TWI729677B - Resin molding device and method for manufacturing resin molded product - Google Patents

Abstract

The disclosure prevents a heat insulating member from being deformed or damaged due to deformation of a platen or the like, including molds (2, 3); platens (41, 42) to which the molds (2, 3) are attached; a plurality of heat insulating members (10) which are provided between the molds (2, 3) and the platens (41, 42), form a space between the molds (2, 3) and the platen (41) and transmit a clamping force from the platens (41, 42) to the molds (2, 3); and a fixing part (11) which fixes the molds (2, 3) with respect to the platens (41, 42), wherein the plurality of heat insulating members (10) are divided into first division elements (5) provided on the molds (2, 3) and second division elements (6) provided on the platens (41, 42).

Description

Resin molding device and manufacturing method of resin molded product

The present invention relates to a resin molding device and a method of manufacturing a resin molded product.

In a resin molding device using compression molding, as a technology to interpose a heat insulation spacer between a molding die and a platen, and heat the molding die between a heater (heater) that heats the molding die and the platform, as a technology, The technique shown in Patent Document 1 is conceivable. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-open No. 1-297221

[The problem to be solved by the invention]

The resin molding device uses a ceramic insulating spacer. However, if a lateral load is applied to the insulating spacer due to deformation of the platform during mold clamping, or a force in the tensile or compression direction is applied, the insulating spacer may be blocked. The thermal spacer is deformed or broken.

Therefore, the main subject of the present invention is to deform or break the heat insulating member due to deformation or the like of the platform on which the molding die is attached. [Means to solve the problem]

That is, the resin molding apparatus of the present invention is characterized by including: a molding die; a platform on which the molding die is mounted; a plurality of heat insulating members provided between the molding die and the platform, and the molding die and the platform A space is formed between the platforms, and the clamping force from the platform is transmitted to the forming mold; and a fixing part that fixes the forming mold with respect to the platform; and the plurality of heat insulating members are It is divided into a first division element provided on the forming mold and a second division element provided on the platform. [Effects of the invention]

According to the present invention constituted in this way, it is possible to prevent the thermal insulation member from being deformed or damaged due to the deformation of the platform on which the molding die is attached.

Next, the present invention will be explained in more detail with examples. However, the present invention is not limited by the following description.

As described above, the resin molding apparatus of the present invention is characterized by comprising: a molding die; a platform on which the molding die is mounted; a plurality of heat insulating members provided between the molding die and the platform, and A space is formed between the forming mold and the platform, and the clamping force from the platform is transmitted to the forming mold; and a fixing portion that fixes the forming mold with respect to the platform, and the plurality of partitions The thermal component is divided into a first division element provided on the forming mold and a second division element provided on the platform. In the case of the resin molding apparatus, a space is formed between the molding die and the platform by a plurality of heat insulating members. The space functions as a heat insulating layer, thereby reducing the heat transferred from the molding die to the platform and suppressing heat dissipation to the outside. In particular, in the present invention, the plurality of heat insulating members are divided into the first division element provided on the forming mold and the second division element provided on the platform. Therefore, even if the platform is deformed, the first division element and the second division element The deformation of the platform is absorbed between the elements. As a result, it is possible to prevent the thermal insulation member from being deformed or damaged due to deformation of the platform on which the molding die is attached. In addition, by dividing the plurality of heat insulating members, the platform can be relatively deformed with respect to the forming die, and the deformation of the forming die can be made smaller than the deformation of the platform, preferably The amount of deformation of the platform is not transmitted to the forming die. As a result, it is possible to maintain the flatness of the forming mold at the time of mold clamping. In addition, when parts need to be replaced due to wear, breakage, etc. of the first split element or the second split element, at least one of the first split element and the second split element can be replaced, so maintenance can be facilitated. .

As a specific embodiment, the contact surface of the first dividing element to the second dividing element is convexly curved or flat. In addition, the contact surface of the second dividing element to the first dividing element is convexly curved or flat.

