CN118024501A - Production die, production device and processing method for exposed packaging structure - Google Patents

Abstract

The present disclosure relates to a production die, a production apparatus, and a processing method for an exposed package structure. The production die for the exposed packaging structure comprises: the first mold, the second mold and the elastic pressing component. The first die is used for supporting a semi-finished product of the packaging structure to be processed, the first die and the second die are arranged at intervals, and the distance between the first die and the second die is adjustable so as to perform die opening operation or die closing operation. And the die pressing surface of the second die is provided with a mounting hole corresponding to the elastic pressing component. The elastic pressing component is arranged in the mounting hole and connected with the second die, and comprises a pressing block, one end of the pressing block facing the first die protrudes out of the mounting hole and is provided with a pressing surface, and the pressing surface of the pressing block is used for being in butt fit with an exposed part of the semi-finished product of the packaging structure. Thus, the production and processing quality of the product can be ensured; meanwhile, the high-temperature-resistant film layer does not need to be replaced frequently as in the traditional technology, so that the cost of the device is greatly reduced.

Description

Production die, production device and processing method for exposed packaging structure

Technical Field

The present disclosure relates to the field of semiconductor devices, and more particularly, to a production mold, a production apparatus, and a processing method for an exposed package structure.

Background

In the prior art, some packaging structures, such as an exposed packaging structure, specifically, local areas of the exposed packaging structure need to be exposed, on one hand, heat dissipation is facilitated, on the other hand, special treatment can be performed on the exposed areas, for example, the treated exposed areas are directly contacted with related media in a use environment, various physical and chemical reactions take place to achieve specific effects, therefore, the exposed areas do not need to be protected by adopting insulating materials, other areas still need to be protected by adopting insulating material packaging treatment, the exposed areas are in the form of grooves relative to other areas, the bottoms of the grooves are the exposed areas, and the side walls are insulating materials for protecting other areas.

In order to expose a local part of the exposed packaging structure, a convex part is generally designed at a corresponding position of the production die according to a corresponding relation between a product shape and the production die, and the size of the convex part is correspondingly set according to the size of an exposed area. In the packaging process, the injection molding material, namely the insulating material for packaging, is stopped by tightly contacting the convex part and the exposed area, but the damage phenomenon of the packaging structure is easily caused, and the production and processing quality of the product cannot be ensured. In addition, there is also a high temperature resistant film layer further added on the surface of the convex portion, and the high temperature resistant film layer is easily extruded and deformed by contact with the exposed area, so that frequent replacement is required, and further, the cost is greatly increased.

Disclosure of Invention

Based on the above, it is necessary to overcome the defects of the prior art, and to provide a production mold, a production device and a processing method for an exposed packaging structure, which can ensure the production and processing quality of products, and greatly reduce the cost of the device.

The technical scheme is as follows: a production mold for an exposed packaging structure, the production mold for an exposed packaging structure comprising:

The device comprises a first die and a second die, wherein the first die is used for supporting a semi-finished product of a packaging structure to be processed, the first die and the second die are arranged at intervals, and the distance between the first die and the second die is adjustable so as to perform die opening operation or die closing operation; and

The elastic pressing assembly is arranged on a pressing die surface of the second die and is corresponding to the elastic pressing assembly, the elastic pressing assembly is arranged in the mounting hole and is connected with the second die, the elastic pressing assembly comprises a pressing block, one end of the pressing block facing the first die protrudes out of the mounting hole and is provided with a pressing surface, and the pressing surface of the pressing block is used for being in butt fit with an exposed part of the semi-finished product of the packaging structure.

In one embodiment, the number of the mounting holes is at least two, the number of the elastic pressing assemblies is at least two, and the at least two elastic pressing assemblies are arranged in one-to-one correspondence with the at least two mounting holes.

In one embodiment, the resilient pressing assembly further comprises a mounting plate; the mounting plate detachably sets up in on the second mould, the briquetting is equipped with spacing portion, the pore wall of mounting hole be equipped with spacing portion looks butt first step each other, with the face of briquetting with the face of the relative setting of face of pressing with the mounting plate looks butt each other.

In one embodiment, a second step is further arranged on the hole wall of the mounting hole, and the mounting plate is detachably connected with the second step; the first step and the second step are sequentially arranged along the direction far away from the first die.

In one embodiment, the pressure block is a high heat resistant synthetic rubber, polyurethane rubber, fluororubber or inorganic silicone rubber.

In one embodiment, the elastic pressing assembly further comprises an elastic member; the pressing block is a hard block or an elastic block, and the pressing block is connected with the second die through the elastic piece.

In one embodiment, the resilient pressing assembly further comprises a mounting plate; the mounting panel detachably set up in on the second mould, the briquetting is equipped with spacing portion, the pore wall of mounting hole be equipped with spacing portion looks butt's first step, with the face of briquetting with the face of propping the face setting relatively with elastic component one end links to each other, the elastic component other end with the mounting panel links to each other.

In one embodiment, the number of the elastic pieces is at least two, and at least two elastic pieces are arranged between the pressing block and the mounting plate at intervals.

In one embodiment, the hole wall of the mounting hole is further provided with a second step, the mounting plate is detachably connected to the second step through a fastener, and the first step and the second step are sequentially arranged along a direction far away from the first die.

In one embodiment, the outer wall of the pressing block is mutually abutted against the hole wall of the mounting hole, and is in sliding guide fit along the central axis direction of the mounting hole.

In one embodiment, the pressing block is made of fluororesin.

