TWI618155B - Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member - Google Patents
Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member Download PDFInfo
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- TWI618155B TWI618155B TW103140295A TW103140295A TWI618155B TW I618155 B TWI618155 B TW I618155B TW 103140295 A TW103140295 A TW 103140295A TW 103140295 A TW103140295 A TW 103140295A TW I618155 B TWI618155 B TW I618155B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 133
- 229920005989 resin Polymers 0.000 claims abstract description 414
- 239000011347 resin Substances 0.000 claims abstract description 414
- 239000000758 substrate Substances 0.000 claims abstract description 135
- 238000007789 sealing Methods 0.000 claims abstract description 66
- 238000000748 compression moulding Methods 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 40
- 230000002093 peripheral effect Effects 0.000 claims description 32
- 238000000465 moulding Methods 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000012546 transfer Methods 0.000 claims description 14
- 238000001721 transfer moulding Methods 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 12
- 239000012530 fluid Substances 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 5
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- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
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- 238000005192 partition Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
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- 238000007429 general method Methods 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
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- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
Abstract
本發明提供一種能夠簡便且有效地製造具有通孔電極(突起電極)及板狀構件兩者之樹脂密封電子零件之樹脂密封電子零件之製造方法。 The present invention provides a method of manufacturing a resin-sealed electronic component capable of easily and efficiently producing a resin-sealed electronic component having both a via electrode (protrusion electrode) and a plate-like member.
本發明係對電子零件進行樹脂密封之樹脂密封電子零件之製造方法，其特徵在於，所要製造之上述樹脂密封電子零件係包含基板、電子零件、樹脂、板狀構件及突起電極，且於基板上形成有佈線圖案之電子零件，上述製造方法具有利用樹脂對電子零件進行密封之樹脂密封步驟，且於上述樹脂密封步驟中，係於在板狀構件之單面固定有突起電極之帶有突起電極之板狀構件中之突起電極固定面與基板之佈線圖案形成面之間，利用樹脂對電子零件進行密封，且使突起電極接觸於佈線圖案。 The present invention relates to a method of manufacturing a resin-sealed electronic component in which an electronic component is resin-sealed, characterized in that the resin-sealed electronic component to be manufactured includes a substrate, an electronic component, a resin, a plate-shaped member, and a bump electrode, and is on the substrate. An electronic component in which a wiring pattern is formed, the manufacturing method having a resin sealing step of sealing an electronic component with a resin, and in the resin sealing step, a protruding electrode having a protruding electrode fixed to one surface of the plate member Between the bump electrode fixing surface of the plate member and the wiring pattern forming surface of the substrate, the electronic component is sealed with a resin, and the bump electrode is brought into contact with the wiring pattern.
Description
相關申請案之交互參照 Cross-references to related applications
本申請主張以2014年4月24日申請之日本申請特願2014-090753為基礎之優先權，且將其公開之所有內容併入本文。 The priority of the Japanese Patent Application No. 2014-090753, filed on Apr. 24, 2014, is hereby incorporated by reference.
本發明係關於一種樹脂密封電子零件之製造方法、帶有突起電極之板狀構件、樹脂密封電子零件、及帶有突起電極之板狀構件之製造方法。 The present invention relates to a method of manufacturing a resin-sealed electronic component, a plate-like member having a protruding electrode, a resin-sealed electronic component, and a method of manufacturing a plate-like member having a protruding electrode.
於多數情形時，IC、半導體晶片等電子零件係作為經樹脂密封之樹脂密封電子零件而成形並被使用。 In many cases, electronic components such as ICs and semiconductor wafers are formed and sealed as resin-sealed resin-sealed electronic components.
上述樹脂密封電子零件有時係於樹脂中埋入通孔電極而形成。該通孔電極能夠以如下方式形成，例如於經樹脂密封之電子零件(封裝)之上述樹脂，自封裝頂面形成通孔形成用孔或槽(以下稱為「通孔形成孔」)，並以上述通孔電極形成材料(例如電鍍材、屏蔽材等)填埋上述通孔形成孔。上述通孔形成孔例如可藉由自封裝頂面向上述樹脂照射雷射光而形成。又，作為用於形成通孔電極之其他方法，提出有如下 方法：將具有突起之金屬構造體之上述突起與半導體晶片一併進行樹脂密封後，去除上述金屬構造體之上述突起以外之部分(日本專利特開2012-015216號公報)。該情形時，於樹脂密封電子零件中，僅上述金屬構造體之上述突起以被樹脂密封之狀態殘留，其成為通孔電極。 The resin-sealed electronic component may be formed by embedding a via electrode in a resin. The via electrode can be formed, for example, in the resin of the resin-sealed electronic component (package), and a through hole forming hole or groove (hereinafter referred to as a "via hole forming hole") is formed from the top surface of the package, and The through hole forming hole is filled in the through hole electrode forming material (for example, a plating material, a shield material, or the like). The through hole forming hole can be formed, for example, by irradiating laser light from the package top toward the resin. Further, as another method for forming the via electrode, the following is proposed In the method, the protrusion of the metal structure having the protrusion is resin-sealed together with the semiconductor wafer, and the portion other than the protrusion of the metal structure is removed (Japanese Patent Laid-Open Publication No. 2012-015216). In this case, in the resin-sealed electronic component, only the protrusion of the metal structure remains in a state of being sealed by a resin, and this becomes a via electrode.
另一方面，樹脂密封電子零件有時係與用於使上述電子零件發出之熱量散開而進行冷卻之散熱板(散熱器)、或用於屏蔽上述電子零件發出之電磁波之屏蔽板(遮蔽板)等板狀構件一併成形(例如，日本專利特開2013-187340號公報及日本專利特開2007-287937號公報)。 On the other hand, the resin-sealed electronic component may be a heat sink (heat sink) for cooling the heat generated by the electronic component, or a shield (shield) for shielding electromagnetic waves emitted from the electronic component. The plate-like members are formed in one piece (for example, Japanese Patent Laid-Open Publication No. 2013-187340 and Japanese Patent Laid-Open No. 2007-287937).
於樹脂形成通孔形成孔之方法中，例如存在下述(1)~(5)等問題。 In the method of forming the via hole by the resin, there are problems such as the following (1) to (5).
(1)因被樹脂密封之電子零件(封裝)之厚度偏差等，有於基板之佈線圖案上無法準確且適當地形成通孔形成孔之深度等之虞。 (1) The thickness of the electronic component (package) sealed by the resin or the like may be such that the depth of the via hole forming hole cannot be accurately and appropriately formed on the wiring pattern of the substrate.
(2)樹脂材料所包含之填充物容易殘留於基板之佈線圖案上。 (2) The filler contained in the resin material is likely to remain on the wiring pattern of the substrate.
(3)根據於上述樹脂挖出通孔形成孔之條件，有對搭載有電子零件之基板上之佈線圖案造成損傷之虞。 (3) The wiring pattern on the substrate on which the electronic component is mounted is damaged by the condition that the resin is formed by the hole forming hole.
(4)與上述(3)相關地，若樹脂材料之填充物密度不同，則需要改變用於在上述樹脂挖出通孔形成孔之雷射加工條件。即，對通孔形成孔之形成條件之控制繁雜。 (4) In the case of the above (3), if the filler density of the resin material is different, it is necessary to change the laser processing conditions for the hole for forming the through hole in the resin. That is, the control of the formation conditions of the through hole forming holes is complicated.
(5)受到上述(1)~(4)之影響，樹脂密封電子零件製造之良率難以提高。 (5) Under the influence of (1) to (4) above, the yield of resin-sealed electronic parts is difficult to increase.
另一方面，於日本專利特開2012-015216號公報之方法中，對金屬構造體之上述突起進行樹脂密封後，需要去除上述金屬構造體之上述突起以外部分之步驟。因此，樹脂密封電子零件之製造步驟變得繁雜，且會導致材料浪費。 On the other hand, in the method of JP-A-2012-015216, after the protrusion of the metal structure is resin-sealed, it is necessary to remove the portion of the metal structure other than the protrusion. Therefore, the manufacturing steps of the resin-sealed electronic component become complicated and result in waste of materials.
進而，於上述任一方法中，於形成通孔電極之後，必須藉由電鍍 等而形成板狀構件，因此導致步驟繁雜。 Further, in any of the above methods, after forming the via electrode, it is necessary to perform plating The plate-like members are formed, and the steps are complicated.
又，於日本專利特開2013-187340號公報及日本專利特開2007-287937號公報中，記載有具有板狀構件之樹脂密封電子零件及其製造方法，但並未記載於形成通孔電極時能夠用於解決上述各個方法之問題之方法。 Further, Japanese Laid-Open Patent Publication No. 2013-187340 and Japanese Patent Laid-Open Publication No. H2007-287937 disclose a resin-sealed electronic component having a plate-shaped member and a method of manufacturing the same, but are not described in the case of forming a via electrode. A method that can be used to solve the problems of the above various methods.
如上所述，能夠簡便且有效地製造具有通孔電極及板狀構件兩者之樹脂密封電子零件之技術還不存在。 As described above, the technique of easily and efficiently manufacturing a resin-sealed electronic component having both a via electrode and a plate member does not exist.
因此，本發明之目的在於提供一種能夠簡便且有效地製造具有通孔電極及板狀構件兩者之樹脂密封電子零件之樹脂密封電子零件之製造方法、帶有突起電極之板狀構件、樹脂密封電子零件、及帶有突起電極之板狀構件之製造方法。 Accordingly, an object of the present invention is to provide a method of manufacturing a resin-sealed electronic component capable of easily and efficiently manufacturing a resin-sealed electronic component having both a through-hole electrode and a plate-like member, a plate-like member having a protruding electrode, and a resin seal A method of manufacturing an electronic component and a plate member having a protruding electrode.
為了達成上述目的，基於本發明之樹脂密封電子零件之製造方法(以下，有時僅稱為「本發明之製造方法」)之特徵在於，其係對電子零件進行樹脂密封之樹脂密封電子零件之製造方法，所要製造之上述樹脂密封電子零件係包含基板、電子零件、樹脂、板狀構件、及突起電極，且於上述基板上形成有佈線圖案之樹脂密封電子零件，上述製造方法具有藉由上述樹脂對上述電子零件進行密封之樹脂密封步驟，於上述樹脂密封步驟中，係於上述板狀構件之單面固定有上述突起電極之帶有突起電極之板狀構件中之、上述突起電極固定面與上述基板之上述佈線圖案形成面之間，藉由上述樹脂對上述電子零件進行密封，且使上述突起電極與上述佈線圖案接觸。 In order to achieve the above object, a method for producing a resin-sealed electronic component according to the present invention (hereinafter sometimes referred to simply as "the manufacturing method of the present invention") is characterized in that it is a resin-sealed electronic component that is resin-sealed to an electronic component. In the manufacturing method, the resin-sealed electronic component to be manufactured includes a substrate, an electronic component, a resin, a plate-shaped member, and a bump electrode, and a resin-sealed electronic component in which a wiring pattern is formed on the substrate, wherein the manufacturing method has the above-described manufacturing method a resin sealing step of sealing the electronic component by the resin, in the resin sealing step, the protruding electrode fixing surface of the plate-shaped member having the protruding electrode on which the protruding electrode is fixed on one surface of the plate-shaped member The electronic component is sealed by the resin between the wiring pattern forming surface of the substrate, and the bump electrode is brought into contact with the wiring pattern.
本發明之帶有突起電極之板狀構件之特徵在於，其係使用於上述本發明之製造方法之帶有突起電極之板狀構件，且上述突起電極係固 定於上述板狀構件之單面。 The plate-like member with a protruding electrode of the present invention is characterized in that it is used in the above-described manufacturing method of the present invention, and has a plate-like member with a protruding electrode, and the above-mentioned protruding electrode is fixed It is set on one side of the above plate-shaped member.
本發明之樹脂密封電子零件之特徵在於，其係對電子零件進行樹脂密封之樹脂密封電子零件，且上述樹脂密封電子零件包含基板、電子零件、樹脂、及上述本發明之帶有突起電極之板狀構件，上述電子零件係配置於上述基板上，且被上述樹脂密封，於上述基板上之上述電子零件配置側，形成有佈線圖案，上述突起電極貫通上述樹脂而與上述佈線圖案接觸。 The resin-sealed electronic component of the present invention is characterized in that it is a resin-sealed electronic component that is resin-sealed to an electronic component, and the resin-sealed electronic component comprises a substrate, an electronic component, a resin, and the above-described board with a protruding electrode of the present invention. In the above-described electronic component, the electronic component is placed on the substrate and sealed by the resin, and a wiring pattern is formed on the electronic component arrangement side of the substrate, and the protruding electrode is in contact with the wiring pattern through the resin.
根據本發明，可提供一種能夠簡便且有效地製造具有通孔電極(突起電極)及板狀構件兩者之樹脂密封電子零件之樹脂密封電子零件之製造方法、帶有突起電極之板狀構件、樹脂密封電子零件、及帶有突起電極之板狀構件之製造方法。 According to the present invention, it is possible to provide a method of manufacturing a resin-sealed electronic component capable of easily and efficiently manufacturing a resin-sealed electronic component having both a via electrode (protrusion electrode) and a plate-like member, a plate-shaped member having a protruding electrode, A resin sealing electronic component and a method of manufacturing a plate member having a protruding electrode.
10‧‧‧帶有突起電極之板狀構件 10‧‧‧Plate-like members with protruding electrodes
11‧‧‧板狀構件 11‧‧‧ Plate-like members
12‧‧‧突起電極 12‧‧‧ protruding electrode
12a‧‧‧下部 12a‧‧‧ lower
12b‧‧‧孔 12b‧‧‧ hole
12c‧‧‧突起 12c‧‧‧ Protrusion
13‧‧‧孔 13‧‧‧ hole
20‧‧‧樹脂密封電子零件 20‧‧‧Resin sealed electronic parts
21‧‧‧基板 21‧‧‧Substrate
22‧‧‧佈線圖案 22‧‧‧Wiring pattern
31‧‧‧電子零件 31‧‧‧Electronic parts
41‧‧‧樹脂 41‧‧‧Resin
50‧‧‧成形模具 50‧‧‧Forming mould
51‧‧‧上模具 51‧‧‧Upper mold
52‧‧‧下模具 52‧‧‧ Lower mold
53‧‧‧柱塞 53‧‧‧Plunger
54‧‧‧加料腔 54‧‧‧feeding chamber
55‧‧‧樹脂通道 55‧‧‧Resin channel
56‧‧‧模腔 56‧‧‧ cavity
57‧‧‧基板安裝部 57‧‧‧Substrate Mounting Department
60‧‧‧樹脂供給構件 60‧‧‧Resin supply member
61‧‧‧樹脂供給部 61‧‧‧Resin Supply Department
62‧‧‧下部擋閘 62‧‧‧lower gate
100‧‧‧脫模膜 100‧‧‧ release film
102‧‧‧中間模具 102‧‧‧Intermediate mould
102a‧‧‧O型環 102a‧‧‧O-ring
104‧‧‧輥 104‧‧‧ Roll
111a‧‧‧下模具腔底面構件 111a‧‧‧ Lower mold cavity bottom member
111b‧‧‧下模具腔 111b‧‧‧ lower mold cavity
111c‧‧‧空隙 111c‧‧‧ gap
112‧‧‧下模具外周頂壓板 112‧‧‧ Lower mold top platen
113‧‧‧下模具外周頂壓板 113‧‧‧ Lower outer peripheral pressure plate
121‧‧‧下模具 121‧‧‧ Lower mold
122‧‧‧上模具 122‧‧‧Upper mold
123‧‧‧真空腔室 123‧‧‧vacuum chamber
1001‧‧‧上模具 1001‧‧‧Upper mold
1003‧‧‧孔 1003‧‧‧ hole
1011‧‧‧下模具 1011‧‧‧Next mold
1011a‧‧‧下模具腔底面構件 1011a‧‧‧ Lower mold cavity bottom member
1011b‧‧‧下模具腔 1011b‧‧‧ lower mold cavity
1011c‧‧‧空隙 1011c‧‧‧ gap
1012‧‧‧下模具頂壓板 1012‧‧‧ Lower mold top plate
1012a‧‧‧O型環 1012a‧‧‧O-ring
2001‧‧‧上模具 2001‧‧‧Upper mold
2001a‧‧‧基板安裝部 2001a‧‧‧Substrate Installation Department
2002‧‧‧上模具基板 2002‧‧‧Upper mold substrate
2004‧‧‧上模具外部氣體隔斷構件 2004‧‧‧Upper mold external gas partition member
2004a‧‧‧O型環 2004a‧‧O-ring
2004b‧‧‧O型環 2004b‧‧‧O-ring
2010‧‧‧下模具基板 2010‧‧‧ Lower mold substrate
2011‧‧‧下模具 2011‧‧‧Next mold
2011a‧‧‧下模具腔底面構件 2011a‧‧‧ Lower mold cavity bottom member
2011b‧‧‧下模具腔 2011b‧‧‧ Lower mold cavity
2011c‧‧‧空隙 2011c‧‧‧ gap
2012‧‧‧下模具外周頂壓板 2012‧‧‧Mold outer peripheral top plate
2012a‧‧‧彈性構件 2012a‧‧‧Flexible components
2013‧‧‧下模具外部氣體隔斷構件 2013‧‧‧Mold outer gas partitioning member
2013a‧‧‧O型環 2013a‧‧‧O-ring
圖1A、1B係表示本發明之帶有突起電極之板狀構件之構造之一例的立體圖。 1A and 1B are perspective views showing an example of a structure of a plate-like member having a protruding electrode of the present invention.
圖2(A)~(D)係例示本發明之帶有突起電極之板狀構件中之突起電極之構造的立體圖。 2(A) to 2(D) are perspective views showing a structure of a protruding electrode in a plate-like member having a protruding electrode of the present invention.
圖3係表示本發明之樹脂密封電子零件之構造之一例之剖視圖。 Fig. 3 is a cross-sectional view showing an example of the structure of the resin-sealed electronic component of the present invention.
圖4係例示採用轉移成形之本發明之製造方法之剖視圖。 Fig. 4 is a cross-sectional view showing a manufacturing method of the present invention by transfer molding.
圖5係例示使用壓縮成形之本發明之製造方法之一例之一步驟的剖視圖。 Fig. 5 is a cross-sectional view showing a step of an example of a manufacturing method of the present invention using compression molding.
圖6係例示與圖5相同之製造方法中之另一步驟之剖視圖。 Fig. 6 is a cross-sectional view showing another step in the same manufacturing method as Fig. 5.
圖7係例示與圖5相同之製造方法中之又一步驟之剖視圖。 Fig. 7 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 5.
圖8係例示與圖5相同之製造方法中之又一步驟之剖視圖。 Fig. 8 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 5.
圖9係例示使用壓縮成形之本發明之製造方法中之另一例之一步 驟的剖視圖。 Figure 9 is a view showing one of the other examples of the manufacturing method of the present invention using compression molding. A cross-sectional view of the step.
圖10係例示與圖9相同之製造方法中之另一步驟之剖視圖。 Fig. 10 is a cross-sectional view showing another step in the same manufacturing method as Fig. 9.
圖11係例示使用壓縮成形之本發明之製造方法中之又一例之一步驟的剖視圖。 Figure 11 is a cross-sectional view showing one step of still another example of the manufacturing method of the present invention using compression molding.
圖12係例示與圖11相同之製造方法中之另一步驟之剖視圖。 Fig. 12 is a cross-sectional view showing another step in the same manufacturing method as Fig. 11.
圖13係例示與圖11相同之製造方法中之又一步驟之剖視圖。 Fig. 13 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 11.
圖14係例示與圖11相同之製造方法中之進而又一步驟之剖視圖。 Fig. 14 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 11.
圖15係例示使用壓縮成形之本發明之製造方法中之進而另一例之一步驟的剖視圖。 Fig. 15 is a cross-sectional view showing a step of still another example of the manufacturing method of the present invention using compression molding.
