JP2017188560A - Resin sealing apparatus and resin sealing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a resin sealing apparatus which is adaptive to even a product of such a type that needs a complicated manufacturing form, such as a substrate double molding method or double-side molding method, and which can cope with a change in product type; and a resin sealing method.SOLUTION: A resin sealing apparatus comprises: a first molding module 10 for sealing, by a resin, one face of a substrate; a second molding module 20 for sealing, by a resin, the one or other face of the substrate; a first resin-supplying module 30 for supplying the first molding module 10 with a resin material; a second resin-supplying module 40 for supplying the second molding module 20 with a resin material; a substrate-supplying module for supplying the substrate to a predetermined position of each molding module; and a control module 60 having a control part 61 for controlling the action of each of the molding modules, the resin-supplying modules, and the substrate-supplying module. The first molding module 10, the second molding module 20, and the control module 60 can be removably attached to at least one of the other modules.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin sealing device and a resin sealing method.

  In the manufacture of an electronic component in which a chip is sealed with a resin, it is possible to adjust the production amount of each device (each type) by making it possible to increase or decrease the number of molds (for example, Patent Document 1).

JP 61-148016 A

  On the other hand, there is a demand for miniaturization of electronic components such as wire diameter reduction and 3D packages in which chips are mounted on both sides of a substrate. For example, there is a need to mount an IC or a passive component on both sides of a module substrate from the area efficiency of a mobile phone IC module, etc., and to seal the both sides with resin from the viewpoint of increasing strength and improving reliability. For this reason, after one surface of the substrate is resin-sealed, a manufacturing method such as a double-molding method in which the one surface is further resin-sealed, or a double-sided molding method in which both surfaces of the substrate are resin-sealed is required. Become.

  However, in the resin sealing device corresponding to the product that requires a complicated production form such as the double-molding method of the substrate and the double-sided molding method, the molding device becomes complicated. It is no longer possible to switch product types by simply replacing substrate supply parts, resin supply parts, and the like. Specifically, for example, it is difficult to switch the type from double molding to double-side molding. Therefore, the resin sealing device corresponding to the product that requires a complicated manufacturing form may result in a dedicated device of one product.

  Therefore, the present invention is capable of dealing with a variety of products that require complicated production forms such as a double-molding method and a double-sided molding method for the substrate, and a resin-sealing device and a resin-sealing device that can cope with product type switching. The purpose is to provide a method.

In order to achieve the above object, the resin sealing device of the present invention comprises:
A resin sealing device for resin sealing one surface or both surfaces (one surface and the other surface) of a substrate,
A first molding module for resin-sealing the one surface of the substrate;
A second molding module for resin-sealing the one surface or the other surface of the substrate;
A first resin supply module for supplying a resin material to the first molding module;
A second resin supply module for supplying a resin material to the second molding module;
A substrate supply module for supplying the substrate to a predetermined position of each molding module;
A control module having a control unit for controlling the operation of each module,
The first molding module, the second molding module, and the control module are detachable from each other with respect to at least one other module.

The resin sealing method of the present invention comprises:
A resin sealing method for resin sealing one side or both sides (one side and the other side) of a substrate,
Using the resin sealing device of the present invention,
A substrate supply step of supplying the substrate to a predetermined position of each molding module by the substrate supply module;
A first resin supply step of supplying a resin material to the first molding module by the first resin supply module;
A second resin supply step of supplying a resin material to the second molding module by the second resin supply module;
A first resin sealing step of resin-sealing the one surface of the substrate by the first molding module;
A second resin sealing step of resin-sealing the one surface or the other surface of the substrate by the second molding module,
The operation of each step is controlled by the control unit of the control module.

  According to the present invention, for example, a resin sealing device and a resin that can cope with a variety of products that require complicated production forms such as a double-molding method and a double-sided molding method of the substrate, and that can cope with switching of the products A sealing method can be provided.

FIG. 1 is a plan view illustrating an example of a resin sealing device according to the first embodiment. FIG. 2 is a cross-sectional view illustrating an example of a process of the resin sealing method using the first molding module of the resin sealing apparatus of Example 1. FIG. 3 is a cross-sectional view illustrating another step of the same resin sealing method as FIG. FIG. 4 is a cross-sectional view illustrating still another process of the same resin sealing method as FIG. FIG. 5 is a cross-sectional view illustrating yet another process of the same resin sealing method as FIG. FIG. 6 is a cross-sectional view illustrating still another process of the same resin sealing method as in FIG. FIG. 7 is a cross-sectional view illustrating still another process of the same resin sealing method as in FIG. FIG. 8 shows a chip that is resin-sealed by using the first molding module of the resin-sealing device of Example 1, and is further double-sealed by using the second molding module of the resin-sealing device. It is sectional drawing which shows an example of the process in the method to do. FIG. 9 is a cross-sectional view illustrating another process of the same resin sealing method as FIG. FIG. 10 is a cross-sectional view illustrating still another process of the same resin sealing method as FIG. FIG. 11 is a cross-sectional view illustrating still another step of the same resin sealing method as FIG. FIG. 12 is a cross-sectional view illustrating still another process of the same resin sealing method as FIG. FIG. 13 is a cross-sectional view schematically showing the structure of an electronic component molded by the resin sealing method of FIGS. FIG. 14 is a plan view illustrating another example of the resin sealing device according to the first embodiment. FIG. 15 is a plan view illustrating still another example of the resin sealing device according to the first embodiment. FIG. 16 is a plan view illustrating still another example of the resin sealing device according to the first embodiment. FIG. 17 is a plan view illustrating still another example of the resin sealing device according to the first embodiment. FIG. 18 is a plan view illustrating still another example of the resin sealing device according to the first embodiment. FIG. 19 is a plan view illustrating still another example of the resin sealing device according to the first embodiment. FIG. 20 is a plan view illustrating still another example of the resin sealing device according to the first embodiment. FIG. 21 is a plan view illustrating still another example of the resin sealing device according to the first embodiment. FIG. 22 is a cross-sectional view schematically illustrating the structure of the first molding module 10 of FIG. FIG. 23 is a cross-sectional view schematically illustrating the structure of the second molding module 20A in FIG. FIG. 24 is a cross-sectional view illustrating an example of one step in the resin sealing method using the resin sealing device of FIG. FIG. 25 is a cross-sectional view illustrating another step in the same resin sealing method as FIG. FIG. 26 is a cross-sectional view illustrating still another step in the same resin sealing method as FIG. FIG. 27 is a cross-sectional view illustrating still another step in the same resin sealing method as FIG. FIG. 28 is a cross-sectional view illustrating yet another step in the same resin sealing method as FIG. FIG. 29 is a cross-sectional view illustrating still another process in the same resin sealing method as FIG. FIG. 30 is a cross-sectional view illustrating yet another step in the same resin sealing method as FIG. FIGS. 31A and 31B are cross-sectional views illustrating a substrate that is resin-sealed by the first molding module of the resin sealing device of the second embodiment.

  Next, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.

  As described above, the resin sealing device of the present invention is a resin sealing device for resin-sealing one surface or both surfaces (one surface and the other surface) of a substrate, A first molding module for resin-sealing a surface, a second molding module for resin-sealing the one surface or the other surface of the substrate, and a first material module for supplying a resin material to the first molding module. 1 resin supply module; a second resin supply module that supplies a resin material to the second molding module; a substrate supply module that supplies the substrate to a predetermined position of each molding module; and A control module having a control unit for controlling operation, wherein the first molding module, the second molding module, and the control module are included in at least one other module. And, characterized in that it is detachable from each other.

