TWI606524B - Method of manufacturing plate-like member with protruding electrode, plate-like member with protruding electrode, method of manufacturing electronic part, and electronic part - Google Patents
Method of manufacturing plate-like member with protruding electrode, plate-like member with protruding electrode, method of manufacturing electronic part, and electronic part Download PDFInfo
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- TWI606524B TWI606524B TW104132097A TW104132097A TWI606524B TW I606524 B TWI606524 B TW I606524B TW 104132097 A TW104132097 A TW 104132097A TW 104132097 A TW104132097 A TW 104132097A TW I606524 B TWI606524 B TW I606524B
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- protruding electrode
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- 238000004519 manufacturing process Methods 0.000 title claims description 177
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
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- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
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- 239000007767 bonding agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/326—Application of electric currents or fields, e.g. for electroforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/46—Structure, shape, material or disposition of the wire connectors prior to the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8534—Bonding interfaces of the connector
- H01L2224/85345—Shape, e.g. interlocking features
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本發明關於一種帶突起電極的板狀構件的製造方法、帶突起電極的板狀構件、電子部件的製造方法以及電子部件。 The present invention relates to a method of manufacturing a plate-like member with a protruding electrode, a plate-shaped member with a protruding electrode, a method of manufacturing an electronic component, and an electronic component.
在多數情況下，IC(積體電路)、半導體晶片等電子部件(下面，有簡稱作“晶片”的情況)通過樹脂密封成形來使用。 In many cases, an electronic component such as an IC (integrated circuit) or a semiconductor wafer (hereinafter, simply referred to as a "wafer") is used by resin sealing molding.
將所述晶片樹脂密封的電子部件(也稱為作為成品的電子部件或封裝體等。以下，有簡稱為“電子部件”的情況)可以是在樹脂中埋入通孔電極而形成。該通孔電極能夠以如下方式形成，例如，在電子部件的所述樹脂，從封裝體頂面形成用於形成通孔的孔或槽(以下稱為“通孔形成孔”)，並使用所述通孔電極形成材料(例如，電鍍、屏蔽(shield)材料、焊錫球等)填充所述通孔形成孔。所述通孔形成孔，例如能夠通過從電子部件(封裝體)頂面對所述樹脂照射雷射來形成。另外，作為用於形成通孔電極的其他方法，提出了如下一種方法，將具有突起的金屬結構體的所述突起與半導體晶片一同進行樹脂密封後，去除所述金屬結構體的所述突起之外的部分(專利文獻1)。該 情況下，在電子部件中，只有所述金屬結構體的所述突起以被樹脂密封的狀態殘留，這便是通孔電極。 An electronic component (also referred to as an electronic component or a package as a finished product, which may be simply referred to as an "electronic component") may be formed by embedding a via electrode in a resin. The via electrode can be formed in such a manner that, for example, in the resin of the electronic component, a hole or a groove for forming a through hole (hereinafter referred to as a "through hole forming hole") is formed from a top surface of the package, and The via electrode forming material (for example, plating, shield material, solder ball, or the like) fills the through hole forming hole. The through hole forming hole can be formed, for example, by irradiating a laser toward the resin from the top of the electronic component (package). Further, as another method for forming the via electrode, a method is proposed in which the protrusion of the metal structure having the protrusion is resin-sealed together with the semiconductor wafer, and the protrusion of the metal structure is removed. The outer part (patent document 1). The In the case of the electronic component, only the protrusion of the metal structure remains in a state of being sealed by a resin, which is a via electrode.
另一方面，所述電子部件可以與用於排出所述晶片產生的熱量而進行冷卻的散熱板(散熱器)或用於屏蔽所述晶片發出的電磁波的屏蔽板(遮蔽板)等板狀構件一同成形(例如，專利文獻2及3)。 On the other hand, the electronic component may be a heat dissipation plate (heat sink) for discharging heat generated by the wafer or a plate member such as a shield plate (shield plate) for shielding electromagnetic waves emitted from the wafer. Formed together (for example, Patent Documents 2 and 3).
[先前技術文獻] [Previous Technical Literature]
[專利文獻] [Patent Literature]
專利文獻1：日本特開2012-015216號公報。 Patent Document 1: Japanese Laid-Open Patent Publication No. 2012-015216.
專利文獻2：日本特開2013-187340號公報。 Patent Document 2: Japanese Laid-Open Patent Publication No. 2013-187340.
專利文獻3：日本特開2007-287937號公報。 Patent Document 3: Japanese Laid-Open Patent Publication No. 2007-287937.
在樹脂形成通孔形成孔的方法中，存在例如下述(1)至(5)等問題。 In the method of forming a via hole by a resin, there are problems such as the following (1) to (5).
(1)由於電子部件(封裝體)厚度偏差等，有可能無法在基板的配線圖案上準確適當地形成通孔形成孔的深度等。 (1) Due to variations in thickness of the electronic component (package), the depth of the via hole forming hole or the like may not be accurately formed on the wiring pattern of the substrate.
(2)樹脂材料所包含的填充物容易殘留在基板的配線圖案上。 (2) The filler contained in the resin material tends to remain on the wiring pattern of the substrate.
(3)根據在所述樹脂上打穿通孔形成孔的條件，可能會對搭載有晶片的基板上的配線圖案帶來損傷。 (3) The wiring pattern on the substrate on which the wafer is mounted may be damaged depending on the condition in which the via hole is formed in the resin.
(4)與所述(3)相關地，若樹脂材料的填充物密度不同，則需要改變用於在所述樹脂上打穿通孔形成孔的雷 射的加工條件。即為對通孔形成孔的形成條件的控制變得繁雜。 (4) In relation to the above (3), if the filler density of the resin material is different, it is necessary to change the thunder for piercing the through hole to form a hole in the resin. The processing conditions of the shot. That is, the control of the formation conditions of the through hole forming holes becomes complicated.
(5)根據上述(1)至(4)的影響，難以提高電子部件(封裝體)製造的成品率。 (5) According to the influence of the above (1) to (4), it is difficult to improve the yield of the electronic component (package).
另一方面，在專利文獻1的方法中，對金屬結構體的所述突起進行樹脂密封後，需要進行將除所述金屬結構體的所述突起之外的部分去除的步驟。因此，電子部件(封裝體)的製造步驟變得繁雜，並且會浪費材料。 On the other hand, in the method of Patent Document 1, after the protrusion of the metal structure is resin-sealed, it is necessary to perform a step of removing a portion other than the protrusion of the metal structure. Therefore, the manufacturing steps of the electronic component (package) become complicated and materials are wasted.
進一步地，在上述任一方法中，在形成通孔電極後，必須通過電鍍等來形成板狀構件，因此導致步驟繁雜。 Further, in any of the above methods, after the via electrodes are formed, it is necessary to form the plate-like members by plating or the like, which results in a complicated procedure.
另外，在專利文獻2及3中，公開了具有板狀構件的電子部件及其製造方法，但並沒有公開在形成通孔電極時解決所述各方法中存在的課題的方法。 Further, Patent Documents 2 and 3 disclose an electronic component having a plate-like member and a method of manufacturing the same, but there is no disclosure of a method for solving the problems in the respective methods when forming a via electrode.
如上所述，能夠簡便且有效地製造同時具有通孔電極及板狀構件的電子部件的技術尚不存在。 As described above, the technique of easily and efficiently manufacturing an electronic component having both a via electrode and a plate member does not exist.
由此，本發明的目的在於提供一種，能夠簡便且有效地製造同時具有通孔電極及板狀構件的電子部件的帶突起電極的板狀構件的製造方法、帶突起電極的板狀構件、電子部件的製造方法以及電子部件。 Accordingly, an object of the present invention is to provide a method for manufacturing a plate-shaped member with a protruding electrode capable of easily and efficiently manufacturing an electronic component having a through-hole electrode and a plate-shaped member, a plate-shaped member with a protruding electrode, and an electron. Manufacturing method of components and electronic components.
為達到上述目的，基於本發明的帶突起電極的板狀構件的製造方法，其為將晶片樹脂密封的電子部件用的構件的製造方法，其特徵在於，所述構件為在板狀構件的單面固定有突起電極的帶突起電極的板狀構件，包括如下成形 步驟，即為通過使用成形模進行成形，將所述板狀構件與所述突起電極同時成形。 In order to achieve the above object, a method for producing a plate member having a protruding electrode according to the present invention is a method for manufacturing a member for an electronic component that seals a wafer resin, characterized in that the member is a single member in a plate member. a plate-like member having a protruding electrode to which a protruding electrode is fixed, including the following forming The step of forming the plate-like member and the protruding electrode simultaneously by forming using a forming die.
本發明的帶突起電極的板狀構件是通過本發明的所述帶突起電極的板狀構件的製造方法所製造的帶突起電極的板狀構件。 The plate-shaped member with a protruding electrode of the present invention is a plate-shaped member with a protruding electrode manufactured by the method for producing a plate-shaped member with a protruding electrode of the present invention.
本發明的電子部件的製造方法，其為將晶片樹脂密封的電子部件的製造方法，其特徵在於，所要製造的所述電子部件是包括基板、晶片、樹脂、板狀構件及突起電極，並且在所述基板上形成配線圖案的電子部件，所述製造方法具有用所述樹脂對所述晶片進行密封的樹脂密封步驟，在所述樹脂密封步驟中，在本發明的所述帶突起電極的板狀構件，在所述突起電極的固定面與所述基板的所述配線圖案形成面之間，用所述樹脂對所述晶片進行密封，並且使所述突起電極與所述配線圖案接觸。 A method of manufacturing an electronic component according to the present invention, which is a method of manufacturing an electronic component for sealing a wafer resin, characterized in that the electronic component to be manufactured includes a substrate, a wafer, a resin, a plate member, and a bump electrode, and An electronic component in which a wiring pattern is formed on the substrate, the manufacturing method having a resin sealing step of sealing the wafer with the resin, and in the resin sealing step, the protruding electrode-equipped board of the present invention The member is sealed between the fixing surface of the protruding electrode and the wiring pattern forming surface of the substrate with the resin, and the protruding electrode is brought into contact with the wiring pattern.
本發明的電子部件，其是將晶片樹脂密封的電子部件，其特徵在於，所述電子部件包括基板、晶片、樹脂及本發明的所述帶突起電極的板狀構件，所述晶片配置在所述基板上，並且由所述樹脂密封，在所述基板上的所述晶片的配置側，形成有配線圖案，所述突起電極貫通所述樹脂而與所述配線圖案接觸。 An electronic component according to the present invention, which is an electronic component in which a wafer resin is sealed, characterized in that the electronic component includes a substrate, a wafer, a resin, and the plate-like member with a protruding electrode of the present invention, and the wafer is disposed in the The substrate is sealed by the resin, and a wiring pattern is formed on the arrangement side of the wafer on the substrate, and the protruding electrode penetrates the resin to be in contact with the wiring pattern.
根據本發明，提供一種能夠簡便且有效地製造同時具有通孔電極(突起電極)及板狀構件的電子部件的帶突起電極的板狀構件的製造方法、帶突起電極的板狀構件、電 子部件的製造方法以及電子部件。 According to the present invention, there is provided a method of manufacturing a plate-like member with a protruding electrode capable of easily and efficiently manufacturing an electronic component having a through-hole electrode (protrusion electrode) and a plate-shaped member, a plate-shaped member with a protruding electrode, and electricity A method of manufacturing a sub-assembly and an electronic component.
10‧‧‧板狀構件 10‧‧‧ Plate-like members
10D、10D1、10D2、10D3、10D4‧‧‧成形模 10D, 10D1, 10D2, 10D3, 10D4‧‧‧ forming die
11‧‧‧板狀構件 11‧‧‧ Plate-like members
11a‧‧‧散熱片 11a‧‧‧Heatsink
11b‧‧‧壁狀構件 11b‧‧‧Wall members
11c‧‧‧樹脂容納部 11c‧‧‧Resin housing
12‧‧‧突起電極 12‧‧‧ protruding electrode
12A‧‧‧變形部 12A‧‧‧Deformation Department
12B‧‧‧剛性部 12B‧‧‧Rigid Department
12a‧‧‧下部 12a‧‧‧ lower
12b‧‧‧貫通孔/孔 12b‧‧‧through holes/holes
12c‧‧‧突起/突起電極 12c‧‧‧Protrusion/protrusion electrode
12D、12D1、12D2、12D3、12D4‧‧‧孔 12D, 12D1, 12D2, 12D3, 12D4‧‧ holes
12E‧‧‧突起 12E‧‧‧ Protrusion
20‧‧‧電子部件 20‧‧‧Electronic components
21‧‧‧基板 21‧‧‧Substrate
22‧‧‧配線圖案 22‧‧‧Wiring pattern
31‧‧‧晶片 31‧‧‧ wafer
41‧‧‧密封樹脂/樹脂 41‧‧‧Sealing Resin/Resin
41A‧‧‧樹脂/熔融樹脂 41A‧‧‧Resin/Molten Resin
41a‧‧‧樹脂材料/樹脂/顆粒樹脂/液態樹脂/熱固性樹脂 41a‧‧‧Resin Materials/Resins/Particle Resins/Liquid Resins/Thermosetting Resins
41b‧‧‧流動性樹脂/樹脂 41b‧‧‧Liquid resin/resin
50‧‧‧成形模 50‧‧‧ Forming die
51‧‧‧上模 51‧‧‧上模
52‧‧‧下模 52‧‧‧Down
53‧‧‧柱塞 53‧‧‧Plunger
54‧‧‧加料腔/孔 54‧‧‧Feeding cavity/hole
55‧‧‧樹脂通道/料道、流道、澆口 55‧‧‧Resin channel/sluice channel, runner, gate
56‧‧‧模腔 56‧‧‧ cavity
57‧‧‧基板設置部 57‧‧‧Substrate setting department
60‧‧‧樹脂供應單元 60‧‧‧Resin supply unit
61‧‧‧樹脂供應部/框 61‧‧‧Resin Supply Department/Box
62‧‧‧下部閘門 62‧‧‧lower gate
70‧‧‧框/框體 70‧‧‧Box/frame
100‧‧‧離型膜 100‧‧‧ release film
101‧‧‧上模 101‧‧‧上模
101a‧‧‧夾具 101a‧‧‧ fixture
102‧‧‧中模/中間板 102‧‧‧中模/中板
102a‧‧‧O型環 102a‧‧‧O-ring
103‧‧‧孔/貫通孔 103‧‧‧ holes/through holes
104‧‧‧滾輪 104‧‧‧Roller
107‧‧‧箭頭 107‧‧‧ arrow
111‧‧‧下模 111‧‧‧Down
111a‧‧‧下模腔底面構件 111a‧‧‧ Lower cavity cavity bottom member
111b‧‧‧下模腔/凹部 111b‧‧‧ Lower cavity/concave
111c‧‧‧空隙/吸附孔 111c‧‧‧void/adsorption hole
111d‧‧‧空隙/吸附孔 111d‧‧‧void/adsorption hole
112‧‧‧下模外周構件/下模主體 112‧‧‧Down die outer member/lower die body
113‧‧‧下模外周構件/下模主體 113‧‧‧Down die outer member/lower die body
114‧‧‧箭頭 114‧‧‧ arrow
115‧‧‧箭頭 115‧‧‧ arrow
116‧‧‧箭頭 116‧‧‧ arrow
121‧‧‧下模 121‧‧‧下模
122‧‧‧上模/安裝器 122‧‧‧Upper/Installer
123‧‧‧真空腔 123‧‧‧vacuum chamber
1001‧‧‧上模 1001‧‧‧上模
1003‧‧‧孔/貫通孔 1003‧‧‧ holes/through holes
1007‧‧‧箭頭 1007‧‧‧ arrow
1011‧‧‧下模 1011‧‧‧Down
1011a‧‧‧下模腔底面構件 1011a‧‧‧ Lower cavity cavity bottom member
1011b‧‧‧下模腔/凹部 1011b‧‧‧ Lower cavity/concave
1011c‧‧‧空隙/吸附孔 1011c‧‧‧Void/adsorption hole
1012‧‧‧下模外周構件/下模主體 1012‧‧‧Down die outer member/lower die body
1012a‧‧‧O型環 1012a‧‧‧O-ring
1014‧‧‧箭頭 1014‧‧‧ arrow
1016‧‧‧箭頭 1016‧‧‧ arrow
2001‧‧‧上模 2001‧‧‧上模
2001a‧‧‧基板設置部 2001a‧‧‧Substrate Setup Department
2002‧‧‧上模底板 2002‧‧‧Upper mold base plate
2003‧‧‧孔 2003‧‧‧ hole
2004‧‧‧上模外氣隔斷構件 2004‧‧‧External air partition member
2004a‧‧‧O型環 2004a‧‧O-ring
2004b‧‧‧O型環 2004b‧‧‧O-ring
2007‧‧‧箭頭 2007‧‧‧ arrow
2010‧‧‧下模底板 2010‧‧‧ Lower mold base plate
2011‧‧‧下模 2011‧‧‧Model
2011a‧‧‧下模腔底面構件 2011a‧‧‧ Lower cavity cavity bottom member
2011b‧‧‧模腔/下模腔/凹部 2011b‧‧‧ cavity / lower cavity / recess
2011c‧‧‧空隙/吸附孔 2011c‧‧‧Void/adsorption hole
2012‧‧‧下模外周構件 2012‧‧‧Down die peripheral components
2012a‧‧‧彈性構件 2012a‧‧‧Flexible components
2013‧‧‧上模外氣隔斷構件 2013‧‧‧External air partition member
2013a‧‧‧O型環 2013a‧‧‧O-ring
2014‧‧‧箭頭 2014‧‧‧ arrow
3001‧‧‧金屬框體/框 3001‧‧‧Metal frame/frame
3001a‧‧‧貫通孔/開口部 3001a‧‧‧through hole/opening
3002‧‧‧黏合片 3002‧‧‧Adhesive sheets
3003‧‧‧上模 3003‧‧‧上模
3004‧‧‧下模 3004‧‧‧下模
3005‧‧‧下模底板 3005‧‧‧ lower mold base plate
3005a‧‧‧下模腔底面構件 3005a‧‧‧ lower cavity bottom member
3005b‧‧‧模腔/下模腔/凹部 3005b‧‧‧ cavity / lower cavity / recess
3006‧‧‧下模外周構件 3006‧‧‧Down die peripheral components
3006a‧‧‧下模彈性構件 3006a‧‧‧Down elastic member
3006c‧‧‧空隙/吸附孔 3006c‧‧‧Void/adsorption hole
3007‧‧‧箭頭 3007‧‧‧ arrow
3011‧‧‧上模底板 3011‧‧‧Upper mold base plate
3012‧‧‧孔/貫通孔 3012‧‧‧ holes/through holes
3013‧‧‧上模外氣隔斷構件 3013‧‧‧External air partition member
3013a‧‧‧O型環 3013a‧‧‧O-ring
3013b‧‧‧O型環 3013b‧‧‧O-ring
3014‧‧‧箭頭 3014‧‧‧ arrow
3021‧‧‧下模外氣隔斷構件 3021‧‧‧Unsprung air partition member
3021a‧‧‧O型環 3021a‧‧ O-ring
3031‧‧‧箭頭 3031‧‧‧ arrow
3032‧‧‧箭頭 3032‧‧‧ arrow
4001‧‧‧熔融樹脂/樹脂 4001‧‧‧Molten resin/resin
5001‧‧‧離型膜 5001‧‧‧ release film
6000‧‧‧成形模 6000‧‧‧ Forming die
6001‧‧‧上模 6001‧‧‧上模
6002‧‧‧下模 6002‧‧‧
6003‧‧‧模腔 6003‧‧‧ cavity
6004‧‧‧設置部 6004‧‧‧Setting Department
6005‧‧‧脂通道/孔 6005‧‧‧lipid channel/hole
6006‧‧‧加料腔 6006‧‧‧feeding chamber
6007‧‧‧柱塞 6007‧‧‧Plunger
圖1顯示出本發明的帶突起電極的板狀構件的結構的一例的立體圖。 Fig. 1 is a perspective view showing an example of a structure of a plate-like member with a protruding electrode of the present invention.
圖2是舉例顯示出本發明的帶突起電極的板狀構件中的突起電極的結構的立體圖。 Fig. 2 is a perspective view showing a structure of a protruding electrode in a plate-like member with a protruding electrode of the present invention.
圖3顯示示出本發明的帶突起電極的板狀構件中的突起電極的結構的另一例的立體圖。 Fig. 3 is a perspective view showing another example of the structure of a bump electrode in the plate-like member with a bump electrode of the present invention.
圖4顯示出本發明的帶突起電極的板狀構件中的突起電極的結構的又另一例的立體圖。 Fig. 4 is a perspective view showing still another example of the structure of the protruding electrodes in the plate-like member with protruding electrodes of the present invention.
圖5顯示出採用電鑄的帶突起電極的板狀構件的製造方法的一例的步驟剖視圖。 Fig. 5 is a cross-sectional view showing a step of an example of a method of manufacturing a plate-shaped member with an electrode which is electroformed.
圖6顯示出採用電鑄的帶突起電極的板狀構件的製造方法的另一例的剖視圖。 Fig. 6 is a cross-sectional view showing another example of a method of manufacturing a plate-shaped member with an electrode which is electroformed.
圖7顯示出採用電鑄的帶突起電極的板狀構件的製造方法的又另一例的剖視圖。 Fig. 7 is a cross-sectional view showing still another example of a method of manufacturing a plate-like member having an electroformed projection electrode.
圖8顯示出採用電鑄的帶突起電極的板狀構件的製造方法的又另一例的剖視圖。 Fig. 8 is a cross-sectional view showing still another example of a method of manufacturing a plate-like member having an electroformed projection electrode.
圖9顯示出採用電鑄的帶突起電極的板狀構件的製造方法的又另一例的步驟剖視圖。 Fig. 9 is a cross-sectional view showing a step of still another example of a method of manufacturing a plate-like member having an electroformed projection electrode.
圖10a顯示出採用壓縮成形的帶突起電極的板狀構件的製造方法的一例的步驟剖視圖。 Fig. 10a is a cross-sectional view showing a step of an example of a method of manufacturing a plate-shaped member having a projection electrode by compression molding.
圖10b顯示出圖10a的後續步驟的步驟剖視圖。 Figure 10b shows a cross-sectional view of the steps of the subsequent steps of Figure 10a.
圖11顯示出採用傳遞模塑法的帶突起電極的板狀構件 的製造方法的一例的步驟剖視圖。 Figure 11 shows a plate-like member with a protruding electrode using transfer molding A cross-sectional view of an example of a manufacturing method.
圖12示意性的顯示出本發明的電子部件的結構及其製造步驟的一例的步驟剖視圖。 Fig. 12 is a schematic cross-sectional view showing an example of the structure of an electronic component of the present invention and a manufacturing step thereof.
圖13舉例顯示出採用傳遞模塑法的本發明的電子部件的製造方法的剖視圖。 Fig. 13 is a cross-sectional view showing, by way of example, a method of manufacturing the electronic component of the present invention by transfer molding.
圖14舉例顯示出採用壓縮成形的本發明的電子部件的製造方法的一例的一步驟的剖視圖。 Fig. 14 is a cross-sectional view showing, in an example, a step of an example of a method of manufacturing the electronic component of the present invention by compression molding.
圖15舉例顯示出與圖14相同的製造方法中另一步驟的剖視圖。 Fig. 15 is a cross-sectional view showing another step in the same manufacturing method as Fig. 14 by way of example.
圖16舉例顯示出與圖14相同的製造方法中又另一步驟的剖視圖。 Fig. 16 exemplifies a cross-sectional view showing still another step in the same manufacturing method as Fig. 14.
圖17舉例顯示出與圖14相同的製造方法中又另一步驟的剖視圖。 Fig. 17 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 14 as an example.
圖18舉例顯示出採用壓縮成形的本發明的電子部件的製造方法中另一例的一步驟的剖視圖。 Fig. 18 is a cross-sectional view showing, by way of example, a step of another example of the method of manufacturing the electronic component of the present invention which is compression-molded.
圖19舉例顯示出與圖18相同的製造方法中另一步驟的剖視圖。 Fig. 19 exemplifies a cross-sectional view showing another step in the same manufacturing method as Fig. 18.
圖20舉例顯示出採用壓縮成形的本發明的電子部件的製造方法中又另一例的一步驟的剖視圖。 Fig. 20 is a cross-sectional view showing, by way of example, a step of still another example of the method of manufacturing the electronic component of the present invention by compression molding.
圖21舉例顯示出與圖20相同的製造方法中另一步驟的剖視圖。 Fig. 21 exemplifies a cross-sectional view showing another step in the same manufacturing method as Fig. 20.
圖22舉例顯示出與圖20相同的製造方法中又另一步驟的剖視圖。 Fig. 22 exemplifies a cross-sectional view showing still another step in the same manufacturing method as Fig. 20.
圖23舉例顯示出與圖20相同的製造方法中又另一步 驟的剖視圖。 Figure 23 shows another step in the same manufacturing method as Figure 20 A cross-sectional view of the step.
圖24舉例顯示出採用壓縮成形的本發明的電子部件的製造方法中又另一例的一步驟的剖視圖。 Fig. 24 is a cross-sectional view showing, by way of example, a step of still another example of the method of manufacturing the electronic component of the present invention by compression molding.
圖25舉例顯示出採用壓縮成形的本發明的電子部件的製造方法中又另一例的一步驟的剖視圖。 Fig. 25 is a cross-sectional view showing, by way of example, a step of still another example of the method of manufacturing the electronic component of the present invention by compression molding.
圖26舉例顯示出本發明的電子部件的製造方法中又另一例的剖視圖。 Fig. 26 is a cross-sectional view showing still another example of the method of manufacturing the electronic component of the present invention.
圖27舉例顯示出本發明的電子部件的製造方法中又另一例的剖視圖。 Fig. 27 is a cross-sectional view showing still another example of the method of manufacturing the electronic component of the present invention.
圖28舉例顯示出採用壓縮成形的本發明的電子部件的製造方法中又另一例的一步驟的剖視圖。 Fig. 28 is a cross-sectional view showing, by way of example, a step of still another example of the method of manufacturing the electronic component of the present invention by compression molding.
圖29舉例顯示出與圖28相同的製造方法中另一步驟的剖視圖。 Fig. 29 exemplifies a cross-sectional view showing another step in the same manufacturing method as Fig. 28.
圖30舉例顯示出與圖28相同的製造方法中另一步驟的剖視圖。 Fig. 30 exemplifies a cross-sectional view showing another step in the same manufacturing method as Fig. 28.
圖31舉例顯示出與圖28相同的製造方法中另一步驟的剖視圖。 Fig. 31 exemplifies a cross-sectional view showing another step in the same manufacturing method as Fig. 28.
接著，舉例對本發明進行進一步詳細說明。但是，本發明並不限定於下文中的說明。 Next, the present invention will be described in further detail by way of examples. However, the invention is not limited to the description below.
本發明的帶突起電極的板狀構件的製造方法，如上所述，其為將晶片樹脂密封的電子部件用的構件的製造方法，其特徵在於，所述構件是在板狀構件的單面固定有突起電極的帶突起電極的板狀構件，包括如下成形步驟，即 為通過使用成形模進行成形，將所述板狀構件與所述突起電極同時成形。 As described above, the method for producing a plate-shaped member with a protruding electrode according to the present invention is a method for manufacturing a member for an electronic component that seals a wafer resin, wherein the member is fixed on one side of the plate member. a plate-like member having a protruding electrode having a protruding electrode, comprising the following forming step, that is, The plate-like member is simultaneously formed with the protruding electrode in order to be formed by using a forming die.
在本發明中，“晶片”是指樹脂密封前的電子部件，具體來講，例如，可舉出IC、半導體晶片等晶片狀的電子部件。在本發明中，為了與樹脂密封後的電子部件進行區分，方便起見將樹脂密封前的電子部件稱為“晶片”。但是，本發明中的“晶片”若為樹脂密封前的電子部件，則沒有特別的限定，也可以是不呈晶片狀的電子部件。另外，在本發明中，僅稱作“電子部件”時，除非特別指明，均指將所述晶片樹脂密封後的電子部件(作為成品的電子部件)。 In the present invention, the "wafer" refers to an electronic component before resin sealing, and specific examples thereof include a wafer-shaped electronic component such as an IC or a semiconductor wafer. In the present invention, in order to distinguish the electronic component after the resin sealing, the electronic component before the resin sealing is referred to as a "wafer" for convenience. However, the "wafer" in the present invention is not particularly limited as long as it is an electronic component before resin sealing, and may be an electronic component not in the form of a wafer. Further, in the present invention, when it is simply referred to as "electronic component", unless otherwise specified, it means an electronic component (as a finished electronic component) in which the wafer resin is sealed.
首先，舉例對通過本發明的帶突起電極的板狀構件的製造方法來能夠製造的本發明的帶突起電極的板狀構件進行說明。 First, a plate-shaped member with a protruding electrode of the present invention which can be manufactured by the method for producing a plate-like member with a protruding electrode of the present invention will be described by way of example.
在本發明的帶突起電極的板狀構件中，所述突起電極的數量是任意的，沒有特別的限定，可以是一個，也可以是複數個。對所述突起電極的形狀沒有特別的限定。另外，所述突起電極為複數個的情況下，這些形狀可互相相同，也可以互不相同。所述突起電極可以是包括可變形的變形部的突起電極，也可以是不包括所述變形部的突出電極。所述變形部較佳為能夠在與所述板狀構件的面方向相垂直的方向上收縮變形。若為包括所述變形部的突起電極，例如，如下所述，由於無需嚴格按照成品的電子部件的厚度來設計所述突起電極的高度，因此是較佳的。例如，所述 突起電極的至少一個是“之”字形突起電極也可。從與所述板狀構件的面方向相平行的方向看所述“之”字形突起電極時，至少所述變形部彎曲成“之”字形，從而所述變形部在與所述板狀構件的面方向相垂直的方向上可收縮變形也可。在所述“之”字形突起電極中，至少所述變形部為如上所述的“之”字形即可，所述變形部之外的部分是否為“之”字形均可。更具體來講，所述“之”字形突起電極的形狀例如可以是如圖2的(A)至(B)或圖4的(A)至(C)的形狀。 In the plate-like member with a protruding electrode of the present invention, the number of the protruding electrodes is arbitrary, and is not particularly limited, and may be one or plural. The shape of the protruding electrode is not particularly limited. Further, in the case where the number of the protruding electrodes is plural, the shapes may be the same as each other or may be different from each other. The protruding electrode may be a protruding electrode including a deformable deformation portion, or may be a protruding electrode not including the deformation portion. Preferably, the deformed portion is contractible and deformable in a direction perpendicular to a surface direction of the plate-like member. In the case of the bump electrode including the deformed portion, for example, as described below, it is preferable to design the height of the bump electrode strictly in accordance with the thickness of the finished electronic component. For example, the At least one of the protruding electrodes may be a zigzag protruding electrode. When the "Z-shaped" protruding electrode is viewed from a direction parallel to the surface direction of the plate-like member, at least the deformed portion is bent into a zigzag shape, so that the deformed portion is in contact with the plate-like member It is also possible to contract and deform in the direction in which the plane direction is perpendicular. In the zigzag protrusion electrode, at least the deformation portion may have a zigzag shape as described above, and a portion other than the deformation portion may be a zigzag shape. More specifically, the shape of the zigzag protrusion electrode may be, for example, a shape as shown in FIGS. 2(A) to (B) or FIG. 4 (A) to (C).
