first lower mold, and the first upper mold and the second lower mold are When the first lower mold and the second upper mold are fixed in a direction in which they can approach and separate, and the first lower mold and the second upper mold are fixed, It can be a standard for compression sealing. For this reason, in the two cavities, errors relating to the movable part are not added to each other, so that compression sealing with high dimensional accuracy can be achieved. At the same time, in the portion (fixed platen) where the first lower mold and the second upper mold are fixed, the pressure applied at the time of compression sealing in the two cavities is offset in opposite directions. For this reason, the fixed platen does not need to be as rigid as the fixed platen of the compression molding apparatus having only one cavity. That is, it is possible to reduce the weight, simplify, or extend the life of the compression molding apparatus while improving productivity.

  The lower mold grips the upper mold with the upper mold and holds the outer side of the compression-sealed region of the molded product held by the upper mold, and fits in the through hole. A lower compression mold disposed in combination, and when the lower frame mold is displaced relative to the lower compression mold, the sealing with the upper mold is maintained. Before the material is compressed and sealed, the position of the molded product can be fixed by gripping (clamping). For this reason, the compression sealing defect accompanying the position shift of the area | region where the molded article is compression-sealed can be avoided. Further, since the position of the lower compression mold can be adjusted at the time of compression sealing, even if the resin amount fluctuation occurs in a specific cavity, it is possible to reduce the occurrence of defective compression sealing in that cavity. At the same time, since the sealing is maintained, leakage of the resin from the cavity can be prevented.

  The upper mold includes an upper frame mold that has a through hole and faces the lower frame mold, and an upper compression mold that is fitted to the through hole and holds the product to be molded. Even if the upper frame mold is displaced relative to the upper compression mold, if the pressure can be reduced between the lower mold and the upper frame mold, the sealed state is obtained when the lower frame mold and the upper frame mold are in contact with each other. The pressure can be reduced between the upper mold and the lower mold at an early stage. For this reason, when compression-sealing, filling of the resin into the molded product can be performed quickly and sufficiently. That is, the compression sealing process can be shortened to further reduce compression sealing defects.

  Furthermore, a lower frame drive mechanism that controls the amount of displacement of the lower frame type relative to the lower compression die is provided, and when the plurality of cavities are simultaneously compression-sealed while controlling the amount of displacement, Since the variation in the compression sealing quality can be reduced, the compression sealing quality can be improved.

  When the resin disposed in the cavity is preformed with a predetermined shape and weight, variation in the amount of resin used for compression sealing can be reduced. At the same time, the resin can be easily handled and managed.

  When the resin is disposed in the cavity with a continuous release film, the resin can be easily conveyed to the cavity, and the used release film can be easily collected.

  In addition, when the said resin is arrange | positioned in the said cavity with the release film isolate | separated in strip shape, arrangement | positioning of the conveyance means of resin can be made free. Moreover, since the excess part of a release film can be reduced as much as possible, a release film can be used effectively.

  Note that the present invention includes an upper mold and a lower mold that are relatively close to and away from each other, and a molded article that is disposed in a cavity formed between the pair of the upper mold and the lower mold. In the compression molding method of compressing and sealing with resin, the upper mold and the lower mold are arranged in series in the approachable / separable direction by arranging a plurality of pairs in the approachable / separable direction. A step of compressing and sealing a plurality of cavities from one axis direction (direction in which they can be approached and separated) by connecting a drive source to at least one of the upper mold and the lower mold for each cavity. It can also be understood as a compression molding method characterized by containing the above.

  According to the present invention, productivity can be improved without minimizing an increase in the area occupied by the compression molding apparatus and without complicating it.

The schematic diagram of the compression molding apparatus with which the example of 1st Embodiment of this invention was applied Schematic diagram showing a series of operations of the compression molding apparatus of FIG. The schematic diagram of the compression molding apparatus with which the example of 2nd Embodiment of this invention was applied Schematic diagram of a compression molding apparatus to which an example of the third embodiment of the present invention is applied. Schematic diagram showing the top view of FIG. Schematic diagram showing a series of operations of the compression molding apparatus of FIG. Schematic diagram of a compression molding apparatus to which an example of the fourth embodiment of the present invention is applied Schematic diagram showing an example of a conventional compression molding device

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic view of a compression molding apparatus to which an example of the first embodiment of the present invention is applied. The general features will be described below.

  As shown in FIG. 1, the compression molding apparatus 100 includes an upper mold (first upper mold 130A, second upper mold 130B) and a lower mold (first lower mold 144A, second lower mold 144B) that are relatively close to and away from each other. ). Therefore, the first upper mold 130A and the first lower mold 144A, the second upper mold 130B and the second lower mold 144B, which are paired, are arranged in two cavities formed between the first upper mold 130A and the first lower mold 144A. The second molded product 102B can be compressed and sealed with the first resin 104A and the second resin 104B, respectively. In the compression molding apparatus 100, the first upper mold 130A and the first lower mold 144A, and the second upper mold 130B and the second lower mold 144B are arranged in directions that can approach and separate, so that the cavity approaches / Two are provided in series in the direction in which they can be separated. A servo motor 112A as a drive source is connected to only the first upper mold 130A of the first upper mold 130A and the first lower mold 144A via the first movable platen 124A. Similarly, a servo motor 112B as a drive source is connected to only the second lower mold 144B of the second upper mold 130B and the second lower mold 144B via the second movable platen 124B. Here, the approachable / separable direction is the vertical direction in FIG. 1 and is limited to one axial direction.

