JP2021014017A - Resin molding apparatus, and manufacturing method of resin molded products - Google Patents

Abstract

To provide a resin molding apparatus capable of suppressing the curing of a thermosetting liquid resin earlier than an appropriate timing, and a method for manufacturing resin molded products.SOLUTION: A resin molding apparatus is provided with a molding mold, a mold clamping mechanism, a film supply mechanism, a liquid resin supply mechanism, and a control unit. The molding die includes an upper die and a lower die facing the upper die. The mold clamping mechanism molds the molding mold. The film supply mechanism supplies a mold release film between the upper mold and the lower mold. The liquid resin supply mechanism supplies a thermosetting liquid resin on the mold release film. The control unit controls the liquid resin supply mechanism so that the liquid resin is supplied onto the release film with the mold release film and the lower mold separated from each other.SELECTED DRAWING: Figure 4

Description

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

Japanese Unexamined Patent Publication No. 2017-183443 (Patent Document 1) discloses a resin molding apparatus. This resin molding apparatus includes an upper mold and a lower mold arranged so as to face each other. A film is fed between the upper mold and the lower mold. In this resin molding apparatus, resin molding is performed by molding the upper mold and the lower mold while the resin material is supplied on the film (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2017-183443

In the resin molding apparatus disclosed in Patent Document 1, the lower mold is heated, and the resin material is supplied onto the film in a state where the film is adsorbed on the lower mold. In such a configuration, for example, when a thermosetting liquid resin is used as the resin material, the liquid resin supplied on the film may be cured earlier than an appropriate timing.

The present invention has been made to solve such a problem, and an object of the present invention is a resin molding apparatus capable of suppressing the curing of a thermosetting liquid resin earlier than an appropriate timing. It is also an object of the present invention to provide a method for producing a resin molded product.

A resin molding apparatus according to a certain aspect of the present invention includes a molding mold, a mold clamping mechanism, a film supply mechanism, a liquid resin supply mechanism, and a control unit. The molding die includes an upper die and a lower die facing the upper die. The mold clamping mechanism molds the molding mold. The film supply mechanism supplies the release film between the upper mold and the lower mold. The liquid resin supply mechanism supplies a thermosetting liquid resin on the release film. The control unit controls the liquid resin supply mechanism so that the liquid resin is supplied onto the release film with the release film and the lower mold separated from each other.

A method for producing a resin molded product according to another aspect of the present invention includes a step of supplying a release film between the upper mold and the lower mold, and a release film and a lower mold separated from each other on the release film. The step of supplying a heat-curable liquid resin, the step of adsorbing the release film to which the liquid resin is supplied onto the lower mold, and the upper mold and the lower mold in which the release film is adsorbed are molded. Including steps to do.

According to the present invention, it is possible to provide a resin molding apparatus capable of suppressing the thermosetting liquid resin from being cured earlier than an appropriate timing, and a method for producing a resin molded product.

It is a front view of the resin molding apparatus. It is a top view of a part of the lower mold. It is a figure including the cross section of the upper mold, the lower mold and the intermediate plate. It is a flowchart which shows the manufacturing procedure of the resin molded article by the resin molding apparatus. It is a figure which shows a mode that a liquid resin supply mechanism supplies a liquid resin on a release film.

Hereinafter, an embodiment according to one aspect of the present invention (hereinafter, also referred to as “the present embodiment”) will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals, and the description thereof will not be repeated. In addition, each drawing is schematically drawn by omitting or exaggerating the object as appropriate for easy understanding. Further, in each drawing, the direction indicated by the arrow is common.

[1. Configuration of resin molding equipment]
(1-1. Overall configuration)
FIG. 1 is a front view of the resin molding apparatus 10 according to the present embodiment. The resin molding apparatus 10 is configured to manufacture a resin molded product by using a so-called compression molding method.

As shown in FIG. 1, the resin molding apparatus 10 moves with the base 100, the tie bar 110, the upper platen 120, the lower platen 130, the mold clamping mechanism 200, the molding mold 300, and the film supply mechanism 500. It includes a mechanism 600, a control unit 700, and a liquid resin supply mechanism 900.

