TWI618155B - Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member - Google Patents

Abstract

The present invention provides a method of manufacturing a resin-sealed electronic component capable of easily and efficiently producing a resin-sealed electronic component having both a via electrode (protrusion electrode) and a plate-like member.

The present invention relates to a method of manufacturing a resin-sealed electronic component in which an electronic component is resin-sealed, characterized in that the resin-sealed electronic component to be manufactured includes a substrate, an electronic component, a resin, a plate-shaped member, and a bump electrode, and is on the substrate. An electronic component in which a wiring pattern is formed, the manufacturing method having a resin sealing step of sealing an electronic component with a resin, and in the resin sealing step, a protruding electrode having a protruding electrode fixed to one surface of the plate member Between the bump electrode fixing surface of the plate member and the wiring pattern forming surface of the substrate, the electronic component is sealed with a resin, and the bump electrode is brought into contact with the wiring pattern.

Description

Method for manufacturing resin-sealed electronic component, plate member with protruding electrode, resin-sealed electronic component, and manufacturing method of plate-shaped member with protruding electrode

Cross-references to related applications

The priority of the Japanese Patent Application No. 2014-090753, filed on Apr. 24, 2014, is hereby incorporated by reference.

The present invention relates to a method of manufacturing a resin-sealed electronic component, a plate-like member having a protruding electrode, a resin-sealed electronic component, and a method of manufacturing a plate-like member having a protruding electrode.

In many cases, electronic components such as ICs and semiconductor wafers are formed and sealed as resin-sealed resin-sealed electronic components.

The resin-sealed electronic component may be formed by embedding a via electrode in a resin. The via electrode can be formed, for example, in the resin of the resin-sealed electronic component (package), and a through hole forming hole or groove (hereinafter referred to as a "via hole forming hole") is formed from the top surface of the package, and The through hole forming hole is filled in the through hole electrode forming material (for example, a plating material, a shield material, or the like). The through hole forming hole can be formed, for example, by irradiating laser light from the package top toward the resin. Further, as another method for forming the via electrode, the following is proposed In the method, the protrusion of the metal structure having the protrusion is resin-sealed together with the semiconductor wafer, and the portion other than the protrusion of the metal structure is removed (Japanese Patent Laid-Open Publication No. 2012-015216). In this case, in the resin-sealed electronic component, only the protrusion of the metal structure remains in a state of being sealed by a resin, and this becomes a via electrode.

On the other hand, the resin-sealed electronic component may be a heat sink (heat sink) for cooling the heat generated by the electronic component, or a shield (shield) for shielding electromagnetic waves emitted from the electronic component. The plate-like members are formed in one piece (for example, Japanese Patent Laid-Open Publication No. 2013-187340 and Japanese Patent Laid-Open No. 2007-287937).

In the method of forming the via hole by the resin, there are problems such as the following (1) to (5).

(1) The thickness of the electronic component (package) sealed by the resin or the like may be such that the depth of the via hole forming hole cannot be accurately and appropriately formed on the wiring pattern of the substrate.

(2) The filler contained in the resin material is likely to remain on the wiring pattern of the substrate.

(3) The wiring pattern on the substrate on which the electronic component is mounted is damaged by the condition that the resin is formed by the hole forming hole.

(4) In the case of the above (3), if the filler density of the resin material is different, it is necessary to change the laser processing conditions for the hole for forming the through hole in the resin. That is, the control of the formation conditions of the through hole forming holes is complicated.

(5) Under the influence of (1) to (4) above, the yield of resin-sealed electronic parts is difficult to increase.

On the other hand, in the method of JP-A-2012-015216, after the protrusion of the metal structure is resin-sealed, it is necessary to remove the portion of the metal structure other than the protrusion. Therefore, the manufacturing steps of the resin-sealed electronic component become complicated and result in waste of materials.

Further, in any of the above methods, after forming the via electrode, it is necessary to perform plating The plate-like members are formed, and the steps are complicated.

Further, Japanese Laid-Open Patent Publication No. 2013-187340 and Japanese Patent Laid-Open Publication No. H2007-287937 disclose a resin-sealed electronic component having a plate-shaped member and a method of manufacturing the same, but are not described in the case of forming a via electrode. A method that can be used to solve the problems of the above various methods.

As described above, the technique of easily and efficiently manufacturing a resin-sealed electronic component having both a via electrode and a plate member does not exist.

Accordingly, an object of the present invention is to provide a method of manufacturing a resin-sealed electronic component capable of easily and efficiently manufacturing a resin-sealed electronic component having both a through-hole electrode and a plate-like member, a plate-like member having a protruding electrode, and a resin seal A method of manufacturing an electronic component and a plate member having a protruding electrode.

In order to achieve the above object, a method for producing a resin-sealed electronic component according to the present invention (hereinafter sometimes referred to simply as "the manufacturing method of the present invention") is characterized in that it is a resin-sealed electronic component that is resin-sealed to an electronic component. In the manufacturing method, the resin-sealed electronic component to be manufactured includes a substrate, an electronic component, a resin, a plate-shaped member, and a bump electrode, and a resin-sealed electronic component in which a wiring pattern is formed on the substrate, wherein the manufacturing method has the above-described manufacturing method a resin sealing step of sealing the electronic component by the resin, in the resin sealing step, the protruding electrode fixing surface of the plate-shaped member having the protruding electrode on which the protruding electrode is fixed on one surface of the plate-shaped member The electronic component is sealed by the resin between the wiring pattern forming surface of the substrate, and the bump electrode is brought into contact with the wiring pattern.

The plate-like member with a protruding electrode of the present invention is characterized in that it is used in the above-described manufacturing method of the present invention, and has a plate-like member with a protruding electrode, and the above-mentioned protruding electrode is fixed It is set on one side of the above plate-shaped member.

The resin-sealed electronic component of the present invention is characterized in that it is a resin-sealed electronic component that is resin-sealed to an electronic component, and the resin-sealed electronic component comprises a substrate, an electronic component, a resin, and the above-described board with a protruding electrode of the present invention. In the above-described electronic component, the electronic component is placed on the substrate and sealed by the resin, and a wiring pattern is formed on the electronic component arrangement side of the substrate, and the protruding electrode is in contact with the wiring pattern through the resin.

According to the present invention, it is possible to provide a method of manufacturing a resin-sealed electronic component capable of easily and efficiently manufacturing a resin-sealed electronic component having both a via electrode (protrusion electrode) and a plate-like member, a plate-shaped member having a protruding electrode, A resin sealing electronic component and a method of manufacturing a plate member having a protruding electrode.

10‧‧‧Plate-like members with protruding electrodes

11‧‧‧ Plate-like members

12‧‧‧ protruding electrode

12a‧‧‧ lower

12b‧‧‧ hole

12c‧‧‧ Protrusion

13‧‧‧ hole

20‧‧‧Resin sealed electronic parts

21‧‧‧Substrate

22‧‧‧Wiring pattern

31‧‧‧Electronic parts

41‧‧‧Resin

50‧‧‧Forming mould

51‧‧‧Upper mold

52‧‧‧ Lower mold

53‧‧‧Plunger

54‧‧‧feeding chamber

55‧‧‧Resin channel

56‧‧‧ cavity

57‧‧‧Substrate Mounting Department

60‧‧‧Resin supply member

61‧‧‧Resin Supply Department

62‧‧‧lower gate

100‧‧‧ release film

102‧‧‧Intermediate mould

102a‧‧‧O-ring

104‧‧‧ Roll

111a‧‧‧ Lower mold cavity bottom member

111b‧‧‧ lower mold cavity

111c‧‧‧ gap

112‧‧‧ Lower mold top platen

113‧‧‧ Lower outer peripheral pressure plate

121‧‧‧ Lower mold

122‧‧‧Upper mold

123‧‧‧vacuum chamber

1001‧‧‧Upper mold

1003‧‧‧ hole

1011‧‧‧Next mold

1011a‧‧‧ Lower mold cavity bottom member

1011b‧‧‧ lower mold cavity

1011c‧‧‧ gap

1012‧‧‧ Lower mold top plate

1012a‧‧‧O-ring

2001‧‧‧Upper mold

2001a‧‧‧Substrate Installation Department

2002‧‧‧Upper mold substrate

2004‧‧‧Upper mold external gas partition member

2004a‧‧O-ring

2004b‧‧‧O-ring

2010‧‧‧ Lower mold substrate

2011‧‧‧Next mold

2011a‧‧‧ Lower mold cavity bottom member

2011b‧‧‧ Lower mold cavity

2011c‧‧‧ gap

2012‧‧‧Mold outer peripheral top plate

2012a‧‧‧Flexible components

2013‧‧‧Mold outer gas partitioning member

2013a‧‧‧O-ring

1A and 1B are perspective views showing an example of a structure of a plate-like member having a protruding electrode of the present invention.

2(A) to 2(D) are perspective views showing a structure of a protruding electrode in a plate-like member having a protruding electrode of the present invention.

Fig. 3 is a cross-sectional view showing an example of the structure of the resin-sealed electronic component of the present invention.

Fig. 4 is a cross-sectional view showing a manufacturing method of the present invention by transfer molding.

Fig. 5 is a cross-sectional view showing a step of an example of a manufacturing method of the present invention using compression molding.

Fig. 6 is a cross-sectional view showing another step in the same manufacturing method as Fig. 5.

Fig. 7 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 5.

Fig. 8 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 5.

Figure 9 is a view showing one of the other examples of the manufacturing method of the present invention using compression molding. A cross-sectional view of the step.

Fig. 10 is a cross-sectional view showing another step in the same manufacturing method as Fig. 9.

Figure 11 is a cross-sectional view showing one step of still another example of the manufacturing method of the present invention using compression molding.

Fig. 12 is a cross-sectional view showing another step in the same manufacturing method as Fig. 11.

Fig. 13 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 11.

Fig. 14 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 11.

Fig. 15 is a cross-sectional view showing a step of still another example of the manufacturing method of the present invention using compression molding.

Fig. 16 is a cross-sectional view showing a step of still another example of the manufacturing method of the present invention using compression molding.

Fig. 17 is a cross-sectional view showing still another example of the manufacturing method of the present invention using compression molding.

Fig. 18 is a cross-sectional view showing still another example of the manufacturing method of the present invention using compression molding.

Fig. 19 is a cross-sectional view showing a step of still another example of the manufacturing method of the present invention using compression molding.

Fig. 20 is a cross-sectional view showing one step of still another example of the manufacturing method of the present invention using compression molding.

Fig. 21 is a cross-sectional view showing still another example of the manufacturing method of the present invention using compression molding.

Fig. 22 is a cross-sectional view showing still another example of the manufacturing method of the present invention using compression molding.

Next, the present invention will be described in more detail by way of examples. However, the present invention is not subject to the following The description is limited.

In the manufacturing method of the present invention, the number of the protruding electrodes is arbitrary, and is not particularly limited, and may be one or plural. The shape of the protruding electrode is not particularly limited. Further, when the plurality of protruding electrodes are plural, the shapes thereof may be the same or different from each other. For example, at least one of the protruding electrodes may be a protruding electrode with a through hole. More specifically, the through hole in the protruding electrode having the through hole may be a through hole penetrating in a direction parallel to a plate surface of the plate member. The protruding electrode having the through hole may have a projection that protrudes in a direction perpendicular to a plate surface of the plate member, at an end opposite to one end of the plate member. More specifically, the shape of the protruding electrode having the through hole may be, for example, the shape of FIGS. 2(A) to (C) to be described later.

In the manufacturing method of the present invention, at least one of the protruding electrodes is a columnar protruding electrode having a columnar shape. Examples of the shape of the columnar projection electrode include a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, and a truncated cone shape.

Further, in the manufacturing method of the present invention, at least one of the protruding electrodes may be a plate-like protruding electrode. In this case, the electronic component may be plural. In the resin sealing step, the substrate is divided into a plurality of regions by the plate-like protruding electrodes, and the electronic component is resin-sealed in each of the regions. Further, it is preferable that the plate-like protruding electrode has a through hole and a protrusion, and the through hole penetrates the plate-shaped protruding electrode in a direction parallel to a plate surface of the plate-shaped member, and the protrusion is formed on the plate-shaped protruding electrode An end opposite to one end of the plate-like member is protruded toward a direction perpendicular to a plate surface of the plate-like member.

