TWI573200B - Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member - Google Patents

Description

Method for manufacturing electronic component, plate member with protruding electrode, electronic component, and manufacturing method of plate member with protruding electrode

The present invention relates to a method of manufacturing an electronic component, a plate member having a protruding electrode, an electronic component, and a method of manufacturing a plate member having a protruding electrode.

In many cases, an electronic component such as an IC (integrated circuit) or a semiconductor wafer is formed and used as an electronic component sealed by a resin.

An electronic component in which the wafer resin is sealed (also referred to as an electronic component or a package as a finished product; hereinafter, simply referred to as "electronic component") may be formed by embedding a via electrode in a resin. The via electrode can be formed, for example, in the resin of the electronic component (package) sealed by the resin, and a hole or a groove for forming a through hole is formed from the top surface of the package (hereinafter referred to as "through hole forming hole" And using the above-described through-hole electrode forming material (for example, plating, shielding material, etc.) to fill the above-mentioned through hole forming holes. The through hole forming hole can be formed, for example, by irradiating laser light from the top of the package toward the resin. Further, as another method for forming the via electrode, a method is proposed in which the protrusion of the metal structure having the protrusion is resin-sealed together with the semiconductor wafer, and then the portion other than the protrusion of the metal structure is removed. Method (Patent Document 1). to In this case, in the electronic component, only the protrusion of the metal structure remains in a resin-sealed state, and this becomes a via electrode.

On the other hand, the electronic component is formed together with a heat dissipating plate (heat sink) for discharging heat generated by the wafer, or a plate member such as a shield plate (shield plate) for shielding electromagnetic waves emitted from the wafer. Case (for example, Patent Documents 2 and 3).

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2012-015216

Patent Document 2: Japanese Patent Laid-Open Publication No. 2013-187340

Patent Document 3: Japanese Patent Laid-Open Publication No. 2007-287937

In the method of forming a via hole in a resin, for example, there are problems such as the following (1) to (5).

(1) Due to variations in thickness of the electronic component (package), the depth of the via hole forming hole or the like may not be accurately formed on the wiring pattern of the substrate.

(2) The filler contained in the resin material is likely to remain on the wiring pattern of the substrate.

(3) The wiring pattern on the substrate on which the wafer is mounted may be damaged as the hole is formed in the resin through the hole.

(4) In the case of the above (3), if the packing density of the resin material is different, it is necessary to change the processing conditions for the laser for forming the hole through the hole in the resin. That is, the control of the formation conditions of the through hole forming holes is complicated.

(5) Due to the influence of the above (1) to (4), it is difficult to improve the yield of the electronic component (package).

On the other hand, in the method of Patent Document 1, after the protrusion of the metal structure is resin-sealed, it is necessary to remove the portion other than the protrusion of the metal structure. The steps are divided. Therefore, the manufacturing steps of the electronic component (package) become complicated and result in wasted material.

Further, in any of the above methods, after the via electrodes are formed, it is necessary to form the plate-like members by plating or the like, which causes complicated steps.

Further, Patent Documents 2 and 3 describe an electronic component having a plate-like member and a method of manufacturing the same, but there is no description of a method for solving the problems of the above methods when forming a via electrode.

Thus, the technique of easily and efficiently manufacturing an electronic component having both a via electrode and a plate member does not exist.

Accordingly, it is an object of the present invention to provide a method of manufacturing an electronic component capable of easily and efficiently manufacturing an electronic component having both a via electrode and a plate member, a plate member having a bump electrode, an electronic component, and A method of manufacturing a plate member of a protruding electrode.

In order to achieve the above object, a method of manufacturing an electronic component according to the present invention (hereinafter, simply referred to as "the manufacturing method of the present invention") is characterized in that it is a method of manufacturing an electronic component in which a wafer resin is sealed, and is to be manufactured. The electronic component includes a substrate, a wafer, a resin, a plate member, and a bump electrode, and an electronic component in which a wiring pattern is formed on the substrate, wherein the manufacturing method includes a resin sealing step of sealing the wafer with the resin. In the resin sealing step, the wafer is sealed with the resin between the fixing surface of the protruding electrode of the plate-like member having the protruding electrode and the surface of the wiring pattern of the substrate, and the protruding electrode and the protruding electrode are The wiring pattern is in contact with the plate-shaped member having the protruding electrode, wherein the protruding electrode is fixed to one surface of the plate-shaped member, and the protruding electrode includes a deformable deformable portion.

The plate-like member with a protruding electrode according to the present invention is a plate-like member having a protruding electrode according to the above-described manufacturing method of the present invention, characterized in that the protruding electrode is fixed to one surface of the plate-shaped member.

The electronic component of the present invention is characterized in that it is an electronic component in which a wafer resin is sealed, and the electronic component includes a substrate, a wafer, a resin, and the above-described plate-like member having a protruding electrode of the present invention, and the wafer is disposed on the substrate And being sealed by the resin, a wiring pattern is formed on the arrangement side of the wafer on the substrate, and the protruding electrode is in contact with the wiring pattern through the resin.

According to the present invention, there is provided a method of manufacturing an electronic component capable of easily and efficiently manufacturing an electronic component having both a via electrode (protrusion electrode) and a plate member, a plate member having a protruding electrode, an electronic component, and a tape A method of manufacturing a plate member having a protruding electrode.

10‧‧‧Plate-like members with protruding electrodes

11‧‧‧ Plate-like members

11a‧‧‧Heatsink

11b‧‧‧Wall members

11c‧‧‧Resin housing

12‧‧‧ protruding electrode

12a‧‧‧Under the protruding electrode

12b‧‧‧through hole

12c‧‧‧ Protrusion

12A‧‧‧Deformation Department

12B‧‧‧Rigid Department

13‧‧‧ hole

20‧‧‧Electronic parts (recycled finished electronic parts)

20'‧‧‧Electronic parts (electronic parts that have been sealed with resin)

21‧‧‧Substrate

22‧‧‧Wiring pattern

31‧‧‧ wafer (electronic parts before resin sealing)

41‧‧‧Resin (sealing resin)

41a‧‧‧Resin (resin material such as liquid resin or granular resin)

41b‧‧‧Resin (liquid resin)

50‧‧‧ Forming die

51‧‧‧上模

52‧‧‧Down

53‧‧‧Plunger

54‧‧‧feeding cavity (hole)

55‧‧‧Resin channel

56‧‧‧ cavity

57‧‧‧Substrate setting department

60‧‧‧Resin supply unit

61‧‧‧Resin Supply Department

62‧‧‧lower gate

70‧‧‧Rectangle frame (frame)

100‧‧‧ release film

101‧‧‧上模

101a‧‧‧ fixture

102‧‧‧中模(middle board)

102a‧‧‧O-ring

103‧‧‧ hole in the upper die (through hole)

104‧‧‧ Roll

107‧‧‧Decompression (vacuum)

111‧‧‧Down

111a‧‧‧ Lower cavity cavity bottom member

111b‧‧‧ lower cavity

111c, 111d‧‧‧ gap (adsorption hole)

112, 113‧‧‧ lower die outer member (lower die body)

114, 115‧‧‧Based on decompression adsorption

116‧‧‧ Air

121‧‧‧下模

122‧‧‧Upper (installer)

123‧‧‧vacuum chamber

1001‧‧‧上模

1001a‧‧‧ fixture

1003‧‧‧ hole in the upper die (through hole)

1007‧‧‧Decompression (vacuum)

1011‧‧‧Down

1011a‧‧‧ Lower cavity cavity bottom member

1011b‧‧‧ lower cavity

1011c, 1011d‧‧‧ gap (adsorption hole)

1012‧‧‧ Lower mold outer member (lower mold body)

1012a‧‧‧O-ring

1014‧‧‧Based on decompression adsorption

1016‧‧‧ Air

2001‧‧‧上模

2001a‧‧‧Substrate Setup Department

2002‧‧‧Upper mold base plate

2003‧‧‧ hole in the upper die (through hole)

2004‧‧‧External air partition member

2004a, 2004b‧‧ O-ring

2007‧‧‧Decompression (vacuum)

2010‧‧‧ Lower mold base plate

2011‧‧‧Model

2011a‧‧‧ Lower cavity cavity bottom member

2011b‧‧‧ lower cavity

2011c‧‧‧Void (adsorption hole)

2012‧‧‧Down die peripheral components

2012a‧‧‧Flexible components

2013‧‧‧Under-mold air partition member

2013a‧‧‧O-ring

2014‧‧‧Based on decompression adsorption

1(A) and 1(B) are perspective views showing an example of a structure of a plate-like member having a protruding electrode of the present invention.

2(A) and 2(B) are perspective views showing the structure of a protruding electrode in a plate-like member having a protruding electrode of the present invention.

3(A) to 3(D) are perspective views showing another example of the structure of the protruding electrode in the plate-like member having the protruding electrode of the present invention.

4(A) to 4(D) are perspective views showing still another example of the structure of the protruding electrode in the plate-like member having the protruding electrode of the present invention.

5(A) to 5(C) are schematic cross sectional views showing an example of a structure of an electronic component of the present invention and a manufacturing procedure thereof.

Fig. 6 is a cross-sectional view showing, by way of example, a manufacturing method of the present invention by transfer molding.

Fig. 7 is a cross-sectional view showing, by way of example, a step of one of the manufacturing methods of the present invention by compression molding.

Fig. 8 is a cross-sectional view showing another step in the same manufacturing method as Fig. 7 as an example.

Fig. 9 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 7.

Fig. 10 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 7.

Figure 11 is a cross-sectional view showing another step in the manufacturing method of the present invention by compression molding.

Fig. 12 is a cross-sectional view showing another step in the same manufacturing method as Fig. 11 as an example.

Fig. 13 is a cross-sectional view showing, by way of example, a step of still another example of the manufacturing method of the present invention by compression molding.

Fig. 14 is a cross-sectional view showing another step in the same manufacturing method as Fig. 13 as an example.

Fig. 15 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 13;

Fig. 16 is a cross-sectional view showing still another step in the same manufacturing method as Fig. 13;

Fig. 17 is a cross-sectional view showing, by way of example, a step of still another example of the manufacturing method of the present invention by compression molding.

Fig. 18 is a cross-sectional view showing, by way of example, a step of still another example of the manufacturing method of the present invention by compression molding.

Fig. 19 is a cross-sectional view showing still another example of the manufacturing method of the present invention.

Fig. 20 is a cross-sectional view showing still another example of the manufacturing method of the present invention.

Fig. 21 is a cross-sectional view showing, by way of example, a step of still another example of the manufacturing method of the present invention by compression molding.

Fig. 22 is a cross-sectional view showing, by way of example, a step of still another example of the manufacturing method of the present invention by compression molding.

Fig. 23 is a cross-sectional view showing still another example of the manufacturing method of the present invention by compression molding.

Fig. 24 is a cross-sectional view showing still another example of the manufacturing method of the present invention using compression molding.

Next, the present invention will be described in further detail by way of examples. However, the present invention is not limited to the following description. In the present invention, as described below, the "plate-like member having the protruding electrode having the deformed portion" composed of the protruding electrode having the deformed portion and the plate-like member is used. In the present invention, the term "wafer" refers to an electronic component before resin sealing. Specifically, for example, a wafer-shaped electronic component such as an IC or a semiconductor wafer can be cited. In the present invention, the electronic component before the resin sealing is referred to as a "wafer" for convenience, and this is to distinguish the electronic component after sealing with the resin. However, the "wafer" in the present invention is not particularly limited as long as it is an electronic component before resin sealing, and may not be a wafer-shaped electronic component. Further, in the present invention, when it is simply referred to as "electronic component", unless otherwise specified, it refers to an electronic component (as a finished electronic component) in which the wafer resin is sealed.

In the manufacturing method of the present invention, the number of the protruding electrodes is arbitrary, and is not particularly limited, and may be one or plural. The shape of the above-mentioned protruding electrode is not particularly limited. Further, when the number of the protruding electrodes is plural, the shapes may be the same or different from each other. For example, at least one of the protruding electrodes may be a lightning-shaped protruding electrode. When the lightning-shaped protruding electrode is viewed from a direction parallel to a surface direction of the plate-like member, at least the deformed portion is bent into a lightning shape, whereby the deformed portion is contracted and deformed in a direction perpendicular to a surface direction of the plate-shaped member. can. In the above-described lightning-shaped protruding electrode, at least the deformed portion may have a lightning shape as described above, and a portion other than the deformed portion may be a lightning bolt. More specifically, the shape of the above-described lightning-shaped protruding electrode can be, for example, the shapes of (A) to (B) of FIG. 2 or (A) to (C) of FIG. 4 described below. Further, for example, at least one of the protruding electrodes may be a protruding electrode of the through hole. More specifically, the through hole on the protruding electrode with the through hole is a through hole penetrating in a direction parallel to the surface direction of the plate member (a direction parallel to the plate surface), and the periphery of the through hole Can be The deformation portion that is contracted and deformed in a direction perpendicular to the surface direction of the plate-like member may be used. The protruding electrode with the through hole may have a protrusion that protrudes in a direction perpendicular to a plate surface of the plate-like member at one end opposite to one end of the plate-shaped member. More specifically, the shape of the protruding electrode with the through hole may be, for example, the shapes of (A) to (C) of FIG. 3 or (A) to (C) of FIG. 4 described below. Further, in the above-described plate-shaped member having a protruding electrode according to the present invention, the deformation of the deformed portion of the protruding electrode may be elastic deformation or plastic deformation. That is, the deformed portion may be an elastically deformable portion (elastic portion) or a plastically deformable portion (plastic portion). The deformation is elastic deformation or plastic deformation, and is determined, for example, according to the material of the projection electrode or the like.

