TW202027948A - Resin molding device and method for manufacturing resin molded product - Google Patents
Resin molding device and method for manufacturing resin molded product Download PDFInfo
- Publication number
- TW202027948A TW202027948A TW109101575A TW109101575A TW202027948A TW 202027948 A TW202027948 A TW 202027948A TW 109101575 A TW109101575 A TW 109101575A TW 109101575 A TW109101575 A TW 109101575A TW 202027948 A TW202027948 A TW 202027948A
- Authority
- TW
- Taiwan
- Prior art keywords
- platform
- mold
- upper mold
- side block
- resin molding
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1742—Mounting of moulds; Mould supports
- B29C45/1744—Mould support platens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本發明是有關於一種樹脂成形裝置以及樹脂成形品的製造方法。The present invention relates to a resin molding device and a method for manufacturing a resin molded product.
在利用壓縮成形的樹脂成形裝置中,作為使隔熱間隔件介於成形模與平台(platen)之間,在對成形模進行加熱的加熱器(heater)與平台之間進行隔熱的技術,可想到專利文獻1所示的技術。 [現有技術文獻] [專利文獻]In a resin molding apparatus using compression molding, as a technology to interpose a heat-insulating spacer between a molding die and a platen, and to insulate between a heater that heats the molding die and the platform, The technique shown in Patent Document 1 is conceivable. [Prior Art Literature] [Patent Literature]
[專利文獻1] 日本專利特開平1-297221號公報[Patent Document 1] Japanese Patent Laid-Open No. 1-297221
[發明所欲解決之課題][The problem to be solved by the invention]
所述樹脂成形裝置使用陶瓷製的隔熱間隔件,但若由於合模時的平台的變形等而對隔熱間隔件施加橫向的負荷,或者拉伸方向或壓縮方向的力作用,則可能隔熱間隔件變形或破損。The resin molding device uses a ceramic insulating spacer. However, if a lateral load is applied to the insulating spacer due to deformation of the platform during mold clamping, or a force in the tensile or compression direction is applied, the insulating spacer may be blocked. The thermal spacer is deformed or broken.
因此,本發明的主要課題在於,由安裝著成形模的平台的變形等導致隔熱構件變形或破損。 [解決課題之手段]Therefore, the main subject of the present invention is to deform or break the heat insulating member due to deformation or the like of the platform on which the molding die is attached. [Means to solve the problem]
即,本發明的樹脂成形裝置的特徵在於包括:成形模;平台,安裝著所述成形模;多個隔熱構件,設於所述成形模與所述平台之間,在所述成形模與所述平台之間形成空間,且將來自所述平台的合模力傳遞至所述成形模;以及固定部,相對於所述平台而固定所述成形模;並且所述多個隔熱構件被分割為設於所述成形模的第一分割元件與設於所述平台的第二分割元件。 [發明的效果]That is, the resin molding apparatus of the present invention is characterized by comprising: a molding die; a platform on which the molding die is mounted; a plurality of heat insulating members provided between the molding die and the platform, and the molding die and the platform A space is formed between the platforms, and the clamping force from the platform is transmitted to the forming mold; and a fixing portion that fixes the forming mold with respect to the platform; and the plurality of heat insulating members are It is divided into a first division element provided on the forming mold and a second division element provided on the platform. [Effects of the invention]
根據這樣構成的本發明,能夠防止由安裝著成形模的平台的變形等導致隔熱構件變形或破損。According to the present invention constituted in this way, it is possible to prevent the thermal insulation member from being deformed or damaged due to the deformation of the platform on which the molding die is attached.
接下來,舉例對本發明進行更詳細說明。但是,本發明不受以下說明的限定。Next, the present invention will be explained in more detail with examples. However, the present invention is not limited by the following description.
