JP2021014017A - Resin molding apparatus, and manufacturing method of resin molded products - Google Patents
Resin molding apparatus, and manufacturing method of resin molded products Download PDFInfo
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- JP2021014017A JP2021014017A JP2019128101A JP2019128101A JP2021014017A JP 2021014017 A JP2021014017 A JP 2021014017A JP 2019128101 A JP2019128101 A JP 2019128101A JP 2019128101 A JP2019128101 A JP 2019128101A JP 2021014017 A JP2021014017 A JP 2021014017A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
- B29C45/14016—Intermittently feeding endless articles, e.g. transfer films, to the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/004—Arrangements for converting the motion of a material which is continuously fed to a working station in a stepwise motion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
- B29C31/08—Feeding of the material to be moulded, e.g. into a mould cavity of preforms to be moulded, e.g. tablets, fibre reinforced preforms, extruded ribbons, tubes or profiles; Manipulating means specially adapted for feeding preforms, e.g. supports conveyors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
- B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
- B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/20—Opening, closing or clamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
- B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
- B29C2043/3605—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
- B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/10—Thermosetting resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本発明は、樹脂成形装置、及び樹脂成形品の製造方法に関する。 The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.
特開2017−183443号公報(特許文献1)は、樹脂成形装置を開示する。この樹脂成形装置は、互いに対向して配置された上型及び下型を備えている。上型と下型との間にはフィルムが送り出される。この樹脂成形装置においては、フィルム上に樹脂材料が供給された状態で上型と下型とを型締めすることによって樹脂成形が行なわれる(特許文献1参照)。 Japanese Unexamined Patent Publication No. 2017-183443 (Patent Document 1) discloses a resin molding apparatus. This resin molding apparatus includes an upper mold and a lower mold arranged so as to face each other. A film is fed between the upper mold and the lower mold. In this resin molding apparatus, resin molding is performed by molding the upper mold and the lower mold while the resin material is supplied on the film (see Patent Document 1).
上記特許文献1に開示されている樹脂成形装置においては、下型が加熱されており、下型にフィルムが吸着された状態でフィルム上に樹脂材料が供給される。このような構成において、たとえば、樹脂材料として熱硬化性を有する液状樹脂が用いられると、フィルム上に供給された液状樹脂が適切なタイミングよりも早くに硬化する可能性がある。 In the resin molding apparatus disclosed in Patent Document 1, the lower mold is heated, and the resin material is supplied onto the film in a state where the film is adsorbed on the lower mold. In such a configuration, for example, when a thermosetting liquid resin is used as the resin material, the liquid resin supplied on the film may be cured earlier than an appropriate timing.
本発明は、このような問題を解決するためになされたものであって、その目的は、熱硬化性を有する液状樹脂が適切なタイミングよりも早くに硬化することを抑制可能な樹脂成形装置、及び、樹脂成形品の製造方法を提供することである。 The present invention has been made to solve such a problem, and an object of the present invention is a resin molding apparatus capable of suppressing the curing of a thermosetting liquid resin earlier than an appropriate timing. It is also an object of the present invention to provide a method for producing a resin molded product.
本発明のある局面に従う樹脂成形装置は、成形型と、型締め機構と、フィルム供給機構と、液状樹脂供給機構と、制御部とを備える。成形型は、上型と、上型に対向する下型とを含む。型締め機構は、成形型を型締めする。フィルム供給機構は、上型と下型との間に離型フィルムを供給する。液状樹脂供給機構は、離型フィルム上に熱硬化性を有する液状樹脂を供給する。制御部は、離型フィルムと下型とが離れた状態で離型フィルム上に液状樹脂を供給するように液状樹脂供給機構を制御する。 A resin molding apparatus according to a certain aspect of the present invention includes a molding mold, a mold clamping mechanism, a film supply mechanism, a liquid resin supply mechanism, and a control unit. The molding die includes an upper die and a lower die facing the upper die. The mold clamping mechanism molds the molding mold. The film supply mechanism supplies the release film between the upper mold and the lower mold. The liquid resin supply mechanism supplies a thermosetting liquid resin on the release film. The control unit controls the liquid resin supply mechanism so that the liquid resin is supplied onto the release film with the release film and the lower mold separated from each other.
本発明の他の局面に従う樹脂成形品の製造方法は、上型と下型との間に離型フィルムを供給するステップと、離型フィルムと下型とが離れた状態で離型フィルム上に熱硬化性を有する液状樹脂を供給するステップと、液状樹脂が供給された離型フィルムを下型上に吸着させるステップと、上型と、離型フィルムを吸着した状態の下型とを型締めするステップとを含む。 A method for producing a resin molded product according to another aspect of the present invention includes a step of supplying a release film between the upper mold and the lower mold, and a release film and a lower mold separated from each other on the release film. The step of supplying a heat-curable liquid resin, the step of adsorbing the release film to which the liquid resin is supplied onto the lower mold, and the upper mold and the lower mold in which the release film is adsorbed are molded. Including steps to do.
本発明によれば、熱硬化性を有する液状樹脂が適切なタイミングよりも早くに硬化することを抑制可能な樹脂成形装置、及び、樹脂成形品の製造方法を提供することができる。 According to the present invention, it is possible to provide a resin molding apparatus capable of suppressing the thermosetting liquid resin from being cured earlier than an appropriate timing, and a method for producing a resin molded product.