圖16係例示使用壓縮成形之本發明之製造方法中之進而又一例之一步驟的剖視圖。 Fig. 16 is a cross-sectional view showing a step of still another example of the manufacturing method of the present invention using compression molding.
圖17係例示使用壓縮成形之本發明之製造方法中之進而又一例之剖視圖。 Fig. 17 is a cross-sectional view showing still another example of the manufacturing method of the present invention using compression molding.
圖18係例示使用壓縮成形之本發明之製造方法中之進而又一例之剖視圖。 Fig. 18 is a cross-sectional view showing still another example of the manufacturing method of the present invention using compression molding.
圖19係例示使用壓縮成形之本發明之製造方法中之進而又一例之一步驟的剖視圖。 Fig. 19 is a cross-sectional view showing a step of still another example of the manufacturing method of the present invention using compression molding.
圖20係例示使用壓縮成形之本發明之製造方法中之進而又一例之一步驟的剖視圖。 Fig. 20 is a cross-sectional view showing one step of still another example of the manufacturing method of the present invention using compression molding.
圖21係例示使用壓縮成形之本發明之製造方法中之進而又一例之剖視圖。 Fig. 21 is a cross-sectional view showing still another example of the manufacturing method of the present invention using compression molding.
圖22係例示使用壓縮成形之本發明之製造方法中之進而又一例之剖視圖。 Fig. 22 is a cross-sectional view showing still another example of the manufacturing method of the present invention using compression molding.
其次，舉例而更詳細地說明本發明。然而，本發明並不受到以下 之說明限定。 Next, the present invention will be described in more detail by way of examples. However, the present invention is not subject to the following The description is limited.
於本發明之製造方法中，上述突起電極之數量為任意，並無特別限定，可為1個，亦可為複數個。上述突起電極之形狀並無特別限定。又，上述突起電極為複數個之情形時，其等之形狀可彼此相同，亦可彼此不同。例如，上述突起電極之至少一者亦可為帶有貫通孔之突起電極。更具體而言，上述帶有貫通孔之突起電極中之上述貫通孔亦可為朝向與上述板狀構件之板面平行之方向貫通之貫通孔。上述帶有貫通孔之突起電極亦可於與固定於上述板狀構件之一端為相反側之端，具有朝向與上述板狀構件之板面垂直之方向突出的突起。更具體而言，此種帶有貫通孔之突起電極之形狀亦可為例如後述之圖2(A)~(C)之形狀。 In the manufacturing method of the present invention, the number of the protruding electrodes is arbitrary, and is not particularly limited, and may be one or plural. The shape of the protruding electrode is not particularly limited. Further, when the plurality of protruding electrodes are plural, the shapes thereof may be the same or different from each other. For example, at least one of the protruding electrodes may be a protruding electrode with a through hole. More specifically, the through hole in the protruding electrode having the through hole may be a through hole penetrating in a direction parallel to a plate surface of the plate member. The protruding electrode having the through hole may have a projection that protrudes in a direction perpendicular to a plate surface of the plate member, at an end opposite to one end of the plate member. More specifically, the shape of the protruding electrode having the through hole may be, for example, the shape of FIGS. 2(A) to (C) to be described later.
於本發明之製造方法中，上述突起電極之至少一者係具有柱狀形狀之柱狀突起電極。作為上述柱狀突起電極之形狀，例如可列舉圓柱狀、稜柱狀、圓錐狀、棱錐狀、圓錐台狀、及棱錐台狀等。 In the manufacturing method of the present invention, at least one of the protruding electrodes is a columnar protruding electrode having a columnar shape. Examples of the shape of the columnar projection electrode include a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, and a truncated cone shape.
又，於本發明之製造方法中，上述突起電極之至少一者亦可為板狀突起電極。該情形時，上述電子零件可為複數個，於上述樹脂密封步驟中，藉由上述板狀突起電極將上述基板區劃成複數個區域，並且於各個上述區域內，對上述電子零件進行樹脂密封。又，較佳為，上述板狀突起電極具有貫通孔及突起，上述貫通孔於與上述板狀構件之板面平行之方向貫通上述板狀突起電極，且上述突起於上述板狀突起電極之、與固定於上述板狀構件之一端為相反側之端，朝向與上述板狀構件之板面垂直之方向突出。 Further, in the manufacturing method of the present invention, at least one of the protruding electrodes may be a plate-like protruding electrode. In this case, the electronic component may be plural. In the resin sealing step, the substrate is divided into a plurality of regions by the plate-like protruding electrodes, and the electronic component is resin-sealed in each of the regions. Further, it is preferable that the plate-like protruding electrode has a through hole and a protrusion, and the through hole penetrates the plate-shaped protruding electrode in a direction parallel to a plate surface of the plate-shaped member, and the protrusion is formed on the plate-shaped protruding electrode An end opposite to one end of the plate-like member is protruded toward a direction perpendicular to a plate surface of the plate-like member.
於本發明之製造方法中，上述板狀構件並無特別限定，但較佳為散熱板(散熱器)或屏蔽板(遮蔽板)。上述屏蔽板例如可為用於屏蔽自上述電子零件釋放出之電磁波者。上述散熱板較佳為於與上述突起電極 之固定面為相反側之一面具有散熱片(fin)。又，上述板狀構件之形狀除了固定有上述突起電極以外，並無特別限定。例如，於上述板狀構件為散熱板之情形時，就上述散熱板而言，除了上述突起電極以外，亦可為用於使散熱效率良好之突起以一個或複數個結合之形狀(例如，散熱片(fin)形狀)等。上述板狀構件之材質亦無特別限定，於上述板狀構件為散熱板或屏蔽板之情形時，例如可使用金屬材料、陶瓷材料、樹脂、及金屬蒸鍍膜等。上述金屬蒸鍍膜並無特別限定，例如亦可為將鋁、銀等蒸鍍於薄膜之金屬蒸鍍膜。又，上述突起電極之材質亦無特別限定，例如可使用金屬材料、陶瓷材料、及樹脂等。作為上述金屬材料，並無特別限定，例如可列舉：不鏽鋼、坡莫合金(鐵與鎳之合金)等鐵系材料；黃銅、銅鉬合金、及鈹銅等銅系材料；硬鋁等鋁系材料。作為上述陶瓷材料，並無特別限定，例如可列舉：氮化鋁等氧化鋁系材料；氮化矽等矽系材料；及氧化鋯系材料。作為上述樹脂，並無特別限定，例如可列舉：彈性橡膠樹脂等橡膠系材料；於矽系之基材中混合傳導性材料之材料；及對該等材料進行擠壓成形或射出成形之樹脂材料。又，於上述帶有突起電極之板狀構件中，亦可對上述板狀構件之表面等進行電鍍、塗裝等表面處理而形成導電層。再者，上述板狀構件亦可為具有某些功能之功能構件(作用構件)。例如，於上述板狀構件係散熱板(散熱器)之情形時，其係具有散熱功能(散熱作用)之功能構件(作用構件)；於上述板狀構件係屏蔽板(遮蔽板)之情形時，其係具有屏蔽功能(屏蔽作用)之功能構件(作用構件)。 In the manufacturing method of the present invention, the plate member is not particularly limited, but is preferably a heat sink (heat sink) or a shield plate (shield plate). The shield plate may be, for example, a shield for shielding electromagnetic waves emitted from the electronic component. The heat dissipation plate is preferably opposite to the protruding electrode The fixing surface has a fin on one side of the opposite side. Further, the shape of the plate-shaped member is not particularly limited, except that the protruding electrode is fixed. For example, in the case where the plate member is a heat dissipation plate, the heat dissipation plate may be in the form of one or a plurality of combined protrusions (for example, heat dissipation) in addition to the protruding electrodes. Pie (fin) shape and so on. The material of the plate-like member is not particularly limited. When the plate-shaped member is a heat dissipation plate or a shield plate, for example, a metal material, a ceramic material, a resin, a metal deposition film, or the like can be used. The metal deposition film is not particularly limited, and may be, for example, a metal deposition film in which aluminum, silver, or the like is deposited on a film. Further, the material of the protruding electrode is not particularly limited, and for example, a metal material, a ceramic material, a resin, or the like can be used. The metal material is not particularly limited, and examples thereof include iron-based materials such as stainless steel and permalloy (alloys of iron and nickel); copper-based materials such as brass, copper-molybdenum alloy, and beryllium copper; and aluminum such as hard aluminum. Department of materials. The ceramic material is not particularly limited, and examples thereof include an alumina-based material such as aluminum nitride; an anthracene-based material such as tantalum nitride; and a zirconia-based material. The resin is not particularly limited, and examples thereof include a rubber-based material such as an elastic rubber resin, a material in which a conductive material is mixed with a base material, and a resin material obtained by extrusion molding or injection molding of the materials. . Further, in the plate-like member having the protruding electrode, the surface of the plate-like member may be subjected to surface treatment such as plating or coating to form a conductive layer. Furthermore, the above-mentioned plate-shaped member may also be a functional member (acting member) having some functions. For example, in the case where the above-mentioned plate member is a heat dissipation plate (heat sink), it is a functional member (acting member) having a heat dissipation function (heat dissipation function); in the case where the above plate member is a shield plate (shield plate) It is a functional member (acting member) having a shielding function (shielding function).
於上述樹脂密封步驟中，樹脂密封方法(成形方法)並無特別限定，亦可為例如轉移成形、壓縮成形等任意方法。 In the resin sealing step, the resin sealing method (forming method) is not particularly limited, and may be any method such as transfer molding or compression molding.
於上述樹脂密封步驟使用壓縮成形之情形時，本發明之製造方法亦可進而包含將上述樹脂載置於上述帶有突起電極之板狀構件之、固 定有上述突起電極之面上之樹脂載置步驟。又，於該情形時，本發明之製造方法亦可進而包含將上述帶有突起電極之板狀構件搬送至成形模具之模腔位置之搬送步驟。又，亦可於上述模腔內，在使上述電子零件浸漬於載置於上述板狀構件上之上述樹脂之狀態下，將上述樹脂與上述帶有突起電極之板狀構件及上述電子零件一併壓縮成形，藉此進行上述樹脂密封步驟。 In the case where the resin sealing step is performed by compression molding, the manufacturing method of the present invention may further comprise: fixing the resin to the plate-like member having the protruding electrode; A resin mounting step on the surface of the above-mentioned bump electrode is fixed. Further, in this case, the manufacturing method of the present invention may further include a transfer step of transporting the plate-like member having the protruding electrode to the cavity position of the molding die. Further, in the cavity, the resin may be immersed in the resin placed on the plate-like member, and the resin and the plate-shaped member having the protruding electrode and the electronic component may be And compression molding, thereby performing the above resin sealing step.
上述樹脂載置步驟及上述搬送步驟之順序並無特別限定，可先進行其中任一者，亦可同時進行。例如，亦可於上述搬送步驟中，將上述樹脂於載置於上述帶有突起電極之板狀構件上之狀態下，與上述帶有突起電極之板狀構件一併搬送至上述成形模具之模腔位置。或者，亦可於上述搬送步驟中，將上述帶有突起電極之板狀構件於載置有樹脂之狀態下，搬送至上述成形模具之模腔位置。於該情形時，本發明之製造方法亦可於上述樹脂載置步驟之前，進而包含於上述模腔內對上述帶有突起電極之板狀構件進行加熱之加熱步驟。然後，亦可於上述帶有突起電極之板狀構件被加熱之狀態下，於上述模腔內進行上述樹脂載置步驟。 The order of the resin mounting step and the transport step is not particularly limited, and either one of them may be performed first or simultaneously. For example, in the above-described transfer step, the resin may be transferred to the mold of the forming mold together with the plate-like member having the protruding electrode in a state of being placed on the plate-like member having the protruding electrode. Cavity position. Alternatively, in the above-described transfer step, the plate-like member having the protruding electrode may be transferred to the cavity position of the molding die while the resin is placed thereon. In this case, the manufacturing method of the present invention may further include a heating step of heating the plate-like member having the protruding electrodes in the cavity before the resin mounting step. Then, the resin mounting step may be performed in the cavity in a state where the plate member having the protruding electrode is heated.
亦可於上述搬送步驟中，於將上述帶有突起電極之板狀構件之、固定有上述突起電極之一面朝上而載置於脫模膜上之狀態下，將上述帶有突起電極之板狀構件向上述成形模具之模腔內搬送。該情形時，亦可於上述搬送步驟中，於框體與上述帶有突起電極之板狀構件一併載置於上述脫模膜上，並且上述帶有突起電極之板狀構件被上述框體包圍之狀態下，將上述帶有突起電極之板狀構件向上述成形模具之模腔內搬送。於上述樹脂載置步驟中，較佳為於上述框體與上述帶有突起電極之板狀構件一併載置於上述脫模膜上，並且上述帶有突起電極之板狀構件被上述框體包圍之狀態下，向由上述帶有突起電極之板狀 構件及上述框體包圍之空間內供給上述樹脂，藉此將上述樹脂載置於上述突起電極之固定面上。於此種情形時，上述樹脂載置步驟及上述搬送步驟之順序並無特別限定，可先進行其中任一者，亦可同時進行，但較佳為於進行上述搬送步驟之前進行上述樹脂載置步驟。 In the above-described transfer step, the plate-shaped member having the protruding electrode may be placed on the release film with one surface of the protruding electrode fixed thereto, and the protruding electrode may be placed. The plate member is conveyed into the cavity of the forming mold. In this case, in the transfer step, the frame body and the plate-shaped member having the protruding electrode may be placed on the release film together, and the plate-shaped member having the protruding electrode may be surrounded by the frame. In this state, the plate-like member having the protruding electrode is conveyed into the cavity of the molding die. Preferably, in the resin mounting step, the frame body and the plate-like member having the protruding electrode are placed on the release film, and the plate-shaped member having the protruding electrode is surrounded by the frame body. In the state of the plate, the plate having the protruding electrode The resin is supplied into the space surrounded by the member and the frame, whereby the resin is placed on the fixing surface of the protruding electrode. In this case, the order of the resin mounting step and the transport step is not particularly limited, and either one of them may be performed first or simultaneously, but it is preferred to carry out the resin mounting before performing the above-described transport step. step.
又，亦可將上述帶有突起電極之板狀構件之、與固定有上述突起電極之一面為相反側之一面，藉由黏著劑而固定於上述脫模膜上。 Further, the plate-like member having the protruding electrode may be fixed to the release film by an adhesive on one side opposite to the surface on which one of the protruding electrodes is fixed.
進行上述搬送步驟之搬送構件亦可為如下構件：於載置有上述樹脂之上述板狀構件載置於脫模膜上之狀態下，將上述樹脂向上述成形模具之模腔內搬送。於該情形時，進行上述樹脂密封之樹脂密封構件亦可為如下構件：具有脫模膜吸附構件，並且於使上述脫模膜吸附於上述脫模膜吸附構件之狀態下，進行上述壓縮成形。又，上述成形模具並無特別限定，例如為金屬模具、或陶瓷模具。 The conveying member that performs the above-described conveying step may be a member that conveys the resin into the cavity of the molding die while the plate-like member on which the resin is placed is placed on the release film. In this case, the resin sealing member that performs the resin sealing may be a member having a release film adsorbing member and performing the above-described compression molding in a state where the release film is adsorbed to the release film adsorbing member. Further, the molding die is not particularly limited, and is, for example, a metal mold or a ceramic mold.
如上所述，本發明之帶有突起電極之板狀構件之特徵在於，其係上述本發明之製造方法中使用之帶有突起電極之板狀構件，且上述突起電極係固定於上述板狀構件之單面。如上所述，上述突起電極之數量及形狀並無特別限定。如上所述，例如上述突起電極之至少一者亦可為上述板狀突起電極。如上所述，較佳為，上述板狀突起電極具有貫通孔及突起，上述貫通孔於與上述板狀構件之板面平行之方向貫通上述板狀突起電極，上述突起於上述板狀突起電極之、與固定於上述板狀構件之一端為相反側之端，朝向與上述板狀構件之板面垂直之方向突出。又，如上所述，例如上述突起電極之至少一者亦可為帶有貫通孔之突起電極。更具體而言，如上所述，上述帶有貫通孔之突起電極12之上述貫通孔亦可為朝向與上述板狀構件之板面平行之方向貫通之貫通孔12b。又，上述帶有貫通孔之突起電極亦可於與固定於上述板狀構件之一端(12a側)為相反側之端，具有朝向與上述板狀構件之板面 垂直之方向突出之突起12c。進而，如上所述，上述突起電極之至少一者亦可具有柱狀形狀(例如，圓柱狀、稜柱狀、圓錐狀、棱錐狀、圓錐台狀、及棱錐台狀等)之柱狀突起電極。 As described above, the plate-like member with the protruding electrode of the present invention is characterized in that it is a plate-like member having a protruding electrode used in the above-described manufacturing method of the present invention, and the protruding electrode is fixed to the above-mentioned plate-shaped member. One side. As described above, the number and shape of the protruding electrodes are not particularly limited. As described above, for example, at least one of the protruding electrodes may be the above-described plate-like protruding electrode. As described above, it is preferable that the plate-like protruding electrode has a through hole and a protrusion, and the through hole penetrates the plate-shaped protruding electrode in a direction parallel to a plate surface of the plate-shaped member, and the protrusion is formed in the plate-shaped protruding electrode And protruding at an end opposite to one end of the plate-like member, and protruding in a direction perpendicular to a plate surface of the plate-shaped member. Further, as described above, for example, at least one of the protruding electrodes may be a protruding electrode having a through hole. More specifically, as described above, the through hole of the protruding electrode 12 having the through hole may be a through hole 12b that penetrates in a direction parallel to the plate surface of the plate member. Further, the protruding electrode having the through hole may have a surface facing the plate member from the end opposite to the one end (12a side) of the plate member. A projection 12c that protrudes in the vertical direction. Further, as described above, at least one of the protruding electrodes may have a columnar protruding electrode having a columnar shape (for example, a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, and a truncated pyramid shape).
又，如上所述，上述板狀構件之形狀並無特別限定，例如上述板狀構件亦可具有樹脂收容部。更具體而言，例如亦可為上述板狀構件之周邊部向上述板狀構件之上述突起電極固定面側隆起，藉此上述板狀構件之中央部形成上述樹脂收容部。又，本發明之製造方法亦可於上述樹脂載置步驟中，將上述樹脂載置於上述板狀構件之上述樹脂收容部內，且於上述樹脂載置於上述樹脂收容部內之狀態下進行上述樹脂密封步驟。 Moreover, as described above, the shape of the plate-shaped member is not particularly limited, and for example, the plate-shaped member may have a resin receiving portion. More specifically, for example, the peripheral portion of the plate-like member may be swelled toward the protruding electrode fixing surface side of the plate-shaped member, and the resin receiving portion may be formed at a central portion of the plate-shaped member. Further, in the resin mounting step of the present invention, the resin may be placed in the resin accommodating portion of the plate-like member, and the resin may be placed in a state where the resin is placed in the resin accommodating portion. Sealing step.
又，於上述樹脂密封步驟中，使用壓縮成形之情形時，亦可將於上述佈線圖案形成面配置有上述電子零件之上述基板，以將上述佈線圖案之形成面朝上之方式載置於基板載置台上，進而，於上述佈線圖案之形成面上載置有上述樹脂之狀態下，按壓上述樹脂。 Further, in the resin sealing step, when the compression molding is used, the substrate on which the electronic component is placed on the wiring pattern forming surface may be placed on the substrate so that the formation surface of the wiring pattern faces upward. On the mounting table, the resin is pressed while the resin is placed on the surface on which the wiring pattern is formed.
於本發明之製造方法中，上述樹脂並無特別限定，例如亦可為熱塑性樹脂或熱固性樹脂中之任一者。上述樹脂例如亦可為選自由顆粒狀樹脂、粉末狀樹脂、液狀樹脂、板狀樹脂、片材狀樹脂、薄膜狀樹脂、及漿狀樹脂組成之群中之至少一者。又，上述樹脂例如亦可為選自由透明樹脂、半透明樹脂、及不透明樹脂組成之群中之至少一者。 In the production method of the present invention, the resin is not particularly limited, and may be, for example, any of a thermoplastic resin or a thermosetting resin. The resin may be, for example, at least one selected from the group consisting of a particulate resin, a powdered resin, a liquid resin, a plate resin, a sheet resin, a film resin, and a paste resin. Further, the resin may be, for example, at least one selected from the group consisting of a transparent resin, a translucent resin, and an opaque resin.
