CN111483101B

CN111483101B - Resin molding device and method for manufacturing resin molded product

Info

Publication number: CN111483101B
Application number: CN202010009588.2A
Authority: CN
Inventors: 荒木宏祐; 谷口翔一; 西平贵则; 高井保昌; 法兼一贵
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2019-01-28
Filing date: 2020-01-06
Publication date: 2022-08-02
Anticipated expiration: 2040-01-06
Also published as: JP2020116917A; JP6785897B2; TW202027948A; CN111483101A; KR102251069B1; KR20200093429A; TWI729677B

Abstract

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product, which prevent a heat insulating member from being deformed or damaged due to deformation of a platen or the like, the resin molding apparatus including: a forming die (2, 3); a platen (41, 42) on which the molding dies (2, 3) are mounted; a plurality of heat insulating members (10) that are provided between the molding dies (2, 3) and the platen plates (41, 42), that form a space between the molding dies (2, 3) and the platen plate (41), and that transmit a mold clamping force from the platen plates (41, 42) to the molding dies (2, 3); and a fixing section (11) that fixes the molding dies (2, 3) to the platens (41, 42), and that divides the plurality of heat insulating members (10) into a first dividing element (5) provided on the molding dies (2, 3) and a second dividing element (6) provided on the platens (41, 42).

Description

Resin molding device and method for manufacturing resin molded product

Technical Field

The present invention relates to a resin molding apparatus and a method of manufacturing a resin molded product.

Background

In a resin molding apparatus using compression molding, as a technique for insulating heat between a heater (heater) for heating a molding die and a platen (platen) by interposing a heat insulating spacer between the molding die and the platen, a technique shown in patent document 1 is conceivable.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. Hei 1-297221

Disclosure of Invention

[ problems to be solved by the invention ]

In the above resin molding apparatus, a ceramic heat insulating spacer is used, but when a load in a lateral direction or a force in a tensile direction or a compressive direction is applied to the heat insulating spacer due to deformation of a platen at the time of mold clamping, the heat insulating spacer may be deformed or broken.

Therefore, the present invention has a main problem in that the heat insulating member is deformed or damaged by deformation or the like of the platen to which the molding die is attached.

[ means for solving problems ]

That is, the resin molding apparatus of the present invention includes: a forming die; a platen on which the molding die is mounted; a plurality of heat insulating members provided between the molding die and the platen, forming a space between the molding die and the platen, and transmitting a mold clamping force from the platen to the molding die; and a fixing portion that fixes the molding die with respect to the platen; and the plurality of heat insulating members are divided into a first dividing element provided on the molding die and a second dividing element provided on the platen.

[ Effect of the invention ]

According to the present invention thus constituted, it is possible to prevent the heat insulating member from being deformed or damaged due to deformation or the like of the platen to which the molding die is attached.

Drawings

Fig. 1 is a front view schematically showing the structure of a resin molding apparatus according to the present embodiment.

Fig. 2 is an enlarged sectional view of the first and second dividing elements of the embodiment.

Fig. 3 is a sectional view mainly showing the second platen and the fixed-side block of the embodiment.

Fig. 4 is an enlarged sectional view of a fixing portion of the fixing-side block of the embodiment.

Fig. 5 is an enlarged sectional view of a positioning portion of the fixed side block of the embodiment.

Fig. 6 is a sectional view mainly showing the first platen and the movable-side block of the embodiment.

Fig. 7 is a diagram showing a simulation result obtained by the configuration of the embodiment.

Fig. 8 is an enlarged sectional view of the first divisional element and the second divisional element of the modified embodiment.

Fig. 9 is an enlarged sectional view of the first divisional element and the second divisional element of the modified embodiment.

Fig. 10(a) and 10(b) are enlarged sectional views of a first divided element and a second divided element of a modified embodiment.

Fig. 11 is an enlarged sectional view of a fixing portion of a modified embodiment.