以下、本発明の一側面に係る実施の形態(以下、「本実施の形態」とも称する。)について、図面を用いて詳細に説明する。なお、図中同一又は相当部分には同一符号を付してその説明は繰り返さない。また、各図面は、理解の容易のために、適宜対象を省略又は誇張して模式的に描かれている。また、各図面において、矢印が示す方向は共通である。 Hereinafter, an embodiment according to one aspect of the present invention (hereinafter, also referred to as “the present embodiment”) will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals, and the description thereof will not be repeated. In addition, each drawing is schematically drawn by omitting or exaggerating the object as appropriate for easy understanding. Further, in each drawing, the direction indicated by the arrow is common.
[1.樹脂成形装置の構成]
(1−1.全体構成)
図1は、本実施の形態に従う樹脂成形装置10の正面図である。樹脂成形装置10は、いわゆるコンプレッションモールド法を用いることによって、樹脂成形品を製造するように構成されている。
[1. Configuration of resin molding equipment]
(1-1. Overall configuration)
FIG. 1 is a front view of the resin molding apparatus 10 according to the present embodiment. The resin molding apparatus 10 is configured to manufacture a resin molded product by using a so-called compression molding method.
図1に示されるように、樹脂成形装置10は、基盤100と、タイバー110と、上プラテン120と、下プラテン130と、型締め機構200と、成形型300と、フィルム供給機構500と、移動機構600と、制御部700と、液状樹脂供給機構900とを含んでいる。 As shown in FIG. 1, the resin molding apparatus 10 moves with the base 100, the tie bar 110, the upper platen 120, the lower platen 130, the mold clamping mechanism 200, the molding mold 300, and the film supply mechanism 500. It includes a mechanism 600, a control unit 700, and a liquid resin supply mechanism 900.
基盤100は、平面視矩形状の板状部材である。複数(4本)のタイバー110の各々は、上下方向に延びる棒状部材である。複数のタイバー110は、基盤100の四隅にそれぞれ固定されている。上プラテン120は、平面視矩形状の板状部材であり、複数のタイバー110の上部に固定されている。上プラテン120は、樹脂成形装置10において基盤100と対向している。下プラテン130は、平面視矩形状の板状部材であり、基盤100と上プラテン120との間において、上下方向に可動な状態で、タイバー110に取り付けられている。下プラテン130は、樹脂成形装置10において上プラテン120及び基盤100の双方と対向している。 The base 100 is a plate-shaped member having a rectangular shape in a plan view. Each of the plurality (4) tie bars 110 is a rod-shaped member extending in the vertical direction. The plurality of tie bars 110 are fixed to the four corners of the base 100, respectively. The upper platen 120 is a plate-shaped member having a rectangular shape in a plan view, and is fixed to the upper portions of the plurality of tie bars 110. The upper platen 120 faces the base 100 in the resin molding apparatus 10. The lower platen 130 is a plate-shaped member having a rectangular shape in a plan view, and is attached to the tie bar 110 in a state of being movable in the vertical direction between the base 100 and the upper platen 120. The lower platen 130 faces both the upper platen 120 and the base 100 in the resin molding apparatus 10.
型締め機構200は、基盤100の上面に固定されている。型締め機構200は、成形型300の型締め及び型開きのために、下プラテン130を昇降させるように構成されている。すなわち、型締め機構200は、成形型300を型締めするように構成されている。型締め機構200は、たとえば、サーボモータ及びボールねじの組合せ、油圧シリンダ及びリンク機構の組合せ等によって実現される。 The mold clamping mechanism 200 is fixed to the upper surface of the base 100. The mold clamping mechanism 200 is configured to raise and lower the lower platen 130 for mold clamping and mold opening of the molding die 300. That is, the mold clamping mechanism 200 is configured to mold mold 300. The mold clamping mechanism 200 is realized by, for example, a combination of a servomotor and a ball screw, a combination of a hydraulic cylinder and a link mechanism, and the like.
成形型300は、金属製の上型310と、該上型310に対向する金属製の下型320と、上型310及び下型320の双方に対向する金属製の中間プレート323とを含んでいる。上型310は上プラテン120の下面に固定されており、下型320は下プラテン130の上面に固定されている。上型310及び下型320の各々には、加熱部(ヒータ)350が設けられている。上型310及び下型320の各々は、加熱部350によって加熱される。中間プレート323は、中央部に平面視矩形状の孔が形成された枠状の部材であり、下型320とともに、離型フィルム400を挟む。成形型300については、後程詳しく説明する。 The molding die 300 includes a metal upper die 310, a metal lower die 320 facing the upper die 310, and a metal intermediate plate 323 facing both the upper die 310 and the lower die 320. There is. The upper mold 310 is fixed to the lower surface of the upper platen 120, and the lower mold 320 is fixed to the upper surface of the lower platen 130. A heating unit (heater) 350 is provided in each of the upper mold 310 and the lower mold 320. Each of the upper mold 310 and the lower mold 320 is heated by the heating unit 350. The intermediate plate 323 is a frame-shaped member having a rectangular hole in a plan view formed in the center thereof, and sandwiches the release film 400 together with the lower mold 320. The molding die 300 will be described in detail later.
