KR20180115253A - Resin sealing apparatus, resin sealing method, and molding die for resin sealing - Google Patents

Resin sealing apparatus, resin sealing method, and molding die for resin sealing Download PDF

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Publication number
KR20180115253A
KR20180115253A KR1020187015482A KR20187015482A KR20180115253A KR 20180115253 A KR20180115253 A KR 20180115253A KR 1020187015482 A KR1020187015482 A KR 1020187015482A KR 20187015482 A KR20187015482 A KR 20187015482A KR 20180115253 A KR20180115253 A KR 20180115253A
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South Korea
Prior art keywords
mold
resin
film
substrate
functional member
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KR1020187015482A
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Korean (ko)
Inventor
다카시 다무라
나오키 다카다
히토시 기타
요시히사 가와모토
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토와 가부시기가이샤
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Publication of KR20180115253A publication Critical patent/KR20180115253A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The substrate on which the chip is mounted and the release film are pulled out sequentially or simultaneously by the attraction caused by the static electricity by using the electrostatic chuck provided on the mold surface of the upper mold. Thereby holding the substrate and the release film in close contact with the upper mold surface in close contact with each other. The upper mold and the lower mold are closed to mold the substrate and the chips mounted on the substrate in the molten resin in the cavity. Since the substrate is contained in the cavity when viewed in a plane, the substrate and the chip are completely immersed in the molten resin. At the time when the resin sealing is completed, the upper surface and the side surface of the substrate and the chip are covered with the cured resin.

Description

Resin sealing apparatus, resin sealing method, and molding die for resin sealing

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus, a resin molding method, and a molding die (molding die). More particularly, the present invention relates to a resin sealing apparatus and a resin sealing method used when resin- .

Conventionally, a chip-type electronic device (hereinafter referred to as " chip ", appropriately) mounted on a substrate corresponding to a functional member is resin-sealed with a cured resin molded using a resin molding technique using a resin molding technique. The chip includes a semiconductor chip such as a transistor, an integrated circuit (IC), or a light emitting diode (LED). Examples of the substrate include a semiconductor substrate such as a silicon substrate, a printed circuit board (PCB), a lead frame, and a ceramics substrate.

A release film may be used when the chip mounted on the substrate is resin-sealed. The release film prevents the cured resin from directly adhering to the mold surface of the mold. The release film is a resin adhesion preventive film. By using a release film, a substrate (molded article; a sealed substrate) on which a chip is resin-sealed is easily released from the mold surface of the mold. In order to bring the release film into close contact with the mold surface, the release film is sucked by using a vacuum source provided in a resin sealing apparatus and a vent hole formed in the molding die and serving as a suction hole. As a result, the drawn release film is brought into close contact with the mold surface of the mold (see Patent Document 1). In other words, by using a vacuum chuck having a vacuum source and a suction hole formed in the molding die, the release film is temporarily adsorbed on the mold surface of the mold.

When the mold is viewed along the direction of opening the mold and closing the mold (the mold opening and closing direction), the sealing resin sometimes contains the substrate. In this case, an adhesive tape is prepared and the substrate is adhered to the adhesive tape. The adhesive tape with the substrate is aligned with the mold surface of the mold and the adhesive tape with the substrate adhered to the mold surface (see Patent Document 2).

Patent Document 1: JP-A-11-040593 (paragraph [0029], Fig. 1) Patent Document 2: JP-A-2001-217270 (paragraph [0021], Fig. 2)

However, conventional resin encapsulation using a vacuum chuck has the following problems. First, in a resin-sealing apparatus, it is necessary to provide a plurality of suction holes, a piping system, and a vacuum source. As a result, the configuration of the resin-sealing apparatus including the molding die becomes complicated. Therefore, the manufacturing cost of a resin sealing apparatus including a molding die increases.

Secondly, in the case of viewing along the mold opening / closing direction, when the sealing resin encapsulates the substrate, it is necessary to use an adhesive tape. By using the adhesive tape, the material cost for resin sealing increases. It is impossible to adsorb both the film and the substrate on the mold surface by using an inexpensive film having no adhesive layer. This is because the substrate can not be sucked because the suction hole is blocked by the film.

An object of the present invention is to provide a resin-sealing apparatus, a resin-sealing method, and a molding die for resin-sealing which can adhere a film and a functional member to a mold surface of a mold.

In order to solve the above-mentioned problems, the resin-

A mold opening and closing mechanism for opening and closing a mold (mold) having at least a first mold and a second mold opposite to each other, And a cavity formed in the molding die, the resin sealing apparatus being used in manufacturing an electronic component including a functional member,

An electrostatic chuck provided on the mold surface of the first mold,

And an arrangement region formed on the mold surface of the first mold so as to overlap the electrostatic chuck when the mold is viewed along the mold opening and closing direction and in which a film supplied from the outside of the mold is disposed,

The electrostatic chuck is energized so that the functional member is temporarily fixed to the mold surface of the first mold in a state in which the functional member is in close contact with the film,

Wherein at least a part of a main surface of the functional member is in fluidic resin produced from a resin material supplied from the outside of the cavity to the cavity, In addition,

At least a part of the main surface of the functional member is covered by the cured resin formed by curing the fluid resin.

In the resin-sealing apparatus according to the present invention,

A film supply mechanism for disposing the film in the arrangement area,

A member supply mechanism for disposing the functional member over the arrangement area,

And a resin supply mechanism for supplying the resin material to the mold

.

In the resin-sealing apparatus according to the present invention,

When the electrostatic chuck is energized, the film is temporarily fixed to the mold surface of the first mold

.

In the resin-sealing apparatus according to the present invention,

Wherein the functional member is a semiconductor substrate or a circuit board on which a chip is mounted on the main surface,

The film is a resin adhesion preventive film

.

In the resin-sealing apparatus according to the present invention,

Wherein the functional member has at least one of a heat radiation function or an electrostatic shield function,

The film is a resin adhesion preventive film

.

In the resin-sealing apparatus according to the present invention,

Wherein the cavity includes a front surface and a side surface of the main surface of the functional member when the mold is in a closed state

.

In the resin-sealing apparatus according to the present invention,

And at least one molding module having the molding die and the mold opening / closing mechanism,

The one molding module and another molding module can be attached and detached

.

In order to solve the above problems, a resin sealing method according to the present invention comprises:

A step of preparing a mold having at least a first mold and a second mold provided opposite to the first mold, and a step of arranging a film in an arrangement region in the mold so as to cover the cavity formed in the mold A step of placing a functional member overlaid on the film, a step of supplying a resin material to the mold, a step of closing the mold, and a step of molding the cavity by a fluid resin produced from the resin material A step of holding the mold in a closed state, a step of curing the fluid resin in the cavity to mold the cured resin, and a step of opening the mold, A resin sealing method for use in manufacturing an electronic component including the functional member,

Temporarily fixing the film to the mold surface of the first mold,

The electrostatic chuck provided on the mold surface of the first mold is energized so that the functional member and the film are brought into close contact with each other to temporarily hold the film between the mold surface of the first mold and the functional member, Comprising:

In the step of mold-closing the mold, at least a part of the main surface of the functional member is accommodated in the cavity,

In the step of molding the cured resin, at least a part of the main surface of the functional member is covered with the cured resin.