如上文所述,本發明的樹脂成形裝置的特徵在於包括:成形模;平台,安裝著所述成形模;多個隔熱構件,設於所述成形模與所述平台之間,在所述成形模與所述平台之間形成空間,且將來自所述平台的合模力傳遞至所述成形模;以及固定部,相對於所述平台而固定所述成形模,並且所述多個隔熱構件被分割為設於所述成形模的第一分割元件與設於所述平台的第二分割元件。 若為所述樹脂成形裝置,則利用多個隔熱構件在成形模與平台之間形成空間。所述空間作為隔熱層發揮功能,由此能夠減少從成形模傳至平台的熱,抑制向外部的散熱。尤其本發明中,將多個隔熱構件分割為設於成形模的第一分割元件與設於平台的第二分割元件,因此即便平台發生了變形時,亦在第一分割元件與第二分割元件之間吸收平台的變形。其結果,能夠防止由安裝著成形模的平台的變形等導致隔熱構件變形或破損。另外,藉由將所述多個隔熱構件分割,從而可使所述平台相對於所述成形模相對變形,能夠使所述成形模的變形量小於所述平台的變形量,較佳能夠使所述平台的變形量不傳至所述成形模。其結果,能夠維持合模時的成形模的平坦度。此外,當由於第一分割元件或第二分割元件的磨損、破損等而需要更換零件時,只要更換第一分割元件及第二分割元件的至少一者便可,因此能夠使維護(maintenance)容易。As described above, the resin molding apparatus of the present invention is characterized by comprising: a molding die; a platform on which the molding die is mounted; a plurality of heat insulating members provided between the molding die and the platform, and A space is formed between the forming mold and the platform, and the clamping force from the platform is transmitted to the forming mold; and a fixing part that fixes the forming mold with respect to the platform, and the plurality of partitions The thermal component is divided into a first division element provided on the forming mold and a second division element provided on the platform. In the case of the resin molding apparatus, a space is formed between the molding die and the platform by a plurality of heat insulating members. The space functions as a heat insulating layer, thereby reducing the heat transferred from the molding die to the platform, and suppressing heat dissipation to the outside. In particular, in the present invention, the plurality of heat insulating members are divided into the first split element provided on the forming mold and the second split element provided on the platform. Therefore, even if the platform is deformed, the first split element and the second split element The deformation of the platform is absorbed between the elements. As a result, it is possible to prevent the heat-insulating member from being deformed or damaged due to the deformation of the platform on which the molding die is attached. In addition, by dividing the plurality of heat insulation members, the platform can be relatively deformed with respect to the forming die, and the deformation of the forming die can be made smaller than the deformation of the platform, preferably The deformation of the platform is not transmitted to the forming die. As a result, it is possible to maintain the flatness of the forming mold when the mold is closed. In addition, when parts need to be replaced due to wear, breakage, etc. of the first split element or the second split element, at least one of the first split element and the second split element only needs to be replaced, thereby facilitating maintenance (maintenance) .
作為具體實施形態,所述第一分割元件對所述第二分割元件的接觸面呈凸曲面狀或平面狀。另外,所述第二分割元件對所述第一分割元件的接觸面呈凸曲面狀或平面狀。As a specific embodiment, the contact surface of the first dividing element to the second dividing element is convexly curved or flat. In addition, the contact surface of the second dividing element to the first dividing element is convexly curved or flat.
可想到樹脂成形裝置具有下模及上模作為所述成形模,且具有安裝著所述下模的第一平台及安裝著上模的第二平台作為所述平台。 所述構成中,理想的是所述多個隔熱構件分別設於所述上模與所述第二平台之間、及所述下模與所述第一平台之間。由此,能夠減少傳至第二平台及第一平台的熱,抑制向外部的散熱。It is conceivable that the resin molding apparatus has a lower mold and an upper mold as the molding mold, and has a first platform on which the lower mold is mounted and a second platform on which the upper mold is mounted as the platform. In the above configuration, it is desirable that the plurality of heat insulating members are respectively provided between the upper mold and the second platform and between the lower mold and the first platform. Thereby, it is possible to reduce the heat transmitted to the second platform and the first platform, and to suppress heat dissipation to the outside.
理想的是樹脂成形裝置包括中間塊,所述中間塊設於所述成形模與所述平台之間,且設有所述多個第一分割元件或所述多個第二分割元件。 若為所述構成,則藉由將中間塊安裝於成形模或平台,從而能夠將多個分割元件一舉設於成形模或平台,而能夠使更換作業簡單。It is desirable that the resin molding apparatus includes an intermediate block provided between the molding die and the platform, and provided with the plurality of first dividing elements or the plurality of second dividing elements. With the above-mentioned configuration, by attaching the intermediate block to the forming mold or the platform, a plurality of divided elements can be installed on the forming mold or the platform at once, and the replacement operation can be simplified.
在利用螺栓將成形模或中間塊固定於平台時,若增強其緊固力,則以分割元件的接觸面為起點而成形模或中間塊變形。於是,可能成形模的平坦度從合模前開始受損。 為了解決所述問題,理想的是所述固定部相對於所述平台而彈性保持所述成形模。When fixing the forming mold or the intermediate block to the platform with bolts, if the fastening force is increased, the forming mold or the intermediate block is deformed from the contact surface of the split element as a starting point. As a result, the flatness of the forming mold may be damaged from before the mold is closed. In order to solve the problem, it is desirable that the fixing part elastically holds the forming die with respect to the platform.
由於藉由將隔熱構件分割從而可使平台相對於成形模相對變形,因此可能成形模相對於平台的位置偏移。 因此,理想的是樹脂成形裝置包括定位部,所述定位部設於比所述多個隔熱構件更靠內側,對所述平台與所述成形模進行定位。此外,所謂可使平台相對於成形模相對變化,亦能夠表述為與成形模相獨立而可使平台變化。Since the platform can be relatively deformed relative to the forming die by dividing the heat insulating member, the position of the forming die relative to the platform may be shifted. Therefore, it is desirable that the resin molding apparatus includes a positioning portion provided on the inner side of the plurality of heat insulating members to position the platform and the molding die. In addition, the so-called making the platform relatively changeable with respect to the forming mold can also be expressed as being able to change the platform independently of the forming mold.
另外,使用所述樹脂成形裝置的樹脂成形品的製造方法亦為本發明的一形態。In addition, the method of manufacturing a resin molded product using the resin molding apparatus is also one aspect of the present invention.
