JP6400446B2 - Method for manufacturing plate-like member with protruding electrode, plate-like member with protruding electrode, method for manufacturing electronic component, and electronic component - Google Patents

Description

  The present invention relates to a method for manufacturing a plate-like member with a protruding electrode, a plate-like member with a protruding electrode, a method for manufacturing an electronic component, and an electronic component.

  Electronic parts such as ICs and semiconductor chips (hereinafter sometimes simply referred to as “chips”) are often used after being resin-sealed.

  An electronic component in which the chip is sealed with a resin (also referred to as a finished product, a package, or the like; hereinafter simply referred to as an “electronic component”) is formed by embedding a via electrode in a resin. Sometimes. The via electrode is formed, for example, by forming a via-forming hole or groove (hereinafter referred to as “via-forming hole”) in the resin of the electronic component from the top surface of the package, and the via-forming hole is used as the via-electrode forming material. (For example, it can be formed by filling with plating, shield material, solder ball, etc.). The via formation hole can be formed, for example, by irradiating the resin with laser light from the top of the electronic component (package). Further, as another method for forming a via electrode, there has been proposed a method of removing a portion other than the protrusion of the metal structure after sealing the protrusion of the metal structure having the protrusion together with a semiconductor chip. (Patent Document 1). In this case, in the electronic component, only the protrusions in the metal structure remain in a resin-sealed state, which becomes a via electrode.

  On the other hand, the electronic component together with a plate-like member such as a heat radiating plate (heat sink) for releasing and cooling the heat generated by the chip or a shield plate (shielding plate) for shielding electromagnetic waves generated by the chip There are cases where it is molded (for example, Patent Documents 2 and 3).

JP 2012-015216 A JP 2013-187340 A JP 2007-287937 A

The method for forming the via formation hole in the resin has the following problems (1) to (5), for example.

(1) Due to variations in the thickness of electronic components (packages), the depth of via formation holes may not be formed properly and properly on the wiring pattern of the substrate.
(2) The filler contained in the resin material tends to remain on the wiring pattern of the substrate.
(3) Depending on the conditions for forming the via formation hole in the resin, the wiring pattern on the substrate on which the chip is mounted may be damaged.
(4) In relation to (3) above, if the resin material has a different filler density, it is necessary to change the laser processing conditions for making a via-forming hole in the resin. That is, the control of the formation conditions of the via formation hole is complicated.
(5) Due to the effects of the above (1) to (4), the yield of package manufacturing is difficult to improve.

  On the other hand, the method of Patent Document 1 requires a step of removing portions other than the protrusions of the metal structure after resin-sealing the protrusions of the metal structure. Therefore, the manufacturing process of the electronic component (package) is complicated, and material is wasted.

  Furthermore, in any of the above methods, in order to form a plate-like member, it must be formed by plating after forming the via electrode, and the process is complicated.

  Patent Documents 2 and 3 describe an electronic component having a plate-like member and a manufacturing method thereof, but do not describe a method that can solve the problems of the above methods in forming a via electrode.

  Thus, there is no technology that can easily and efficiently manufacture an electronic component having both via electrodes and plate-like members.

  Therefore, the present invention provides a method for producing a plate-like member with a protruding electrode, a method for producing a plate-like member with a protruding electrode, a method for producing an electronic component, which can easily and efficiently produce an electronic component having both a via electrode and a plate-like member, and The purpose is to provide electronic components.

In order to achieve the above object, the method for producing a plate-like member with protruding electrodes according to the present invention comprises:
A method for producing a member for an electronic component in which a chip is resin-sealed,
The member is a plate-like member with a protruding electrode in which a protruding electrode is fixed on one side of the plate-shaped member,
It includes a molding step of simultaneously molding the plate member and the protruding electrode by molding using a molding die.

  The plate-like member with protruding electrodes of the present invention is a plate-shaped member with protruding electrodes manufactured by the method for manufacturing the plate-shaped member with protruding electrodes of the present invention.

The method for manufacturing an electronic component of the present invention includes:
A method for manufacturing an electronic component in which a chip is resin-sealed,
The electronic component to be manufactured is an electronic component including a substrate, a chip, a resin, a plate-like member, and a protruding electrode, and a wiring pattern is formed on the substrate,
The manufacturing method includes a resin sealing step of sealing the chip with the resin,
In the resin sealing step, the chip is sealed with the resin between the protruding electrode fixing surface and the wiring pattern forming surface of the substrate in the plate-like member with the protruding electrode of the present invention, The protruding electrode is brought into contact with the wiring pattern.

The electronic component of the present invention is
An electronic component in which a chip is sealed with resin,
The electronic component includes a substrate, a chip, a resin, and a plate-like member with a protruding electrode of the present invention,
The chip is disposed on the substrate and sealed with the resin,
A wiring pattern is formed on the substrate on the chip placement side,
The protruding electrode may be in contact with the wiring pattern through the resin.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the plate-shaped member with a projection electrode which can manufacture easily and efficiently the electronic component which has both a via electrode (projection electrode) and a plate-shaped member, the plate-shaped member with a projection electrode, and an electronic component A manufacturing method and an electronic component can be provided.

FIG. 1 is a perspective view showing an example of the structure of a plate-like member with protruding electrodes according to the present invention. FIG. 2 is a perspective view illustrating the structure of the protruding electrode in the plate-like member with the protruding electrode of the present invention. FIG. 3 is a perspective view showing another example of the structure of the protruding electrode in the plate member with the protruding electrode of the present invention. FIG. 4 is a perspective view showing still another example of the structure of the protruding electrode in the plate-like member with the protruding electrode of the present invention. FIG. 5 is a process cross-sectional view illustrating an example of a method for producing a plate-like member with protruding electrodes by electroforming. FIG. 6 is a cross-sectional view showing another example of a method for producing a plate-like member with protruding electrodes by electroforming. FIG. 7 is a cross-sectional view showing still another example of a method for producing a plate-like member with protruding electrodes by electroforming. FIG. 8 is a cross-sectional view showing still another example of a method for producing a plate-like member with protruding electrodes by electroforming. FIG. 9 is a process cross-sectional view showing still another example of a method for producing a plate-like member with protruding electrodes by electroforming. FIG. 10a is a process cross-sectional view illustrating an example of a method for producing a plate-like member with protruding electrodes by compression molding. 10b is a process cross-sectional view illustrating a process continued from FIG. 10a. FIG. 11 is a process cross-sectional view illustrating an example of a method for producing a plate-like member with protruding electrodes by transfer molding. FIG. 12 is a process cross-sectional view schematically showing an example of the structure of the electronic component of the present invention and the manufacturing process thereof. FIG. 13 is a cross-sectional view illustrating a method for manufacturing an electronic component of the present invention using transfer molding. FIG. 14 is a cross-sectional view illustrating an example of one step in the method for manufacturing an electronic component of the present invention using compression molding. FIG. 15 is a cross-sectional view illustrating another process in the same manufacturing method as FIG. FIG. 16 is a cross-sectional view illustrating still another step in the same manufacturing method as FIG. FIG. 17 is a cross-sectional view illustrating still another step in the same manufacturing method as FIG. FIG. 18 is a cross-sectional view illustrating a process of another example in the method for manufacturing an electronic component of the present invention using compression molding. FIG. 19 is a cross-sectional view illustrating another process in the same manufacturing method as FIG. FIG. 20 is a cross-sectional view illustrating a process of still another example in the method for manufacturing an electronic component of the present invention using compression molding. FIG. 21 is a cross-sectional view illustrating another process in the same manufacturing method as FIG. FIG. 22 is a cross-sectional view illustrating still another step in the same manufacturing method as FIG. FIG. 23 is a cross-sectional view illustrating still another step in the same manufacturing method as FIG. FIG. 24 is a cross-sectional view illustrating a process of still another example in the method for manufacturing an electronic component of the present invention using compression molding. FIG. 25 is a cross-sectional view illustrating a process of still another example in the method for manufacturing an electronic component of the present invention using compression molding. FIG. 26 is a cross-sectional view illustrating still another example in the method for manufacturing an electronic component of the present invention. FIG. 27 is a cross-sectional view illustrating still another example in the method for manufacturing an electronic component of the present invention. FIG. 28 is a cross-sectional view illustrating a process of still another example in the method for manufacturing an electronic component of the present invention using compression molding. FIG. 29 is a cross-sectional view illustrating another process in the same manufacturing method as FIG. FIG. 30 is a cross-sectional view illustrating another step in the same manufacturing method as FIG. FIG. 31 is a cross-sectional view illustrating another process in the same manufacturing method as FIG.

  Next, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.

The manufacturing method of the plate-like member with protruding electrodes of the present invention is as described above.
A method for producing a member for an electronic component in which a chip is resin-sealed,
The member is a plate-like member with a protruding electrode in which a protruding electrode is fixed on one side of the plate-shaped member,
It includes a molding step of simultaneously molding the plate member and the protruding electrode by molding using a molding die.

  In the present invention, “chip” refers to an electronic component before resin sealing, and specifically includes, for example, a chip-shaped electronic component such as an IC or a semiconductor chip. In the present invention, an electronic component before resin sealing is referred to as a “chip” for convenience in order to distinguish it from an electronic component after resin sealing. However, the “chip” in the present invention is not particularly limited as long as it is an electronic component before resin sealing, and may not be a chip-shaped electronic component. In the present invention, the term “electronic component” means an electronic component (an electronic component as a finished product) in which the chip is sealed with a resin unless otherwise specified.

  First, the plate-shaped member with protruding electrodes of the present invention that can be manufactured in the method for manufacturing the plate-shaped member with protruding electrodes of the present invention will be described with examples.

  In the plate-like member with protruding electrodes of the present invention, the number of the protruding electrodes is not particularly limited, and may be arbitrary and may be one or plural. The shape of the protruding electrode is not particularly limited. Moreover, when there are a plurality of the protruding electrodes, their shapes may be the same or different from each other. The protruding electrode may be a protruding electrode that includes a deformable deformable portion, or may not include the deformable portion. It is preferable that the deformation portion can be deformed by being contracted in a direction perpendicular to the surface direction of the plate-like member. The protruding electrode including the deformed portion is preferable because, for example, as described later, the height of the protruding electrode does not need to be designed in accordance with the thickness of the finished electronic component. For example, at least one of the protruding electrodes may be a lightning-shaped protruding electrode. The lightning-shaped protruding electrode has at least the deformed portion bent in a lightning bolt shape when viewed from a direction parallel to the surface direction of the plate-shaped member, so that the deformed portion is perpendicular to the surface direction of the plate-shaped member. It may be possible to shrink and deform. The lightning bolt-shaped protruding electrode may have at least the deformed portion as described above, and the portion other than the deformed portion may or may not be lightning bolt shaped. More specifically, the shape of the lightning protrusion electrode may be, for example, a shape as shown in FIGS. 2 (A) to 2 (B) or FIGS. 4 (A) to 4 (C) described later.

  Further, for example, at least one of the protruding electrodes may be a protruding electrode with a through hole. More specifically, even if the through hole in the projecting electrode with through hole (12) is a through hole (12b) penetrating in a direction parallel to the surface direction of the plate-like member (a direction parallel to the plate surface). good. The protruding electrode with a through hole has a protrusion (12c) protruding in a direction perpendicular to the plate surface of the plate-like member at the end opposite to the end (12a side) fixed to the plate-like member. May be. Further, the deformable portion that can be deformed may be provided around the through hole. It is preferable that the periphery of the through hole is the deformable portion that can be contracted and deformed in a direction perpendicular to the surface direction of the plate-like member. More specifically, the shape of such a protruding electrode with a through hole may be, for example, a shape as shown in FIGS. 3A to 3C or FIGS. 4A to 4C described later. . In the plate-like member with protruding electrodes of the present invention, the deformation of the protruding electrode at the deformed portion may be elastic deformation or plastic deformation. That is, the deformation part may be a part capable of elastic deformation (elastic part) or a part capable of plastic deformation (plastic part). Whether the deformation is elastic deformation or plastic deformation depends on, for example, the material of the protruding electrode.

  In the manufacturing method of the present invention, at least one of the protruding electrodes may be a columnar protruding electrode having a columnar shape. Examples of the shape of the columnar protruding electrode include a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, and a truncated pyramid shape. For example, when a columnar protruding electrode is used, the entire protruding electrode may be a deformable portion that can be deformed by contracting in a direction perpendicular to the surface direction of the plate member. In this case, for example, the column-shaped side surface may be swollen as a whole and be bent into a barrel shape.

  In the manufacturing method of the present invention, at least one of the protruding electrodes may be a plate-shaped protruding electrode. In this case, in the method of manufacturing an electronic component according to the present invention, the chip is plural, and in the resin sealing step, the substrate is divided into a plurality of regions by the plate-like protruding electrodes, and each of the regions Inside, the electronic component may be resin-sealed. The plate-like protruding electrode has a through-hole and a protrusion, the through-hole penetrates the plate-like protruding electrode in a direction parallel to the plate surface of the plate-like member, and the protrusion has the plate-like shape. It is preferable that the protruding electrode protrudes in a direction perpendicular to the plate surface of the plate member at the end opposite to the end fixed to the plate member. Further, the deformable portion that can be deformed may be provided around the through hole. It is preferable that the periphery of the through hole is the deformable portion that can be contracted and deformed in a direction perpendicular to the surface direction of the plate-like member.

  In the production method of the present invention, the plate member is not particularly limited, but is preferably a heat sink (heat sink) or a shield plate (shield plate). For example, the shield plate may shield electromagnetic waves emitted from the electronic component. It is preferable that the heat radiating plate has a radiating fin on a surface opposite to the protruding electrode fixing surface. Further, the shape of the plate-like member is not particularly limited except that the protruding electrode is fixed. For example, when the plate member is a heat radiating plate, the heat radiating plate has a shape (for example, fin shape) in which one or a plurality of protrusions for improving heat radiating efficiency are combined in addition to the protruding electrode. Also good. The material of the plate-like member is not particularly limited, but when the plate-like member is a heat radiating plate or a shield plate, for example, a metal material, a ceramic material, a resin, a metal vapor deposition film, or the like can be used. Although the said metal vapor deposition film is not specifically limited, For example, the metal vapor deposition film which vapor-deposited aluminum, silver, etc. on the film may be sufficient. The material of the protruding electrode is not particularly limited, and for example, a metal material, a ceramic material, a resin, or the like can be used. The metal material is not particularly limited. For example, iron-based materials such as stainless steel, permalloy (iron-nickel alloy), copper-based materials such as brass, copper-molybdenum alloy, and beryllium copper, and aluminum-based materials such as duralumin. , Etc. The ceramic material is not particularly limited, and examples thereof include alumina-based materials such as aluminum nitride, silicon-based materials such as silicon nitride, and zirconia-based materials. The resin is not particularly limited. For example, a rubber-based material such as an elastomer resin, a material obtained by mixing a conductive material with a silicon-based base material, and a resin material obtained by extrusion or injection molding of these materials. Is mentioned. In the plate-like member with protruding electrodes, the conductive layer may be formed by subjecting the surface of the plate-like member to surface treatment such as plating or painting. The plate member is also a functional member (action member) having some function. For example, when the plate member is a heat sink (heat sink), it is a functional member (action member) having a heat dissipation function (heat dissipation action), and when it is a shield plate (shielding board), a shielding function (shield action) ) Is a functional member (action member).

  Further, as described above, the shape of the plate-like member is not particularly limited. For example, the plate-like member may have a resin housing portion. More specifically, for example, the peripheral portion of the plate-like member is raised on the protruding electrode fixing surface side of the plate-like member, so that the central portion of the plate-like member forms the resin housing portion. May be.

  Next, the method for producing the plate-like member with protruding electrodes according to the present invention will be described with examples.

  The manufacturing method of the plate-like member with protruding electrodes of the present invention includes a forming step of simultaneously forming the plate-like member and the protruding electrodes by forming using a forming die as described above. The mold is not particularly limited, and examples thereof include a mold, a ceramic mold, and a resin mold. The forming step may be a step of simultaneously forming the plate-like member and the protruding electrode by, for example, electroforming, compression molding, or transfer molding. Although it does not specifically limit as a shaping | molding method using the said shaping | molding die, For example, injection molding etc. are mentioned other than electroforming, compression molding, or transfer molding.

  In the case where the forming step is a step of simultaneously forming the plate-like member and the protruding electrode by electroforming, the protruding electrode may be a protruding electrode including a deformable deformable portion. In the case where the molding step is a step of simultaneously molding the plate-like member and the protruding electrode by electroforming, the molding die is a molding die manufactured by molding using a master die. Also good. In the case where the mold is a mold manufactured by molding using a master mold, the molding process is performed in a state where the mold is divided into a plurality of parts and the plurality of divided molds are assembled. May be. In this case, the mold may be divided into a plurality of parts substantially parallel to the surface direction of the plate-like member.

