JP2015116728A - Resin molding apparatus and resin molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin molding apparatus in which a resin transporting mechanism is easily moved to make it possible to select a resin material and a resin feeding mechanism corresponding to a product.SOLUTION: A resin molding apparatus 1 comprises: a movable lower die 12; a molding tool including the movable lower die 12 and a fixed upper die; a cavity 14 provided for the movable lower die 12; a resin feeding mechanism 18 which feeds raw material resin to the cavity 14; a resin storing mechanism 17 which stores the resin material; a resin transporting mechanism 16 in which the resin feeding mechanism 18 and the resin storing mechanism 17 are unified; and molding modules 3A, 3B, 3C, 3D which include the molding die and are detachable from each other, in which the unified resin transporting mechanism 16 is easily moved. Liquid resin or solid resin can be selected as resin material, one-liquid type or two-liquid mixture type can be selected as liquid resin. A single or a plurality or pre-sealing substrate 5 can be sealed by resin in each molding module, and the number of the molding modules 3A, 3B, 3C, 3D can be increased/decreased.

Description

  The present invention relates to a resin molding apparatus used when encapsulating electronic components such as transistors, integrated circuits (ICs), and light emitting diodes (LEDs) using a liquid resin, and the like. The present invention relates to a resin molding method. In the present application document, the term “liquid” means that it is liquid at room temperature and has fluidity, regardless of the degree of fluidity, in other words, the degree of viscosity.

  2. Description of the Related Art Conventionally, an optical element such as an LED is resin-sealed using a liquid resin that is thermosetting and transmits light as a resin material, such as a silicone resin or an epoxy resin. As a resin sealing technique, a resin molding technique such as compression molding or transfer molding is used. In resin molding, a liquid resin as a main agent is mixed with a liquid resin as an auxiliary agent such as a curing agent, and the mixed liquid resin (hereinafter referred to as “mixed liquid resin”) is heated to be cured.

  A resin molding apparatus using a liquid resin includes a container filled with a main agent and a container filled with a curing agent. Two kinds of liquid resins (hereinafter referred to as “two liquids”) supplied at a constant rate from a container filled with the main agent and a container filled with the curing agent are mixed in a mixing container or the like. The mixing ratio of the main agent and the curing agent is adjusted according to the object to be molded, and the viscosity of the mixed liquid resin is optimized. When mixing the two liquids, the main agent and the curing agent are stored in separate containers at room temperature, and the two liquids are mixed in actual use to form a mixed liquid resin. In some cases, the mixed liquid resin prepared by mixing the main agent and the curing agent in advance into one liquid is filled in a container, and the mixed liquid resin is used. It is necessary to select the most suitable main agent and curing agent according to the product and application.

  As a liquid resin supply device for supplying a liquid resin, “a liquid resin supply device for supplying a liquid resin to a workpiece, and a plurality of replacement units are supplied to a dispensing unit that discharges and supplies the liquid resin filled in a syringe to the workpiece. A syringe supply unit holding the syringe is rotatably provided, and the dispensing unit receives a replacement syringe from the syringe supply unit, and supplies a predetermined amount of liquid resin to the work held at the liquid material discharge position. A resin supply device has been proposed (see, for example, paragraph [0006] of FIG. 1 and FIG. 2 in Patent Document 1).

JP 2012-126075 A

  However, the liquid resin supply device disclosed in Patent Document 1 has the following problems. As shown in FIGS. 2 and 4 to 8 of Patent Document 1, in the above-described apparatus, the dispensing unit 18 and the syringe 19 for storing the liquid resin 5 are configured separately, and the syringe 19 is used when used. Is automatically mounted on the dispensing unit 18. The dispensing unit 18 is configured to arrange the syringe 19 along the vertical direction. When the syringe 19 is attached to the dispense unit 18, it is necessary to accurately align the piston 18c, the syringe 19, and the tube nozzle 19a provided in the dispense unit 18, in other words, to align the axes. If this axial alignment is shifted, it becomes difficult to operate the piston 18c normally, and it becomes difficult to accurately discharge the liquid resin 5. If the piston 18 c is not correctly inserted into the syringe 19, there is a problem that air in the atmosphere is mixed into the syringe 19.

  Further, since the syringe 19 storing the liquid resin 5 is used by replacing the syringe 19, a mixed liquid resin in which the main agent and the curing agent are mixed in advance is used as the liquid resin 5. Since the chemical reaction proceeds when the main agent and the curing agent are mixed, it is important to control the temperature of the mixed liquid resin. Moreover, in such an apparatus, the mixed liquid resin produced by mixing the main agent and the curing agent cannot be used when actually used. Therefore, there is a problem that an optimal mixed liquid resin cannot be selected according to the product or application.

  The present invention solves the above problems, and by providing a resin transport mechanism in which a resin storage mechanism and a resin supply mechanism are integrated, the selection of a resin material and the selection of a resin supply device can be performed on products and applications. It is an object of the present invention to provide a resin molding apparatus and a resin molding method that can be selected in accordance with the above, and that can easily move a resin transport mechanism in the resin molding apparatus to supply a raw material resin.

  In order to solve the above problems, a resin molding apparatus according to the present invention is provided in at least one of an upper mold, a lower mold provided opposite to the upper mold, and the lower mold and the upper mold. A cavity, a housing part that stores a raw material resin that should be cured into a cured resin in the cavity, a resin transport mechanism that transports a resin material in the vicinity of the lower mold, and a resin supply mechanism that supplies the raw material resin to the housing part And a mold clamping mechanism for clamping a mold having at least an upper mold and a lower mold, and a resin molding apparatus for molding a molded product containing a cured resin, the resin storage mechanism provided in the resin transport mechanism A first storage unit provided in the resin storage mechanism for storing the resin material, a second storage unit provided in the resin supply mechanism for storing the resin material transferred from the first storage unit, and a resin Provided in the supply mechanism and stored in the second storage A resin material sending section for sending the resin material toward the housing section; a raw material resin feeding section that is provided in the resin supply mechanism and feeds the raw material resin generated from the resin material sent toward the housing section to the housing section; A first moving mechanism for moving the resin transport mechanism to the vicinity of the lower mold, and a second moving mechanism for moving at least the resin supply mechanism from the vicinity of the lower mold to the upper portion of the housing portion. Is characterized in that the resin storage mechanism and the resin supply mechanism are moved together.

  In the resin molding apparatus according to the present invention, in the above-described resin molding apparatus, the first storage unit stores a mixed liquid resin generated by mixing a plurality of types of liquid resins in advance. The mixed liquid resin is transferred from the section to the second storage section, and the mixed liquid resin stored in the second storage section is sent out by the resin material sending section, so that the raw material resin composed of the mixed liquid resin is supplied as the raw resin. It is supplied to a storage part from a part.

  Further, the resin molding apparatus according to the present invention is the above-described resin molding apparatus, wherein the resin supply mechanism includes a third storage unit that stores the mixed liquid resin generated by mixing a plurality of types of liquid resins in advance, The third storage unit is configured by directly connecting the first storage unit and the second storage unit, and the mixed liquid resin passes through the second storage unit and is sent out toward the storage unit. The parts are detachable from the resin material delivery part and the raw material resin supply part, respectively.

  Moreover, the resin molding apparatus according to the present invention includes the liquid resin mixing mechanism provided in the resin supply mechanism in the above-described resin molding apparatus, and the resin material includes a plurality of types of liquid resins, and the first storage unit and A plurality of second storage units are provided, and a plurality of types of liquid resins are stored in each of the plurality of first storage units, and a plurality of types of liquid resins are stored in the plurality of first storage units. Are transferred to a plurality of second storage units for each type, and a plurality of types of liquid resins are respectively transferred from the plurality of second storage units to the liquid resin mixing mechanism by a plurality of delivery mechanisms provided in the resin supply mechanism. The raw material resin which consists of mixed liquid resin is produced | generated by sending out and mixing several types of liquid resin by a liquid resin mixing mechanism, It is characterized by the above-mentioned.

  In the resin molding apparatus according to the present invention, in the above-described resin molding apparatus, the first storage unit stores the solid resin, the solid resin is transferred from the first storage unit to the second storage unit, and the second storage unit The solid resin stored in the storage unit is sent out by the resin material sending unit, so that the raw material resin made of the solid resin is supplied to the storage unit.

  Moreover, the resin molding apparatus according to the present invention is the above-described resin molding apparatus, wherein the temperature of the resin material stored in at least one of the first storage unit, the second storage unit, or the third storage unit. Is provided with a temperature management mechanism for keeping the temperature constant.

  Further, the resin molding apparatus according to the present invention is the above-described resin molding apparatus, wherein the lower mold includes at least a plurality of cavities, the plurality of substrates are arranged on the upper mold so as to face the plurality of cavities, and the plurality of cavities Are filled with a raw material resin, and chips mounted on a plurality of substrates are sealed with a cured resin, respectively.