<本發明的一實施方式> 以下,參照圖式對本發明的樹脂成形裝置的一實施方式進行說明。此外,關於以下所示的任一個圖,均為了容易地理解而適當省略或誇張地示意性描述。對相同構成元件標註相同符號並適當省略說明。<One embodiment of the present invention> Hereinafter, an embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, regarding any of the drawings shown below, they are all easily understood and are appropriately omitted or exaggerated and schematically described. The same symbols are assigned to the same constituent elements, and the description is appropriately omitted.
本實施方式的樹脂成形裝置100針對搭載有電子零件的基板,利用樹脂將搭載有電子零件的零件搭載面密封而製造樹脂成形品。此外,基板例如能夠舉出金屬製基板、樹脂製基板、玻璃製基板、陶瓷製基板、電路基板、半導體基板、導線架(lead frame)等。樹脂材料除了顆粒狀或粉末狀的樹脂材料以外,還能夠使用液狀、薄片狀、小片狀等的樹脂材料。The
如圖1所示,所述樹脂成形裝置100具有:下模2,為形成有模腔(cavity)的第一成形模;上模3,為保持基板的第二成形模;以及合模機構4,安裝著下模2及上模3並且將下模2及上模3合模。As shown in FIG. 1, the
合模機構4具有:安裝著下模2的可動盤41(以下亦稱為第一平台41)、安裝著上模3的上部固定盤42(以下亦稱為第二平台42)、以及用於使第一平台41升降移動的驅動機構43。The
第一平台41在其上表面安裝著下模2,由設於下部固定盤44的多個支柱部45可升降移動地支撐。本實施方式中,利用設於例如俯視下矩形狀的下部固定盤44的四角的四根支柱部(亦稱為繫桿(tie-bar))45來可升降移動地支撐第一平台41。The
第二平台42在其下表面安裝著上模3,以與第一平台41相向的方式固定在四根支柱部45的上端部。The
驅動機構43設於第一平台41與下部固定盤44之間,藉由使第一平台41升降移動從而將下模2與上模3合模並且施加規定的合模力(成形壓力)。本實施方式的驅動機構43為使用將伺服馬達(servo motor)等的旋轉變換為直線移動的滾珠螺桿機構431而傳遞至第一平台41的直動方式,但亦可為使用例如肘節連桿(toggle link)等連桿機構將伺服馬達等的動力源傳遞至第一平台41的連桿方式。The
而且,在下模2與第一平台41之間,設有保持下模2的下模保持部46。所述下模保持部46具有對下模2進行加熱的加熱板等。Furthermore, between the
在上模3與第二平台42之間,設有保持上模3的上模保持部47。所述上模保持部47具有對上模3進行加熱的加熱板等。Between the
而且本實施方式中,在上模3與第二平台42之間、以及下模2與第一平台41之間設有多個隔熱構件10。Furthermore, in this embodiment, a plurality of
上模3與第二平台42之間的多個隔熱構件10在上模3與第二平台42之間形成空間。另外,下模2與第一平台41之間的多個隔熱構件10在下模2與第一平台41之間形成空間。The plurality of
而且,多個隔熱構件10被分割為設於上模3側或下模2側的第一分割元件5、與設於第二平台42或第一平台41的第二分割元件6。Furthermore, the plurality of
上模3與第二平台42之間的多個第一分割元件5、第二分割元件6將驅動機構43的合模力從第二平台42傳遞至上模3。另外,下模2與第一平台41之間的多個第一分割元件5、第二分割元件6將驅動機構43的合模力從第一平台41傳遞至下模2。該些第一分割元件5、第二分割元件6例如為呈圓柱狀的金屬製的柱狀物(pillar)。The plurality of
本實施方式中,在各平台41、平台42與各成形模2、成形模3之間,與四個支柱部45對應地設有四個第一分割元件5、第二分割元件6。具體而言,設置為俯視下位於四角形的頂點。In the present embodiment, between each
多個第一分割元件5設於下模2側及上模3側,多個第二分割元件6與第一分割元件5對應地設於第一平台41及第二平台42。而且,在第二平台42側,第一分割元件5的上端面與第二分割元件6的下端面成為彼此接觸的接觸面5a、接觸面6a,在第一平台41側,第一分割元件5的下端面與第二分割元件6的上端面成為彼此接觸的接觸面5a、接觸面6a。此處,接觸面6a成為凸曲面狀的接觸面。The plurality of
此處,多個第一分割元件5、第二分割元件6以允許第一平台41或第二平台42相對於下模2或上模3相對變形,並且將合模力從第一平台41或第二平台42傳遞至下模2或上模3的方式構成。Here, the plurality of
具體而言,如圖2所示,第二分割元件6的接觸面6a呈凸曲面狀。本實施方式的接觸面6a呈向下部鼓起的球面狀,更詳細而言,呈在第二分割元件6的中心軸上具有頂點的球面狀。另一方面,第一分割元件5的接觸面5a呈平面狀。由此,下模2的變形量小於第一平台41的變形量,上模3的變形量小於第二平台42的變形量。當該些構成的效果最顯著時,由於凸曲面狀的接觸面6a而第一平台41或第二平台42的變形量不會傳至下模2或上模3,由第一平台41的變形量所引起的下模2的變形量成為零,由第二平台42的變形量所引起的上模3的變形量成為零。Specifically, as shown in FIG. 2, the
