JP2017107980A - Resin sealing device of electronic element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin sealing device for sealing resin so as to be sandwiched by an electronic substrate and a heat dissipation member, with less influence on the electronic substrate while responding to large size.SOLUTION: A resin sealing device includes an upper mold for fixing an electronic substrate, a lower mold for fixing a heat dissipation member to be paired with the electronic substrate, and a resin injection part for injecting resin into a sealing space formed between the electronic substrate and heat dissipation member. The lower mold has a recess for fixing the heat dissipation member to the bottom face, the electronic substrate closes the opening of the recess, the heat dissipation member is fixed to the bottom face of the recess, the sealing space is formed between the heat dissipation member and electronic substrate in the recess, and the resin injection part injects resin with the heat dissipation member as the bottom face, and fills the sealing space.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a resin sealing device that seals resin between a substrate on which an electronic element is mounted and a heat dissipation member.

  Many electronic devices, measuring devices, electrical devices, and transportation devices include an electronic board that processes electrical signals. Many electronic elements such as semiconductor elements and integrated circuits are mounted on these electronic substrates. A single semiconductor element, a semiconductor integrated element such as a microprocessor, or a power element utilizing a high voltage is mounted on an electronic substrate as an electronic element.

  An electronic board on which an electronic element is mounted operates by being stored in an electronic device or a measuring device. At this time, some of the mounted electronic elements are not preferable when exposed on the electronic substrate. In some cases, it is necessary to seal the electronic element with a resin in order to improve durability and compatibility with impact and the like.

  As described above, a resin sealing device that seals an electronic element (single or plural) mounted on an electronic substrate with a resin is used in various situations. A normal resin sealing device completely seals an electronic element mounted on an electronic substrate with a resin.

  When a resin is sealed on the surface of an electronic element mounted on such an electronic substrate, the electronic element may be mounted on a wide surface of the electronic substrate. In this case, the resin may seal over a wide range of the electronic substrate. As a result, a wide range of the mounting surface of the electronic substrate is sealed with the resin.

  On the other hand, heat generation of electronic elements tends to increase with the increase in integration and speed of electronic elements. Furthermore, along with the high density mounting of electronic elements on the electronic substrate, the entire electronic substrate tends to generate more heat. Such heat generation of the electronic element or the electronic substrate may affect the entire electronic element or the electronic substrate, and it is not preferable to leave it as it is. For this reason, it is necessary to mount a heat dissipation member on the surface of the resin after the mounting surface of the electronic substrate is sealed with the resin.

  At this time, in the sequential procedure of sealing the resin on the mounting surface of the electronic substrate and then mounting the heat dissipation member on the surface of the sealed resin, there is a problem that the labor and cost of work increase. Alternatively, problems such as resin sealing accuracy and a decrease in the degree of adhesion between the resin and the heat dissipation member occur (if the degree of adhesion is low, the thermal resistance between the electronic substrate and the heat dissipation member increases, and the heat dissipation capability of the heat dissipation member decreases. )

  For this reason, resin sealing is performed in which the resin is sandwiched between the electronic substrate and the heat dissipation member, and the electronic element is sealed with the resin (see, for example, Patent Document 1, Patent Document 2, and Patent Document 3). By such resin sealing, the electronic element mounted in the region sandwiched between the electronic substrate and the heat dissipation member is sealed with resin. Furthermore, the degree of adhesion between the resin and the heat radiating member increases, and the thermal resistance between the electronic substrate and the heat radiating member also decreases. Due to the decrease in the thermal resistance, the heat dissipation member can release the heat conducted from the electronic substrate through the resin to the outside.

  In this way, it is possible to seal the resin for the purpose of protecting the electronic element mounted on the electronic board and to release the heat from the electronic element on the premise that it is protected by the resin from the heat dissipation member. The

Japanese Patent Laid-Open No. 5-24075 JP 2004-259816 A JP-A-8-511168

  Patent Document 1 includes an upper die and a lower die, and a mover that is transported to a moving means, advances between the upper die and the lower die, and retreats between the upper die and the lower die. A mold press apparatus for an electronic component in which a non-mounting object to be mounted on the upper surface and the lower surface of the mold body is mounted, and suction means for sucking the non-mounted object is provided on the lower surface of the upper mold and the upper surface of the lower mold Is disclosed.

  Patent Document 1 can seal the resin between the electronic substrate and the heat sink with such a configuration. As a result, the resin is sandwiched between the electronic substrate and the heat sink, and the resin protects the electronic element mounted on the electronic substrate.