  The forming step may be a step of simultaneously forming the plate-like member and the protruding electrode with a metal, for example. Further, for example, the forming step may be a step of simultaneously forming the plate member and the protruding electrode with a conductive resin. The conductive resin may be, for example, a mixture of resin and conductive particles. Although the said electroconductive particle is not specifically limited, For example, a metal particle etc. are mentioned. The metal in the metal particles is not particularly limited, and examples thereof include gold, silver, copper, nickel, tin, other arbitrary metals, and alloys containing two or more thereof. Further, in the method for producing a protruding electrode plate member of the present invention, the forming step is a step of simultaneously forming the plate member and the protruding electrode with a resin, and further, the protruding electrode surface and the plate shape A conductive film providing step of attaching a conductive film to the surface of the member on the protruding electrode side may be included. Although the said electroconductive film is not specifically limited, For example, films | membranes, such as a metal, are mentioned. The metal in the conductive film is not particularly limited, and examples thereof include gold, silver, copper, nickel, tin, and an alloy containing two or more thereof. The method for forming the conductive film is not particularly limited, and examples thereof include plating, coating, sputtering, and vapor deposition. The plating may be, for example, electroless plating or electrolytic plating.

  In the method for producing a protruding electrode plate member according to the present invention, the molding die includes a mold surface corresponding to the protruding electrode fixing surface of the plate member, and a hole formed on the mold surface and corresponding to the shape of the protruding electrode. In the forming step, the plate-like member and the protruding electrode are simultaneously formed by bringing the forming material of the protruding electrode-attached plate-like member into contact with the mold surface and the inner surface of the hole. May be. Further, the molding die has a mold surface corresponding to the protruding electrode fixing surface of the plate-like member, and a protrusion formed on the mold surface and corresponding to the shape of the protruding electrode. The plate member and the protruding electrode may be simultaneously formed by bringing the forming material of the protruding electrode-attached plate member into contact with the mold surface and the surface of the protrusion.

  Further, for example, the shape of the protruding electrode is not particularly limited as described above, but may be, for example, a tapered shape having a diameter that decreases toward the tip of the protruding electrode. When the protruding electrode has such a shape, the plate-like member with the protruding electrode can be easily detached from the mold as described later.

  Next, the method for manufacturing an electronic component of the present invention will be described with an example.

  In the method for manufacturing an electronic component of the present invention, for example, as described above, at least one of the protruding electrodes is a plate-shaped protruding electrode, the plurality of chips, and in the resin sealing step, the substrate is The plate-like protruding electrodes may be divided into a plurality of regions, and the chip may be resin-sealed in each of the regions.

  In the resin sealing step, a method (molding method) used for resin sealing is not particularly limited. For example, the chip may be resin-sealed by transfer molding in the resin process, or the chip may be resin-sealed by compression molding.

  In the resin sealing step, when the chip is resin-sealed by compression molding, the manufacturing method of the present invention further provides the resin on the surface of the plate-like member with the protruding electrode to which the protruding electrode is fixed. A resin placing step of placing may be included. In this case, the manufacturing method of the present invention may further include a transporting step of transporting the plate-like member with protruding electrodes to the position of the mold cavity of the mold. Further, in the mold cavity, in a state where the chip is immersed in the resin placed on the plate-like member, the resin is compression-molded together with the plate-like member with protruding electrodes and the chip, The resin sealing step may be performed.

  The order of the resin placing step and the transporting step is not particularly limited, and either may be first or may be simultaneous. For example, in the transporting step, the resin may be transported to the position of the mold cavity of the molding die together with the plate-like member with protruding electrodes while being placed on the plate-like member with protruding electrodes. Or in the said conveyance process, you may convey the said plate-shaped member with a protruding electrode to the position of the type | mold cavity of the said shaping | molding die in the state in which resin is not mounted. In this case, the manufacturing method of the present invention may further include a heating step of heating the plate-like member with protruding electrodes in the mold cavity prior to the resin placing step. And you may perform the said resin mounting process in the said mold cavity in the state in which the said plate-shaped member with a protruding electrode was heated.

  In the transporting step, the plate-like member with protruding electrodes is placed on the release film with the surface on which the protruding electrodes are fixed facing upward. It may be conveyed into the mold cavity. In this case, in the transporting step, the protruding electrode in a state where a frame is placed on the release film together with the plate-shaped member with the protruding electrode, and the plate-shaped member with the protruding electrode is surrounded by the frame. The attached plate member may be conveyed into the mold cavity of the mold. In the resin placing step, the projecting electrode in a state where the frame is placed on the release film together with the projecting electrode-attached plate-like member, and the plate-like member with the projecting electrode is surrounded by the frame. It is preferable that the resin is placed on the protruding electrode fixing surface by supplying the resin into a space surrounded by the plate-like member and the frame. In such a case, the order of the resin placing process and the transporting process is not particularly limited, and either may be performed first or simultaneously, but it is preferable to perform the resin placing process prior to the transporting process.

  Moreover, the surface on the opposite side to the surface where the said projection electrode was fixed of the plate-shaped member with the said projection electrode may be fixed on the said release film with an adhesive.

  The transport means for performing the transport process may be a means for transporting the resin into a mold cavity of the molding die in a state where the plate-like member on which the resin is placed is placed on a release film. good. In this case, the resin sealing means for performing the resin sealing includes a release film adsorbing means, and means for performing the compression molding in a state where the release film is adsorbed to the release film adsorbing means. There may be. Moreover, the said shaping | molding die is although it does not specifically limit, For example, it is a metal mold | die or a ceramic type | mold.

  In the method for manufacturing an electronic component of the present invention, as described above, the plate-like member of the plate-like member with protruding electrodes may have a resin housing portion. More specifically, for example, the peripheral portion of the plate-like member is raised on the protruding electrode fixing surface side of the plate-like member, so that the central portion of the plate-like member forms the resin housing portion. May be. In the method of manufacturing an electronic component according to the present invention, in the resin placing step, the resin is placed in the resin housing portion of the plate-like member, and the resin sealing step is performed in the resin housing portion. You may carry out in the state in which was mounted.

  Further, in the resin sealing step, the substrate on which the chip is arranged on the wiring pattern forming surface is placed on a substrate mounting table with the wiring pattern forming surface facing up, and further, the wiring pattern formation is performed. You may press the said resin in the state which mounted the said resin on the surface. More specifically, in the above state, the plate-like member with protruding electrodes may be pressed against the resin from the protruding electrode side. Thereby, the protruding electrode can be connected to the wiring pattern of the substrate on which the electronic component is mounted.

  Further, as described above, the plate-like member in the plate-like member with protruding electrodes is not particularly limited. For example, the plate-like member is a heat radiating plate, and the heat radiating plate is opposite to the protruding electrode fixing surface. You may have a radiation fin in the side surface.

  In the method for manufacturing an electronic component of the present invention, the resin is not particularly limited, and may be, for example, either a thermoplastic resin or a thermosetting resin. The resin may be, for example, at least one selected from the group consisting of granular resin, powder resin, liquid resin, plate resin, sheet resin, film resin, and paste resin. Further, the resin may be at least one selected from the group consisting of a transparent resin, a translucent resin, and an opaque resin, for example.

  Hereinafter, examples of specific embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, each drawing is schematically drawn with appropriate omission, exaggeration, and the like.

  In this example, an example of a plate-like member with a protruding electrode of the present invention, an example of a method for producing a plate-shaped member with a protruding electrode of the present invention, an example of an electronic component of the present invention using the plate-shaped member with a protruding electrode, And an example of the manufacturing method of the said electronic component is demonstrated.

  In the perspective view of FIG. 1, the structure of the plate-like member with protruding electrodes of the present embodiment is schematically shown. As shown in the figure, the plate-like member 10 with protruding electrodes is formed by fixing the pattern of the protruding electrodes 12 on one surface of the plate-like member 11. The length (height) of the protruding electrode 12 is not particularly limited, but can be set as appropriate according to the thickness of the finished electronic component (molded package), for example. In the present invention, the pattern of the protruding electrode is not limited to the pattern of the present embodiment (FIG. 1), and is arbitrary.

  The structure of the protruding electrode 12 shown in FIG. 1 is not particularly limited. The protruding electrode 12 may be, for example, a protruding electrode including a deformable deformable portion. 2A and 2B show an example of the structure of the protruding electrode 12 including such a deformed portion. In the perspective views of FIGS. 2A and 2B, the vertical direction on the paper surface indicates the direction perpendicular to the surface direction of the plate-like member 11. The protruding electrode 12 shown in FIG. 6A includes a deformed portion 12A at the central portion, and a portion other than the central portion is configured by a rigid portion 12B (an end portion of the protruding electrode 12). As shown in the figure, the deforming portion 12A is bent in a lightning bolt shape when viewed from the direction parallel to the surface direction of the plate-like member 11. As shown in FIG. 6A, the protruding electrode 12 can be contracted in the vertical direction so that the deformed portion 12A bends in a zigzag shape. Further, the protruding electrode 12 shown in FIG. 5B is entirely constituted by a deformed portion 12A. 12B is also bent in a lightning bolt shape when viewed from a direction parallel to the surface direction of the plate-like member 11. The protruding electrode 12 shown in FIG. 5B can be deformed by being contracted in the vertical direction so as to be bent in a dogleg shape. Thereby, for example, even when the height of the protruding electrode 12 is designed to be higher than the thickness of a finished electronic component (an electronic component formed by sealing a chip with a resin), the protrusion The electrode follows the thickness without damage. For this reason, it is not necessary to design the height of the protruding electrode in accordance with the thickness in advance, so that an electronic component having both a via electrode (projecting electrode) and a plate-like member can be easily and efficiently manufactured.

  Further, the shape of the protruding electrode 12 is not limited to the structure in which the deformable portion 12A is bent in a lightning bolt shape (zigzag) as shown in FIG. For example, the shape of the protruding electrode 12 may be a shape having the through hole 12b, and more specifically, for example, the shape shown in FIG. 3, the upper right side is a perspective view showing a part of the plate-like member 10 with protruding electrodes in FIG. 3A to 3C are perspective views schematically showing an example of the structure of the protruding electrode 12. As shown in FIGS. 3A to 3C, no hole is formed in the lower portion 12 a (the portion connected to the plate-like member 11) of the protruding electrode 12. On the other hand, in the upper part of the protruding electrode 12 (the part opposite to the side connected to the plate-like member 11), a hole (through hole) that penetrates the protruding electrode 12 in a direction parallel to the plate surface of the plate-like member 11. 12b is open. A part of the upper end of the protruding electrode 12 (the end opposite to the end fixed to the plate-like member 11) protrudes upward (in the direction perpendicular to the plate surface of the plate-like member 11), and the protrusion 12c is formed. Forming. The protruding electrode 12 can be in contact with the wiring pattern (substrate electrode) of the substrate at the tip portion of the protrusion 12c. In FIG. 3A, the number of protruding electrodes 12c is two. FIG. 3B is the same as FIG. 3A except that the number of protruding electrodes 12c is one and the width of the protruding electrode 12 is slightly narrow. FIG. 3C is the same as FIG. 3B except that the protruding electrode 12 is narrower. Thus, the number of protrusions 12c is not particularly limited, and may be one or more. The number of protrusions 12c is 1 or 2 in FIGS. 3A to 3C, but may be 3 or more. Also, the number of holes (through holes) 12b is 1 in FIGS. 3A to 3C, but is not particularly limited, and may be arbitrary and may be plural.

  By having the projection 12c, the projection electrode 12 can easily come into contact with the wiring pattern (substrate electrode) of the substrate without being obstructed by the resin. That is, the protrusion 12c scrapes a resin (for example, a molten resin or a liquid resin) between the protruding electrode 12 and a wiring pattern 22 in FIG. 12 to be described later, and the tip of the protrusion 12c comes into contact with the wiring pattern 22 (physically And electrically connected. Further, since the protruding electrode 12 has the hole 12b, it becomes easier to perform resin sealing of the electronic component. That is, since the resin can flow through the holes 12b, the resin flows more smoothly and the efficiency of resin sealing is further improved. This effect is particularly remarkable when an electronic component is manufactured by transfer molding (a chip is sealed with a plate-like member with protruding electrodes). Further, when the protruding electrode 12 abuts (contacts) with the wiring pattern 22, the protruding electrode 12 bends in the vicinity of the hole 12b as shown in FIG. Can be reduced. That is, in the protruding electrode 12 having the shape shown in FIGS. 3A to 3D, the periphery of the through hole 12 b is the deformed portion that can shrink in the direction perpendicular to the surface direction of the plate-like member 11. Thereby, the height of the protruding electrode 12 can be adjusted corresponding to the resin thickness (package thickness) of the electronic component. Considering this point, the height (length) of the protruding electrode 12 may be set in advance slightly longer than the resin thickness (package thickness).

  Further, the protruding electrode 12 may be, for example, the lightning-shaped protruding electrode and the protruding electrode with a through hole. That is, the protruding electrode 12 includes the deformed portion bent in a lightning bolt shape (zigzag) when viewed from the direction parallel to the surface direction of the plate-like member 11 and the through-hole penetrating in the direction parallel to the surface direction of the plate-like member 11. You may have both. FIG. 4 shows an example of such a structure. In FIG. 4, the figure on the upper right side is a perspective view showing a part of the plate-like member 10 with protruding electrodes in FIG. 4A to 4C are perspective views schematically showing an example of the structure of the protruding electrode 12. 4A to 4C, the protruding electrode 12 includes a lower portion 12a of the protruding electrode 12 (a portion connected to the plate-like member 11 and a portion having no hole) and an upper portion (the plate-like member 11). 3 (A) to (C) except that the connecting side and the opposite side (the portion where the through hole 12b is open) are connected and integrated by the deforming portion 12A. is there. 4 (A) to 4 (C), the deforming portion 12A is bent in a lightning bolt shape (zigzag) when viewed from a direction parallel to the surface direction of the plate-like member 11, as in FIG. 2 (A). 11 can be contracted in a direction perpendicular to the surface direction. 4A to 4C, as in FIGS. 3A to 3C, when the protruding electrode 12 bends in the vicinity of the hole 12b, for example, as shown in FIG. In addition, the height (length) of the protruding electrode 12 can be reduced.

  In addition, the shape of the protruding electrode 12 is not limited to the shape of FIGS. For example, the shape illustrated in FIGS. 2 to 4 is an example of the protruding electrode 12 including the deforming portion 12A, but the protruding electrode 12 is not limited to the protruding electrode including the deforming portion. Also, when the protruding electrode 12 includes the deformed portion 12A, the shape is not limited to the shape of FIGS. 2 to 4, and may be another shape in addition to or instead of the shape of FIGS. For example, as described above, at least one of the protruding electrodes 12 may be a columnar protruding electrode having a columnar shape. Examples of the shape of the columnar protruding electrode include a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, and a truncated pyramid shape as described above.

  Further, as described above, at least one of the protruding electrodes 12 may be a plate-shaped protruding electrode. In this case, as described above, in the resin sealing step in the manufacturing method of the present invention, the substrate is divided into a plurality of regions by the plate-like protruding electrodes, and the electronic component is resin-sealed in each of the regions. You can stop it. Moreover, the said plate-like projection electrode may have a through-hole and a projection similarly to the projection electrode of FIG. 3 (A)-(C). The said through-hole may penetrate the said plate-shaped projection electrode in the direction parallel to the plate surface of the said plate-shaped member similarly to FIG. 3 (A)-(C). In addition, as in FIGS. 3A to 3C, the protrusion is formed on the plate-like protrusion electrode at the end opposite to the end fixed to the plate-like member. It is preferable to project in the vertical direction. The numbers of the through holes and the protrusions of the plate-like protruding electrode are not particularly limited and are arbitrary, but a plurality is preferable. Since the plate-like protruding electrode has the through-hole and the protrusion, there are advantages similar to those of the through-hole 12b and the protrusion 12c in FIGS. That is, first, since the plate-like protruding electrode has the protrusion, the plate-like protruding electrode can easily come into contact with the wiring pattern (substrate electrode) of the substrate without being obstructed by the resin. In addition, since the plate-like protruding electrode has the through hole, the resin can flow through the through hole, so that the resin can flow more smoothly and the resin sealing efficiency is further improved. . This effect is particularly remarkable when an electronic component is manufactured by transfer molding (a chip is sealed with a plate-like member with protruding electrodes). Furthermore, it is possible to reduce the height (length) of the plate-like protruding electrode by bending the plate-like protruding electrode in the vicinity of the through hole. Thereby, the height of the plate-like protruding electrode can be adjusted corresponding to the resin thickness (package thickness) of the electronic component. In consideration of this point, the height (length) of the plate-like protruding electrode may be set in advance slightly longer than the resin thickness (package thickness).

  Further, in the present invention, it is preferable that the deformed portion of the protruding electrode can be contracted in a direction perpendicular to the surface direction of the plate-like member, but any deformation other than contracting in the vertical direction is performed. May be. For example, the deforming portion may be contracted in a direction perpendicular to the surface direction of the plate-shaped member and spread in the entire lateral direction including the surface direction (horizontal plane direction) and the oblique direction of the plate-shaped member. . The type of deformation depends on, for example, the material and shape of the plate member.

  Next, an example of a method for producing the plate-like member with protruding electrodes will be described.

  As described above, the plate-like member with protruding electrodes of the present invention includes a forming step of simultaneously forming the plate-like member and the protruding electrodes by forming using a forming die.