  Further, the resin molding apparatus according to the present invention is characterized in that, in the above-described resin molding apparatus, a plurality of resin supply mechanisms that respectively supply the raw resin to a plurality of accommodating portions respectively corresponding to the plurality of cavities are provided.

  Moreover, the resin molding apparatus according to the present invention is the above-described resin molding apparatus, comprising at least one molding module having a molding die and a clamping mechanism, and a resin material supply module for supplying the resin material. The supply module and one molding module are detachable, and one molding module is detachable from other molding modules.

  In order to solve the above problems, a resin molding method according to the present invention includes a step of preparing a molding die having at least an upper die and a lower die provided opposite to the upper die, and a cured resin is provided. A resin molding method for molding a molded product including a step of storing a resin material in a first storage unit provided in a resin storage mechanism, and a first storage unit provided in a resin supply mechanism A step of transferring the resin material from the storage unit; a step of sending the resin material stored in the second storage unit toward the storage unit by the resin material sending unit provided in the resin supply mechanism; A housing part that includes a resin transporting mechanism in which a resin material that is to be cured in a cavity provided in at least one of the molds to be cured resin is generated from a resin material, and a resin storage mechanism and a resin supply mechanism are integrated Moving to the vicinity of At least the step of moving the resin supply mechanism from the vicinity of the housing portion to the upper portion of the housing portion, the step of supplying the raw material resin to the housing portion using the raw material resin supply portion provided in the resin supply mechanism, and the cavity It is characterized by comprising a step of filling with a raw material resin, a step of clamping a mold, and a step of forming a cured resin in the cavity.

  In the resin molding method according to the present invention, in the above-described resin molding method, in the step of storing the resin material, a mixed liquid resin generated by previously mixing a plurality of types of liquid resins is stored as the resin material, In the generating step, the mixed liquid resin transferred to the second storage unit is sent out using the resin material sending unit, thereby generating a raw material resin composed of the mixed liquid resin.

  Further, the resin molding method according to the present invention is the above-described resin molding method, wherein the first storage unit and the second storage unit are directly connected, and the resin material delivery unit and the raw material resin supply unit are connected. The method includes a step of preparing a removable third storage unit and a step of replacing the third storage unit mounted on the resin supply mechanism with another third storage unit.

  Further, the resin molding method according to the present invention includes a step of storing a plurality of types of liquid resins in the plurality of first storage units for each type in the above-described resin molding method, and a plurality of first storage units. In the step of transferring a plurality of types of liquid resins to a plurality of second storage units and storing them in the plurality of second storage units for each type, and in the step of generating the raw material resin from the resin material, resin supply A raw resin composed of a mixed liquid resin is produced by mixing a plurality of types of liquid resins using a liquid resin mixing mechanism provided in the mechanism.

  Further, the resin molding method according to the present invention is the resin molding method described above, wherein the resin material is made of a solid resin, and in the step of generating the raw material resin from the resin material, the solid resin stored in the second storage unit is made of resin. The raw material resin which consists of solid resin is produced | generated by sending out using a material delivery part, It is characterized by the above-mentioned.

  Further, the resin molding method according to the present invention is the above resin molding method, wherein the temperature of the resin material stored in at least one of the first storage unit, the second storage unit, or the third storage unit. The method is characterized by comprising a step of maintaining a constant state.

  In the resin molding method according to the present invention, in the above-described resin molding method, at least a plurality of the cavities are provided in the lower mold, and in the step of supplying the raw material resin to the housing portion, a plurality of resin supply mechanisms are used. The raw material resin is supplied to each of the plurality of accommodating portions formed of cavities.

  In the resin molding method according to the present invention, in the above-described resin molding method, in the step of supplying the raw material resin to the housing portion, a plurality of resin supply mechanisms are used, and each of the plurality of resin supply mechanisms has a plurality of cavities. A raw material resin is supplied to each of the above.

  Further, the resin molding method according to the present invention is the above-mentioned resin molding method, wherein a step of preparing at least one molding module having a molding die and a clamping mechanism for clamping the molding die, and supplying a resin material A step of preparing a resin material supply module to be installed, a step of attaching the resin material supply module and one molding module, and the resin material supply module and one molding module can be removed. The molding module and other molding modules can be attached and detached.

  According to the present invention, the resin storage mechanism and the resin supply mechanism are integrated to constitute the resin transport mechanism. By doing in this way, a resin conveyance mechanism can be reduced in size in a resin molding apparatus, and can be moved easily. In addition, the selection of the resin material stored in the resin storage mechanism and the configuration of the resin supply device can be freely recombined according to the product and application. Therefore, it is possible to simplify the configuration of the resin molding apparatus and cope with various production forms.

In the resin molding apparatus which concerns on this invention, it is a top view which shows the outline | summary of Example 1. FIG. FIG. 2 is a schematic view showing a resin transport mechanism in the resin molding apparatus shown in FIG. 1. FIG. 2A is a schematic partial sectional view showing a state in which the resin transport mechanism supplies the mixed liquid resin to the cavity of the movable lower mold, and FIG. 2B is a schematic plan view showing the resin transport mechanism. It is the schematic which shows the structure of the resin conveyance mechanism shown by FIG. 2, and a compressor. In the resin molding apparatus which concerns on this invention, it is the schematic which shows the resin conveyance mechanism of Example 2. FIG. FIG. 4A is a schematic partial sectional view showing a state in which the resin transport mechanism supplies the mixed liquid resin to the cavity of the movable lower mold, and FIG. 4B is a schematic plan view showing the resin transport mechanism. In the resin molding apparatus which concerns on this invention, it is the schematic which shows the resin conveyance mechanism of Example 3. FIG. FIG. 5A is a schematic partial sectional view showing a state in which the resin transport mechanism supplies the mixed liquid resin to the cavity of the movable lower mold, and FIG. 5B is a schematic plan view showing the resin transport mechanism. In the resin molding apparatus which concerns on this invention, it is a top view which shows the outline | summary of Example 4. FIG. In the resin molding apparatus which concerns on this invention, it is a top view which shows the outline | summary of Example 5. FIG.

  As shown in FIGS. 1, 2, 5, and 7, the resin molding apparatus 1 includes a movable lower mold 12, a cavity 14 provided in the movable lower mold 12, and mixed liquid resins 33 and 42 in the cavity 14. Alternatively, the resin supply mechanisms 18 and 45 for supplying the solid resin 47, the resin storage mechanisms 17 and 44 for storing the resin material, and the resin supply mechanisms 18 and 45 and the resin storage mechanisms 17 and 44 are integrated. A resin transport mechanism 16 and a moving mechanism 21 that moves the resin transport mechanism 16 are provided. In FIG. 2, the mixed liquid resin 33 is supplied to the cavity 14 using a one-component dispenser 18 as the resin supply mechanism 18. In FIG. 5, the mixed liquid resin 42 is supplied to the cavity 14 using a two-liquid mixing type dispenser 18 as the resin supply mechanism 18. In FIG. 7, the solid resin 47 is supplied to the cavity 14 using the resin supply mechanism 45.

  Example 1 of the resin molding apparatus according to the present invention will be described with reference to FIGS. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

  The resin molding apparatus 1 shown in FIG. 1 includes a substrate supply / storage module 2, four molding modules 3A, 3B, 3C, and 3D, and a resin supply module 4 as components. The substrate supply / storage module 2, the molding modules 3A, 3B, 3C, and 3D, and the resin supply module 4, which are constituent elements, can be attached to and detached from each other and exchanged with each other. Can be done. For example, in a state where the substrate supply / storage module 2 and the molding module 3A are mounted, the molding module 3B can be mounted on the molding module 3A, and the resin supply module 4 can be mounted on the molding module 3B.

  The substrate supply / storage module 2 is provided with a pre-sealing substrate supply unit 6 that supplies the pre-sealing substrate 5 and a sealed substrate storage unit 8 that stores the sealed substrate 7. The substrate supply / storage module 2 includes a loader 9 and an unloader 10, and a rail 11 that supports the loader 9 and the unloader 10 is provided along the X direction. The loader 9 and the unloader 10 move along the rail 11.

  The loader 9 and unloader 10 supported by the rail 11 move in the X direction between the substrate supply / storage module 2, the molding modules 3A, 3B, 3C, and 3D and the resin supply module 4. Therefore, in a state where the substrate supply / storage module 2 and the molding module 3A are mounted, the loader 9 and the unloader 10 move along the direction (X direction) in which the substrate supply / storage module 2 and the molding module 3A are arranged. .

  In addition, the loader 9 and unloader 10 move in the Y direction. That is, the loader 9 and the unloader 10 move in the horizontal direction. In the present application document, the terms horizontal direction and vertical direction include not only the strict horizontal direction and vertical direction but also the case where the direction is tilted to the extent that it does not interfere with the operation of the moving component.