The base 100 is a plate-shaped member having a rectangular shape in a plan view. Each of the plurality (4) tie bars 110 is a rod-shaped member extending in the vertical direction. The plurality of tie bars 110 are fixed to the four corners of the base 100, respectively. The upper platen 120 is a plate-shaped member having a rectangular shape in a plan view, and is fixed to the upper portions of the plurality of tie bars 110. The upper platen 120 faces the base 100 in the resin molding apparatus 10. The lower platen 130 is a plate-shaped member having a rectangular shape in a plan view, and is attached to the tie bar 110 in a state of being movable in the vertical direction between the base 100 and the upper platen 120. The lower platen 130 faces both the upper platen 120 and the base 100 in the resin molding apparatus 10.

The mold clamping mechanism 200 is fixed to the upper surface of the base 100. The mold clamping mechanism 200 is configured to raise and lower the lower platen 130 for mold clamping and mold opening of the molding die 300. That is, the mold clamping mechanism 200 is configured to mold mold 300. The mold clamping mechanism 200 is realized by, for example, a combination of a servomotor and a ball screw, a combination of a hydraulic cylinder and a link mechanism, and the like.

The molding die 300 includes a metal upper die 310, a metal lower die 320 facing the upper die 310, and a metal intermediate plate 323 facing both the upper die 310 and the lower die 320. There is. The upper mold 310 is fixed to the lower surface of the upper platen 120, and the lower mold 320 is fixed to the upper surface of the lower platen 130. A heating unit (heater) 350 is provided in each of the upper mold 310 and the lower mold 320. Each of the upper mold 310 and the lower mold 320 is heated by the heating unit 350. The intermediate plate 323 is a frame-shaped member having a rectangular hole in a plan view formed in the center thereof, and sandwiches the release film 400 together with the lower mold 320. The molding die 300 will be described in detail later.

The film supply mechanism 500 is configured to supply a long release film 400 between the upper mold 310 (intermediate plate 323) and the lower mold 320. As the material of the release film 400, a resin material having characteristics such as heat resistance, releasability, flexibility and extensibility is used. For example, PTFE (polytetrafluoroethylene) and ETFE (ethylene / fluorinated ethylene) are used. Copolymer), PET (polyethylene terephthalate), FEP (ethylene tetrafluorinated / propylene hexafluorinated copolymer), polypropylene, polystyrene, polyvinylidene chloride and the like are used.

The film supply mechanism 500 includes a feeding mechanism 510, a winding mechanism 520, a feeding roller 530, and a winding roller 540.

The delivery mechanism 510 is configured to feed the release film 400 before use wound on a reel between the upper mold 310 (intermediate plate 323) and the lower mold 320. For example, the delivery mechanism 510 includes a delivery roll and a motor (not shown) for rotating the delivery roll. The winding mechanism 520 is configured to wind the used release film 400 used for resin molding on a reel. For example, the take-up mechanism 520 includes a take-up roll and a motor (not shown) for rotating the take-up roll. By controlling the torque of each motor, the release film 400 is sent out in the traveling direction. Further, when the release film 400 is delivered, the torque of each motor is controlled, so that an appropriate tension is applied in the traveling direction of the release film 400.

A delivery roller 530 for applying tension to the release film 400 is arranged between the delivery mechanism 510 and the molding die 300. That is, the delivery roller 530 is arranged on the delivery mechanism 510 side of the lower mold 320 on the transfer path of the release film 400. A take-up roller 540 for applying tension to the release film 400 is arranged between the mold 300 and the take-up mechanism 520. That is, the take-up roller 540 is arranged on the take-up mechanism 520 side of the lower mold 320 on the transport path of the release film 400. Each of the delivery roller 530 and the take-up roller 540 is configured to apply tension to the release film 400 and to convey the release film 400 between the upper mold 310 and the lower mold 320.

Each moving mechanism 600 holds the rotation axis of the sending roller 530 or the winding roller 540 in a state of being movable in the vertical direction. The moving mechanism 600 is configured to raise and lower the rotation shafts of the delivery roller 530 and the take-up roller 540. The moving mechanism 600 can physically separate the release film 400 from the lower mold 320 by, for example, raising the rotation axes of the delivery roller 530 and the take-up roller 540. The moving mechanism 600 is realized by, for example, a combination of a servomotor and a ball screw, an air cylinder, and the like.

The liquid resin supply mechanism 900 is a so-called dispenser, and is configured to discharge a thermosetting liquid resin onto the release film 400. The liquid resin supply mechanism 900 can discharge the liquid resin while moving in the plane direction (arrow XY direction) in the region between the upper mold 310 and the lower mold 320 (intermediate plate 323), and the upper mold 310 and the lower mold 310. It can be saved in an area other than the area between the mold 320 and the mold 320. For example, the liquid resin supply mechanism 900 retracts to a region other than between the upper mold 310 and the lower mold 320 after the liquid resin has been supplied onto the release film 400.