  Each of the first molded product 102A and the second molded product 102B is, for example, a substrate (including a lead frame) on which a semiconductor chip is mounted. A semiconductor chip is mounted in the region to be compressed and sealed, and only the substrate exists outside the region to be compressed and sealed. The first resin 104A and the second resin 104B are preformed with a predetermined shape and weight so as to fill the region to be compressed and sealed with compression and sealing. The first release film 106A and the second release film 106B are separated in a strip shape and can be expanded and contracted. The first resin 104A and the second resin 104B are disposed in the cavity by the first release film 106A and the second release film 106B. The first release film 106A and the second release film 106B can improve the peelability from the cavity when compressed and seal and prevent cavity contamination. In the present embodiment, since the first molded product 102A and the second molded product 102B are the same, the first resin 104A and the second resin 104B are the same. However, the present invention is not limited to this, and the first molded product and the second molded product may not be the same.

  Hereinafter, the configuration will be described in detail.

  As shown in FIG. 1, the compression molding apparatus 100 is provided with two molds on the main body frame 110. The two molds are composed of a pair of a first upper mold 130A and a first lower mold 144A, and a second upper mold 130B and a second lower mold 144B.

  The first upper mold 130A and the second lower mold 144B are respectively held and movable by the first movable platen 124A and the second movable platen 124B attached to the linear guide mechanisms 122A and 122B provided on the main body frame 110. Has been. The movement amounts of the first movable platen 124A and the second movable platen 124B are controlled by ball screws 120A and 120B, respectively. The ball screws 120A and 120B are driven by servo motors 112A and 112B fixed to the main body frame 110 via pulleys 118A and 118B-timing belts 116A and 116B-pulleys 114A and 114B, respectively (vertical linear drive) ).

  On the other hand, the first lower mold 144A and the second upper mold 130B adjacent to the first lower mold 144A are attached and fixed back to back on a fixed platen 126 attached to the main body frame 110. For this reason, the first upper mold 130A and the second lower mold 144B move with respect to the first lower mold 144A and the second upper mold 130B attached to the fixed platen 126, respectively, and the mold clamping is performed at the same time. Thus, the force applied to the fixed platen 126 is canceled out.

  Next, the configuration of the first upper mold 130A and the first lower mold 144A will be described. Note that the configurations of the second upper mold 130B and the second lower mold 144B are the same as the configurations of the first upper mold 130A and the first lower mold 144A, and a description thereof will be omitted.

  As shown in FIG. 1, the first upper mold 130A includes a heat insulating plate 132A, a heater 134A, a first upper frame mold 136A, an upper spring 138A, and a first upper compression mold 140A. The heat insulating plate 132A is disposed in contact with the first movable platen 124A, and prevents the temperature of the first upper mold 130A from diffusing into the first movable platen 124A. The heater 134A heats the entire first upper mold 130A to a predetermined temperature. The first upper frame mold 136A has a through hole and faces the first lower mold 144A. 140 A of 1st upper compression mold | types are arrange | positioned by fitting to the said through-hole, and hold | maintain 102A of 1st to-be-molded articles. The first upper frame mold 136A is attached to the first upper compression mold 140A via an upper spring 138A. The first upper frame mold 136A is not limited by the first molded article 102A, even when the first molded article 102A is held by the first upper compression mold 140A, and is not limited by the first upper compression mold 140A. It is possible to move. A sealing member such as an O-ring (not shown) is provided at a portion where the first upper frame mold 136A and the first upper compression mold 140A are fitted. The first upper compression mold 140A is provided with a suction mechanism and a pressure reducing mechanism (not shown) for holding the first molded product 102A. Therefore, the first upper frame mold 136A is relatively in relation to the first upper compression mold 140A in a state in which the first upper frame mold 136A is in contact with the first lower mold 144A via the first release film 106A. Suppose that it is displaced. Even in this case, a sealed state is configured between the first upper mold 130A and the first lower mold 144A, and pressure reduction is possible.

  As shown in FIG. 1, the first lower mold 144A includes a first lower frame mold 150A, a lower spring 152A, a first lower compression mold 154A, a heater (not shown), and a heat insulating plate (not shown). The first lower frame mold 150A has a first upper compression of the first upper mold 130A outside the area to be compressed and sealed of the first molded article 102A held by the first upper compression mold 140A of the first upper mold 130A. Grip (clamp) with the mold 140A. The first lower frame mold 150A includes a through hole. The first lower compression mold 154A is fitted in the through hole. The first lower frame mold 150A is attached to the first lower compression mold 154A via a lower spring 152A. Therefore, the first lower frame mold 150A is movable with respect to the first lower compression mold 154A. A sealing member such as an O-ring (not shown) is provided at a portion where the first lower frame mold 150A and the first lower compression mold 154A are fitted. The first lower frame mold 150A is also opposed to the first upper frame mold 136A. Therefore, even when the first lower frame mold 150A is displaced relative to the first lower compression mold 154A in a state where the first lower frame mold 150A is in contact with the first upper frame mold 136A, the first lower mold The seal between 144A and the first upper mold 130A is maintained. The heater is configured to heat the entire first lower mold 144A to a predetermined temperature. The heat insulating plate 132 </ b> A is disposed in contact with the fixed platen 126 and prevents the temperature of the first lower mold 144 </ b> A from diffusing into the fixed platen 126. The first lower mold 144A is provided with a decompression mechanism (not shown) for adsorbing the first release film 106A.