  Each of the molding modules 3A, 3B, 3C, and 3D is provided with a movable lower mold 12 that can be moved up and down, and a fixed upper mold (not shown, see FIG. 2) disposed opposite to the movable lower mold 12. The fixed upper mold and the movable lower mold 12 constitute a mold. Each molding module has a clamping mechanism 13 (a circular portion indicated by a two-dot chain line) that clamps and opens the fixed upper mold and the movable lower mold 12. A cavity 14 composed of a space to which raw material resin is supplied is provided in the movable lower mold 12, and the cavity 14 is covered with a release film 15 (a rectangular portion indicated by a two-dot chain line). The movable lower mold 12 and the fixed upper mold only need to move relative to each other so that the mold can be clamped and opened.

  The resin supply module 4 is provided with a resin transport mechanism 16. The resin transport mechanism 16 is supported by the rail 11 and moves along the rail 11. Therefore, in a state where the resin supply module 4 and the molding module 3D are mounted, the resin transport mechanism 16 moves along the direction (X direction) in which the resin supply module 4 and the molding module 3D are arranged.

  The resin transport mechanism 16 is configured by integrating a resin storage mechanism 17 and a resin supply mechanism 18. In the first embodiment, a liquid resin is stored in the resin storage mechanism 17 and a dispenser is used as the resin supply mechanism 18. The resin storage mechanism 17 is provided with two cartridges 19 and 20 for storing a liquid resin. Each cartridge 19, 20 and the dispenser 18 are connected by a flexible hose (not shown). The number of cartridges provided in the resin storage mechanism 17 can be arbitrarily set according to the type of liquid resin to be used and the production form.

  The resin supply module 4 is provided with a moving mechanism 21. The resin transport mechanism 16 supported by the rail 11 is moved in the X direction along the rail 11 by the moving mechanism 21. If it demonstrates concretely, the resin conveyance mechanism 16 will move between the resin supply module 4 and each shaping | molding module 3A, 3B, 3C, 3D. The dispenser 18 moves in the Y direction. In addition, the resin transport mechanism 16 may be moved in the Y direction.

  In the application documents, the words “integrated and configured”, “integrated”, “integrated”, “integrated”, etc., consist of a plurality of components. It means that the lump can move. The terms “integrated and configured”, “integrated”, “integrated”, “integrated”, etc. indicate that multiple components that can move together can be separated from each other. Including. In addition, expressions such as “C in which A and B are integrated” do not exclude that C includes components other than A and B.

  The resin supply module 4 includes a vacuum pulling mechanism 22 that forcibly sucks and discharges air from the cavity 14 in a state where the fixed upper mold and the movable lower mold 12 are clamped in the molding modules 3A, 3B, 3C, and 3D. Provided. The resin supply module 4 is provided with a control unit 23 that controls the operation of the entire resin molding apparatus 1. In FIG. 1, the case where the vacuuming mechanism 22 and the control unit 23 are provided in the resin supply module 4 is shown. Not only this but the vacuuming mechanism 22 and the control part 23 may be provided in another module.

  A mechanism in which the dispenser 18 according to the first embodiment supplies the mixed liquid resin to the cavity 14 provided in the movable lower mold 12 will be described with reference to FIGS. 1 and 2. As shown in FIG. 2A, each of the molding modules 3A, 3B, 3C, and 3D (see FIG. 1) is provided with a fixed upper mold 24, a movable lower mold 12, and a film pressing member 25. At least the fixed upper mold 24 and the movable lower mold 12 constitute a molding mold. Each of the molding modules 3A, 3B, 3C, and 3D has a mold clamping mechanism 13 (see FIG. 1) for clamping the mold and opening the mold.

  The release film 15 covers the cavity 14 and its periphery. The film pressing member 25 is a member for pressing and fixing the release film 15 to the mold surface of the movable lower mold 12 around the cavity 14. The film pressing member 25 has an opening at the center, and the mold is located inside the opening. For example, the pre-sealing substrate 5 on which the LED chip 26 or the like is mounted is fixed to the fixed upper mold 24 by suction or clamping. The movable lower mold 12 is provided with an entire cavity 14 and individual cavities 27 corresponding to the respective LED chips 26 in the entire cavity 14.

  A release film 15 is supplied so as to cover the entire surface of the entire cavity 14. Around the entire cavity 14, the release film 15 is pressed against and fixed to the mold surface of the movable lower mold 12 by the film pressing member 25. The release film 15 is adsorbed along the mold surface in each individual cavity 27. FIG. 2A shows the case where the film pressing member 25 is used. Not limited to this, the release film 15 and the film pressing member 25 may not be used.

  As shown in FIG. 2B, the resin transport mechanism 16 is configured by integrating a resin storage mechanism 17 and a dispenser 18. The dispenser 18 shown in FIG. 2 uses a mixed liquid resin produced by previously mixing a liquid resin as a main agent and a curing agent as an auxiliary agent. A so-called one-component dispenser is used. Accordingly, the mixed liquid resin is stored in each of the cartridges 19 and 20. A resin storage mechanism 17 is provided on the side of the resin transport mechanism 16 (the lower side in FIG. 2B). Instead of this, the resin storage mechanism 16 may be provided behind the resin transport mechanism 16 (on the right side in FIG. 2B).

  Each cartridge 19, 20 is connected to a mixed liquid resin reservoir 29 provided in the dispenser 18 by a flexible hose 28 that is a pipe. The reservoir 29 is made of stainless steel. The flexible hose 28 is provided with a switching valve (not shown) that switches the target connected to the flow path toward the storage unit 29 to one of the cartridges 19 and 20.

  The length of the flexible hose 28 should just be the length corresponding to the distance which the dispenser 18 which the resin conveyance mechanism 16 has moves to a Y direction. The flexible hose 28 preferably has flexibility, pressure resistance, heat resistance, and the like. The flexible hose 28 is made of, for example, a fluororesin.

  The dispenser 18 includes a storage unit 29 that stores the mixed liquid resin, a metering and feeding mechanism 30 that supplies the stored mixed liquid resin by a predetermined amount, and a static mixer that is a static mixing member that stirs the sent mixed liquid resin. 31 and the nozzle 32 which is a discharge part are connected and comprised integrally. In this case, the mixed liquid resin 33 is discharged directly (−Z direction) from the tip of the nozzle 32. The direction in which the mixed liquid resin 33 is discharged from the tip of the nozzle 32 may be right side or may be obliquely below.

  The resin transport mechanism 16 is provided with a moving mechanism 34 that moves the dispenser 18 of the resin transport mechanism 16 in the Y direction. The dispenser 18 can also be moved in the vertical direction (Z direction). The dispenser 18 shown in FIG. 2A is centered on one point in a vertical plane (in a plane including the Y axis and the Z axis) or in a horizontal plane (in a plane including the X axis and the Y axis). And can be reciprocated so as to partially rotate. In this case, the dispenser 18 reciprocates so as to draw a part of the arc.

  The dispenser 18 shown in FIG. 2 is configured integrally by connecting a reservoir 29, a metering delivery mechanism 30, a static mixer 31, and a nozzle 32. Therefore, each component (reservoir 29, metering delivery mechanism 30, static mixer 31, nozzle 32) can be attached to and detached from each other and replaced. By doing in this way, dispenser 18 can be constituted optimally according to a product and a use.

  In the resin transport mechanism 16, the mixed liquid resin 33 is stored in the cartridges 19 and 20 and the storage unit 29. A temperature for managing the temperature of the mixed liquid resin 33 around the cartridges 19 and 20 and around the storage portion 29 in order to store the mixed liquid resin 33 at a stable temperature or at a predetermined temperature rising state or temperature decreasing state. A management mechanism CTL (a portion schematically shown by a dotted line in FIG. 2B) can be provided. The temperature management mechanism CTL includes a heating element or a cooling element. As the temperature management mechanism CTL, a cylindrical member made of a heat insulating material may be attached to the cartridges 19 and 20 and the storage unit 29.

  With reference to FIG. 1 and FIG. 2, the case where the molding module 3C is used as operation | movement of the resin molding apparatus 1 is demonstrated. For example, the pre-sealing substrate 5 on which the LED chip 26 is mounted is transferred from the pre-sealing substrate supply unit 6 to the loader 9 with the surface on which the LED chip 26 is mounted facing down. Next, the loader 9 is moved in the + X direction from the substrate supply / storage module 2 along the rail 11 to the molding module 3C.

  Next, in the molding module 3C, the loader 9 is moved in the −Y direction to a predetermined position between the movable lower mold 12 and the fixed upper mold 24 (see FIG. 2). The pre-sealing substrate 5 with the surface on which the LED chip 26 is mounted facing down is fixed to the lower surface of the fixed upper mold 24. After placing the pre-sealing substrate 5 on the lower surface of the fixed upper mold 24, the loader 9 is moved to the original position in the substrate supply / storage module 2.