[ description of symbols ]

2: lower die (Forming die)

3: upper die (Forming die)

4: mould clamping mechanism

5: first dividing element

5 a: contact surface of first dividing element

6: second dividing element

6 a: contact surface of the second separating element

7A: fixed side block (middle block)

7B: movable side block (middle block)

7 h: through hole

7h1, 932: small diameter part

7h2, 931: large diameter part

8: fixing part

9A, 9B: positioning part

10: heat insulation member

11: fixing part

41: first bedplate (Movable plate)

42: second bedplate (Upper fixed tray)

43: driving mechanism

44: lower fixing disc

45: pillar part

46: lower die holding section (Forming die holding section)

47: upper die holding part (Forming die holding part)

81. 111: bolt

82: elastic body

83. 112, 112: distance limiting part

91. 92, 94, 95: locating hole

93. 96: locating pin

100: resin molding apparatus

111b, 811: head part

111a, 812: shaft part

431: ball screw mechanism

Detailed Description

The present invention will be described in more detail below by way of examples. However, the present invention is not limited to the following description.

As described above, the resin molding apparatus of the present invention includes: a forming die; a platen on which the molding die is mounted; a plurality of heat insulating members provided between the molding die and the platen, forming a space between the molding die and the platen, and transmitting a mold clamping force from the platen to the molding die; and a fixing portion that fixes the molding die with respect to the platen, and the plurality of heat insulating members are divided into a first dividing element provided on the molding die and a second dividing element provided on the platen.

In the resin molding apparatus, a space is formed between the molding die and the platen by the plurality of heat insulating members. The space functions as a heat insulating layer, thereby reducing heat transmitted from the molding die to the platen and suppressing heat dissipation to the outside. In particular, in the present invention, since the plurality of heat insulating members are divided into the first dividing element provided in the molding die and the second dividing element provided in the platen, even when the platen is deformed, the deformation of the platen is absorbed between the first dividing element and the second dividing element. As a result, the heat insulating member can be prevented from being deformed or damaged due to deformation or the like of the platen to which the molding die is attached. Further, by dividing the plurality of heat insulating members, the platen can be deformed relative to the molding die, and the amount of deformation of the molding die can be made smaller than the amount of deformation of the platen, and preferably the amount of deformation of the platen can be prevented from being transmitted to the molding die. As a result, the flatness of the molding die can be maintained during mold clamping. Further, when the parts need to be replaced due to wear, breakage, or the like of the first divided element or the second divided element, it is only necessary to replace at least one of the first divided element and the second divided element, and therefore, maintenance (maintenance) can be facilitated.

In a specific embodiment, a contact surface of the first dividing element with the second dividing element is a convex surface or a flat surface. In addition, the contact surface of the second dividing element with the first dividing element is a convex curved surface or a plane surface.

The resin molding apparatus may include a lower mold and an upper mold as the molding mold, and a first platen on which the lower mold is mounted and a second platen on which the upper mold is mounted as the platen.

In the above configuration, it is preferable that the plurality of heat insulating members are provided between the upper die and the second platen and between the lower die and the first platen, respectively. This reduces heat transmitted to the second platen and the first platen, and suppresses heat dissipation to the outside.

It is desirable for the resin molding apparatus to include an intermediate block provided between the molding die and the platen, and provided with the plurality of first divisional elements or the plurality of second divisional elements.

In the above configuration, the intermediate block is attached to the molding die or the platen, so that the plurality of dividing elements can be provided to the molding die or the platen at one time, and the replacement operation can be simplified.

When the forming die or the intermediate block is fixed to the platen by the bolts, the forming die or the intermediate block is deformed from the contact surface of the split member as a starting point when the fastening force is increased. Thus, the flatness of the molding die may be damaged from before the die is closed.

In order to solve the above problem, it is desirable that the fixing portion elastically holds the molding die with respect to the platen.

Since the platen can be deformed relative to the molding die by dividing the heat insulating member, the position of the molding die relative to the platen may be displaced.

Therefore, it is preferable that the resin molding apparatus includes a positioning portion which is provided further inside than the plurality of heat insulating members and which positions the platen and the molding die. In addition, the platen may be changed relative to the molding die, or the platen may be changed independently of the molding die.