In one embodiment, the first mold or the second mold is further provided with a conveying assembly for conveying molten injection molding material to a spaced area between the first mold and the second mold; the conveying assembly comprises a conveying channel arranged on the first die or the second die, and a pushing mechanism movably arranged inside the conveying channel, wherein the conveying channel is used for being communicated with the interval area, and the pushing mechanism is used for moving along the conveying channel so as to push injection molding materials inside the conveying channel to the interval area.

In one embodiment, the second mold comprises a main structure and a carrier detachably connected with the main structure, the carrier is connected to a side surface, close to the first mold, of the main structure, the mounting hole is formed in the carrier, and the elastic pressing component is connected with the carrier.

The production device for the exposed packaging structure comprises the production die for the exposed packaging structure, a bracket, a lifting mechanism and a guide mechanism; the first die is arranged on the bracket, the lifting mechanism is arranged on the bracket, and the lifting mechanism is connected with the second die and used for driving the second die to lift; the second die is connected with the first die or the bracket through a guide mechanism.

The processing method for the exposed packaging structure adopts the production die for the exposed packaging structure, and comprises the following steps:

a feeding step, namely placing a semi-finished product of the packaging structure to be processed on a first die;

A die closing step, namely reducing the distance between the second die and the first die, so that the pressing surface of the pressing block is abutted with the exposed part of the semi-finished product of the packaging structure;

An injection molding step, namely extruding a molten injection molding material into a cavity formed by enclosing the first die and the second die, and wrapping the molten injection molding material at a position except for an exposed position on the outer surface of the semi-finished product of the packaging structure;

When the injection molding material is completely wrapped at a part except for an exposed part on the outer surface of the semi-finished product of the packaging structure, controlling the temperature of the injection molding material to be a preset temperature, and waiting for a preset time to enable the injection molding material to be solidified and molded;

And opening the die, namely, after the injection molding material on the semi-finished product of the packaging structure is solidified and molded, obtaining the finished product of the packaging structure, opening the first die and the second die, and taking out the finished product of the packaging structure.

In one embodiment, in the closing step, the pressing force applied to the second mold is finely adjusted so that each pressing block on the second mold is closely abutted against the corresponding exposed portion.

According to the production mold, the production device and the processing method for the exposed packaging structure, when the semi-finished product of the packaging structure to be processed is subjected to injection molding packaging, after the first mold and the second mold are closed, the pressing surface of the pressing block is tightly abutted and matched with the exposed part of the semi-finished product of the packaging structure, so that a gap is formed between the pressing surface of the pressing block and the exposed part of the semi-finished product of the packaging structure to prevent molten injection molding material from flowing in; meanwhile, the elastic pressing component has elasticity, so that the pressing surface of the pressing block is in tight abutting fit with the exposed part of the semi-finished product of the packaging structure, and damage to the semi-finished product of the packaging structure caused by overlarge pressing force of the pressing block in the prior art can be prevented. Thus, the production and processing quality of the product can be ensured; meanwhile, the high-temperature-resistant film layer does not need to be replaced frequently as in the traditional technology, so that the cost of the device is greatly reduced.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate and explain the exemplary embodiments of the disclosure and together with the description serve to explain the disclosure, and do not constitute an undue limitation on the disclosure.

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

FIG. 1 is a schematic view of a production mold for an exposed package structure in a molding step according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a structure in a loading step in a production mold for an exposed packaging structure according to another embodiment of the present disclosure;

FIG. 3 is a schematic view of a structure in a molding step in a production mold for an exposed package structure according to another embodiment of the present disclosure;

FIG. 4 is a schematic view of a production mold for an exposed packaging structure in a mold closing step according to still another embodiment of the present disclosure;

FIG. 5 is a schematic view of a production mold for an exposed package structure in an injection molding step according to yet another embodiment of the present disclosure;

FIG. 6 is a schematic structural view of a production mold for an exposed package structure in a molding step according to yet another embodiment of the present disclosure;

FIG. 7 is a schematic diagram of a package structure of an embodiment of the present disclosure;

Fig. 8 is a flow chart of a processing method for an exposed package structure according to an embodiment of the disclosure.

10. A first mold; 11. a transport assembly; 111. a conveying channel; 112. a pushing mechanism; 20. a second mold; 21. a main body structure; 22. a carrier; 221. a mounting hole; 2211. a first step; 2212. a second step; 30. an elastic pressing component; 31. pressing blocks; 311. a pressing surface; 312. a limit part; 32. a mounting plate; 33. a fastener; 34. an elastic member; 40. packaging the structural finished product; 41. packaging the semi-finished product of the structure; 411. a substrate; 412. a chip assembly; 4121. a first chip; 4122. a second chip; 42. injection molding a material; 43. exposed parts; 44. and (5) conducting wires.

Detailed Description

In order that the above-recited objects, features and advantages of the present disclosure will become more readily apparent, a more particular description of the disclosure will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. The present disclosure may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the disclosure, and therefore the disclosure is not to be limited to the specific embodiments disclosed below.

Just as in the background art, the protruding part in the prior art is closely contacted with the exposed area to stop the injection molding material, but the problem that the exposed packaging structure is easy to damage is found, and the research finds that the problem is caused by that when the number of the exposed areas of the exposed packaging structure is at least two, the number of protruding parts on the production mould is at least two correspondingly, and in the film-combining processing process, the at least two protruding parts of the production mould are required to be closely attached to the at least two exposed areas of the packaging structure in a one-to-one correspondence mode respectively. However, because the convex portions and/or the exposed areas have processing errors, it is not guaranteed that each convex portion can be tightly attached to the corresponding exposed area under the preset pressure, which can easily cause injection molding materials in the exposed area when the package structure is pressed by the original preset pressure, or can easily cause bad defects of pressing the exposed package structure when each convex portion is tightly attached to the corresponding exposed area by using a pressure higher than the preset pressure.