フィルム供給機構500は、長尺状の離型フィルム400を上型310(中間プレート323)と下型320との間に供給するように構成されている。離型フィルム400の材料としては、耐熱性、離型性、柔軟性、伸展性等の特性を有する樹脂材料が用いられ、たとえば、PTFE(ポリテトラフルオロエチレン)、ETFE(エチレン・四フッ化エチレン共重合体)、PET(ポリエチレンテレフタレート)、FEP(四フッ化エチレン・六フッ化プロピレン共重合体)、ポリプロピレン、ポリスチレン、ポリ塩化ビニリデン等が用いられる。 The film supply mechanism 500 is configured to supply a long release film 400 between the upper mold 310 (intermediate plate 323) and the lower mold 320. As the material of the release film 400, a resin material having characteristics such as heat resistance, releasability, flexibility and extensibility is used. For example, PTFE (polytetrafluoroethylene) and ETFE (ethylene / fluorinated ethylene) are used. Copolymer), PET (polyethylene terephthalate), FEP (ethylene tetrafluorinated / propylene hexafluorinated copolymer), polypropylene, polystyrene, polyvinylidene chloride and the like are used.
フィルム供給機構500は、送出し機構510と、巻取り機構520と、送出しローラ530と、巻取りローラ540とを含んでいる。 The film supply mechanism 500 includes a feeding mechanism 510, a winding mechanism 520, a feeding roller 530, and a winding roller 540.
送出し機構510は、リールに巻かれた使用前の離型フィルム400を上型310(中間プレート323)と下型320との間に送り出すように構成されている。たとえば、送出し機構510は、送出しロールと、該送出しロールを回転させるモータ(不図示)とを含んでいる。巻取り機構520は、樹脂成形に用いられた使用済みの離型フィルム400をリールに巻き取るように構成されている。たとえば、巻取り機構520は、巻取りロールと、該巻取りロールを回転させるモータ(不図示)とを含んでいる。各モータのトルクが制御されることで、離型フィルム400が進行方向に送り出される。また、離型フィルム400の送出し時には、各モータのトルクが制御されることで、離型フィルム400の進行方向に適度な張力(テンション)が掛けられている。 The delivery mechanism 510 is configured to feed the release film 400 before use wound on a reel between the upper mold 310 (intermediate plate 323) and the lower mold 320. For example, the delivery mechanism 510 includes a delivery roll and a motor (not shown) for rotating the delivery roll. The winding mechanism 520 is configured to wind the used release film 400 used for resin molding on a reel. For example, the take-up mechanism 520 includes a take-up roll and a motor (not shown) for rotating the take-up roll. By controlling the torque of each motor, the release film 400 is sent out in the traveling direction. Further, when the release film 400 is delivered, the torque of each motor is controlled, so that an appropriate tension is applied in the traveling direction of the release film 400.
送出し機構510と成形型300との間には、離型フィルム400に張力を加えるための送出しローラ530が配置されている。すなわち、送出しローラ530は、離型フィルム400の搬送経路上において、下型320よりも送出し機構510側に配置されている。成形型300と巻取り機構520との間には、離型フィルム400に張力を加えるための巻取りローラ540が配置されている。すなわち、巻取りローラ540は、離型フィルム400の搬送経路上において、下型320よりも巻取り機構520側に配置されている。送出しローラ530及び巻取りローラ540の各々は、離型フィルム400に張力を加えるとともに、上型310と下型320との間において離型フィルム400を搬送するように構成されている。 A delivery roller 530 for applying tension to the release film 400 is arranged between the delivery mechanism 510 and the molding die 300. That is, the delivery roller 530 is arranged on the delivery mechanism 510 side of the lower mold 320 on the transfer path of the release film 400. A take-up roller 540 for applying tension to the release film 400 is arranged between the mold 300 and the take-up mechanism 520. That is, the take-up roller 540 is arranged on the take-up mechanism 520 side of the lower mold 320 on the transport path of the release film 400. Each of the delivery roller 530 and the take-up roller 540 is configured to apply tension to the release film 400 and to convey the release film 400 between the upper mold 310 and the lower mold 320.
各移動機構600は、送出しローラ530又は巻取りローラ540の回転軸を、上下方向に可動な状態で保持している。移動機構600は、送出しローラ530及び巻取りローラ540の回転軸を昇降させるように構成されている。移動機構600は、たとえば、送出しローラ530及び巻取りローラ540の回転軸を上昇させることによって、離型フィルム400を下型320から物理的に離すことができる。移動機構600は、たとえば、サーボモータ及びボールねじの組合せ、エアーシリンダ等によって実現される。 Each moving mechanism 600 holds the rotation axis of the sending roller 530 or the winding roller 540 in a state of being movable in the vertical direction. The moving mechanism 600 is configured to raise and lower the rotation shafts of the delivery roller 530 and the take-up roller 540. The moving mechanism 600 can physically separate the release film 400 from the lower mold 320 by, for example, raising the rotation axes of the delivery roller 530 and the take-up roller 540. The moving mechanism 600 is realized by, for example, a combination of a servomotor and a ball screw, an air cylinder, and the like.