  Next, using the moving mechanism 21, the resin transport mechanism 16 is moved in the −X direction from the standby position in the resin supply module 4 to the molding module 3 </ b> C along the rail 11. As a result, the resin transport mechanism 16 is moved to a predetermined position near the movable lower mold 12 in the module 3C. FIG. 1 shows a state after the resin transport mechanism 16 is moved to a predetermined position near the movable lower mold 12 in the module 3C.

  Next, using the moving mechanism 34, the dispenser 18 is moved from the resin transport mechanism 16 to a predetermined position above the movable lower mold 12.

  Next, as shown in FIG. 2A, the mixed liquid resin 33 is supplied from the nozzle 32 of the dispenser 18 to the cavity 14.

  Specifically, the mixed liquid resin 33 stored in one of the cartridges 19 and 20 is transferred to the storage unit 29 provided in the dispenser 18 via the flexible hose 28. The mixed liquid resin 33 is delivered from the storage unit 29 using the metering delivery mechanism 30. Using the static mixer 31, the mixed liquid resin 33 delivered from the storage unit 29 is agitated. The mixed liquid resin 33 is discharged from the nozzle 32 of the dispenser 18 into the cavity 14.

  The step of moving the dispenser 18 from the resin transport mechanism 16 to a predetermined position above the movable lower mold 12 and the step of sending and stirring the mixed liquid resin 33 from the storage unit 29 to the static mixer 31 are performed in parallel. Can also be executed.

  Next, after supplying the mixed liquid resin 33 to the cavity 14, the dispenser 18 is moved back to the original position of the resin transport mechanism 16 using the moving mechanism 34. The moving mechanism 21 is used to move the resin transport mechanism 16 to the original standby position in the resin supply module 4.

  Next, in the molding module 3 </ b> C, after the mixed liquid resin 33 is supplied to the cavity 14, the movable lower mold 12 is moved upward using the mold clamping mechanism 13, and the fixed upper mold 24 and the movable lower mold 12 are molded. Tighten. By clamping the mold, the LED chip 26 attached to the pre-sealing substrate 5 is immersed in the mixed liquid resin 33 supplied to the cavity 14. At this time, a predetermined resin pressure can be applied to the mixed liquid resin 33 in the cavity 14 by using a cavity bottom member (not shown) provided in the movable lower mold 12.

  In the process of clamping the mold, the inside of the cavity 14 may be sucked using the vacuuming mechanism 22. As a result, air remaining in the cavity 14 and bubbles contained in the mixed liquid resin 33 are discharged to the outside of the mold. In addition, the inside of the cavity 14 is set to a predetermined degree of vacuum.

  Next, the mixed liquid resin 33 is cured by heating the mixed liquid resin 33 for a time necessary for curing, thereby forming a cured resin. Thus, the LED chip 26 mounted on the pre-sealing substrate 5 is resin-sealed with a cured resin formed corresponding to the shape of the cavity 14. After the mixed liquid resin 33 is cured, the fixed upper mold 24 and the movable lower mold 12 are opened using the mold clamping mechanism 13. The mixed liquid resin 33 is a material supplied to the cavity 14 immediately before the cured resin is formed. Hereinafter, a material supplied to the cavity 14 immediately before the cured resin is formed is referred to as a raw material resin.

  Next, the loader 9 is retracted to an appropriate position that does not prevent the unloader 10 from moving to the molding module 3C. For example, the loader 9 is retracted from the substrate supply / storage module 2 to an appropriate position in the molding module 3D or the resin supply module 4. Thereafter, the unloader 10 is moved in the + X direction along the rail 11 from the substrate supply / storage module 2 to the forming module 3C.

  Next, in the molding module 3 </ b> C, the unloader 10 is moved in the −Y direction to a predetermined position between the movable lower mold 12 and the fixed upper mold 24, and the unloader 10 receives the sealed substrate 7 from the fixed upper mold 24. . After receiving the sealed substrate 7, the unloader 10 is returned to the substrate supply / storage module 2, and the sealed substrate 7 is stored in the sealed substrate storage portion 8. At this point, resin sealing of the first pre-sealing substrate 5 is completed, and the first sealed substrate 7 is completed.

  Next, the loader 9 that has been retracted to an appropriate position in the molding module 3 </ b> D or the resin supply module 4 is moved to the substrate supply / storage module 2. The next pre-sealing substrate 5 is delivered from the pre-sealing substrate supply unit 6 to the loader 9. In this way, resin sealing is repeated.

  Using the control unit 23, supply of the substrate 5 before sealing, movement of the resin transport mechanism 16 and the dispenser 18, discharge of the mixed liquid resin 33, clamping and opening of the fixed upper mold 24 and the movable lower mold 12, All operations such as storage of the sealed substrate 7 are controlled.

  According to the present embodiment, the resin transport mechanism 16 is configured by integrating the resin storage mechanism 17 and the dispenser 18. Thus, the movement distance of the dispenser 18 becomes a short distance from the vicinity of the movable lower mold 12 to a predetermined position above the movable lower mold 12. Therefore, the distance of the flexible hose 28 can be shortened. When the entire resin transport mechanism 16 is moved in the -Y direction to a predetermined position near the movable lower mold 12, the dispenser 18 itself is not moved in the -Y direction. Can be made even shorter.

  By shortening the distance of the flexible hose 28, the resin conveyance mechanism 16 can be reduced in size first. Accordingly, the resin transport mechanism 16 can be easily moved via the rail 11 between the resin supply module 4 and the molding modules 3A, 3B, 3C, and 3D.

  Secondly, the flexible hose 28 can be prevented from being bent or bent as the dispenser 18 moves. Thereby, in the flexible hose 28, it can suppress that the liquid mixture resin 33 and air accumulate in a curved part. Therefore, the mixed liquid resin 33 can be stably transferred to the storage portion 29 of the dispenser 18.

  According to the present embodiment, the dispenser 18 that moves from the vicinity of the movable lower mold 12 to a predetermined position above the movable lower mold 12 is connected to the storage section 29, the metering delivery mechanism 30, the static mixer 31, and the nozzle 32. It is configured integrally. By configuring integrally, the dispenser 18 itself can be reduced in size. Therefore, the resin transport mechanism 16 in which the dispenser 18 and the resin storage mechanism 17 are integrated can be reduced in size.

  Moreover, each component (the storage part 29, the metering delivery mechanism 30, the static mixer 31, the nozzle 32) which comprises the dispenser 18 can be mutually attached and detached and replaced | exchanged. For example, by replacing the nozzle 32, the direction in which the mixed liquid resin 33 is discharged can be set to an arbitrary direction such as right below, right next, or diagonally below. In addition, since the mixed liquid resin 33 previously mixed in one liquid is used, the static mixer 31 may not be provided. In this case, the dispenser 18 can be further downsized.

  According to the present embodiment, the reservoir 29 of the mixed liquid resin 33 is made of stainless steel (stain-less steel). For example, the storage part made of polypropylene swells by receiving pressure (resin pressure) when the mixed liquid resin 33 is transferred. On the other hand, the stainless steel reservoir does not swell even when subjected to resin pressure. Therefore, the storage part 29 is not deformed by the resin pressure. As a result, the inner diameter of the reservoir 29 does not vary. Therefore, the metering delivery mechanism 30 can stably deliver a predetermined amount of the mixed liquid resin 33 without variation.

  According to the present embodiment, the mixed liquid resin 33 is used in which the main agent and the curing agent are mixed to generate one liquid in advance. After the mixed liquid resin 33 mixed in one liquid is mixed, a chemical reaction proceeds. In order to store the mixed liquid resin 33 stably, it is desirable to control the temperature. Therefore, a temperature management mechanism CTL (a portion schematically shown by a dotted line in FIG. 2B) that manages the temperature of the mixed liquid resin 33 can be provided around the cartridges 19 and 20 or around the storage portion 29. The mixed liquid resin 33 can be cooled by the temperature management mechanism CTL to suppress the progress of the chemical reaction.

  According to the present embodiment, a plurality of cartridges 19 and 20 for storing the mixed liquid resin 33 are provided. This makes it possible to store a large volume of mixed liquid resin 33. For example, when the mixed liquid resin 33 in one cartridge 19 becomes empty, it can be switched to the remaining cartridge 20 using a switching valve (not shown) and connected to the flexible hose 28. Therefore, it is not necessary to stop the operation of the resin molding apparatus 1 in order to replace the cartridge, so that productivity is not lowered.

  According to the present embodiment, the substrate supply / storage module 2, the molding modules 3A, 3B, 3C, and 3D, and the resin supply module 4, which are the components shown in FIG. 1, are respectively attached to and detached from other components. And can be exchanged. As a result, the number of molding modules can be increased or decreased afterwards in the resin molding apparatus 1. Therefore, it can be increased or decreased and transferred in units of molding modules in accordance with changes in market trends. In FIG. 1, each component is mounted and arranged along the X direction, and the case where four molding modules are provided is shown. However, the present invention is not limited to this, and an arbitrary number of molding modules can be provided.

