JP2017183443A - Resin molding device, resin molding method, film conveyance roller and film supply device for resin molding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mold resin by reducing occurrence of wrinkles and curves in a film.SOLUTION: A resin molding device that uses molding dies provided with a cavity 17 at least one of a first die 8 and a second die 9 arranged opposite each other and molds resin by closing the molding dies, comprises: a feed mechanism 13 that feeds a film 12 between the first die 8 and the second die 9; a take-up mechanism 14 that takes up the film 12 from between the first die 8 and the second die 9; a first roller 15 provided on a feed mechanism side; a second roller 16 provided on a take-up mechanism side; and a plurality of main cylindrical members 20 respectively attached to one end part and the other end part of the target shaft 19 of at least one of a rotary shaft 19 of the first roller 15 and a rotary shaft 19 of the second roller 16. Of the plurality of main cylindrical members 20, the outside diameter of the outer main cylindrical member 20c is greater than the outside diameter of the inner main cylindrical member 20a. The plurality of main cylindrical members 20 are attachable to or detachable from the target shaft 19.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a resin molding apparatus, a resin molding method, a film transport roller, and a film feeding apparatus for a resin molding apparatus that are used when a chip-shaped electronic device is resin-sealed.

  Conventionally, a chip-shaped electronic device (hereinafter referred to as “chip” as appropriate) mounted on a substrate is resin-sealed with a resin-molded cured resin using a resin molding technique. The chip includes a semiconductor chip such as a transistor, an integrated circuit (IC), and a light emitting diode (LED). Examples of the substrate include a semiconductor substrate such as a silicon substrate, a printed circuit board (PCB), a lead frame, and a ceramics substrate. Examples of the resin molding technique include a transfer molding method, a compression molding (compression molding) method, and an injection molding (injection molding) method.

  A release film (release film) may be used when resin-sealing. The release film prevents the cured resin from directly attaching to the mold surface of the mold. In other words, the release film is a resin adhesion preventing film. By using the release film, the substrate on which the chip is sealed with resin (molded product; sealed substrate) is easily released from the mold surface of the mold.

  As a semiconductor resin sealing device for preventing wrinkles from being generated on the release film, “When a semiconductor element is resin-sealed using a resin-sealing mold, these semiconductor elements after resin sealing are used. A semiconductor resin sealing device using a release film for releasing from the mold, wherein a drum-type roller is used as a roller for transporting the release film to the position of the mold. A sealing device has been proposed (see, for example, paragraph [0006] of Patent Document 1 and FIGS. 1 to 3).

JP 2004-39823 A

  However, the conventional semiconductor resin sealing device disclosed in Patent Document 1 has the following problems. As shown in FIG. 3 of Patent Document 1, it is possible to suppress the deflection when the release film 1 is fed by using the drum rollers 6 and 7. Depending on the product, the release film used has a wide variety of materials, thickness and width. Therefore, in the same resin sealing device, there is a possibility that the deflection cannot be suppressed depending on the release film used. In this case, it was necessary to newly design and manufacture a drum roller having a shape corresponding to the release film.

The present invention solves the above-described problems, and can be easily applied to a plurality of different types of films, and can be resin-molded by reducing the occurrence of wrinkles and deflections on the film, a resin-molding method, and film transport It is an object to provide a roller for use and a film supply device for a resin molding apparatus.

  In order to solve the above-described problems, a resin molding apparatus according to the present invention uses a molding die in which a cavity is provided in at least one of a first die and a second die that are arranged to face each other. A resin molding apparatus that performs resin molding by fastening, a feed mechanism for feeding a film between a first mold and a second mold, and a winding mechanism for winding the film from between the first mold and the second mold One end of at least one target shaft among the first roller provided on the feed mechanism side, the second roller provided on the take-up mechanism side, and the rotation shaft of the first roller and the rotation shaft of the second roller A plurality of main cylindrical members attached to each of the first end portion and the other end portion, and of the plurality of main cylindrical members, the outer diameter of the outer main cylindrical member is larger than the outer diameter of the inner main cylindrical member. Each of the plurality of main cylindrical members is attached to the target shaft. Possible it is.

  In order to solve the above-described problems, a resin molding method according to the present invention uses a molding die in which a cavity is provided in at least one of a first die and a second die that are arranged to face each other. A resin molding method for performing resin molding by clamping a mold, the step of feeding a film using a first roller between a first mold and a second mold, and between the first mold and the second mold And a step of winding the film using the second roller, and in at least one of the feeding step and the winding step, one of the rotating shaft of the first roller and the rotating shaft of the second roller. Using a plurality of cylindrical members attached to one end and the other end of each of the target shafts, the outer cylindrical member out of the plurality of cylindrical members has a greater force than the inner cylindrical member. In addition to each of the plurality of cylindrical members, It is detachable.

  In order to solve the above-described problems, a film transport roller according to the present invention is a film transport roller used in a resin molding apparatus, and is attached to each of one end and the other end of a rotating shaft. A cylindrical member is provided, and among the plurality of cylindrical members, the outer diameter of the cylindrical member on the outside is larger than the outer diameter of the cylindrical member on the inner side, and each of the plurality of cylindrical members can be attached to and detached from the rotating shaft. It is.

  In order to solve the above problems, a film supply apparatus for a resin molding apparatus according to the present invention includes a feed mechanism for feeding a film, a winding mechanism for winding the film, a first roller provided on the feed mechanism side, Plural attached to each of one end and the other end of at least one target shaft among the second roller provided on the winding mechanism side, the rotation shaft of the first roller, and the rotation shaft of the second roller Of the plurality of cylindrical members, the outer diameter of the outer cylindrical member is larger than the outer diameter of the inner cylindrical member, and each of the plurality of cylindrical members is relative to the target axis. Detachable.

  According to the present invention, it can be easily applied to a plurality of different types of films, and the resin can be molded while reducing the occurrence of wrinkles and deflections on the film.

It is a front view which shows the structure of the resin molding apparatus (molding unit) of Embodiment 1. It is the schematic which shows the release film supply mechanism used in the resin molding apparatus of Embodiment 1, (a) is a top view, (b) is the sectional view on the AA line of (a), (c) is B FIG. (A)-(c) is a schematic sectional drawing which shows the process in which a mold release film and a resin material are supplied to a cavity in the resin molding apparatus by the compression molding method of Embodiment 2. FIG. (A)-(c) is a schematic sectional drawing which shows the process of resin-sealing the chip | tip with which the board | substrate with which the compression molding method of Embodiment 2 was applied by the mounting | wearing board | substrate was mounted | worn. It is a schematic sectional drawing at the time of applying the release film supply mechanism of Embodiment 3 to the resin molding apparatus by a transfer mold method. It is a schematic sectional drawing at the time of applying the modification of the release film supply mechanism of Embodiment 4 to the resin molding apparatus by a compression molding method. It is a top view which shows the outline | summary of the resin molding apparatus by the compression molding method of Embodiment 5.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.
Embodiment 1

  The configuration of the resin sealing device according to the embodiment of the present invention will be described with reference to FIG. In the present application document, “resin molding apparatus” means an apparatus having at least a function of performing resin molding. The “resin molding apparatus” includes the resin molding apparatus 1 having the configuration shown in FIG. The “resin molding apparatus” also includes a resin molding apparatus 100 having a configuration shown in FIG. 7 described later, in which the resin molding apparatus 1 having the configuration shown in FIG.