It is conceivable that the resin molding apparatus has a lower mold and an upper mold as the molding mold, and has a first platform on which the lower mold is mounted and a second platform on which the upper mold is mounted as the platform. In the above configuration, it is desirable that the plurality of heat insulating members are provided between the upper mold and the second platform, and between the lower mold and the first platform, respectively. Thereby, it is possible to reduce the heat transmitted to the second platform and the first platform, and to suppress heat dissipation to the outside.

It is desirable that the resin molding device includes an intermediate block provided between the molding die and the platform, and provided with the plurality of first dividing elements or the plurality of second dividing elements. With the above-mentioned configuration, by attaching the intermediate block to the forming mold or the platform, a plurality of divided elements can be installed on the forming mold or the platform at once, and the replacement operation can be simplified.

When the forming mold or the intermediate block is fixed to the platform with bolts, if the fastening force is increased, the forming mold or the intermediate block is deformed from the contact surface of the split element as a starting point. As a result, the flatness of the forming mold may be damaged from before the mold is closed. In order to solve the problem, it is desirable that the fixing part elastically holds the forming die with respect to the platform.

Since the platform can be relatively deformed relative to the forming die by dividing the heat insulating member, the position of the forming die relative to the platform may be shifted. Therefore, it is desirable that the resin molding apparatus includes a positioning portion provided on the inner side of the plurality of heat insulating members to position the platform and the molding die. In addition, the so-called that the platform can be changed relative to the forming mold can also be expressed as being independent of the forming mold and the platform can be changed.

In addition, a method of manufacturing a resin molded product using the resin molding apparatus is also one aspect of the present invention.

<One embodiment of the present invention> Hereinafter, an embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, with regard to any of the figures shown below, they are all easily understood and are appropriately omitted or exaggerated and schematically described. The same symbols are assigned to the same constituent elements, and the description is appropriately omitted.

The resin molding apparatus 100 of the present embodiment manufactures a resin molded product by sealing the component mounting surface on which the electronic component is mounted with resin, with respect to the substrate on which the electronic component is mounted. In addition, the substrate can include, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a lead frame, and the like. As the resin material, in addition to pelletized or powdered resin materials, resin materials in the form of liquids, flakes, and flakes can also be used.

As shown in FIG. 1, the resin molding apparatus 100 has: a lower mold 2 which is a first molding mold in which a cavity is formed; an upper mold 3 is a second molding mold that holds a substrate; and a mold clamping mechanism 4 , The lower mold 2 and the upper mold 3 are installed and the lower mold 2 and the upper mold 3 are closed.

The mold clamping mechanism 4 has: a movable plate 41 (hereinafter also referred to as a first platform 41) on which the lower mold 2 is installed, an upper fixed plate 42 (hereinafter also referred to as a second platform 42) on which the upper mold 3 is installed, and A driving mechanism 43 that moves the first platform 41 up and down.

The lower mold 2 is mounted on the upper surface of the first platform 41 and is supported by a plurality of pillar portions 45 provided on the lower fixed plate 44 so as to be movable up and down. In this embodiment, the first platform 41 is supported in a vertically movable manner by using four pillar portions (also referred to as tie-bars) 45 provided at the four corners of the rectangular lower fixed disk 44 in a plan view.

The upper mold 3 is mounted on the lower surface of the second platform 42 and is fixed to the upper ends of the four pillars 45 so as to face the first platform 41.

The driving mechanism 43 is provided between the first platform 41 and the lower fixed plate 44, and by moving the first platform 41 up and down, the lower mold 2 and the upper mold 3 are clamped and a predetermined clamping force (forming pressure) is applied. The drive mechanism 43 of this embodiment is a linear motion method that uses a ball screw mechanism 431 that converts the rotation of a servo motor or the like into linear movement and transmits it to the first stage 41, but it may also be a toggle link, for example. (Toggle link) A link system in which a link mechanism such as a servo motor transmits a power source such as a servo motor to the first platform 41.

Furthermore, between the lower mold 2 and the first platform 41, a lower mold holding portion 46 for holding the lower mold 2 is provided. The lower mold holding portion 46 has a heating plate and the like for heating the lower mold 2.

Between the upper mold 3 and the second platform 42, an upper mold holding portion 47 for holding the upper mold 3 is provided. The upper mold holding portion 47 has a heating plate and the like for heating the upper mold 3.