In the manufacturing method of the present invention, the plate member is not particularly limited, but is preferably a heat sink (heat sink) or a shield plate (shield plate). The shield plate may be, for example, a shield for shielding electromagnetic waves emitted from the electronic component. The heat dissipation plate is preferably opposite to the protruding electrode The fixing surface has a fin on one side of the opposite side. Further, the shape of the plate-shaped member is not particularly limited, except that the protruding electrode is fixed. For example, in the case where the plate member is a heat dissipation plate, the heat dissipation plate may be in the form of one or a plurality of combined protrusions (for example, heat dissipation) in addition to the protruding electrodes. Pie (fin) shape and so on. The material of the plate-like member is not particularly limited. When the plate-shaped member is a heat dissipation plate or a shield plate, for example, a metal material, a ceramic material, a resin, a metal deposition film, or the like can be used. The metal deposition film is not particularly limited, and may be, for example, a metal deposition film in which aluminum, silver, or the like is deposited on a film. Further, the material of the protruding electrode is not particularly limited, and for example, a metal material, a ceramic material, a resin, or the like can be used. The metal material is not particularly limited, and examples thereof include iron-based materials such as stainless steel and permalloy (alloys of iron and nickel); copper-based materials such as brass, copper-molybdenum alloy, and beryllium copper; and aluminum such as hard aluminum. Department of materials. The ceramic material is not particularly limited, and examples thereof include an alumina-based material such as aluminum nitride; an anthracene-based material such as tantalum nitride; and a zirconia-based material. The resin is not particularly limited, and examples thereof include a rubber-based material such as an elastic rubber resin, a material in which a conductive material is mixed with a base material, and a resin material obtained by extrusion molding or injection molding of the materials. . Further, in the plate-like member having the protruding electrode, the surface of the plate-like member may be subjected to surface treatment such as plating or coating to form a conductive layer. Furthermore, the above-mentioned plate-shaped member may also be a functional member (acting member) having some functions. For example, in the case where the above-mentioned plate member is a heat dissipation plate (heat sink), it is a functional member (acting member) having a heat dissipation function (heat dissipation function); in the case where the above plate member is a shield plate (shield plate) It is a functional member (acting member) having a shielding function (shielding function).

In the resin sealing step, the resin sealing method (forming method) is not particularly limited, and may be any method such as transfer molding or compression molding.

In the case where the resin sealing step is performed by compression molding, the manufacturing method of the present invention may further comprise: fixing the resin to the plate-like member having the protruding electrode; A resin mounting step on the surface of the above-mentioned bump electrode is fixed. Further, in this case, the manufacturing method of the present invention may further include a transfer step of transporting the plate-like member having the protruding electrode to the cavity position of the molding die. Further, in the cavity, the resin may be immersed in the resin placed on the plate-like member, and the resin and the plate-shaped member having the protruding electrode and the electronic component may be And compression molding, thereby performing the above resin sealing step.

The order of the resin mounting step and the transport step is not particularly limited, and either one of them may be performed first or simultaneously. For example, in the above-described transfer step, the resin may be transferred to the mold of the forming mold together with the plate-like member having the protruding electrode in a state of being placed on the plate-like member having the protruding electrode. Cavity position. Alternatively, in the above-described transfer step, the plate-like member having the protruding electrode may be transferred to the cavity position of the molding die while the resin is placed thereon. In this case, the manufacturing method of the present invention may further include a heating step of heating the plate-like member having the protruding electrodes in the cavity before the resin mounting step. Then, the resin mounting step may be performed in the cavity in a state where the plate member having the protruding electrode is heated.

In the above-described transfer step, the plate-shaped member having the protruding electrode may be placed on the release film with one surface of the protruding electrode fixed thereto, and the protruding electrode may be placed. The plate member is conveyed into the cavity of the forming mold. In this case, in the transfer step, the frame body and the plate-shaped member having the protruding electrode may be placed on the release film together, and the plate-shaped member having the protruding electrode may be surrounded by the frame. In this state, the plate-like member having the protruding electrode is conveyed into the cavity of the molding die. Preferably, in the resin mounting step, the frame body and the plate-like member having the protruding electrode are placed on the release film, and the plate-shaped member having the protruding electrode is surrounded by the frame body. In the state of the plate, the plate having the protruding electrode The resin is supplied into the space surrounded by the member and the frame, whereby the resin is placed on the fixing surface of the protruding electrode. In this case, the order of the resin mounting step and the transport step is not particularly limited, and either one of them may be performed first or simultaneously, but it is preferred to carry out the resin mounting before performing the above-described transport step. step.

Further, the plate-like member having the protruding electrode may be fixed to the release film by an adhesive on one side opposite to the surface on which one of the protruding electrodes is fixed.

The conveying member that performs the above-described conveying step may be a member that conveys the resin into the cavity of the molding die while the plate-like member on which the resin is placed is placed on the release film. In this case, the resin sealing member that performs the resin sealing may be a member having a release film adsorbing member and performing the above-described compression molding in a state where the release film is adsorbed to the release film adsorbing member. Further, the molding die is not particularly limited, and is, for example, a metal mold or a ceramic mold.

As described above, the plate-like member with the protruding electrode of the present invention is characterized in that it is a plate-like member having a protruding electrode used in the above-described manufacturing method of the present invention, and the protruding electrode is fixed to the above-mentioned plate-shaped member. One side. As described above, the number and shape of the protruding electrodes are not particularly limited. As described above, for example, at least one of the protruding electrodes may be the above-described plate-like protruding electrode. As described above, it is preferable that the plate-like protruding electrode has a through hole and a protrusion, and the through hole penetrates the plate-shaped protruding electrode in a direction parallel to a plate surface of the plate-shaped member, and the protrusion is formed in the plate-shaped protruding electrode And protruding at an end opposite to one end of the plate-like member, and protruding in a direction perpendicular to a plate surface of the plate-shaped member. Further, as described above, for example, at least one of the protruding electrodes may be a protruding electrode having a through hole. More specifically, as described above, the through hole of the protruding electrode 12 having the through hole may be a through hole 12b that penetrates in a direction parallel to the plate surface of the plate member. Further, the protruding electrode having the through hole may have a surface facing the plate member from the end opposite to the one end (12a side) of the plate member. A projection 12c that protrudes in the vertical direction. Further, as described above, at least one of the protruding electrodes may have a columnar protruding electrode having a columnar shape (for example, a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, and a truncated pyramid shape).

Moreover, as described above, the shape of the plate-shaped member is not particularly limited, and for example, the plate-shaped member may have a resin receiving portion. More specifically, for example, the peripheral portion of the plate-like member may be swelled toward the protruding electrode fixing surface side of the plate-shaped member, and the resin receiving portion may be formed at a central portion of the plate-shaped member. Further, in the resin mounting step of the present invention, the resin may be placed in the resin accommodating portion of the plate-like member, and the resin may be placed in a state where the resin is placed in the resin accommodating portion. Sealing step.

Further, in the resin sealing step, when the compression molding is used, the substrate on which the electronic component is placed on the wiring pattern forming surface may be placed on the substrate so that the formation surface of the wiring pattern faces upward. On the mounting table, the resin is pressed while the resin is placed on the surface on which the wiring pattern is formed.

In the production method of the present invention, the resin is not particularly limited, and may be, for example, any of a thermoplastic resin or a thermosetting resin. The resin may be, for example, at least one selected from the group consisting of a particulate resin, a powdered resin, a liquid resin, a plate resin, a sheet resin, a film resin, and a paste resin. Further, the resin may be, for example, at least one selected from the group consisting of a transparent resin, a translucent resin, and an opaque resin.

Hereinafter, embodiments of the present invention will be described based on the drawings. For convenience of explanation, each drawing is schematically represented by omitting, enlarging, or the like as appropriate.

[Example 1]

In the present embodiment, an example of the resin-sealed electronic component of the present invention using the above-described plate-like member having the protruding electrode, and the resin-sealed electronic using the transfer molding are used as an example of the plate-like member with the protruding electrode of the present invention. An example of manufacturing a part Description.

In the perspective view of Fig. 1, the configuration of the plate-like member with the protruding electrodes of the present embodiment is schematically shown. As shown in FIG. 1, the plate-like member 10 having the protruding electrodes is formed by fixing a pattern of the protruding electrodes 12 to one surface of the plate-like member 11. The length (height) of the bump electrode 12 is not particularly limited, and can be appropriately set, for example, according to the thickness of the resin-sealed electronic component (molding package) of the finished product. Further, in the present invention, the pattern of the protruding electrodes is not limited to the pattern of the embodiment (Fig. 1), and may be any pattern.

The structure of the plate-like member with the protruding electrodes shown in the perspective view of Fig. 1 is as shown in two of Figs. 1(A) and (B). First, as shown in Fig. 1(A), in the plate-like member 10 having the protruding electrodes, the pattern of the protruding electrodes 12 is fixed to the metal in a direction perpendicular to the surface direction of the metal plate (plate-like member) 11. One side of the plate (plate member) 11. On the other hand, in Fig. 1(B), in the case of the plate-like member 10 having the projecting electrodes, one portion of the metal plate (plate-like member) 11 is punched, and one of the above-mentioned portions to be punched faces the plate-like member 11 The surface direction is curved in a direction perpendicular to the protrusion electrode. As shown in the figure, in the plate-like member 11, a part of the above-mentioned punched portion is formed as a hole 13. Other than this, it is the same as FIG. 1(A).

In FIG. 1(A) or (B), the shape of the bump electrode 12 is not particularly limited, and may be, for example, a shape as shown in FIG. 2. In Fig. 2, the upper side view is a perspective view showing a part of the plate-like member 10 having the projecting electrodes shown in Fig. 1. Further, (A) to (C) on the lower side of FIG. 2 schematically show a perspective view of an example of the structure of the bump electrode 12. As shown in Figs. 2(A) to (C), respectively, no hole is provided in the lower portion 12a of the protruding electrode 12 (portion on the side to which the plate member 11 is connected). On the other hand, a hole (through hole) penetrating the protruding electrode 12 in a direction parallel to the plate surface of the plate member 11 is formed on the upper portion of the protruding electrode 12 (the portion opposite to the side to which the plate member 11 is connected). 12b. Further, the upper end of the protruding electrode 12 (the end opposite to the end fixed to the plate-like member 11) is formed with a projection 12c so that a part thereof protrudes upward (in a direction perpendicular to the plate surface of the plate-like member 11). The protruding electrode 12 can be adjacent to the substrate at the front end portion of the protrusion 12c The wiring pattern (substrate electrode) is in contact. Further, in Fig. 2(A), the number of the projections 12c is two. Fig. 2(B) is the same as Fig. 2(A) except that the number of the projections 12c is one and the width of the protruding electrode 12 is slightly narrow. 2(C) is the same as FIG. 2(B) except that the width of the bump electrode 12 is narrower. Thus, the number of the protrusions 12c is not particularly limited, and may be plural. The number of the projections 12c is one or two in Figs. 2(A) to (C), but may be three or more. Further, the number of the holes (through holes) 12b is one in FIGS. 2(A) to (C), but is not particularly limited, and may be any number or plural.

Since the protrusions 12c are provided, the bump electrodes 12 are easily in contact with the wiring pattern (substrate electrode) of the substrate without being disturbed by the resin. That is, the resin (for example, molten resin or liquid resin) between the bump electrode 12 and the wiring pattern 22 in FIG. 1 is separated by the protrusion 12c, and the front end of the protrusion 12c abuts (physical contact) with the wiring pattern 22. At the same time, it is electrically connected. Further, since the bump electrode 12 has the hole 12b, it is easier to resin-seale the electronic component. That is, since the resin can flow through the holes 12b, the flow of the resin becomes smoother, and the efficiency of resin sealing is further improved. This effect is particularly remarkable in the case of transfer forming. Further, when the bump electrode 12 abuts (contacts) the wiring pattern 22, as shown in FIG. 2(D), the bump electrode 12 is bent in the vicinity of the hole 12b, whereby the height (length) of the bump electrode 12 can be reduced. Thereby, the height of the bump electrode 12 can be adjusted in accordance with the resin thickness (package thickness) of the resin-sealed electronic component. In consideration of this point, the height (length) of the bump electrode 12 may be set to be slightly longer than the above-described resin thickness (package thickness).