以下，基於圖式對本發明之實施形態進行說明。為了便於說明，各圖係適當地進行省略、放大等而模式性地表示。 Hereinafter, embodiments of the present invention will be described based on the drawings. For convenience of explanation, each drawing is schematically represented by omitting, enlarging, or the like as appropriate.
於本實施例中，對本發明之帶有突起電極之板狀構件之一例、使用上述帶有突起電極之板狀構件之本發明之樹脂密封電子零件之一例、及使用轉移成形之上述樹脂密封電子零件之製造方法之一例進行 說明。 In the present embodiment, an example of the resin-sealed electronic component of the present invention using the above-described plate-like member having the protruding electrode, and the resin-sealed electronic using the transfer molding are used as an example of the plate-like member with the protruding electrode of the present invention. An example of manufacturing a part Description.
於圖1之立體圖中，模式性地表示本實施例之帶有突起電極之板狀構件之構造。如圖1所示，該帶有突起電極之板狀構件10係突起電極12之圖案固定於板狀構件11之單面而形成。突起電極12之長度(高度)並無特別限定，例如可根據完成品之樹脂密封電子零件(成形封裝)之厚度而適當地設定。又，於本發明中，上述突起電極之圖案不限定於本實施例(圖1)之圖案，可為任意圖案。 In the perspective view of Fig. 1, the configuration of the plate-like member with the protruding electrodes of the present embodiment is schematically shown. As shown in FIG. 1, the plate-like member 10 having the protruding electrodes is formed by fixing a pattern of the protruding electrodes 12 to one surface of the plate-like member 11. The length (height) of the bump electrode 12 is not particularly limited, and can be appropriately set, for example, according to the thickness of the resin-sealed electronic component (molding package) of the finished product. Further, in the present invention, the pattern of the protruding electrodes is not limited to the pattern of the embodiment (Fig. 1), and may be any pattern.
圖1之立體圖所示之帶有突起電極之板狀構件之構造係如圖1(A)及(B)之兩個所示。首先，如圖1(A)所示，就該帶有突起電極之板狀構件10而言，突起電極12之圖案朝向與金屬板(板狀構件)11之面方向垂直之方向而固定於金屬板(板狀構件)11之單面。另一方面，於圖1(B)中，就帶有突起電極之板狀構件10而言，金屬板(板狀構件)11之一部分被衝壓，並且上述被衝壓之一部分朝向與板狀構件11之面方向垂直之方向彎曲而形成突起電極。如圖所示，於板狀構件11中，上述被衝壓一部分之部分形成為孔13。除此之外與圖1(A)相同。 The structure of the plate-like member with the protruding electrodes shown in the perspective view of Fig. 1 is as shown in two of Figs. 1(A) and (B). First, as shown in Fig. 1(A), in the plate-like member 10 having the protruding electrodes, the pattern of the protruding electrodes 12 is fixed to the metal in a direction perpendicular to the surface direction of the metal plate (plate-like member) 11. One side of the plate (plate member) 11. On the other hand, in Fig. 1(B), in the case of the plate-like member 10 having the projecting electrodes, one portion of the metal plate (plate-like member) 11 is punched, and one of the above-mentioned portions to be punched faces the plate-like member 11 The surface direction is curved in a direction perpendicular to the protrusion electrode. As shown in the figure, in the plate-like member 11, a part of the above-mentioned punched portion is formed as a hole 13. Other than this, it is the same as FIG. 1(A).
於圖1(A)或(B)中，突起電極12之形狀並無特別限定，例如亦可為如圖2所示之形狀。於圖2中，上側之圖係表示圖1所示之帶有突起電極之板狀構件10之一部分之立體圖。又，圖2之下側之(A)~(C)係模式性地表示突起電極12之構造之一例之立體圖。分別如圖2(A)~(C)所示，於突起電極12之下部12a(與板狀構件11連接之側之部分)並未設置孔。另一方面，於突起電極12之上部(與板狀構件11連接之側為相反側之部分)，形成有於與板狀構件11之板面平行之方向貫通突起電極12之孔(貫通孔)12b。又，突起電極12之上端(與固定於板狀構件11之端為相反側之端)以其一部分向上方(朝向與板狀構件11之板面垂直之方向)突出之方式形成有突起12c。突起電極12於突起12c之前端部分可與基板 之佈線圖案(基板電極)接觸。再者，於圖2(A)中，突起12c之數量為兩個。圖2(B)除了突起12c之數量為一個，且突起電極12之寬度略窄以外，與圖2(A)相同。圖2(C)除了突起電極12之寬度更窄以外，與圖2(B)相同。如此，突起12c之數量並無特別限定，為一個亦可為複數個。突起12c之數量於圖2(A)~(C)中為一個或兩個，但亦可為三個以上。又，孔(貫通孔)12b之數量於圖2(A)~(C)中為一個，但亦無特別限定，可為任意，亦可為複數個。 In FIG. 1(A) or (B), the shape of the bump electrode 12 is not particularly limited, and may be, for example, a shape as shown in FIG. 2. In Fig. 2, the upper side view is a perspective view showing a part of the plate-like member 10 having the projecting electrodes shown in Fig. 1. Further, (A) to (C) on the lower side of FIG. 2 schematically show a perspective view of an example of the structure of the bump electrode 12. As shown in Figs. 2(A) to (C), respectively, no hole is provided in the lower portion 12a of the protruding electrode 12 (portion on the side to which the plate member 11 is connected). On the other hand, a hole (through hole) penetrating the protruding electrode 12 in a direction parallel to the plate surface of the plate member 11 is formed on the upper portion of the protruding electrode 12 (the portion opposite to the side to which the plate member 11 is connected). 12b. Further, the upper end of the protruding electrode 12 (the end opposite to the end fixed to the plate-like member 11) is formed with a projection 12c so that a part thereof protrudes upward (in a direction perpendicular to the plate surface of the plate-like member 11). The protruding electrode 12 can be adjacent to the substrate at the front end portion of the protrusion 12c The wiring pattern (substrate electrode) is in contact. Further, in Fig. 2(A), the number of the projections 12c is two. Fig. 2(B) is the same as Fig. 2(A) except that the number of the projections 12c is one and the width of the protruding electrode 12 is slightly narrow. 2(C) is the same as FIG. 2(B) except that the width of the bump electrode 12 is narrower. Thus, the number of the protrusions 12c is not particularly limited, and may be plural. The number of the projections 12c is one or two in Figs. 2(A) to (C), but may be three or more. Further, the number of the holes (through holes) 12b is one in FIGS. 2(A) to (C), but is not particularly limited, and may be any number or plural.
由於具有突起12c，因此突起電極12不受樹脂之干擾地，容易與基板之佈線圖案(基板電極)接觸。即，藉由突起12c將突起電極12與圖1中之佈線圖案22之間之樹脂(例如熔融樹脂、或液狀樹脂)撥開，而突起12c之前端與佈線圖案22抵接(物理接觸)，同時與其電性連接。又，由於突起電極12具有孔12b，因此更容易對電子零件進行樹脂密封。即，由於樹脂可穿過孔12b而流動，因此樹脂之流動變得更流暢，樹脂密封之效率進一步提高。該效果於轉移成形之情形時尤其顯著。進而，突起電極12與佈線圖案22抵接(接觸)時，如圖2(D)所示，突起電極12於孔12b附近彎曲，藉此可減小突起電極12之高度(長度)。藉此，可對應於樹脂密封電子零件之樹脂厚度(封裝厚度)而調整突起電極12之高度。考慮到該點，亦可將突起電極12之高度(長度)預先設定成較上述樹脂厚度(封裝厚度)略長。 Since the protrusions 12c are provided, the bump electrodes 12 are easily in contact with the wiring pattern (substrate electrode) of the substrate without being disturbed by the resin. That is, the resin (for example, molten resin or liquid resin) between the bump electrode 12 and the wiring pattern 22 in FIG. 1 is separated by the protrusion 12c, and the front end of the protrusion 12c abuts (physical contact) with the wiring pattern 22. At the same time, it is electrically connected. Further, since the bump electrode 12 has the hole 12b, it is easier to resin-seale the electronic component. That is, since the resin can flow through the holes 12b, the flow of the resin becomes smoother, and the efficiency of resin sealing is further improved. This effect is particularly remarkable in the case of transfer forming. Further, when the bump electrode 12 abuts (contacts) the wiring pattern 22, as shown in FIG. 2(D), the bump electrode 12 is bent in the vicinity of the hole 12b, whereby the height (length) of the bump electrode 12 can be reduced. Thereby, the height of the bump electrode 12 can be adjusted in accordance with the resin thickness (package thickness) of the resin-sealed electronic component. In consideration of this point, the height (length) of the bump electrode 12 may be set to be slightly longer than the above-described resin thickness (package thickness).
再者，突起電極12之形狀亦可於圖2(A)~(C)之形狀之基礎上、或代替該等形狀，而為其他形狀。例如，如上所述，突起電極12之至少一者亦可為具有柱狀形狀之柱狀突起電極。作為上述柱狀突起電極之形狀，如上所述，例如可列舉圓柱狀、稜柱狀、圓錐狀、棱錐狀、圓錐台狀、及棱錐台狀等。 Further, the shape of the bump electrode 12 may be other shapes in addition to or in place of the shapes of FIGS. 2(A) to (C). For example, as described above, at least one of the bump electrodes 12 may be a columnar bump electrode having a columnar shape. As the shape of the columnar projection electrode, as described above, for example, a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, and a truncated cone shape can be cited.
又，如上所述，突起電極12之至少一者亦可為板狀突起電極。該 情形時，如上所述，於本發明之製造方法之上述樹脂密封步驟中，亦可將上述基板藉由上述板狀突起電極而區劃成複數個區域，並且於各個上述區域內，對上述電子零件進行樹脂密封。又，上述板狀突起電極亦可與圖2(A)~(C)之突起電極相同，具有貫通孔及突起。上述貫通孔亦可與圖2(A)~(C)相同，將上述板狀突起電極向與上述板狀構件之板面平行之方向貫通。又，較佳為，與圖2(A)~(C)相同，上述突起於上述板狀突起電極之、與固定於上述板狀構件之一端為相反側之端，向與上述板狀構件之板面垂直之方向突出。上述板狀突起電極之上述貫通孔及上述突起之數量亦無特別限定而為任意，但較佳為複數個。上述板狀突起電極具有上述貫通孔及上述突起，藉此具有與圖2(A)~(C)之貫通孔12b及突起12c相同之優點。即，首先，上述板狀突起電極具有上述突起，藉此上述板狀突起電極不受樹脂干擾地，容易與基板之佈線圖案(基板電極)接觸。又，上述板狀突起電極具有上述貫通孔，藉此樹脂可穿過上述貫通孔而流動，因此樹脂之流動變得更流暢，樹脂密封之效率進一步提高。該效果於轉移成形之情形時尤其顯著。又，進而上述板狀突起電極於上述貫通孔附近彎曲，藉此可減小上述板狀突起電極之高度(長度)。藉此，可對應於樹脂密封電子零件之樹脂厚度(封裝厚度)而調整上述板狀突起電極之高度。考慮到該點，亦可將上述板狀突起電極之高度(長度)預先設定成較上述樹脂厚度(封裝厚度)略長。 Further, as described above, at least one of the bump electrodes 12 may be a plate-like bump electrode. The In the above, in the resin sealing step of the manufacturing method of the present invention, the substrate may be divided into a plurality of regions by the plate-like protruding electrodes, and the electronic components may be in the respective regions. Perform a resin seal. Further, the plate-like projection electrode may have the same through-holes and projections as the projection electrodes of FIGS. 2(A) to (C). The through-holes may be formed in the same direction as the plate faces of the plate-like members in the same manner as in FIGS. 2(A) to (C). Further, in the same manner as in Figs. 2(A) to (C), it is preferable that the projection is at an end opposite to one end of the plate-like projection electrode and fixed to one end of the plate-like member, and is formed in the same manner as the plate-shaped member. The board surface protrudes in the vertical direction. The number of the through holes and the protrusions of the plate-like projection electrode is not particularly limited, but is preferably plural. The plate-like projection electrode has the above-described through hole and the protrusion, and has the same advantages as the through hole 12b and the projection 12c of Figs. 2(A) to 2(C). In other words, first, the plate-like projection electrode has the protrusion, and the plate-shaped protrusion electrode is easily brought into contact with the wiring pattern (substrate electrode) of the substrate without being disturbed by the resin. Further, since the plate-like projection electrode has the through hole, the resin can flow through the through hole, so that the flow of the resin becomes smoother, and the efficiency of resin sealing is further improved. This effect is particularly remarkable in the case of transfer forming. Further, the plate-like projection electrode is bent in the vicinity of the through hole, whereby the height (length) of the plate-like projection electrode can be reduced. Thereby, the height of the above-mentioned plate-like projecting electrode can be adjusted in accordance with the resin thickness (package thickness) of the resin-sealed electronic component. In view of this point, the height (length) of the above-mentioned plate-like projection electrode may be set to be slightly longer than the above-mentioned resin thickness (package thickness).
再者，本發明之帶有突起電極之板狀構件之製造方法，例如可列舉：藉由將板狀構件(金屬板)與突起電極接合而進行製造之方法；將金屬板用作板狀構件且對上述金屬板進行衝壓彎曲而製造突起電極之方法等，但並不限定於此。具體而言，例如亦可依據一般手法進行下述(1)~(6)所示之方法，藉此製造圖1(A)所示之帶有突起電極之板狀構 件。 Further, a method for producing a plate-like member having a protruding electrode according to the present invention includes, for example, a method of manufacturing a plate-shaped member (metal plate) by bonding a protruding electrode; and using a metal plate as a plate-like member. Further, the method of manufacturing the bump electrode by punching and bending the metal plate is not limited thereto. Specifically, for example, the method shown in the following (1) to (6) can be carried out according to a general method, whereby the plate-like structure with the protruding electrodes shown in FIG. 1(A) can be manufactured. Pieces.
(1)藉由金屬板之蝕刻而進行製造之方法 (1) Method of manufacturing by etching a metal plate
(2)藉由將金屬板與突起電極接合而進行製造之方法 (2) A method of manufacturing by bonding a metal plate to a bump electrode
(3)藉由電鑄同時成形板狀構件及突起電極之方法 (3) Method for simultaneously forming a plate-shaped member and a protruding electrode by electroforming
(4)藉由具有導電性(屏蔽性)之樹脂，同時成形板狀構件及突起電極之方法 (4) A method of simultaneously forming a plate-shaped member and a protruding electrode by a resin having conductivity (shielding property)
(5)將突起電極接合於具有導電性(屏蔽性)之樹脂(板狀構件)而進行製造之方法 (5) A method in which a bump electrode is bonded to a resin (plate member) having conductivity (shield)
(6)於具有樹脂板(plate)及突起部之構件上附加導電性(屏蔽性)塗膜之方法 (6) A method of adding a conductive (shielding) coating film to a member having a resin plate and a projection
如上所述，本發明之帶有突起電極之板狀構件之製造方法並無特別限制，例如亦可依據一般手法進行下述(7)所示之方法，藉此製造圖1(B)所示之帶有突起電極之板狀構件。 As described above, the method for producing the plate-like member having the protruding electrode of the present invention is not particularly limited. For example, the method shown in the following (7) can be carried out according to a general method, thereby producing the pattern shown in Fig. 1(B). A plate-like member having a protruding electrode.
(7)將金屬板用作板狀構件且對上述金屬板進行衝壓彎曲而製造突起電極之方法。 (7) A method of manufacturing a bump electrode by using a metal plate as a plate member and punching and bending the above metal plate.
於圖3之剖視圖中，模式性地表示使用圖1所示之帶有突起電極之板狀構件而製造之本實施例之樹脂密封電子零件之構造。如圖所示，該樹脂密封電子零件20包含基板21、電子零件31、樹脂41、板狀構件11、及突起電極12。突起電極12係固定於板狀構件11之單面，且板狀構件11與突起電極12成為一體而形成帶有突起電極之板狀構件。電子零件31係固定於基板21上，並且被樹脂41密封。於基板21上之電子零件31之配置側，形成有佈線圖案22。於圖1中已說明，突起電極12固定於板狀構件11之單面。又，突起電極12貫通上述樹脂41而與佈線圖案22接觸。 In the cross-sectional view of Fig. 3, the structure of the resin-sealed electronic component of the present embodiment manufactured using the plate-like member having the protruding electrodes shown in Fig. 1 is schematically shown. As shown in the figure, the resin-sealed electronic component 20 includes a substrate 21, an electronic component 31, a resin 41, a plate-like member 11, and a bump electrode 12. The bump electrode 12 is fixed to one surface of the plate member 11, and the plate member 11 and the bump electrode 12 are integrated to form a plate member having the bump electrode. The electronic component 31 is fixed to the substrate 21 and sealed by the resin 41. A wiring pattern 22 is formed on the arrangement side of the electronic component 31 on the substrate 21. As shown in FIG. 1, the bump electrode 12 is fixed to one side of the plate member 11. Further, the bump electrode 12 penetrates the resin 41 and comes into contact with the wiring pattern 22.
再者，板狀構件11並無特別限定，如上所述，例如可為散熱板、 或屏蔽板(遮蔽板)等。例如，於一個IC(樹脂密封電子零件)中配置有複數個晶片(電子零件)之情形時等，亦可考慮各自晶片之功能而藉由屏蔽板(遮蔽板)進行電磁屏蔽。 Further, the plate member 11 is not particularly limited, and as described above, for example, may be a heat dissipation plate, Or shielding plate (shading plate), etc. For example, when a plurality of wafers (electronic components) are disposed in one IC (resin-sealed electronic component), electromagnetic shielding can be performed by a shield plate (shield plate) in consideration of the function of the respective wafers.
又，帶有突起電極之板狀構件亦可為與一個基板(一個樹脂密封電子零件)對應之板狀構件，但如圖1(A)及(B)所示，亦可為與複數個基板(複數個樹脂密封電子零件)對應之板狀構件(矩陣式)。於矩陣式之情形時，例如將分別固定有電子零件及佈線圖案之複數個基板，與上述矩陣式之帶有突起電極之板狀構件一併進行樹脂密封。其後，可藉由切斷等，將上述矩陣式之帶有突起電極之板狀構件分割成與各基板對應之各區域。又，例如如上所述，上述突起電極之至少一者亦可為板狀突起電極。該情形時，可藉由上述板狀突起電極區劃(劃分)基板面上之、一個樹脂密封電子零件(一個製品單位)所需之範圍(或具有特定功能之範圍)。 Further, the plate-like member having the protruding electrode may be a plate-shaped member corresponding to one substrate (one resin-sealed electronic component), but as shown in FIGS. 1(A) and (B), it may be a plurality of substrates (Multiple resin-sealed electronic parts) Corresponding plate members (matrix type). In the case of a matrix type, for example, a plurality of substrates each having an electronic component and a wiring pattern are fixed and resin-sealed together with the matrix-shaped plate-shaped member having the protruding electrodes. Thereafter, the matrix-shaped plate-like member having the protruding electrodes can be divided into regions corresponding to the respective substrates by cutting or the like. Further, for example, as described above, at least one of the protruding electrodes may be a plate-like protruding electrode. In this case, the range (or range of specific functions) required for one resin to seal the electronic component (one product unit) on the substrate surface can be divided (divided) by the above-mentioned plate-like projection electrode.