  However, the mold press apparatus of Patent Document 1 is only installed at a place where resin sealing is performed after the electronic substrate and the heat sink are attracted and moved. If the electronic board or heat sink is small, there is no problem, but if the electronic board or heat sink is large, the heat sink or electronic board will bend when the heat sink and electronic board are installed above and below, respectively. There's a problem. If the resin is sealed between the heat sink and the electronic substrate in the bent state, the heat sink and the electronic substrate may be adversely affected. Patent Document 1 aims to seal a single semiconductor conductor integrated circuit such as an IC or LSI.

  That is, Patent Document 1 assumes a single semiconductor integrated circuit as an object to be sealed, and does not assume a large electronic substrate on which many electronic elements are mounted. That is, it is assumed that a small-sized electronic substrate on which a single semiconductor integrated circuit such as a CPU is mounted is sealed. In such a small electronic substrate and a heat sink set in the small-sized electronic substrate, resin-sealed Therefore, it is not necessary to consider bending when installing. In other words, the technique of Patent Document 1 has a problem that it is not suitable for sealing a resin between a large electronic substrate or a large heat sink that is combined with the large electronic substrate.

  In the technique of Patent Document 1, an electronic substrate, a heat sink, and a sealing resin unit are set in a mold for molding simultaneously. When the resin is sealed on the electronic substrate and the heat sink, it is necessary to heat the electronic substrate and the heat sink. During the heating of the electronic substrate and the heat sink, the resin starts to cure, and there is a problem that the resin sealing becomes insufficient.

  Furthermore, in the technique of Patent Document 1, a heat sink is installed on the upper mold on the upper side, an electronic board is installed on the lower mold on the lower side, and resin is poured between the heat sink and the electronic board. At this time, since the electronic substrate is on the lower side, there is a problem that pressure is applied to the wire of the electronic substrate when the resin flows. The application of pressure may have an adverse effect on wire bonding and the like.

  Patent Document 2 discloses a work loading device in which a die access unit that is accessible by moving forward and backward to a mold in the same direction as the work holding portion is integrated with a loading device main body having a work holding portion that holds a workpiece. Disclose.

  Patent Document 2 also discloses a technique in which an electronic substrate as a work and a heat spreader are set up and down and the space is sealed with a resin.

  However, each of the electronic substrate and the heat spreader is set in the mold at different timings. The electronic substrate and the heat spreader are finally sandwiched together with resin, but there is a problem that it takes time to set by setting at different timings. In addition, since they are set in the mold at different timings, the heating times of the electronic substrate and the heat spreader are different, and there is a problem that the accuracy of sealing with the resin is lowered.

  Further, as in Patent Document 1, when the electronic substrate and the heat spreader are enlarged, there is a problem that the electronic substrate and the heat spreader bend during setting to the mold and resin sealing time. If it bends, the problem of the precision of resin sealing, the performance of the sealed electronic substrate, etc. may occur.

  In Patent Document 3, a substrate 12 is clamped with a lower mold provided with a set portion for setting a substrate at a predetermined position and an upper mold provided with a cavity recess for resin-sealing a semiconductor chip, and the cavity is filled with resin. Disclosed is a BGA package in which a mold die used for manufacturing a BGA package to be molded is provided with a suction hole that is connected to a vacuum suction mechanism on the inner surface of a cavity recess and allows a heat sink to be vacuum-sucked.

  Patent Document 3 also discloses a technique for sealing a resin between an electronic substrate and a heat sink.

  However, in Patent Document 3, as in Patent Document 1, the electronic substrate is set in the lower mold and the heat sink is set in the upper mold. After this setting, the resin is poured into the space between the electronic substrate and the heat sink. For this reason, there is a problem that various defects occur due to the pressure of the resin flowing into the wires of the electronic substrate.

  The technique of Patent Document 3 discloses that the heat sink is set in a state of being warped in advance and the heat sink is flattened by pulling back the resin. However, there is a problem that the heat sink remains deformed or is pulled by the deformation pressure of the heat sink, causing warpage of the electronic substrate and resin sealing. If warpage occurs in the electronic board, problems in mounting electronic components also occur.

  The prior art device for sealing resin by sandwiching an electronic substrate and a heat radiating member has the above problems.

  In view of the above problems, the present invention provides a resin sealing device in which resin is sealed in a form sandwiched between an electronic substrate and a heat radiating member, and is less likely to affect the electronic substrate while accommodating an increase in size. With the goal.

In view of the above problems, the resin sealing device of the present invention includes an upper mold for fixing an electronic substrate,
A lower mold for fixing a heat dissipating member paired with an electronic substrate;
A resin injection part for injecting resin into a sealing space formed between the electronic substrate and the heat dissipation member,
The lower mold has a recess for fixing the heat dissipating member to its bottom surface,
The electronic board closes the opening of the recess,
The heat dissipation member is fixed to the bottom surface of the recess,
The sealing space is formed between the heat dissipation member and the electronic substrate in the recess,
The resin injecting portion is injected with the heat radiating member as a bottom surface to fill the sealing space.