In addition, a method for producing a resin molded product using the resin molding apparatus is also an aspect of the present invention.

< one embodiment of the present invention >

Hereinafter, an embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. In addition, with respect to any one of the drawings shown below, schematic description is appropriately omitted or exaggerated for easy understanding. The same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

The resin molding apparatus 100 of the present embodiment manufactures a resin molded product by sealing a component mounting surface on which an electronic component is mounted with resin with respect to a substrate on which the electronic component is mounted. Examples of the substrate include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, and a lead frame (lead frame). As the resin material, in addition to a granular or powdery resin material, a liquid, flake, chip, or the like resin material can be used.

As shown in fig. 1, the resin molding apparatus 100 includes: a lower die 2 which is a first forming die having a cavity (cavity) formed therein; an upper mold 3 which is a second molding mold for holding the substrate; and a mold clamping mechanism 4 for clamping the lower mold 2 and the upper mold 3 while attaching the lower mold 2 and the upper mold 3.

The mold clamping mechanism 4 includes: a movable platen 41 (hereinafter also referred to as a first platen 41) to which the lower mold 2 is attached, an upper fixed platen 42 (hereinafter also referred to as a second platen 42) to which the upper mold 3 is attached, and a driving mechanism 43 for moving the first platen 41 up and down.

The first platen 41 has the lower mold 2 mounted on its upper surface and is supported by a plurality of support portions 45 provided on a lower fixed platen 44 so as to be movable up and down. In the present embodiment, the first platen 41 is supported so as to be movable in a height direction by four column portions (also referred to as tie-bars) 45 provided at four corners of a rectangular lower fixed platen 44 in a plan view, for example.

The second platen 42 has the upper die 3 attached to its lower surface, and is fixed to the upper end portions of the four column portions 45 so as to face the first platen 41.

The drive mechanism 43 is provided between the first platen 41 and the lower fixed platen 44, and moves the first platen 41 up and down to clamp the lower mold 2 and the upper mold 3 and apply a predetermined clamping force (molding pressure). The drive mechanism 43 of the present embodiment is a linear motion type in which rotation of a servo motor (servo motor) or the like is converted into linear motion by using a ball screw mechanism 431 and is transmitted to the first base plate 41, but may be a link type in which a power source such as a servo motor or the like is transmitted to the first base plate 41 by using a link mechanism such as a toggle link (toggle link).

Further, a lower die holding portion 46 for holding the lower die 2 is provided between the lower die 2 and the first platen 41. The lower die holding portion 46 has a hot plate or the like for heating the lower die 2.

An upper mold holding portion 47 for holding the upper mold 3 is provided between the upper mold 3 and the second platen 42. The upper mold holding portion 47 includes a hot plate or the like for heating the upper mold 3.

In the present embodiment, a plurality of heat insulating members 10 are provided between the upper die 3 and the second platen 42, and between the lower die 2 and the first platen 41.

The plurality of heat insulating members 10 between the upper die 3 and the second platen 42 form a space between the upper die 3 and the second platen 42. Further, the plurality of heat insulating members 10 between the lower die 2 and the first platen 41 form a space between the lower die 2 and the first platen 41.

The plurality of heat insulating members 10 are divided into first dividing elements 5 provided on the upper die 3 side or the lower die 2 side and second dividing elements 6 provided on the second platen 42 or the first platen 41.

The plurality of first and

second split elements

5 and 6 between the upper die 3 and the second platen 42 transmit the mold clamping force of the drive mechanism 43 from the second platen 42 to the upper die 3. The plurality of first divided elements 5 and second divided elements 6 between the lower die 2 and the first platen 41 transmit the mold clamping force of the driving mechanism 43 from the first platen 41 to the lower die 2. The first and

second dividing elements

5 and 6 are, for example, columnar metal columns (pilars).

In the present embodiment, four first and

second dividing elements

5 and 6 are provided between each of the platen 41 and the platen 42 and each of the molding die 2 and the molding die 3 so as to correspond to the four pillar portions 45. Specifically, the vertex of the quadrangle is positioned in a plan view.