又，電子零件31亦可為電子零件已被樹脂密封之形態(即樹脂密封電子零件)。於該情形時，由於樹脂密封電子零件20係對樹脂密封電子零件31進一步進行樹脂密封之形態，故而電子零件被複數次樹脂密封。 Further, the electronic component 31 may be in a form in which the electronic component has been sealed with a resin (that is, a resin-sealed electronic component). In this case, since the resin-sealed electronic component 20 is further resin-sealed to the resin-sealed electronic component 31, the electronic component is sealed with a plurality of resins.
於圖4之剖視圖中，模式性地表示圖3之電子零件之製造方法之一例。如上所述，該製造方法係使用轉移成形之製造方法。 In the cross-sectional view of Fig. 4, an example of a method of manufacturing the electronic component of Fig. 3 is schematically shown. As described above, this manufacturing method uses a manufacturing method of transfer molding.
如圖4所示，該製造方法能夠使用用於一般之轉移成形之成形模具50而進行。如圖所示，成形模具50由上模具51及下模具52形成。於上模具51之模面設置有用於成形樹脂之模腔56，於下模具52之模面設置有用於供給並安裝設置有電子零件31及佈線圖案22之基板21的基板安裝部57。 As shown in Fig. 4, this manufacturing method can be carried out using a molding die 50 for general transfer molding. As shown, the forming die 50 is formed by an upper die 51 and a lower die 52. A mold cavity 56 for molding a resin is provided on the mold surface of the upper mold 51, and a substrate mounting portion 57 for supplying and mounting the substrate 21 on which the electronic component 31 and the wiring pattern 22 are provided is provided on the mold surface of the lower mold 52.
又，於下模具52設置有用於供給樹脂材料之加料腔(孔)54，於加料腔內嵌入安裝有樹脂加壓用之柱塞(plunger)53。 Further, a feeding chamber (hole) 54 for supplying a resin material is provided in the lower mold 52, and a plunger 53 for pressurizing the resin is fitted in the charging chamber.
對使用圖4之裝置之轉移成形之方法並無特別限定，亦可按照一般之轉移成形方法進行。即，首先，向上述加料腔54內供給樹脂片(tablet)等樹脂材料，且於上述基板安裝部57供給並安裝基板21，然後將上述上下兩模具51、52合模。其次，於上述加料腔54內加熱樹脂而使其熔融化，並且上移柱塞53而對加料腔54內之熔融樹脂41進行加壓，藉此自下模具52之加料腔54內經過樹脂通道(料道、流道、澆口)55，向上模具51之模腔56內注入熔融樹脂。此時，可藉由柱塞53向模腔56內之樹脂施加所需之樹脂壓。 The method of transfer molding using the apparatus of Fig. 4 is not particularly limited, and it can also be carried out in accordance with a general transfer molding method. In other words, first, a resin material such as a resin sheet is supplied into the charging chamber 54, and the substrate 21 is supplied and mounted to the substrate mounting portion 57, and then the upper and lower molds 51 and 52 are clamped. Next, the resin is heated in the charging chamber 54 to be melted, and the plunger 53 is moved up to pressurize the molten resin 41 in the charging chamber 54, thereby passing through the resin passage from the charging chamber 54 of the lower mold 52. (Tank, runner, gate) 55, molten resin is injected into the cavity 56 of the upper mold 51. At this time, the required resin pressure can be applied to the resin in the cavity 56 by the plunger 53.
經過固化所需之必要時間後，藉由將上下兩模具51、52開模，可於模腔56內，在與腔體之形狀相對應之封裝(樹脂成形體)內對電子零件31等進行密封成形(參照圖3所示之樹脂密封電子零件20)。 After the necessary time required for curing, by opening the upper and lower molds 51, 52, the electronic component 31 and the like can be carried out in the cavity 56 in the package (resin molded body) corresponding to the shape of the cavity. Seal molding (refer to the resin-sealed electronic component 20 shown in Fig. 3).
於本實施例中，圖4所示之製造方法(圖3所示之樹脂密封電子零件20之製造)例如能夠以下述方式進行。即，首先，於下模具52之模面上(基板安裝部)，在與上模具51之模腔對應之位置配置設有電子零件31及佈線圖案22之基板21，並於基板21上，將板狀構件11及突起電極12配置成與完成品之樹脂密封電子零件20(圖3)相同之位置關係。此時，如圖4所示，使基板21之、與電子零件31之配置側相反之側與下模具52接觸，而於電子零件31之配置側之面上載置帶有突起電極之板狀構件(板狀構件11及突起電極12)，從而佈線圖案22與突起電極12之前端部物理地電性連接。 In the present embodiment, the manufacturing method shown in FIG. 4 (manufacture of the resin-sealed electronic component 20 shown in FIG. 3) can be performed, for example, in the following manner. In other words, first, on the mold surface (substrate mounting portion) of the lower mold 52, the substrate 21 on which the electronic component 31 and the wiring pattern 22 are placed is placed at a position corresponding to the cavity of the upper mold 51, and on the substrate 21, The plate member 11 and the bump electrode 12 are disposed in the same positional relationship as the resin-sealed electronic component 20 (FIG. 3) of the finished product. At this time, as shown in FIG. 4, the side of the substrate 21 opposite to the arrangement side of the electronic component 31 is brought into contact with the lower mold 52, and the plate-like member with the protruding electrode is placed on the surface on the side of the arrangement side of the electronic component 31. (the plate member 11 and the bump electrode 12), the wiring pattern 22 is physically electrically connected to the front end portion of the bump electrode 12.
再者，基板21、電子零件31、板狀構件11、及突起電極12亦可於與圖4呈上下倒置之狀態下載置於下模具52之模面上。即，亦可為板狀構件11之、與突起電極12之形成面為相反側之面與下模具52相接觸，而於上述突起電極12之形成面側配置基板21及電子零件31。 Further, the substrate 21, the electronic component 31, the plate member 11, and the bump electrode 12 can be downloaded and placed on the mold surface of the lower mold 52 in a state of being vertically inverted from FIG. In other words, the lower surface of the plate member 11 on the side opposite to the surface on which the projection electrode 12 is formed may be in contact with the lower mold 52, and the substrate 21 and the electronic component 31 may be disposed on the surface on which the projection electrode 12 is formed.
其次，如圖4所示，將上模具51與下模具52合模。此時，將上模 具51載置於下模具52上，於上模具之模腔內收容基板21、電子零件31、板狀構件11、及突起電極12，而板狀構件11抵接於模腔之頂面。 Next, as shown in FIG. 4, the upper mold 51 and the lower mold 52 are clamped. At this point, the upper mold The 51 is placed on the lower mold 52, and the substrate 21, the electronic component 31, the plate member 11, and the protruding electrode 12 are housed in the cavity of the upper mold, and the plate member 11 abuts against the top surface of the cavity.
於該狀態下，進而，如圖4所示，藉由柱塞53自下模具52之加料腔54經過樹脂通道55而向上模具51之模腔內注入樹脂41。藉此，對配置於基板21上之電子零件31與板狀構件11及突起電極12一併進行樹脂密封。如此，可製造圖3所示之樹脂密封電子零件20。 In this state, further, as shown in Fig. 4, the resin 41 is injected into the cavity of the upper mold 51 through the resin passage 55 from the charging chamber 54 of the lower mold 52 by the plunger 53. Thereby, the electronic component 31 placed on the substrate 21 is resin-sealed together with the plate-like member 11 and the bump electrode 12. Thus, the resin-sealed electronic component 20 shown in FIG. 3 can be manufactured.
再者，當向模腔56內注入樹脂時，於模腔56內，樹脂(熔融樹脂)41能夠在突起電極12之間流動，且可穿過突起電極12之孔12b內而流動。 Further, when resin is injected into the cavity 56, the resin (molten resin) 41 can flow between the protruding electrodes 12 in the cavity 56, and can flow through the holes 12b of the protruding electrodes 12.
又，於上述說明中，對將基板及帶有突起電極之板狀構件兩者均載置於下模具之模面上後進行合模之方法進行說明，但本發明不限定於此。例如，亦可將基板21供給並安裝在下模具52之模面，於上模具51之模腔頂面安裝帶有突起電極之板狀構件(板狀構件11)，並將上模具51與下模具52合模，而向模腔內注入樹脂。此時，如上所述，亦可使板狀構件11及基板21之位置上下倒置。 In the above description, a method of clamping the substrate and the plate-like member having the protruding electrodes on the mold surface of the lower mold and then performing the mold clamping will be described. However, the present invention is not limited thereto. For example, the substrate 21 may be supplied and mounted on the mold surface of the lower mold 52, and a plate-like member (plate member 11) having the protruding electrodes may be mounted on the top surface of the cavity of the upper mold 51, and the upper mold 51 and the lower mold may be attached. 52 is closed and the resin is injected into the cavity. At this time, as described above, the positions of the plate-like member 11 and the substrate 21 may be inverted upside down.
又，於轉移成形之成形(樹脂密封)時，例如亦可將模腔內等設定為特定之真空度而進行轉移成形。設定為上述特定之真空度之方法亦並無特別限定，例如亦可使用基於一般之轉移成形之方法。 Moreover, in the case of the molding of the transfer molding (resin sealing), for example, the inside of the cavity may be set to a specific degree of vacuum to perform transfer molding. The method of setting the specific degree of vacuum is not particularly limited, and for example, a method based on general transfer molding can also be used.
使用於上述轉移成形之裝置並無特別限定，例如亦可與一般之轉移成形用裝置相同。又，上述樹脂密封步驟之具體條件亦並無特別限定，例如亦可與一般之轉移成形相同。 The apparatus used for the above transfer molding is not particularly limited, and may be, for example, the same as a general transfer molding apparatus. Further, the specific conditions of the resin sealing step are not particularly limited, and may be, for example, the same as general transfer molding.
再者，為了更確實地連接突起電極12與佈線圖案22，亦可預先於突起電極12與佈線圖案22之間插入焊料。於該情形時，例如亦可於上述樹脂密封步驟後，藉由回焊等使上述焊料熔融，而接合突起電極12與佈線圖案22。於以下之各實施形態中亦相同。 Further, in order to more reliably connect the bump electrode 12 and the wiring pattern 22, solder may be inserted between the bump electrode 12 and the wiring pattern 22 in advance. In this case, for example, after the resin sealing step, the solder may be melted by reflow or the like to bond the bump electrode 12 and the wiring pattern 22. The same applies to the following embodiments.
根據本發明，以上述方式形成通孔電極，故而無需於樹脂挖出通 孔形成孔(槽或孔)。因此，例如可獲得下述(1)~(5)之效果。但，該等效果為例示，並不限定本發明。 According to the present invention, the via electrode is formed in the above manner, so that it is not necessary to excavate the resin The holes form holes (grooves or holes). Therefore, for example, the effects of the following (1) to (5) can be obtained. However, the effects are exemplified and do not limit the present invention.
(1)由於無需於樹脂挖出通孔形成孔，因此，不會因被樹脂密封之電子零件(封裝)之厚度偏差等，導致基板之佈線圖案上無法準確適當地形成通孔形成孔之深度等。 (1) Since it is not necessary to dig out the through hole forming hole in the resin, the thickness of the through hole forming hole cannot be accurately and appropriately formed on the wiring pattern of the substrate due to variations in thickness of the electronic component (package) sealed by the resin or the like. Wait.
(2)由於無需於樹脂挖出通孔形成孔，因此樹脂材料所含之填充物不會殘留於基板之佈線圖案上。 (2) Since it is not necessary to dig out the through hole forming holes in the resin, the filler contained in the resin material does not remain on the wiring pattern of the substrate.
(3)由於無需於樹脂挖出通孔形成孔，因此不會對搭載有電子零件之基板上之佈線圖案帶來損傷。 (3) Since it is not necessary to dig the through hole forming hole in the resin, the wiring pattern on the substrate on which the electronic component is mounted is not damaged.
(4)由於無需於樹脂挖出通孔形成孔，因此樹脂密封電子零件之製造條件不會受到樹脂材料之填充物密度之影響。 (4) Since the through holes are not required to be formed in the resin, the manufacturing conditions of the resin-sealed electronic parts are not affected by the packing density of the resin material.
(5)根據上述(1)~(4)之影響，能夠簡便且有效地製造樹脂密封電子零件，且良率良好。進而，基板之佈線圖案與突起電極(通孔電極)之連接等變得良好，因此亦有助於樹脂密封電子零件之性能提高、或不良品發生率之降低等。 (5) According to the influence of the above (1) to (4), it is possible to easily and efficiently manufacture the resin-sealed electronic component, and the yield is good. Further, since the connection between the wiring pattern of the substrate and the bump electrode (via electrode) is good, the performance of the resin-sealed electronic component is improved, and the incidence of defective products is lowered.
其次，使用圖5~圖8，對本發明之其他實施例進行說明。於本實施例中，對使用壓縮成形之上述樹脂密封電子零件之製造方法之一例進行說明。 Next, other embodiments of the present invention will be described with reference to Figs. 5 to 8 . In the present embodiment, an example of a method of manufacturing the above-described resin-sealed electronic component using compression molding will be described.
首先，準備壓縮成形裝置(樹脂密封電子零件之製造裝置)。圖5之步驟剖視圖中表示該壓縮成形裝置之一部分、即成形模具之一部分之構造。如圖所示，該壓縮成形裝置係以上模具101、下模具111、及中間模具(中間板)102為主要構成要素。下模具111包含下模具腔底面構件111a、下模具頂壓板(下模具主體)112及113。下模具頂壓板(下模具主體)112及113係框架狀之下模具腔側面構件。更具體而言，下模具頂 壓板112以包圍下模具腔底面構件111a之周圍之方式配置，進而，下模具頂壓板113以包圍下模具頂壓板112之外周之方式配置。於下模具腔底面構件111a與下模具頂壓板112之間，形成有空隙(吸附孔)111c。於下模具頂壓板112與下模具頂壓板113之間，形成有空隙(吸附孔)111d。如下所述，對該等空隙111c及111d藉由真空泵(未圖示)進行減壓，而可吸附脫模膜等。下模具頂壓板112上表面之高度高於下模具腔底面構件111a及下模具頂壓板113上表面之高度。藉此，形成由下模具腔底面構件111a上表面與下模具頂壓板112內周面包圍之下模具腔(凹部)111b。又，於上模具101形成有孔(貫通孔)103。如下所述，於合模後，藉由真空泵(未圖示)自孔103進行抽吸，藉此可使至少下模具腔111b內減壓。中間模具(中間板)102係框狀(環狀)之形狀，並以位於下模具外周頂壓板113之正上方之方式配置。於中間模具102之下表面與下模具外周頂壓板113之上表面之間，可把持並固定脫模膜100。於中間模具102之上表面之周邊部，安裝有具有彈性之O型環102a。又，該壓縮成形裝置係如圖所示般於圖之左右兩側具有輥104。而且，一個長條之脫模膜100之兩端分別捲繞於左右之輥104。藉由左右之輥104，可自圖5之右側向左側、或自左側向右側送出脫模膜100。藉此，如下所述，可將帶有突起電極之板狀構件於載置於脫模膜100上之狀態下，搬送至上述下模具腔位置。即，輥104相當於搬送構件，即，將上述帶有突起電極之板狀構件搬送至成形模具之模腔位置。又，雖未圖示，但該壓縮成形裝置(樹脂密封電子零件之製造裝置)進而包含樹脂載置構件。上述樹脂載置構件用於在上述帶有突起電極之板狀構件之上述突起電極形成面上載置樹脂。 First, a compression molding device (manufacturing device for resin-sealed electronic components) is prepared. The configuration of a part of the compression molding apparatus, that is, a part of the molding die, is shown in the cross-sectional view of Fig. 5. As shown in the figure, the compression molding apparatus is mainly composed of the upper mold 101, the lower mold 111, and the intermediate mold (intermediate plate) 102. The lower mold 111 includes a lower mold cavity bottom surface member 111a and a lower mold top pressure plate (lower mold main body) 112 and 113. The lower mold top pressing plates (lower mold main bodies) 112 and 113 are frame-shaped lower mold cavity side members. More specifically, the lower mold top The pressure plate 112 is disposed to surround the periphery of the lower mold cavity bottom surface member 111a, and further, the lower mold top pressure plate 113 is disposed to surround the outer periphery of the lower mold top pressure plate 112. A gap (adsorption hole) 111c is formed between the lower mold cavity bottom surface member 111a and the lower mold top pressure plate 112. A gap (adsorption hole) 111d is formed between the lower mold top pressing plate 112 and the lower mold top pressing plate 113. As described below, the voids 111c and 111d are depressurized by a vacuum pump (not shown) to adsorb a release film or the like. The height of the upper surface of the lower mold top pressing plate 112 is higher than the height of the upper surfaces of the lower mold cavity bottom surface member 111a and the lower mold bottom pressing plate 113. Thereby, a mold cavity (recess) 111b surrounded by the upper surface of the lower mold cavity bottom surface member 111a and the inner peripheral surface of the lower mold top pressing plate 112 is formed. Further, a hole (through hole) 103 is formed in the upper mold 101. As described below, after the mold clamping, suction is performed from the hole 103 by a vacuum pump (not shown), whereby at least the inside of the lower mold cavity 111b can be decompressed. The intermediate mold (intermediate plate) 102 has a frame shape (annular shape) and is disposed so as to be located directly above the lower mold outer peripheral pressing plate 113. The release film 100 can be held and fixed between the lower surface of the intermediate mold 102 and the upper surface of the lower mold outer pressing plate 113. An O-ring 102a having elasticity is attached to a peripheral portion of the upper surface of the intermediate mold 102. Further, the compression molding apparatus has a roller 104 on the left and right sides of the drawing as shown in the drawing. Further, both ends of one long strip release film 100 are wound around the left and right rolls 104, respectively. The release film 100 can be fed from the right side of FIG. 5 to the left side or from the left side to the right side by the left and right rolls 104. Thereby, as described below, the plate-like member with the protruding electrode can be conveyed to the lower mold cavity position while being placed on the release film 100. That is, the roller 104 corresponds to the conveying member, that is, the plate-shaped member having the protruding electrode is conveyed to the cavity position of the molding die. Further, although not shown, the compression molding device (manufacturing device for resin-sealed electronic components) further includes a resin mounting member. The resin mounting member is for placing a resin on the protruding electrode forming surface of the plate-like member having the protruding electrode.
其次，如圖5所示，將在單面固定有電子零件31之基板21，藉由夾持器(clamper)101a固定於上模具101之下表面。此時，基板21之電子 零件31之形成面朝下。再者，基板21及電子零件31係與實施例1相同，與實施例1相同地於基板21形成有佈線圖案22。進而，如圖5所示，藉由上述樹脂載置構件，將樹脂41載置於板狀構件11之突起電極12之固定面上(樹脂載置步驟)。再者，板狀構件11、突起電極12、及樹脂41係與實施例1相同。樹脂41之形態並無特別限定，於上述樹脂載置步驟中，較佳為，樹脂41不自板狀構件11之突起電極12固定面上灑落。例如於上述樹脂載置步驟中，亦可使片材狀之樹脂41在板狀構件11之突起電極12之固定面上層壓(積層)並按壓。進而，如圖5所示，將載置有樹脂41之板狀構件11載置於脫模膜100上。此時，如圖5所示，使板狀構件11之樹脂41之載置面(突起電極12之形成面)朝上(即，與突起電極12之形成面為相反側之面接觸於脫模膜100之上表面)。又，雖未圖示，亦可為黏著劑(接著層)存在於脫模膜100之上表面與板狀構件11之間，並且板狀構件11藉由上述黏著劑(接著層)而固定於脫模膜100之上表面。如此，若存在上述黏著劑(接著層)，例如即便如圖1(B)般於板狀構件11形成有孔13，樹脂41亦難以自孔13漏出等，因此自該優點而言較佳。進而，如圖5所示，藉由上述搬送構件，將樹脂41與板狀構件11、突起電極12、及脫模膜100一併搬送至下模具腔111b之位置。 Next, as shown in FIG. 5, the substrate 21 to which the electronic component 31 is fixed on one side is fixed to the lower surface of the upper mold 101 by a clamper 101a. At this time, the electrons of the substrate 21 The part 31 is formed face down. Further, the substrate 21 and the electronic component 31 are the same as in the first embodiment, and the wiring pattern 22 is formed on the substrate 21 in the same manner as in the first embodiment. Furthermore, as shown in FIG. 5, the resin 41 is placed on the fixing surface of the bump electrode 12 of the plate-shaped member 11 by the resin mounting member (resin mounting step). Further, the plate member 11, the bump electrode 12, and the resin 41 are the same as those of the first embodiment. The form of the resin 41 is not particularly limited. In the resin mounting step, it is preferable that the resin 41 does not sprinkle from the fixing surface of the protruding electrode 12 of the plate member 11. For example, in the resin mounting step, the sheet-like resin 41 may be laminated (laminated) on the fixing surface of the bump electrode 12 of the plate member 11 and pressed. Further, as shown in FIG. 5, the plate-like member 11 on which the resin 41 is placed is placed on the release film 100. At this time, as shown in FIG. 5, the mounting surface of the resin 41 of the plate-like member 11 (the surface on which the projection electrode 12 is formed) faces upward (that is, the surface opposite to the surface on which the projection electrode 12 is formed is in contact with the mold release). The upper surface of the film 100). Further, although not shown, an adhesive (adhesion layer) may be present between the upper surface of the release film 100 and the plate member 11, and the plate member 11 may be fixed by the above adhesive (adhesive layer). The upper surface of the release film 100. As described above, in the case where the above-mentioned adhesive (adhesive layer) is present, for example, even if the hole 13 is formed in the plate-like member 11 as shown in Fig. 1(B), the resin 41 is hard to leak from the hole 13, and the like, which is preferable. Furthermore, as shown in FIG. 5, the resin 41 is conveyed together with the plate-shaped member 11, the protrusion electrode 12, and the release film 100 to the position of the lower mold cavity 111b by the said conveyance member.