In the resin sealing method according to the present invention,

In the step of disposing the film in the disposition region, a film supply mechanism is used,

In the step of disposing the functional member, a member supply mechanism is used,

In the step of supplying the resin material, a resin supply mechanism is used

.

In the resin sealing method according to the present invention,

And a step of temporarily fixing the film to the mold surface of the first mold by energizing the electrostatic chuck

.

In the resin sealing method according to the present invention,

Wherein the functional member is a semiconductor substrate or a circuit board on which a chip is mounted on the main surface,

The film is a resin adhesion preventive film

.

In the resin sealing method according to the present invention,

Wherein the functional member has at least one of a heat radiation function or an electrostatic shield function,

The film is a resin adhesion preventive film

.

In the resin sealing method according to the present invention,

In the step of molding the cured resin, the front surface and the side surface of the main surface of the functional member are covered with the cured resin

.

In the resin sealing method according to the present invention,

And preparing at least one molding module having the mold and the mold opening / closing mechanism,

The one molding module and the other molding module can be attached and detached

.

In order to solve the above problems, the mold for resin-

A first mold, a second mold disposed opposite to the first mold, and a cavity formed on at least one of the first mold and the second mold, As a molding die for resin sealing used in manufacturing electronic parts,

And an electrostatic chuck provided on the mold surface of the first mold,

Wherein a film is disposed in an arrangement region in the mold surface of the first mold,

Wherein the functional member is disposed over the film,

The electrostatic chuck is energized so that the functional member is temporarily fixed to the mold surface of the first mold in a state in which the functional member is in close contact with the film,

At least a part of the main surface of the functional member is covered by the cured resin formed by curing the fluid resin filled in the cavity in the mold-closed state.

In the mold for resin sealing according to the present invention,

When the electrostatic chuck is energized, the film is temporarily fixed to the mold surface of the first mold

.

According to the present invention, it is possible to provide a resin sealing apparatus, a resin sealing method, and a molding die for resin sealing, in which a film and a functional member are closely contacted to a mold surface of a mold.

1A is a front view showing a configuration of a molding module in a resin sealing apparatus according to the present invention.
Fig. 1B is a schematic partial sectional view showing a molding die in a molding module. Fig.
2A is a schematic cross-sectional view showing a first step in a process of holding a release film and a substrate on which a chip is mounted on a mold surface in a resin-sealing apparatus according to the present invention.
FIG. 2B is a schematic cross-sectional view showing a second step in a process of holding a release film and a substrate on which a chip is mounted on a mold surface in a resin mold sealing apparatus according to the present invention. FIG.
FIG. 2C is a schematic cross-sectional view showing a third step in a process of holding a release film and a substrate on which a chip is mounted on a mold surface in a resin-sealing apparatus according to the present invention. FIG.
3A is a schematic cross-sectional view showing a first step in a process of resin-sealing a substrate and a chip mounted on the substrate in the resin-sealing apparatus according to the present invention.
3B is a schematic cross-sectional view showing a second step in a process of resin-sealing a substrate and a chip mounted on the substrate in the resin-sealing apparatus according to the present invention.
3C is a schematic cross-sectional view showing a third step in a process of resin-sealing a substrate and a chip mounted on the substrate in the resin-sealing apparatus according to the present invention.
4 is a plan view showing the outline of the apparatus in the resin sealing apparatus according to the present invention.

As shown in Figs. 3A to 3C, in the resin sealing apparatus, the electrostatic chuck 15 is provided on the mold surface of the upper mold 8 (upper mold). The electrostatic chuck 15 is used to pull the release film 16 and the substrate 18 on which the chip 17 is mounted sequentially or simultaneously by attraction due to static electricity. Thus, the substrate 18 and the release film 16 are held in close contact with the mold surface of the upper mold 8 in tight contact with each other. The chip 17 mounted on the substrate 18 and the substrate 18 is immersed in the molten resin 20 filled in the cavity 13 by closing the upper mold 8 and the lower mold 11. [ The substrate 18 and the chip 17 are completely immersed in the molten resin 20 because the substrate 18 is included in the cavity 13 when viewed in plan view (when viewed along the mold opening / closing direction D) . Therefore, at the time when the resin sealing is completed, the upper surface and the side surface of the substrate 18 and the chip 17 are covered with the cured resin 21.

(Example 1)

The configuration of a molding module provided in the resin sealing apparatus according to the present invention will be described with reference to Figs. 1A to 1B. Any of the drawings in this application document are drawn schematically, omitting appropriately or exaggeratingly, for the sake of clarity. The same components are denoted by the same reference numerals and the description thereof is appropriately omitted.

The resin-sealing apparatus 1A shown in Fig. 1A is a resin-sealing apparatus by a compression molding method. In the resin-sealing apparatus 1A, the molding module 2 has a lower base 3. At the four corners of the lower base 3, four tie bars 4 as support members are fixed. An upper base 5 opposed to each other is fixed to the lower base 3 on top of four tie bars 4 extending upward. Between the lower base 3 and the upper base 5, a lift bar 6 opposed to each of the lower base 3 and the upper base 5 is sandwiched between the four tie bars 4 . On the lower base 3, a mold opening / closing mechanism 7 is fixed. The mold opening / closing mechanism 7 is a driving mechanism for lifting and raising the lifting and lowering plate 6 to perform a mold opening and a mold closing along the mold opening and closing direction D. As the mold opening / closing mechanism 7, for example, a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a link mechanism, and the like are used. The lifting and lowering plate 6 is lifted or lowered by the mold opening / closing mechanism 7. [

The upper die (8) is fixed to the lower surface of the upper base (5). Immediately below the upper die 8, a frame-like peripheral member 9 is provided opposite to the upper die 8. The upper surface of the circumferential surface member 9 is opposed to the lower surface of the upper mold 8. A rectangular through hole is formed in the central portion of the circumferential surface member 9 when seen in plan view. A bottom surface member 10 having a rectangular planar shape is fitted to the through hole of the circumferential surface member 9.

In the through hole of the circumferential surface member 9, the bottom surface member 10 can move relative to the circumferential surface member 9. The circumferential surface member 9 and the bottom surface member are vertically driven by the mold opening / closing mechanism 7 and the lifting and lowering unit 6 in a lump.

The circumferential surface member 9 and the bottom surface member 10 are included in the lower mold 11. The upper mold 8 and the lower mold 11 are included in one set of molds 12 (hereinafter, simply referred to as " molds 12 "). The mold 12 may be provided with an intermediate mold provided between the upper mold 8 and the lower mold 11. [ The upper mold 8 and the lower mold 11 are appropriately provided with a heater (not shown) as a heating means.

As shown in Fig. 1B, on the upper surface of the lower mold 11, a cavity 13 is formed which is a space in which the cured resin is molded. The cavity 13 has a rectangular planar shape. The portion surrounding the cavity 13 is referred to as " cavity side ", and the portion constituting the bottom of the cavity 13 is referred to as " inner bottom of cavity ". The side surface of the cavity 13 is constituted by the inner circumferential surface of the circumferential surface member 9. The inner bottom surface of the cavity 13 is constituted by the top surface (upper surface in the figure) of the bottom surface member 10. The cavity 13 is a space surrounded by the inner circumferential surface of the peripheral surface member 9 and the top surface of the bottom surface member 10.

