WO2022172518A1

WO2022172518A1 - Resin molding device and method for producing resin molded article

Info

Publication number: WO2022172518A1
Application number: PCT/JP2021/039635
Authority: WO
Inventors: 市橋秀男
Original assignee: Ｔｏｗａ株式会社
Priority date: 2021-02-10
Filing date: 2021-10-27
Publication date: 2022-08-18
Also published as: KR20230113606A; TW202231443A; JP7360407B2; TWI793941B; JP2022122674A; CN116829324A

Abstract

[Problem] To provide a resin molding device with a simple structure that allows easy exchange of release film and a method for producing a resin molded article. [Solution] The resin molding device 30 is equipped with a fixed frame 3A, a molding mold C, a movable platen 34, a mold clamping mechanism 35, and a film supply mechanism 1. The film supply mechanism 1 has a delivery mechanism 11 that is fixed to the fixed frame 3A and delivers a release film F, a recovery mechanism 12 that is fixed to the fixed frame 3A and recovers the release film F, and a pair of moving rollers 13a that are supported by the fixed frame 3A on the delivery mechanism 11 side and recovery mechanism 12 side in the transport path of the release film F and move in conjunction with displacement of the relative positions of the upper mold UM and lower mold LM.

Description

RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD

The present disclosure relates to a resin molding apparatus and a method of manufacturing a resin molded product.

A substrate with a chip connected to it is generally used as an electronic component by being sealed with resin. Conventionally, as a resin molding apparatus for resin-sealing a substrate, one having a film supply mechanism for supplying a release film between an upper mold and a lower mold is known (see, for example, Patent Document 1). .

The film supply mechanism described in Patent Document 1 includes a supply roll fixed to a movable platen that moves together with a lower mold, a collection roll fixed to a main body, and a buffer roller that moves in conjunction with the movement of the movable platen. ing. The release film supplied from the supply roll passes through the lower part of the main body from between the upper mold and the lower mold, and is arranged to surround the main body so as to be collected by the collection roll via the buffer roller.

JP 2009-178901 A

Since the film supply mechanism described in Patent Document 1 supplies the release film so as to surround the main body, the device configuration is complicated. In addition, since the supply roll is fixed to the movable platen and the collection roll is fixed to the main body, it is necessary to work inside the main body when exchanging the release film, which is inconvenient.

Therefore, there is a demand for a resin molding apparatus and a method for manufacturing a resin molded product that have a simple configuration and are easy to replace the release film.

The characteristic configuration of the resin molding apparatus according to the present disclosure includes a fixed frame, a molding die supported by the fixed frame and having an upper mold and a lower mold, and the upper mold and the lower mold supported by the fixed frame. a movable platen that displaces the relative position of the mold, a mold clamping mechanism that moves the movable platen to clamp the mold, and a film supply mechanism that supplies a release film between the upper mold and the lower mold. , wherein the film supply mechanism includes a delivery mechanism fixed to the fixed frame for delivering the release film, a recovery mechanism fixed to the fixed frame for recovering the release film, and and a pair of moving rollers supported by the fixed frame on the sending mechanism side and the collecting mechanism side in the conveying path and moving in conjunction with the displacement of the relative position.

The method for manufacturing a resin molded product using the resin molding apparatus is characterized by a film supply step of supplying the release film between the upper mold and the lower mold by the film supply mechanism, and a mold clamping mechanism. a mold clamping step in which the movable platen is moved to move the upper mold and the lower mold closer to each other, and the moving roller moves in conjunction with the closer movement; and a pre-molding substrate and a resin material are supplied to the mold. and a molding step of performing resin molding.

According to the present disclosure, it is possible to provide a resin molding apparatus and a method of manufacturing a resin molded product that have a simple configuration and facilitate replacement of the release film.

1] is a schematic diagram of a resin molding unit. [FIG. 1] is a schematic diagram showing a resin molding apparatus. [FIG. 4] is a schematic diagram showing a movement mechanism of a film feeding mechanism. [FIG. 1] is a schematic diagram showing a method for manufacturing a resin molded product. [FIG.

An embodiment of a resin molding apparatus and a method for manufacturing a resin molded product according to the present disclosure will be described below based on the drawings. However, without being limited to the following embodiments, various modifications are possible without departing from the scope of the invention.

A substrate (molding object) to which a semiconductor chip is connected is used as an electronic component by sealing with resin. A compression method (compression molding), a transfer method, and the like can be cited as techniques for resin-sealing an object to be molded. As one of the compression methods, after supplying liquid resin (resin material) to the release film, the release film is adsorbed to the lower mold of the mold, and the object to be molded is immersed in the liquid resin on the release film. A method of resin molding can be mentioned. As one of the transfer methods, the object to be molded is placed on the release film that is adsorbed to the lower mold of the mold, and a resin tablet (resin material) is supplied to the pot of the mold. A method of resin-molding an object to be molded by heating and melting the resin by heating and supplying the molten resin to the cavity can be mentioned.