  In the present invention, the resin (resin material) is not particularly limited, and may be a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. Further, it may be a composite material partially including a thermosetting resin or a thermoplastic resin. Examples of the form of the resin to be supplied include a granular resin, a fluid resin, a sheet-like resin, a tablet-like resin, and a powdery resin. In the present invention, the fluid resin is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. In the present invention, the liquid resin refers to, for example, a resin that is liquid at room temperature or has fluidity. In the present invention, the molten resin refers to, for example, a resin that is in a liquid or fluid state by melting. The form of the resin may be other forms as long as it can be supplied to a cavity, pot, or the like of the mold.

  As described above, in the resin sealing device corresponding to the type that requires a complicated manufacturing form such as the double-molding method of the substrate and the double-sided molding method, the molding device becomes complicated. It is not possible to change the product type only by replacement, replacement of substrate supply parts, resin supply parts, and the like.

  In contrast, in the resin sealing device of the present invention, the first molding module, the second molding module, and the control module are detachable from each other with respect to at least one other module. For this reason, the resin sealing device of the present invention can flexibly handle the required combination even in complicated manufacturing forms such as the double-molding method and double-sided molding method of the substrate. It can be handled by manufacturing equipment.

  In the resin sealing device of the present invention, it is preferable that at least one of the substrate supply module, the first resin supply module, and the second resin supply module is incorporated in the control module. Thereby, the said resin sealing apparatus can be simplified.

  In the resin sealing device of the present invention, at least one of the first resin supply module, the second resin supply module, and the substrate supply module can be attached to and detached from at least one other module. It is preferable. Thereby, for example, a single manufacturing apparatus can cope with complicated manufacturing forms such as the double-molding method and double-side molding method of the substrate.

  The resin sealing device of the present invention may be, for example, a resin molding device for double molding that performs resin sealing of one surface of the substrate in a double manner, or both surfaces of the substrate are resin sealed. It may be a resin sealing device for double-sided molding. Specifically, for example, the first molding module is resin-sealed on one surface of the substrate, and the second molding module is resin-sealed by the first molding module. The one surface may be further resin-sealed (double molding). In addition, for example, the first molding module may be resin-sealed on one surface of the substrate, and the second molding module may be resin-sealed on the other surface of the substrate (double-sided molding). .

  In the resin sealing device of the present invention, for example, at least one of the first resin supply module and the second resin supply module may supply thermally conductive particles together with the resin.

  In the resin sealing device of the present invention, it is preferable that the first resin supply module also serves as the second resin supply module. Thereby, the said resin sealing apparatus can be simplified.

  In the resin sealing device of the present invention, the first molding module and the second molding module are disposed adjacent to each other, and the first molding module is adjacent to the second molding module. An end opposite to the one end is adjacent to the first resin supply module, and the second molding module is the other end opposite to the one end adjacent to the first molding module and the second Adjacent to the resin supply module is preferable from the viewpoint of improving productivity.

  In the resin sealing device of the present invention, when the first resin supply module also serves as the second resin supply module, the first molding module and the second molding module are disposed adjacent to each other. From the viewpoint of improving productivity, the first molding module is adjacent to the first resin supply module at the end opposite to the one end adjacent to the second molding module. preferable.

  The resin sealing device of the present invention includes a pair of the first molding module, the second molding module, the first resin supply module, and the second resin supply module, respectively, on both sides of the control module. From the viewpoint of improving productivity, it is preferable that the molding modules and the resin supply modules are arranged one by one.

  In the resin sealing device of the present invention, for example, the first molding module may be a molding module for compression molding, and the second molding module may be a molding module for transfer molding. Alternatively, in the resin sealing device of the present invention, for example, both the first molding module and the second molding module may be compression molding modules. The molding module for transfer molding may be, for example, a form using a top gate module.

  In the resin sealing device of the present invention, for example, the first molding module may be a compression molding module for compression molding, and may further include a high pressure gas supply module for supplying high pressure gas to the compression molding module. Good. In this case, the compression molding module and the high-pressure gas supply module are arranged adjacent to each other, and the high-pressure gas supply module is attachable to and detachable from at least one other module. From the viewpoint of improving the property. The high-pressure gas supplied from the high-pressure gas supply module is not particularly limited, and may be compressed air, for example.

  The resin sealing device of the present invention may further include a plate-like member supply module that supplies a plate-like member to at least one of the first resin supply module and the second resin supply module. In this case, at least one of the first resin supply module and the second resin supply module is placed on the first molding module or the second molding module with the resin placed on the plate-like member. Supplying the resin placed on the plate-like member, and at least one of the first molding module and the second molding module has one surface or both surfaces (one surface and the other surface) of the substrate, The plate-shaped member is sealed with resin, and the plate-shaped member supply module may be detachable from each other with respect to at least one other module.

  The plate-like member is not particularly limited, but may be, for example, a heat-dissipating plate-like member (heat sink) or a shielding plate-like member that blocks electromagnetic waves (EMI or barrier metal for EMC countermeasures). It may be both of the plate member for heat dissipation and the plate member for shielding.

  In the resin sealing device of the present invention, each of the first resin supply unit and the second resin supply unit has the first molding module and the second resin in a state where the resin is placed on a release film, respectively. The resin may be supplied to the molding module. Further, each of the first resin supply means and the second resin supply means places the frame member on the release film, and puts the resin in the through-hole. The resin may be supplied to the module and the second molding module.

  An example of a substrate to be resin-sealed by the resin-sealing device of the present invention is a mounting substrate in which a chip is mounted on one surface or both surfaces (one surface and the other surface). As the mounting substrate, for example, as shown in FIG. 31 (a), a chip 1 and a wire 3 for electrically connecting the chip 1 and the substrate 2 are provided on one of both surfaces thereof. The other is a mounting substrate 7 provided with a flip chip 4 and ball terminals 5 as external terminals. When only one surface is resin-sealed, the mounting substrate is a wire 3 for electrically connecting the chip 1 and the chip 1 and the substrate 2 to only one of both surfaces of FIG. The mounting board comprised from these may be sufficient. In the present invention, the material of the substrate to be resin-sealed is not particularly limited, but may be a glass epoxy substrate, for example. In the present invention, the “substrate” may be, for example, a lead frame or a silicon wafer. In addition, the shape of the substrate may be any shape and form as long as it can be molded. For example, a rectangular or circular substrate in plan view may be used.

  Here, when molding both surfaces of the substrate having the above-described configuration, it is necessary to expose the ball terminal 5 from at least one surface. When the ball terminal 5 is exposed on the compression molding side, the ball terminal 5 is preferably pressed against the release film to be exposed. Further, if necessary, after the resin sealing, the sealing resin may be subjected to a grinding process or the like in order to expose the ball terminal 5. On the other hand, when the terminals are exposed on the transfer molding side, for example, as shown in the mounting substrate of FIG. 31B, instead of the ball terminal 5, the exposed surface is a flat terminal 6 and is used for transfer molding. It is preferable to perform mold clamping in advance with a convex portion provided on the mold of the molding module, and press and expose the flat terminal 6. The mounting board 7 in FIG. 31 (b) is not provided with the ball terminal 5 of the mounting board 7 in FIG. 31 (a) on the one surface but on the other surface, and is a flat terminal 6. Is the same as the mounting substrate 7 of FIG. This is preferable because reliable exposure is possible.