The plurality of first divided elements 5 are provided on the lower die 2 side and the upper die 3 side, and the plurality of second divided elements 6 are provided on the first platen 41 and the second platen 42 corresponding to the first divided elements 5. Further, the upper end surface of the first divisional element 5 and the lower end surface of the second divisional element 6 on the second platen 42 side form a contact surface 5a and a contact surface 6a that are in contact with each other, and the lower end surface of the first divisional element 5 and the upper end surface of the second divisional element 6 on the first platen 41 side form a contact surface 5a and a contact surface 6a that are in contact with each other. Here, the contact surface 6a is a convex curved surface.

Here, the plurality of first and second divided

elements

5 and 6 are configured to allow the first platen 41 or the second platen 42 to be deformed relative to the lower mold 2 or the upper mold 3 and to transmit the mold clamping force from the first platen 41 or the second platen 42 to the lower mold 2 or the upper mold 3.

Specifically, as shown in fig. 2, the contact surface 6a of the second divided element 6 is a convex curved surface. The contact surface 6a of the present embodiment has a spherical shape bulging toward the lower portion, and more specifically, has a spherical shape having a vertex on the central axis of the second split element 6. On the other hand, the contact surface 5a of the first divisional element 5 is planar. Accordingly, the lower die 2 is deformed by a smaller amount than the first platen 41, and the upper die 3 is deformed by a smaller amount than the second platen 42. When the effect of these configurations is most remarkable, the amount of deformation of the first platen 41 or the second platen 42 is not transmitted to the lower die 2 or the upper die 3 due to the convex curved surface-shaped contact surface 6a, the amount of deformation of the lower die 2 due to the amount of deformation of the first platen 41 becomes zero, and the amount of deformation of the upper die 3 due to the amount of deformation of the second platen 42 becomes zero.

In the present embodiment, the plurality of first divided elements 5 provided on the upper die 3 are fixed to an intermediate block 7A (hereinafter also referred to as a fixed-side block 7A). The fixed side block 7A is fixed to an upper die holding portion 47 that holds the upper die 3. Thereby, the plurality of first dividing elements 5 are provided on the upper die 3. The plurality of first divided elements 5 provided on the lower die 2 are fixed to an intermediate block 7B (hereinafter also referred to as a movable side block 7B). The movable side block 7B is fixed to a lower mold holding portion 46 that holds the lower mold 2. Thereby, the plurality of first divisional elements 5 are provided on the lower die 2.

In the present embodiment, the first divisional element 5 and the second divisional element 6 are interposed between the second platen 42 and the upper die 3, the upper die holding portion 47, and the fixed side block 7A. The first divided element 5 and the second divided element 6 are interposed between the first platen 41, which is directly attached to the column portion 45 so as to be slidable or attached via an attachment member, and the lower die 2, the lower die holding portion 46, and the movable side block 7B.

Next, the peripheral structure of the second platen 42 and the fixed-side block 7A will be described with reference to fig. 3. In fig. 3, the upper mold 3 and the upper mold holding portion 47 are not illustrated.

The resin molding apparatus 100 of the present embodiment includes a fixing portion 8 for fixing the upper mold 3 to the second platen 42. The fixing portion 8 elastically holds the upper die 3 with respect to the second platen 42.

As shown in fig. 4, the fixing portion 8 includes: a bolt 81 inserted into a through hole 7h formed in the fixed-side block 7A and fastened to the second platen 42; and an elastic body 82 interposed between the head 811 of the bolt 81 and the fixed side block 7A.

The through hole 7h formed in the fixed-side block 7A has a small diameter portion 7h1 into which the shaft portion 812 of the bolt 81 is inserted, and a large diameter portion 7h2 that receives the head portion 811 of the bolt 81. Further, for example, a spring as the elastic body 82 is provided between the inner surface of the through-hole 7h and the head 811 of the bolt 81.