其次，如圖6之箭頭114所示，藉由真空泵(未圖示)對下模具腔底面構件111a與下模具外周頂壓板112之間之間隙(空隙111c)進行減壓。而且，如圖6之箭頭115所示，藉由真空泵(未圖示)對下模具外周頂壓板112與下模具外周頂壓板113之間之間隙(空隙111d)進行減壓。進而，使中間模具102與O型環102a一併下降，並於中間模具102之下表面與下模具外周頂壓板113之上表面之間把持脫模膜100。藉此，將脫模膜100固定於下模具外周頂壓板112、及下模具外周頂壓板113之上表面。又，可藉由下模具腔111b內之減壓114，使脫模膜100覆蓋於下模具腔 111b之面。藉此，如圖所示，可將樹脂41於載置於板狀構件11上之狀態下，載置於下模具腔之腔體面上。 Next, as shown by an arrow 114 in Fig. 6, a gap (void 111c) between the lower mold cavity bottom surface member 111a and the lower die outer peripheral pressing plate 112 is decompressed by a vacuum pump (not shown). Further, as shown by an arrow 115 in Fig. 6, a gap (void 111d) between the lower die outer peripheral pressing plate 112 and the lower die outer peripheral pressing plate 113 is reduced by a vacuum pump (not shown). Further, the intermediate mold 102 is lowered together with the O-ring 102a, and the release film 100 is held between the lower surface of the intermediate mold 102 and the upper surface of the lower mold outer peripheral pressing plate 113. Thereby, the release film 100 is fixed to the upper surface of the lower mold outer peripheral pressing plate 112 and the lower mold outer peripheral pressing plate 113. Moreover, the release film 100 can be covered in the lower mold cavity by the pressure reduction 114 in the lower mold cavity 111b. The face of 111b. Thereby, as shown in the figure, the resin 41 can be placed on the cavity surface of the lower mold cavity while being placed on the plate-like member 11.
其次，如圖7~8所示，進行上述樹脂密封步驟。再者，於圖7中，為了便於說明，省略夾持器101a之圖示。 Next, as shown in Figs. 7 to 8, the above resin sealing step is carried out. In addition, in FIG. 7, the illustration of the holder 101a is abbreviate|omitted for convenience of description.
即，首先，如圖7所示，使下模具111(下模具腔底面構件111a、與下模具外周頂壓板112及113)，與中間模具102及用於隔斷外部氣體之O型環102a一併上升。此時，藉由接合上模具101之模面與O型環102a之上表面，至少使下模具腔111b內設定成外部氣體隔斷狀態，從而能夠於上中下模具(三個模具)形成外部氣體隔斷空間部。該狀態下，如箭頭107所示，經由上模具101之孔103，可藉由真空泵(未圖示)抽吸至少下模具腔111b內(外部氣體隔斷空間部內)，對其進行減壓。進而，使下模具111與中間模具102成為一體並上升。此時，可經由脫模膜100而接合下模具外周頂壓板112之上表面(下模具111)與基板21之表面。 That is, first, as shown in Fig. 7, the lower mold 111 (the lower mold cavity bottom surface member 111a and the lower mold outer peripheral pressing plates 112 and 113) are combined with the intermediate mold 102 and the O-ring 102a for blocking the outside air. rise. At this time, by bonding the mold surface of the upper mold 101 and the upper surface of the O-ring 102a, at least the inside of the lower mold cavity 111b is set to the external gas barrier state, so that the external gas can be formed in the upper middle mold (three molds). Partition space department. In this state, as indicated by an arrow 107, the inside of the lower mold cavity 111b (inside the external gas shutoff space portion) can be sucked by the vacuum pump (not shown) through the hole 103 of the upper mold 101, and the pressure can be reduced. Further, the lower mold 111 and the intermediate mold 102 are integrated and raised. At this time, the upper surface of the lower mold outer pressing plate 112 (the lower mold 111) and the surface of the substrate 21 can be joined via the release film 100.
其次，使下模具腔底面構件111a上升。此時，使樹脂41處於具有流動性之狀態。藉此，首先，於下模具腔111b內，可將電子零件31浸漬於樹脂41中，其次，可藉由下模具腔底面構件111a對下模具腔111b內之樹脂41進行加壓。因此，於下模具腔111b內，可將安裝於基板21之電子零件31(包括突起電極及佈線圖案22)於與下模具腔111b之形狀相對應之成形封裝(樹脂成形體)41內進行壓縮成形(樹脂成形)。此時，板狀構件11處於安裝於與成形封裝41之基板21為相反側之頂面側之狀態。再者，此時，於基板21與脫模膜100之間亦可具有少許間隙(空隙)。 Next, the lower mold cavity bottom surface member 111a is raised. At this time, the resin 41 is placed in a fluid state. Thereby, first, in the lower mold cavity 111b, the electronic component 31 can be immersed in the resin 41, and secondly, the resin 41 in the lower mold cavity 111b can be pressurized by the lower die cavity bottom surface member 111a. Therefore, in the lower mold cavity 111b, the electronic component 31 (including the bump electrode and the wiring pattern 22) mounted on the substrate 21 can be compressed in the molded package (resin molded body) 41 corresponding to the shape of the lower mold cavity 111b. Forming (resin forming). At this time, the plate-like member 11 is in a state of being mounted on the top surface side opposite to the substrate 21 of the molded package 41. Further, at this time, there may be a slight gap (void) between the substrate 21 and the release film 100.
該狀態下，如箭頭107所示，經由上模具101之孔103，藉由真空泵(未圖示)抽吸至少下模具腔111b內，對其進行減壓。而且，該狀態下，與板狀構件11、突起電極12、電子零件31、及基板21一併對樹脂41進行壓縮成形，從而對電子零件31進行樹脂密封。此時，突起電極 12與形成於基板21上之佈線圖案22接觸。藉此，進行上述「樹脂密封步驟」，而可製造樹脂密封電子零件。 In this state, as indicated by an arrow 107, at least the lower mold cavity 111b is sucked through a hole 103 of the upper die 101 by a vacuum pump (not shown), and the pressure is reduced. In this state, the resin 41 is compression-molded together with the plate member 11, the bump electrode 12, the electronic component 31, and the substrate 21, and the electronic component 31 is resin-sealed. At this time, the protruding electrode 12 is in contact with the wiring pattern 22 formed on the substrate 21. Thereby, the above-mentioned "resin sealing step" is performed, and resin-sealed electronic parts can be manufactured.
再者，如上所述，當將電子零件31浸漬於下模具腔111b內之樹脂41時，樹脂41處於具有流動性之狀態。該具有流動性之樹脂41，例如可為液體樹脂(固化前之熱固性樹脂等)，或亦可為使顆粒狀、粉末狀、及漿狀等固體狀之樹脂加熱而熔融化之熔融狀態。樹脂41之加熱例如可藉由下模具腔底面構件111a之加熱等進行。又，例如與樹脂41為熱固性樹脂之情形時，亦可對下模具腔111b內之樹脂41進行加熱，且進行加壓而使其熱固化。藉此，可將電子零件31於與下模具腔之形狀相對應之樹脂成形體(封裝)內進行樹脂密封成形(壓縮成形)。如此，例如可於將板狀構件11露出於樹脂成形體(封裝)之上表面(與基板為相反側之面)之狀態下形成。 Further, as described above, when the electronic component 31 is immersed in the resin 41 in the lower mold cavity 111b, the resin 41 is in a fluid state. The fluid resin 41 may be, for example, a liquid resin (a thermosetting resin before curing) or a molten state in which a solid resin such as a pellet, a powder or a slurry is heated and melted. The heating of the resin 41 can be performed, for example, by heating of the lower mold cavity bottom surface member 111a or the like. Further, for example, when the resin 41 is a thermosetting resin, the resin 41 in the lower mold cavity 111b may be heated and pressurized to be thermally cured. Thereby, the electronic component 31 can be subjected to resin sealing molding (compression molding) in a resin molded body (package) corresponding to the shape of the lower mold cavity. In this manner, for example, the plate member 11 can be exposed in a state in which the upper surface of the resin molded body (package) is exposed (the surface opposite to the substrate).
於進行壓縮成形(樹脂密封)後、即對樹脂41進行固化後，如圖8所示，使下模具111(下模具腔底面構件111a、和下模具外周頂壓板112及113)與中間模具102及O型環102a一併下降。藉此，使下模具腔111b內開放而解除減壓狀態。此時，使下模具腔底面構件111a與下模具外周頂壓板112之間之空隙之減壓(抽真空)解除。如箭頭116所示，亦可相反地向上述空隙送入空氣。藉此，如圖8所示，脫模膜100自下模具腔底面構件111a之上表面分離。此時，下模具外周頂壓板112與113之間之空隙之減壓(抽真空)未被解除。又，中間模具102繼續處於與下模具外周頂壓板113一併把持脫模膜100之狀態。因此，如圖8所示，脫模膜100繼續吸附(固定)於下模具外周頂壓板112及113上表面。並且，基板21藉由夾持器101a繼續固定於上模具101之下表面(模面)。而且，樹脂41及板狀構件11與基板21及電子零件31一併被壓縮成形，因此，藉由下模具111之下降，脫模膜100自由基板21、板狀構件11、突起電極12、 電子零件31、及樹脂41形成之樹脂密封電子零件剝離。而且，藉由輥104，脫模膜100向圖中右方向或左方向送出(捲繞)。 After the compression molding (resin sealing), that is, after curing the resin 41, as shown in FIG. 8, the lower mold 111 (the lower mold cavity bottom surface member 111a, and the lower mold outer peripheral pressing plates 112 and 113) and the intermediate mold 102 are formed. And the O-ring 102a is lowered together. Thereby, the inside of the lower mold cavity 111b is opened, and the decompression state is released. At this time, the pressure reduction (vacuum) of the gap between the lower mold cavity bottom surface member 111a and the lower mold outer circumferential pressure plate 112 is released. As indicated by the arrow 116, air may also be supplied to the gap in the opposite direction. Thereby, as shown in FIG. 8, the release film 100 is separated from the upper surface of the lower mold cavity bottom surface member 111a. At this time, the pressure reduction (vacuum) of the gap between the lower die outer pressing plates 112 and 113 is not released. Further, the intermediate mold 102 continues to be in a state of holding the release film 100 together with the lower die outer peripheral pressing plate 113. Therefore, as shown in Fig. 8, the release film 100 continues to be adsorbed (fixed) to the upper surfaces of the lower die outer pressing plates 112 and 113. Further, the substrate 21 is continuously fixed to the lower surface (die surface) of the upper mold 101 by the holder 101a. Further, since the resin 41 and the plate member 11 are compression-molded together with the substrate 21 and the electronic component 31, the release film 100 is free from the substrate 21, the plate member 11, the bump electrode 12, and the lower mold 111. The electronic component 31 and the resin-sealed electronic component formed by the resin 41 are peeled off. Further, the release film 100 is fed (winded) in the right or left direction in the drawing by the roller 104.
於本發明中，例如如本實施例所示般，當進行電子零件之樹脂密封時，於下模具腔111b內之樹脂41(熔融樹脂、或液狀樹脂)中，存在突起電極12整體。該狀態下，如上所述，若使下模具腔底面構件111a上移，則在樹脂41中，突起電極12之前端部與基板21之佈線圖案22物理地抵接而相連接。藉此，例如與對電子零件進行樹脂密封後挖出通孔形成孔之方法相比，樹脂不會進入突起電極之前端與基板之佈線圖案之間，從而容易使突起電極之前端與基板之佈線圖案相接觸。即，有利於突起電極與基板之佈線圖案之電性連接。該點例如於板狀構件為屏蔽板之情形時在屏蔽性能面有利。又，如圖2(A)~(D)所示，例如突起電極12亦可縮小(高度變小)。即，即便突起電極12之高度略高於樹脂41厚度，當突起12c之前端抵接於佈線圖案22時，突起12c向孔12b側之空隙進行彈性移動(下降)，藉此突起電極12可縮小。藉此，如上所述，可對應於樹脂密封電子零件之樹脂厚度(封裝厚度)而對突起電極12之高度進行調整。 In the present invention, for example, as shown in the present embodiment, when the resin sealing of the electronic component is performed, the entire protruding electrode 12 is present in the resin 41 (molten resin or liquid resin) in the lower mold cavity 111b. In this state, as described above, when the lower mold cavity bottom surface member 111a is moved upward, the front end portion of the bump electrode 12 is physically and abutted to the wiring pattern 22 of the substrate 21 in the resin 41. Thereby, for example, the resin does not enter between the front end of the bump electrode and the wiring pattern of the substrate, and the wiring of the front end of the bump electrode and the substrate is facilitated, as compared with the method of peeling the through hole forming hole after resin sealing the electronic component. The patterns are in contact. That is, it is advantageous to electrically connect the bump electrodes to the wiring patterns of the substrate. This point is advantageous in the case of the shielding performance, for example, in the case where the plate member is a shield plate. Further, as shown in FIGS. 2(A) to (D), for example, the bump electrode 12 can be reduced (the height becomes small). That is, even if the height of the protruding electrode 12 is slightly higher than the thickness of the resin 41, when the front end of the projection 12c abuts against the wiring pattern 22, the projection 12c elastically moves (drops) toward the gap on the side of the hole 12b, whereby the protruding electrode 12 can be reduced . Thereby, as described above, the height of the bump electrode 12 can be adjusted in accordance with the resin thickness (package thickness) of the resin-sealed electronic component.
其次，對圖9~10進行說明。於圖5~8中，對如下方法進行說明：進行將樹脂41載置於板狀構件11上之「樹脂載置步驟」，之後，進行將帶有突起電極之板狀構件搬送至模腔位置之「搬送步驟」之方法。但，如上所述，上述樹脂載置步驟及上述搬送步驟之順序並無特別限定。圖9~10表示於上述搬送步驟後進行上述樹脂載置步驟之、上述樹脂密封電子零件之製造方法之一例。如圖9~10所示，使用該方法之壓縮成形裝置(樹脂密封電子零件之製造裝置)除了具有樹脂供給構件60以外，與圖5~8之壓縮成形裝置(樹脂密封電子零件之製造裝置)相同。但於圖9~10中，為了簡化而省略了上模具101、上模具之孔(貫通 孔)103、夾持器101a、基板21、佈線圖案22、及電子零件31。如圖9~10所示，樹脂供給構件60係由樹脂供給部61、及下部擋閘(shutter)62構成。樹脂供給部61係於上端及下端形成有開口之框狀之形狀。樹脂供給部(框)61下端之開口係藉由下部擋閘62而關閉。藉此，如圖9所示，於由樹脂供給部(框)61與下部擋閘62所包圍之空間內，可收容樹脂41。如圖9所示，該狀態下，使樹脂供給構件60進入下模具腔111b之正上方(下模具111與上模具101之間之空間內)。而且，如圖10所示，拉開下部擋閘62而打開樹脂供給部(框)61下端之開口，藉此可使樹脂41自上述開口落下，而供給(載置)至下模具腔111b內。再者，樹脂41於圖9及10中為顆粒狀樹脂，但並非特別限定於此。又，亦可於圖5~8所示之步驟之前之上述樹脂載置步驟中，與圖9~10相同，使用由樹脂供給部61、及下部擋閘62構成之樹脂供給構件60。 Next, the description of Figs. 9 to 10 will be given. In FIGS. 5 to 8, the following method will be described: a "resin mounting step" of placing the resin 41 on the plate member 11 is performed, and then the plate member having the protruding electrodes is transferred to the cavity position. The method of "transfer step". However, as described above, the order of the resin mounting step and the transport step is not particularly limited. 9 to 10 show an example of a method of manufacturing the resin-sealed electronic component in which the resin mounting step is performed after the above-described transfer step. As shown in FIGS. 9 to 10, the compression molding apparatus (manufacturing apparatus for resin-sealed electronic components) using this method has a compression molding apparatus (manufacturing apparatus for resin-sealed electronic components) of FIGS. 5 to 8 in addition to the resin supply member 60. the same. However, in FIGS. 9 to 10, the holes of the upper mold 101 and the upper mold are omitted for simplification (through The hole 103, the holder 101a, the substrate 21, the wiring pattern 22, and the electronic component 31. As shown in FIGS. 9 to 10, the resin supply member 60 is composed of a resin supply portion 61 and a lower shutter 62. The resin supply unit 61 has a frame shape in which an opening is formed at the upper end and the lower end. The opening at the lower end of the resin supply portion (frame) 61 is closed by the lower shutter 62. Thereby, as shown in FIG. 9, the resin 41 can be accommodated in the space surrounded by the resin supply part (frame) 61 and the lower shutter 62. As shown in Fig. 9, in this state, the resin supply member 60 is placed directly above the lower mold cavity 111b (in the space between the lower die 111 and the upper die 101). Further, as shown in FIG. 10, the lower shutter 62 is opened to open the opening of the lower end of the resin supply portion (frame) 61, whereby the resin 41 can be dropped from the opening and supplied (mounted) into the lower mold cavity 111b. . Further, the resin 41 is a particulate resin in FIGS. 9 and 10, but is not particularly limited thereto. Further, in the resin mounting step before the steps shown in FIGS. 5 to 8, the resin supply member 60 composed of the resin supply portion 61 and the lower shutter 62 may be used in the same manner as in FIGS. 9 to 10.
於圖9~10所示之方法中，首先，於上述搬送步驟中，除了樹脂41未載置於板狀構件11上以外，進行與圖5~6相同之步驟。藉此，如圖9所示，帶有突起電極之板狀構件(板狀構件11及突起電極12)除了未載置有樹脂41以外於與圖6相同之狀態下，(經由脫模膜100)載置於下模具腔111b之腔體面上。 In the method shown in Figs. 9 to 10, first, in the above-described transfer step, the steps similar to those in Figs. 5 to 6 are performed except that the resin 41 is not placed on the plate member 11. As a result, as shown in FIG. 9 , the plate-shaped member (the plate-shaped member 11 and the protruding electrode 12) having the protruding electrodes is in the same state as that of FIG. 6 except that the resin 41 is not placed (via the release film 100). ) is placed on the cavity surface of the lower mold cavity 111b.