In the manufacturing method of the present invention, at least one of the protruding electrodes may be a columnar protruding electrode having a columnar shape. Examples of the shape of the columnar projection electrode include a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, and a truncated cone shape. Further, for example, in the case of using a columnar protruding electrode, the entire protruding electrode may be a deformed portion that can be contracted and deformed in a direction perpendicular to the surface direction of the plate member. Further, in this case, for example, the cylindrical side surface may be integrally expanded in a flexible barrel shape.

Further, in the manufacturing method of the present invention, at least one of the protruding electrodes may be a plate-like protruding electrode. In this case, the plurality of wafers are plural. In the resin sealing step, the substrate is divided into a plurality of regions by the plate-like projection electrodes, and the wafer may be resin-sealed in each of the regions. Further, preferably, the plate-like protruding electrode has a through hole and a protrusion, and the through hole penetrates the plate-shaped protruding electrode in a direction parallel to a plate surface of the plate-shaped member, and the periphery of the through hole is The deformation portion which is contracted and deformed in a direction in which the surface direction of the plate member is perpendicular to the plate is formed at one end of the plate-like projection electrode opposite to one end of the plate-shaped member, and the protrusion is formed on the plate and the plate member. The surface protrudes in the direction perpendicular to the surface.

In the manufacturing method of the present invention, the plate member is not particularly limited, but is preferably a heat sink (heat sink) or a shield plate (shield plate). The above shielding plate can be used, for example, for shielding from The part of the electromagnetic wave released by the above wafer. Preferably, the heat dissipation plate has a heat sink on one side opposite to the fixing surface of the protruding electrode. Further, the shape of the plate-shaped member is not particularly limited except that the protruding electrode is fixed. For example, in the case of the above-mentioned plate-like member heat-dissipating plate, in addition to the above-mentioned protruding electrode, the above-mentioned heat-dissipating plate is used for one or a plurality of shapes for which heat-dissipating efficiency is good (for example, a fin (fin) )))). The material of the plate-like member is not particularly limited, and in the case of the plate-like member-based heat dissipation plate or the shield plate, for example, a metal material, a ceramic material, a resin, a metal deposition film, or the like can be used. The metal deposition film is not particularly limited, and may be, for example, a metal deposition film obtained by depositing aluminum, silver, or the like on a film. Further, the material of the protruding electrode is not particularly limited, and for example, a metal material, a ceramic material, a resin, or the like can be used. The metal material is not particularly limited, and examples thereof include iron-based materials such as stainless steel and permalloy (alloys of iron and nickel); copper-based materials such as brass, copper-molybdenum alloy, and beryllium copper; Aluminum material. The ceramic material is not particularly limited, and examples thereof include an alumina-based material such as aluminum nitride, a lanthanoid material such as tantalum nitride, and a zirconia-based material. The resin is not particularly limited, and examples thereof include a rubber-based material such as an elastomer resin, a material in which a conductive material is mixed in a matrix of a lanthanoid system, and a resin material obtained by extrusion molding or injection molding of the materials. . Further, in the plate-like member having the protruding electrodes, the surface of the plate-like member may be subjected to surface treatment such as plating or coating to form a conductive layer. Furthermore, the above-mentioned plate-shaped member may be a functional member (acting member) having some functions. For example, in the case where the above-mentioned plate member is a heat dissipation plate (heat sink), it is a functional member (acting member) having a heat dissipation function (heat dissipation function); in the case where the above plate member is a shield plate (shield plate) It is a functional member (acting member) having a shielding function (shielding function).

In the resin sealing step, the method (forming method) used for the resin sealing is not particularly limited, and for example, any one of a transfer molding method and a compression molding method may be employed.

In the case where the resin sealing step is performed by compression molding, the manufacturing method of the present invention may further comprise fixing the resin to the plate member having the protruding electrode. There is a resin mounting step on one of the above-mentioned bump electrodes. Further, in this case, the manufacturing method of the present invention may further include a transfer step of transporting the plate-like member having the protruding electrode to the cavity position of the molding die. Further, in the cavity, the wafer is immersed in the resin placed on the plate-like member, and the resin is compression-molded together with the plate-shaped member having the protruding electrode and the wafer. It is also possible to carry out the above resin sealing step.

The order of the resin mounting step and the above-described transport step is not particularly limited, and any one of the steps may be performed at the same time. For example, in the above-described transfer step, the resin is placed on the plate-shaped member having the protruding electrode and conveyed to the position of the molding cavity together with the plate-shaped member having the protruding electrode. Also. Alternatively, in the above-described transfer step, the plate-like member having the protruding electrode may be conveyed to the cavity of the molding die without being placed on the resin. In this case, the manufacturing method of the present invention may further include a heating step of heating the plate-like member having the protruding electrodes in the cavity before the resin mounting step. Then, the resin mounting step may be performed in the cavity in a state where the plate-like member having the protruding electrode is heated.

In the above-described transfer step, the plate-like member with the protruding electrode is placed in a state in which one of the protruding electrodes is fixed to the release film and the projection member is placed on the release film. It may be conveyed into the cavity of the above-mentioned forming mold. In this case, in the transporting step, the frame body is placed on the release film together with the plate-like member having the protruding electrode, and the plate-shaped member having the protruding electrode is surrounded by the frame. In this state, the plate-like member having the protruding electrode may be conveyed into the cavity of the molding die. Preferably, in the resin mounting step, the frame body is placed on the release film together with the plate-like member having the protruding electrode, and the plate-shaped member having the protruding electrode is formed by the frame In a state of being surrounded, the resin is supplied into a space surrounded by the plate-like member having the protruding electrode and the frame, whereby the resin is placed thereon. The fixing surface of the above protruding electrode. In this case, the order of the resin mounting step and the transport step is not particularly limited, and any one of the steps may be carried out at the same time. However, it is preferable to carry out the resin mounting before the transport step. step.

Further, the surface of the plate-like member having the protruding electrode and the surface opposite to the surface on which the protruding electrode is fixed may be fixed to the release film by an adhesive.

The conveying unit that performs the above-described conveying step may be a unit that conveys the resin into the cavity of the molding die in a state where the plate-like member on which the resin is placed is placed on the release film. In this case, the resin sealing unit that performs the above-described resin sealing may be a unit having a release film adsorption unit and performing the above compression molding in a state where the release film is adsorbed to the release film adsorption unit. . Further, the above-mentioned molding die is not particularly limited, and is, for example, a metal mold or a ceramic mold.

As described above, the plate-like member with the protruding electrode of the present invention is used for the above-described manufacturing method of the present invention, and the plate-shaped member having the protruding electrode is characterized in that the protruding electrode is fixed to one side of the plate-shaped member. on. As described above, the number and shape of the above-mentioned bump electrodes are not particularly limited. As described above, for example, at least one of the protruding electrodes may be the above-described plate-like protruding electrode. As described above, it is preferable that the plate-like protruding electrode has a through hole and a protrusion, and the through hole penetrates the plate-shaped protruding electrode in a direction parallel to a plate surface of the plate-shaped member, and the plate-shaped protruding electrode is One end of the plate-like member is fixed to one end of the opposite side, and the protrusion protrudes in a direction perpendicular to the plate surface of the plate-like member. Further, as described above, for example, at least one of the protruding electrodes may be a protruding electrode of the through hole. More specifically, as described above, the through hole of the protruding electrode (12) having the through hole may be a through hole (12b) penetrating in a direction parallel to the plate surface of the plate member. Further, the projection electrode having the through hole has one end opposite to the one end (12a side) fixed to the plate member, and has a projection (12c) protruding in a direction perpendicular to the plate surface of the plate member. can. Further, as described above, at least one of the protruding electrodes has a columnar shape (for example, a columnar shape, a prismatic column shape, a conical shape, and a pyramid shape) Columnar protrusion electrodes of a shape, a trapezoidal shape, a pyramid shape, or the like may be used.

Further, as described above, the shape of the plate-like member is not particularly limited, and for example, the plate-shaped member may have a resin containing portion. More specifically, for example, the resin accommodating portion may be formed in the central portion of the plate-like member by bulging the peripheral edge portion of the plate-like member toward the fixing surface side of the protruding electrode of the plate-shaped member. Further, in the resin mounting step of the present invention, the resin is placed in the resin containing portion of the plate member, and the resin is placed in the resin containing portion. The above resin sealing step may also be performed.

Further, in the resin sealing step, the substrate on which the wafer is placed on the wiring pattern forming surface is placed on the substrate mounting table so that the wiring pattern forming surface faces upward, and the wiring pattern forming surface is further formed on the wiring pattern forming surface. In the state in which the resin is placed, the "plate-shaped member with a protruding electrode having a deformed portion" may be pressed from the protruding electrode side toward the resin. Thereby, the bump electrode can be connected to the wiring pattern of the substrate on which the wafer is mounted.

In the production method of the present invention, the resin is not particularly limited, and may be, for example, any of a thermoplastic resin and a thermosetting resin. The resin may be, for example, at least one selected from the group consisting of a particulate resin, a powdered resin, a liquid resin, a plate resin, a sheet resin, a film resin, and a paste resin. Further, the resin may be, for example, at least one selected from the group consisting of a transparent resin, a translucent resin, and an opaque resin.

Hereinafter, embodiments of the present invention will be described based on the drawings. For convenience of explanation, each drawing is schematically represented by appropriate omission, enlargement, and the like.

[Example 1]

In the present embodiment, an example of the electronic component of the present invention using the plate-shaped member having the protruding electrode having the deformed portion as an example of the "plate-like member having a protruding electrode having a deformed portion" according to the present invention, and An example of a method of manufacturing the above-described electronic component by transfer molding will be described.

In the perspective view of Fig. 1, the structure of the plate-like member with the protruding electrode having the deformed portion of the present embodiment is schematically shown. As shown in the figure, the plate-like member 10 having the protruding electrode having the deformed portion is formed by fixing the pattern of the protruding electrode 12 having the deformed portion to one surface of the plate-like member 11. The length (height) of the bump electrode 12 is not particularly limited, and can be appropriately set, for example, according to the thickness of the finished electronic component (molded package). Further, in the present invention, the pattern of the protruding electrodes is not limited to the pattern of the embodiment (Fig. 1), and may be any pattern.

The structure of the plate-like member 10 having the protruding electrodes as shown in the perspective view of Fig. 1 is as shown in Fig. 1 (A) and (B). First, as shown in FIG. 1(A), in the plate-like member 10 having the protruding electrodes, the pattern of the protruding electrodes 12 is fixed in a direction perpendicular to the surface direction of the metal plate (plate-like member) 11. One side of the metal plate (plate member) 11. On the other hand, in Fig. 1(B), in the case of the plate-like member 10 having the projecting electrodes, one portion of the metal plate (plate-like member) 11 is punched, and one of the above-mentioned punched portions is in the same plate The direction in which the surface of the member 11 is perpendicular is curved to form a bump electrode. As shown in FIG. 1, in the plate-like member 11, a part of the above-mentioned punched portion is formed as a hole 13. Other than this, it is the same as (A) of FIG.

The structure of the bump electrode 12 and its deformed portion is not particularly limited. 2(A) and 2(B) are perspective views showing an example of the structure of the bump electrode 12 shown in Figs. 1(A) and 1(B). In the perspective views of (A) and (B) of FIG. 2, the upper and lower directions of the paper surface indicate a direction perpendicular to the plane direction of the plate-like member 11. The protruding electrode 12 shown in FIG. 2(A) includes a deformed portion 12A at a central portion thereof, and a portion other than the central portion is formed of a rigid portion 12B (an end portion of the protruding electrode 12). As shown in FIG. 2(A), when the deformation portion 12A is viewed from a direction parallel to the surface direction of the plate-like member 11, it is bent into a lightning bolt shape. Further, as shown in FIG. 2(A), the deformed portion 12A of the bump electrode 12 can be contracted in the vertical direction so as to be curved in a "Z" shape. Further, the projection electrode 12 shown in Fig. 2(B) is entirely composed of the deformed portion 12A. When the deformation portion 12A of Fig. 2(B) is viewed from a direction parallel to the plane direction of the plate member 11, it is also bent into Lightning shape. In the bump electrode 12 shown in Fig. 2(B), the entire body can be bent in a "ㄑ" shape to be contracted and deformed in the vertical direction. Thereby, for example, even when the height of the protruding electrode 12 is designed to be larger than the thickness of the finished electronic component (molding package), the protruding electrode does not damage and conforms to the thickness at the time of molding. Thereby, since it is not necessary to design the height of the above-mentioned protrusion electrode in accordance with the above thickness, it is possible to easily and efficiently manufacture an electronic component having both the via electrode (protrusion electrode) and the plate member.