  The resin sealing device of the present invention does not affect the mounting state on the electronic substrate when sealing the resin between the electronic substrate and the heat dissipation member. Further, even when the electronic substrate and the heat dissipation member are enlarged, the electronic substrate and the heat dissipation member can be sealed with resin without causing deflection. As a result, the sealing accuracy and the shape accuracy of the resin sealing can be improved in a form in which the electronic substrate and the heat dissipation member sandwich the resin.

  In addition, the correlation between the heating of the electronic substrate and the heat dissipation member and the time until the resin is cured can be optimized, and it is difficult to cause defects in resin sealing on the mounting surface of the electronic substrate. For example, a void that does not enter the resin is not generated.

  As a result, the mounting surface of the electronic substrate can be reliably sealed without affecting the performance and shape of the electronic substrate and the heat dissipation member. This reliable sealing makes it difficult for voids to form at the boundaries of the electronic substrate, the resin, and the heat dissipation member, reduces the thermal resistance, and allows the heat dissipation member to efficiently release heat from the electronic substrate. .

It is a side view of the electronic member sealed with resin in Embodiment 1 of this invention. It is a schematic diagram of the resin sealing apparatus in Embodiment 1 of this invention. It is a side view which shows the state with which the upper mold | type and the lower mold | type in Embodiment 1 of this invention were united. It is a schematic diagram which shows the state in which resin in Embodiment 1 of this invention is inject | poured. It is a schematic diagram of the bottom face of the upper mold in Embodiment 1 of the present invention. It is a side view which shows the suction in the upper suction part and the lower suction part in Embodiment 1 of this invention. It is a top view of the transport part in Embodiment 2 of this invention. It is a schematic diagram which shows the transport state by the transport part in Embodiment 2 of this invention. The inside of the transport part 80 is in a visible state and shows a state viewed from the side.

A resin sealing device according to a first aspect of the present invention includes an upper mold for fixing an electronic substrate,
A lower mold for fixing a heat dissipating member paired with an electronic substrate;
A resin injection part for injecting resin into a sealing space formed between the electronic substrate and the heat dissipation member,
The lower mold has a recess for fixing the heat dissipating member to its bottom surface,
The electronic board closes the opening of the recess,
The heat dissipation member is fixed to the bottom surface of the recess,
The sealing space is formed between the heat dissipation member and the electronic substrate in the recess,
The resin injecting portion is injected with the heat radiating member as a bottom surface to fill the sealing space.

  With this configuration, in the sealed space into which the resin is injected, the bottom surface side is a heat dissipation member and the top surface side is an electronic substrate.

  In the resin sealing device according to the second aspect of the present invention, in addition to the first aspect, the size of the opening of the recess is smaller than the size of the electronic substrate.

  With this configuration, the electronic substrate can use the upper part of the sealing space as a lid. By being a lid, there is a merit that the resin does not spread outside the sealed space when the resin is injected into the sealed space.

  In the resin sealing device according to the third aspect of the present invention, in addition to the first or second aspect, the bottom surface has a shape that does not cause a gap between the heat radiation member and the heat radiating member fixed to the bottom surface. .

  With this configuration, the heat radiating member is completely fitted on the bottom surface, so that the resin layer formed in the sealed space does not leak to the surface of the heat radiating member.

  In the resin sealing device according to the fourth aspect of the present invention, in addition to any one of the first to third aspects, the upper mold further includes an upper suction portion that sucks the electronic substrate upward.

  With this configuration, the electronic substrate is fixed without dropping or shifting until the upper die and the lower die are combined.

  In the resin sealing device according to the fifth aspect of the present invention, in addition to any one of the first to fourth aspects, the lower mold further includes a lower suction portion that sucks the heat radiating member downward.

  With this configuration, it is difficult for the heat dissipation member to shift its position until the upper die and the lower die are combined. In addition, it is difficult to form a gap between the bottom surface of the concave portion, and problems such as resin leaking out to the surface of the heat dissipation member during resin sealing are unlikely to occur.

  In the resin sealing device according to the sixth aspect of the present invention, in addition to the fifth aspect, at least one of the upper suction portion and the lower suction portion is while the resin is being injected into the sealing space from the resin injection portion. Also, the suction operation is continued.

  With this configuration, the position and angle of the electronic substrate and the heat radiating member are unlikely to shift due to the pressure when the resin is injected.

  In the resin sealing device according to the seventh aspect of the present invention, in addition to any of the first to sixth aspects, the resin injection portion is provided on the side surface of the sealing space.

