KR102338656B1 - Resin molding device and method of manufacturing resin molded product - Google Patents

Abstract

Provided are a resin molding apparatus capable of suppressing curing of a liquid resin having thermosetting properties faster than an appropriate timing, and a method for manufacturing a resin molded article.
A resin molding apparatus is equipped with a shaping|molding die, a clamping mechanism, a film supply mechanism, a liquid resin supply mechanism, and a control part. The molding die includes an upper die and a lower die opposing the upper die. The mold clamping mechanism clamps the molding die. A film supply mechanism supplies a release film between an upper mold and a lower mold. A liquid resin supply mechanism supplies liquid resin which has thermosetting on a release film. The control unit controls the liquid resin supply mechanism to supply the liquid resin onto the release film in a state where the release film and the lower mold are separated from each other.

Description

A resin molding apparatus and the manufacturing method of a resin molded article TECHNICAL FIELD

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded article.

Japanese Patent Laid-Open No. 2017-183443 (Patent Document 1) discloses a resin molding apparatus. This resin molding apparatus is provided with the upper die and the lower die arrange|positioned to mutually oppose. A film is sent between the upper and lower molds. In this resin molding apparatus, resin molding is performed by clamping an upper die and a lower die in the state in which the resin material was supplied on the film (refer patent document 1).

Japanese Patent Laid-Open No. 2017-183443

In the resin molding apparatus disclosed by the said patent document 1, the lower mold|type is heated, and the resin material is supplied on the film in the state which the film adsorbed to the lower mold|die. In such a configuration, when, for example, a thermosetting liquid resin is used as the resin material, there is a possibility that the liquid resin supplied on the film is cured faster than an appropriate timing.

The present invention has been made in order to solve such a problem, and an object of the present invention is to provide a resin molding apparatus capable of suppressing curing of a liquid resin having thermosetting properties faster than an appropriate timing, and a method for manufacturing a resin molded article.

A resin molding apparatus according to a certain aspect of the present invention includes a molding die, a die clamping mechanism, a film supply mechanism, a liquid resin supply mechanism, and a control unit. The molding die includes an upper die and a lower die opposing the upper die. The mold clamping mechanism clamps the molding die. A film supply mechanism supplies a release film between an upper mold and a lower mold. A liquid resin supply mechanism supplies liquid resin which has thermosetting on a release film. The control unit controls the liquid resin supply mechanism to supply the liquid resin onto the release film in a state where the release film and the lower mold are separated from each other.

A method for manufacturing a resin molded article according to another aspect of the present invention includes the steps of supplying a release film between an upper mold and a lower mold, and supplying a liquid resin having thermosetting properties on the release film in a state where the release film and the lower mold are spaced apart; , the step of adsorbing the release film supplied with the liquid resin onto the lower die, and the step of clamping the upper die and the lower die in a state in which the release film is adsorbed.

ADVANTAGE OF THE INVENTION According to this invention, the resin molding apparatus and the manufacturing method of a resin molded article which can suppress that the liquid resin which has thermosetting property harden|cure faster than appropriate timing can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a front view of a resin molding apparatus.
2 is a plan view of a portion of a lower mold.
3 is a view including a cross section of an upper mold, a lower mold, and an intermediate plate.
It is a flowchart which shows the manufacturing procedure of the resin molded article by the resin molding apparatus.
Fig. 5 is a view showing a mode in which the liquid resin supply mechanism supplies liquid resin on a release film.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment which concerns on one side of this invention (henceforth "this embodiment" is also called) is described in detail using drawings. In addition, the same code|symbol is attached|subjected to the same or equivalent part in a figure, and the description is not repeated. In addition, in each figure, for the ease of understanding, the object is abbreviate|omitted or exaggerated suitably, and is drawn typically. In addition, in each figure, the direction indicated by an arrow is common.

[One. Composition of Resin Molding Equipment]

(1-1. Overall configuration)

1 : is a front view of the resin molding apparatus 10 which concerns on this embodiment. The resin molding apparatus 10 is comprised so that a resin molding may be manufactured by using a so-called compression molding method.

As shown in FIG. 1 , the resin molding apparatus 10 includes a base 100 , a tie bar 110 , an upper platen 120 , a lower platen 130 , and a mold clamping mechanism 200 . ), a molding die 300 , a film supply mechanism 500 , a movement mechanism 600 , a control unit 700 , and a liquid resin supply mechanism 900 .