Liquid resin includes not only resin that is liquid at normal temperature (room temperature), but also molten resin that is melted by heating and becomes liquid. The liquid resin that becomes liquid at room temperature may be either a thermoplastic resin or a thermosetting resin. A thermosetting resin is a liquid resin at room temperature, and when heated, its viscosity decreases, and when further heated, it polymerizes and hardens to become a hardened resin. As described below, it is desirable to use a thermosetting resin when resin-molding and sealing the pre-molding substrate to which the semiconductor chip is connected.

The powdery resin includes not only powdery resin but also resin tablets formed of solid resin obtained by pressing powdery resin. It becomes a molten resin. This powdery resin may be either a thermoplastic resin or a thermosetting resin. When the thermosetting resin is heated, its viscosity decreases, and when it is further heated, it polymerizes and hardens to become a cured resin. As described below, it is desirable to use a thermosetting resin when resin-molding and sealing the pre-molding substrate to which the semiconductor chip is connected.

[overall structure]
A transfer-type resin molding apparatus will be described below as an example. FIG. 1 shows a schematic diagram of a resin molding unit D equipped with a resin molding device 30 according to this embodiment. The resin molding unit D includes a molding module 3, a supply module 4, a controller 6, and a transport mechanism. The molding module 3 has a resin molding device 30 for resin-sealing an object to be molded. The control unit 6 includes at least a program stored in hardware such as an HDD or memory as software for controlling the operation of the resin molding apparatus 30, and includes a computer ASIC, FPGA, CPU, or a processor including other hardware. Executed by

The resin molding device 30 in this embodiment is a device for resin-molding the pre-molding substrate Sa to which the semiconductor chip is connected, and is incorporated in the molding module 3 . The molding module 3 may be a resin molding device, and the resin molding unit D may be a resin molding device, without any particular limitation.

The molding module 3 uses the resin molding device 30 to seal the pre-molding substrate Sa (molding object) with resin to mold the molded substrate Sb (resin molded product). A plurality of molding modules 3 (two in this embodiment) are provided, and each molding module 3 can be attached or detached independently. Details of the resin molding apparatus 30 will be described later.

The supply module 4 is for supplying the pre-molding substrate Sa and the resin tablet T to the molding module 3 and receiving the molded substrate Sb from the molding module 3. It includes a mechanism 45 and a substrate receiving portion 46 . A loader 41 and an unloader 42 included in the transport mechanism wait inside the supply module 4 . The substrate supply mechanism 43 delivers the stock pre-molded substrates Sa to the substrate alignment mechanism 44 . One semiconductor chip or a plurality of semiconductor chips are aligned vertically and/or horizontally and connected to the pre-molding substrate Sa. The substrate alignment mechanism 44 puts the pre-molding substrate Sa delivered from the substrate supply mechanism 43 into a state suitable for transportation. The resin supply mechanism 45 stocks the resin tablets T, and arranges the resin tablets T in a state suitable for transportation.

The transport mechanism includes a loader 41 that transports the pre-molding substrate Sa and the resin tablet T to which the semiconductor chip before resin sealing is connected, and an unloader 42 that transports the molded substrate Sb after resin sealing. The loader 41 receives the pre-molding substrate Sa from the substrate alignment mechanism 44, receives the resin tablet T from the resin supply mechanism 45, and moves from the supply module 4 to each molding module 3 on the rail. The substrate Sa before molding and the resin tablet T can be transferred. The unloader 42 can take out the molded substrates Sb from the molding modules 3 , move on the rails from each molding module 3 to the substrate storage section 46 , and store the molded substrates Sb in the substrate storage section 46 . In the molded substrate Sb, the semiconductor chip is sealed with a cured resin obtained by solidifying the molten resin.

[Details of resin molding equipment]
FIG. 2 shows a resin molding device 30 in this embodiment. The resin molding apparatus 30 includes a fixed frame 3A placed on a horizontal surface and fixed in an immovable state by gravity, a mold C supported by the fixed frame 3A, a movable platen 34 supported by the fixed frame 3A, and a movable platen 34. A mold clamping mechanism 35 for clamping the mold C by moving the platen 34 and a film supply mechanism 1 for supplying the release film F are provided. In addition, "supported by the fixed frame 3A" means a state in which the fixed frame 3A is supported directly or indirectly so as to be relatively movable with respect to the fixed frame 3A, and the same applies hereinafter.