  Next, the resin sealing method of the present invention will be described. As described above, the resin sealing method of the present invention is a resin sealing method for resin sealing one surface or both surfaces (one surface and the other surface) of the substrate, and the resin sealing method of the present invention. A substrate supply step of supplying the substrate to a predetermined position of each molding module by the substrate supply module using a stopper, and supplying a resin material to the first molding module by the first resin supply module A first resin supply step, a second resin supply step of supplying a resin material to the second molding module by the second resin supply module, and the first molding module of the substrate. A first resin sealing step of resin-sealing one surface, and a second resin sealing step of resin-sealing the one surface or the other surface of the substrate by the second molding module; Including By the control unit of the control module, and controls the operation of each module.

  In the resin sealing method of the present invention, the first molding module, the second molding module, and the control module are detachable from each other with respect to at least one other module. Can be done. For this reason, it is possible to deal with various products with one molding device by rearranging the modules.

  In the resin sealing method of the present invention, for example, after sealing the one surface by the first resin sealing step, the one surface is further sealed by the second resin sealing step. It may be a method of stopping (double molding method), or a method of resin sealing both sides of the substrate by the first resin sealing step and the second resin sealing step (double side molding method). It may be.

  In the resin sealing method of the present invention, for example, the first resin supply module also serves as the second resin supply module, and in the second resin supply step, the first resin supply module Resin may be supplied to the second molding module.

  In the resin sealing method of the present invention, for example, in the first resin sealing step, the one surface of the substrate is resin-sealed by compression molding, and in the second resin sealing step, The one surface or the other surface may be resin-sealed by transfer molding.

  The resin sealing method of the present invention further includes, for example, a high-pressure gas supply step of supplying high-pressure gas by the high-pressure gas supply module, and is supplied by the high-pressure gas supply step in the first resin sealing step. The one surface of the substrate may be resin-sealed by compression molding using the compression molding module using the high pressure gas. The high-pressure gas supplied in the high-pressure gas supply step is not particularly limited as described above, but may be compressed air, for example.

  In the resin sealing method of the present invention, for example, the plate-shaped member supply module supplies the plate-shaped member to at least one of the first resin supply module and the second resin supply module by the plate-shaped member supply module. And at least one of the first resin supply step and the second resin supply step, the first molding module and the second molding in a state where a resin material is placed on the plate-like member. A resin material placed on the plate-like member is supplied to at least one of the modules, and at least one of the first molding module and the second molding module is one surface or both surfaces of the substrate (one surface and The other surface) may be resin-sealed together with the plate-like member.

  In general, the term “electronic component” may refer to a chip before resin-sealing or a state in which the chip is resin-sealed. In the present invention, the term “electronic component” Unless otherwise specified, it means an electronic component (an electronic component as a finished product) in which the chip is sealed with a resin. In the present invention, “chip” refers to a chip before resin sealing, and specifically includes chips such as ICs, semiconductor chips, and semiconductor elements for power control. In the present invention, the chip before resin sealing is referred to as “chip” for convenience in order to distinguish it from the electronic component after resin sealing. However, the “chip” in the present invention is not particularly limited as long as it is a chip before resin sealing, and may not be in a chip shape.

  In the present invention, “flip chip” refers to an IC chip having bump-like protruding electrodes called bumps on an electrode (bonding pad) on the surface of the IC chip, or such a chip form. This chip is mounted downward (face down) on a wiring portion such as a printed circuit board. The flip chip is used as, for example, a chip for wireless bonding or one of mounting methods.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, each drawing is schematically drawn with appropriate omission, exaggeration, and the like.

  In this example, an example of the resin sealing device and the resin sealing method of the present invention will be described.

  The plan view of FIG. 1 schematically shows the configuration of the resin sealing device 100 of the present embodiment. As shown, the apparatus 100 includes a first molding module 10, a second molding module 20, a first resin supply module 30, a second resin supply module 40, a heat sink barrier metal supply module 50, And a control module 60. The apparatus 100 of FIG. 1 has a configuration in which the substrate supply module is incorporated in a control module 60 as described later. In addition, although it does not specifically limit as a board | substrate for resin-sealing using the resin sealing apparatus 100, For example, you may use the board | substrate 2 similar to Fig.31 (a).

  The first molding module 10 is a compression molding module for compression molding, and includes, for example, a molding die 10a for compression molding. For example, the first molding module 10 seals one surface of the substrate 2 with a molding die 10a by compression molding. The second molding module 20 is a compression molding module for compression molding, and includes, for example, a molding die 20a for compression molding. For example, the second molding module 20 further seals the one surface of the substrate 2 with a molding die 20a by compression molding.

  The first resin supply module 30 and the second resin supply module 40 each include, for example, a resin transport unit 31 (41) and a resin supply unit 32 (42). Resin supply means 32 (42) supplies resin from a resin supply source, for example, and resin conveyance means 31 (41) conveys resin to the 1st (2nd) molding module 10 (20). For example, the resin supply means 32 (42) may supply a release film from a release film supply source in addition to the resin, and the resin transport means 31 (41) places the resin on the release film. In the state, the resin may be conveyed to the first (second) molding module 10 (20). Furthermore, the resin supply means 32 (42) may supply a frame member placed on the release film from a frame member supply source, for example.

  The heat sink barrier metal supply module 50 corresponds to the plate member supply module of the present invention. The heat sink barrier metal supply module 50 includes, for example, a heat sink barrier metal supply means 51. The heat sink barrier metal supply means 51 includes, for example, the second resin supply module 40, the heat dissipation plate member, and the shield plate member. At least one (plate member) is supplied. In this embodiment, the heat sink barrier metal supply module 50 is not an essential component.

  The control module 60 includes a control unit 61 that controls the operation of each module, a substrate supply storage unit 62 that stores a substrate supplied from a substrate supply source (not shown), and supplies the substrate to a predetermined position of each molding module. And a substrate transfer means 63. The control module 60 of the apparatus 100 of FIG. 1 includes a substrate supply / accommodation unit 62 and a substrate transfer means 63 so that the control module 60 also serves as the substrate supply module.

  The modules are detachable from each other with respect to at least one other module. Thereby, the apparatus 100 of a present Example can respond | correspond with one manufacturing apparatus even if it is complicated manufacture forms, such as the double forming method of the said board | substrate, the double-sided forming method.

  In the apparatus 100 of the present embodiment, the first molding module 10 and the second molding module 20 are arranged adjacent to each other, and the first molding module 10 has one end adjacent to the second molding module 20. Is adjacent to the first resin supply module 30. The second molding module 20 is adjacent to the second resin supply module 40 at the end opposite to the one end adjacent to the first molding module 10. Thus, productivity can be improved by defining the position of each module.

  In the resin sealing device 100 of the present embodiment, for example, the first resin supply module 30 may also serve as the second resin supply module 40. In this case, the second resin supply module 40 may be removed from the apparatus 100.

  Next, an example of the resin sealing method of a present Example is demonstrated using FIGS. 2 to 12 show an example of a double molding method in which one surface of a substrate is double-resin-sealed (molded).

  2-7 is an example of the resin sealing method using the 1st shaping | molding module 10 and the shaping | molding die 10a for compression molding in FIG. 8 to 12 are examples of a resin sealing method using the second molding module 20 and the molding die 20a for compression molding in FIG. First, the molds 10a and 20a for compression molding in FIG. 1 will be described with reference to FIGS.

  The molding die 10a for compression molding included in the first molding module 10 is formed of, for example, an upper die 11 and a lower die 12 as shown in FIG. The lower mold 12 is formed of, for example, a lower mold base plate 13, a lower cavity frame member 14, an elastic member 15, and a lower cavity lower surface member 16 as illustrated. The lower mold 12 includes a lower cavity lower surface member 16 and a lower cavity frame member 14 to form a lower cavity. The lower cavity lower surface member 16 is installed in a state of being placed on the lower mold base plate 13, for example. For example, the lower cavity frame member 14 is disposed so as to surround the lower cavity lower surface member 16 in a state of being placed on the lower mold base plate 13 via a plurality of elastic members 15. The upper mold 11 and the lower mold 12 are illustrated in a simplified manner. Further, illustration and detailed description of the outside air blocking members and the like of the upper mold 11 and the lower mold 12 are omitted for simplification.