  A resin molding apparatus 1 shown in FIG. 1 is a resin molding apparatus using a compression molding method or a resin molding apparatus using a transfer molding method. The resin molding apparatus 1 has a base 3. Four tie bars 4 that are holding members are fixed to the four corners of the base 3. An upper platen 5 facing the base 3 is fixed to the upper part of the four tie bars 4 extending upward. Between the base plate 3 and the upper platen 5, the lower platen 6 facing the base plate 3 and the upper platen 5 is fitted into the four tie bars 4. The tie bar 4 holds the upper platen 5 so as to fix it, and holds the lower platen 6 movably. A mold clamping mechanism 7 is fixed on the base 3. The mold clamping mechanism 7 is a mechanism that raises and lowers the lower platen 6 in order to perform mold clamping and mold opening. As the mold clamping mechanism 7, for example, a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a link mechanism, or the like is used. The lower platen 6 is raised or lowered by the mold clamping mechanism 7.

  An upper mold 8 is fixed to the lower surface of the upper platen 5. A lower die 9 is provided directly below the upper die 8 so as to face the upper die 8. The lower mold 9 is fixed to the upper surface of the lower platen 6. The upper mold 8 and the lower mold 9 together constitute a set of molds 10 (hereinafter simply referred to as “molding mold 10”). The upper mold 8 and the lower mold 9 are provided with heaters (not shown) as heating means.

  As shown in FIG. 1, the resin molding apparatus 1 further includes a release film supply mechanism 11. The release film supply mechanism 11 is, for example, a film supply for transporting a long release film 12 between the upper mold 8 and the lower mold 9 and supplying it to the mold surface of the upper mold 8 or the lower mold 9. Mechanism. The release film supply mechanism 11 is also a film supply device. When supplying the release film 12 to the mold surface of the lower mold 9, the release film supply mechanism 11 is provided on the upper surface of the lower platen 6. Conversely, when the release film 12 is supplied to the mold surface of the upper mold 8, the release film supply mechanism 11 is provided on the lower surface of the upper platen 5. The release film supply mechanism 11 can be provided on both the upper surface of the lower platen 6 and the lower surface of the upper platen 5.

  The mold release film supply mechanism 11 is raised and lowered along the mold opening / closing direction (Z-axis direction) by a drive mechanism (not shown). By moving the release film supply mechanism 11 up and down, the release film 12 is brought into close contact with the mold surface of the upper mold 8 or the lower mold 9. In FIG. 1, the example which supplies the release film 12 to the type | mold surface of the lower mold | type 9 is shown.

  The release film supply mechanism 11 includes a delivery mechanism 13 that feeds a release film 12 wound on a reel before use between the upper mold 8 and the lower mold 9, and a used release film used for resin molding. And a winding mechanism 14 that winds 12 around a reel. A torque (rotation speed) of a motor (not shown) provided in the delivery mechanism 13 and a torque (rotation speed) of a motor (not shown) provided in the winding mechanism 14 are controlled. Thus, the release film 12 is sent out from the feed-out mechanism 13 while applying an appropriate tension (tension) with respect to the traveling direction of the release film 12 (direction indicated by the arrow in the figure; -Y direction).

  A delivery roller 15 (first roller) is provided between the delivery mechanism 13 and the mold 10 to apply tension to the release film 12 before being used and delivered from the delivery mechanism 13. A take-up roller 16 (second roller) that is transported between the upper die 8 and the lower die 9 and applies tension to the release film 12 before resin molding between the mold 10 and the take-up mechanism 14. ) Is provided. The feed roller 15 and the take-up roller 16 function as film transport rollers that apply tension to the release film 12 and transport the release film 12 between the upper mold 8 and the lower mold 9.

  As the release film 12, a resin material having characteristics such as heat resistance, release properties, flexibility, and extensibility is used. For example, PTFE, ETFE, PET, FEP, polypropylene, polystyrene, polyvinylidene chloride and the like are used depending on the product. The characteristics of the release film 12 vary depending on the resin material.

  With reference to FIG. 2, the conveyance roller (the delivery roller 15 and the take-up roller 16) used in the release film supply mechanism 11 of the resin molding apparatus 1 of the present embodiment will be described. In FIG. 2, the example which supplies the release film 12 to the cavity 17 provided in the lower mold | type 9 is shown.

  In the release film supply mechanism 11, the delivery roller 15 and the take-up roller 16 are independent of each other and function as film transport rollers for transporting the release film 12 between the upper mold 8 and the lower mold 9. In the following description, the feed roller 15 and the take-up roller 16 may be collectively expressed as a transport roller 18.

  The conveyance roller 18 (the delivery roller 15 and the take-up roller 16) includes a rotation shaft 19 and a plurality of detachable cylindrical members 20 attached to the rotation shaft 19. In FIG. 2, three cylindrical members 20 a, 20 b, and 20 c correspond to the width of the release film 12 (the rectangular portion indicated by the two-dot chain line in FIG. 2A) on both sides of the rotating shaft 19. Shown when installed. The cylindrical member 20 is configured such that the outer diameter of the cylindrical member 20 a located inside the rotating shaft 19 is the smallest and the outer diameter of the cylindrical member 20 c located outside the rotating shaft 19 is the largest. Therefore, the conveying roller 18 is a stepped roller having a stepped shape in which the outer diameter gradually increases from the central portion toward both ends. In other words, the cylindrical members 20a, 20b, and 20c are attached to the transport roller 18 so that the outer diameter increases stepwise from the center toward both ends.

  The conveying roller 18 is configured by attaching a plurality of cylindrical members 20 to a rotating shaft 19. Aluminum is used for the rotating shaft 19. An elastic member such as urethane rubber or silicone rubber is used for the cylindrical member 20. A plurality of cylindrical members 20 can be attached to and detached from the rotating shaft 19. The material, hardness, length, outer diameter, etc. of the cylindrical member 20 can be easily changed. Therefore, the shape of the conveying roller 18 can be adjusted to an optimum shape by replacing the cylindrical member 20.

  With reference to FIG. 2, the operation | movement which conveys the release film 12 between the upper mold | type 8 and the lower mold | type 9 is demonstrated. As shown in FIG. 2B, a motor (not shown) provided in the winding mechanism 14 is used to rotate the winding mechanism 14 counterclockwise with a torque T1 (rotational speed r1). . At the same time, a motor (not shown) provided in the delivery mechanism 13 is used to rotate the delivery mechanism 13 clockwise with a torque T2 (rotational speed r2). The torque T1 applied to the winding mechanism 14 is made larger than the torque T2 applied to the delivery mechanism 13 (T1> T2). In other words, the rotational speed r1 of the winding mechanism 14 is set to be larger than the rotational speed r2 of the delivery mechanism 13 (r1> r2). As a result, as shown in FIG. 2A, the release film 12 is fed from the feed mechanism 13 to the mold 10 in a state where a tension F <b> 1 is applied in the traveling direction (−Y direction). Therefore, as shown in FIG. 2C, the release film 12 is in close contact with the feeding roller 15 and the take-up roller 16 (conveying roller 18) by the tension F1 applied in the traveling direction of the release film 12. It is conveyed in the state.

  In a conventional resin molding apparatus, a cylindrical roller (straight roller) having a constant rotating shaft diameter is used as a conveying roller. When a release film is sent out using a cylindrical roller, a plurality of deflections (waves) that undulate in a direction parallel to the traveling direction of the release film may occur. In particular, this phenomenon appears prominently when the thickness of the release film is thin or when the width of the release film is large. When the release film is adsorbed to the mold in a state where the release film is bent, the release film is wrinkled due to the deflection. When resin molding is performed in a state where wrinkles are generated, the wrinkles are transferred to a molded product formed by resin molding. Therefore, it is important to reduce wrinkles and deflections in the release film.