The base 100 is a planar view rectangular plate-shaped member. Each of the plurality (four) tie bars 110 is a bar-shaped member extending in the vertical direction. The plurality of tie bars 110 are respectively fixed to the four corners of the base 100 . The upper platen 120 is a plate-shaped member having a rectangular shape in plan view, and is fixed to the upper portions of the plurality of tie bars 110 . The upper platen 120 faces the base 100 in the resin molding apparatus 10 . The lower platen 130 is a plate-shaped member having a rectangular shape in plan view, and is installed on the tie bar 110 between the base 100 and the upper platen 120 in a vertically movable state. . The lower platen 130 faces both the upper platen 120 and the base 100 in the resin molding apparatus 10 .

The mold clamping mechanism 200 is being fixed to the upper surface of the base 100 . The mold clamping mechanism 200 is configured to raise and lower the lower platen 130 for clamping and opening the mold 300 . That is, the mold clamping mechanism 200 is comprised so that the shaping|molding mold 300 may be clamped. The mold clamping mechanism 200 is realized by, for example, a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a link mechanism, and the like.

The molding die 300 has a metal upper die 310, a metal lower die 320 opposing the upper die 310, and a metallic intermediate plate opposing both the upper die 310 and the lower die 320 ( 323) is included. The upper mold 310 is fixed to the lower surface of the upper platen 120 , and the lower mold 320 is fixed to the upper surface of the lower platen 130 . A heating unit (heater) 350 is provided in each of the upper die 310 and the lower die 320 . Each of the upper die 310 and the lower die 320 is heated by the heating unit 350 . The intermediate plate 323 is a frame-like member in which a hole having a rectangular shape in plan view is formed in the central portion, and the release film 400 is sandwiched together with the lower mold 320 . The molding die 300 will be described in detail later.

The film supply mechanism 500 is configured to supply the elongated release film 400 between the upper mold 310 (intermediate plate 323 ) and the lower mold 320 . As the material of the release film 400, a resin material having characteristics such as heat resistance, releasability, flexibility, and extensibility is used, for example, PTFE (polytetrafluoroethylene), ETFE (ethylene/tetrafluoride ethylene copolymer), PET (polyethylene terephthalate), FEP (ethylene tetrafluoride-hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, etc. are used.

The film supply mechanism 500 includes a delivery mechanism 510 , a winding mechanism 520 , a delivery roller 530 , and a winding roller 540 .

The sending mechanism 510 is comprised so that the release film 400 before use wound on a reel may be sent out between the upper mold|type 310 (intermediate plate 323) and the lower mold|type 320. For example, the delivery mechanism 510 includes a delivery roll and a motor (not shown) that rotates the delivery roll. The winding mechanism 520 is configured to wind the used release film 400 used for resin molding on a reel. For example, the winding mechanism 520 includes a winding roll and a motor (not shown) which rotates this winding roll. By controlling the torque of each motor, the release film 400 is sent out in the advancing direction. In addition, at the time of sending out the release film 400, the appropriate tension|tensile_strength (tension) is applied in the advancing direction of the release film 400 by controlling the torque of each motor.

A delivery roller 530 for applying tension to the release film 400 is disposed between the delivery mechanism 510 and the molding die 300 . That is, on the conveyance path|route of the release film 400, the sending roller 530 is arrange|positioned rather than the lower mold|type 320 on the sending mechanism 510 side. A winding roller 540 for applying tension to the release film 400 is disposed between the molding die 300 and the winding mechanism 520 . That is, on the conveyance path|route of the release film 400, the winding roller 540 is arrange|positioned rather than the lower mold|type 320 on the winding-up mechanism 520 side. Each of the delivery roller 530 and the take-up roller 540 is configured to convey the release film 400 between the upper mold 310 and the lower mold 320 while applying tension to the release film 400 . .

Each moving mechanism 600 holds the rotation shaft of the feed roller 530 or the take-up roller 540 in a vertically movable state. The moving mechanism 600 is comprised so that the rotation shaft of the sending roller 530 and the winding-up roller 540 may be raised and lowered. The moving mechanism 600 may physically separate the release film 400 from the lower mold 320 by, for example, raising the rotation axes of the delivery roller 530 and the winding roller 540 . The moving mechanism 600 is realized by, for example, a combination of a servo motor and a ball screw, an air cylinder, or the like.

The liquid resin supply mechanism 900 is a so-called dispenser, and is configured to discharge the thermosetting liquid resin onto the release film 400 . The liquid resin supply mechanism 900 is capable of discharging the liquid resin while moving in the plane direction (arrow XY direction) in the region between the upper mold 310 and the lower mold 320 (intermediate plate 323), and the upper mold ( It is possible to retreat to an area other than between the 310 and the lower mold 320 . For example, the liquid resin supply mechanism 900 retreats to a region other than between the upper mold 310 and the lower mold 320 after the supply of the liquid resin onto the release film 400 is completed.