  The compression mold 20a included in the second molding module 10 is formed of, for example, an upper mold 101 and a lower mold 102 as shown in FIG. As the upper mold 101, for example, the same one as the upper mold 11 in FIG. 2 can be used. For example, as shown in the drawing, the lower mold 102 is replaced with the lower mold base plate 103 instead of the lower mold base plate 13, the lower cavity frame member 104 instead of the lower cavity frame member 14, the elastic member 105 instead of the elastic member 15, and the like. 2 is the same as the lower mold 12 in FIG. 2 except that the lower cavity lower surface member 16 is replaced by a lower cavity lower surface member 106. As shown in the drawing, the lower mold 102 has a cavity slightly larger and deeper than the lower mold 12 in order to further seal the surface of the substrate 2 that is resin-sealed with the lower mold 12. . The lower mold 102 is illustrated in a simplified manner as in the lower mold 12, and the illustration and detailed description of the outside air blocking member and the like are omitted for the sake of simplicity.

  Moreover, in FIG.2 and FIG.8, the board | substrate 2 may be the same as the board | substrate 2 of Fig.31 (a), for example. 2 and 8, the flip chip 4 and the ball terminal 5 are not shown for simplicity.

  The resin sealing method using the resin sealing device 100 of FIG. 1 can be performed as follows, for example.

  First, a substrate supply process is performed. First, the substrate 2 supplied from a substrate supply source (not shown) is stored, for example, in the substrate supply storage unit 62 of FIG. 1 (substrate supply storage process). Next, for example, the substrate 2 stored in the substrate supply / storage unit 62 is supplied to a predetermined position of the molding die 10a of the first molding module 10 by the substrate transporting unit 63 (first) as shown in FIG. Substrate supply process). And the board | substrate 2 is fixed to the lower surface of the upper mold | type 11, for example, as shown in FIG. The substrate 2 can be fixed to the lower surface of the upper mold 11 by, for example, a substrate fixing member (not shown), air adsorption or the like.

  Next, as shown to FIGS. 3-4, a 1st resin supply process is performed. That is, first, the resin supply means 32 of the first resin supply module 30 supplies the granular resin 70a and the release film 110 from, for example, a resin supply source (not shown) and a release film supply source (not shown). . Next, as illustrated, the resin conveying means 31 of the first resin supply module 30 is placed on the mold 10a of the first molding module 10 with the granular resin 70a placed on the release film 110, for example. The granular resin 70a is conveyed. At this time, for example, as illustrated, the frame member 71 may be placed on the release film 110 and the granular resin 70 a may be placed on the release film 110 in the through hole of the frame member 71. Then, the resin conveying means 31 places the release film 110 on which the granular resin is placed on the lower mold 12 (on the surface of the cavity 17 and the upper surface of the lower mold cavity frame member 14). Further, thereafter, as shown in FIG. 4, the release film 110 is adsorbed from the sliding hole 18 in the gap between the lower cavity lower surface member 16 and the lower cavity frame member 14 by suction in the arrow direction X1. Thereby, the granule resin 70 a is supplied to the cavity 17 of the lower mold 12 together with the release film 110.

  Next, as shown in FIGS. 5 to 6, one surface of the substrate 2 is sealed with a sealing resin 70 with the lower mold 12 of the molding die 10 a of the first molding module 10 (first resin sealing). Stop process). Specifically, for example, as shown in FIG. 5, first, the granule resin 70a is heated and melted by the lower mold 12 heated in advance by a heating means (not shown) to obtain a molten resin (flowable resin). ) 70b. Next, as shown in FIG. 5, the lower mold 12 is raised in the direction of the arrow Y1 by a drive mechanism (not shown), and the molten resin (flowable resin) 70b filled in the lower cavity 17 is The chip 1 and the wire 3 attached to the lower surface of the substrate 2 are immersed.

  Next, as shown in FIG. 6, after the molten resin (fluid resin) 70b is cured and the sealing resin 70 is formed, the lower mold 12 is lowered in the direction of the arrow Y2 by a drive mechanism (not shown). Then, mold opening is performed (mold opening process). When opening the mold, for example, as shown in FIG. 6, suction through the sliding hole 18 may be released.

  After the mold is opened, as shown in FIG. 7, the substrate 2 having one surface (lower surface) formed thereon is transferred to the second forming module 20 by the substrate transfer means 63 as indicated by an arrow Z1.

  Next, as shown in FIG. 8, the substrate 2 whose one surface is resin-sealed is transported to the molding die 20a of the second molding module 20 (second substrate supplying step). As shown in the figure, the second substrate supplying step may be performed by the substrate transport means 63, or the first molding module 10 includes a transport means (not shown), whereby the first molding module is provided. 10 may be performed. In this embodiment, the substrate supply step of the present invention includes the first substrate supply step and the second substrate supply step.

  Next, as shown in FIGS. 9 to 10, a second resin supply step is performed. First, by the resin supply means 42 of the second resin supply module 40, for example, a granular resin 170a, from a resin supply source (not shown), a heat sink barrier metal supply module 50, and a release film supply source (not shown), A heat sink barrier metal (a plate-like member with protruding electrodes) and a release film 110 are supplied. As shown in the figure, the heat sink barrier metal (plate member with protruding electrodes) is formed by providing protruding electrodes 90 on one surface of the plate member 80. Next, as shown in the figure, the resin transport means 41 of the second resin supply module 40 transports the granular resin 170a to the molding die 20a of the second molding module 20. Specifically, for example, as shown in the figure, the plate-like member 80 and the protruding electrode 90 (plate-like member with a protruding electrode) are mounted on the release film 110 with the protruding electrode 90 side facing away from the release film 110. In addition, the granular resin 170a is conveyed in a state where the granular resin 170a is placed thereon. At this time, for example, as illustrated, the frame member 91 may be placed on the release film 110, and the granular resin 170a may be placed on the plate member 80 in the through hole of the frame member 91. Then, for example, the release film 110 on which the granule resin 170 a is placed is placed in the cavity 107 of the lower mold 102 by the resin transport means 41. Further, as shown in FIG. 10, the release film 110 is adsorbed from the sliding hole 108 in the gap between the lower cavity lower surface member 106 and the lower cavity frame member 104 by suction in the arrow direction X2. Thereby, the granule resin 170a is supplied to the cavity 107 of the lower mold 102 together with the release film 110.

  In addition, the granule resin 170a supplied to the shaping | molding die 20a of the 2nd shaping | molding module 20 may contain the heat conductive particle | grains 180, as shown, for example in FIGS. Examples of the thermally conductive particles 180 include, for example, copper powder.

  In the resin sealing device and the resin sealing method of the present invention, the thermally conductive particles are, for example, the second molded module together with the resin using the second resin supply module as described in FIGS. Can be supplied to. However, the present invention is not limited to this, and the first resin supply module may be used to supply thermally conductive particles to the first molding module together with the resin.