The stationary frame 3A includes a lower stationary platen 31 and an upper stationary platen 33 which are rectangular in plan view and are connected by a plurality of tie bars (not shown) or plate members (not shown). there is A movable platen 34 having a rectangular shape in plan view is provided between the lower stationary platen 31 and the upper stationary platen 33 . The mold C has an upper mold UM and a lower mold LM. The upper mold UM and the lower mold LM are composed of molds and the like arranged to face each other. A heater (not shown) is built in the upper mold UM and the lower mold LM, and the substrate and the resin tablet supplied to the molding die C can be heated by the heater. In addition, the lower mold LM is provided with an adsorption mechanism (not shown) for adsorbing the release film F to the mold surface by means of a vacuum pump or the like.

The movable platen 34 can move up and down along the tie bars or plate members of the fixed frame 3A, and moves the lower die LM up and down so as to displace the relative positions of the lower die LM and the upper die UM. A mold clamping mechanism 35 for moving the movable platen 34 up and down is provided on the lower stationary platen 31 . The mold clamping mechanism 35 is composed of, for example, a combination of a servomotor and a ball screw, a combination of a hydraulic cylinder and a link mechanism, or the like. The mold clamping mechanism 35 can clamp the mold C by moving the movable platen 34 upward, and can open the mold C by moving the movable platen 34 downward.

The film supply mechanism 1 supplies the release film F between the upper mold UM and the lower mold LM. As a material for the release film F, a resin material having properties such as heat resistance, release properties, flexibility, and extensibility is used. copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene/hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, and the like.

The film supply mechanism 1 includes a delivery mechanism 11 that delivers the release film F, a recovery mechanism 12 that recovers the release film F, and a delivery mechanism 11 side in the transfer path of the release film F (the mold C and the delivery mechanism 11). ) and a pair of moving

mechanisms

13, 13 disposed on the recovery mechanism 12 side (between the molding die C and the recovery mechanism 12).

The delivery mechanism 11 can deliver the release film F before use between the upper mold UM and the lower mold LM, and is fixed to the stationary frame 3A. The delivery mechanism 11 in the present embodiment includes a delivery roll 11a for delivering the release film F before use wound on a reel, and a motor (not shown) for rotationally driving the delivery roll 11a. It is housed in an openable and closable case 11b. The delivery mechanism 11 including the case 11b is fixed to the side of the fixed frame 3A outside the fixed frame 3A. Note that "fixed to the fixed frame 3A" means a state of being directly or indirectly supported by the fixed frame 3A so as not to move relative to the fixed frame 3A, and the same applies hereinafter. .

The recovery mechanism 12 can recover the used release film F used for resin molding, and is fixed to the fixed frame 3A. The recovery mechanism 12 in this embodiment includes a recovery roll 12a that winds and recovers the used release film F on a reel, and a motor (not shown) that rotates the recovery roll 12a. are housed in an openable and closable case 12b. The recovery mechanism 12 including the case 12b is fixed outside the fixed frame 3A on the side of the fixed frame 3A opposite to the delivery mechanism 11. As shown in FIG. The control unit 6 controls the torque of each motor in the delivery mechanism 11 and the recovery mechanism 12, so that the release film F is delivered in the advancing direction (direction from the delivery mechanism 11 to the recovery mechanism 12). Also, when the release film F is sent out, an appropriate tension is applied to the release film F by controlling the torque of each motor.

A plurality of (four in this embodiment) feeding rollers 14a to 14d for applying tension Fa to the release film F are rotatably fixed to the fixed frame 3A between the feeding mechanism 11 and the mold C. ing. The plurality of delivery rollers 14a to 14d includes a first delivery roller 14a and a second delivery roller 14b arranged in order from the delivery mechanism 11 side between the delivery mechanism 11 and the moving mechanism 13, the moving mechanism 13, and the mold C. An upper third delivery roller 14c and a lower fourth delivery roller 14d disposed between. A pair of

delivery rollers

14c and 14d located closest to the mold C sandwich the release film F and guide the release film F so as to be parallel to the mold surface of the mold C. As shown in FIG.

A plurality of (four in this embodiment) recovery rollers 15a to 15d for applying tension Fb to the release film F are rotatably fixed to the fixed frame 3A between the recovery mechanism 12 and the mold C. ing. A plurality of recovery rollers 15a to 15d are arranged between the moving mechanism 13 and the molding die C, a first upper recovery roller 15a and a second lower recovery roller 15b, and between the moving mechanism 13 and the recovery mechanism 12. and a third collection roller 15c and a fourth collection roller 15d arranged in order from the moving mechanism 13 side. A pair of

recovery rollers

15a and 15b positioned closest to the mold C sandwich the release film F and guide the release film F so as to be parallel to the surface of the mold C. As shown in FIG.