接著，於上述樹脂載置步驟之前，於圖9所示之狀態下，於下模具腔內對帶有突起電極之板狀構件進行加熱(加熱步驟)。上述加熱例如可藉由下模具腔底面構件111a之加熱等進行。於該加熱步驟中，較佳為，使帶有突起電極之板狀構件充分熱膨脹。即，較佳為，於之後所進行之樹脂密封步驟中，使帶有突起電極之板狀構件不產生加熱所致之膨脹。藉此，於上述樹脂密封步驟中，突起電極12與佈線圖案22之間不易發生位置偏離，且容易對準。 Next, before the resin mounting step, the plate-like member with the protruding electrodes is heated in the lower mold cavity in the state shown in Fig. 9 (heating step). The above heating can be performed, for example, by heating of the lower mold cavity bottom surface member 111a or the like. In the heating step, it is preferred that the plate-like member having the protruding electrodes is sufficiently thermally expanded. That is, it is preferable that the plate-like member having the protruding electrode is not expanded by heating in the resin sealing step performed later. Thereby, in the resin sealing step described above, positional deviation between the bump electrode 12 and the wiring pattern 22 is less likely to occur, and alignment is easy.
進而，如圖10所示，於下模具腔111b內，將樹脂41載置於板狀構 件11之突起電極12之固定面上(樹脂載置步驟)。就該步驟而言，例如拉開下部擋閘62而打開樹脂供給部(框)61下端之開口，藉此使樹脂41自上述開口落下，而供給(載置)至下模具腔111b內。其後，以與圖7~8相同之方式，進行上述樹脂密封步驟。再者，樹脂41於圖10中為顆粒狀樹脂，但並不限定於此。例如樹脂41亦可為熱塑性樹脂(例如顆粒狀樹脂、粉末樹脂等)，藉由帶有突起電極之板狀構件之熱量而使樹脂41熔融化後，冷卻並固化。又，樹脂41亦可為固化前為液狀之熱固性樹脂，藉由帶有突起電極之板狀構件之熱量而固化。 Further, as shown in FIG. 10, the resin 41 is placed in the plate structure in the lower mold cavity 111b. The fixing surface of the bump electrode 12 of the member 11 (resin mounting step). In this step, for example, the lower shutter 62 is opened to open the opening of the lower end of the resin supply portion (frame) 61, whereby the resin 41 is dropped from the opening and supplied (placed) into the lower mold cavity 111b. Thereafter, the resin sealing step described above is carried out in the same manner as in Figs. 7 to 8. Further, the resin 41 is a particulate resin in Fig. 10, but is not limited thereto. For example, the resin 41 may be a thermoplastic resin (for example, a particulate resin or a powder resin), and the resin 41 is melted by the heat of the plate-like member having the protruding electrodes, and then cooled and solidified. Further, the resin 41 may be a thermosetting resin which is liquid before curing, and is cured by heat of a plate-like member having a protruding electrode.
又，於本實施例中，壓縮成形裝置之構造不限定於圖5~10所示之構造，可為任何構造，例如可與一般之壓縮成形裝置之構造相同或以其為基準。具體而言，上述壓縮成形裝置之構造亦可與例如日本專利特開2013-187340號公報、日本專利特開2005-225133號公報、日本專利特開2010-069656號公報、日本專利特開2007-125783號公報、及日本專利特開2010-036542號公報等所示之構造相同或以其等為基準。壓縮成形裝置亦可代替圖5~10所示之構造，而為例如與日本專利特開2013-187340號公報之圖2~6相同之構造(代替中間模具而於上模具附有薄膜壓板之構造)。使用此種壓縮成形裝置之壓縮成形模具方法(樹脂密封電子零件之製造方法)，例如可與日本專利特開2013-187340號公報所記載之方法相同地進行。又，關於樹脂供給構件，可為代替圖9及10之樹脂供給構件60之任意構造。例如上述樹脂供給構件可為日本專利特開2010-036542號公報所記載之樹脂材料之分配構件(包含樹脂材料之投入構件、計量構件、漏斗、及線性振動進料器等)。或者，上述樹脂供給構件亦可如日本專利特開2007-125783號公報所記載之樹脂供給機構般，構成為具備儲存部、計量部、投入部、供給部、擋閘、托盤、狹縫(slit)等。又，例如，關於未在圖5~10中圖示之下模具 之上下移動機構等，亦可與上述日本專利特開2005-225133號公報、日本專利特開2010-069656號公報等相同或以其等為基準，例如亦可於下模具腔底面構件之下方連接彈性構件。 Further, in the present embodiment, the configuration of the compression molding apparatus is not limited to the configuration shown in Figs. 5 to 10, and may be any configuration, for example, the same as or based on the configuration of a general compression molding apparatus. Specifically, the configuration of the above-described compression molding apparatus can be similar to, for example, Japanese Laid-Open Patent Publication No. 2013-187340, Japanese Patent Laid-Open No. Hei. No. 2005-225133, Japanese Patent Laid-Open No. 2010-069656, and Japanese Patent Publication No. 2007- The structures shown in the publication No. 125783 and Japanese Patent Laid-Open No. 2010-036542 are the same or based on them. The compression molding apparatus may be configured in the same manner as in Figs. 2 to 6 of the Japanese Patent Publication No. 2013-187340, for example, in place of the intermediate mold, and a film press plate is attached to the upper mold. ). The compression molding die method (method of manufacturing a resin-sealed electronic component) using such a compression molding apparatus can be carried out in the same manner as the method described in JP-A-2013-187340. Further, the resin supply member may be of any configuration other than the resin supply member 60 of FIGS. 9 and 10. For example, the resin supply member may be a resin material distribution member (including a resin material input member, a metering member, a funnel, a linear vibration feeder, or the like) described in JP-A-2010-036542. Alternatively, the resin supply member may be configured to include a storage portion, a metering portion, an input portion, a supply portion, a stopper, a tray, and a slit as in the resin supply mechanism described in JP-A-2007-125783. )Wait. Also, for example, regarding a mold that is not illustrated in FIGS. 5-10 The upper moving mechanism or the like may be the same as or based on the above-mentioned Japanese Patent Laid-Open Publication No. 2005-225133, and the like, and may be connected to the lower surface of the lower mold cavity bottom member, for example. Elastic member.
又，於本實施例中，使用了對下模具腔內進行減壓而進行壓縮成形之方法。但，本發明並不限定於此，亦可使用其他壓縮成形(壓模)。 Further, in the present embodiment, a method of performing compression molding on the inside of the lower mold cavity under reduced pressure is used. However, the present invention is not limited thereto, and other compression molding (compression molding) may be used.
又，如上所述，本發明之製造方法係包含上述樹脂密封步驟之製造方法，但例如亦可如本實施例所示般包含其他任意步驟。 Further, as described above, the production method of the present invention includes the production method of the resin sealing step described above, but may include any other step as shown in the embodiment, for example.
如上所述，於本實施例中，係於脫模膜上載置上述帶有突起電極之板狀構件，且於該狀態下，將上述帶有突起電極之板狀構件向成形模具之模腔內搬送。藉此，例如容易簡化板狀構件及其搬送構件之構造。又，如上所述，於本實施例中，係於將上述帶有突起電極之板狀構件載置於上述脫模膜上之狀態下，將上述樹脂載置於上述帶有突起電極之板狀構件上。藉此，例如於圖5~10中，可防止樹脂41與下模具腔底面構件111a之間之接觸，且可防止樹脂41進入下模具111與下模具外周頂壓板112之間之空隙內。 As described above, in the present embodiment, the plate-like member having the protruding electrode is placed on the release film, and in this state, the plate-like member having the protruding electrode is placed in the cavity of the molding die. Transfer. Thereby, for example, the structure of the plate-shaped member and the conveying member can be easily simplified. Further, as described above, in the present embodiment, the resin is placed on the plate with the protruding electrodes in a state where the plate-like member having the protruding electrodes is placed on the release film. On the component. Thereby, for example, in FIGS. 5 to 10, contact between the resin 41 and the lower mold cavity bottom surface member 111a can be prevented, and the resin 41 can be prevented from entering the gap between the lower mold 111 and the lower mold outer peripheral pressing plate 112.
再者，於本發明中，用於搬送上述帶有突起電極之板狀構件(載置有或未載置有樹脂之狀態)之構件(機構)並不限定於圖5~10中之構成，亦可為具有其他任意構成之搬送構件(搬送機構)。例如，於圖5~10中，上述脫模膜之形狀係藉由輥進行捲繞之長條之脫模膜，但並不限定於此。例如上述脫模膜之形狀亦可為短條之脫模膜、長條之脫模膜、輥捲之脫模膜等任意形狀。例如，將長條之脫模膜或輥捲之脫模膜，供給至本發明之製造方法之前，亦可對其進行切割(預切割)而形成短條之脫模膜。當使用經預切割之脫模膜時，上述搬送步驟(將上述帶有突起電極之板狀構件搬送至成形模具之模腔位置之步驟)亦可與例如日本專利特開2013-187340號公報之圖1及其說明相同地進行。 Further, in the present invention, the member (mechanism) for transporting the plate-like member having the protruding electrode (the state in which the resin is placed or not) is not limited to the configuration shown in Figs. 5 to 10, It may be a conveying member (transporting mechanism) having any other configuration. For example, in FIGS. 5 to 10, the shape of the release film is a long release film wound by a roll, but is not limited thereto. For example, the shape of the release film may be any shape such as a strip release film, a long release film, or a roll release film. For example, a release film of a long release film or a roll of a roll may be cut (pre-cut) to form a strip release film before being supplied to the production method of the present invention. When the pre-cut release film is used, the above-described transfer step (the step of transferring the plate-like member having the protruding electrode to the cavity position of the molding die) can also be used, for example, in Japanese Patent Laid-Open Publication No. 2013-187340 Figure 1 and its description are performed in the same manner.
其次，對本發明之又一實施例進行說明。於本實施例中，表示使用壓縮成形之製造方法之又一例。 Next, still another embodiment of the present invention will be described. In the present embodiment, another example of a manufacturing method using compression molding is shown.
圖11~14之步驟剖視圖模式性地表示本實施例之製造方法。如圖11~14所示，本實施例與實施例2(圖5~10)不同之處在於，不使用脫模膜100，且板狀構件11之形狀不同。 The step sectional views of Figs. 11 to 14 schematically show the manufacturing method of this embodiment. As shown in Figs. 11 to 14, this embodiment is different from the second embodiment (Figs. 5 to 10) in that the release film 100 is not used and the shape of the plate member 11 is different.
於本實施例中，板狀構件11之周邊部隆起，而中央部成為樹脂收容部。更具體而言，如圖11~14所示，板狀構件11之周邊部向板狀構件11之突起電極12之固定面側隆起，而形成壁狀構件11b。藉此，板狀構件11之中央部形成為樹脂收容部11c。即，藉由使板狀構件11之周邊部隆起而形成壁狀構件11b，形成為托盤模具(上表面敞開之箱型)之形狀。而且，板狀構件11之中央部形成為，被板狀構件11之主體(底面部)及壁狀構件(周邊部)11b包圍之樹脂收容部(上述托盤模具形狀之凹部)11c。再者，如圖11~14所示，突起電極12固定於板狀構件11主體(底面部)之上述樹脂收容部(凹部)11c側之面。又，壁狀構件11b係板狀構件11之一部分，並且與突起電極12不同。壁狀構件11b例如亦可作為散熱構件、或用於屏蔽電磁波之屏蔽構件發揮功能。於板狀構件11具有壁狀構件11b之情形時，突起電極12之形狀為任意，並無特別限定，但較佳為，例如突起電極12之至少一者係上述板狀突起電極。於本實施例中，由於具有樹脂收容部11c，因此，即便不使用脫模膜，亦可防止樹脂41與下模具腔底面構件之間之接觸，且可防止樹脂41進入下模具外周頂壓板與下模具腔底面構件之間之空隙內。因此，可藉由省略脫模膜而降低成本，且可省略黏貼或吸附脫模膜之步驟，故而可提高樹脂密封電子零件之製造效率。 In the present embodiment, the peripheral portion of the plate-like member 11 is swelled, and the central portion is a resin accommodating portion. More specifically, as shown in FIGS. 11 to 14, the peripheral portion of the plate-like member 11 is swelled toward the fixing surface side of the protruding electrode 12 of the plate-like member 11, and the wall-shaped member 11b is formed. Thereby, the center part of the plate-shaped member 11 is formed in the resin accommodation part 11c. In other words, the wall member 11b is formed by bulging the peripheral portion of the plate member 11, and is formed into a shape of a tray mold (box type in which the upper surface is opened). Further, the central portion of the plate-like member 11 is formed as a resin accommodating portion (the recessed portion of the tray mold shape) surrounded by the main body (bottom portion) of the plate-shaped member 11 and the wall-shaped member (peripheral portion) 11b. Further, as shown in FIGS. 11 to 14, the projecting electrode 12 is fixed to the surface of the main body (bottom portion) of the plate-like member 11 on the side of the resin accommodating portion (recessed portion) 11c. Further, the wall member 11b is a part of the plate member 11 and is different from the protruding electrode 12. The wall member 11b can also function as a heat radiating member or a shield member for shielding electromagnetic waves, for example. In the case where the plate-like member 11 has the wall-shaped member 11b, the shape of the protruding electrode 12 is arbitrary, and is not particularly limited, but preferably, for example, at least one of the protruding electrodes 12 is the above-mentioned plate-shaped protruding electrode. In the present embodiment, since the resin accommodating portion 11c is provided, the contact between the resin 41 and the lower mold cavity bottom surface member can be prevented even if the release film is not used, and the resin 41 can be prevented from entering the lower mold outer peripheral pressing plate and In the gap between the bottom member of the lower mold cavity. Therefore, the cost can be reduced by omitting the release film, and the step of adhering or adsorbing the release film can be omitted, so that the manufacturing efficiency of the resin-sealed electronic component can be improved.
於本實施例中，如圖11~14所示，包含成形模具(上模具及下模具) 之壓縮成形裝置除了不具有脫模膜之輥及中間模具以外，可使用與實施例2相同之壓縮成形裝置。具體而言，如圖11~14所示，上述壓縮成形裝置係以上模具1001、和下模具1011為主要構成要素。下模具1011包含下模具腔底面構件1011a、下模具頂壓板(下模具主體)1012。下模具頂壓板(下模具主體)1012係框架狀之下模具腔側面構件。更具體而言，下模具頂壓板1012以包圍下模具腔底面構件1011a之周圍之方式配置。於下模具腔底面構件1011a與下模具頂壓板1012之間具有空隙(吸附孔)1011c。如圖12及13之箭頭1014所示，藉由真空泵(未圖示)對該空隙1011c進行減壓，而吸附板狀構件。又，於壓縮成形後，如圖14之箭頭1016所示，相反地自該空隙1011c送入空氣，藉此可使上述板狀構件脫離。下模具頂壓板1012之上表面之高度高於下模具腔底面構件1011a之上表面之高度。藉此，形成被下模具腔底面構件1011a之上表面與下模具頂壓板1012之內周面包圍之下模具腔(凹部)1011b。又，於上模具1001形成開孔(貫通孔)1003。藉此，如圖13之箭頭1007所示，進行合模後，藉由真空泵(未圖示)自孔1003抽吸，藉此可對至少下模具腔1011b內進行減壓。於下模具之頂壓板1012上表面之周邊部，安裝有具有彈性之O型環1012a。又，雖未圖示，但該壓縮成形裝置(樹脂密封電子零件之製造裝置)進而包含樹脂載置構件及搬送構件。上述樹脂載置構件用於將樹脂載置於上述帶有突起電極之板狀構件之上述突起電極之形成面上。上述搬送構件用於將上述帶有突起電極之板狀構件搬送至成形模具之模腔位置。 In this embodiment, as shown in FIGS. 11 to 14, the forming mold (upper mold and lower mold) is included. The compression molding apparatus can use the same compression molding apparatus as that of the second embodiment except for the roller and the intermediate mold which do not have a release film. Specifically, as shown in FIGS. 11 to 14, the above-described compression molding apparatus is a main component of the upper mold 1001 and the lower mold 1011. The lower mold 1011 includes a lower mold cavity bottom surface member 1011a and a lower mold top pressure plate (lower mold main body) 1012. The lower mold top pressing plate (lower mold main body) 1012 is a frame-shaped lower mold cavity side member. More specifically, the lower mold top pressing plate 1012 is disposed to surround the periphery of the lower mold cavity bottom surface member 1011a. There is a gap (adsorption hole) 1011c between the lower mold cavity bottom surface member 1011a and the lower mold top pressure plate 1012. As shown by an arrow 1014 in Figs. 12 and 13, the void 1011c is depressurized by a vacuum pump (not shown) to adsorb the plate-like member. Further, after the compression molding, as shown by an arrow 1016 in Fig. 14, air is supplied from the gap 1011c in the opposite direction, whereby the plate-like member can be detached. The height of the upper surface of the lower mold top plate 1012 is higher than the height of the upper surface of the lower mold cavity bottom member 1011a. Thereby, a mold cavity (concave portion) 1011b surrounded by the upper surface of the lower mold cavity bottom surface member 1011a and the inner peripheral surface of the lower mold top pressing plate 1012 is formed. Further, an opening (through hole) 1003 is formed in the upper mold 1001. Thereby, as shown by an arrow 1007 in Fig. 13, after the mold clamping is performed, the vacuum pump (not shown) is sucked from the hole 1003, whereby the inside of at least the lower mold cavity 1011b can be decompressed. An O-ring 1012a having elasticity is attached to a peripheral portion of the upper surface of the top plate 1012 of the lower mold. Further, although not shown, the compression molding device (manufacturing device for resin-sealed electronic components) further includes a resin mounting member and a conveying member. The resin mounting member is for placing a resin on a surface on which the projection electrode of the plate-like member having the protruding electrode is formed. The conveying member is configured to convey the plate-shaped member having the protruding electrode to a cavity position of the molding die.
如圖11~14所示，本實施例之製造方法不使用脫模膜，而是將在樹脂收容部11c載置樹脂41之板狀構件11搬送至下模具腔1011b之位置。又，如圖12之箭頭1014所示，代替使脫模膜吸附於下模具及下模具外周頂壓板，而藉由真空泵(未圖示)對下模具外周頂壓板1012與下 模具腔底面構件1011a之間之空隙1011c進行減壓，使板狀構件11吸附於下模具腔1011b(下模具腔底面構件1011a之上表面及下模具外周頂壓板1012之內周面)。除此之外，本實施例(圖11~14)之製造方法可與實施例2之圖5~8相同地進行。 As shown in FIGS. 11 to 14, the manufacturing method of the present embodiment does not use a release film, but conveys the plate-like member 11 on which the resin 41 is placed in the resin accommodating portion 11c to the lower mold cavity 1011b. Further, as shown by an arrow 1014 in Fig. 12, instead of adsorbing the release film to the lower die and the lower die outer pressing plate, the lower die outer pressing plate 1012 and the lower die are pressed by a vacuum pump (not shown). The gap 1011c between the mold cavity bottom surface members 1011a is decompressed, and the plate-like member 11 is attracted to the lower mold cavity 1011b (the upper surface of the lower mold cavity bottom surface member 1011a and the inner peripheral surface of the lower mold outer circumferential top plate 1012). Except for this, the manufacturing method of the present embodiment (Figs. 11 to 14) can be performed in the same manner as in Figs. 5 to 8 of the second embodiment.