  In this embodiment, as shown in FIG. 2A, the dispenser 18 itself is arranged along the horizontal direction, in other words, it is arranged sideways. As a result, the height of the resin molding apparatus 1 can be reduced. The dispenser 18 itself may be arranged along the vertical direction, in other words, vertically. Thereby, the plane area of the resin molding apparatus 1 can be reduced. In addition, the dispenser 18 itself may be disposed obliquely downward. Depending on characteristics such as the viscosity of the mixed liquid resin 33, the dispenser 18 itself may be disposed obliquely upward or upward.

  In this embodiment, the direction in which the resin transport mechanism 16 moves (X direction) and the direction in which the dispenser 18 moves (Y direction) are orthogonal to each other. Not limited to this, the direction in which the resin transport mechanism 16 moves and the direction in which the dispenser 18 moves may not be orthogonal to each other, and may be in the same direction.

  In the present embodiment, the entire resin transport mechanism 16 is moved to a predetermined position near the movable lower mold 12 in the module 3C. In this step, the entire resin transport mechanism 16 may be moved in the −Y direction to a predetermined position near the movable lower mold 12. In this case, a moving mechanism for moving the resin transport mechanism 16 along the Y direction is provided separately from the moving mechanism 21 (see FIG. 1) for moving the resin transport mechanism 16 along the X direction. The phrase “predetermined position in the vicinity of the movable lower mold 12 in the module 3 </ b> C” includes from the position on the rail 11 in the molding module 3 </ b> C to the position where the resin transport mechanism 16 can be closest to the movable lower mold 12.

  With reference to FIG. 3, in Example 1 which concerns on this invention, the structure of the resin storage mechanism 17, the dispenser 18, and a pressurization mechanism is demonstrated. In FIG. 3, the mixed liquid resin 33 is stored in both of the two cartridges 19 and 20. The compressor 35 as a pressurizing mechanism is connected to the cartridges 19 and 20 by a flexible hose 36. Compressed air is supplied from the compressor 35 to the cartridges 19 and 20 through the flexible hose 36. An electropneumatic regulator 37 that controls the pressure of compressed air is provided between the compressor 35 and the cartridges 19 and 20. The electropneumatic regulator 37 can be used to control the pressure of the compressed air supplied from the compressor 35 in multiple stages.

  Compressed air is supplied to one of the two cartridges 19 using a switching valve (not shown). FIG. 3 shows a case where two cartridges 19 and 20 are provided. Three or more cartridges may be provided.

  Plungers 38 and 39 that advance and retreat in accordance with the pressure of the compressed air supplied from the compressor 35 are provided inside the cartridges 19 and 20, respectively.

  A temperature management mechanism CTL that manages the temperature of the mixed liquid resin 33 can be provided around each of the cartridges 19 and 20 and around the storage unit 29.

  In the resin molding apparatus 1 (see FIG. 1), the resin transport mechanism 16 (see FIGS. 1 and 2) in which the resin storage mechanism 17 and the dispenser 18 are integrated includes the resin supply module 4 and the molding modules 3A, 3B, Move between 3C and 3D. Therefore, the flexible hose 36 for supplying compressed air from the compressor 35 is preferably made of a flexible material.

  The operation of the dispenser 18 will be described with reference to FIG. For example, compressed air is supplied into the cartridge 19 from the compressor 35 via the flexible hose 36 and the electropneumatic regulator 37 in order. The compressed air supplied into the cartridge 19 is used to press the plunger 38 in the cartridge 19. The pressed plunger 38 descends and presses the mixed liquid resin 33. Thus, the mixed liquid resin 33 is transferred to the storage unit 29 provided in the dispenser 18 via the flexible hose 28.

  Similarly, compressed air is supplied from the compressor 35 into the cartridge 20. The plunger 39 is pressed using the compressed air supplied into the cartridge 20. In this way, the mixed liquid resin 33 is transferred from the cartridge 20 to the storage unit 29.

  The controller 23 (see FIG. 1) controls the transfer of the mixed liquid resin 33 as follows. The operation in which the compressed air supplied from the compressor 35 presses the mixed liquid resin 33 in the cartridge 19 and the operation in which the mixed liquid resin 33 is sucked into the storage portion 29 from the cartridge 19 using the metering delivery mechanism 30 are synchronized. Let By doing so, the mixed liquid resin 33 can be stably filled in the storage part 29 without forming a vacuum state in the storage part 29.

  Depending on the viscosity of the mixed liquid resin 33, for example, the electropneumatic regulator 37 can be used to control the pressure of the compressed air in several steps from high pressure to low pressure. As a result, the mixed liquid resin 33 can be filled in the storage portion 29 more stably. By using the electropneumatic regulator 37 and optimizing the pressure in accordance with the viscosity of the mixed liquid resin 33, it is possible to further suppress the mixed liquid resin 33 and air accumulation in the flexible hose 28.

  The liquid amount of the mixed liquid resin 33 in each cartridge 19 and 20 can be managed using a capacitance sensor, a beam sensor, an infrared sensor, a proximity sensor, or the like. By managing the amount of liquid, it is detected that the mixed liquid resin 33 in one cartridge is reduced in a plurality of cartridges 19 and 20.

  In a state where the resin molding apparatus 1 is in operation, for example, when the mixed liquid resin 33 in the cartridge 19 is reduced, the mixed liquid resin 33 in the unused cartridge 20 is used by switching to the unused cartridge 20. To do. By doing so, it is possible to avoid a situation in which air is mixed into the mixed liquid resin 33 filled in the storage portion 29 and bubbles are generated.

  With reference to FIG. 4, the mechanism in which the resin conveyance mechanism 16 in Example 2 supplies the mixed liquid resin 33 to the cavity 14 provided in the movable lower mold | type 12 is demonstrated. The difference from the first embodiment is that the resin transport mechanism 16 is provided with only the dispenser 18 without providing the resin storage mechanism 17.

  As shown in FIG. 4, the resin transport mechanism 16 is provided with only the dispenser 18 without the resin storage mechanism 17. In the dispenser 18 shown in FIG. 4, for example, the functions of one cartridge 19 provided in the resin storage mechanism 17 shown in FIG. 2 and the storage portion 29 provided in the dispenser 18 are integrated into one. A cartridge 40 is newly provided. The cartridge 40 includes portions 40a and 40b having virtually two functions. For example, one part 40 a has a function of storing the mixed liquid resin 33 included in the cartridge 19, and the other part 40 b has a function of storing the mixed liquid resin 33 included in the storage unit 29. Therefore, the mixed liquid resin 33 that does not require the transfer operation is stored in the cartridge 40.

  On one side of the cartridge 40, a metering delivery mechanism 30 that delivers a predetermined amount of the mixed liquid resin 33 is provided. On the other side of the cartridge 40, a static mixer 31 for stirring the delivered mixed liquid resin 33 is provided. A nozzle 32 is attached to the tip of the static mixer 31. The mixed liquid resin 33 is discharged directly (−Z direction) from the tip of the nozzle 32.

  The dispenser 18 shown in FIG. 4 is configured integrally by connecting a cartridge 40, a metering delivery mechanism 30, a static mixer 31, and a nozzle 32. Therefore, each component (cartridge 40, metering delivery mechanism 30, static mixer 31, nozzle 32) can be attached to and detached from each other and replaced. By changing the cartridge 40, the mixed liquid resin 33 can be supplied to the dispenser 18. Further, by replacing the nozzle 32, the direction in which the mixed liquid resin 33 is discharged can be set to any direction such as right below, right next, or diagonally below.

  Similarly to the first embodiment, in order to store the mixed liquid resin 33 at a stable temperature, the temperature management mechanism CTL (FIG. 4B) manages the temperature of the mixed liquid resin 33 around the cartridge 40. A portion schematically shown by a dotted line) can be provided.

  Since the operations of the dispenser 18 and the resin transport mechanism 16 shown in the second embodiment are the same as those in the first embodiment, the description thereof is omitted.

  According to the present embodiment, only the dispenser 18 is provided in the resin transport mechanism 16 without providing the resin storage mechanism 17. Therefore, the resin transport mechanism 16 can be minimized and miniaturized. In addition, since the mixed liquid resin 33 previously mixed in one liquid is used, the static mixer 31 may not be provided. In this case, the dispenser 18 can be further downsized. Therefore, the resin transport mechanism 16 can be further downsized.

  Further, since the resin storage mechanism 17 is not provided, the flexible hose 28 that connects the cartridges 19 and 20 and the storage portion 29 of the dispenser 18 is not necessary. Therefore, it is possible to completely eliminate the bending or bending of the flexible hose 28 accompanying the movement of the dispenser 18. In this way, by adopting a configuration in which the resin storage mechanism 17 is not provided, the entire resin molding apparatus 1 can be simplified and downsized.