  With this configuration, since the resin is injected from the side surface of the sealing space, the resin can be efficiently and reliably injected into the sealing space wide in the side surface direction. As a result, it is difficult to generate voids or the like in the resin layer.

  In the resin sealing device according to the eighth aspect of the present invention, in addition to the seventh aspect, a plurality of resin injection portions are provided on the side surface of the sealing space.

  With this configuration, the resin can be reliably injected into a large sealing space in the side surface direction. In addition, the time until resin injection is completed can be shortened.

In addition to any one of the first to eighth inventions, the resin sealing device according to the ninth invention of the present invention further includes a transport section for transporting at least one of the electronic substrate, the heat dissipation member, and the resin,
The transportation department
An electronic board holding unit for holding an electronic board to be transported;
A heat dissipating member holding part for holding a heat dissipating member to be transported;
A resin holding part for holding the resin to be transported,
The resin holding part is isolated from the electronic substrate holding part and the heat dissipation member holding part.

  With this configuration, the transport unit can transport the electronic substrate or the like from the housing unit to the upper mold or the like. In transportation, a pair of electronic substrates to be sealed, a heat radiating member, and a resin can be transported in one set. Furthermore, since the resin holding part is isolated from the electronic board holding part or the like, the resin is not easily affected by the heat of the electronic board or the like.

In the resin sealing device according to the tenth invention of the present invention, in addition to the ninth invention, the transport section is
An electronic board gripping part that holds the electronic board taken out from the electronic board holding part and is installed in the upper mold,
Grasping the heat radiating member taken out from the heat radiating member holding part and installing it in the lower mold,
Gripping the resin taken out from the resin holding part, and equipped with a resin gripping part installed in the resin injection part,
The resin gripping portion causes the resin holding portion to wait while the electronic substrate and the heat dissipation member are installed.

  With this configuration, the electronic substrate or the like transported to the vicinity of the upper mold or the like by the transport unit is installed at a predetermined position such as the upper mold or the like by the grip unit. Further, since the resin stands by in the transport section until the pair of electronic substrates to be sealed and the heat radiating member are installed, the resin is not easily affected by the heat of the electronic substrate or the like.

  In the resin sealing device according to the eleventh aspect of the present invention, in addition to the tenth aspect, the electronic substrate gripping portion and the heat dissipation member gripping portion are arranged so that the electronic substrate and the heat dissipation member are substantially the same as the upper mold and the lower portion, respectively. Each of the pair of electronic substrates and the heat dissipating members that are installed and sealed in the mold is fixed to the upper mold and the lower mold substantially simultaneously.

  With this configuration, the electronic substrate and the heat dissipation member can be set one after another for resin sealing. In addition, the working efficiency of resin sealing can be improved by simultaneous setting.

  In the resin sealing device according to the twelfth invention of the present invention, in addition to the tenth or eleventh invention, the electronic substrate gripper corrects the deflection of the electronic substrate when the electronic substrate is installed in the upper mold. The electronic substrate holding part has a heat radiation member holding part that corrects the deflection of the heat radiation member when the heat radiation member is installed in the lower mold.

  With this configuration, a large or thin electronic substrate or heat dissipation member can be installed in the upper mold and the lower mold without bending. Subsequent to this installation, the electronic substrate and the heat dissipating member are sucked and fixed without bending.

  In the resin sealing device according to the thirteenth aspect of the present invention, in addition to the twelfth aspect, the electronic substrate pressing portion has a heating portion for heating the electronic substrate, and the heat dissipation member pressing portion heats the heat dissipation member. It has a heating part.

  With this configuration, the electronic substrate and the heat radiating member are preheated, and a smooth spread of the resin in the resin injection can be realized.

  In the resin sealing device according to the fourteenth aspect of the present invention, in addition to the thirteenth aspect, each of the electronic substrate heating section and the heat radiation member heating section can independently control heating.

  With this configuration, heating according to the characteristics of the electronic substrate and the heat dissipation member can be realized. By this heating, easiness of spreading of the resin and improvement in accuracy of resin sealing can be realized.

  In the resin sealing device according to the fifteenth invention of the present invention, in addition to any of the tenth to fourteenth inventions, the resin gripping portion is provided after the pair of electronic substrates to be sealed and the heat dissipation member are installed. The resin is placed in the resin injection part.

  With this configuration, the resin is injected into the formed sealing space before the molten state of the resin melted by heating decreases.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(State of resin sealing)
First, the resin-sealed electronic member manufactured by the resin sealing device of the present invention will be described. FIG. 1 is a side view of a resin-sealed electronic member according to Embodiment 1 of the present invention.

  In the resin-sealed electronic member 100, the resin 70 is sealed between the electronic substrate 50 and the heat dissipation member 60. Thus, the resin sealing device of the present invention seals the electronic substrate 50 and the heat dissipation member 60 in a sandwich-like manner via the resin layer 70.