  When the thermally conductive particles are contained in the resin sealing resin, there is an advantage that the heat dissipation in the resin-sealed molded body (package) can be improved. Specifically, it is as follows. First, in many cases, a resin (for example, silicon oxide) is contained in a resin sealing resin in order to improve heat dissipation. However, if the filler content is excessively increased, the wire may be deformed or disconnected due to an increase in the viscosity of the resin when melted. Therefore, for example, in a primary mold (first molding module), the portion close to the wire is resin-sealed using a resin (low viscosity) with a reduced content such as filler (silicon oxide). By doing in this way, a deformation | transformation or disconnection of a wire can be suppressed or prevented efficiently. Next, resin sealing is performed using a secondary mold (second molding module) with a resin containing thermally conductive particles (a resin with an increased filler content). By doing in this way, even if the heat dissipation is reduced by the amount of filler and the like of the resin-sealed molded body (package) in the primary mold is reduced, the amount of the resin-sealed molded body (package in the secondary mold) is reduced. ) Has a merit that can be covered by high heat dissipation. Further, when the secondary mold is molded together with a heat sink or a barrier metal, the heat dissipation is further improved (high).

  Next, as shown in FIGS. 11 to 12, the one surface of the substrate 2 is further resin-sealed with a sealing resin 170 in the lower mold 102 of the molding die 20 a of the second molding module 20 ( Second resin sealing step). Specifically, for example, as shown in FIG. 11, first, the granular resin 170a is heated and melted by the lower mold 102 that has been heated in advance by a heating means (not shown), and a molten resin (flowable resin) is obtained. ) 170b. Next, as shown in FIG. 11, the lower mold 102 is raised in the direction of the arrow Y3 by a drive mechanism (not shown). Thereby, the chip 1 and the wire 3 sealed with the sealing resin 70 on the lower surface of the substrate 2 are immersed together with the sealing resin 70 in the molten resin (fluid resin) 170 b filled in the lower cavity 107.

  Next, as shown in FIG. 12, after the molten resin (fluid resin) 170b is cured and the sealing resin 170 is formed, the lower mold 102 is lowered in the direction of the arrow Y4 by a drive mechanism (not shown). Then, mold opening is performed (mold opening process). When opening the mold, for example, as shown in FIG. 12, suction through the sliding hole 108 may be released.

  As described above, as described with reference to FIGS. 2 to 12, it is possible to manufacture an electronic component in which one surface of the substrate is double-resin-sealed (double-molded). In addition, the structure of the electronic component shape | molded by the resin sealing method of FIGS. 2-12 is typically shown in sectional drawing of FIG. As illustrated, in this electronic component, the chip 1 and the wire 3 arranged on one surface of the substrate 2 are sealed with a sealing resin 70. The sealing resin 70 is further sealed with a sealing resin 170 containing thermally conductive particles 180. The outer periphery of the sealing resin 170 is covered with a plate member with protruding electrodes (heat sink barrier metal) including the plate member 80 and the protruding electrodes 90. That is, in the electronic component of FIG. 13, as illustrated, the sealing resin portion A (the chip 1 and the wire 3 are sealed with the sealing resin 70) on the substrate 2 is the heat conductive particle-containing resin portion. It has a triple structure in which it is covered with B (sealing resin 170 containing thermally conductive particles 180) and the outer periphery thereof is further covered with a heat sink barrier metal C.

  In this way, the resin sealing method of this embodiment can be applied to the double molding method using the resin sealing device of this embodiment.

  The first molding module, the second molding module, and the control module can perform the respective steps while being detachable from each other with respect to at least one other module. For this reason, it is possible to deal with various products with one molding device by rearranging the modules.

  The resin sealing method of the present embodiment may use a frame member and a plate-like member, for example, as shown in FIGS. Specifically, for example, as described above, the plate-like member 80 may be supplied to the second resin supply module by the heat sink barrier metal supply module 50 (plate-like member supply step). However, the resin sealing method of this invention is not limited to this, A frame member may not be used and a plate-shaped member may not be used. In the second resin sealing step, the mold 20 a of the second molding module 20 may be resin-sealed together with the plate-like member 80, for example, on the other surface of the substrate 2. The plate-like member 80 may or may not be provided with the protruding electrode 90 as shown in FIGS. When the protruding electrode 90 is provided, the protruding electrode 90 may be provided with a cushion function so that it can extend and contract in the vertical direction of the molding module 20. When the protruding electrode 90 is not provided, for example, the plate member 80 may be a plate member 80 for a heat sink. In this case, the second molding module 20 is resin-sealed together with the plate-like member.

  In addition, the structure of the resin sealing apparatus of this invention is not limited to the resin sealing apparatus 100 (FIG. 1) of a present Example, A various change is possible so that it may demonstrate below. For example, as described above, in the resin sealing device of the present invention, the heat sink barrier metal supply module 50 is not an essential component. Therefore, for example, as shown in the apparatus 200 of FIG. 14, the heat sink barrier metal supply module 50 may be removed from the apparatus 100 of FIG. In this case, for example, a plate member (heat sink barrier metal) may not be used in resin sealing of the substrate 2.

  For example, at least one of the first resin supply module and the second resin supply module may be modified to be incorporated in the control module 60 with respect to the resin sealing device 100 of the present embodiment. . In this case, for example, as shown in the apparatus 300 of FIG. 15, instead of providing the first resin supply module 30, the first resin supply means 31 and the first resin transport means 32 are incorporated in the control module 60, The control module 60 may be configured to also serve as the function of the first resin supply module 30. Thereby, since the resin sealing apparatus of this invention can take a more simplified structure, it is preferable.

  With respect to the resin sealing apparatus 100 of the present embodiment, for example, as shown in the apparatus 400 of FIG. A modification may be made so as to be adjacent to the resin supply module 30 and the control module 60.

  For the resin sealing device 100 of the present embodiment, for example, as shown in a device 500 of FIG. 17, the first molding module 10, the second molding module 20, the first resin supply module 30, and the second A change may be made so that each of the resin supply modules 40 includes a pair, and the molding modules 10 and 20 and the resin supply modules 30 and 40 are arranged one on each side of the control module 60. As shown in FIG. 17, it is preferable to arrange the control module 60 in the center because productivity is improved.

  For example, as shown in an apparatus 600 in FIG. 18, the second molding module (compression molding module) 20 is removed from the resin sealing apparatus 100 of this embodiment, and a molding module 20A for transfer molding is used instead. Modifications may be made to attach as a second molding module. In this case, for example, the resin supply means of the second resin supply module 40A supplies the tablet resin for transfer molding from the resin supply source. Note that the second resin supply module 40A may be the same as the second resin supply module 40 shown in FIG. 1, or may be different if necessary.

  For example, as shown in an apparatus 700 in FIG. 19, the resin sealing apparatus 100 according to the present embodiment further includes a high pressure gas supply module 21 for supplying high pressure gas to the compression molding module 20. The high pressure gas supply module 21 may be arranged adjacent to each other, and the high pressure gas supply module may be modified so that it can be attached to and detached from at least one other module.

  Further, for example, with respect to the resin sealing device 600 of FIG. 18, the position of the heat sink barrier metal supply module 50 is changed so as to be disposed between the first molding module 10 and the first resin supply module 30. A resin sealing device 800 in FIG. 20 may be used.

  Further, for example, a high pressure gas supply module 11B for supplying high pressure gas to the first molding module (compression molding module) 10 with respect to the resin sealing device 600 of FIG. It may be arranged between the second molding module (transfer molding module) 20A and the resin sealing device 900 of FIG. 21 does not include the heat sink barrier metal supply module 50. For example, the heat sink barrier is provided at the same position as the resin sealing device 600 in FIG. 18 or the resin sealing device 800 in FIG. A metal supply module 50 may be provided.