  In the release film supply mechanism 11 of the resin molding apparatus 1 of the present embodiment, a feed roller 15 and a take-up roller 16 having a stepped shape are used as the transport rollers 18. The conveying roller 18 is a stepped roller having a stepped shape in which the outer diameter gradually increases from the center toward both ends. Therefore, the moving distance (rotating distance) of the conveying roller 18 is different between the central portion and both end portions. The movement distance becomes larger toward both ends of the conveying roller 18. This means that the circumferential speed (circumferential speed = diameter × π × rotational speed) of the conveying roller 18 increases as it goes to both ends. As a result, as shown in FIG. 2A, the axial direction (+ X of the rotary shaft 19 with respect to the advancing direction (−Y direction) of the release film 12 by the take-up roller 16 constituting the conveying roller 18. Direction and -X direction). That is, the tension F <b> 2 that works from the center of the release film 12 toward both sides is applied to the release film 12. In addition to the tension F <b> 1 that works in the traveling direction of the release film 12, a tension F <b> 2 that works in the outward direction from the center of the release film 12 is applied to the release film 12. As a result, a force for pulling the release film 12 outward by the take-up roller 16 is applied between the feed roller 15 and the take-up roller 16. Therefore, the occurrence of deflection in the release film 12 conveyed between the upper mold 8 and the lower mold 9 can be reduced.

  Similarly, a force for pulling the release film 12 outward is applied between the delivery roller 15 and the delivery mechanism 13 by the delivery roller 15. This can reduce the occurrence of deflection of the release film 12 between the feed roller 15 and the feed mechanism 13.

  As the conveying roller 18 (feeding roller 15 and take-up roller 16), a stepped roller having a stepped shape in which the outer diameter gradually increases from the center toward both ends. By this, the force pulled outside can be applied to the release film 12. Accordingly, it is possible to reduce the occurrence of deflection in the release film 12 and transport the release film 12 from the delivery mechanism 13 to the mold 10.

  In order to reduce the occurrence of deflection in the release film 12, it is effective to increase the tension F <b> 2 acting outward from the center of the release film 12. Therefore, it is preferable to use urethane rubber, silicone rubber or the like having a large dynamic friction coefficient as the cylindrical member 20. In addition, in order to increase the frictional force between the conveying roller 18 and the release film 12, it is preferable to perform surface processing on at least one of the front surface of the cylindrical member 20 and the back surface of the release film 12. As a specific example of the surface processing, there is a texture processing such as a satin finish. By these things, the tension | tensile_strength F2 which works toward the outer side from the center part of the release film 12 can be enlarged.

  In the present embodiment, a feeding mechanism 13 that feeds the film 12 between the upper mold 8 and the lower mold 9, a winding mechanism 14 that winds the film 12 between the upper mold 8 and the lower mold 9, and a feeding mechanism 13. A feed roller 15 as a first roller provided on the side, a take-up roller 16 as a second roller provided on the take-up mechanism 14 side, a rotary shaft 19 of the feed roller 15 and a rotary shaft of the take-up roller 16 19 are provided with cylindrical members 20a, 20b, 20c, which are main cylindrical members attached to each of one end and the other end of at least one target shaft 19, and the cylindrical members 20a, 20b, Of the resin molding apparatus 1, the outer diameter of the outer cylindrical member of 20 c is larger than the outer diameter of the inner cylindrical member, and each of the cylindrical members 20 a, 20 b, 20 c is detachable from the target shaft 19. Structure And the.

  According to the present embodiment, a plurality of cylindrical members 20 a are provided on each of one end and the other end of at least one target shaft 19 out of the rotation shaft 19 of the feed roller 15 and the rotation shaft 19 of the take-up roller 16. , 20b and 20c can be easily resin-molded with reduced generation of wrinkles and deflections in the film. Furthermore, by making the plurality of cylindrical members 20a, 20b, and 20c detachable from the rotation shaft, it can be easily applied to different types of films.

  Moreover, if it is set as the structure by which surface processing was made | formed so that the dynamic friction coefficient of the surface of cylindrical member 20a, 20b, 20c might be enlarged, generation | occurrence | production of a wrinkle and a bending can be reduced further.

  More specifically, according to the present embodiment, the conveying roller 18 is configured by attaching the plurality of cylindrical members 20 to the rotation shafts 19 of the feed roller 15 and the take-up roller 16. The cylindrical member 20 is configured so that the outer diameter of the cylindrical member 20a located inside the rotating shaft 19 is the smallest and the outer diameter of the cylindrical member 20c located outside the rotating shaft 19 is the largest. Therefore, the conveying roller 18 has a stepped shape in which the outer diameter gradually increases from the central portion toward both ends. Thereby, the tension F <b> 2 that works outward from the center of the release film 12 can be applied to the release film 12. Since the pulling force is applied to the release film 12 by using the conveying roller 18 having a stepped shape, the deflection generated in the release film 12 can be reduced.

  According to the present embodiment, a plurality of cylindrical members 20 are attached to the rotating shaft 19 of the conveying roller 18 to constitute the conveying roller. A plurality of cylindrical members 20 can be attached to and detached from the rotating shaft 19. By replacing the cylindrical member 20, the shape of the conveying roller 18 can be adjusted. Accordingly, the length, number, thickness, etc. of the cylindrical member 20 can be optimized so as to reduce the occurrence of wrinkles and deflections according to the material, thickness, width, etc. of the release film 12. it can. In addition, it is possible to suppress meandering or skewing of the release film 12 by finely adjusting the positions of the plurality of cylindrical members 20 and the like.

  According to the present embodiment, the shape of the conveying roller 18 can be adjusted by a simple method of attaching a plurality of cylindrical members 20 to the rotating shaft 19. Corresponding to the characteristics of the release film 12, there is no need to newly prepare a transport roller. Therefore, the cost of the release film supply mechanism 11 (resin molding apparatus 1) can be suppressed.

  In the present embodiment, the feed roller 15 and the take-up roller 16 are provided as the transport roller 18. However, the present invention is not limited to this, and a transport roller having a plurality of stepped shapes can be provided between the feed mechanism 13 and the feed roller 15. A conveying roller having a plurality of stepped shapes can be further provided between the winding roller 16 and the winding mechanism 14. By these things, the release film 12 can be conveyed, applying the tension | tensile_strength which acts toward the outer side in several places with respect to the elongate release film 12. FIG.

  In the present embodiment, the configuration in which the cylindrical member 20 is attached to both the feed roller 15 and the take-up roller 16 has been described. Not only this but the structure which attached the cylindrical member 20 to any one of the delivery roller 15 and the winding roller 16 is good. In this case, the configuration in which the cylindrical member 20 is attached only to the take-up roller 16 can reduce the deflection generated in the release film 12 than the configuration in which the cylindrical member 20 is attached only to the feeding roller 15. it can.

In the description of FIG. 2 of the present embodiment, the configuration in which the distance between the outer ends of the cylindrical member 20c having the largest outer diameter at both end portions is matched with the width of the release film 12 has been described. Not only this but the space | interval of the outer end of the cylindrical member 20c of both ends may be made longer than the width | variety of the release film 12. FIG. Moreover, as long as the deflection generated in the release film 12 can be reduced, the interval between the outer ends of the cylindrical members 20 c at both ends may be made shorter than the width of the release film 12.
[Embodiment 2]

  With reference to FIGS. 3 to 4, a process of resin-sealing a substrate on which a semiconductor chip is mounted using the resin molding apparatus 1 described in the first embodiment will be described. In Embodiment 2, the example which applied the release film supply mechanism 11 to the resin molding apparatus by a compression molding method is shown.

  As shown in FIG. 3A, first, the upper mold 8 and the lower mold 9 are opened. Next, using the substrate transport mechanism (see FIG. 7), for example, the substrate 22 on which the semiconductor chip 21 (hereinafter referred to as “chip 21” as appropriate) is mounted is transported to a predetermined position below the upper mold 8. The substrate 22 is a pre-sealing substrate on which the chip 21 is mounted on the main surface (the lower surface in the figure). The electrode of the chip 21 and the electrode of the substrate 22 are electrically connected by a bonding wire 23 made of, for example, a gold wire or a copper wire.