  The fixed platen 126 is provided with a first lower frame drive mechanism 156A. The first lower frame drive mechanism 156A is driven by a servo motor 158A attached to the main body frame 110. Note that the force of the lower spring 152A is greater than that of the upper spring 138A. For this reason, the first lower frame drive mechanism 156A has a function of the first lower frame mold 150A relative to the first lower compression mold 154A even when the first upper frame mold 136A and the first lower frame mold 150A are in contact with each other. The amount of displacement can be controlled. The second lower frame drive mechanism 156B is attached to the second movable platen 124B together with the servo motor 158B, but the configuration thereof is the same as that of the first lower frame drive mechanism 156A, and the description thereof is omitted. .

  Next, operation | movement of the compression molding apparatus 100 is demonstrated using FIG.

  When the first upper mold 130A, the second upper mold 130B, the first lower mold 144A, and the second lower mold 144B are separated from each other, the first release film 106A and the second release film 106B are the first. It is arranged and adsorbed on the lower mold 144A and the second lower mold 144B, respectively. At this time, the upper surfaces of the first lower frame mold 150A and the second lower frame mold 150B and the first lower compression mold 154A and the second lower compression mold 154B are moved by the first lower frame drive mechanism 156A and the second lower frame drive mechanism 156B. The positions of the upper surfaces are the same. In this state, the first upper mold 130A and the first lower mold 144A, and the second upper mold 130B and the second lower mold 144B are set to a constant temperature (for example, 175 degrees) when compression-sealing (for example, 175 degrees). FIG. 2 (A)).

  Next, the first molding product 102A and the second molding product 102B are held by the first upper compression mold 140A and the second upper compression mold 140B, respectively, by a transport mechanism (not shown) (FIG. 2B). In addition, the holding | maintenance by adsorption | suction of the 1st to-be-molded product 102A and the 2nd to-be-molded product 102B may not be simultaneous.

  Next, the first resin 104A and the second resin 104B are respectively mounted on the first release film 106A and the second release film 106B by a resin transport mechanism (not shown) (FIG. 2C). The mounting of the first resin 104A and the second resin 104B is performed at the same time as much as possible in order to match the time until the resin is cured.

  Next, the first lower frame mold 150A is raised by the first lower frame drive mechanism 156A. Then, the first movable platen 124A is moved downward to bring the first upper mold 130A closer to the first lower mold 144A. Then, the first upper frame mold 136A and the first lower frame mold 150A come into contact with each other via the first release film 106A, and the first release film 106A is fixed. At the same time, the first upper mold 130A and the first lower mold 144A form a sealed state. Further, the first upper mold 130A and the first lower mold 144A are brought close to each other, and the first molded product 102A is gripped (clamped) by the first upper compression mold 140A and the first lower frame mold 150A. For this reason, the first molded article 102A is firmly fixed. Note that pressure reduction is performed between the first upper mold 130A and the first lower mold 144A.

  At the same time, the second lower frame mold 150B is raised by the second lower frame drive mechanism 156B. Then, the second movable platen 124B is moved upward in synchronization with the first movable platen 124A to bring the second lower mold 144B closer to the second upper mold 130B. Then, the second upper frame mold 136B and the second lower frame mold 150B come into contact with each other via the second release film 106B, and the second release film 106B is fixed. At the same time, the second upper mold 130B and the second lower mold 144B form a sealed state. Further, the second upper mold 130B and the second lower mold 144B are brought close to each other, and the second molded product 102B is gripped (clamped) by the second upper compression mold 140B and the second lower frame mold 150B. For this reason, the 2nd to-be-molded product 102B is fixed firmly. Note that pressure reduction is performed between the second upper mold 130B and the second lower mold 144B (FIG. 2D).

  Next, the first movable platen 124A is moved further downward to bring the first upper mold 130A closer to the first lower mold 144A. Further, the second movable platen 124B is synchronized with the first movable platen 124A, and is further moved upward to bring the second lower mold 144B closer to the second lower mold 130B. At this time, the displacement amount of the first lower frame mold 150A and the second lower frame mold 150B is controlled by the first lower frame drive mechanism 156A and the second lower frame drive mechanism 156B, respectively. Then, the pressure applied between the first upper mold 130A and the first lower mold 144A and the pressure applied between the second upper mold 130B and the second lower mold 144B are kept in the vertical direction (uniaxial) Direction) to complete the mold clamping (FIG. 2E). That is, while controlling the amount of displacement, a cavity formed between the first upper mold 130A and the first lower mold 144A and a cavity formed between the second upper mold 130B and the second lower mold 144B, At the same time, compression sealing is performed. Here, the moving direction of the first movable platen 124A and the moving direction of the second movable platen 124B are opposite to each other, and the pressure is equal. For this reason, the force applied to the stationary platen 126 is canceled in the compression sealing step.