  With reference to FIG. 5, the mechanism in which the resin transport mechanism 16 in Example 3 supplies mixed liquid resin to the cavity 14 provided in the movable lower mold | type 12 is demonstrated. The difference from Example 1 is that a so-called two-component mixing type dispenser that uses a mixed liquid resin produced by mixing a main agent and a curing agent when actually used is used.

  As shown in FIG. 5, the resin transport mechanism 16 is configured by integrating a resin storage mechanism 17 and a dispenser 18. The resin storage mechanism 17 is provided with two cartridges 19A and 19B for main agent for storing the liquid resin as the main agent and two cartridges 20C and 20D for hardener for storing the liquid resin as the hardener. It is done. As the main agent, a silicone resin or an epoxy resin having thermosetting properties and translucency is used.

  The dispenser 18 shown in FIG. 5 is a two-component mixing type dispenser that mixes a main agent and a curing agent when actually used. A resin storage mechanism 17 was provided on one side of the resin transport mechanism 16 (the lower side in FIG. 5B). Instead of this, the resin storage mechanism 17 may be provided on both sides (the upper side and the lower side in FIG. 5B) of the resin transport mechanism 16.

  The main cartridges 19A and 19B are connected to a main agent storage 29A provided in the dispenser 18 by a flexible hose 28A. The hardener cartridges 20C and 20D are connected to a hardener storage portion 29C provided in the dispenser 18 by a flexible hose 28C. The main agent reservoir 29A and the hardener reservoir 29C are both made of stainless steel.

  The length of the flexible hoses 28A, 28C may be a length corresponding to the distance that the dispenser 18 of the resin transport mechanism 16 moves in the Y direction. The flexible hoses 28A and 28C preferably have flexibility, pressure resistance, heat resistance, and the like, as in the first embodiment.

  The main agent metering mechanism 30A is connected to the main agent reservoir 29A. A curing agent metering mechanism 30C is connected to the curing agent reservoir 29C. Both the main agent reservoir 29 </ b> A and the hardener reservoir 29 </ b> C are connected to a common space called a mixing chamber 41.

  A static mixer 31 is connected to the mixing chamber 41. The mixing chamber 41 and the static mixer 31 together constitute a mixing unit that mixes the main agent and the curing agent. A nozzle 32 is attached to the tip of the static mixer 31. The mixed liquid resin 42 generated by mixing the main agent and the curing agent in the mixing unit is discharged directly from the tip of the nozzle 32 (in the −Z direction).

  The resin transport mechanism 16 is provided with a moving mechanism 43 that moves the dispenser 18 of the resin transport mechanism 16 in the Y direction. The dispenser 18 can also be moved in the vertical direction (Z direction). Similarly to the first embodiment, the dispenser 18 shown in FIG. 5A is placed in the vertical plane (in the plane including the Y axis and the Z axis) or in the horizontal plane (in the plane including the X axis and the Y axis). , It can be reciprocated so as to partially rotate around a certain point.

  The static mixer 31 and the nozzle 32 shown in FIG. 5 are attached to and detached from each other. Therefore, the static mixer 31 and the nozzle 32 can be exchanged with each other. It can replace with this and the static mixer 31 and the nozzle 32 can be made into the integrated member. In addition, by exchanging the nozzle 32, the direction in which the mixed liquid resin 42 is discharged can be set to be just beside or obliquely downward.

  In the third embodiment, an operation in which the two-liquid mixing type dispenser 18 supplies the mixed liquid resin 42 to the cavity 14 will be described. The operation other than the operation of the dispenser 18 supplying the mixed liquid resin 42 to the cavity 14 is the same as that shown in the first embodiment, and a description thereof will be omitted.

  The main agent stored in one of the main agent cartridges 19A and 19B is transferred to the main agent reservoir 29A via the flexible hose 28A. The main agent is sent out from the main agent reservoir 29A to the mixing chamber 41 using the metering mechanism 30A. The curing agent stored in one of the cartridges 20C and 20D for the curing agent is transferred to the curing agent storage unit 29C via the flexible hose 28C. Using the metering delivery mechanism 30C, the curing agent is delivered from the curing agent reservoir 29C to the mixing chamber 41. In the mixing chamber 41, the main agent and the curing agent are merged. The main agent and the curing agent which have started to be mixed and mixed in the mixing chamber 41 are further stirred and mixed using the static mixer 31. As a result, the mixed liquid resin 42 is generated. The mixed liquid resin 42 generated in the cavity 14 is discharged directly from the nozzle 32 of the dispenser 18.

  As shown in the third embodiment, the dispenser 18 is configured by integrating the following components. These components include storage portions 29A and 29C for storing the main agent and the curing agent, metering delivery mechanisms 30A and 30C for sending the stored main agent and the curing agent by a predetermined amount, and the sent main agent and the curing agent, respectively. A mixing chamber 41 and a static mixer 31 that mix to generate a mixed liquid resin 42 and a nozzle 32 that discharges the mixed liquid resin 42. Thereby, the dispenser 18 can be reduced in size. Therefore, the resin transport mechanism 16 in which the dispenser 18 and the resin storage mechanism 17 are integrated can be reduced in size.

  The two-component mixing type dispenser 18 mixes the main agent and the curing agent to generate a mixed liquid resin 42. The mixing ratio of the mixed liquid resin 42 is determined by controlling the amount of the main agent delivered from the storage unit 29A and the amount of the curing agent delivered from the storage unit 29C. Therefore, the viscosity of the mixed liquid resin 42 can be optimized by adjusting the mixing ratio of the main agent and the curing agent in the dispenser 18. Depending on the product and application, the resin molding apparatus 1 can produce an optimal mixed liquid resin 42 and perform resin sealing.

  For example, a combination of a servo motor and a ball screw can be used as the main agent and curing agent metering mechanisms 30A and 30C. Depending on the number of rotations of the servo motor, it is possible to accurately control the amounts of the main agent and the curing agent to be delivered. Not only this but the combination of a stepping motor and a ball screw, a uniaxial eccentric screw system, an air cylinder, etc. can also be used.

  In FIG. 5, the case where all the components which comprise the dispenser 18 are integrated is shown. Not limited to this, the dispenser 18 can also be divided into two blocks. Specifically, there are two blocks: a block for dispensing and dispensing dispensed liquid resin (stored delivery unit) and a block for mixing and delivering dispensed liquid resin (mixed delivery unit). Divide into Further, the storage and delivery unit is divided into a main agent storage and delivery unit and a curing agent storage and delivery unit. The mixed discharge unit can move in the Y direction.

  As shown in the first and third embodiments, in the present invention, the resin storage mechanism 17 and the dispenser 18 are integrated to form the resin transport mechanism 16. By doing in this way, the resin conveyance mechanism 16 can be reduced in size and can be easily moved in the resin molding apparatus 1. In addition, the selection of the liquid resin to be used and the configuration of the dispenser can be freely selected according to the product and application. As the dispenser 18, either one liquid type or two liquid mixture type dispenser can be selected. Therefore, the configuration of the resin molding apparatus 1 can be simplified and various production forms can be handled.

  Further, as shown in the second embodiment, the resin transport mechanism 16 may be configured such that the resin storage mechanism 17 is not provided. In this case, the resin transport mechanism 16 can be further downsized. Therefore, the structure of the resin molding apparatus 1 can be further simplified and downsized.

  With reference to FIG. 6, Example 4 of the resin molding apparatus 1 which concerns on this invention is demonstrated. The difference from Example 1 is an apparatus configuration in which a plurality of pre-sealing substrates 5 are resin-sealed by a single molding process. The basic apparatus configuration and operation are the same as those in the first embodiment, and detailed description thereof is omitted here.

  As shown in FIG. 6, two cavities 14A and 14C are provided in each movable lower mold 12 of each of the molding modules 3A, 3B, 3C, and 3D. The cavities 14 </ b> A and 14 </ b> C are covered with a single release film 15. Or each cavity 14A, 14C can also be set as the structure coat | covered with two release films separately.

  Two dispensers 18A and 18C are provided in the resin transport mechanism 16 corresponding to the two cavities 14A and 14C. As the dispensers 18A and 18C, either a one-component type or a two-component mixed type dispenser can be selected. Also for the resin storage mechanisms 17A and 17C, an optimal type of liquid resin can be selected in accordance with the configuration of the dispensers 18A and 18C to be used.

  For example, a one-liquid type dispenser is selected as the dispensers 18A and 18C. In this case, in the cartridges 19A and 20C provided in the resin storage mechanism 17A and the cartridges 19B and 20D provided in the resin storage mechanism 17C, the main agent and the curing agent are mixed in advance and generated as one liquid. The mixed liquid resin 33 is stored. The mixed liquid resin 33 is transferred from one of the cartridges 19A and 20C to the dispenser 18A, and the mixed liquid resin 33 is transferred from one of the cartridges 19B and 20D to the dispenser 18C.