  5A to 5C schematically show an example in which the plate member and the protruding electrode are simultaneously formed by electroforming in the forming step. First, as shown in FIG. 5A, a molding die 10D for electroforming is prepared. As shown in the drawing, in this mold 10D, one surface (the surface on the upper side of the paper surface) forms a mold surface corresponding to the protruding electrode fixing surface of the plate-like member. A hole 12D corresponding to the shape of the protruding electrode is formed in the mold surface. Although the manufacturing method of the shaping | molding die 10D for electroforming is not specifically limited, For example, you may manufacture by the machining etc. of a resin plate or a metal plate. For example, the hole 12D may be formed by machining (milling) or the like. Alternatively, the mold 10D may be manufactured by molding using a master mold having a mold surface corresponding to the shape of the mold 10D (inverted irregularities on the surface shape of the mold 10D). The molding method using the master mold is not particularly limited, and examples thereof include electroforming, compression molding, transfer molding, and the like. The material for forming the mold 10D is not particularly limited, and examples thereof include resins, metals, ceramics, and the like. From the viewpoint of use as a mold for electroforming, a conductive material is preferable. When the forming material of the mold 10D is a resin, a conductive resin is preferable. Although the said conductive resin is not specifically limited, For example, the mixture of resin and electroconductive particle may be sufficient. Although the said electroconductive particle is not specifically limited, For example, a metal particle etc. are mentioned. The metal in the metal particles is not particularly limited, and examples thereof include gold, silver, copper, nickel, tin, other arbitrary metals, and alloys containing two or more thereof. Further, the mold 10D may be a mold in which a conductive film is provided on the surface of the conductive resin or the nonconductive resin. The conductive film is not particularly limited, and examples thereof include a metal film as described above. The metal in the conductive film is not particularly limited, and examples thereof include gold, silver, copper, nickel, tin, and an alloy containing two or more thereof. The method for forming the conductive film is not particularly limited, and examples thereof include plating, coating, sputtering, and vapor deposition. The plating may be, for example, electroless plating or electrolytic plating.

  Then, as shown by the arrow in FIG. 5A, the forming material of the plate-like member with protruding electrodes is brought into contact with the mold surface of the mold 10D and the inner surface of the hole 12D by electroforming. That is, as shown in FIG. 5B, the plate-like member 11 and the protruding electrode are brought into contact with the mold surface of the forming die 10D and the inner surface of the hole 12D by bringing the forming material of the plate-like member 10 with the protruding electrode into contact therewith. 12 are formed at the same time (forming step), and the plate-like member 10 with protruding electrodes is manufactured. Thus, when manufacturing the plate-shaped member 10 with the protruding electrode by electroforming, the material for forming the plate-shaped member 10 with the protruding electrode is not particularly limited, but, for example, a metal such as nickel or copper, and two types thereof. The alloy containing the above etc. are mentioned. Then, as shown in FIG. 5C, the plate-like member 10 with protruding electrodes is used by being removed from the mold 10D. At this time, the plate-like member 10 with the protruding electrodes may be removed from the mold 10D while maintaining the shape of the mold 10D. Further, for example, the plate-like member 10 with protruding electrodes may be removed from the molding die 10D by melting the molding die 10D. In this case, it is preferable from the viewpoint of simplicity that the forming material of the mold 10D is a resin. The resin may be, for example, a conductive resin mixed with conductive particles. For example, if the mold 10D is manufactured using the master mold, the mold 10D having the same shape and the same size can be easily manufactured any number of times. Thereby, even if it melt | dissolves the shaping | molding die 10D and it makes it disposable, the manufacture of the plate-shaped member 10 with a protruding electrode can be performed efficiently and at low cost. Further, for example, a material obtained by melting the mold 10D may be used again as a forming material of the mold 10D.

  In addition, the manufacturing method of the plate-shaped member with protruding electrodes of the present invention may or may not include steps other than the forming step (step of simultaneously forming the plate-shaped member and the protruding electrodes). It is not necessary. For example, in the example shown in FIG. 5, as shown in FIG. 5C, after the plate-like member 10 with protruding electrodes is removed from the molding die 10 </ b> D, unnecessary portions of the plate-like member 10 with protruding electrodes are machined (for example, cutting and polishing). Etc.) or a step of removing by etching or the like may or may not be included.

  FIGS. 6 to 9 show several modified examples in the case where the forming step (step of simultaneously forming the plate-like member and the protruding electrode) is performed by electroforming.

  First, FIG. 6 shows an example in which the mold 10D is a convex mold. That is, in FIGS. 5A to 5C, the case where the mold 10D is a concave mold is illustrated. Here, as described in FIG. 5, the concave mold has a mold surface corresponding to the protruding electrode fixing surface of the plate-like member, and a hole formed in the mold surface and corresponding to the shape of the protruding electrode. It is a mold. On the other hand, the convex mold refers to a mold having a mold surface corresponding to the protruding electrode fixing surface of the plate-like member and a protrusion formed on the mold surface and corresponding to the shape of the protruding electrode. That is, as shown in the drawing mold 10D (convex mold) of FIG. 6, one surface (the upper surface of the paper surface) forms a mold surface corresponding to the protruding electrode fixing surface of the plate-like member. . A protrusion 12E corresponding to the shape of the protruding electrode is formed on the mold surface. In FIG. 6, as shown in the figure, in the molding step, the plate-like member 11 and the protruding electrode 12 are brought into contact with the mold surface and the surface of the protrusion 12 </ b> E by bringing the forming material of the plate-like member 10 with the protruding electrode into contact therewith. Mold at the same time. The manufacturing method of the plate-like member 10 with protruding electrodes in FIG. 6 can be performed using electroforming. More specifically, in the manufacturing method of FIG. 6, for example, except that the convex mold shown in FIG. 6 is used instead of the concave mold shown in FIG. The production can be carried out in the same manner as in the production method C).

  FIGS. 7 and 8 show examples in which the shape of the protruding electrode 12 is a tapered shape with a diameter becoming narrower toward the tip of the protruding electrode 12 (away from the plate-like member 11). FIG. 7 is an example of a concave shape, except that the shape of the protruding electrode 12 is a tapered shape with a diameter decreasing toward the tip of the protruding electrode 12 (away from the plate member 11). It is the same. FIG. 8 is an example of a convex shape, and the shape of the protruding electrode 12 is the same as that of FIG. 6 except that the diameter decreases toward the tip of the protruding electrode 12 (the farther away from the plate-like member 11). It is. As shown in FIGS. 7 and 8, the hole 12 </ b> D corresponding to the shape of the protruding electrode 12 or the shape of the protrusion 12 </ b> E corresponding to the shape of the protruding electrode 12 is a shape corresponding to the shape of the protruding electrode 12. In other words, the shapes of the holes 12D and the protrusions 12E are tapered such that the diameters become narrower toward the tips of the protruding electrodes 12 (away from the plate member 11). The plate-like member 10 with protruding electrodes using the mold 12D shown in FIGS. 7 and 8 can be manufactured in the same manner as in FIG. It is preferable that the protruding electrode 12 has such a tapered shape because the plate-like member 10 with the protruding electrode can be easily detached from the mold 10D.

  Moreover, process sectional drawing of FIG. 9 (A)-(D) is an illustration in case the shaping | molding die is divided | segmented into plurality. As shown in FIG. 9 (A), the mold is divided into a plurality of parts substantially parallel to the surface direction of the plate-like member. Specifically, this mold is divided into four molds 10D1, 10D2, 10D3, and 10D4 from the protruding electrode tip side to the plate-like member side as shown in the figure. Molding die 10D1 corresponds to the tip of the protruding electrode. The molds 10D2 and 10D3 correspond to a deformed portion that is a central portion of the protruding electrode. Mold 10D4 corresponds to the plate-like member and the plate-like member side portion of the protruding electrode. The upper surface (upper surface of the paper surface) of the mold 10D4 is a mold surface corresponding to the protruding electrode fixing surface of the plate member. The molds 10D1, 10D2, 10D3, and 10D4 have holes 12D1, 12D2, 12D3, and 12D4 corresponding to the shape of the protruding electrodes, respectively. The hole 12D1 does not penetrate the molding die 10D1, and the holes 12D2, 12D3, and 12D4 are through-holes that penetrate the molding dies 10D2, 10D3, and 10D4, respectively. As shown in FIG. 9B, when the molds 10D1, 10D2, 10D3, and 10D4 are assembled, a single mold having holes corresponding to the shape of the protruding electrodes is formed on the mold surface. In this mold, holes 12D1, 12D2, 12D3, and 12D4 are combined to form holes corresponding to the shape of the protruding electrodes. Using this mold, a plate-like member with protruding electrodes can be produced by electroforming, as in FIGS. 5 (A) to (C). That is, the plate-shaped member as shown in FIG. 9C is obtained by bringing the forming material of the plate-shaped member with protruding electrodes into contact with the mold surface of the mold shown in FIG. 9B and the inner surface of the hole. 11 and the protruding electrode 12 are simultaneously formed (forming step), and the plate-like member 10 with the protruding electrode is manufactured. In the plate-like member 10 with protruding electrodes, as shown in the figure, the central portion of the protruding electrode 12 is a deformable deformable portion 12A. Then, as shown in FIG. 9D, the plate-like member 10 with protruding electrodes is removed from the mold 10D and used.

  As shown in FIGS. 9A to 9D, a method using a molding die divided into a plurality of parts substantially parallel to the surface direction of the plate-like member is preferable when the shape of the protruding electrode 12 is complicated. Specifically, the case where the shape of the protruding electrode 12 is complicated includes, for example, a case where the protruding electrode 12 includes a deformed portion 12A as shown in FIGS. 9C and 9D. The shape of the protruding electrode 12 including the deformed portion 12A is not particularly limited, but is, for example, as shown in FIGS. Even in the case where the shape of the protruding electrode 12 is complicated, it is easy to manufacture the forming die by using the forming die divided into a plurality of parts in substantially parallel to the surface direction of the plate member. . Moreover, the method of removing the plate-like member 10 with protruding electrodes from the molding die 10D after the molding step (FIG. 9C) is not particularly limited, but it is preferable to melt the molding die 10D. By melting the mold 10D, even if the shape of the protruding electrode 12 is a complicated shape, the plate-like member 10 with the protruding electrode can be easily detached from the forming mold 10D. In this case, the mold 10D is preferably manufactured using a master mold.

  In the above, the example of the manufacturing method which manufactures the plate-shaped member with a projection electrode by electroforming was demonstrated using FIGS. If molding by electroforming is used, a plate-like member with protruding electrodes having the same shape can be manufactured with extremely high accuracy and efficiency. Moreover, according to electroforming, even if the shape of the plate-like member with protruding electrodes is a complicated shape, a fine shape, or the like, it can be accurately reproduced.

  Although the manufacturing method of the electronic component using the plate-shaped member with a projection electrode is not specifically limited, For example, it can carry out by the manufacturing process shown to typical process sectional drawing of FIG. 12 (A)-(C). The cross-sectional view of FIG. 12C is a schematic view of the structure of the electronic component of this example manufactured by the manufacturing process. First, as shown in FIG. 12C, the electronic component 20 includes a protruding electrode 12 having a substrate 21, a chip 31, a resin 41, a plate-like member 11, and a deforming portion 12 </ b> A. The protruding electrode 12 is fixed to one surface of the plate-like member 11, and the plate-like member 11 and the protruding electrode 12 are integrated to form a plate-like member with a protruding electrode. The chip 31 is fixed on the substrate 21 and is sealed with a resin 41. A wiring pattern 22 is formed on the substrate 21 on the chip 31 side. The protruding electrode 12 is fixed to one surface of the plate-like member 11 as described with reference to FIG. Further, the protruding electrode 12 penetrates the resin 41 and is in contact with the wiring pattern 22.

  Next, the manufacturing process of FIGS. 12A to 12C will be described. First, as shown in FIG. 12A, a plate-like member 10 with protruding electrodes and a substrate 21 are prepared. As shown in the figure, in the plate-like member 10 with protruding electrodes, the protruding electrode 12 is fixed to one surface of the plate-like member 11, and the plate-like member 11 and the protruding electrode 12 are integrated to form the plate-like member 10 with protruding electrodes. doing. In FIG. 12A, the length (height) of the protruding electrode 12 in the direction perpendicular to the surface direction of the plate-like member 11 is indicated by an arrow and a symbol M. A chip 31 is fixed on the substrate 21. A wiring pattern 22 is formed on the substrate 21 on the chip 31 side. Then, as shown in FIG. 12A, the plate-like member 10 with protruding electrodes and the substrate 21 are arranged with the protruding electrode 12 fixing surface and the wiring pattern 22 forming surface facing each other.

  Then, as shown in FIG. 12B, the chip 31 is sealed with a resin 41 between the surface on which the protruding electrode 12 is fixed on the plate-like member 11 and the surface on which the wiring pattern 22 is formed on the substrate 21. In the figure, the protruding electrode 12 having the deformed portion 12A is not shrunk. That is, the length (height) of the protruding electrode 12 in the direction perpendicular to the surface direction of the plate-like member 11 remains M as in FIG. In this state, if the protruding electrode 12 is in contact with the wiring pattern 22 and the length of the protruding electrode 12 follows the predetermined thickness of the electronic component, this may be used as the electronic component 20. When the length of the protruding electrode 12 does not follow the predetermined thickness of the electronic component, the distance (distance) between the plate member 11 and the substrate 21 is reduced by pressing in the direction perpendicular to the surface direction of the plate member 11. Thus, it follows the predetermined thickness of the electronic component. At this time, a pressing force is applied to the protruding electrode 12 due to contact with the wiring pattern 22 of the substrate 21. By this pressing force, the entire protruding electrode 12 is relatively pressed in the direction perpendicular to the surface direction of the plate-like member 11. By this pressing, as shown in FIG. 12C, the protruding electrode 12 is contracted in a direction perpendicular to the surface direction of the plate-like member 11 when the deformed portion 12 </ b> A is bent. That is, as shown, the length (height) of the protruding electrode 12 in the direction perpendicular to the surface direction of the plate-like member 11 is N, which is a numerical value smaller than M in FIGS. 12 (A) and 12 (B). (M> N). Thereby, the protruding electrode 12 follows the predetermined thickness of the electronic component (the distance between the plate-like member 11 and the substrate 21). Further, the protruding electrode 12 is in contact with the wiring pattern 22 in the state of FIG. In this way, the illustrated electronic component 20 can be manufactured. In FIG. 12, for convenience of explanation, the protruding electrode 12 has been described as having a shape having a lightning-shaped deformed portion 12 </ b> A. However, as described above, the shape of the protruding electrode 12 is not limited to this, and may be any shape as described above. Hereinafter, the same applies to all cross-sectional views including the protruding electrode 12.

  Moreover, the plate-shaped member 11 is not specifically limited, For example, as above-mentioned, a heat sink, a shielding board (shield board), etc. may be sufficient. For example, in the case where a plurality of chips (chips) are arranged in one IC (electronic component), etc., they may be shielded electromagnetically by a shielding plate (shielding plate) due to the function of each chip. .

  Further, the plate-like member with protruding electrodes may be a plate-like member corresponding to one substrate (one electronic component), but as shown in FIG. 1, a plate corresponding to a plurality of substrates (a plurality of electronic components). A shaped member (matrix type) may be used. In the case of the matrix type, for example, a plurality of substrates each having a chip and a wiring pattern fixed thereon are resin-sealed together with the matrix type plate-like member with protruding electrodes. Thereafter, the matrix-type plate-like member with protruding electrodes may be divided into regions corresponding to the respective substrates by cutting or the like. For example, as described above, at least one of the protruding electrodes may be a plate-shaped protruding electrode. In this case, a required range (range having a specific function) corresponding to one electronic component (one product unit) on the substrate surface can be partitioned (separated) by the plate-like protruding electrodes. .

  Furthermore, instead of the chip 31, an electronic component in which the chip is already sealed with a resin may be used. In this case, since the electronic component 20 has a form in which the electronic component 31 is further resin-sealed, the chip is resin-sealed a plurality of times.

  12A to 12C have described the case where the protruding electrode 12 has the deformed portion 12A. When the protruding electrode 12 does not have a deformed portion, the length (height) of the protruding electrode 12 in the direction perpendicular to the surface direction of the plate-like member 11 does not shrink in the direction perpendicular to the surface direction of the plate-like member 11. Other than that, even when the protruding electrode 12 does not have a deformed portion, the plate-like member 10 with the protruding electrode can be manufactured in the same manner as in FIGS. However, if the protruding electrode 12 has the deformed portion 12A, as described above, it is not necessary to design the height of the protruding electrode in accordance with the thickness of the finished (resin-sealed) electronic component. For this reason, an electronic component having both a via electrode (projection electrode) and a plate-like member can be easily and efficiently manufactured, which is preferable. For example, as described above, in consideration of the contraction electrode 12 contracting in a direction perpendicular to the surface direction of the plate-like member 11, the height (length) of the projection electrode 12 is set in advance (resin-sealed). ) It may be set slightly longer than the resin thickness (package thickness) of the electronic component.

  In addition, although the manufacturing method of the electronic component using the plate-shaped member with a projection electrode was typically illustrated in FIG. 12 (A)-(C), as above-mentioned, it is not specifically limited to this method. More specific examples of the electronic component manufacturing method will be described in each embodiment described later.

