JP2711259B2 - Resin molding equipment - Google Patents
Resin molding equipmentInfo
- Publication number
- JP2711259B2 JP2711259B2 JP63129356A JP12935688A JP2711259B2 JP 2711259 B2 JP2711259 B2 JP 2711259B2 JP 63129356 A JP63129356 A JP 63129356A JP 12935688 A JP12935688 A JP 12935688A JP 2711259 B2 JP2711259 B2 JP 2711259B2
- Authority
- JP
- Japan
- Prior art keywords
- heat insulating
- insulating spacer
- support member
- support base
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、樹脂を加熱硬化して成形する装置に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an apparatus for molding a resin by heat curing.
第２図に示す樹脂成形装置は、金属製の支持基体１上
に複数の断熱スペーサ２を介して金属製の支持部材３を
載置し、ボルト６、７で支持部材３と支持基体１、断熱
スペーサ２を固着し、支持部材３上に成形型５を載置し
ていた。また、支持部材３内にはヒータ４を備え、該ヒ
ータ４に通電して支持部材３、成形型５を高温にし、成
形型５内に注入した樹脂を加熱硬化させ、上下から注入
圧以上の、例えば150Kg/cm2程度の圧力を加えて成形を
行うようになっていた。In the resin molding apparatus shown in FIG. 2, a metal support member 3 is placed on a metal support base 1 via a plurality of heat insulating spacers 2, and the support members 3 and the support base 1, The heat insulating spacer 2 was fixed, and the mold 5 was placed on the support member 3. Further, a heater 4 is provided in the support member 3, and the heater 4 is energized to raise the temperature of the support member 3 and the mold 5 to heat and cure the resin injected into the mold 5. For example, molding was performed by applying a pressure of about 150 kg / cm 2 .
このとき支持部材３の熱が支持基体１側へ伝わりやす
いと、加熱効率が悪くなるだけでなく、支持基体１の温
度分布および温度上昇による熱膨張によって支柱８と支
持基体１の摺動が不可能となるため、上記のように断熱
スペーサ２を具備するかまたは、支持基体１を強制水冷
するようにしていた。上記断熱方式の場合、断熱スペー
サ２は、熱伝導率が0.001cal/cm・sec・℃程度と低いシ
リコン樹脂からなるものを用いていた。At this time, if the heat of the support member 3 is easily transmitted to the support base 1 side, not only the heating efficiency is deteriorated, but also the sliding of the support 8 and the support base 1 due to the temperature distribution of the support base 1 and the thermal expansion due to the temperature rise. To make it possible, the heat insulating spacer 2 is provided as described above, or the support base 1 is forcibly water-cooled. In the case of the heat insulation method, the heat insulation spacer 2 is made of a silicon resin having a thermal conductivity as low as about 0.001 cal / cm · sec · ° C.
ところが、上記の如き断熱方式の樹脂成形装置では、
断熱スペーサ２がシリコン樹脂からなっていたため、耐
圧性が悪く、１〜３ケ月程度の使用で変形して、支持部
材３を水平に保てなくなり、新品と交換しなければなら
ず、非常に手間のかかるものであり、極端な場合には成
形型５のソリ発生に至る場合も生じていた。However, in the heat-insulating resin molding apparatus as described above,
Since the heat insulating spacer 2 is made of silicone resin, the pressure resistance is poor, and the supporting member 3 is deformed after being used for about 1 to 3 months, so that the supporting member 3 cannot be kept horizontal and must be replaced with a new one. In extreme cases, warping of the mold 5 may occur.
また、シリコン樹脂から成る断熱スペーサ２自体は非
常に熱伝導率の低いものであるが、支持部材３または支
持基体１と断熱スペーサ２との接触面が完全に密着する
ため、接触面における表面熱伝導率が高く、そのため全
体としての断熱効果は優れたものではなかった。その結
果、支持部材３の加熱効率が悪いという問題点があっ
た。Further, the heat insulating spacer 2 itself made of silicone resin has a very low thermal conductivity, but the contact surface between the supporting member 3 or the support base 1 and the heat insulating spacer 2 is completely adhered, so that the surface heat on the contact surface is reduced. The conductivity was high, and the heat insulation effect as a whole was not excellent. As a result, there is a problem that the heating efficiency of the support member 3 is poor.