Furthermore, in this embodiment, a plurality of heat insulating members 10 are provided between the upper mold 3 and the second platform 42 and between the lower mold 2 and the first platform 41.

The plurality of heat insulating members 10 between the upper mold 3 and the second platform 42 form a space between the upper mold 3 and the second platform 42. In addition, the plurality of heat insulating members 10 between the lower mold 2 and the first platform 41 form a space between the lower mold 2 and the first platform 41.

Furthermore, the plurality of heat insulating members 10 are divided into a first division element 5 provided on the upper mold 3 side or lower mold 2 side, and a second division element 6 provided on the second platform 42 or the first platform 41.

The plurality of first splitting elements 5 and second splitting elements 6 between the upper mold 3 and the second platform 42 transfer the mold clamping force of the driving mechanism 43 from the second platform 42 to the upper mold 3. In addition, the plurality of first split elements 5 and second split elements 6 between the lower mold 2 and the first platform 41 transmit the mold clamping force of the driving mechanism 43 from the first platform 41 to the lower mold 2. The first split element 5 and the second split element 6 are, for example, cylindrical metal pillars.

In this embodiment, between each platform 41, platform 42 and each forming die 2 and forming die 3, four first split elements 5 and four second split elements 6 are provided corresponding to the four pillar portions 45. Specifically, it is set to be located at the vertex of a quadrangle in plan view.

The plurality of first dividing elements 5 are provided on the lower mold 2 side and the upper mold 3 side, and the plurality of second dividing elements 6 are provided on the first platform 41 and the second platform 42 corresponding to the first dividing elements 5. Furthermore, on the second platform 42 side, the upper end surface of the first split element 5 and the lower end surface of the second split element 6 become the contact surface 5a and the contact surface 6a that are in contact with each other. On the first platform 41 side, the first split element 5 The lower end surface of and the upper end surface of the second dividing element 6 become a contact surface 5a and a contact surface 6a that are in contact with each other. Here, the contact surface 6a becomes a convex curved contact surface.

Here, the plurality of first dividing elements 5 and second dividing elements 6 allow the first platform 41 or the second platform 42 to deform relative to the lower mold 2 or the upper mold 3, and reduce the clamping force from the first platform 41 or The second platform 42 is configured to be transferred to the lower mold 2 or the upper mold 3.

Specifically, as shown in FIG. 2, the contact surface 6 a of the second dividing element 6 has a convex curved surface shape. The contact surface 6 a of the present embodiment has a spherical shape swelling downward, and more specifically, has a spherical shape having an apex on the central axis of the second dividing element 6. On the other hand, the contact surface 5a of the first dividing element 5 is flat. Thus, the amount of deformation of the lower mold 2 is smaller than the amount of deformation of the first platform 41, and the amount of deformation of the upper mold 3 is smaller than the amount of deformation of the second platform 42. When the effect of these configurations is the most significant, the deformation of the first platform 41 or the second platform 42 will not be transmitted to the lower mold 2 or the upper mold 3 due to the convex curved contact surface 6a, and the deformation of the first platform 41 The amount of deformation of the lower mold 2 caused by the amount of deformation becomes zero, and the amount of deformation of the upper mold 3 caused by the amount of deformation of the second platform 42 becomes zero.

In this embodiment, the plurality of first dividing elements 5 provided in the upper mold 3 are fixed to the middle block 7A (hereinafter also referred to as the fixed side block 7A). The fixed side block 7A is fixed to the upper mold holding portion 47 that holds the upper mold 3. As a result, the plurality of first dividing elements 5 are provided on the upper mold 3. In addition, the plurality of first dividing elements 5 provided in the lower mold 2 are fixed to the middle block 7B (hereinafter also referred to as the movable side block 7B). The movable side block 7B is fixed to the lower mold holding portion 46 that holds the lower mold 2. As a result, the plurality of first dividing elements 5 are provided on the lower mold 2. In this embodiment, the first split element 5 and the second split element 6 are interposed between the second platform 42 and the upper mold 3, the upper mold holding portion 47, and the fixed side block 7A. In addition, the first split element 5 and the second split element 6 are interposed between the first platform 41 and the lower mold 2, the lower mold holding portion 46, and the movable mold which are directly mounted in a slidable manner with respect to the pillar portion 45 or via a mounting member. Between side blocks 7B.