Further, the shape of the bump electrode 12 may be other shapes in addition to or in place of the shapes of FIGS. 2(A) to (C). For example, as described above, at least one of the bump electrodes 12 may be a columnar bump electrode having a columnar shape. As the shape of the columnar projection electrode, as described above, for example, a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, and a truncated cone shape can be cited.

Further, as described above, at least one of the bump electrodes 12 may be a plate-like bump electrode. The In the above, in the resin sealing step of the manufacturing method of the present invention, the substrate may be divided into a plurality of regions by the plate-like protruding electrodes, and the electronic components may be in the respective regions. Perform a resin seal. Further, the plate-like projection electrode may have the same through-holes and projections as the projection electrodes of FIGS. 2(A) to (C). The through-holes may be formed in the same direction as the plate faces of the plate-like members in the same manner as in FIGS. 2(A) to (C). Further, in the same manner as in Figs. 2(A) to (C), it is preferable that the projection is at an end opposite to one end of the plate-like projection electrode and fixed to one end of the plate-like member, and is formed in the same manner as the plate-shaped member. The board surface protrudes in the vertical direction. The number of the through holes and the protrusions of the plate-like projection electrode is not particularly limited, but is preferably plural. The plate-like projection electrode has the above-described through hole and the protrusion, and has the same advantages as the through hole 12b and the projection 12c of Figs. 2(A) to 2(C). In other words, first, the plate-like projection electrode has the protrusion, and the plate-shaped protrusion electrode is easily brought into contact with the wiring pattern (substrate electrode) of the substrate without being disturbed by the resin. Further, since the plate-like projection electrode has the through hole, the resin can flow through the through hole, so that the flow of the resin becomes smoother, and the efficiency of resin sealing is further improved. This effect is particularly remarkable in the case of transfer forming. Further, the plate-like projection electrode is bent in the vicinity of the through hole, whereby the height (length) of the plate-like projection electrode can be reduced. Thereby, the height of the above-mentioned plate-like projecting electrode can be adjusted in accordance with the resin thickness (package thickness) of the resin-sealed electronic component. In view of this point, the height (length) of the above-mentioned plate-like projection electrode may be set to be slightly longer than the above-mentioned resin thickness (package thickness).

Further, a method for producing a plate-like member having a protruding electrode according to the present invention includes, for example, a method of manufacturing a plate-shaped member (metal plate) by bonding a protruding electrode; and using a metal plate as a plate-like member. Further, the method of manufacturing the bump electrode by punching and bending the metal plate is not limited thereto. Specifically, for example, the method shown in the following (1) to (6) can be carried out according to a general method, whereby the plate-like structure with the protruding electrodes shown in FIG. 1(A) can be manufactured. Pieces.

(1) Method of manufacturing by etching a metal plate

(2) A method of manufacturing by bonding a metal plate to a bump electrode

(3) Method for simultaneously forming a plate-shaped member and a protruding electrode by electroforming

(4) A method of simultaneously forming a plate-shaped member and a protruding electrode by a resin having conductivity (shielding property)

(5) A method in which a bump electrode is bonded to a resin (plate member) having conductivity (shield)

(6) A method of adding a conductive (shielding) coating film to a member having a resin plate and a projection

As described above, the method for producing the plate-like member having the protruding electrode of the present invention is not particularly limited. For example, the method shown in the following (7) can be carried out according to a general method, thereby producing the pattern shown in Fig. 1(B). A plate-like member having a protruding electrode.

(7) A method of manufacturing a bump electrode by using a metal plate as a plate member and punching and bending the above metal plate.

In the cross-sectional view of Fig. 3, the structure of the resin-sealed electronic component of the present embodiment manufactured using the plate-like member having the protruding electrodes shown in Fig. 1 is schematically shown. As shown in the figure, the resin-sealed electronic component 20 includes a substrate 21, an electronic component 31, a resin 41, a plate-like member 11, and a bump electrode 12. The bump electrode 12 is fixed to one surface of the plate member 11, and the plate member 11 and the bump electrode 12 are integrated to form a plate member having the bump electrode. The electronic component 31 is fixed to the substrate 21 and sealed by the resin 41. A wiring pattern 22 is formed on the arrangement side of the electronic component 31 on the substrate 21. As shown in FIG. 1, the bump electrode 12 is fixed to one side of the plate member 11. Further, the bump electrode 12 penetrates the resin 41 and comes into contact with the wiring pattern 22.

Further, the plate member 11 is not particularly limited, and as described above, for example, may be a heat dissipation plate, Or shielding plate (shading plate), etc. For example, when a plurality of wafers (electronic components) are disposed in one IC (resin-sealed electronic component), electromagnetic shielding can be performed by a shield plate (shield plate) in consideration of the function of the respective wafers.

Further, the plate-like member having the protruding electrode may be a plate-shaped member corresponding to one substrate (one resin-sealed electronic component), but as shown in FIGS. 1(A) and (B), it may be a plurality of substrates (Multiple resin-sealed electronic parts) Corresponding plate members (matrix type). In the case of a matrix type, for example, a plurality of substrates each having an electronic component and a wiring pattern are fixed and resin-sealed together with the matrix-shaped plate-shaped member having the protruding electrodes. Thereafter, the matrix-shaped plate-like member having the protruding electrodes can be divided into regions corresponding to the respective substrates by cutting or the like. Further, for example, as described above, at least one of the protruding electrodes may be a plate-like protruding electrode. In this case, the range (or range of specific functions) required for one resin to seal the electronic component (one product unit) on the substrate surface can be divided (divided) by the above-mentioned plate-like projection electrode.

Further, the electronic component 31 may be in a form in which the electronic component has been sealed with a resin (that is, a resin-sealed electronic component). In this case, since the resin-sealed electronic component 20 is further resin-sealed to the resin-sealed electronic component 31, the electronic component is sealed with a plurality of resins.

In the cross-sectional view of Fig. 4, an example of a method of manufacturing the electronic component of Fig. 3 is schematically shown. As described above, this manufacturing method uses a manufacturing method of transfer molding.

As shown in Fig. 4, this manufacturing method can be carried out using a molding die 50 for general transfer molding. As shown, the forming die 50 is formed by an upper die 51 and a lower die 52. A mold cavity 56 for molding a resin is provided on the mold surface of the upper mold 51, and a substrate mounting portion 57 for supplying and mounting the substrate 21 on which the electronic component 31 and the wiring pattern 22 are provided is provided on the mold surface of the lower mold 52.

Further, a feeding chamber (hole) 54 for supplying a resin material is provided in the lower mold 52, and a plunger 53 for pressurizing the resin is fitted in the charging chamber.

The method of transfer molding using the apparatus of Fig. 4 is not particularly limited, and it can also be carried out in accordance with a general transfer molding method. In other words, first, a resin material such as a resin sheet is supplied into the charging chamber 54, and the substrate 21 is supplied and mounted to the substrate mounting portion 57, and then the upper and lower molds 51 and 52 are clamped. Next, the resin is heated in the charging chamber 54 to be melted, and the plunger 53 is moved up to pressurize the molten resin 41 in the charging chamber 54, thereby passing through the resin passage from the charging chamber 54 of the lower mold 52. (Tank, runner, gate) 55, molten resin is injected into the cavity 56 of the upper mold 51. At this time, the required resin pressure can be applied to the resin in the cavity 56 by the plunger 53.

After the necessary time required for curing, by opening the upper and lower molds 51, 52, the electronic component 31 and the like can be carried out in the cavity 56 in the package (resin molded body) corresponding to the shape of the cavity. Seal molding (refer to the resin-sealed electronic component 20 shown in Fig. 3).

In the present embodiment, the manufacturing method shown in FIG. 4 (manufacture of the resin-sealed electronic component 20 shown in FIG. 3) can be performed, for example, in the following manner. In other words, first, on the mold surface (substrate mounting portion) of the lower mold 52, the substrate 21 on which the electronic component 31 and the wiring pattern 22 are placed is placed at a position corresponding to the cavity of the upper mold 51, and on the substrate 21, The plate member 11 and the bump electrode 12 are disposed in the same positional relationship as the resin-sealed electronic component 20 (FIG. 3) of the finished product. At this time, as shown in FIG. 4, the side of the substrate 21 opposite to the arrangement side of the electronic component 31 is brought into contact with the lower mold 52, and the plate-like member with the protruding electrode is placed on the surface on the side of the arrangement side of the electronic component 31. (the plate member 11 and the bump electrode 12), the wiring pattern 22 is physically electrically connected to the front end portion of the bump electrode 12.

Further, the substrate 21, the electronic component 31, the plate member 11, and the bump electrode 12 can be downloaded and placed on the mold surface of the lower mold 52 in a state of being vertically inverted from FIG. In other words, the lower surface of the plate member 11 on the side opposite to the surface on which the projection electrode 12 is formed may be in contact with the lower mold 52, and the substrate 21 and the electronic component 31 may be disposed on the surface on which the projection electrode 12 is formed.

Next, as shown in FIG. 4, the upper mold 51 and the lower mold 52 are clamped. At this point, the upper mold The 51 is placed on the lower mold 52, and the substrate 21, the electronic component 31, the plate member 11, and the protruding electrode 12 are housed in the cavity of the upper mold, and the plate member 11 abuts against the top surface of the cavity.

In this state, further, as shown in Fig. 4, the resin 41 is injected into the cavity of the upper mold 51 through the resin passage 55 from the charging chamber 54 of the lower mold 52 by the plunger 53. Thereby, the electronic component 31 placed on the substrate 21 is resin-sealed together with the plate-like member 11 and the bump electrode 12. Thus, the resin-sealed electronic component 20 shown in FIG. 3 can be manufactured.

Further, when resin is injected into the cavity 56, the resin (molten resin) 41 can flow between the protruding electrodes 12 in the cavity 56, and can flow through the holes 12b of the protruding electrodes 12.

In the above description, a method of clamping the substrate and the plate-like member having the protruding electrodes on the mold surface of the lower mold and then performing the mold clamping will be described. However, the present invention is not limited thereto. For example, the substrate 21 may be supplied and mounted on the mold surface of the lower mold 52, and a plate-like member (plate member 11) having the protruding electrodes may be mounted on the top surface of the cavity of the upper mold 51, and the upper mold 51 and the lower mold may be attached. 52 is closed and the resin is injected into the cavity. At this time, as described above, the positions of the plate-like member 11 and the substrate 21 may be inverted upside down.

Moreover, in the case of the molding of the transfer molding (resin sealing), for example, the inside of the cavity may be set to a specific degree of vacuum to perform transfer molding. The method of setting the specific degree of vacuum is not particularly limited, and for example, a method based on general transfer molding can also be used.

The apparatus used for the above transfer molding is not particularly limited, and may be, for example, the same as a general transfer molding apparatus. Further, the specific conditions of the resin sealing step are not particularly limited, and may be, for example, the same as general transfer molding.

Further, in order to more reliably connect the bump electrode 12 and the wiring pattern 22, solder may be inserted between the bump electrode 12 and the wiring pattern 22 in advance. In this case, for example, after the resin sealing step, the solder may be melted by reflow or the like to bond the bump electrode 12 and the wiring pattern 22. The same applies to the following embodiments.

According to the present invention, the via electrode is formed in the above manner, so that it is not necessary to excavate the resin The holes form holes (grooves or holes). Therefore, for example, the effects of the following (1) to (5) can be obtained. However, the effects are exemplified and do not limit the present invention.

(1) Since it is not necessary to dig out the through hole forming hole in the resin, the thickness of the through hole forming hole cannot be accurately and appropriately formed on the wiring pattern of the substrate due to variations in thickness of the electronic component (package) sealed by the resin or the like. Wait.