According to this configuration, the elastic body 82 and the bolt 81 are inserted into the through hole 7h, and the bolt 81 is fastened to the second base plate 42, whereby the elastic body 82 is sandwiched between the inner surface of the through hole 7h of the fixed-side block 7A and the head 811 of the bolt 81, and the elastic force acts to press the fixed-side block 7A against the second base plate 42, thereby elastically holding and fixing the fixed-side block 7A and the upper die 3. In this fixed state, the contact surface 5a of the first divisional element 5 of the fixed side block 7A is in press contact with the contact surface 6a of the second divisional element 6 of the second platen 42.

Further, by fixing the fixed-side block 7A to the second platen 42, a space is formed between the second platen 42 and the fixed-side block 7A by the first divisional element 5 and the second divisional element 6, and the space functions as a heat insulating layer. This reduces heat transmitted from the upper mold holding portion 47 holding the upper mold to the second platen 42, and suppresses heat dissipation to the outside.

Here, if the bolt 81 is tightened excessively, the fixed-side block 7A may be deformed by a force received from the second divided element 6 and a force received from the bolt 81. When the fixed side block 7A is deformed, the upper mold holding portion 47 and the upper mold 3 are also deformed.

Therefore, the fixing portion 8 of the present embodiment further includes a distance regulating portion 83, and the distance regulating portion 83 regulates the distance between the second platen 42 and the fixed-side block 7A. The distance regulating portion 83 is inserted into the through hole 7h of the fixed side block 7A together with the bolt 81, and contacts the second platen 42 and the head 811 of the bolt 81 to regulate the distance between the second platen 42 and the fixed side block 7A. Specifically, the distance limiting portion 83 is cylindrical into which the shaft portion 812 of the bolt 81 is inserted, and has one end surface in the axial direction in contact with the lower surface of the second platen 42 and the other end surface in the axial direction in contact with the head portion 811 of the bolt 81.

The distance between the second platen 42 and the head 811 of the bolt 81 is determined by the distance regulating portion 83, and the amount of deformation of the elastic body 82 provided between the head 811 of the bolt 81 and the fixed-side block 7A is determined. As a result, the elastic force applied to the fixed-side block 7A by the elastic body 82 becomes constant. That is, the distance between the second platen 42 and the fixed-side block 7A is limited by the distance limiting section 83, and the amount of deformation of the elastic body 82 is determined so that the elastic force applied to the fixed-side block 7A is constant.

Further, since the fixed side block 7A is held in a floating state with respect to the second platen 42, there is a possibility that the positions of the fixed side block 7A and the upper die 3 fixed to the fixed side block 7A are shifted with respect to the second platen 42.

Therefore, in the present embodiment, as shown in fig. 3, a positioning portion 9A for positioning the upper die 3 with respect to the second platen 42 is provided. Specifically, as shown in fig. 5, the positioning portion 9A includes positioning holes 91 and positioning holes 92 formed in the second platen 42 and the fixed-side block 7A, and positioning pins 93 inserted into these positioning holes 91 and positioning holes 92. In the present embodiment, the following configuration is adopted: positioning pin 93 is fitted and fixed to positioning hole 91, and positioning pin 93 is inserted into positioning hole 92 so as to be movable in the axial direction thereof, but the opposite is also possible.

Here, the positioning portion 9A is configured to be able to absorb deformation of the second platen 42 with respect to the upper die 3 during clamping in a state where the fixed-side block 7A is fixed to the second platen 42. Specifically, a gap is formed between the bottom surface of positioning hole 92 and the upper end surface of positioning pin 93, and positioning pin 93 is configured to be slidable with respect to positioning hole 92. In fig. 5, positioning pin 93 has a large diameter portion 931 at a portion fitted into positioning hole 91 and a small diameter portion 932 at a portion inserted into positioning hole 92. Further, a gap is formed between the upward surface of the step formed between the large-diameter portion 931 and the small-diameter portion 932 and the lower surface of the second platen 42. Positioning portion 9A may be formed such that positioning pin 93 has a uniform cross-sectional shape in the axial direction.

Next, the peripheral structure of the first platen 41 and the movable side block 7B will be described with reference to fig. 6. In fig. 6, the lower die 2 and the lower die holding portion 46 are not shown.