The control unit 700 is configured to control the entire resin molding apparatus 10 . The control part 700 controls the clamping mechanism 200, the film supply mechanism 500, the moving mechanism 600, the liquid resin supply mechanism 900, etc., for example. The control unit 700 includes a hardware processor such as a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and the like, and is configured to execute information processing based on a program and various data. In addition, the control part 700 may be arrange|positioned at any place in the resin molding apparatus 10, and may be comprised by several computers.

(1-2. Composition of molding mold and adsorption mechanism)

2 is a plan view of a portion of the lower mold 320 . 3 is a view including a cross section of the upper die 310 , the lower die 320 , and the intermediate plate 323 . In FIG. 3 , a cross section of a portion of the lower die 320 corresponds to a cross section III-III in FIG. 2 .

2 and 3 , a cavity 326 is formed in the lower mold 320 , and the lower mold 320 includes a bottom member 321 constituting a bottom surface of the cavity 326 and a cavity 326 . ) and a side member 322 constituting the side surface. The bottom member 321 is a plate-shaped member having a rectangular shape in plan view. The side member 322 is a frame-like member that covers the periphery of the bottom member 321 . In the lower mold|die 320, the side member 322 is being fixed via the installation member 328 containing elastic members, such as a spring. The side member 322 is located slightly above the bottom member 321 so as to constitute the cavity 326 . A slight gap is formed between the bottom member 321 and the side member 322 so that the bottom member 321 and the side member 322 can slide relatively.

The lower die 320 further includes a lower seal fixing member 329 and an installation rod 327 . In a state in which the release film 400 is sandwiched by the intermediate plate 323 and the lower mold 320 , the upper surfaces of the installation rod 327 and the lower seal fixing member 329 are in contact with the intermediate plate 323 . A through passage 324 is formed in the lower seal fixing member 329 . Each passage 324 is connected to a vacuum pump 330 via a suction pipe 325 . As described above, since a gap is formed between the bottom member 321 and the side member 322 , the vacuum pump 330 performs intake air, so that the release film 400 positioned on the lower mold 320 is transferred to the lower mold. adsorbed onto (320). The configuration including each through passage 324 and the vacuum pump 330 is an example of the "adsorption mechanism" of the present invention.

The upper die 310 is configured such that, for example, a substrate 800 on which a plurality of chips 810 are disposed is installed. The chip 810 is, for example, a semiconductor integrated circuit. The chip 810 may or may not be electrically connected to the substrate 800 . The shape of the substrate 800 is, for example, a rectangle or a circle. The substrate 800 is, for example, a semiconductor substrate (such as a silicon wafer), a metal substrate, a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate, and is a Fan Out Wafer Level Package (FO-WLP) or Fan Out Panel (FOPLP). The carrier of the plate-shaped member used for Level Package) may be included. The upper die 310 includes an upper seal fixing member 311 . The upper seal fixing member 311 is in contact with the intermediate plate 323 at the time of clamping the molding die 300 .

[2. Countermeasures against curing of liquid resin]

In the resin molding apparatus 10 as described above, for example, in a state in which the release film 400 is adsorbed to the lower mold 320 , it has thermosetting properties on the release film 400 by the liquid resin supply mechanism 900 . It is assumed that liquid resin is discharged. In this case, since the heat of the lower mold 320 is easily transferred to the liquid resin supplied on the release film 400 , there is a possibility that the liquid resin is cured faster than the appropriate timing.

In particular, when the liquid resin discharged by the liquid resin supply mechanism 900 has a high viscosity, or when the area on the release film 400 to which the liquid resin is to be discharged is large (for example, a square with one side of 300 mm or more, circular) having a diameter of 300 mm or more, requires a long time to complete the supply of the liquid resin. In this case, the situation in which the liquid resin is cured faster than the appropriate timing is more likely to occur.

For example, as a means to solve this problem, a liquid resin is supplied on the release film 400 at a separate place other than the resin molding apparatus 10, and then, the release film 400 to which the liquid resin is supplied. A method of arranging on the lower mold 320 may be considered. However, according to this method, for example, when the release film 400 is disposed on the lower mold 320 , wrinkles may occur in the release film 400 . In particular, when the size of the release film 400 increases, it is difficult to arrange the release film 400 on the lower mold 320 without wrinkles.