For the above reasons, the present disclosure provides a production mold, a production apparatus and a processing method for an exposed packaging structure, which can ensure the production and processing quality of a product, and at the same time, the cost of the apparatus is greatly reduced.

Referring to fig. 1 to 3, fig. 1 shows a schematic structural view of a production mold for an exposed encapsulation structure in a molding step according to an embodiment of the present disclosure, fig. 2 shows a schematic structural view of a production mold for an exposed encapsulation structure in a loading step according to another embodiment of the present disclosure, and fig. 3 shows a schematic structural view of a production mold for an exposed encapsulation structure in a molding step according to another embodiment of the present disclosure. The production tooling shown in fig. 1 differs from the production tooling shown in fig. 2 primarily in the elastomeric press assembly 30. A production die for an exposed package structure provided in an embodiment of the present disclosure includes: the first mold 10, the second mold 20 and the elastic pressing assembly 30. The first mold 10 is used for supporting a semi-finished product 41 of a packaging structure to be processed, the first mold 10 and the second mold 20 are arranged at intervals, and the distance between the first mold 10 and the second mold 20 is adjustable to perform mold opening operation or mold closing operation. The die surface of the second die 20 is provided with mounting holes 221 corresponding to the elastic pressing assemblies 30. The elastic pressing component 30 is disposed in the mounting hole 221 and connected to the second mold 20, the elastic pressing component 30 includes a pressing block 31, one end of the pressing block 31 facing the first mold 10 protrudes to the outside of the mounting hole 221 and is provided with a pressing surface 311, and the pressing surface 311 of the pressing block 31 is used for being in abutting fit with the exposed portion 43 of the semi-finished product 41 of the package structure.

In order to completely prevent the exposed portion 43 of the semi-finished product 41 from having the injection molding material 42, the shape, size and setting position of the pressing surface 311 of the pressing block 31 are set in accordance with the exposed portion 43 of the semi-finished product 41, that is, the pressing surface 311 of the pressing block 31 of the elastic pressing assembly 30 is correspondingly adjusted and set according to the shape, size and setting position of the exposed region of the finished product 40. In other words, during the injection molding process, the part of the semi-finished product 41 of the package structure, which is in contact with the pressing surface 311 of the pressing block 31, can prevent the molten injection molding material 42 from entering, so that after the product package of the semi-finished product 41 of the package structure is molded, the part of the semi-finished product 41 of the package structure, which is in contact with the pressing surface 311 of the pressing block 31, is correspondingly exposed part 43, and the rest parts of the semi-finished product 41 of the package structure are correspondingly encapsulated with the injection molding material 42.

In the above production mold for exposing the package structure, when the package structure semi-finished product 41 to be processed is injection-molded and packaged, after the first mold 10 and the second mold 20 are closed, the pressing surface 311 of the pressing block 31 is tightly pressed against the exposed portion 43 of the package structure semi-finished product 41, so that the gap between the pressing surface 311 of the pressing block 31 and the exposed portion 43 of the package structure semi-finished product 41 can be prevented from flowing into the molten injection molding material 42; meanwhile, since the elastic pressing component 30 has elasticity, the pressing surface 311 of the pressing block 31 applies appropriate pressure to the exposed portion 43 of the semi-finished product 41 of the package structure, so that the pressing surface 311 of the pressing block 31 can be tightly matched with the exposed portion 43 of the semi-finished product 41 of the package structure, and damage to the semi-finished product 41 of the package structure due to overlarge pressing force of the pressing block 31 in the prior art can be prevented. Thus, the production and processing quality of the product can be ensured; meanwhile, the high-temperature-resistant film layer does not need to be replaced frequently as in the traditional technology, so that the cost of the device is greatly reduced.

Referring to fig. 7, fig. 7 is a schematic structural diagram of a package structure 40 according to an embodiment of the disclosure. As can be seen in fig. 7, the package structure finish 40 comprises a package structure blank 41 and an injection molding material 42 connected to the package structure blank 41. The exposed portion 43 of the semi-finished product 41 is provided with a plurality of exposed portions 43, the exposed portions 43 are exposed outwards, and the exposed portions 43 of the semi-finished product 41 are wrapped with the injection molding material 42.

It should be noted that the number of the exposed portions 43 of the package structure semi-finished product 41 includes, but is not limited to, one, two, three, four, or other numbers. Accordingly, the number of the mounting holes 221 and the elastic pressing assemblies 30 is not limited to one, and may be at least two, and are disposed in one-to-one correspondence with at least two exposed portions 43 of the semi-finished product 41.

Referring to fig. 7, in some embodiments, the package structure semi-finished product 41 includes a substrate 411 and at least one chip assembly 412 connected to the substrate 411. The chip assembly 412 is electrically connected to the substrate 411 through the conductive wires 44. The exposed portion 43 is disposed on a surface of the chip assembly 412. The surface of the semi-finished product 41 of the package structure facing the second mold 20, that is, the upper surface of the semi-finished product 41 of the package structure is provided with an exposed portion 43, and the remaining area of the exposed portion 43 of the upper surface is connected with the injection molding material 42. In addition, the surface of the semi-finished product 41 of the package structure facing away from the second mold 20, that is, the lower surface of the semi-finished product 41 of the package structure is directly placed on the first mold 10 to be in contact with the first mold 10, so that the molten injection molding material 42 cannot flow into the gap between the surface of the semi-finished product 41 of the package structure facing away from the second mold 20 and the first mold 10 during the injection molding process, and the lower surface of the semi-finished product 41 of the package structure is exposed outwards.