  Next, the substrate 22 is raised using the substrate transport mechanism, and the substrate 22 is fixed to the mold surface of the upper mold 8 by suction or clamping (not shown). The substrate 22 is fixed to the mold surface of the upper mold 8 so that the main surface on which the semiconductor chip 21 is mounted faces downward.

  Next, the release film supply mechanism 11 is used to convey the release film 12 to a predetermined position between the upper mold 8 and the lower mold 9. By using the winding mechanism 14 and the delivery mechanism 13, the release film 12 is sent out from the delivery mechanism 13 while applying a tension F <b> 1 (see FIG. 2A) with respect to the traveling direction of the release film 12. When the tension F1 is applied to the release film 12, the release film 12 is conveyed in close contact with the feed roller 15 and the take-up roller 16 having a stepped shape (see FIG. 2C).

  The delivery roller 15 and the take-up roller 16 that constitute the transport roller 18 (see FIG. 2A) gradually increase in outer diameter from the center to both ends. Accordingly, a tension F2 (see FIG. 2A) that works from the center of the release film 12 toward both sides is applied to the release film 12. The release film 12 is applied with a tension F2 that works in the outward direction from the center of the release film 12 in addition to the tension F1 that works in the traveling direction. By these things, the release film 12 is conveyed between the upper mold | type 8 and the lower mold | type 9, applying the pulling force to the advancing direction of the release film 12, and an outer side. Therefore, it is possible to reduce the occurrence of deflection in the release film 12 and transport the release film 12 to a predetermined position above the lower mold 9.

  Next, as shown in FIG. 3B, the release film supply mechanism 11 is lowered to bring the release film 12 into close contact with the mold surface (upper surface) of the lower mold 9. In this state, the release film 12 has not been supplied to the cavity 17 yet. Since the release film 12 is transported above the lower mold 9 with the occurrence of deflection being reduced, the release film 12 can be brought into close contact with the mold surface of the lower mold 9 while reducing the occurrence of deflection.

  Next, the release film 12 is adsorbed along the mold surface of the lower mold 9 and the mold surface of the cavity 17 using an adsorption mechanism (not shown) provided in the lower mold 9. Since the release film 12 has a reduced occurrence of deflection and is in close contact with the lower mold 9, it is possible to reduce the occurrence of wrinkles due to the deflection and to adsorb the release film 12 along the mold surface of the cavity 17. it can.

  Next, as shown in FIG. 3C, a predetermined amount of the resin material 24 is supplied to the cavity 17 provided in the lower mold 9 using a resin material transport mechanism (see FIG. 7). As the resin material 24, it is possible to use a resin such as powder, granule, or sheet, or a resin that is liquid at room temperature. The liquid resin is a fluid resin having fluidity at room temperature. It does not matter the degree of fluidity that the liquid resin has at room temperature. This embodiment shows an example in which a granular resin (granular resin) 24 is supplied as the resin material 24.

  Next, as shown in FIG. 4A, the granular resin 24 is heated by a heater (not shown) provided in the lower mold 9. By heating, the granular resin 24 is melted to produce a fluid resin 25. When a liquid resin is supplied to the cavity 17 as a resin material, the liquid resin itself corresponds to the fluid resin 25.

  Next, as shown in FIG. 4B, the lower platen 6 is raised using the mold clamping mechanism 7 (see FIG. 1). By raising the lower platen 6, the lower mold 9 and the release film supply mechanism 11 are simultaneously raised. As the lower platen 6 rises, the upper mold 8 and the lower mold 9 are clamped. Therefore, the cavity 17 is sealed by the upper mold 8 and the lower mold 9. In this state, the chip 21 is immersed in the fluid resin 25.

  Next, a predetermined resin pressure is applied to the fluid resin 25 in the cavity 17 using a cavity bottom member (not shown) provided in the lower mold 9. By pressurizing at a predetermined temperature for a predetermined time, the fluid resin 25 is cured and the cured resin 26 is formed. As a result, the chip 21 mounted on the substrate 22 is resin-sealed with the cured resin 26.

  Next, as shown in FIG. 4C, after forming a molded product 27 having the substrate 22, the chip 21, and the cured resin 26, the lower mold 9 is used by using the mold clamping mechanism 7 (see FIG. 1). And the release film supply mechanism 11 are lowered. In this state, the upper mold 8 and the lower mold 9 are opened.

  Next, after releasing the adsorption or clamping to the resin-sealed molded product 27, the molded product 27 is taken out from the upper mold 8. The taken out molded product 27 is stored in the substrate storage portion by the substrate transport mechanism (see FIG. 7). The release film 12 used for resin sealing is released from the lower mold 9, and the used release film 12 is taken out of the mold 10 by the winding mechanism 14. The resin sealing is completed by the steps so far.

  Next, the molded product 27 in which the chip 21 is sealed with the cured resin 26 is singulated in units of regions corresponding to the final product. For example, one chip 21 is included in the region. Through the steps up to here, an individual electronic component as a final product is completed.

  In the process of clamping the upper mold 8 and the lower mold 9, it is preferable to reduce the pressure by sucking the inside of the cavity 17 using a vacuuming mechanism (not shown). As a result, air remaining in the cavity 17 or bubbles contained in the fluid resin 25 can be discharged to the outside of the mold 10.

  In the present embodiment, the example in which the semiconductor chip mounting substrate is resin-sealed by compression molding using the resin molding apparatus 1 of the first embodiment has been described. As described in the first embodiment, according to the present embodiment, one end and the other end of at least one target shaft 19 out of the rotation shaft 19 of the feed roller 15 and the rotation shaft 19 of the take-up roller 16. By attaching a plurality of cylindrical members 20a, 20b, and 20c to each of them, it can be easily applied to a plurality of different types of films, and the resin can be molded while reducing the occurrence of wrinkles and deflections.

  More specifically, according to the present embodiment, the release film 12 is transported using the transport roller 18 having a stepped shape in the resin molding apparatus using the compression molding method. The conveying roller 18 gradually increases in outer diameter from the central portion toward both ends. Therefore, tension acting from the center of the release film 12 toward both sides is applied to the release film 12. The release film 12 is transported between the upper mold 8 and the lower mold 9 while applying a pulling force to the moving direction and the outside of the release film 12. Therefore, it is possible to reduce the occurrence of deflection in the release film 12 and transport the release film 12 to a predetermined position above the lower mold 9.

Since the release film 12 is transported to a predetermined position above the lower mold 9 with the occurrence of deflection being reduced, the occurrence of deflection on the mold surface of the lower mold 9 is reduced and the release film 12 can be brought into close contact. . Since the release film 12 is reduced in the occurrence of deflection and is in close contact with the mold surface of the lower mold 9, the occurrence of wrinkles is reduced and the release film 12 can be adsorbed along the mold surface of the cavity 17. Therefore, the generation of wrinkles is reduced and the resin can be molded.
[Embodiment 3]

  With reference to FIG. 5, the example which applied the release film supply mechanism 11 of this embodiment to the resin molding apparatus by a transfer mold method is shown. In the resin molding apparatus of this embodiment, the molding dies (upper mold 8 and lower mold 9) of the resin molding apparatus 1 of the first embodiment are mainly replaced. The basic configuration is the same as that of the resin molding apparatus 1 of the first embodiment.