  When the one-liquid type dispensers 18A and 18C are selected, only one of the resin storage mechanisms 17A and 17C can be provided. For example, by providing only the resin storage mechanism 17A, the mixed liquid resin 33 can be transferred from the cartridge 19A to the dispenser 18A, and the mixed liquid resin 33 can be transferred from the cartridge 20C to the dispenser 18C. The number of cartridges provided in the resin storage mechanisms 17A and 17C can be selected depending on the product and the production amount.

  As the dispensers 18A and 18C, a two-liquid mixing type dispenser is selected. In that case, the main agent is stored in the cartridge 19A provided in the resin storage mechanism 17A, and the curing agent is stored in the cartridge 20C. The main agent from the cartridge 19A and the curing agent from the cartridge 20C are transferred to the dispenser 18A, and the two liquids are mixed in the dispenser 18A to generate a mixed liquid resin 42 (see FIG. 5). Similarly, the main agent from the cartridge 19B provided in the resin storage mechanism 17C and the curing agent from the cartridge 20D are transferred to the dispenser 18C, and the two liquids are mixed in the dispenser 18C to generate the mixed liquid resin 42. The configurations and operations of the dispensers 18A and 18C are the same as the configurations of the dispenser 18 shown in the first and third embodiments, and the operations are the same for both the one-liquid type and the two-liquid mixing type dispensers.

  As shown in FIG. 6, the resin transport mechanism 16 is configured by integrating resin storage mechanisms 17A and 17C and dispensers 18A and 18C. The resin transport mechanism 16 can be moved by the moving mechanism 21 through the rail 11 between the resin supply module 16 and the molding modules 3A, 3B, 3C, and 3D. In each molding module, the dispensers 18A and 18C are moved to a predetermined position near the movable lower mold 12, and the mixed liquid resins 33 and 42 (see FIGS. 2 and 5) are supplied to the cavities 14A and 14C.

  As shown in FIG. 6, in each molding module, the movable lower mold 12 is provided with a plurality of cavities 14 </ b> A and 14 </ b> C. Corresponding to the plurality of cavities 14 </ b> A and 14 </ b> C, a plurality of pre-sealing substrates 5 are arranged on the fixed upper mold 24. Therefore, the plurality of pre-sealing substrates 5 can be resin-sealed by one molding process. Since a plurality of pre-sealing substrates 5 can be resin-sealed by a single molding process, productivity can be significantly improved. Therefore, it becomes possible to provide the resin molding apparatus 1 corresponding to a production form and a production amount.

  FIG. 6 shows a case where two dispensers 18A and 18C are provided corresponding to the cavities 14A and 14C. The present invention is not limited to this, and it is also possible to provide only one dispenser 18 and supply the mixed liquid resins 33 and 42 to the two cavities 14 </ b> A and 14 </ b> C by one dispenser 18. Further, it is possible to provide three or more cavities in the movable lower mold 12.

  With reference to FIG. 7, Example 5 of the resin molding apparatus 1 which concerns on this invention is demonstrated. The difference from Example 1 is that not a liquid resin but a solid resin is used as a resin material. When a high viscosity liquid resin is used, there are liquid resins that are difficult to store in a liquid state. In that case, the liquid resin is used in a solid state. For example, in resin molding such as underfill of a semiconductor chip, resin molding is performed using a solid silicone resin or epoxy resin.

  In FIG. 7, the resin transport mechanism 16 is configured by integrating a resin storage mechanism 44 and a resin supply mechanism 45. A plurality of cassettes 46 are installed in the resin storage mechanism 44. The cassette 46 is loaded with a solid resin 47 formed in a plate shape using, for example, a silicone resin or an epoxy resin. The resin supply mechanism 45 is provided with a loader and a robot arm that can carry the solid resin 47.

  In the fifth embodiment, the operation of supplying the solid resin 47 to the cavity 14 provided in the movable lower mold 12 will be described. First, the solid resin 47 is transferred from the cassette 46 to the resin supply mechanism 45 by a protruding mechanism (not shown). The protruding mechanism is provided in the resin storage mechanism 44 or outside the resin molding apparatus 1. Next, the movement mechanism 21 moves the resin transport mechanism 16 from the resin supply module 4 along the rail 11 to a predetermined position near the molding module C in the −X direction.

  Next, in the molding module C, the solid resin 47 is supplied to the cavity 14 to which the release film 15 is adsorbed by the resin supply mechanism 45 of the resin transport mechanism 16. The resin supply mechanism 45 supplies the solid resin 47 to the cavity 14 using a loader, a robot arm, or the like. In this embodiment, the solid resin 47 is a raw material resin. Other configurations and operations are the same as those in the first embodiment.

  According to the fifth embodiment, even a liquid resin that cannot be stably stored in a liquid state can be stably stored in a solid state. Therefore, in the case of such a liquid resin, it is desirable to perform resin molding using the solid resin 47 after the solid resin 47 is formed. By forming the solid resin 47, variations in the resin amount are reduced.

  Moreover, in Example 5, the case where plate-shaped solid resin was used as the solid resin 47 was shown. Not limited to this, as the solid resin 47, a columnar, sheet-like, granular, granular, or powdery resin material can be used.

  In Examples 1 to 5, four molding modules 3A, 3B, 3C, and 3D were mounted side by side in the X direction between the substrate supply / storage module 2 and the resin supply module 4. The substrate supply / storage module 2 and the resin supply module 4 may be combined into one module, and a single molding module 3A may be mounted side by side in the X direction. Further, the molding module 3A may be mounted in one module side by side in the X direction, and another molding module 3B may be mounted on the molding module 3A. Therefore, the configuration of the resin molding apparatus 1 can be optimized in accordance with the production form and production volume, and productivity can be improved.

  In addition, in each Example mentioned above, the resin molding apparatus and the resin molding method used when resin-sealing an LED chip were demonstrated. The target for resin sealing may be a semiconductor chip such as an IC or a transistor, or a passive element. The present invention can be applied when resin-sealing one or a plurality of electronic component chips mounted on a substrate such as a printed circuit board or a ceramic substrate.

  In addition, the present invention is not limited to the case where an electronic component is sealed with a resin. Can be applied.

  In each Example, the resin molding apparatus and the resin molding method by compression molding were demonstrated. In addition, the present invention can be applied to a resin molding apparatus and a resin molding method by transfer molding. In this case, there is a resin storage portion formed of a cylindrical space provided in the mold (a portion where a lifting member called a plunger is disposed below and a columnar resin material usually made of a solid resin is stored. The raw material resin made of the mixed liquid resin is supplied to a pot).

  In each of the embodiments, an example has been described in which a cavity provided in the lower mold is used as a housing portion and a raw resin made of a mixed liquid resin or a solid resin is supplied to the cavity. In addition to the cavity, the accommodating portion may be any of the following. 1stly, an accommodating part is the pot (above-mentioned) provided in the lower mold | type.

  Second, the accommodating portion is a space including the upper surface of the substrate and including a chip (chip of an electronic component such as a semiconductor chip or a passive component chip) mounted on the upper surface of the substrate. A raw material resin made of a mixed liquid resin or a plate-like solid resin (hereinafter referred to as “raw material resin”) is supplied so as to cover the chip mounted on the upper surface of the substrate. In this case, it is preferable to perform electrical connection between the chip and the substrate by flip chip.

  Third, the accommodating portion is a space including the upper surface of a semiconductor substrate such as a silicon wafer. The raw material resin is supplied so as to cover a functional part such as a semiconductor circuit formed on the semiconductor substrate. In this case, it is preferable that a protruding electrode (bump) is formed on the upper surface of the semiconductor substrate.

  Fourth, the accommodating portion is a space including the upper surface of the film that is to be finally accommodated in the cavity of the mold. The accommodating part in this case is a recessed part formed, for example, when a film is dented. The raw material resin is supplied to the recess formed by the depression of the film. Examples of the purpose of the film include improvement of releasability, transfer of a shape composed of irregularities on the surface of the film, and transfer of a pattern formed in advance on the film. The raw material resin stored in the concave portion of the film is transported together with the film using an appropriate transport mechanism, and finally stored in the cavity of the mold.

  In any of the first to fourth cases, the raw material resin accommodated in the accommodating portion is finally accommodated in the cavity of the mold and hardened in the cavity.

  In any of the second to fourth cases, the raw material resin is supplied to the housing part outside the pair of molds facing each other, and the components including at least the housing part are conveyed between the molding dies. it can.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. It is.