Alternatively, the chip assemblies 412 in the present embodiment are not limited to one, and specifically, for example, a plurality of chip assemblies 412 are disposed on the substrate 411 at intervals in sequence. When the number of the chip assemblies 412 is plural, since each chip assembly 412 is provided with the exposed portion 43, the package structure semi-finished product 41 is provided with the exposed portion 43 correspondingly plural.

Alternatively, the chip assembly 412 may be configured to be a single chip, or configured to be a combination of at least two single chips stacked on each other, or configured to be a combination of a single chip and other functional insertion devices, and how to be configured can be flexibly adjusted and configured according to actual needs, which is not limited herein. Specifically, in the present embodiment, the chip assembly 412 includes a first chip 4121 connected to the substrate 411 and a second chip 4122 connected to the first chip 4121. The exposed portion 43 is disposed on a surface of the second chip 4122 facing away from the first chip 4121.

Referring to fig. 4 to 6, fig. 4 is a schematic structural view showing a production mold for an exposed package structure in a closing step according to still another embodiment of the present disclosure, fig. 5 is a schematic structural view showing a production mold for an exposed package structure in an injection step according to still another embodiment of the present disclosure, and fig. 6 is a schematic structural view showing a production mold for an exposed package structure in a molding step according to still another embodiment of the present disclosure. In one embodiment, the number of the mounting holes 221 is at least two, the number of the elastic pressing assemblies 30 is at least two, and the at least two elastic pressing assemblies 30 are arranged in one-to-one correspondence with the at least two mounting holes 221. Thus, the injection molding processing treatment when at least two exposed parts 43 are arranged on the semi-finished product 41 of the packaging structure can be satisfied; in addition, since the elastic pressing assemblies 30 have elasticity, when a certain pressing force is applied to both the first mold 10 and the second mold 20, the pressing blocks 31 of each elastic pressing assembly 30 can synchronously abut against each exposed portion 43 of the semi-finished product 41 of the package structure, so that the processing quality of all the exposed portions 43 on the semi-finished product 41 of the package structure can be ensured.

Referring to fig. 1, in one embodiment, the pressing block 31 is an elastic block. In this way, the pressing block 31 deforms to a certain extent (for example, generally within several tens micrometers to several hundreds micrometers, for example, 50-100 micrometers) after being stressed in the process of pressing the exposed portion 43 of the semi-finished product 41 of the packaging structure, so that good contact with the exposed portion 43 of the semi-finished product 41 of the packaging structure can be ensured.

In addition, the pressing block 31 contacts the exposed portion 43 of the package structure semi-finished product 41 under the pressing force when the second mold 20 and the first mold 10 are closed, and is deformed to a certain extent to be in close contact with the exposed portion 43 of the package structure semi-finished product 41. And due to the elastic properties of the pressing blocks 31, even if the heights of the respective exposed portions 43 of the package structure semi-finished product 41 with respect to the reference surface of the package structure semi-finished product 41 are slightly different, all the pressing blocks 31 can be brought into good contact with the exposed portions 43 of the package structure semi-finished product 41. Thereby ensuring the processing quality of the package structure semi-finished product 41.

Referring to fig. 1, in one embodiment, the resilient pressing assembly 30 further includes a mounting plate 32. The mounting plate 32 is detachably disposed on the second mold 20, the pressing block 31 is provided with a limiting portion 312, the hole wall of the mounting hole 221 is provided with a first step 2211 abutting against the limiting portion 312, and the plate surface of the pressing block 31 opposite to the pressing surface 311 abuts against the mounting plate 32. On the one hand, since the mounting plate 32 can be detached, the pressing block 31 is in abutting relation with the mounting plate 32 and the first step 2211 respectively, and after the mounting plate 32 is detached, the pressing block 31 can be directly separated from the mounting hole 221, so that the pressing block 31 can be conveniently detached, replaced and maintained, and the processing method is suitable for processing of semi-finished products 41 with different types of packaging structures; on the other hand, the mounting plate 32 can be replaced easily.

Referring to fig. 1, in one embodiment, a second step 2212 is further provided on the wall of the mounting hole 221. The mounting plate 32 is detachably connected to the second step 2212. The first step 2211 and the second step 2212 are sequentially disposed in a direction away from the first die 10. In this way, the mounting plate 32 is conveniently detachably mounted on the second die 20, and the pressing block 31 is conveniently detachably disposed in the mounting hole 221. In addition, the mounting plate 32 is disposed on the second step 2212, and the second step 2212 plays a role in positioning the mounting plate 32, so as to ensure that the mounting plate 32 is stably disposed in the mounting hole 221, and prevent the mounting hole 221 from being offset and swaying.

Specifically, the mounting plate 32 is removably mounted to the second step 2212 using fasteners 33 including, but not limited to, screws, pins, rivets, snaps, and the like.

Referring to fig. 1, in one embodiment, the pressing block 31 is a high heat resistant synthetic rubber, polyurethane rubber, fluororubber, or inorganic silicone rubber. In this way, the pressing block 31 has heat resistance at a temperature higher than the molding temperature (typically 170 to 180 ℃) and is less likely to cause seal failure due to high temperature deformation, and has a relatively long service life.