  Next, an example of producing a plate-like member with protruding electrodes by compression molding will be described.

  10A to 10H schematically show a process of manufacturing a plate-like member with protruding electrodes by compression molding according to the present embodiment in the process cross-sectional views (however, only FIG. 10A is a plan view). . 10A (H), FIG. 10A (FIGS. 10A to 10D) and FIG. 10B (FIGS. 10E to 10H) are shown for convenience. 10a and 10b are simply referred to as FIG.

  First, as shown in the plan view of FIG. 10A, a metal frame 3001 is prepared. As shown in the figure, this metal frame (frame) 3001 is rectangular (rectangular), and has a rectangular through hole (opening) 3001a at the center. However, the shapes of the metal frame 3001 and the through-hole 3001a are not limited to a rectangle and can be arbitrarily selected, and can be appropriately selected according to the shape of the plate-like member with protruding electrodes.

  Next, as shown in the cross-sectional view of FIG. 10B, a metal frame 3001 is attached to one side of an adhesive sheet 3002 having the same shape and size as the metal frame 3001. The pressure-sensitive adhesive sheet 3002 is provided with a pressure-sensitive adhesive on the surface of the metal frame 3001 attached side. The surface of the pressure-sensitive adhesive sheet 3002 opposite to the side to which the metal frame 3001 is attached can be sucked into the upper mold by suction through a suction hole (not shown) provided in the upper mold of the mold. Further, on the side of the adhesive sheet 3002 to which the metal frame 3001 is attached, a plate-like member with protruding electrodes can be adhered to the adhesive surface exposed from the through-hole 3001a as described later.

  Next, as shown in FIGS. 10C to 10G, a plate-like member with protruding electrodes is manufactured by compression molding. First, as shown in FIG. 10C, the adhesive sheet 3002 and the metal frame 3001 are adsorbed to the upper mold 3003 of the mold. This adsorption can be performed, for example, by depressurization (evacuation) by suction from the adsorption hole (not shown) of the upper mold 3003 described above. Moreover, this shaping | molding die is a part of compression molding apparatus for manufacturing the plate-shaped member with a protruding electrode. The cross-sectional view of FIG. 10C is a schematic view showing a partial structure of this mold. The figure shows a state in which the resin material 4001 is supplied in a mold open state before the mold is clamped.

  As shown in FIG. 10 (C), this mold includes an upper mold 3003 and a lower mold 3004 arranged to face the upper mold as main components. On the mold surface (lower surface) of the upper mold 3003, as shown in the figure, an adhesive sheet 3002 with a metal frame 3001 attached can be adsorbed (attached) with the metal frame 3001 facing downward and fixed. .

  The upper mold 3003 is installed in a state of hanging from the upper mold base plate 3011. An upper mold outside air blocking member 3013 is provided at the outer peripheral position of the upper mold 3003 on the upper mold base plate 3011. An O-ring 3013a for blocking outside air is provided on an upper end surface of the upper mold outside air blocking member 3013 (a portion sandwiched between the upper mold base plate 3011 and the upper mold outside air blocking member 3013). In addition, an O-ring 3013 b for blocking outside air is also provided on the lower end surface of the upper mold outside air blocking member 3013. The upper mold base plate 3011 is provided with an upper mold hole (through hole) 3012 for forcibly sucking and discharging the air in the space in the mold.

  The lower mold 3004 is formed of a lower mold cavity bottom member 3005a, a lower mold outer peripheral member 3006, and a lower mold elastic member 3006a. Further, the lower mold cavity bottom surface member 3005a includes a cavity (lower mold cavity) 3005b which is a space for resin molding on the mold surface (upper surface). The lower mold cavity bottom member 3005a is provided below the lower mold cavity 3005b. The mold surface (upper surface) of the lower mold cavity bottom surface member 3005a has a shape corresponding to the protruding electrode fixing surface side of the plate-shaped member in the plate-shaped member with the protruding electrodes. The lower mold cavity 3005b has a hole corresponding to the shape of the protruding electrode in the plate-like member with the protruding electrode. The lower die outer peripheral member (lower die frame body, cavity side member) 3006 is disposed so as to surround the lower die cavity bottom surface member 3005a. The height of the upper surface of the lower mold outer peripheral member 3006 is higher than the height of the upper surface of the lower mold cavity bottom member 3005a. Thus, a lower mold cavity (concave portion) 3005b surrounded by the upper surface of the lower mold cavity bottom surface member 3005a and the inner peripheral surface of the lower mold outer peripheral member 3006 is formed. Between the lower mold cavity bottom member 3005a and the lower mold outer peripheral member 3006, there is a gap (suction hole) 3006c. As will be described later, the gap 3006c can be depressurized with a vacuum pump (not shown) to adsorb a release film or the like. The lower mold 3004 (the lower mold cavity bottom member 3005a, the lower mold outer peripheral member 3006, and the lower mold elastic member 3006a) is mounted in a state of being placed on the lower mold base plate 3005. The lower mold elastic member 3006 a for buffering is provided between the lower mold outer peripheral member 3006 and the lower mold base plate 3005. Further, a lower mold outside air blocking member 3021 is provided at the outer peripheral position of the lower mold outer peripheral member 3006 on the lower mold base plate 3005. An O-ring 3021a for blocking outside air is provided on the lower end surface of the lower mold outside air blocking member 3021 (a portion sandwiched between the lower mold base plate 3005 and the lower mold outside air blocking member 3021). The lower mold outside air blocking member 3021 is disposed directly below the upper mold outside air blocking member 3013 and the outside air blocking O-ring 3013b. By having the above configuration, at the time of clamping the upper and lower molds, by joining the upper mold outside air blocking member 3013 including the O rings 3013a and 3013b and the lower mold outside air blocking member 3021 including the O ring 3021a, at least The inside of the lower mold cavity 3005b can be shut off from the outside air.

  Then, as shown in FIG. 10C, the resin 4001 is supplied into the lower mold cavity 3005b. As illustrated, the resin 4001 is placed on the release film 5001. The release film 5001 is adsorbed on the upper surface (cavity surface) of the lower mold cavity 3005b. The resin 4001 is arranged (set) in the lower mold cavity 3005b through the release film 5001. The release film 5001 is adsorbed on the cavity surface of the lower mold cavity 3005b by adsorbing the lower mold suction hole 3006c with a vacuum pump (not shown) and reducing the pressure, as indicated by an arrow 3007 in FIG. Yes. Accordingly, the cavity surface of the lower mold cavity 3005b is covered with the release film 5001. The method for supplying and setting the release film 5001 and the resin 4001 in the lower mold cavity 3005b is not particularly limited, but may be the same as that shown in FIGS. That is, first, a rectangular frame (frame) having a through hole is placed on the release film 5001, and a “resin supply frame” is formed in which the resin 4001 is supplied into the through hole. The “resin supply frame” is conveyed and entered between the upper mold 3003 and the lower mold 3004 (position of the lower mold cavity 3005b). Then, after the release film 5001 is adsorbed to the cavity surface of the lower mold cavity 3005b as described above, only the rectangular frame (frame) is removed. In FIG. 10C, the resin 4001 is shown in a molten state. The resin 4001 may be conveyed between the upper mold 3003 and the lower mold 3004 in the form of a granular resin, for example, as in FIGS. Then, as described above, after the resin 4001 is set in the lower mold cavity 3005b, the lower mold 3004 can be melted by heating.

  Next, the upper and lower molds are clamped. First, as shown in FIG. 10 (D), the lower surface of the metal frame 3001 (the opposite side of the adhesive sheet 3002 application surface) and the upper surface of the lower mold outer peripheral member 3006 covered with the release film 5001 are held at a required interval. Perform intermediate mold clamping to bring it to a finished state. That is, first, the lower mold 3004 side is moved up in the direction of the arrow 3031 from the state of FIG. Accordingly, as shown in FIG. 10D, the upper mold outside air blocking member 3013 and the lower mold outside air blocking member 3021 are closed together with the O-ring 3013b interposed therebetween. In this manner, as shown in the figure, an outside air blocking space portion surrounded by the upper mold 3003, the lower mold 3004, the upper mold outside air blocking member 3013, and the lower mold outside air blocking member 3021 is formed. In this state, as shown by an arrow 3014 in the figure, through the upper mold hole 3012 provided in the upper mold base plate 3011, at least the outside air blocking space is sucked with a vacuum pump (not shown) to reduce the pressure, Set to a predetermined degree of vacuum.

  Further, as shown in FIG. 10 (E), complete clamping is performed by joining the lower surface of the metal frame 3001 and the upper surface of the lower mold outer peripheral member 3006 covered with the release film 5001. That is, the lower mold 3004 is further moved up from the state of FIG. Accordingly, as shown in FIG. 10E, the metal frame 3001 attached (adsorbed) (fixed) to the upper mold 3003 via the adhesive sheet 3002 is attached to the lower mold outer peripheral member via the release film 5001. It is made to contact 3006. Then, by further moving the lower mold base plate 3005, the lower mold cavity bottom member 3005a is further moved upward. At this time, the resin 4001 is in a fluid state. As shown in the figure, the upper surface of the resin 4001 is adhered to the portion of the adhesive sheet 3002 exposed from the through hole 3001a in the metal frame 3001 by the pressing force due to the upward movement of the lower mold cavity bottom member 3005a. At this time, the lower elastic member 3006a and the O-rings 3013a, 3013b, 3021a contract to function as a cushion. In this manner, the resin 4001 is pressurized and compression molded. Then, the resin 4001 is cured. Thereby, as shown to FIG.10 (E)-(H), the plate-shaped member 10 with the protruding electrode in which the protruding electrode 12 was formed in the single side | surface of the plate-shaped member 11 can be shape | molded.

  The steps shown in FIGS. 10E to 10H can be performed as follows, for example. That is, first, from the state shown in FIG. 10E, after the time required for curing the resin 4001 has elapsed, the vacuum pump is stopped and suction is performed through the upper mold hole 3012 provided in the upper mold base plate 3011. Release the vacuum (evacuation). At this time, the pressure reduction (evacuation) of the gap between the lower mold cavity bottom member 3005a and the lower mold outer peripheral member 3006 may be released, but without releasing the release film 5001 to the lower mold cavity bottom member 3005a. It is preferable to leave it adsorbed. This is because the step of releasing (releasing) the plate-like member 10 with protruding electrodes from the release film 5001 is easier in the following. Next, the lower mold 3004 (lower mold cavity bottom member 3005a, lower mold outer circumferential member 3006, and lower mold elastic member 3006a) is lowered together with the lower mold base plate 3005 in the direction of the arrow 3032. As a result, the inside of the outside air blocking space surrounded by the upper mold 3003, the lower mold 3004, the upper mold outside air blocking member 3013 and the lower mold outside air blocking member 3021 is opened to release the pressure reduction. As a result, the upper mold 3003 and the lower mold 3004 are opened as shown in FIG. And as shown in the figure, the plate-like member 10 with the protruding electrode is separated from the release film 5001 in a state where the surface opposite to the protruding electrode 12 fixing surface of the plate-like member 11 is adhered to the adhesive sheet 3002 ( Is released).

  And the pressure reduction (evacuation) by the suction from the suction hole (not shown) of the upper mold 3003 is released. Thereby, as shown in FIG. 10G, the adhesive sheet 3002 is taken out from the upper mold 3003 together with the metal frame 3001 and the plate-like member 10 with protruding electrodes. Furthermore, as shown in FIG. 10H, the plate-like member 10 with protruding electrodes (plate-like member 11) is peeled off from the adhesive sheet 3002 and the metal frame 3001. As described above, the plate-like member 10 with protruding electrodes can be manufactured. Note that a release agent (for example, a fluorine-based release agent, but not limited to it) is applied in advance to the inner periphery of the metal frame 3001 (the portion around the through hole 3001a and in contact with the plate-like member 11). May be. Thereby, the releasability with respect to the plate-shaped member 11 becomes high, and it becomes easy to remove the plate-shaped member 10 with a protruding electrode.

  Moreover, the material for forming the plate-like member 10 with protruding electrodes is not particularly limited, and may be, for example, a conductive resin or a non-conductive resin. Although the said conductive resin is not specifically limited, For example, the mixture of resin and electroconductive particle may be sufficient. Although the said electroconductive particle is not specifically limited, For example, a metal particle etc. are mentioned. The metal in the metal particles is not particularly limited, and examples thereof include gold, silver, copper, nickel, tin, other arbitrary metals, and alloys containing two or more thereof. In addition, for example, after the molding step with the molding die, a conductive film is formed on the surface on the protruding electrode side of the plate-like member with the protruding electrode formed of the conductive resin or nonconductive resin (particularly, nonconductive resin). May be attached. Although the said electroconductive film is not specifically limited, For example, films | membranes, such as a metal, are mentioned. The metal in the conductive film is not particularly limited, and examples thereof include gold, silver, copper, nickel, tin, and an alloy containing two or more thereof. The method for forming the conductive film is not particularly limited, and examples thereof include plating, coating, sputtering, and vapor deposition. The plating may be, for example, electroless plating or electrolytic plating.

  Moreover, the manufacturing method of the plate-shaped member with a projection electrode using compression molding is not limited to this example (FIG. 10 (A)-(H)), It can change suitably. For example, in this example, the metal frame 3001 having the through hole 3001a is attached to the adhesive sheet 3002, but a metal plate or a resin sheet having no through hole may be used instead. For example, the metal plate or the resin sheet may be attached to the upper mold 3003 without using the adhesive sheet 3002 with an adhesive or by suction (decompression) using a vacuum pump. In addition, the metal plate or the resin sheet has a release agent (not particularly limited, for example, a fluorine-based release agent) in advance in order to improve the release property from the plate-like member with protruding electrodes and facilitate separation. May be applied.

  Next, an example of manufacturing a plate-like member with protruding electrodes by transfer molding will be described.

  The cross-sectional view of FIG. 11 schematically shows an example of a method for manufacturing the plate-like member with protruding electrodes 10 in which the protruding electrodes 12 are fixed to one surface of the plate-like member 11. As described above, this manufacturing method is a manufacturing method using transfer molding.

  As shown in FIG. 11, this manufacturing method can be performed using a general mold 6000 for transfer molding. As shown in the figure, the mold 6000 is formed of an upper mold 6001 and a lower mold 6002. A mold cavity 6003 for resin molding is provided on the mold surface of the upper mold 6001, and an adhesive sheet 3002 with a metal frame 3001 attached to the mold surface of the lower mold 6002 is used. A set unit 6004 is provided. Further, the upper mold cavity 6003 has a shape corresponding to the unevenness of the plate-like member 11 and the protruding electrode 12 (the unevenness is inverted) as shown in the figure.

  The upper mold 6001 is provided with a resin passage (hole) 6005 for supplying a resin material. A resin pressurizing pot 6006 and a plunger 6007 are connected to the resin passage 6005.

  The transfer molding method using the apparatus of FIG. 11 is not particularly limited, and may be performed according to a general transfer molding method. That is, first, as shown in the drawing, an adhesive sheet 3002 having a metal frame 3001 attached to a set part 6004 of a mold surface (upper surface) of the lower mold 6002 is placed on the metal frame 3001 on the upper side (opposite to the mold surface of the lower mold 6002). Set the supply with the Further, a resin material such as a resin tablet or a liquid resin (for example, a thermosetting resin) is supplied into the pot 6006. Then, the upper and lower molds 6001 and 6002 are clamped. Next, the resin is heated and melted in the pot 6006, and the molten resin 4001 in the pot 6006 is pressurized by the plunger 6007, so that the resin passage 6005 of the upper mold 6001 enters the mold cavity 6003 of the upper mold 6001. It is comprised so that molten resin can be inject | poured. At this time, a required resin pressure can be applied to the resin in the mold cavity 6003 by the plunger 6007.

  After the elapse of the time required for curing, the upper and lower molds 6001 and 6002 are opened so that the protruding electrode 12 is fixed to one surface of the plate-shaped member 11 in the mold cavity 6003. Can be molded.

  The transfer molding conditions and the like are not limited to the conditions shown in FIG. 11 and can be arbitrarily changed. For example, in order to improve the releasability of the upper mold 6001 (easiness of separation from the plate-like member 10 with protruding electrodes after molding), for example, the mold cavity 6003 of the upper mold 6001 may be covered with a release film The ejector pins may be provided on the upper mold 6001. For example, in FIG. 11, the metal frame 3001 and the mold cavity 6003 face upward, but the structure may be reversed so that the metal frame 3001 and the mold cavity 6003 face downward. That is, the mold cavity 6003 may be provided in the lower mold 6002 instead of the upper mold 6001, and the set portion 6004 may be provided in the upper mold 6001 instead of the lower mold 6002.

  Further, at the time of molding in transfer molding, for example, transfer molding may be performed by setting the inside of a mold cavity or the like to a predetermined degree of vacuum. The method for setting the predetermined degree of vacuum is not particularly limited, and for example, a general transfer molding method may be used.

  The apparatus used for the transfer molding is not particularly limited, and may be the same as, for example, a general transfer molding apparatus. Moreover, the specific conditions of the resin sealing step are not particularly limited, and may be the same as, for example, general transfer molding.