The moving mechanism 13 has a moving roller 13a that applies tension to the release film F by moving in conjunction with the displacement of the relative positions of the upper die UM and the lower die LM. The moving roller 13a is supported by the stationary frame 3A. In this embodiment, since the sending mechanism 11, the collecting mechanism 12, the sending rollers 14a to 14d, and the collecting rollers 15a to 15d are fixed to the fixed frame 3A, the moving roller 13a moves in conjunction with the vertical movement of the lower die LM. moves up and down, tension can be applied to the release film F appropriately. Details of the moving mechanism 13 will be described later.

The film supply mechanism 1 in this embodiment further has a nip roll 16 that presses and holds the release film F. The nip roll 16 is rotatably fixed to the fixed frame 3A on the recovery mechanism 12 side (between the moving mechanism 13 on the recovery mechanism 12 side and the recovery mechanism 12) in the transport path of the release film F. The nip roll 16 includes a conveying roller 16a that is rotated by a driving force of a motor (not shown) to adjust the conveying speed V of the release film F, and a pressure roller 16b that presses the release film F toward the conveying roller 16a. contains. The surfaces of the conveying roller 16a and the pressing roller 16b are covered with rubber, resin, or the like having a high coefficient of friction in order to hold the release film F thereon.

The operation of the film supply mechanism 1 is controlled by the controller 6. The control unit 6 controls the delivery roll 11a of the delivery mechanism 11 to apply a rotational torque Ta in a direction opposite to the traveling direction of the release film F, thereby applying an appropriate tension Fa to the release film F. do. Further, the control unit 6 applies an appropriate tension Fb to the release film F by controlling the recovery roll 12a of the recovery mechanism 12 to apply a rotational torque Tb in the traveling direction of the release film F. Further, the controller 6 can control the transport speed V of the release film F by controlling the rotation speed Nc of the transport roller 16 a of the nip roll 16 . When the release film F is supplied, the rotational torque of the conveying roller 16a is made larger than the rotational torque Ta of the delivery roll 11a, and the delivery roll 11a and the collection roll 12a are rotated in the traveling direction of the release film F.

The tension Fa applied to the release film F from the delivery roll 11a to the transport roller 16a is obtained by dividing the rotational torque Ta of the delivery roll 11a by the radius (Da/2) of the delivery roll 11a, and the above equation (1) is It is calculated as shown in the formula. Further, the tension Fb applied to the release film F from the conveying roller 16a to the collection roll 12a can be obtained by dividing the rotational torque Tb of the collection roll 12a by the radius (Db/2) of the collection roll 12a, as shown in Equation (1). is calculated according to the following formula. The radius of the delivery roll 11a and the radius of the recovery roll 12a change depending on the amount of release film F sent out and the amount of winding. In the case of the delivery mechanism 11 or recovery mechanism 12 whose radius does not change depending on the delivery amount or the winding amount of the release film F, as shown in Equation (1), the rotational torque Ta of the delivery mechanism 11 or the rotation torque Ta of the recovery mechanism 12 is The tensions Fa and Fb applied to the release film F can be controlled based on the rotational torque Tb.

The transport speed V of the release film F is calculated as shown in Equation (2) by multiplying the rotation speed Nc of the transport roller 16a (nip roll 16) by the peripheral length (diameter Dc×π) of the transport roller 16a. .

The changing diameter Da of the delivery roll 11a or the diameter Db of the recovery roll 12a can be obtained by dividing the transport speed V of the release film F by the rotation speed Na of the delivery roll 11a or the rotation speed Nb of the recovery roll 12a. 3) is calculated as follows.

The rotational torque Ta of the delivery roll 11a or the rotational torque Tb of the recovery roll 12a can be converted from the voltage value applied to the motor, etc., and the diameter Dc of the conveying roller 16a remains unchanged. That is, the tension Fa of the release film F can be calculated as the upper formula of the formula (4) by measuring the rotation speed Nc of the nip roll 16 and the rotation speed Na of the delivery roll 11a by a sensor (not shown). be able to. Further, the tension Fb of the release film F is calculated by the following formula of the formula (4) by measuring the rotational speed Nc of the nip roll 16 and the rotational speed Nb of the collection roll 12a by a sensor (not shown). be able to. Note that the tensions Fa and Fb of the release film F may be calculated using predetermined coefficients in consideration of friction loss and mechanical loss.