As shown in Fig. 1A, a bottom member 10 is fixed to the upper surface of the lifting and lowering plate 6. A plurality of elastic members (coil springs, disc springs, etc.) 14 are placed around the bottom member 10 on the upper surface of the lifting and lowering member 6. A circumferential surface member (9) is placed on the plurality of elastic members (14). In other words, the circumferential surface member 9 is elastically supported by the plurality of elastic members 14. The lower mold 11 (the peripheral member 9 and the bottom member 10) is moved up and down by the lifting and lowering mechanism 6 being lifted and lowered by the mold opening / closing mechanism 7. [ A plurality of elastic members (not shown) may be provided between the bottom member 10 and the elevating and lowering plate 6. [

An independent driving mechanism different from that of the mold opening / closing mechanism 7 may be provided on the upper surface of the lifting / In this case, the following two configurations may be employed. As a first configuration, an independent drive mechanism is provided in a space between the upper surface of the lifting and lowering member 6 and the lower surface of the bottom member 10. [ The independent driving mechanism moves the bottom member 10 up and down. As a second configuration, an independent drive mechanism is provided in a space between the upper surface of the lift-up table 6 and the lower surface of the circumferential surface member 9. The independent drive mechanism moves the circumferential surface member 9 up and down.

As shown in Figs. 1A and 1B, an electrostatic chuck (ESC) 15 is provided on a mold surface (upper side in Figs. 1A and 1B) of the upper die 8. In the present application document, the phrase " the electrostatic chuck 15 is provided on the mold surface " includes the following two aspects. First, a surface of the electrostatic chuck 15 constitutes a mold surface of the upper mold 8. Secondly, the surface of the protective layer covering the surface of the electrostatic chuck 15 constitutes the mold surface of the upper mold 8. This protective layer is constituted by a thin metal plate, a resin plate or the like.

When a voltage is applied to the electrostatic chuck 15, the electrostatic chuck 15 to which a voltage is applied (energized) uniformly attracts the entire object by attraction due to static electricity. Thus, the energized electrostatic chuck 15 keeps the object in close contact with the surface of the electrostatic chuck 15. In this regard, the electrostatic chuck 15 is different from a mechanical clamp using a vacuum chuck using a suction hole and a rotating claw, which locally and mechanically holds the object.

The electrostatic chuck 15 described in the present application includes any one of a Coulombic electrostatic chuck, a Johnson-Rahbeck (JR) electrostatic chuck, and a gradient electrostatic chuck. The phrase "energized electrostatic chuck" in the present application document includes an electrostatic chuck having a force due to a charge remaining after stopping the voltage application.

By using the electrostatic chuck 15, first, a thin, flexible and easily bendable film, a thin and easily breakable member, and the like can be uniformly adhered to the mold surface of the upper die 8 and maintained. Secondly, the entire surface of the large-area object can be uniformly kept in close contact with the mold surface of the upper mold 8. Thirdly, since the entire object is pulled by the attractive force caused by the static electricity to uniformly adhere to the mold surface of the upper mold 8, mechanical adverse effects (for example, scratches, cracks, Can be reduced.

By using the electrostatic chuck 15, a wide range of objects such as a conductor, a semiconductor, and an insulator can be held on the mold surface of the upper die 8. In addition, by using the electrostatic chuck 15, it becomes possible to maintain the stacked body, which was impossible with the conventional vacuum chuck, on the mold surface of the upper mold 8. For example, a laminate of a release film and a substrate on which a semiconductor chip is mounted, a laminate of a release film and a semiconductor wafer, and the like can be maintained on the mold surface of the upper die 8. In the present application document, the word " lamination " means that a plurality of members are superimposed on each other and are not bonded to each other.

2A to 2C and 3A to 3C, a process of resin-sealing a substrate on which a semiconductor chip is mounted in a resin encapsulation apparatus 1A according to the present invention will be described. In this embodiment, a release film 16 is used. The release film 16 is not tacky. As the release film 16, a resin material having properties such as heat resistance, releasability, flexibility, and extensibility is used. As the release film 16, for example, PTFE, ETFE, PET, FEP, polypropylene, polystyrene, polyvinylidene chloride and the like are used. As the release film 16, either a release film cut into a rectangular shape or a long type (roll type) release film supplied continuously from the film supply reel to the film take-up reel is used.

First, as shown in Fig. 2A, the mold 12 (upper mold 8 and lower mold 11) is opened.

Next, as shown in Fig. 2B, the release film 16 is transported to a predetermined position below the upper mold 8 by using a release film supply mechanism (see Fig. 4). Using the release film feeding mechanism, the release film 16 is lifted from a predetermined position. Thereby, the release film 16 is pushed against the placement region AR virtually formed on the mold surface of the upper die 8. It is preferable to prevent the release film 16 from being sagged, bent, wrinkled or the like at a predetermined position below the upper mold 8 by applying tension to the release film 16. [ The release film is disposed in the arrangement area AR in the mold surface of the upper die 8 even when the release film 16 cut in the form of a rectangle or the roll release film is used. In addition, the release film 16 and the roll-shaped release film contain the cavity 13 in a plan view.

Next, a predetermined voltage is applied to the electrostatic chuck 15. This voltage is a voltage (close contact voltage) for attracting the release film 16 to the mold surface of the upper mold 8 and bringing it into close contact. Using the electrostatic chuck 15 to which the tightening voltage is applied, the release film 16 is attracted to the mold surface of the upper mold 8 and brought into close contact therewith.

Subsequently, energization of the electrostatic chuck 15 is continued. Thereby, the release film 16 is held on the mold surface of the upper mold 8 by the electrostatic chuck 15. The release film 16 is pulled by the electrostatic chuck 15 by the attractive force caused by the static electricity so that the release film 16 can be uniformly kept in close contact with the mold surface of the top mold 8. [ This step corresponds to the step of temporarily fixing the release film 16 to the mold surface of the upper mold 8. In the case of carrying out this step, it is preferable to use an electrostatic chuck 15 suitable for use in attracting the insulator to the surface of the electrostatic chuck 15 and bringing it into close contact.

Next, as shown in Fig. 2C, the substrate (hereinafter, appropriately referred to as " functional member ") 18 is transported downward of the upper die 8 by using a substrate transport mechanism (see Fig. 4). The substrate 18 is a pre-sealing substrate mounted on a main surface (bottom surface in the figure) of the chips 17. [ The substrate transport mechanism stops the substrate 18 by positioning the substrate 18 at a predetermined position below the upper die 8. The electrode of the chip 17 and the electrode of the substrate 18 are electrically connected by bonding wires or bumps made of, for example, gold wire, copper wire or the like. The substrate 18 on which the chips 17 are mounted is temporarily fixed to the mold surface of the upper mold 8.

Next, the substrate 18 is raised by using the substrate transport mechanism, and the back surface of the substrate 18 is brought into contact with the release film 16. The substrate 18 is further raised by using the substrate transport mechanism while the back surface of the substrate 18 is in contact with the release film 16. [ Thereby, the substrate 18 is pressed against the mold surface of the upper mold 8 with the release film 16 therebetween.