  By this sealing, the electronic component mounted on the electronic substrate 50 is sealed with the resin 70, and the electronic component is protected. Further, the heat dissipation member 60 is connected to the surface of the electronic substrate 50 by the resin layer 70. With such a sandwich structure, the electronic component of the electronic substrate 50 is protected by the resin layer 70 and heat from the electronic component can be released to the outside by the heat dissipation member 60.

  In this way, resin sealing in which the electronic substrate 50 and the heat dissipation member 60 are integrated can be realized.

(Overview)
FIG. 2 is a schematic diagram of the resin sealing device according to Embodiment 1 of the present invention. The resin sealing device 1 includes an upper mold 2, a lower mold 3, and a resin injection part 4. FIG. 2 is a state seen from the side surface of the resin sealing device 1 and shows the internal structure necessary for explanation in a visible state.

  The upper mold 2 fixes the electronic substrate 50. The fixing means that the electronic substrate 50 is not connected, welded, bonded, or the like, but is placed at a position necessary for the resin sealing operation by the resin sealing device 1. .

  The upper mold | type 2 has the dent 21 in the bottom face as needed. In the upper mold 2, the electronic substrate 50 may be fixed to the recess 21. In FIG. 2, the electronic substrate 50 is fixed to the recess 21. For this reason, it is preferable that the recess 21 has the same shape and area as the electronic substrate 50. The upper mold 2 can fix the electronic substrate 50 accurately at a position necessary for resin sealing by fixing the electronic substrate 50 to the recess 21.

  As will be described later, the electronic substrate 50 needs to be installed at a position to be paired with the heat dissipation member 60 fixed to the lower mold 3. For this reason, fixing the electronic substrate 50 to the recess 21 on the bottom surface of the upper mold 2 meets this purpose.

  An electronic component 50 is mounted on the electronic substrate 50. The resin sealing device 1 seals the electronic component 80 (the surface on which the electronic component 80 is mounted) with a resin. Therefore, as shown in FIG. 2, the upper mold 2 fixes the electronic substrate 50 so that the mounting surface of the electronic component 80 faces downward. If the resin layer 70 is formed between the electronic substrate 50 and the heat dissipation member 60 by such fixing, the electronic component 80 is sealed with resin.

  The lower die 3 is paired with and opposed to the upper die 2. The lower mold 3 fixes a heat radiating member 60 that is paired with the electronic substrate 50 when performing resin sealing as shown in FIG. Fixing here also has the same meaning as fixing with the upper die 2.

  The lower mold 3 includes a recess 5. The recess 5 is formed to be recessed downward from the upper surface of the lower mold 3. The lower mold 3 fixes (installs) the heat radiating member 60 on the bottom surface 53 of the recess 5. In other words, the heat dissipation member 60 is placed on the bottom surface 53 of the recess 5. By this fixing, the positional relationship between the electronic substrate 50 on the upper side and the heat radiation member 60 on the lower side is established and the positional relationship is opposed. Due to this positional relationship, after resin sealing, the configuration is as shown in FIG.

  FIG. 3 is a side view showing a state where the upper die and the lower die are combined in the first embodiment of the present invention. FIG. 3 shows a state after the upper die 2 and the lower die 3 are brought close to each other on the opposing surface and are brought together.

  As can be seen from FIG. 3, when the upper mold 2 and the lower mold 3 are combined (fitted), the electronic substrate 50 closes the opening 51 at the top of the recess 5. That is, the electronic substrate 50 serves as a lid for the recess 5. Since the heat dissipating member 60 is fixed to the bottom surface 53 of the recess 5, a sealed space 55 is formed between the electronic substrate 50 and the heat dissipating member 60 above the opening 51 serving as a lid.

  The resin injection part 4 injects the resin 40 into the sealing space 55. By injecting the resin 40, the sealing space 55 is filled with the resin. After the filling, when the resin is cured, a resin layer 70 is formed between the electronic substrate 50 and the heat dissipation member 60.

  FIG. 4 is a schematic diagram showing a state where the resin in the first embodiment of the present invention is injected. An arrow in FIG. 4 indicates a direction in which the resin 40 is injected into the sealing space 55 through the resin injection portion 4. The resin injecting unit 4 sends the resin 40 into the sealing space 55 along the path along the arrow when the resin pressing unit 41 presses the molten resin 40 installed in the resin pot 42.

  As the resin 40 is injected from the resin injection portion 4, the sealing space 55 is gradually filled with the resin 40. FIG. 4 shows a state in which the sealing space 55 is gradually filled with the resin 40. At this time, in the sealed space 55, the resin 40 is filled with the heat dissipation member 60 as a bottom surface and the electronic component 50 as an upper lid. Eventually, all of the sealed space 55 is filled with the resin 40.