一方、強制水冷方式では断熱スペーサ２は金属製で良
いが、支持部材３に埋設したヒータ４を大型とする必要
があり、消費電力が大きく、冷却水循環等のためランニ
ングコストが高いなど、前記断熱方式に比べて不利なも
のであった。On the other hand, in the forced water cooling system, the heat insulating spacer 2 may be made of metal. However, the heater 4 embedded in the support member 3 needs to be large in size, so that power consumption is large and running cost is high due to cooling water circulation and the like. It was disadvantageous compared to the method.
上記に鑑みて本発明は、樹脂成形装置の成形型と該成
形型を支持する支持基体との間に、熱伝導率が0.03cal/
cm・sec・℃未満でかつ圧縮強度が12000kg/cm2以上のセ
ラミックスからなる複数個の断熱スペースを隙間を設け
て並置したものである。In view of the above, the present invention has a thermal conductivity of 0.03 cal / between the molding die of the resin molding apparatus and the supporting base supporting the molding die.
A plurality of heat insulating spaces made of ceramics having a temperature of less than cm · sec · ° C. and a compressive strength of 12000 kg / cm 2 or more are juxtaposed with gaps.
以下本発明の実施例を説明する。 Hereinafter, embodiments of the present invention will be described.
第１図に示す樹脂成形装置は金属製の支持基体１上に
セラミックスから成る複数の断熱スペーサ２を介して金
属製の支持部材３を載置し、さらに成形型５を載置して
なるものである。前記支持部材３内にはヒータ４を備
え、またボルト6,7によって支持部材３と支持基体1,断
熱スペーサ２を固着している。The resin molding apparatus shown in FIG. 1 has a metal support member 3 placed on a metal support base 1 via a plurality of heat insulating spacers 2 made of ceramics, and further has a molding die 5 placed thereon. It is. A heater 4 is provided in the support member 3, and the support member 3, the support base 1, and the heat insulating spacer 2 are fixed by bolts 6,7.
上記断熱スペーサ２は、フォルステライト、ジルコニ
ア、ステアタイト、ムライト、ジルコン、チタニアなど
の熱伝導率が0.03cal/cm・sec・℃未満のセラミックス
からなり、断熱スペーサ２自体の断熱効果は高いもので
ある。The heat insulating spacer 2 is made of ceramics such as forsterite, zirconia, steatite, mullite, zircon, and titania having a thermal conductivity of less than 0.03 cal / cm · sec · ° C., and the heat insulating spacer 2 itself has a high heat insulating effect. is there.
また、セラミックスから成る断熱スペーサ２と、金属
から成る支持基体１、支持部材３との接触面は完全に密
着せず、わずかな隙間ができて空気層が存在するため、
表面熱伝導率は非常に小さくなる。しかも、複数個の断
熱スペーサ２を隙間を設けて並置したことから、該隙間
に存在する空気層によって断熱効果をより一層と高める
ことができ、全体としての断熱効果は非常に高いものと
なる。Further, the contact surfaces of the heat insulating spacer 2 made of ceramics, the support base 1 made of metal, and the support member 3 do not completely adhere to each other, and a slight gap is formed, so that an air layer exists.
The surface thermal conductivity becomes very small. In addition, since a plurality of heat insulating spacers 2 are arranged side by side with a gap, the heat insulating effect can be further enhanced by the air layer existing in the gap, and the heat insulating effect as a whole becomes very high.
さらに断熱スペーサ２をセラミックスから形成してあ
ることにより、強度が大きく変形しにくいため、長期間
交換せずに使用することができる。Further, since the heat insulating spacer 2 is formed from ceramics, the strength is large and the deformation is difficult, so that the heat insulating spacer 2 can be used without replacement for a long time.
次に第１表に示す、さまざまな材質を用いて、直径40
mm、厚さ30mmの円柱形状をした断熱スペーサ２を試作
し、この断熱スペーサ２を40個用いて、600mm×400mm×
50mmの鋼材からなる支持部材３を支持基体１上に保存
し、使用試験を行った。まず、同一条件の下でヒータ４
に通電し、成形型５が300℃となるまでの時間を測定
し、次に１ケ月使用後の断熱スペーサ２の変形状態を調
べた。結果は第１表の通りである。Next, using various materials shown in Table 1, the diameter 40
A 30 mm thick, heat insulating spacer 2 having a columnar shape and a thickness of 30 mm was prototyped, and 40 heat insulating spacers 2 were used to form a 600 mm × 400 mm ×
The support member 3 made of a 50 mm steel material was stored on the support base 1 and a use test was performed. First, under the same conditions, the heater 4
And the time required for the mold 5 to reach 300 ° C. was measured, and then the deformation state of the heat insulating spacer 2 after one month of use was examined. The results are shown in Table 1.