Referring to fig. 2 and 3, in one embodiment, the elastic pressing component 30 further includes an elastic member 34. The pressing block 31 is a hard block or an elastic block, and the pressing block 31 is connected with the second mold 20 through an elastic member 34. In this way, when the first mold 10 and the second mold 20 gradually approach each other, the pressing surface 311 of the pressing block 31 and the exposed surface of the encapsulation mechanism abut each other, and as the elastic member 34 is compressed, good contact with the exposed portion 43 of the semi-finished encapsulation structure 41 can be ensured.

In addition, even if the heights of the respective exposed portions 43 of the package structure semi-finished product 41 are slightly different with respect to the reference plane of the package structure semi-finished product 41, due to the elastic characteristics of the elastic member 34, the respective pressing blocks 31 can be independently moved up and down, and all the pressing blocks 31 can be in good contact with the exposed portions 43 of the package structure semi-finished product 41, which can prevent molten EMC from penetrating into the exposed portions 43 of the package structure semi-finished product 41 during molding to successfully complete the processing of the package structure semi-finished product 41, thereby ensuring the processing quality of the package structure semi-finished product 41.

Wherein the resilient member 34 includes, but is not limited to, a spring, a resilient rod, a resilient post, and the like.

Referring to fig. 1-3, in one embodiment, the resilient pressing assembly 30 further includes a mounting plate 32. The mounting plate 32 is detachably arranged on the second die 20, the pressing block 31 is provided with a limiting part 312, the hole wall of the mounting hole 221 is provided with a first step 2211 mutually abutting against the limiting part 312, the plate surface of the pressing block 31 opposite to the pressing surface 311 is connected with one end of the elastic piece 34, and the other end of the elastic piece 34 is connected with the mounting plate 32. On the one hand, since the mounting plate 32 can be disassembled, the pressing block 31 is in abutting relation with the first step 2211, the pressing block 31 is also abutted against the mounting plate 32 through the elastic piece 34, after the mounting plate 32 is disassembled, the pressing block 31 and the elastic piece 34 can be directly disassembled from the mounting hole 221, so that the pressing block 31 can be conveniently disassembled, replaced and maintained, and the processing method is suitable for processing of semi-finished products 41 with different types of packaging structures; on the other hand, the mounting plate 32 can be replaced easily.

Referring to fig. 2 and 3, in an embodiment, the connection manner between the plate surface of the pressing block 31 opposite to the pressing surface 311 and one end of the elastic member 34 includes, but is not limited to, abutting contact, clamping connection, welding connection or adhesive connection, or may be a connection member such as a screw, a pin, a rivet, or the like, or may be a manner in which the elastic member 34 and the pressing block 31 are integrally formed, i.e. for example, the pressing block 31 and the elastic member 34 are integrally formed.

Similarly, the other end of the elastic member 34 may be connected to the mounting plate 32 by, but not limited to, abutting contact, clamping connection, welding connection or adhesive connection, or may be connected by using a connecting member such as a screw, a pin, a rivet, or the like, or may be formed by integrally forming the elastic member 34 and the mounting plate 32, i.e., for example, by integrally forming the mounting plate 32 and the elastic member 34.

In one embodiment, the stop 312 is disposed circumferentially around the abutment block 31. In addition, a plurality of limiting portions 312 may be provided and circumferentially spaced around the pressing block 31.

Note that, the "limiting portion 312" may be a part of the pressing block 31, that is, the "limiting portion 312" and the other part of the pressing block 31 are integrally formed; the stopper 312 may be a separate member which is separable from the rest of the pressing block 31, and may be manufactured separately and integrated with the rest of the pressing block 31.

Referring to fig. 2 and 3, in one embodiment, the number of the elastic members 34 is at least two, and the at least two elastic members 34 are disposed between the pressing block 31 and the mounting plate 32 at intervals. In this way, after the number of the elastic members 34 is increased, the stress of the pressing block 31 can be more stable, which is beneficial to ensuring that the pressing surface 311 of the pressing block 31 is in good contact with the exposed surface of the semi-finished product 41 of the packaging structure.

Specifically, the number of the elastic members 34 is not limited to one, and may be, for example, two, three, four, five, six, or other numbers. When the number of the elastic members 34 is at least two, the at least two elastic members 34 are arranged between the pressing block 31 and the mounting plate 32 at equal intervals. As a specific example, one of the elastic members 34 is arranged on the central axis of the pressing block 31, and the remaining elastic members 34 are sequentially arranged at equal intervals around the central axis of the pressing block 31.

Referring to fig. 1 to 3, in one embodiment, the wall of the mounting hole 221 is further provided with a second step 2212. The mounting plate 32 is detachably connected to the second step 2212 by the fastener 33, and the first step 2211 and the second step 2212 are sequentially arranged in a direction away from the first die 10. In this way, the mounting plate 32 can be conveniently and detachably mounted on the second die 20, and the pressing block 31 can be conveniently and detachably disposed in the mounting hole 221.

Specifically, the mounting plate 32 is removably mounted to the second step 2212 using fasteners 33 including, but not limited to, screws, pins, rivets, snaps, and the like.

Referring to fig. 2 and 3, in one embodiment, the outer wall of the pressing block 31 abuts against the wall of the mounting hole 221, and slidingly guides and cooperates along the central axis direction (the dotted line O shown in fig. 3) of the mounting hole 221. In this way, in the process of closing the first mold 10 and the second mold 20, when the pressing surface 311 of the pressing block 31 and the exposed portion 43 of the semi-finished product 41 of the package structure come close to each other, the pressing block 31 contacts the exposed portion 43 of the semi-finished product 41 of the package structure, so that the elastic member 34 is deformed by extrusion and compression, and the outer wall of the pressing block 31 and the hole wall of the mounting hole 221 are mutually pressed and slidably matched, so that the upward and downward sliding effect of the pressing block 31 along the direction of the central axis of the mounting hole 221 is stable and smooth, and further, the good contact between the pressing surface 311 of the pressing block 31 and the exposed surface of the semi-finished product 41 of the package structure can be ensured.