Next, the electrostatic chuck 15 is used to pull the substrate 18 by the attractive force caused by the static electricity. This step corresponds to the step of temporarily fixing the substrate 18 to the mold surface of the upper die 8. A step of temporarily fixing the release film 16 to the mold surface of the upper mold 8 and a process of temporarily fixing the substrate 18 to the mold surface of the upper mold 8 are sequentially executed. The substrate 18 and the release film 16 are held in close contact with the mold surface of the upper mold 8 by the electrostatic chuck 15 by the above steps. The release film 16 and the substrate 18 are kept in the mold surface of the upper mold 8 in a state in which the release film 16 and the substrate 18 are laminated by using the electrostatic chuck 15 provided on the upper mold 8 .

The release film 16, the substrate 18 on which the chip 17 is mounted, and a functional member such as a semiconductor wafer are held by the electrostatic chuck 15 on the mold surface of the upper die 8. In this embodiment, the size of the functional member is set so as to be included in the size of the cavity 13 along the die opening / closing direction D, in order to increase the number of products obtained from one functional member. In other words, the size of the functional member is set so as to be accommodated in the cavity 13 in plan view.

Next, a predetermined amount of the resin material is supplied to the upper surface of the release film 19 (see Fig. 3A) outside the mold 12 in advance. Thereafter, the releasing film 19 and the resin material are collectively transported to above the cavity 13, and are supplied to the cavity 13.

As the resin material, a resin such as a powder, a particle, a granule, a sheet, a paste, a jelly, or a solid, or a resin which is liquid at room temperature can be used. The liquid resin is a liquid resin having fluidity at room temperature. Regardless of the degree of fluidity of the liquid resin at room temperature. This embodiment shows an example in which a molten resin 20 is produced by melting a granular resin (granular resin) supplied as a resin material (see FIG. 3A).

Next, as shown in Fig. 3A, the molten resin 20 is produced by heating the resin material supplied to the cavity 13 using a heater (not shown). The molten resin 20 is a fluid resin. At this time, the cavity 13 is filled with the molten resin 20.

Next, as shown in Fig. 3B, the lifting / lowering unit 6 (see Figs. 1A and 1B) is lifted by using the mold opening / closing mechanism 7. [ As a result, the upper surface of the peripheral surface member 9 is pressed against the electrostatic chuck 15 provided on the upper die 8. Strictly speaking, between the upper surface of the peripheral member 9 and the electrostatic chuck 15, release films 16 and 19 are interposed. After the upper surface (mold surface) of the circumferential surface member 9 is brought into contact with the release film 19, the release films 19 and 16 are sequentially disposed between the upper surface of the circumferential surface member 9 and the electrostatic chuck 15, The upper surface of the face member 9 is pressed against the electrostatic chuck 15.

Next, the upper mold 8 and the lower mold 11 are closed. The chips 17 mounted on the substrate 18 and the substrate 18 are immersed in the molten resin 20 filled in the cavities 13. In the present embodiment, the planar shape of the substrate 18 is included in the plane shape of the cavity 13. Therefore, the chip 17 and the main surface of the substrate 18 (the surface on which the chip 17 is mounted, the bottom surface in the figure) and the side surface can be completely immersed in the molten resin 20.

Next, the lifting and lowering plate 6 (see Figs. 1A and 1B) is further lifted by using the mold opening / closing mechanism 7. [ The upper surface of the circumferential surface member 9 is raised by a predetermined distance in a state in which the upper surface of the circumferential surface member 9 is pressed against the surface of the electrostatic chuck 15 with the release films 19 and 16 interposed therebetween . Thus, a pressure (molding pressure) is applied to the molten resin 20 in the cavity 13. Subsequently, the molten resin 20 is heated so as to cure the molten resin 20 to form the cured resin 21. [ The substrate 18 and the chip 17 mounted on the substrate 18 are resin-sealed with a hardening resin (sealing resin) At this point, the upper surface and the side surface of the chip 17 and the substrate 18 are covered with the cured resin 21.

Next, as shown in Fig. 3C, the lower mold 11 is lowered using a mold opening / closing mechanism (see Figs. 1A and 1B) after resin sealing is completed. As a result, the upper mold 8 and the lower mold 11 are opened. The application of the close contact voltage to the electrostatic chuck 15 is stopped. Thereafter, the molded product (encapsulated substrate) 22 is taken out from the upper mold 8 using the substrate transport mechanism (see Fig. 4).

Next, using the cutting device (not shown), the molded article 22 is cut in each region where each chip 17 is mounted. A plurality of products 23 corresponding to a plurality of regions are produced by cutting the molded product 22 into individual pieces. Each product 23 corresponds to an electronic component. On the other hand, like the electronic module for control, the molded article 22 itself may correspond to one electronic component.

According to this embodiment, since the upper surface and the side surface of the substrate 18 are resin-sealed, an unnecessary portion UNP that does not directly contribute to the product 23 can be reduced as much as possible. Therefore, the number of products 23 to be produced from the molded article 22 can be increased.

According to the present embodiment, the electrostatic chuck 15 is provided on the mold surface of the upper die 8. The electrostatic chuck 15 attracts the entire object by the attractive force caused by the static electricity and uniformly adheres to the mold surface of the upper mold 8 and holds it. Therefore, for the first time, a thin, flexible and easy-to-bend film, a thin and easily breakable member, and the like can be uniformly adhered to the mold surface of the upper mold 8 and maintained. Secondly, the entire surface of the large-area object can be uniformly kept in close contact with the mold surface of the upper mold 8. Thirdly, since the entire object is pulled by the attractive force caused by the static electricity and is uniformly brought into close contact with the mold surface of the upper mold 8, the mechanical adverse effect imparted to the object is lowered compared to the case of using the vacuum chuck and the mechanical clamp Can be reduced. Fourthly, a laminate (for example, a laminate of the release film 16 and the substrate 18, a laminate of the release film 16 and a semiconductor wafer, etc.) which was impossible with a vacuum chuck, It is possible to uniformly adhere to and maintain it. Fifthly, since the structure of the molding die can be simplified as compared with the case of using a mechanical clamp or a vacuum chuck, the manufacturing cost of the resin sealing apparatus can be reduced.

Incidentally, according to the present embodiment, the release film 16 covers the flat surface of the upper die 8 with the planar shape of the substrate 18 being contained. Thereby, firstly, when the upper surface and the side surface of the substrate 18 are resin-sealed, it is possible to prevent the resin burr from adhering to the mold surface of the upper die 8. Secondly, when the substrate 18 is resin-sealed, the unnecessary portion UNP which does not directly contribute to the product 23 can be reduced as much as possible, so that the number of products to be manufactured from one substrate can be increased . Thirdly, since the adhesive tape is unnecessary, the material cost when resin sealing is performed can be reduced.

As a modified example of this embodiment, a laminate in which a plate-like member or a lid-like member (hereinafter referred to as " conductive member ") made of a metal plate, a porous metal plate or a conductive resin plate and the like . The laminate is uniformly adhered and held on the mold surface of the molding die (lower die 11) opposed to the molding die (upper die 8) in which the substrate 18 is held. In the case where the opening is formed in the conductive member, the resin burr is prevented from being formed between the conductive member and the film. The conductive member corresponds to a functional member, and has at least one of a heat radiation function or an electrostatic shielding function.