Therefore, the control unit 6 in the present embodiment adjusts the tension Fa and Fb applied to the release film F based on the rotational speed Nc of the nip roll 16 and the rotational speed Na of the delivery roll 11a or the rotational speed Nb of the collection roll 12a. can be controlled. That is, the control unit 6 adjusts the torque of the motor that rotates at least one of the delivery roll 11a, recovery roll 12a, and transport roller 16a so that the tensions Fa and Fb applied to the release film F are within appropriate ranges. Control. As a result, the release film F can be prevented from being deformed or damaged.

As shown in FIGS. 2 and 3, the moving mechanisms 13 provided on the sending mechanism 11 side and the collecting mechanism 12 side respectively hold the moving roller 13a, the spring 13b that presses the moving roller 13a, and the moving roller 13a. and a support frame 13d for supporting the moving roller 13a, the spring 13b and the holding plate 13c.

The pair of moving

rollers

13a, 13a are fixed to a holding plate 13c on the sending mechanism 11 side and the collecting mechanism 12 side in the transport path of the release film F, and are supported by the fixed frame 3A via the support frame 13d. there is The moving roller 13a can move up and down in conjunction with the relative movement (vertical movement) of the lower mold LM with respect to the upper mold UM by the mold clamping mechanism 35 .

The spring 13b is composed of a compression spring or the like, and presses the moving roller 13a via the holding plate 13c in the direction of applying tension to the release film F (downward). The pressing force of the spring 13b is greater than the tension Fa applied to the release film F, and the force with which the delivery mechanism 11 and the recovery mechanism 12 hold the release film F (the force applied to the delivery roll 11a and the recovery roll 12a in the (value obtained by dividing the applied rotational torque by the radius). As a result, when the lower mold LM moves up and down, the spring 13b can expand and contract against the tension Fa of the release film F while the release film F is held by the delivery mechanism 11 and the recovery mechanism 12. can.

The holding plate 13c rotatably holds the moving roller 13a and is supported by the support frame 13d. The support frame 13d is fixed to the fixed frame 3A, and is formed by connecting the four corners of the upper plate 13d1 and the lower plate 13d2 with a plurality (four in this embodiment) of rod-shaped members 13d3. The holding plate 13c is provided with a hole through which the rod-shaped member 13d3 passes, and can move up and down along the rod-shaped member 13d3. The spring 13b is arranged outside the rod-like member 13d3, and has one end in contact with the lower surface of the upper plate 13d1 and the other end in contact with the upper surface of the holding plate 13c.

[Method for manufacturing resin molded product]
A method for manufacturing a resin molded product will be described with reference to FIGS. 1 and 4. FIG. A method of manufacturing a resin molded product (molded substrate Sb) includes a film supply step of supplying a release film F between an upper mold UM and a lower mold LM by a film supply mechanism 1, and a movable platen 34 by a mold clamping mechanism 35. is moved to move the upper mold UM and the lower mold LM closer to each other, and the moving roller 13a moves in conjunction with the moving rollers 13a. and a molding step of supplying a resin obtained by melting the resin) and performing resin molding. In this molding process, the resin molding apparatus 30 resin-moldes the pre-molded substrate Sa during the period from the loading of the pre-molded substrate Sa into the molding module 3 to the unloading of the molded substrate Sb from the molding module 3. The molding process includes a mold clamping process.

As shown in FIG. 1, the loader 41 is heated in advance while the housing space for the resin tablet T is insulated, and the molding die C is also heated. Then, the pre-molded substrate Sa taken out from the substrate supply mechanism 43 is placed on the loader 41 . Also, the resin tablets T aligned by the resin supply mechanism 45 are stored in the resin tablet T storage space of the loader 41 . Then, the loader 41 conveys the pre-molding substrate Sa and the resin tablet T to the molding module 3, and stores the resin tablet T in the pot of the lower mold LM. By housing the resin tablet T in the pot, the heater incorporated in the lower mold LM heats the resin tablet T to become a molten resin.

In addition, the film supply mechanism 1 supplies the release film F before use between the upper mold UM and the lower mold LM (FIG. 4(a), film supply process). At this time, the control unit 6 controls the tensions Fa and Fb applied to the release film F based on the rotational speed Nc of the nip roll 16 and the rotational speed Na of the delivery roll 11a or the rotational speed Nb of the collection roll 12a. Also good.