  The filled resin 40 is cured when a predetermined time elapses. By this curing, the resin layer 70 is formed between the electronic substrate 50 and the heat dissipation member 60. By this formation, resin sealing with a sandwich structure as shown in FIG. 1 is realized.

  Here, as shown in FIGS. 2 to 4, the resin 40 is injected into the sealing space 55 with the electronic substrate 50 on the upper side and the heat dissipation member 60 on the lower side. The resin 40 moves downward according to gravity as shown in FIG. For this reason, the movement (flow) pressure of the resin 40 is applied below the bottom surface of the sealing space 55. This bottom surface is the heat dissipation member 60. The heat radiating member 60 does not mount the electronic component 80 unlike the electronic substrate 50. For this reason, even if the moving pressure of the injected resin is applied, the structure and function of the heat dissipation member 60 are not affected.

  Conversely, when the bottom side is an electronic board as in the prior art, the moving pressure of the resin is applied to the mounting surface of the electronic board, which may adversely affect the mounting of electronic components and wiring. is there.

  In the resin sealing device 1 according to the first embodiment, the sealing space 55 is formed with the electronic substrate 50 on the upper side and the heat dissipation member 60 on the lower side. As a result, when the resin 40 is injected into the sealing space 55, the mounting pressure of the electronic component 80 is not affected by the moving pressure of the resin.

  Further, since the electronic substrate 50 covers the entire upper portion of the sealing space 55 as a lid, the resin does not leak except between the electronic substrate 50 and the heat dissipation member 60 in the resin injection in the sealing space 55.

  Further, a heat dissipation member 60 is installed on the bottom surface 53 of the recess 5. The resin 40 is injected into the sealed space 55 formed in the installed state as shown in FIG. Since the sealing member 60 is installed with the bottom surface 53 in contact with the surface thereof, the injected resin 40 does not enter between the bottom surface 53 and the surface of the heat dissipation member 60. As a result, the resin 40 can be prevented from adhering to the surface of the heat dissipation member 60.

  In addition, when the heat radiating member 60 fits smoothly corresponding to the outer shape of the recess 5, the resin does not adhere to the outer periphery of the heat radiating member 60. In this way, when the resin 40 is injected, the heat radiation member 60 is installed in the lower mold 3 and the electronic substrate 50 is installed in the upper mold 2, so that the resin 40 is sealed in the resin sealing. It is difficult to cause problems such as sticking to the surface of the electronic substrate or leaking to the outer periphery of the electronic substrate 50.

  As a result, the resin sealing device 1 can realize resin sealing as shown in FIG. 1 in which a resin layer 70 having a sandwich structure is formed between the electronic substrate 50 and the heat dissipation member 60.

  Next, the detail of each part is demonstrated.

(Upper type)
The upper mold 2 fixes the electronic substrate 50. Furthermore, by approaching and facing the lower mold 3, it is combined with the lower mold 3 to form a sealed space 55 as shown in FIG.

  The upper mold 2 may include a recess 21 so that the electronic substrate 50 can be fixed. By fixing the electronic substrate 50 to the recess 21, the electronic substrate 50 can be reliably fixed. Further, since the outer shape and area of the recess 21 are equal to those of the electronic substrate 50, the electronic substrate 50 fits exactly into the recess 21. This matching further secures the electronic substrate 50.

  At this time, the upper mold | type 2 should just be able to fix the some electronic substrate 50. FIG. Here, fixing means dropping the electronic substrate 50 or shifting the position in the operation of bringing the upper mold 2 close to the lower mold 3 in order to form the sealed space 55 as shown in FIG. Say to reduce.

  For this fixing, it is also preferable that the upper mold 2 further includes an upper suction part 22 that sucks the electronic substrate 50 upward. In FIG. 2 etc., the upper mold | type 2 is equipped with the upper suction part 22 is shown. The upper suction part 22 has a suction function, and sucks the electronic substrate 50 upward by the suction function. By this suction, the electronic substrate 50 is fixed so as to stick to the bottom surface of the upper mold 2.

  The upper suction part 22 is connected to a suction device at one end. For example, it is connected to a suction pump or an air cylinder. By connecting with the suction device, the upper suction part 22 can suck air upwards of the electronic substrate 50.

  The upper suction part 22 may be single or plural for one of the electronic substrates 50. In the case where a plurality of upper suction portions 22 are provided for one electronic substrate 50, the flat electronic substrate 50 is attracted upward in a well-balanced range. Due to this balanced suction, the upper mold 2 is less likely to drop the electronic substrate 50 or change its position during movement or proximity operation.