Further, as shown in FIG. 2, the shape of the bump electrode 12 is not limited to the configuration in which the deformed portion 12A is bent into a lightning bolt shape ("Z" shape). For example, the shape of the bump electrode 12 may have a shape having the above-described through hole 12b, and more specifically, for example, the shape shown in FIG. In Fig. 3, the upper right side view is a perspective view showing a part of the plate-like member 10 having the protruding electrodes of Fig. 1. Further, (A) to (C) of FIG. 3 are perspective views schematically showing an example of the structure of the bump electrode 12. As shown in (A) to (C) of FIG. 3, respectively, the lower portion 12a of the protruding electrode 12 (the portion on the side connected to the plate-like member 11) is not opened. On the other hand, in the upper portion of the protruding electrode 12 (the portion opposite to the side on which the plate-like member 11 is connected), a hole penetrating the protruding electrode 12 is opened in a direction parallel to the plate surface of the plate-like member 11 ( Through hole) 12b. Further, a portion of the upper end of the protruding electrode 12 (one end opposite to one end fixed to one end of the plate-like member 11) protrudes upward (in a direction perpendicular to the plate surface of the plate-like member 11) to form a projection 12c. The protruding electrode 12 is in contact with the wiring pattern (substrate electrode) of the substrate at the end portion of the protrusion 12c. Furthermore, in FIG. 3(A), the number of the bump electrodes 12c is two. In Fig. 3(B), the number of the bump electrodes 12c is one, and is the same as Fig. 3(A) except that the width of the bump electrodes 12 is slightly narrow. In Fig. 3(C), the same as Fig. 3(B) except that the width of the bump electrode 12 is narrower. Thus, the number of the protrusions 12c is not particularly limited, and may be one or plural. Although the number of the projections 12c is one or two in (A) to (C) of FIG. 3, it may be three or more. Further, the number of the holes (through holes) 12b is one in (A) to (C) of FIG. 3, but is not particularly limited, and may be any number or plural.

Since the protrusion 12c is provided, the bump electrode 12 is not interfered by the resin and is easily brought into contact with the wiring pattern (substrate electrode) of the substrate. That is, the resin (for example, molten resin or liquid resin) between the bump electrode 12 and the wiring pattern 22 of FIG. 5 described below is pulled by the protrusion 12c, and the front end of the protrusion 12c abuts (physically contacts) with the wiring pattern 22, and It is electrically connected. Further, since the bump electrode 12 has the hole 12b, it is easier to resin-seal the wafer. That is, the resin can flow through the holes 12b, so that the flow of the resin becomes smoother, thereby improving the efficiency of resin sealing. This effect is particularly remarkable when the transfer forming is employed. Further, when the bump electrode 12 abuts (contacts) the wiring pattern 22, as shown in FIG. 3(D), the bump electrode 12 is bent in the vicinity of the hole 12b, so that the height (length) of the bump electrode 12 can be made small. In other words, in the bump electrode 12 having the shape shown in FIGS. 3(A) to 3(D), the periphery of the through hole 12b is formed by the above-described deformed portion which is contractible in a direction perpendicular to the surface direction of the plate member 11. Thereby, the height of the bump electrode 12 can be adjusted corresponding to the resin thickness (package thickness) of the electronic component. In view of this aspect, the height (length) of the bump electrode 12 can be set to be slightly longer than the above-described resin thickness (package thickness).

Further, the bump electrode 12 may be, for example, the above-described lightning-shaped bump electrode and the bump electrode with the through hole. In other words, the protruding electrode 12 can have the above-described deformation portion which is bent into a lightning bolt shape ("Z" shape) when viewed from a direction parallel to the surface direction of the plate-like member 11, and is parallel to the surface direction of the plate-like member 11. The through hole penetrating in the direction. An example of such a configuration is shown in FIG. In Fig. 4, the upper right side view is a perspective view showing a part of the plate-like member 10 having the projecting electrodes of Fig. 1. Further, (A) to (C) of FIG. 4 schematically show a perspective view of an example of the structure of the bump electrode 12. In the bump electrode 12 of (A) to (C) of FIG. 4, except for the lower portion 12a of the bump electrode 12 (the portion of the unconnected side on the side connected to the plate member 11) and the upper portion (connected to the plate member 11) The portion on the opposite side that is open to the through hole 12b is the same as (A) to (C) in Fig. 3 except that the deformation portion 12A is integrally connected. In (A) to (C) of FIG. 4, the deformed portion 12A is bent into a lightning shape when viewed from a direction parallel to the plane direction of the plate member 11 ("Z"). The glyph is contracted in a direction perpendicular to the direction of the surface of the plate member 11. Further, in the bump electrode 12 of (A) to (C) of FIG. 4, as in the case of (A) to (C) of FIG. 3, the bump electrode 12 is bent in the vicinity of the hole 12b, so that the height of the bump electrode 12 can be made. The (length) becomes small, for example, as shown in Fig. 4(D).

Further, the shape of the bump electrode 12 is not particularly limited except for including the above-described deformed portion, and other shapes may be added to the shape of FIGS. 2 to 4 or replaced with other shapes. For example, as described above, at least one of the bump electrodes 12 may be a columnar bump electrode having a columnar shape. As described above, the shape of the columnar projection electrode may be, for example, a columnar shape, a prismatic shape, a conical shape, a pyramid shape, a truncated cone shape, or a truncated cone shape.

Further, as described above, at least one of the bump electrodes 12 may be a plate-like bump electrode. In this case, as described above, in the resin sealing step of the manufacturing method of the present invention, the substrate is divided into a plurality of regions by the plate-like protruding electrodes, and the wafer is subjected to resin in each of the regions. Sealing is also possible. Further, similarly to the bump electrodes of FIGS. 3(A) to (C), the plate-like bump electrodes may have through holes and protrusions. Similarly to the through holes of FIGS. 3(A) to 3(C), the through-holes may pass through the plate-like projection electrodes in a direction parallel to the plate surface of the plate-like member. Further, in the same manner as in Figs. 3(A) to (C), the projection is preferably formed on one end of the plate-like projection electrode opposite to one end of the plate-like member and is opposite to the plate-like member. The board surface protrudes in the vertical direction. The number of the through holes and the protrusions of the plate-like projection electrode is not particularly limited, and may be any number, but is preferably plural. The plate-like projection electrode has the above-described through hole and the protrusion, and has the same advantages as the through hole 12b and the projection 12c of FIGS. 3(A) to (C). In other words, first, since the plate-like projection electrode has the protrusion, the plate-shaped protrusion electrode is not interfered with by the resin, and is easily brought into contact with the wiring pattern (substrate electrode) of the substrate. Further, since the plate-like projection electrode has the through hole, the resin can flow through the through hole, so that the flow of the resin is smoother and the efficiency of the resin sealing is further improved. This effect is to manufacture electronic parts by transfer molding (the wafer is bonded to the plate-like member with the protruding electrodes for resin sealing) It is especially noticeable when it is sealed. Further, the plate-like projection electrode is also bent in the vicinity of the through hole, and the height (length) of the plate-like projection electrode can be made small. Thereby, the height of the plate-like projecting electrode can be adjusted in accordance with the resin thickness (package thickness) of the electronic component. In view of this aspect, the height (length) of the plate-like projection electrode can be set to be slightly longer than the resin thickness (package thickness).

Further, in the invention, the deformed portion of the protruding electrode may be contracted in a direction perpendicular to a surface direction of the plate-like member, but may be deformed in any other manner in addition to contraction in the vertical direction. For example, the deformation portion may be contracted in a direction perpendicular to the surface direction of the plate-like member, and enlarged in the lateral direction (horizontal direction) including the plate-like member and the entire lateral direction of the oblique direction. The deformation of the above-described deformation is determined according to, for example, the material, shape, and the like of the above-described plate member.

Further, a method for producing a plate-like member having a protruding electrode according to the present invention includes, for example, a method of joining a plate-shaped member (metal plate) and a bump electrode; and using a metal plate as a plate-like member. Further, the metal plate is subjected to punching and bending to produce a bump electrode, and the like, but is not limited thereto. Specifically, for example, the method shown in the following (1) to (6) can be carried out in accordance with a conventional method, whereby a plate-like member having a protruding electrode as shown in Fig. 1(A) can be produced.

(1) a method of manufacturing by etching a metal plate;

(2) a method of manufacturing by joining a metal plate and a bump electrode;

(3) a method of simultaneously forming a plate member and a protruding electrode by electroforming;

(4) For example, a method of simultaneously forming a plate-like member and a protruding electrode by a resin having conductivity (shielding property) by using an injection molding method;

(5) a method of manufacturing a bump electrode by bonding a resin (plate member) having conductivity (shield);

(6) A method of attaching a conductive (shielding) coating film to a member having a resin plate and a projection.

As described above, the method for producing the plate-like member with the projecting electrode of the present invention is not particularly limited, and for example, the method shown in the following (7) is carried out in accordance with a conventional method, thereby producing a belt as shown in Fig. 1(B). A plate member having a protruding electrode may also be used.

(7) A method of manufacturing a bump electrode having a deformed portion by using a metal plate as a plate member and punching and bending the metal plate. For example, first, a shape corresponding to a bump electrode having a desired shape deforming portion is punched out on the metal plate, and then the punched portion is vertically bent with respect to the metal plate, whereby it is possible to form a desired A plate-like member having a protruding electrode in the shape deforming portion. Examples of the bump electrode having the deformed portion having the above-described desired shape include a bump electrode having a deformed portion having a through hole and a bump electrode having a lightning-shaped ("Z"-shaped) deformed portion.

In the cross-sectional views of Figs. 5(A) to 5(C), an example of a step of manufacturing an electronic component using the plate-like member having the protruding electrodes shown in Fig. 1 is schematically shown. Fig. 5(C) is a schematic view showing the configuration of the electronic component of the embodiment manufactured by the above manufacturing steps. First, as shown in FIG. 5(C), the electronic component 20 includes a substrate 21, a wafer 31, a resin 41, a plate-like member 11, and a bump electrode 12 having a deformed portion 12A. The bump electrode 12 is fixed to one surface of the plate member 11, and the plate member 11 and the bump electrode 12 are integrated to form a plate member having the bump electrode. The wafer 31 is fixed to the substrate 21 and sealed by the resin 41. A wiring pattern 22 is formed on the arrangement side of the wafer 31 on the substrate 21. As also shown in Fig. 1, the projecting electrode 12 is fixed to one surface of the plate member 11. Further, the bump electrode 12 penetrates the resin 41 and comes into contact with the wiring pattern 22.

Next, the manufacturing steps of FIGS. 5(A) to (C) will be described. First, as shown in FIG. 5(A), a plate member 10 having a bump electrode and a substrate 21 are prepared. As shown in Fig. 5(A), in the plate-like member 10 having the protruding electrodes, the protruding electrodes 12 are fixed to one side of the plate-like member 11, and the plate-like member 11 and the protruding electrodes 12 are integrated to form a protruding electrode. The plate member 10. Further, in FIG. 5(A), the length (height) of the projection electrode 12 in the direction perpendicular to the surface direction of the plate-like member 11 is indicated by an arrow and a symbol M. A wafer is fixed on the substrate 21 31. A wiring pattern 22 is formed on the arrangement side of the wafer 31 on the substrate 21. Further, as shown in FIG. 5A, the plate-like member 10 having the protruding electrodes and the substrate 21 are disposed such that the fixing faces of the protruding electrodes 12 face the wiring pattern 22.

Further, as shown in FIG. 5(B), between the fixed surface of the bump electrode 12 of the plate-like member 11 and the surface on which the wiring pattern 22 of the substrate 21 is formed, the wafer 31 is sealed with the resin 41 to form the electronic component 20. '. In FIG. 5(B), the bump electrode 12 having the deformed portion 12A is not shrunk. That is, the length (height) of the protruding electrode 12 in the direction perpendicular to the surface direction of the plate-like member 11 is M which is the same as that of FIG. 5A. In this state, if the bump electrode 12 is in contact with the wiring pattern 22 and the length of the bump electrode 12 matches the specific thickness of the electronic component, the electronic component 20' in this state may be a finished electronic component. Since the length of the protruding electrode 12 does not match the specific thickness of the electronic component, the electronic component 20' is not a finished product, and therefore, the plate member is reduced by pushing in the direction perpendicular to the plane direction of the plate member 11. The distance (distance) between the substrate 11 and the substrate 21 is such that the length of the bump electrode 12 matches the specific thickness of the electronic component. At this time, a pressing force generated by the bump electrode 12 abutting on the wiring pattern 22 of the substrate 21 is applied to the bump electrode 12. By this pressing force, the entire projection electrode 12 is pressed against the direction perpendicular to the surface direction of the plate-like member 11. By this pressing, as shown in FIG. 5(C), the protruding electrode 12 is contracted in the direction perpendicular to the surface direction of the plate-like member 11 by the bending of the deformed portion 12A. That is, as shown in Fig. 5(C), the length (height) of the projection electrode 12 in the direction perpendicular to the plane direction of the plate-like member 11 becomes smaller than M in Figs. 5(A) and (B). The value N (M>N). Thereby, the bump electrode 12 and the specific thickness of the electronic component (the space between the plate member 11 and the substrate 21) match. Moreover, in the state of FIG. 5(C), the bump electrode 12 is in contact with the wiring pattern 22. In this way, the finished electronic component 20 as shown in FIG. 5(C) can be manufactured. In addition, in FIG. 5, for the convenience of description, the protrusion electrode 12 has the shape of the lightning-shaped deformation part 12A. However, as described above, the shape of the bump electrode 12 is not limited thereto, and may be any shape as described above. Hereinafter, in all of the cross-sectional views including the bump electrodes 12, the same is true.

Further, the plate-like member 11 is not particularly limited, and as described above, for example, it may be a heat dissipation plate or a shielding plate (shield plate). For example, when a plurality of wafers (electronic components before resin sealing) are disposed in one IC (electronic component after resin sealing of a wafer), a shielding plate (shield plate) is considered in consideration of the function of each wafer. ) Electromagnetic shielding is also possible.