另外，例如，所述突起電極中至少一個是帶貫通孔的突起電極也可。更具體來講，例如，如圖3的(A)至(C)或圖4的(A)至(C)所示，所述帶貫通孔的突起電極12上的所述貫通孔為在與所述板狀構件的面方向相平行的方向(與板面平行的方向)上貫通的貫通孔12b也可。另外，就所述帶貫通孔的突起電極而言，在與固定在所述板狀構件的一端(下部12a側)成相反側的一端，具有在與所述板狀構件的板面相垂直的方向上突出的突起12c也可。另外，所述貫通孔的周圍是可變形的所述變形部也可。所述貫通孔的周圍較佳為是在與所述板狀構件的面方向相垂直的方向可收縮變形的所述變形部。更具體來講，這種帶貫通孔的突起電極的形狀例如可以是圖3的(A)至(C)或圖4的(A)至(C)所示的形狀。另外，在本發明的所述帶突起電極的板狀構件中，所述突起電極的所述變形部的變形可以是彈性變形，也可以是塑性變形。即為所述變 形部可以是可發生彈性變形的部分(彈性部)，也可以是可發生塑性變形的部分(塑性部)。所述變形為彈性變形還是塑性變形，例如，根據所述突起電極的材質等決定。 Further, for example, at least one of the protruding electrodes may be a protruding electrode with a through hole. More specifically, for example, as shown in (A) to (C) of FIG. 3 or (A) to (C) of FIG. 4, the through hole on the protruding electrode 12 with the through hole is The through hole 12b penetrating in the direction in which the surface directions of the plate-like members are parallel (the direction parallel to the plate surface) may be used. Further, the protruding electrode with the through hole has a direction perpendicular to the plate surface of the plate member, at one end opposite to the one end (the lower portion 12a side) fixed to the plate member. The protruding protrusion 12c may also be used. Further, the periphery of the through hole may be the deformable portion. The periphery of the through hole is preferably the deformed portion that is contractible and deformable in a direction perpendicular to the surface direction of the plate member. More specifically, the shape of the protruding electrode with the through hole may be, for example, the shapes shown in (A) to (C) of FIG. 3 or (A) to (C) of FIG. 4. Further, in the plate-like member with a protruding electrode of the present invention, the deformation of the deformed portion of the protruding electrode may be elastic deformation or plastic deformation. The change The shape may be a portion (elastic portion) that can be elastically deformed, or a portion (plastic portion) that can be plastically deformed. Whether the deformation is elastic deformation or plastic deformation is determined, for example, depending on the material of the projection electrode or the like.
在本發明的製造方法中，所述突起電極的至少一個是具有柱狀形狀的柱狀突起電極也可。作為所述柱狀突起電極的形狀，例如，可以舉出圓柱狀、棱柱狀、圓錐狀、棱錐狀、圓錐台狀、棱錐台狀等。此外，例如，在使用圓柱狀的突起電極的情況下，其突起電極整體可以是可在與板狀構件的面方向相垂直的方向上收縮變形的變形部。另外，在此情況下，例如，所述圓柱狀的側面可以整體膨脹呈撓曲桶狀。 In the manufacturing method of the present invention, at least one of the protruding electrodes may be a columnar protruding electrode having a columnar shape. Examples of the shape of the columnar projection electrode include a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, and a truncated cone shape. Further, for example, in the case of using a columnar protruding electrode, the entire protruding electrode may be a deformed portion that can be contracted and deformed in a direction perpendicular to the surface direction of the plate-like member. Further, in this case, for example, the cylindrical side surface may be integrally expanded in a flexible barrel shape.
另外，在本發明的製造方法中，所述突起電極的至少一個是板狀突起電極也可。在此情況下，在所述本發明的電子部件的製造方法中，所述晶片為複數個，在所述樹脂密封步驟中，通過所述板狀突起電極將所述基板劃分為複數個區域，並且在各個所述區域內，對所述電子部件進行樹脂密封也可。另外，較佳地，所述板狀突起電極具有貫通孔及突起，所述貫通孔在與所述板狀構件的板面相平行的方向上貫通所述板狀突起電極，在所述板狀突起電極的與固定在所述板狀構件的一端成相反側的一端，所述突起在與所述板狀構件的板面相垂直的方向上突出。另外，所述貫通孔的周圍是可變形的所述變形部也可。較佳地，所述貫通孔的周圍是可在與所述板狀構件的面方向相垂直的方向上收縮變形的所述變形部。 Further, in the manufacturing method of the present invention, at least one of the protruding electrodes may be a plate-like protruding electrode. In this case, in the method of manufacturing an electronic component according to the present invention, the plurality of wafers are plural, and in the resin sealing step, the substrate is divided into a plurality of regions by the plate-like protruding electrodes. Further, the electronic component may be resin-sealed in each of the regions. Further, preferably, the plate-like protruding electrode has a through hole and a protrusion, and the through hole penetrates the plate-shaped protruding electrode in a direction parallel to a plate surface of the plate-shaped member, and the plate-shaped protrusion An end of the electrode opposite to an end fixed to one end of the plate-like member, the protrusion protruding in a direction perpendicular to a plate surface of the plate-like member. Further, the periphery of the through hole may be the deformable portion. Preferably, the periphery of the through hole is the deformation portion that is contractible and deformable in a direction perpendicular to the surface direction of the plate member.
在本發明的製造方法中，對所述板狀構件沒有特別的限定，但較佳為散熱板(散熱器)或屏蔽板(遮蔽板)。所述屏蔽板例如可以是用於屏蔽從所述電子部件釋放出的電磁波的部件。所述散熱板較佳為在與所述突起電極的固定面成相反側的一面具有散熱片。另外，對所述板狀構件的形狀而言，除了固定有所述突起電極之外，沒有特別的限定。例如，在所述板狀構件是散熱板的情況下，就所述散熱板而言，除了所述突起電極之外，也可以呈使散熱效率良好的突起具有一個或結合複數個而成的形狀(例如，散熱片(fin)形狀)等。對所述板狀構件的材質也沒有特別的限定，在所述板狀構件是散熱板或屏蔽板的情況下，例如能夠使用金屬材料、陶瓷材料、樹脂及金屬蒸鍍膜等。對所述金屬蒸鍍膜沒有特別的限定，例如可以是將鋁、銀等蒸鍍在膜上的金屬蒸鍍膜。另外，對所述突起電極的材質也沒有特別的限定，例如能夠使用金屬材料、陶瓷材料及樹脂等。作為所述金屬材料，沒有特別的限定，例如可以舉出不鏽鋼、坡莫合金(鐵與鎳的合金)等鐵系材料；黃銅、銅鉬合金及鈹銅等銅系材料；硬鋁等鋁系材料等。作為所述陶瓷材料，沒有特別的限定，例如可以舉出氮化鋁等氧化鋁系材料、氮化矽等矽系材料及氧化鋯系材料等。作為所述樹脂，沒有特別的限定，例如可以舉出彈性體樹脂等橡膠系材料；在矽系的基體中混合導電性材料的材料及對這些材料進行擠壓成形或注塑模塑的樹脂材料等。另外，在所述帶突起電極的板狀構件中，對所述板狀 構件的表面等進行電鍍、塗裝等表面處理，從而形成導電層也可。此外，所述板狀構件可以是具有某些功能的功能構件(作用構件)。例如，在所述板狀構件是散熱板(散熱器)的情況下，其是具有散熱功能(散熱作用)的功能構件(作用構件)；在所述板狀構件是屏蔽板(遮蔽板)的情況下，其是具有屏蔽功能(屏蔽作用)的功能構件(作用構件)。 In the manufacturing method of the present invention, the plate member is not particularly limited, but is preferably a heat sink (heat sink) or a shield (shield). The shield plate may be, for example, a member for shielding electromagnetic waves emitted from the electronic component. Preferably, the heat dissipation plate has a heat sink on a side opposite to a fixing surface of the protruding electrode. Further, the shape of the plate-like member is not particularly limited except for the fact that the protruding electrode is fixed. For example, in the case where the plate-like member is a heat dissipation plate, the heat dissipation plate may have a shape in which a plurality of protrusions having a good heat dissipation efficiency are combined with a plurality of shapes in addition to the protrusion electrodes. (for example, fin shape). The material of the plate-shaped member is also not particularly limited. When the plate-shaped member is a heat dissipation plate or a shield plate, for example, a metal material, a ceramic material, a resin, a metal deposition film, or the like can be used. The metal deposition film is not particularly limited, and may be, for example, a metal deposition film obtained by depositing aluminum, silver, or the like on a film. Further, the material of the bump electrode is not particularly limited, and for example, a metal material, a ceramic material, a resin, or the like can be used. The metal material is not particularly limited, and examples thereof include iron-based materials such as stainless steel and permalloy (alloys of iron and nickel); copper-based materials such as brass, copper-molybdenum alloy, and beryllium copper; and aluminum such as hard aluminum. Department materials, etc. The ceramic material is not particularly limited, and examples thereof include an alumina-based material such as aluminum nitride, a lanthanoid-based material such as tantalum nitride, and a zirconia-based material. The resin is not particularly limited, and examples thereof include a rubber-based material such as an elastomer resin, a material in which a conductive material is mixed in a lanthanoid-based substrate, and a resin material obtained by extrusion molding or injection molding of these materials. . Further, in the plate-like member with the protruding electrode, the plate shape The surface of the member or the like may be subjected to surface treatment such as plating or coating to form a conductive layer. Further, the plate member may be a functional member (acting member) having certain functions. For example, in the case where the plate member is a heat dissipation plate (heat sink), it is a functional member (acting member) having a heat dissipation function (heat dissipation effect); and the plate member is a shield plate (shield plate) In this case, it is a functional member (acting member) having a shielding function (shielding function).
另外，如上所述，對所述板狀構件的形狀沒有特別的限定，例如，所述板狀構件具有樹脂容納部也可。更具體來講，例如，通過使所述板狀構件的周邊部向所述板狀構件的所述突起電極的固定面側隆起，使得所述板狀構件的中央部形成所述樹脂容納部也可。 Further, as described above, the shape of the plate-like member is not particularly limited, and for example, the plate-shaped member may have a resin containing portion. More specifically, for example, the peripheral portion of the plate-like member is swelled toward the fixing surface side of the protruding electrode of the plate-like member, so that the central portion of the plate-like member forms the resin receiving portion. can.
接著，舉例對本發明的帶突起電極的板狀構件的製造方法進行說明。 Next, a method of manufacturing the plate-like member with a protruding electrode of the present invention will be described by way of example.
如上所述，本發明的帶突起電極的板狀構件的製造方法包括，通過使用成形模進行成形，將所述板狀構件與所述突起電極同時成形的成形步驟。此外，對所述成形模沒有特別的限定，例如，可以舉出金屬模、陶瓷模、樹脂制的模等。所述成形步驟例如是通過電鑄、壓縮成形或傳遞模塑，將所述板狀構件與所述突起電極同時成形的步驟也可。作為使用所述成形模的成形方法，沒有特別的限定，除了電鑄、壓縮成形法或傳遞模塑法之外，例如，可以舉出注塑模塑等。 As described above, the method for producing a plate-like member with a protruding electrode of the present invention includes a forming step of simultaneously molding the plate-shaped member and the protruding electrode by molding using a forming die. Further, the molding die is not particularly limited, and examples thereof include a metal mold, a ceramic mold, and a resin mold. The forming step may be, for example, a step of simultaneously forming the plate-like member and the protruding electrode by electroforming, compression molding or transfer molding. The molding method using the molding die is not particularly limited, and examples thereof include injection molding or the like, in addition to electroforming, compression molding, or transfer molding.
在所述成形步驟是通過電鑄將所述板狀構件與所述突 起電極同時成形的步驟的情況下，所述突起電極是包括可變形的變形部的突起電極也可。另外，在所述成形步驟是，通過電鑄將所述板狀構件與所述突起電極同時成形的步驟的情況下，所述成形模是通過使用原盤模成形所製造的成形模也可。在所述成形模是通過使用原盤模成形所製造的成形模的情況下，將所述成形模分割成複數個，在將所述分割成複數個的成形模組裝完成後的狀態下，實施所述成形步驟也可。另外，在此情況下，將所述成形模以與所述板狀構件的面方向大致平行的方式分割成複數個也可。 In the forming step, the plate member and the protrusion are formed by electroforming In the case of the step of simultaneously forming the electrode, the protruding electrode may be a protruding electrode including a deformable deformation portion. Further, in the case where the forming step is a step of simultaneously molding the plate-like member and the protruding electrode by electroforming, the forming die may be a forming die manufactured by using a master disk molding. In the case where the molding die is formed by using a mastering die, the molding die is divided into a plurality of molding dies, and the assembly is performed in a state in which the plurality of molding dies are assembled. The forming step is also possible. Further, in this case, the molding die may be divided into a plurality of pieces so as to be substantially parallel to the surface direction of the plate-shaped member.
所述成形步驟是，例如通過金屬將所述板狀構件與所述突起電極同時成形的步驟也可。另外，所述成形步驟例如是通過導電性樹脂將所述板狀構件與所述突起電極同時成形的步驟也可。所述導電性樹脂例如是樹脂及導電性粒子的混合物也可。對所述導電性粒子沒有特別的限定，例如，可以舉出金屬粒子等。對所述金屬粒子中的金屬也沒有特別的限定，例如，可以舉出金、銀、銅、鎳、錫、其他的任意的金屬及包括兩種以上這些金屬的合金等。另外，在本發明的突起電極板狀構件的製造方法中，所述成形步驟是通過樹脂將所述板狀構件與所述突起電極同時成形的步驟，並且，包括在所述突起電極表面及所述板狀構件的所述突起電極側的一面附加導電性膜的導電性膜附加步驟也可。對所述導電性膜沒有特別的限定，例如，可以舉出金屬等的膜。對所述導電性膜的金屬也沒有特別的限定，例如，可以舉出金、銀、銅、鎳、錫及包括兩種以上 這些金屬的合金等。對所述導電性膜的形成方法也沒有特別的限定，例如，可以舉出電鍍、塗敷、濺射、蒸鍍等。所述電鍍例如可以是無電解電鍍，也可以是電解電鍍。 The forming step may be a step of simultaneously forming the plate member and the protruding electrode by metal, for example. Further, the forming step may be, for example, a step of simultaneously molding the plate-like member and the protruding electrode by a conductive resin. The conductive resin may be, for example, a mixture of a resin and conductive particles. The conductive particles are not particularly limited, and examples thereof include metal particles and the like. The metal in the metal particles is not particularly limited, and examples thereof include gold, silver, copper, nickel, tin, any other metal, and an alloy including two or more of these metals. Further, in the method of manufacturing a protruding electrode plate member of the present invention, the forming step is a step of simultaneously molding the plate member and the protruding electrode by a resin, and is included on the surface of the protruding electrode A step of adding a conductive film to the one side of the protruding electrode side of the plate-like member to which a conductive film is added may be used. The conductive film is not particularly limited, and examples thereof include a film of metal or the like. The metal of the conductive film is also not particularly limited, and examples thereof include gold, silver, copper, nickel, tin, and two or more. Alloys of these metals, etc. The method for forming the conductive film is not particularly limited, and examples thereof include plating, coating, sputtering, vapor deposition, and the like. The electroplating may be, for example, electroless plating or electrolytic plating.
在本發明的突起電極板狀構件的製造方法中，所述成形模具有與所述板狀構件的所述突起電極固定面相對應的模面及形成在所述模面並與所述突起電極的形狀相對應的孔，在所述成形步驟中，通過使所述帶突起電極的板狀構件的形成材料與所述模面及所述孔的內表面抵接，將所述板狀構件與所述突起電極同時成形也可。另外，所述成形模具有與所述板狀構件的所述突起電極固定面相對應的模面及形成在所述模面並與所述突起電極的形狀相對應的突起，在所述成形步驟中，通過使所述帶突起電極的板狀構件的形成材料與所述模面及所述突起的表面抵接，將所述板狀構件與所述突起電極同時成形也可。 In the method of manufacturing a protruding electrode plate member of the present invention, the forming die has a die face corresponding to the protruding electrode fixing face of the plate member and a die face formed on the die face and the protruding electrode a hole corresponding to the shape, in the forming step, the plate-shaped member is placed by abutting the forming material of the plate-like member with the protruding electrode with the die surface and the inner surface of the hole It is also possible to form the bump electrodes simultaneously. Further, the forming die has a die face corresponding to the protruding electrode fixing face of the plate member and a protrusion formed on the die face and corresponding to the shape of the protruding electrode, in the forming step The plate-shaped member and the protruding electrode may be simultaneously molded by abutting the forming material of the plate-like member having the protruding electrode with the surface of the die face and the protrusion.
另外，例如，如上所述，對所述突起電極的形狀沒有特別的限定，例如，呈越朝向所述突起電極頂端而直徑越小的頂端尖細形狀也可。若所述突起電極呈這種形狀，如下所述，則易於將所述帶突起電極的板狀構件從成形模拆卸。 Further, for example, as described above, the shape of the protruding electrode is not particularly limited, and for example, a tip end tapered shape having a smaller diameter toward the tip end of the protruding electrode may be used. If the protruding electrode has such a shape, as described below, it is easy to detach the plate-like member with the protruding electrode from the forming die.
接著，舉例對本發明的電子部件的製造方法進行說明。 Next, a method of manufacturing the electronic component of the present invention will be described by way of example.
在本發明的電子部件的製造方法中，例如，如上所述，所述突起電極的至少一個是板狀突起電極，所述晶片為複數個，在所述樹脂密封步驟中，通過所述板狀突起電極將所述基板劃分為複數個區域，並且在各個所述區域內，對 所述晶片進行樹脂密封也可。 In the method of manufacturing an electronic component of the present invention, for example, as described above, at least one of the bump electrodes is a plate-like bump electrode, and the wafer is plural, and in the resin sealing step, the plate is passed through a bump electrode divides the substrate into a plurality of regions, and in each of the regions, The wafer may be resin-sealed.
在所述樹脂密封步驟中，對用於樹脂密封的方法(成形方法)沒有特別的限定。例如，在所述樹脂步驟中，可以通過傳遞模塑法對所述晶片進行樹脂密封，也可以通過壓縮成形對所述晶片進行樹脂密封。 In the resin sealing step, the method (forming method) for resin sealing is not particularly limited. For example, in the resin step, the wafer may be resin-sealed by transfer molding, or the wafer may be resin-sealed by compression molding.
在所述樹脂密封步驟中，在通過壓縮成形對所述晶片進行樹脂密封的情況下，本發明的製造方法還可以包括如下樹脂載置步驟，即為將所述樹脂載置於所述帶突起電極的板狀構件的固定有所述突起電極的一面上。另外，在此情況下，本發明的製造方法還可以包括如下搬運步驟，即為將所述帶突起電極的板狀構件搬運至成形模的模腔位置。另外，在所述模腔內，在所述晶片浸漬在載置於所述板狀構件上的所述樹脂中的狀態下，將所述樹脂與所述帶突起電極的板狀構件及所述晶片一同壓縮成形，由此實施所述樹脂密封步驟也可。 In the resin sealing step, in the case where the wafer is resin-sealed by compression molding, the manufacturing method of the present invention may further include a resin mounting step of placing the resin on the protrusion The plate-like member of the electrode is fixed to one side of the protruding electrode. Further, in this case, the manufacturing method of the present invention may further include a carrying step of transporting the plate-like member with the protruding electrode to the cavity position of the forming die. Further, in the cavity, in a state where the wafer is immersed in the resin placed on the plate-like member, the resin and the plate-like member with the protruding electrode and the The wafer is compression-molded together, whereby the resin sealing step can be carried out.
對所述樹脂載置步驟及所述搬運步驟的順序沒有特別的限定，先進行其中任意一個步驟也可，同時進行也可。例如，在所述搬運步驟中，將所述樹脂在其載置於所述帶突起電極的板狀構件上的狀態下，與所述帶突起電極的板狀構件一同搬運至所述成形模模腔的位置也可。或者，在所述搬運步驟中，將所述帶突起電極的板狀構件在未載置有樹脂的狀態下，搬運至所述成形模的模腔的位置也可。在此情況下，本發明的製造方法還可以在所述樹脂載置步驟之前包括如下加熱步驟，即為在所述模腔內對所述帶突 起電極的板狀構件進行加熱。然後，在所述帶突起電極的板狀構件被加熱的狀態下，在所述模腔內實施所述樹脂載置步驟也可。 The order of the resin mounting step and the transport step is not particularly limited, and any one of the steps may be performed first or simultaneously. For example, in the carrying step, the resin is carried to the forming mold together with the plate-like member with the protruding electrode in a state where it is placed on the plate-like member with the protruding electrode The position of the cavity is also acceptable. Alternatively, in the transporting step, the plate-shaped member with the protruding electrode may be transported to a position of the cavity of the forming mold without being placed on the resin. In this case, the manufacturing method of the present invention may further include, before the resin mounting step, a heating step of rubbing the strip in the cavity The plate-like member that serves as the electrode is heated. Then, the resin mounting step may be performed in the cavity in a state where the plate-like member with the protruding electrode is heated.
在所述搬運步驟中，在將所述帶突起電極的板狀構件中固定有所述突起電極的一面朝上而載置於離型膜上的狀態下，將所述帶突起電極的板狀構件向所述成形模的模腔內搬運也可。在此情況下，在所述搬運步驟中，在框體(frame)與所述帶突起電極的板狀構件一同載置於所述離型膜上，並且所述帶突起電極的板狀構件被所述框體包圍的狀態下，將所述帶突起電極的板狀構件向所述成形模的模腔內搬運也可。在所述樹脂載置步驟中，較佳地，在所述框體與所述帶突起電極的板狀構件一同載置於所述離型膜上，並且所述帶突起電極的板狀構件被所述框體包圍的狀態下，向由所述帶突起電極的板狀構件及所述框體包圍的空間內供應所述樹脂，由此將所述樹脂載置於所述突起電極的固定面上。在這種情況下，對所述樹脂載置步驟及所述搬運步驟的順序沒有特別的限定，先實施其中任意一個步驟也可，同時實施也可，但較佳地，在所述搬運步驟之前實施所述樹脂載置步驟。 In the carrying step, the plate with the protruding electrode is placed in a state in which the surface of the plate-shaped member with the protruding electrode is fixed with the protruding electrode facing up and placed on the release film. The member may be conveyed into the cavity of the forming die. In this case, in the carrying step, a frame is placed on the release film together with the plate-like member with the protruding electrode, and the plate-shaped member with the protruding electrode is The plate-shaped member with the protruding electrode may be conveyed into the cavity of the molding die in a state in which the frame body is surrounded. In the resin mounting step, preferably, the frame body is placed on the release film together with the plate-like member with the protruding electrode, and the plate-shaped member with the protruding electrode is In a state in which the casing is surrounded, the resin is supplied into a space surrounded by the plate-shaped member with the protruding electrode and the frame, thereby placing the resin on the fixing surface of the protruding electrode. on. In this case, the order of the resin placing step and the carrying step is not particularly limited, and any one of the steps may be performed first, and may be carried out at the same time, but preferably, before the carrying step The resin mounting step is carried out.
另外，所述帶突起電極的板狀構件的與固定有所述突起電極的表面成相反側的表面，通過黏合劑固定在所述離型膜上也可。 Further, the surface of the plate-like member with the protruding electrode on the side opposite to the surface on which the protruding electrode is fixed may be fixed to the release film by an adhesive.
用於實施所述搬運步驟的搬運單元可以是如下單元，在載置有所述樹脂的所述板狀構件載置於離型膜上的狀態 下，將所述樹脂向所述成形模的模腔內搬運的單元。在此情況下，用於進行所述樹脂密封的樹脂密封單元可以是如下單元，具有離型膜吸附單元，並且在使所述離型膜吸附在所述離型膜吸附單元的狀態下，進行所述壓縮成形的單元。另外，對所述成形模沒有特別的限定，例如是金屬模或陶瓷模。 The transport unit for carrying out the transporting step may be a unit in which the plate-like member on which the resin is placed is placed on the release film. Next, the unit that transports the resin into the cavity of the forming die. In this case, the resin sealing unit for performing the resin sealing may be a unit having a release film adsorption unit, and in a state where the release film is adsorbed to the release film adsorption unit, The compression-molded unit. Further, the forming die is not particularly limited, and is, for example, a metal mold or a ceramic mold.
如上所述，在本發明的電子部件的製造方法中，所述帶突起電極的板狀構件的所述板狀構件具有樹脂容納部也可。更具體來講，例如，通過使所述板狀構件的周邊部向所述板狀構件的所述突起電極固定面側隆起，使得所述板狀構件的中央部形成所述樹脂容納部也可。另外，就本發明的電子部件的製造方法而言，在所述樹脂載置步驟中，將所述樹脂載置於所述板狀構件的所述樹脂容納部內，並且，在所述樹脂載置於所述樹脂容納部內的狀態下實施所述樹脂密封步驟也可。 As described above, in the method of manufacturing an electronic component of the present invention, the plate-shaped member of the plate-like member having the protruding electrode may have a resin containing portion. More specifically, for example, the peripheral portion of the plate-like member is swelled toward the protruding electrode fixing surface side of the plate-like member, so that the central portion of the plate-like member forms the resin receiving portion. . Further, in the method of manufacturing an electronic component of the present invention, in the resin mounting step, the resin is placed in the resin housing portion of the plate member, and the resin is placed on the resin. The resin sealing step may be carried out in a state of being inside the resin containing portion.
另外，在所述樹脂密封步驟中，以所述配線圖案形成面朝上的方式將所述配線圖案形成面上配置有所述晶片的所述基板載置在基板載置臺上，並且，以在所述配線圖案形成面上載置所述樹脂的狀態，按壓所述樹脂也可。更具體來講，以上述狀態，對所述帶突起電極的板狀構件從所述突起電極側向所述樹脂按壓也可。由此，能夠使安裝有電子部件的基板的配線圖案與所述突起電極連接。 Further, in the resin sealing step, the substrate on which the wafer is placed on the wiring pattern forming surface is placed on the substrate mounting table with the wiring pattern forming surface facing upward, and The resin may be pressed while the resin is placed on the wiring pattern forming surface. More specifically, in the above state, the plate-like member with the protruding electrode may be pressed toward the resin from the protruding electrode side. Thereby, the wiring pattern of the board on which the electronic component is mounted can be connected to the protrusion electrode.
另外，如上所述，對所述帶突起電極的板狀構件中的所述板狀構件沒有特別的限定，例如，所述板狀構件是散 熱板，所述散熱板在與所述突起電極固定面成相反側的一面具有散熱片也可。 Further, as described above, the plate-like member in the plate-like member with the protruding electrodes is not particularly limited, for example, the plate-like member is scattered. The heat plate may have a heat sink on a side opposite to the surface on which the protruding electrode is fixed.
在本發明的電子部件的製造方法中，對所述樹脂沒有特別的限定，例如是熱塑性樹脂或熱固性樹脂中的任意一種均可。所述樹脂例如可以是選自顆粒狀樹脂、粉末狀樹脂、液態樹脂、板狀樹脂、片狀樹脂、膜狀樹脂及漿糊狀樹脂中的至少一種。另外，所述樹脂例如可以是選自透明樹脂、半透明樹脂及不透明樹脂中的至少一種。 In the method for producing an electronic component of the present invention, the resin is not particularly limited, and may be, for example, any of a thermoplastic resin and a thermosetting resin. The resin may be, for example, at least one selected from the group consisting of a particulate resin, a powdered resin, a liquid resin, a plate resin, a sheet resin, a film resin, and a paste resin. Further, the resin may be, for example, at least one selected from the group consisting of a transparent resin, a translucent resin, and an opaque resin.
以下，根據附圖，對本發明的具體實施方案的一例進行說明。為了便於說明，各個附圖是經過適當省略、放大等而示意性地示出的。 Hereinafter, an example of a specific embodiment of the present invention will be described with reference to the drawings. For convenience of explanation, the respective drawings are schematically illustrated by being appropriately omitted, enlarged, and the like.
實施例1 Example 1
在本實施例中，對本發明的帶突起電極的板狀構件的一例、本發明的帶突起電極的板狀構件的製造方法的一例、使用所述帶突起電極的板狀構件的本發明的電子部件的一例及所述電子部件的製造方法的一例進行說明。 In the present embodiment, an example of a plate-shaped member with a protruding electrode of the present invention, an example of a method for producing a plate-shaped member with a protruding electrode of the present invention, and an electron of the present invention using the plate-shaped member with a protruding electrode An example of a component and an example of a method of manufacturing the electronic component will be described.
圖1的立體圖中，示意性示出了本實施例的帶突起電極的板狀構件的結構。如圖1所示，該帶突起電極的板狀構件10通過突起電極12的圖案固定在板狀構件11的單面上而形成。對突起電極12的長度(高度)沒有特別的限定，例如，能夠根據成品的電子部件(成形封裝體)的厚度進行適當設定。另外，在本發明中，所述突起電極的圖案不限定於本實施例(圖1)的圖案，可以是任意的圖案。 In the perspective view of Fig. 1, the structure of the plate-like member with protruding electrodes of the present embodiment is schematically shown. As shown in FIG. 1, the plate-like member 10 with the protruding electrodes is formed by being fixed to one surface of the plate-like member 11 by the pattern of the protruding electrodes 12. The length (height) of the bump electrode 12 is not particularly limited, and can be appropriately set according to, for example, the thickness of the finished electronic component (molded package). Further, in the present invention, the pattern of the bump electrodes is not limited to the pattern of the embodiment (Fig. 1), and may be any pattern.
對圖1所示的突起電極12的結構沒有特別的限定。突 起電極12例如是包括可變形的變形部的突起電極也可。在圖2的(A)及(B)的立體圖中，示出了包括這種變形部的突起電極12的結構的一例。在圖2的(A)及(B)的立體圖中，紙面的上下方向表示與板狀構件11的面方向相垂直的方向。在圖2的(A)所示的突起電極12中，在中央部分包括變形部12A，所述中央部分之外的部分由剛性部12B(突起電極12的端部)構成。如圖2的(A)所示，從與板狀構件11的面方向相平行的方向看變形部12A時，其彎曲成“之”字形。並且，如圖2的(A)所示，突起電極12通過變形部12A彎曲成“Z”字狀，可在所述垂直方向上收縮。另外，對於圖2的(B)所示的突起電極12，其整體都由變形部12A構成。從與板狀構件11的面方向相平行的方向看圖2的(B)的變形部12A時，其也彎曲成“之”字形。在圖2的(B)所示的突起電極12通過整體彎曲成“<”字狀，可在所述垂直方向上收縮變形。由此，例如，即使在將所述突起電極12的高度設計成大於成品的電子部件(對晶片進行樹脂密封而成形的電子部件)的厚度情況下，在成形時，所述突起電極也不會發生損傷且與所述厚度相吻合。由此，由於不需要事先按照所述厚度來設計的所述突起電極的高度，因此可以簡便且有效地製造同時具有通孔電極(突起電極)及板狀構件的電子部件。 The structure of the bump electrode 12 shown in FIG. 1 is not particularly limited. Burst The starting electrode 12 may be, for example, a protruding electrode including a deformable deformation portion. In the perspective views of (A) and (B) of FIG. 2, an example of the structure of the bump electrode 12 including such a deformed portion is shown. In the perspective views of (A) and (B) of FIG. 2, the vertical direction of the paper surface indicates a direction perpendicular to the surface direction of the plate-like member 11. In the protruding electrode 12 shown in (A) of FIG. 2, the deformed portion 12A is included in the central portion, and the portion other than the central portion is constituted by the rigid portion 12B (the end portion of the protruding electrode 12). As shown in FIG. 2(A), when the deformed portion 12A is seen from a direction parallel to the surface direction of the plate-like member 11, it is bent into a zigzag shape. Further, as shown in FIG. 2(A), the protruding electrode 12 is bent into a "Z" shape by the deformed portion 12A, and is contractible in the vertical direction. Further, the bump electrode 12 shown in FIG. 2(B) is entirely composed of the deformed portion 12A. When the deformation portion 12A of Fig. 2(B) is seen from a direction parallel to the surface direction of the plate member 11, it is also bent into a zigzag shape. The bump electrode 12 shown in (B) of FIG. 2 is bent in a "<" shape as a whole, and can be contracted and deformed in the vertical direction. Thus, for example, even when the height of the bump electrode 12 is designed to be larger than the thickness of the finished electronic component (electronic component formed by resin sealing the wafer), the bump electrode does not form at the time of molding. Damage occurs and coincides with the thickness. Thereby, since the height of the protruding electrode designed in advance according to the thickness is not required, an electronic component having a via electrode (protrusion electrode) and a plate member can be easily and efficiently manufactured.