液状樹脂供給機構900は、いわゆるディスペンサであり、離型フィルム400上に熱硬化性を有する液状樹脂を吐出するように構成されている。液状樹脂供給機構900は、上型310と下型320(中間プレート323)との間の領域において面方向(矢印XY方向)に移動しつつ液状樹脂を吐出可能であるとともに、上型310と下型320との間以外の領域に退避可能である。たとえば、液状樹脂供給機構900は、離型フィルム400上への液状樹脂の供給完了後、上型310と下型320との間以外の領域に退避する。 The liquid resin supply mechanism 900 is a so-called dispenser, and is configured to discharge a thermosetting liquid resin onto the release film 400. The liquid resin supply mechanism 900 can discharge the liquid resin while moving in the plane direction (arrow XY direction) in the region between the upper mold 310 and the lower mold 320 (intermediate plate 323), and the upper mold 310 and the lower mold 310. It can be saved in an area other than the area between the mold 320 and the mold 320. For example, the liquid resin supply mechanism 900 retracts to a region other than between the upper mold 310 and the lower mold 320 after the liquid resin has been supplied onto the release film 400.
制御部700は、樹脂成形装置10全体を制御するように構成されている。制御部700は、たとえば、型締め機構200、フィルム供給機構500、移動機構600、液状樹脂供給機構900等を制御する。制御部700は、ハードウェアプロセッサであるCPU(Central Processing Unit)、RAM(Random Access Memory)及びROM(Read Only Memory)等を含み、プログラム及び各種データに基づいて情報処理を実行するように構成されている。なお、制御部700は、樹脂成形装置10内のいずれの場所に配置されていてもよいし、複数のコンピュータによって構成されてもよい。 The control unit 700 is configured to control the entire resin molding apparatus 10. The control unit 700 controls, for example, the mold clamping mechanism 200, the film supply mechanism 500, the moving mechanism 600, the liquid resin supply mechanism 900, and the like. The control unit 700 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and the like, which are hardware processors, and is configured to execute information processing based on a program and various data. ing. The control unit 700 may be arranged at any place in the resin molding apparatus 10, or may be configured by a plurality of computers.
(1−2.成形型及び吸着機構の構成)
図2は、下型320の一部分の平面図である。図3は、上型310、下型320及び中間プレート323の断面を含む図である。図3において、下型320の一部分の断面は、図2のIII−III断面に対応している。
(1-2. Configuration of molding mold and suction mechanism)
FIG. 2 is a plan view of a part of the lower mold 320. FIG. 3 is a view including a cross section of the upper mold 310, the lower mold 320, and the intermediate plate 323. In FIG. 3, the cross section of a part of the lower mold 320 corresponds to the III-III cross section of FIG.
図2及び図3に示されるように、下型320にはキャビティ326が形成されており、下型320は、キャビティ326の底面を構成する底面部材321と、キャビティ326の側面を構成する側面部材322とを含んでいる。底面部材321は、平面視矩形状の板状部材である。側面部材322は、底面部材321の周囲を覆う枠状部材である。下型320において、側面部材322は、スプリング等の弾性部材を含む取付部材328を介して固定されている。側面部材322は、キャビティ326を構成するように、底面部材321よりも僅かに上方に位置している。底面部材321と側面部材322との間には、底面部材321と周面部材322とが相対的に摺動可能なようにわずかな隙間が形成されている。 As shown in FIGS. 2 and 3, a cavity 326 is formed in the lower mold 320, and the lower mold 320 has a bottom surface member 321 forming the bottom surface of the cavity 326 and a side surface member forming the side surface of the cavity 326. 322 and is included. The bottom surface member 321 is a plate-shaped member having a rectangular shape in a plan view. The side surface member 322 is a frame-shaped member that covers the periphery of the bottom surface member 321. In the lower mold 320, the side surface member 322 is fixed via a mounting member 328 including an elastic member such as a spring. The side member 322 is located slightly above the bottom member 321 so as to form the cavity 326. A slight gap is formed between the bottom surface member 321 and the side surface member 322 so that the bottom surface member 321 and the peripheral surface member 322 can be relatively slidable.
下型320は、さらに、下側シール固定部材329と、取付棒327とを含んでいる。中間プレート323と下型320とによって離型フィルム400を挟んでいる状態で、取付棒327及び下側シール固定部材329の上面は中間プレート323に接する。下側シール固定部材329には、貫通路324が形成されている。各貫通路324は、吸引用配管325を介して、真空ポンプ330に接続されている。上述のように底面部材321と側面部材322との間には隙間が形成されているため、真空ポンプ330が吸気を行なうことによって、下型320上に位置する離型フィルム400が下型320上に吸着される。各貫通路324及び真空ポンプ330を含む構成は、本発明の「吸着機構」の一例である。 The lower mold 320 further includes a lower seal fixing member 329 and a mounting rod 327. The upper surfaces of the mounting rod 327 and the lower seal fixing member 329 are in contact with the intermediate plate 323 while the release film 400 is sandwiched between the intermediate plate 323 and the lower mold 320. A through-passage 324 is formed in the lower seal fixing member 329. Each gangway 324 is connected to the vacuum pump 330 via a suction pipe 325. Since a gap is formed between the bottom surface member 321 and the side surface member 322 as described above, the release film 400 located on the lower mold 320 is moved onto the lower mold 320 by sucking air from the vacuum pump 330. Is adsorbed on. The configuration including each through-passage 324 and the vacuum pump 330 is an example of the "suction mechanism" of the present invention.