  Next, the first movable platen 124A and the second movable platen 124B are moved away from the fixed platen 126 (FIG. 2F). Then, the first upper mold 130A and the first lower mold 144A, the second upper mold 130B and the second lower mold 144B, and the first molded product 102A and the second molded product that are compressed and sealed, are opened. 102B (simply referred to as a molded product) is taken out by a conveying device (not shown). At this time, the surface of the first lower frame mold 150A is set to the same height as the surface of the first lower compression mold 154A by the first lower frame drive mechanism 156A. For this reason, it becomes easy to take out the molded product, and the next compression sealing becomes easy. The second lower frame drive mechanism 156B performs the same operation.

  As described above, in the present embodiment, the first upper mold 130A and the first lower mold 144A, and the second upper mold 130B and the second lower mold 144B are arranged in a direction (vertical direction) in which they can approach and separate. A plurality of cavities are provided in series in a direction (vertical direction) in which they can approach and leave. In other words, the plurality of cavities are not arranged side by side (in parallel), but overlap in series in the approachable / separable direction (vertical direction). Therefore, the first upper mold 130A and the first lower mold 144A, and the second upper mold 130B and the second lower mold 144B can be compressed and sealed in each cavity without increasing the size of each. At the same time, since the cavities are not arranged in parallel, the sealing quality can be maintained while eliminating the need for an isobaric mechanism. That is, productivity can be improved without increasing the occupation area and without complicating the apparatus.

  In addition, the compression sealing in the two cavities is independently performed on one axis in a so-called direction (vertical direction). For this reason, even if a compression seal failure occurs due to a change in the amount of resin in one cavity, it can be avoided that the compression seal failure adversely affects the compression seal of other cavities.

  In addition, the first upper die 130A and the second upper die 130B are provided as the upper die, the first lower die 144A and the second lower die 144B are provided as the lower die, and a pair of the first upper die 130A and the first lower die 144A is provided. , And a pair of the second upper mold 130B and the second lower mold 144B disposed adjacent to the lower side of the first lower mold 144A to form two cavities, and the first upper mold 130A and the second lower mold The mold 144B is movable in a direction (vertical direction) in which the mold 144B can approach and leave, and the first lower mold 144A and the second upper mold 130B are fixed. Therefore, the first lower mold 144A and the second upper mold 130B can be used as a reference for compressing and sealing the first molded product 102A and the second molded product 102B. That is, the two cavities do not add errors related to the movable part to each other, so that compression sealing with high dimensional accuracy can be achieved. At the same time, in the fixed platen 126 that fixes the first lower mold 144A and the second upper mold 130B, the pressures applied during compression sealing in the two cavities are offset in opposite directions. For this reason, the fixed platen 126 does not need to be as rigid as the fixed platen of the compression molding apparatus having only one cavity. Furthermore, only the first upper mold 130A (second lower mold 144B) that constitutes the cavity is the control target. That is, the control can be easily performed as compared with the case where the fixed first lower mold (second upper mold) is moved simultaneously. In other words, the compression molding apparatus 100 can be reduced in weight, simplified, or extended in life while improving productivity.

  Further, the first lower mold 144A grips (clamps) the outside of the region to be compressed and sealed of the first molded article 102A held by the first upper mold 130A with the first upper mold 130A and has a through hole. A first lower frame mold 150A, and a first lower compression mold 154A arranged to be fitted in the through hole. And even if the first lower frame mold 150A is displaced relative to the first lower compression mold 154A, the sealing with the first upper mold 130A is maintained. Therefore, the position of the first molded product 102A can be fixed by gripping (clamping) before the first molded product 102A is compressed and sealed. That is, it is possible to avoid a compression sealing failure caused by a positional shift of the region to be compressed and sealed of the first molded product 102A. In addition, since the position of the first lower compression mold 154A can be adjusted at the time of compression sealing, even if a resin amount variation occurs in a specific cavity, the occurrence of defective compression sealing in that cavity is reduced. be able to. At the same time, since the sealing is maintained, leakage of the first resin 104A from the cavity can be prevented. These effects are also the same for the second lower mold 144B of the present embodiment.

  Further, the first upper mold 130A has a first upper frame mold 136A provided with a through hole and opposed to the first lower frame mold 150A, and is fitted and disposed in the through hole to hold the first molded product 102A. A first upper compression mold 140A. Even if the first upper frame mold 136A is displaced relative to the first upper compression mold 140A, the first upper frame mold 136A can be depressurized with the first lower mold 144A. Therefore, a sealed state can be created when the first lower frame mold 150A and the first upper frame mold 136A are in contact with each other, and a reduced pressure state is established between the first upper mold 130A and the first lower mold 144A at an early stage. It can be. That is, when the compression sealing is performed, the first resin 104A can be quickly and sufficiently filled into the first molded product 102A. That is, the compression sealing process can be shortened to further reduce compression sealing defects. These effects are also the same for the second upper mold 130B of the present embodiment.

  Further, the displacement amount of the first lower frame mold 150A relative to the first lower compression mold 154A is controlled, and the displacement amount of the second lower frame mold 150B relative to the second lower compression mold 154B is controlled. A second lower frame drive mechanism 156B that performs compression and sealing simultaneously in two cavities while controlling two displacement amounts. For this reason, since the dispersion | variation in the compression sealing quality for every cavity can be reduced, the improvement of compression sealing quality can be aimed at.