(2) Since it is not necessary to dig out the through hole forming holes in the resin, the filler contained in the resin material does not remain on the wiring pattern of the substrate.

(3) Since it is not necessary to dig the through hole forming hole in the resin, the wiring pattern on the substrate on which the electronic component is mounted is not damaged.

(4) Since the through holes are not required to be formed in the resin, the manufacturing conditions of the resin-sealed electronic parts are not affected by the packing density of the resin material.

(5) According to the influence of the above (1) to (4), it is possible to easily and efficiently manufacture the resin-sealed electronic component, and the yield is good. Further, since the connection between the wiring pattern of the substrate and the bump electrode (via electrode) is good, the performance of the resin-sealed electronic component is improved, and the incidence of defective products is lowered.

[Embodiment 2]

Next, other embodiments of the present invention will be described with reference to Figs. 5 to 8 . In the present embodiment, an example of a method of manufacturing the above-described resin-sealed electronic component using compression molding will be described.

First, a compression molding device (manufacturing device for resin-sealed electronic components) is prepared. The configuration of a part of the compression molding apparatus, that is, a part of the molding die, is shown in the cross-sectional view of Fig. 5. As shown in the figure, the compression molding apparatus is mainly composed of the upper mold 101, the lower mold 111, and the intermediate mold (intermediate plate) 102. The lower mold 111 includes a lower mold cavity bottom surface member 111a and a lower mold top pressure plate (lower mold main body) 112 and 113. The lower mold top pressing plates (lower mold main bodies) 112 and 113 are frame-shaped lower mold cavity side members. More specifically, the lower mold top The pressure plate 112 is disposed to surround the periphery of the lower mold cavity bottom surface member 111a, and further, the lower mold top pressure plate 113 is disposed to surround the outer periphery of the lower mold top pressure plate 112. A gap (adsorption hole) 111c is formed between the lower mold cavity bottom surface member 111a and the lower mold top pressure plate 112. A gap (adsorption hole) 111d is formed between the lower mold top pressing plate 112 and the lower mold top pressing plate 113. As described below, the voids 111c and 111d are depressurized by a vacuum pump (not shown) to adsorb a release film or the like. The height of the upper surface of the lower mold top pressing plate 112 is higher than the height of the upper surfaces of the lower mold cavity bottom surface member 111a and the lower mold bottom pressing plate 113. Thereby, a mold cavity (recess) 111b surrounded by the upper surface of the lower mold cavity bottom surface member 111a and the inner peripheral surface of the lower mold top pressing plate 112 is formed. Further, a hole (through hole) 103 is formed in the upper mold 101. As described below, after the mold clamping, suction is performed from the hole 103 by a vacuum pump (not shown), whereby at least the inside of the lower mold cavity 111b can be decompressed. The intermediate mold (intermediate plate) 102 has a frame shape (annular shape) and is disposed so as to be located directly above the lower mold outer peripheral pressing plate 113. The release film 100 can be held and fixed between the lower surface of the intermediate mold 102 and the upper surface of the lower mold outer pressing plate 113. An O-ring 102a having elasticity is attached to a peripheral portion of the upper surface of the intermediate mold 102. Further, the compression molding apparatus has a roller 104 on the left and right sides of the drawing as shown in the drawing. Further, both ends of one long strip release film 100 are wound around the left and right rolls 104, respectively. The release film 100 can be fed from the right side of FIG. 5 to the left side or from the left side to the right side by the left and right rolls 104. Thereby, as described below, the plate-like member with the protruding electrode can be conveyed to the lower mold cavity position while being placed on the release film 100. That is, the roller 104 corresponds to the conveying member, that is, the plate-shaped member having the protruding electrode is conveyed to the cavity position of the molding die. Further, although not shown, the compression molding device (manufacturing device for resin-sealed electronic components) further includes a resin mounting member. The resin mounting member is for placing a resin on the protruding electrode forming surface of the plate-like member having the protruding electrode.

Next, as shown in FIG. 5, the substrate 21 to which the electronic component 31 is fixed on one side is fixed to the lower surface of the upper mold 101 by a clamper 101a. At this time, the electrons of the substrate 21 The part 31 is formed face down. Further, the substrate 21 and the electronic component 31 are the same as in the first embodiment, and the wiring pattern 22 is formed on the substrate 21 in the same manner as in the first embodiment. Furthermore, as shown in FIG. 5, the resin 41 is placed on the fixing surface of the bump electrode 12 of the plate-shaped member 11 by the resin mounting member (resin mounting step). Further, the plate member 11, the bump electrode 12, and the resin 41 are the same as those of the first embodiment. The form of the resin 41 is not particularly limited. In the resin mounting step, it is preferable that the resin 41 does not sprinkle from the fixing surface of the protruding electrode 12 of the plate member 11. For example, in the resin mounting step, the sheet-like resin 41 may be laminated (laminated) on the fixing surface of the bump electrode 12 of the plate member 11 and pressed. Further, as shown in FIG. 5, the plate-like member 11 on which the resin 41 is placed is placed on the release film 100. At this time, as shown in FIG. 5, the mounting surface of the resin 41 of the plate-like member 11 (the surface on which the projection electrode 12 is formed) faces upward (that is, the surface opposite to the surface on which the projection electrode 12 is formed is in contact with the mold release). The upper surface of the film 100). Further, although not shown, an adhesive (adhesion layer) may be present between the upper surface of the release film 100 and the plate member 11, and the plate member 11 may be fixed by the above adhesive (adhesive layer). The upper surface of the release film 100. As described above, in the case where the above-mentioned adhesive (adhesive layer) is present, for example, even if the hole 13 is formed in the plate-like member 11 as shown in Fig. 1(B), the resin 41 is hard to leak from the hole 13, and the like, which is preferable. Furthermore, as shown in FIG. 5, the resin 41 is conveyed together with the plate-shaped member 11, the protrusion electrode 12, and the release film 100 to the position of the lower mold cavity 111b by the said conveyance member.

Next, as shown by an arrow 114 in Fig. 6, a gap (void 111c) between the lower mold cavity bottom surface member 111a and the lower die outer peripheral pressing plate 112 is decompressed by a vacuum pump (not shown). Further, as shown by an arrow 115 in Fig. 6, a gap (void 111d) between the lower die outer peripheral pressing plate 112 and the lower die outer peripheral pressing plate 113 is reduced by a vacuum pump (not shown). Further, the intermediate mold 102 is lowered together with the O-ring 102a, and the release film 100 is held between the lower surface of the intermediate mold 102 and the upper surface of the lower mold outer peripheral pressing plate 113. Thereby, the release film 100 is fixed to the upper surface of the lower mold outer peripheral pressing plate 112 and the lower mold outer peripheral pressing plate 113. Moreover, the release film 100 can be covered in the lower mold cavity by the pressure reduction 114 in the lower mold cavity 111b. The face of 111b. Thereby, as shown in the figure, the resin 41 can be placed on the cavity surface of the lower mold cavity while being placed on the plate-like member 11.

Next, as shown in Figs. 7 to 8, the above resin sealing step is carried out. In addition, in FIG. 7, the illustration of the holder 101a is abbreviate|omitted for convenience of description.

That is, first, as shown in Fig. 7, the lower mold 111 (the lower mold cavity bottom surface member 111a and the lower mold outer peripheral pressing plates 112 and 113) are combined with the intermediate mold 102 and the O-ring 102a for blocking the outside air. rise. At this time, by bonding the mold surface of the upper mold 101 and the upper surface of the O-ring 102a, at least the inside of the lower mold cavity 111b is set to the external gas barrier state, so that the external gas can be formed in the upper middle mold (three molds). Partition space department. In this state, as indicated by an arrow 107, the inside of the lower mold cavity 111b (inside the external gas shutoff space portion) can be sucked by the vacuum pump (not shown) through the hole 103 of the upper mold 101, and the pressure can be reduced. Further, the lower mold 111 and the intermediate mold 102 are integrated and raised. At this time, the upper surface of the lower mold outer pressing plate 112 (the lower mold 111) and the surface of the substrate 21 can be joined via the release film 100.

Next, the lower mold cavity bottom surface member 111a is raised. At this time, the resin 41 is placed in a fluid state. Thereby, first, in the lower mold cavity 111b, the electronic component 31 can be immersed in the resin 41, and secondly, the resin 41 in the lower mold cavity 111b can be pressurized by the lower die cavity bottom surface member 111a. Therefore, in the lower mold cavity 111b, the electronic component 31 (including the bump electrode and the wiring pattern 22) mounted on the substrate 21 can be compressed in the molded package (resin molded body) 41 corresponding to the shape of the lower mold cavity 111b. Forming (resin forming). At this time, the plate-like member 11 is in a state of being mounted on the top surface side opposite to the substrate 21 of the molded package 41. Further, at this time, there may be a slight gap (void) between the substrate 21 and the release film 100.

In this state, as indicated by an arrow 107, at least the lower mold cavity 111b is sucked through a hole 103 of the upper die 101 by a vacuum pump (not shown), and the pressure is reduced. In this state, the resin 41 is compression-molded together with the plate member 11, the bump electrode 12, the electronic component 31, and the substrate 21, and the electronic component 31 is resin-sealed. At this time, the protruding electrode 12 is in contact with the wiring pattern 22 formed on the substrate 21. Thereby, the above-mentioned "resin sealing step" is performed, and resin-sealed electronic parts can be manufactured.

Further, as described above, when the electronic component 31 is immersed in the resin 41 in the lower mold cavity 111b, the resin 41 is in a fluid state. The fluid resin 41 may be, for example, a liquid resin (a thermosetting resin before curing) or a molten state in which a solid resin such as a pellet, a powder or a slurry is heated and melted. The heating of the resin 41 can be performed, for example, by heating of the lower mold cavity bottom surface member 111a or the like. Further, for example, when the resin 41 is a thermosetting resin, the resin 41 in the lower mold cavity 111b may be heated and pressurized to be thermally cured. Thereby, the electronic component 31 can be subjected to resin sealing molding (compression molding) in a resin molded body (package) corresponding to the shape of the lower mold cavity. In this manner, for example, the plate member 11 can be exposed in a state in which the upper surface of the resin molded body (package) is exposed (the surface opposite to the substrate).

After the compression molding (resin sealing), that is, after curing the resin 41, as shown in FIG. 8, the lower mold 111 (the lower mold cavity bottom surface member 111a, and the lower mold outer peripheral pressing plates 112 and 113) and the intermediate mold 102 are formed. And the O-ring 102a is lowered together. Thereby, the inside of the lower mold cavity 111b is opened, and the decompression state is released. At this time, the pressure reduction (vacuum) of the gap between the lower mold cavity bottom surface member 111a and the lower mold outer circumferential pressure plate 112 is released. As indicated by the arrow 116, air may also be supplied to the gap in the opposite direction. Thereby, as shown in FIG. 8, the release film 100 is separated from the upper surface of the lower mold cavity bottom surface member 111a. At this time, the pressure reduction (vacuum) of the gap between the lower die outer pressing plates 112 and 113 is not released. Further, the intermediate mold 102 continues to be in a state of holding the release film 100 together with the lower die outer peripheral pressing plate 113. Therefore, as shown in Fig. 8, the release film 100 continues to be adsorbed (fixed) to the upper surfaces of the lower die outer pressing plates 112 and 113. Further, the substrate 21 is continuously fixed to the lower surface (die surface) of the upper mold 101 by the holder 101a. Further, since the resin 41 and the plate member 11 are compression-molded together with the substrate 21 and the electronic component 31, the release film 100 is free from the substrate 21, the plate member 11, the bump electrode 12, and the lower mold 111. The electronic component 31 and the resin-sealed electronic component formed by the resin 41 are peeled off. Further, the release film 100 is fed (winded) in the right or left direction in the drawing by the roller 104.