The control unit 700 is configured to control the entire resin molding apparatus 10. The control unit 700 controls, for example, the mold clamping mechanism 200, the film supply mechanism 500, the moving mechanism 600, the liquid resin supply mechanism 900, and the like. The control unit 700 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and the like, which are hardware processors, and is configured to execute information processing based on a program and various data. ing. The control unit 700 may be arranged at any place in the resin molding apparatus 10, or may be configured by a plurality of computers.

(1-2. Configuration of molding mold and suction mechanism)
FIG. 2 is a plan view of a part of the lower mold 320. FIG. 3 is a view including a cross section of the upper mold 310, the lower mold 320, and the intermediate plate 323. In FIG. 3, the cross section of a part of the lower mold 320 corresponds to the III-III cross section of FIG.

As shown in FIGS. 2 and 3, a cavity 326 is formed in the lower mold 320, and the lower mold 320 has a bottom surface member 321 forming the bottom surface of the cavity 326 and a side surface member forming the side surface of the cavity 326. 322 and is included. The bottom surface member 321 is a plate-shaped member having a rectangular shape in a plan view. The side surface member 322 is a frame-shaped member that covers the periphery of the bottom surface member 321. In the lower mold 320, the side surface member 322 is fixed via a mounting member 328 including an elastic member such as a spring. The side member 322 is located slightly above the bottom member 321 so as to form the cavity 326. A slight gap is formed between the bottom surface member 321 and the side surface member 322 so that the bottom surface member 321 and the peripheral surface member 322 can be relatively slidable.

The lower mold 320 further includes a lower seal fixing member 329 and a mounting rod 327. The upper surfaces of the mounting rod 327 and the lower seal fixing member 329 are in contact with the intermediate plate 323 while the release film 400 is sandwiched between the intermediate plate 323 and the lower mold 320. A through-passage 324 is formed in the lower seal fixing member 329. Each gangway 324 is connected to the vacuum pump 330 via a suction pipe 325. Since a gap is formed between the bottom surface member 321 and the side surface member 322 as described above, the release film 400 located on the lower mold 320 is moved onto the lower mold 320 by sucking air from the vacuum pump 330. Is adsorbed on. The configuration including each through-passage 324 and the vacuum pump 330 is an example of the "suction mechanism" of the present invention.

The upper die 310 is configured to mount, for example, a substrate 800 on which a plurality of chips 810 are arranged. The chip 810 is, for example, a semiconductor integrated circuit. The chip 810 may or may not be electrically connected to the substrate 800. The shape of the substrate 800 is, for example, a quadrangle or a circle. The substrate 800 is, for example, a semiconductor substrate (silicon wafer or the like), a metal substrate, a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate, and is FO-WLP (Fan Out Wafer Level Package) or FO-PLP (Fan Out Panel). It may include a carrier of a plate-shaped member used for Level Package). The upper mold 310 includes an upper seal fixing member 311. The upper seal fixing member 311 comes into contact with the intermediate plate 323 when the molding die 300 is compacted.

[2. Measures against curing of liquid resin]
In the resin molding apparatus 10 as described above, the release film 400 is temporarily adsorbed on the lower mold 320, and the liquid resin supply mechanism 900 discharges the thermosetting liquid resin onto the release film 400. And. In this case, since the heat of the lower mold 320 is easily transferred to the liquid resin supplied on the release film 400, the liquid resin may be cured earlier than an appropriate timing.

In particular, when the liquid resin discharged by the liquid resin supply mechanism 900 has a high viscosity, or when the area on the release film 400 on which the liquid resin should be discharged is large (for example, a square having a side of 300 mm or more or a diameter). It takes a long time to complete the supply of the liquid resin (circular shape of 300 mm or more). In such a case, it is more likely that the liquid resin will be cured earlier than the appropriate timing.

For example, as a means for solving such a problem, a liquid resin is supplied onto the release film 400 at a place other than the resin molding apparatus 10, and then the release film 400 to which the liquid resin is supplied is transferred to the lower mold 320. A method of placing it on the top is conceivable. However, according to such a method, for example, when the release film 400 is placed on the lower mold 320, wrinkles may occur in the release film 400. In particular, when the size of the release film 400 becomes large, it is difficult to arrange the release film 400 on the lower mold 320 without causing wrinkles.