  Further, the resin sealing method of the present embodiment is not limited to the above description, and may be appropriately changed. For example, the resin sealing device is a device 600 shown in FIG. 18 instead of the device 100 shown in FIG. 1, and in the first resin sealing step, one surface of the substrate is resin-sealed by compression molding. In the second resin sealing step, the one surface or the other surface of the substrate may be resin-sealed by transfer molding.

  Further, the resin sealing method of the present invention includes, for example, a high pressure gas supply step of using the apparatus 700 of FIG. 19 instead of the resin sealing device 100 and supplying high pressure gas by the high pressure gas supply module 21. In the first resin sealing step, the one surface of the substrate may be resin-sealed by compression molding with the compression molding module 20 using the high-pressure gas supplied in the high-pressure gas supply step. .

  Moreover, the resin sealing method of the present invention includes, for example, a high pressure gas supply step of using the apparatus 900 of FIG. 21 instead of the resin sealing apparatus 100 and supplying high pressure gas by the high pressure gas supply module 11B. In the first resin sealing step, the one surface of the substrate may be resin-sealed by compression molding by the compression molding module 10 using the high-pressure gas supplied in the high-pressure gas supply step. .

  In the present invention, as described above, the first molding module may be resin-sealed on one surface of the substrate, and the second molding module may be resin-sealed on the other surface of the substrate. (Double-sided molding). For example, if an apparatus such as the apparatus 900 of FIG. 21 is used, in the first resin sealing step, one surface of the substrate is resin-sealed by compression molding in the first molding module, and then In the second resin sealing step, the other surface of the substrate can be resin-sealed by transfer molding in the second molding module. According to such a resin sealing method, there exists an advantage which can suppress the curvature of a board | substrate as demonstrated below.

  First, in general, in order to seal the both surfaces of the substrate with resin, a hole (a hole for pouring resin from one surface side of the substrate to the other surface side, hereinafter referred to as “opening”) is formed in the substrate. There is a resin sealing method in which one surface of a substrate is resin-sealed by transfer molding, and the other surface is resin-sealed by turning resin from the opening to the other surface side. On the other hand, recently, as the density of portable devices and the like increases, a package in which chips are mounted on almost the entire surface of one side and the other side (both sides) of a substrate is required. In the package manufacturing process, it is necessary to resin-encapsulate almost the entire surface of both surfaces of the substrate. However, in the manufacture of a package, when both surfaces of a substrate are simultaneously resin-sealed using a resin-sealing method, one of the cavities (upper cavity or lower cavity) is filled with resin first. Sometimes. For example, when the resin is first filled in the lower mold cavity (lower cavity), there arises a problem that the substrate is warped (deformed) upward. This is because if both surfaces are sealed with resin simultaneously by transfer molding, the resin may be filled in one of the cavities first due to gravity, flow resistance, or the like. In that case, the resin flows from the one surface side of the substrate to the other surface side of the substrate through the opening of the substrate. If it does so, there exists a possibility that a board | substrate may swell toward the other surface side by the flow resistance at the time of resin flowing from the opening of a board | substrate. In this case, the resin is filled in the other cavity with the substrate swelled. Resin pressure is applied to the substrate by filling one or the other cavity with resin, but the resin pressure applied to one and the other surface of the substrate is the same pressure (one and the other cavity are connected by the opening of the substrate) Therefore, no force is generated to return the substrate from a swelled state to a flat state. Therefore, the curing of the resin proceeds with the other surface of the substrate swelled, and the molding is completed with the substrate swelled (deformed state). That is, if both surfaces (one surface and the other surface) of the substrate are simultaneously resin-sealed using the resin sealing method, the substrate may be deformed.

  On the other hand, according to the double-sided molding as shown in the present embodiment, it is possible to provide a resin sealing device and a resin sealing method capable of achieving both suppression of the warpage of the substrate and double-sided molding of the substrate. Specifically, it is not necessary to provide an opening for allowing the resin to flow from one surface side of the substrate to the other surface side in the substrate used in the double-sided molding of this embodiment. By not providing the opening, the resin does not flow from the one surface side of the substrate through the opening to the other surface side of the substrate. For this reason, deformation (warping) of the substrate due to flow resistance when the resin passes through the opening of the substrate does not occur. In addition, when the other surface is resin-sealed, one surface is supported by a resin for compression molding (resin material, fluid resin, or sealing resin), so that the other surface side is applied to the substrate. On the other hand, even if the resin pressure is applied, the warpage of the substrate can be suppressed. Thereby, suppression of the curvature of a board | substrate and double-sided molding of a board | substrate are compatible. In the conventional method described above, that is, a method in which an opening is formed in the substrate and both surfaces of the substrate are resin-sealed by transfer molding, there is a problem of cost due to the opening in the substrate. In addition, when resin is sealed by turning the resin from the opening to the other surface side, the flow distance until the entire surface of the other surface is resin-sealed is increased, voids (bubbles) are generated, and the wire that is a component part Such deformation may occur. On the other hand, in this embodiment, resin sealing on both sides of the substrate is possible without opening an opening in the substrate. For this reason, there is no cost due to opening an opening in the substrate, the flow distance until resin sealing on both sides is short, and generation of voids (bubbles) and deformation of the wire can be suppressed.

  In this embodiment, when the substrate is formed on both sides, for example, one surface of the substrate is first resin-sealed by compression molding. Thereby, it is possible to suppress both warpage (deformation) of the substrate and double-sided molding of the substrate. The reason is that the amount of resin (resin for compression molding) supplied to the cavity can be adjusted in the case of compression molding. For example, when adjusting the volume of the resin, if the specific gravity of the resin is known, it can be adjusted by measuring the weight of the supplied resin. Specifically, for example, the amount of resin for compression molding is set to approximately the same volume as the cavity in a flat substrate state (calculated cavity volume assuming that the substrate is not deformed), and compression molding is performed in the cavity. Resin is supplied and sealed (filled). If it does so, the generation | occurrence | production of the swelling of a board | substrate or dent by at least excess and deficiency of a resin can be suppressed. On the other hand, when both sides of the substrate are molded, one surface of the substrate may be first resin-sealed by transfer molding. However, when the vertical position of the plunger changes, the amount of resin supplied to the cavity also changes. When the resin amount changes in this way, the substrate may bulge or dent due to excess or deficiency in the resin amount. Therefore, when both sides of the substrate are molded, it is preferable that one of the substrates is first resin-sealed by compression molding.

  Hereinafter, an example of the above-described double-sided molding in the resin sealing method of the present embodiment will be described with reference to FIGS. That is, FIGS. 22 to 30 show an example of a double-sided molding method in which both sides of a substrate are resin-sealed (molded). More specifically, FIGS. 22 to 30 show an example in which the apparatus 900 of FIG. 21 is used, and one surface of the substrate is resin-sealed by compression molding and the other surface is resin-sealed by transfer molding.

  First, the cross-sectional view of FIG. 22 schematically shows an example of the structure of the first molding module (compression molding module) 10 in the apparatus 900 of FIG. The figure also includes the substrate 2 and the high-pressure gas supply module 11B that are resin-sealed. Further, the substrate 2 in the figure has two flat terminals 6 and the flat terminals 6 are provided on the same side as the flip chip 4 (opposite the chip 1 and the wire 3). Except this, it is the same as the substrate 2 of FIG.

  As shown in FIG. 22, the first molding module 10 includes a substrate holding member (upper die) 6000 and a lower die 7000 arranged to face the substrate holding member (upper die) 6000.