Although the details will be described later, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 is a liquid resin on the release film 400 in a state where the release film 400 and the lower mold 320 are spaced apart. Controls the liquid resin supply mechanism 900 to supply.

In the resin molding apparatus 10, since the liquid resin is supplied on the release film 400 in a state where the release film 400 and the lower mold 320 are physically separated from each other, the heat of the lower mold 320 is transferred to the release film ( 400), it is difficult to transfer to the liquid resin. Therefore, according to the resin molding apparatus 10, the situation in which liquid resin hardens faster than an appropriate timing can be suppressed.

[3. Manufacturing procedure of resin molded products]

4 : is a flowchart which shows the manufacturing procedure of the resin molded article by the resin molding apparatus 10. As shown in FIG. The process shown in FIG. 4 is performed by the control part 700 in the state in which the release film 400 is set in the film supply mechanism 500, and the shaping|molding die 300 is mold-opened.

Referring to FIG. 4 , the control unit 700 moves the sending roller 530 and the winding roller 540 to a predetermined position (eg, a position where the release film 400 contacts the lower surface of the intermediate plate 323 ). The moving mechanism 600 is controlled to raise it (step S100). That is, the controller 700 controls the moving mechanism 600 so that the release film 400 and the lower mold 320 are physically spaced apart.

When the movement of the delivery roller 530 and the take-up roller 540 is completed, the control unit 700 controls the film supply mechanism 500 to increase the tension applied to the release film 400 (step S110). More specifically, the control unit 700 fixes the rotation of the delivery roll in the delivery mechanism 510 and controls the torque of the take-up roll in the take-up mechanism 520 , so that the release film 400 increase the tension. Alternatively, the control unit 700 fixes the rotation of the take-up roll in the take-up mechanism 520 and controls the torque of the delivery roll in the delivery mechanism 510 . Thereby, when the liquid resin is supplied on the release film 400, the downward sagging of the release film 400 can be suppressed.

The control unit 700 controls the liquid resin supply mechanism 900 to supply the liquid resin onto the release film 400 in a state where the release film 400 and the lower mold 320 are physically separated (step S120 ).

FIG. 5 is a diagram showing a mode in which the liquid resin supply mechanism 900 supplies the liquid resin onto the release film 400 . As shown in FIG. 5 , in the liquid resin supply mechanism 900 , in a state in which the release film 400 is physically spaced apart from both of the bottom member 321 and the side member 322 , the release film 400 is The liquid resin 910 is supplied in a predetermined range within the plane.

When the supply of the liquid resin on the release film 400 is completed, the control unit 700 controls the liquid resin supply mechanism 900 to retreat from between the upper mold 310 and the lower mold 320 (step S130). . When the retreat of the liquid resin supply mechanism 900 is completed, the control unit 700 controls the movement mechanism 600 to lower the delivery roller 530 and the take-up roller 540 to a predetermined position (step S140). .

When the lowering of the delivery roller 530 and the take-up roller 540 is completed, the control unit 700 causes the side member 322 to come into contact with the release film 400 , and then, the lower seal fixing member 329 to the release film. The mold clamping mechanism 200 is controlled to raise the lower mold 320 to a position in contact with the intermediate plate 323 through 400 (step S150). When the raising of the lower mold 320 is completed, the control unit 700 controls the vacuum pump 330 and the like (adsorption mechanism) to adsorb the release film 400 supplied with the liquid resin onto the lower mold 320 ( step S160).

Then, the control unit 700, after the viscosity of the liquid resin on the release film 400 is lowered, from the state in which the side member 322 is in contact with the substrate 800 through the release film 400, the bottom member 321 ), the lower mold 320 is raised to control the mold clamping mechanism 200 to clamp the mold 300 (step S170). Thereby, a resin molded article is completed. In the resin molding apparatus 10, the mold opening of the shaping|molding die 300, conveyance of the release film 400, and the process of step S100 - step S170 are repeated after that, whereby a resin molded article is mass-produced.

[4. effect, etc.]

As described above, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 supplies the liquid resin on the release film 400 in a state where the release film 400 and the lower mold 320 are spaced apart. The liquid resin supply mechanism 900 is controlled to do so. In the resin molding apparatus 10, since the liquid resin is supplied on the release film 400 in a state where the release film 400 and the lower mold 320 are physically separated from each other, the heat of the lower mold 320 is transferred to the release film ( 400), it is difficult to transfer to the liquid resin. Therefore, according to the resin molding apparatus 10, the situation in which liquid resin hardens faster than an appropriate timing can be suppressed.