  Further, since the first resin 104A and the second resin 104B arranged in the cavity are each pre-formed with a predetermined shape and weight, fluctuations in the amount of resin used for compression sealing can be reduced. At the same time, the resin can be easily handled and managed.

  Further, the first resin 104A and the second resin 104B are disposed in the cavities by the first release film 106A and the second release film 106B, which are separated into strips, respectively. For this reason, arrangement | positioning of the conveyance means of 104 A of 1st resin and 2nd resin 104B can be made free. In addition, since the excess portions of the first release film 106A and the second release film 106B can be reduced as much as possible, the first release film 106A and the second release film 106B can be effectively used.

  That is, productivity can be improved without minimizing an increase in the occupation area of the compression molding apparatus 100 and without complicating it.

  In the present embodiment, it is not always necessary to use two cavities, and only one of the cavities can be used as appropriate.

  In the present embodiment, each of the first movable platen 124A and the second movable platen 124B is supported by the linear guide mechanism 122A and moved by a combination of the ball screws 120A and 120B and the servo motors 112A and 112B (vertical linear motion). Mold drive). For this reason, in the present embodiment, the first movable platen 124A and the second movable platen 124B can be moved with high accuracy, and high shape reproducibility of the molded product is realized. However, the present invention is not limited to this. In the present embodiment, the first lower frame drive mechanism 156A and the second lower frame drive mechanism 156B are provided, but the present invention is not limited to this. Instead of using the ball screw and the linear guide mechanism, toggle link mechanisms 222A and 222B may be used as in the second embodiment shown in FIG. 3 (vertical toggle link type drive). At that time, the first movable platen 224A and the second movable platen 224B are supported by the tie bars 210 so as to be movable by the guide portions 225A and 225B, respectively. In this case, the movement of the first movable platen 224A and the second movable platen 224B can be made faster and the distance can be increased, so that the time required for the compression sealing process can be shortened. Further, since the lower frame driving mechanism is not used, the configuration can be simplified and the cost can be reduced as compared with the first embodiment. In FIG. 3, since the other configuration is the same as that of the first embodiment, the last three digits of the reference numerals are the same and the description thereof is omitted.

  In the first embodiment, the upper mold includes the first upper mold 130A and the second upper mold 130B, the lower mold includes the first lower mold 144A and the second lower mold 144B, and the first upper mold 130A and the second upper mold 130B. Two cavities are formed by a pair of the first lower mold 144A and a pair of the second upper mold 130B and the second lower mold 144B arranged adjacent to the lower side of the first lower mold 144A, The mold 130A and the second lower mold 144B are movable in a direction (vertical direction) in which the mold 130A can approach and leave, and the first lower mold 144A and the second upper mold 130B are fixed. However, the present invention is not limited to this. For example, the first upper mold is fixed, the drive source is connected to the second lower mold via a movable platen, and the second lower mold directly presses the second upper mold to The first lower mold may be integrated, and the first lower mold, the second upper mold, and the second lower mold may be movable in directions in which the first lower mold, the second upper mold, and the second lower mold can approach and leave. A third embodiment shown in FIG. 4 will be specifically described.

  In the compression molding apparatus 300 according to the present embodiment, as shown in FIG. 4, the first upper mold 330 </ b> A is attached and fixed to a fixed platen 326. The first lower mold 344A and the second upper mold 330B are integrally attached to the first movable platen 324A, and the second lower mold 344B is attached to the second movable platen 324B. Here, since the configuration around the first movable platen 324A is different from that of the above-described embodiment, it will be described below, and for the other configurations, the last three digits of the reference numerals are the same and description thereof is omitted. FIG. 5 shows a top view of the second lower mold 344B portion.

  The first movable platen 324A is movably supported by the tie bar 320 via the guide portion 325A. Although the drive source is not connected to the first movable platen 324A, a stopper 328 is provided to prevent the first movable platen 324A from moving downward from a predetermined position. The stopper 328 enables the mold opening of the second upper mold 330A and the second lower mold 344B.

  A first lower mold 344A is provided on the first upper mold side of the first movable platen 324A. The first lower mold 344A has a first upper mold 330A that grips (clamps) the outer side of the first molded article 302A held by the upper compression mold 340A with the first upper mold 330A and includes a first through hole. A lower frame mold 350A and a first lower compression mold 354A arranged to be fitted in the through hole are provided. Of these, the first lower compression mold 352A is attached to the first movable platen 324A.

  On the other hand, a second upper mold 330B is provided on the second lower mold side of the first movable platen 324A. The second upper mold 330B includes a second upper frame mold 336B that includes a through hole and faces the second lower frame mold 350B, and a second upper mold 330B that is disposed in the through hole and that holds the second molded product 302B. An upper compression mold 340B. Among them, the second upper compression mold 340B is attached to the first movable platen 324A. A middle heater 348A is provided in the second upper mold 330B, and the first lower mold 344A and the second upper mold 330B are simultaneously maintained at the same temperature (for example, 175 degrees). The first lower frame mold 350A and the second upper frame mold 336B are directly connected by a middle spring 352A. The first lower frame mold 350A is movable with respect to the first lower compression mold 354A within a predetermined range (the second upper frame mold 336B is similar to the second upper compression mold 340B). The first movable platen 324A is not provided with a lower frame drive mechanism. Further, the relationship of the force of the upper spring 338A <the force of the middle spring 352A ≦ the force of the lower spring 352B. For this reason, even if the upper spring 338A, the middle spring 352A, and the lower spring 352B are all contracted, the amount of displacement of the second lower frame mold 350B relative to the second lower compression mold 354B by the second lower frame drive mechanism 356B is Will be controlled.