Next, the peripheral structure of the second platform 42 and the fixed side block 7A will be described with reference to FIG. 3. In addition, in FIG. 3, illustration of the upper mold 3 and the upper mold holding portion 47 is omitted.

The resin molding apparatus 100 of this embodiment has a fixing portion 8 that fixes the upper mold 3 with respect to the second stage 42. The fixing portion 8 elastically holds the upper mold 3 relative to the second platform 42.

As shown in FIG. 4, the fixing portion 8 includes: a bolt 81 inserted into the through hole 7h formed in the fixed side block 7A and fastened to the second platform 42; and an elastic body 82 interposed between the head 811 of the bolt 81 And the fixed side block 7A.

The through hole 7h formed in the fixed side block 7A has a small diameter portion 7h1 into which the shaft portion 812 of the bolt 81 is inserted, and a large diameter portion 7h2 that accommodates the head portion 811 of the bolt 81. Furthermore, between the inner surface of the through hole 7h and the head 811 of the bolt 81, a spring, for example, as an elastic body 82 is provided.

According to this configuration, by inserting the elastic body 82 and the bolt 81 into the through hole 7h, and tightening the bolt 81 to the second platform 42, the elastic body 82 is clamped in the through hole 7h of the fixed side block 7A. Between the surface and the head 811 of the bolt 81, elastic force acts to press the fixed side block 7A against the second platform 42 to elastically hold and fix the fixed side block 7A and the upper mold 3. In this fixed state, the contact surface 5a of the first dividing element 5 of the fixed side block 7A and the contact surface 6a of the second dividing element 6 of the second platform 42 are in pressing contact.

In addition, by fixing the fixed side block 7A to the second platform 42, the first division element 5 and the second division element 6 are used to form a space between the second platform 42 and the fixed side block 7A, and the space serves as a heat insulation Layer functions. Thereby, the heat transmitted from the upper mold holding part 47 holding the upper mold to the second stage 42 is reduced, and the heat dissipation to the outside is suppressed.

Here, if the bolt 81 is tightened excessively, the fixed side block 7A may be deformed by the force received from the second dividing element 6 and the force received from the bolt 81. When the fixed side block 7A is deformed, the upper mold holding portion 47 and the upper mold 3 are also deformed.

Therefore, the fixed portion 8 of the present embodiment further includes a distance restricting portion 83 that restricts the distance between the second platform 42 and the fixed side block 7A. The distance restricting portion 83 is inserted into the through hole 7h of the fixed side block 7A together with the bolt 81, contacts the second platform 42 and the head 811 of the bolt 81, and restricts the distance between the second platform 42 and the fixed side block 7A. Specifically, the distance restricting portion 83 has a cylindrical shape into which the shaft portion 812 of the bolt 81 is inserted, one end surface in the axial direction is in contact with the lower surface of the second platform 42, and the other end surface in the axial direction is in contact with the head 811 of the bolt 81.

The distance limiting portion 83 determines the distance between the second platform 42 and the head 811 of the bolt 81, and determines the amount of deformation of the elastic body 82 provided between the head 811 of the bolt 81 and the fixed side block 7A. As a result, the elastic force applied to the fixed side block 7A by the elastic body 82 becomes constant. That is, the distance between the second platform 42 and the fixed side block 7A is restricted by the distance restricting portion 83, the deformation amount of the elastic body 82 is determined, and the elastic force applied to the fixed side block 7A becomes constant.

In addition, since the fixed side block 7A is held in a floating state with respect to the second platform 42, the positions of the fixed side block 7A and the upper mold 3 fixed to the fixed side block 7A may be shifted relative to the second platform 42.

Therefore, in this embodiment, as shown in FIG. 3, a positioning portion 9A for positioning the upper mold 3 with respect to the second platform 42 is provided. Specifically, as shown in FIG. 5, the positioning portion 9A includes a positioning hole 91 formed on the second platform 42 and the fixed side block 7A, a positioning hole 92, and a positioning pin 93 inserted into the positioning hole 91 and the positioning hole 92. In the present embodiment, the positioning pin 93 is fitted and fixed to the positioning hole 91, and the positioning pin 93 is inserted into the positioning hole 92 movably in its axial direction, but the reverse is also possible.