After supplying the release film F before use, the control unit 6 controls the transport speed of the transport roller 16a (stops the rotation of the transport roller 16a), stops transporting the release film F, and releases the release film F. The tensions Fa and Fb applied to the film F are maintained. Next, the movable platen 34 is moved upward by the mold clamping mechanism 35 to move the lower mold LM toward the upper mold UM, and the release film F before use is brought into close contact with the lower mold LM (FIG. 4(b)). . At this time, the spring 13b is slightly contracted against the tension Fa of the release film F. Then, the release film F is adsorbed to the mold surface of the lower mold LM by the adsorption mechanism, and the pre-molding substrate Sa is supplied onto the release film F. As shown in FIG. The amount of movement of the lower mold LM when the release film F before use is brought into close contact with the lower mold LM is sufficient if there is a space between the upper mold UM and the lower mold LM that can supply the pre-molding substrate Sa. preset.

Next, the mold clamping mechanism 35 moves the movable platen 34 further upward to move the upper mold UM and the lower mold LM closer to each other, thereby clamping the mold C (FIG. 4(c), mold clamping process). At this time, in a state where the release film F is held by the delivery mechanism 11 and the recovery mechanism 12, the spring 13b resists the tension Fa of the release film F, and the state shown in FIG. By reducing the size to the state, the pair of moving

rollers

13a, 13a moves upward, and the tension Fa applied to the release film F becomes appropriate. In the present embodiment, the pressing force of the spring 13b is set larger than the tension Fa applied to the release film F and smaller than the force with which the release film F is held by the delivery mechanism 11 and the recovery mechanism 12. A moderate force can be applied to the tension applied to the release film F without providing a complicated control mechanism. As a result, there is no problem that the mold release film F is deformed, the molding accuracy is lowered, or the transport line of the release film F is shifted. Further, when the release film F moves between the pair of

delivery rollers

14c and 14d and the pair of

recovery rollers

15a and 15b due to mold clamping operation or the like, the pair of moving

rollers

13a and 13a moves in conjunction with each other. To absorb the variation in the length of the release film F. As a result, the release film F hardly moves between the delivery roll 11a side of the second delivery roller 14b and the recovery roll 12a side of the transport roller 16a. Therefore, there is no problem that the transfer line of the release film F is shifted.

Next, the pre-molding substrate Sa is resin-molded by causing the melted resin of the resin tablet T accommodated in the lower mold LM to flow through the cavity MC by an extrusion mechanism (not shown) to manufacture the molded substrate Sb (Fig. 4(c), molding step). After resin molding, the movable platen 34 is moved downward to open the mold C. As shown in FIG. At this time, the spring 13b extends against the tension Fa of the release film F, so that the pair of moving

rollers

13a, 13a moves downward, and the tension Fa applied to the release film F is moderate. becomes. Then, the molded substrate Sb is released from the cavity MC and accommodated in the substrate accommodating portion 46 by the unloader 42 (see also FIG. 1).

By the time the next pre-molding substrate Sa is supplied to the lower mold LM, the used release film F is removed from the mold C by driving the transport roller 16a, and the release film F before use is removed. A film supply step is performed to supply the film to the mold C, and this film supply step, the mold clamping step and the molding step described above are repeatedly performed. When the release film F runs short on the delivery roll 11a of the delivery mechanism 11, or when the recovery roll 12a of the recovery mechanism 12 can no longer take up the release film F, the

cases

11b and 12b are removed. It is opened to replace the delivery roll 11a or the collection roll 12a (see also FIG. 2).

In this embodiment, since the feeding mechanism 11 and the collecting mechanism 12 are fixed to both sides of the fixed frame 3A, it is possible to replace the release film F outside the fixed frame 3A. Easy to replace F. Further, by providing the delivery mechanism 11 and the recovery mechanism 12 outside the fixed frame 3A, it is easy to secure the installation space for the delivery mechanism 11 and the recovery mechanism 12. Therefore, according to the required amount of the release film F, the delivery mechanism 11 And the size of the recovery mechanism 12 can be changed, which is highly convenient.

[Other embodiments]
Hereinafter, members similar to those of the above-described embodiment will be described using the same terms and symbols for easy understanding.

<1> In the above-described embodiment, the release film F is attached to the lower mold LM. F may be adsorbed.

<2> In the above-described embodiment, the sending mechanism 11 and the collecting mechanism 12 are fixed on both sides of the fixed frame 3A, but the sending mechanism 11 and the collecting mechanism 12 may be fixed inside the fixed frame 3A.

<3> In the above-described embodiment, the moving roller 13a is pressed by the spring 13b, but the moving roller 13a may be pressed by the fluid supplied to the cylinder. When a cylinder is used, the pressing force against the moving roller 13a may be changed in conjunction with the relative movement of the lower die LM and the upper die UM.

<4> In the above-described embodiment, in addition to the pair of moving

rollers

13a, 13a provided on the sending mechanism 11 side and the collecting mechanism 12 side, a moving roller 13a may be further provided.