本實施方式中,設於上模3的多個第一分割元件5固定於中間塊7A(以下亦稱為固定側塊7A)。所述固定側塊7A固定於保持上模3的上模保持部47。由此,多個第一分割元件5設於上模3。另外,設於下模2的多個第一分割元件5固定於中間塊7B(以下亦稱為可動側塊7B)。所述可動側塊7B固定於保持下模2的下模保持部46。由此,多個第一分割元件5設於下模2。
本實施方式中,第一分割元件5及第二分割元件6介於第二平台42與上模3、上模保持部47及固定側塊7A之間。另外,第一分割元件5及第二分割元件6介於以相對於支柱部45可滑動的方式直接安裝或經由安裝構件而安裝的第一平台41與下模2、下模保持部46及可動側塊7B之間。In this embodiment, the plurality of
接下來,參照圖3對第二平台42及固定側塊7A的周邊結構進行說明。此外,圖3中,上模3及上模保持部47的圖示省略。Next, the peripheral structure of the
本實施方式的樹脂成形裝置100具有相對於第二平台42而固定上模3的固定部8。所述固定部8相對於第二平台42而彈性保持上模3。The
如圖4所示,固定部8包括:螺栓81,插入至形成於固定側塊7A的貫穿孔7h並緊固於第二平台42;及彈性體82,介於所述螺栓81的頭部811與固定側塊7A之間。As shown in FIG. 4, the fixing
形成於固定側塊7A的貫穿孔7h具有供螺栓81的軸部812插入的小徑部7h1、及收容螺栓81的頭部811的大徑部7h2。而且,在貫穿孔7h的內表面與螺栓81的頭部811之間,設有作為彈性體82的例如彈簧。The through
根據此種構成,藉由將彈性體82及螺栓81插入至貫穿孔7h,並將螺栓81緊固於第二平台42,從而將彈性體82夾持在固定側塊7A的貫穿孔7h的內表面與螺栓81的頭部811之間,彈性力以對第二平台42按壓固定側塊7A的方式作用,而將固定側塊7A及上模3彈性保持並固定。在此經固定的狀態下,固定側塊7A的第一分割元件5的接觸面5a、與第二平台42的第二分割元件6的接觸面6a擠壓接觸。According to this configuration, by inserting the
另外,藉由將固定側塊7A固定於第二平台42,從而利用第一分割元件5及第二分割元件6在第二平台42與固定側塊7A之間形成空間,所述空間作為隔熱層發揮功能。由此,減少從保持上模的上模保持部47傳至第二平台42的熱,抑制向外部的散熱。In addition, by fixing the fixed
此處,若過度擰緊螺栓81,則固定側塊7A可能因從第二分割元件6承受的力及從螺栓81承受的力而變形。若固定側塊7A變形,則上模保持部47及上模3亦變形。Here, if the
因此,本實施方式的固定部8還包括距離限制部83,所述距離限制部83限制第二平台42與固定側塊7A的距離。所述距離限制部83與螺栓81一起插入至固定側塊7A的貫穿孔7h,與第二平台42和螺栓81的頭部811接觸,限制第二平台42與固定側塊7A的距離。具體而言,距離限制部83呈供螺栓81的軸部812插入的圓筒狀,軸向一端面與第二平台42的下表面接觸,軸向另一端面與螺栓81的頭部811接觸。Therefore, the fixing
利用所述距離限制部83來決定第二平台42與螺栓81的頭部811的距離,而決定設於螺栓81的頭部811與固定側塊7A之間的彈性體82的變形量。其結果,由彈性體82施加於固定側塊7A的彈性力成為一定。即,利用距離限制部83來限制第二平台42與固定側塊7A的距離,決定彈性體82的變形量而施加於固定側塊7A的彈性力成為一定。The
另外,由於相對於第二平台42以浮起狀態保持固定側塊7A,因此可能固定側塊7A及固定於此固定側塊7A的上模3的位置相對於第二平台42偏移。In addition, since the fixed
因此本實施方式中,如圖3所示,設有用於將上模3相對於第二平台42進行定位的定位部9A。具體而言,如圖5所示,定位部9A包含形成於第二平台42及固定側塊7A的定位孔91、定位孔92以及插入至該些定位孔91、定位孔92的定位銷93。本實施方式中,設為如下構成:將定位銷93嵌合固定於定位孔91,定位銷93於其軸向可移動地插入到定位孔92中,但亦可相反。Therefore, in this embodiment, as shown in FIG. 3, a
此處,以在將固定側塊7A固定於第二平台42的狀態下,定位部9A能夠吸收合模時的第二平台42相對於上模3的變形的方式進行構成。具體而言,在定位孔92的底面與定位銷93的上端面之間形成有間隙,構成為定位銷93相對於定位孔92可滑動。圖5中,定位銷93中,將與定位孔91嵌合的部分設為大徑部931,將插入至定位孔92的部分設為小徑部932。而且,以在形成於大徑部931與小徑部932之間的階部的向上面、與第二平台42的下表面之間亦形成間隙的方式構成。此外,定位部9A亦能以定位銷93於軸向成為等截面形狀的方式構成。Here, in a state where the fixed
接著,參照圖6對第一平台41及可動側塊7B的周邊結構進行說明。此外,圖6中,下模2及下模保持部46的圖示省略。Next, the peripheral structure of the