Here, in a state where the fixed side block 7A is fixed to the second platform 42, the positioning portion 9A is configured to be able to absorb the deformation of the second platform 42 with respect to the upper mold 3 at the time of mold clamping. Specifically, a gap is formed between the bottom surface of the positioning hole 92 and the upper end surface of the positioning pin 93, and the positioning pin 93 is configured to be slidable with respect to the positioning hole 92. In FIG. 5, in the positioning pin 93, the part to be fitted into the positioning hole 91 is referred to as the large diameter part 931, and the part inserted into the positioning hole 92 is referred to as the small diameter part 932. Furthermore, it is configured such that a gap is also formed between the upper surface of the step formed between the large-diameter portion 931 and the small-diameter portion 932 and the lower surface of the second platform 42. In addition, the positioning portion 9A can also be configured such that the positioning pin 93 has a uniform cross-sectional shape in the axial direction.

Next, the peripheral structure of the first platform 41 and the movable side block 7B will be described with reference to FIG. 6. In addition, in FIG. 6, illustration of the lower mold 2 and the lower mold holding portion 46 is omitted.

As shown in FIG. 6, the movable side block 7B for fixing the lower mold 2 is placed on the first platform 41. Specifically, the first dividing element 5 of the movable side block 7B is placed on the second dividing element 6 of the first stage 41.

In addition, when only the movable side block 7B is placed on the first platform 41, when the lower mold 2 and the upper mold 3 are opened, the lower mold 2 is in close contact with the upper mold 3, and the movable side block 7B is separated from the first platform. Platform 41. Therefore, the lower mold 2 may be fixed to the first platform 41 by using the same configuration as the fixing portion 8.

In addition, as shown in FIG. 6, a positioning portion 9B is provided between the first platform 41 and the movable side block 7B. Specifically, the positioning portion 9B includes a positioning hole 94 formed on the first platform 41 and the movable side block 7B, a positioning hole 95, and a positioning pin 96 inserted into the positioning holes 94 and the positioning holes 95. A gap is formed between the bottom surface of the positioning hole 95 and the upper end surface of the positioning pin 96, and the positioning pin 96 is configured to be slidable with respect to the positioning hole 95. In the present embodiment, a configuration is adopted in which the positioning pin 96 is fitted and fixed to the positioning hole 94, and the positioning pin 96 is inserted into the positioning hole 95 movably in its axial direction, but the reverse is also possible. The positioning pin 96 is formed in a shape having a uniform cross-sectional shape in the axial direction, but it may be formed in a shape whose diameter is different from above and below in the axial direction.

<Effects of this embodiment> According to the resin molding apparatus 100 of the present embodiment, a space is formed between the molding die 2, the molding die 3 and the platform 41 and the platform 42 by the plurality of heat insulating members 10. The space functions as a heat insulating layer, thereby reducing the heat transmitted from the molding die 2 and the molding die 3 to the platform 41 and the platform 42 and suppressing heat dissipation to the outside. Particularly in this embodiment, the plurality of heat insulating members 10 are divided into the first split element 5 provided on the forming mold 2, the forming mold 3, and the second split element 6 provided on the platform 41 and the platform 42. Therefore, even on the platform 41 When the platform 42 is deformed, the deformation of the platform 41 and the platform 42 is also absorbed between the first segmentation element 5 and the second segmentation element 6. As a result, it is possible to prevent the thermal insulation member 10 from being deformed or damaged due to deformation or the like of the platform 41 and the platform 42 on which the forming die 2 and the forming die 3 are attached. In addition, by dividing the plurality of heat insulation members 10, the platform 41 and the platform 42 can be relatively deformed with respect to the forming die 2 and the forming die 3, and the deformation amount of the forming die 2 and the forming die 3 can be made smaller than that of the platform 41 and the platform 41 and the platform. The amount of deformation of 42. As a result, it is possible to maintain the flatness of the forming mold 2 and the forming mold 3 at the time of mold clamping. Here, it can also be expressed that each of the platforms 41 and 42 is partially (partially) inclined from the convex-curved contact surface 6a as a starting point. In addition, when parts need to be replaced due to wear, breakage, etc. of the first split element 5 or the second split element 6, at least one of the first split element 5 and the second split element 6 can be replaced. Easy to maintain. In addition, due to the thermal insulation effect, it is possible to eliminate the need for expensive thermal insulation panels or forced cooling mechanisms such as air blowers used in conventional resin molding equipment, which can reduce the need to improve the heat resistance of peripheral (external) components, and can improve The thermal efficiency of the heater that heats the forming mold.