  The substrate holding member (upper mold) 6000 includes, for example, a communication member 610 that is connected to the high-pressure gas supply module 11B, a cavity upper surface and a frame member 620, and a convex member 630 for exposing the flat terminal 6 mounted on the substrate 2. , A plurality of elastic members 602 and a plate member 640. The cavity upper surface and the frame member 620 have a cavity 601. The high-pressure gas supply module 11B is not particularly limited, but may be a module including a high-pressure gas source such as a compressor or a compressed air tank.

  The communication member 610, the cavity upper surface, and the frame member 620 are installed in a state of being suspended from the plate member 640 via a plurality of elastic members 602. The communication member 610 is provided with an air passage (air passage) 603 for pressure-feeding high-pressure gas (for example, compressed air) supplied from the high-pressure gas supply module 650 to the cavity 601. The cavity upper surface and the frame member 620 are configured such that the upper cavity upper surface member having the cavity 601 and the frame member surrounding the upper cavity upper surface member are integrated. A plurality of air holes 604 are provided on the upper surface of the cavity 601 for communicating the air passage 603 of the communication member 610 with the cavity 601.

  The convex member 630 is provided in a portion where the substrate 2 may be suppressed, such as the upper surface of the flat terminal 6 so that the substrate 2 is not warped by resin sealing by the first molding module 10. It is preferable.

  The lower mold 7000 is a compression mold, and is formed of, for example, a lower cavity lower surface member 710, a lower cavity frame member 720, an elastic member 702, and a lower mold base plate 730. The lower mold 7000 includes a lower cavity lower surface member 710 and a lower cavity frame member 720 to form a lower cavity 701. The lower cavity lower surface member 710 is installed in a state of being placed on the lower mold base plate 730, for example. Further, the lower cavity lower surface member 710 may be mounted in a state of being mounted on the lower mold base plate 730 via the elastic member 702, for example. For example, the lower cavity frame member 720 is disposed so as to surround the lower cavity lower surface member 710 in a state where the lower cavity frame member 720 is placed on the lower mold base plate 730 via a plurality of elastic members 702. A sliding hole 711 is formed by a gap between the lower cavity lower surface member 710 and the lower cavity frame member 720. As will be described later, for example, a release film or the like can be adsorbed by suction through the sliding hole 711. The lower mold 7000 is provided with a heating means (not shown) for heating the lower mold 7000, for example. By heating the lower mold 7000 with the heating means, the resin in the lower cavity 701 is heated and cured (melted and cured). The lower mold 7000 can be moved in the vertical direction by a drive mechanism (not shown) provided in the first molding module 10, for example. In addition, the lower mold outside air blocking member of the lower mold 7000 is not illustrated or described in detail for the sake of simplicity.

  FIG. 23 shows a sectional view of the second molding module (transfer molding module) 20A of the resin sealing device 900 of FIG. 21 and the substrate 2 resin-sealed thereby. As shown in FIG. 23, the second molding module 20A includes an upper mold 9000 and a substrate holding member (lower mold) 10000 disposed to face the upper mold.

  The upper mold 9000 is a transfer mold, for example, an upper cavity upper surface member 910, an upper cavity frame member 920 that is a frame member surrounding the upper cavity upper surface member 910, and a flat terminal mounted on the substrate 2. 6 is formed of a convex member 930 for exposing 6, a plurality of elastic members 902, and an upper mold base plate 940. In the upper mold 9000, an upper cavity 901 is configured by the upper cavity upper surface member 910. The upper mold 9000 is mounted in a state where the upper cavity upper surface member 910 is suspended from the upper mold base plate 940 via a plurality of elastic members 902, and the upper cavity frame member 920 is suspended from the upper mold base plate 940. It is equipped with. Note that illustration and detailed description of the upper mold outside air blocking member of the upper mold 9000 are omitted for simplification.

  The upper mold 9000 is provided with a resin passage 950 for supplying a resin material, for example. The upper cavity 901 and the pot 960 are connected by the resin passage 950. The plunger 970 disposed inside the pot 960 can move in the vertical direction by, for example, a plunger driving mechanism (not shown) provided in the second molding module 20A.

  The substrate holding member (lower mold) 10000 is a plate on which the substrate 2 whose one surface is resin-sealed by the first molding module 10 is placed. For example, the cavity lower surface member 1010, the cavity frame member 1020, a plurality of The elastic member 1030 and the base member 1040 are formed. In the substrate holding member (lower mold) 10000, for example, a cavity lower surface member 1010 and a cavity frame member 1020 constitute a cavity 1001. The cavity lower surface member 1010 and the cavity frame member 1020 are installed in a state of being placed on the base member 1040 via a plurality of elastic members 1030. The substrate 2 is placed on the substrate holding member (lower mold) 10000 such that the resin sealing region is accommodated in the cavity 1001. The second molding module 20A is provided with heating means (not shown) for heating the pot 960, for example. By heating the pot 960 by the heating means (not shown), the resin supplied (set) to the pot 960 is heated and cured (melted and cured). The substrate holding member (lower mold) 10000 can be moved in the vertical direction by, for example, a substrate holding member drive mechanism (not shown) provided in the second molding module 20A.

  In this embodiment, in the first molding module 10, the cavity 601 may be filled with a gel-like solid instead of the configuration in which the compressed air is supplied to the cavity 601. By holding the substrate 2 with the gel-like solid, warpage of the substrate 2 can be suppressed.

  Next, an example of a resin sealing method using the resin sealing device shown in FIGS. 21 to 23 will be described with reference to FIGS.

  Prior to the first resin sealing step, a substrate supply step and a first resin supply step described below are performed.

  That is, as shown in FIG. 24, first, the substrate 2 is supplied to the substrate holding member (upper die) 6000 of the first molding module 10 by the substrate transport means 1100, and the substrate is clamped by the substrate clamper and the suction hole (not shown). 2 is fixed (substrate supply step). After the substrate supply process, the substrate transfer means 1100 is withdrawn.

  Next, a resin transfer means (not shown) is inserted between the substrate holding member (upper mold) 6000 and the lower mold 7000. As shown in FIG. 25, the resin conveying means, as shown in FIG. 25, release resin 130, resin frame member 140 placed on release film 130, and granular resin 150 a supplied to internal through hole 140 </ b> A of resin frame member 140, Transport to lower mold 7000. Then, the release film 130 is adsorbed from the sliding hole 711 in the gap between the lower cavity lower surface member 710 and the lower cavity frame member 720 by suction in the arrow direction X3 shown in FIG. And granular resin 150a are supplied (first resin supply step). Thereafter, the resin conveying means and the resin frame member 140 are withdrawn.

  Next, as shown in FIGS. 26 to 27, a first resin sealing step is performed. Specifically, in the first resin sealing step, one surface of the substrate is resin-sealed by compression molding using the first molding module 10 having a lower mold.

  First, as shown in FIG. 26, the granular resin 150a is heated and melted by the lower mold 7000 whose temperature has been raised by a heating means (not shown) to become a molten resin (flowable resin) 150b. Next, as shown in FIG. 26, the lower mold 7000 is raised by a drive mechanism (not shown) and attached to the lower surface of the substrate 2 on the molten resin (fluid resin) 150b filled in the lower cavity 701. The chip 1 and the wire 3 are immersed. At the same time or at a slightly delayed timing, the high-pressure gas supply module 11B supplies air having the same pressure as the molding pressure to the substrate holding member (upper die) 6000 in the direction of the arrow in FIG. Thus, one surface (lower surface) of the substrate 2 can be resin-sealed while the substrate warpage is suppressed.