In one embodiment, the pressure block 31 includes, but is not limited to, being made of a fluororesin. As such, it has been found that the pressing block 31 made of a fluororesin material is very suitable because it has various excellent heat resistance, low friction coefficient, no tackiness and good mechanical properties. Of course, the pressing block 31 may be made of other materials, which is not limited herein, and may be flexibly adjusted and set according to actual requirements.

In one embodiment, the pressing surface 311 of the pressing block 31 is disposed in correspondence with the exposed portion 43 of the package structure blank 41. In general, the exposed portion 43 of the semi-finished product 41 is a plane, and accordingly, the pressing surface 311 is, for example, a plane; when the exposed portion 43 of the package structure semi-finished product 41 is an arc surface, the pressing surface 311 is correspondingly configured as an arc surface, so as to ensure good abutting contact between the pressing surface 311 and the exposed portion 43 of the package structure semi-finished product 41.

In one embodiment, the shape of the pressing surface 311 of the pressing block 31 includes, but is not limited to, a circle, an ellipse, a polygon, or other regular and irregular shapes, and can be flexibly adjusted and set according to actual needs, so long as the shape is adapted to the exposed portion 43 of the semi-finished product 41 of the package structure.

Referring to fig. 4 to 6, in one embodiment, the first mold 10 or the second mold 20 is further provided with a conveying assembly 11. The delivery assembly 11 is used to deliver molten injection molding material 42 to a spaced region between the first mold 10 and the second mold 20. The space region, i.e. the first mould 10 encloses the cavity formed by the second mould 20. The conveying assembly 11 includes a conveying passage 111 provided on the first mold 10 or the second mold 20, and a pressing mechanism 112 movably provided inside the conveying passage 111. The conveying passage 111 is configured to communicate with the spacing region, and the pushing mechanism 112 is configured to move along the conveying passage 111 to push the injection molding material 42 inside the conveying passage 111 to the spacing region.

The spacing area is specifically a spacing formed by the first mold 10 and the second mold 20 after the first mold 10 and the second mold 20 are closed, and the specific size can be flexibly adjusted and set according to actual requirements. Further, since the pressing block 31 is in good contact with the exposed portion 43 of the package structure preform 41, the injection molding material 42 inside the conveying passage 111 flows into all the areas other than the exposed portion 43 in the space area.

Referring to fig. 4 to 6, in one embodiment, the second mold 20 includes a main body structure 21, and a carrier 22 detachably connected to the main body structure 21. The carrier 22 is connected to the side of the main body structure 21 near the first mold 10, the mounting hole 221 is disposed on the carrier 22, and the elastic pressing component 30 is connected to the carrier 22. Thus, for the package structure semi-finished product 41 with different shapes and sizes, the carrier 22 and the elastic pressing component 30 with corresponding shapes and sizes can be selected and installed on the main structure 21, namely, the carrier 22 and the elastic pressing component 30 are mainly replaced, and the main structure 21 and the second mold 20 in the production mold are reserved, so that the universality of the production mold can be improved, and the cost is reduced.

Referring to fig. 1 to 3, in one embodiment, a production apparatus for an exposed package structure includes the production mold for an exposed package structure of any of the above embodiments.

Further, optionally, the production device for the exposed package structure further includes a bracket (not shown), a lifting mechanism (not shown), and a guide mechanism (not shown). The first mold 10 is disposed on the support, and the lifting mechanism is disposed on the support and connected to the second mold 20 for driving the second mold 20 to move up and down. The second mold 20 is connected to the first mold 10 or the bracket by a guide mechanism.

In the above-mentioned production device for the exposed package structure, when the package structure semi-finished product 41 to be processed is injection-molded and packaged, after the first mold 10 and the second mold 20 are closed, the pressing surface 311 of the pressing block 31 is tightly abutted and matched with the exposed portion 43 of the package structure semi-finished product 41, so that the gap between the pressing surface 311 of the pressing block 31 and the exposed portion 43 of the package structure semi-finished product 41 can be prevented from flowing into the molten injection molding material 42; meanwhile, since the elastic pressing component 30 has elasticity, the pressing surface 311 of the pressing block 31 applies appropriate pressure to the exposed portion 43 of the semi-finished product 41 of the package structure, so that the pressing surface 311 of the pressing block 31 can be tightly matched with the exposed portion 43 of the semi-finished product 41 of the package structure, and damage to the semi-finished product 41 of the package structure due to overlarge pressing force of the pressing block 31 in the prior art can be prevented. Thus, the production and processing quality of the product can be ensured; meanwhile, the high-temperature-resistant film layer does not need to be replaced frequently as in the traditional technology, so that the cost of the device is greatly reduced.

In addition, the production device for the exposed packaging structure further comprises a lifting mechanism and a guiding mechanism. Thus, when the first mold 10 and the second mold 20 are closed or opened, the lifting mechanism drives the second mold 20 to lift and move, and the guiding mechanism plays a guiding role on the movement of the second mold 20, so that the precision of the closing positions of the first mold 10 and the second mold 20 can be ensured, the precision of the opening of the first mold 10 and the second mold 20 can be ensured, and the processing quality of the semi-finished product 41 of the packaging structure can be ensured.