更具體而言，圖13~14所示之步驟(樹脂密封步驟)例如可如下所述般進行。即，首先，使下模具1011自圖12之狀態上移，並使上模具1001之模面抵接於下模具之O型環1012a之上端。此時，於上模具面(上模具1001之模面)與下模具面(下模具1011之模面)之間保持所需間隔。即，於上模具1001與下模具1011完全合模之前，進行保持兩者之間之所需間隔之中間合模。於進行該中間合模期間，藉由O型環1012a使至少上下兩個模面間及腔體空間部處於外部氣體隔斷狀態，從而可形成外部氣體隔斷空間部。又，此時，如圖13之箭頭1007所示，自上模具之孔1003強制地抽吸上述外部氣體隔斷空間部內之空氣並將其排出，藉此可使上述外部氣體隔斷空間部內設定為特定之真空度。其次，閉合上模具面(上模具1001之模面)與下模具面(下模具1011之模面)，藉此進行完全合模。進而，使腔體底面構件1011a上移。再者，此時使樹脂41處於具有流動性之狀態。藉此，如圖13所示，接合突起電極12與佈線圖案22，且將電子零件31浸漬於樹脂41，進而，對下模具腔1011b內之樹脂41進行加壓。藉此，安裝於基板11之電子零件31可於所需形狀之樹脂41(固化樹脂)內進行壓縮成形(密封成形)。更具體而言，於下模具腔1011b內，將安裝於基板21之電子零件31(包含突起電極及佈線圖案22)壓縮成形(樹脂成形)於與下模具腔1011b之形狀相對應之成形封裝(樹脂成形體)41內。此時，板狀構件11處於安裝於與成形封裝41之基板21為相反側之頂面側之狀態。而且，經過樹脂41之固化所需之時間後，如圖14所示，將上下兩模具開模。具體而言，使下模具1011(下 模具腔底面構件1011a、及下模具頂壓板1012)與O型環1012a一併下降。藉此，開放下模具腔1011b內而解除減壓。此時，解除下模具腔底面構件1011a與下模具頂壓板1012之間之空隙之減壓(抽真空)狀態。如箭頭1016所示，亦可相反地向上述空隙送入空氣。藉此，可獲得具備具有樹脂收容部11c之板狀構件11、基板21、電子零件31、佈線圖案22、及突起電極12之樹脂密封電子零件(成形品)。 More specifically, the steps (resin sealing step) shown in FIGS. 13 to 14 can be carried out, for example, as follows. That is, first, the lower mold 1011 is moved upward from the state of Fig. 12, and the mold surface of the upper mold 1001 is brought into contact with the upper end of the O-ring 1012a of the lower mold. At this time, a desired interval is maintained between the upper mold surface (the mold surface of the upper mold 1001) and the lower mold surface (the mold surface of the lower mold 1011). That is, before the upper mold 1001 and the lower mold 1011 are completely closed, an intermediate mold clamping is performed to maintain a desired interval therebetween. During the intermediate mold clamping, at least the upper and lower mold faces and the cavity space portion are in an external gas barrier state by the O-ring 1012a, whereby the external gas shutoff space portion can be formed. Further, at this time, as shown by an arrow 1007 in FIG. 13, the air in the outside air shutoff space portion is forcibly sucked from the hole 1003 of the upper mold and discharged, whereby the outside air partition space portion can be set to be specific. The degree of vacuum. Next, the upper mold surface (the mold surface of the upper mold 1001) and the lower mold surface (the mold surface of the lower mold 1011) are closed, thereby performing complete mold clamping. Further, the cavity bottom member 1011a is moved up. Further, at this time, the resin 41 is in a state of having fluidity. Thereby, as shown in FIG. 13, the bump electrode 12 and the wiring pattern 22 are bonded, the electronic component 31 is immersed in the resin 41, and the resin 41 in the lower mold cavity 1011b is further pressurized. Thereby, the electronic component 31 mounted on the substrate 11 can be compression-molded (sealed and formed) in the resin 41 (cured resin) of a desired shape. More specifically, in the lower mold cavity 1011b, the electronic component 31 (including the bump electrode and the wiring pattern 22) mounted on the substrate 21 is compression-molded (resin-molded) into a molded package corresponding to the shape of the lower mold cavity 1011b ( Inside the resin molded body 41. At this time, the plate-like member 11 is in a state of being mounted on the top surface side opposite to the substrate 21 of the molded package 41. Further, after the time required for the curing of the resin 41, as shown in Fig. 14, the upper and lower molds are opened. Specifically, the lower mold 1011 is made (below The mold cavity bottom member 1011a and the lower die top plate 1012) are lowered together with the O-ring 1012a. Thereby, the inside of the lower mold cavity 1011b is opened to release the pressure reduction. At this time, the decompression (vacuum) state of the gap between the lower mold cavity bottom surface member 1011a and the lower mold top pressing plate 1012 is released. As indicated by the arrow 1016, air may also be supplied to the gap in the opposite direction. Thereby, a resin-sealed electronic component (molded article) including the plate-like member 11 having the resin containing portion 11c, the substrate 21, the electronic component 31, the wiring pattern 22, and the bump electrode 12 can be obtained.
又，本實施例並不限定於此，例如亦可與實施例2之圖9~10相同，於上述搬送步驟後進行上述樹脂載置步驟。該情形時，與實施例2相同，較佳為於上述樹脂載置步驟之前，於下模具腔內加熱(加熱步驟)帶有突起電極之板狀構件。又，於該加熱步驟中，基於與實施例2相同之理由，較佳為使帶有突起電極之板狀構件充分熱膨脹。 Further, the present embodiment is not limited thereto. For example, similarly to FIGS. 9 to 10 of the second embodiment, the resin mounting step may be performed after the above-described transfer step. In this case, as in the second embodiment, it is preferable to heat (heat step) the plate-like member having the protruding electrodes in the lower mold cavity before the resin mounting step. Further, in the heating step, for the same reason as in the second embodiment, it is preferable that the plate-like member having the protruding electrode is sufficiently thermally expanded.
再者，於本發明中，上述板狀構件之形狀並不限定於本實施例及實施例1~2之形狀，可為任何形狀。例如上述板狀構件之形狀除了突起電極固定於單面以外，亦可與專利文獻2(日本專利特開2013-187340)所例示之板狀構件為相同形狀。於圖15及16分別表示變更板狀構件形狀之製造方法(變化例)之一例。如圖15所示，板狀構件11除了於與突起電極12之固定面為相反側之面(圖15中，與下模具腔底面構件111a對向側之面)具有散熱片(fin)11a以外，與圖5~8(實施例2)相同，且可使用與圖5~8相同之壓縮成形裝置而以與實施例2相同之方式進行。如圖16所示，板狀構件11除了於與突起電極12之固定面為相反側之面(圖16中，與下模具腔底面構件1011a對向側之面)具有散熱片11a以外，與圖11~14(實施例3)相同，且可使用與圖11~14相同之壓縮成形裝置而以與實施例3相同之方式進行。再者，如圖16所示，於圖16之壓縮成形裝置中，於下模具腔底面構件1011a之上表面，形成有可與散熱片11a之凹凸形狀嵌合之凹凸形狀。若形成此種形狀，則板狀構件11於下模具 腔內穩定，且下模具腔底面構件1011a之上表面不易受到散熱片所致之損傷。又，如圖16所示，較佳為散熱片11a形成為無法於下模具頂壓板1012與板狀構件11之間形成間隙之形狀。若使用此種形狀，則於下模具腔內，可有效地進行利用減壓之抽吸(箭頭1014)。 Furthermore, in the present invention, the shape of the plate-like member is not limited to the shape of the embodiment and the examples 1 and 2, and may be any shape. For example, the shape of the above-mentioned plate-shaped member may be the same as that of the plate-shaped member exemplified in Patent Document 2 (Japanese Patent Laid-Open Publication No. 2013-187340), except that the protruding electrode is fixed to one surface. An example of a manufacturing method (variation) of changing the shape of the plate member is shown in Figs. 15 and 16 , respectively. As shown in Fig. 15, the plate-like member 11 has a fin 11a other than the surface on the opposite side to the fixed surface of the bump electrode 12 (the surface on the opposite side to the lower mold cavity bottom surface member 111a in Fig. 15). 5 to 8 (Example 2), the same compression molding apparatus as that of Figs. 5 to 8 can be used in the same manner as in the second embodiment. As shown in FIG. 16, the plate-like member 11 has a heat sink 11a except for a surface opposite to the fixed surface of the bump electrode 12 (the surface opposite to the lower mold cavity bottom surface member 1011a in Fig. 16). 11 to 14 (Example 3) are the same, and can be carried out in the same manner as in Example 3, using the same compression molding apparatus as that of Figs. Further, as shown in Fig. 16, in the compression molding apparatus of Fig. 16, a concave-convex shape which can be fitted to the uneven shape of the fins 11a is formed on the upper surface of the lower mold cavity bottom surface member 1011a. If such a shape is formed, the plate member 11 is in the lower mold The cavity is stable, and the upper surface of the lower mold cavity bottom member 1011a is not easily damaged by the heat sink. Further, as shown in FIG. 16, it is preferable that the fins 11a are formed in a shape in which a gap cannot be formed between the lower mold top pressing plate 1012 and the plate-like member 11. When such a shape is used, suction by decompression can be efficiently performed in the lower mold cavity (arrow 1014).
其次，對本發明之又一實施例進行說明。於本實施例中，表示與使用壓縮成形之製造方法不同之又一例。 Next, still another embodiment of the present invention will be described. In the present embodiment, another example is shown which is different from the manufacturing method using compression molding.
圖17之剖視圖模式性地表示本實施例之製造方法。如圖17所示，該製造方法使用下模具121、上模具(安裝器(mounter))122、及真空腔室123而進行。下模具121之上表面為平坦面，且可載置樹脂密封電子零件之基板。真空腔室123為與樹脂密封電子零件之形狀相對應之筒狀之形狀，且可載置於上述樹脂密封電子零件之基板上。上模具122可嵌合於真空腔室123之內壁。 Fig. 17 is a cross-sectional view schematically showing the manufacturing method of the embodiment. As shown in FIG. 17, this manufacturing method is performed using the lower mold 121, the upper mold (mounter) 122, and the vacuum chamber 123. The upper surface of the lower mold 121 is a flat surface, and a substrate on which the resin seals the electronic component can be placed. The vacuum chamber 123 has a cylindrical shape corresponding to the shape of the resin-sealed electronic component, and can be placed on the substrate of the resin-sealed electronic component. The upper mold 122 can be fitted to the inner wall of the vacuum chamber 123.
於本實施例之製造方法中，首先，將液狀樹脂(熱固性樹脂)41印刷於在單面固定有電子零件31及佈線圖案22之基板21之、上述電子零件31及佈線圖案22之固定面上。其次，使於板狀構件11之單面固定有突起電極12之帶有突起電極之板狀構件之突起電極12，貫通液狀樹脂41而與佈線圖案22接觸。藉此，基板21、電子零件31、樹脂41、板狀構件11、及突起電極12以與完成品之樹脂密封電子零件20(圖3)相同之位置關係之方式配置。而且，例如如圖17所示，使基板21、電子零件31、樹脂41、板狀構件11、及突起電極12以成為上述位置關係(配置)之方式載置於下模具121之上表面。此時，如圖17所示，使基板21之、與電子零件31之配置側相反之側與下模具121之上表面接觸，且於電子零件31配置側之面上載置帶有突起電極之板狀構件(板狀構件11及突起電極12)。 In the manufacturing method of the present embodiment, first, a liquid resin (thermosetting resin) 41 is printed on a fixed surface of the electronic component 31 and the wiring pattern 22 on the substrate 21 on which the electronic component 31 and the wiring pattern 22 are fixed on one side. on. Then, the bump electrode 12 having the plate-like member having the bump electrode on the one surface of the plate member 11 is fixed to the wiring pattern 22 through the liquid resin 41. Thereby, the substrate 21, the electronic component 31, the resin 41, the plate-like member 11, and the bump electrode 12 are disposed in the same positional relationship as the resin-sealed electronic component 20 (FIG. 3) of the finished product. Further, for example, as shown in FIG. 17, the substrate 21, the electronic component 31, the resin 41, the plate-like member 11, and the bump electrode 12 are placed on the upper surface of the lower mold 121 so as to have the above-described positional relationship (arrangement). At this time, as shown in FIG. 17, the side of the substrate 21 opposite to the arrangement side of the electronic component 31 is brought into contact with the upper surface of the lower mold 121, and the plate with the protruding electrode is placed on the surface on the side where the electronic component 31 is disposed. The member (the plate member 11 and the protruding electrode 12).
其次，於基板21之上表面周邊部之、未配置(載置)有樹脂41之部分，載置真空腔室123。藉此，電子零件31、樹脂41、板狀構件11、及突起電極12之周圍被真空腔室123包圍。而且，自電子零件31、樹脂41、板狀構件11、及突起電極12之上方，使上模具122下降，並嵌合於真空腔室123之內壁。藉此，於被板狀構件11、真空腔室123、及上模具122包圍而密閉之內部空間內，收容電子零件31、樹脂41、及突起電極12。進而，藉由真空泵(未圖示)對上述內部空間內進行減壓。藉此，電子零件31、樹脂41、板狀構件11、及突起電極12被上模具122按壓。而且，於該狀態下，加熱液狀樹脂(熱固性樹脂)41而使其固化，藉此與板狀構件11及突起電極12一併對電子零件31進行樹脂密封。例如可藉由下模具121之加熱進行液狀樹脂41之加熱。藉此，可製造與圖3所示之樹脂密封電子零件20相同之樹脂密封電子零件。 Next, the vacuum chamber 123 is placed on the portion of the peripheral surface of the upper surface of the substrate 21 where the resin 41 is not disposed (mounted). Thereby, the periphery of the electronic component 31, the resin 41, the plate-shaped member 11, and the protrusion electrode 12 is surrounded by the vacuum chamber 123. Further, the upper mold 122 is lowered from the upper surface of the electronic component 31, the resin 41, the plate member 11, and the bump electrode 12, and fitted to the inner wall of the vacuum chamber 123. Thereby, the electronic component 31, the resin 41, and the bump electrode 12 are housed in the sealed internal space surrounded by the plate member 11, the vacuum chamber 123, and the upper mold 122. Further, the inside of the internal space is decompressed by a vacuum pump (not shown). Thereby, the electronic component 31, the resin 41, the plate-shaped member 11, and the bump electrode 12 are pressed by the upper mold 122. In this state, the liquid resin (thermosetting resin) 41 is heated and solidified, whereby the electronic component 31 is resin-sealed together with the plate-like member 11 and the bump electrode 12. Heating of the liquid resin 41 can be performed, for example, by heating of the lower mold 121. Thereby, the same resin-sealed electronic component as the resin-sealed electronic component 20 shown in FIG. 3 can be manufactured.
再者，於本實施例中，例如亦可省略利用真空腔室之減壓。但，例如於板狀構件和樹脂之間不允許存在空氣或間隙之情形時等，較佳為利用真空腔室進行減壓。又，於省略利用真空腔室之減壓之情形時，利用上模具(安裝器)之按壓可進行、亦可不進行。 Further, in the present embodiment, for example, the pressure reduction by the vacuum chamber may be omitted. However, for example, when air or a gap is not allowed between the plate member and the resin, it is preferable to perform pressure reduction using a vacuum chamber. Further, when the decompression using the vacuum chamber is omitted, the pressing by the upper mold (mounter) may or may not be performed.
又，圖18之剖視圖模式性地表示本實施例之製造方法之變化例。圖18之製造方法，除了以塗佈代替印刷而將液狀樹脂(熱固性樹脂)41a塗佈於基板21之、上述電子零件31、及佈線圖案22固定面上，以及板狀構件11於與突起電極12之固定面為相反側之面(圖18中，與上模具122對向側之面)具有散熱片11a以外，與圖17之製造方法相同。再者，於圖17之製造方法中，亦可與圖18相同地，使用具有散熱片之帶有突起電極之板狀構件，亦可與此相反地，於圖18之製造方法中，與圖17相同地，使用不具有散熱片之帶有突起電極之板狀構件。又，例如於圖17或18中，亦可代替樹脂之印刷或塗佈，藉由薄板樹脂之層壓、樹 脂之旋轉塗佈等，於基板21之、上述電子零件31及佈線圖案22之固定面上，配置樹脂41或41a。 Moreover, the cross-sectional view of Fig. 18 schematically shows a modification of the manufacturing method of the present embodiment. In the manufacturing method of FIG. 18, a liquid resin (thermosetting resin) 41a is applied to the substrate 21, the electronic component 31, and the wiring pattern 22 fixed surface, and the plate member 11 and the protrusion are applied by coating instead of printing. The surface on the opposite side of the fixed surface of the electrode 12 (the surface on the opposite side to the upper mold 122 in Fig. 18) has the fins 11a, and is the same as the manufacturing method of Fig. 17. Further, in the manufacturing method of FIG. 17, a plate-like member having a protruding electrode having a heat sink may be used in the same manner as in FIG. 18, or vice versa, in the manufacturing method of FIG. In the same manner, a plate-like member having a protruding electrode without a heat sink is used. Moreover, for example, in FIG. 17 or 18, it is also possible to replace the printing or coating of the resin, by laminating the thin resin, and the tree. The resin 41 or 41a is placed on the fixed surface of the substrate 21 and the electronic component 31 and the wiring pattern 22 by spin coating or the like.
其次，對本發明之進而又一實施例進行說明。於本實施例中，表示使用壓縮成形之製造方法之進而又一例。 Next, still another embodiment of the present invention will be described. In the present embodiment, still another example of the manufacturing method using compression molding is shown.
於本實施例中，對使用已預切割之脫模膜、及具有貫通孔(樹脂供給部)之矩形狀之框(框體)之樹脂密封電子零件之製造方法及壓縮成形裝置(電子零件之樹脂密封裝置)進行說明。本實施例中，於上述帶有突起電極之板狀構件載置有樹脂材料(顆粒狀樹脂)之狀態下，搬送至下模具腔之位置，供給並安裝至下模具腔內。 In the present embodiment, a method of manufacturing a resin-sealed electronic component using a pre-cut release film and a rectangular frame (frame) having a through hole (resin supply portion) and a compression molding device (electronic component) The resin sealing device will be described. In the present embodiment, the plate-like member having the protruding electrode is placed in a state where the resin material (particulate resin) is placed, and is conveyed to the lower mold cavity, and is supplied and attached to the lower mold cavity.
本實施例中，於已預切割之脫模膜上配置框體，於框體貫通孔(樹脂供給部)內之脫模膜上配置載置有顆粒狀樹脂之帶有突起電極之板狀構件。藉此，可防止上述顆粒狀樹脂自上述帶有突起電極之板狀構件上灑落。再者，於本實施例中，對樹脂材料為顆粒狀樹脂之情形進行說明，但顆粒狀樹脂以外之任意樹脂(例如粉末狀樹脂、液狀樹脂、板狀樹脂、片材狀樹脂、薄膜狀樹脂、及漿狀樹脂等)亦可同樣地進行。 In the present embodiment, the frame body is placed on the pre-cut release film, and the plate-like member with the protruding electrode on which the particulate resin is placed is placed on the release film in the frame through-hole (resin supply portion). . Thereby, it is possible to prevent the above-mentioned particulate resin from being scattered from the above-mentioned plate-like member having the protruding electrodes. In the present embodiment, a case where the resin material is a particulate resin will be described, but any resin other than the particulate resin (for example, a powdery resin, a liquid resin, a plate resin, a sheet resin, or a film) The resin, the slurry resin, and the like can also be carried out in the same manner.
以下，使用圖19~22，對本實施例進行更具體之說明。 Hereinafter, the present embodiment will be described more specifically with reference to Figs. 19 to 22 .
首先，使用圖19，對本實施例之壓縮成形裝置(樹脂密封電子零件之製造裝置)進行說明。圖19係表示作為上述壓縮成形裝置之一部分之、成形模具(金屬模具)之一部分之構造之模式圖。又，圖19表示向該成形模具供給樹脂材料之前之開模狀態。 First, a compression molding apparatus (manufacturing apparatus for resin-sealed electronic components) of the present embodiment will be described with reference to Fig. 19 . Fig. 19 is a schematic view showing the structure of a part of a molding die (metal mold) which is a part of the above-described compression molding apparatus. Moreover, Fig. 19 shows a mold opening state before the supply of the resin material to the molding die.