The planar shape of the substrate 18 may include the planar shape of the cavity 13. In this case, as the first configuration, the molded article 22 is cut in each region where each chip 17 is mounted. Thereby, a plurality of products 23 are produced. As a second configuration, one area corresponding to the product is formed on the substrate 18, and the molded article 22 is cut along the periphery of the area. Thereby, one product 23 is produced.

In this embodiment, the cured resin 21 is molded at least in part of the main surface of the substrate 18. [ The " curable resin 21 is molded in at least a part of the main surface of the substrate 18 " includes the following three aspects. In the first embodiment, in the plan view, a part of the inside of the main surface of the substrate 18 is covered with the cured resin 21. [ In the second aspect, in the plan view, all portions of the main surface of the substrate 18 are covered with the cured resin 21, and the side surfaces are not covered with the cured resin 21. [ In the third aspect, in the plan view, all portions of the main surface of the substrate 18 are covered with the cured resin 21, and the side surfaces of the substrate 18 are covered with the cured resin 21. In this embodiment, as shown in Figs. 3A to 3C, a region where the release film 16 and the molten resin (fluid resin) 20 are in contact with each other on the outer side of the substrate 18 in a plan view, and There may be a region where the release film 16 and the cured resin (sealing resin) 21 are in contact with each other.

In this embodiment, the release film 16 and the substrate 18 are supplied to the topsheet 8 using different supply mechanisms (release film supply mechanism and substrate transport mechanism). The substrate 18 and the release film 16 may be provided in the state that the release film 16 is disposed on the back surface (upper surface in Fig. 2C) of the substrate 18 by using the same substrate transport mechanism, And can be supplied to the upper die 8 collectively.

As another method of supplying the release film 19 and the resin material to the cavity 13, only the release film 19 may be supplied above the cavity 13. The mold releasing film 19 is adhered to the mold surface of the cavity 13 and brought into close contact with each other by using a suction hole and a suction mechanism (both not shown) formed in the lower mold 11. [ The cavity 13 is in contact with the mold surface of the cavity 13 and the space surrounded by the release film 19 in the cavity 13 Supply. Depending on the characteristics of the lower die 11 and the characteristics of the resin material, the release film 19 may not be used. In this case, the resin material is directly supplied to the cavity 13 surrounded by the exposed mold surface.

As another method of closely fixing the release film 16 and the substrate 18 to the mold surface of the upper mold 8, the following method may be employed. This is because the release film 16 and the substrate 18 are laminated below the upper mold 8 so that the laminate composed of the release film 16 and the substrate 18 can be stacked substantially simultaneously with the mold surface of the upper mold 8 It is a method of pulling and holding. In this case, a step of temporarily fixing the release film 16 to the mold surface of the upper mold 8 and a process of temporarily fixing the substrate 18 to the mold surface of the upper mold 8 are simultaneously carried out. When the release film 16 and the substrate 18 are simultaneously pulled to the mold surface of the upper mold 8, the applied voltage can be determined in consideration of the weight and planarity of the laminate.

The voltage (applied voltage) to be applied to the electrostatic chuck 15 may be determined as follows. Generally, when compared per unit area, the weight of the substrate 18 is larger than the weight of the release film 16. In this regard, when the release film 16 and the substrate 18 are sequentially pulled toward the mold surface of the upper mold 8, the voltage applied to the substrate (the upper mold 8) 18 may be held at the mold surface of the upper mold 8 may be increased.

Instead of stopping the application of the close contact voltage to the electrostatic chuck 15, a voltage whose absolute value is almost the same as the close contact voltage and whose polarity is opposite to the positive polarity may be applied. The applied voltage is a charge removing voltage for removing the charge remaining in the electrostatic chuck 15. It is possible to easily remove the molded product 22 from the top mold 8 by removing the charge remaining in the electrostatic chuck 15. [

By setting the charge removal voltage to an appropriate value, an appropriate amount of charge may be left. An appropriate amount of the remaining charge can be used in order to temporarily fix the release film 16 used in the subsequent resin sealing to the mold surface of the upper mold 8. [

The releasing film 16 is attracted to the mold surface by sucking the releasing film 16 in advance and the functional member (or both of the releasing film 16 and the functional member) is formed on the mold surface by energizing the electrostatic chuck 15, It may be used in combination. In this case, a plurality of suction holes are formed on the outer side of the electrostatic chuck 15 in plan view and on the mold surface of the region outside the functional member. A plurality of electrostatic chucks 15 may be provided in an area inside the functional member as viewed in plan view and a plurality of suction holes may be formed in the mold surface between the electrostatic chucks 15. [ The plurality of suction holes are connected to depressurization sources such as a suction pump, a decompression tank, and the like via piping and on / off valves, respectively.

In the process of closing the upper mold 8 and the lower mold 11, it is preferable to suck the inside of the cavity 13 by using a vacuuming mechanism (not shown) and depressurize it. Thus, air remaining in the cavity 13, bubbles contained in the molten resin 20, and the like can be discharged to the outside of the mold 12.

A drive source and a control signal (both not shown) may be supplied to the resin-sealing apparatus 1A from the outside of the resin-sealing apparatus 1A. Examples of the driving source include electric power, high-pressure gas (compressed air, etc.). A predetermined electric power is supplied to at least the mold opening / closing mechanism 7, the electrostatic chuck 15 and the heater (not shown). A control signal received from an operation section (control section) operated by an operator is supplied to at least the mold opening / closing mechanism 7, the electrostatic chuck 15 and the heater. The die opening and closing mechanism 7, the electrostatic chuck 15 and the heater are controlled by the received control signal. In this case, a worker, a robot or the like supplies the release film 16, the substrate 18, and a resin material (not shown) to the resin sealing apparatus 1A. In this case, the resin encapsulation device 1A operates according to the received drive source and control signal.

A power source and a control unit (both not shown) can be provided in the resin sealing apparatus 1A. In this case, the resin-sealing apparatus 1A itself can operate.

(Example 2)

4, a resin sealing apparatus 1B according to the present invention will be described. The resin-sealing apparatus 1B shown in Fig. 4 is a resin-sealing apparatus by a compression molding method. The resin sealing apparatus 1B includes a substrate supply and storage module 24, three molding modules 25A, 25B and 25C and a material supply module 26 as constituent elements. The substrate supply and storage module 24 as a component, the forming modules 25A, 25B and 25C and the material supply module 26 can be attached to and detached from each other for different components, have. Each of the molding modules 25A, 25B and 25C may correspond to the resin sealing apparatus 1A shown in Fig. 1A.

The substrate supply and storage module 24 is provided with a pre-sealing substrate supply part 28 for supplying the pre-sealing substrate 27, a sealed substrate storage part 30 for housing the sealed substrate 29, A substrate arranging section 31 for transferring the substrate 27 and the sealed substrate 29 and a substrate transport mechanism 32 for transporting the substrate 27 before the sealing and the substrate 29 after the sealing are provided. The substrate placement section 31 moves in the Y direction in the substrate supply / storage module 24. [ The substrate transport mechanism 32 moves in the X direction, the Y direction, and the Z direction within the substrate supply / storage module 24 and the respective molding modules 25A, 25B, and 25C. The predetermined position S1 is a stand-by position in a state in which the substrate transport mechanism 32 is not operated.