FIG. 7 shows the simulation results related to the deformation at the time of mold clamping. In the above simulation, it was assumed that the force equivalent to that at the time of mold clamping was applied from below the upper mold 3 and from above the lower mold 2.

According to the results, the second platform 42 and the first platform 41 are bent and deformed when the mold is clamped. In contrast, the fixed side block 7A of the upper mold 3 and the movable side block 7B of the lower mold 2 are not deformed, but maintain The flatness and parallelism of the upper mold 3 and the lower mold 2.

This is because the contact surface 5a and the contact surface 6a of the first dividing element 5 and the second dividing element 6 are relatively rotated, so the deformation of the second platform 42 and the first platform 41 is not transmitted to the fixing of the upper mold 3 The side block 7A and the movable side block 7B of the lower mold 2. In addition, it is conceivable that by forming the first split element 5 and the second split element 6 with metal, the elastic deformation of these split elements also contributes.

In addition, since the fixed side block 7A and the upper mold 3 are elastically held by the fixing portion 8, the relative rotation of the first split element 5 and the second split element 6 becomes easy.

Furthermore, the positioning portion 9A and the positioning portion 9B are provided at the central portion on the inner side of the plurality of first and second division elements 5 and 6, and the positioning hole 92 and the positioning hole 95 of the positioning portion 9A and the positioning portion 9B are provided. There is a gap between the positioning pin 93 and the positioning pin 96, so positioning can be performed without transmitting the deformation of the second platform 42 and the first platform 41 to the fixed side block 7A of the upper mold 3 and the movable side block 7B of the lower mold 2 .

In the conventional resin molding apparatus, if the substrate as the molding object is enlarged, in order to maintain the flatness and parallelism of the molding die, the rigidity of the constituent members such as the platform is increased, and the apparatus is increased in size and weight. However, in this embodiment, such an operation is not required, and therefore it is possible to reduce the size and weight of the device.

<Other Modified Embodiments> In addition, the present invention is not limited to the embodiment.

For example, in the above embodiment, the contact surface 6a of the second split element 6 is convexly curved, and the contact surface 5a of the first split element 5 is flat. However, the contact surface 6a of the second split element 6 may also be set as In a planar shape, the contact surface 5a of the first dividing element 5 is made into a convex curved shape.

In addition, as shown in FIG. 8, the contact surface 6 a of the second dividing element 6 may be a convex curved surface, and the contact surface 5 a of the first dividing element 5 may be a concave curved surface. In this case, the curvature of the contact surface 5a in the shape of a concave curved surface is smaller than the curvature of the contact surface 6a in the shape of a convex curved surface. That is, a part of the convex-curved contact surface 6a is accommodated in the recess of the concave-curved contact surface 5a.

Furthermore, when referring to a contact surface, the contact surface 5a of the first split element 5 and the contact surface 6a of the second split element 6 may be respectively convexly curved.

The convex shape is not limited to the spherical shape, and may be an elliptical spherical shape, or may be a convex strip extending in one direction. In addition, the convex curved shape only needs to be able to realize the relative rotation of the first dividing element 5 and the second dividing element 6, and for example, it may be a free curve.

In addition, as shown in FIG. 9, the contact surface 5 a of the first split element 5 and the contact surface 6 a of the second split element 6 may also be planar. Here, the contact surface 5a and the contact surface 6a may be horizontal surfaces or inclined surfaces.