Further, the plate-like member having the protruding electrode may be a plate-shaped member corresponding to one substrate (one electronic component), and as shown in FIGS. 1(A) and (B), may be a plurality of substrates (plurality Electronic parts) corresponding to the plate-shaped members (matrix type). In the case of the matrix type, for example, a plurality of substrates each having a wafer and a wiring pattern fixed thereon are resin-sealed together with the matrix-shaped plate-like member having the protruding electrodes. Thereafter, the matrix-shaped plate-like member having the protruding electrodes may be divided into regions corresponding to the respective substrates by cutting or the like. Further, for example, as described above, at least one of the protruding electrodes may be a plate-like protruding electrode. In this case, the plate-shaped projection electrode can be used to divide (divide) a desired range (or a range having a specific function) corresponding to one electronic component (one product unit) on the substrate surface.

Further, instead of the wafer 31, an electronic component in a state in which the resin is sealed may be used. In this case, the electronic component 20 is in a state in which the electronic component 31 is again resin-sealed, and therefore, the wafer is in a state in which a plurality of resin seals are performed.

In the cross-sectional view of Fig. 6, an example of a method of manufacturing the electronic component of Fig. 5 is schematically shown. As described above, this manufacturing method uses a manufacturing method of transfer molding.

As shown in Fig. 6, this manufacturing method can be carried out using a general molding die 50 for transfer molding. As shown in FIG. 6, the forming die 50 is formed of an upper die 51 and a lower die 52. A mold cavity 56 for molding a resin is provided on a mold surface of the upper mold 51, and a substrate installation portion 57 for supplying and mounting the substrate 21 is provided on a mold surface of the lower mold 52. The substrate 31 is provided with a wafer 31 and a wiring pattern 22 .

Further, a feeding chamber (hole) 54 for supplying a resin material is provided in the lower mold 52, and a plunger 53 for pressurizing the resin is fitted in the charging chamber.

The method of transfer forming using the apparatus shown in Fig. 6 is not particularly limited, and is generally used. The transfer molding method can also be carried out. In other words, first, a resin material such as a resin sheet is supplied into the charging chamber 54, and the substrate 21 is supplied and mounted in the substrate mounting portion 57, and then the two molds of the upper mold 51 and the lower mold 52 are clamped. Next, as shown in FIG. 6, the projection electrode 12 is contracted in a direction perpendicular to the surface direction of the plate-like member 11 by the bending of the deformation portion 12A. Thereby, the bump electrode 12 coincides with the specific thickness of the resin sealing member. Next, the resin is heated in the charging chamber 54 to be melted, and the plunger 53 is moved up to pressurize the molten resin 41 in the charging chamber 54, whereby the molten resin 41 is supplied from the charging chamber 54 of the lower mold 52. The inside passes through the resin passage (path, runner, gate) 55, thereby injecting molten resin into the cavity 56 of the upper mold 51. At this time, the plunger 53 can be used to apply a desired resin pressure to the resin in the cavity 56.

After the time required for curing, the two molds of the upper mold 51 and the lower mold 52 are opened, and in the cavity 56, the wafer 31 or the like can be hermetically formed into a package corresponding to the shape of the cavity ( Inside the resin molded body (see electronic component 20 shown in Fig. 5).

In the present embodiment, the manufacturing method shown in Fig. 6 (manufacture of the electronic component 20 shown in Fig. 5) can be performed, for example, in the following manner. In other words, first, the substrate 21 on which the wafer 31 and the wiring pattern 22 are provided is placed on the mold surface (substrate mounting portion) of the lower mold 52 at a position corresponding to the cavity of the upper mold 51, and on the substrate 21, The plate-like member 11 and the protruding electrode 12 are disposed in the same positional relationship as the positional relationship in the electronic component 20 (FIG. 5) of the finished product. At this time, as shown in FIG. 6, the substrate 21 is brought into contact with the lower mold 52 on the side opposite to the arrangement side of the wafer 31, and a plate-like member having a protruding electrode is placed on the surface on the side where the wafer 31 is disposed (plate shape). The member 11 and the bump electrode 12) are such that the wiring pattern 22 and the front end portion of the bump electrode 12 are physically electrically connected.

Further, the substrate 21, the wafer 31, the plate-like member 11, and the bump electrode 12 can be downloaded and placed on the mold surface of the lower mold 52 in a state of being vertically inverted as shown in FIG. In other words, the surface of the plate-like member 11 opposite to the surface on which the projection electrode 12 is formed is in contact with the lower mold 52, and the substrate 21 and the wafer 31 may be disposed on the surface on which the projection electrode 12 is formed.

Next, as shown in FIG. 6, the upper mold 51 and the lower mold 52 are clamped. At this time, the upper mold 51 is placed on the lower mold 52, whereby the substrate 21, the wafer 31, the plate-like member 11, and the protruding electrode 12 are housed in the cavity of the upper mold, and the plate-like member 11 is abutted. On the top surface of the cavity. At this time, as described above, during the above-described mold clamping, the projection electrode 12 is contracted in a direction perpendicular to the surface direction of the plate-like member 11 by the bending of the deformation portion 12A. Thereby, the bump electrode 12 coincides with the thickness of the above electronic component.

In this state, further, as shown in Fig. 6, the resin 41 is injected from the charging chamber 54 of the lower mold 52 through the resin passage 55 into the cavity of the upper mold 51 by the plunger 53. Thereby, the wafer 31 placed on the substrate 21 is resin-sealed together with the plate-like member 11 and the bump electrode 12. In this way, the electronic component 20 shown in FIG. 5 can be manufactured.

Further, when resin is injected into the cavity 56, the resin (molten resin) 41 can flow between the protruding electrodes 12 in the cavity 56 or can flow through the holes 12b of the protruding electrodes 12.

Further, in the above, a method of performing mold clamping after placing both the substrate and the plate-like member having the protruding electrodes on the die surface of the lower mold has been described, but the present invention is not limited thereto. For example, the substrate 21 is supplied and mounted on the die surface of the lower mold 52, and the plate-like member (plate member 11) having the protruding electrodes is mounted on the top surface of the cavity of the upper mold 51, and the upper mold 51 and the lower mold are attached. 52 mold clamping, and it is also possible to inject resin into the cavity. At this time, as described above, the positions of the plate-like member 11 and the substrate 21 may be inverted upside down.

In addition, when molding (resin sealing) by transfer molding, for example, the inside of the cavity may be set to a specific degree of vacuum, and transfer molding may be performed. The method of setting the specific degree of vacuum described above is also not particularly limited, and for example, a method based on general transfer molding can be employed.

The apparatus for the above transfer molding is not particularly limited, and for example, it may be the same as the apparatus for general transfer molding. Further, the specific conditions of the resin sealing step are not particularly limited, and may be, for example, the same as general transfer molding.

Furthermore, in order to more reliably connect the bump electrode 12 and the wiring pattern 22, soldering is performed in advance. The material may be inserted between the bump electrode 12 and the wiring pattern 22. In this case, for example, after the resin sealing step, the solder may be melted by reflow or the like to bond the bump electrode 12 and the wiring pattern 22. The same applies to the embodiments below.

As described above, according to the present invention, it is not necessary to design the height of the protruding electrode in advance in accordance with the above-described thickness. Therefore, it is possible to easily and efficiently manufacture an electronic component having both the via electrode (protrusion electrode) and the plate member.

Further, as described above, according to the present invention, it is not necessary to form a hole (groove or hole) through the through hole on the resin in order to form the via electrode. Therefore, for example, the following effects (1) to (5) can be obtained. However, the effects are exemplified and the invention is not limited.

(1) Since it is not necessary to form a hole through the through hole in the resin, there is no possibility that the through hole is formed accurately and appropriately on the wiring pattern of the substrate due to variations in thickness of the electronic component (package) sealed by the resin or the like. The depth of the hole, etc.

(2) Since it is not necessary to form a hole through the through hole in the resin, the filler contained in the resin material does not remain on the wiring pattern of the substrate.

(3) Since it is not necessary to form a hole through the through hole in the resin, the wiring pattern on the substrate on which the wafer is mounted is not damaged.

(4) Since it is not necessary to form a hole through the through hole in the resin, the manufacturing conditions of the electronic component are not affected by the packing density of the resin material.

(5) By the influence of the above (1) to (4), the electronic component can be easily and efficiently manufactured, and therefore the yield is good. Further, since the connection between the wiring pattern of the substrate and the bump electrode (via electrode) is good, it is also advantageous in improving the performance of the electronic component or reducing the incidence of defective products.

[Embodiment 2]

Next, another embodiment of the present invention will be described with reference to Figs. 7 to 10 . In the present embodiment, an example of a method of manufacturing the above-described electronic component by compression molding will be described. Further, the protruding electrode member of the plate-like member with the protruding electrode used in the embodiment is Prepare the deformation section.

First, a compression molding device (manufacturing device for electronic components) is prepared. In the step sectional view of Fig. 7, a configuration of a part of the compression molding apparatus, i.e., a part of the forming mold, is shown. As shown in Fig. 7, the compression molding apparatus upper mold 101, lower mold 111, and middle mold (intermediate plate) 102 are main constituent elements. The lower mold 111 includes a lower cavity bottom surface member 111a and a lower mold outer peripheral member (lower mold body) 112 and 113. The lower die outer peripheral members (lower die bodies) 112 and 113 are frame-shaped lower die cavity side members. More specifically, the lower mold outer peripheral member 112 is disposed to surround the lower cavity bottom surface member 111a, and the lower mold outer peripheral member 113 is disposed to surround the outer periphery of the lower mold outer peripheral member 112. A gap (adsorption hole) 111c is formed between the lower cavity bottom surface member 111a and the lower die outer circumferential member 112. A gap (adsorption hole) 111d is formed between the lower mold outer peripheral member 112 and the lower mold outer peripheral member 113. The voids 111c and 111d are depressurized by a vacuum pump (not shown) as described below, whereby a release film or the like can be adsorbed. The height of the upper surface of the lower mold outer peripheral member 112 is higher than the upper surfaces of the lower cavity bottom surface member 111a and the lower mold outer peripheral member 113. Thereby, a cavity (recess) 111b surrounded by the upper surface of the lower cavity bottom surface member 111a and the inner peripheral surface of the lower die outer peripheral member 112 is formed. Further, a hole (through hole) 103 is formed in the upper mold 101. As described below, after the mold clamping is performed, suction is performed from the hole 103 by a vacuum pump (not shown), whereby at least the inside of the lower mold cavity 111b can be decompressed. The middle mold (intermediate plate) 102 has a frame-like (annular) shape and is disposed so as to be positioned directly above the lower mold outer peripheral member 113. The release film 100 can be held and fixed between the lower surface of the middle mold 102 and the upper surface of the lower mold outer peripheral member 113. An elastic O-ring 102a is attached to the peripheral portion of the upper surface of the intermediate mold 102. Further, in the compression molding apparatus, as shown in Fig. 7, rollers 104 are provided on the left and right sides of the drawing. Further, both ends of one strip of the release film 100 are wound around the left and right rolls 104, respectively. The release film 100 can be carried out from the right side to the left side of FIG. 7 or from the left side to the right side by the left and right rolls 104. Thereby, as described below, the plate-like member with the protruding electrode can be transported to the position of the lower mold cavity while being placed on the release film 100. That is, the roller 104 corresponds to transporting the above-described plate-like member having the protruding electrode to the forming die The transport unit of the cavity position. Further, although not shown, the compression molding apparatus (manufacturing device for electronic components) further includes a resin mounting unit. The resin mounting unit is configured to mount a resin on a surface on which the projection electrode of the plate-like member having the protruding electrode is formed.

Next, as shown in FIG. 7, the substrate 21 to which the wafer 31 is fixed on one side is fixed to the lower surface of the upper mold 101 by a clamper 101a. At this time, the wafer 31 forming surface of the substrate 21 is directed downward. Further, the substrate 21 and the wafer 31 are the same as in the first embodiment, and the wiring pattern 22 is formed on the substrate 21 in the same manner as in the first embodiment. Furthermore, as shown in FIG. 7, the resin material (resin) 41a is placed on the fixing surface of the bump electrode 12 of the plate-shaped member 11 by the resin mounting means (resin mounting step). Further, the plate member 11, the bump electrode 12, and the resin material 41a are the same as in the first embodiment. The form of the resin material 41a is not particularly limited. In the resin mounting step, the resin material 41a is preferably not dropped from the fixing surface of the protruding electrode 12 of the plate member 11. For example, in the resin mounting step, the sheet-like resin material 41a may be laminated (laminated) on the fixing surface of the bump electrode 12 of the plate member 11, and may be pressed. Further, as shown in FIG. 7, the plate-like member 11 on which the resin material 41a is placed is placed on the release film 100. At this time, as shown in FIG. 7, the mounting surface of the resin material 41a of the plate-like member 11 (the surface on which the projection electrode 12 is formed) faces upward (that is, the surface opposite to the surface on which the projection electrode 12 is formed and the release film) 100 surface contact). Further, an adhesive (adhesion layer) is present between the upper surface of the release film 100 and the plate member 11 (not shown), and the plate member 11 is fixed to the release film by the above adhesive (adhesion layer). 100 upper surface is also available. When the above-mentioned adhesive (adhesive layer) is present, for example, as shown in FIG. 1(B), even if the hole 13 is formed in the plate member 11, the resin material 41a is hard to leak from the hole 13, and therefore, from the viewpoint of the advantage Preferably. Furthermore, as shown in FIG. 7, the resin material 41a is conveyed together with the plate-shaped member 11, the protrusion electrode 12, and the release film 100 to the position of the lower cavity 111b by the said conveyance means.