  FIG. 5 is a schematic diagram of the bottom surface of the upper mold according to Embodiment 1 of the present invention. In FIG. 5, two dents 21 are provided on the bottom surface of the upper mold 2. That is, the upper mold 2 can fix the two electronic substrates 50. An upper suction portion 22 is provided in each of the recesses 21. Since the upper suction part 22 sucks the electronic substrate 50 fitted in the recess 21, the upper suction part 22 is located in the recess 21. In FIG. 5, four upper suction portions 22 are provided in one recess 21. The four corners of the rectangular electronic substrate 50 can be sucked and fixed in a balanced manner.

  FIG. 6 is a side view showing suction in the upper suction portion and the lower suction portion in Embodiment 1 of the present invention.

  An arrow A in FIG. 6 indicates a state in which the upper suction unit 22 is sucking the electronic substrate 50 upward. The electronic substrate 50 is fixed to the bottom surface of the upper mold 2 by this suction.

(Lower type)
The lower mold 3 is a pair of members that are positioned to face the upper mold 2. The lower mold 3 fixes the heat radiating member 60. The lower mold 3 includes a concave portion 5, and the concave space 5 faces the upper die 2 (by facing the electronic substrate 50 fixed to the upper die 2), so that a sealed space 55 can be formed. .

  The lower mold 3 includes a recess 5 that can fix the heat dissipation member 60 and form a sealed space. The recess 5 is an element that is recessed downward from the upper surface of the lower mold 3. The heat radiating member 60 is installed and fixed on the bottom surface 53 of the recess 5.

  The lower die 3 only needs to be able to fix one or a plurality of heat dissipating members 60. For this reason, the lower mold | type 3 should just be provided with the recessed part 5 matched with the number of the heat radiating members 60 to fix. In addition, since resin sealing is performed together with the upper die 2, the number and positions of the recesses 5 included in the lower die 3 correspond to the number of electronic substrates 50 to which the upper die 2 is fixed.

  The recess 5 has an opening 51. Resin sealing is performed by placing the electronic substrate 50 on the opening 51 like a lid. For this reason, it is preferable that the size of the opening 51 is smaller than the size of the electronic substrate 50. As a result, the electronic substrate 50 can cover the upper portion of the sealing space 55 when contacting the lower mold 3. By covering the entire upper portion of the sealing space 55, the resin 40 injected into the sealing space 55 does not leak out from the opening 51.

  The recess 5 fixes the heat radiating member 60 to the bottom surface 53 thereof. Here, the bottom surface 53 of the recess 5 has a surface shape such that no gap is generated between the bottom surface 53 and the heat dissipation member 60. This is because the gap does not occur so that the resin 40 does not enter the surface of the heat dissipation member 60 after the resin 40 is injected into the sealing space 55.

  For example, if the heat dissipating member 60 is flat, the bottom surface 53 is also flat. Alternatively, if the heat dissipating member 60 has a curved shape, the bottom surface 53 preferably has a corresponding curved shape.

  Moreover, the recessed part 5 forms the sealing space 55 like FIG. At this time, the sealing space 55 is formed by the remaining space in which the heat dissipation member 60 is fixed to the bottom surface 53 of the recess 5. For this reason, the recess 5 preferably has a depth deeper than the thickness of the heat dissipation member 60.

  Conversely, the recess 21 of the upper mold 2 preferably has a depth equal to or less than the thickness of the electronic substrate 50. The electronic substrate 50 needs to cover the opening 51 like a lid. For this reason, when the upper mold | type 2 and the lower mold | type 3 are put together, it is because the electronic substrate 50 needs to be able to contact the circumference | surroundings of the opening part 51. FIG.

  Similar to the upper mold 2, the lower mold 3 only needs to be formed of a material such as a metal, an alloy, or a resin.

  It is also preferable that the lower mold 3 includes a lower suction portion 52 that sucks the heat radiating member 60 downward. The heat dissipation member 60 is fixed to the bottom surface 53 of the recess 5. In this state, resin is injected into the sealing space 55. There is a possibility that the heat radiating member 60 installed on the bottom surface 53 is moved by the injection pressure of the resin 40. If it moves, the resin 40 may enter between the surface of the heat dissipation member 60 and the bottom surface 53. Alternatively, there is a possibility of moving before resin injection.

  Since the lower suction part 52 sucks the heat radiation member 60 downward, it is possible to prevent the heat radiation member 60 from moving. Due to this prevention, the above-described problems are unlikely to occur.

  An arrow B in FIG. 6 indicates a direction in which the lower suction part 52 sucks the heat radiating member 60. By sucking downward, the heat dissipation member 60 is securely fixed to the bottom surface 53. Further, the lower suction part 52 may be provided in the recess 5. By being provided in the concave portion 5, the heat radiating member 60 installed on the bottom surface 53 of the concave portion 5 is sucked by the lower suction portion 52 and securely fixed.