第１表より、断熱スペーサ２としてNo.5のシリコン樹
脂を用いた場合は、成形型５が300℃となるまでの加熱
時間が３時間と長く、１ケ月後には変形が大きいため新
品と交換しなければならなかった。これは、前記したよ
うにシリコン樹脂と金属との接触面における表面熱伝導
率が高く、全体としての断熱効果が小さいため、加熱効
果が悪いことを示している。 According to Table 1, when No. 5 silicone resin is used as the heat insulating spacer 2, the heating time for the mold 5 to reach 300 ° C. is as long as 3 hours, and after one month, the deformation is large. I had to. This indicates that the heating effect is poor because the surface thermal conductivity at the contact surface between the silicon resin and the metal is high and the heat insulation effect as a whole is small as described above.
また、第１表中、No.3,4のアルミナ、窒化珪素を用い
た場合は、セラミックと金属との接触面における表面熱
伝導率を小さくできるが、断熱スペーサ２自体の熱伝導
率が0.03cal/cm・sec・℃以上と高く、全体としての断
熱効果が小さいため、支持基体１の昇温が大きく、支柱
８との摺動が困難となってしまい試験を中止した。In Table 1, when No. 3 and No. 4 alumina and silicon nitride are used, the surface thermal conductivity at the contact surface between the ceramic and the metal can be reduced, but the thermal conductivity of the heat insulating spacer 2 itself is 0.03. Cal / cm · sec · ° C. or higher, and the heat insulation effect as a whole was small. Therefore, the temperature of the support base 1 was large and it was difficult to slide the support 8, and the test was stopped.
これらに対し、本発明実施例に係るNo.1,2のフォルス
テライト、ジルコニアを用いればセラミックスと金属と
の接触面における表面熱伝導率が小さいだけでなく、断
熱スペーサ２自体の熱伝導率が低いこともあって、全体
としての断熱効果を大きくできる結果、成形型５を300
℃とするまでの時間が１〜1.2時間と短くすることがで
きた。しかも、上記フォルステライト、ジルコニアは、
第２表に示すように、熱伝導率が0.03cal/cm・sec・℃
未満の他のセラミックスに比べ、圧縮強度が12000kg/cm
2以上と優れた耐圧性を有していることから、１カ月後
も特に変化は見られず、優れた結果を示した。On the other hand, when the forsterites and zirconia of Nos. 1 and 2 according to the embodiment of the present invention are used, not only the surface thermal conductivity at the contact surface between the ceramic and the metal is small, but also the thermal conductivity of the heat insulating spacer 2 itself is reduced. Due to the low temperature, the heat insulation effect as a whole can be increased.
The time until it reached ° C was shortened to 1-1.2 hours. Moreover, the above forsterite and zirconia,
As shown in Table 2, the thermal conductivity is 0.03 cal / cm · sec · ° C
Compressive strength of 12000kg / cm compared to other ceramics less than
Since it had an excellent pressure resistance of 2 or more, no change was observed even after one month, showing excellent results.
上記断熱スペーサ２の形状は、円柱状、円筒状、角柱
状などさまざまなものとすることができ、ボルト７を挿
通するための孔を形成したものでもよい。実際に用いる
場合は、支持部材３の大きさや使用温度に応じて形状や
使用する個数を自由に変更できる。さらに、断熱スペー
サ２の厚さを大きくすると、断熱効果は大きくなるが、
支持安定性が悪くなり、全体的に大きなスペースを必要
とすることから、前記実験例程度の大きさとしたものが
良かった。 The shape of the heat insulating spacer 2 can be various shapes such as a columnar shape, a cylindrical shape, and a prismatic shape, and may be a shape having a hole for inserting the bolt 7. In the case of actual use, the shape and the number to be used can be freely changed according to the size of the support member 3 and the use temperature. Furthermore, when the thickness of the heat insulating spacer 2 is increased, the heat insulating effect is increased.
Since the supporting stability is deteriorated and a large space is required as a whole, the one having the size of the experimental example is preferable.