如圖6所示,供固定下模2的可動側塊7B載置於第一平台41。具體而言,可動側塊7B的第一分割元件5載置在第一平台41的第二分割元件6上。As shown in FIG. 6, the
此外,僅將可動側塊7B載置於第一平台41的情況下,可能在將下模2與上模3開模時,下模2緊貼於上模3,可動側塊7B離開第一平台41。因此,亦可利用與所述固定部8相同的構成,相對於第一平台41而固定下模2。In addition, when only the
另外,如圖6所示,在第一平台41與可動側塊7B之間設有定位部9B。具體而言,定位部9B包含形成於第一平台41及可動側塊7B的定位孔94、定位孔95以及插入至該些定位孔94、定位孔95的定位銷96。在定位孔95的底面與定位銷96的上端面之間形成有間隙,構成為定位銷96相對於定位孔95可滑動。本實施方式中,設為如下的構成:將定位銷96嵌合固定於定位孔94,定位銷96於其軸向可移動地插入至定位孔95中,但亦可相反。定位銷96設為於軸向呈等截面形狀的形狀,但亦可設為直徑在軸向的上方與下方不同的形狀。In addition, as shown in FIG. 6, a
<本實施方式的效果>
根據本實施方式的樹脂成形裝置100,利用多個隔熱構件10在成形模2、成形模3與平台41、平台42之間形成空間。所述空間作為隔熱層發揮功能,由此能夠減少從成形模2、成形模3傳至平台41、平台42的熱,抑制向外部的散熱。尤其本實施方式中,將多個隔熱構件10分割為設於成形模2、成形模3的第一分割元件5與設於平台41、平台42的第二分割元件6,因此即便在平台41、平台42發生了變形時,亦在第一分割元件5與第二分割元件6之間吸收平台41、平台42的變形。其結果,能夠防止由安裝著成形模2、成形模3的平台41、平台42的變形等導致隔熱構件10變形或破損。另外,藉由將多個隔熱構件10分割,從而可使平台41、平台42相對於成形模2、成形模3相對變形,能夠使成形模2、成形模3的變形量小於平台41、平台42的變形量。其結果,能夠維持合模時的成形模2、成形模3的平坦度。此處,亦能夠表述為各平台41、平台42以凸曲面狀的接觸面6a為起點而局部地(部分地)傾斜。此外,當由於第一分割元件5或第二分割元件6的磨損、破損等而需要零件更換時,只要更換第一分割元件5及第二分割元件6中的至少一者便可,因此能夠使維護容易。另外,由於隔熱效果而能夠不需要現有的樹脂成形裝置中所用那樣的昂貴的隔熱板、或送風機等強制冷卻機構,能夠降低提高周邊(外部)構件的耐熱性的必要性,而能夠提高對成形模進行加熱的加熱器的熱效率。<Effects of this embodiment>
According to the
圖7中示出與合模時的變形有關的模擬結果。所述模擬中,設為從上模3的下方及從下模2的上方施加與合模時同等的力的狀態。Fig. 7 shows the simulation results related to the deformation during mold clamping. In the simulation, it was assumed that the force equivalent to that at the time of mold clamping was applied from below the
由所述結果得知,在合模時第二平台42及第一平台41彎曲變形,相對於此,上模3的固定側塊7A及下模2的可動側塊7B並未變形,而維持上模3及下模2的平坦度及平行度。According to the results, the
這是因為在第一分割元件5與第二分割元件6的接觸面5a、接觸面6a,兩者相對旋轉,由此第二平台42及第一平台41的變形並未傳至上模3的固定側塊7A及下模2的可動側塊7B。另外,可想到藉由以金屬製來構成第一分割元件5及第二分割元件6,從而該些分割元件的彈性變形亦作出貢獻。This is because the
另外,利用固定部8來彈性保持固定側塊7A及上模3,因此第一分割元件5及第二分割元件6的相對旋轉變得容易。In addition, since the fixed
進而,將定位部9A、定位部9B設於比多個第一分割元件5、第二分割元件6更靠內側的中央部,並且在定位部9A、定位部9B的定位孔92、定位孔95及定位銷93、定位銷96之間設有間隙,因此能夠進行定位而不將第二平台42及第一平台41的變形傳至上模3的固定側塊7A及下模2的可動側塊7B。Furthermore, the
現有的樹脂成形裝置中,若作為成形對象物的基板大型化,則為了維持成形模的平坦度及平行度,而提高各平台等構成構件的剛性等而伴有裝置的大型化及重量化,但本實施方式中無需此種操作,因此能夠實現裝置的小型化及輕量化。In the conventional resin molding apparatus, when the substrate as the molding object is enlarged, in order to maintain the flatness and parallelism of the molding die, the rigidity of each platform and other constituent members is increased, and the apparatus is enlarged and weighted. However, this embodiment does not require such an operation, so it is possible to reduce the size and weight of the device.