Each of the molding modules 25A, 25B and 25C is provided with a lower mold 11 capable of ascending and descending and an upper mold 8 arranged opposite to the lower mold 11 (see Fig. 1A). The upper die 8 is provided with an electrostatic chuck 15 (see Figs. 1A and 1B). A mold releasing film supply mechanism 33 (a rectangular portion indicated by a chain double-dashed line in Fig. 4) for supplying the elongated release film 16 (see Fig. 2B) to the upper die 8 is provided. Each of the molding modules 25A, 25B and 25C is provided with a mold opening / closing mechanism 7 (a circular portion indicated by a chain double-dashed line in Fig. 4) for opening and closing the upper mold 8 and the lower mold 11 do. The release film 19 and the cavity 13 to which the resin material is supplied are formed in the lower die 11 (see Figs. 3A to 3C).

The material supply module 26 is provided with an XY table 34 and a release film supply mechanism 35 for supplying a release film 19 (see Figs. 3A to 3C) onto the XY table 34, 36 and a resin transport mechanism 38 for transporting the resin containing frame 36 are provided. The X-Y table 34 moves in the X direction and the Y direction in the material supply module 26. The resin transport mechanism 38 moves in the X direction, the Y direction, and the Z direction within the material supply module 26 and the respective molding modules 25A, 25B, and 25C. The predetermined position M1 is a stand-by position in a state in which the resin transport mechanism 38 is not operated.

The substrate supply / storage module 24 is provided with a control unit CTL. The control unit CTL controls the transport of the substrate 27 before the sealing and the substrate 29 after the sealing, transport of the resin material, heating of the molding die, opening and closing of the molding die, and the like. In addition, the control unit CTL controls the electrostatic chuck 15 such that the start of energization and stop of energization of the electrostatic chuck 15 shown in Figs. 2A to 2C and Figs. 3A to 3C, the value of the voltage applied to the electrostatic chuck 15, .

The control unit CTL may be provided in each of the molding modules 25A, 25B, and 25C or may be provided in the material supply module 26. [ The substrate supply / storage module 24 and the single molding module 25A may be integrated into one body. The material supply module 26 and the single molding module 25C may be integrated into one body. In these cases, a control unit (CTL) can be installed in the main body. It is possible to integrate the substrate supply / storage module 24 and the material supply module 26, and install the control unit CTL in the integrated module.

Referring to Fig. 4, the operation of resin-sealing using the resin-sealing apparatus 1B will be described. The substrate 27 is first sent from the unseasoned substrate supply section 28 to the substrate placement section 31 in the substrate supply and storage module 24. The substrate transport mechanism 32 is moved in the -Y direction from the predetermined position S1 and the substrate transport mechanism 32 receives the substrate 27 before sealing from the substrate arrangement part 31. [ The substrate transport mechanism 32 is returned to the predetermined position S1.

Next, the substrate transport mechanism 32 is moved in the + X direction to a predetermined position P1 of the forming module 25B, for example. In the forming module 25B, the substrate transport mechanism 32 is moved in the -Y direction to stop at the predetermined position C1 on the lower die 11. The release film 16 (see Figs. 2A to 2C) is supplied from the release film supply mechanism 33 to the upper die 8. The electrification chuck 15 (see Figs. 2A to 2C) is energized to hold the release film 16 on the mold surface of the upper mold 8. Fig. The substrate transport mechanism 32 is raised to supply the substrate 27 before the sealing process. The electrification chuck 15 is energized to hold the release film 16 and the unsealed substrate 27 in the mold face of the upper die 8. The substrate transport mechanism 32 is returned to the predetermined position S1 of the substrate supply / storage module 24.

Next, in the material supply module 26, the release film 19 (see Figs. 3A to 3C) is supplied from the release film supply mechanism 35 to the X-Y table 34 and cut to a predetermined size. Next, the resin conveying mechanism 38 is moved in the -Y direction from the predetermined position M1, and the resin containing frame 36 is placed on the release film 19 coated on the X-Y table 34. Then, The resin transport mechanism 38 is returned to the predetermined position M1.

Next, the X-Y table 34 is moved to stop the resin containing frame 36 at a predetermined position below the resin material feeding mechanism 37. The X-Y table 34 is moved in the X direction and the Y direction so that a predetermined amount of the resin material is supplied from the resin material charging mechanism 37 to the resin containing frame 36. At this point, the resin containing frame 36, the release film 19, and the resin material are temporarily integrated and handled. Thereafter, the X-Y table 34 is returned to its original position.

Next, the resin transport mechanism 38 is moved in the -Y direction from the predetermined position M1. The resin conveying mechanism 38 receives the resin containing frame 36, the release film 19, and the resin material disposed in the X-Y table 34. The resin transport mechanism 38 is returned to the predetermined position M1. The resin conveying mechanism 38 is moved in the -X direction to the predetermined position P1 of the forming module 25B. In the forming module 25B, the resin transporting mechanism 38 is moved in the -Y direction to stop at the predetermined position C1 on the lower mold 11. [ The resin conveying mechanism 38 is lowered and the resin material and the release film 19 (see Figs. 3A to 3C) are supplied from the resin receiving frame 36 to the cavity 13 by the resin conveying mechanism 38. The resin transport mechanism 38 is returned to the predetermined position M1.

Next, in the forming module 25B, the lower die 11 is raised by the die opening / closing mechanism 7 to close the upper die 8 (see Figs. 3A to 3C) and the lower die 11. After the predetermined time has elapsed, the upper mold 8 and the lower mold 11 are opened. The substrate transport mechanism 32 is moved from the predetermined position S1 of the substrate supply and storage module 24 to the predetermined position C1 on the lower die 11 and the substrate transport mechanism 32 transports the substrate 30, (Corresponding to the molded article 22 in Figs. 3A to 3C). The substrate transport mechanism 32 is moved and the sealed substrate 29 is transferred from the substrate transport mechanism 32 to the substrate disposition section 31. The sealed substrate 29 is stored in the sealed substrate storage section 30 from the substrate arrangement section 31. [ By the above steps, the resin sealing is completed.

In the present embodiment, three molding modules 25A, 25B and 25C are mounted side by side in the X direction between the substrate supply / storage module 24 and the material supply module 26. [ The substrate supply / storage module 24 and the material supply module 26 may be formed as one module, and one or a plurality of molding modules 25A may be mounted side by side in the X direction. Thus, the molding modules 25A, 25B, ... can be increased or decreased in steps of manufacturing the apparatus and in steps after the apparatus is installed in the factory. It is possible to optimize the configuration of the resin-sealing apparatus 1B in each factory in accordance with the production form and the production amount. Therefore, the productivity of each factory can be improved.

In each of the embodiments, the resin-sealing apparatus and the resin-sealing method by the compression molding method are shown. In the case of using the compression molding method, at least a part of the substrate 27 before the sealing is immersed in the fluid resin filled in the cavity in the step of mold-closing the mold. The present invention can be applied not only to the compression molding method but also to a resin sealing method and a resin sealing method by a transfer molding method and an injection molding method. In the case of using the transfer molding method and the injection molding method, the step of closing the mold and the step of filling the cavity with the fluid resin are sequentially executed.