  Next, operation | movement of the compression molding apparatus 300 is demonstrated using FIG.

  When the first upper mold 330A, the second upper mold 330B, the first lower mold 344A, and the second lower mold 344B are separated from each other, the first release film 306A and the second release film 306B are the first. They are arranged and adsorbed on the lower mold 344A and the second lower mold 344B, respectively. At this time, the upper surface of the second lower frame mold 350B is located above the upper surface of the second lower compression mold 354B. Further, in this state, the first upper mold 330A, the first lower mold 344A, the second upper mold 330B, and the second lower mold 344B are set to a constant temperature (for example, 175 degrees) when compression-sealing.

  Next, the first molding product 302A and the second molding product 302B are respectively held by the first upper compression mold 340A and the second upper compression mold 340B by a transport mechanism (not shown). Note that the first molded product 302A and the second molded product 302B may not be held simultaneously by suction.

  Next, the first resin 304A and the second resin 304B are mounted on the first release film 306A and the second release film 306B by a resin transport mechanism (not shown) (FIG. 6A). The mounting of the first resin 304A and the second resin 304B is performed at the same time as much as possible in order to match the time until the resin is cured.

  Next, the second movable platen 324B connected to a drive source (not shown) is moved upward by the drive source, and the second lower die 344B is brought closer to the second upper die 330B. Then, the second upper frame mold 336B and the second lower frame mold 350B come into contact with each other via the second release film 306B, and the second release film 306B is fixed. The second upper mold 330B and the second lower mold 344B form a sealed state. At the same time, the second lower frame mold 350B pushes up the first lower frame mold 350A via the middle spring 352A. Thereafter, the second lower frame mold 350B comes into contact with the second molded product 302B and grips (clamps) the second upper compression mold 340B and the second molded product 302B. For this reason, the second molded product 302B is firmly fixed. At the same time, the first movable platen 324A starts to move upward (FIG. 6B; direct pressing).

  Next, along with the movement of the second movable platen 324B and the first movable platen 324A, the first lower frame mold 350A comes into contact with the first upper frame mold 336A via the first release film 306A (FIG. 6C )). Then, the first release film 306A is fixed, and the first upper mold 330A and the first lower mold 344A form a sealed state.

  Next, the first lower frame mold 350A comes into contact with the first molded product 302A and grips (clamps) the first upper compression mold 340A and the first molded product 302A (FIG. 6D). Therefore, the first molded product 302A is firmly fixed. Note that pressure reduction is performed between the first upper mold 330A and the first lower mold 344A, and between the second upper mold 330B and the second lower mold 344B.

  Next, the displacement amount of the first lower frame mold 350A and the second lower frame mold 350B is controlled by the second lower frame drive mechanism 356B. That is, the distance between the first molded product 302A and the first resin 304A and the distance between the second molded product 302B and the second resin 304B are made the same. Then, the movement of the second movable platen 324B is continued to complete the mold clamping of the two cavities simultaneously (FIG. 6E). That is, the cavity formed between the first upper mold 330A and the first lower mold 344A and the cavity formed between the second upper mold 330B and the second lower mold 344B while controlling the displacement amount. At the same time, compression sealing is performed from the vertical direction (uniaxial direction).

  Next, the second movable platen 324B is moved away from the fixed platen 326. Then, the first movable platen 324A is also separated from the fixed platen 326, but the movement is stopped by the stopper 328. Then, the second upper mold 330B and the second lower mold 344B are separated from each other (FIG. 6F). Then, the first molded product 302A and the second molded product 302B (simply referred to as molded products) that have been compression-sealed are taken out by a conveying device (not shown).

  As described above, in the present embodiment, the first movable platen 324A does not have a drive source, and the heater, the spring, and the lower frame drive mechanism are only the middle heater 348A, the middle spring 352B, and the second lower frame drive mechanism 356B, respectively. Have That is, the number of parts is smaller than in the above embodiment, and the cost can be reduced. In addition, the pressing force for compression sealing can be made the same as in the case of one cavity even with a single drive source, and can be equally applied to the two cavities. And compared with the case where a drive source is connected with a 1st movable platen, since there are few drive sources, the number of components can be reduced and it can be reduced in size. At the same time, in particular, control complexity can be avoided, so that cost reduction can be realized. That is, since the press force is not increased while the productivity is improved (the press force is smaller than that in the above embodiment), it is possible to avoid an increase in the size of the compression molding apparatus 300 for increasing the press force.

