JP2012236223A - Device for manufacturing radiator and method for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for manufacturing a radiator that can manufacture a radiator while bringing a press blade into even contact with a widening groove, thereby increasing fitting property between fins and a metallic base and reducing thermal contact resistance between the metallic base and fins in the radiator, and to provide a method for manufacturing a semiconductor device.SOLUTION: The device for manufacturing a radiator manufactures the radiator which includes the metallic base 4 and radiator fins 5, and in which the radiator fins are fixed to the metallic base by pushing one end of the radiator fin into an upper groove 4g of a protrusion 4a formed in the metallic base while expanding the upper groove. The device for manufacturing a radiator includes the pressing blade that is moved along the lateral surface of the radiator fin to push and expand the groove and provided therein so as to be movable in a direction perpendicular to the lateral surface of the radiator fin.

Description

  The present invention relates to a radiator manufacturing apparatus and a semiconductor device manufacturing method using the radiator manufacturing apparatus.

For example, heat sinks that dissipate heat generated by power semiconductor elements include those in which fins and bases are integrated by die casting or extrusion molding, and those in which fins and bases are individually combined.
The combination of individualized fins and bases allows the fins and metal bases to be individualized so that there are few restrictions on the strength of the mold required for extrusion molding and die casting, narrow fin pitch and long fins. Since the length can be realized, it is effective in reducing the size and cost of the semiconductor device.
Moreover, the caulking method is mentioned as a fitting method at the time of combining a fin and a metal base. For example, Patent Document 1 discloses a method in which fins are fitted into a metal base by inserting every other fin into a groove formed in the metal base and inserting a press blade into the groove in which no fin is inserted. Is disclosed. That is, in Patent Document 1, the fins and the press blades are arranged so as to be adjacent to each other, and the press blades are applied with a press load to the grooves from directly above to widen the single fins. In Patent Document 1, the depth of the groove into which the fin is inserted and the height of the groove to be widened and the height of the groove are the same. Therefore, the heights of the fixing positions by the widened grooves on both sides of the fin are almost the same.

Japanese Patent Laying-Open No. 2001-102786 (FIG. 1)

However, with the conventional fin and metal base caulking method, when the metal base groove is widened, it is not always easy to accurately apply the press blade to a predetermined position of the metal base groove, and the press blade is displaced. In some cases, the groove was loaded. If there is such a bias in load, a difference occurs in the amount of widening of the grooves, the fins are in an unstable state, and sufficient cooling performance by the fins cannot be ensured.
For example, in the structure shown in Patent Document 1, caulking is performed by applying pressure to a single fin from the left and right and deforming the fitting portion. Here, if caulking is performed in a state where the press blade is shifted to the left or right, the pressing force on one side increases, but the pressing force on the other side decreases. For this reason, when the amount of positional deviation increases, there is a concern that the unbalance of the fitting force of the caulking portion is large, and as a result, the contact thermal resistance increases.

  Therefore, the present invention produces a radiator that can make the contact between the press blade and the widening groove uniform, has a high fitting property between the fin and the metal base, and has a low contact thermal resistance between the metal base and the fin. An object of the present invention is to provide a heatsink manufacturing apparatus and a semiconductor device manufacturing method that can be used.

In order to solve the above-described problems, a radiator manufacturing apparatus according to the present invention includes a metal base and a heat radiating fin, and the heat radiating fin is expanded by expanding a groove on a convex portion provided on the metal base. A radiator manufacturing apparatus for manufacturing a radiator that is fixed to the metal base at one end, comprising a press blade that moves along a side surface of the radiation fin to expand the groove,
The press blade is provided so as to be movable in a direction intersecting a side surface of the heat radiating fin.

  A manufacturing method of a semiconductor device according to the present invention is a manufacturing method of a semiconductor device including a semiconductor element and the heat radiator, wherein the semiconductor element is disposed on a surface different from a surface on which the convex portion of the metal base is formed. After joining and sealing the semiconductor element so as to enclose a part including the joint portion of the metal base, the radiator manufacturing apparatus according to any one of claims 1 to 8 is used. The heat dissipating fins are fixed to the metal base.