The lifting mechanism includes, but is not limited to, a cylinder driving structure, a hydraulic cylinder driving structure, a motor screw structure, a motor cam driving structure, a motor gear driving structure, a motor pulley driving structure, and the like, as long as the injection molding material 42 inside the conveying passage 111 can be powered.

As one example, the guide mechanism includes, but is not limited to, a combination of a guide rail and a slider, a combination of a guide rod and a guide hole.

Referring to fig. 4 to 6 and 8, fig. 8 is a flow chart illustrating a processing method for an exposed package structure according to an embodiment of the disclosure. In one embodiment, a processing method for an exposed packaging structure, using the production mold for an exposed packaging structure of any one of the above embodiments, includes the steps of:

step S10, a loading step, namely placing a semi-finished product 41 of a packaging structure to be processed on a first die 10;

Step S20, a mold closing step, please refer to fig. 4, of reducing the distance between the second mold 20 and the first mold 10, so that the pressing surface 311 of the pressing block 31 abuts against the exposed portion 43 of the semi-finished product 41 of the package structure;

Step S30, an injection molding step, please refer to fig. 5 and 6, in which the molten injection molding material 42 is extruded into a cavity formed by enclosing the first mold 10 and the second mold 20, and is wrapped around the outer surface of the semi-finished product 41 except the exposed portion 43;

Step S40, a molding step, when the injection molding material 42 is completely wrapped at a part other than the exposed part 43 on the outer surface of the semi-finished product 41 of the packaging structure, controlling the temperature of the injection molding material 42 to be a preset temperature, and waiting for a preset time to enable the injection molding material 42 to be solidified and molded;

step S50, a mold opening step, namely, after the injection molding material 42 on the semi-finished product 41 of the packaging structure is solidified and molded, obtaining the finished product 40 of the packaging structure, opening the first mold 10 and the second mold 20, and taking out the finished product 40 of the packaging structure.

In the above processing method for the exposed package structure, when the package structure semi-finished product 41 to be processed is injection-molded and packaged, after the first mold 10 and the second mold 20 are closed, the pressing surface 311 of the pressing block 31 is tightly abutted and matched with the exposed portion 43 of the package structure semi-finished product 41, so that the gap between the pressing surface 311 of the pressing block 31 and the exposed portion 43 of the package structure semi-finished product 41 can be prevented from flowing into the molten injection molding material 42; meanwhile, since the elastic pressing component 30 has elasticity, the pressing surface 311 of the pressing block 31 applies appropriate pressure to the exposed portion 43 of the semi-finished product 41 of the package structure, so that the pressing surface 311 of the pressing block 31 can be tightly matched with the exposed portion 43 of the semi-finished product 41 of the package structure, and damage to the semi-finished product 41 of the package structure due to overlarge pressing force of the pressing block 31 in the prior art can be prevented. Thus, the production and processing quality of the product can be ensured; meanwhile, the high-temperature-resistant film layer does not need to be replaced frequently as in the traditional technology, so that the cost of the device is greatly reduced.

In one embodiment, the molten injection molding material 42 includes, but is not limited to, EMC material. Wherein EMC-Epoxy Molding Compound is epoxy resin molding compound and epoxy molding compound, which is powdery molding compound prepared by mixing epoxy resin as matrix resin, high-performance phenolic resin as curing agent, silica micropowder and the like as filler, and various additives.

In one embodiment, in the clamping step, the pressing force applied to the second mold 20 is finely adjusted so that each pressing block 31 on the second mold 20 is brought into close contact with the corresponding exposed portion 43.

Specifically, when the pressing blocks 31 of the second mold 20 contact the exposed portions 43 of the package structure semi-finished product 41, each pressing block 31 of the second mold 20 is brought into contact with the corresponding exposed portion 43 by gradually increasing the pressing force of the second mold 20; and continuously increasing the pressing force of the second mold 20 step by step, each elastic pressing component 30 is subjected to compression deformation, so that the pressing surface 311 of each pressing block 31 can be ensured to be closely abutted with the corresponding exposed part 43.

Wherein the manner of gradually increasing the pressing force of the second mold 20 includes, but is not limited to, gradually adjusting the pressing force in the range of 5N to 10N

In one embodiment, the processing method for the exposed encapsulation structure further comprises: prior to the loading step, a release agent is applied to the surface of the second die 20 facing the first die 10. In this way, by providing the mold release agent on the surface of the second mold 20 facing the first mold 10, the package structure semi-finished product 40 can be easily separated from the production mold after the package structure semi-finished product 41 is molded to obtain the package structure finished product 40.

In one embodiment, the preset temperature includes, but is not limited to, 170 ℃ to 180 ℃, such as 170 ℃, 172 ℃, 175 ℃, 178 ℃,180 ℃, and the like, and specifically can be flexibly adjusted and set according to actual requirements, which is not limited herein. In addition, the preset temperature may be adjusted to any value from 170 ℃ to 180 ℃ depending on the actual injection molding material 42.

In one embodiment, the preset time includes, but is not limited to, 10S-100S, and is flexibly adjusted and set accordingly according to the type of the injection molding material 42.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples represent only a few embodiments of the present disclosure, which are described in more detail and detail, but are not to be construed as limiting the scope of the disclosure. It should be noted that variations and modifications can be made by those skilled in the art without departing from the spirit of the disclosure, which are within the scope of the disclosure. Accordingly, the scope of protection of the present disclosure should be determined by the following claims.

In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present disclosure.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.

In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.