また、断熱スペーサ２の支持基体１、支持部材３との
接触面は中心線平均粗さ（Ra）0.5〜0.6μｍとしてある
が、もっと粗い面としたり、表面に微細な凹凸を形成す
れば、前記した接触面の隙間を大きくでき、より断熱効
果を高めることができる。The contact surface of the heat insulating spacer 2 with the support base 1 and the support member 3 has a center line average roughness (Ra) of 0.5 to 0.6 μm. However, if the surface is made rougher or fine irregularities are formed on the surface, The gap between the contact surfaces can be increased, and the heat insulating effect can be further enhanced.
以上の実施例では、支持基体１、支持部材３が金属か
らなるもののみを示したが、セラミックなど他の材質か
らなるものであっても同様に優れた断熱効果を示した。In the above embodiment, only the support base 1 and the support member 3 are made of metal. However, even when the support base 1 and the support member 3 are made of other materials such as ceramics, the same excellent heat insulating effect is exhibited.
叙上のように本発明によれば、樹脂成形装置の成形型
と支持基体の間に熱伝導率が0.03cal/cm・sec・℃未満
のセラミックスからなる複数個の断熱スペーサを隙間を
設けて並置したことによって、断熱スペーサと支持基
体、支持部材間の表面熱伝導率も小さくなるため、全体
としての断熱効果を大きくできる結果、成形型のソリを
防止し、加熱効率を良くすることができるだけでなく、
長期間使用しても断熱スペーサが変形せず、交換の必要
がないなどの特長を有する樹脂成形装置を提供できる。As described above, according to the present invention, a plurality of heat insulating spacers made of ceramics having a thermal conductivity of less than 0.03 cal / cm The juxtaposition also reduces the surface thermal conductivity between the heat insulating spacer and the supporting base and supporting members, so that the overall heat insulating effect can be increased. As a result, it is possible to prevent warping of the mold and improve the heating efficiency as much as possible. But not
It is possible to provide a resin molding apparatus having such features that the heat insulating spacer is not deformed even after long-term use and does not need to be replaced.
第１図は本発明実施例に係る樹脂成形装置を示す断面
図、第２図は従来の樹脂成形装置を示す断面図である。 1:支持基体 2:断熱スペーサ 3:支持部材 4:ヒータ 5:成形型FIG. 1 is a sectional view showing a resin molding apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional resin molding apparatus. 1: Support base 2: Heat insulation spacer 3: Support member 4: Heater 5: Mold
Claims (1)
間に、熱伝導率が0.03cal/cm・sec・℃未満でかつ圧縮
強度が12000kg/cm2以上のセラミックスからなる複数個
の断熱スペーサを隙間を設けて並置したことを特徴とす
る樹脂成形装置。Between 1. A support base for supporting the mold and the forming die, a plurality of thermal conductivity 0.03cal / cm · sec · ℃ less than a and compressive strength consists of 12000kg / cm 2 or more ceramic A resin molding apparatus, wherein the heat insulating spacers are arranged side by side with a gap provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63129356A JP2711259B2 (en) | 1988-05-26 | 1988-05-26 | Resin molding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63129356A JP2711259B2 (en) | 1988-05-26 | 1988-05-26 | Resin molding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01297221A JPH01297221A (en) | 1989-11-30 |
| JP2711259B2 true JP2711259B2 (en) | 1998-02-10 |
Family
ID=15007574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63129356A Expired - Lifetime JP2711259B2 (en) | 1988-05-26 | 1988-05-26 | Resin molding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2711259B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19521550A1 (en) * | 1995-06-16 | 1996-12-19 | Luckow Hans Juergen | Injection molding method and apparatus |
| JP5592086B2 (en) * | 2009-07-03 | 2014-09-17 | 株式会社ソディック | Molding device clamping machine |
| JP5215445B2 (en) * | 2011-10-17 | 2013-06-19 | ファナック株式会社 | Injection molding machine with adapter plate with temperature control piping |
| JP5905378B2 (en) * | 2012-11-29 | 2016-04-20 | 住友重機械工業株式会社 | Injection molding machine |
| JP6440599B2 (en) * | 2015-08-28 | 2018-12-19 | Ｔｏｗａ株式会社 | Resin molding apparatus and resin molding method |
| JP6785897B2 (en) | 2019-01-28 | 2020-11-18 | Ｔｏｗａ株式会社 | Resin molding equipment and manufacturing method of resin molded products |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5812715A (en) * | 1981-07-16 | 1983-01-24 | Matsushita Electric Ind Co Ltd | Mold for resin molding |
-
1988
- 1988-05-26 JP JP63129356A patent/JP2711259B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01297221A (en) | 1989-11-30 |
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