<5> The delivery mechanism 11 in the above-described embodiment may have any structure as long as it is a mechanism capable of delivering the release film F. Similarly, the recovery mechanism 12 in the above-described embodiment may have any structure as long as it is a mechanism capable of recovering the release film F. In other words, even if the release film F moves between the pair of

delivery rollers

14c and 14d and the pair of

recovery rollers

15a and 15b due to a mold clamping operation or the like, it is recovered from the delivery side of the second delivery roller 14b and the transport roller 16a. A mechanism may be provided to hold the release film F and apply an appropriate tension so that the release film F does not move on the side.

<6> The nip roll 16 in the above-described embodiment may be omitted, the nip roll 16 may be provided on the delivery mechanism 11 side of the mold C, or the delivery mechanism 11 side or the recovery mechanism 12 may be provided on the delivery mechanism 11 side of the mold C. A plurality of nip rolls 16 may be provided on each side.

<7> In the above-described embodiment, the transfer-type resin molding apparatus 30 has been described, but the compression-type resin molding apparatus 30 can also be applied. Substrates resin-molded by the resin molding apparatus 30 are, for example, semiconductor substrates (silicon wafers, etc.), metal substrates (lead frames, etc.), glass substrates, ceramic substrates, resin substrates, or wiring substrates.

[Outline of the above embodiment]
An outline of the resin molding apparatus 30 and the method of manufacturing a resin molded product described in the above embodiment will be described below.

(1) The characteristic configuration of the resin molding apparatus 30 includes: a fixed frame 3A; a forming die C supported by the fixed frame 3A and having an upper die UM and a lower die LM; A movable platen 34 for displacing the relative position with the lower mold LM, a mold clamping mechanism 35 for clamping the mold C by moving the movable platen 34, and a release film F between the upper mold UM and the lower mold LM. The film supply mechanism 1 is fixed to the fixed frame 3A and feeds out the release film F, and the fixed frame 3A is fixed to collect the release film F. A collection mechanism 12 and a pair supported by a fixed frame 3A on the delivery mechanism 11 side and the collection mechanism 12 side in the transport path of the release film F and moving in conjunction with displacement of the relative positions of the upper mold UM and the lower mold LM. and a moving roller 13a.

In this configuration, both the delivery mechanism 11 for delivering the release film F and the recovery mechanism 12 for recovering the release film F are fixed to the fixed frame 3A, so that the delivery mechanism 11 and the recovery mechanism 12 have a high degree of freedom in arrangement. , the release film F can be arranged to be easily replaced. On the other hand, since the delivery mechanism 11 and the recovery mechanism 12 are configured not to move in conjunction with the movable platen 34, the release film F is easily deformed by being pulled when the mold clamping mechanism 35 is operated. Therefore, in this configuration, a pair of moving rollers 13a that move in conjunction with the displacement of the relative positions of the upper die UM and the lower die LM are provided on the sending mechanism 11 side and the collecting mechanism 12 side. At the time of operation of 35, the tension Fa of the release film F is moderated by the moving roller 13a. In this way, deformation of the release film F is prevented by a simple configuration in which the delivery mechanism 11 and the recovery mechanism 12 are fixed to the fixed frame 3A and a pair of moving rollers 13a are provided on the delivery mechanism 11 side and the recovery mechanism 12 side. However, it is possible to provide the resin molding apparatus 30 in which the release film F can be easily replaced.

(2) The delivery mechanism 11 and the recovery mechanism 12 may be fixed to both sides of the fixed frame 3A.

In this way, if the sending mechanism 11 and the collecting mechanism 12 are fixed to both sides of the fixed frame 3A, it is possible to replace the release film F outside the fixed frame 3A. becomes easier to replace. Further, by providing the delivery mechanism 11 and the recovery mechanism 12 outside the fixed frame 3A, it is easy to secure the installation space for the delivery mechanism 11 and the recovery mechanism 12. Therefore, according to the required amount of the release film F, the delivery mechanism 11 And the size of the recovery mechanism 12 can be changed, which is highly convenient.

(3) The moving roller 13a may be pressed in a direction in which tension is applied to the release film F by a spring 13b.

Thus, if the moving roller 13a is pressed by the spring 13b, the tension Fa applied to the release film F can be moderated without providing a complicated control mechanism.

(4) The pressing force of the spring 13b may be set larger than the tension Fa applied to the release film F and smaller than the force with which the recovery mechanism 12 holds the release film F.