As shown in fig. 6, the movable side block 7B for fixing the lower mold 2 is placed on the first platen 41. Specifically, the first dividing element 5 of the movable-side block 7B is placed on the second dividing element 6 of the first platen 41.

In addition, when only the movable side block 7B is placed on the first platen 41, when the lower die 2 and the upper die 3 are opened, the lower die 2 may be brought into close contact with the upper die 3, and the movable side block 7B may be separated from the first platen 41. Therefore, the lower mold 2 may be fixed to the first base plate 41 by the same configuration as the fixing portion 8.

As shown in fig. 6, a positioning portion 9B is provided between the first platen 41 and the movable side block 7B. Specifically, the positioning portion 9B includes positioning holes 94 and 95 formed in the first platen 41 and the movable side block 7B, and positioning pins 96 inserted into these positioning holes 94 and 95. A gap is formed between the bottom surface of the positioning hole 95 and the upper end surface of the positioning pin 96, and the positioning pin 96 is configured to be slidable with respect to the positioning hole 95. In the present embodiment, the following configuration is adopted: the positioning pin 96 is fitted and fixed to the positioning hole 94, and the positioning pin 96 is inserted into the positioning hole 95 movably in the axial direction thereof, but the reverse is also possible. The positioning pin 96 has a shape having a uniform cross-sectional shape in the axial direction, but may have a shape having a diameter different between the upper side and the lower side in the axial direction.

< Effect of the present embodiment >

According to the resin molding apparatus 100 of the present embodiment, a space is formed between the molding die 2 and the molding die 3 and between the platen 41 and the platen 42 by the plurality of heat insulating members 10. The space functions as a heat insulating layer, and thus heat transmitted from the molding die 2 and the molding die 3 to the platen 41 and the platen 42 can be reduced, and heat dissipation to the outside can be suppressed. In particular, in the present embodiment, since the plurality of heat insulating members 10 are divided into the first dividing element 5 provided in the molding die 2 or 3 and the second dividing element 6 provided in the

platen

41 or 42, even when the

platen

41 or 42 is deformed, the deformation of the

platen

41 or 42 is absorbed between the first dividing element 5 and the second dividing element 6. As a result, the heat insulating member 10 can be prevented from being deformed or damaged due to deformation of the platen 41 or the platen 42 to which the molding die 2 or the molding die 3 is attached. Further, by dividing the plurality of heat insulating members 10, the platen 41 and the platen 42 can be deformed relative to the molding die 2 and the molding die 3, and the deformation amount of the molding die 2 and the molding die 3 can be made smaller than the deformation amount of the platen 41 and the platen 42. As a result, the flatness of the molding dies 2 and 3 can be maintained during mold clamping. Here, the

respective platens

41 and 42 may be partially (partially) inclined with the convex curved contact surface 6a as a starting point. Further, when parts need to be replaced due to wear, breakage, or the like of the first divisional element 5 or the second divisional element 6, at least one of the first divisional element 5 and the second divisional element 6 needs to be replaced, so maintenance can be facilitated. Further, the heat insulating effect eliminates the need for expensive heat insulating plates or forced cooling means such as a blower, which are used in conventional resin molding apparatuses, and the necessity of improving the heat resistance of peripheral (exterior) members can be reduced, thereby improving the thermal efficiency of a heater for heating the molding die.

Fig. 7 shows simulation results regarding deformation during mold clamping. In the simulation, the force equivalent to that applied when the mold is closed is applied from below the upper mold 3 and from above the lower mold 2.

From the above results, it was found that the second platen 42 and the first platen 41 were bent and deformed during the mold clamping, and the fixed side block 7A of the upper mold 3 and the movable side block 7B of the lower mold 2 were not deformed, and the flatness and parallelism of the upper mold 3 and the lower mold 2 were maintained.

This is because the deformation of the second platen 42 and the first platen 41 is not transmitted to the fixed-side block 7A of the upper die 3 and the movable-side block 7B of the lower die 2 by the relative rotation of the contact surfaces 5a and 6a of the first divided element 5 and the second divided element 6. Further, it is conceivable that the first and

second split elements

5 and 6 are made of metal, and that elastic deformation of these split elements also contributes.