  In the present embodiment, the first movable platen 324A is supported by the four tie bars 320 that support the fixed platen 326 via the guide portion 325A. That is, the parallelism between the first upper mold 330A and the first lower mold 344A and the parallelism between the second upper mold 330B and the second lower mold 344B are mechanically maintained. This eliminates the need for a position sensor for measuring and adjusting the two parallelisms. The tie bar 320 is also used as the first lower mold 344A, the second upper mold 330B, and the second lower mold 344B (for all mold parts that can be moved in the approachable / separable direction). Therefore, it is possible to avoid an increase in the size of the apparatus as compared to providing a tie bar separately. Further, by increasing the diameter of the tie bar 320, the rigidity of the tie bar 320 is increased, and the first lower mold 344A, the second upper mold 330B, and the second lower mold 344B can be moved with higher accuracy. .

  In the present embodiment, the first upper mold 330A is attached and fixed to the fixed platen 326. However, the present invention is not limited to this, and the second lower mold is attached and fixed to the fixed platen. The mold may be movable in a direction in which the mold can approach and leave.

  Although the present invention has been described with reference to the above embodiment, the present invention is not limited to the above embodiment. That is, it goes without saying that improvements and design changes can be made without departing from the scope of the present invention.

  For example, in the above embodiment, the first lower mold and the second upper mold are integrated, but the present invention is not limited to this. For example, it may be as in the fourth embodiment shown in FIG. The first upper mold 430A and the second lower mold 444B are attached and fixed to different fixed platens 426A and 426B, respectively. At the same time, the first lower mold 444A and the second upper mold 430B are attached to the first movable platen 424A and the second movable platen 424B, respectively, and are movable in directions opposite to each other in directions that can be approached and separated. At that time, for example, by using the toggle link mechanism 422, the reaction force of each other can be used to move the first lower mold 444A and the second upper mold 430B disposed between the cavities. For this reason, as shown in the third embodiment, the press force can be prevented from increasing while improving the productivity. That is, although the pressing force is the same as that of the first embodiment and the second embodiment, since the number of driving sources can be made one, the enlargement of the compression molding apparatus 400 for increasing the pressing force can be avoided. At the same time, as shown in the first embodiment, the two cavities do not add errors related to the movable part to each other, so that compression sealing with high dimensional accuracy can be achieved.

  Moreover, in the said embodiment, although compression sealing was performed with two cavities by two metal mold | dies, this invention is not limited to this, You may use three or more metal mold | dies. In that case, a plurality of fixed platens may be provided, and the combination is not particularly limited.

  In the above embodiment, the first lower mold and the second lower mold are compressed and sealed by the first molded product and the second molded product held by the first upper mold and the second upper mold, respectively. A first lower frame mold and a second lower frame mold that hold the outside of the region with the first upper mold and the second upper mold and that have a through hole, and a first lower compression that is fitted and disposed in the through hole. And a second lower compression mold. Even if the first lower frame mold and the second lower frame mold are displaced relative to the first lower compression mold and the second lower compression mold, the sealing with the first upper mold and the second upper mold is maintained. However, the present invention is not limited to this configuration.

  In the above embodiment, the first upper mold and the second upper mold each have a through hole and are opposed to the first lower frame mold and the second lower frame mold, respectively. And a first upper compression mold and a second upper compression mold that are disposed in the through holes and hold the first molded article and the second molded article. Even if the first upper frame mold and the second upper frame mold are displaced relative to the first upper compression mold and the second upper compression mold, respectively, the pressure is reduced between the first lower mold and the second lower mold. Although possible, the present invention is not limited to this configuration.

  Moreover, in the said embodiment, although 1st resin and 2nd resin arrange | positioned at a cavity were each preformed by the predetermined | prescribed shape and weight, this invention is not limited to this, Powdery, granular form The resin may be a liquid resin.

  Moreover, in the said embodiment, although 1st resin and 2nd resin were each arrange | positioned in the cavity by the 1st release film and the 2nd release film which were isolate | separated into strip shape, this invention is limited to this. Not. For example, the first resin and the second resin may be arranged in the cavity with a continuous first release film and second release film, respectively. In that case, the first resin and the second resin can be easily conveyed to the cavity, and the used first release film and second release film can be easily collected. Alternatively, one may be in a strip-like state, the other may be in a continuous state, or the first release film and the second release film used in the preliminary molding of the first resin and the second resin, It may be used as it is in a strip shape or in a continuous state (that is, it is used in a state where the first resin and the second resin are attached to the first release film and the second release film). Alternatively, the first lower mold and the second lower mold do not have an adsorption mechanism, and the first release film and the second release film may not be used.

  The compression molding apparatus of the present invention can be used, for example, for applications in which a molded product such as a substrate (including a lead frame) on which a semiconductor chip is mounted is compressed and sealed with a resin.