In the present invention, for example, as shown in the present embodiment, when the resin sealing of the electronic component is performed, the entire protruding electrode 12 is present in the resin 41 (molten resin or liquid resin) in the lower mold cavity 111b. In this state, as described above, when the lower mold cavity bottom surface member 111a is moved upward, the front end portion of the bump electrode 12 is physically and abutted to the wiring pattern 22 of the substrate 21 in the resin 41. Thereby, for example, the resin does not enter between the front end of the bump electrode and the wiring pattern of the substrate, and the wiring of the front end of the bump electrode and the substrate is facilitated, as compared with the method of peeling the through hole forming hole after resin sealing the electronic component. The patterns are in contact. That is, it is advantageous to electrically connect the bump electrodes to the wiring patterns of the substrate. This point is advantageous in the case of the shielding performance, for example, in the case where the plate member is a shield plate. Further, as shown in FIGS. 2(A) to (D), for example, the bump electrode 12 can be reduced (the height becomes small). That is, even if the height of the protruding electrode 12 is slightly higher than the thickness of the resin 41, when the front end of the projection 12c abuts against the wiring pattern 22, the projection 12c elastically moves (drops) toward the gap on the side of the hole 12b, whereby the protruding electrode 12 can be reduced . Thereby, as described above, the height of the bump electrode 12 can be adjusted in accordance with the resin thickness (package thickness) of the resin-sealed electronic component.

Next, the description of Figs. 9 to 10 will be given. In FIGS. 5 to 8, the following method will be described: a "resin mounting step" of placing the resin 41 on the plate member 11 is performed, and then the plate member having the protruding electrodes is transferred to the cavity position. The method of "transfer step". However, as described above, the order of the resin mounting step and the transport step is not particularly limited. 9 to 10 show an example of a method of manufacturing the resin-sealed electronic component in which the resin mounting step is performed after the above-described transfer step. As shown in FIGS. 9 to 10, the compression molding apparatus (manufacturing apparatus for resin-sealed electronic components) using this method has a compression molding apparatus (manufacturing apparatus for resin-sealed electronic components) of FIGS. 5 to 8 in addition to the resin supply member 60. the same. However, in FIGS. 9 to 10, the holes of the upper mold 101 and the upper mold are omitted for simplification (through The hole 103, the holder 101a, the substrate 21, the wiring pattern 22, and the electronic component 31. As shown in FIGS. 9 to 10, the resin supply member 60 is composed of a resin supply portion 61 and a lower shutter 62. The resin supply unit 61 has a frame shape in which an opening is formed at the upper end and the lower end. The opening at the lower end of the resin supply portion (frame) 61 is closed by the lower shutter 62. Thereby, as shown in FIG. 9, the resin 41 can be accommodated in the space surrounded by the resin supply part (frame) 61 and the lower shutter 62. As shown in Fig. 9, in this state, the resin supply member 60 is placed directly above the lower mold cavity 111b (in the space between the lower die 111 and the upper die 101). Further, as shown in FIG. 10, the lower shutter 62 is opened to open the opening of the lower end of the resin supply portion (frame) 61, whereby the resin 41 can be dropped from the opening and supplied (mounted) into the lower mold cavity 111b. . Further, the resin 41 is a particulate resin in FIGS. 9 and 10, but is not particularly limited thereto. Further, in the resin mounting step before the steps shown in FIGS. 5 to 8, the resin supply member 60 composed of the resin supply portion 61 and the lower shutter 62 may be used in the same manner as in FIGS. 9 to 10.

In the method shown in Figs. 9 to 10, first, in the above-described transfer step, the steps similar to those in Figs. 5 to 6 are performed except that the resin 41 is not placed on the plate member 11. As a result, as shown in FIG. 9 , the plate-shaped member (the plate-shaped member 11 and the protruding electrode 12) having the protruding electrodes is in the same state as that of FIG. 6 except that the resin 41 is not placed (via the release film 100). ) is placed on the cavity surface of the lower mold cavity 111b.

Next, before the resin mounting step, the plate-like member with the protruding electrodes is heated in the lower mold cavity in the state shown in Fig. 9 (heating step). The above heating can be performed, for example, by heating of the lower mold cavity bottom surface member 111a or the like. In the heating step, it is preferred that the plate-like member having the protruding electrodes is sufficiently thermally expanded. That is, it is preferable that the plate-like member having the protruding electrode is not expanded by heating in the resin sealing step performed later. Thereby, in the resin sealing step described above, positional deviation between the bump electrode 12 and the wiring pattern 22 is less likely to occur, and alignment is easy.

Further, as shown in FIG. 10, the resin 41 is placed in the plate structure in the lower mold cavity 111b. The fixing surface of the bump electrode 12 of the member 11 (resin mounting step). In this step, for example, the lower shutter 62 is opened to open the opening of the lower end of the resin supply portion (frame) 61, whereby the resin 41 is dropped from the opening and supplied (placed) into the lower mold cavity 111b. Thereafter, the resin sealing step described above is carried out in the same manner as in Figs. 7 to 8. Further, the resin 41 is a particulate resin in Fig. 10, but is not limited thereto. For example, the resin 41 may be a thermoplastic resin (for example, a particulate resin or a powder resin), and the resin 41 is melted by the heat of the plate-like member having the protruding electrodes, and then cooled and solidified. Further, the resin 41 may be a thermosetting resin which is liquid before curing, and is cured by heat of a plate-like member having a protruding electrode.

Further, in the present embodiment, the configuration of the compression molding apparatus is not limited to the configuration shown in Figs. 5 to 10, and may be any configuration, for example, the same as or based on the configuration of a general compression molding apparatus. Specifically, the configuration of the above-described compression molding apparatus can be similar to, for example, Japanese Laid-Open Patent Publication No. 2013-187340, Japanese Patent Laid-Open No. Hei. No. 2005-225133, Japanese Patent Laid-Open No. 2010-069656, and Japanese Patent Publication No. 2007- The structures shown in the publication No. 125783 and Japanese Patent Laid-Open No. 2010-036542 are the same or based on them. The compression molding apparatus may be configured in the same manner as in Figs. 2 to 6 of the Japanese Patent Publication No. 2013-187340, for example, in place of the intermediate mold, and a film press plate is attached to the upper mold. ). The compression molding die method (method of manufacturing a resin-sealed electronic component) using such a compression molding apparatus can be carried out in the same manner as the method described in JP-A-2013-187340. Further, the resin supply member may be of any configuration other than the resin supply member 60 of FIGS. 9 and 10. For example, the resin supply member may be a resin material distribution member (including a resin material input member, a metering member, a funnel, a linear vibration feeder, or the like) described in JP-A-2010-036542. Alternatively, the resin supply member may be configured to include a storage portion, a metering portion, an input portion, a supply portion, a stopper, a tray, and a slit as in the resin supply mechanism described in JP-A-2007-125783. )Wait. Also, for example, regarding a mold that is not illustrated in FIGS. 5-10 The upper moving mechanism or the like may be the same as or based on the above-mentioned Japanese Patent Laid-Open Publication No. 2005-225133, and the like, and may be connected to the lower surface of the lower mold cavity bottom member, for example. Elastic member.

Further, in the present embodiment, a method of performing compression molding on the inside of the lower mold cavity under reduced pressure is used. However, the present invention is not limited thereto, and other compression molding (compression molding) may be used.

Further, as described above, the production method of the present invention includes the production method of the resin sealing step described above, but may include any other step as shown in the embodiment, for example.

As described above, in the present embodiment, the plate-like member having the protruding electrode is placed on the release film, and in this state, the plate-like member having the protruding electrode is placed in the cavity of the molding die. Transfer. Thereby, for example, the structure of the plate-shaped member and the conveying member can be easily simplified. Further, as described above, in the present embodiment, the resin is placed on the plate with the protruding electrodes in a state where the plate-like member having the protruding electrodes is placed on the release film. On the component. Thereby, for example, in FIGS. 5 to 10, contact between the resin 41 and the lower mold cavity bottom surface member 111a can be prevented, and the resin 41 can be prevented from entering the gap between the lower mold 111 and the lower mold outer peripheral pressing plate 112.

Further, in the present invention, the member (mechanism) for transporting the plate-like member having the protruding electrode (the state in which the resin is placed or not) is not limited to the configuration shown in Figs. 5 to 10, It may be a conveying member (transporting mechanism) having any other configuration. For example, in FIGS. 5 to 10, the shape of the release film is a long release film wound by a roll, but is not limited thereto. For example, the shape of the release film may be any shape such as a strip release film, a long release film, or a roll release film. For example, a release film of a long release film or a roll of a roll may be cut (pre-cut) to form a strip release film before being supplied to the production method of the present invention. When the pre-cut release film is used, the above-described transfer step (the step of transferring the plate-like member having the protruding electrode to the cavity position of the molding die) can also be used, for example, in Japanese Patent Laid-Open Publication No. 2013-187340 Figure 1 and its description are performed in the same manner.

[Example 3]

Next, still another embodiment of the present invention will be described. In the present embodiment, another example of a manufacturing method using compression molding is shown.

The step sectional views of Figs. 11 to 14 schematically show the manufacturing method of this embodiment. As shown in Figs. 11 to 14, this embodiment is different from the second embodiment (Figs. 5 to 10) in that the release film 100 is not used and the shape of the plate member 11 is different.

In the present embodiment, the peripheral portion of the plate-like member 11 is swelled, and the central portion is a resin accommodating portion. More specifically, as shown in FIGS. 11 to 14, the peripheral portion of the plate-like member 11 is swelled toward the fixing surface side of the protruding electrode 12 of the plate-like member 11, and the wall-shaped member 11b is formed. Thereby, the center part of the plate-shaped member 11 is formed in the resin accommodation part 11c. In other words, the wall member 11b is formed by bulging the peripheral portion of the plate member 11, and is formed into a shape of a tray mold (box type in which the upper surface is opened). Further, the central portion of the plate-like member 11 is formed as a resin accommodating portion (the recessed portion of the tray mold shape) surrounded by the main body (bottom portion) of the plate-shaped member 11 and the wall-shaped member (peripheral portion) 11b. Further, as shown in FIGS. 11 to 14, the projecting electrode 12 is fixed to the surface of the main body (bottom portion) of the plate-like member 11 on the side of the resin accommodating portion (recessed portion) 11c. Further, the wall member 11b is a part of the plate member 11 and is different from the protruding electrode 12. The wall member 11b can also function as a heat radiating member or a shield member for shielding electromagnetic waves, for example. In the case where the plate-like member 11 has the wall-shaped member 11b, the shape of the protruding electrode 12 is arbitrary, and is not particularly limited, but preferably, for example, at least one of the protruding electrodes 12 is the above-mentioned plate-shaped protruding electrode. In the present embodiment, since the resin accommodating portion 11c is provided, the contact between the resin 41 and the lower mold cavity bottom surface member can be prevented even if the release film is not used, and the resin 41 can be prevented from entering the lower mold outer peripheral pressing plate and In the gap between the bottom member of the lower mold cavity. Therefore, the cost can be reduced by omitting the release film, and the step of adhering or adsorbing the release film can be omitted, so that the manufacturing efficiency of the resin-sealed electronic component can be improved.

In this embodiment, as shown in FIGS. 11 to 14, the forming mold (upper mold and lower mold) is included. The compression molding apparatus can use the same compression molding apparatus as that of the second embodiment except for the roller and the intermediate mold which do not have a release film. Specifically, as shown in FIGS. 11 to 14, the above-described compression molding apparatus is a main component of the upper mold 1001 and the lower mold 1011. The lower mold 1011 includes a lower mold cavity bottom surface member 1011a and a lower mold top pressure plate (lower mold main body) 1012. The lower mold top pressing plate (lower mold main body) 1012 is a frame-shaped lower mold cavity side member. More specifically, the lower mold top pressing plate 1012 is disposed to surround the periphery of the lower mold cavity bottom surface member 1011a. There is a gap (adsorption hole) 1011c between the lower mold cavity bottom surface member 1011a and the lower mold top pressure plate 1012. As shown by an arrow 1014 in Figs. 12 and 13, the void 1011c is depressurized by a vacuum pump (not shown) to adsorb the plate-like member. Further, after the compression molding, as shown by an arrow 1016 in Fig. 14, air is supplied from the gap 1011c in the opposite direction, whereby the plate-like member can be detached. The height of the upper surface of the lower mold top plate 1012 is higher than the height of the upper surface of the lower mold cavity bottom member 1011a. Thereby, a mold cavity (concave portion) 1011b surrounded by the upper surface of the lower mold cavity bottom surface member 1011a and the inner peripheral surface of the lower mold top pressing plate 1012 is formed. Further, an opening (through hole) 1003 is formed in the upper mold 1001. Thereby, as shown by an arrow 1007 in Fig. 13, after the mold clamping is performed, the vacuum pump (not shown) is sucked from the hole 1003, whereby the inside of at least the lower mold cavity 1011b can be decompressed. An O-ring 1012a having elasticity is attached to a peripheral portion of the upper surface of the top plate 1012 of the lower mold. Further, although not shown, the compression molding device (manufacturing device for resin-sealed electronic components) further includes a resin mounting member and a conveying member. The resin mounting member is for placing a resin on a surface on which the projection electrode of the plate-like member having the protruding electrode is formed. The conveying member is configured to convey the plate-shaped member having the protruding electrode to a cavity position of the molding die.