  Below, the example of the manufacturing method of the electronic component using the plate-shaped member with a projection electrode of this invention is demonstrated. In this embodiment, an example in which an electronic component is manufactured by transfer molding will be described.

  An example of a method for manufacturing the electronic component in FIG. 12 is schematically shown in the cross-sectional view in FIG. As described above, this manufacturing method is a manufacturing method using transfer molding. In addition, the case where the protruding electrode 12 has a deformed portion 12A will be described.

  As shown in FIG. 13, this manufacturing method can be performed using a general mold 50 for transfer molding. As illustrated, the mold 50 is formed of an upper mold 51 and a lower mold 52. A mold cavity 56 for resin molding is provided on the mold surface of the upper mold 51, and a substrate setting portion 57 for supplying and setting the substrate 21 on which the chip 31 and the wiring pattern 22 are provided is provided on the mold surface of the lower mold 52. It is provided and configured.

  The lower mold 52 is provided with a pot (hole) 54 for supplying a resin material, and a plunger 53 for pressurizing the resin is fitted in the pot.

  The transfer molding method using the apparatus of FIG. 13 is not particularly limited, and may be performed according to a general transfer molding method. That is, first, a resin material such as a resin tablet or liquid resin (for example, thermosetting resin) is supplied into the pot 54, and the substrate 21 is supplied and set in the substrate setting portion 57. The mold 52 is clamped. At this time, as shown in FIG. 13, the protruding electrode 12 contracts in a direction perpendicular to the surface direction of the plate-like member 11 when the deformable portion 12 </ b> A is bent. Thereby, the protruding electrode 12 follows the predetermined thickness of the resin-encapsulated component. Next, the resin is heated and melted in the pot 54, and the molten resin 41 in the pot 54 is moved upward from the pot 53 of the lower mold 52 by pressurizing the plunger 53 to press the resin passage (cal, The molten resin can be injected into the mold cavity 56 of the upper mold 51 through the runner 55 (gate) 55. At this time, a required resin pressure can be applied to the resin in the mold cavity 56 by the plunger 53.

  After the time required for curing has elapsed, the upper die 51 and the lower die 52 are opened to seal and mold the chip 31 and the like in a package (resin molding) corresponding to the shape of the cavity in the die cavity 56. (See the electronic component 20 shown in FIG. 12).

  In the present embodiment, the manufacturing method shown in FIG. 13 (manufacture of the electronic component 20 shown in FIG. 12) can be performed as follows, for example. That is, first, the substrate 21 provided with the chip 31 and the wiring pattern 22 is arranged on the mold surface (substrate setting portion) of the lower mold 52 at a position corresponding to the mold cavity of the upper mold 51, and on the substrate 21. The plate-like member 11 and the protruding electrode 12 are arranged so as to have the same positional relationship as the finished electronic component 20 (FIG. 12). At this time, as shown in FIG. 13, the side opposite to the chip 31 arrangement side of the substrate 21 is in contact with the lower mold 52, and a plate-like member with protruding electrodes (plate-like member 11 and The protruding electrode 12) is placed, and the wiring pattern 22 and the tip of the protruding electrode 12 are physically and electrically connected.

  The substrate 21, the chip 31, the plate-like member 11, and the protruding electrode 12 may be placed on the mold surface of the lower mold 52 with the top and bottom reversed with respect to FIG. That is, the surface of the plate-like member 11 opposite to the surface on which the protruding electrode 12 is formed may be in contact with the lower mold 52, and the substrate 21 and the chip 31 may be disposed on the surface on which the protruding electrode 12 is formed.

  Next, as shown in FIG. 13, the upper mold 51 and the lower mold 52 are clamped. At this time, the upper die 51 is placed on the lower die 52, and the substrate 21, chip 31, plate member 11 and protruding electrode 12 are accommodated in the upper die cavity, and the plate member 11 is placed on the top surface of the die cavity. It will abut. At this time, as described above, the protruding electrode 12 contracts in the direction perpendicular to the surface direction of the plate-like member 11 by bending the deformable portion 12A in the process of clamping. Thereby, the protruding electrode 12 follows the thickness of the electronic component.

  In this state, as shown in FIG. 13, the resin 41 is further injected by the plunger 53 from the pot 54 of the lower mold 52 into the mold cavity of the upper mold 51 through the resin passage 55. Thereby, the chip 31 disposed on the substrate 21 is resin-sealed together with the plate-like member 11 and the protruding electrode 12. In this way, the electronic component 20 shown in FIG. 12 can be manufactured.

  When the resin is injected into the mold cavity 56, the resin (molten resin) 41 flows between the protruding electrodes 12 or flows through the holes 12 b of the protruding electrodes 12 in the mold cavity 56. Can do.

  In the above description, the method of clamping the mold after placing both the substrate and the plate-like member with protruding electrodes on the mold surface of the lower mold has been described. However, the present invention is not limited to this. For example, the substrate 21 is supplied and set on the mold surface of the lower mold 52, the plate-like member with protruding electrodes (plate-like member 11) is mounted on the mold cavity top surface of the upper mold 51, and the upper mold 51 and the lower mold 52 are attached. The mold may be clamped and the resin injected into the mold cavity. At this time, as described above, the positions of the plate-like member 11 and the substrate 21 may be turned upside down.

  Further, at the time of molding (resin sealing) in transfer molding, for example, transfer molding may be performed by setting the inside of a mold cavity or the like to a predetermined degree of vacuum. The method for setting the predetermined degree of vacuum is not particularly limited, and for example, a general transfer molding method may be used.

  The apparatus used for the transfer molding is not particularly limited, and may be the same as, for example, a general transfer molding apparatus. Moreover, the specific conditions of the resin sealing step are not particularly limited, and may be the same as, for example, general transfer molding.

  In order to make the connection between the protruding electrode 12 and the wiring pattern 22 more reliable, solder may be inserted between the protruding electrode 12 and the wiring pattern 22 in advance. In this case, for example, after the resin sealing step, the solder may be melted by reflow or the like, and the protruding electrode 12 and the wiring pattern 22 may be joined. The same applies to the following embodiments.

  Further, FIG. 13 illustrates the case where the protruding electrode 12 has the deformed portion 12A. However, when the protruding electrode 12 does not have the deformed portion 12A, an electronic component can be manufactured in the same manner except that the protruding electrode 12 does not shrink. . However, if the projecting electrode 12 has the deformed portion 12A, it is not necessary to design the height of the projecting electrode 12 in advance according to the resin thickness of the electronic component, so both the via electrode (projecting electrode) and the plate-like member are provided. Electronic components can be easily and efficiently manufactured. The same applies to each embodiment described later (when an electronic component is manufactured by compression molding).

Further, according to the present invention, it is not necessary to make a via formation hole (groove or hole) in the resin in order to form the via electrode. For this reason, for example, the following effects (1) to (5) are obtained. However, these effects are examples and do not limit the present invention.

(1) Since there is no need to make a via formation hole in the resin, the depth of the via formation hole is correct on the wiring pattern of the substrate due to variations in the thickness of the resin-encapsulated chip (package). There is no such thing as being not properly formed.
(2) Since there is no need to make a via formation hole in the resin, the filler contained in the resin material does not remain on the wiring pattern of the substrate.
(3) Since there is no need to make a via formation hole in the resin, the wiring pattern on the substrate on which the chip is mounted is not damaged.
(4) Since there is no need to make via formation holes in the resin, the manufacturing conditions of the electronic component are not affected by the filler density of the resin material.
(5) Due to the effects of (1) to (4) above, electronic parts can be manufactured easily and efficiently, and the yield is good. Further, since the connection between the wiring pattern of the substrate and the protruding electrode (via electrode) becomes good, it contributes to the improvement of the performance of the electronic component or the reduction of the defective product occurrence rate.

  Next, another embodiment of the present invention will be described with reference to FIGS. In the present embodiment, an example of a method for manufacturing the electronic component using compression molding will be described. Note that the protruding electrode of the plate-like member with the protruding electrode used in this example has a deformed portion. However, as described in Example 3, even when the protruding electrode does not have a deformed portion, it can be manufactured similarly except that the protruding electrode is not deformed (does not shrink).

  First, a compression molding apparatus (electronic component manufacturing apparatus) is prepared. FIG. 14 is a sectional view showing the structure of a part of a molding die that is a part of the compression molding apparatus. As shown in the figure, the compression molding apparatus includes an upper mold 101, a lower mold 111, and an intermediate mold (intermediate plate) 102 as main components. The lower mold 111 includes a lower mold cavity bottom member 111a and lower mold outer peripheral members (lower mold main bodies) 112 and 113. Lower mold outer peripheral members (lower mold main bodies) 112 and 113 are frame-shaped lower mold cavity side members. More specifically, the lower mold outer peripheral member 112 is disposed so as to surround the lower mold cavity bottom surface member 111a, and the lower mold outer peripheral member 113 is further disposed so as to surround the outer periphery of the lower mold outer peripheral member 112. ing. Between the lower mold cavity bottom member 111a and the lower mold outer peripheral member 112, there is a gap (suction hole) 111c. Between the lower mold outer peripheral member 112 and the lower mold outer peripheral member 113, there is a gap (adsorption hole) 111d. As will be described later, these gaps 111c and 111d can be depressurized by a vacuum pump (not shown) to adsorb a release film or the like. The height of the upper surface of the lower mold outer peripheral member 112 is higher than the height of the upper surfaces of the lower mold cavity bottom surface member 111a and the lower mold outer peripheral member 113. Thus, a lower mold cavity (concave portion) 111b surrounded by the upper surface of the lower mold cavity bottom surface member 111a and the inner peripheral surface of the lower mold outer peripheral member 112 is formed. The upper mold 101 has a hole (through hole) 103. As will be described later, at least the inside of the lower mold cavity 111b can be depressurized by suctioning from the hole 103 with a vacuum pump (not shown) after clamping. The intermediate mold (intermediate plate) 102 has a frame shape (annular shape), and is disposed so as to be positioned directly above the lower mold outer peripheral member 113. The release film 100 can be gripped and fixed between the lower surface of the intermediate mold 102 and the upper surface of the lower mold outer peripheral member 113. An elastic O-ring 102 a is attached to the peripheral edge of the upper surface of the intermediate mold 102. Further, as shown in the figure, this compression molding apparatus has rolls 104 on both the left and right sides of the figure. Then, both ends of one long release film 100 are wound around the left and right rolls 104, respectively. With the left and right rolls 104, it is possible to feed the release film 100 from right to left in FIG. 14 or from left to right. Thereby, as will be described later, the plate-like member with protruding electrodes can be transported to the position of the lower mold cavity while being placed on the release film 100. In other words, the roll 104 corresponds to a transport unit that transports the plate-like member with protruding electrodes to the position of the mold cavity of the mold. Moreover, although not shown in figure, this compression molding apparatus (electronic component manufacturing apparatus) further includes a resin placing means. The resin placing means places resin on the protruding electrode forming surface of the plate-like member with protruding electrodes.

  Next, as shown in FIG. 14, the substrate 21 on which the chip 31 is fixed on one side is fixed to the lower surface of the upper mold 101 by the clamper 101a. At this time, the chip 31 forming surface of the substrate 21 is directed downward. The substrate 21 and the chip 31 are the same as in the first embodiment, and the wiring pattern 22 is formed on the substrate 21 as in the first embodiment. Further, as shown in the figure, the resin placing means places a resin material (resin) 41a on the protruding electrode 12 fixing surface of the plate-like member 11 (resin placing step). The plate-like member 11, the protruding electrode 12, and the resin 41 are the same as in the first embodiment. The form of the resin material 41a is not particularly limited, but it is preferable that the resin material 41a is not spilled from the fixed surface of the protruding electrode 12 of the plate-like member 11 in the resin placing step. For example, in the resin placing step, the sheet-shaped resin material 41a may be laminated (laminated) on the fixed surface of the protruding electrode 12 of the plate member 11 and pressed. Further, as illustrated, the plate-like member 11 on which the resin material 41 a is placed is placed on the release film 100. At this time, as shown in the drawing, the release material 100 is such that the surface on which the resin material 41a of the plate-like member 11 is placed (projection electrode 12 formation surface) faces upward (that is, the surface opposite to the projection electrode 12 formation surface). Touch the top surface). Although not shown, a pressure-sensitive adhesive (adhesive layer) exists between the upper surface of the release film 100 and the plate-like member 11, and the plate-like member 11 becomes upper surface of the release film 100 by the pressure-sensitive adhesive (adhesive layer). It may be fixed to. Thus, the presence of the pressure-sensitive adhesive (adhesive layer) is preferable because, for example, even if the plate-like member 11 has a hole, the resin 41 hardly leaks from the hole. Further, as shown in FIG. 14, the transporting means transports the resin material 41 a to the position of the lower mold cavity 111 b together with the plate member 11, the protruding electrode 12, and the release film 100.

  Next, as indicated by an arrow 114 in FIG. 15, the gap (gap 111c) between the lower mold cavity bottom member 111a and the lower mold outer peripheral member 112 is reduced in pressure by a vacuum pump (not shown). At the same time, the gap (gap 111d) between the lower mold outer peripheral member 112 and the lower mold outer peripheral member 113 is depressurized by a vacuum pump (not shown) as indicated by an arrow 115 in FIG. Further, the intermediate mold 102 is lowered together with the O-ring 102 a, and the release film 100 is gripped between the lower surface of the intermediate mold 102 and the upper surface of the lower mold outer peripheral member 113. Thus, the release film 100 is fixed to the upper surfaces of the lower mold outer peripheral member 112 and the lower mold outer peripheral member 113. Further, the release film 100 can be coated on the surface of the lower mold cavity 111b with the reduced pressure 114 in the lower mold cavity 111b. By doing so, as illustrated, the resin material 41a can be placed on the cavity surface of the lower mold cavity while being placed on the plate-like member 11.

  Next, the resin sealing step is performed as shown in FIGS. In FIG. 16, the clamper 101a is not shown for convenience.

  That is, first, as shown in FIG. 16, the lower mold 111 (the lower mold cavity bottom member 111a and the lower mold outer peripheral members 112 and 113) is raised together with the intermediate mold 102 and the O-ring 102a for shutting out the outside air. At this time, by joining the mold surface of the upper mold 101 and the upper surface side of the O-ring 102a, at least the inside of the lower mold cavity 111b is set to the outside air blocking state, and the outside air blocking space is formed in the upper and lower middle molds (three-sheet mold). Can be formed. In this state, as indicated by an arrow 107, at least the inside of the lower mold cavity 111 b (inside the outside air blocking space) can be sucked through the hole 103 of the upper mold 101 with a vacuum pump (not shown) to reduce the pressure. Further, the lower mold 111 and the intermediate mold 102 are raised together. At this time, the upper surface (lower mold 111) of the lower mold outer peripheral member 112 and the surface of the substrate 21 can be bonded via the release film 100.

  Next, the lower mold cavity bottom member 111a is raised. At this time, as shown in FIG. 16, the resin material (resin) 41a is kept in the state of a fluid resin (resin) 41b by heating or the like. Thus, first, the chip 31 is immersed in the fluid resin 41b in the lower mold cavity 111b, and then the fluid resin 41b in the lower mold cavity 111b can be pressurized by the lower mold cavity bottom member 111a. Accordingly, as shown in FIG. 17, the chip 31 (including the protruding electrodes and the wiring pattern 22) mounted on the substrate 21 in the lower mold cavity 111b is compression-molded (resin) in a sealing resin (resin) 41 made of a cured resin. And forming a molded package (resin molded body) corresponding to the shape of the lower mold cavity 111b. At this time, the plate-like member 11 is in a state of being mounted on the top surface side opposite to the substrate 21 of the molded package. At this time, there may be a slight clearance (gap) between the substrate 21 and the release film 100.

  As described above, as indicated by the arrow 107, at least the inside of the lower mold cavity 111 b is sucked with a vacuum pump (not shown) through the hole 103 of the upper mold 101 to reduce the pressure. In this state, the fluid resin 41b is compression-molded together with the plate member 11, the protruding electrode 12, the chip 31, and the substrate 21, and the chip 31 is resin-sealed. At this time, the entire protruding electrode 12 is relatively pressed in the vertical direction by the pressing force caused by the protruding electrode 12 coming into contact with the wiring pattern 22 of the substrate 21. By this pressing, as shown in the drawing, the protruding portion 12 of the protruding electrode 12 designed to be higher than the thickness of the fluid resin 41b is bent. Thereby, the protruding electrode 12 contracts in the direction perpendicular to the surface direction of the plate-like member 11 (that is, the length in the direction perpendicular to the surface direction becomes shorter), and follows the predetermined thickness of the resin-encapsulated component. At this time, the protruding electrode 12 is brought into contact with the wiring pattern 22 formed on the substrate 21. Furthermore, the fluid resin 41b is cured to form a sealing resin (resin) 41 made of a cured resin as shown in FIG. In this way, the “resin sealing step” can be performed to manufacture an electronic component.