  As shown in FIG. 5, the resin molding apparatus using the transfer mold method includes an upper mold 28 and a lower mold 29. The upper mold 28 and the lower mold 29 together form a mold. The lower mold 29 is provided with a pot 31 for accommodating the resin tablet 30. In the pot 31, a plunger 32 for pressing the accommodated resin tablet 30 is provided. The upper mold 28 is provided with a cull recess 33 and a runner 34 that serve as a resin passage for the fluid resin that is melted by heating the resin tablet 30. The upper mold 28 is provided with a cavity 37 which is a space in which a cured resin is formed by accommodating a substrate 36 which is disposed at a predetermined position of the lower mold 29 and on which the chip 35 is mounted. The cavity 37 and the runner 34 are connected. The chip 35 and the substrate 36 are electrically connected by a bonding wire 38.

  In FIG. 5, a release film supply mechanism 11 is provided on the upper mold side (the lower surface of the upper platen 5 shown in FIG. 1) in order to supply the release film 12 to the mold surface of the upper mold 28. The release film supply mechanism 11 is exactly the same as the release film supply mechanism 11 shown in the second and third embodiments.

  With reference to FIG. 5, the process of resin-sealing a substrate on which a semiconductor chip is mounted using a resin molding apparatus by transfer molding will be described.

  As shown in FIG. 5, in a state where the molds (the upper mold 28 and the lower mold 29) are opened, a chip 35 is mounted at a predetermined position of the lower mold 29 using a substrate transport mechanism (not shown). A substrate 36 is disposed. Next, the resin tablet 30 is supplied to the pot 31 provided in the lower mold 29 using a resin transport mechanism (not shown).

  Next, the release film 12 is transported to a predetermined position between the upper mold 28 and the lower mold 29 using the release film supply mechanism 11. The release film 12 is sent out from the feed mechanism 13 while applying tension to the traveling direction of the release film 12. Since the outer diameter of the conveying roller 18 (the feeding roller 15 and the take-up roller 16) increases from the center toward both ends, the release film 12 is lifted while applying a pulling force to the release film 12. It is conveyed between the mold 28 and the lower mold 29. Therefore, it is possible to reduce the occurrence of deflection in the release film 12 and transport the release film 12 to a predetermined position below the upper mold 28.

  Next, the release film supply mechanism 11 is raised to bring the release film 12 into close contact with the mold surface (lower surface) of the upper mold 28. Since the release film 12 is transported below the upper mold 28 with the occurrence of deflection being reduced, the occurrence of deflection in the release film 12 can be reduced and brought into close contact with the mold surface of the upper mold 28.

  Next, using a suction mechanism (not shown) provided on the upper die 28, the release film 12 is sucked along the upper die 28, the cull recess 33, the runner 34, and the cavity 37. . Since the release film 12 has a reduced occurrence of deflection and is in close contact with the upper mold 28, it is possible to reduce the generation of wrinkles due to the deflection and to adsorb the release film 12 over the entire upper mold 28.

  Next, the upper mold 28 and the lower mold 29 are clamped using the mold clamping mechanism 7 (see FIG. 1). By clamping the mold, the chip 35 mounted on the substrate 36 is accommodated in the cavity 37.

Next, the resin tablet 30 supplied to the pot 31 is heated and melted to produce a fluid resin. The fluid resin is pressed by the plunger 32, and the fluid resin is injected into the cavity 37 through the resin passage (the cull recess 33 and the runner 34). Subsequently, the curable resin is formed by heating the fluid resin. As a result, the chip 35 mounted on the substrate 36 is sealed with resin. After the resin sealing is completed, the upper mold 28 and the lower mold 29 are opened using the mold clamping mechanism 7. After opening the mold, the molded product is taken out from the lower mold 29. The resin sealing is completed by the steps so far.

  In the present embodiment, the example in which the semiconductor chip mounting substrate is resin-sealed by transfer molding using the resin molding apparatus having the same basic configuration as the resin molding apparatus 1 of the first embodiment has been described. As described in the first and second embodiments, according to the present embodiment, one end of at least one target shaft 19 among the rotating shaft 19 of the feed roller 15 and the rotating shaft 19 of the take-up roller 16 and the like. By attaching a plurality of cylindrical members 20a, 20b, and 20c to each of the end portions, it can be easily applied to a plurality of different types of films, and the film can be formed by reducing the occurrence of wrinkles and deflections. .

  More specifically, according to this embodiment, the release film 12 is transported using the transport roller 18 (the feed roller 15 and the take-up roller 16) having a stepped shape in the resin molding apparatus using the transfer mold method. To do. The conveying roller 18 has an outer diameter that increases from the center toward both ends. Therefore, tension acting from the center of the release film 12 toward both sides is applied to the release film 12. The release film 12 is conveyed between the upper mold 28 and the lower mold 29 while applying a pulling force to the moving direction and the outside of the release film 12. Therefore, it is possible to reduce the occurrence of deflection in the release film 12 and transport the release film 12 to a predetermined position below the upper mold 28.

Since the release film 12 is transported below the upper mold 28 with the occurrence of deflection being reduced, the release film 12 can be brought into close contact with the mold surface of the upper mold 28 by reducing the occurrence of deflection. Since the release film 12 has a reduced occurrence of deflection and is in close contact with the mold surface of the upper mold 28, it is possible to reduce the generation of wrinkles and to adsorb the release film 12 over the entire surface of the upper mold 28. Therefore, resin molding can be performed while reducing the generation of wrinkles.
[Embodiment 4]

  With reference to FIG. 6, the modification of the release film supply mechanism used in the resin molding apparatus 1 demonstrated in the said Embodiment 1 is shown. In FIG. 6, the example which supplies the release film 12 to the mold surface of the lower mold | type of the resin molding apparatus by a compression molding method is shown.

  As shown in FIG. 6, the release film supply mechanism 39 includes a delivery mechanism 13 that delivers the release film 12 between the upper mold 8 and the lower mold 9, and a used mold release used for resin sealing. A take-up mechanism 14 for taking up the film 12. A delivery roller 40 (first roller) is provided between the delivery mechanism 13 and the forming die 10 (see FIG. 1) to apply tension to the release film 12 before being sent out from the delivery mechanism 13. A take-up roller 16 (second roller) that is transported between the upper die 8 and the lower die 9 and applies tension to the release film 12 before resin molding between the mold 10 and the take-up mechanism 14. ) And a pulling roller 41 (third roller) for applying tension to the release film 12 after resin molding.

  The pulling roller 41 has the same configuration as the feeding roller 15 and the winding roller 16 described in the first embodiment. The pulling roller 41 is disposed between the take-up roller 16 and the take-up mechanism 14 so as to come into contact with a surface opposite to the surface with which the take-up roller 16 contacts the release film 12.

  The feed roller 40, the take-up roller 16 and the pulling roller 41 each function as a film transport roller in the release film supply mechanism 39.

  The feed roller 40 includes a rotating shaft 42 and a plurality of cylindrical members 20 (see FIG. 2) that are attached to and detachable from the rotating shaft 42. The feed roller 40 is a stepped roller having a stepped shape in which the outer diameter gradually increases from the center toward both ends. The process up to this point is the same as the feed roller 15 described in the first embodiment. In the present embodiment, the rotary shaft 42 incorporates a heater 43 for preheating the release film 12. Accordingly, the feed roller 40 is a transport roller having a stepped shape with a built-in heater 43 built-in.

  An external heater 44 using a heating wire, a lamp, or the like as a heat source is provided above the feed roller 40. The release film 12 is preheated by the built-in heater 43 and the external heater 44 built in the feed roller 40. The external heater 44 is preferably configured to blow hot air over the entire width of the release film 12.

  An ionizer (static discharge device) 45 for removing static electricity charged on the release film 12 can be provided between the feed roller 40 and the mold 10. By removing the static electricity charged on the release film 12 using the ionizer 45, particles are prevented from adhering to the release film 12.