As shown in FIGS. 11 to 14, the manufacturing method of the present embodiment does not use a release film, but conveys the plate-like member 11 on which the resin 41 is placed in the resin accommodating portion 11c to the lower mold cavity 1011b. Further, as shown by an arrow 1014 in Fig. 12, instead of adsorbing the release film to the lower die and the lower die outer pressing plate, the lower die outer pressing plate 1012 and the lower die are pressed by a vacuum pump (not shown). The gap 1011c between the mold cavity bottom surface members 1011a is decompressed, and the plate-like member 11 is attracted to the lower mold cavity 1011b (the upper surface of the lower mold cavity bottom surface member 1011a and the inner peripheral surface of the lower mold outer circumferential top plate 1012). Except for this, the manufacturing method of the present embodiment (Figs. 11 to 14) can be performed in the same manner as in Figs. 5 to 8 of the second embodiment.

More specifically, the steps (resin sealing step) shown in FIGS. 13 to 14 can be carried out, for example, as follows. That is, first, the lower mold 1011 is moved upward from the state of Fig. 12, and the mold surface of the upper mold 1001 is brought into contact with the upper end of the O-ring 1012a of the lower mold. At this time, a desired interval is maintained between the upper mold surface (the mold surface of the upper mold 1001) and the lower mold surface (the mold surface of the lower mold 1011). That is, before the upper mold 1001 and the lower mold 1011 are completely closed, an intermediate mold clamping is performed to maintain a desired interval therebetween. During the intermediate mold clamping, at least the upper and lower mold faces and the cavity space portion are in an external gas barrier state by the O-ring 1012a, whereby the external gas shutoff space portion can be formed. Further, at this time, as shown by an arrow 1007 in FIG. 13, the air in the outside air shutoff space portion is forcibly sucked from the hole 1003 of the upper mold and discharged, whereby the outside air partition space portion can be set to be specific. The degree of vacuum. Next, the upper mold surface (the mold surface of the upper mold 1001) and the lower mold surface (the mold surface of the lower mold 1011) are closed, thereby performing complete mold clamping. Further, the cavity bottom member 1011a is moved up. Further, at this time, the resin 41 is in a state of having fluidity. Thereby, as shown in FIG. 13, the bump electrode 12 and the wiring pattern 22 are bonded, the electronic component 31 is immersed in the resin 41, and the resin 41 in the lower mold cavity 1011b is further pressurized. Thereby, the electronic component 31 mounted on the substrate 11 can be compression-molded (sealed and formed) in the resin 41 (cured resin) of a desired shape. More specifically, in the lower mold cavity 1011b, the electronic component 31 (including the bump electrode and the wiring pattern 22) mounted on the substrate 21 is compression-molded (resin-molded) into a molded package corresponding to the shape of the lower mold cavity 1011b ( Inside the resin molded body 41. At this time, the plate-like member 11 is in a state of being mounted on the top surface side opposite to the substrate 21 of the molded package 41. Further, after the time required for the curing of the resin 41, as shown in Fig. 14, the upper and lower molds are opened. Specifically, the lower mold 1011 is made (below The mold cavity bottom member 1011a and the lower die top plate 1012) are lowered together with the O-ring 1012a. Thereby, the inside of the lower mold cavity 1011b is opened to release the pressure reduction. At this time, the decompression (vacuum) state of the gap between the lower mold cavity bottom surface member 1011a and the lower mold top pressing plate 1012 is released. As indicated by the arrow 1016, air may also be supplied to the gap in the opposite direction. Thereby, a resin-sealed electronic component (molded article) including the plate-like member 11 having the resin containing portion 11c, the substrate 21, the electronic component 31, the wiring pattern 22, and the bump electrode 12 can be obtained.

Further, the present embodiment is not limited thereto. For example, similarly to FIGS. 9 to 10 of the second embodiment, the resin mounting step may be performed after the above-described transfer step. In this case, as in the second embodiment, it is preferable to heat (heat step) the plate-like member having the protruding electrodes in the lower mold cavity before the resin mounting step. Further, in the heating step, for the same reason as in the second embodiment, it is preferable that the plate-like member having the protruding electrode is sufficiently thermally expanded.

Furthermore, in the present invention, the shape of the plate-like member is not limited to the shape of the embodiment and the examples 1 and 2, and may be any shape. For example, the shape of the above-mentioned plate-shaped member may be the same as that of the plate-shaped member exemplified in Patent Document 2 (Japanese Patent Laid-Open Publication No. 2013-187340), except that the protruding electrode is fixed to one surface. An example of a manufacturing method (variation) of changing the shape of the plate member is shown in Figs. 15 and 16 , respectively. As shown in Fig. 15, the plate-like member 11 has a fin 11a other than the surface on the opposite side to the fixed surface of the bump electrode 12 (the surface on the opposite side to the lower mold cavity bottom surface member 111a in Fig. 15). 5 to 8 (Example 2), the same compression molding apparatus as that of Figs. 5 to 8 can be used in the same manner as in the second embodiment. As shown in FIG. 16, the plate-like member 11 has a heat sink 11a except for a surface opposite to the fixed surface of the bump electrode 12 (the surface opposite to the lower mold cavity bottom surface member 1011a in Fig. 16). 11 to 14 (Example 3) are the same, and can be carried out in the same manner as in Example 3, using the same compression molding apparatus as that of Figs. Further, as shown in Fig. 16, in the compression molding apparatus of Fig. 16, a concave-convex shape which can be fitted to the uneven shape of the fins 11a is formed on the upper surface of the lower mold cavity bottom surface member 1011a. If such a shape is formed, the plate member 11 is in the lower mold The cavity is stable, and the upper surface of the lower mold cavity bottom member 1011a is not easily damaged by the heat sink. Further, as shown in FIG. 16, it is preferable that the fins 11a are formed in a shape in which a gap cannot be formed between the lower mold top pressing plate 1012 and the plate-like member 11. When such a shape is used, suction by decompression can be efficiently performed in the lower mold cavity (arrow 1014).

[Example 4]

Next, still another embodiment of the present invention will be described. In the present embodiment, another example is shown which is different from the manufacturing method using compression molding.

Fig. 17 is a cross-sectional view schematically showing the manufacturing method of the embodiment. As shown in FIG. 17, this manufacturing method is performed using the lower mold 121, the upper mold (mounter) 122, and the vacuum chamber 123. The upper surface of the lower mold 121 is a flat surface, and a substrate on which the resin seals the electronic component can be placed. The vacuum chamber 123 has a cylindrical shape corresponding to the shape of the resin-sealed electronic component, and can be placed on the substrate of the resin-sealed electronic component. The upper mold 122 can be fitted to the inner wall of the vacuum chamber 123.

In the manufacturing method of the present embodiment, first, a liquid resin (thermosetting resin) 41 is printed on a fixed surface of the electronic component 31 and the wiring pattern 22 on the substrate 21 on which the electronic component 31 and the wiring pattern 22 are fixed on one side. on. Then, the bump electrode 12 having the plate-like member having the bump electrode on the one surface of the plate member 11 is fixed to the wiring pattern 22 through the liquid resin 41. Thereby, the substrate 21, the electronic component 31, the resin 41, the plate-like member 11, and the bump electrode 12 are disposed in the same positional relationship as the resin-sealed electronic component 20 (FIG. 3) of the finished product. Further, for example, as shown in FIG. 17, the substrate 21, the electronic component 31, the resin 41, the plate-like member 11, and the bump electrode 12 are placed on the upper surface of the lower mold 121 so as to have the above-described positional relationship (arrangement). At this time, as shown in FIG. 17, the side of the substrate 21 opposite to the arrangement side of the electronic component 31 is brought into contact with the upper surface of the lower mold 121, and the plate with the protruding electrode is placed on the surface on the side where the electronic component 31 is disposed. The member (the plate member 11 and the protruding electrode 12).

Next, the vacuum chamber 123 is placed on the portion of the peripheral surface of the upper surface of the substrate 21 where the resin 41 is not disposed (mounted). Thereby, the periphery of the electronic component 31, the resin 41, the plate-shaped member 11, and the protrusion electrode 12 is surrounded by the vacuum chamber 123. Further, the upper mold 122 is lowered from the upper surface of the electronic component 31, the resin 41, the plate member 11, and the bump electrode 12, and fitted to the inner wall of the vacuum chamber 123. Thereby, the electronic component 31, the resin 41, and the bump electrode 12 are housed in the sealed internal space surrounded by the plate member 11, the vacuum chamber 123, and the upper mold 122. Further, the inside of the internal space is decompressed by a vacuum pump (not shown). Thereby, the electronic component 31, the resin 41, the plate-shaped member 11, and the bump electrode 12 are pressed by the upper mold 122. In this state, the liquid resin (thermosetting resin) 41 is heated and solidified, whereby the electronic component 31 is resin-sealed together with the plate-like member 11 and the bump electrode 12. Heating of the liquid resin 41 can be performed, for example, by heating of the lower mold 121. Thereby, the same resin-sealed electronic component as the resin-sealed electronic component 20 shown in FIG. 3 can be manufactured.

Further, in the present embodiment, for example, the pressure reduction by the vacuum chamber may be omitted. However, for example, when air or a gap is not allowed between the plate member and the resin, it is preferable to perform pressure reduction using a vacuum chamber. Further, when the decompression using the vacuum chamber is omitted, the pressing by the upper mold (mounter) may or may not be performed.

Moreover, the cross-sectional view of Fig. 18 schematically shows a modification of the manufacturing method of the present embodiment. In the manufacturing method of FIG. 18, a liquid resin (thermosetting resin) 41a is applied to the substrate 21, the electronic component 31, and the wiring pattern 22 fixed surface, and the plate member 11 and the protrusion are applied by coating instead of printing. The surface on the opposite side of the fixed surface of the electrode 12 (the surface on the opposite side to the upper mold 122 in Fig. 18) has the fins 11a, and is the same as the manufacturing method of Fig. 17. Further, in the manufacturing method of FIG. 17, a plate-like member having a protruding electrode having a heat sink may be used in the same manner as in FIG. 18, or vice versa, in the manufacturing method of FIG. In the same manner, a plate-like member having a protruding electrode without a heat sink is used. Moreover, for example, in FIG. 17 or 18, it is also possible to replace the printing or coating of the resin, by laminating the thin resin, and the tree. The resin 41 or 41a is placed on the fixed surface of the substrate 21 and the electronic component 31 and the wiring pattern 22 by spin coating or the like.

[Example 5]

Next, still another embodiment of the present invention will be described. In the present embodiment, still another example of the manufacturing method using compression molding is shown.

In the present embodiment, a method of manufacturing a resin-sealed electronic component using a pre-cut release film and a rectangular frame (frame) having a through hole (resin supply portion) and a compression molding device (electronic component) The resin sealing device will be described. In the present embodiment, the plate-like member having the protruding electrode is placed in a state where the resin material (particulate resin) is placed, and is conveyed to the lower mold cavity, and is supplied and attached to the lower mold cavity.