Next, as shown by an arrow 114 in Fig. 8, a gap (void 111c) between the lower cavity bottom surface member 111a and the lower die outer peripheral member 112 is reduced by a vacuum pump (not shown). Further, as shown by an arrow 115 in Fig. 8, a vacuum pump (not shown) is used to the lower mold outer peripheral member 112 and the lower portion. The gap (void 111d) between the outer peripheral members 113 is depressurized. Further, the middle mold 102 is lowered together with the O-ring 102a, and the release film 100 is held between the lower surface of the middle mold 102 and the upper surface of the lower mold outer peripheral member 113. Thereby, the release film 100 is fixed to the upper surfaces of the lower mold outer peripheral member 112 and the lower mold outer peripheral member 113. Further, the release film 100 can be covered on the surface of the lower mold cavity 111b by the pressure reduction 114 in the lower mold cavity 111b. Thereby, as shown in FIG. 8, the resin material 41a can be placed on the cavity surface of the lower cavity in a state where it is placed on the plate-like member 11.

Next, as shown in FIGS. 9 to 10, the above resin sealing step is performed. In addition, in FIG. 9, the illustration of the jig 101a is abbreviate|omitted for convenience of description.

That is, first, as shown in FIG. 9, the lower mold 111 (the lower cavity bottom surface member 111a and the lower mold outer peripheral members 112 and 113) is raised together with the middle mold 102 and the O-ring 102a for blocking the outside air. At this time, by joining the mold surface of the upper mold 101 and the upper surface side of the O-ring 102a, at least the lower mold cavity 111b is set to the outside air shutoff state, so that external air can be formed in the upper and lower middle molds (3 molds). Partition space department. In this state, as indicated by an arrow 107, a vacuum pump (not shown) can be used to at least suction the inside of the lower mold cavity 111b (inside the outer air partition space portion) through the hole 103 of the upper mold 101, thereby reducing the pressure. Further, the lower mold 111 and the middle mold 102 are integrated and raised. At this time, the upper surface (lower mold 111) of the lower mold outer peripheral member 112 and the surface of the substrate 21 can be joined via the release film 100.

Next, the lower cavity bottom surface member 111a is raised. At this time, as shown in FIG. 9, the resin material (resin) 41a is in a state of a fluid resin (resin) 41b by heating or the like. Thereby, first, the wafer 31 can be immersed in the fluid resin 41b in the lower cavity 111b, and then the fluid resin 41b in the lower cavity 111b can be pressurized by the lower cavity bottom surface member 111a. Therefore, as shown in FIG. 10, in the lower mold cavity 111b, the wafer 31 (including the bump electrode and the wiring pattern 22) mounted on the substrate 21 can be compression-molded in a sealing resin (resin) 41 composed of a cured resin (resin The molding) constitutes a molded package (resin molded body) corresponding to the shape of the lower cavity 111b. At this time, the plate member 11 is mounted on The state of the top surface side of the formed package 41 opposite to the substrate 21 is formed. Further, at this time, there may be some gap (void) between the substrate 21 and the release film 100.

As described above, as indicated by an arrow 107, at least the inside of the lower cavity 111b is sucked through the hole 103 of the upper mold 101 using a vacuum pump (not shown) to reduce the pressure. In this state, the fluid resin 41b is compression-molded together with the plate-like member 11, the bump electrode 12, the wafer 31, and the substrate 21, and the wafer 31 is resin-sealed. At this time, the pressing force generated by abutting the bump electrode 12 and the wiring pattern 22 of the substrate 21 causes the entire bump electrode 12 to be pressed in the vertical direction. By this pressing, as shown in Fig. 9, in the projection electrode 12 designed to have a height larger than the thickness of the fluid resin 41b, the deformation portion 12A is bent. Thereby, the projecting electrode 12 is contracted in a direction perpendicular to the surface direction of the plate-like member 11 (that is, the length in the direction perpendicular to the plane direction is shortened) to match the specific thickness of the resin sealing member. Moreover, at this time, the bump electrode 12 is in contact with the wiring pattern 22 formed on the substrate 21. Further, the fluid resin 41b is cured, and as shown in FIG. 10, a sealing resin (resin) 41 composed of a cured resin is formed. In this way, the above-mentioned "resin sealing step" can be performed to manufacture electronic parts.

Further, as described above, when the wafer 31 is immersed in the resin 41 in the lower cavity 111b, the resin is in a state of fluidity of the fluid resin 41b. The fluid resin 41b may be, for example, a liquid resin (a thermosetting resin before curing) or a molten state in which a solid resin such as a pellet, a powder or a paste is heated and melted. The heating of the resin material 41a can be performed, for example, by heating of the lower cavity bottom surface member 111a or the like. Further, for example, when the resin material 41a is a thermosetting resin and has fluidity (that is, in a state of being in the state of the fluid resin 41b), the resin material 41a (flowable resin 41b) in the lower cavity 111b is heated and Pressurize and heat cure. Thereby, the wafer 31 can be resin-sealed (compression-molded) in the resin molded body (package) corresponding to the shape of the lower cavity. In this way, for example, the plate member 11 may be exposed to the upper surface (surface opposite to the substrate) of the resin molded body (package).

After the compression molding (resin sealing), that is, after the fluid resin 41b is cured to form the sealing resin 41, the pressure reduction in the lower cavity 111b via the hole 103 of the upper mold 101 is released (arrow 107 in Fig. 9). . Next, as shown in FIG. 10, the lower mold 111 (the lower mold bottom surface member 111a and the lower mold outer peripheral members 112 and 113) is lowered together with the middle mold 102 and the O-ring 102a. At this time, the pressure reduction (vacuum) of the gap between the lower cavity bottom surface member 111a and the lower die outer circumferential member 112 may be released. Further, as indicated by the arrow 116, conversely, air may be supplied to the gap. Thereby, as shown in FIG. 10, the release film 100 is separated from the upper surface of the lower cavity bottom surface member 111a. At this time, the pressure reduction (vacuum) of the gap between the lower mold outer peripheral members 112 and 113 is not released. Further, the middle mold 102 continues to be in a state of holding the release film 100 together with the lower mold outer peripheral member 113. Therefore, as shown in FIG. 10, the release film 100 continues to be adsorbed (fixed) to the upper surfaces of the lower mold outer peripheral members 112 and 113. Further, the substrate 21 is continuously fixed to the lower surface (die surface) of the upper mold 101 by the jig 101a. Further, since the resin 41 and the plate member 11 are compression-molded together with the substrate 21 and the wafer 31, the release film 100 is lowered from the substrate 21, the plate member 11, the bump electrode 12, the wafer 31, and the like by the lower mold 111. The electronic component formed by the resin 41 is peeled off. Further, by the roller 104, the release film 100 is successively fed (winded) in the right direction or the left direction in FIG.

In the present invention, for example, as shown in the present embodiment, when the resin sealing of the wafer is performed, the bump electrode 12 as a whole is present in the fluid resin 41b (molten resin or liquid resin) in the lower cavity 111b. In this state, as described above, when the lower cavity bottom surface member 111a is moved upward, the front end portion of the protruding electrode 12 and the wiring pattern 22 of the substrate 21 are physically abutted and connected to each other in the fluid resin 41b. By adopting this method, for example, compared with the method of forming a hole through the through hole after resin sealing the wafer, the front end of the bump electrode is in easy contact with the wiring pattern of the substrate, and the resin does not enter between the two. Happening. That is, it is more advantageous to electrically connect the bump electrodes to the wiring patterns of the substrate. For example, in the case where the plate member is a shield plate, this is advantageous in terms of shielding performance. Further, for example, instead of or in addition to bending of the deformation portion of the lightning bolt ("Z" shape), Further, as shown in FIGS. 3(A) to (D) or FIGS. 4(A) to 4(D), the protruding electrode 12 may be shrunk (the height becomes small). That is, even if the height of the bump electrode 12 is slightly larger than the thickness of the resin 41, when the front end of the projection 12c abuts against the wiring pattern 22, the projection 12c elastically moves (drops) toward the gap on the side of the hole 12b, so that the projection electrode 12 can be shrunk. . Thereby, as described above, the height of the bump electrode 12 can be adjusted in accordance with the resin thickness (package thickness) of the electronic component.

Next, FIGS. 11 to 12 will be described. In FIGS. 7 to 10, the following method has been described: a "resin mounting step" of placing the resin 41 on the plate member 11 is performed, and then the plate member having the protruding electrodes is transferred to the cavity. The method of "transfer step" of the location. However, as described above, the order of the resin mounting step and the above-described transport step is not particularly limited. 11 to 12 show an embodiment of the above-described electronic component manufacturing method in which the resin mounting step is performed after the above-described transfer step. As shown in FIGS. 11 to 12, the compression molding apparatus (manufacturing apparatus for electronic components) used in the method is the same as the compression molding apparatus (manufacturing apparatus for electronic components) of FIGS. 7 to 10 except for the resin supply unit 60. However, in FIGS. 11 to 12, the upper mold 101, the holes (through holes) 103 of the upper mold, the jig 101a, the substrate 21, the wiring pattern 22, and the wafer 31 are omitted for simplification. As shown in FIGS. 11 to 12, the resin supply unit 60 is composed of a resin supply unit 61 and a lower shutter 62. The resin supply portion 61 has a frame shape in which an opening is formed at the upper end and the lower end. The opening at the lower end of the resin supply portion (frame) 61 is closed by the shutter 62. Thereby, as shown in FIG. 11, the resin material 41a can be accommodated in the space surrounded by the resin supply part (frame) 61 and the lower gate 62. In this state, as shown in FIG. 11, the resin supply unit 60 is caused to enter directly above the lower mold cavity 111b (in the space between the lower mold 111 and the upper mold 101). Further, as shown in FIG. 12, by opening the lower shutter 62 and opening the opening of the lower end of the resin supply portion (frame) 61, the resin material 41a can be dropped from the opening, and the resin material 41a can be supplied into the lower mold cavity 111b ( Placed). Further, the resin material 41a is a particulate resin in FIGS. 11 and 12, but is not particularly limited thereto. Further, in the resin mounting step before the steps of FIGS. 7 to 10, similarly to FIGS. 11 to 12, the resin supply unit 60 composed of the resin supply portion 61 and the lower shutter 62 can be used.

In the method shown in Figs. 11 to 12, first, in the above-described transfer step, the steps similar to those in Figs. 7 to 8 are performed except that the resin material 41a is not placed on the plate member 11. As a result, as shown in FIG. 11, the plate-like member (the plate-like member 11 and the protruding electrode 12) having the protruding electrodes is in the same state as in FIG. 8 except that the resin material 41a is not placed (the release film is interposed). 100) placed on the cavity surface of the lower mold cavity 111b.

Next, before the resin mounting step, the plate-like member having the protruding electrodes is heated in the lower cavity in the state shown in Fig. 11 (heating step). The heating can be performed, for example, by heating of the lower cavity bottom surface member 111a or the like. In the heating step, it is preferred that the plate-like member having the protruding electrodes is sufficiently thermally expanded. That is, it is preferable that the plate-like member with the protruding electrode is not expanded by heating in the resin sealing step which is performed later. Thereby, in the resin sealing step, the positional displacement of the bump electrode 12 and the wiring pattern 22 is less likely to occur, and the position is easily aligned.

Furthermore, as shown in FIG. 12, the resin material 41a is placed in the lower mold cavity 111b on the fixing surface of the bump electrode 12 of the plate-shaped member 11 (resin mounting step). In this step, for example, the lower shutter 62 is opened to open the opening of the lower end of the resin supply portion (frame) 61, whereby the resin material 41a is dropped from the opening and supplied (placed) into the lower mold cavity 111b. Thereafter, the resin sealing step described above was carried out in the same manner as in FIGS. 9 to 10. Further, the resin material 41a is a particulate resin in Fig. 12, but is not limited thereto. For example, the resin material 41a may be a thermoplastic resin (for example, a particulate resin, a powder resin, or the like), and the fluid resin 41b may be formed by the heat-melting resin material 41a of the plate-like member having the protruding electrodes, and then cooled and solidified. . Further, as described above, the resin material 41a may be a thermosetting resin which is liquid before curing, and is cured by heat of a plate-like member having a protruding electrode.

Further, in the present embodiment, the structure of the compression molding apparatus may be of any configuration, and is not limited to the configuration shown in Figs. 7 to 10, and may be the same as or based on the configuration of a general compression molding apparatus. Specifically, the configuration of the above-described compression molding apparatus can be, for example, Japanese Patent Laid-Open Publication No. 2013-187340, Japanese Patent Laid-Open Publication No. 2005-225133 The structures disclosed in the Japanese Patent Laid-Open Publication No. 2010-069656, the Japanese Patent Publication No. 2007-125783, and the Japanese Patent Publication No. 2010-036542 are the same or the same. For example, in the compression molding apparatus, for example, the same configuration as that of Figs. 2 to 6 of Japanese Laid-Open Patent Publication No. 2013-187340 (a structure having a film pressing plate on the upper mold without a middle mold) may be employed instead of Figs. 7 to 10. The structure of the display. The compression molding method (method of manufacturing an electronic component) using such a compression molding apparatus can be carried out, for example, in the same manner as the method described in Japanese Laid-Open Patent Publication No. 2013-187340. Further, the resin supply unit may be of any configuration other than the resin supply unit 60 of FIGS. 11 and 12. For example, the resin supply unit may be a distribution unit of a resin material disclosed in Japanese Laid-Open Patent Publication No. 2010-036542 (including an input unit of a resin material, a metering unit, a funnel, a linear vibrating feeder, etc.). Alternatively, the resin supply unit is the same as the resin supply unit disclosed in Japanese Laid-Open Patent Publication No. 2007-125783, and includes a structure such as a storage unit, a metering unit, an input unit, a supply unit, a shutter, a tray, and a slit. Also. In addition, for example, the above-described lower mold moving mechanism or the like, which is not shown in FIGS. 7 to 10, may be the same as or used in the above-mentioned Japanese Patent Laid-Open Publication No. 2005-225133, Japanese Patent Laid-Open No. 2010-069656, or the like. The reference may also, for example, connect the elastic member to the lower surface of the lower cavity bottom member.