  With reference to FIG. 6, the operation of resin sealing using the release film supply mechanism 39 will be described. In the release film supply mechanism 39, the pre-use release film 12 sent from the delivery mechanism 13 is preheated by a built-in heater 43 built in the delivery roller 40 and an external heater 44 provided above the delivery roller 40. To do. The release film 12 is softened and stretched by being preheated. Since the outer diameter of the feed roller 40 increases from the center toward both ends, the release film 12 is placed between the upper mold 8 and the lower mold 9 while applying a pulling force to the extended release film 12. Transport.

  The take-up roller 16 is the same as the take-up roller 16 shown in FIG. 2, and the outer diameter increases from the center toward both ends. Therefore, the tension | tensile_strength which acts with respect to an outward direction is applied to the release film 12 from the center part of the release film 12 extended by preheating. As a result, the release film 12 in the stretched state is conveyed to a predetermined position above the lower mold 9 with the occurrence of deflection being reduced.

  Next, the release film 12 that has been preheated and stretched is brought into close contact with the mold surface of the lower mold 9. Since the release film 12 has been preheated and already extended, the degree of further extension by the heat received from the heater provided in the lower mold 9 is reduced. As a result, wrinkles can be prevented from occurring due to heat from the heater. Therefore, the generation of wrinkles in the release film 12 can be reduced, and the release film 12 can be adsorbed on the mold surface of the cavity 17 to be resin-molded.

  The release film 12 after resin molding is deformed along the mold surface of the cavity 17. Furthermore, since the influence of heat from the heater provided in the lower mold 9 is eliminated, the release film 12 contracts. The pulling roller 41 has an outer diameter that increases from the center toward both ends. By providing the pulling roller 41 between the take-up roller 16 and the take-up mechanism 14, it is possible to apply a pulling force to the release film 12 after resin molding. As a result, a force is applied to the release film 12 that has been deformed and shrunk to return it to its original flat state. Therefore, the influence which it has on the release film 12 used for the next resin sealing can be reduced.

  In order to relieve deformation and shrinkage of the release film 12 after resin molding, a heater can be incorporated in the winding roller 16 and the pulling roller 41. Since the release film 12 is heated by the heater built in the take-up roller 16 and the pulling roller 41, deformation and shrinkage of the release film 12 can be reduced. In addition, since a pulling force is applied to the release film 12, the release film 12 can be more easily returned to the original flat state. Accordingly, the influence on the release film 12 used for the next resin molding can be further reduced.

  In the present embodiment, in the film supply mechanism (film supply apparatus) of the first embodiment, a tension roller 41 that is a third roller is provided between the winding roller 16 that is the second roller and the winding mechanism 14. It was. According to this structure, generation | occurrence | production of a wrinkle and a bending can be reduced further in a film.

  In the present embodiment, a built-in heater 43 and an external heater 44 that are heaters capable of heating the film located on the feed roller 40 that is the first roller are provided. The heater capable of heating the film may be at least one of the built-in heater 43 and the external heater 44. According to this configuration, since the release film 12 is preheated, it is possible to further reduce the occurrence of wrinkles and deflections in the film during resin molding.

  Also, at least one of a roller built-in heater and an external heater is provided so that the film located on the take-up roller 16 as the second roller can be heated, or a built-in heater is provided in the pulling roller 41 as the third roller. It is good also as a structure. According to this structure, the deformation | transformation and shrinkage | contraction of the release film 12 after resin molding can be relieved, and generation | occurrence | production of a wrinkle and a bending can be further reduced in the film at the time of resin molding.

  More specifically, according to the present embodiment, the release film 12 is preheated by the built-in heater 43 built in the rotating shaft 42 of the feed roller 40 and the external heater 44 provided above the feed roller 40. Soften. Since the pulling force is applied to the release film 12 that has been softened and stretched, the deflection of the stretched release film 12 can be reduced. Since the release film 12 has already been extended, the degree of further extension by the heat received from the heater provided in the lower mold 9 is reduced. Therefore, the generation of wrinkles in the release film 12 can be reduced, and the release film 12 can be adsorbed on the mold surface of the cavity 17 to be resin-molded.

  According to the present embodiment, the pulling roller 41 is provided between the winding roller 16 and the winding mechanism 14. By providing the pulling roller 41, a pulling force is applied to the release film 12 after resin molding. As a result, it is possible to apply a force to restore the original flat state to the release film 12 which is deformed and contracted along the mold surface of the cavity 17. Since the influence on the release film 12 used for the next resin molding is reduced, the release film 12 can be used without waste. Therefore, the material cost which uses the release film 12 can be suppressed.

  In the present embodiment, the release film 12 is heated using both the built-in heater 43 built in the feed roller 40 and the external heater 44 provided above the feed roller 40. Not limited to this, the release film 12 may be heated using either a built-in heater 43 built in the feed roller 40 or an external heater 44 provided above the feed roller 40.

  In the present embodiment, a roller having a stepped shape in which a plurality of cylindrical members 20 are fitted is used as the delivery roller 40. In order to enhance heat conduction from the built-in heater 43 built in the rotating shaft 42, aluminum may be used as the plurality of cylindrical members 20. Furthermore, instead of a roller having a stepped shape, a cylindrical roller (straight roller) made of aluminum may be used.

  In the present embodiment, the pulling roller 41 is provided in order to easily return the release film 12 that has been deformed and contracted by resin molding to its original flat state. Furthermore, in order to make it easy to return the release film 12 after resin molding to the original state, a heater can be incorporated in the winding roller 16 and the pulling roller 41. Thereby, the deformation | transformation and shrinkage | contraction of the release film 12 after resin molding can be eased further.

  In addition, a slit addition mechanism for slitting the release film 12 can be provided between the winding roller 16 and the pulling roller 41. For example, a plurality of slits are formed in the release film 12 using a plurality of cutting edges such as a cutter. By putting a plurality of slits in the release film 12, deformation and shrinkage after resin molding can be further relaxed.

In the present embodiment, the configuration in which the cylindrical member 20 is attached to any of the take-up roller 16, the feed roller 40, and the pulling roller 41 has been described. The configuration is not limited to this, and the cylindrical member 20 may be attached to at least one of the take-up roller 16, the feed roller 40, and the pulling roller 41. When one of the cylindrical members 20 is attached, the effect of reducing the deflection generated in the release film 12 increases in the order of the winding roller 16, the pulling roller 41, and the feeding roller 40.

[Embodiment 5]

  With reference to FIG. 7, the resin molding apparatus 100 of this embodiment is demonstrated. A resin molding apparatus 100 shown in FIG. 7 is a resin molding apparatus using a compression molding method. The resin molding apparatus 100 shown in FIG. 7 includes a substrate supply / storage module 46, three molding modules 47A, 47B, and 47C, and a material supply module 48 as components. The substrate supply / storage module 46, the forming modules 47A, 47B, and 47C, and the material supply module 48, which are components, can be attached to and detached from each other and exchanged. be able to.

  The substrate supply / storage module 46 includes a pre-sealing substrate supply unit 50 that supplies a pre-sealing substrate 49, a sealed substrate storage unit 52 that stores a sealed substrate 51, a pre-sealing substrate 49, and a sealing. A substrate platform 53 for delivering the stopped substrate 51 and a substrate transport mechanism 54 for transporting the pre-sealing substrate 49 and the sealed substrate 51 are provided. The substrate platform 53 moves in the Y direction within the substrate supply / storage module 46. The substrate transport mechanism 54 moves in the X direction, the Y direction, and the Z direction within the substrate supply / storage module 46 and the respective molding modules 47A, 47B, and 47C. The predetermined position S1 is a position to stand by when the substrate transport mechanism 54 does not operate.