另外，如圖2所示，突起電極12的形狀不限於變形部12A彎曲成“之”字形(“Z”字形)的結構。例如，突起 電極12的形狀可以是具有所述貫通孔12b的形狀，更具體來講，例如，可以是圖3所示的形狀。在圖3中，右上側的圖是示出圖1的帶突起電極的板狀構件10的一部分的立體圖。另外，圖3的(A)至(C)為示意性示出突起電極12的結構的一例的立體圖。如圖3的(A)至(C)各自所示，在突起電極12的下部12a(與板狀構件11連接的一側的部分)沒有開孔。另一方面，在突起電極12的上部(與板狀構件11連接的一側成相反側的部分)，在與板狀構件11的板面相平行的方向上，開通有貫通突起電極12的孔(貫通孔)12b。另外，突起電極12的上端(與固定在板狀構件11的一端成相反側的一端)的一部分向上方(與板狀構件11的板面相垂直的方向)突出，從而形成突起12c。突起電極12在突起12c的頂端部分可與基板的配線圖案(基板電極)接觸。此外，在圖3的(A)中，突起電極12c的數量為兩個。圖3的(B)中，突起電極12c的數量為一個，除了突起電極12的寬度略窄外，與圖3的(A)相同。圖3的(C)中，除了突起電極12的寬度更窄外，與圖3的(B)相同。如此地，突起12c的數量沒有特別的限定，可以是一個也可以是複數個。突起12c的數量雖在圖3的(A)至(C)中為一個或兩個，但也可以是三個以上。另外，孔(貫通孔)12b的數量雖在圖3的(A)至(C)中是一個，但沒有特別的限定，可以是任意數量，採用複數個也無妨。 Further, as shown in FIG. 2, the shape of the protruding electrode 12 is not limited to the structure in which the deformed portion 12A is bent into a zigzag shape ("Z" shape). For example, protrusion The shape of the electrode 12 may be a shape having the through hole 12b, and more specifically, for example, may be the shape shown in FIG. In FIG. 3, the upper right side view is a perspective view showing a part of the plate-like member 10 with the protruding electrodes of FIG. 1. In addition, (A) to (C) of FIG. 3 are perspective views schematically showing an example of the structure of the bump electrode 12. As shown in each of (A) to (C) of FIG. 3, the lower portion 12a of the protruding electrode 12 (portion on the side connected to the plate-like member 11) has no opening. On the other hand, in the upper portion of the protruding electrode 12 (portion opposite to the side connected to the plate-like member 11), a hole penetrating the protruding electrode 12 is opened in a direction parallel to the plate surface of the plate-like member 11 ( Through hole) 12b. Further, a part of the upper end of the protruding electrode 12 (one end opposite to the end fixed to the one end of the plate-like member 11) protrudes upward (in a direction perpendicular to the plate surface of the plate-like member 11) to form the projection 12c. The bump electrode 12 can be in contact with the wiring pattern (substrate electrode) of the substrate at the tip end portion of the bump 12c. Further, in (A) of FIG. 3, the number of the protruding electrodes 12c is two. In (B) of FIG. 3, the number of the protruding electrodes 12c is one, and is the same as (A) of FIG. 3 except that the width of the protruding electrodes 12 is slightly narrow. (C) of FIG. 3 is the same as (B) of FIG. 3 except that the width of the bump electrode 12 is narrower. Thus, the number of the protrusions 12c is not particularly limited, and may be one or plural. Although the number of the projections 12c is one or two in (A) to (C) of Fig. 3, it may be three or more. In addition, although the number of the holes (through holes) 12b is one in (A) to (C) of FIG. 3, it is not particularly limited, and may be any number, and a plurality of them may be used.
由於具有突起12c，因此突起電極12不受樹脂干擾， 容易與基板的配線圖案(基板電極)接觸。即為通過突起12c，撥開突起電極12與圖12所示的配線圖案22之間的樹脂(例如，熔融樹脂或液態樹脂)，由此突起12c的頂端與配線圖案22抵接(物理接觸)，同時與其電連接。另外，由於突起電極12具有貫通孔12b，因此更容易對電子部件進行樹脂密封。即為樹脂能夠穿過貫通孔12b而流動，因此，樹脂的流動變得更加順暢，進一步提高樹脂密封的效率。該效果在通過傳遞模塑製造電子部件(將晶片與帶突起電極的板狀構件一同進行樹脂密封)的情況下尤其顯著。進一步地，突起電極12與配線圖案22抵接(接觸)時，如圖3的(D)所示，突起電極12在孔12b附近彎曲，從而可以使突起電極12的高度(長度)變小。即為在具有圖3的(A)至(D)所示的形狀的突起電極12中，貫通孔12b周圍是在與板狀構件11的面方向相垂直的方向上可收縮的所述變形部。由此，能夠與電子部件的樹脂厚度(封裝體厚度)相對應地調整突起電極12的高度。考慮到這一點，可以預先將突起電極12的高度(長度)設定為比所述樹脂厚度(封裝體厚度)稍大。 Since the protrusion 12c has the protrusion 12c, the protruding electrode 12 is not interfered by the resin. It is easy to contact the wiring pattern (substrate electrode) of the substrate. That is, the resin (for example, molten resin or liquid resin) between the bump electrode 12 and the wiring pattern 22 shown in FIG. 12 is pulled out by the protrusion 12c, whereby the tip end of the protrusion 12c abuts (physical contact) with the wiring pattern 22. At the same time, it is electrically connected. Further, since the bump electrode 12 has the through hole 12b, it is easier to resin-seale the electronic component. That is, since the resin can flow through the through hole 12b, the flow of the resin becomes smoother, and the efficiency of resin sealing is further improved. This effect is particularly remarkable in the case where the electronic component is manufactured by transfer molding (the wafer is resin-sealed together with the plate-shaped member with the protruding electrode). Further, when the bump electrode 12 abuts (contacts) the wiring pattern 22, as shown in FIG. 3(D), the bump electrode 12 is bent in the vicinity of the hole 12b, so that the height (length) of the bump electrode 12 can be made small. In the projection electrode 12 having the shape shown in (A) to (D) of FIG. 3, the periphery of the through hole 12b is the deformation portion which is contractible in a direction perpendicular to the surface direction of the plate member 11. . Thereby, the height of the bump electrode 12 can be adjusted corresponding to the resin thickness (package thickness) of the electronic component. In view of this, the height (length) of the bump electrode 12 can be set to be slightly larger than the resin thickness (package thickness) in advance.
另外，就突起電極12而言，例如，其可以為所述“之”字形突起電極且為所述帶貫通孔的突起電極。即為突起電極12可同時具有從與板狀構件11的面方向相平行的方向看時彎曲成“之”字形(“Z”字形)的所述變形部及在與板狀構件11的面方向相平行的方向上貫通的所述貫通孔。在圖4中，示出了這種結構的一例。在圖4中，右上 側的圖是示出圖1的帶突起電極的板狀構件10的一部分的立體圖。另外，圖4的(A)至(C)是示意性示出突起電極12的結構的一例的立體圖。在圖4的(A)至(C)的突起電極12中，除了突起電極12的下部12a(與板狀構件11連接的一側的未開孔的部分)與上部(與板狀構件11連接的一側成相反側的開通有貫通孔12b的部分)通過變形部12A連接成為一體之外，與圖3的(A)至(C)相同。在圖4的(A)至(C)中，變形部12A與圖2的(A)相同地，從與板狀構件11的面方向相平行的方向看時彎曲成“之”字形(“Z”字形)，且可在與板狀構件11的面方向相垂直的方向上收縮。另外，在圖4的(A)至(C)的突起電極12中，與圖3的(A)至(C)相同地，突起電極12在孔12b附近彎曲，例如，如圖4的(D)所示，從而可使突起電極12的高度(長度)變小。 Further, as for the bump electrode 12, for example, it may be the "Zigzag" bump electrode and the bump electrode with the through hole. That is, the protruding electrode 12 can have both the deformed portion bent in a zigzag shape ("Z" shape) when viewed in a direction parallel to the surface direction of the plate-like member 11, and in the direction of the surface with the plate-like member 11. The through holes penetrating in parallel directions. An example of such a structure is shown in FIG. In Figure 4, top right The side view is a perspective view showing a part of the plate-like member 10 with the protruding electrodes of Fig. 1. In addition, (A) to (C) of FIG. 4 are perspective views schematically showing an example of the structure of the bump electrode 12. In the protruding electrode 12 of (A) to (C) of FIG. 4, except for the lower portion 12a of the protruding electrode 12 (the unopened portion of the side connected to the plate-like member 11) and the upper portion (connected to the plate-like member 11) The portion in which the through hole 12b is opened on the opposite side is integrated with the deformed portion 12A, and is the same as (A) to (C) of Fig. 3 . In (A) to (C) of FIG. 4, the deformed portion 12A is bent into a zigzag shape when viewed in a direction parallel to the surface direction of the plate-like member 11 as in (A) of FIG. 2 ("Z The "letter shape" is contracted in a direction perpendicular to the plane direction of the plate member 11. Further, in the bump electrodes 12 of (A) to (C) of FIG. 4, as in (A) to (C) of FIG. 3, the bump electrodes 12 are bent near the holes 12b, for example, as shown in FIG. 4 (D). ), so that the height (length) of the bump electrode 12 can be made small.
此外，突起電極12的形狀並不限定於圖2至4的形狀。例如，圖2至4中舉例示出的形狀是包括變形部12A的突起電極12的一例，但突起電極12並不限定於包括變形部的突起電極。另外，在突起電極12包括變形部12A的情況下，也並不限定於圖2至4所示的形狀，可以在圖2至4所示的形狀的基礎上增加其他形狀或用其他形狀代替。例如，如上所述，突起電極12的至少一個可以是呈柱狀形狀的柱狀突起電極。作為所述柱狀突起電極的形狀，如上所述，例如，可以舉出圓柱狀、棱柱狀、圓錐狀、棱錐狀、圓錐台狀及棱錐台狀等。 Further, the shape of the protruding electrode 12 is not limited to the shapes of FIGS. 2 to 4. For example, the shape illustrated in FIGS. 2 to 4 is an example of the protruding electrode 12 including the deformed portion 12A, but the protruding electrode 12 is not limited to the protruding electrode including the deformed portion. Further, in the case where the protruding electrode 12 includes the deformed portion 12A, it is not limited to the shape shown in FIGS. 2 to 4, and other shapes may be added or replaced with other shapes in addition to the shapes shown in FIGS. 2 to 4. For example, as described above, at least one of the protruding electrodes 12 may be a columnar protruding electrode in a columnar shape. As the shape of the columnar projection electrode, as described above, for example, a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, and a truncated pyramid shape can be given.
另外，如上所述，突起電極12的至少一個可以是板狀突起電極。在此情況下，如上所述，在本發明的製造方法的所述樹脂密封步驟中，通過所述板狀突起電極將所述基板劃分為複數個區域，並且在各個所述區域內，對所述電子部件進行樹脂密封也可。另外，與圖3的(A)至(C)的突起電極相同地，所述板狀突起電極可具有貫通孔及突起。與圖3的(A)至(C)相同地，所述貫通孔在與所述板狀構件的板面相平行的方向上貫通所述板狀突起電極也可。另外，較佳地，與圖3的(A)至(C)相同地，所述突起在所述板狀突起電極的與固定在所述板狀構件的一端成相反側的一端上，向與所述板狀構件的板面相垂直的方向突出。對所述板狀突起電極的所述貫通孔及所述突起的數量也沒有特別的限定，可以是任意數量，但較佳為複數個。所述板狀突起電極具有所述貫通孔及所述突起，從而具有與圖3的(A)至(C)的貫通孔12b及突起12c相同的優點。即為首先，所述板狀突起電極具有所述突起，因此所述板狀突起電極不受樹脂干擾，容易與基板的配線圖案(基板電極)接觸。另外，由於所述板狀突起電極具有所述貫通孔，樹脂能夠穿過所述貫通孔而流動，因此，樹脂的流動將更加順暢，樹脂密封的效率得到進一步提高。該效果在通過傳遞模塑製造電子部件(將晶片與帶突起電極的板狀構件一同進行樹脂密封)時尤其顯著。另外，所述板狀突起電極還在所述貫通孔附近彎曲，從而可以使所述板狀突起電極的高度(長度)變小。由此，能夠與電子 部件的樹脂厚度(封裝體厚度)相對應地調整所述板狀突起電極的高度。考慮到這一點，可以預先將所述板狀突起電極的高度(長度)設定為比所述樹脂厚度(封裝體厚度)稍大。 Further, as described above, at least one of the protruding electrodes 12 may be a plate-like protruding electrode. In this case, as described above, in the resin sealing step of the manufacturing method of the present invention, the substrate is divided into a plurality of regions by the plate-like protruding electrodes, and in each of the regions, The electronic component may be resin-sealed. Further, similarly to the bump electrodes of (A) to (C) of FIG. 3, the plate-like bump electrodes may have through holes and protrusions. Similarly to (A) to (C) of FIG. 3, the through hole may penetrate the plate-like protruding electrode in a direction parallel to the plate surface of the plate-shaped member. Further, preferably, in the same manner as (A) to (C) of Fig. 3, the protrusion is on the end of the plate-like protruding electrode opposite to the end fixed to the plate-like member. The plate surface of the plate member protrudes in a direction perpendicular to the plate. The number of the through holes and the protrusions of the plate-like projection electrode is not particularly limited, and may be any number, but is preferably plural. The plate-like projection electrode has the through hole and the protrusion, and has the same advantages as the through hole 12b and the protrusion 12c of FIGS. 3(A) to (C). That is, first, since the plate-like protrusion electrode has the protrusion, the plate-like protrusion electrode is not interfered with by the resin, and is easily brought into contact with the wiring pattern (substrate electrode) of the substrate. Further, since the plate-like projection electrode has the through hole, the resin can flow through the through hole, so that the flow of the resin is smoother, and the efficiency of resin sealing is further improved. This effect is particularly remarkable when the electronic component is manufactured by transfer molding (the wafer is resin-sealed together with the plate-like member with the protruding electrode). Further, the plate-like projection electrode is also bent in the vicinity of the through hole, so that the height (length) of the plate-like projection electrode can be made small. Thereby being able to interact with electronics The resin thickness (package thickness) of the member is adjusted correspondingly to the height of the plate-like projection electrode. In view of this, the height (length) of the plate-like projection electrode can be set to be slightly larger than the resin thickness (package thickness) in advance.
進一步地，在本發明中，所述突起電極的所述變形部較佳地可在與所述板狀構件的面方向相垂直的方向上收縮，但除了在所述垂直方向上收縮之外，還可以發生其他任意變形。例如，所述變形部可以呈如下狀態，在與所述板狀構件的面方向相垂直的方向上收縮的同時，在包括所述板狀構件的面方向(水平面方向)或斜向的整個橫向上擴大。所述變形為何種變形是根據例如所述板狀構件的材質、形狀等決定。 Further, in the invention, the deformation portion of the protruding electrode is preferably contractible in a direction perpendicular to a plane direction of the plate member, but in addition to contracting in the vertical direction, Any other deformation can also occur. For example, the deformation portion may be in a state of being contracted in a direction perpendicular to the surface direction of the plate-like member, in the plane direction (horizontal direction) including the plate-like member or the entire lateral direction of the oblique direction Expanded. The deformation is determined according to, for example, the material, shape, and the like of the plate member.
接著，對所述帶突起電極的板狀構件的製造方法的一例進行說明。 Next, an example of a method of manufacturing the plate-like member with the protruding electrodes will be described.
如上所述，對本發明的帶突起電極的板狀構件而言，包括通過使用成形模成形，將所述板狀構件與所述突起電極同時成形的成形步驟。 As described above, the plate-shaped member with a protruding electrode of the present invention includes a forming step of simultaneously molding the plate-shaped member and the protruding electrode by molding using a forming die.
在圖5的(A)至(C)的步驟剖視圖中，示意性示出了在所述成形步驟中，通過電鑄將所述板狀構件與所述突起電極同時成形的一例。首先，如圖5的(A)所示，準備電鑄用成形模10D。如圖所示，就該成形模10D而言，一側的表面(紙面的上側的面)形成為與所述板狀構件的所述突起電極固定面相對應的模面。在所述模面形成有與所述突起電極的形狀相對應的孔12D。對電鑄用成形模 10D的製造方法沒有特別的限定，例如，通過樹脂板或金屬板的機械加工等製造也可。例如，通過機械加工(銑削)等形成孔12D也可。或者是，通過使用具有與成形模10D的形狀相對應的(使成形模10D的表面形狀的凹凸顛倒)模面的原盤模成形，製造成形模10D也可。對作為使用原盤模的成形方法沒有特別的限定，例如，可以舉出電鑄、壓縮成形法、傳遞模塑法等。對成形模10D的形成材料沒有特別的限定，可以舉出樹脂、金屬、陶瓷等，但從作為電鑄用成形模使用的觀點考慮，較佳為導電性材料。在成形模10D的形成材料為樹脂的情況下，較佳為導電性樹脂。對所述導電性樹脂沒有特別的限定，例如，可以是樹脂及導電性粒子的混合物。對所述導電性粒子沒有特別的限定，例如，可以舉出金屬粒子等。對所述金屬粒子中的金屬也沒有特別的限定，例如，可以舉出金、銀、銅、鎳、錫、其他任意的金屬及包括兩種以上這些金屬的合金等。另外，成形模10D是在所述導電性樹脂或非導電性樹脂的表面附加了導電性膜的成形模也可。對所述導電性膜沒有特別的限定，例如，如上所述，可以舉出金屬等的膜。對所述導電性膜中的金屬也沒有特別的限定，例如，可以舉出金、銀、銅、鎳、錫及包括兩種以上這些金屬的合金等。對所述導電性膜的形成方法也沒有特別的限定，例如，可以舉出電鍍、塗敷、濺射、蒸鍍等。所述電鍍例如可以是無電解電鍍，也可以是電解電鍍。 In the step sectional view of the steps (A) to (C) of Fig. 5, an example in which the plate-like member and the projecting electrode are simultaneously formed by electroforming in the forming step is schematically shown. First, as shown in FIG. 5(A), a molding die 10D for electroforming is prepared. As shown in the figure, in the molding die 10D, a surface on one side (a surface on the upper side of the paper surface) is formed as a die surface corresponding to the projection electrode fixing surface of the plate-shaped member. A hole 12D corresponding to the shape of the protruding electrode is formed on the die face. Forming die for electroforming The manufacturing method of 10D is not particularly limited, and for example, it may be produced by machining of a resin plate or a metal plate. For example, the hole 12D may be formed by machining (milling) or the like. Alternatively, the molding die 10D may be manufactured by using a master die having a die face corresponding to the shape of the forming die 10D (the unevenness of the surface shape of the forming die 10D is reversed). The molding method using the master disk mold is not particularly limited, and examples thereof include electroforming, compression molding, and transfer molding. The material for forming the molding die 10D is not particularly limited, and examples thereof include a resin, a metal, and a ceramic. However, from the viewpoint of use as a molding die for electroforming, a conductive material is preferable. In the case where the forming material of the forming mold 10D is a resin, a conductive resin is preferable. The conductive resin is not particularly limited, and may be, for example, a mixture of a resin and conductive particles. The conductive particles are not particularly limited, and examples thereof include metal particles and the like. The metal in the metal particles is not particularly limited, and examples thereof include gold, silver, copper, nickel, tin, any other metal, and an alloy including two or more of these metals. Further, the molding die 10D may be a molding die to which a conductive film is added to the surface of the conductive resin or the non-conductive resin. The conductive film is not particularly limited, and examples thereof include a film of a metal or the like as described above. The metal in the conductive film is also not particularly limited, and examples thereof include gold, silver, copper, nickel, tin, and an alloy including two or more of these metals. The method for forming the conductive film is not particularly limited, and examples thereof include plating, coating, sputtering, vapor deposition, and the like. The electroplating may be, for example, electroless plating or electrolytic plating.
然後，如圖5的(A)的箭頭所示，通過電鑄，使所述 帶突起電極的板狀構件的形成材料與成形模10D的所述模面及孔12D的內表面抵接。即為如圖5的(B)所示，通過使帶突起電極的板狀構件10的形成材料與成形模10D的所述模面及孔12D的內表面抵接，將板狀構件11與突起電極12同時成形(成形步驟)，從而製造帶突起電極的板狀構件10。如此地，在通過電鑄製造帶突起電極的板狀構件10的情況下，對帶突起電極的板狀構件10的形成材料沒有特別的限定，例如，可以舉出鎳、銅等金屬及包括兩種以上這些金屬的合金等。然後，如圖5的(C)所示，將帶突起電極的板狀構件10從成形模10D拆卸下來使用。此時，在保持成形模10D的形態的狀態下，將帶突起電極的板狀構件10從成形模10D拆卸下來也可。另外，例如，通過將成形模10D熔融的方式，將帶突起電極的板狀構件10從成形模10D拆卸下來也可。在此情況下，從簡便性的觀點考慮，成形模10D的形成材料較佳為樹脂。所述樹脂例如是混合了導電性粒子的導電性樹脂等也可。例如，若使用原盤模製造成形模10D，則能夠多次簡便地製造相同形狀和相同尺寸的成形模10D。由此，即使將成形模10D熔融以一次性使用，也能夠高效、低成本地進行帶突起電極的板狀構件10的製造。另外，例如，將成形模10D熔融後所得到的材料再次作為成形模10D的形成材料使用也可。 Then, as shown by the arrow of (A) of FIG. 5, the said The material for forming the plate-like member with the protruding electrodes abuts against the die face of the molding die 10D and the inner surface of the hole 12D. That is, as shown in FIG. 5(B), the plate-like member 11 and the protrusion are brought into contact with the molding surface of the plate-shaped member 10 with the protruding electrode and the mold surface of the molding die 10D and the inner surface of the hole 12D. The electrode 12 is simultaneously formed (forming step), thereby manufacturing the plate-like member 10 with the protruding electrode. In the case of manufacturing the plate-like member 10 with the protruding electrodes by electroforming, the material for forming the plate-like member 10 with the protruding electrodes is not particularly limited, and examples thereof include metals such as nickel and copper, and two. An alloy or the like of these metals. Then, as shown in FIG. 5(C), the plate-like member 10 with the protruding electrodes is detached from the forming die 10D and used. At this time, the plate-shaped member 10 with the protruding electrode may be detached from the molding die 10D while the form of the molding die 10D is held. Further, for example, the plate-shaped member 10 with the protruding electrode may be detached from the forming die 10D by melting the forming die 10D. In this case, the material for forming the molding die 10D is preferably a resin from the viewpoint of simplicity. The resin may be, for example, a conductive resin in which conductive particles are mixed. For example, when the molding die 10D is manufactured using the master disk mold, the molding die 10D having the same shape and the same size can be easily manufactured multiple times. Thereby, even if the molding die 10D is melted and used at once, the production of the plate-like member 10 with the protruding electrodes can be performed efficiently and at low cost. Further, for example, the material obtained by melting the molding die 10D may be used again as a material for forming the molding die 10D.
此外，本發明的帶突起電極的板狀構件的製造方法可以適當包括除所述成形步驟(將所述板狀構件與所述突起 電極同時成形的步驟)之外的步驟，也可以不包括。例如，在圖5所示的一例中，如圖5的(C)所示，將帶突起電極的板狀構件10從成形模10D拆卸下來後，包括或不包括將帶突起電極的板狀構件10的不需要部分通過機械加工(例如切削研磨等)或蝕刻等去除的步驟均可。 Further, the method of manufacturing the plate-like member with protruding electrodes of the present invention may suitably include, in addition to the forming step (the plate-like member and the protrusions) Steps other than the step of simultaneously forming the electrodes may not be included. For example, in the example shown in FIG. 5, as shown in FIG. 5(C), after the plate-like member 10 with the protruding electrodes is detached from the forming die 10D, the plate-like member with the protruding electrodes is included or not included. The unnecessary portion of 10 may be removed by mechanical processing (for example, cutting and polishing, etc.) or etching or the like.
另外，在圖6至圖9中，示出在通過電鑄實施所述成形步驟(將所述板狀構件與所述突起電極同時成形的步驟)情況下的幾個變形例。 In addition, in FIGS. 6 to 9, several modifications in the case where the forming step (the step of simultaneously forming the plate-like member and the protruding electrode) is performed by electroforming are shown.
首先，在圖6中，示出成形模10D為凸模的情況下的一例。即為在圖5的(A)至(C)中，舉例示出了成形模10D為凹模的情況。在此，如用圖5所作的說明，凹模是指具有與所述板狀構件的所述突起電極固定面相對應的模面及形成在所述模面且與所述突起電極的形狀相對應的孔的成形模。與之相對，凸模是指具有與所述板狀構件的所述突起電極固定面相對應的模面及形成在所述模面且與所述突起電極的形狀相對應的突起的成形模。即為如圖6所示，就圖6的成形模10D(凸模)而言，一側的表面(紙面的上側的面)形成有與所述板狀構件的所述突起電極固定面相對應的模面。在所述模面形成有與所述突起電極的形狀相對應的突起12E。在圖6中，如圖所示，在所述成形步驟中，通過使帶突起電極的板狀構件10的形成材料與所述模面及突起12E的表面抵接，將板狀構件11與突起電極12同時成形。使用電鑄能夠實施圖6中的帶突起電極的板狀構件10的製造方法。更具體來講，就圖6所示的製 造方法而言，例如，作為成形模10D，除了使用圖6所示的凸模來代替圖5的(A)所示的凹模之外，能夠以與圖5的(A)至(C)的製造方法相同的方法實施。 First, an example of the case where the forming die 10D is a punch is shown in FIG. That is, in (A) to (C) of FIG. 5, a case where the forming die 10D is a female die is exemplified. Here, as described with reference to FIG. 5, the female mold means having a die face corresponding to the protruding electrode fixing face of the plate-like member and formed on the die face and corresponding to the shape of the protruding electrode The forming die of the hole. On the other hand, the punch is a molding die having a die face corresponding to the projection electrode fixing surface of the plate member and a projection formed on the die face and corresponding to the shape of the projection electrode. That is, as shown in FIG. 6, in the molding die 10D (embossing die) of FIG. 6, one surface (the upper surface of the paper surface) is formed to correspond to the protruding electrode fixing surface of the plate-shaped member. Die surface. A protrusion 12E corresponding to the shape of the protruding electrode is formed on the die surface. In Fig. 6, as shown in the figure, in the forming step, the plate-like member 11 and the projection are made by abutting the forming material of the plate-like member 10 with the protruding electrode with the surface of the die face and the projection 12E. The electrodes 12 are simultaneously formed. The method of manufacturing the plate-like member 10 with the protruding electrodes in Fig. 6 can be carried out by electroforming. More specifically, the system shown in Figure 6 In the manufacturing method, for example, as the forming die 10D, in addition to the punch shown in FIG. 6, instead of the die shown in (A) of FIG. 5, it is possible to use (A) to (C) of FIG. The manufacturing method is the same as the method of implementation.
另外，圖7及圖8是突起電極12的形狀為越朝向突起電極12的頂端(越遠離板狀構件11)而直徑越小的頂端尖細形狀的情況下的一例。圖7是凹模的一例，除突起電極12的形狀為越朝向突起電極12的頂端(越遠離板狀構件11)而直徑越小的頂端尖細形狀之外，與圖5的(B)相同。圖8是凸模的一例，除突起電極12的形狀為越朝向突起電極12的頂端(越遠離板狀構件11)而直徑越小的頂端尖細形狀之外，與圖6相同。如圖7及8所示，與突起電極12的形狀相對應的孔12D或與突起電極12的形狀相對應的突起12E的形狀呈與突起電極12的形狀相對應的形狀。即為孔12D及突起12E的形狀呈越朝向突起電極12的頂端(越遠離板狀構件11)而直徑越小的頂端尖細形狀。就使用圖7及圖8所示的成形模10D來進行帶突起電極的板狀構件10的製造而言，能夠與圖5或6相同的方法實施。若突起電極12為這種頂端尖細形狀，則易於將帶突起電極的板狀構件10從成形模10D進行拆卸，因此是較佳的。 In addition, FIG. 7 and FIG. 8 are examples in which the shape of the bump electrode 12 is a tip end tapered shape in which the diameter of the bump electrode 12 is smaller toward the tip end of the bump electrode 12 (the distance from the plate member 11). FIG. 7 is an example of a female die, and is the same as (B) of FIG. 5 except that the shape of the protruding electrode 12 is smaller toward the tip end of the protruding electrode 12 (the further away from the plate-shaped member 11) and the diameter is smaller. . FIG. 8 is an example of a punch, and is the same as FIG. 6 except that the shape of the bump electrode 12 is tapered toward the tip end of the bump electrode 12 (further away from the plate member 11). As shown in FIGS. 7 and 8, the shape of the hole 12D corresponding to the shape of the protruding electrode 12 or the protrusion 12E corresponding to the shape of the protruding electrode 12 has a shape corresponding to the shape of the protruding electrode 12. In other words, the shape of the hole 12D and the projection 12E is tapered toward the tip end of the protruding electrode 12 (further away from the plate-like member 11). The production of the plate-like member 10 with the protruding electrodes using the molding die 10D shown in FIGS. 7 and 8 can be carried out in the same manner as in FIG. 5 or 6. When the projection electrode 12 has such a tip end shape, it is easy to detach the plate-like member 10 with the protruding electrode from the molding die 10D.