In the present embodiment, the frame body is placed on the pre-cut release film, and the plate-like member with the protruding electrode on which the particulate resin is placed is placed on the release film in the frame through-hole (resin supply portion). . Thereby, it is possible to prevent the above-mentioned particulate resin from being scattered from the above-mentioned plate-like member having the protruding electrodes. In the present embodiment, a case where the resin material is a particulate resin will be described, but any resin other than the particulate resin (for example, a powdery resin, a liquid resin, a plate resin, a sheet resin, or a film) The resin, the slurry resin, and the like can also be carried out in the same manner.

Hereinafter, the present embodiment will be described more specifically with reference to Figs. 19 to 22 .

First, a compression molding apparatus (manufacturing apparatus for resin-sealed electronic components) of the present embodiment will be described with reference to Fig. 19 . Fig. 19 is a schematic view showing the structure of a part of a molding die (metal mold) which is a part of the above-described compression molding apparatus. Moreover, Fig. 19 shows a mold opening state before the supply of the resin material to the molding die.

The compression molding apparatus of Fig. 19 is the same as the third embodiment (Figs. 11 to 14) in that the molding die includes the upper mold and the lower mold, but the upper mold outer gas partitioning member and the lower mold outer gas partitioning member are included. different. More specifically, it is as follows. That is, as shown in FIG. 19, the compression molding apparatus of FIG. 19, the above mold 2001, and the upper mold are aligned The mold 2011 is the main component. The upper mold 2001 is disposed in a state of being suspended from the upper mold substrate 2002. An upper mold outer gas shutoff member 2004 is disposed at an outer peripheral position of the upper mold 2001 on the upper mold substrate 2002. An O-ring 2004a for blocking the outside air is provided on the upper end surface of the upper mold outer gas shutoff member 2004 (the portion sandwiched by the upper mold substrate 2002 and the upper mold outer gas shutoff member 2004). Further, an O-ring 2004b for blocking the outside air is also provided on the lower end surface of the upper mold outer gas shutoff member 2004. Further, on the upper mold substrate 2002, a hole 2003 for forcibly sucking and discharging the air in the space portion in the mold is provided. A substrate mounting portion 2001a for supplying and mounting the substrate 21 on which the electronic component 31 is mounted with the mounting surface side of the electronic component 31 facing downward is provided on the mold surface (lower surface) of the upper mold 2001. (assembly). The substrate 21 can be attached to the board mounting portion 2001a by, for example, a holder (not shown). Further, similarly to the above-described respective embodiments, the wiring pattern 22 is provided on the mounting surface of the electronic component 31 of the substrate 21.

Further, the lower mold 2011 includes a lower mold cavity bottom member 2011a, a lower mold outer peripheral pressing plate 2012, and an elastic member 2012a. Further, in the lower mold 2011, a cavity (lower mold cavity) 2011b as a space for resin molding is included on the die surface thereof. The lower mold cavity bottom surface member 2011a is disposed below the lower mold cavity 2011b. The lower mold top pressing plate (the lower mold frame, the cavity side member) 2012 is disposed to surround the lower mold cavity bottom surface member 2011a. The height of the upper surface of the lower mold top pressing plate 2012 is higher than the height of the upper surface of the lower mold cavity bottom surface member 2011a. Thereby, the mold cavity (concave portion) 2011b surrounded by the upper surface of the lower mold cavity bottom surface member 2011a and the inner circumferential surface of the lower mold top pressing plate 2012 is formed. A gap (adsorption hole) 2011c is formed between the lower mold cavity bottom member 2011 and the lower die outer peripheral pressing plate 2012. As described below, the void 2011c is decompressed by a vacuum pump (not shown) to adsorb a release film or the like. Moreover, the lower mold 2011 and the lower mold top pressing plate 2012 are provided in a state of being placed on the lower mold substrate 2010. An elastic member 2012a for cushioning is disposed between the lower mold top pressing plate 2012 and the lower mold substrate 2010. Further, on the lower mold substrate 2010, the outer peripheral pressing plate of the mold The lower mold outer gas shutoff member 2013 is provided at the outer peripheral position of 2012. The O-ring 2013a for blocking the outside air is provided on the lower end surface of the lower mold outer gas shutoff member 2013 (the portion sandwiched by the lower mold substrate 2010 and the lower mold outer gas shutoff member 2013). The lower mold outer gas shutoff member 2013 is disposed directly under the upper mold outer gas shutoff member 2004 and the O-ring 2004b for blocking the outside air. By clamping the upper and lower molds by the above configuration, by joining the mold outer gas partitioning member 2004 including the O-rings 2004a and 2004b, and the mold outer gas partitioning member 2013 including the O-ring 2013a, At least the lower mold cavity can be placed in an external gas barrier state.

Next, a method of manufacturing the resin-sealed electronic component of the present embodiment using the compression molding apparatus will be described. That is, first, as shown in FIG. 19, the substrate 31 is mounted on the mold surface (substrate mounting portion 2001a) of the upper mold 2001 as described above. Further, as shown in FIG. 19, a rectangular frame (frame) 70 having a through hole is used, and the granular resin 41 is supplied into the lower mold cavity 2011b. More specifically, as shown in FIG. 19, the frame body 70 is placed on the release film 100 which has been previously cut (pre-cut) to a desired length. At this time, the pre-cut release film 100 can also be adsorbed and fixed to the lower surface of the frame 70. Then, the plate-like member having the protruding electrode on which the protruding electrode 12 is fixed to one surface of the plate member 11 is placed on the release film 100 from the opening (resin supply portion) on the upper side of the through hole of the frame 70. . At this time, the bump electrode 12 is placed in a state of being upward (opposite to the release film 100). Further, in the present embodiment, the plate-like member having the projecting electrode is the same as that of the second embodiment (Figs. 5 to 10), and does not have the wall member 11b and the resin accommodating portion (concave portion) 11c. Further, the particulate resin 41 is supplied (mounted) on the fixed surface of the bump electrode 12 of the plate-like member 11 in a flattened state. As a result, as shown in FIG. 19, the resin 41 is supplied into the space surrounded by the plate member 11 and the frame 70, and the space surrounded by the plate member 11 and the frame 70 can be placed on the release film 100. "Resin supply frame". Further, as shown in FIG. 19, the resin supply frame is conveyed and placed between the mold 2001 and the lower mold 2011 (position of the lower mold cavity 2011b) in the mold opening state.

Next, the resin supply frame is placed on the mold surface of the lower mold 2011. At this time, as shown in FIG. 20, the mold release film 100 is sandwiched between the frame body 70 and the lower mold outer peripheral pressing plate 2012, and the opening portion (lower mold surface) of the lower mold cavity 2011b and the lower side of the through hole of the frame body 70 are formed. The opening is matched. Further, as shown by an arrow 2014 in Fig. 20, the suction hole 2011c of the lower mold is sucked by a vacuum pump, and the pressure is reduced. Thereby, as shown in FIG. 20, the release film 100 is adsorbed and coated on the surface of the cavity of the lower mold cavity 2011b, and the granular resin 41 is supplied and mounted in the lower mold cavity 2011b. Further, as shown in FIG. 20, the resin 41 is melted by heating the lower mold 2011. Thereafter, the frame 70 is removed in a state where the release film 100 is adsorbed to the surface of the cavity of the lower mold cavity 2011b by the pressure reduction 2014.

Next, the upper and lower molds are clamped. First, as shown in FIG. 21, an intermediate mold clamping is performed in a state in which the substrate surface (the fixed surface of the electronic component 31 of the substrate 21) and the lower mold surface are maintained at a desired interval. That is, first, in a state where the frame 70 is removed from the structure of Fig. 20, the lower mold 2011 side is moved up. Thereby, as shown in FIG. 21, the upper mold outer gas shutoff member 2004 and the lower mold outer gas shutoff member 2013 are closed in a state in which the O-ring 2004b is sandwiched. Thereby, as shown in FIG. 21, the external gas partition space portion surrounded by the upper mold 2001, the lower mold 2011, the upper mold outer gas shutoff member 2004, and the lower mold outer gas shutoff member 2013 is formed. In this state, as shown by an arrow 2007 in FIG. 21, at least the external air shutoff space portion is sucked through a hole 2003 of the upper mold substrate 2002 by a vacuum pump (not shown), and is depressurized to be set to Specific vacuum.

Further, as shown in Fig. 22, the substrate surface and the lower mold surface are joined to perform complete mold clamping. That is, from the state of Fig. 21, the lower mold 2011 is further moved up. Thereby, as shown in FIG. 22, the upper surface of the lower mold top pressing plate 2012 is interposed (separated) by the release film 100 to abut against the substrate surface (fixed surface of the electronic component 31) supplied to and mounted on the substrate 21 of the upper mold 2001. . Further, the lower mold cavity bottom surface member 2011a is further moved upward together with the lower mold base substrate 2010 and the lower mold 2011 as the other members. At this time, the resin 41 is placed in a fluid state. With this, As shown in FIG. 22, the front end of the bump electrode 12 abuts (contacts) the wiring pattern 22 of the substrate 21, and in the lower mold cavity 2011b, the electronic component 31 is immersed in the resin 41, and further, the resin 41 is pressurized. . At this time, as shown in FIG. 22, the elastic member 2012a and the O-rings 2004a, 2004b, and 2013a contract and function as a cushion. Thereby, the resin 41 is pressurized as described above to achieve compression molding. Moreover, the resin 41 is cured. Thereby, between the fixing surface of the protruding electrode 12 of the plate-like member 11 and the surface formed by the wiring pattern 22 of the substrate 21, the electronic component 31 is sealed by the resin 41, and the protruding electrode 12 can be brought into contact with the wiring pattern 22 (resin Sealing step). After the time required for the resin 41 to be cured, the upper and lower molds were opened in the same order as in Example 2 or 3 (Fig. 8 or 14). Thereby, in the lower mold cavity 2011b, a molded article (resin-sealed electronic component) composed of the substrate 21, the electronic component 31, the wiring pattern 22, the resin 41, the bump electrode 12, and the plate-shaped member 11 can be obtained.

Further, in the present embodiment, the configuration of the compression molding device (manufacturing device for resin-sealed electronic components) is not limited to the configuration of Figs. 19 to 22, and may be the same as or the same as that of a general compression molding device. Benchmark. In particular, Japanese Patent Laid-Open No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The structures described in Japanese Laid-Open Patent Publication No. 2010-036542 or the like are the same or based on them.

The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selected as needed within the scope of the gist of the present invention.

For example, the shape of the above-mentioned protruding electrode of the plate-like member having the protruding electrode is not limited to the shape shown in Fig. 2, and may be any shape. As an example, as described above, at least a part of the protruding electrodes may have a plate shape. Further, on the substrate surface, the desired range corresponding to one resin-sealed electronic component (one product unit) may be defined by the above-described plate-shaped electrode division.

The present invention may be embodied in other forms without departing from the spirit and scope of the invention. The embodiments disclosed in the present application are to be understood as illustrative and not restrictive. The scope of the present invention is defined by the scope of the appended claims, and is not limited to the above description. All changes that come within the meaning and range of equivalence of the scope of the invention are included in the invention.