According to the radiator manufacturing apparatus according to the present invention configured as described above, the press blade is provided so as to be movable in a direction intersecting the side surface of the heat radiating fin. It is possible to manufacture a radiator that can be made uniform, has a high fit between the fin and the metal base, and has a low contact thermal resistance between the metal base and the fin.
Moreover, since the manufacturing method of the semiconductor device according to the present invention uses the radiator manufacturing device according to the present invention, the radiator having high fitting property between the fin and the metal base and low contact thermal resistance between the metal base and the fin. Can be manufactured.

It is sectional drawing of the heat radiator manufactured by the heat radiator manufacturing apparatus which concerns on this invention. It is sectional drawing which shows the structure of the press blade assembly in the heat radiator manufacturing apparatus of Embodiment 1 which concerns on this invention. It is sectional drawing which shows typically the mode after performing caulking by the press blade assembly of Embodiment 1. FIG. It is a side view of the heat radiator manufacturing apparatus of Embodiment 1 provided with the press blade assembly shown in FIG. It is sectional drawing about the YY line of FIG. It is sectional drawing of the heat radiator manufacturing apparatus of the modification of Embodiment 1 which concerns on this invention. It is sectional drawing which expands and shows a part of heat radiator manufacturing apparatus of Embodiment 2 which concerns on this invention. It is sectional drawing of the heat radiator produced by the heat radiator manufacturing method of Embodiment 3 which concerns on this invention.

Embodiments according to the present invention will be described below.
Embodiment 1. FIG.
FIG. 1 shows a radiator manufactured by a radiator manufacturing apparatus according to the present invention, and is used as a heat sink of a semiconductor device. 2 is a cross-sectional view showing a configuration for realizing the press blade assembly of the press blade 8 in the heat radiator manufacturing apparatus according to the first embodiment of the present invention, and FIG. 3 shows the manufacturing of the heat radiator according to the first embodiment. It is sectional drawing which shows typically the mode after performing caulking with an apparatus.
Hereinafter, the self-alignment mechanism of the press blade 8 will be described with reference to FIGS.

First, an example of a radiator to which the radiator manufacturing apparatus of Embodiment 1 is applied will be described with reference to FIG.
The radiator shown in FIG. 1 includes a metal base 4 and heat radiating fins 5, and the heat radiating fins 5 are provided in fitting grooves between the convex portions 4 a and the fixed convex portions 4 b respectively formed on the upper surface of the metal base 4.
Here, a widening groove 4g is formed on the upper surface of the convex portion 4a, and the widening groove 4g is widened by a press blade 8 to be described later, and the radiating fin 5 is fixed to the fitting groove. Moreover, it is preferable to form the fixed convex part 4b higher than the convex part 4a. Thereby, the radiation fin 5 can be fixed reliably and stably by the caulking process described later.

  Next, in the heat radiator manufacturing apparatus according to the first embodiment of the present invention, when the press blade 8 expands the widening groove 4g, the center of the tip thereof coincides with the center line extending in the longitudinal direction of the widening groove 4g. A basic configuration (press blade assembly) for realizing a moving self-alignment mechanism will be described.

  As shown in FIG. 2, the press blade assembly according to the first embodiment of the present invention includes a press blade 8 that moves downward along the side surface of the radiating fin 5 to push and widen the widening groove 4 g. 8 is provided to be movable in a horizontal direction (a direction orthogonal to the side surface of the radiation fin 5).

  Specifically, in the press blade assembly of the first embodiment, the press blade 8 has a wedge-shaped tip portion 8a in order to push and widen the widening groove 4g, and the ridge line 8r of the tip portion 8a is directly above the widening groove 4g. It is supported by the support shaft 12 so as to be located at The press blade 8 has a support shaft 12 inserted into a through-hole formed in the press blade 8 and is supported at a predetermined height, so that the press blade 8 can move in the axial direction of the support shaft 12. A gap is provided between the through hole of the press blade 8 and the support shaft 12.