Although the details will be described later, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 supplies the liquid resin onto the release film 400 with the release film 400 and the lower mold 320 separated from each other. Controls the liquid resin supply mechanism 900.

In the resin molding apparatus 10, since the liquid resin is supplied onto the release film 400 in a state where the release film 400 and the lower mold 320 are physically separated from each other, the heat of the lower mold 320 is generated on the release film 400. It is difficult to be transmitted to the liquid resin. Therefore, according to the resin molding apparatus 10, it is possible to suppress a situation in which the liquid resin is cured earlier than an appropriate timing.

[3. Manufacturing procedure for resin molded products]
FIG. 4 is a flowchart showing a manufacturing procedure of a resin molded product by the resin molding apparatus 10. The process shown in FIG. 4 is executed by the control unit 700 in a state where the release film 400 is set in the film supply mechanism 500 and the mold 300 is opened.

With reference to FIG. 4, the control unit 700 raises the delivery roller 530 and the take-up roller 540 to a predetermined position (for example, a position where the release film 400 contacts the lower surface of the intermediate plate 323). Control 600 (step S100). That is, the control unit 700 controls the moving mechanism 600 so that the release film 400 and the lower mold 320 are physically separated from each other.

When the movement of the delivery roller 530 and the take-up roller 540 is completed, the control unit 700 controls the film supply mechanism 500 so as to increase the tension applied to the release film 400 (step S110). More specifically, the control unit 700 fixes the rotation of the delivery roll in the delivery mechanism 510 and controls the torque of the take-up roll in the take-up mechanism 520 to increase the tension applied to the release film 400. .. Alternatively, the control unit 700 fixes the rotation of the take-up roll in the take-up mechanism 520 and controls the torque of the take-up roll in the take-out mechanism 510. As a result, it is possible to suppress the downward sagging of the release film 400 when the liquid resin is supplied onto the release film 400.

The control unit 700 controls the liquid resin supply mechanism 900 so that the release film 400 and the lower mold 320 are physically separated from each other and the liquid resin is supplied onto the release film 400 (step S120).

FIG. 5 is a diagram showing how the liquid resin supply mechanism 900 supplies the liquid resin onto the release film 400. As shown in FIG. 5, the liquid resin supply mechanism 900 is predetermined in the plane of the release film 400 with the release film 400 physically separated from both the bottom member 321 and the side surface member 322. Liquid resin 910 is supplied to the range.

When the supply of the liquid resin on the release film 400 is completed, the control unit 700 controls the liquid resin supply mechanism 900 so as to retract from between the upper mold 310 and the lower mold 320 (step S130). When the evacuation of the liquid resin supply mechanism 900 is completed, the control unit 700 controls the moving mechanism 600 so as to lower the delivery roller 530 and the take-up roller 540 to a predetermined position (step S140).

When the lowering of the delivery roller 530 and the take-up roller 540 is completed, in the control unit 700, the side member 322 comes into contact with the release film 400, and then the lower seal fixing member 329 passes through the release film 400 and the intermediate plate 323. The mold clamping mechanism 200 is controlled so as to raise the lower mold 320 to a position in contact with the mold (step S150). When the ascent of the lower mold 320 is completed, the control unit 700 controls the vacuum pump 330 and the like (adsorption mechanism) so as to attract the release film 400 to which the liquid resin is supplied onto the lower mold 320 (step S160).

After that, the control unit 700 lowers the bottom member 321 from the state where the side member 322 is in contact with the substrate 800 via the release film 400 after the viscosity of the liquid resin on the release film 400 is lowered. The mold clamping mechanism 200 is controlled so as to raise the mold 320 to perform mold clamping of the molding mold 300 (step S170). As a result, the resin molded product is completed. In the resin molding apparatus 10, the resin molded product is mass-produced by repeating the mold opening of the molding mold 300, the transfer of the release film 400, and the processes of steps S100 to S170.

[4. Effect, etc.]
As described above, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 supplies the liquid resin onto the release film 400 with the release film 400 and the lower mold 320 separated from each other. Controls the supply mechanism 900. In the resin molding apparatus 10, since the liquid resin is supplied onto the release film 400 in a state where the release film 400 and the lower mold 320 are physically separated from each other, the heat of the lower mold 320 is generated on the release film 400. It is difficult to be transmitted to the liquid resin. Therefore, according to the resin molding apparatus 10, it is possible to suppress a situation in which the liquid resin is cured earlier than an appropriate timing.