圖19之壓縮成形裝置與實施例3(圖11~14)相比，於成形模具包含上模具及下模具之方面相同，但於包含上模具外部氣體隔斷構件及下模具外部氣體隔斷構件之方面不同。更具體而言，如下所述。即，如圖19所示，圖19之壓縮成形裝置，以上模具2001、及與上模具對向配 置之下模具2011為主要構成要素。上模具2001以自上模具基板2002垂下之狀態設置。於上模具基板2002上之上模具2001之外周位置，設置有上模具外部氣體隔斷構件2004。於上模具外部氣體隔斷構件2004之上端面(被上模具基板2002及上模具外部氣體隔斷構件2004夾住之部分)，設置有用於隔斷外部氣體之O型環2004a。又，於上模具外部氣體隔斷構件2004之下端面，亦設置有用於隔斷外部氣體之O型環2004b。又，於上模具基板2002，設置有用於強制地抽吸模具內之空間部之空氣並使其排出之孔2003。於上模具2001之模面(下表面)設置有基板安裝部2001a，其中上述基板安裝部2001a用於使安裝有電子零件31之基板21以電子零件31之安裝面側朝下之狀態供給並安裝(裝配)。基板21例如可藉由夾持器(未圖示)等安裝於基板安裝部2001a。再者，與上述各實施例相同，於基板21之電子零件31安裝面設置有佈線圖案22。 The compression molding apparatus of Fig. 19 is the same as the third embodiment (Figs. 11 to 14) in that the molding die includes the upper mold and the lower mold, but the upper mold outer gas partitioning member and the lower mold outer gas partitioning member are included. different. More specifically, it is as follows. That is, as shown in FIG. 19, the compression molding apparatus of FIG. 19, the above mold 2001, and the upper mold are aligned The mold 2011 is the main component. The upper mold 2001 is disposed in a state of being suspended from the upper mold substrate 2002. An upper mold outer gas shutoff member 2004 is disposed at an outer peripheral position of the upper mold 2001 on the upper mold substrate 2002. An O-ring 2004a for blocking the outside air is provided on the upper end surface of the upper mold outer gas shutoff member 2004 (the portion sandwiched by the upper mold substrate 2002 and the upper mold outer gas shutoff member 2004). Further, an O-ring 2004b for blocking the outside air is also provided on the lower end surface of the upper mold outer gas shutoff member 2004. Further, on the upper mold substrate 2002, a hole 2003 for forcibly sucking and discharging the air in the space portion in the mold is provided. A substrate mounting portion 2001a for supplying and mounting the substrate 21 on which the electronic component 31 is mounted with the mounting surface side of the electronic component 31 facing downward is provided on the mold surface (lower surface) of the upper mold 2001. (assembly). The substrate 21 can be attached to the board mounting portion 2001a by, for example, a holder (not shown). Further, similarly to the above-described respective embodiments, the wiring pattern 22 is provided on the mounting surface of the electronic component 31 of the substrate 21.
又，下模具2011包含下模具腔底面構件2011a、下模具外周頂壓板2012、及彈性構件2012a。進而，就下模具2011而言，於其模面包含作為用於樹脂成形之空間之腔體(下模具腔)2011b。下模具腔底面構件2011a設置於下模具腔2011b之下方。下模具頂壓板(下模具之框架、腔體側面構件)2012以包圍下模具腔底面構件2011a周圍之方式配置。下模具頂壓板2012上表面之高度高於下模具腔底面構件2011a上表面之高度。藉此，形成被下模具腔底面構件2011a之上表面與下模具頂壓板2012之內周面包圍之下模具腔(凹部)2011b。於下模具腔底面構件2011與下模具外周頂壓板2012之間，形成有空隙(吸附孔)2011c。如下所述，藉由真空泵(未圖示)對該空隙2011c進行減壓，而可吸附脫模膜等。又，下模具2011及下模具頂壓板2012以載置於下模具基板2010之狀態設置。於下模具頂壓板2012與下模具基板2010之間設置有用於緩衝之彈性構件2012a。進而，於下模具基板2010上之下模具外周頂壓板 2012之外周位置設置有下模具外部氣體隔斷構件2013。於下模具外部氣體隔斷構件2013之下端面(被下模具基板2010及下模具外部氣體隔斷構件2013夾住之部分)，設置有用於隔斷外部氣體之O型環2013a。下模具外部氣體隔斷構件2013配置於上模具外部氣體隔斷構件2004及用於隔斷外部氣體之O型環2004b之正下方。藉由具有如上之構造，於上下兩模具進行合模時，藉由接合包含O型環2004a及2004b之上模具外部氣體隔斷構件2004、與包含O型環2013a之下模具外部氣體隔斷構件2013，可使至少下模具腔內處於外部氣體隔斷狀態。 Further, the lower mold 2011 includes a lower mold cavity bottom member 2011a, a lower mold outer peripheral pressing plate 2012, and an elastic member 2012a. Further, in the lower mold 2011, a cavity (lower mold cavity) 2011b as a space for resin molding is included on the die surface thereof. The lower mold cavity bottom surface member 2011a is disposed below the lower mold cavity 2011b. The lower mold top pressing plate (the lower mold frame, the cavity side member) 2012 is disposed to surround the lower mold cavity bottom surface member 2011a. The height of the upper surface of the lower mold top pressing plate 2012 is higher than the height of the upper surface of the lower mold cavity bottom surface member 2011a. Thereby, the mold cavity (concave portion) 2011b surrounded by the upper surface of the lower mold cavity bottom surface member 2011a and the inner circumferential surface of the lower mold top pressing plate 2012 is formed. A gap (adsorption hole) 2011c is formed between the lower mold cavity bottom member 2011 and the lower die outer peripheral pressing plate 2012. As described below, the void 2011c is decompressed by a vacuum pump (not shown) to adsorb a release film or the like. Moreover, the lower mold 2011 and the lower mold top pressing plate 2012 are provided in a state of being placed on the lower mold substrate 2010. An elastic member 2012a for cushioning is disposed between the lower mold top pressing plate 2012 and the lower mold substrate 2010. Further, on the lower mold substrate 2010, the outer peripheral pressing plate of the mold The lower mold outer gas shutoff member 2013 is provided at the outer peripheral position of 2012. The O-ring 2013a for blocking the outside air is provided on the lower end surface of the lower mold outer gas shutoff member 2013 (the portion sandwiched by the lower mold substrate 2010 and the lower mold outer gas shutoff member 2013). The lower mold outer gas shutoff member 2013 is disposed directly under the upper mold outer gas shutoff member 2004 and the O-ring 2004b for blocking the outside air. By clamping the upper and lower molds by the above configuration, by joining the mold outer gas partitioning member 2004 including the O-rings 2004a and 2004b, and the mold outer gas partitioning member 2013 including the O-ring 2013a, At least the lower mold cavity can be placed in an external gas barrier state.
其次，對使用該壓縮成形裝置之本實施例之樹脂密封電子零件之製造方法進行說明。即，首先，如圖19所示，於上模具2001之模面(基板安裝部2001a)，如上所述安裝基板31。進而，如圖19所示，使用具有貫通孔之矩形狀之框(框體)70，向下模具腔2011b內供給顆粒狀樹脂41。更具體而言，如圖19所示，於預先切斷(預切割)成所需長度之脫模膜100上，載置框體70。此時，已預切割之脫模膜100亦可吸附並固定於框體70之下表面。其次，自框體70之貫通孔上側之開口部(樹脂供給部)，將於板狀構件11之單面固定有突起電極12之帶有突起電極之板狀構件載置於脫模膜100上。此時，使突起電極12處於朝上(與脫模膜100相反側)之狀態。再者，於本實施例中，帶有突起電極之板狀構件與實施例2(圖5~10)相同，不具有壁狀構件11b及樹脂收容部(凹部)11c。進而，於板狀構件11之突起電極12之固定面上，以平坦化之狀態供給(載置)顆粒狀樹脂41。藉此，如圖19所示，向被板狀構件11及框體70包圍之空間內供給樹脂41，而可形成由板狀構件11及框體70包圍之空間載置於脫模膜100上之「樹脂供給框體」。進而，如圖19所示，搬送上述樹脂供給框體，且使其進入處於開模狀態之上模具2001與下模具2011之間(下模具腔2011b之位置)。 Next, a method of manufacturing the resin-sealed electronic component of the present embodiment using the compression molding apparatus will be described. That is, first, as shown in FIG. 19, the substrate 31 is mounted on the mold surface (substrate mounting portion 2001a) of the upper mold 2001 as described above. Further, as shown in FIG. 19, a rectangular frame (frame) 70 having a through hole is used, and the granular resin 41 is supplied into the lower mold cavity 2011b. More specifically, as shown in FIG. 19, the frame body 70 is placed on the release film 100 which has been previously cut (pre-cut) to a desired length. At this time, the pre-cut release film 100 can also be adsorbed and fixed to the lower surface of the frame 70. Then, the plate-like member having the protruding electrode on which the protruding electrode 12 is fixed to one surface of the plate member 11 is placed on the release film 100 from the opening (resin supply portion) on the upper side of the through hole of the frame 70. . At this time, the bump electrode 12 is placed in a state of being upward (opposite to the release film 100). Further, in the present embodiment, the plate-like member having the projecting electrode is the same as that of the second embodiment (Figs. 5 to 10), and does not have the wall member 11b and the resin accommodating portion (concave portion) 11c. Further, the particulate resin 41 is supplied (mounted) on the fixed surface of the bump electrode 12 of the plate-like member 11 in a flattened state. As a result, as shown in FIG. 19, the resin 41 is supplied into the space surrounded by the plate member 11 and the frame 70, and the space surrounded by the plate member 11 and the frame 70 can be placed on the release film 100. "Resin supply frame". Further, as shown in FIG. 19, the resin supply frame is conveyed and placed between the mold 2001 and the lower mold 2011 (position of the lower mold cavity 2011b) in the mold opening state.
接著，於下模具2011之模面上載置上述樹脂供給框體。此時，如圖20所示，由框體70與下模具外周頂壓板2012夾住脫模膜100，並使下模具腔2011b之開口部(下模具表面)與框體70之貫通孔下側之開口部吻合。進而，如圖20之箭頭2014所示，藉由真空泵吸附下模具之吸附孔2011c，對其進行減壓。藉此，如圖20所示，於下模具腔2011b之腔體表面吸附並披覆脫模膜100，將粒狀樹脂41供給並安裝至下模具腔2011b內。進而，如圖20所示，藉由加熱下模具2011使樹脂41熔融。之後，於藉由減壓2014使脫模膜100吸附於下模具腔2011b之腔體表面之狀態下去除框體70。 Next, the resin supply frame is placed on the mold surface of the lower mold 2011. At this time, as shown in FIG. 20, the mold release film 100 is sandwiched between the frame body 70 and the lower mold outer peripheral pressing plate 2012, and the opening portion (lower mold surface) of the lower mold cavity 2011b and the lower side of the through hole of the frame body 70 are formed. The opening is matched. Further, as shown by an arrow 2014 in Fig. 20, the suction hole 2011c of the lower mold is sucked by a vacuum pump, and the pressure is reduced. Thereby, as shown in FIG. 20, the release film 100 is adsorbed and coated on the surface of the cavity of the lower mold cavity 2011b, and the granular resin 41 is supplied and mounted in the lower mold cavity 2011b. Further, as shown in FIG. 20, the resin 41 is melted by heating the lower mold 2011. Thereafter, the frame 70 is removed in a state where the release film 100 is adsorbed to the surface of the cavity of the lower mold cavity 2011b by the pressure reduction 2014.
其次，將上下兩模具合模。首先，如圖21所示，進行使基板面(基板21之電子零件31之固定面)與下模具表面保持所需間隔之狀態之中間合模。即，首先，於自圖20之構造中去除框體70之狀態下，使下模具2011側上移。藉此，如圖21所示，使上模具外部氣體隔斷構件2004及下模具外部氣體隔斷構件2013於夾住O型環2004b之狀態下閉合。藉此，如圖21所示，形成被上模具2001、下模具2011、上模具外部氣體隔斷構件2004、及下模具外部氣體隔斷構件2013包圍之外部氣體隔斷空間部。於該狀態下，如圖21之箭頭2007所示，經由上模具基板2002之孔2003，藉由真空泵(未圖示)抽吸至少上述外部氣體隔斷空間部，對其進行減壓，而設定成特定之真空度。 Next, the upper and lower molds are clamped. First, as shown in FIG. 21, an intermediate mold clamping is performed in a state in which the substrate surface (the fixed surface of the electronic component 31 of the substrate 21) and the lower mold surface are maintained at a desired interval. That is, first, in a state where the frame 70 is removed from the structure of Fig. 20, the lower mold 2011 side is moved up. Thereby, as shown in FIG. 21, the upper mold outer gas shutoff member 2004 and the lower mold outer gas shutoff member 2013 are closed in a state in which the O-ring 2004b is sandwiched. Thereby, as shown in FIG. 21, the external gas partition space portion surrounded by the upper mold 2001, the lower mold 2011, the upper mold outer gas shutoff member 2004, and the lower mold outer gas shutoff member 2013 is formed. In this state, as shown by an arrow 2007 in FIG. 21, at least the external air shutoff space portion is sucked through a hole 2003 of the upper mold substrate 2002 by a vacuum pump (not shown), and is depressurized to be set to Specific vacuum.
進而，如圖22所示，接合基板面與下模具表面而進行完全合模。即，自圖21之狀態，使下模具2011進一步上移。藉此，如圖22所示，下模具頂壓板2012之上表面介隔(隔著)脫模膜100抵接於供給並安裝至上模具2001之基板21之基板面(電子零件31之固定面)。而且，使下模具腔底面構件2011a與作為其他構件之下模具基板2010及下模具2011一併進一步上移。此時，使樹脂41處於具有流動性之狀態。藉此， 如圖22所示，突起電極12之前端抵接於(接觸)基板21之佈線圖案22，並且於下模具腔2011b內，使電子零件31浸漬於樹脂41中，進而，對樹脂41進行加壓。再者，此時，如圖22所示，彈性構件2012a、及O型環2004a、2004b、2013a收縮而發揮緩衝墊之功能。藉此，如上所述般對樹脂41進行加壓而實現壓縮成形。而且，使樹脂41固化。藉此，於板狀構件11之突起電極12固定面、與基板21之佈線圖案22形成面之間，藉由樹脂41而密封電子零件31，且可使突起電極12與佈線圖案22接觸(樹脂密封步驟)。於經過樹脂41固化所需之時間後，以與實施例2或3(圖8或14)相同之順序將上下兩模具開模。藉此，於下模具腔2011b內，可獲得由基板21、電子零件31、佈線圖案22、樹脂41、突起電極12、及板狀構件11構成之成形品(樹脂密封電子零件)。 Further, as shown in Fig. 22, the substrate surface and the lower mold surface are joined to perform complete mold clamping. That is, from the state of Fig. 21, the lower mold 2011 is further moved up. Thereby, as shown in FIG. 22, the upper surface of the lower mold top pressing plate 2012 is interposed (separated) by the release film 100 to abut against the substrate surface (fixed surface of the electronic component 31) supplied to and mounted on the substrate 21 of the upper mold 2001. . Further, the lower mold cavity bottom surface member 2011a is further moved upward together with the lower mold base substrate 2010 and the lower mold 2011 as the other members. At this time, the resin 41 is placed in a fluid state. With this, As shown in FIG. 22, the front end of the bump electrode 12 abuts (contacts) the wiring pattern 22 of the substrate 21, and in the lower mold cavity 2011b, the electronic component 31 is immersed in the resin 41, and further, the resin 41 is pressurized. . At this time, as shown in FIG. 22, the elastic member 2012a and the O-rings 2004a, 2004b, and 2013a contract and function as a cushion. Thereby, the resin 41 is pressurized as described above to achieve compression molding. Moreover, the resin 41 is cured. Thereby, between the fixing surface of the protruding electrode 12 of the plate-like member 11 and the surface formed by the wiring pattern 22 of the substrate 21, the electronic component 31 is sealed by the resin 41, and the protruding electrode 12 can be brought into contact with the wiring pattern 22 (resin Sealing step). After the time required for the resin 41 to be cured, the upper and lower molds were opened in the same order as in Example 2 or 3 (Fig. 8 or 14). Thereby, in the lower mold cavity 2011b, a molded article (resin-sealed electronic component) composed of the substrate 21, the electronic component 31, the wiring pattern 22, the resin 41, the bump electrode 12, and the plate-shaped member 11 can be obtained.
再者，於本實施例中，壓縮成形裝置(樹脂密封電子零件之製造裝置)之構造並不限定於圖19~22之構造，例如亦可與一般之壓縮成形裝置之構造相同或以其為基準。具體而言，亦可與例如日本專利特開2013-187340號公報、日本專利特開2005-225133號公報、日本專利特開2010-069656號公報、日本專利特開2007-125783號公報、及日本專利特開2010-036542號公報等所記載之構造相同或以其等為基準。 Further, in the present embodiment, the configuration of the compression molding device (manufacturing device for resin-sealed electronic components) is not limited to the configuration of Figs. 19 to 22, and may be the same as or the same as that of a general compression molding device. Benchmark. In particular, Japanese Patent Laid-Open No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The structures described in Japanese Laid-Open Patent Publication No. 2010-036542 or the like are the same or based on them.
本發明並不限定於上述實施例，於不脫離本發明之主旨之範圍內，可視需要任意且適當地組合、變更、或選擇採用。 The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selected as needed within the scope of the gist of the present invention.
例如，帶有突起電極之板狀構件之上述突起電極之形狀並不限定於圖2所示之形狀，可為任意形狀。作為一例，如上所述，上述突起電極中，至少一部分亦可為板狀之形狀。而且，於基板面上，亦可藉由上述板狀之電極區劃與一個樹脂密封電子零件(一個製品單位)對應之所需範圍。 For example, the shape of the above-mentioned protruding electrode of the plate-like member having the protruding electrode is not limited to the shape shown in Fig. 2, and may be any shape. As an example, as described above, at least a part of the protruding electrodes may have a plate shape. Further, on the substrate surface, the desired range corresponding to one resin-sealed electronic component (one product unit) may be defined by the above-described plate-shaped electrode division.
於不脫離本發明技術思想之範圍內，本發明可以其他形態實施。 於本申請中揭示之實施形態應被理解為舉例說明，而不應解釋為限制本發明。本發明之範圍係由隨附之申請專利範圍界定，而不限定於以上之描述。所有於與申請專利範圍均等之含義或範圍內之變更均包含於本發明。 The present invention may be embodied in other forms without departing from the spirit and scope of the invention. The embodiments disclosed in the present application are to be understood as illustrative and not restrictive. The scope of the present invention is defined by the scope of the appended claims, and is not limited to the above description. All changes that come within the meaning and range of equivalence of the scope of the invention are included in the invention.
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| JP2014090753A JP6017492B2 (en) | 2014-04-24 | 2014-04-24 | Manufacturing method of resin-encapsulated electronic component, plate-like member with protruding electrode, and resin-encapsulated electronic component |
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| JP6639931B2 (en) * | 2016-02-02 | 2020-02-05 | Ｔｏｗａ株式会社 | Apparatus and method for manufacturing electronic component, and electronic component |
| WO2017145331A1 (en) | 2016-02-25 | 2017-08-31 | 三菱電機株式会社 | Semiconductor package and module |
| US10797025B2 (en) | 2016-05-17 | 2020-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Advanced INFO POP and method of forming thereof |
| JP6723185B2 (en) * | 2017-03-29 | 2020-07-15 | Ｔｏｗａ株式会社 | Mold, resin molding apparatus, resin molding method, and resin molded article manufacturing method |
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Also Published As
| Publication number | Publication date |
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| KR101703184B1 (en) | 2017-02-06 |
| JP2015211091A (en) | 2015-11-24 |
| JP6017492B2 (en) | 2016-11-02 |
| CN105006438A (en) | 2015-10-28 |
| US9728426B2 (en) | 2017-08-08 |
| KR20150123142A (en) | 2015-11-03 |
| CN105006438B (en) | 2018-06-08 |
| US20150311095A1 (en) | 2015-10-29 |
| TW201541530A (en) | 2015-11-01 |
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