Further, since the fixed side block 7A and the upper die 3 are elastically held by the fixing portion 8, the relative rotation of the first divided element 5 and the second divided element 6 is facilitated.

Further, since the

positioning portions

9A and 9B are provided at the central portions on the inner sides of the plurality of first divided elements 5 and second divided elements 6 and gaps are provided between the positioning holes 92, 95, 93, and 96 of the

positioning portions

9A and 9B, the positioning can be performed without transmitting the deformation of the second platen 42 and the first platen 41 to the fixed side block 7A of the upper die 3 and the movable side block 7B of the lower die 2.

In the conventional resin molding apparatus, if the substrate as the object to be molded is large-sized, the rigidity of the components such as the platens is increased to maintain the flatness and parallelism of the molding die, and the apparatus is increased in size and weight.

< other modified embodiment >

Further, the present invention is not limited to the embodiments.

For example, in the above embodiment, the contact surface 6a of the second divided element 6 is formed in a convex curved surface shape, and the contact surface 5a of the first divided element 5 is formed in a planar shape, but the contact surface 6a of the second divided element 6 may be formed in a planar shape, and the contact surface 5a of the first divided element 5 may be formed in a convex curved surface shape.

As shown in fig. 8, the contact surface 6a of the second divided element 6 may be formed in a convex curved surface shape, and the contact surface 5a of the first divided element 5 may be formed in a concave curved surface shape. In this case, the curvature of the concave curved contact surface 5a is smaller than the curvature of the convex curved contact surface 6 a. That is, a part of the convex curved contact surface 6a is accommodated in the concave portion of the concave curved contact surface 5 a.

Further, if the contact surface is mentioned, the contact surface 5a of the first divided element 5 and the contact surface 6a of the second divided element 6 may be formed in a convex curved surface shape, respectively.

The convex surface shape is not limited to a spherical surface shape, but may be an ellipsoidal spherical surface shape, or may be a convex strip extending in one direction. The convex curved surface may be, for example, a free curve as long as relative rotation of the first split device 5 and the second split device 6 can be achieved.

As shown in fig. 9, the contact surface 5a of the first divisional element 5 and the contact surface 6a of the second divisional element 6 may be planar. Here, the contact surfaces 5a and 6a may be horizontal surfaces or inclined surfaces.

Here, since the second platen 42 is deformed so that the center portion thereof becomes higher and the first platen 41 is deformed so that the center portion thereof becomes lower at the time of mold clamping, the inclination of the contact surfaces 5a and 6a of the

respective split elements

5 and 6 can be considered as follows. That is, as shown in fig. 10(a) and 10(b), the contact surface 5a of the first divisional element 5 provided on the upper die 3 is an inclined surface whose inner side is higher and outer side is lower, and the contact surface 6a of the second divisional element 6 provided on the second platen 42 is an inclined surface whose inner side is lower and outer side is higher. The contact surface 5a of the first divided element 5 provided on the lower die 2 is an inclined surface whose inner side is higher and outer side is lower, and the contact surface 6a of the second divided element 6 provided on the first base plate 41 is an inclined surface whose inner side is lower and outer side is higher.

By configuring the contact surface 5a of the first divisional element 5 and the contact surface 6a of the second divisional element 6 in this manner, the first divisional element 5 and the second divisional element 6 can easily slide with each other in accordance with the deformation of the

respective platens

41, 42.

Further, an yttrium oxide film (Y) containing nitrogen (N) and a group 4A element may be formed on at least one of the contact surface 5a of the first divided element 5 and the contact surface 6a of the second divided element 6 ₂ O ₃ ). Here, as the group 4A element, at least one kind of cation selected from the group consisting of titanium (Ti), zirconium (Zr), and hafnium (Hf) can be used. With the above configuration, the first divided element 5 and the second divided element 6 are easily slid with each other, and the flatness of the molding dies 2 and 3 can be further maintained.