  Each molding module 47A, 47B, 47C is provided with a molding unit 2 (see FIG. 1) corresponding to the resin molding apparatus 1 of the first embodiment. The molding unit 2 is provided with a lower mold 9 that can be moved up and down, and an upper mold 8 (see FIG. 1) that is disposed opposite to the lower mold 9. The molding unit 2 includes a mold clamping mechanism 7 (a circular portion indicated by a two-dot chain line) for clamping and opening the upper mold 8 and the lower mold 9. The upper mold | type 8 and the lower mold | type 9 should just move relatively and can clamp and open a mold | type. The lower mold 9 is provided with a cavity 17. A release film supply mechanism 11 for supplying a long release film 12 (see FIG. 2) to the mold surface of the lower mold 9 is provided on the lower mold side (the upper surface of the lower platen 6; see FIG. 1).

  In the material supply module 48, the XY table 55, the resin material accommodation mechanism 56 that accommodates a predetermined amount of the resin material 24 (see FIG. 3C), and the resin material 24 are put into the resin material accommodation mechanism 56. A resin material feeding mechanism 57 and a resin material transport mechanism 58 for transporting the resin material accommodation mechanism 56 are provided. The XY table 55 moves in the X direction and the Y direction within the material supply module 48. The resin material transport mechanism 58 moves in the X direction, the Y direction, and the Z direction within the material supply module 48 and the molding modules 47A, 47B, and 47C. The predetermined position H1 is a position to stand by when the XY table 55 is not operating. The predetermined position M1 is a position to stand by when the resin material transport mechanism 58 does not operate.

  The substrate supply / storage module 46 is provided with a control unit CTL. The control unit CTL controls the transport of the pre-sealing substrate 49 and the sealed substrate 51, the transport of the resin material 24, the transport of the release film 12, the heating of the mold 10, the opening and closing of the mold 10. In other words, the control unit CTL controls each operation in the substrate supply / storage module 46, the molding modules 47A, 47B, 47C, and the material supply module 48.

  The control unit CTL may be provided in each molding module 47A, 47B, 47C, or may be provided in the material supply module 48. The substrate supply / storage module 46 and one molding module 47A may be integrated into a master unit. The material supply module 48 and one molding module 47C may be integrated into a master unit. In these cases, the control unit CTL can be provided in the master unit. The substrate supply / storage module 46 and the material supply module 48 can be integrated, and the control unit CTL can be provided in the integrated module. Note that the control unit CTL may be configured as a plurality of control units separated at least in part according to the operation to be controlled.

  With reference to FIG. 7, the operation | movement which carries out resin sealing using the resin molding apparatus 100 is demonstrated. First, in the substrate supply / storage module 46, the unsealed substrate 49 is sent from the unsealed substrate supply unit 50 to the substrate mounting unit 53. Next, the substrate transport mechanism 54 is moved in the −Y direction from the predetermined position S <b> 1 to receive the pre-sealing substrate 49 from the substrate platform 53. The substrate transport mechanism 54 is returned to the predetermined position S1.

  Next, for example, the substrate transport mechanism 54 is moved in the + X direction to the predetermined position P1 of the molding module 47B. Next, in the molding module 47 </ b> B, the substrate transport mechanism 54 is moved in the −Y direction and stopped at a predetermined position C <b> 1 above the lower mold 9. Next, the substrate transport mechanism 54 is raised to fix the pre-sealing substrate 49 to the mold surface of the upper mold 8 (see FIG. 3A). The substrate transport mechanism 54 is returned to the predetermined position S1 of the substrate supply / storage module 46.

  Next, in the molding module 47B, the release film supply mechanism 11 is used to transport the release film 12 to a predetermined position between the upper mold 8 and the lower mold 9 (see FIG. 3A). In this state, the release film 12 is arranged at a predetermined position above the lower mold 9 with the occurrence of deflection being reduced. Next, the release film supply mechanism 11 is lowered to bring the release film 12 into close contact with the mold surface of the lower mold 9. Next, the release film 12 is adsorbed along the mold surface of the lower mold 9 and the mold surface of the cavity 17 using an adsorption mechanism provided in the lower mold 9. The release film 12 is reduced in the generation of wrinkles and is attracted to the mold surface of the cavity 17 (see FIG. 3B).

  Next, in the material supply module 48, the resin material accommodation mechanism 56 placed on the XY table 55 is moved from the predetermined position H <b> 1 in the −Y direction, and the resin material accommodation mechanism 56 is moved to the resin material injection mechanism 57. Is stopped at a predetermined position below. By moving the XY table 55 in the X direction and the Y direction, a predetermined amount of the resin material 24 is charged into the resin material accommodation mechanism 56 from the resin material charging mechanism 57. The XY table 55 on which the resin material accommodation mechanism 56 is placed is returned to the predetermined position H1.

  Next, the resin material transport mechanism 58 is moved from the predetermined position M <b> 1 in the −Y direction, and the resin material accommodation mechanism 56 placed on the XY table 55 is received. The resin material transport mechanism 58 is returned to the predetermined position M1.

  Next, the resin material transport mechanism 58 is moved in the −X direction to the predetermined position P1 of the molding module 47B. Next, in the molding module 47 </ b> B, the resin material transport mechanism 58 is moved in the −Y direction and stopped at a predetermined position C <b> 1 above the lower mold 9. The resin material transport mechanism 58 is lowered to supply the resin material 24 to the cavity 17 (see FIG. 3C). The resin material transport mechanism 58 is returned to the predetermined position M1.

  Next, in the molding module 47B, the resin material 24 is melted to produce the fluid resin 25 (see FIG. 4A). The lower mold 9 is raised by the mold clamping mechanism 7, and the upper mold 8 and the lower mold 9 are clamped (see FIG. 4B). After a predetermined time has elapsed, the upper mold 8 and the lower mold 9 are opened (see FIG. 4C). Next, the substrate transport mechanism 54 is moved from a predetermined position S1 of the substrate supply / storage module 46 to a predetermined position C1 above the lower mold, and the sealed substrate 51 is received. Next, the substrate transport mechanism 54 is moved to deliver the sealed substrate 51 to the substrate platform 53. The sealed substrate 51 is stored in the sealed substrate storage portion 52 from the substrate mounting portion 53. At this stage, resin sealing is completed.

  In the present embodiment, three molding modules 47A, 47B, and 47C are mounted side by side in the X direction between the substrate supply / storage module 46 and the material supply module 48. The substrate supply / storage module 46 and the material supply module 48 may be combined into one module, and one or a plurality of molding modules 47A may be mounted side by side in the X direction. This makes it possible to increase or decrease the molding modules 47A, 47B,... Both at the stage of manufacturing the apparatus and at the stage after the apparatus is installed in the factory. The configuration of the resin molding apparatus 1 in each factory can be optimized in accordance with the production form and production volume. Therefore, the productivity in each factory can be improved.

  In each embodiment, a resin material made of a thermosetting resin is used. For example, an epoxy resin or a silicone resin can be used. A resin material made of a thermoplastic resin may be used.

  In each embodiment, the release film 12 was brought into close contact with the lower mold or the upper mold by lowering or raising the release film supply mechanism. However, the present invention is not limited to this, and the release film 12 can be brought into close contact with the lower or upper mold surface only by suction after being transported to the vicinity of the lower or upper mold surface. In this case, the function of raising and lowering the release film supply mechanism can be removed. If the release film 12 is supplied to the lower mold, the release film 12 may be brought into close contact with the lower mold surface by raising the lower mold.