Further, in the present embodiment, a method of reducing the pressure in the lower cavity and compressing the molding is used. However, the present invention is not limited thereto, and other compression forming (compression molding) may be used.

Further, as described above, the manufacturing method of the present invention includes the above-described manufacturing method of the resin sealing step, and for example, as shown in the present embodiment, any other steps may be included.

In the present embodiment, as described above, the plate-like member having the protruding electrode is placed on the release film, and in this state, the plate-like member having the protruding electrode is transferred to the cavity of the forming die. Inside. Thereby, for example, the structure of the plate-shaped member and the conveying unit can be easily simplified. Further, in the present embodiment, as described above, the resin is placed on the plate-like member having the protruding electrode in a state where the plate-like member having the protruding electrode is placed on the release film. on. Thereby, for example, in FIGS. 7 to 10, resin (resin can be prevented) The material 41a, the fluid resin 41b, and the sealing resin 41) are in contact with the lower cavity bottom surface member 111a, and the resin can be prevented from entering the gap between the lower mold 111 and the lower mold outer peripheral member 112.

Further, in the present invention, the unit (mechanism) for transporting the plate-like member having the protruding electrode (in a state in which the resin is placed or not) is not limited to the configuration of FIGS. 7 to 10, and may have any other configuration. Transfer unit (transport mechanism). For example, in FIGS. 7 to 10, the shape of the release film is a release film in which a long release film is wound into a roll, but is not limited thereto. For example, the shape of the release film may be any shape such as a release film of a short strip, a release film of a long stripe, or a release film wound into a roll. For example, before the release film is supplied in the production method of the present invention, a long release film or a release film wound into a roll may be cut (pre-cut) to form a short release film. In the case of using a pre-cut release film, the above-described transfer step (step of transferring the plate-like member having the protruding electrode to the position of the molding cavity), for example, can be combined with Japanese Patent Laid-Open No. 2013- Figure 1 of the 187340 and the description thereof are performed in the same manner.

[Example 3]

Next, still another embodiment of the present invention will be described. In the present embodiment, still another example of a manufacturing method in which compression molding is performed using a plate-like member having a protruding electrode having a deformed portion is shown.

In the cross-sectional view of the steps of Figs. 13 to 16, the manufacturing method of this embodiment is schematically shown. As shown in FIGS. 13 to 16, this embodiment differs from the second embodiment (FIGS. 7 to 10) in that the shape of the release film 100 and the plate member 11 are not used.

In the present embodiment, the peripheral edge portion of the plate-like member 11 is swelled, so that the central portion becomes a resin accommodating portion. More specifically, as shown in the figure, the peripheral edge portion of the plate-like member 11 is swelled toward the fixing surface side of the protruding electrode 12 of the plate-like member 11, thereby forming the wall-shaped member 11b. Thereby, the central portion of the plate-like member 11 is formed as the resin accommodating portion 11c. In other words, the plate-like member 11 is formed into a tray type (box shape in which the upper surface is open) by bulging its peripheral portion and forming the wall member 11b. Further, the central portion of the plate member 11 is formed by the body (bottom portion) of the plate member 11 and A resin accommodating portion (the above-described tray-shaped recessed portion) 11c surrounded by the wall member (peripheral portion) 11b. Moreover, as shown in the figure, the protruding electrode 12 is fixed to the surface of the main body (bottom portion) of the plate-like member 11 on the side of the resin accommodating portion (recessed portion) 11c. Further, the wall member 11b is a part of the plate-like member 11, which is different from the protruding electrode 12. The wall member 11b may have a function as a heat dissipating member or a shield member for shielding electromagnetic waves, for example. In the case where the plate-like member 11 has the wall-shaped member 11b, the shape of the protruding electrode 12 is not particularly limited, and may be any shape. Preferably, for example, at least one of the protruding electrodes 12 is the above-described plate-like protruding electrode. In the present embodiment, since the resin accommodating portion 11c is provided, it is possible to suppress or prevent the resin (the resin material 41a, the fluid resin 41b, and the sealing resin 41) from coming into contact with the lower cavity bottom member without using the release film, and The resin is inhibited or prevented from entering the gap between the lower mold outer peripheral member and the lower mold cavity bottom member. Therefore, cost can be saved by omitting the release film, and the manufacturing efficiency of the electronic component can be improved by omitting the step of pasting or adsorbing the release film.

In the present embodiment, as shown in Figs. 13 to 16, the compression molding apparatus including the molding die (upper die and lower die) can use the same apparatus as in the second embodiment except for the roller and the intermediate die which do not have the release film. Specifically, as shown in the figure, the above-described compression molding apparatus upper mold 1011 and lower mold 1011 are main components. The lower mold 1011 includes a lower cavity bottom surface member 1011a and a lower mold outer peripheral member (lower mold body) 1012. The lower mold outer peripheral member (lower mold main body) 1012 is a frame-shaped lower mold cavity side member. More specifically, the lower mold outer peripheral member 1012 is disposed to surround the lower cavity bottom surface member 1011a. A gap (adsorption hole) 1011c is provided between the lower cavity bottom surface member 1011a and the lower die outer circumferential member 1012. As shown by an arrow 1014 in FIGS. 14 and 15, the gap 1011c can be decompressed using a vacuum pump (not shown) to adsorb the plate-like member. Further, after the compression molding, as shown by an arrow 1016 in Fig. 16, air is supplied from the gap 1011c in the opposite direction, whereby the plate-like member can be detached. The height of the upper surface of the lower mold peripheral member 1012 is higher than the height of the upper surface of the lower cavity bottom member 1011a. Thereby, the upper surface of the lower cavity bottom surface member 1011a and the inner peripheral surface of the lower mold outer peripheral member 1012 are formed. Lower cavity (recess) 1011b. Further, a hole (through hole) 1003 is opened in the upper mold 1001. Thereby, as shown by an arrow 1007 in Fig. 15, after the mold clamping is performed, suction is performed from the hole 1003 using a vacuum pump (not shown), so that at least the inside of the lower mold cavity 1011b can be depressurized. An elastic O-ring 1012a is attached to the peripheral portion of the upper surface of the lower peripheral member 1012. Further, although not shown, the compression molding apparatus (manufacturing device for electronic components) further includes a resin mounting unit and a conveying unit. The resin mounting unit mounts a resin on a surface on which the projection electrode of the plate-like member having the protruding electrode is formed. The transport unit transports the plate-like member having the protruding electrode to a position of a cavity of the molding die.

As shown in FIGS. 13 to 16, the manufacturing method of the present embodiment is carried out at a position where the plate-like member 11 on which the resin material 41a is placed in the resin containing portion 11c is transported to the lower mold cavity 1011b without using a release film. Further, as shown by an arrow 1014 in Fig. 14, the gap 1011c between the lower mold outer peripheral member 1012 and the lower cavity bottom surface member 1011a is depressurized by a vacuum pump (not shown) to adsorb the plate member 11 to the lower mold. Instead of the release film being adsorbed to the lower die and the lower die outer peripheral member, the cavity 1011b (the upper surface of the lower cavity bottom surface member 1011a and the inner peripheral surface of the lower die outer peripheral member 1012) is replaced. Otherwise, the manufacturing method of the present embodiment (Figs. 13 to 16) can be carried out in the same manner as in Figs. 7 to 10 of the second embodiment.

More specifically, the steps (resin sealing step) shown in FIGS. 15 to 16 can be performed, for example, in the following manner. That is, first, from the state of Fig. 14, the lower mold 1011 is moved up, and the mold surface of the upper mold 1001 is brought into contact with the upper end of the O-ring 1012a of the lower mold. At this time, the required interval is maintained between the upper die face (the die face of the upper die 1001) and the lower die face (the die face of the lower die 1011). That is, before the upper mold 1001 and the lower mold 1011 are completely closed, the mold clamping is performed while maintaining the required interval therebetween. When the middle mold clamping is performed, at least the upper and lower mold faces and the cavity space portion are separated from each other by the O-ring 1012a, so that the outer air partition space portion can be formed. At this time, as shown by an arrow 1007 in Fig. 15, the air in the outer air partition space portion is forcibly sucked and discharged from the hole 1003 of the upper mold, and the inside of the outer air partition space portion can be set to a specific vacuum. degree. Next, close the upper die face (upper die The die face of 1001) and the lower die face (the die face of the lower die 1011) are thereby completely closed. Further, the cavity bottom surface part 1011a is moved up. In this case, as shown in FIG. 15, the resin material 41a is placed in a state of the fluid resin 41b. As a result, as shown in FIG. 15, the bump electrode 12 and the wiring pattern 22 are bonded, and the wafer 31 is immersed in the fluid resin 41b, and the fluid resin 41b in the lower mold cavity 1011b is further pressurized. Further, as described below, the fluid resin 41b is cured, and as shown in Fig. 23, a sealing resin (resin) 41 composed of a cured resin is formed. Thereby, the wafer 31 mounted on the substrate 11 can be compression-molded (sealed and formed) in the resin 41 (cured resin) of a desired shape. More specifically, as shown in FIG. 16, in the lower mold cavity 1011b, the wafer 31 (including the bump electrode and the wiring pattern 22) mounted on the substrate 21 is compression-molded (resin-molded) to a sealing resin composed of a cured resin. In the (resin) 41, a molded package (resin molded body) corresponding to the shape of the lower cavity 1011b can be formed. At this time, the plate-like member 11 is in a state of being attached to the top surface side of the formed package which is opposite to the substrate 21. Further, at this time, due to the pressing force generated by the upward movement of the cavity bottom surface part 1011a, the entire protruding electrode 12 is pressed in the direction perpendicular to the surface direction of the plate-like member 11. By this pressing, as shown in the figure, in the projection electrode 12 designed to be higher than the thickness of the fluid resin 41b, the deformation portion 12A is bent. Thereby, the protruding electrode 12 is contracted in a direction perpendicular to the surface direction of the plate-like member 11 to match the specific thickness of the resin sealing member. Further, as shown in Fig. 16, after the time required for the fluid resin 41b to cure, the two molds of the upper mold and the lower mold are opened. Specifically, the lower mold 1011 (the lower cavity bottom surface member 1011a and the lower mold outer peripheral member 1012) is lowered together with the O-ring 1012a. Thereby, the inside of the lower cavity 1011b is opened to release the pressure reduction. At this time, the pressure reduction (vacuum) of the gap between the lower cavity bottom surface member 1011a and the lower mold outer circumferential member 1012 is released. As indicated by arrow 1016, conversely, air can be delivered into the aforementioned voids. Thereby, an electronic component (molded article) having the plate-like member 11 including the resin containing portion 11c, the substrate 21, the wafer 31, the wiring pattern 22, and the bump electrode 12 can be obtained.

Further, the present embodiment is not limited thereto, and is, for example, the same as FIGS. 11 to 12 of the second embodiment, The resin mounting step may be performed after the above-described transfer step. In this case, as in the second embodiment, it is preferable to heat the plate-like member having the protruding electrode in the lower cavity before the resin mounting step (heating step). Further, in the heating step, for the same reason as in the second embodiment, it is preferred that the plate-like member having the protruding electrode is sufficiently thermally expanded.

Furthermore, in the present invention, the shape of the plate-like member is not limited to the shape of the embodiment and the examples 1 and 2, and may be any shape. For example, the shape of the above-mentioned plate-like member may be the same as that of the plate-like member exemplified in Patent Document 2 (Japanese Patent Laid-Open Publication No. 2013-187340), except that the protruding electrode is fixed to one surface. In Figs. 17 and 18, an example of a manufacturing method (variation) in which the shape of the plate member is changed is shown. In Fig. 17, the plate-like member 11 has a heat sink 11a other than the surface on the opposite side to the fixed surface of the bump electrode 12 (the surface facing the lower cavity bottom surface member 111a in the figure), and Fig. 7 In the same manner as in the second embodiment, the same compression molding apparatus as that of Figs. 7 to 10 can be used in the same manner as in the second embodiment. In Fig. 18, the plate-like member 11 has a heat sink 11a other than the surface on the opposite side to the fixed surface of the bump electrode 12 (the surface facing the lower cavity bottom surface member 1011a in Fig. 18), and Fig. 13 In the same manner as in the third embodiment, the same processing as that of the third embodiment can be carried out in the same manner as in the third embodiment. Further, in the compression molding apparatus of Fig. 18, as shown in the drawing, on the upper surface of the lower cavity bottom surface member 1011a, a concavo-convex shape which can be fitted to the uneven shape of the fins 11a is formed. If such a shape is formed, there is an advantage that the plate member 11 is stabilized in the lower cavity, and the upper surface of the lower cavity bottom member 1011a is less susceptible to damage by the fin. Moreover, as shown in FIG. 18, it is preferable that the heat sink 11a is formed in such a shape that a gap cannot be formed between the lower die outer peripheral member 1012 and the plate member 11. When such a shape is adopted, it is easy to efficiently perform suction by decompression in the lower cavity (arrow 1014).