上型310は、たとえば、複数のチップ810が配置された基板800が取り付けられるように構成されている。チップ810は、たとえば、半導体集積回路である。チップ810は、基板800に対して、電気的に接続されてもよいし、電気的に接続されなくてもよい。基板800の形状は、たとえば、四角形又は円形である。基板800は、たとえば、半導体基板(シリコンウェハ等)、金属基板、ガラス基板、セラミック基板、樹脂基板、又は配線基板であり、FO−WLP(Fan Out Wafer Level Package)又はFO−PLP(Fan Out Panel Level Package)に用いられる板状部材のキャリアを含んでいてもよい。上型310は、上側シール固定部材311を含む。上側シール固定部材311は、成形型300の型締め時に中間プレート323に接する。 The upper die 310 is configured to mount, for example, a substrate 800 on which a plurality of chips 810 are arranged. The chip 810 is, for example, a semiconductor integrated circuit. The chip 810 may or may not be electrically connected to the substrate 800. The shape of the substrate 800 is, for example, a quadrangle or a circle. The substrate 800 is, for example, a semiconductor substrate (silicon wafer or the like), a metal substrate, a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate, and is FO-WLP (Fan Out Wafer Level Package) or FO-PLP (Fan Out Panel). It may include a carrier of a plate-shaped member used for Level Package). The upper mold 310 includes an upper seal fixing member 311. The upper seal fixing member 311 comes into contact with the intermediate plate 323 when the molding die 300 is compacted.
[2.液状樹脂の硬化対策]
上述のような樹脂成形装置10において、仮に、離型フィルム400が下型320に吸着された状態で、液状樹脂供給機構900によって離型フィルム400上に熱硬化性を有する液状樹脂が吐出されるとする。この場合には、下型320の熱が離型フィルム400上に供給された液状樹脂に伝達されやすいため、液状樹脂が適切なタイミングよりも早くに硬化する可能性がある。
[2. Measures against curing of liquid resin]
In the resin molding apparatus 10 as described above, the release film 400 is temporarily adsorbed on the lower mold 320, and the liquid resin supply mechanism 900 discharges the thermosetting liquid resin onto the release film 400. And. In this case, since the heat of the lower mold 320 is easily transferred to the liquid resin supplied on the release film 400, the liquid resin may be cured earlier than an appropriate timing.
特に、液状樹脂供給機構900によって吐出される液状樹脂が高粘度である場合や、液状樹脂が吐出されるべき離型フィルム400上の面積が広い場合(たとえば、一辺が300mm以上の四角形や、直径が300mm以上の円形)には、液状樹脂の供給の完了に長時間を要する。このような場合には、液状樹脂が適切なタイミングよりも早くに硬化する事態がより生じやすい。 In particular, when the liquid resin discharged by the liquid resin supply mechanism 900 has a high viscosity, or when the area on the release film 400 on which the liquid resin should be discharged is large (for example, a square having a side of 300 mm or more or a diameter). It takes a long time to complete the supply of the liquid resin (circular shape of 300 mm or more). In such a case, it is more likely that the liquid resin will be cured earlier than the appropriate timing.
たとえば、このような問題を解決する手段として、樹脂成形装置10以外の別の場所で離型フィルム400上に液状樹脂を供給し、その後、液状樹脂が供給された離型フィルム400を下型320上に配置する方法が考えられる。しかしながら、このような方法によれば、たとえば、離型フィルム400を下型320上に配置するときに、離型フィルム400に皺が生じ得る。特に、離型フィルム400の大きさが大きくなると、皺を生じさせることなく離型フィルム400を下型320上に配置することは困難である。 For example, as a means for solving such a problem, a liquid resin is supplied onto the release film 400 at a place other than the resin molding apparatus 10, and then the release film 400 to which the liquid resin is supplied is transferred to the lower mold 320. A method of placing it on the top is conceivable. However, according to such a method, for example, when the release film 400 is placed on the lower mold 320, wrinkles may occur in the release film 400. In particular, when the size of the release film 400 becomes large, it is difficult to arrange the release film 400 on the lower mold 320 without causing wrinkles.
詳細については後述するが、本実施の形態に従う樹脂成形装置10において、制御部700は、離型フィルム400と下型320とが離れた状態で離型フィルム400上に液状樹脂を供給するように液状樹脂供給機構900を制御する。 Although the details will be described later, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 supplies the liquid resin onto the release film 400 with the release film 400 and the lower mold 320 separated from each other. Controls the liquid resin supply mechanism 900.
樹脂成形装置10においては、離型フィルム400と下型320とが物理的に離れた状態で離型フィルム400上に液状樹脂が供給されるため、下型320の熱が離型フィルム400上の液状樹脂に伝達されにくい。したがって、樹脂成形装置10によれば、液状樹脂が適切なタイミングよりも早くに硬化する事態を抑制することができる。 In the resin molding apparatus 10, since the liquid resin is supplied onto the release film 400 in a state where the release film 400 and the lower mold 320 are physically separated from each other, the heat of the lower mold 320 is generated on the release film 400. It is difficult to be transmitted to the liquid resin. Therefore, according to the resin molding apparatus 10, it is possible to suppress a situation in which the liquid resin is cured earlier than an appropriate timing.