  Next, as shown in FIG. 27, after the molten resin (fluid resin) 150b is cured and the sealing resin 150 is formed, the lower mold 7000 is lowered by a drive mechanism (not shown) to open the mold. Perform (mold opening process). When opening the mold, for example, as shown in FIG. 27, the suction through the sliding hole 711 may be released. Then, after the mold is opened, the substrate 2 having one surface (lower surface) formed thereon is transferred to the second forming module 20A by the substrate transfer means 1100 (second module transfer step).

  Next, as shown in FIG. 28, the substrate 2 is transferred to the substrate holding member (lower mold) 10000 of the second molding module 20A by the substrate transfer means 1100 shown in FIG. Thereafter, the tablet resin is supplied to the pot 960 by a resin conveying means (not shown), and the tablet resin is heated and melted by a pot (lower mold) heated by a heating means (not shown). (Flowable resin) 971a (resin supply step). The substrate transport means 1100 may supply the tablet resin. For example, the substrate 2 may be turned upside down by a substrate turning mechanism (not shown). In that case, the cavity is upside down.

  Next, as shown in FIG. 29, the upper mold 9000 and the substrate holding member (lower mold) 10000 are clamped. At this time, as shown in FIG. 29, the lower surface of the convex member 930 attached to the upper cavity surface of the upper mold 9000 is pressed against the upper surface of the flat terminal 6 attached to the upper surface of the substrate 2.

  Furthermore, a 2nd resin sealing process is performed as shown to FIGS. Specifically, the other surface (upper surface) of the substrate 2 is resin-sealed by transfer molding with the second molding module 20A. That is, first, as shown in FIG. 29, the substrate holding member (lower mold) 10000 is raised by the substrate holding member driving mechanism (not shown) to clamp the substrate 2. Then, as shown in FIG. 30, the plunger 970 is raised by a plunger drive mechanism (not shown) to fill the upper cavity 901 with molten resin (fluid resin) 971a, and further, the fluid resin 971a is cured. As shown in FIG. 30, the sealing resin 971 is used. In this manner, the upper surface of the substrate 2 is resin-sealed with the sealing resin 971 and molded. At this time, as described above, since the upper surface of the flat terminal 6 is pressed against the lower surface of the convex member 930, it is not immersed in the molten resin 971a. Therefore, resin sealing can be performed in a state where the upper surface of the flat terminal 6 is exposed from the sealing resin 971.

  In this way, when one surface of the substrate is first resin-sealed by compression molding using a molding module for compression molding, one surface is sealed when the other surface is resin-sealed by transfer molding. Is supported by a resin for compression molding, so that the warpage of the substrate can be suppressed even when a resin pressure is applied to the substrate from the other surface side. Thereby, suppression of the curvature of a board | substrate and double-sided molding of a board | substrate are compatible. In addition, by sealing the other surface of the substrate by transfer molding, it is easy to mold the terminal provided on the substrate (the other surface) exposed from the sealing resin.

  22 to 30 show an example in which one surface of the substrate is resin-sealed by compression molding and the other surface is resin-sealed by transfer molding, but the present invention is not limited to this. For example, both sides of the substrate may be resin-sealed by compression molding using the apparatus 500 of FIG. 17 or the apparatus 700 of FIG. In addition, the apparatus 500 in FIG. 17, the apparatus 700 in FIG. 19, the apparatus 900 in FIG. 21, and the like are not limited to double-sided molding (both sides of the substrate are resin-sealed). It can also be used for double resin sealing.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. is there.

1 chip 2 substrate 3 wire 4 flip chip 5 ball terminal (terminal)
6 Flat terminal (terminal)
7 Mounting substrate 10 First molding module 10a, 20a Mold 11, 101, 6000, 9000 Upper mold 11B, 21 High pressure gas supply module 12, 102, 7000, 10000 Lower mold 13, 103, 730 Lower mold base plate 14, 104 , 720 Lower cavity frame members 15, 105, 702, 1030 Elastic members 16, 106, 710 Lower cavity lower surface members 17, 107, 701 Lower cavities 18, 108, 711 Sliding holes 20, 20A Second molding module 30 First Resin supply modules 31, 41 Resin transport means 32, 42 Resin supply means 40, 40A Second resin supply module 50 Heat sink barrier metal supply module 51 Heat sink barrier metal supply means 60 Control module 60a Substrate supply module 61 Control section 62 Supply accommodating section 63 substrate transfer means 70, 170 sealing resin 70a, 170a granules resin 70b, 170b molten resin (fluid resin)
71, 91 Frame member 80 Plate-like member 90 Projection electrode 100, 200, 300, 400, 500, 600, 700, 800, 900 Resin sealing device 110 Release film 170a Granule resin 601, 1001 Cavity 603 Air passage 604 Air hole 610 Communication member 620 Cavity upper surface and frame members 630 and 930 Convex member 640 Plate member 650 High-pressure gas source 1000 Substrate holding member (lower mold)
1010 Cavity lower surface member 1020 Cavity frame member 1040 Base member 1100 Substrate transport means X1, X2, X3, Y1, Y2, Y3, Y4, Z1 arrow

Claims (8)

A resin sealing device for resin sealing one side or both sides of a substrate,
A first molding module for resin-sealing the one surface of the substrate;
A second molding module for resin-sealing the one surface or the other surface of the substrate;
A first resin supply module for supplying a resin material to the first molding module;
A second resin supply module for supplying a resin material to the second molding module;
A substrate supply module for supplying the substrate to a predetermined position of each molding module;
A control module having a control unit for controlling the operation of each module,
The resin molding apparatus, wherein the first molding module, the second molding module, and the control module are detachable from each other with respect to at least one other module.   The first molding module is resin-sealed on the one surface of the substrate, and the second molding module is further on the one surface of the substrate that is resin-sealed by the first molding module. The resin sealing device according to claim 1, wherein the resin sealing is performed.   The resin sealing device according to claim 1, wherein at least one of the first resin supply module and the second resin supply module supplies thermally conductive particles together with the resin material. The first molding module is resin-sealed on the one surface of the substrate,
4. The resin sealing device according to claim 1, wherein the second molding module performs resin sealing on the other surface of the substrate. 5. The first molding module is a molding module for compression molding,
The resin sealing device according to any one of claims 1 to 4, wherein the second molding module is a molding module for transfer molding. The first molding module is a compression molding module for compression molding,
The resin sealing device further includes a high pressure gas supply module for supplying high pressure gas to the compression molding module,
The compression molding module and the high-pressure gas supply module are disposed adjacent to each other, and the high-pressure gas supply module is detachable from each other with respect to at least one other module. The resin sealing apparatus as described in any one. The resin sealing device further includes a plate member supply module that supplies a plate member to at least one of the first resin supply module and the second resin supply module,
At least one of the first resin supply module and the second resin supply module has the plate placed on the first molding module or the second molding module in a state where a resin material is placed on the plate-like member. Supply the resin material placed on the shaped member,
At least one of the first molding module and the second molding module is resin-sealed together with the plate-like member on the one surface or both surfaces of the substrate,
The said plate-shaped member supply module is a resin sealing apparatus as described in any one of Claim 1 to 6 which can mutually be attached or detached with respect to at least one other said each module. A resin sealing method for resin sealing one side or both sides of a substrate,
Using the resin sealing device according to any one of claims 1 to 7,
A substrate supply step of supplying the substrate to a predetermined position of each molding module by the substrate supply module;
A first resin supply step of supplying a resin material to the first molding module by the first resin supply module;
A second resin supply step of supplying a resin material to the second molding module by the second resin supply module;
A first resin sealing step of resin-sealing the one surface of the substrate by the first molding module;
A second resin sealing step of resin-sealing the one surface or the other surface of the substrate by the second molding module;
The operation of each step is controlled by the control unit of the control module.

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