  As described above, when the chip 31 is immersed in the resin in the lower mold cavity 111b, the resin is in the state of a fluid resin 41b having fluidity. The fluid resin 41b may be, for example, a liquid resin (thermosetting resin before curing), or a solid resin such as a granule, a powder, or a paste is heated and melted. It may be in a molten state. The resin material 41a can be heated, for example, by heating the lower cavity bottom member 111a. Further, for example, when the resin material 41a is a thermosetting resin and has fluidity (that is, already in the state of the fluid resin 41b), the resin material 41a (fluid resin in the lower mold cavity 111b). 41b) may be heated and pressurized to thermally cure. Thereby, the chip | tip 31 can be resin-sealed and molded (compression molding) in the resin molding (package) corresponding to the shape of a lower mold | type cavity. If it does in this way, it is also possible to form in the state which exposed the plate-shaped member 11 on the upper surface (surface on the opposite side to a board | substrate) of a resin molding (package), for example.

  After compression molding (resin sealing), that is, after the fluid resin 41b is cured to form the sealing resin 41, the gap between the lower mold cavity bottom surface member 111a and the lower mold outer peripheral member 112 as shown in FIG. Release the vacuum (evacuation). Conversely, as indicated by the arrow 116, air may be fed into the gap. Next, the lower mold 111 (the lower mold cavity bottom member 111a and the lower mold outer peripheral members 112 and 113) is lowered together with the intermediate mold 102 and the O-ring 102a. Thereby, the inside of the lower mold cavity 111b is opened to release the pressure reduction. Thereby, the release film 100 leaves | separates from the upper surface of the lower mold cavity bottom face member 111a as shown in the figure. At this time, the pressure reduction (evacuation) of the gap between the lower mold outer peripheral members 112 and 113 is not released. Further, the intermediate mold 102 holds the release film 100 together with the lower mold outer peripheral member 113. For this reason, the release film 100 continues to be adsorbed (fixed) on the upper surfaces of the lower mold outer peripheral members 112 and 113 as shown in the figure. The substrate 21 is continuously fixed to the lower surface (mold surface) of the upper mold 101 by the clamper 101a. Since the sealing resin 41 and the plate-like member 11 are compression-molded together with the substrate 21 and the chip 31, when the lower mold 111 is lowered, the substrate 21, the plate-like member 11, the protruding electrode 12, the chip 31 and the sealing member are sealed. The release film 100 is peeled from the electronic component formed by the resin 41. Then, the release film 100 is fed out (rolled up) by the roll 104 in the right or left direction in the figure.

  In the present invention, for example, as shown in the present embodiment, when the resin sealing of the chip is performed, the protruding electrode 12 is contained in the fluid resin 41b (molten resin or liquid resin) in the lower mold cavity 111b. The whole exists. In this state, when the lower cavity bottom member 111a is moved upward as described above, the tip of the protruding electrode 12 and the wiring pattern 22 of the substrate 21 are physically contacted and connected in the fluid resin 41b. Is done. By doing so, for example, compared to a method of forming a via formation hole after resin sealing of the chip, the tip of the protruding electrode and the wiring pattern of the substrate are easily in contact with each other without entering the resin therebetween. . That is, the electrical connection between the protruding electrode and the wiring pattern of the substrate tends to be advantageous. This is advantageous in terms of shielding performance when the plate-like member is a shield plate, for example. Further, as described above, the protruding electrode 12 may not have the deformed portion 12A. However, if the deformed portion 12A is provided, the height of the protruded electrode 12 is strictly matched to the thickness of the finished electronic component. This is preferable because it is not necessary to design. For example, instead of or in addition to the bending portion of the lightning bolt (zigzag) being bent, as shown in FIGS. 3 (A) to (D) or FIGS. 4 (A) to (D), the protruding electrode 12 It may be possible to shrink (the height decreases). That is, even when the height of the protruding electrode 12 is slightly higher than the thickness of the resin 41, when the tip of the protrusion 12c comes into contact with the wiring pattern 22, the protrusion 12c elastically moves (lowers) to the gap on the hole 12b side. ), The protruding electrode 12 can be shrunk. Accordingly, as described above, the height of the protruding electrode 12 can be adjusted in accordance with the resin thickness (package thickness) of the electronic component.

  Next, FIGS. 18 to 19 will be described. 14 to 17, a “resin placing process” is performed in which the resin material 41 a is placed on the plate-like member 11, and then a “conveying process” in which the plate-like member with protruding electrodes is conveyed to the position of the mold cavity is performed. The method was explained. However, as described above, the order of the resin placing process and the transporting process is not particularly limited. FIGS. 18 to 19 show an example of a method for manufacturing the electronic component in which the resin placing step is performed after the carrying step. As shown in the figure, the compression molding apparatus (electronic component manufacturing apparatus) used in this method is the same as the compression molding apparatus (electronic component manufacturing apparatus) shown in FIGS. However, in FIGS. 18 to 19, the upper mold 101, the upper mold hole (through hole) 103, the clamper 101 a, the substrate 21, the wiring pattern 22, and the chip 31 are omitted for simplification. The resin supply means 60 is comprised from the resin supply part 61 and the lower shutter 62 as shown in the figure. The resin supply unit 61 has a frame shape in which openings are formed at the upper end and the lower end. The opening at the lower end of the resin supply unit (frame) 61 is closed by a shutter 62. As a result, as shown in FIG. 18, the resin material 41 a can be accommodated in a space surrounded by the resin supply unit (frame) 61 and the lower shutter 62. In this state, as shown in FIG. 18, the resin supply means 60 is made to enter just above the lower mold cavity 111b (in the space between the lower mold 111 and the upper mold 101). Then, as shown in FIG. 19, the lower shutter 62 is pulled to open an opening at the lower end of the resin supply part (frame) 61, thereby dropping the resin material 41a from the opening and supplying (mounting) it into the lower mold cavity 111b. can do. The resin material 41a is a granular resin in FIGS. 18 and 19, but is not particularly limited thereto. Further, in the resin placement step prior to the steps of FIGS. 14 to 17, a resin supply means 60 including a resin supply unit 61 and a lower shutter 62 may be used as in FIGS. 18 to 19.

  In the method shown in FIGS. 18 to 19, first, the same process as FIGS. 14 to 15 is performed except that the resin material 41 a is not placed on the plate-like member 11 in the transporting process. As a result, as shown in FIG. 18, the plate-shaped members with protruding electrodes (the plate-shaped member 11 and the protruding electrodes 12) are in the same state as FIG. 15 except that the resin material 41a is not placed. It is mounted on the cavity surface of 111b (through the release film 100).

  Next, prior to the resin placement step, the plate-like member with protruding electrodes is heated in the lower mold cavity in the state shown in FIG. 18 (heating step). The heating can be performed by, for example, heating the lower cavity bottom member 111a. In this heating step, it is preferable that the plate-like member with protruding electrodes is sufficiently thermally expanded. That is, it is preferable to prevent expansion of the plate-like member with protruding electrodes due to heating in the resin sealing step performed later. Thereby, in the said resin sealing process, position shift with the protruding electrode 12 and the wiring pattern 22 becomes difficult to occur, and it becomes easy to align.

  Further, as shown in FIG. 19, the resin material 41a is placed on the protruding electrode 12 fixing surface of the plate-like member 11 in the lower mold cavity 111b (resin placing step). In this step, for example, the lower shutter 62 is pulled to open the opening at the lower end of the resin supply part (frame) 61, thereby dropping the resin material 41a from the opening and supplying (mounting) it in the lower mold cavity 111b. Thereafter, the resin sealing step is performed in the same manner as in FIGS. In addition, although the resin material 41a is a granular resin in FIG. 19, it is not limited to this. For example, the resin material 41a is a thermoplastic resin (for example, granule resin, powder resin, etc.), and the resin material 41a is melted by the heat of the plate-like member with protruding electrodes to form a fluid resin 41b, and then cooled. The sealing resin 41 may be solidified. Further, as described above, the resin material 41a is a liquid thermosetting resin before being cured, and may be cured by the heat of the plate-like member with protruding electrodes.

  In the present embodiment, the structure of the compression molding apparatus is not limited to the structure shown in FIGS. 14 to 17, and may be any structure, for example, the same as or similar to the structure of a general compression molding apparatus. Also good. Specifically, the structure of the compression molding apparatus includes, for example, JP2013-187340A, JP2005-225133A, JP2010-069656A, JP2007-125783A, and JP2010. It may be the same as or similar to the structure shown in Japanese Patent No. 0-03542. For example, the compression molding apparatus has the same structure as that shown in FIGS. 2 to 6 of JP2013-187340A (instead of having no intermediate mold, instead of the structure shown in FIGS. May also be used. A compression molding method (electronic component manufacturing method) using such a compression molding apparatus can be performed in the same manner as the method described in the publication, for example. Further, the resin supply means may have an arbitrary configuration in place of the resin supply means 60 of FIGS. For example, the resin supply means may be a resin material distribution means (including a resin material charging means, a weighing means, a hopper, a linear vibration feeder, etc.) described in Japanese Patent Application Laid-Open No. 2010-036542. Or the said resin supply means may be the structure provided with the storage part, the measurement part, the injection | throwing-in part, the supply part, a shutter, a tray, a slit, etc. like the resin supply mechanism of Unexamined-Japanese-Patent No. 2007-125783. Further, for example, a lower mold vertical movement mechanism or the like not shown in FIGS. 14 to 17 may be the same as or similar to the above-mentioned JP-A-2005-225133, JP-A-2010-069656, etc. An elastic member may be connected below the bottom member of the lower mold cavity.

  Further, in this example, a compression molding method was used in which the inside of the lower mold cavity was reduced in pressure. However, the present invention is not limited to this, and other compression molding (compression molding) may be used.

  Further, as described above, the manufacturing method of the present invention is a manufacturing method including the resin sealing step. However, for example, as shown in the present embodiment, other optional steps may be included.

  In this embodiment, as described above, the plate-like member with protruding electrodes is placed on the release film, and in this state, the plate-like member with protruding electrodes is conveyed into the mold cavity of the mold. Thereby, for example, it is easy to simplify the structure of the plate-like member and its conveying means. In the present embodiment, as described above, the resin is placed on the plate-like member with protruding electrodes in a state where the plate-like member with protruding electrodes is placed on the release film. Accordingly, for example, in FIGS. 14 to 17, the contact between the resin (the resin material 41 a, the fluid resin 41 b and the sealing resin 41) and the lower mold cavity bottom member 111 a, and the lower mold 111 and the lower mold outer peripheral member 112 It is possible to prevent the resin from entering the voids.

  In addition, in this invention, the means (mechanism) which conveys the said plate-shaped member with a projection electrode (The state which mounted resin, or the state which is not mounted) is not limited to the structure of FIGS. A conveying means (conveying mechanism) having an arbitrary configuration may be used. For example, although the shape of the said release film is a release film which rolled the long release film in FIGS. 14-17, it is not limited to this. For example, the shape of the release film may be any shape such as a short release film, a long release film, and a roll release film. For example, a long release film or a roll release film may be cut (pre-cut) into a short release film before being subjected to the production method of the present invention. In the case of using a pre-cut release film, the transport step (the step of transporting the plate-like member with protruding electrodes to the position of the mold cavity of the mold) is, for example, FIG. 1 of JP 2013-187340 A and its You may carry out similarly to description.

  Next, still another embodiment of the present invention will be described. In the present embodiment, still another example of a method for manufacturing an electronic component using compression molding will be described.

  20 to 23 schematically illustrate the manufacturing method of this example. As illustrated, this example differs from Example 5 (FIGS. 14 to 17) in that the release film 100 is not used and the shape of the plate-like member 11 is different.

  In the present embodiment, the peripheral portion of the plate-like member 11 is raised and the central portion is a resin housing portion. More specifically, as shown in the drawing, the peripheral portion of the plate-like member 11 is raised to the protruding electrode 12 fixing surface side of the plate-like member 11 to form the wall-like member 11b. Thereby, the center part of the plate-shaped member 11 forms the resin accommodating part 11c. That is, the plate-like member 11 has a tray shape (a box shape with an open upper surface) by the peripheral edge thereof being raised to form the wall-like member 11b. And the center part of the plate-shaped member 11 forms the resin accommodating part (the said tray-shaped recessed part) 11c enclosed by the main body (bottom part) and the wall-shaped member (peripheral part) 11b of the plate-shaped member 11. ing. In addition, the protruding electrode 12 is being fixed to the surface at the side of the said resin accommodating part (recessed part) 11c in the plate-shaped member 11 main body (bottom part) as shown in the figure. The wall-shaped member 11 b is a part of the plate-shaped member 11 and is different from the protruding electrode 12. The wall-shaped member 11b may have a function as, for example, a heat dissipation member or a shield member that shields electromagnetic waves. When the plate-like member 11 includes the wall-like member 11b, the shape of the protruding electrode 12 is not particularly limited and is arbitrary. For example, it is preferable that at least one of the protruding electrodes 12 is the plate-like protruding electrode. In this embodiment, because of the resin accommodating portion 11c, the contact between the resin (the resin material 41a, the fluid resin 41b, and the sealing resin 41) and the lower mold cavity bottom member without using a release film, It is possible to suppress or prevent the resin from entering the gap between the lower mold outer peripheral member and the lower mold cavity bottom member. For this reason, since the cost reduction by omission of a release film and the process of sticking or adsorbing the release film can be omitted, the manufacturing efficiency of electronic parts is improved.

  In this example, as shown in FIGS. 20 to 23, the compression molding apparatus including the mold (upper mold and lower mold) is the same as that of Example 5 except that it does not have a release film roll and an intermediate mold. be able to. Specifically, as shown in the figure, the compression molding apparatus has an upper mold 1001 and a lower mold 1011 as main components. The lower mold 1011 includes a lower mold cavity bottom member 1011 a and a lower mold outer peripheral member (lower mold main body) 1012. The lower mold outer peripheral member (lower mold main body) 1012 is a frame-shaped lower mold cavity side member. More specifically, the lower mold outer peripheral member 1012 is disposed so as to surround the lower mold cavity bottom surface member 1011a. Between the lower mold cavity bottom member 1011a and the lower mold outer peripheral member 1012 is a gap (adsorption hole) 1011c. The gap 1011c can be depressurized with a vacuum pump (not shown) as shown by an arrow 1014 in FIGS. 21 and 22 to adsorb the plate-like member. Further, after compression molding, as indicated by an arrow 1016 in FIG. 23, it is possible to feed air in reverse from the gap 1011c to detach the plate-like member. The height of the upper surface of the lower mold outer peripheral member 1012 is higher than the height of the upper surface of the lower mold cavity bottom member 1011a. Thus, a lower mold cavity (concave portion) 1011b surrounded by the upper surface of the lower mold cavity bottom surface member 1011a and the inner peripheral surface of the lower mold outer peripheral member 1012 is formed. Further, a hole (through hole) 1003 is opened in the upper mold 1001. As a result, as indicated by an arrow 1007 in FIG. 22, at least the inside of the lower mold cavity 1011b can be depressurized by suction from the hole 1003 with a vacuum pump (not shown) after clamping. An elastic O-ring 1012 a is attached to the peripheral edge of the upper surface of the lower mold outer peripheral member 1012. Further, although not shown, the compression molding apparatus (electronic component manufacturing apparatus) further includes a resin placing means and a conveying means. The resin placing means places resin on the protruding electrode forming surface of the plate-like member with protruding electrodes. The said conveyance means conveys the said plate-shaped member with a protruding electrode to the position of the type | mold cavity of a shaping | molding die.

  As shown in FIGS. 20 to 23, the manufacturing method of this example conveys the plate-like member 11 on which the resin material 41 a is placed in the resin accommodating portion 11 c to the position of the lower die cavity 1011 b without using a release film. To do. Further, instead of adsorbing the release film to the lower mold and the lower mold outer periphery presser, the gap 1011c between the lower mold outer peripheral member 1012 and the lower mold cavity bottom member 1011a is evacuated as shown by an arrow 1014 in FIG. By reducing the pressure with a pump (not shown), the plate member 11 is adsorbed to the lower mold cavity 1011b (the upper surface of the lower mold cavity bottom surface member 1011a and the inner peripheral surface of the lower mold outer peripheral member 1012). Except for these, the manufacturing method of this example (FIGS. 20 to 23) can be performed in the same manner as in FIGS.