<其他變形實施方式> 此外,本發明不限於所述實施方式。<Other Modified Embodiments> In addition, the present invention is not limited to the embodiment.
例如,所述實施方式中,第二分割元件6的接觸面6a呈凸曲面狀,第一分割元件5的接觸面5a呈平面狀,但亦可將第二分割元件6的接觸面6a設為平面狀,將第一分割元件5的接觸面5a設為凸曲面狀。For example, in the above embodiment, the
另外,如圖8所示,亦可將第二分割元件6的接觸面6a設為凸曲面狀,將第一分割元件5的接觸面5a設為凹曲面狀。在此情況下,凹曲面狀的接觸面5a的曲率小於凸曲面狀的接觸面6a的曲率。即,使凸曲面狀的接觸面6a的一部分收容在凹曲面狀的接觸面5a的凹部內。In addition, as shown in FIG. 8, the
進而,若提及接觸面,則亦可將第一分割元件5的接觸面5a、第二分割元件6的接觸面6a分別設為凸曲面狀。Furthermore, when referring to a contact surface, the
凸曲面狀不限於球面狀,亦可為橢圓球面狀,或亦可為在一個方向上延伸的凸條。此外,凸曲面狀只要可實現第一分割元件5與第二分割元件6的相對旋轉便可,例如亦可為自由曲線。The convex shape is not limited to the spherical shape, and may be an elliptical spherical shape, or may be a convex strip extending in one direction. In addition, the convex curved shape only needs to realize the relative rotation of the
另外,如圖9所示,第一分割元件5的接觸面5a及第二分割元件6的接觸面6a亦可呈平面狀。此處,接觸面5a、接觸面6a既可為水平面,亦可為傾斜面。In addition, as shown in FIG. 9, the
此處,在合模時第二平台42以中央部變高的方式變形,第一平台41以中央部變低的方式變形,因此可想到將各分割元件5、分割元件6的接觸面5a、接觸面6a的傾斜形態設為以下。即,如圖10(a)與圖10(b)所示,設於上模3的第一分割元件5的接觸面5a設為內側變高且外側變低的傾斜面,設於第二平台42的第二分割元件6的接觸面6a設為內側變低且外側變高的傾斜面。另外,設於下模2的第一分割元件5的接觸面5a設為內側變高且外側變低的傾斜面,設於第一平台41的第二分割元件6的接觸面6a設為內側變低且外側變高的傾斜面。
藉由這樣構成第一分割元件5的接觸面5a及第二分割元件6的接觸面6a,從而第一分割元件5及第二分割元件6能夠根據各平台41、平台42的變形而容易地彼此滑動。Here, the
而且,亦可在第一分割元件5的接觸面5a或第二分割元件6的接觸面6a的至少一者形成含有氮(N)及4A族元素的氧化釔膜(Y2
O3
)。此處,4A族元素能夠使用選自由鈦(Ti)、鋯(Zr)及鉿(Hf)所組成的群組中的至少一種的陽離子。若為所述構成,則第一分割元件5與第二分割元件6容易彼此滑動,能夠進一步維持成形模2、成形模3的平坦度。Furthermore, an yttrium oxide film (Y 2 O 3 ) containing nitrogen (N) and a group 4A element may be formed on at least one of the
所述實施方式中,為多個第一分割元件5設於中間塊7A、中間塊7B的構成,但亦可為多個第二分割元件6設於中間塊7A、中間塊7B的構成,或亦可為不將多個第一分割元件5、第二分割元件6設於中間塊7A、中間塊7B,而是設於成形模2、成形模3或成形模保持部46、成形模保持部47或者平台41、平台42的構成。In the above-mentioned embodiment, the plurality of
所述實施方式中,為在成形模2、成形模3與平台41、平台42之間的四處設有隔熱構件10的構成,但亦可為在兩處以上設有隔熱構件10的構成。In the above-mentioned embodiment, the heat-insulating
進而,所述實施方式中,為利用四根支柱部45可升降移動地支撐第一平台41的構成,但亦可為利用兩個支柱部45可升降移動地支撐第一平台41的構成。兩個支柱部45例如呈設於矩形狀的下部固定盤44的相向的側邊的板狀。在此情況下,可想到隔熱構件10沿著兩個支柱部45的相向方向而設於兩處。Furthermore, in the above-described embodiment, the
所述實施方式中,為在第二平台42與上模3之間、及第一平台41與下模2之間分別將隔熱構件10分割的構成,但亦可設為將第二平台42與上模3之間、或第一平台41與下模2之間的一者的隔熱構件10分割的構成。In the above-mentioned embodiment, the insulating
另外,亦可使設於第二平台42與上模3之間的多個隔熱構件10、與設於第一平台41與下模2之間的多個隔熱構件10的配置個數、配置形態或者隔熱構件10的構成互不相同。In addition, the number of
設於第二平台42與上模3之間、或第一平台41與下模2之間的多個隔熱構件10亦可根據位置而變更其形狀。The plurality of
除了所述實施方式的固定部8以外,亦可使用圖11所示的固定部11。所述固定部11包括:螺栓111,插入至形成於固定側塊7A的貫穿孔7h並緊固於第二平台42;及距離限制部112,限制第二平台42與固定側塊7A的距離。所述距離限制部112與螺栓111一起插入至固定側塊7A的貫穿孔7h,與第二平台42和螺栓111的頭部111b接觸,限制第二平台42與固定側塊7A的距離。具體而言,距離限制部112呈供螺栓111的軸部111a插入的圓筒狀,軸向一端面與第二平台42的下表面接觸,軸向另一端面與螺栓111的頭部111b接觸。此外,所述固定部11亦可用於相對於第一平台41而固定可動側塊7B的構成。In addition to the fixing
另外,所述實施方式中,為將安裝著下模2的第一平台41設為可動盤而使其可動的構成,但亦可為將安裝著上模3的第二平台42設為可動盤而使其可動的構成。當將第二平台42設為可動盤時,亦可將第一平台41設為固定盤。In addition, in the above-described embodiment, the
此外,本發明不限於所述實施方式,當然可在不偏離其主旨的範圍內進行各種變形。In addition, the present invention is not limited to the above-mentioned embodiments, and of course various modifications can be made within a range that does not deviate from the gist.