DESCRIPTION OF SYMBOLS 1 Resin molding apparatus 2 Substrate supply / storage module 3A, 3B, 3C, 3D Molding module 4 Resin supply module (resin material supply module)
5 Substrate before sealing (substrate)
6 Pre-sealing substrate supply unit 7 Sealed substrate 8 Sealed substrate storage unit 9 Loader 10 Unloader 11 Rail 12 Movable lower mold (lower mold, molding mold)
13 Clamping mechanism 14, 14A, 14C Cavity, whole cavity (cavity, accommodating part)
15 Release film 16 Resin transport mechanism 17, 17A, 17C Resin storage mechanism 18, 18A, 18C Dispenser (resin supply mechanism)
19, 19A, 19B Cartridge (first storage unit)
20, 20C, 20D cartridge (first storage unit)
21 Movement mechanism (first movement mechanism)
22 Vacuum pulling mechanism 23 Control unit 24 Fixed upper mold (upper mold)
25 Intermediate type 26 LED chip (chip)
27 Individual cavity 28, 28A, 28C, Flexible hose 29, 29A, 29C Storage part (second storage part)
30, 30A, 30C Metering delivery mechanism (resin material delivery section, delivery mechanism)
31 Static mixer (raw resin supply part, liquid resin mixing mechanism)
32 nozzle (raw resin supply part)
33 Mixed liquid resin (mixed liquid resin, raw resin)
34 Movement mechanism (second movement mechanism)
35 Compressor 36 Flexible hose 37 Electropneumatic regulator 38 Plunger 39 Plunger 40 Cartridge (third storage unit)
41 Mixing chamber (liquid resin mixing mechanism)
42 Mixed liquid resin (mixed liquid resin, raw resin)
43 Movement mechanism (second movement mechanism)
44 Resin storage mechanism 45 Resin supply mechanism 46 Cassette (first storage unit)
47 Solid resin (raw resin)
CTL temperature control mechanism

Claims (18)

An upper die, a lower die provided opposite to the upper die, a cavity provided in at least one of the lower die and the upper die, and a raw material that should be cured in the cavity to become a cured resin At least a housing part that contains resin, a resin transport mechanism that transports a resin material to the vicinity of the lower mold, a resin supply mechanism that supplies the raw resin to the housing part, A mold-clamping mechanism for clamping a mold having a resin-molding apparatus for molding a molded product containing the cured resin,
A resin storage mechanism provided in the resin transport mechanism;
A first storage unit provided in the resin storage mechanism for storing the resin material;
A second storage unit provided in the resin supply mechanism for storing the resin material transferred from the first storage unit;
A resin material delivery unit that is provided in the resin supply mechanism and delivers the resin material stored in the second storage unit toward the storage unit;
A raw material resin supply unit that is provided in the resin supply mechanism and supplies the raw material resin generated from the resin material sent toward the storage unit to the storage unit;
A first moving mechanism for moving the resin transport mechanism to the vicinity of the lower mold;
A second moving mechanism for moving at least the resin supply mechanism from the vicinity of the lower mold to above the accommodating portion;
The first moving mechanism moves the resin storage mechanism and the resin supply mechanism as one body. In the resin molding apparatus described in claim 1,
In the first storage unit, a mixed liquid resin generated by previously mixing a plurality of types of liquid resins is stored,
The mixed liquid resin is transferred from the first storage unit to the second storage unit,
When the mixed liquid resin stored in the second storage unit is sent out by the resin material sending unit, the raw resin made of the mixed liquid resin is supplied from the raw resin supply unit to the containing unit. The resin molding apparatus characterized by the above-mentioned. In the resin molding apparatus described in claim 1,
The resin supply mechanism includes a third storage unit that stores a mixed liquid resin generated by mixing a plurality of types of liquid resins in advance.
The third storage unit is configured by directly connecting the first storage unit and the second storage unit,
The mixed liquid resin passes through the second storage unit and is sent out toward the storage unit,
The resin molding apparatus, wherein the third storage unit is detachable from the resin material delivery unit and the raw material resin supply unit. In the resin molding apparatus described in claim 1,
A liquid resin mixing mechanism provided in the resin supply mechanism;
The resin material comprises a plurality of types of liquid resins,
A plurality of the first storage unit and the second storage unit are provided,
In the plurality of first storage units, the plurality of types of liquid resins are stored for each type,
The plurality of types of liquid resins are transferred from the plurality of first storage units to the plurality of second storage units for each type,
The plurality of types of liquid resin are respectively sent from the plurality of second storage units to the liquid resin mixing mechanism by a plurality of delivery mechanisms provided in the resin supply mechanism,
The resin molding apparatus, wherein the raw resin made of the mixed liquid resin is generated by mixing the plurality of types of liquid resins by the liquid resin mixing mechanism. In the resin molding apparatus described in claim 1,
The first storage unit stores solid resin,
The solid resin is transferred from the first storage unit to the second storage unit,
The resin molding apparatus, wherein the solid resin stored in the second storage unit is delivered by the resin material delivery unit, so that the raw resin made of the solid resin is supplied to the storage unit. . In the resin molding apparatus as described in any one of Claims 1-5,
A temperature management mechanism is provided that keeps the temperature of the resin material stored in at least one of the first storage unit, the second storage unit, or the third storage unit in a constant state. A resin molding device. In the resin molding apparatus described in any one of Claims 1-6,
The lower mold is provided with at least a plurality of the cavities,
A plurality of substrates are arranged on the upper mold opposite to the plurality of cavities,
The plurality of cavities are each filled with the raw resin,
A resin molding apparatus, wherein a chip mounted on each of the plurality of substrates is sealed with the cured resin. In the resin molding apparatus according to claim 7,
A resin molding apparatus comprising: a plurality of the resin supply mechanisms that respectively supply the raw resin to the plurality of accommodating portions respectively corresponding to the plurality of cavities. In the resin molding apparatus described in any one of Claims 1-8,
At least one molding module having the molding die and the clamping mechanism;
A resin material supply module for supplying the resin material;
The resin material supply module and the one molding module are detachable,
The resin molding apparatus, wherein the one molding module is detachable from other molding modules. A resin molding method comprising a step of preparing a molding die having at least an upper die and a lower die provided opposite to the upper die, and molding a molded product containing a cured resin,
Storing the resin material in a first storage section provided in the resin storage mechanism;
Transferring the resin material from the first storage unit to a second storage unit provided in a resin supply mechanism;
A step of sending the resin material stored in the second storage unit toward the storage unit by a resin material sending unit provided in the resin supply mechanism;
Generating from the resin material a raw material resin that is to be cured in a cavity provided in at least one of the lower mold and the upper mold to become the cured resin;
Moving the resin transport mechanism in which the resin storage mechanism and the resin supply mechanism are integrated to the vicinity of the accommodating portion;
Moving at least the resin supply mechanism from the vicinity of the housing portion to above the housing portion;
Using the raw resin supply part provided in the resin supply mechanism to supply the raw resin to the housing part;
Making the cavity filled with the raw material resin;
Clamping the mold, and
And a step of forming the cured resin in the cavity. In the resin molding method according to claim 10,
In the step of storing the resin material, a mixed liquid resin generated by previously mixing a plurality of types of liquid resins is stored as the resin material,
In the generating step, the raw material resin made of the mixed liquid resin is generated by sending the mixed liquid resin transferred to the second storage unit using the resin material sending unit. A resin molding method. In the resin molding method according to claim 10,
A step of preparing a third storage unit that is configured by directly connecting the first storage unit and the second storage unit and is detachable from the resin material delivery unit and the raw material resin supply unit; ,
Replacing the third storage unit mounted on the resin supply mechanism with another third storage unit. In the resin molding method according to claim 10,
Storing a plurality of types of liquid resins in each of the plurality of first storage units for each type;
Transferring the plurality of types of liquid resins from the plurality of first storage units to the plurality of second storage units, and storing each of the types in the plurality of second storage units;
In the step of generating the raw material resin from the resin material, the raw material resin made of a mixed liquid resin by mixing the plurality of types of liquid resins using a liquid resin mixing mechanism provided in the resin supply mechanism The resin molding method characterized by producing | generating. In the resin molding method according to claim 10,
The resin material is made of a solid resin,
In the step of generating the raw material resin from the resin material, the solid resin stored in the second storage unit is sent out using the resin material sending unit, so that the raw resin made of the solid resin is obtained. The resin molding method characterized by producing | generating. In the resin molding method as described in any one of Claims 10-14,
The method includes a step of maintaining a temperature of the resin material stored in at least one of the first storage unit, the second storage unit, or the third storage unit in a constant state. Resin molding method. In the resin molding method as described in any one of Claims 10-15,
Providing at least a plurality of the cavities in the lower mold;
In the step of supplying the raw resin to the housing part, the raw material resin is supplied to each of the plurality of housing parts including the plurality of cavities using the resin supply mechanism. In the resin molding method according to claim 16,
In the step of supplying the raw resin to the housing portion, a plurality of the resin supply mechanisms are used, and each of the plurality of resin supply mechanisms supplies the raw resin to each of the plurality of cavities. Resin molding method. In the resin molding method described in any one of Claims 10-17,
Preparing at least one molding module having the molding die and a clamping mechanism for clamping the molding die;
Preparing a resin material supply module for supplying the resin material;
A step of attaching the resin material supply module and the one molding module;
The resin material supply module and the one molding module can be removed,
The resin molding method characterized in that the one molding module and another molding module can be attached and detached.

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