  More specifically, the process (resin sealing process) shown in FIGS. 22 to 23 can be performed as follows, for example. That is, first, the lower mold 1011 is moved upward from the state shown in FIG. 21, and the mold surface of the upper mold 1001 is brought into contact with the upper end of the lower mold O-ring 1012a. At this time, a predetermined interval is maintained between the upper mold surface (the mold surface of the upper mold 1001) and the lower mold surface (the mold surface of the lower mold 1011). That is, prior to complete mold clamping between the upper mold 1001 and the lower mold 1011, intermediate mold clamping is performed with a predetermined interval between them. At the time of intermediate clamping, at least the space between the upper and lower mold surfaces and the cavity space portion can be set to the outside air blocking state by the O-ring 1012a to form the outside air blocking space portion. At this time, as indicated by an arrow 1007 in FIG. 22, the air in the outside air blocking space is forcibly sucked and discharged from the upper mold hole 1003, and the inside of the outside air blocking space is set to a predetermined degree of vacuum. be able to. Next, the upper mold surface (the mold surface of the upper mold 1001) and the lower mold surface (the mold surface of the lower mold 1011) are closed to perform complete mold clamping. Further, the cavity bottom member 1011a is moved up. At this time, as shown in FIG. 22, the resin material 41a is kept in a state of a fluid resin 41b. Thereby, as shown in FIG. 22, the protruding electrode 12 and the wiring pattern 22 are joined, the chip 31 is immersed in the resin 41, and the fluid resin 41b in the lower mold cavity 1011b is further pressurized. Further, as will be described later, the fluid resin 41b is cured to form a sealing resin (resin) 41 made of a cured resin as shown in FIG. As a result, the chip 31 mounted on the substrate 11 can be compression-molded (sealed) in a sealing resin (cured resin) 41 having a required shape. More specifically, as shown in FIG. 23, the chip 31 (including the protruding electrodes and the wiring pattern 22) mounted on the substrate 21 in the lower mold cavity 1011b is placed in a sealing resin (resin) 41 made of a cured resin. The molded package (resin molded body) corresponding to the shape of the lower mold cavity 1011b can be formed by compression molding (resin molding). At this time, the plate-like member 11 is in a state of being mounted on the top surface side opposite to the substrate 21 of the molded package. At this time, the entire protruding electrode 12 is relatively pressed in the direction perpendicular to the surface direction of the plate-like member 11 by the pressing force generated by the upward movement of the cavity bottom member 1011a. By this pressing, as shown in the drawing, the protruding portion 12 of the protruding electrode 12 designed to be higher than the thickness of the fluid resin 41b is bent. Thereby, the protruding electrode 12 shrinks in the direction perpendicular to the surface direction of the plate-like member 11 and follows the predetermined thickness of the resin-encapsulated component. And after progress of the time required for hardening of the fluid resin 41b, as shown in FIG. 23, both upper and lower molds are opened. Specifically, the lower mold 1011 (the lower mold cavity bottom surface member 1011a and the lower mold outer peripheral member 1012) is lowered together with the O-ring 1012a. Thereby, the inside of the lower mold cavity 1011b is opened to release the pressure reduction. At this time, the pressure reduction (evacuation) of the gap between the lower mold cavity bottom member 1011a and the lower mold outer peripheral member 1012 is released. On the contrary, air may be sent into the gap as indicated by an arrow 1016. Thereby, an electronic component (molded product) having the plate-like member 11 having the resin accommodating portion 11c, the substrate 21, the chip 31, the wiring pattern 22, and the protruding electrode 12 can be obtained.

  Moreover, a present Example is not limited to this, For example, you may perform the said resin mounting process after the said conveyance process similarly to FIGS. 18-19 of Example 5. FIG. In this case, it is preferable to heat the plate-like member with protruding electrodes in the lower mold cavity prior to the resin placing step (heating step), as in Example 5. In this heating step, it is preferable that the plate-like member with protruding electrodes is sufficiently thermally expanded for the same reason as in the fifth embodiment.

  In addition, in this invention, the shape of the said plate-shaped member is not limited to the shape of a present Example and Examples 1-5, What kind of shape may be sufficient. For example, the shape of the plate-like member may be the same as the shape of the plate-like member exemplified in Patent Document 2 (Japanese Patent Laid-Open No. 2013-187340) except that the protruding electrode is fixed to one surface. 24 and 25 show an example of a manufacturing method (modified example) in which the shape of the plate member is changed. FIG. 24 is different from FIG. 14 except that the plate-like member 11 has the radiation fins 11a on the surface opposite to the protruding electrode 12 fixing surface (the surface on the side facing the lower mold cavity bottom surface member 111a in FIG. 24). To 17 (Example 5), and can be performed in the same manner as Example 5 using the same compression molding apparatus as in FIGS. FIG. 25 is the same as FIG. 20 except that the plate-like member 11 has the radiation fins 11a on the surface opposite to the protruding electrode 12 fixing surface (the surface on the side facing the lower mold cavity bottom surface member 1011a in FIG. 25). To 23 (Example 6), and can be carried out in the same manner as Example 6 using the same compression molding apparatus as in FIGS. In the compression molding apparatus of FIG. 25, as shown in the figure, an uneven shape capable of fitting with the uneven shape of the radiation fin 11a is formed on the upper surface of the bottom surface 1011a of the lower mold cavity. In this way, there is an advantage that the plate-like member 11 is stabilized in the lower mold cavity, and the upper surface of the lower mold cavity bottom surface member 1011a is not easily damaged by the radiation fins. In addition, as shown in FIG. 25, it is preferable that the radiation fins 11 a have such a shape that no gap is formed between the lower mold outer peripheral member 1012 and the plate-like member 11. In this way, it is easy to effectively perform suction (arrow 1014) by decompression in the lower mold cavity.

  Next, still another embodiment of the present invention will be described with reference to FIGS. In this embodiment, still another example of a method for manufacturing an electronic component will be shown.

  The cross-sectional view of FIG. 26 schematically shows the manufacturing method of this example. As illustrated, this manufacturing method is performed using a lower mold 121, an upper mold (mounter) 122, and a vacuum chamber 123. The upper surface of the lower mold 121 is a flat surface on which a substrate for electronic components can be placed. The vacuum chamber 123 has a cylindrical shape that matches the shape of the electronic component, and can be placed on the substrate of the electronic component. The upper mold 122 can be fitted to the inner wall of the vacuum chamber 123.

  In the manufacturing method of the present embodiment, first, a resin material made of a liquid resin (thermosetting resin) on the chip 31 and the wiring pattern 22 fixing surface of the substrate 21 on which the chip 31 and the wiring pattern 22 are fixed on one side. (Resin) 41a is printed. Next, the protruding electrode 12 of the plate-like member with the protruding electrode in which the protruding electrode 12 is fixed to one surface of the plate-like member 11 is brought into contact with the wiring pattern 22 through the liquid resin 41a. Thereby, the substrate 21, the chip 31, the liquid resin 41a, the plate-like member 11, and the protruding electrode 12 are arranged so as to have the same positional relationship as the finished electronic component 20 (FIG. 12). Then, for example, as shown in FIG. 26, the substrate 21, the chip 31, the liquid resin 41 a, the plate-like member 11, and the protruding electrodes 12 are arranged on the upper surface of the lower mold 121 so as to have the positional relationship (arrangement). At this time, as shown in the figure, the side opposite to the chip 31 arrangement side of the substrate 21 is in contact with the upper surface of the lower mold 121, and the plate-like member with protruding electrodes (the plate-like member 11 and the deforming part) A protruding electrode 12) having 12A is arranged.

  Next, the vacuum chamber 123 is placed on the periphery of the upper surface of the substrate 21 where the liquid resin 41a is not placed (placed). Thereby, the periphery of the chip 31, the resin 41, the plate-like member 11, and the protruding electrode 12 is surrounded by the vacuum chamber 123. Then, the upper mold 122 is lowered from above the chip 31, the liquid resin 41 a, the plate-like member 11, and the protruding electrode 12, and is fitted to the inner wall of the vacuum chamber 123. As a result, the chip 31, the liquid resin 41a, and the protruding electrode 12 are accommodated in the sealed internal space surrounded by the plate member 11, the vacuum chamber 123, and the upper mold 122. Further, the internal space is depressurized by a vacuum pump (not shown). As a result, the chip 31, the liquid resin 41 a, the plate-like member 11, and the protruding electrode 12 are pressed by the upper mold 122. At this time, the protruding electrode 12 having the deformed portion 12 </ b> A contacts the wiring pattern 22 of the substrate 21. Further, the entire protruding electrode 12 is relatively pressed in the direction perpendicular to the surface direction of the plate-like member 11 by the pressing force of the upper mold 122. Due to this pressing, the projecting electrode 12 designed to be higher than the thickness of the liquid resin 41a bends the deformed portion 12A. Thereby, the protruding electrode 12 shrinks in the direction perpendicular to the surface direction of the plate-like member 11 and follows the predetermined thickness of the resin-encapsulated component. In this state, the liquid resin (thermosetting resin) 41 a is heated and cured to seal the chip 31 together with the plate-like member 11 and the protruding electrode 12. The liquid resin 41 a can be heated by, for example, heating the lower mold 121. In this way, an electronic component similar to the electronic component 20 shown in FIG. 12 can be manufactured.

  In this embodiment, for example, the decompression by the vacuum chamber may be omitted. However, for example, when air or a gap between the plate-like member and the resin is not allowed, it is preferable to perform pressure reduction using a vacuum chamber. Moreover, when omitting the pressure reduction by the vacuum chamber, pressing by the upper mold (mounter) may or may not be performed.

  Moreover, the modification of the manufacturing method of a present Example is typically shown in sectional drawing of FIG. In the manufacturing method shown in the figure, a liquid resin (thermosetting resin) 41a is applied to the chip 31 and the wiring pattern 22 fixing surface of the substrate 21 instead of printing. 26 is the same as the manufacturing method of FIG. 26 except that the heat dissipating fins 11a are provided on the surface opposite to the protruding electrode 12 fixing surface (the surface on the side facing the upper mold 122 in the figure). In the manufacturing method of FIG. 26, a plate-like member with protruding electrodes having a radiation fin may be used as in FIG. 27. Conversely, in the manufacturing method of FIG. You may use the plate-like member with a projection electrode which does not. In addition, for example, in FIG. 26 or 27, instead of printing or applying the resin, the resin 41 or the surface of the substrate 21 on the chip 31 and the wiring pattern 22 fixing surface by laminating a sheet resin, spin coating of the resin, or the like. 41a may be arranged.

  Next, still another embodiment of the present invention will be described. In the present embodiment, still another example of a method for manufacturing an electronic component using compression molding will be described.

  In this example, a method for manufacturing an electronic component and a compression molding apparatus (chip resin sealing apparatus) using a pre-cut release film and a rectangular frame (frame) having a through hole (resin supply part) will be described. To do. In this embodiment, the resin material (granular resin) is placed on the plate-like member with protruding electrodes, and is conveyed to the position of the lower mold cavity and supplied and set in the lower mold cavity.

  In this embodiment, a frame is placed on a pre-cut release film, and a plate-like member with protruding electrodes on which a granular resin is placed is placed on the release film in the frame through-hole (resin supply part). Thereby, it can prevent that the said granular resin spills down on the said plate-shaped member with a projection electrode. In this embodiment, the case where the resin material is a granule resin will be described. However, any resin other than the granule resin (for example, a powder resin, a liquid resin, a plate resin, a sheet resin, a film resin, a paste) The same can be done for the resin-like resin).

  Hereinafter, the present embodiment will be described more specifically with reference to FIGS.

  First, the compression molding apparatus (electronic component manufacturing apparatus) in the present embodiment will be described with reference to FIG. FIG. 2 is a schematic view showing a partial structure of a molding die that is a part of the compression molding apparatus. Moreover, the figure has shown the mold open state before supplying resin material to this shaping | molding die.

  The compression molding apparatus of FIG. 28 is the same as Example 6 (FIGS. 20 to 23) in that the molding die includes an upper die and a lower die, but includes an upper die outside air blocking member and a lower die outside air blocking member. The point is different. More specifically, it is as follows. That is, the compression molding apparatus of FIG. 28 includes an upper mold 2001 and a lower mold 2011 disposed opposite to the upper mold as main components as illustrated. The upper mold 2001 is installed in a state of hanging from the upper mold base plate 2002. An upper mold outside air blocking member 2004 is provided at an outer peripheral position of the upper mold 2001 on the upper mold base plate 2002. An O-ring 2004a for blocking outside air is provided on an upper end surface of the upper mold outside air blocking member 2004 (a portion sandwiched between the upper mold base plate 2002 and the upper mold outside air blocking member 2004). In addition, an O-ring 2004 b for blocking outside air is also provided on the lower end surface of the upper mold outside air blocking member 2004. The upper mold base plate 2002 is provided with a hole 2003 for forcibly sucking and discharging the air in the space in the mold. The mold surface (lower surface) of the upper mold 2001 is provided with a substrate setting unit 2001a for supplying and setting (mounting) the substrate 21 on which the chip 31 is mounted with the chip 31 mounting surface side facing downward. The substrate 21 can be mounted on the substrate setting unit 2001a with, for example, a clamper (not shown). Note that the wiring pattern 22 is provided on the chip 31 mounting surface of the substrate 21 as in the above embodiments.

  The lower mold 2011 is formed of a lower mold cavity bottom member 2011a, a lower mold outer peripheral member 2012, and an elastic member 2012a. Further, the lower mold 2011 includes a cavity (lower mold cavity) 2011b which is a space for resin molding on the mold surface. The lower mold cavity bottom member 2011a is provided below the lower mold cavity 2011b. The lower mold outer peripheral member (lower mold frame body, cavity side member) 2012 is disposed so as to surround the lower mold cavity bottom surface member 2011a. The height of the upper surface of the lower mold outer peripheral member 2012 is higher than the height of the upper surface of the lower mold cavity bottom member 2011a. Thus, a lower mold cavity (concave portion) 2011b surrounded by the upper surface of the lower mold cavity bottom surface member 2011a and the inner peripheral surface of the lower mold outer peripheral member 2012 is formed. Between the lower mold cavity bottom member 2011 and the lower mold outer peripheral member 2012, there is a gap (adsorption hole) 2011c. As will be described later, the gap 2011c can be depressurized by a vacuum pump (not shown) to adsorb a release film or the like. The lower mold 2011 (the lower mold cavity bottom member 2011a, the lower mold outer peripheral member 2012, and the elastic member 2012a) is mounted in a state of being placed on the lower mold base plate 2010. The buffering elastic member 2012 a is provided between the lower mold outer peripheral member 2012 and the lower mold base plate 2010. Further, a lower mold outside air blocking member 2013 is provided at the outer peripheral position of the lower mold outer peripheral member 2012 on the lower mold base plate 2010. An O-ring 2013a for blocking outside air is provided on the lower end surface of the lower mold outside air blocking member 2013 (a portion sandwiched between the lower mold base plate 2010 and the lower mold outside air blocking member 2013). The lower mold outside air blocking member 2013 is arranged directly below the upper mold outside air blocking member 2004 and the outside air blocking O-ring 2004b. By having the above configuration, at the time of clamping both the upper and lower molds, by joining the upper mold outside air blocking member 2004 including the O rings 2004a and 2004b and the lower mold outside air blocking member 2013 including the O ring 2013a, at least The inside of the lower mold cavity can be shut off from the outside air.

  Next, a method for manufacturing the electronic component of this example using this compression molding apparatus will be described. That is, first, as shown in FIG. 28, the substrate 21 is mounted on the mold surface (substrate set part 2001a) of the upper mold 2001 as described above. Furthermore, as shown in the figure, granular resin (resin material) 41a is supplied into the lower mold cavity 2011b using a rectangular frame (frame) 70 having a through hole. More specifically, as shown in the drawing, the frame 70 is placed on the release film 100 that has been cut to a required length in advance (precut). At this time, the pre-cut release film 100 may be adsorbed and fixed on the lower surface of the frame 70. Next, a plate-like member with protruding electrodes in which the protruding electrodes 12 are fixed on one surface of the plate-like member 11 is placed on the release film 100 from the opening (resin supply portion) on the upper side of the through hole of the frame 70. To do. At this time, the protruding electrode 12 is directed upward (on the opposite side to the release film 100). In the present embodiment, the plate-like member with protruding electrodes does not have the wall-like member 11b and the resin accommodating portion (concave portion) 11c, as in the fifth embodiment (FIGS. 14 to 17). Further, the granule resin 41a is supplied (placed) on the protruding surface of the plate-like member 11 in a flattened state. In this way, as shown in FIG. 28, the resin 41 is supplied into the space surrounded by the plate-like member 11 and the frame 70, and these form a “resin supply frame” placed on the release film 100. can do. Further, the resin supply frame is transported and entered between the upper mold 2001 and the lower mold 2011 in the mold open state (position of the lower mold cavity 2011b) as shown in FIG.

  Next, the resin supply frame is placed on the mold surface of the lower mold 2011. At this time, as shown in FIG. 29, the release film 100 is sandwiched between the frame 70 and the lower mold outer peripheral member 2012, and the opening (lower mold surface) of the lower mold cavity 2011b is positioned below the through hole of the frame 70. Match the openings. Furthermore, as indicated by an arrow 2014 in the figure, the lower mold suction hole 2011c is suctioned by a vacuum pump to reduce the pressure. Thereby, as shown in the drawing, the release film 100 is adsorbed and coated on the cavity surface of the lower mold cavity 2011b, and the granule resin 41 is supplied and set in the lower mold cavity 2011b. Furthermore, by heating the lower mold 2011, the granular resin 41a is melted as shown in the drawing to obtain a fluid resin 41b. Thereafter, the frame 70 is removed while the release film 100 is adsorbed on the cavity surface of the lower mold cavity 2011b by the reduced pressure 2014.