2:下模(成形模)
3:上模(成形模)
4:合模機構
5:第一分割元件
5a:第一分割元件的接觸面
6:第二分割元件
6a:第二分割元件的接觸面
7A:固定側塊(中間塊)
7B:可動側塊(中間塊)
7h:貫穿孔
7h1、932:小徑部
7h2、931:大徑部
8:固定部
9A、9B:定位部
10:隔熱構件
11:固定部
41:第一平台(可動盤)
42:第二平台(上部固定盤)
43:驅動機構
44:下部固定盤
45:支柱部
46:下模保持部(成形模保持部)
47:上模保持部(成形模保持部)
81、111:螺栓
82:彈性體
83、112:距離限制部
91、92、94、95:定位孔
93、96:定位銷
100:樹脂成形裝置
111b、811:頭部
111a、812:軸部
431:滾珠螺桿機構2: Lower mold (forming mold)
3: Upper mold (forming mold)
4: Clamping mechanism
5: The
圖1為示意性地表示本實施方式的樹脂成形裝置的構成的正面圖。 圖2為所述實施方式的第一分割元件及第二分割元件的放大剖面圖。 圖3為主要表示所述實施方式的第二平台及固定側塊的剖面圖。 圖4為所述實施方式的固定側塊的固定部的放大剖面圖。 圖5為所述實施方式的固定側塊的定位部的放大剖面圖。 圖6為主要表示所述實施方式的第一平台及可動側塊的剖面圖。 圖7為表示由所述實施方式的構成所得的模擬結果的圖。 圖8為變形實施方式的第一分割元件及第二分割元件的放大剖面圖。 圖9為變形實施方式的第一分割元件及第二分割元件的放大剖面圖。 圖10(a)與圖10(b)為變形實施方式的第一分割元件及第二分割元件的放大剖面圖。 圖11為變形實施方式的固定部的放大剖面圖。FIG. 1 is a front view schematically showing the configuration of the resin molding apparatus of this embodiment. Fig. 2 is an enlarged cross-sectional view of the first dividing element and the second dividing element of the embodiment. Fig. 3 is a cross-sectional view mainly showing the second platform and the fixed side block of the embodiment. Fig. 4 is an enlarged cross-sectional view of the fixing portion of the fixing side block of the embodiment. Fig. 5 is an enlarged cross-sectional view of the positioning portion of the fixed side block of the embodiment. Fig. 6 is a cross-sectional view mainly showing the first platform and the movable side block of the embodiment. Fig. 7 is a diagram showing simulation results obtained by the configuration of the embodiment. Fig. 8 is an enlarged cross-sectional view of a first split element and a second split element according to a modified embodiment. Fig. 9 is an enlarged cross-sectional view of a first split element and a second split element in a modified embodiment. 10(a) and 10(b) are enlarged cross-sectional views of the first split element and the second split element of the modified embodiment. Fig. 11 is an enlarged cross-sectional view of a fixing portion of a modified embodiment.