[Example 4]

Next, still another embodiment of the present invention will be described using Figs. Yu Shishi In the embodiment, a further example of a method of manufacturing a plate-like member having a protruding electrode having a deformed portion is shown.

Fig. 19 is a cross-sectional view schematically showing the manufacturing method of this embodiment. As shown, the manufacturing method is performed using a lower mold 121, an upper mold (rmounter) 122, and a vacuum chamber 123. The upper surface of the lower mold 121 has a flat surface, and the substrate of the electronic component can be placed. The vacuum chamber 123 has a cylindrical shape corresponding to the shape of the electronic component, and can be placed on the substrate of the electronic component. The upper mold 122 is engageable with the inner wall of the vacuum chamber 123.

In the manufacturing method of the present embodiment, the resin material (resin) 41a composed of a liquid resin (thermosetting resin) is printed on the wafer 31 and the wiring pattern 22 on the substrate 21 on which the wafer 31 and the wiring pattern 22 are fixed on one side. On the fixed surface. Then, the bump electrode 12 having the plate-like member having the bump electrode on the one surface of the plate member 11 is fixed to the wiring pattern 22 so as to penetrate the liquid resin 41a. Thereby, the substrate 21, the wafer 31, the liquid resin 41a, the plate-like member 11, and the bump electrode 12 are disposed in the same positional relationship with the positional relationship in the electronic component 20 (FIG. 5) of the finished product. Further, for example, as shown in FIG. 19, the substrate 21, the wafer 31, the liquid resin 41a, the plate-like member 11, and the protruding electrode 12 are disposed on the upper surface of the lower mold 121 in the above-described positional relationship (arrangement). At this time, as shown in the figure, one side of the substrate 21 opposite to the side on which the wafer 31 is disposed is brought into contact with the upper surface of the lower mold 121, and a plate-like member having a protruding electrode is disposed on the surface on the side of the arrangement side of the wafer 31 (plate) The member 11 and the protruding electrode 12) having the deformed portion 12A.

Next, the vacuum chamber 123 is placed on the peripheral portion of the upper surface of the substrate 21, and the portion where the liquid resin 41a is not placed (mounted). Thereby, the periphery of the wafer 31, the liquid resin 41a, the plate-like member 11, and the bump electrode 12 is surrounded by the vacuum chamber 123. Then, the upper mold 122 is lowered from above the wafer 31, the liquid resin 41a, the plate member 11, and the bump electrode 12, and fitted into the inner wall of the vacuum chamber 123. Thereby, the wafer 31, the liquid resin 41a, and the bump electrode 12 are housed in the sealed internal space surrounded by the plate member 11, the vacuum chamber 123, and the upper mold 122. Further, a pressure is reduced in the internal space by using a vacuum pump (not shown). Thereby, the wafer 31. The liquid resin 41a, the plate member 11, and the protruding electrode 12 are pressed by the upper mold 122. At this time, the bump electrode 12 having the deformed portion 12A is in contact with the wiring pattern 22 of the substrate 21. Further, due to the urging force of the upper mold 122, the entire projection electrode 12 is pressed against the direction perpendicular to the surface direction of the plate-like member 11. Due to this pressing, in the projection electrode 12 designed to be higher than the thickness of the liquid resin 41a, the deformation portion 12A is bent. Thereby, the protruding electrode 12 is contracted in a direction perpendicular to the surface direction of the plate-like member 11 to match the specific thickness of the resin sealing member. In this state, the liquid resin (thermosetting resin) 41a is heated and solidified, and the wafer 31 is resin-sealed together with the plate-like member 11 and the bump electrode 12. For example, heating of the liquid resin 41a can be performed by heating of the lower mold 121. Thereby, the same electronic component as the electronic component 20 shown in FIG. 5 can be manufactured.

Furthermore, in the present embodiment, for example, the decompression based on the vacuum chamber can be omitted. However, for example, when air or a gap is not allowed between the plate member and the resin, it is preferable to perform pressure reduction based on the vacuum chamber. Further, when the decompression by the vacuum chamber is omitted, the pressing by the upper mold (mounter) may or may not be performed.

Moreover, the cross-sectional view of Fig. 20 schematically shows a modification of the manufacturing method of the present embodiment. In the manufacturing method of FIG. 20, the printing method of printing the liquid resin (thermosetting resin) 41a on the fixed surface of the wafer 31 and the wiring pattern 22 of the substrate 21 is replaced with the coating method and the fixing of the plate-like member 11 to the protruding electrode 12. The surface on the opposite side (the surface facing the upper mold 122 in Fig. 20) has the fins 11a, and is the same as the manufacturing method of Fig. 19. Further, in the manufacturing method of Fig. 19, a plate-like member having a bump electrode having a heat sink can be used as in Fig. 20; otherwise, in the manufacturing method of Fig. 20, the heat dissipation is not the same as that of Fig. 19. A plate-like member having a protruding electrode for the sheet may also be used. Further, for example, in FIG. 19 or FIG. 20, the resin 41 or 41a is placed on the fixed surface of the wafer 31 and the wiring pattern 22 of the substrate 21 by lamination of a thin resin or a spin coating of a resin, instead of printing of a resin. Or coating method is also available.

[Example 5]

Next, another embodiment of the present invention will be described. In the present embodiment, still another example of a manufacturing method using compression molding is shown.

In the present embodiment, a frame (frame) having a rectangular shape having a through hole (resin supply portion) and an electronic component manufacturing method and a compression molding device (resin sealing device for an electronic component) using a pre-cut release film are used. )Be explained. In the present embodiment, the resin material (particle resin) is transferred to the lower mold cavity in a state where the resin material (particle resin) is placed on the plate-like member having the protruding electrode having the deformation portion. And supplied and installed in the lower mold cavity.

In the present embodiment, the frame body is placed on the release film which has been cut in advance, and the plate-like member having the protruding electrode on which the granular resin is placed is placed in the frame through hole (resin supply portion). On the release film. Thereby, it is possible to prevent the above-mentioned particulate resin from falling from the above-mentioned plate-like member with the protruding electrodes. In the present embodiment, the case where the resin material is a particulate resin will be described, but any resin other than the particulate resin (for example, a powdery resin, a liquid resin, a plate resin, a sheet resin, a film resin, a paste) The resin or the like can also be carried out in the same manner.

Hereinafter, the present embodiment will be described more specifically with reference to Figs. 21 to 24.

First, a compression molding apparatus (manufacturing apparatus for electronic components) of the present embodiment will be described with reference to Fig. 21 . Fig. 21 is a schematic view showing the structure of a part of a molding die (e.g., a metal mold or a ceramic mold) which is a part of the above-described compression molding apparatus. Moreover, Fig. 21 shows a mold opening state before the supply of the resin material to the molding die.

The compression molding apparatus of Fig. 21 is the same as that of the third embodiment (Figs. 13 to 16) in that the forming mold includes the upper mold and the lower mold, but includes the upper mold outer air partition member and the lower mold outer air partition member. This aspect is different. More specifically, it is as follows. That is, as shown in Fig. 21, the compression molding apparatus upper mold 2001 and the upper mold arrangement lower mold 2011 are main constituent elements. The upper mold 2001 is disposed in a state of being lowered at the upper mold base plate 2002. An outer mold outer air partition member 2004 is disposed at an outer peripheral position of the upper mold 2001 on the upper mold bottom plate 2002. to The upper end surface of the upper outer mold air partition member 2004 (the portion sandwiched by the upper mold base plate 2002 and the upper mold outer air partition member 2004) is provided with an O-ring 2004a for blocking the outside air. Further, an O-ring 2004b for blocking the outside air is also provided on the lower end surface of the upper die outer air partition member 2004. Further, in the upper mold base plate 2002, a hole 2003 for forcibly sucking the air in the in-mold space portion and discharging it is provided. The substrate mounting portion 2001a is provided on the die surface (lower surface) of the upper mold 2001, and the substrate 21 on which the wafer 31 is mounted is supplied and disposed such that the wafer 31 mounting surface side faces downward in the substrate mounting portion 2001a. (installation). The substrate 21 can be attached to the substrate installation portion 2001a by, for example, a jig (not shown). Further, similarly to the above-described respective embodiments, the wiring pattern 22 is provided on the mounting surface of the wafer 31 of the substrate 21.

Further, the lower mold 2011 is formed by the lower cavity bottom surface member 2011a, the lower mold outer circumferential member 2012, and the elastic member 2012a. Further, as for the lower mold 2011, a cavity (lower cavity) 2011b as a space for resin molding is included on the die face. The lower cavity bottom surface member 2011a is disposed below the lower cavity 2011b. The lower mold outer peripheral member (the lower mold frame, the cavity side member) 2012 is disposed to surround the lower cavity bottom surface member 2011a. The height of the upper surface of the lower mold outer peripheral member 2012 is higher than the height of the upper surface of the lower mold cavity bottom surface member 2011a. Thereby, the cavity (concave portion) 2011b surrounded by the upper surface of the lower cavity bottom surface member 2011a and the inner circumferential surface of the lower die outer peripheral member 2012 is formed. A gap (adsorption hole) 2011c is formed between the lower cavity bottom surface member 2011 and the lower die outer peripheral member 2012. The void 2011c is decompressed using a vacuum pump (not shown) as described below, so that a release film or the like can be adsorbed. Further, the lower mold 2011 and the lower mold outer peripheral member 2012 are provided in a state of being placed on the lower mold base plate 2010. An elastic member 2012a for cushioning is provided between the lower mold outer peripheral member 2012 and the lower mold bottom plate 2010. Further, a lower-mold outer air blocking member 2013 is provided at an outer peripheral position of the lower mold outer peripheral member 2012 on the lower mold base plate 2010. The O-ring 2013a for blocking the outside air is provided on the lower end surface of the lower mold outer air partition member 2013 (the portion sandwiched by the lower mold base plate 2010 and the lower mold outer air partition member 2013). The lower die outer air partition member 2013 is disposed on the upper die outer air partition member 2004 and It is directly under the O-ring 2004b for blocking the outside air. By having the above configuration, when the two molds of the upper mold and the lower mold are clamped, the outer mold air partition member 2004 including the O-rings 2004a and 2004b and the outer mold gas including the O-ring 2013a are joined. The partition member 2013 can at least bring the inside of the lower cavity into an external air-off state.

Next, a method of manufacturing the electronic component of the present embodiment using the compression molding apparatus will be described. That is, first, as shown in FIG. 21, the substrate 21 is attached to the mold surface of the upper mold 2001 (substrate setting portion 2001a) as described above. Further, as shown in the drawing, the frame resin 70 having a rectangular shape having a through hole is used to supply the pellet resin 41 into the lower cavity 2011b. More specifically, as shown in the drawing, the frame 70 is placed on the release film 100 which has been previously cut into a desired length (precut). At this time, the release film 100 which has been cut beforehand may be adsorbed and fixed on the lower surface of the casing 70. Then, the frame member 70 is inserted through the opening (resin supply portion) on the upper side of the hole, and the plate-like member having the protruding electrode to which the protruding electrode 12 is fixed on one surface of the plate member 11 is placed on the release film 100. At this time, the bump electrode 12 is placed in a state of being directed upward (opposite side of the release film 100). Further, in the present embodiment, as in the second embodiment (Figs. 7 to 10), the plate-like member having the protruding electrodes does not have the wall member 11b and the resin accommodating portion (concave portion) 11c. Further, the pellet resin 41a is supplied (mounted) on the fixing surface of the bump electrode 12 of the plate-like member 11 in a flat state. As a result, as shown in FIG. 21, the granular resin 41a is supplied into the space surrounded by the plate-shaped member 11 and the frame 70, and the "resin supply frame" placed on the release film 100 can be formed. . Further, as shown in FIG. 21, the resin supply frame is conveyed to enter between the upper mold 2001 and the lower mold 2011 in the mold opening state (the position of the lower mold cavity 2011b).

Next, the resin supply frame is placed on the mold surface of the lower mold 2011. At this time, as shown in FIG. 22, the release film 100 is sandwiched between the frame body 70 and the lower mold outer peripheral member 2012, and the frame 70 is inserted through the opening portion on the lower side of the hole and the opening portion of the lower mold cavity 2011b (the lower mold surface). ) Align. Further, as shown by an arrow 2014 in Fig. 22, the adsorption hole 2011c of the lower mold is sucked by a vacuum pump, and the pressure is reduced. Thereby, as shown in the figure, the adsorption on the cavity surface of the lower mold cavity 2011b The release film 100 is covered, and the particulate resin 41 is supplied and disposed in the lower mold cavity 2011b. Further, as shown in the figure, by heating the lower mold 2011, the particulate resin 41a is melted and becomes the state of the fluid resin 41b. Thereafter, the casing 70 is removed by adsorbing the release film 100 to the cavity surface of the lower cavity 2011b by the pressure reduction 2014.

Next, the two molds of the upper mold and the lower mold are clamped. First, as shown in FIG. 23, an intermediate mold clamping is performed in a state in which the substrate surface (the fixed surface of the wafer 31 of the substrate 21) and the lower mold surface are maintained at a desired interval. That is, first, in a state where the frame 70 is removed from the structure of Fig. 22, the lower mold 2011 side is moved up. Thereby, as shown in FIG. 23, the upper-mold outer air blocking member 2004 and the lower-mold outer air blocking member 2013 are closed in a state in which the O-ring 2004b is sandwiched. Thereby, as shown in FIG. 23, the air-interrupting space portion surrounded by the upper mold 2001, the lower mold 2011, the upper-mold outer air blocking member 2004, and the lower-mold outer air blocking member 2013 is formed. In this state, as shown by an arrow 2007 in FIG. 23, a vacuum pump (not shown) is used to suck at least the outer air partition space portion through the hole 2003 of the upper mold base plate 2002, and to reduce the pressure. Set to a specific vacuum.