  Next, the upper and lower molds are clamped. First, as shown in FIG. 30, intermediate mold clamping is performed in which the substrate surface (the surface on which the chip 31 of the substrate 21 is fixed) and the lower mold surface are held at a predetermined interval. That is, first, the lower mold 2011 side is moved up with the frame 70 removed from FIG. As a result, as shown in FIG. 30, the upper mold outside air blocking member 2004 and the lower mold outside air blocking member 2013 are closed together with the O-ring 2004b interposed therebetween. In this manner, as shown in the figure, an outside air blocking space portion surrounded by the upper mold 2001, the lower mold 2011, the upper mold outside air blocking member 2004, and the lower mold outside air blocking member 2013 is formed. In this state, as indicated by an arrow 2007 in the figure, through the hole 2003 of the upper mold base plate 2002, at least the outside air blocking space is sucked with a vacuum pump (not shown) to reduce the pressure and set to a predetermined degree of vacuum. To do.

  Further, as shown in FIG. 31, the substrate surface and the lower mold surface are joined to perform complete mold clamping. That is, the lower mold 2011 is further moved up from the state of FIG. Thereby, as shown in FIG. 31, the upper surface of the lower mold outer peripheral member 2012 is sandwiched between the substrate surface (chip 31 fixing surface) of the substrate 21 supplied and set to the upper mold 2001 via the release film 100. Make contact. Then, the lower mold base bottom plate 2011a is further moved upward by further moving the lower mold base plate 2010 upward. At this time, as described above, the resin is in the state of the fluid resin 41b. As a result, as shown in FIG. 31, the tip of the protruding electrode 12 is brought into contact (contacted) with the wiring pattern 22 of the substrate 21, and the chip 31 is immersed in the fluid resin 41b in the lower mold cavity 2011b. The fluid resin 41b is pressurized. At this time, the entire protruding electrode 12 is relatively pressed in the direction perpendicular to the surface direction of the plate-like member 11 by the pressing force of the lower mold cavity bottom surface member 2011a. By this pressing, as shown in the drawing, the protruding portion 12 of the protruding electrode 12 designed to be higher than the thickness of the fluid resin 41b is bent. Thereby, the protruding electrode 12 shrinks in the direction perpendicular to the surface direction of the plate-like member 11 and follows the predetermined thickness of the resin-encapsulated component. At this time, as illustrated, the elastic member 2012a and the O-rings 2004a, 2004b, 2013a contract to function as a cushion. Thereby, the resin 41 is pressurized and compression-molded as described above. Then, the fluid resin 41b is cured to form a sealing resin. In this manner, the chip 31 is sealed with the sealing resin between the protruding electrode 12 fixing surface of the plate-like member 11 and the wiring pattern 22 forming surface of the substrate 21, and the protruding electrode 12 is connected to the wiring pattern 22. (Resin sealing step). After elapse of the time required for curing the fluid resin 41b, the upper and lower molds are opened in the same procedure as in Example 1, 5 or 6 (FIG. 10F, 17 or 23). Thereby, a molded product (electronic component) including the substrate 21, the chip 31, the wiring pattern 22, the resin (sealing resin) 41, the protruding electrode 12, and the plate-like member 11 can be obtained in the lower mold cavity 2011b.

  In addition, in a present Example, the structure of the compression molding apparatus (electronic component manufacturing apparatus) is not limited to the structure of FIGS. 28-31, For example, it may be the same as that of the structure of a general compression molding apparatus, or according to it. . Specifically, for example, it was shown in JP2013-187340A, JP2005-225133A, JP2010-069656A, JP2007-125783A, JP2010-036542A, and the like. It may be the same as or similar to the structure.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. is there.

  For example, the shape of the protruding electrode in the plate-like member with the protruding electrode is not limited to the shape shown in FIGS. As an example, as described above, at least a part of the protruding electrodes may have a plate shape. Then, on the substrate surface, a required range corresponding to one electronic component (one product unit) may be partitioned by the plate-like electrode.

DESCRIPTION OF SYMBOLS 10 Plate-like member with protruding electrode 10D Mold 10D1, 10D2, 10D3, 10D4 Divided molding 11 Plate-shaped member 11a Radiation fin 11b Wall-shaped member 11c Resin accommodating part 12 Projected electrode 12a Lower part of projected electrode 12 12b Through-hole 12c Projection 12A Deformation part 12D Hole (hole corresponding to the shape of the projection electrode 12)
12D1, 12D2, 12D3, 12D4 Hole corresponding to the shape of a part of the protruding electrode 12 12E Protrusion (protrusion corresponding to the shape of the protruding electrode 12)
20 Electronic components (resin-encapsulated finished electronic components)
21 Substrate 22 Wiring pattern 31 Chip (electronic component before resin sealing)
41 Resin (sealing resin)
41a Resin (resin materials such as liquid resin and granule resin)
41b Resin (flowable resin)
50 Mold 51 Upper mold 52 Lower mold 53 Plunger 54 Pot (hole)
55 Resin passage 56 Mold cavity 57 Substrate setting part 60 Resin supply means 61 Resin supply part 62 Lower shutter 70 Rectangular frame (frame)
100 Release film 101 Upper mold 101a Clamper 102 Intermediate mold (intermediate plate)
102a O-ring 103 Upper mold hole (through hole)
104 roll 107 reduced pressure (evacuation)
111 Lower mold 111a Lower mold cavity bottom member 111b Lower mold cavity 111c, 111d Air gap (adsorption hole)
112, 113 Lower die outer peripheral member (lower die body)
114, 115 Adsorption by decompression 116 Air 121 Lower mold 122 Upper mold (mounter)
123 Vacuum chamber 1001 Upper mold 1001a Clamper 1003 Upper mold hole (through hole)
1007 Depressurization (evacuation)
1011 Lower mold 1011a Lower mold cavity bottom member 1011b Lower mold cavity 1011c, 1011d Air gap (adsorption hole)
1012 Lower die outer peripheral member (lower die body)
1012a O-ring 1014 Adsorption by decompression 1016 Air 2001 Upper mold 2001a Substrate setting part 2002 Upper mold base plate 2003 Upper mold hole (through hole)
2004 Upper mold outside air blocking member 2004a, 2004b O-ring 2007 Depressurization (evacuation)
2010 Lower mold base plate 2011 Lower mold 2011a Lower mold cavity bottom member 2011b Lower mold cavity 2011c Air gap (adsorption hole)
2012 Lower mold outer peripheral member 2012a Elastic member 2013 Lower mold outside air blocking member 2013a O-ring 2014 Adsorption by decompression 3001 Metal frame 3001a Through hole (opening)
3002 Adhesive sheet 3003 Upper mold 3004 Lower mold 3005 Lower mold base plate 3005a Lower mold cavity bottom member 3005b Lower mold cavity 3006 Lower mold outer peripheral member 3006a Lower mold elastic member 3006c Air gap (adsorption hole)
3007 Adsorption by reduced pressure 3011 Upper mold base plate 3012 Upper mold hole (through hole)
3013 Upper mold outside air blocking member 3013a, 3013b O-ring 3014 Adsorption by reduced pressure 3021 Lower mold outside air blocking member 3021a O ring 3031 Arrow indicating the direction of lower mold upper movement 3032 Arrow indicating the direction of lower mold lower movement 4001 Resin 5001 Release film 6000 Mold 6001 Upper mold 6002 Lower mold 6003 Mold cavity 6004 Set part 6005 Resin passage 6006 Pot 6007 Plunger

Claims (33)

A method for producing a member for an electronic component in which a chip is resin-sealed,
The member is a plate-like member with a protruding electrode in which a protruding electrode is fixed on one side of the plate-shaped member,
By molding using a mold, it saw including a forming step of forming the said plate-like member and the protruding electrodes at the same time,
The forming step is a step of simultaneously forming the plate-like member and the protruding electrode by electroforming,
The mold is a mold manufactured by molding using a master mold,
The mold is divided into a plurality of parts;
The method for producing a plate-like member with protruding electrodes , wherein the forming step is performed in a state where the plurality of forming dies are assembled . The protrusion electrodes is a projecting electrode including a deformable deformation portion, the production method of the projection electrode-formed plate-shaped member according to claim 1, wherein. The manufacturing method of Claim 1 or 2 with which the said shaping | molding die is divided | segmented into plurality substantially parallel to the surface direction of the said plate-shaped member. The manufacturing method of the plate-shaped member with a protruding electrode according to any one of claims 1 to 3 , wherein the forming step is a step of simultaneously forming the plate-shaped member and the protruding electrode with a metal.   Furthermore, the manufacturing method of the plate-shaped member with a projection electrode as described in any one of Claim 1 to 4 including the process of melt | dissolving the said shaping | molding die and taking out the said plate-shaped member with a projection electrode after the said shaping | molding process. A method for producing a member for an electronic component in which a chip is resin-sealed,
The member is a plate-like member with a protruding electrode in which a protruding electrode is fixed on one side of the plate-shaped member,
By molding using a mold, it saw including a forming step of forming the said plate-like member and the protruding electrodes at the same time,
The method for producing a plate-like member with protruding electrodes, wherein the forming step is a step of simultaneously forming the plate-like member and the protruding electrode by compression molding of a conductive resin . A method for producing a member for an electronic component in which a chip is resin-sealed,
The member is a plate-like member with a protruding electrode in which a protruding electrode is fixed on one side of the plate-shaped member,
A molding step in which the plate-like member and the protruding electrode are simultaneously molded by molding using a molding die, and a conductive film is provided on the surface of the protruding electrode and the surface of the plate-like member on the side of the protruding electrode. only contains a membrane application process,
The method for producing a plate-like member with protruding electrodes, wherein the forming step is a step of simultaneously forming the plate-like member and the protruding electrodes by compression molding of resin molding . A method for producing a member for an electronic component in which a chip is resin-sealed,
The member is a plate-like member with a protruding electrode in which a protruding electrode is fixed on one side of the plate-shaped member,
By molding using a mold, it saw including a forming step of forming the said plate-like member and the protruding electrodes at the same time,
The method for producing a plate-like member with protruding electrodes, wherein the forming step is a step of simultaneously forming the plate-like member and the protruding electrode by transfer molding of a conductive resin . A method for producing a member for an electronic component in which a chip is resin-sealed,
The member is a plate-like member with a protruding electrode in which a protruding electrode is fixed on one side of the plate-shaped member,
A molding step in which the plate-like member and the protruding electrode are simultaneously molded by molding using a molding die, and a conductive film is provided on the surface of the protruding electrode and the surface of the plate-like member on the side of the protruding electrode. only contains a membrane application process,
The method for producing a plate-like member with protruding electrodes, wherein the forming step is a step of simultaneously forming the plate-like member and the protruding electrodes by transfer molding . A method for producing a member for an electronic component in which a chip is resin-sealed,
The member is a plate-like member with a protruding electrode in which a protruding electrode is fixed on one side of the plate-shaped member,
By molding using a mold, it saw including a forming step of forming the said plate-like member and the protruding electrodes at the same time,
The method for producing a plate-like member with protruding electrodes, wherein the forming step is a step of simultaneously forming the plate-like member and the protruding electrodes with a conductive resin . The manufacturing method according to claim 6, 8 or 10 , wherein the conductive resin is a mixture of a resin and conductive particles. A method for producing a member for an electronic component in which a chip is resin-sealed,
The member is a plate-like member with a protruding electrode in which a protruding electrode is fixed on one side of the plate-shaped member,
By molding using a mold, it saw including a forming step of forming the said plate-like member and the protruding electrodes at the same time,
The molding step is a step of simultaneously molding the plate-like member and the protruding electrode with a resin;
Furthermore, the manufacturing method of the plate-shaped member with a projection electrode characterized by including the electroconductive film provision process of attaching | subjecting a conductive film to the surface of the said projection electrode and the said projection-electrode side of the said plate-shaped member . The mold has a mold surface corresponding to the surface on which the protruding electrodes are fixed in the plate-like member, and a hole corresponding to the shape of the protruding electrodes are formed on the mold surface,
From the said formation process, the said plate-shaped member and the said protruding electrode are shape | molded simultaneously by making the forming material of the said plate-shaped member with a protruding electrode contact | abut to the said mold surface and the inner surface of the said hole. The manufacturing method of the plate-shaped member with a protruding electrode as described in any one of 12. The mold has a mold surface corresponding to the surface on which the protruding electrodes are fixed in the plate-like member, and a protrusion corresponding to the shape of the protruding electrodes are formed on the mold surface,
From the said shaping | molding process, the said plate-shaped member and the said protruding electrode are shape | molded simultaneously by making the forming material of the said plate-shaped member with a protruding electrode contact | abut to the said mold surface and the surface of the said protrusion. The manufacturing method of the plate-shaped member with a protruding electrode as described in any one of 12.   The manufacturing method according to claim 1, wherein a shape of the protruding electrode is a tapered shape having a diameter that decreases toward a tip of the protruding electrode. A manufacturing method for manufacturing an electronic component having a chip sealed with a resin after manufacturing a plate-like member with a protruding electrode by the manufacturing method according to any one of claims 1 to 15 ,
The electronic component to be manufactured is an electronic component including a substrate, a chip, a resin, a plate-like member, and a protruding electrode, and a wiring pattern is formed on the substrate,
The manufacturing method includes a resin sealing step of sealing the chip with the resin,
In the resin sealing step, in the protruding electrode formed plate-shaped member, and the protruding electrodes are fixed surface, between said wiring pattern forming surface of the substrate, thereby sealing the chip by the resin, The manufacturing method, wherein the protruding electrode is brought into contact with the wiring pattern. At least one of the protruding electrodes is a plate-shaped protruding electrode,
A plurality of the chips,
The manufacturing method according to claim 16 , wherein, in the resin sealing step, the substrate is divided into a plurality of regions by the plate-like protruding electrodes, and the chip is resin-sealed in each of the regions. The manufacturing method according to claim 16 or 17 , wherein, in the resin sealing step, the chip is resin-sealed by transfer molding. The manufacturing method according to claim 16 or 17 , wherein, in the resin sealing step, the chip is resin-sealed by compression molding. Furthermore, a resin placing step of placing the resin on the surface of the plate-like member with the protruding electrode on which the protruding electrode is fixed,
A conveying step of conveying the plate-like member with protruding electrodes to the position of the mold cavity of the mold,
In the mold cavity, the resin is compression-molded together with the plate-shaped member with protruding electrodes and the chip in a state where the chip is immersed in the resin placed on the plate-shaped member. The manufacturing method of Claim 19 which performs a sealing process. 21. The manufacturing method according to claim 20 , wherein, in the transporting step, the resin is transported to the position of the mold cavity of the mold together with the plate-like member with protruding electrodes while being placed on the plate-like member with protruding electrodes. Method. In the transporting step, the plate-like member with protruding electrodes is transported to the position of the mold cavity of the molding die in a state where the resin is not placed,
Furthermore, prior to the resin placing step, including a heating step of heating the plate-like member with protruding electrodes in the mold cavity,
The manufacturing method according to claim 20 , wherein the resin placing step is performed in the mold cavity in a state where the plate-like member with protruding electrodes is heated. In the transporting step, the plate-like member with protruding electrodes is placed on the release film with the surface on which the protruding electrodes are fixed facing upward. The manufacturing method as described in any one of Claim 20 to 22 conveyed in the type | mold cavity of this. In the conveying step,
A frame is placed on the release film together with the plate-like member with the protruding electrode, and the plate-like member with the protruding electrode is placed in the mold while the plate-like member with the protruding electrode is surrounded by the frame. 24. The manufacturing method according to claim 23 , wherein the manufacturing method is carried into a mold cavity. In the resin placing step,
The plate-like member with protruding electrodes and the frame in a state where the frame is placed on the release film together with the plate-like member with protruding electrodes, and the plate-like member with protruding electrodes is surrounded by the frame. 25. The manufacturing method according to claim 24 , wherein the resin is placed on a surface on which the protruding electrode is fixed by supplying the resin into a space surrounded by the surface. The manufacturing method of Claim 24 which performs the said resin mounting process prior to the said conveyance process. The protruding electrode formed plate-shaped member, the surface opposite to the protruding electrode is fixed face, according to any one of claims 23 to 26 which is fixed to the release film on the adhesive Production method. The plate-like member has a resin container;
In the resin placement step, the resin is placed in the resin container,
The manufacturing method according to any one of claims 20 to 27 , wherein the resin sealing step is performed in a state where the resin is placed in the resin housing portion. In the resin sealing step,
The substrate on which the chip is arranged on the wiring pattern forming surface was placed on a substrate mounting table with the wiring pattern forming surface facing up, and the resin was placed on the wiring pattern forming surface. The manufacturing method according to any one of claims 20 to 28 , wherein the resin is pressed in a state. The plate-like member is a heat sink;
The manufacturing method according to any one of claims 16 to 29 , wherein the heat radiating plate has a heat radiating fin on a surface opposite to a surface on which the protruding electrode is fixed. The method according to any one of claims 16 to 30 , wherein the resin is a thermoplastic resin or a thermosetting resin. The resin is either granular resin, powdered resin, liquid resin, a plate-like resin, the sheet-like resin, a film-like resin and claim 16 is at least one selected from the group consisting of paste-like resin 31 The manufacturing method according to one item. The manufacturing method according to any one of claims 16 to 32 , wherein the resin is at least one selected from the group consisting of a transparent resin, a translucent resin, and an opaque resin.

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