100, 200, 300, 400 ... compression molding apparatus 102A, 202A, 302A ... first molded product 102B, 202B, 302B ... second molded product 104A, 204A, 304A ... first resin 104B, 204B, 304B ... second Resin 106A, 206A, 306A ... 1st release film 106B, 206B, 306B ... 2nd release film 110 ... Main body frame 112A, 112B, 158A, 158B, 212A, 212B ... Servo motor 114A, 114B, 118A, 118B, 214A , 214B, 218A, 218B ... pulleys 116A, 116B, 216A, 216B ... timing belts 120A, 120B ... ball screws 122A, 122B ... linear guide mechanisms 124A, 224A, 324A, 424A ... first movable platen 12 B, 224B, 324B, 424B ... second movable platen 126, 226, 326, 426A, 426B ... fixed platen 130A, 230A, 330A, 430A ... first upper mold 130B, 230B, 330B, 430B ... second upper mold 132A, 132B, 332A, 346B ... heat insulating plates 134A, 134B, 334A, 348A, 348B ... heater 136A, 336A, 444A ... first upper frame type 136B, 336B, 444B ... second upper frame type 138A, 138B, 338A, 338B ... upper Spring 140A, 340A ... First upper compression type 140B, 340B ... Second upper compression type 144A, 244A, 344A, 444A ... First lower mold 144B, 244B, 344B, 444B ... Second lower mold 150A, 350A ... First lower Frame type 150B, 350B ... second lower frame type 152 A, 152B, 352B ... lower springs 154A, 354A ... first lower compression type 154B, 354B ... second lower compression type 156A ... first lower frame drive mechanism 156B, 356B ... second lower frame drive mechanism 210, 320, 410 ... Tie bar 222A, 222B, 422 ... Toggle link mechanism 225A, 325A ... Guide portion 352A ... Intermediate spring 328 ... Stopper

Claims (13)

The upper and lower molds that can be relatively approached and separated from each other, and the molded product placed in the cavity formed between the paired upper and lower molds is compressed and sealed with resin. In the compression molding device to
By arranging a plurality of pairs of the upper mold and the lower mold in the approachable / separable direction, a plurality of the cavities are provided in series in the approachable / separable direction,
A compression molding apparatus characterized in that a drive source for moving one of the upper mold and the lower mold for each cavity in the direction in which the one can approach and leave is connected to at least one of the upper mold and the lower mold. In claim 1,
The compression molding apparatus, wherein two or more upper molds or lower molds constituting the cavities are driven by one drive source. In claim 1 or 2,
The upper mold includes a first upper mold and a second upper mold, the lower mold includes a first lower mold and a second lower mold, and a pair of the first upper mold and the first lower mold, and the first mold Forming the two cavities by a pair of the second upper mold and the second lower mold disposed adjacent to the lower side of the first lower mold;
One of the first upper mold and the second lower mold is fixed, and the drive source is connected to the other of the first upper mold and the second lower mold, and the other is the first lower mold. Alternatively, by directly pressing the second upper mold, the first lower mold and the second upper mold are integrally movable in the approachable / separable direction. . In claim 1 or 2,
The upper mold includes a first upper mold and a second upper mold, the lower mold includes a first lower mold and a second lower mold, and a pair of the first upper mold and the first lower mold, and the first mold Forming the two cavities by a pair of the second upper mold and the second lower mold disposed adjacent to the lower side of the first lower mold;
The first upper mold and the second lower mold are fixed, and the first lower mold and the second upper mold are movable in directions opposite to each other in the approachable / detachable direction. A compression molding device characterized. In claim 3 or 4,
All the tie bars that support two or more of the first upper mold, the first lower mold, the second upper mold, and the second lower mold are movable in the approachable and disengageable directions. A compression molding device. In claim 1,
The upper mold includes a first upper mold and a second upper mold, the lower mold includes a first lower mold and a second lower mold, and a pair of the first upper mold and the first lower mold, and the first mold Forming the two cavities by a pair of the second upper mold and the second lower mold disposed adjacent to the lower side of the first lower mold;
The first upper mold and the second lower mold are movable in the approaching and separating directions, and the first lower mold and the second upper mold are fixed. apparatus. In any one of Claims 1 thru | or 6.
The lower mold holds the outer side of the compression-sealed region of the molded product held by the upper mold with the upper mold and fits into the through-hole and a lower frame mold having a through-hole. A lower compression mold disposed,
A compression molding apparatus, wherein the lower frame mold is kept sealed with the upper mold even when the lower frame mold is displaced relative to the lower compression mold. In claim 7,
The upper mold includes an upper frame mold that has a through hole and is opposed to the lower frame mold, and an upper compression mold that is fitted in the through hole and holds the product to be molded.
A compression molding apparatus, wherein the upper frame mold can be depressurized with respect to the lower mold even when the upper frame mold is displaced relative to the upper compression mold. In claim 7 or 8, further
A lower frame drive mechanism for controlling the amount of displacement of the lower frame mold relative to the lower compression mold;
A compression molding apparatus, wherein the plurality of cavities are simultaneously compressed and sealed while controlling the amount of displacement. In any one of Claims 1 thru | or 9,
The compression molding apparatus, wherein the resin disposed in the cavity is preformed with a predetermined shape and weight. In any one of Claims 1 thru | or 10.
The said resin is arrange | positioned in the said cavity with the continuous release film. The compression molding apparatus characterized by the above-mentioned. In any one of Claims 1 thru | or 10.
The said resin is arrange | positioned in the said cavity with the release film isolate | separated in strip shape. The compression molding apparatus characterized by the above-mentioned. The upper and lower molds that can be relatively approached and separated from each other, and the molded product placed in the cavity formed between the paired upper and lower molds is compressed and sealed with resin. In the compression molding method to
By arranging a plurality of pairs of the upper mold and the lower mold in the approachable / separable direction, at most each of the cavities provided in series in the approachable / separable direction A compression molding method comprising a step of compressing and sealing from one axis direction by connecting a drive source to only one of the upper mold and the lower mold.

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