In each of the embodiments, the resin encapsulation device and the resin encapsulation method used for resin encapsulation of the semiconductor chip have been described. The object to be resin-sealed may be a semiconductor chip such as an IC chip, a transistor chip, or an LED chip. The object to be resin-sealed may be a passive element chip such as a capacitor or an inductor, or a chip group in which a semiconductor chip and a passive element chip are mixed. Objects to be resin-sealed may include sensors, oscillators, filters, actuators, and the like. The present invention can be applied when one or a plurality of chips mounted on a substrate such as a lead frame, a printed board, and a ceramics substrate is resin-sealed with a cured resin. Therefore, the present invention can also be applied to manufacturing a multi-chip package, a multi-chip module, a hybrid IC, and an electronic module for control.

The object to be resin-sealed may be a semiconductor substrate (functional member) such as a silicon wafer or a compound semiconductor wafer. A chip may be mounted on the surface of the semiconductor substrate. The chip may not be mounted on the surface of the semiconductor substrate.

In each embodiment, the plane shape of the substrate (functional member) may be a rectangle having long sides and short sides, a square, a circle, or the like. The shape of the substrate may be substantially circular, such as a semiconductor substrate having a notch, an orientation flat, or the like.

The planar shape of the electrostatic chuck 15 may be determined in correspondence with the plane shape of the workpiece as the substrate 18 (functional member) on which the chip 17 is mounted. In addition, a plurality of electrodes may be formed on the electrostatic chuck 15. In the case where the plane shape of the fixed object is a specific rectangle, the planar shape of the plurality of electrodes may be a plurality of concentric rectangles resembling a specific rectangle. In the case where the plane shape of the object to be fixed is circular, the planar shape of the plurality of electrodes may be a concentric circle. A plurality of electrodes having different sizes from those of the planar shape are formed on the electrostatic chuck 15 regardless of the shape of the plane of the object to be fixed.

In the case where the plane shape of the fixed object is rectangular, for example, a plurality of electrodes extending in a direction parallel to short sides may be arranged. In the case where the plane shape of the fixed object is circular, for example, a plurality of electrodes extending in a direction parallel to a specific diameter may be arranged. In any case, it is possible to apply a voltage sequentially from the central electrode toward the outer electrode, or from the outer electrode toward the central electrode. When the fixed shape of the fixed object is circular, the fixed object may be divided into a plurality of sectors (including a semicircle), and an electrode having a shape slightly smaller than each sector and resembling each sector may be provided.

When fixing a thin fixture having a large planar shape to the mold surface of the upper mold, the center portion of the fixture may be sagged. When the vacuum chuck is used, it is difficult to fix the center of gravity of the object to be fixed on the upper mold surface. In this case, it is preferable that the step of temporarily fixing the fixture to the mold surface of the upper mold is carried out as follows. First, among the plurality of electrodes overlapping the fixed object, electricity is applied to the electrode located at one end. The fixed object at one end thereof is fixed to the mold face of the upper mold. Next, the electrode adjacent to the one end is energized. The fixed object superimposed on the adjacent electrode is fixed to the upper mold surface. Next, the non-energized electrodes adjacent to the immediately previous energized electrode are sequentially energized. As a result, the deflection of the fixed object in which the center portion is caught is sequentially eliminated from one end toward the other end. Therefore, the fixture suspended at the center portion is temporarily fixed to the mold surface of the upper mold.

It is possible to apply the voltage to the electrode or the electrode group located at the innermost position among the plurality of electrodes of the electrostatic chuck 15 and sequentially apply the voltage to the electrode or the electrode group adjacent to the outside. The absolute value of the voltage applied to the electrode or the group of electrodes adjacent to the outside may be sequentially increased toward the outside. As a result, it is possible to suppress occurrence of wrinkles and slack in the object to be fixed which is liable to be thinned. In addition, it is possible to suppress occurrence of wrinkles, sagging, and the like in the release film 16 having a range overlapping with the fixed object in a plan view.

An electrode positioned at the innermost side of the plurality of electrodes of the electrostatic chuck 15 and an electrode adjacent to the outside of the plurality of electrodes may be a pair of electrodes. A plurality of electrode pairs are formed from the inner side to the outer side of the electrostatic chuck 15 in plan view. In each electrode pair, a voltage whose absolute value is almost the same and whose polarity is opposite to that of the electrode is applied to the inner electrode and the outer electrode. The absolute value of the voltage applied to the electrode pair or electrode pair group adjacent to the outside may be sequentially increased toward the outside.

The electrodes of the electrostatic chuck 15 will be collectively described. The electrostatic chuck 15 is provided so as to overlap in a predetermined range of the release film 16 as viewed in a plan view. The electrostatic chuck 15 has electrodes divided into a plurality (N (N is an integer equal to or larger than 2, the same applies hereinafter)). The electrostatic chuck 15 may have a plurality of pairs (N pairs) of electrode pairs. N electrodes are energized one by one or M (M is an integer equal to or less than N, the same shall apply hereinafter) with a time difference. Alternatively, one pair or M pieces of N pairs of electrode pairs are sequentially energized with a time difference. It is preferable to appropriately set the order of energization in accordance with the weight of the substrate 18 as the object to be fixed and the degree of deformation such as deflection, warpage, undulations in the substrate 18, and the like.

The degree of deformation may be measured before fixing the substrate 18 to the mold surface of the upper mold 8. For the N electrodes or N pairs of electrode pairs, the dividing method and the order of energization are appropriately determined depending on the degree of deformation. For example, as described above, with respect to the fixed object in which the center portion is caught, the material is sequentially energized from one end toward the other end. With regard to the defendant still standing in the peripheral part (the central part rises), it energizes sequentially from the central part toward the peripheral part. In order to measure the degree of deformation of the substrate 18, a non-contact displacement sensor such as a laser displacement sensor, a three-dimensional image inspection system, or the like is used. The control unit CTL shown in Fig. 4 controls the measurement of the deformation degree of the substrate 18, the value of the voltage applied to the electrode of the electrostatic chuck 15, the order of energizing the electrode, and the like.

In each of the embodiments, a substrate (functional member) having an opening may be used. Examples of the substrate having the opening include a lead frame and a printed board having an opening. A substrate having an opening and a resin adhesion preventive film having no adhesiveness are laminated to form a laminate. The stacked body is brought into close contact with the mold surface by the attractive force caused by the static electricity generated by the electrostatic chuck 15. [ The resin adhesion preventive film and the substrate having the opening may be successively brought into close contact with the upper mold surface by the attractive force caused by the static electricity generated by the electrostatic chuck 15. Thereby, first, the substrate having the opening and the resin adhesion prevention film can be brought into close contact with the mold surface without using the adhesive film. Secondly, occurrence of resin burrs on the back surface of the substrate having the opening (surface contacting the resin adhesion preventing film) can be prevented.

In each embodiment, a resin material made of a thermosetting resin was used. As the thermosetting resin, for example, an epoxy resin, a silicone resin and the like can be used. A resin material made of a thermoplastic resin may be used.

An example has been described in which the cavity 13 is formed in the lower mold 11 having the peripheral member 9 and the bottom member 10 as the molding die 12 to which the present invention is applied. The present invention is not limited to this, and the cavity 13 may be formed in the lower mold integrally configured. In addition, the cavity 13 may be formed in the upper die 8, and the cavity 13 may be formed in both the upper die 8 and the lower die 11. An intermediate mold may be provided between the upper mold 8 and the lower mold 11. [ The mold surface of the intermediate mold may constitute the mold surface of the cavity 13.