  Further, the press blade assembly of the first embodiment has the fin guide plate 10 provided so as to face the fixed convex portion 4b in addition to the press blade 8, and the press blade 8 and the fin guide plate 10 are provided alternately. ing. Similar to the press blade 8, the fin guide plate 10 is supported at a predetermined height by inserting a support shaft 12 into a through hole formed in the fin guide plate 10. The fin guide plate 10 may be configured to be movable in the axial direction of the support shaft 12 or may be fixed to the support shaft 12.

  And between the press blade 8 and the fin guide plate 10, the elastic member 9 which consists of the disc spring 9a is provided, for example. The disc spring 9a has a through hole in the center, and the two disc springs 9a are provided between the press blade 8 and the fin guide plate 10 so that the convex surfaces are in contact with each other. By this elastic member 9, the press blade 8 is initially set so that the ridge line 8r of the tip 8a is positioned immediately above the widening groove 4g.

In the radiator manufacturing apparatus according to the first embodiment configured as described above, when the press blade assembly is lowered along the side surface of the radiating fin 5, the self-alignment mechanism works as described below, and the widening groove is formed. 4g can be spread evenly from side to side.
For example, assuming that the tip 8a of the press blade 8 is in contact with one side wall on both sides of the widening groove 4g first, the press blade 8 moves to the other side wall and contacts the both side walls. Press to spread the side walls on both sides.
Further, when the tip 8a of the press blade 8 is in contact with the side walls on both sides of the widening groove 4g at the same time, pressure is applied so as to push the side walls on both sides without expanding left and right.

As described above, the press blade assembly according to the first embodiment is, for example, a case where the press blade 8 is misaligned with respect to the widening groove 4g due to processing variation of the metal base 4 or the like. When the widening groove 4g is expanded, the ridgeline 8r of the tip 8a moves so as to coincide with the center line extending in the longitudinal direction of the widening groove 4g (self-alignment mechanism), and the widening groove 4g is always evenly pushed left and right. (FIG. 3).
When the caulking process is completed and the pressing force is released, the press blade 8 automatically returns to the initial position.

According to the heat radiator manufacturing apparatus of the first embodiment provided with the above press blade assembly, the processing accuracy of the widening groove dimension and position of the metal base 4 can be moderated, and the cost of the metal base can be reduced. .
Note that the movable range (play displacement amount) of the press blade 8 in the press blade assembly is based on, for example, the difference between the linear expansion coefficients of the mold resin and the base, the difference between the after cure temperature and the normal temperature, and the length of the metal base 4. It is set so that the processing variation assumed in the above can be absorbed.

Hereinafter, the whole structure of the heat radiator manufacturing apparatus of Embodiment 1 provided with the said press blade assembly is demonstrated, referring FIG.4 and FIG.5.
The press blade assembly in which the press blade 8, the fin guide plate 10 and the elastic member 9 are supported by the support shaft 12 is, for example, an outer member having a guide upper plate 11a and a guide side plate 11b as shown in FIGS. It is incorporated in the guide plate 11.
4 and 5 show an example in which the press blade assembly in which the press blade 8 and the fin guide plate 10 are supported by the two support shafts 12 is used, the present invention is limited to this. It is not a thing and what is necessary is just one or more support shafts.

  Specifically, the outer guide plate 11 includes guide side plates 11b attached to both ends of the guide upper plate 11a. Each guide side plate 11b is provided with a hole for supporting the support shaft 12. The press blade assembly is attached to the outer guide plate 11 so that the upper surface of the press blade 8 of the press blade assembly and the upper surface of the fin guide plate 10 are in contact with the lower surface of the guide upper plate 11a. The method of fixing the support shaft 12 to the guide side plate 11b is not particularly limited. For example, as shown in FIGS. 4 and 5, the guide shaft is guided to a screw portion formed at the tip portion of the support shaft 12. What is necessary is just to make it fix with the volt | bolt 13 from the outer side of the side plate 11b.