[3.樹脂成形品の製造手順]
図4は、樹脂成形装置10による樹脂成形品の製造手順を示すフローチャートである。図4に示される処理は、フィルム供給機構500に離型フィルム400がセットされており、成形型300が型開きした状態で、制御部700によって実行される。
[3. Manufacturing procedure for resin molded products]
FIG. 4 is a flowchart showing a manufacturing procedure of a resin molded product by the resin molding apparatus 10. The process shown in FIG. 4 is executed by the control unit 700 in a state where the release film 400 is set in the film supply mechanism 500 and the mold 300 is opened.
図4を参照して、制御部700は、送出しローラ530及び巻取りローラ540を予め定められ位置(たとえば、離型フィルム400が中間プレート323の下面に接する位置)まで上昇させるように移動機構600を制御する(ステップS100)。すなわち、制御部700は、離型フィルム400と下型320とが物理的に離れるように移動機構600を制御する。 With reference to FIG. 4, the control unit 700 raises the delivery roller 530 and the take-up roller 540 to a predetermined position (for example, a position where the release film 400 contacts the lower surface of the intermediate plate 323). Control 600 (step S100). That is, the control unit 700 controls the moving mechanism 600 so that the release film 400 and the lower mold 320 are physically separated from each other.
送出しローラ530及び巻取りローラ540の移動が完了すると、制御部700は、離型フィルム400に掛かる張力を高めるようにフィルム供給機構500を制御する(ステップS110)。より具体的には、制御部700は、送出し機構510における送出しロールの回転を固定し、巻取り機構520における巻取りロールのトルクを制御することによって、離型フィルム400に掛かる張力を高める。または、制御部700は、巻取り機構520における巻取りロールの回転を固定し、送出し機構510における送出しロールのトルクを制御する。これにより、離型フィルム400上に液状樹脂が供給された場合における離型フィルム400の下方への垂れを抑制することができる。 When the movement of the delivery roller 530 and the take-up roller 540 is completed, the control unit 700 controls the film supply mechanism 500 so as to increase the tension applied to the release film 400 (step S110). More specifically, the control unit 700 fixes the rotation of the delivery roll in the delivery mechanism 510 and controls the torque of the take-up roll in the take-up mechanism 520 to increase the tension applied to the release film 400. .. Alternatively, the control unit 700 fixes the rotation of the take-up roll in the take-up mechanism 520 and controls the torque of the take-up roll in the take-out mechanism 510. As a result, it is possible to suppress the downward sagging of the release film 400 when the liquid resin is supplied onto the release film 400.
制御部700は、離型フィルム400と下型320とが物理的に離れた状態で離型フィルム400上に液状樹脂を供給するように液状樹脂供給機構900を制御する(ステップS120)。 The control unit 700 controls the liquid resin supply mechanism 900 so that the release film 400 and the lower mold 320 are physically separated from each other and the liquid resin is supplied onto the release film 400 (step S120).
図5は、液状樹脂供給機構900が離型フィルム400上に液状樹脂を供給する様子を示す図である。図5に示されるように、液状樹脂供給機構900は、離型フィルム400が底面部材321及び側面部材322の双方から物理的に離れた状態で、離型フィルム400の面内の予め定められた範囲に液状樹脂910を供給する。 FIG. 5 is a diagram showing how the liquid resin supply mechanism 900 supplies the liquid resin onto the release film 400. As shown in FIG. 5, the liquid resin supply mechanism 900 is predetermined in the plane of the release film 400 with the release film 400 physically separated from both the bottom member 321 and the side surface member 322. Liquid resin 910 is supplied to the range.
離型フィルム400上における液状樹脂の供給が完了すると、制御部700は、上型310と下型320との間から退避するように液状樹脂供給機構900を制御する(ステップS130)。液状樹脂供給機構900の退避が完了すると、制御部700は、送出しローラ530及び巻取りローラ540を予め定められた位置まで下降させるように移動機構600を制御する(ステップS140)。 When the supply of the liquid resin on the release film 400 is completed, the control unit 700 controls the liquid resin supply mechanism 900 so as to retract from between the upper mold 310 and the lower mold 320 (step S130). When the evacuation of the liquid resin supply mechanism 900 is completed, the control unit 700 controls the moving mechanism 600 so as to lower the delivery roller 530 and the take-up roller 540 to a predetermined position (step S140).
送出しローラ530及び巻取りローラ540の下降が完了すると、制御部700は、側面部材322が離型フィルム400に接し、その後、下側シール固定部材329が離型フィルム400を介して中間プレート323と接する位置まで下型320を上昇させるように型締め機構200を制御する(ステップS150)。下型320の上昇が完了すると、制御部700は、液状樹脂が供給された離型フィルム400を下型320上に吸着させるように真空ポンプ330等(吸着機構)を制御する(ステップS160)。 When the lowering of the delivery roller 530 and the take-up roller 540 is completed, in the control unit 700, the side member 322 comes into contact with the release film 400, and then the lower seal fixing member 329 passes through the release film 400 and the intermediate plate 323. The mold clamping mechanism 200 is controlled so as to raise the lower mold 320 to a position in contact with the mold (step S150). When the ascent of the lower mold 320 is completed, the control unit 700 controls the vacuum pump 330 and the like (adsorption mechanism) so as to attract the release film 400 to which the liquid resin is supplied onto the lower mold 320 (step S160).