2:下模(成形模) 2: Lower mold (forming mold)
3:上模(成形模) 3: Upper mold (forming mold)
4:合模機構 4: Clamping mechanism
5:第一分割元件 5: The first split element
6:第二分割元件 6: The second split element
7A:固定側塊(中間塊) 7A: Fixed side block (middle block)
7B:可動側塊(中間塊) 7B: Movable side block (middle block)
10:隔熱構件 10: Thermal insulation
41:第一平台(可動盤) 41: The first platform (movable plate)
42:第二平台(上部固定盤) 42: Second platform (upper fixed plate)
43:驅動機構 43: drive mechanism
44:下部固定盤 44: Lower fixed plate
45:支柱部 45: Pillar
46:下模保持部(成形模保持部) 46: Lower mold holding part (forming mold holding part)
47:上模保持部(成形模保持部) 47: Upper mold holding part (forming mold holding part)
100:樹脂成形裝置 100: Resin molding device
431:滾珠螺桿機構 431: Ball screw mechanism
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019012140A JP6785897B2 (en) | 2019-01-28 | 2019-01-28 | Resin molding equipment and manufacturing method of resin molded products |
JP2019-012140 | 2019-01-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202027948A true TW202027948A (en) | 2020-08-01 |
TWI729677B TWI729677B (en) | 2021-06-01 |
Family
ID=71791689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109101575A TWI729677B (en) | 2019-01-28 | 2020-01-16 | Resin molding device and method for manufacturing resin molded product |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6785897B2 (en) |
KR (1) | KR102251069B1 (en) |
CN (1) | CN111483101B (en) |
TW (1) | TWI729677B (en) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1017245B (en) * | 1974-07-18 | 1977-07-20 | Pirelli | IMPROVEMENTS IN PRESSES FOR THE VULCANIZATION OF RUBBER ARTICLES |
JPS5520498Y2 (en) * | 1977-10-31 | 1980-05-16 | ||
JPH0324345Y2 (en) * | 1986-04-18 | 1991-05-28 | ||
JP2711259B2 (en) | 1988-05-26 | 1998-02-10 | 京セラ株式会社 | Resin molding equipment |
JPH0551621U (en) * | 1991-12-10 | 1993-07-09 | 積水化学工業株式会社 | Injection mold |
JP2738230B2 (en) * | 1992-08-24 | 1998-04-08 | 日本電気株式会社 | Mold fixing mechanism |
WO1998021018A1 (en) * | 1996-11-14 | 1998-05-22 | Idemitsu Petrochemical Co., Ltd. | Compression device for molding, injection compression molding machine, and injection compression molding method using compression device |
JP3490606B2 (en) * | 1998-03-20 | 2004-01-26 | 富士通株式会社 | Mold for semiconductor device manufacturing |
JP2008238544A (en) * | 2007-03-27 | 2008-10-09 | Inoac Corp | Molding die |
JP2011083956A (en) * | 2009-10-15 | 2011-04-28 | Ube Machinery Corporation Ltd | Electric mold clamping device |
CN101722607B (en) * | 2009-11-30 | 2012-05-09 | 裕克施乐塑料制品(太仓)有限公司 | Mold assembling machine |
JP5423467B2 (en) * | 2010-02-23 | 2014-02-19 | 宇部興産機械株式会社 | Clamping device |
JP2012086379A (en) * | 2010-10-15 | 2012-05-10 | Kanto Auto Works Ltd | Method for adjusting die for injection molding and die device |
JP6441151B2 (en) * | 2015-03-31 | 2018-12-19 | 住友重機械工業株式会社 | Injection molding machine |
JP6440599B2 (en) * | 2015-08-28 | 2018-12-19 | Towa株式会社 | Resin molding apparatus and resin molding method |
CN206840546U (en) * | 2017-06-09 | 2018-01-05 | 贵州理工学院 | A kind of hot press of use for laboratory |
-
2019
- 2019-01-28 JP JP2019012140A patent/JP6785897B2/en active Active
- 2019-12-19 KR KR1020190170553A patent/KR102251069B1/en active IP Right Grant
-
2020
- 2020-01-06 CN CN202010009588.2A patent/CN111483101B/en active Active
- 2020-01-16 TW TW109101575A patent/TWI729677B/en active
Also Published As
Publication number | Publication date |
---|---|
CN111483101B (en) | 2022-08-02 |
JP2020116917A (en) | 2020-08-06 |
KR20200093429A (en) | 2020-08-05 |
KR102251069B1 (en) | 2021-05-13 |
CN111483101A (en) | 2020-08-04 |
JP6785897B2 (en) | 2020-11-18 |
TWI729677B (en) | 2021-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7462027B2 (en) | Mold apparatus | |
CN107921679B (en) | Resin molding apparatus and method for manufacturing resin molded product | |
KR20090031295A (en) | Thermal press formation device and die system for the same | |
KR102192276B1 (en) | Mold apparatus, compression molding apparatus and compression molding method | |
US7901196B2 (en) | Molding apparatus incorporating pressure uniformity adjustment | |
US9339958B2 (en) | Mold mounting platen for injection molding machine | |
TWI729677B (en) | Resin molding device and method for manufacturing resin molded product | |
KR101613356B1 (en) | Apparatus of compression molding, adjustment method of molding surface parallel degree, and adjustment method of die height | |
TWI720794B (en) | Resin molding device and method for manufacturing resin molded product | |
TWI744771B (en) | Resin molding device and method for manufacturing resin molded product | |
KR20170030428A (en) | Press machine, press method, compression molding apparatus and compression molding method | |
CN101241885B (en) | High performance semiconductor module | |
CN218366963U (en) | Gold stamping embossing die | |
TWI729318B (en) | Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method | |
JP2012236223A (en) | Device for manufacturing radiator and method for manufacturing semiconductor device | |
KR20160037003A (en) | Fan insert |