另外，圖9的(A)至(D)的步驟剖視圖舉例示出了成形模被分割為複數個的情況。如圖9的(A)所示，該成形模與板狀構件的面方向大致平行地被分割為複數個。具體來講，如圖9的(A)所示，該成形模從突起電極頂 端側朝向板狀構件一側，被分成四個成形模，成形模10D1、成形模10D2、成形模10D3及成形模10D4。成形模10D1與突起電極頂端部相對應。成形模10D2及成形模10D3相當於作為突起電極的中央部分的變形部。成形模10D4與板狀構件及突起電極的板狀構件一側的部分相對應。成形模10D4的上表面(紙面的上側的面)是與板狀構件的突起電極固定面相對應的模面。在成形模10D1、成形模10D2、成形模10D3及成形模10D4，分別開設有與突起電極的形狀相對應的孔12D1、孔12D2、孔12D3及孔12D4。孔12D1不貫通成形模10D1，孔12D2、孔12D3及孔12D4則為分別貫通成形模10D2、成形模10D3及成形模10D4的貫通孔。如圖9的(B)所示，若組裝成形模10D1、成形模10D2、成形模10D3及成形模10D4，則將成為在所述模面形成有與突起電極的形狀相對應的孔的一個成形模。在這種成形模中，孔12D1、孔12D2、孔12D3及孔12D4相結合，成為與所述突起電極的形狀相對應的孔。與圖5的(A)至(C)相同地，使用該成形模，通過電鑄能夠製造帶突起電極的板狀構件。即為使帶突起電極的板狀構件的形成材料與圖9的(B)所示的成形模的所述模面及所述孔的內表面抵接，如圖9的(C)所示，將板狀構件11與突起電極12同時成形(成形步驟)，從而製造帶突起電極的板狀構件10。如圖9的(C)所示，就該帶突起電極的板狀構件10而言，突起電極12的中央部分是可變形的變形部12A。並且，如圖9(D)所示，將帶突 起電極的板狀構件10從成形模10D拆卸下來使用。 In addition, the step sectional view of (A) to (D) of FIG. 9 exemplifies a case where the forming mold is divided into a plurality of pieces. As shown in FIG. 9(A), the forming die is divided into a plurality of pieces substantially parallel to the surface direction of the plate-like member. Specifically, as shown in (A) of FIG. 9, the forming die is from the top of the protruding electrode The end side faces the side of the plate member, and is divided into four forming dies, a forming die 10D1, a forming die 10D2, a forming die 10D3, and a forming die 10D4. The forming die 10D1 corresponds to the tip end portion of the protruding electrode. The molding die 10D2 and the molding die 10D3 correspond to a deformed portion which is a central portion of the bump electrode. The molding die 10D4 corresponds to a plate-like member and a portion on the side of the plate-like member of the protruding electrode. The upper surface (the upper surface of the paper surface) of the molding die 10D4 is a die surface corresponding to the projection electrode fixing surface of the plate member. The hole 12D1, the hole 12D2, the hole 12D3, and the hole 12D4 corresponding to the shape of the protrusion electrode are respectively formed in the molding die 10D1, the molding die 10D2, the molding die 10D3, and the molding die 10D4. The hole 12D1 does not penetrate the molding die 10D1, and the hole 12D2, the hole 12D3, and the hole 12D4 are through holes that penetrate the molding die 10D2, the molding die 10D3, and the molding die 10D4, respectively. As shown in FIG. 9(B), when the molding die 10D1, the molding die 10D2, the molding die 10D3, and the molding die 10D4 are assembled, a molding in which a hole corresponding to the shape of the projection electrode is formed on the die surface is formed. mold. In this molding die, the hole 12D1, the hole 12D2, the hole 12D3, and the hole 12D4 are combined to form a hole corresponding to the shape of the protruding electrode. Similarly to (A) to (C) of Fig. 5, a plate-like member having a protruding electrode can be produced by electroforming using the molding die. In other words, the material for forming the plate-like member having the protruding electrode is in contact with the die surface of the molding die shown in FIG. 9(B) and the inner surface of the hole, as shown in FIG. 9(C). The plate member 11 and the protruding electrode 12 are simultaneously molded (forming step), thereby manufacturing the plate member 10 with the protruding electrode. As shown in FIG. 9(C), in the plate-like member 10 with the protruding electrodes, the central portion of the protruding electrode 12 is a deformable deformation portion 12A. And, as shown in Fig. 9(D), the band is protruding The plate-like member 10 that serves as an electrode is detached from the forming die 10D for use.
如圖9的(A)至(D)所示，使用與板狀構件的面方向大致平行地被分割成複數個的成形模的方法在突起電極12的形狀比較複雜的情況下是較佳的。具體來講，突起電極12的形狀比較複雜的情況是指，例如，如圖9的(C)及(D)所示，可以舉出突起電極12包括變形部12A的情況。對包括變形部12A的突起電極12的形狀沒有特別的限定，例如，如圖2至圖4所示。如此地，即使突起電極12的形狀是比較複雜的情況，若使用與板狀構件的面方向大致平行地被分割成複數個的成形模，則也容易製造成形模。另外，對於所述成形步驟(圖9(C))之後將帶突起電極的板狀構件10從成形模10D拆卸下來的方法沒有特別的限定，但較佳為採用熔融成形模10D的方法。通過熔融成形模10D，即使突起電極12的形狀是比較複雜的形狀，也能夠容易地將帶突起電極的板狀構件10從成形模10D拆卸下來。在此情況下，較佳為使用原盤模來製造成形模10D。 As shown in (A) to (D) of FIG. 9, the method of dividing into a plurality of forming dies substantially parallel to the surface direction of the plate-like member is preferable in the case where the shape of the protruding electrode 12 is relatively complicated. . Specifically, the case where the shape of the bump electrode 12 is relatively complicated means that, for example, as shown in FIGS. 9C and 9D, the bump electrode 12 includes the deformed portion 12A. The shape of the bump electrode 12 including the deformed portion 12A is not particularly limited, and is, for example, as shown in FIGS. 2 to 4. In this manner, even if the shape of the bump electrode 12 is complicated, it is easy to manufacture the mold by using a plurality of molds that are divided into a plurality of shapes substantially parallel to the plane direction of the plate member. Further, the method of detaching the plate-like member 10 with the protruding electrode from the forming die 10D after the forming step (Fig. 9(C)) is not particularly limited, but a method of using the melt-molding die 10D is preferable. By the melt molding die 10D, even if the shape of the protruding electrode 12 is a relatively complicated shape, the plate-like member 10 with the protruding electrode can be easily detached from the forming die 10D. In this case, it is preferable to use the original disk mold to manufacture the molding die 10D.
以上，使用圖5至圖9，對通過電鑄製造帶突起電極的板狀構件的製造方法的一例進行了說明。如果通過電鑄進行成形，能夠精度極好且有效地製造相同形狀的帶突起電極的板狀構件。另外，通過電鑄，即使帶突起電極的板狀構件的形狀是複雜的形狀、微細的形狀等，也可以精度良好地進行再現。 As described above, an example of a method of manufacturing a plate-like member having a bump electrode by electroforming has been described with reference to FIGS. 5 to 9 . If the molding is performed by electroforming, the plate-like member with the protruding electrodes of the same shape can be manufactured with high precision and efficiency. Further, by electroforming, even if the shape of the plate-like member with the protruding electrodes is a complicated shape, a fine shape, or the like, the reproduction can be performed with high precision.
對使用帶突起電極的板狀構件的電子部件的製造方法 沒有特別的限定，例如，能夠通過圖12(A)至(C)的示意性步驟剖視圖所示的製造步驟實施。圖12(C)的剖視圖是通過所述製造步驟所製造的本實施例的電子部件的結構的示意圖。首先，如圖12(C)所示，該電子部件20包括基板21、晶片31、樹脂41、板狀構件11及具有變形部12A的突起電極12。突起電極12固定在板狀構件11的單面上，並且板狀構件11和突起電極12成為一體而形成帶突起電極的板狀構件。晶片31固定在基板21上，並且被樹脂41密封。在基板21上的晶片31的配置側，形成有配線圖案22。如在圖1中也已說明，突起電極12固定在板狀構件11的單面上。另外，突起電極12貫通所述樹脂41而與配線圖案22接觸。 Method for manufacturing electronic component using plate member with protruding electrode It is not particularly limited, and for example, it can be carried out by the manufacturing steps shown in the schematic step sectional views of FIGS. 12(A) to (C). The cross-sectional view of Fig. 12(C) is a schematic view showing the structure of the electronic component of the present embodiment manufactured by the manufacturing steps. First, as shown in FIG. 12(C), the electronic component 20 includes a substrate 21, a wafer 31, a resin 41, a plate-like member 11, and a bump electrode 12 having a deformed portion 12A. The bump electrode 12 is fixed to one surface of the plate member 11, and the plate member 11 and the bump electrode 12 are integrated to form a plate member having the bump electrode. The wafer 31 is fixed on the substrate 21 and sealed by the resin 41. A wiring pattern 22 is formed on the arrangement side of the wafer 31 on the substrate 21. As also explained in Fig. 1, the projecting electrode 12 is fixed to one surface of the plate member 11. Further, the bump electrode 12 penetrates the resin 41 and comes into contact with the wiring pattern 22.
接著，對圖12(A)至(C)的製造步驟進行說明。首先，如圖12的(A)所示，準備帶突起電極的板狀構件10及基板21。如圖12的(A)所示，在帶突起電極的板狀構件10中，突起電極12固定在板狀構件11的單面，板狀構件11與突起電極12成為一體而形成帶突起電極的板狀構件10。另外，在圖12的(A)中，將突起電極12的與板狀構件11的面方向相垂直的方向上的長度(高度)用箭頭及附圖標記M表示。在基板21上固定有晶片31。在基板21上的晶片31的配置側，形成有配線圖案22。並且，如圖12的(A)所示，將帶突起電極的板狀構件10及基板21以突起電極12的固定面與配線圖案22的形成面面向彼此的方式配置。 Next, the manufacturing steps of FIGS. 12(A) to (C) will be described. First, as shown in FIG. 12(A), the plate-like member 10 with the protruding electrodes and the substrate 21 are prepared. As shown in FIG. 12(A), in the plate-like member 10 with the protruding electrode, the protruding electrode 12 is fixed to one surface of the plate-like member 11, and the plate-like member 11 and the protruding electrode 12 are integrated to form a protruding electrode. Plate member 10. In addition, in (A) of FIG. 12, the length (height) of the projection electrode 12 in the direction perpendicular to the surface direction of the plate-like member 11 is indicated by an arrow and a reference symbol M. A wafer 31 is fixed to the substrate 21. A wiring pattern 22 is formed on the arrangement side of the wafer 31 on the substrate 21. Further, as shown in FIG. 12(A), the plate-like member 10 and the substrate 21 with the protruding electrodes are disposed such that the fixing surface of the protruding electrode 12 and the surface on which the wiring pattern 22 are formed face each other.
然後，如圖12的(B)所示，在板狀構件11的突起電極12固定面與基板21的配線圖案22形成面之間，用樹脂41對晶片31進行密封。在該圖12的(B)中，具有變形部12A的突起電極12沒有收縮。即為突起電極12的與板狀構件11的面方向相垂直的方向上的長度(高度)為與圖12的(A)相同的M。在該狀態下，若突起電極12與配線圖案22接觸且突起電極12的長度與電子部件的規定的厚度吻合，則將其作為電子部件20也可。在突起電極12的長度與電子部件的規定的厚度不吻合的情況下，通過在與板狀構件11的面方向相垂直的方向上進行按壓，縮小板狀構件11與基板21的間隔(距離)，從而使突起電極12的長度與電子部件的規定的厚度吻合。此時，由於突起電極12與基板21的配線圖案22抵接而產生的按壓力會施加於突起電極12。通過該按壓力，突起電極12整體相對地在與板狀構件11的面方向相垂直的方向上受到按壓。通過該按壓，如圖12的(C)所示，突起電極12通過其變形部12A的彎曲，在與板狀構件11的面方向相垂直的方向上收縮。即為如圖12的(C)所示，突起電極12的與板狀構件11的面方向相垂直的方向上的長度(高度)變為比圖12的(A)及(B)中的M更小的數值N(M>N)。由此，突起電極12與所述電子部件的規定的厚度(板狀構件11與基板21的間隔)吻合。另外，在如圖12的(C)所示的狀態下，突起電極12處於與配線圖案22接觸的狀態。通過這種方式，能夠製造圖示的電子部件20。此外，在圖 12中，為便於說明，說明了突起電極12具有“之”字形變形部12A的形狀。但是，如上所述，突起電極12的形狀並不限於此，如上所述，可以是任意形狀。下文中，在包括突起電極12的所有的剖視圖中，都與此相同。 Then, as shown in FIG. 12(B), the wafer 31 is sealed with the resin 41 between the surface on which the bump electrode 12 of the plate member 11 is fixed and the surface on which the wiring pattern 22 of the substrate 21 is formed. In (B) of FIG. 12, the bump electrode 12 having the deformed portion 12A is not shrunk. That is, the length (height) in the direction perpendicular to the surface direction of the plate-like member 11 of the protruding electrode 12 is M which is the same as (A) of FIG. In this state, if the bump electrode 12 is in contact with the wiring pattern 22 and the length of the bump electrode 12 matches the predetermined thickness of the electronic component, it may be used as the electronic component 20. When the length of the bump electrode 12 does not match the predetermined thickness of the electronic component, the gap (distance) between the plate member 11 and the substrate 21 is reduced by pressing in a direction perpendicular to the surface direction of the plate member 11. Thus, the length of the bump electrode 12 coincides with the prescribed thickness of the electronic component. At this time, a pressing force generated by the bump electrode 12 abutting on the wiring pattern 22 of the substrate 21 is applied to the bump electrode 12. By this pressing force, the projecting electrode 12 as a whole is relatively pressed in a direction perpendicular to the surface direction of the plate-like member 11. By this pressing, as shown in FIG. 12(C), the protruding electrode 12 is contracted in a direction perpendicular to the surface direction of the plate-like member 11 by the bending of the deformed portion 12A. That is, as shown in (C) of FIG. 12, the length (height) of the protruding electrode 12 in the direction perpendicular to the plane direction of the plate-like member 11 becomes larger than that of (A) and (B) of FIG. A smaller value N (M>N). Thereby, the bump electrode 12 matches the predetermined thickness of the electronic component (the interval between the plate member 11 and the substrate 21). Further, in the state shown in FIG. 12(C), the bump electrode 12 is in a state of being in contact with the wiring pattern 22. In this way, the illustrated electronic component 20 can be manufactured. In addition, in the figure In the case of 12, the protruding electrode 12 has a shape of a zigzag deformed portion 12A for convenience of explanation. However, as described above, the shape of the bump electrode 12 is not limited thereto, and may be any shape as described above. Hereinafter, in all the cross-sectional views including the protruding electrodes 12, the same is true.
另外，對於板狀構件11沒有特別的限定，如上所述，例如可以是散熱板或遮蔽板(屏蔽板)等。例如，在一個IC(電子部件)中配置有複數個晶片的情況下，考慮到各晶片的功能，通過遮蔽板(屏蔽板)進行電磁屏蔽也可。 Further, the plate-like member 11 is not particularly limited, and as described above, for example, may be a heat dissipation plate or a shielding plate (shield plate). For example, when a plurality of wafers are arranged in one IC (electronic component), electromagnetic shielding may be performed by a shielding plate (shield plate) in consideration of the function of each wafer.
進一步地，帶突起電極的板狀構件可以是與一個基板(一個電子部件)對應的板狀構件，如圖1所示，也可以是與複數個基板(複數個電子部件)對應的板狀構件(矩陣式)。在矩陣式的情況下，例如將分別固定有晶片及配線圖案的複數個基板與所述矩陣式的帶突起電極的板狀構件一同進行樹脂密封。此後，通過切斷等方式，將所述矩陣式的帶突起電極的板狀構件分割成與各基板對應的各區域也可。另外，例如，如上所述，所述突起電極的至少一個是板狀突起電極也可。在此情況下，能夠用所述板狀突起電極劃開(劃分)基板面上的與一個電子部件(一個產品單位)對應的所需範圍(或具有某特定功能的範圍)。 Further, the plate-like member with the protruding electrode may be a plate-like member corresponding to one substrate (one electronic component), as shown in FIG. 1, or may be a plate-shaped member corresponding to a plurality of substrates (a plurality of electronic components) (matrix). In the case of the matrix type, for example, a plurality of substrates each having a wafer and a wiring pattern fixed thereon are resin-sealed together with the matrix-shaped plate-shaped member having the protruding electrodes. Thereafter, the matrix-shaped plate-shaped member with the protruding electrodes may be divided into regions corresponding to the respective substrates by cutting or the like. Further, for example, as described above, at least one of the protruding electrodes may be a plate-like protruding electrode. In this case, the plate-like projection electrode can be used to divide (divide) a desired range (or a range having a specific function) corresponding to one electronic component (one product unit) on the substrate surface.
進一步地，使用晶片已被樹脂密封狀態下的電子部件代替晶片31也可。在此情況下，電子部件20為對電子部件再次進行樹脂密封的形態，因此，晶片31被多次樹脂密封。 Further, it is also possible to use the electronic component in which the wafer has been sealed by the resin instead of the wafer 31. In this case, since the electronic component 20 is in a form in which the electronic component is again resin-sealed, the wafer 31 is resin-sealed a plurality of times.
此外，圖12的(A)至(C)對突起電極12具有變形 部12A的情況進行了說明。在突起電極12不具有變形部12A的情況下，突起電極12的與板狀構件11的面方向相垂直的方向上的長度(高度)，在與板狀構件11的面方向相垂直的方向上不收縮。除此之外，在突起電極12不具有變形部12A的情況下，與圖12的(A)至(C)相同地，也能夠製造帶突起電極的板狀構件10。但是，若突起電極12具有變形部12A，則如以上所述，無需按照成品的(樹脂密封後)電子部件的厚度來設計所述突起電極的高度。因此，能夠簡便且有效地製造同時具有通孔電極(突起電極)及板狀構件的電子部件是較佳的。例如，如上所述，考慮到突起電極12在與板狀構件11的面方向相垂直的方向上收縮，可以預先將突起電極12的高度(長度)設定為比成品的(樹脂密封後)電子部件的樹脂厚度(封裝體厚度)稍大。 Further, (A) to (C) of FIG. 12 have deformation of the bump electrode 12 The case of the part 12A has been described. In the case where the protruding electrode 12 does not have the deformed portion 12A, the length (height) in the direction perpendicular to the surface direction of the plate-like member 11 of the protruding electrode 12 is in a direction perpendicular to the surface direction of the plate-like member 11. Does not shrink. In addition, when the protruding electrode 12 does not have the deformed portion 12A, the plate-like member 10 with the protruding electrode can be manufactured similarly to (A) to (C) of FIG. 12 . However, if the bump electrode 12 has the deformed portion 12A, as described above, it is not necessary to design the height of the bump electrode in accordance with the thickness of the finished (resin-sealed) electronic component. Therefore, it is preferable to easily and efficiently manufacture an electronic component having a via electrode (protrusion electrode) and a plate member. For example, as described above, in consideration of the contraction of the protruding electrode 12 in a direction perpendicular to the surface direction of the plate-like member 11, the height (length) of the protruding electrode 12 can be set to be higher than that of the finished (resin-sealed) electronic component. The resin thickness (package thickness) is slightly larger.
此外，在圖12的(A)至(C)中，對使用帶突起電極的板狀構件的電子部件的製造方法進行了示意性地舉例示出，但如上所述，並不特別限定於該方法。對電子部件的製造方法的更具體的例子，在後述的各實施方案中進行說明。 Further, in (A) to (C) of FIG. 12, a method of manufacturing an electronic component using a plate-like member having a bump electrode is schematically illustrated, but as described above, it is not particularly limited to the method. More specific examples of the method of manufacturing the electronic component will be described in each of the embodiments described later.
實施例2 Example 2
接著，對通過壓縮成形製造帶突起電極的板狀構件的一例進行說明。 Next, an example of manufacturing a plate-shaped member having a protruding electrode by compression molding will be described.
在圖10的(A)至(H)的步驟剖視圖(其中，僅圖10的(A)是俯視圖)中，示意性的顯示出了本實施例的 通過壓縮成形製造帶突起電極的板狀構件的步驟。此外，關於圖10的(A)至(H)的步驟剖視圖，為了方便，分成圖10a(圖10的(A)至(D))及圖10b(圖10的(E)至(H))這兩個圖，圖10a及圖10b總稱為圖10。 In the cross-sectional view of steps (A) to (H) of FIG. 10 (in which only (A) of FIG. 10 is a plan view), the present embodiment is schematically shown. The step of producing a plate-like member with protruding electrodes by compression molding. Further, regarding the step sectional views of (A) to (H) of FIG. 10, for convenience, it is divided into FIG. 10a ((A) to (D) of FIG. 10) and FIG. 10b ((E) to (H) of FIG. 10). These two figures, Fig. 10a and Fig. 10b, are collectively referred to as Fig. 10.
首先，如圖10的(A)的俯視圖所示，準備金屬框體(框)3001。如圖10的(A)所示，該金屬框體(框)3001為矩形(長方形)，在其中央部分具有長方形的貫通孔(開口部)3001a。但是，金屬框體3001及貫通孔3001a的形狀並不限定於矩形，可以是任意形狀，能夠根據帶突起電極的板狀構件的形狀等進行適當的選擇。 First, as shown in the plan view of FIG. 10(A), a metal casing (frame) 3001 is prepared. As shown in FIG. 10(A), the metal frame (frame) 3001 has a rectangular shape (rectangular shape), and has a rectangular through hole (opening) 3001a at a central portion thereof. However, the shape of the metal casing 3001 and the through hole 3001a is not limited to a rectangular shape, and may be any shape, and can be appropriately selected depending on the shape of the plate-shaped member with the protruding electrode or the like.
接著，如圖10的(B)的剖視圖所示，將金屬框體3001黏貼在與金屬框體3001相同形狀和相同尺寸的黏合片3002的單面上。就黏合片3002而言，在金屬框體3001黏貼一側的面上，附有黏合劑。通過由設置在成形模的上模的吸附孔(未圖示)進行吸引，可以使黏合片3002上的與金屬框體3001黏貼一側成相反側的面吸附在所述上模。另外，在黏合片3002的金屬框體3001黏貼一側，如後述，可以使帶突起電極的板狀構件黏合在從貫通孔3001a露出的黏合面。 Next, as shown in the cross-sectional view of FIG. 10(B), the metal frame 3001 is adhered to one surface of the adhesive sheet 3002 having the same shape and the same size as the metal frame 3001. In the adhesive sheet 3002, a bonding agent is attached to the surface on which the metal frame 3001 is adhered. By suctioning by an adsorption hole (not shown) provided in the upper mold of the molding die, the surface on the opposite side to the side where the metal frame body 3001 is adhered to the bonding sheet 3002 can be adsorbed to the upper mold. Moreover, the metal frame 3001 of the adhesive sheet 3002 is adhered to the side, and as will be described later, the plate-shaped member with the protruding electrode can be bonded to the adhesive surface exposed from the through hole 3001a.
接著，如圖10的(C)至(G)所示，通過壓縮成形來製造帶突起電極的板狀構件。首先，如圖10的(C)所示，使黏合片3002及金屬框體3001吸附在成形模的上模3003。該吸附例如能夠通過由來自上述的上模3003的吸附孔(未圖示)的吸引而進行的減壓(抽真空)來實施。另 外，該成形模是用於製造帶突起電極的板狀構件的壓縮成形裝置的一部分。圖10的(C)的剖視圖是顯示出該成形模的一部分的結構的示意圖。另外，該圖10的(C)顯示出了在對成形模進行合模之前的開模的狀態下，並且供應過樹脂4001的狀態。 Next, as shown in (C) to (G) of FIG. 10, a plate-like member with a protruding electrode is produced by compression molding. First, as shown in FIG. 10(C), the adhesive sheet 3002 and the metal frame 3001 are attracted to the upper mold 3003 of the forming mold. This adsorption can be carried out, for example, by pressure reduction (vacuum extraction) by suction from an adsorption hole (not shown) of the upper mold 3003 described above. another Further, the forming die is a part of a compression molding apparatus for manufacturing a plate-like member having a protruding electrode. The cross-sectional view of (C) of Fig. 10 is a schematic view showing the structure of a part of the forming mold. In addition, (C) of FIG. 10 shows a state in which the resin 4001 is supplied in a state in which the mold is opened before the mold is closed.
如圖10的(C)所示，該成形模以上模3003和以與上模面向配置的下模3004為主要構成要素。如圖10的(C)所示，能夠將黏貼有金屬框體3001的黏合片3002以金屬框體3001一側朝向下方的狀態吸附(安裝)在上模3003的模面(下表面)，並進行固定。 As shown in FIG. 10(C), the forming die upper die 3003 and the lower die 3004 disposed facing the upper die are main components. As shown in FIG. 10(C), the adhesive sheet 3002 to which the metal frame 3001 is adhered can be adsorbed (mounted) on the die surface (lower surface) of the upper mold 3003 with the metal frame 3001 side facing downward. Fix it.
上模3003以從上模底板3011垂下的狀態設置。在上模底板3011上的上模3003的外周位置，設置有上模外氣隔斷構件3013。在上模外氣隔斷構件3013的上端面(被上模底板3011及上模外氣隔斷構件3013夾住的部分)，設置有用於隔斷外氣的O型環3013a。另外，在上模外氣隔斷構件3013的下端面，也設置有用於隔斷外氣的O型環3013b。另外，在上模底板3011，設置有用於强制性地吸引模內空間部的空氣並將其排出的上模的孔(貫通孔)3012。 The upper mold 3003 is provided in a state of being suspended from the upper mold base plate 3011. An upper outer mold air shutoff member 3013 is provided at an outer peripheral position of the upper mold 3003 on the upper mold bottom plate 3011. An O-ring 3013a for blocking the outside air is provided on the upper end surface of the upper die outer air blocking member 3013 (the portion sandwiched by the upper die bottom plate 3011 and the upper die outer air blocking member 3013). Further, an O-ring 3013b for blocking the outside air is also provided on the lower end surface of the upper die outer air blocking member 3013. Further, the upper mold base plate 3011 is provided with a hole (through hole) 3012 for the upper mold for forcibly sucking and discharging the air in the in-mold space portion.
另外，下模3004由下模腔底面構件3005a、下模外周構件3006及下模彈性構件3006a形成。進一步地，就下模腔底面構件3005a而言，在其模面(上表面)包括作為用於樹脂成形的空間的模腔(下模腔)3005b。下模腔底面構件3005a設置在下模腔3005b的下方。下模腔底面構件 3005a的模面(上表面)呈與帶突起電極的板狀構件的、板狀構件的突起電極固定面一側相對應的形狀。另外，下模腔3005b具有與帶突起電極的板狀構件的、突起電極的形狀相對應的孔。下模外周構件(下模的框體、模腔側面構件)3006以包圍下模腔底面構件3005a的周圍的方式配置。下模外周構件3006上表面的高度比下模腔底面構件3005a上表面的高度更高。由此，形成了由下模腔底面構件3005a上表面和下模外周構件3006內周面所包圍的下模腔(凹部)3005b。在下模腔底面構件3005a與下模外周構件3006之間，形成有空隙(吸附孔)3006c。如下所述，使用真空泵(未圖示)對該空隙3006c進行減壓，由此可以吸附離型膜等。另外，下模3004(下模腔底面構件3005a、下模外周構件3006及下模彈性構件3006a)以載置於下模底板3005的狀態設置。緩衝用的下模彈性構件3006a設置在下模外周構件3006與下模底板3005之間。進一步地，在下模底板3005上的下模外周構件3006的外周位置設置有下模外氣隔斷構件3021。在下模外氣隔斷構件3021的下端面(被下模底板3005及下模外氣隔斷構件3021夾住的部分)，設置有外氣隔斷用的O型環3021a。下模外氣隔斷構件3021配置在上模外氣隔斷構件3013及用於隔斷外氣的O型環3013b的正下方。通過具備以上結構，在上下兩模進行合模時，通過接合包括O型環3013a及O型環3013b的上模外氣隔斷構件3013與包括O型環3021a的下模外氣隔斷構件3021，至少能夠使下模腔3005b 內處於外氣隔斷狀態。 Further, the lower mold 3004 is formed by the lower cavity bottom surface member 3005a, the lower mold outer peripheral member 3006, and the lower mold elastic member 3006a. Further, as for the lower cavity bottom surface member 3005a, a cavity (lower cavity) 3005b as a space for resin molding is included on the die face (upper surface) thereof. The lower cavity bottom surface member 3005a is disposed below the lower cavity 3005b. Lower cavity bottom member The die surface (upper surface) of 3005a has a shape corresponding to the side of the protruding electrode fixing surface of the plate-like member of the plate-like member with the protruding electrode. Further, the lower mold cavity 3005b has a hole corresponding to the shape of the protruding electrode of the plate-like member with the protruding electrode. The lower mold outer peripheral member (the lower mold frame body and the cavity side surface member) 3006 is disposed to surround the lower cavity bottom surface member 3005a. The height of the upper surface of the lower mold outer peripheral member 3006 is higher than the height of the upper surface of the lower cavity bottom surface member 3005a. Thereby, a lower cavity (recess) 3005b surrounded by the upper surface of the lower cavity bottom surface member 3005a and the inner circumferential surface of the lower die outer peripheral member 3006 is formed. A gap (adsorption hole) 3006c is formed between the lower cavity bottom surface member 3005a and the lower die outer circumferential member 3006. The void 3006c is depressurized by a vacuum pump (not shown) as described below, whereby a release film or the like can be adsorbed. Further, the lower mold 3004 (the lower cavity bottom surface member 3005a, the lower mold outer peripheral member 3006, and the lower mold elastic member 3006a) is provided in a state of being placed on the lower mold bottom plate 3005. The lower mold elastic member 3006a for cushioning is disposed between the lower mold outer peripheral member 3006 and the lower mold bottom plate 3005. Further, a lower die outer air blocking member 3021 is provided at an outer peripheral position of the lower die outer peripheral member 3006 on the lower die bottom plate 3005. The lower end surface of the lower die outer air blocking member 3021 (the portion sandwiched by the lower die bottom plate 3005 and the lower die outer air blocking member 3021) is provided with an O-ring 3021a for external air shutoff. The lower die outer air blocking member 3021 is disposed directly below the upper die outer air blocking member 3013 and the O-ring 3013b for blocking the outside air. By having the above configuration, when the upper and lower molds are closed, the upper outer air blocking member 3013 including the O-ring 3013a and the O-ring 3013b and the lower outer air blocking member 3021 including the O-ring 3021a are joined, at least Capable of making the lower mold cavity 3005b The inside is in an air-tight state.
接著，如圖10的(C)所示，將樹脂4001供應至下模腔3005b內。如圖10的(C)所示，樹脂4001載置在離型膜5001上。離型膜5001吸附在下模腔3005b的上表面(模腔面)。樹脂4001經由離型膜5001配置(設置)在下模腔3005b內。如該圖10的(C)的箭頭3007所示，通過使用真空泵(未圖示)吸附下模的吸附孔3006c進行減壓，離型膜5001吸附在下模腔3005b的模腔面。由此，下模腔3005b的模腔面被離型膜5001所覆蓋。此外，對將離型膜5001及樹脂4001供應至下模腔3005b內並進行設置的方法沒有特別的限定，例如，採用與後述的圖28至圖30所示方法相同的方法也可。即為首先，將具有貫通孔的矩形形狀的框(框體)載置於離型膜5001上，形成向貫通孔內供應樹脂4001的“樹脂供應框體”。搬運該“樹脂供應框體”，使其進入上模3003與下模3004之間(下模腔3005b的位置)。然後，如上所述，使離型膜5001吸附在下模腔3005b的模腔面後，僅去除所述矩形形狀的框(框體)。另外，圖10的(C)顯示出了樹脂4001處於熔融的狀態。與後述的圖28至圖30相同地，可以將樹脂4001例如以顆粒樹脂狀態搬運至上模3003與下模3004之間。然後，按照所述方式，在將樹脂4001設置在下模腔3005b內後，能夠通過加熱使下模3004熔融。 Next, as shown in (C) of FIG. 10, the resin 4001 is supplied into the lower cavity 3005b. As shown in FIG. 10(C), the resin 4001 is placed on the release film 5001. The release film 5001 is adsorbed on the upper surface (cavity surface) of the lower mold cavity 3005b. The resin 4001 is disposed (arranged) in the lower mold cavity 3005b via the release film 5001. As shown by an arrow 3007 in FIG. 10(C), the pressure is reduced by suction of the adsorption hole 3006c of the lower mold by using a vacuum pump (not shown), and the release film 5001 is adsorbed on the cavity surface of the lower cavity 3005b. Thereby, the cavity surface of the lower mold cavity 3005b is covered by the release film 5001. In addition, the method of supplying the release film 5001 and the resin 4001 to the lower cavity 3005b is not particularly limited, and for example, the same method as the method shown in FIGS. 28 to 30 to be described later may be employed. In other words, a rectangular frame (frame) having a through hole is placed on the release film 5001 to form a "resin supply frame" for supplying the resin 4001 into the through hole. The "resin supply frame" is carried so as to enter between the upper mold 3003 and the lower mold 3004 (the position of the lower mold cavity 3005b). Then, as described above, after the release film 5001 is adsorbed on the cavity surface of the lower cavity 3005b, only the rectangular frame (frame) is removed. In addition, (C) of FIG. 10 shows that the resin 4001 is in a molten state. Similarly to FIGS. 28 to 30 to be described later, the resin 4001 can be transported between the upper mold 3003 and the lower mold 3004, for example, in a particulate resin state. Then, in the manner described above, after the resin 4001 is placed in the lower mold cavity 3005b, the lower mold 3004 can be melted by heating.