Further, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 increases the tension applied to the release film 400 before the liquid resin supply mechanism 900 supplies the liquid resin onto the release film 400. Controls the supply mechanism 500. As a result, it is possible to suppress the downward sagging of the release film 400 when the liquid resin is supplied onto the release film 400.

Further, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 uses a vacuum pump 330 or the like so as to attract the release film 400 onto the lower mold 320 after the liquid resin is supplied onto the release film 400. (Adsorption mechanism) is controlled. As a result, the displacement of the release film 400 on the lower mold 320 can be suppressed, and the resin molded product can be manufactured with higher accuracy.

[5. Other embodiments]
The idea of the above embodiment is not limited to the embodiment described above. Hereinafter, an example of another embodiment to which the idea of the above embodiment can be applied will be described.

In the above embodiment, the intermediate plate 323 is provided between the upper mold 310 and the lower mold 320, but the intermediate plate 323 is not always necessary.

Further, in the above embodiment, the resin molding apparatus 10 is a single apparatus. However, the resin molding apparatus 10 does not necessarily have to be a single apparatus, and may be a part of the apparatus in the apparatus having a plurality of functions.

The embodiments of the present invention have been exemplified above. That is, for illustrative purposes, detailed description and accompanying drawings have been disclosed. Therefore, some of the components described in the detailed description and the attached drawings may include components that are not essential for solving the problem. Therefore, just because those non-essential components are described in the detailed description and accompanying drawings should not be immediately determined to be essential.

Moreover, the above-described embodiment is merely an example of the present invention in all respects. The above-described embodiment can be improved or modified in various ways within the scope of the present invention. That is, in carrying out the present invention, a specific configuration can be appropriately adopted according to the embodiment.

10 Resin molding equipment, 100 base, 110 tie bar, 120 upper platen, 130 lower platen, 200 mold tightening mechanism, 300 molding mold, 310 upper mold, 311 upper seal fixing member, 320 lower mold, 321 bottom member, 322 side member, 323 Intermediate plate, 324 through-passage, 325 suction pipe, 326 cavity, 327 mounting rod, 328 mounting member, 329 lower seal fixing member, 330 vacuum pump, 350 heating part, 400 release film, 500 film supply mechanism, 510 Delivery mechanism, 520 take-up mechanism, 530 take-up roller, 540 take-up roller, 600 movement mechanism, 700 control unit, 800 board, 810 chips, 900 liquid resin supply mechanism, 910 liquid resin.

Claims (8)

A molding mold including an upper mold and a lower mold facing the upper mold,
A mold clamping mechanism for molding the molding mold and
A film supply mechanism that supplies a release film between the upper mold and the lower mold,
A liquid resin supply mechanism that supplies a thermosetting liquid resin onto the release film,
A resin molding apparatus including a control unit that controls the liquid resin supply mechanism so as to supply the liquid resin onto the release film in a state where the release film and the lower mold are separated from each other. The resin molding apparatus according to claim 1, further comprising a moving mechanism for moving the release film to a position away from the lower mold. The film supply mechanism
The delivery mechanism that sends out the release film and
A winding mechanism for winding the release film and
A delivery roller arranged on the delivery mechanism side of the lower mold on the transfer path of the release film, and a delivery roller.
Including a take-up roller arranged on the take-up mechanism side of the lower mold on the transfer path of the release film.
The resin molding apparatus according to claim 2, wherein the moving mechanism raises the sending roller and the winding roller. The control unit controls the film supply mechanism so as to increase the tension applied to the release film before the liquid resin supply mechanism supplies the liquid resin onto the release film, according to claim 1. Item 3. The resin molding apparatus according to any one of Items 3. Further provided with an adsorption mechanism for adsorbing the release film onto the lower mold,
Any of claims 1 to 4, wherein the control unit controls the adsorption mechanism so that the release film is adsorbed on the lower mold after the liquid resin is supplied onto the release film. The resin molding apparatus according to item 1. The step of supplying a release film between the upper mold and the lower mold,
A step of supplying a thermosetting liquid resin onto the release film with the release film and the lower mold separated from each other.
A step of adsorbing the release film to which the liquid resin is supplied onto the lower mold,
A method for producing a resin molded product, which comprises a step of molding the upper mold and the lower mold in a state where the release film is adsorbed. The method for producing a resin molded product according to claim 6, further comprising a step of moving the release film to a position away from the lower mold before supplying the liquid resin onto the release film. The method for producing a resin molded product according to claim 6 or 7, further comprising a step of increasing the tension applied to the release film before supplying the liquid resin onto the release film.