  In each embodiment, the resin molding apparatus and the resin molding method used when resin-sealing a semiconductor chip have been described. The target to be resin-sealed may be a chip of an active element such as an IC chip, a transistor chip, or an LED chip. The target of resin sealing may be a chip of a passive element such as a capacitor or an inductor, or a chip group in which an active element chip and a passive element chip are mixed. The target to be oil-sealed may be a semiconductor chip using a semiconductor, a non-semiconductor chip not using a semiconductor, or a chip group in which semiconductor chips and non-semiconductor chips are mixed. The target to be resin-sealed may include a sensor, an oscillator, an actuator, and the like. The present invention can be applied when one or a plurality of chips mounted on a substrate such as a lead frame, a printed circuit board, or a ceramic substrate is sealed with a cured resin. Therefore, the present invention can also be applied when manufacturing multichip packages, multichip modules, hybrid ICs, and the like. Electronic components manufactured in each embodiment include a high-frequency signal module, a power control module, a device control module, an LED package, and the like.

  In each embodiment, the release film 12 which is a resin adhesion preventing film has been described as an example. The release film 12 has a function of easily releasing the cured resin 26 from the mold surface side of the cavity 17. An example of the film used other than the release film 12 is a transfer film. The transfer film has a function of transferring an element having a functional surface composed of a surface in contact with the fluid resin to the surface of the cured resin. The element which the functional surface of a transfer film has is the shape formed in the functional surface first. The shape includes a shape corresponding to a mirror surface, an uneven shape corresponding to a satin finish, an uneven shape corresponding to a microlens array, and an uneven shape corresponding to a Fresnel lens. Secondly, elements of the functional surface of the transfer film are layers, films, and the like formed on the functional surface. Examples of the layer and the film include a layer including a pattern / pattern, a conductive layer, a metal foil, and the like.

  In the description so far, the example in which the chip mounted on the substrate is sealed with the resin has been described. The substrate includes a printed circuit board, a ceramic substrate, a lead frame, a semiconductor wafer, and the like. The shape of the substrate may be a rectangle having a long side and a short side, or may be a square. The substrate shape may be substantially circular, such as a semiconductor wafer having notches, orientation flats, and the like.

  The present invention is also applied to a resin molding apparatus or a resin molding method for molding a general resin molded product. In other words, the present invention is not limited to the case where the chip is sealed with resin, but is also applied to the case where optical products such as lenses, optical modules, and light guide plates, and other resin molded products (resin products) are manufactured by the resin molding technology. Is done. In other words, the present invention is also applied when manufacturing a resin molded product. The present invention is particularly effective when there are severe requirements regarding the quality of the resin product to be produced (for example, wrinkles of functional films, appearance quality such as the presence or absence of scratches due to deflection, surface smoothness, etc.). .

  The present invention is not limited to each of the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. It is.

DESCRIPTION OF SYMBOLS 1,100 Resin molding apparatus 2 Molding unit 3 Base 4 Tie bar 5 Upper platen 6 Lower platen 7 Mold clamping mechanism 8, 28 Upper mold (1st type, 2nd type)
9, 29 Lower mold (2nd mold, 1st mold)
10 Mold 11, 39 Release film supply mechanism (film supply device)
12 Release film (film)
13 Feeding mechanism 14 Winding mechanism 15, 40 Sending roller (film transport roller, first roller)
16 Winding roller (film transport roller, second roller)
17, 37 Cavity 18 Conveying roller (film conveying roller)
19 Rotating shaft 20, 20a, 20b, 20c Tubular member 21, 35 Chip 22, 36 Substrate 23, 38 Bonding wire 24 Resin material 25 Fluid resin 26 Cured resin 27 Molded product 30 Resin tablet 31 Pot 32 Plunger 33 Cal 34 Runner 41 Tension roller (film transport roller, third roller)
42 Rotating shaft 43 Built-in heater (heater)
44 External heater (heater)
45 Ionizer 46 Substrate supply / storage module 47A, 47B, 47C Molding module 48 Material supply module 49 Pre-sealing substrate 50 Pre-sealing substrate supply portion 51 Sealed substrate 52 Sealed substrate storage portion 53 Substrate placement portion 54 Substrate Transport mechanism 55 XY table 56 Resin material accommodation mechanism 57 Resin material loading mechanism 58 Resin material transport mechanism T1, T2 Torque r1, r2 Rotational speed F1, F2 Tension CTL control unit S1, H1, M1, P1, C1 Predetermined position

Claims (9)

A resin molding apparatus that uses a molding die provided with a cavity in at least one of a first die and a second die arranged to face each other, and performs resin molding by clamping the molding die.
A delivery mechanism for delivering a film between the first mold and the second mold;
A winding mechanism for winding the film from between the first mold and the second mold;
A first roller provided on the delivery mechanism side;
A second roller provided on the winding mechanism side;
A main cylindrical member attached to each of one end and the other end of at least one target shaft of the rotation shaft of the first roller and the rotation shaft of the second roller;
Among the plurality of main cylindrical members, the outer diameter of the outer main cylindrical member is larger than the outer diameter of the inner main cylindrical member,
A resin molding apparatus, wherein each of the plurality of main cylindrical members is detachable from the target shaft. In the resin molding apparatus described in claim 1,
A resin molding apparatus in which surface processing is performed so as to increase a dynamic friction coefficient of a surface of the main cylindrical member. In the resin molding apparatus described in claim 1,
The resin molding apparatus provided with the heater which can heat the said film located in at least one among the said 1st roller and the said 2nd roller. In the resin molding apparatus described in claim 1,
A third roller provided between the second roller and the winding mechanism; and a plurality of sub-tubular members attached to one end and the other end of the rotation shaft of the third roller. ,
Among the plurality of sub-cylindrical members, the outer diameter of the outer sub-cylindrical member is larger than the outer diameter of the inner sub-cylindrical member,
A resin molding apparatus, wherein each of the plurality of sub-cylindrical members is attachable to and detachable from a rotation shaft of the third roller. In the resin molding apparatus described in any one of Claims 1-4,
Comprising at least one molding module having the molding die and a clamping mechanism for clamping the molding die;
A resin molding apparatus in which the one molding module and another molding module can be attached and detached. A resin molding method for performing resin molding by clamping a molding die using a molding die provided with a cavity in at least one of a first die and a second die arranged to face each other,
Sending the film between the first mold and the second mold using a first roller;
A step of winding the film from between the first mold and the second mold using a second roller;
In at least one of the feeding step and the winding step, one end and one other end of one target shaft of the rotation shaft of the first roller and the rotation shaft of the second roller, respectively. Using a plurality of attached cylindrical members, the outer cylindrical member among the plurality of cylindrical members applies a greater force to the film than the inner cylindrical member,
A resin molding method, wherein each of the plurality of cylindrical members is detachable from the target shaft. A film conveying roller used in a resin molding apparatus,
A plurality of cylindrical members attached to one end and the other end of the rotating shaft,
Of the plurality of cylindrical members, the outer diameter of the cylindrical member on the outside is larger than the outer diameter of the cylindrical member on the inside,
Each of the said cylindrical members is a roller for film conveyance which can be attached or detached with respect to the said rotating shaft. In the roller for film conveyance according to claim 7,
A film conveying roller in which a heater is built in the rotating shaft. A delivery mechanism for delivering the film;
A winding mechanism for winding the film;
A first roller provided on the delivery mechanism side;
A second roller provided on the winding mechanism side;
A plurality of cylindrical members attached to each of one end and the other end of at least one target shaft of the rotation shaft of the first roller and the rotation shaft of the second roller;
Of the plurality of cylindrical members, the outer diameter of the outer cylindrical member is larger than the outer diameter of the inner cylindrical member,
A film supply device for a resin molding apparatus, wherein each of the plurality of cylindrical members is detachable from the target shaft.

Images