接著，對上下兩模進行合模。首先，如圖10的(D)所示，進行使金屬框體3001的下表面(黏合片3002的黏 貼面的相反側)及被離型膜5001所覆蓋的下模外周構件3006的上表面保持所需間隔的狀態的中間合模。即為首先，從圖10的(C)的狀態，使下模3004側向箭頭3031的方向上移。由此，如圖10的(D)所示，將上模外氣隔斷構件3013及下模外氣隔斷構件3021在夾住O型環3013b的狀態下閉合。通過這種方式，如該圖10的(D)所示，形成由上模3003、下模3004、上模外氣隔斷構件3013及下模外氣隔斷構件3021所包圍的外氣隔斷空間部。在該狀態下，如該圖10的(D)的箭頭3014所示，使用真空泵(未圖示)，經由設置在上模底板3011的上模的孔3012，至少吸引所述外氣隔斷空間部，並對其進行減壓，從而將其設定為規定的真空度。 Next, the upper and lower molds are clamped. First, as shown in FIG. 10(D), the lower surface of the metal frame 3001 (adhesive of the adhesive sheet 3002) is performed. The opposite side of the veneer and the intermediate mold in a state in which the upper surface of the lower mold outer peripheral member 3006 covered by the release film 5001 is maintained at a desired interval. That is, first, from the state of (C) of FIG. 10, the lower mold 3004 is moved upward in the direction of the arrow 3031. Thereby, as shown in FIG. 10(D), the upper mold outer air blocking member 3013 and the lower outer mold air blocking member 3021 are closed while sandwiching the O-ring 3013b. In this manner, as shown in FIG. 10(D), the outer air partition space portion surrounded by the upper mold 3003, the lower mold 3004, the upper outer mold air shutoff member 3013, and the lower outer mold air shutoff member 3021 is formed. In this state, as shown by an arrow 3014 in FIG. 10(D), at least the outer air partition space portion is sucked through a hole 3012 provided in the upper mold of the upper mold base plate 3011 by using a vacuum pump (not shown). And depressurize it to set it to a prescribed degree of vacuum.
進一步地，如圖10的(E)所示，接合金屬框體3001的下表面與被離型膜5001覆蓋的下模外周構件3006的上表面而進行完全合模。即為從圖10的(D)的狀態，使下模3004進一步上移。由此，如圖10的(E)所示，使經由黏合片3002安裝(吸附)(固定)在上模3003的金屬框體3001介由離型膜5001抵接於下模外周構件3006。之後，使下模底板3005進一步上移，由此使下模腔底面構件3005a進一步上移。此外，此時，使樹脂4001處於具有流動性的狀態。如圖10的(E)所示，通過下模腔底面構件3005a的上移產生的按壓力，樹脂4001的上表面與黏合片3002的從金屬框體3001的貫通孔3001a露出的部分黏合。此時，下模彈性構件3006a及O型環3013a、O型環 3013b、O型環3021a收縮，從而發揮緩衝的功能。通過這種方式，對樹脂4001進行加壓實施壓縮成形。之後，使樹脂4001固化。由此，如圖10的(E)至(H)所示，能夠成形在板狀構件11的單面形成有突起電極12的帶突起電極的板狀構件10。 Further, as shown in FIG. 10(E), the lower surface of the joined metal frame 3001 and the upper surface of the lower die outer peripheral member 3006 covered by the release film 5001 are completely closed. That is, the lower mold 3004 is further moved upward from the state of (D) of FIG. Thereby, as shown in FIG. 10(E), the metal casing 3001 attached (adsorbed) (fixed) to the upper mold 3003 via the adhesive sheet 3002 is brought into contact with the lower mold outer peripheral member 3006 via the release film 5001. Thereafter, the lower mold bottom plate 3005 is further moved upward, thereby further moving the lower cavity bottom surface member 3005a upward. Further, at this time, the resin 4001 is brought into a state of fluidity. As shown in FIG. 10(E), the upper surface of the resin 4001 is bonded to the portion of the adhesive sheet 3002 exposed from the through hole 3001a of the metal casing 3001 by the pressing force generated by the upward movement of the lower cavity bottom surface member 3005a. At this time, the lower mold elastic member 3006a and the O-ring 3013a, the O-ring The 3013b and the O-ring 3021a are contracted to function as a buffer. In this manner, the resin 4001 is pressurized to perform compression molding. Thereafter, the resin 4001 is cured. Thereby, as shown in FIGS. 10(E) to (H), the plate-like member 10 with the protruding electrodes on which the protruding electrodes 12 are formed on one surface of the plate-like member 11 can be formed.
圖10的(E)至(H)所示的步驟例如能夠按照以下方式實施。即為首先，從圖10的(E)的狀態，在經過樹脂4001的固化所需的必要的時間之後，使真空泵停止工作，解除經由設置在上模底板3011的上模的孔3012來吸引的減壓(抽真空)。此時，可以解除對下模腔底面構件3005a與下模外周構件3006之間的空隙進行的減壓(抽真空)，但較佳為不進行解除，保持使離型膜5001吸附在下模腔底面構件3005a的狀態。其目的在於使在後進行的將帶突起電極的板狀構件10從離型膜5001分離(脫模)的步驟易於實施。接著，使下模3004(下模腔底面構件3005a、下模外周構件3006及下模彈性構件3006a)與下模底板3005一同向箭頭3032的方向下降。由此，對由上模3003、下模3004、上模外氣隔斷構件3013及下模外氣隔斷構件3021所包圍的所述外氣隔斷空間部內進行了開放，並解除減壓。由此，如圖10的(F)所示，對上模3003及下模3004進行開模。之後，如該圖10的(F)所示，在與板狀構件11的突起電極12固定面成相反側的面和黏合片3002黏合的狀態下，帶突起電極的板狀構件10從離型膜5001分離(脫模)。 The steps shown in (E) to (H) of FIG. 10 can be implemented, for example, in the following manner. In other words, first, from the state of (E) of FIG. 10, after the necessary time required for the curing of the resin 4001, the vacuum pump is stopped, and the suction is performed via the hole 3012 provided in the upper mold of the upper mold base plate 3011. Decompression (vacuum). At this time, the pressure reduction (vacuum) of the gap between the lower cavity bottom surface member 3005a and the lower mold outer circumferential member 3006 can be released, but it is preferable not to release the release film 5001 to be adsorbed on the bottom surface of the lower cavity. The state of the member 3005a. The purpose of this is to facilitate the step of separating (releasing) the plate-like member 10 with the protruding electrodes from the release film 5001. Next, the lower mold 3004 (the lower cavity bottom surface member 3005a, the lower mold outer peripheral member 3006, and the lower mold elastic member 3006a) is lowered in the direction of the arrow 3032 together with the lower mold bottom plate 3005. Thereby, the inside of the outside air partition space surrounded by the upper die 3003, the lower die 3004, the upper die outer air blocking member 3013, and the lower die outer air blocking member 3021 is opened, and the pressure reduction is released. Thereby, as shown in FIG. 10(F), the upper mold 3003 and the lower mold 3004 are opened. Then, as shown in FIG. 10(F), in a state in which the surface opposite to the surface on which the projection electrode 12 of the plate member 11 is fixed and the adhesive sheet 3002 are bonded, the plate-like member 10 with the protruding electrode is released from the mold. The membrane 5001 is separated (released).
然後，解除基於由上述的上模3003的吸附孔(未圖示)的吸引而進行的減壓(抽真空)。由此，如圖10的(G)所示，將黏合片3002與金屬框體3001及帶突起電極的板狀構件10一同從上模3003取出。進一步地，如圖10的(H)所示，將帶突起電極的板狀構件10(板狀構件11)從黏合片3002及金屬框體3001揭下。按照以上的方式，能夠製造帶突起電極的板狀構件10。此外，在金屬框體3001的內周(貫通孔3001a周圍的、與板狀構件11接觸的部分)，可以預先塗布脫模劑(對此沒有特別的限定，例如，可以是氟系脫模劑等)。由此，相對於板狀構件11的脫模性提高，從而易於拿下帶突起電極的板狀構件10。 Then, the pressure reduction (vacuum) by the suction of the adsorption hole (not shown) of the upper mold 3003 described above is released. Thereby, as shown in FIG. 10(G), the adhesive sheet 3002 is taken out from the upper mold 3003 together with the metal frame 3001 and the plate-like member 10 with the protruding electrodes. Further, as shown in (H) of FIG. 10, the plate-like member 10 (plate-like member 11) with the protruding electrodes is peeled off from the adhesive sheet 3002 and the metal frame 3001. According to the above manner, the plate-like member 10 with the protruding electrodes can be manufactured. Further, in the inner circumference of the metal frame 3001 (the portion around the through hole 3001a that is in contact with the plate-like member 11), the release agent may be applied in advance (this is not particularly limited, and for example, it may be a fluorine-based release agent) Wait). Thereby, the mold release property with respect to the plate-shaped member 11 is improved, and it is easy to take off the plate-shaped member 10 with a protrusion electrode.
另外，對帶突起電極的板狀構件10的形成材料也沒有特別的限定，例如，可以是導電性樹脂，也可以是非導電性樹脂。對所述導電性樹脂沒有特別的限定，例如，可以是樹脂及導電性粒子的混合物。對所述導電性粒子沒有特別的限定，例如，可以舉出金屬粒子等。對所述金屬粒子中的金屬也沒有特別的限定，例如，可以舉出金、銀、銅、鎳、錫、其他任意的金屬及包括兩種以上這些金屬的合金等。另外，例如，在通過所述成形模實施的成形步驟之後，在使用所述導電性樹脂或非導電性樹脂(尤其是非導電性樹脂)而形成的帶突起電極的板狀構件的所述突起電極側的面上，可以附加導電性膜。對所述導電性膜沒有特別的限定，例如，可以舉出金屬等的膜。對所述導電性膜中的金屬也沒有特別的限定，例如，可以舉出金、銀、銅、鎳、 錫及包括兩種以上這些金屬的合金等。對所述導電性膜的形成方法也沒有特別的限定，例如，可以舉出電鍍、塗敷、濺射、蒸鍍等。所述電鍍例如可以是無電解電鍍，也可以是電解電鍍。 Further, the material for forming the plate-like member 10 having the protruding electrode is not particularly limited, and may be, for example, a conductive resin or a non-conductive resin. The conductive resin is not particularly limited, and may be, for example, a mixture of a resin and conductive particles. The conductive particles are not particularly limited, and examples thereof include metal particles and the like. The metal in the metal particles is not particularly limited, and examples thereof include gold, silver, copper, nickel, tin, any other metal, and an alloy including two or more of these metals. Further, for example, after the forming step by the molding die, the protruding electrode of the plate-like member having the protruding electrode formed using the conductive resin or the non-conductive resin (particularly, a non-conductive resin) A conductive film may be added to the side surface. The conductive film is not particularly limited, and examples thereof include a film of metal or the like. The metal in the conductive film is also not particularly limited, and examples thereof include gold, silver, copper, and nickel. Tin and alloys including two or more of these metals. The method for forming the conductive film is not particularly limited, and examples thereof include plating, coating, sputtering, vapor deposition, and the like. The electroplating may be, for example, electroless plating or electrolytic plating.
另外，採用壓縮成形的帶突起電極的板狀構件的製造方法並不限定於本例(圖10的(A)至(H))，對其可以進行適當的變更。例如，在本例中，將具有貫通孔3001a的金屬框體3001黏貼在黏合片3002來使用，但也可以使用不具有貫通孔的金屬板或樹脂薄片來代替。所述金屬板或樹脂薄片例如可以不經由黏合片3002，而通過黏合劑，或通過由真空泵進行吸引(減壓)等黏貼在上模3003。另外，為了提高與帶突起電極的板狀構件的脫模性，從而易於分離，在所述金屬板或樹脂薄片可以預先塗布脫模劑(對此沒有特別的限定，例如，可以是氟系脫模劑等)。 In addition, the manufacturing method of the plate-shaped member with a projection electrode which is formed by compression is not limited to this example (FIG. 10 (A)-(H)), and can be suitably changed. For example, in the present embodiment, the metal frame 3001 having the through hole 3001a is adhered to the adhesive sheet 3002, but a metal plate or a resin sheet having no through hole may be used instead. The metal plate or the resin sheet can be adhered to the upper mold 3003 by, for example, an adhesive or by suction (decompression) by a vacuum pump, without passing through the adhesive sheet 3002. In addition, in order to improve the mold release property of the plate-like member with the protruding electrode and to facilitate separation, the metal plate or the resin sheet may be previously coated with a release agent (this is not particularly limited, and for example, it may be a fluorine-based release). Molding agent, etc.).
實施例3 Example 3
接著，對通過傳遞模塑製造帶突起電極的板狀構件的一例進行說明。 Next, an example of manufacturing a plate-like member having a protruding electrode by transfer molding will be described.
在圖11的剖視圖中，示意性的顯示出在板狀構件11的單面固定有突起電極12的帶突起電極的板狀構件10的製造方法的一例。如上所述，該製造方法是採用傳遞模塑的製造方法。 In the cross-sectional view of Fig. 11, an example of a method of manufacturing the plate-like member 10 with the protruding electrodes to which the protruding electrodes 12 are fixed on one surface of the plate member 11 is schematically shown. As described above, the manufacturing method is a manufacturing method using transfer molding.
如圖11所示，該製造方法能夠採用用於一般的傳遞模塑的成形模6000而進行。如圖11所示，成形模6000包括上模6001及下模6002。在上模6001的模面設置有用於樹 脂成形的模腔6003，在下模6002的模面設置有用於供應設置黏合片3002的設置部6004，在黏合片3002黏貼有與實施例2(圖10)相同的金屬框體3001。另外，如圖11所示，上模的模腔6003具有與板狀構件11及突起電極12的凹凸相對應的(使所述凹凸顛倒)形狀。 As shown in Fig. 11, the manufacturing method can be carried out using a molding die 6000 for general transfer molding. As shown in FIG. 11, the forming die 6000 includes an upper die 6001 and a lower die 6002. The mold surface of the upper mold 6001 is provided for the tree In the die-forming cavity 6003, a mounting portion 6004 for supplying the adhesive sheet 3002 is provided on the mold surface of the lower mold 6002, and the same metal frame 3001 as in the second embodiment (FIG. 10) is adhered to the adhesive sheet 3002. Further, as shown in FIG. 11, the cavity 6003 of the upper mold has a shape corresponding to the unevenness of the plate-like member 11 and the protruding electrode 12 (the unevenness is reversed).
另外，在上模6001設置有用於供應樹脂材料的樹脂通道(孔)6005。用於對樹脂加壓的加料腔6006及柱塞6007與樹脂通道6005連接。 In addition, a resin passage (hole) 6005 for supplying a resin material is provided in the upper mold 6001. A charging chamber 6006 and a plunger 6007 for pressurizing the resin are connected to the resin passage 6005.
對採用圖11所示的裝置的傳遞模塑的方法沒有特別的限定，按照一般的傳遞模塑的方法進行也可。即為首先，如圖11所示，在將金屬框體3001朝向上的(與下模6002的模面成相反側)的狀態下，將黏貼有金屬框體3001的黏合片3002供應設置在下模6002的模面(上表面)的設置部6004。進一步地，向加料腔6006內供應樹脂片、液態樹脂(例如，熱固性樹脂)等樹脂材料。然後，將上模6001及下模6002進行合模。接著，在加料腔6006內加熱樹脂而使其熔融化，通過使用柱塞6007對加料腔6006內的熔融樹脂4001進行加壓，從而能夠從上模6001的樹脂通道6005內向上模6001的模腔6003內注入熔融樹脂4001。此時，能夠用所述柱塞6007向模腔6003內的樹脂施加所需的樹脂壓力。 The method of transfer molding using the apparatus shown in Fig. 11 is not particularly limited, and it may be carried out in accordance with a general transfer molding method. That is, first, as shown in FIG. 11, in a state in which the metal casing 3001 is directed upward (opposite to the die surface of the lower mold 6002), the adhesive sheet 3002 to which the metal casing 3001 is adhered is supplied and disposed in the lower mold. A setting portion 6004 of a die face (upper surface) of 6002. Further, a resin material such as a resin sheet or a liquid resin (for example, a thermosetting resin) is supplied into the charging chamber 6006. Then, the upper mold 6001 and the lower mold 6002 are clamped. Next, the resin is heated and melted in the charging chamber 6006, and the molten resin 4001 in the charging chamber 6006 is pressurized by using the plunger 6007, so that the cavity of the mold 6001 can be upwardly molded from the resin passage 6005 of the upper mold 6001. Molten resin 4001 is injected into 6003. At this time, the plunger 6007 can be used to apply a desired resin pressure to the resin in the cavity 6003.
經過固化所需的時間後，通過將上模6001及下模6002進行開模，在模腔6003內，能夠成形在板狀構件11的單面固定有突起電極12的帶突起電極的板狀構件10。 After the time required for the curing, the upper mold 6001 and the lower mold 6002 are opened, and in the cavity 6003, the plate-like member with the protruding electrodes to which the protruding electrodes 12 are fixed on one side of the plate member 11 can be formed. 10.
此外，傳遞模塑的條件等並不限定於圖11的條件，可任意進行變更。例如，為了提高上模6001的脫模性(使其與成形後的帶突起電極的板狀構件10易於分離)，例如，可以用離型膜覆蓋上模6001的模腔6003，也可以在上模6001設置頂出銷(ejector)。另外，例如，在圖11中，金屬框體3001及模腔6003朝上，但將其上下顛倒，使其成為金屬框體3001及模腔6003朝下的結構也可。即為將模腔6003設置在下模6002來代替設置在上模6001，將設置部6004設置在上模6001來代替設置在下模6002也可。 Further, the conditions of transfer molding and the like are not limited to the conditions of FIG. 11 and can be arbitrarily changed. For example, in order to improve the mold release property of the upper mold 6001 (to be easily separated from the formed plate-like member 10 with the protruding electrodes), for example, the mold cavity 6003 of the upper mold 6001 may be covered with a release film, or may be The die 6001 is provided with an ejector. Further, for example, in FIG. 11, the metal frame 3001 and the cavity 6003 are directed upward, but the metal frame 3001 and the cavity 6003 may be turned upside down. That is, instead of being disposed in the upper mold 6001, the mold portion 6003 may be disposed in the lower mold 6002, and the installation portion 6004 may be disposed in the upper mold 6001 instead of the lower mold 6002.
另外，在用傳遞模塑進行成形時，例如，將模腔內等設定為規定的真空度而進行傳遞模塑也可。對設定為所述規定真空度的方法也沒有特別的限定，例如可以採用基於一般的傳遞模塑的方法。 Further, in the case of molding by transfer molding, for example, the inside of the cavity may be set to a predetermined degree of vacuum to perform transfer molding. The method of setting the predetermined degree of vacuum is also not particularly limited, and for example, a method based on general transfer molding can be employed.
對所述傳遞模塑所使用的裝置沒有特別的限定，例如，與一般的用於傳遞模塑的裝置相同也可。另外，對所述樹脂密封步驟的具體條件也沒有特別的限定，例如與一般的傳遞模塑相同也可。 The apparatus used for the transfer molding is not particularly limited, and for example, it may be the same as a general apparatus for transfer molding. Further, the specific conditions of the resin sealing step are not particularly limited, and may be, for example, the same as general transfer molding.
實施例4 Example 4
接著，對採用本發明的帶突起電極的板狀構件的、電子部件的製造方法的一例進行說明。在本實施例中，對通過傳遞模塑製造電子部件的一例進行說明。 Next, an example of a method of manufacturing an electronic component using the plate-shaped member with a bump electrode of the present invention will be described. In the present embodiment, an example of manufacturing an electronic component by transfer molding will be described.
在圖13的剖視圖中，示意性的顯示出圖12的電子部件的製造方法的一例。如上所述，該製造方法為使用傳遞模塑的製造方法。另外，在該圖13中，對突起電極12具 有變形部12A的情況進行說明。 In the cross-sectional view of Fig. 13, an example of a method of manufacturing the electronic component of Fig. 12 is schematically shown. As described above, the manufacturing method is a manufacturing method using transfer molding. In addition, in FIG. 13, the protrusion electrode 12 is provided. The case where the deformed portion 12A is provided will be described.
如圖13所示，該製造方法能夠使用用於一般的傳遞模塑的成形模50而進行。如圖13所示，成形模50包括上模51及下模52。在上模51的模面設置有用於樹脂成形的模腔56，在下模52的模面設置有用於供應設置基板21的基板設置部57，在所述基板21設置有晶片31及配線圖案22。 As shown in Fig. 13, this manufacturing method can be carried out using a molding die 50 for general transfer molding. As shown in FIG. 13, the forming die 50 includes an upper die 51 and a lower die 52. A cavity 56 for resin molding is provided on the mold surface of the upper mold 51, and a substrate installation portion 57 for supplying the installation substrate 21 is provided on the mold surface of the lower mold 52. The substrate 31 and the wiring pattern 22 are provided on the substrate 21.
另外，在下模52設置有用於供應樹脂材料的加料腔(孔)54，在加料腔內嵌入安裝有用於加壓樹脂的柱塞(plunger)53。 Further, a feeding chamber (hole) 54 for supplying a resin material is provided in the lower mold 52, and a plunger 53 for pressurizing the resin is fitted in the charging chamber.
對使用圖13所示裝置的傳遞模塑的方法沒有特別的限定，按照一般的傳遞模塑方法進行也可。即為首先，向所述加料腔54內供應樹脂片、液態樹脂(例如，熱固性樹脂)等樹脂材料，且在所述基板設置部57供應設置基板21，然後將上模51及下模52進行合模。此時，如圖13所示，通過變形部12A的彎曲，突起電極12在與板狀構件11的面方向相垂直的方向上收縮。由此，突起電極12與樹脂密封部件的規定的厚度吻合。接著，在加料腔54內加熱樹脂而使其熔融化，並且上移柱塞53而對加料腔54內的熔融樹脂41加壓，由此能夠從下模52的加料腔54內經過樹脂通道(料道、流道、澆口)55，從而向上模51的模腔56內注入熔融樹脂。此時，能夠用柱塞53向模腔56內的樹脂施加所需的樹脂壓力。 The method of transfer molding using the apparatus shown in Fig. 13 is not particularly limited and may be carried out in accordance with a general transfer molding method. That is, first, a resin material such as a resin sheet or a liquid resin (for example, a thermosetting resin) is supplied into the charging chamber 54, and the substrate 21 is supplied to the substrate setting portion 57, and then the upper mold 51 and the lower mold 52 are subjected to Close the mold. At this time, as shown in FIG. 13, the protruding electrode 12 is contracted in a direction perpendicular to the surface direction of the plate-like member 11 by the bending of the deformed portion 12A. Thereby, the bump electrode 12 matches the predetermined thickness of the resin sealing member. Next, the resin is heated in the charging chamber 54 to be melted, and the plunger 53 is moved up to pressurize the molten resin 41 in the charging chamber 54, thereby being able to pass through the resin passage from the charging chamber 54 of the lower mold 52 ( A channel, a runner, a gate 55), thereby injecting molten resin into the cavity 56 of the upper die 51. At this time, the plunger 53 can be used to apply a desired resin pressure to the resin in the cavity 56.
經過固化所需的時間後，通過將上模51及下模52進行開模，在模腔56內，能夠將晶片31等密封成形在與模 腔的形狀相對應的封裝體(樹脂成形體)內(參照圖12所示電子部件20)。 After the time required for curing, the upper mold 51 and the lower mold 52 are opened, and the wafer 31 and the like can be sealed and formed in the mold cavity 56. The inside of the package (resin molded body) corresponding to the shape of the cavity (refer to the electronic component 20 shown in FIG. 12).
在本實施例中，圖13所示的製造方法(圖12所示的電子部件20的製造)，例如能夠以下述方式進行。即為首先，在下模52的模面上(基板設置部)，將設置有晶片31及配線圖案22的基板21配置在與上模51的模腔相對應的位置上，並且在基板21上，將板狀構件11及突起電極12以與成品的電子部件20(圖12)為相同的位置關係的方式配置。此時，如圖13所示，使基板21的與晶片31配置側成相反的一側與下模52接觸，並且在晶片31配置側的表面上載置有帶突起電極的板狀構件(板狀構件11及突起電極12)，從而配線圖案22和突起電極12的頂端部分以物理方式電連接。 In the present embodiment, the manufacturing method shown in FIG. 13 (manufacture of the electronic component 20 shown in FIG. 12) can be performed, for example, in the following manner. In other words, first, on the die surface (substrate mounting portion) of the lower mold 52, the substrate 21 on which the wafer 31 and the wiring pattern 22 are provided is disposed at a position corresponding to the cavity of the upper mold 51, and on the substrate 21, The plate-like member 11 and the protruding electrode 12 are disposed in the same positional relationship as the electronic component 20 (FIG. 12) of the finished product. At this time, as shown in FIG. 13, the side opposite to the arrangement side of the wafer 31 of the substrate 21 is brought into contact with the lower mold 52, and a plate-like member with a protruding electrode is placed on the surface on the side where the wafer 31 is disposed (plate shape). The member 11 and the bump electrode 12) are such that the wiring pattern 22 and the tip end portion of the bump electrode 12 are physically electrically connected.
此外，基板21、晶片31、板狀構件11及突起電極12可以以與圖13成上下顛倒的狀態載置於下模52的模面上。即為板狀構件11的與突起電極12形成面成相反側的表面與下模52接觸，在所述突起電極12的形成面側配置基板21及晶片31也可。 Further, the substrate 21, the wafer 31, the plate-like member 11, and the bump electrode 12 may be placed on the die surface of the lower mold 52 in a state of being upside down with respect to FIG. In other words, the surface of the plate-like member 11 on the side opposite to the surface on which the projection electrode 12 is formed is in contact with the lower mold 52, and the substrate 21 and the wafer 31 may be disposed on the surface on which the projection electrode 12 is formed.
接著，如圖13所示，將上模51及下模52進行合模。此時，將上模51載置於下模52上，由此使基板21、晶片31、板狀構件11及突起電極12容納在上模51的模腔內，並使板狀構件11抵接於模腔的頂面。此時，如上所述，在所述合模的過程中，通過變形部12A的彎曲，突起電極12在與板狀構件11的面方向相垂直的方向上收縮。由此，突 起電極12與所述電子部件的厚度吻合。 Next, as shown in FIG. 13, the upper mold 51 and the lower mold 52 are clamped. At this time, the upper mold 51 is placed on the lower mold 52, whereby the substrate 21, the wafer 31, the plate-like member 11, and the protruding electrode 12 are housed in the cavity of the upper mold 51, and the plate-like member 11 is brought into contact with each other. On the top surface of the cavity. At this time, as described above, in the process of the mold clamping, the projection electrode 12 is contracted in a direction perpendicular to the surface direction of the plate-like member 11 by the bending of the deformation portion 12A. Thus The starting electrode 12 coincides with the thickness of the electronic component.
在該狀態下，進一步地，如圖13所示，使用柱塞53，從下模52的加料腔54經由樹脂通道55向上模51的模腔56內注入樹脂41。對配置在基板21上的晶片31與板狀構件11及突起電極12一同進行樹脂密封。通過這種方式，能夠製造圖12所示的電子部件20。 In this state, further, as shown in FIG. 13, the resin 41 is injected from the charging chamber 54 of the lower mold 52 through the resin passage 55 into the cavity 56 of the upper mold 51, as shown in FIG. The wafer 31 disposed on the substrate 21 is resin-sealed together with the plate-like member 11 and the bump electrode 12. In this way, the electronic component 20 shown in Fig. 12 can be manufactured.
此外，在向模腔56內注入樹脂時，在模腔56內，樹脂(熔融樹脂)41A能夠在突起電極12之間流動，或者能夠穿過突起電極12的孔12b內而流動。 Further, when resin is injected into the cavity 56, the resin (molten resin) 41A can flow between the protruding electrodes 12 or can flow through the holes 12b of the protruding electrodes 12 in the cavity 56.
另外，在上文中，對將基板及帶突起電極的板狀構件兩者均載置在下模的模面上之後進行合模的方法進行了說明，但本發明並不限於此。例如，將基板21供應設置在下模52的模面，將帶突起電極的板狀構件(板狀構件11)安裝在上模51的模腔頂面上，之後將上模51和下模52進行合模，然後向模腔內注入樹脂也可。此時，如上所述，也可以將板狀構件11及基板21的位置上下倒置。 Further, in the above, a method of performing mold clamping after both the substrate and the plate-like member with the protruding electrode are placed on the die surface of the lower mold has been described, but the present invention is not limited thereto. For example, the substrate 21 is supplied to the mold surface of the lower mold 52, the plate-like member (plate member 11) having the protruding electrodes is mounted on the top surface of the cavity of the upper mold 51, and then the upper mold 51 and the lower mold 52 are subjected to The mold is closed, and then the resin is injected into the cavity. At this time, as described above, the positions of the plate-like member 11 and the substrate 21 may be inverted upside down.
另外，在用傳遞模塑進行成形(樹脂密封)時，例如將模腔內等設定為規定真空度而進行傳遞模塑也可。對設定為所述規定真空度的方法也沒有特別的限定，例如可以採用基於一般的傳遞模塑的方法。 In addition, when molding (resin sealing) by transfer molding, for example, the inside of the cavity may be set to a predetermined degree of vacuum, and transfer molding may be performed. The method of setting the predetermined degree of vacuum is also not particularly limited, and for example, a method based on general transfer molding can be employed.
對所述傳遞模塑所使用的裝置沒有特別的限定，例如與傳遞模塑所使用的一般裝置相同也可。另外，對所述樹脂密封步驟的具體條件也沒有特別的限定，例如與一般的傳遞模塑相同也可。 The apparatus used for the transfer molding is not particularly limited, and may be the same as the general apparatus used for transfer molding. Further, the specific conditions of the resin sealing step are not particularly limited, and may be, for example, the same as general transfer molding.
此外，為了更切實地連接突起電極12和配線圖案22，預先將軟釺料插入突起電極12與配線圖案22之間也可。在此情況下，例如在實施所述樹脂密封步驟之後，通過回流等方式使所述軟釺料熔融，由此接合突起電極12和配線圖案22也可。在下文中的各實施方案中也是相同的。 Further, in order to more reliably connect the bump electrode 12 and the wiring pattern 22, a soft solder may be inserted between the bump electrode 12 and the wiring pattern 22 in advance. In this case, for example, after the resin sealing step is performed, the soft material may be melted by reflow or the like, whereby the bump electrode 12 and the wiring pattern 22 may be bonded. The same is true in the various embodiments below.
另外，在圖13中，對突起電極12具有變形部12A的情況進行了說明，在突起電極12不具有變形部12A的情況下，除突起電極12不收縮之外，同樣地能夠製造電子部件。但是，若突起電極12具有變形部12A，由於無需預先按照電子部件的樹脂厚度設計突起電極12的高度，因此能夠簡便且有效地製造同時具有通孔電極(突起電極)及板狀構件的電子部件。在後述的各實施方案(通過壓縮成形製造電子部件的情況)中，也是相同的。 In addition, in FIG. 13, the case where the bump electrode 12 has the deformed portion 12A has been described. When the bump electrode 12 does not have the deformed portion 12A, the electronic component can be manufactured in the same manner except that the bump electrode 12 does not shrink. However, if the bump electrode 12 has the deformed portion 12A, since it is not necessary to design the height of the bump electrode 12 in advance in accordance with the resin thickness of the electronic component, it is possible to easily and efficiently manufacture the electronic component having the via electrode (protrusion electrode) and the plate member at the same time. . The same applies to each of the embodiments (the case where the electronic component is manufactured by compression molding) described later.
另外，根據本發明，無需為了形成通孔電極而在樹脂上穿通通孔形成孔(槽或孔)。因此，例如可以得到下列(1)至(5)的效果。但是，這些效果為舉例顯示出，並不限定本發明。 Further, according to the present invention, it is not necessary to form a hole (groove or hole) through the through hole in the resin in order to form the via electrode. Therefore, for example, the effects of the following (1) to (5) can be obtained. However, these effects are shown by way of example and do not limit the invention.