In this disclosure, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Claims (17)

1. A production die for an exposed packaging structure, the production die for an exposed packaging structure comprising:

The device comprises a first die and a second die, wherein the first die is used for supporting a semi-finished product of a packaging structure to be processed, the first die and the second die are arranged at intervals, and the distance between the first die and the second die is adjustable so as to perform die opening operation or die closing operation; and

The elastic pressing assembly is arranged on a pressing die surface of the second die and is corresponding to the elastic pressing assembly, the elastic pressing assembly is arranged in the mounting hole and is connected with the second die, the elastic pressing assembly comprises a pressing block, one end of the pressing block facing the first die protrudes out of the mounting hole and is provided with a pressing surface, and the pressing surface of the pressing block is used for being in butt fit with an exposed part of the semi-finished product of the packaging structure.

2. The production die for the exposed packaging structure according to claim 1, wherein the number of the mounting holes is at least two, the number of the elastic pressing assemblies is at least two, and the at least two elastic pressing assemblies are arranged in one-to-one correspondence with the at least two mounting holes.

3. The production die for an exposed encapsulation structure according to claim 1 or 2, wherein the pressing block is an elastic block.

4. A production die for an exposed encapsulation structure according to claim 3 wherein the resilient pressing assembly further comprises a mounting plate; the mounting plate detachably sets up in on the second mould, the briquetting is equipped with spacing portion, the pore wall of mounting hole be equipped with spacing portion looks butt first step each other, with the face of briquetting with the face of the relative setting of face of pressing with the mounting plate looks butt each other.

5. The production die for the exposed packaging structure according to claim 4, wherein a second step is further provided on a wall of the mounting hole, and the mounting plate is detachably connected with the second step; the first step and the second step are sequentially arranged along the direction far away from the first die.

6. A production die for an exposed package structure according to claim 3, wherein the pressure-resistant block is a high heat-resistant synthetic rubber, a urethane rubber, a fluororubber or an inorganic silicone rubber.

7. The production die for an exposed encapsulation structure according to claim 1 or 2, wherein the resilient pressing assembly further comprises a resilient member; the pressing block is a hard block or an elastic block, and the pressing block is connected with the second die through the elastic piece.

8. The production die for an exposed encapsulation structure of claim 7 wherein the resilient pressing assembly further comprises a mounting plate; the mounting panel detachably set up in on the second mould, the briquetting is equipped with spacing portion, the pore wall of mounting hole be equipped with spacing portion looks butt's first step, with the face of briquetting with the face of propping the face setting relatively with elastic component one end links to each other, the elastic component other end with the mounting panel links to each other.

9. The production die for an exposed package structure according to claim 8, wherein the number of the elastic members is at least two, and at least two of the elastic members are disposed between the pressing block and the mounting plate at a spacing.

10. The production die for the exposed packaging structure according to claim 8, wherein the hole wall of the mounting hole is further provided with a second step, the mounting plate is detachably connected to the second step by a fastener, and the first step and the second step are sequentially arranged in a direction away from the first die.

11. The production die for the exposed package structure according to claim 8, wherein the outer wall of the pressing block is abutted against the wall of the mounting hole and slidably guided in the direction of the central axis of the mounting hole.

12. The production die for an exposed encapsulation structure according to claim 7, wherein the pressing block is made of a fluororesin.

13. The production mould for the exposed encapsulation structure according to claim 1 or 2, wherein the first mould or the second mould is further provided with a conveying assembly for conveying molten injection molding material to a spacing region between the first mould and the second mould; the conveying assembly comprises a conveying channel arranged on the first die or the second die, and a pushing mechanism movably arranged inside the conveying channel, wherein the conveying channel is used for being communicated with the interval area, and the pushing mechanism is used for moving along the conveying channel so as to push injection molding materials inside the conveying channel to the interval area.

14. The production mold for an exposed package structure according to claim 1 or 2, wherein the second mold comprises a main body structure, and a carrier detachably connected to the main body structure, the carrier being connected to a side of the main body structure close to the first mold, the mounting hole being provided on the carrier, the elastic pressing member being connected to the carrier.

15. A production apparatus for an exposed package structure, characterized in that the production apparatus for an exposed package structure comprises the production mold for an exposed package structure according to any one of claims 1 to 14, further comprising a bracket, a lifting mechanism, and a guide mechanism; the first die is arranged on the bracket, the lifting mechanism is arranged on the bracket, and the lifting mechanism is connected with the second die and used for driving the second die to lift; the second die is connected with the first die or the bracket through a guide mechanism.

16. A processing method for an exposed package structure, characterized in that a production die for an exposed package structure according to any one of claims 1 to 14 is employed, comprising the steps of:

a feeding step, namely placing a semi-finished product of the packaging structure to be processed on a first die;

A die closing step, namely reducing the distance between the second die and the first die, so that the pressing surface of the pressing block is abutted with the exposed part of the semi-finished product of the packaging structure;

An injection molding step, namely extruding a molten injection molding material into a cavity formed by enclosing the first die and the second die, and wrapping the molten injection molding material at a position except for an exposed position on the outer surface of the semi-finished product of the packaging structure;

When the injection molding material is completely wrapped at a part except for an exposed part on the outer surface of the semi-finished product of the packaging structure, controlling the temperature of the injection molding material to be a preset temperature, and waiting for a preset time to enable the injection molding material to be solidified and molded;

And opening the die, namely, after the injection molding material on the semi-finished product of the packaging structure is solidified and molded, obtaining the finished product of the packaging structure, opening the first die and the second die, and taking out the finished product of the packaging structure.

17. The method according to claim 16, wherein in the clamping step, the pressing force applied to the second mold is finely adjusted so that each of the pressing blocks on the second mold is brought into close contact with the corresponding exposed portion.