その後、制御部700は、離型フィルム400上の液状樹脂の粘度が低下した後に、離型フィルム400を介して側面部材322を基板800に接触させた状態から底面部材321を上昇させるよう、下型320を上昇させて成形型300の型締めを行なうように型締め機構200を制御する(ステップS170)。これにより、樹脂成形品が完成する。樹脂成形装置10においては、その後、成形型300の型開き、及び、離型フィルム400の搬送、及び、ステップS100〜ステップS170の処理が繰り返されることによって、樹脂成形品が量産される。 After that, the control unit 700 lowers the bottom member 321 from the state where the side member 322 is in contact with the substrate 800 via the release film 400 after the viscosity of the liquid resin on the release film 400 is lowered. The mold clamping mechanism 200 is controlled so as to raise the mold 320 to perform mold clamping of the molding mold 300 (step S170). As a result, the resin molded product is completed. In the resin molding apparatus 10, the resin molded product is mass-produced by repeating the mold opening of the molding mold 300, the transfer of the release film 400, and the processes of steps S100 to S170.
[4.効果等]
以上のように、本実施の形態に従う樹脂成形装置10において、制御部700は、離型フィルム400と下型320とが離れた状態で離型フィルム400上に液状樹脂を供給するように液状樹脂供給機構900を制御する。樹脂成形装置10においては、離型フィルム400と下型320とが物理的に離れた状態で離型フィルム400上に液状樹脂が供給されるため、下型320の熱が離型フィルム400上の液状樹脂に伝達されにくい。したがって、樹脂成形装置10によれば、液状樹脂が適切なタイミングよりも早くに硬化する事態を抑制することができる。
[4. Effect, etc.]
As described above, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 supplies the liquid resin onto the release film 400 with the release film 400 and the lower mold 320 separated from each other. Controls the supply mechanism 900. In the resin molding apparatus 10, since the liquid resin is supplied onto the release film 400 in a state where the release film 400 and the lower mold 320 are physically separated from each other, the heat of the lower mold 320 is generated on the release film 400. It is difficult to be transmitted to the liquid resin. Therefore, according to the resin molding apparatus 10, it is possible to suppress a situation in which the liquid resin is cured earlier than an appropriate timing.
また、本実施の形態に従う樹脂成形装置10において、制御部700は、液状樹脂供給機構900が液状樹脂を離型フィルム400上に供給する前に、離型フィルム400に掛かる張力を高めるようにフィルム供給機構500を制御する。これにより、離型フィルム400上に液状樹脂が供給された場合における離型フィルム400の下方への垂れを抑制することができる。 Further, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 increases the tension applied to the release film 400 before the liquid resin supply mechanism 900 supplies the liquid resin onto the release film 400. Controls the supply mechanism 500. As a result, it is possible to suppress the downward sagging of the release film 400 when the liquid resin is supplied onto the release film 400.
また、本実施の形態に従う樹脂成形装置10において、制御部700は、離型フィルム400上に液状樹脂が供給された後に、離型フィルム400を下型320上に吸着させるように真空ポンプ330等(吸着機構)を制御する。これにより、下型320上における離型フィルム400の位置ずれを抑制することができ、より高精度に樹脂成形品を製造することができる。 Further, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 uses a vacuum pump 330 or the like so as to attract the release film 400 onto the lower mold 320 after the liquid resin is supplied onto the release film 400. (Adsorption mechanism) is controlled. As a result, the displacement of the release film 400 on the lower mold 320 can be suppressed, and the resin molded product can be manufactured with higher accuracy.
[5.他の実施の形態]
上記実施の形態の思想は、以上で説明された実施の形態に限定されない。以下、上記実施の形態の思想を適用できる他の実施の形態の一例について説明する。
[5. Other embodiments]
The idea of the above embodiment is not limited to the embodiment described above. Hereinafter, an example of another embodiment to which the idea of the above embodiment can be applied will be described.
上記実施の形態においては、上型310と下型320との間に中間プレート323が設けられたが、中間プレート323は必ずしも必要ではない。 In the above embodiment, the intermediate plate 323 is provided between the upper mold 310 and the lower mold 320, but the intermediate plate 323 is not always necessary.
また、上記実施の形態においては、樹脂成形装置10は、単体の装置であった。しかしながら、樹脂成形装置10は、必ずしも単体の装置である必要はなく、複数の機能を有する装置における一部のユニットであってもよい。 Further, in the above embodiment, the resin molding apparatus 10 is a single apparatus. However, the resin molding apparatus 10 does not necessarily have to be a single apparatus, and may be a part of the apparatus in the apparatus having a plurality of functions.
以上、本発明の実施の形態について例示的に説明した。すなわち、例示的な説明のために、詳細な説明及び添付の図面が開示された。よって、詳細な説明及び添付の図面に記載された構成要素の中には、課題解決のために必須でない構成要素が含まれることがある。したがって、それらの必須でない構成要素が詳細な説明及び添付の図面に記載されているからといって、それらの必須でない構成要素が必須であると直ちに認定されるべきではない。 The embodiments of the present invention have been exemplified above. That is, for illustrative purposes, detailed description and accompanying drawings have been disclosed. Therefore, some of the components described in the detailed description and the attached drawings may include components that are not essential for solving the problem. Therefore, just because those non-essential components are described in the detailed description and accompanying drawings should not be immediately determined to be essential.