(1)由於無需在樹脂上穿通通孔形成孔，因此，不存在因被樹脂密封的晶片(封裝體)的厚度偏差等引起的在基板的配線圖案上不能準確適當地形成通孔形成孔的深度等的現象。 (1) Since it is not necessary to form a hole through the through hole in the resin, there is no possibility that the through hole forming hole can be accurately formed on the wiring pattern of the substrate due to variations in thickness of the wafer (package) sealed by the resin or the like. The phenomenon of depth and the like.
(2)由於無需在樹脂上穿通通孔形成孔，因此樹脂材料所包含的填充物不會殘留在基板的配線圖案上。 (2) Since it is not necessary to form a hole through the through hole in the resin, the filler contained in the resin material does not remain on the wiring pattern of the substrate.
(3)由於無需在樹脂上穿通通孔形成孔，因此不會對 搭載有晶片的基板上的配線圖案造成損傷。 (3) Since there is no need to form a hole through the through hole in the resin, it is not correct The wiring pattern on the substrate on which the wafer is mounted is damaged.
(4)由於無需在樹脂上穿通通孔形成孔，因此電子部件的製造條件不會受到樹脂材料的填充物密度的影響。 (4) Since it is not necessary to form a hole through the through hole in the resin, the manufacturing conditions of the electronic component are not affected by the filler density of the resin material.
(5)通過上述(1)至(4)的影響，能夠簡便且有效地製造電子部件，因此成品率良好。進一步地，由於基板的配線圖案和突起電極(通孔電極)的連接等變得良好，因此，有利於提高電子部件的性能或降低不良品發生率等。 (5) By the influence of the above (1) to (4), the electronic component can be easily and efficiently manufactured, and the yield is good. Further, since the wiring pattern of the substrate and the connection of the bump electrode (via electrode) and the like become good, it is advantageous in improving the performance of the electronic component, reducing the occurrence rate of defective products, and the like.
實施例5 Example 5
接著，使用圖14至圖17，對本發明的其他實施例進行說明。在本實施例中，對採用壓縮成形的所述電子部件的製造方法的一例進行說明。此外，本實施例中所使用的帶突起電極的板狀構件的突起電極具有變形部。但是，如通過實施例3所進行的說明，在突起電極不具有變形部的情況下，除所述突起電極不變形(不收縮)之外，同樣地能夠進行製造。 Next, other embodiments of the present invention will be described using Figs. 14 to 17 . In the present embodiment, an example of a method of manufacturing the electronic component by compression molding will be described. Further, the protruding electrode of the plate-like member with the protruding electrode used in the present embodiment has a deformed portion. However, as described in the third embodiment, in the case where the bump electrode does not have a deformed portion, the bump electrode can be manufactured in the same manner except that it does not deform (do not shrink).
首先，準備壓縮成形裝置(電子部件的製造裝置)。在圖14的步驟剖視圖中，顯示出該壓縮成形裝置一部分、即成形模的一部分的結構。如圖14所示，該壓縮成形裝置以上模101、下模111、中模(中間板)102作為主要構成要素。下模111包括下模腔底面構件111a、下模外周構件(下模主體)112及下模外周構件(下模主體)113。下模外周構件(下模主體)112及下模外周構件(下模主體)113為框架狀的下模腔側面構件。更具體來講，下模外周構件112以包圍下模腔底面構件111a的周圍的方式配置，進一 步地，下模外周構件113以包圍下模外周構件112的外周的方式配置。在下模腔底面構件111a與下模外周構件112之間，具有空隙(吸附孔)111c。在下模外周構件112與下模外周構件113之間，具有空隙(吸附孔)111d。如下所述，使用真空泵(未圖示)對這些空隙111c及空隙111d進行減壓，由此可以吸附離型膜等。下模外周構件112上表面的高度大於下模腔底面構件111a及下模外周構件113上表面的高度。由此，形成由被下模腔底面構件111a上表面和下模外周構件112內周面包圍的下模腔(凹部)111b。另外，在上模101開通有孔(貫通孔)103。如下所述，在進行合模後，用真空泵(未圖示)從孔103進行吸引，由此至少能夠使下模腔111b內減壓。中模(中間板)102是框狀(環狀)形狀，並以位於下模外周構件113正上方的方式進行配置。能夠在中模102下表面與下模外周構件113上表面之間，把持並固定離型膜100。在中模102上表面的周邊部上，安裝有具有彈性的O型環102a。另外，就該壓縮成形裝置而言，如圖14所示，在圖的左右兩側具有滾輪104。並且，一個長尺寸的離型膜100的兩端分別捲繞在左右的滾輪104上。通過左右的滾輪104，可以從圖14的右側向左側或從左側向右側搬出離型膜100。由此，如下所述，能夠將帶突起電極的板狀構件在其載置於離型膜100上的狀態下，搬運至所述下模腔的位置。即為滾輪104相當於將所述帶突起電極的板狀構件搬運至成形模的模腔位置的搬運單元。另外，雖未圖示，但該壓縮成形裝置(電 子部件的製造裝置)還包括樹脂載置單元。所述樹脂載置單元用於在所述帶突起電極的板狀構件的所述突起電極的形成面上載置樹脂。 First, a compression molding apparatus (manufacturing apparatus for electronic components) is prepared. In the step sectional view of Fig. 14, a part of the compression molding apparatus, that is, a part of the forming mold, is shown. As shown in Fig. 14, the compression molding apparatus has the upper mold 101, the lower mold 111, and the intermediate mold (intermediate plate) 102 as main constituent elements. The lower mold 111 includes a lower cavity bottom surface member 111a, a lower mold outer peripheral member (lower mold main body) 112, and a lower mold outer peripheral member (lower mold main body) 113. The lower mold outer peripheral member (lower mold main body) 112 and the lower mold outer peripheral member (lower mold main body) 113 are frame-shaped lower cavity side members. More specifically, the lower mold outer peripheral member 112 is disposed so as to surround the periphery of the lower cavity bottom surface member 111a, and further In step, the lower die outer peripheral member 113 is disposed to surround the outer periphery of the lower die outer peripheral member 112. A gap (adsorption hole) 111c is provided between the lower cavity bottom surface member 111a and the lower mold outer circumferential member 112. A gap (adsorption hole) 111d is provided between the lower mold outer peripheral member 112 and the lower mold outer peripheral member 113. As described below, the voids 111c and the void 111d are depressurized by a vacuum pump (not shown), whereby a release film or the like can be adsorbed. The height of the upper surface of the lower mold outer peripheral member 112 is greater than the height of the upper surface of the lower cavity bottom surface member 111a and the lower mold outer peripheral member 113. Thereby, a lower cavity (recess) 111b surrounded by the upper surface of the lower cavity bottom surface member 111a and the inner circumferential surface of the lower die outer peripheral member 112 is formed. Further, a hole (through hole) 103 is opened in the upper mold 101. As described below, after the mold clamping is performed, suction is performed from the hole 103 by a vacuum pump (not shown), whereby at least the inside of the lower mold cavity 111b can be decompressed. The middle mold (intermediate plate) 102 has a frame-like (annular) shape and is disposed to be positioned directly above the lower mold outer peripheral member 113. The release film 100 can be held and fixed between the lower surface of the middle mold 102 and the upper surface of the lower mold outer peripheral member 113. On the peripheral portion of the upper surface of the middle mold 102, an elastic O-ring 102a is attached. Further, in the compression molding apparatus, as shown in Fig. 14, the roller 104 is provided on the left and right sides of the drawing. Further, both ends of one long-sized release film 100 are wound around the left and right rollers 104, respectively. The release film 100 can be carried out from the right side to the left side or from the left side to the right side of FIG. 14 by the left and right rollers 104. Thereby, as described below, the plate-like member with the protruding electrode can be transported to the position of the lower mold cavity while being placed on the release film 100. That is, the roller 104 corresponds to a conveyance unit that conveys the plate-shaped member with the protruding electrode to the cavity position of the molding die. Further, although not shown, the compression molding device (electricity The manufacturing device of the sub-assembly) further includes a resin mounting unit. The resin mounting unit is configured to mount a resin on a surface on which the protruding electrode of the plate-shaped member having the protruding electrode is formed.
接著，如圖14所示，將在單面固定有晶片31的基板21，通過夾具(clamper)101a固定在上模101的下表面。此時，使基板21的形成有晶片31的表面朝向下方。此外，基板21及晶片31與實施例1相同，在基板21與實施例1相同地形成有配線圖案22。進一步地，如圖14所示，通過所述樹脂載置單元，將樹脂材料(樹脂)41a載置於板狀構件11的突起電極12的固定面上(樹脂載置步驟)。此外，板狀構件11、突起電極12及樹脂材料41a與實施例1相同。對樹脂材料41a的形態沒有特別的限定，在所述樹脂載置步驟中，較佳為使樹脂材料41a不會從板狀構件11的突起電極12的固定面上掉落。例如，在所述樹脂載置步驟中，將薄板狀的樹脂材料41a層壓(層叠)在板狀構件11的突起電極12的固定面上並進行按壓也可。進一步地，如圖14所示，將載置有樹脂材料41a的板狀構件11載置於離型膜100上。此時，如圖14所示，使板狀構件11的樹脂材料41a載置面(突起電極12的形成面)朝上(即為與突起電極12的形成面成相反側的一面與離型膜100的上表面接觸)。另外，雖未圖示，黏合劑(黏合層)存在於離型膜100的上表面與板狀構件11之間，並且通過所述黏合劑(黏合層)使板狀構件11固定在離型膜100上表面也可。像這樣存在所述黏合劑(黏合層)具有如下優點，例如， 即使在板狀構件11處形成有孔，樹脂材料41a也難以從所述孔漏出等，因此是較佳的。進一步地，如圖14所示，通過所述搬運單元，將樹脂材料41a與板狀構件11、突起電極12及離型膜100一同搬運至下模腔111b的位置。 Next, as shown in FIG. 14, the substrate 21 to which the wafer 31 is fixed on one side is fixed to the lower surface of the upper mold 101 by a clamper 101a. At this time, the surface of the substrate 21 on which the wafer 31 is formed faces downward. Further, the substrate 21 and the wafer 31 are the same as in the first embodiment, and the wiring pattern 22 is formed on the substrate 21 in the same manner as in the first embodiment. Furthermore, as shown in FIG. 14, the resin material (resin) 41a is placed on the fixing surface of the bump electrode 12 of the plate-shaped member 11 by the resin mounting unit (resin mounting step). Further, the plate member 11, the bump electrode 12, and the resin material 41a are the same as those in the first embodiment. The form of the resin material 41a is not particularly limited, and in the resin mounting step, it is preferable that the resin material 41a does not fall from the fixing surface of the protruding electrode 12 of the plate-shaped member 11. For example, in the resin mounting step, the thin resin material 41a may be laminated (laminated) on the fixing surface of the bump electrode 12 of the plate member 11 and pressed. Further, as shown in FIG. 14, the plate-like member 11 on which the resin material 41a is placed is placed on the release film 100. At this time, as shown in FIG. 14, the mounting surface of the resin material 41a of the plate-shaped member 11 (the surface on which the projection electrode 12 is formed) faces upward (that is, the surface opposite to the surface on which the projection electrode 12 is formed and the release film). The upper surface of 100 is in contact with). Further, although not shown, a binder (adhesive layer) exists between the upper surface of the release film 100 and the plate member 11, and the plate member 11 is fixed to the release film by the binder (adhesive layer). 100 upper surface is also available. The presence of the binder (adhesive layer) like this has the following advantages, for example, Even if a hole is formed in the plate member 11, it is difficult for the resin material 41a to leak out from the hole or the like, and thus it is preferable. Further, as shown in FIG. 14, the resin material 41a is transported together with the plate-like member 11, the bump electrode 12, and the release film 100 to the position of the lower mold cavity 111b by the transfer unit.
接著，如圖15的箭頭114所示，使用真空泵(未圖示)對下模腔底面構件111a與下模外周構件112之間的間隙(空隙111c)進行減壓。而且，如該圖15的箭頭115所示，使用真空泵(未圖示)對下模外周構件112與下模外周構件113之間的間隙(空隙111d)進行減壓。進一步地，使中模102與O型環102a一同下降，並在中模102下表面與下模外周構件113上表面之間把持離型膜100。由此，將離型膜100固定在下模外周構件112及下模外周構件113的上表面。另外，通過對下模腔111b內的減壓，能夠使離型膜100覆蓋在下模腔111b的表面上。由此，如圖15所示，能夠將樹脂材料41a在其載置在板狀構件11上的狀態下，載置在下模腔的模腔面上。 Next, as shown by an arrow 114 in FIG. 15, a gap (void 111c) between the lower cavity bottom surface member 111a and the lower die outer peripheral member 112 is reduced by a vacuum pump (not shown). Further, as indicated by an arrow 115 in FIG. 15, a gap (void 111d) between the lower die outer peripheral member 112 and the lower die outer peripheral member 113 is reduced by a vacuum pump (not shown). Further, the middle mold 102 is lowered together with the O-ring 102a, and the release film 100 is held between the lower surface of the middle mold 102 and the upper surface of the lower mold outer peripheral member 113. Thereby, the release film 100 is fixed to the upper surfaces of the lower mold outer peripheral member 112 and the lower mold outer peripheral member 113. Further, by releasing the pressure in the lower cavity 111b, the release film 100 can be covered on the surface of the lower cavity 111b. Thereby, as shown in FIG. 15, the resin material 41a can be placed on the cavity surface of the lower cavity in a state where it is placed on the plate-shaped member 11.
接著，如圖16至圖17所示，實施所述樹脂密封步驟。此外，在圖16中，為了便於說明，省略夾具101a的圖示。 Next, as shown in FIGS. 16 to 17, the resin sealing step is carried out. In addition, in FIG. 16, for the convenience of description, illustration of the jig 101a is abbreviate|omitted.
即為首先，如圖16所示，使下模111(下模腔底面構件111a、下模外周構件112及下模外周構件113)，與中模102及用於隔斷外氣的O型環102a一同上升。此時，通過接合上模101的模面與O型環102a的上表面側，至少將下模腔111b內設定為外氣隔斷狀態，從而能夠在上下中模(3個模)形成外氣隔斷空間部。在該狀態下，如箭頭107 所示，能夠使用真空泵(未圖示)經由上模101的孔103至少吸引下模腔111b內(外氣隔斷空間部內)，從而對其進行減壓。進一步地，使下模111與中模102成為一體並上升。此時，能夠經由離型膜100接合下模外周構件112的上表面(下模111)與基板21的表面。 That is, first, as shown in FIG. 16, the lower mold 111 (the lower mold bottom surface member 111a, the lower mold outer peripheral member 112, and the lower mold outer peripheral member 113), and the middle mold 102 and the O-ring 102a for blocking the outside air are provided. Rise together. At this time, by bonding the mold surface of the upper mold 101 and the upper surface side of the O-ring 102a, at least the inside of the lower mold cavity 111b is set to the outside air shutoff state, so that the outer air mold can be formed in the upper and lower middle molds (three molds). Space Department. In this state, as arrow 107 As shown in the drawing, a vacuum pump (not shown) can be used to at least suction the inside of the lower mold cavity 111b (inside the outer air partition space portion) through the hole 103 of the upper mold 101, thereby reducing the pressure. Further, the lower mold 111 and the middle mold 102 are integrated and raised. At this time, the upper surface (lower mold 111) of the lower mold outer peripheral member 112 and the surface of the substrate 21 can be joined via the release film 100.
接著，使下模腔底面構件111a上升。此時，如圖16所示，通過加熱等方式，使樹脂材料(樹脂)41a呈流動性樹脂(樹脂)41b的狀態。由此，首先，在下模腔111b內，能夠將晶片31浸漬在流動性樹脂41b中；接著，能夠使用下模腔底面構件111a對下模腔111b內的流動性樹脂41b加壓。因此，如圖17所示，在下模腔111b內，能夠將安裝在基板21的晶片31(包括突起電極12及配線圖案22)在由固化樹脂構成的密封樹脂(樹脂)41內壓縮成形(樹脂成形)，由此構成與下模腔111b的形狀相對應的成形封裝體(樹脂成形體)。此時，板狀構件11處於安裝在與成形封裝體的基板21成相反側的頂面側的狀態。另外，此時，在基板21與離型膜100之間具有一些間隙(空隙)也可。 Next, the lower cavity bottom surface member 111a is raised. At this time, as shown in FIG. 16, the resin material (resin) 41a is in a state of a fluid resin (resin) 41b by heating or the like. Thus, first, the wafer 31 can be immersed in the fluid resin 41b in the lower cavity 111b. Then, the fluid resin 41b in the lower cavity 111b can be pressurized by the lower cavity bottom surface member 111a. Therefore, as shown in FIG. 17, in the lower mold cavity 111b, the wafer 31 (including the bump electrode 12 and the wiring pattern 22) mounted on the substrate 21 can be compression-molded in a sealing resin (resin) 41 made of a cured resin (resin The molding) constitutes a molded package (resin molded body) corresponding to the shape of the lower cavity 111b. At this time, the plate-like member 11 is in a state of being mounted on the top surface side opposite to the substrate 21 on which the package body is formed. Further, at this time, there may be some gap (void) between the substrate 21 and the release film 100.
如上所述，如箭頭107所示，使用真空泵(未圖示)經由上模101的孔103至少對下模腔111b內進行吸引，使其減壓。並且，在該狀態下，將流動性樹脂41b與板狀構件11、突起電極12、晶片31及基板21一同壓縮成形，從而對晶片31進行樹脂密封。此時，通過使突起電極12與基板21的配線圖案22抵接而產生的按壓力，突起電極12 整體相對地在垂直方向上受到按壓。通過該按壓，如圖17所示，在設計成其高度大於流動性樹脂41b的厚度的突起電極12中，變形部12A發生彎曲。由此，突起電極12在與板狀構件11的面方向相垂直的方向上收縮(即為在與面方向相垂直的方向上的長度變短)，從而與樹脂密封部件規定的厚度吻合。另外，此時，突起電極12與形成在基板21上的配線圖案22接觸。進一步地，使流動性樹脂41b固化，如圖17所示，形成由固化樹脂構成的密封樹脂(樹脂)41。通過這種方式，實施所述的“樹脂密封步驟”，能夠製造電子部件。 As described above, as indicated by an arrow 107, at least the inside of the lower cavity 111b is sucked through the hole 103 of the upper mold 101 using a vacuum pump (not shown) to reduce the pressure. In this state, the fluid resin 41b is compression-molded together with the plate-like member 11, the bump electrode 12, the wafer 31, and the substrate 21, and the wafer 31 is resin-sealed. At this time, the projection electrode 12 is generated by the pressing force generated by the bump electrode 12 abutting on the wiring pattern 22 of the substrate 21. The whole is relatively pressed in the vertical direction. By this pressing, as shown in FIG. 17, in the projection electrode 12 designed to have a height larger than the thickness of the fluid resin 41b, the deformation portion 12A is bent. Thereby, the protruding electrode 12 contracts in a direction perpendicular to the surface direction of the plate-like member 11 (that is, the length in the direction perpendicular to the surface direction becomes short), and matches the thickness specified by the resin sealing member. Further, at this time, the bump electrode 12 is in contact with the wiring pattern 22 formed on the substrate 21. Further, the fluid resin 41b is cured, and as shown in FIG. 17, a sealing resin (resin) 41 made of a cured resin is formed. In this way, by performing the "resin sealing step" described above, it is possible to manufacture an electronic component.
此外，如上所述，將晶片31浸漬在下模腔111b內的樹脂41中時，所述樹脂呈具有流動性的流動性樹脂41b的狀態。該流動性樹脂41b例如可以是液體樹脂(固化前的熱固性樹脂等)，或者也可以是將顆粒狀、粉末狀、糊狀等固體狀的樹脂加熱融化後的熔融狀態。對樹脂材料41a的加熱，例如能夠通過對下模腔底面構件111a的加熱等進行。另外，例如，在樹脂材料41a為熱固性樹脂且具有流動性(即為已處於流動性樹脂41b的狀態)的情況下，對下模腔111b內的樹脂材料41a(流動性樹脂41b)加熱並加壓，使之熱固化也可。由此，能夠在與下模腔的形狀相對應的樹脂成形體(封裝體)內對晶片31進行樹脂密封成形(壓縮成形)。這樣，例如，可以在將板狀構件11露出於樹脂成形體(封裝體)的上表面(與基板成相反側的表面)的狀態下形成。 Further, as described above, when the wafer 31 is immersed in the resin 41 in the lower cavity 111b, the resin is in a state of fluidity of the fluid resin 41b. The fluid resin 41b may be, for example, a liquid resin (a thermosetting resin before curing) or a molten state in which a solid resin such as a pellet, a powder or a paste is heated and melted. The heating of the resin material 41a can be performed, for example, by heating the lower cavity bottom surface member 111a or the like. In addition, for example, in the case where the resin material 41a is a thermosetting resin and has fluidity (that is, a state in which it is already in the fluid resin 41b), the resin material 41a (flowable resin 41b) in the lower cavity 111b is heated and added. Press it to make it heat cure. Thereby, the wafer 31 can be resin-sealed (compression-molded) in the resin molded body (package) corresponding to the shape of the lower cavity. Thus, for example, the plate-like member 11 can be formed in a state in which the plate-shaped member 11 is exposed on the upper surface (surface opposite to the substrate) of the resin molded body (package).
在進行壓縮成形(樹脂密封)之後，即為使流動性樹脂41b固化而形成密封樹脂41後，如圖17所示，解除對下模腔底面構件111a與下模外周構件112之間的空隙進行的減壓(抽真空)。如箭頭116所示，相反地，也可以將空氣送入所述空隙。接著，使下模111(下模腔底面構件111a、下模外周構件112及下模外周構件113)與中模102及O型環102a一同下降。由此，將下模腔1011b內開放從而解除減壓。由此，如圖17所示，離型膜100從下模腔底面構件111a的上表面分離。此時，對下模外周構件112與下模外周構件113之間的空隙進行的減壓(抽真空)還沒有被解除。另外，中模102繼續處於與下模外周構件113一同把持離型膜100的狀態。因此，如圖17所示，離型膜100繼續吸附(固定)在下模外周構件112及下模外周構件113上表面。並且，通過夾具101a，基板21繼續固定在上模101下表面(模面)。並且，密封樹脂41及板狀構件11與基板21及晶片31一同被壓縮成形，因此通過下模111的下降，離型膜100從由基板21、板狀構件11、突起電極12、晶片31及密封樹脂41形成的電子部件剝離。並且，通過滾輪104，離型膜100向圖中的右側方向或左側方向陸續送出(捲繞)。 After the compression molding (resin sealing), that is, after the fluid resin 41b is cured to form the sealing resin 41, as shown in FIG. 17, the gap between the lower cavity bottom surface member 111a and the lower mold outer circumferential member 112 is released. Decompression (vacuum). As indicated by arrow 116, conversely, air can also be delivered into the void. Next, the lower mold 111 (the lower mold bottom surface member 111a, the lower mold outer peripheral member 112, and the lower mold outer peripheral member 113) is lowered together with the middle mold 102 and the O-ring 102a. Thereby, the inside of the lower mold cavity 1011b is opened to release the pressure reduction. Thereby, as shown in FIG. 17, the release film 100 is separated from the upper surface of the lower cavity bottom surface member 111a. At this time, the pressure reduction (vacuum) of the gap between the lower mold outer peripheral member 112 and the lower mold outer peripheral member 113 has not been released. Further, the middle mold 102 continues to be in a state of holding the release film 100 together with the lower mold outer peripheral member 113. Therefore, as shown in FIG. 17, the release film 100 continues to be adsorbed (fixed) on the upper surfaces of the lower mold outer peripheral member 112 and the lower mold outer peripheral member 113. Further, the substrate 21 is continuously fixed to the lower surface (die surface) of the upper mold 101 by the jig 101a. Further, since the sealing resin 41 and the plate-like member 11 are compression-molded together with the substrate 21 and the wafer 31, the release film 100 is removed from the substrate 21, the plate-like member 11, the bump electrode 12, and the wafer 31 by the lowering of the lower mold 111. The electronic component formed by the sealing resin 41 is peeled off. Further, the release film 100 is successively fed (winded) in the right direction or the left direction in the drawing by the roller 104.
在本發明中，例如如本實施例所示，在進行晶片的樹脂密封時，突起電極12整體存在於下模腔111b內的流動性樹脂41b(熔融樹脂或液態樹脂)中。在該狀態下，如上所述，若使下模腔底面構件111a上移，則在流動性樹脂 41b中，突起電極12的頂端部分與基板21的配線圖案22以物理方式抵接而連接。通過採用該方式，例如，與對晶片進行樹脂密封後穿通通孔形成孔的方法相比，突起電極的頂端與基板的配線圖案容易接觸，且不會發生樹脂進入兩者之間的情況。即為更有利於突起電極與基板的配線圖案的電連接。例如，在板狀構件為屏蔽板時，這一點對於屏蔽性能方面是有利的。另外，如上所述，突起電極12可以不具有變形部12A，若具有變形部12A，則由於無需嚴格按照成品的電子部件的厚度來設計突起電極12的高度，因此是較佳的。例如，代替“之”字形(“Z”字形)變形部彎曲的方式，或在其基礎上，突起電極12可以以圖3的(A)至(D)或圖4的(A)至(D)所示的方式收縮(高度變小)也可。即為即使突起電極12的高度略大於樹脂41的厚度，在突起12c的頂端與配線圖案22抵接時，突起12c向孔12b側的空隙進行彈性移動(下降)，從而可以使突起電極12收縮。由此，如上所述，能夠對應於電子部件的樹脂厚度(封裝體厚度)來調整突起電極12的高度。 In the present invention, for example, as shown in the present embodiment, when the resin sealing of the wafer is performed, the protruding electrode 12 as a whole is present in the fluid resin 41b (molten resin or liquid resin) in the lower cavity 111b. In this state, as described above, if the lower cavity bottom surface member 111a is moved up, the fluid resin is In 41b, the tip end portion of the bump electrode 12 is physically connected to the wiring pattern 22 of the substrate 21 to be connected. By adopting this method, for example, the tip end of the bump electrode is easily brought into contact with the wiring pattern of the substrate, and the resin does not enter between the two, as compared with the method of forming the hole through the through hole by resin sealing the wafer. That is, it is more advantageous for electrical connection of the bump electrode and the wiring pattern of the substrate. For example, when the plate member is a shield plate, this is advantageous in terms of shielding performance. Further, as described above, the bump electrode 12 may not have the deformed portion 12A, and if the deformed portion 12A is provided, it is preferable to design the height of the bump electrode 12 strictly in accordance with the thickness of the finished electronic component. For example, instead of or in addition to the "Z"-shaped ("Z"-shaped) deformation portion, the protruding electrode 12 may be in (A) to (D) of FIG. 3 or (A) to (D) in FIG. The way shown is contraction (height becomes smaller). That is, even if the height of the bump electrode 12 is slightly larger than the thickness of the resin 41, when the tip end of the bump 12c comes into contact with the wiring pattern 22, the protrusion 12c elastically moves (drops) toward the gap on the side of the hole 12b, so that the bump electrode 12 can be shrunk. . Thereby, as described above, the height of the bump electrode 12 can be adjusted in accordance with the resin thickness (package thickness) of the electronic component.
接著，對圖18至圖19進行說明。在圖14至圖17中，對如下方法進行了說明實施將樹脂41a載置在板狀構件11上的“樹脂載置步驟”之後，實施將帶突起電極的板狀構件搬運至模腔位置的“搬運步驟”的方法。但是，如上所述，對所述樹脂載置步驟和所述搬運步驟的順序沒有特別的限定。圖18至圖19顯示出，在所述搬運步驟後實施所述樹脂載置步驟的、所述電子部件製造方法的一例。如圖 18至圖19所示，用於該方法的壓縮成形裝置(電子部件的製造裝置)除了具有樹脂供應單元60之外，與圖14至圖17的壓縮成形裝置(電子部件的製造裝置)相同。但是，在圖18至圖19中，為了簡化，省略了上模101、上模的孔(貫通孔)103、夾具101a、基板21、配線圖案22及晶片31的圖示。如圖18至圖19所示，樹脂供應單元60包括樹脂供應部61及下部閘門62。樹脂供應部61為在上端及下端形成有開口的框狀形狀。樹脂供應部(框)61下端的開口被下部閘門62關閉。由此，如圖18所示，在由樹脂供應部(框)61與下部閘門62所包圍的空間內，可容納樹脂材料41a。在該狀態下，如圖18所示，使樹脂供應單元60進入下模腔111b的正上方(下模111與上模101之間的空間內)。並且，如圖19所示，通過拉開下部閘門62而打開樹脂供應部(框)61下端的開口，能夠使樹脂材料41a從所述開口落下，將樹脂材料41a供應(載置)至下模腔111b內。此外，雖然樹脂材料41a在圖18及19中為顆粒樹脂，但對其並無特別限定。另外，在圖14至圖17的步驟之前的所述樹脂載置步驟中，與圖18至圖19相同地，可以使用由樹脂供應部61及下部閘門62構成的樹脂供應單元60。 Next, FIG. 18 to FIG. 19 will be described. In the following description, the following method has been described. After the "resin mounting step" in which the resin 41a is placed on the plate-like member 11, the step of transporting the plate-shaped member with the protruding electrode to the cavity position is performed. The method of "handling steps". However, as described above, the order of the resin mounting step and the carrying step is not particularly limited. 18 to 19 show an example of the method of manufacturing the electronic component in which the resin mounting step is performed after the transporting step. As shown 18 to 19, the compression molding apparatus (manufacture apparatus of electronic components) used in this method is the same as the compression molding apparatus (manufacturing apparatus of electronic components) of FIGS. 14 to 17 except that the resin supply unit 60 is provided. However, in FIGS. 18 to 19, the upper mold 101, the holes (through holes) 103 of the upper mold, the jig 101a, the substrate 21, the wiring pattern 22, and the wafer 31 are omitted for simplification. As shown in FIGS. 18 to 19, the resin supply unit 60 includes a resin supply portion 61 and a lower shutter 62. The resin supply portion 61 has a frame shape in which an opening is formed at the upper end and the lower end. The opening at the lower end of the resin supply portion (frame) 61 is closed by the lower shutter 62. Thereby, as shown in FIG. 18, the resin material 41a can be accommodated in the space surrounded by the resin supply part (frame) 61 and the lower gate 62. In this state, as shown in FIG. 18, the resin supply unit 60 is placed directly above the lower mold cavity 111b (in the space between the lower mold 111 and the upper mold 101). Further, as shown in FIG. 19, by opening the lower shutter 62 and opening the opening at the lower end of the resin supply portion (frame) 61, the resin material 41a can be dropped from the opening, and the resin material 41a can be supplied (mounted) to the lower mold. Inside the cavity 111b. Further, although the resin material 41a is a particulate resin in FIGS. 18 and 19, it is not particularly limited. Further, in the resin mounting step before the steps of FIGS. 14 to 17, the resin supply unit 60 composed of the resin supply portion 61 and the lower shutter 62 can be used similarly to FIGS. 18 to 19.
在圖18至圖19所示的方法中，首先，在所述搬運步驟中，除了樹脂材料41a未載置於板狀構件11上之外，實施與圖14至圖15相同的步驟。由此，如圖18所示，帶突起電極的板狀構件(板狀構件11及突起電極12)除未載 置樹脂材料41a之外，以與圖15相同的狀態，(經由離型膜100)載置在下模腔111b的模腔面上。 In the method shown in Figs. 18 to 19, first, in the carrying step, the same steps as those in Figs. 14 to 15 are carried out except that the resin material 41a is not placed on the plate member 11. Thereby, as shown in FIG. 18, the plate-shaped member (plate-shaped member 11 and the protrusion electrode 12) with the protrusion electrode is not loaded. The resin material 41a is placed on the cavity surface of the lower mold cavity 111b (via the release film 100) in the same state as in FIG.