In addition, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 , before the liquid resin supply mechanism 900 supplies the liquid resin onto the release film 400 , to the release film 400 . The film supply mechanism 500 is controlled to increase the applied tension. Thereby, when the liquid resin is supplied on the release film 400, the downward sagging of the release film 400 can be suppressed.

In addition, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 , after the liquid resin is supplied on the release film 400 , adsorbs the release film 400 onto the lower mold 320 . to control the vacuum pump 330 and the like (adsorption mechanism). Thereby, the position shift of the release film 400 on the lower mold|type 320 can be suppressed, and a resin molded article can be manufactured more highly precisely.

[5. other embodiment]

The idea of the said embodiment is not limited to the embodiment demonstrated above. Hereinafter, an example of another embodiment to which the idea of the said embodiment can be applied is demonstrated.

In the above embodiment, although the intermediate plate 323 is provided between the upper die 310 and the lower die 320, the intermediate plate 323 is not necessarily required.

In addition, in the said embodiment, the resin molding apparatus 10 was a single-piece apparatus. However, the resin molding apparatus 10 does not necessarily need to be a single-piece apparatus, and may be some units in the apparatus which has several functions.

In the above, embodiments of the present invention have been exemplarily described. That is, for illustrative purposes, the detailed description and accompanying drawings have been disclosed. Therefore, components that are not essential for solving the problem may be included among the components described in the detailed description and the accompanying drawings. Therefore, even if those non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately admitted that those non-essential components are essential.

In addition, the said embodiment is only an illustration of this invention in all points. Various improvement and change are possible in the said embodiment within the scope of the present invention. That is, in the practice of the present invention, a specific configuration can be appropriately adopted depending on the embodiment.

10: resin molding device
100: base
110: tie bar
120: upper platen
130: lower platen
200: mold clamping mechanism
300: molding mold
310: hieroglyph
311: upper seal fixing member
320: lower
321: bottom member
322: side member
323: intermediate plate
324: through passage
325: suction pipe
326: cavity
327: installation bar
328: installation member
329: lower seal fixing member
330: vacuum pump
350: heating unit
400: release film
500: film supply mechanism
510: transmission mechanism
520: winding mechanism
530: dispensing roller
540: winding roller
600: moving mechanism
700: control unit
800: substrate
810: chip
900: liquid resin supply mechanism
910: liquid resin

Claims (8)

A molding die comprising an upper die and a lower die opposite to the upper die;
a mold clamping mechanism for clamping the molding mold;
a film supply mechanism for supplying a release film between the upper mold and the lower mold;
a liquid resin supply mechanism for supplying a liquid resin having thermosetting properties on the release film;
a control unit for controlling the liquid resin supply mechanism to supply the liquid resin onto the release film in a state in which the release film and the lower mold are spaced apart;
and a moving mechanism for moving the release film to a position spaced apart from the lower mold,
The film supply mechanism,
a sending mechanism for sending out the release film;
a winding mechanism for winding the release film;
a delivery roller disposed on the delivery mechanism side of the release film rather than the lower mold on the delivery path of the release film;
a winding roller disposed on the side of the winding mechanism rather than the lower mold on the conveyance path of the release film;
The said moving mechanism raises the said sending roller and the said winding-up roller, The resin molding apparatus of Claim. The resin molding apparatus according to claim 1, wherein the control unit controls the film supply mechanism to increase the tension applied to the release film before the liquid resin supply mechanism supplies the liquid resin onto the release film. According to claim 1 or 2, further comprising an adsorption mechanism for adsorbing the release film on the lower mold,
After the liquid resin is supplied onto the release film, the control unit controls the adsorption mechanism to adsorb the release film onto the lower mold. A step of supplying a release film between the upper mold and the lower mold by means of a film supply mechanism;
moving the release film to a position spaced apart from the lower mold by a moving mechanism;
supplying a liquid resin having thermosetting properties on the release film in a state in which the release film and the lower mold are spaced apart;
adsorbing the release film supplied with the liquid resin onto the lower mold;
comprising the step of clamping the upper mold and the lower mold in a state in which the release film is adsorbed,
The film supply mechanism,
a sending mechanism for sending out the release film;
a winding mechanism for winding the release film;
a delivery roller disposed on the delivery mechanism side of the release film rather than the lower mold on the delivery path of the release film;
a winding roller disposed on the side of the winding mechanism rather than the lower mold on the conveyance path of the release film;
The said moving mechanism raises the said sending roller and the said winding-up roller, The manufacturing method of the resin molded article. 5 . The method of claim 4 , further comprising, before supplying the liquid resin onto the release film, increasing the tension applied to the release film. delete delete delete

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