  In the press blade assembly of the radiator manufacturing apparatus according to Embodiment 1 described above, a disc spring is used as the elastic member 9, but the present invention is not limited to this, and the ring-shaped elastic body (hard material) shown in FIG. (Rubber, elastic resin) may be used.

In the first embodiment, the upper end surface 8b of the press blade 8 is processed flat and is in contact with the flat outer guide plate. For this reason, when the press blade 8 is displaced and is pressed perpendicularly to the widening groove 4g of the metal base 4, a horizontal force is applied. At this time, each press blade 8 has a disc spring 9a and an upper end surface 8b. Due to the action of the flat surface and the flat surface of the outer guide plate, it moves horizontally while applying vertical pressure, and automatically prevents the piece from being caulked.
By finishing the upper end surface 8b of the press blade 8 and the lower surface of the outer guide plate as smooth surfaces, horizontal movement can be facilitated and stable caulking can be performed.
Further, by setting the spring constant of the disc spring 9a to an appropriate value, it is possible to ensure smooth movement of the press blade 8 and to achieve stable caulking.

  However, in the present invention, the upper end surface 8b of the press blade 8 can be curved as in the second embodiment.

Embodiment 2. FIG.
As shown in FIG. 7, the radiator manufacturing apparatus according to the second embodiment of the present invention has a concave arcuate curved surface such that the rear end surface 8 b of the press blade 8 is in contact with the lower surface of the guide upper plate at a part of the rear end surface. Except for this, the configuration is the same as that of the radiator manufacturing apparatus of the first embodiment.

In the radiator manufacturing apparatus according to Embodiment 2 configured as described above, the press blade 8 is directed toward the center of the widening groove 4g of the convex portion 4a because the rear end surface 8b of the press blade 8 is formed in a concave arc shape. When the self-alignment is performed, the friction between the rear end surface 8b of the press blade 8 and the outer guide plate 11 can be reduced, so that the press blade 8 can be easily moved. Thereby, the fitting process of the fin 5 and the metal base 4 can be performed smoothly, the processing throughput can be improved, and the productivity can be greatly improved.
Note that the end surface of the fin guide plate 10 (the surface in contact with the outer guide plate 11) may be formed in a concave arc shape or flat (plane) as in the case of the rear end surface 8b.

  In the heat radiator manufacturing apparatus according to the first and second embodiments described above, the mechanism in which the press blade 8 moves in the lateral direction perpendicular to the pressurizing movement direction and self-aligns toward the center of the groove 4g has been mainly described. However, the present invention is not limited to this, and instead of moving in the lateral direction or in addition to moving in the lateral direction, for example, rotation about the central axis of the arcuate rear end surface 8b in the second embodiment. The function of following the positional deviation of the press blade may be fulfilled by the movement of the tip end due to. Even with such rotational movement or rotational movement, the aspect ratio of the press blade (the ratio of the length in the pressurization direction to the thickness of the press blade) is sufficiently large, so there is almost no fluctuation in the pressurization direction. Thus, it is possible to realize a movement in which only the tip portion moves. Further, by further providing a shaft support at the end portion in the front-rear direction in the figure (not shown), it is possible to prevent the press blade from falling off when the press processing is finished and the press blade is raised (or when the workpiece is lowered). It is possible to cope with strong caulking power.

Embodiment 3. FIG.
Embodiment 3 which concerns on this invention concerns on the manufacturing method of the semiconductor device used for the heat radiator manufacturing apparatus of Embodiment 1 or 2. FIG.
First, the configuration of a semiconductor device manufactured by the semiconductor device manufacturing method of Embodiment 3 will be described with reference to FIG.
The semiconductor device of FIG. 8 includes a radiator shown in FIG. 1, a frame 2a fixed to the lower surface of the metal base 4 via an insulating sheet 1, a semiconductor element 3, and a frame 2b connected to the semiconductor element 3 by wires. The base portion (joint portion) excluding the fixed convex portion 4b and the widened convex portion 4a of the metal base 4 is sealed together with the semiconductor element 3 by mold resin.