In the above embodiment, the plurality of first divided elements 5 are provided in the intermediate block 7A and the intermediate block 7B, but a plurality of second divided elements 6 may be provided in the intermediate block 7A and the intermediate block 7B, or a plurality of first divided elements 5 and second divided elements 6 may be provided in the molding die 2, the molding die 3, the molding die holding section 46, the molding die holding section 47, the platen 41, and the platen 42 without being provided in the intermediate block 7A and the intermediate block 7B.

In the above embodiment, the heat insulating members 10 are provided at four positions between the molding die 2 and the molding die 3 and between the platen 41 and the platen 42, but the heat insulating members 10 may be provided at two or more positions.

Further, in the above embodiment, the first base plate 41 is supported by four column portions 45 so as to be movable up and down, but the first base plate 41 may be supported by two column portions 45 so as to be movable up and down. The two column portions 45 are, for example, plate-shaped and provided on opposite side edges of the rectangular lower fixed tray 44. In this case, the heat insulating member 10 may be provided at two positions along the facing direction of the two pillar portions 45.

In the above embodiment, the heat insulating member 10 is divided between the second platen 42 and the upper die 3 and between the first platen 41 and the lower die 2, but the heat insulating member 10 may be divided between the second platen 42 and the upper die 3 or between the first platen 41 and the lower die 2.

The number and arrangement of the plurality of heat insulating members 10 provided between the second platen 42 and the upper die 3 and the plurality of heat insulating members 10 provided between the first platen 41 and the lower die 2, or the configuration of the heat insulating members 10 may be different from each other.

The shape of the plurality of heat insulating members 10 provided between the second platen 42 and the upper die 3 or between the first platen 41 and the lower die 2 may be changed depending on the position.

In addition to the fixing portion 8 of the above embodiment, the fixing portion 11 shown in fig. 11 may be used. The fixing portion 11 includes: a bolt 111 inserted into a through hole 7h formed in the fixed-side block 7A and fastened to the second platen 42; and a distance limiting part 112 for limiting the distance between the second bedplate 42 and the fixed side block 7A. The distance regulating portion 112 is inserted into the through hole 7h of the fixed side block 7A together with the bolt 111, and contacts the second platen 42 and the head portion 111b of the bolt 111 to regulate the distance between the second platen 42 and the fixed side block 7A. Specifically, the distance limiting portion 112 is cylindrical into which the shaft portion 111a of the bolt 111 is inserted, and has one end surface in the axial direction in contact with the lower surface of the second platen 42 and the other end surface in the axial direction in contact with the head portion 111b of the bolt 111. The fixing portion 11 may be configured to fix the movable side block 7B to the first base plate 41.

In the above embodiment, the first platen 41 to which the lower mold 2 is attached is configured to be movable as a movable plate, but the second platen 42 to which the upper mold 3 is attached may be configured to be movable as a movable plate. When the second platen 42 is a movable platen, the first platen 41 may be a fixed platen.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit thereof.

Claims

1. A resin forming apparatus comprising:

a forming die having a lower die and an upper die;

a platen on which the molding die is mounted;

a plurality of heat insulating members provided between the molding die and the platen, forming a space between the molding die and the platen, and transmitting a mold clamping force from the platen to the molding die;

a fixing portion provided between the molding die and the platen, the fixing portion fixing the molding die to the platen by elastically holding the molding die; and

a positioning portion provided on an inner side of the plurality of heat insulating members, positioning the platen and the molding die, and positioning the platen and the molding die

The plurality of heat insulating members are divided into a first dividing element provided in the molding die and a second dividing element provided in the platen.

2. The resin forming apparatus according to claim 1, wherein a first platen on which the lower mold is mounted and a second platen on which the upper mold is mounted are provided as the platens,

the plurality of heat insulating members are respectively provided between the upper die and the second platen and between the lower die and the first platen.

3. The resin forming apparatus according to claim 1, comprising: and an intermediate block provided between the forming die and the platen, the intermediate block being provided with the plurality of first divided elements or the plurality of second divided elements.

4. A method for producing a resin molded article, using the resin molding apparatus according to any one of claims 1 to 3.