The present invention is also applied to a resin molding apparatus and a resin molding method for molding a general resin molded article. In other words, the present invention is also applied to the case where an optical product and other resin molded articles (resin products) are produced by a resin molding technique. As the film used in this case, in addition to the resin adhesion prevention film, there can be mentioned a transfer film used when transferring a pattern or the like to the surface of the cured resin included in the resin molded article. Optical products, resin molded articles, and the like correspond to functional members.

The present invention is not limited to the above-described embodiments, and may be arbitrarily combined, modified, or selected as necessary within the scope of the present invention. In the following description, each symbol in the "Description of Symbols" corresponds to each member in each embodiment, and further corresponds to each component in the claims defining the scope of rights of the present invention.

1A, 1B: resin sealing device 2: molding module
3: Lower mold base 4: Tie bar
5: Upper mold base 6:
7: mold opening / closing mechanism 8: upper mold (type 2, type 1)
9: circumferential surface member 10: bottom surface member
11: lower mold (first type, second type) 12: molding type
13: Cavity 14: Elastic body
15: electrostatic chuck 16: release film (film)
17: chip 18: substrate (functional member)
19: release film 20: molten resin (fluid resin)
21: hardened resin 22: molded product
23: Products (electronic parts) 24: Board supply / storage module
25A, 25B, 25C: forming module 26: material supplying module
27: pre-sealing substrate 28: pre-sealing substrate supplying portion
29: Sealed substrate 30: Sealed substrate supply part
31:
32: Substrate transport mechanism (member supply mechanism)
33: release film feeding mechanism (film feeding mechanism)
34: XY table 35: release film feeding mechanism
36: resin receiving frame 37: resin material feeding mechanism
38: Resin transport mechanism (resin supply mechanism) AR: Arrangement area
CTL: Control part D: Opening / closing direction
S1, P1, C1, M1:

Claims (16)

A mold opening and closing mechanism for opening and closing a mold (mold) having at least a first mold and a second mold opposite to each other, And a cavity formed in the molding die, the resin sealing apparatus being used in manufacturing an electronic component including a functional member,
An electrostatic chuck provided on the mold surface of the first mold,
And an arrangement region formed on the mold surface of the first mold so as to overlap the electrostatic chuck when the mold is viewed along the mold opening and closing direction and in which a film supplied from the outside of the mold is disposed,
The electrostatic chuck is energized so that the functional member is temporarily fixed to the mold surface of the first mold in a state in which the functional member is in close contact with the film,
Wherein at least a part of a main surface of the functional member is in fluidic resin produced from a resin material supplied from the outside of the cavity to the cavity, In addition,
Wherein at least a part of the main surface of the functional member is covered by the cured resin formed by curing the fluid resin. The film processing apparatus according to claim 1, further comprising: a film supply mechanism for disposing the film in the arrangement area;
A member supply mechanism for disposing the functional member over the arrangement area,
And a resin supply mechanism for supplying the resin material to the mold. The resin-sealing apparatus according to claim 1, wherein the film is temporarily fixed to the mold surface of the first mold by energizing the electrostatic chuck. The semiconductor device according to claim 1, wherein the functional member is a semiconductor substrate or a circuit board on which a chip is mounted,
Wherein the film is a resin adhesion preventive film. The electronic device according to claim 1, wherein the functional member has at least one of a heat radiation function or an electrostatic shield function,
Wherein the film is a resin adhesion preventive film. The resin-sealing apparatus according to claim 1, wherein the cavity includes a front surface and a side surface of the main surface of the functional member when the mold is closed. The molding apparatus according to any one of claims 1 to 6, further comprising at least one molding module having the molding die and the mold opening / closing mechanism,
Wherein the one molding module and another molding module can be attached and detached. A step of preparing a mold having at least a first mold and a second mold provided opposite to the first mold, and a step of arranging a film in an arrangement region in the mold so as to cover the cavity formed in the mold A step of placing a functional member overlaid on the film, a step of supplying a resin material to the mold, a step of closing the mold, and a step of molding the cavity by a fluid resin produced from the resin material A step of holding the mold in a closed state, a step of curing the fluid resin in the cavity to mold the cured resin, and a step of opening the mold, A resin sealing method for use in manufacturing an electronic component including the functional member,
Temporarily fixing the film to the mold surface of the first mold,
The electrostatic chuck provided on the mold surface of the first mold is energized so that the functional member and the film are brought into close contact with each other to temporarily hold the film between the mold surface of the first mold and the functional member, Comprising:
In the step of mold-closing the mold, at least a part of the main surface of the functional member is accommodated in the cavity,
Wherein in the step of molding the cured resin, at least a part of the main surface of the functional member is covered with the cured resin. The method according to claim 8, wherein a film supply mechanism is used in the step of disposing the film in the disposition area,
In the step of disposing the functional member, a member supply mechanism is used,
Wherein a resin supply mechanism is used in the step of supplying the resin material. The resin encapsulation method according to claim 8, further comprising a step of temporarily fixing the film to the mold surface of the first mold by energizing the electrostatic chuck. 9. The semiconductor device according to claim 8, wherein the functional member is a semiconductor substrate or a circuit board on which a chip is mounted,
Wherein the film is a resin adhesion preventive film. 9. The electronic device according to claim 8, wherein the functional member has at least one of a heat radiation function or an electrostatic shield function,
Wherein the film is a resin adhesion preventive film. The resin sealing method according to claim 8, wherein, in the step of molding the cured resin, the front surface and the side surface of the main surface of the functional member are covered with the cured resin. 14. The method according to any one of claims 8 to 13, comprising preparing at least one molding module having the mold and the mold opening / closing mechanism,
And the one molding module and the other molding module can be attached and detached. A first mold, a second mold disposed opposite to the first mold, and a cavity formed on at least one of the first mold and the second mold, As a molding die for resin sealing used in manufacturing electronic parts,
And an electrostatic chuck provided on the mold surface of the first mold,
Wherein a film is disposed in an arrangement region in the mold surface of the first mold,
Wherein the functional member is disposed over the film,
The electrostatic chuck is energized so that the functional member is temporarily fixed to the mold surface of the first mold in a state in which the functional member is in close contact with the film,
Wherein at least a part of the main surface of the functional member is covered with a cured resin formed by curing the fluid resin filled in the cavity when the mold is closed. The mold for molding a resin according to claim 15, wherein the film is temporarily fixed to the mold surface of the first mold by energizing the electrostatic chuck.
KR1020187015482A 2016-02-13 2017-01-30 Resin sealing apparatus, resin sealing method, and molding die for resin sealing KR20180115253A (en)

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JP2016025379A JP6491120B2 (en) 2016-02-13 2016-02-13 Resin sealing device, resin sealing method, and resin molded product manufacturing method
JPJP-P-2016-025379 2016-02-13
PCT/JP2017/003171 WO2017138386A1 (en) 2016-02-13 2017-01-30 Resin sealing device, resin sealing method, and mold for resin sealing

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CN112248339B (en) * 2019-07-22 2022-09-09 Oppo广东移动通信有限公司 Housing, method for manufacturing housing, and electronic apparatus
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CN112060448A (en) * 2020-08-28 2020-12-11 北京辉德商贸有限公司 Panel product forming die
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