  And in the manufacturing method of the semiconductor device of Embodiment 3 which concerns on this invention, after joining the semiconductor element 3 to the metal base 4 and resin-sealing, it is used for the heat radiator manufacturing apparatus of Embodiment 1 or 2, and the widening groove | channel 4g. And the heat dissipating fin 5 is fitted and fixed to the metal base 4.

Thus, after resin sealing, if it is going to pressurize the widening groove | channel 4g and it is going to fit and fix the radiation fin 5, when it seals with a thermosetting epoxy resin, for example, a curing temperature will usually be 180 degreeC. However, in the process of returning from the curing temperature to room temperature, since there are a plurality of constituent materials included in the mold resin 6, warping occurs due to the difference in linear expansion coefficient, and the fixed convex portion 4 b and the widened convex portion 4 a The position accuracy of will deteriorate. However,
Since the semiconductor device manufacturing method according to the third embodiment is used in the radiator manufacturing apparatus according to the first or second embodiment, the widening groove 4g is not biased by the self-alignment function, and stable caulking is possible. It becomes.

DESCRIPTION OF SYMBOLS 1 Insulation sheet 2 Frame 3 Semiconductor element 4 Metal base 4a Convex 4b Fixed convex 4g Widening groove 5 Radiation fin 6 Mold resin 8 Press blade 8a Wedge-shaped tip 8b Upper end 8r Ridge line 9 Elastic member 9a Belleville spring 9b Elastic body DESCRIPTION OF SYMBOLS 10 Fin guide plate 11a Guide upper plate 11b Guide side plate 11 Outer guide plate 12 Support shaft

Claims (9)

A radiator manufacturing apparatus for manufacturing a radiator including a metal base and a heat radiating fin, wherein the heat radiating fin is fixed to the metal base at one end thereof by expanding a groove on a convex portion provided on the metal base. Because
A press blade that moves along the side surface of the heat dissipating fins to expand the groove,
The radiator manufacturing apparatus, wherein the press blade is provided so as to be movable in a direction intersecting a side surface of the radiation fin.   The press blade has a wedge-shaped tip portion having a ridge line parallel to the longitudinal direction of the groove, and the tip portion coincides with a center line where the ridge line extends in the longitudinal direction of the groove when the groove is expanded. The radiator manufacturing apparatus according to claim 1, which is movably provided.   An outer guide plate having a guide upper plate and a guide side plate; and a support shaft that passes through the press blade in a direction perpendicular to the ridgeline and is fixed to the guide side plate on both sides of the press blade. The heat radiator manufacturing apparatus according to claim 1, wherein the heat sink is supported by an outer guide plate so as to be movable in an axial direction of the support shaft.   The radiator manufacturing apparatus according to claim 3, wherein a rear end surface of the press blade is a curved surface so as to be in contact with a lower surface of the guide upper plate at a part of the rear end surface.   5. The radiator according to claim 3, wherein an elastic member having a through hole is provided on both sides of the press blade, the support shaft passes through the through hole, and the position of the press blade is initially set by the elastic member. manufacturing device.   The radiator manufacturing apparatus according to claim 5, wherein the elastic member is a disc spring curved toward both ends from the through hole.   The radiator manufacturing apparatus according to claim 5, wherein the elastic member is made of an elastic body.   The metal base has fixed convex portions provided alternately with the convex portions, and a radiator for manufacturing the radiator in which the radiating fins are fixed by the convex portions and the fixed convex portions in which grooves are expanded. It is a heat radiator manufacturing apparatus, Comprising: The heat radiator manufacturing apparatus as described in any one of Claims 1-7 which further has a fin guide plate in the position facing the said fixed convex part. A method of manufacturing a semiconductor device comprising a semiconductor element and the heat radiator,
The semiconductor element is bonded to a surface different from the surface on which the convex portion of the metal base is formed, and the semiconductor element is resin-sealed so as to include a part including the metal base bonding portion. The manufacturing method of the semiconductor device characterized by fixing the said radiation fin to the said metal base using the radiator manufacturing apparatus of any one of claim | item 1 -8.

Images