Claims (38)

A method for producing a resin-sealed electronic component, which is characterized in that it is a resin-sealed electronic component manufacturing method for resin sealing of an electronic component; the resin-sealed electronic component manufactured includes a substrate, an electronic component, a resin molded body, and a plate shape a resin-sealed electronic component in which a wiring pattern is formed on the substrate; and the manufacturing method includes: mounting a substrate on one of an upper film or a lower film having a molding die of the upper film and the lower film a step of attaching the plate member and the protruding electrode to the other of the upper or lower film forming mold of the forming die; a step of clamping the forming die; and performing the electronic component by the resin molded body a sealing resin sealing step; and in the step of laminating the molding die, the protruding electrode fixing surface in the plate-like member having the protruding electrode on the one surface of the plate member Between the wiring pattern forming surfaces of the substrate, the protruding electrodes are brought into contact with the wiring pattern; Step to the mold via the state of the laminated film is formed between the surface of the substrate and the wiring pattern of the bump in the fixed surface, by the above-described resin molded article for sealing the electronic parts. A method of producing a resin-sealed electronic component according to claim 1, wherein at least one of said protruding electrodes has a columnar protruding electrode having a columnar shape. A method of manufacturing a resin-sealed electronic component according to claim 1, wherein said protruding electrode At least one of the plate-like projection electrodes, wherein the plurality of electronic components are plural, and in the resin sealing step, the substrate is divided into a plurality of regions by the plate-like protruding electrodes, and the electrons are formed in each of the regions The parts are sealed with a resin. A method of manufacturing a resin-sealed electronic component according to claim 1, wherein the plate-like member is a heat dissipation plate or a shield plate. The method of producing a resin-sealed electronic component according to claim 1, wherein in the resin sealing step, the electronic component is resin-sealed by transfer molding. The method of producing a resin-sealed electronic component according to claim 1, wherein in the resin sealing step, the electronic component is resin-sealed by compression molding. The method for producing a resin-sealed electronic component according to claim 6, further comprising: a resin mounting step of placing a resin material on the protruding electrode fixing surface of the plate-like member having the protruding electrode; and a transfer step And conveying the plate-like member having the protruding electrode to a cavity of the molding die; and immersing the electronic component in a fluid resin produced by the resin material in the cavity The resinous resin is cured by curing the fluid resin, and the plate-shaped member having the protruding electrodes and the electronic component are resin-sealed to perform the resin sealing step. The method of manufacturing a resin-sealed electronic component according to claim 7, wherein in the transferring step, the resin material is placed on the plate-like member having the protruding electrode, and the protruding electrode is provided The plate-like members are collectively conveyed to the position of the cavity of the forming mold. A method of manufacturing a resin-sealed electronic component according to claim 7, wherein the above-mentioned plate member In the resin mounting step, the resin material is placed in the resin accommodating portion, and the resin sealing step is performed in a state where the resin material is placed in the resin accommodating portion. The method of manufacturing a resin-sealed electronic component according to claim 7, wherein in the resin sealing step, the substrate on which the electronic component is disposed on the wiring pattern forming surface is placed on the substrate with the wiring pattern forming surface facing upward On the mounting table, the resin material is pressed while the resin material is placed on the wiring pattern forming surface. The method of manufacturing a resin-sealed electronic component according to claim 6, wherein the plate-like member is a heat dissipation plate, and the heat dissipation plate has a heat sink on a surface opposite to a surface on which the protruding electrode is fixed. A method of producing a resin-sealed electronic component according to claim 1, wherein the resin-based thermoplastic resin or thermosetting resin is used to produce the resin molded body. The method for producing a resin-sealed electronic component according to claim 1, wherein the resin for producing the resin molded body is selected from the group consisting of a granular resin, a powdered resin, a liquid resin, a plate resin, a sheet resin, and a film resin. And at least one of the group consisting of a paste resin. The method for producing a resin-sealed electronic component according to claim 1, wherein the resin for producing the resin molded body is at least one selected from the group consisting of a transparent resin, a translucent resin, and an opaque resin. Method for manufacturing resin-sealed electronic parts, characterized in that it is tied to electronic zero A method of manufacturing a resin-sealed electronic component by resin sealing; the resin-sealed electronic component manufactured by the invention comprises a substrate, an electronic component, a resin molded body, a plate-shaped member, and a bump electrode, and a resin seal having a wiring pattern formed on the substrate The electronic component has a resin sealing step of sealing the electronic component by the resin molded body, and in the resin sealing step, the protruding electrode is fixed to one surface of the plate member The electronic component is sealed by the resin molded body between the protruding electrode fixing surface of the electrode plate member and the wiring pattern forming surface of the substrate, and the protruding electrode is in contact with the wiring pattern; wherein the protrusion At least one of the electrodes is a protruding electrode having a through hole, and the through hole of the protruding electrode having the through hole is a through hole penetrating in a direction parallel to a plate surface of the plate member, and the through hole is continuous The protruding electrode of the hole is opposite to one end fixed to the above-mentioned plate member The end having a protrusion toward the direction perpendicular to the plate surface of the plate member and the projection. A method for producing a resin-sealed electronic component, which is characterized in that it is a resin-sealed electronic component manufacturing method for resin sealing of an electronic component; the resin-sealed electronic component manufactured includes a substrate, an electronic component, a resin molded body, and a plate shape a resin-sealed electronic component in which a wiring pattern is formed on the substrate; and the manufacturing method includes a resin sealing step of sealing the electronic component by the resin molded body, and in the resin sealing step, Fixed on one side of the above-mentioned plate member Between the protruding electrode fixing surface of the protruding member having the protruding electrode and the wiring pattern forming surface of the substrate, the electronic component is sealed by the resin molded body, and the protruding electrode is brought into contact with The wiring pattern; wherein at least one of the protruding electrodes is a plate-shaped protruding electrode, and the plurality of electronic components are plural. In the resin sealing step, the substrate is divided into a plurality of regions by the plate-shaped protruding electrode, and The electronic component is resin-sealed in each of the regions; the plate-shaped protruding electrode has a through hole and a protrusion, and the through hole penetrates the plate-shaped protruding electrode in a direction parallel to a plate surface of the plate-shaped member, and the protruding portion is The plate-like projection electrode protrudes in a direction perpendicular to a plate surface of the plate-like member at an end opposite to one end of the plate-like member. A method for producing a resin-sealed electronic component, which is characterized in that it is a resin-sealed electronic component manufacturing method for resin sealing of an electronic component; the resin-sealed electronic component manufactured includes a substrate, an electronic component, a resin molded body, and a plate shape a member and a bump electrode, and a resin-sealed electronic component in which a wiring pattern is formed on the substrate; and the manufacturing method includes a resin sealing step of sealing the electronic component by the resin molded body, and in the resin sealing step, The surface of the plate-shaped member is fixed between the protruding electrode fixing surface of the plate-shaped member having the protruding electrode and the wiring pattern forming surface of the substrate, and the electronic component is used by the resin molded body Sealing and contacting the protruding electrode to the wiring pattern In the resin sealing step, the electronic component is resin-sealed by compression molding. The manufacturing method further includes a resin mounting step of placing the resin material on the plate-like member having the protruding electrode. And the transporting step of transporting the plate-shaped member having the protruding electrode to a cavity of the molding die; and immersing the electronic component in the cavity In the state of the fluid resin produced by the resin material, the fluid resin is cured to produce a resin molded body, and the plate-shaped member having the protruding electrode and the electronic component are collectively compression-molded to perform the resin. a sealing step in which the plate-shaped member having the protruding electrode is conveyed to a position of a cavity of the molding die without being placed on the resin material, and the manufacturing method further includes a heating step. The heating step is performed before the resin mounting step to heat the plate-like member with the protruding electrode in the cavity At the above state is heated with the plate-like member projecting electrodes, in the resin in the cavity for placing step. A method for producing a resin-sealed electronic component, which is characterized in that it is a resin-sealed electronic component manufacturing method for resin sealing of an electronic component; the resin-sealed electronic component manufactured includes a substrate, an electronic component, a resin molded body, and a plate shape a resin-sealed electronic component in which a wiring pattern is formed on the substrate; and the manufacturing method includes a resin sealing step of sealing the electronic component by the resin molded body, and in the resin sealing step, Fixed on one side of the above-mentioned plate member Between the protruding electrode fixing surface of the protruding member having the protruding electrode and the wiring pattern forming surface of the substrate, the electronic component is sealed by the resin molded body, and the protruding electrode is brought into contact with In the above-described wiring pattern, the electronic component is resin-sealed by compression molding in the resin sealing step, and the manufacturing method further includes transporting the plate-shaped member having the protruding electrode to a position of a cavity of the molding die. In the step of transferring, the plate-like member having the protruding electrode is placed on the release film with the surface on which the protruding electrode is fixed facing upward, and the plate-shaped electrode having the protruding electrode is formed. The member is transferred into the cavity of the above-mentioned forming mold. The method of manufacturing a resin-sealed electronic component according to claim 18, wherein in the transferring step, the frame body and the plate-like member having the protruding electrode are placed on the release film together, and the protruding electrode is provided The plate-shaped member having the protruding electrodes is conveyed into the cavity of the molding die in a state in which the plate-shaped member is surrounded by the frame. The method of manufacturing a resin-sealed electronic component according to claim 19, wherein in the resin mounting step, the frame body and the plate-like member having the protruding electrode are placed on the release film together, and the In a state in which the plate-like member of the protruding electrode is surrounded by the frame, a resin material is supplied into a space surrounded by the plate-shaped member having the protruding electrode and the frame, whereby the resin material is placed on the protrusion. Electrode fixed surface. A method of manufacturing a resin-sealed electronic component according to claim 20, wherein the moving step is The above resin mounting step is carried out before the step. The method of producing a resin-sealed electronic component according to claim 18, wherein the surface of the plate-like member having the protruding electrode and the surface on which the one surface of the protruding electrode is fixed is fixed to the release film by an adhesive. . A plate-shaped member having a protruding electrode, which is used in a plate-like member having a protruding electrode in the manufacturing method of claim 1, wherein the protruding electrode is fixed to one surface of the plate-shaped member. A plate-like member having a projecting electrode according to claim 23, wherein at least one of said protruding electrodes is said plate-like projecting electrode of claim 3. A plate-like member having a protruding electrode according to claim 23, wherein at least one of said protruding electrodes is a columnar protruding electrode of claim 2. A plate-like member having a projecting electrode according to claim 23, wherein the plate-like member has a resin receiving portion. The plate-like member having the projecting electrode of claim 26, wherein a peripheral portion of the plate-like member is swelled toward the protruding electrode fixing surface side of the plate-shaped member, whereby the resin receiving portion is formed at a central portion of the plate-shaped member . A plate-like member having a projecting electrode according to claim 23, wherein one of the plate-like members is partially pressed, and one of the stamped portions is bent in a direction perpendicular to a surface direction of the plate-like member to form the protruding electrode. A plate-shaped member having a protruding electrode, wherein the plate-shaped member having a protruding electrode is used in the manufacturing method of claim 16, and the protruding electrode is fixed to one side of the plate-shaped member; At least one of the protruding electrodes is the plate-like protruding electrode of claim 16, and the plate-shaped protruding electrode is a plate-shaped protruding electrode having the through hole and the protrusion. A plate-shaped member having a protruding electrode, which is used for a plate-like member having a protruding electrode in the manufacturing method of claim 15, wherein the protruding electrode is fixed to one side of the plate-shaped member; At least one of the bump electrodes is the bump electrode having the through hole described in claim 15. A method of producing a plate-like member having a protruding electrode according to claim 23, comprising the step of forming said protruding electrode by etching said plate-shaped member formed of a metal plate. A method of producing a plate-like member having a protruding electrode according to claim 23, comprising the step of joining said plate-like member formed of a metal plate to said protruding electrode. A method of producing a plate-like member having a projecting electrode according to claim 23, comprising the step of simultaneously molding said plate-like member and said projecting electrode by electroforming. A method of producing a plate-like member having a protruding electrode according to claim 23, comprising the step of simultaneously molding said plate-like member and said protruding electrode by a conductive resin. A method of producing a plate-like member having a protruding electrode according to claim 23, comprising the step of bonding said protruding electrode to said plate-like member formed of a conductive resin. A method of producing a plate-like member having a projecting electrode according to claim 23, wherein said plate-like member is formed of a resin plate, and said manufacturing method comprises the step of adding a conductive coating film to said plate-like member and said protruding electrode . A method of manufacturing a plate-like member having a protruding electrode according to claim 23, wherein said plate-like member is formed of a metal plate, and said manufacturing method comprises: stamping and bending a portion of said metal plate to form said protruding electrode step. A resin-sealed electronic component characterized in that it is a resin for electronic parts The sealed resin-sealed electronic component includes a substrate, an electronic component, a resin molded body, and a plate-like member having a protruding electrode according to claim 23, wherein the electronic component is disposed on the substrate The resin molded body is sealed, and a wiring pattern is formed on the electronic component arrangement side of the substrate, and the protruding electrode is in contact with the wiring pattern through the resin molded body.