接著，在實施所述樹脂載置步驟之前，在圖18所示的狀態下，在下模腔內對帶突起電極的板狀構件進行加熱(加熱步驟)。所述加熱例如能夠通過對下模腔底面構件111a加熱等實施。在該加熱步驟中，較佳地，使帶突起電極的板狀構件充分熱膨脹。即為較佳地，在之後實施的樹脂密封步驟中，使帶突起電極的板狀構件不會由於加熱而發生膨脹。由此，在所述樹脂密封步驟中，突起電極12與配線圖案22的位置不易發生偏差，容易對齊位置。 Next, before the resin mounting step is performed, the plate-like member with the protruding electrodes is heated in the lower mold cavity in the state shown in FIG. 18 (heating step). The heating can be performed, for example, by heating the lower cavity bottom surface member 111a or the like. In this heating step, it is preferred that the plate-like member with the protruding electrode is sufficiently thermally expanded. That is, preferably, in the resin sealing step to be performed later, the plate-like member with the protruding electrodes is not swollen by heating. Thereby, in the resin sealing step, the positions of the bump electrodes 12 and the wiring patterns 22 are less likely to be deviated, and the positions are easily aligned.
進一步地，如圖19所示，在下模腔111b內，將樹脂材料41a載置在板狀構件11的突起電極12的固定面上(樹脂載置步驟)。在該步驟中，例如拉開下部閘門62而打開樹脂供應部(框)61下端的開口，由此使樹脂材料41a從所述開口落下，從而向下模腔111b內供應(載置)。之後，以與圖16至圖17相同的方式，實施所述樹脂密封步驟。此外，樹脂材料41a在圖19中為顆粒樹脂，但不限於此。例如，樹脂材料41a可以是熱塑性樹脂(例如，顆粒樹脂、粉末樹脂等)，也可以通過帶突起電極的板狀構件的熱量來融化樹脂材料41a形成流動性樹脂41b後，進行冷卻使其固化而形成密封樹脂41。另外，如上所述，樹脂材料41a為固化前的呈液態的熱固性樹脂，通過帶突起電極的板狀構件的熱量使其固化也可。 Further, as shown in FIG. 19, in the lower mold cavity 111b, the resin material 41a is placed on the fixing surface of the bump electrode 12 of the plate-like member 11 (resin mounting step). In this step, for example, the lower gate 62 is opened to open the opening of the lower end of the resin supply portion (frame) 61, whereby the resin material 41a is dropped from the opening, thereby being supplied (placed) into the lower mold cavity 111b. Thereafter, the resin sealing step is carried out in the same manner as in FIGS. 16 to 17. Further, the resin material 41a is a particulate resin in FIG. 19, but is not limited thereto. For example, the resin material 41a may be a thermoplastic resin (for example, a particulate resin, a powder resin, or the like), or the resin material 41a may be melted by heat of a plate-like member having a protruding electrode to form a fluid resin 41b, and then cooled and solidified. The sealing resin 41 is formed. Further, as described above, the resin material 41a is a liquid thermosetting resin before curing, and may be cured by heat of a plate-like member having a protruding electrode.
另外，在本實施例中，壓縮成形裝置的結構可以是任 意結構，不限於圖14至圖17所示結構，例如，與一般的壓縮成形裝置的結構相同或以其為基準也可。具體來講，所述壓縮成形裝置的結構，例如可以與日本國特開2013-187340號公報、日本國特開2005-225133號公報、日本國特開2010-069656號公報、日本國特開2007-125783號公報、日本國特開2010-036542號公報等所公開的結構相同或以其為基準。例如，壓縮成形裝置例如可以採用與日本國特開2013-187340號公報的圖2至圖6相同的結構(在上模上帶有薄膜壓板而不具有中模的結構)來代替圖14至圖17所示的結構。使用這種壓縮成形裝置的壓縮成形方法(電子部件的製造方法)，例如能夠以與日本國特開2013-187340號公報中記載的方法相同的方法實施。另外，關於樹脂供應單元，可以是代替圖18及19的樹脂供應單元60的任意結構。例如，所述樹脂供應單元可以是日本國特開2010-036542號公報所公開的樹脂材料的分配單元(包括樹脂材料的投入單元、計量單元、漏斗及線性振動進料器等)。或者，所述樹脂供應單元是與日本國特開2007-125783號公報中公開的樹脂供應機構相同地，具備儲存部、計量部、投入部、供應部、閘門、盤、狹縫(slit)等的結構也可。另外，例如，關於未在圖14至圖17中顯示出的下模的上下移動機構等，可以與所述日本國特開2005-225133號公報、日本國特開2010-069656號公報等相同或以其為基準也可，例如，可以將彈性構件與下模腔底面構件的下方連接。 In addition, in this embodiment, the structure of the compression molding apparatus may be any The structure is not limited to the structure shown in Figs. 14 to 17, and may be the same as or based on the structure of a general compression molding apparatus. Specifically, the structure of the compression molding apparatus can be disclosed, for example, in Japanese Laid-Open Patent Publication No. 2013-187340, Japanese Patent Laid-Open Publication No. 2005-225133, Japanese Patent Laid-Open Publication No. 2010-069656, and Japanese Patent Publication No. 2007 The structure disclosed in Japanese Laid-Open Patent Publication No. Hei. No. 2010-036542 or the like is the same or based on the same. For example, the compression molding apparatus may be, for example, the same structure as that of FIGS. 2 to 6 of Japanese Laid-Open Patent Publication No. 2013-187340 (a structure having a film presser on the upper mold without a middle mold) instead of FIG. 14 to FIG. Structure shown in 17. The compression molding method (method of manufacturing an electronic component) using such a compression molding apparatus can be carried out, for example, in the same manner as the method described in Japanese Laid-Open Patent Publication No. 2013-187340. Further, the resin supply unit may be of any configuration instead of the resin supply unit 60 of FIGS. 18 and 19. For example, the resin supply unit may be a dispensing unit of a resin material disclosed in Japanese Laid-Open Patent Publication No. 2010-036542 (including an input unit of a resin material, a metering unit, a funnel, a linear vibrating feeder, etc.). Alternatively, the resin supply unit includes a storage unit, a metering unit, an input unit, a supply unit, a shutter, a disk, a slit, and the like, similarly to the resin supply mechanism disclosed in Japanese Laid-Open Patent Publication No. 2007-125783. The structure is also ok. In addition, for example, the vertical movement mechanism and the like of the lower mold which are not shown in FIGS. 14 to 17 may be the same as those described in Japanese Laid-Open Patent Publication No. 2005-225133, Japanese Patent Application Laid-Open No. 2010-069656, or the like. Alternatively, for example, the elastic member may be connected to the lower surface of the lower cavity bottom member.
另外，在本實施例中，採用了對下模腔內進行減壓而壓縮成形的方法。但是，本發明不限於此，可以採用其他壓縮成形(壓模)。 Further, in the present embodiment, a method of performing compression reduction on the lower cavity is employed. However, the present invention is not limited thereto, and other compression forming (compression molding) may be employed.
另外，如上所述，本發明的製造方法是包括所述樹脂密封步驟的製造方法，例如，如本實施例中所示，可以包括其他任意步驟。 Further, as described above, the manufacturing method of the present invention is a manufacturing method including the resin sealing step, and for example, as shown in the present embodiment, any other steps may be included.
在本實施例中，如上所述，將所述帶突起電極的板狀構件載置在離型膜上，在該狀態下，將所述帶突起電極的板狀構件搬運至成形模的模腔內。由此，例如，容易簡化板狀構件及其搬運單元的結構。另外，在本實施例中，如上所述，在將所述帶突起電極的板狀構件載置在所述離型膜上的狀態下，將所述樹脂載置在所述帶突起電極的板狀構件上。由此，例如，在圖14至17中，能夠防止樹脂(樹脂材料41a、流動性樹脂41b及密封樹脂41)與下模腔底面構件111a相接觸，並能夠防止所述樹脂進入下模111與下模外周構件112的空隙內。 In the present embodiment, as described above, the plate-like member with the protruding electrode is placed on the release film, and in this state, the plate-like member with the protruding electrode is conveyed to the cavity of the forming die. Inside. Thereby, for example, it is easy to simplify the structure of the plate-shaped member and the conveyance unit. Further, in the present embodiment, as described above, the resin is placed on the plate with the protruding electrodes in a state where the plate-like member with the protruding electrodes is placed on the release film. On the member. Thus, for example, in FIGS. 14 to 17, it is possible to prevent the resin (the resin material 41a, the fluid resin 41b, and the sealing resin 41) from coming into contact with the lower cavity bottom surface member 111a, and to prevent the resin from entering the lower mold 111 and The inside of the gap of the lower die outer peripheral member 112.
此外，在本發明中，用於搬運所述帶突起電極的板狀構件(呈載置或未載置樹脂的狀態)的單元(機構)不限於圖14至17的結構，可以是具有其他任意結構的搬運單元(搬運機構)。例如，在圖14至17中，所述離型膜的形狀為將長尺寸的離型膜卷成卷的離型膜，但不限於此。例如，所述離型膜的形狀可以為短尺寸的離型膜、長尺寸的離型膜、卷成卷的離型膜等任意形狀。例如，在本發明的製造方法中供應離型膜之前，可以將長尺寸的離型膜或卷 成卷的離型膜切斷(預先切斷)而形成短尺寸的離型膜。在使用經預先切斷的離型膜的情況下，所述搬運步驟(將所述帶突起電極的板狀構件搬運至成形模模腔的位置的步驟)，例如，可以與日本國特開2013-187340號公報的圖1及其說明相同地實施。 Further, in the present invention, the unit (mechanism) for conveying the plate-like member with the protruding electrode (in a state in which the resin is placed or not) is not limited to the structures of Figs. 14 to 17, and may have any other Structure handling unit (transport mechanism). For example, in FIGS. 14 to 17, the shape of the release film is a release film in which a long-sized release film is wound into a roll, but is not limited thereto. For example, the shape of the release film may be any shape such as a release film of a short size, a release film of a long size, a release film wound into a roll, or the like. For example, a long-sized release film or roll may be supplied before the release film is supplied in the production method of the present invention. The roll of the release film is cut (pre-cut) to form a release film of a short size. In the case of using a pre-cut release film, the carrying step (the step of transporting the plate-like member with the protruding electrode to the position of the molding cavity), for example, can be performed with Japan National Open 2013 Fig. 1 of the Japanese Patent Publication No. 187340 and the description thereof are carried out in the same manner.
實施例6 Example 6
接著，對本發明另一個實施例進行說明。在本實施例中，顯示出了使用壓縮成形的電子部件的製造方法的又一個實施例。 Next, another embodiment of the present invention will be described. In the present embodiment, still another embodiment of a manufacturing method using a compression-molded electronic component is shown.
在圖20至圖23的步驟剖視圖中，示意性的顯示出了本實施例的製造方法。如圖所示，本實施例與實施例5(圖14至圖17)不同之處在於，沒有使用離型膜100以及板狀構件11的形狀不同。 In the step sectional view of Figs. 20 to 23, the manufacturing method of this embodiment is schematically shown. As shown in the figure, this embodiment is different from the embodiment 5 (Figs. 14 to 17) in that the shape of the release film 100 and the plate member 11 are not used.
在本實施例中，板狀構件11的周邊部隆起，從而使中央部成為樹脂容納部。更具體來講，如圖20至圖23所示，板狀構件11的周邊部向板狀構件11的突起電極12的固定面側隆起，從而形成壁狀構件11b。由此，板狀構件11的中央部形成為樹脂容納部11c。即為板狀構件11通過使其周邊部隆起並形成壁狀構件11b，呈托盤型(上表面開放的箱型)的形狀。並且，板狀構件11的中央部形成為，由板狀構件11的主體(底面部)與壁狀構件(周邊部)11b所包圍的樹脂容納部(所述盤型形狀的凹部)11c。此外，如圖所示，突起電極12固定在板狀構件11主體(底面部)的所述樹脂容納部(凹部)11c側的一面。另外，壁狀構 件11b是板狀構件11的一部分，與突起電極12不同。壁狀構件11b例如具有作為散熱部件或用於屏蔽電磁波的屏蔽部件的功能也可。在板狀構件11具有壁狀構件11b的情況下，突起電極12的形狀沒有特別的限定，可以是任意形狀，但較佳地，例如突起電極12的至少一個為所述板狀突起電極。在本實施例中，由於具有樹脂容納部11c，即使不使用離型膜，也能夠抑制或防止樹脂(樹脂材料41a、流動性樹脂41b及密封樹脂41)與下模腔底面構件接觸，並能夠防止所述樹脂進入下模外周構件與下模腔底面構件之間的空隙內。因此，通過省略離型膜能夠節約成本，並且通過能夠省略黏貼或吸附離型膜的步驟，因此提高了電子部件的製造效率。 In the present embodiment, the peripheral portion of the plate-like member 11 is swelled so that the central portion becomes a resin accommodating portion. More specifically, as shown in FIGS. 20 to 23, the peripheral portion of the plate-like member 11 is swelled toward the fixing surface side of the protruding electrode 12 of the plate-like member 11, thereby forming the wall-shaped member 11b. Thereby, the central portion of the plate-like member 11 is formed as the resin accommodating portion 11c. In other words, the plate-like member 11 has a shape of a tray type (box type in which the upper surface is open) by bulging the peripheral portion thereof and forming the wall member 11b. Further, the central portion of the plate-like member 11 is formed as a resin accommodating portion (the disk-shaped recessed portion) 11c surrounded by the main body (bottom portion) of the plate-like member 11 and the wall-shaped member (peripheral portion) 11b. Further, as shown in the figure, the projecting electrode 12 is fixed to one surface of the main body (bottom portion) of the plate-like member 11 on the side of the resin accommodating portion (recessed portion) 11c. In addition, the wall structure The piece 11b is a part of the plate-like member 11, and is different from the protruding electrode 12. The wall member 11b may have a function as a heat dissipating member or a shielding member for shielding electromagnetic waves, for example. In the case where the plate-like member 11 has the wall-shaped member 11b, the shape of the protruding electrode 12 is not particularly limited and may be any shape, but preferably, for example, at least one of the protruding electrodes 12 is the plate-like protruding electrode. In the present embodiment, since the resin accommodating portion 11c is provided, it is possible to suppress or prevent the resin (the resin material 41a, the fluid resin 41b, and the sealing resin 41) from coming into contact with the lower cavity bottom member without using the release film, and The resin is prevented from entering the gap between the lower mold outer peripheral member and the lower mold cavity bottom member. Therefore, cost can be saved by omitting the release film, and the manufacturing efficiency of the electronic component can be improved by omitting the step of attaching or adsorbing the release film.
在本實施例中，如圖20至圖23所示，包括成形模(上模及下模)的壓縮成形裝置除了不具有離型膜的滾輪及中模之外，能夠使用與實施例5相同的裝置。具體來講，如圖所示，所述壓縮成形裝置以上模1001和下模1011為主要構成要素。下模1011包括下模腔底面構件1011a及下模外周構件(下模主體)1012。下模外周構件(下模主體)1012為框體狀的下模腔側面構件。更具體來講，下模外周構件1012以包圍下模腔底面構件1011a周圍的方式配置。在下模腔底面構件1011a與下模外周構件1012之間具有空隙(吸附孔)1011c。如圖21及22的箭頭1014所示，可以使用真空泵(未圖示)對該空隙1011c進行減壓，從而吸附板狀構件。另外，在壓縮成形之後，如圖23的箭頭 1016所示，相反地從該空隙1011c送入空氣，由此能使所述板狀構件脫離。下模外周構件1012上表面的高度比下模腔底面構件1011a上表面的高度更高。由此，形成了由下模腔底面構件1011a上表面與下模外周構件1012內周面所包圍的下模腔(凹部)1011b。另外，在上模1001開通有孔(貫通孔)1003。由此，如圖22的箭頭1007所示，合模後，使用真空泵(未圖示)從孔1003進行吸引，從而能夠至少對下模腔1011b內進行減壓。在下模外周構件1012上表面的周邊部上，安裝有具有彈性的O型環1012a。另外，雖未圖示，該壓縮成形裝置(電子部件的製造裝置)進一步包括樹脂載置單元及搬運單元。所述樹脂載置單元用於將樹脂載置在所述帶突起電極的板狀構件的所述突起電極的形成面上。所述搬運單元用於將所述帶突起電極的板狀構件搬運至成形模模腔的位置。 In the present embodiment, as shown in Figs. 20 to 23, the compression molding apparatus including the forming mold (upper mold and lower mold) can be used in the same manner as in the fifth embodiment except for the roller and the middle mold which do not have the release film. s installation. Specifically, as shown in the figure, the above-described compression molding apparatus upper mold 1011 and lower mold 1011 are main constituent elements. The lower mold 1011 includes a lower cavity bottom surface member 1011a and a lower mold outer peripheral member (lower mold main body) 1012. The lower die outer peripheral member (lower die main body) 1012 is a frame-shaped lower cavity side member. More specifically, the lower mold outer peripheral member 1012 is disposed to surround the lower cavity bottom surface member 1011a. A gap (adsorption hole) 1011c is provided between the lower cavity bottom surface member 1011a and the lower die outer circumferential member 1012. As shown by an arrow 1014 in FIGS. 21 and 22, the gap 1011c can be decompressed using a vacuum pump (not shown) to adsorb the plate-like member. In addition, after compression forming, the arrow of Figure 23 As shown at 1016, air is sent from the gap 1011c instead, whereby the plate member can be detached. The height of the upper surface of the lower mold outer peripheral member 1012 is higher than the height of the upper surface of the lower cavity bottom surface member 1011a. Thereby, a lower cavity (recess) 1011b surrounded by the upper surface of the lower cavity bottom surface member 1011a and the inner peripheral surface of the lower die outer peripheral member 1012 is formed. Further, a hole (through hole) 1003 is opened in the upper mold 1001. Thereby, as shown by an arrow 1007 in Fig. 22, after the mold is closed, suction is performed from the hole 1003 using a vacuum pump (not shown), and at least the inside of the lower mold cavity 1011b can be decompressed. On the peripheral portion of the upper surface of the lower mold outer peripheral member 1012, an elastic O-ring 1012a is attached. Further, although not shown, the compression molding apparatus (manufacturing device for electronic components) further includes a resin mounting unit and a conveying unit. The resin mounting unit is for placing a resin on a formation surface of the protruding electrode of the plate-shaped member with the protruding electrode. The transport unit is configured to transport the plate-like member with the protruding electrode to a position of the molding cavity.
如圖20至圖23所示，本實施例的製造方法在不使用離型膜的情況下，將在樹脂容納部11c載置有樹脂材料41a的板狀構件11搬運至下模腔1011b的位置。另外，如圖21的箭頭1014所示，使用真空泵(未圖示)對下模外周構件1012與下模腔底面構件1011a之間的空隙1011c進行減壓，從而使板狀構件11吸附在下模腔1011b(下模腔底面構件1011a上表面及下模外周構件1012內周面)上，以代替使離型膜吸附在下模及下模外周構件上。除此以外，本實施例(圖20至圖23)的製造方法能夠按照與實施例5的圖14至圖17相同的方式實施。 As shown in FIG. 20 to FIG. 23, in the manufacturing method of the present embodiment, when the release film is not used, the plate-shaped member 11 on which the resin material 41a is placed in the resin accommodating portion 11c is transported to the lower cavity 1011b. . Further, as shown by an arrow 1014 in Fig. 21, a vacuum pump (not shown) is used to decompress the gap 1011c between the lower mold outer peripheral member 1012 and the lower cavity bottom surface member 1011a, thereby causing the plate member 11 to be attracted to the lower mold cavity. Instead of the release film being adsorbed on the lower mold and the lower mold outer peripheral member, 1011b (the upper surface of the lower cavity bottom surface member 1011a and the inner circumferential surface of the lower mold outer circumferential member 1012) is replaced. Except for this, the manufacturing method of the present embodiment (Figs. 20 to 23) can be carried out in the same manner as Figs. 14 to 17 of the fifth embodiment.
更具體來講，圖22至圖23所示的步驟(樹脂密封步驟)例如能夠以如下方式實施。即為首先，從圖21的狀態開始，使下模1011上移，從而使上模1001的模面與下模的O型環1012a的上端抵接。此時，使上模面(上模1001的模面)與下模面(下模1011的模面)之間保持所需的間隔。即為在上模1001與下模1011完全合模之前，進行使兩者之間保持所需間隔的中模合模。在進行該中模合模期間，用O型環1012a至少使上下兩個模面間和模腔空間部處於外氣隔斷狀態，從而能夠形成外氣隔斷空間部。另外，此時，如圖22的箭頭1007所示，從上模的孔1003强制地吸引所述外氣隔斷空間部內的空氣並將其排出，從而能夠將所述外氣隔斷空間部內設定為規定的真空度。接著，閉合上模面(上模1001的模面)與下模面(下模1011的模面)，由此進行完全合模。進一步地，使模腔底面構件1011a上移。另外，此時，如圖22所示，使樹脂材料41a處於流動性樹脂41b的狀態。由此，如圖22所示，接合突起電極12和配線圖案22，且使晶片31浸漬在樹脂41中，進一步地，對下模腔1011b內的流動性樹脂41b加壓。接著，如下所述，使流動性樹脂41b固化，如圖23所示，形成由固化樹脂構成的密封樹脂(樹脂)41。由此，能夠將安裝在基板11上的晶片31壓縮成形(密封成形)在所需形狀的密封樹脂(固化樹脂)41內。更具體來講，如圖23所示，在下模腔1011b內，將安裝在基板21上的晶片31(包括突起電極及配線圖案22)壓縮成形(樹脂成形)在由固化 樹脂構成的密封樹脂(樹脂)41內，從而能夠形成與下模腔1011b的形狀相對應的成形封裝體(樹脂成形體)。此時，板狀構件11處於安裝在與所述成形封裝體的基板21成相反側的頂面側的狀態。並且，此時，由於模腔底面構件1011a上移產生的按壓力，突起電極12整體相對地在與板狀構件11的面方向相垂直的方向上受到按壓。如圖23所示，通過該按壓，在設計成高於流動性樹脂41b厚度的突起電極12中，變形部12A發生彎曲。由此，突起電極12在與板狀構件11的面方向相垂直的方向上收縮，從而與樹脂密封部件的規定厚度吻合。並且，如圖23所示，經過流動性樹脂41b固化所需要的時間後，將上下兩模進行開模。具體來講，使下模1011(下模腔底面構件1011a及下模外周構件1012)與O型環1012a一同下降。由此，開放下模腔1011b內從而解除減壓。此時，解除下模腔底面構件1011a與下模外周構件1012之間的空隙的減壓(抽真空)。如箭頭1016所示，相反地，可以將空氣送入所述空隙中。由此，能夠制得具有具備樹脂容納部11c的板狀構件11、基板21、晶片31、配線圖案22及突起電極12的電子部件(成形品)。 More specifically, the steps (resin sealing step) shown in FIGS. 22 to 23 can be carried out, for example, in the following manner. That is, first, from the state of FIG. 21, the lower mold 1011 is moved up, and the mold surface of the upper mold 1001 is brought into contact with the upper end of the O-ring 1012a of the lower mold. At this time, a desired interval is maintained between the upper die face (the die face of the upper die 1001) and the lower die face (the die face of the lower die 1011). That is, before the upper mold 1001 and the lower mold 1011 are completely closed, a middle mold clamping that maintains a desired interval therebetween is performed. During the middle mold clamping, at least the upper and lower mold faces and the cavity space are separated from each other by the O-ring 1012a, so that the outside air partition space portion can be formed. In addition, at this time, as shown by an arrow 1007 in FIG. 22, the air in the outside air partition space portion is forcibly sucked and discharged from the hole 1003 of the upper mold, and the inside air partition space portion can be set as a regulation. The degree of vacuum. Next, the upper die face (the die face of the upper die 1001) and the lower die face (the die face of the lower die 1011) are closed, thereby performing full mold clamping. Further, the cavity bottom surface member 1011a is moved up. Moreover, at this time, as shown in FIG. 22, the resin material 41a is in a state of the fluid resin 41b. Thereby, as shown in FIG. 22, the bump electrode 12 and the wiring pattern 22 are bonded, the wafer 31 is immersed in the resin 41, and the fluid resin 41b in the lower cavity 1011b is further pressurized. Next, the fluid resin 41b is cured as described below, and as shown in FIG. 23, a sealing resin (resin) 41 made of a cured resin is formed. Thereby, the wafer 31 mounted on the substrate 11 can be compression-molded (sealed and formed) into a sealing resin (cured resin) 41 of a desired shape. More specifically, as shown in FIG. 23, in the lower cavity 1011b, the wafer 31 (including the bump electrode and the wiring pattern 22) mounted on the substrate 21 is compression-molded (resin-formed) by curing In the sealing resin (resin) 41 made of a resin, a molded package (resin molded body) corresponding to the shape of the lower cavity 1011b can be formed. At this time, the plate-like member 11 is in a state of being mounted on the top surface side opposite to the substrate 21 of the molded package. Further, at this time, the projection electrode 12 is relatively pressed in the direction perpendicular to the surface direction of the plate-like member 11 due to the pressing force generated by the upward movement of the cavity bottom surface member 1011a. As shown in FIG. 23, by this pressing, in the projection electrode 12 designed to be higher than the thickness of the fluid resin 41b, the deformation portion 12A is bent. Thereby, the protruding electrode 12 contracts in a direction perpendicular to the surface direction of the plate-like member 11, and matches the predetermined thickness of the resin sealing member. Then, as shown in FIG. 23, after the time required for the fluid resin 41b to cure, the upper and lower molds are opened. Specifically, the lower mold 1011 (the lower cavity bottom surface member 1011a and the lower mold outer peripheral member 1012) is lowered together with the O-ring 1012a. Thereby, the inside of the lower cavity 1011b is opened to release the pressure reduction. At this time, the pressure reduction (vacuum) of the gap between the lower cavity bottom surface member 1011a and the lower die outer circumferential member 1012 is released. As indicated by arrow 1016, conversely, air can be delivered into the void. Thereby, an electronic component (molded article) including the plate-shaped member 11 including the resin containing portion 11c, the substrate 21, the wafer 31, the wiring pattern 22, and the bump electrode 12 can be obtained.
另外，本實施例並不限於此，例如與實施例5的圖18至圖19相同地，在實施所述搬運步驟之後實施所述樹脂載置步驟也可。在此情況下，與實施例5相同地，較佳為在所述樹脂載置步驟之前，在下模腔內對帶突起電極的板狀構件進行加熱(加熱步驟)。另外，在該加熱步驟中，根據 與實施例5相同的理由，較佳為使帶突起電極的板狀構件充分熱膨脹。 Further, the present embodiment is not limited thereto. For example, similarly to FIGS. 18 to 19 of the fifth embodiment, the resin mounting step may be performed after the carrying step. In this case, as in the fifth embodiment, it is preferable to heat the plate-like member with the protruding electrode in the lower cavity before the resin mounting step (heating step). In addition, in the heating step, according to For the same reason as in the fifth embodiment, it is preferred that the plate-like member with the protruding electrode is sufficiently thermally expanded.
此外，在本發明中，所述板狀構件的形狀不限於本實施例及實施例1至實施例5的形狀，可以是任意形狀。例如，所述板狀構件的形狀除了突起電極固定在單面之外，可以呈與專利文獻2(日本國特開2013-187340)中舉例示出的板狀構件相同的形狀。在圖24及圖25中，分別示出了變更了板狀構件形狀的製造方法(變形例)的一例。在圖24中，板狀構件11除了在與突起電極12的固定面成相反側的表面(在該圖中為面向下模腔底面構件111a一側的表面)具有散熱片11a之外，與圖14至圖17(實施例5)相同，能夠使用與圖14至圖17相同的壓縮成形裝置以與實施例5相同的方式進行。在圖25中，板狀構件11除了在與突起電極12的固定面成相反側的表面(在圖25中，面向下模腔底面構件1011a一側的表面)具有散熱片11a之外，與圖20至圖23(實施例6)相同，能夠使用與圖20至圖23相同的壓縮成形裝置並以與實施例6相同的方式進行。此外，在圖25的壓縮成形裝置中，如圖所示，在下模腔底面構件1011a上表面，形成有可與散熱片11a的凹凸形狀嵌合的凹凸形狀。若形成這種形狀，則具有如下優點，板狀構件11在下模腔內穩定，並且下模腔底面構件1011a的上表面不容易受到由散熱片11a帶來的損傷。另外，如圖25所示，較佳地，散熱片11a以無法在下模外周構件1012與板狀構件11之間形成間隙的方式形成其形 狀。若採用這種形狀，則能夠在下模腔內有效地進行基於減壓的吸引(箭頭1014)。 Further, in the present invention, the shape of the plate-like member is not limited to the shapes of the embodiment and the first to fifth embodiments, and may be any shape. For example, the shape of the plate-like member may be the same as that of the plate-like member exemplified in Patent Document 2 (JP-A-2013-187340), except that the protruding electrode is fixed to one surface. In FIGS. 24 and 25, an example of a manufacturing method (variation) in which the shape of the plate member is changed is shown. In FIG. 24, the plate-like member 11 has a heat sink 11a except for a surface on the opposite side to the fixing surface of the protruding electrode 12 (the surface facing the lower cavity bottom surface member 111a in the drawing). 14 to 17 (Example 5), the same compression molding apparatus as that of Figs. 14 to 17 can be used in the same manner as in the fifth embodiment. In FIG. 25, the plate-like member 11 has a heat sink 11a except for a surface on the opposite side to the fixed surface of the bump electrode 12 (the surface facing the lower cavity bottom surface member 1011a side in FIG. 25). 20 to 23 (Embodiment 6), the same compression molding apparatus as that of Figs. 20 to 23 can be used and carried out in the same manner as in the sixth embodiment. Further, in the compression molding apparatus of Fig. 25, as shown in the drawing, an uneven shape that can be fitted to the uneven shape of the fins 11a is formed on the upper surface of the lower cavity bottom surface member 1011a. If such a shape is formed, there is an advantage that the plate-like member 11 is stabilized in the lower cavity, and the upper surface of the lower cavity bottom member 1011a is less susceptible to damage by the fins 11a. Further, as shown in Fig. 25, preferably, the fins 11a are formed in such a manner that a gap cannot be formed between the lower mold outer peripheral member 1012 and the plate member 11. shape. With such a shape, suction by decompression can be efficiently performed in the lower cavity (arrow 1014).
實施例7 Example 7
接著，使用圖26至圖27，進一步對本發明又一實施例進行說明。在本實施例中，示出了電子部件的製造方法的另一實施例。 Next, still another embodiment of the present invention will be described using Figs. 26 to 27 . In the present embodiment, another embodiment of a method of manufacturing an electronic component is shown.
在圖26的剖視圖中，示意性示出本實施例的製造方法。如圖26所示，該製造方法使用下模121、上模(安裝器(mounter))122及真空腔123而進行。下模121上表面呈平坦面，可載置電子部件的基板。真空腔123呈與電子部件的形狀相對應的筒狀形狀，且可載置在所述電子部件的基板上。上模122可嵌合在真空腔123的內壁。 In the cross-sectional view of Fig. 26, the manufacturing method of the present embodiment is schematically shown. As shown in FIG. 26, this manufacturing method is performed using the lower mold 121, the upper mold (mounter) 122, and the vacuum chamber 123. The upper surface of the lower mold 121 has a flat surface, and the substrate of the electronic component can be placed. The vacuum chamber 123 has a cylindrical shape corresponding to the shape of the electronic component, and can be placed on the substrate of the electronic component. The upper mold 122 can be fitted to the inner wall of the vacuum chamber 123.