また、上記実施の形態は、あらゆる点において本発明の例示にすぎない。上記実施の形態は、本発明の範囲内において、種々の改良や変更が可能である。すなわち、本発明の実施にあたっては、実施の形態に応じて具体的構成を適宜採用することができる。 Moreover, the above-described embodiment is merely an example of the present invention in all respects. The above-described embodiment can be improved or modified in various ways within the scope of the present invention. That is, in carrying out the present invention, a specific configuration can be appropriately adopted according to the embodiment.
10 樹脂成形装置、100 基盤、110 タイバー、120 上プラテン、130 下プラテン、200 型締め機構、300 成形型、310 上型、311 上側シール固定部材、320 下型、321 底面部材、322 側面部材、323 中間プレート、324 貫通路、325 吸引用配管、326 キャビティ、327 取付棒、328 取付部材、329 下側シール固定部材、330 真空ポンプ、350 加熱部、400 離型フィルム、500 フィルム供給機構、510 送出し機構、520 巻取り機構、530 送出しローラ、540 巻取りローラ、600 移動機構、700 制御部、800 基板、810 チップ、900 液状樹脂供給機構、910 液状樹脂。 10 Resin molding equipment, 100 base, 110 tie bar, 120 upper platen, 130 lower platen, 200 mold tightening mechanism, 300 molding mold, 310 upper mold, 311 upper seal fixing member, 320 lower mold, 321 bottom member, 322 side member, 323 Intermediate plate, 324 through-passage, 325 suction pipe, 326 cavity, 327 mounting rod, 328 mounting member, 329 lower seal fixing member, 330 vacuum pump, 350 heating part, 400 release film, 500 film supply mechanism, 510 Delivery mechanism, 520 take-up mechanism, 530 take-up roller, 540 take-up roller, 600 movement mechanism, 700 control unit, 800 board, 810 chips, 900 liquid resin supply mechanism, 910 liquid resin.
Claims (8)
前記成形型を型締めする型締め機構と、
前記上型と前記下型との間に離型フィルムを供給するフィルム供給機構と、
前記離型フィルム上に熱硬化性を有する液状樹脂を供給する液状樹脂供給機構と、
前記離型フィルムと前記下型とが離れた状態で前記離型フィルム上に前記液状樹脂を供給するように前記液状樹脂供給機構を制御する制御部とを備える、樹脂成形装置。 A molding mold including an upper mold and a lower mold facing the upper mold,
A mold clamping mechanism for molding the molding mold and
A film supply mechanism that supplies a release film between the upper mold and the lower mold,
A liquid resin supply mechanism that supplies a thermosetting liquid resin onto the release film,
A resin molding apparatus including a control unit that controls the liquid resin supply mechanism so as to supply the liquid resin onto the release film in a state where the release film and the lower mold are separated from each other.
前記離型フィルムを送り出す送出し機構と、
前記離型フィルムを巻き取る巻取り機構と、
前記離型フィルムの搬送経路上において前記下型よりも前記送出し機構側に配置された送出しローラと、
前記離型フィルムの搬送経路上において前記下型よりも前記巻取り機構側に配置された巻取りローラとを含み、
前記移動機構は、前記送出しローラ及び前記巻取りローラを上昇させる、請求項2に記載の樹脂成形装置。 The film supply mechanism
The delivery mechanism that sends out the release film and
A winding mechanism for winding the release film and
A delivery roller arranged on the delivery mechanism side of the lower mold on the transfer path of the release film, and a delivery roller.
Including a take-up roller arranged on the take-up mechanism side of the lower mold on the transfer path of the release film.
The resin molding apparatus according to claim 2, wherein the moving mechanism raises the sending roller and the winding roller.
前記制御部は、前記離型フィルム上に前記液状樹脂が供給された後に、前記離型フィルムを前記下型上に吸着させるように前記吸着機構を制御する、請求項1から請求項4のいずれか1項に記載の樹脂成形装置。 Further provided with an adsorption mechanism for adsorbing the release film onto the lower mold,
Any of claims 1 to 4, wherein the control unit controls the adsorption mechanism so that the release film is adsorbed on the lower mold after the liquid resin is supplied onto the release film. The resin molding apparatus according to item 1.
前記離型フィルムと前記下型とが離れた状態で前記離型フィルム上に熱硬化性を有する液状樹脂を供給するステップと、
前記液状樹脂が供給された前記離型フィルムを前記下型上に吸着させるステップと、
前記上型と、前記離型フィルムを吸着した状態の前記下型とを型締めするステップとを含む、樹脂成形品の製造方法。 The step of supplying a release film between the upper mold and the lower mold,
A step of supplying a thermosetting liquid resin onto the release film with the release film and the lower mold separated from each other.
A step of adsorbing the release film to which the liquid resin is supplied onto the lower mold,
A method for producing a resin molded product, which comprises a step of molding the upper mold and the lower mold in a state where the release film is adsorbed.
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