Here, the second platform 42 deforms so that the center portion becomes higher during mold clamping, and the first platform 41 deforms so that the center portion becomes lower. Therefore, it is conceivable to change the contact surfaces 5a, The inclination of the contact surface 6a is as follows. That is, as shown in Figs. 10(a) and 10(b), the contact surface 5a of the first split element 5 provided on the upper mold 3 is set as an inclined surface whose inner side becomes higher and the outer side becomes lower, and is provided on the second platform The contact surface 6a of the second division element 6 of 42 is an inclined surface whose inner side becomes lower and the outer side becomes higher. In addition, the contact surface 5a of the first dividing element 5 provided on the lower mold 2 is an inclined surface whose inner side becomes higher and the outer side becomes lower, and the contact surface 6a of the second dividing element 6 provided on the first platform 41 is set as an inner variable surface. Slope surface that is low and high on the outside. By configuring the contact surface 5a of the first split element 5 and the contact surface 6a of the second split element 6 in this way, the first split element 5 and the second split element 6 can easily interact with each other according to the deformation of the respective platforms 41 and 42 slide.

_{Furthermore, an yttrium oxide film (Y 2} O ₃ ) containing nitrogen (N) and a group 4A element may be formed on at least one of the contact surface 5 a of the first split element 5 or the contact surface 6 a of the second split element 6. Here, the 4A group element can use at least one cation selected from the group consisting of titanium (Ti), zirconium (Zr), and hafnium (Hf). With the above-mentioned configuration, the first split element 5 and the second split element 6 easily slide against each other, and the flatness of the molding die 2 and the molding die 3 can be further maintained.

In the above-mentioned embodiment, the plurality of first dividing elements 5 are provided in the middle block 7A and the middle block 7B, but it may be a structure in which the plurality of second dividing elements 6 are provided in the middle block 7A and the middle block 7B, or It is also possible that the plurality of first split elements 5 and second split elements 6 are not provided in the middle block 7A and the middle block 7B, but in the forming mold 2, the forming mold 3, or the forming mold holding portion 46, and the forming mold holding portion. 47 or the composition of the platform 41 and the platform 42.

In the above-mentioned embodiment, the heat-insulating member 10 is provided in four places between the forming die 2, the forming die 3, the platform 41, and the platform 42. However, it may be a structure in which the heat-insulating member 10 is provided at two or more places. .

Furthermore, in the above-described embodiment, the first platform 41 is supported in a vertically movable manner by the four pillar portions 45, but the first platform 41 may be supported in a vertically movable manner by the two pillar portions 45. The two pillar portions 45 have, for example, a plate shape provided on opposite sides of the rectangular lower fixing plate 44. In this case, it is conceivable that the heat insulating member 10 is provided in two places along the opposing direction of the two pillar parts 45.

In the above-mentioned embodiment, the insulating member 10 is divided between the second platform 42 and the upper mold 3, and between the first platform 41 and the lower mold 2, but the second platform 42 may also be divided. A structure in which the thermal insulation member 10 is divided from one of the upper mold 3 or between the first platform 41 and the lower mold 2.

In addition, the number of heat insulating members 10 provided between the second platform 42 and the upper mold 3 and the number of heat insulating members 10 provided between the first platform 41 and the lower mold 2, The arrangement form or the structure of the heat insulating member 10 are different from each other.

The plurality of heat insulating members 10 provided between the second platform 42 and the upper mold 3 or between the first platform 41 and the lower mold 2 may also have their shapes changed according to positions.

In addition to the fixing part 8 of the above-mentioned embodiment, the fixing part 11 shown in FIG. 11 can also be used. The fixing portion 11 includes a bolt 111 inserted into the through hole 7h formed in the fixing side block 7A and fastened to the second platform 42; and a distance limiting portion 112 that limits the distance between the second platform 42 and the fixing side block 7A. The distance restriction portion 112 is inserted into the through hole 7h of the fixed side block 7A together with the bolt 111, contacts the second platform 42 and the head 111b of the bolt 111, and restricts the distance between the second platform 42 and the fixed side block 7A. Specifically, the distance restricting portion 112 has a cylindrical shape into which the shaft portion 111 a of the bolt 111 is inserted. One end surface in the axial direction is in contact with the lower surface of the second platform 42, and the other end surface in the axial direction is in contact with the head 111 b of the bolt 111. In addition, the fixed portion 11 can also be used for a structure that fixes the movable side block 7B with respect to the first platform 41.