在本實施例的製造方法中，首先，將由液態樹脂(熱固性樹脂)構成的樹脂材料(樹脂)41a印刷在單面固定有晶片31及配線圖案22的基板21的、所述晶片31及配線圖案22的固定面上。接著，使在板狀構件11的單面固定有突起電極12的帶突起電極的板狀構件的突起電極12，貫通液態樹脂41a而與配線圖案22接觸。由此，基板21、晶片31、液態樹脂41a、板狀構件11及突起電極12以與成品的電子部件20(圖12)呈相同位置關係的方式配置。並且，例如，如圖26所示，使基板21、晶片31、液態樹脂41a、板狀構件11及突起電極12以呈所述位置關係(配置)的方式配置在下模121上表面。此時，如圖26所示，使基板21的與晶片31配置側相反的一側與下模121 的上表面接觸，並且在晶片31配置側的表面上配置帶突起電極的板狀構件(板狀構件11及具有變形部12A的突起電極12)。 In the manufacturing method of the present embodiment, first, a resin material (resin) 41a made of a liquid resin (thermosetting resin) is printed on the wafer 31 and the wiring pattern of the substrate 21 on which the wafer 31 and the wiring pattern 22 are fixed on one side. The fixed surface of 22. Then, the bump electrode 12 of the plate-shaped member with the bump electrode on which the bump electrode 12 is fixed on one surface of the plate member 11 penetrates the liquid resin 41a and comes into contact with the wiring pattern 22. Thereby, the substrate 21, the wafer 31, the liquid resin 41a, the plate-like member 11, and the bump electrode 12 are disposed in the same positional relationship with the electronic component 20 (FIG. 12) of the finished product. Further, for example, as shown in FIG. 26, the substrate 21, the wafer 31, the liquid resin 41a, the plate-like member 11, and the protruding electrode 12 are disposed on the upper surface of the lower mold 121 so as to have the positional relationship (arrangement). At this time, as shown in FIG. 26, the side opposite to the arrangement side of the wafer 31 of the substrate 21 and the lower mold 121 are made. The upper surface is in contact with each other, and a plate-like member (a plate-like member 11 and a protruding electrode 12 having the deformed portion 12A) having the protruding electrode is disposed on the surface on the side on which the wafer 31 is disposed.
接著，將真空腔123載置於基板21上表面的周邊部的、未配置(載置)有液態樹脂41a的部分。由此，晶片31、樹脂41、板狀構件11及突起電極12的周圍被真空腔123包圍。並且，使上模122從晶片31、液態樹脂41a、板狀構件11及突起電極12的上方下降，並嵌合於真空腔123的內壁。由此，將晶片31、液態樹脂41a及突起電極12容納於由板狀構件11、真空腔123及上模122包圍而成密閉的內部空間內。進一步地，使用真空泵(未圖示)對所述內部空間內進行減壓。由此，晶片31、液態樹脂41a、板狀構件11及突起電極12被上模122按壓。此時，具有變形部12A的突起電極12與基板21的配線圖案22抵接。並且，由於上模122的按壓力，突起電極12整體相對地在與板狀構件11的面方向相垂直的方向上受到按壓。由於該按壓，在設計成高於液態樹脂41a厚度的突起電極12中，變形部12A發生彎曲。由此，突起電極12在與板狀構件11的面方向相垂直的方向上收縮，從而與樹脂密封部件規定的厚度吻合。並且，在該狀態下，加熱液態樹脂(熱固性樹脂)41a並使其固化，與板狀構件11及突起電極12一同對晶片31進行樹脂密封。例如能夠通過對下模121加熱來對液態樹脂41a加熱。通過這種方式，能夠製造與圖12所示的電子部件20相同的電子部件。 Next, the vacuum chamber 123 is placed on a portion of the peripheral portion of the upper surface of the substrate 21 where the liquid resin 41a is not disposed (mounted). Thereby, the periphery of the wafer 31, the resin 41, the plate-like member 11, and the bump electrode 12 is surrounded by the vacuum chamber 123. Then, the upper mold 122 is lowered from above the wafer 31, the liquid resin 41a, the plate member 11, and the bump electrode 12, and fitted into the inner wall of the vacuum chamber 123. Thereby, the wafer 31, the liquid resin 41a, and the bump electrode 12 are housed in the sealed internal space surrounded by the plate member 11, the vacuum chamber 123, and the upper mold 122. Further, a pressure is reduced in the internal space using a vacuum pump (not shown). Thereby, the wafer 31, the liquid resin 41a, the plate-like member 11, and the protruding electrode 12 are pressed by the upper mold 122. At this time, the bump electrode 12 having the deformed portion 12A is in contact with the wiring pattern 22 of the substrate 21. Further, due to the pressing force of the upper mold 122, the projecting electrode 12 as a whole is relatively pressed in a direction perpendicular to the surface direction of the plate-like member 11. Due to this pressing, in the protruding electrode 12 designed to be higher than the thickness of the liquid resin 41a, the deformed portion 12A is bent. Thereby, the protruding electrode 12 contracts in a direction perpendicular to the surface direction of the plate-like member 11, and matches the thickness specified by the resin sealing member. In this state, the liquid resin (thermosetting resin) 41a is heated and solidified, and the wafer 31 is resin-sealed together with the plate-like member 11 and the bump electrode 12. For example, the liquid resin 41a can be heated by heating the lower mold 121. In this way, the same electronic components as the electronic component 20 shown in FIG. 12 can be manufactured.
另外，在本實施例中，例如，可以省略基於真空腔的減壓。但是，例如，在板狀構件與樹脂之間不允許存在空氣或間隙時，較佳地，進行基於真空腔的減壓。另外，在省略基於真空腔的減壓時，可以進行基於上模(安裝器)的按壓，也可以不進行。 Further, in the present embodiment, for example, the pressure reduction based on the vacuum chamber can be omitted. However, for example, when air or a gap is not allowed between the plate member and the resin, it is preferable to perform pressure reduction based on the vacuum chamber. Further, when the pressure reduction by the vacuum chamber is omitted, the pressing by the upper mold (mounter) may or may not be performed.
另外，圖27的剖視圖示意性示出本實施例的製造方法的變形例。圖27的製造方法，除了將在基板21的所述晶片31及配線圖案22的固定面上印刷液態樹脂(熱固性樹脂)41a的印刷方式替換為塗布方式、以及板狀構件11在與突起電極12的固定面成相反側的表面(在圖27中，面向上模122一側的表面)具有散熱片11a之外，與圖26的製造方法相同。此外，在圖26的製造方法中，可以與圖27相同地，使用具有散熱片的帶突起電極的板狀構件；反之在圖27的製造方法中，與圖26相同地，使用不具有散熱片的帶突起電極的板狀構件也可。另外，例如在圖26或27中，通過薄板樹脂的層壓、樹脂的旋塗等方式，將樹脂41a配置在基板21的晶片31及配線圖案22的固定面上來代替樹脂的印刷或塗布方式也可。 In addition, the cross-sectional view of FIG. 27 schematically shows a modification of the manufacturing method of the present embodiment. In the manufacturing method of FIG. 27, a printing method in which a liquid resin (thermosetting resin) 41a is printed on a fixed surface of the wafer 31 and the wiring pattern 22 of the substrate 21 is replaced with a coating method, and the plate-like member 11 and the protruding electrode 12 are formed. The surface of the opposite side to the opposite side (the surface facing the upper mold 122 in Fig. 27) has the fins 11a, which is the same as the manufacturing method of Fig. 26. Further, in the manufacturing method of Fig. 26, a plate-like member having a bump electrode having a heat sink may be used as in Fig. 27; otherwise, in the manufacturing method of Fig. 27, the heat sink is not used as in Fig. 26 A plate-like member with protruding electrodes is also possible. Further, for example, in FIG. 26 or 27, the resin 41a is placed on the fixed surface of the wafer 31 and the wiring pattern 22 of the substrate 21 by lamination of a thin resin or a spin coating of a resin, instead of printing or coating a resin. can.
實施例8 Example 8
接著，對本發明又另一實施例進行說明。在本實施例中，示出了採用壓縮成形的電子部件的製造方法又另一實施例。 Next, still another embodiment of the present invention will be described. In the present embodiment, still another embodiment of a manufacturing method of a compression-molded electronic component is shown.
本實施例中，對使用經預先切斷的離型膜及具有貫通孔(樹脂供應部)的矩形形狀的框(框體)的電子部件製 造方法及壓縮成形裝置(晶片的樹脂密封裝置)進行說明。在本實施例中，在樹脂材料(顆粒樹脂)載置於所述帶突起電極的板狀構件的狀態下，將該樹脂材料(顆粒樹脂)搬運至下模腔的位置，並且供應設置在下模腔內。 In the present embodiment, an electronic component made of a pre-cut release film and a rectangular frame (frame) having a through hole (resin supply portion) is used. The manufacturing method and the compression molding device (resin sealing device for wafer) will be described. In the present embodiment, in a state where the resin material (particulate resin) is placed on the plate-like member with the protruding electrode, the resin material (particulate resin) is transported to the position of the lower mold cavity, and the supply is set in the lower mold. Inside the cavity.
在本實施例中，將框體配置在經預先切斷的離型膜上，並將載置有顆粒樹脂的帶突起電極的板狀構件配置在框體貫通孔(樹脂供應部)內的離型膜上。由此，能夠防止所述顆粒樹脂從所述帶突起電極的板狀構件上掉落。另外，在本實施例中，對樹脂材料為顆粒樹脂的情況進行說明，但顆粒樹脂以外的任意樹脂(例如，粉末狀樹脂、液態樹脂、板狀樹脂、片狀樹脂、膜狀樹脂、漿糊狀樹脂等)，也能夠以相同方式實施。 In the present embodiment, the frame body is placed on the release film that has been cut in advance, and the plate-shaped member with the protruding electrode on which the granular resin is placed is placed in the frame through-hole (resin supply portion). On the membrane. Thereby, it is possible to prevent the particulate resin from falling from the plate-like member with the protruding electrode. Further, in the present embodiment, a case where the resin material is a particulate resin will be described, but any resin other than the particulate resin (for example, a powdery resin, a liquid resin, a plate resin, a sheet resin, a film resin, a paste) The resin or the like can also be carried out in the same manner.
以下，參照圖28至圖31，對本實施例進行更具體的說明。 Hereinafter, the present embodiment will be more specifically described with reference to Figs. 28 to 31.
首先，參照圖28，對本實施例的壓縮成形裝置(電子部件的製造裝置)進行說明。圖28是示出作為所述壓縮成形裝置一部分的成形模的一部分的結構的示意圖。另外，圖28示出向該成形模供應樹脂材料之前的開模狀態。 First, a compression molding apparatus (manufacturing apparatus for electronic components) of the present embodiment will be described with reference to Fig. 28 . Figure 28 is a schematic view showing the structure of a part of a forming die which is a part of the compression forming device. In addition, Fig. 28 shows a mold opening state before the supply of the resin material to the forming mold.
圖28的壓縮成形裝置與實施例6(圖20至圖23)相比，在成形模包括上模及下模這一點上相同，但在包括上模外氣隔斷構件及下模外氣隔斷構件這一點上不同。具體內容如下所述。即為如圖所示，圖28的壓縮成形裝置以上模2001及面向上模配置的下模2011作為主要構成要素。上模2001在上模底板2002處以垂下的狀態設置。在上模 底板2002上的上模2001的外周位置，設置有上模外氣隔斷構件2004。在上模外氣隔斷構件2004的上端面(被上模底板2002及上模外氣隔斷構件2004夾住的部分)，設置有用於隔斷外氣的O型環2004a。另外，在上模外氣隔斷構件2004的下端面，也設置有用於隔斷外氣的O型環2004b。另外，在上模底板2002，設置有用於强制性地吸引模內空間部的空氣並將其排出的孔2003。在上模2001的模面(下表面)設置有基板設置部2001a，其中，在所述基板設置部2001a處，將安裝有晶片31的基板21以晶片31安裝面側朝向下方的方式進行供應設置(安裝)。基板21例如能夠通過夾具(未圖示)等安裝在基板設置部2001a。另外，與所述各實施例相同，在基板21的晶片31安裝面上設置有配線圖案22。 The compression forming apparatus of Fig. 28 is the same as that of the embodiment 6 (Figs. 20 to 23) in that the forming die includes the upper die and the lower die, but includes the upper die outer air blocking member and the lower die outer air blocking member. This is different. The details are as follows. That is, as shown in the figure, the compression molding apparatus of Fig. 28 has the upper mold 2001 and the lower mold 2011 disposed facing the upper mold as main constituent elements. The upper mold 2001 is disposed in a state of being suspended at the upper mold base plate 2002. In the upper mold An outer peripheral air blocking member 2004 is provided at an outer peripheral position of the upper mold 2001 on the bottom plate 2002. An O-ring 2004a for blocking the outside air is provided on the upper end surface of the upper die outer air partition member 2004 (portion sandwiched by the upper die bottom plate 2002 and the upper die outer air blocking member 2004). Further, an O-ring 2004b for blocking the outside air is also provided on the lower end surface of the upper die outer air blocking member 2004. Further, in the upper mold base plate 2002, a hole 2003 for forcibly sucking air from the in-mold space portion and discharging it is provided. The substrate mounting portion 2001a is provided on the die surface (lower surface) of the upper mold 2001, and the substrate 21 on which the wafer 31 is mounted is supplied and disposed such that the wafer 31 mounting surface side faces downward in the substrate mounting portion 2001a. (installation). The substrate 21 can be attached to the substrate installation portion 2001a by, for example, a jig (not shown). Further, similarly to the above-described respective embodiments, the wiring pattern 22 is provided on the wafer 31 mounting surface of the substrate 21.
另外，下模2011包括下模腔底面構件2011a、下模外周構件2012及彈性構件2012a。進一步地，就下模2011而言，在其模面包括作為用於樹脂成形的空間的模腔(下模腔)2011b。下模腔底面構件2011a設置在下模腔2011b的下方。下模外周構件(下模的框體、模腔側面構件)2012以包圍下模腔底面構件2011a周圍的方式配置。下模外周構件2012上表面的高度高於下模腔底面構件2011a上表面的高度。由此，形成了由下模腔底面構件2011a上表面及下模外周構件2012內周面所包圍的下模腔(凹部)2011b。在下模腔底面構件2011與下模外周構件2012之間，形成有空隙(吸附孔)2011c。如下所述，使用真空泵(未圖示) 對該空隙2011c進行減壓，從而可以吸附離型膜等。另外，下模2011(下模腔底面構件2011a、下模外周構件2012及彈性構件2012a)以載置於下模底板2010的狀態設置。在下模外周構件2012與下模底板2010之間設置有用於緩衝的彈性構件2012a。進一步地，在下模底板2010上的下模外周構件2012的外周位置設置有下模外氣隔斷構件2013。在下模外氣隔斷構件2013的下端面(被下模底板2010及下模外氣隔斷構件2013夾住的部分)，設置有用於隔斷外氣的O型環2013a。下模外氣隔斷構件2013配置在上模外氣隔斷構件2004及用於隔斷外氣的O型環2004b的正下方。通過具備以上結構，在將上下兩模合模時，通過接合包括O型環2004a及2004b的上模外氣隔斷構件2004與包括O型環2013a的下模外氣隔斷構件2013，至少能夠使下模腔內處於外氣隔斷狀態。 In addition, the lower mold 2011 includes a lower cavity bottom surface member 2011a, a lower mold outer peripheral member 2012, and an elastic member 2012a. Further, as for the lower mold 2011, a cavity (lower cavity) 2011b as a space for resin molding is included on the die face thereof. The lower cavity bottom surface member 2011a is disposed below the lower cavity 2011b. The lower mold outer peripheral member (the lower mold frame body and the cavity side surface member) 2012 is disposed to surround the lower cavity bottom surface member 2011a. The height of the upper surface of the lower mold outer peripheral member 2012 is higher than the height of the upper surface of the lower cavity bottom surface member 2011a. Thereby, the lower cavity (concave portion) 2011b surrounded by the upper surface of the lower cavity bottom surface member 2011a and the inner circumferential surface of the lower die outer peripheral member 2012 is formed. A gap (adsorption hole) 2011c is formed between the lower cavity bottom surface member 2011 and the lower die outer peripheral member 2012. Use a vacuum pump (not shown) as described below The void 2011c is decompressed to adsorb a release film or the like. Further, the lower mold 2011 (the lower cavity bottom surface member 2011a, the lower mold outer peripheral member 2012, and the elastic member 2012a) is placed in a state of being placed on the lower mold base plate 2010. An elastic member 2012a for cushioning is provided between the lower mold outer peripheral member 2012 and the lower mold base plate 2010. Further, a lower outer mold air partition member 2013 is provided at an outer peripheral position of the lower mold outer peripheral member 2012 on the lower mold base plate 2010. An O-ring 2013a for blocking the outside air is provided at a lower end surface of the lower die outer air partition member 2013 (a portion sandwiched by the lower die bottom plate 2010 and the lower die outer air blocking member 2013). The lower mold outer air partition member 2013 is disposed directly below the upper outer mold air partition member 2004 and the O-ring 2004b for blocking the outside air. By having the above configuration, when the upper and lower molds are closed, the upper outer air blocking member 2004 including the O-rings 2004a and 2004b and the lower outer air blocking member 2013 including the O-ring 2013a can be at least brought down. The cavity is in an external air blocking state.
接著，對使用了該壓縮成形裝置的本實施例的電子部件的製造方法進行說明。即為首先，如圖28所示，以如上所述方式將基板21安裝在上模2001的模面(基板設置部2001a)。進一步地，如圖28所示，使用具有貫通孔的矩形形狀的框(框體)70，將顆粒樹脂(樹脂材料)41a供應至下模腔2011b內。更具體來講，如圖28所示，將框體70載置在已預先切斷成所需長度(預先切斷)的離型膜100上。此時，在框體70的下表面，吸附並固定經預先切斷的離型膜100也可。接著，從框體70貫通孔上側的開口部(樹脂供應部)，將板狀構件11的單面固定有突起電極12的帶 突起電極的板狀構件載置在離型膜100上。此時，使突起電極12處於朝向上方(離型膜100的相反側)的狀態。此外，在本實施例中，與實施例5(圖14至圖17)相同地，帶突起電極的板狀構件不具有壁狀構件11b及樹脂容納部(凹部)11c。進一步地，將顆粒樹脂41a以平整過的狀態供應(載置)在板狀構件11的突起電極12的固定面上。通過這種方式，如圖28所示，將樹脂41供應至由板狀構件11及框體70包圍的空間內，從而能夠形成載置在離型膜100上的“樹脂供應框體”。並且，如圖28所示，搬運所述樹脂供應框體，使其進入處於開模狀態的上模2001與下模2011之間(下模腔2011b的位置)。 Next, a method of manufacturing the electronic component of the present embodiment using the compression molding apparatus will be described. That is, first, as shown in FIG. 28, the substrate 21 is mounted on the mold surface (substrate setting portion 2001a) of the upper mold 2001 as described above. Further, as shown in FIG. 28, a granular resin (resin material) 41a is supplied into the lower cavity 2011b using a rectangular frame (frame) 70 having through holes. More specifically, as shown in FIG. 28, the casing 70 is placed on the release film 100 which has been previously cut into a desired length (pre-cut). At this time, the release film 100 which has been cut beforehand may be adsorbed and fixed on the lower surface of the casing 70. Then, the opening 70 (resin supply portion) on the upper side of the hole is passed through the frame 70, and the belt of the protruding electrode 12 is fixed to one surface of the plate member 11. The plate-like member of the protruding electrode is placed on the release film 100. At this time, the bump electrode 12 is placed in a state of being directed upward (opposite side of the release film 100). Further, in the present embodiment, as in the fifth embodiment (Figs. 14 to 17), the plate-like member with the protruding electrode does not have the wall member 11b and the resin accommodating portion (concave portion) 11c. Further, the particulate resin 41a is supplied (placed) on the fixing surface of the protruding electrode 12 of the plate-like member 11 in a flat state. In this manner, as shown in FIG. 28, the resin 41 is supplied into the space surrounded by the plate-like member 11 and the frame 70, whereby the "resin supply frame" placed on the release film 100 can be formed. Then, as shown in FIG. 28, the resin supply frame is conveyed to enter between the upper mold 2001 and the lower mold 2011 in the mold opening state (the position of the lower mold cavity 2011b).
接著，將所述樹脂供應框體載置在下模2011的模面上。此時，如圖29所示，用框體70和下模外周構件2012夾住離型膜100，並且使框體70貫通孔下側的開口部與下模腔2011b的開口部(下模面)對齊。進一步地，如圖29的箭頭2014所示，使用真空泵吸附下模的吸附孔2011c，並對其減壓。由此，如圖29所示，在下模腔2011b的模腔面上吸附並包覆離型膜100，將顆粒樹脂41供應設置在下模腔2011b內。進一步地，如圖29所示，通過加熱下模2011，使顆粒樹脂41a熔融並成為流動性樹脂41b的狀態。之後，在通過減壓使離型膜100吸附在下模腔2011b的模腔面的狀態下，去除框體70。 Next, the resin supply frame is placed on the mold surface of the lower mold 2011. At this time, as shown in FIG. 29, the release film 100 is sandwiched by the frame 70 and the lower die outer peripheral member 2012, and the frame 70 is inserted through the opening portion on the lower side of the hole and the opening portion of the lower cavity 2011b (the lower die face). ) Align. Further, as shown by an arrow 2014 in Fig. 29, the adsorption hole 2011c of the lower mold is sucked using a vacuum pump, and the pressure is reduced. Thereby, as shown in FIG. 29, the release film 100 is adsorbed and coated on the cavity surface of the lower cavity 2011b, and the particulate resin 41 is supplied and disposed in the lower cavity 2011b. Further, as shown in FIG. 29, by heating the lower mold 2011, the particulate resin 41a is melted and becomes the state of the fluid resin 41b. Thereafter, the casing 70 is removed in a state where the release film 100 is adsorbed to the cavity surface of the lower cavity 2011b by pressure reduction.
接著，將上下兩模合模。首先，如圖30所示，進行使基板面(基板21的晶片31的固定面)及下模面保持所需 間隔的狀態的中間合模。即為首先，在從圖29的結構去除了框體70的狀態下，使下模2011側上移。由此，如圖30所示，上模外氣隔斷構件2004及下模外氣隔斷構件2013以夾住O型環2004b的狀態閉合。通過這種方式，如圖30所示，形成由上模2001、下模2011、上模外氣隔斷構件2004及下模外氣隔斷構件2013所包圍的外氣隔斷空間部。在該狀態下，如圖30的箭頭2007所示，使用真空泵(未圖示)，經由上模底板2002的孔2003，至少吸引所述外氣隔斷空間部，並對其減壓，從而將其設定為規定的真空度。 Next, the upper and lower molds are clamped. First, as shown in FIG. 30, it is required to hold the substrate surface (the fixing surface of the wafer 31 of the substrate 21) and the lower mold surface. The middle of the interval state is clamped. That is, first, in a state where the casing 70 is removed from the configuration of FIG. 29, the lower mold 2011 side is moved upward. Thereby, as shown in FIG. 30, the upper-mold outer air blocking member 2004 and the lower-mold outer air blocking member 2013 are closed in a state in which the O-ring 2004b is sandwiched. In this manner, as shown in FIG. 30, the outer air partition space portion surrounded by the upper mold 2001, the lower mold 2011, the upper outer mold air shutoff member 2004, and the lower outer mold air shutoff member 2013 is formed. In this state, as shown by an arrow 2007 in FIG. 30, a vacuum pump (not shown) is used to suck at least the outer air partition space portion through the hole 2003 of the upper mold base plate 2002, and decompress the same. Set to the specified degree of vacuum.
進一步地，如圖31所示，接合基板面與下模面而進行完全合模。即為從圖30的狀態，使下模2011進一步上移。由此，如圖31所示，下模外周構件2012的上表面經由(隔著)離型膜100抵接於供應設置在上模2001處的基板21的基板面(晶片31的固定面)。之後，使下模底板2010進一步上移，由此使下模腔底面構件2011a進一步上移。此時，如上所述，使樹脂處於流動性樹脂41b的狀態。由此，如圖31所示，使突起電極12的頂端與基板21的配線圖案22抵接(接觸)，並且使晶片31在下模腔2011b內，浸漬於流動性樹脂41b中，進一步地，對流動性樹脂41b加壓。此時，通過下模腔底面構件2011a的按壓力，突起電極12整體相對地在與板狀構件11的面方向相垂直的方向上受到按壓。通過該按壓，如圖31所示，在設計成高於流動性樹脂41b厚度的突起電極12中，變形部12A發生 彎曲。由此，突起電極12在與板狀構件11的面方向相垂直的方向上收縮，從而與樹脂密封部件規定的厚度相吻合。另外，此時，如圖31所示，彈性構件2012a及O型環2004a、2004b、2013a發生收縮，從而發揮緩衝的作用。由此，如上所述，對流動性樹脂41b進行加壓而實現壓縮成形。之後，使流動性樹脂41b固化並形成密封樹脂。通過這種方式，在板狀構件11上的突起電極12的固定面與基板21的配線圖案22的形成面之間，通過所述密封樹脂對晶片31進行密封，並且能夠使突起電極12與配線圖案22接觸(樹脂密封步驟)。在經過流動性樹脂41b的固化所需要的時間後，以與實施例1、5或6(圖10(F)、17或23)相同的步驟將上下兩模開模。由此，在下模腔2011b內，能夠制得包括基板21、晶片31、配線圖案22、樹脂(密封樹脂)41、突起電極12及板狀構件11的成形品(電子部件)。 Further, as shown in FIG. 31, the substrate surface and the lower mold surface are joined to perform complete mold clamping. That is, from the state of FIG. 30, the lower mold 2011 is further moved up. Thereby, as shown in FIG. 31, the upper surface of the lower mold outer peripheral member 2012 abuts on the substrate surface (fixed surface of the wafer 31) on which the substrate 21 provided at the upper mold 2001 is supplied via the release film 100. Thereafter, the lower mold base plate 2010 is further moved upward, thereby further moving the lower cavity bottom surface member 2011a upward. At this time, as described above, the resin is placed in a state of the fluid resin 41b. Thereby, as shown in FIG. 31, the tip end of the bump electrode 12 is brought into contact (contact) with the wiring pattern 22 of the substrate 21, and the wafer 31 is immersed in the fluid mold resin 41b in the lower mold cavity 2011b, and further, The fluid resin 41b is pressurized. At this time, the projection electrode 12 is relatively pressed in the direction perpendicular to the surface direction of the plate-like member 11 by the pressing force of the lower cavity bottom surface member 2011a. By this pressing, as shown in FIG. 31, in the protruding electrode 12 designed to be higher than the thickness of the fluid resin 41b, the deformation portion 12A occurs. bending. Thereby, the protruding electrode 12 contracts in a direction perpendicular to the surface direction of the plate-like member 11, and matches the thickness specified by the resin sealing member. Further, at this time, as shown in FIG. 31, the elastic member 2012a and the O-rings 2004a, 2004b, and 2013a are contracted to function as a cushion. Thereby, as described above, the fluid resin 41b is pressurized to achieve compression molding. Thereafter, the fluid resin 41b is cured to form a sealing resin. In this manner, between the fixed surface of the bump electrode 12 on the plate member 11 and the formation surface of the wiring pattern 22 of the substrate 21, the wafer 31 is sealed by the sealing resin, and the bump electrode 12 and the wiring can be made. The pattern 22 is in contact (resin sealing step). After the time required for the curing of the fluid resin 41b, the upper and lower molds were opened in the same manner as in Example 1, 5 or 6 (Fig. 10 (F), 17 or 23). Thereby, in the lower mold cavity 2011b, a molded article (electronic component) including the substrate 21, the wafer 31, the wiring pattern 22, the resin (sealing resin) 41, the bump electrode 12, and the plate-like member 11 can be obtained.
此外，在本實施例中，壓縮成形裝置(電子部件的製造裝置)的結構不限於圖28至圖31的結構，例如，可以與一般的壓縮成形裝置的結構相同或以其為基準。具體來講，例如，可以與日本國特開2013-187340號公報、日本國特開2005-225133號公報、日本國特開2010-069656號公報、日本國特開2007-125783號公報及日本國特開2010-036542號公報等公開的結構相同或以其為基準。 Further, in the present embodiment, the configuration of the compression molding device (manufacturing device for electronic components) is not limited to the configuration of FIGS. 28 to 31, and may be, for example, the same as or based on the structure of a general compression molding device. Specifically, for example, Japanese Laid-Open Patent Publication No. 2013-187340, Japanese Patent Laid-Open Publication No. 2005-225133, Japanese Patent Laid-Open Publication No. 2010-069656, Japanese Patent Publication No. 2007-125783, and Japan The structures disclosed in Japanese Laid-Open Patent Publication No. 2010-036542 or the like are the same or based on them.
本發明不限於上述的實施例，在不脫離本發明主旨的範圍內，根據需要，能夠任意且適當地進行組合、變更或 選擇採用。 The present invention is not limited to the above-described embodiments, and can be combined, changed, or arbitrarily and appropriately as needed within the scope of the gist of the present invention. Choose to adopt.
例如，帶突起電極的板狀構件的所述突起電極的形狀不限於圖2至圖4所示形狀，可以是任意形狀。作為一例，如上所述，在所述突起電極中，至少一部分可以呈板狀形狀。並且，在基板面上，可以使用所述板狀的電極來劃分與一個電子部件(一個產品單位)對應的所需的範圍。 For example, the shape of the protruding electrode of the plate-like member with the protruding electrode is not limited to the shape shown in FIGS. 2 to 4, and may be any shape. As an example, as described above, at least a part of the protruding electrodes may have a plate shape. Further, on the substrate surface, the plate-shaped electrode can be used to divide a desired range corresponding to one electronic component (one product unit).
10‧‧‧板狀構件 10‧‧‧ Plate-like members
10D‧‧‧成形模 10D‧‧‧forming mould
11‧‧‧板狀構件 11‧‧‧ Plate-like members
12‧‧‧突起電極 12‧‧‧ protruding electrode
12D‧‧‧孔 12D‧‧‧ hole
Claims (48)
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| JP2014240752A JP6400446B2 (en) | 2014-11-28 | 2014-11-28 | Method for manufacturing plate-like member with protruding electrode, plate-like member with protruding electrode, method for manufacturing electronic component, and electronic component |
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| CN112575365A (en) * | 2019-09-29 | 2021-03-30 | 张宇明 | Electroplating anode and electroplating method using same |
| JP7360364B2 (en) * | 2020-07-03 | 2023-10-12 | Ｔｏｗａ株式会社 | Resin molding equipment and method for manufacturing resin molded products |
| TWI781702B (en) * | 2021-07-29 | 2022-10-21 | 閎暉實業股份有限公司 | In-mold electronics manufacturing process made electronic component and manufacturing method thereof |
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| JP2002110869A (en) * | 2000-09-26 | 2002-04-12 | Toshiba Corp | Semiconductor device |
| US6580167B1 (en) * | 2001-04-20 | 2003-06-17 | Amkor Technology, Inc. | Heat spreader with spring IC package |
| JP4326786B2 (en) * | 2002-11-26 | 2009-09-09 | Ｔｏｗａ株式会社 | Resin sealing device |
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| JP4580676B2 (en) * | 2004-04-15 | 2010-11-17 | 出光興産株式会社 | Method for injection compression molding of conductive thermoplastic resin composition |
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| JP2007287937A (en) | 2006-04-17 | 2007-11-01 | Kyocera Chemical Corp | Resin-sealed semiconductor device and its manufacturing method |
| JP2007294554A (en) * | 2006-04-24 | 2007-11-08 | Sumitomo Electric Ind Ltd | Convex structural member |
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| TWI447781B (en) * | 2007-10-11 | 2014-08-01 | Univ Nat Cheng Kung | A method of making a microstructure embossing die |
| JP5153509B2 (en) * | 2008-08-08 | 2013-02-27 | Ｔｏｗａ株式会社 | Electronic component compression molding method and mold apparatus |
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| US8012799B1 (en) * | 2010-06-08 | 2011-09-06 | Freescale Semiconductor, Inc. | Method of assembling semiconductor device with heat spreader |
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