If the pressing force of the spring 13b is set in this manner, the tension Fa of the release film F is appropriately applied by the moving roller 13a while the release film F is held by the recovery mechanism 12 when the mold clamping mechanism 35 is operated. can be

(5) The film supply mechanism 1 may further include a nip roll 16 that is fixed to the fixed frame 3A on the recovery mechanism 12 side of the release film F transport path and presses and holds the release film F.

By providing the nip rolls 16 in this manner, the release film F can be transported smoothly.

(6) A control unit 6 for controlling the operation of the film supply mechanism 1 is further provided, and the control unit 6 controls the rotational speed Nc of the nip roll 16 and the rotational speeds Na, Nb of at least one of the delivery mechanism 11 and the collection mechanism 12. The tensions Fa and Fb applied to the release film F may be controlled based on.

By controlling in this way, the release film F can be prevented from being deformed or damaged.

(7) A feature of the method for manufacturing a resin molded product (molded substrate Sb) using the resin molding apparatus 30 described in any one of (1) to (6) above is that the upper mold UM and the lower mold LM are separated by the film supply mechanism 1. and a mold clamping mechanism 35 to move the movable platen 34 to move the upper die UM and the lower die LM closer to each other, and the moving roller 13a interlocks with the approaching movement. and a molding step of supplying the pre-molding substrate Sa and the resin material (resin obtained by melting the resin tablet T) to the molding die C to perform resin molding.

In this method, when the mold clamping mechanism 35 is actuated, an appropriate force is added to the tension of the release film F by the moving roller 13a that moves in conjunction with the approaching movement of the upper mold UM and the lower mold LM. As a result, deformation of the release film F is prevented, and proper resin molding can be achieved.

It should be noted that the configurations disclosed in the above-described embodiments (including other embodiments; the same shall apply hereinafter) can be applied in combination with the configurations disclosed in other embodiments as long as there is no contradiction. In addition, the embodiments disclosed in this specification are exemplifications, and the embodiments of the present disclosure are not limited thereto, and can be modified as appropriate without departing from the scope of the present disclosure.

The present disclosure can be used for a resin molding apparatus and a method for manufacturing a resin molded product.

Reference Signs List 1: Film supply mechanism 3A: Fixed frame 6: Control unit 11: Sending mechanism 12: Recovery mechanism 13a: Moving roller 13b: Spring 16: Nip roll 30: Resin molding device 34: Movable platen 35: Mold clamping mechanism C: Mold F : Release film Fa : Tension LM : Lower mold Na : Rotational speed of feeding mechanism Nb : Rotational speed of collection mechanism Nc : Rotational speed of nip roll Sa : Substrate before molding Sb : Molded substrate (resin molded product)
T: resin tablet (resin material)
UM: upper die

Claims

a fixed frame;
a mold supported by the fixed frame and having an upper mold and a lower mold;
a movable platen that is supported by the fixed frame and displaces the relative position of the upper mold and the lower mold;
a mold clamping mechanism that moves the movable platen to clamp the mold;
A film supply mechanism that supplies a release film between the upper mold and the lower mold,
The film supply mechanism is
a delivery mechanism that is fixed to the fixed frame and delivers the release film;
a collection mechanism that is fixed to the fixed frame and collects the release film;
a pair of moving rollers that are supported by the fixed frame on the sending mechanism side and the collecting mechanism side in the release film conveying path and move in conjunction with displacement of the relative position.
The resin molding apparatus according to claim 1, wherein the delivery mechanism and the recovery mechanism are fixed to both sides of the fixed frame.
The resin molding apparatus according to claim 1 or 2, wherein the moving roller is pressed by a spring in a direction in which tension is applied to the release film.
The resin molding apparatus according to claim 3, wherein the pressing force of the spring is set larger than the tension applied to the release film and smaller than the force with which the recovery mechanism holds the release film.
5. The film supply mechanism according to any one of claims 1 to 4, further comprising a nip roll that is fixed to the fixed frame on the recovery mechanism side of the release film transport path and presses and holds the release film. The resin molding apparatus according to 1.
Further comprising a control unit for controlling the operation of the film supply mechanism,
The resin molding according to claim 5, wherein the control unit controls the tension applied to the release film based on the rotation speed of the nip roll and the rotation speed of at least one of the delivery mechanism and the recovery mechanism. Device.
A method for manufacturing a resin molded product using the resin molding apparatus according to any one of claims 1 to 6,
a film supply step of supplying the release film between the upper mold and the lower mold by the film supply mechanism;
a mold clamping step in which the movable platen is moved by the mold clamping mechanism to move the upper mold and the lower mold closer to each other, and the moving roller moves in conjunction with the closer movement;
and a molding step of supplying a pre-molding substrate and a resin material to the molding die to perform resin molding.