In addition, in the above-described embodiment, the first platform 41 on which the lower mold 2 is mounted is configured as a movable plate, but the second platform 42 on which the upper mold 3 is mounted may be configured as a movable plate. And make it movable. When the second platform 42 is set as a movable plate, the first platform 41 can also be set as a fixed plate.

In addition, the present invention is not limited to the above-described embodiments, and of course various modifications can be made within a range that does not deviate from the gist.

2: Lower mold (forming mold) 3: Upper mold (forming mold) 4: Mold clamping mechanism 5: The first split element 5a: Contact surface of the first dividing element 6: The second split element 6a: The contact surface of the second dividing element 7A: Fixed side block (middle block) 7B: Movable side block (middle block) 7h: Through hole 7h1, 932: Small diameter part 7h2, 931: large diameter part 8: Fixed part 9A, 9B: positioning part 10: Thermal insulation 11: Fixed part 41: The first platform (movable plate) 42: The second platform (upper fixed plate) 43: drive mechanism 44: Lower fixed plate 45: Pillar 46: Lower mold holding part (forming mold holding part) 47: Upper mold holding part (forming mold holding part) 81, 111: Bolt 82: Elastomer 83, 112: Distance restriction department 91, 92, 94, 95: positioning hole 93, 96: positioning pins 100: Resin molding device 111b, 811: head 111a, 812: shaft 431: Ball screw mechanism

FIG. 1 is a front view schematically showing the configuration of the resin molding apparatus of this embodiment. Fig. 2 is an enlarged cross-sectional view of the first dividing element and the second dividing element of the embodiment. Fig. 3 is a cross-sectional view mainly showing the second platform and the fixed side block of the embodiment. Fig. 4 is an enlarged cross-sectional view of the fixing portion of the fixing side block of the embodiment. Fig. 5 is an enlarged cross-sectional view of the positioning portion of the fixed side block of the embodiment. Fig. 6 is a cross-sectional view mainly showing the first platform and the movable side block of the embodiment. Fig. 7 is a diagram showing simulation results obtained by the configuration of the embodiment. Fig. 8 is an enlarged cross-sectional view of a first split element and a second split element according to a modified embodiment. Fig. 9 is an enlarged cross-sectional view of a first split element and a second split element according to a modified embodiment. 10(a) and 10(b) are enlarged cross-sectional views of the first split element and the second split element of a modified embodiment. Fig. 11 is an enlarged cross-sectional view of a fixing portion of a modified embodiment.

2: Lower mold (forming mold)

3: Upper mold (forming mold)

4: Mold clamping mechanism

5: The first split element

6: The second split element

7A: Fixed side block (middle block)

7B: Movable side block (middle block)

10: Thermal insulation

41: The first platform (movable plate)

42: The second platform (upper fixed plate)

43: drive mechanism

44: Lower fixed plate

45: Pillar

46: Lower mold holding part (forming mold holding part)

47: Upper mold holding part (forming mold holding part)

100: Resin molding device

431: Ball screw mechanism

Claims (4)

A resin forming device includes: a forming mold having an upper mold and a lower mold; a platform on which the forming mold is installed; a plurality of heat insulating members arranged between the forming mold and the platform, and the forming mold A space is formed between the platform and the platform, and the mold clamping force from the platform is transmitted to the forming mold; Elastically holding and fixing the forming mold; and a positioning portion, which is provided on the inner side of the plurality of heat insulating members, positions the platform and the forming mold, and the plurality of heat insulating members are divided into The first dividing element provided on the forming mold and the second dividing element provided on the platform. The resin molding apparatus described in the first item of the scope of patent application has a first platform on which the lower mold is mounted and a second platform on which the upper mold is mounted as the platform, and the plurality of heat insulating members are respectively Set between the upper mold and the second platform, and between the lower mold and the first platform. The resin molding device described in the first item of the patent application includes: an intermediate block, which is provided between the molding die and the platform, and is provided with the plurality of first division elements or the plurality of second divisions element. A method for manufacturing a resin molded product using the resin molding device described in any one of the first to third items in the scope of the patent application.

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