Further, as shown in FIG. 24, the substrate surface and the lower mold surface are joined to perform complete mold clamping. That is, from the state of Fig. 23, the lower mold 2011 is further moved up. As a result, as shown in FIG. 24, the upper surface of the lower mold outer peripheral member 2012 is in contact with the substrate surface (the fixed surface of the wafer 31) of the substrate 21 supplied and provided at the upper mold 2001 via the release film 100. . Thereafter, the lower mold base plate 2010 is further moved upward, whereby the lower cavity bottom surface member 2011a is further moved upward. At this time, as described above, the resin is placed in a state of the fluid resin 41b. As a result, as shown in FIG. 24, the front end of the bump electrode 12 is brought into contact (contact) with the wiring pattern 22 of the substrate 21, and the wafer 31 is immersed in the fluid mold resin 41b in the lower mold cavity 2011b, and further, The fluid resin 41b is pressurized. At this time, the entire projection electrode 12 is pressed in the direction perpendicular to the surface direction of the plate-like member 11 by the pressing force of the lower cavity bottom surface member 2011a. By this pressing, as shown in the figure, in the projection electrode 12 designed to be higher than the thickness of the fluid resin 41b, the deformation portion 12A is bent. Thereby, the protruding electrode 12 is on the side of the plate member 11 Shrinks in the vertical direction to match the specific thickness of the resin sealing part. At this time, as shown in the figure, the elastic member 2012a and the O-rings 2004a, 2004b, and 2013a are contracted to function as a buffer. Thereby, as described above, the fluid resin 41b is pressurized and compression-molded. Thereafter, the fluid resin 41b is cured to form a sealing resin. Thereby, between the fixing surface of the bump electrode 12 on the plate member 11 and the surface on which the wiring pattern 22 of the substrate 21 is formed, the wafer 31 is sealed by the sealing resin, and the bump electrode 12 and the wiring pattern 22 can be made. Contact (resin sealing step). After the time required for the curing of the fluid resin 41b, the two molds of the upper mold and the lower mold were opened in the same manner as in Example 2 or 3 (Fig. 10 or 16). Thereby, in the lower cavity 2011b, a molded article (electronic component) including the substrate 21, the wafer 31, the wiring pattern 22, the resin (sealing resin) 41, the bump electrode 12, and the plate member 11 can be obtained.

Further, in the present embodiment, the configuration of the compression molding apparatus (manufacturing apparatus for electronic parts) is not limited to the configuration of Figs. 21 to 24, and may be, for example, the same as or based on the configuration of a general compression molding apparatus. Specifically, for example, Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The structure disclosed in Japanese Laid-Open Patent Publication No. 2010-036542 or the like is the same or based on it.

The present invention is not limited to the above-described embodiments, and may be combined, changed, or selected as desired, without departing from the spirit and scope of the invention.

For example, the shape of the above-mentioned protruding electrode of the plate-like member having the protruding electrode is not limited to the shape shown in Figs. 2 to 4, and may be any shape. As an example, as described above, at least a part of the protruding electrodes may have a plate shape. Further, on the substrate surface, the plate-shaped electrode can be used to divide the required range corresponding to one electronic component (one product unit).

10‧‧‧Plate-like members with protruding electrodes

11‧‧‧ Plate-like members

12‧‧‧ protruding electrode

12A‧‧‧Deformation Department

21‧‧‧Substrate

22‧‧‧Wiring pattern

31‧‧‧ wafer (electronic parts before resin sealing)

41‧‧‧Resin (sealing resin)

50‧‧‧ Forming die

51‧‧‧上模

52‧‧‧Down

53‧‧‧Plunger

54‧‧‧feeding cavity (hole)

55‧‧‧Resin channel

56‧‧‧ cavity

57‧‧‧Substrate setting department

Claims (40)

A manufacturing method for manufacturing an electronic component in which a wafer is resin-sealed, wherein the electronic component to be manufactured includes a substrate, a wafer, a resin, a plate member, and a bump electrode, and is formed on the substrate An electronic component of a wiring pattern; wherein the manufacturing method has a resin sealing step of sealing the wafer with the resin; and in the resin sealing step, the fixing surface of the protruding electrode of the plate-shaped member having the protruding electrode and the substrate are Between the formation faces of the wiring patterns, the wafer is sealed by the resin, and the protruding electrodes are brought into contact with the wiring pattern, wherein the plate-shaped member having the protruding electrodes is on one side of the plate-shaped member The above-mentioned protruding electrode is fixed, and the protruding electrode includes a deformable deformation portion. The manufacturing method of claim 1, wherein at least one of the protruding electrodes is a lightning-shaped protruding electrode; and when the lightning-shaped protruding electrode is viewed from a direction parallel to a surface direction of the plate-shaped member, at least the deformed portion is curved into a lightning bolt shape. Therefore, the deformed portion can be contracted in a direction perpendicular to the surface direction of the plate-like member. The manufacturing method of claim 1 or 2, wherein at least one of the protruding electrodes is a protruding electrode with a through hole; and the through hole of the protruding electrode with the through hole is in a direction parallel to a plane direction of the plate member a through hole penetrating therethrough, wherein the periphery of the through hole is a deformable deformation portion, and is fixed to the plate member in the protruding electrode with the through hole One end is formed at one end of the opposite side, and has a protrusion that protrudes in a direction perpendicular to the plate surface of the above-mentioned plate-like member. The manufacturing method of claim 1 or 2, wherein at least one of the protruding electrodes is a columnar protruding electrode having a columnar shape. The manufacturing method of claim 1 or 2, wherein at least one of the protruding electrodes is a plate-like protruding electrode; the plurality of the wafers are plural; and in the resin sealing step, the substrate is divided into a plurality of the plurality of the plate-shaped protruding electrodes The wafer is resin-sealed in the region and in each of the above regions. The manufacturing method of claim 5, wherein the plate-like projection electrode has a through hole and a protrusion, and the through hole penetrates the plate-shaped projection electrode in a direction parallel to a plate surface of the plate-shaped member, and the periphery of the through hole is The deformed portion is deformed at one end of the plate-like projecting electrode that is fixed to one end of the plate-like member, and the protrusion protrudes in a direction perpendicular to a plate surface of the plate-shaped member. The manufacturing method of claim 1 or 2, wherein the plate-like member is a heat dissipation plate or a shield plate. The manufacturing method of claim 1 or 2, wherein in the resin sealing step, the wafer is resin-sealed by transfer molding. The manufacturing method of claim 1 or 2, wherein in the resin sealing step, the wafer is resin-sealed by compression molding. The manufacturing method of claim 9, further comprising: a resin mounting step of placing the resin on a fixing surface of the protruding electrode of the plate-like member having the protruding electrode; a transporting step of transporting the plate-like member having the protruding electrode to a cavity position of the molding die; and in the cavity, the wafer is immersed in the resin placed on the plate-shaped member, and the The resin is subjected to the above-described resin sealing step by compression molding together with the above-described plate-like member having the protruding electrodes and the above-mentioned wafer. The manufacturing method of claim 10, wherein in the transferring step, the resin is placed on the plate-like member having the protruding electrode, and is transported together with the plate-shaped member having the protruding electrode to The cavity position of the above forming die. The manufacturing method of claim 10, wherein the plate-shaped member having the protruding electrode is conveyed to a cavity position of the molding die without being placed on the resin in the conveying step; the manufacturing method further includes a heating step of heating the plate-like member having the protruding electrode in the cavity before performing the resin mounting step; and in the cavity in a state in which the plate-shaped member with the protruding electrode is heated The resin mounting step described above is carried out. The manufacturing method of claim 10, wherein in the transporting step, the plate-shaped member having the protruding electrode is placed on the release film with the surface on which the protruding electrode is fixed upward, A plate-like member having a protruding electrode is conveyed into the cavity of the above-mentioned forming die. The manufacturing method of claim 13, wherein in the carrying step, the frame body is placed on the release film together with the plate-like member having the protruding electrode, and the plate-like member having the protruding electrode is The plate-like member having the protruding electrode is conveyed into the cavity of the forming die in a state in which the frame is surrounded. The manufacturing method of claim 14, wherein in the resin mounting step, The frame body is placed on the release film together with the plate-like member having the protruding electrode, and the plate-shaped member having the protruding electrode is surrounded by the frame body, and the projection electrode is provided The resin is supplied into the space surrounded by the plate member and the frame, whereby the resin is placed on the fixing surface of the protruding electrode. The manufacturing method of claim 15, wherein the resin mounting step is performed before the transferring step. The method of claim 13, wherein the surface of the plate-like member having the protruding electrode and the surface opposite to the surface on which the protruding electrode is fixed is fixed to the release film by an adhesive. The manufacturing method of claim 10, wherein the plate-shaped member has a resin accommodating portion; in the resin mounting step, the resin is placed in the resin accommodating portion; and the resin is placed in the resin accommodating portion. The above resin sealing step is carried out. The manufacturing method of claim 9, wherein in the resin sealing step, the substrate on which the wafer is disposed on the surface on which the wiring pattern is formed is placed on the substrate stage in such a manner that the formation surface of the wiring pattern faces upward Further, the resin is pressed while the resin is placed on the surface on which the wiring pattern is formed. The manufacturing method of claim 1 or 2, wherein the plate-like member is a heat dissipation plate; and the heat dissipation plate has a heat sink on a surface opposite to a fixing surface of the protruding electrode. The manufacturing method of claim 1 or 2, wherein the above resin is a thermoplastic resin or a thermosetting resin. The manufacturing method of claim 1 or 2, wherein the resin is selected from the group consisting of a granular resin, At least one of a group consisting of a powdery resin, a liquid resin, a plate resin, a sheet resin, a film resin, and a paste resin. The manufacturing method of claim 1 or 2, wherein the resin is at least one selected from the group consisting of a transparent resin, a translucent resin, and an opaque resin. A plate-like member having a protruding electrode, wherein the plate-like member having the protruding electrode is a plate-like member having a protruding electrode used in the manufacturing method according to any one of claims 1 to 23 The protrusion electrode is fixed to one surface of the plate member. A plate-like member having a projecting electrode according to claim 24, wherein at least one of said protruding electrodes is said lightning-shaped protruding electrode as claimed in claim 2. A plate-like member having a projecting electrode according to claim 24 or 25, wherein at least one of said protruding electrodes is said plate-like projecting electrode as claimed in claim 5. A plate-like member having a projecting electrode according to claim 26, wherein the plate-like projecting electrode is a plate-like projecting electrode having the through hole and the protrusion as claimed in claim 6. A plate-like member having a projecting electrode according to claim 24 or 25, wherein at least one of said protruding electrodes is the above-mentioned protruding electrode with a through hole as claimed in claim 3. A plate-like member having a projecting electrode according to claim 24 or 25, wherein at least one of said protruding electrodes is a columnar projecting electrode as claimed in claim 4. A plate-like member having a projecting electrode according to claim 24 or 25, wherein said plate-like member has a resin containing portion. The plate-like member having the projecting electrode of claim 30, wherein a peripheral edge portion of the plate-like member is swelled toward a fixing surface side of the protruding electrode of the plate-shaped member, and a central portion of the plate-shaped member forms the resin accommodating portion . A plate-like member having a projecting electrode according to claim 24 or 25, wherein one of the plate-like members is partially punched, and the punched portion is bent in a direction perpendicular to a direction of a surface of the plate-like member, thereby forming The above protruding electrode. A method of producing a plate-like member having a protruding electrode according to any one of claims 24 to 32, comprising the step of forming said protruding electrode by etching said plate-shaped member formed of a metal plate. A method of producing a plate-like member having a protruding electrode according to any one of claims 24 to 32, comprising the step of joining said plate-like member formed of a metal plate to said protruding electrode. A method of producing a plate-like member having a projecting electrode according to any one of claims 24 to 32, comprising the step of simultaneously molding said plate-like member and said projecting electrode by electroforming. A method of producing a plate-like member having a protruding electrode according to any one of claims 24 to 32, comprising the step of simultaneously molding the plate-like member and the protruding electrode by a conductive resin. A method of producing a plate-like member having a protruding electrode according to any one of claims 24 to 32, comprising the step of joining said protruding electrode to said plate-like member formed of a conductive resin. A method of manufacturing a plate-like member having a projecting electrode according to any one of claims 24 to 32, wherein said plate-like member is formed of a resin plate; and said manufacturing method comprises attaching a conductive coating film to said plate-like member and The above steps of protruding electrodes. A method of manufacturing a plate-like member having a protruding electrode according to any one of claims 24 to 32, wherein said plate-like member is formed of a metal plate; and said manufacturing method comprises punching a portion of said metal plate The step of bending to form the above-mentioned protruding electrode. An electronic component characterized in that The electronic component is an electronic component that resin-seales the wafer; the electronic component includes a substrate, a wafer, a resin, and a plate-like member having a protruding electrode according to any one of claims 24 to 32; wherein the wafer is disposed on the substrate And being sealed by the resin; a wiring pattern is formed on the side of the wafer on the substrate; and the protruding electrode is in contact with the wiring pattern through the resin.