  Here, it is also preferable that at least one of the upper suction portion 22 and the lower suction portion 52 perform the suction operation while the resin 40 is being injected from the resin injection portion 4. Since the suction operation is performed while the resin 40 is being injected, the electronic substrate 50 and the heat dissipation member 60 are not displaced due to the pressure during the resin injection.

(Resin injection part)
The resin injection part 4 injects the resin 40 into the sealing space 55 when the upper mold 2 and the lower mold 3 are close to each other and the sealing space 55 can be formed. In FIG. 4, the resin injection port 4 is provided on the side surface of the sealing space 55. By being provided on the side surface, the resin 40 can be easily filled into the sealing space 55. In addition, since the resin 40 accumulates from the lower side of the heat radiating member 60, the pressure of the resin 40 applied to the electronic substrate 50 tends to be low.

  Moreover, the some resin injection | pouring part 4 may be formed. For example, the resin injection part 4 may be provided on a plurality of side surfaces of the sealing space 55. This is because the filling of the resin 40 inside the sealed space 55 is ensured by injecting the resin 40 from the plurality of resin injection portions 4.

  As described above, the resin sealing device 1 according to the first embodiment can be sealed by forming the resin layer 70 between the electronic substrate 50 and the heat radiating member 60 without causing problems or the like.

  (Embodiment 2)

  Next, a second embodiment will be described.

  In the second embodiment, a mode of transporting the electronic substrate 50 to which the upper mold 2 is fixed, the heat radiation member 60 to which the lower mold 3 is fixed, and the like will be described.

  The upper mold 2 fixes one or a plurality of electronic substrates 50. This fixing is performed when the upper suction part 22 applies an upward suction pressure to the electronic substrate 50 in the recess 21. The upper mold 2 fixes the electronic substrate 50 to be sealed. At this time, the upper mold 2 fixes the number of electronic substrates 50 corresponding to the number of electronic substrates 50 (the number of heat dissipating members 60 to be sealed) sealed by the resin sealing device 1.

  On the other hand, the resin sealing device 1 wants to perform resin sealing of a larger number of electronic substrates 50 than the upper mold 2 can be fixed. Naturally, it is desired to perform resin sealing of a larger number of heat dissipating members 60 than the lower mold 3 can be fixed. The lower mold 3 seals the number of heat dissipating members 60 corresponding to the number of electronic substrates 50 to which the upper mold 2 is fixed.

  Under such circumstances, a certain amount of the electronic substrate 50 is accommodated in the electronic substrate accommodating portion 59. A necessary number of electronic substrates may be transported from the electronic substrate housing portion 59 and finally transported to the upper mold 2.

  Similarly, a certain amount of the heat radiation member 60 may be accommodated in the heat radiation member accommodation portion 69. The necessary number of heat dissipating members 60 may be transported from the heat dissipating member accommodating portion 69 and finally installed in the lower mold 3. Further, a certain amount of resin 40 (this resin 40 has a shape such as a tablet having a certain shape and is preferably transportable individually) is accommodated in the resin accommodating portion 49. . The required number of resins 40 may be transported from the resin container 49 and finally installed on the resin pod 42.

(Transportation Department)
The resin sealing device 1 further includes a transport unit that transports at least one of the electronic substrate 50, the heat radiating member 60, and the resin 40 from such an electronic substrate housing unit.

  FIG. 7 is a plan view of the transport section according to Embodiment 2 of the present invention. The resin sealing device 1 further includes the transport unit 80, and FIG. 7 shows the state of the transport unit 80 viewed from above with the internal features also visible.

  The transport unit 80 transports at least a part of the electronic substrate 50, the heat radiating member 60, and the resin 40 to be sealed by the upper mold 2 and the lower mold 3. At this time, as described above, the electronic substrate 50 taken out from the electronic board housing portion, the heat radiation member 60 taken out from the heat radiation member housing portion, and the resin 40 taken out from the resin housing portion are transported. The transport unit 80 can transport any one or two of the electronic substrate 50, the heat radiating member 60, and the resin 40, or a set of the electronic substrate 50 and the heat radiating member to be sealed with the upper mold 2 or the like. 60 and resin 40 can also be transported at once. FIG. 7 shows this state.

  In this way, the transport unit 80 includes the electronic substrate holding unit 25 that holds the electronic substrate 50 during transportation, the heat dissipation so that the electronic substrate 50, the heat radiation member 60, and the resin 40 necessary for the sealing operation can be transported at a time. A heat radiating member holding part 35 for holding the member 60 and a resin holding part 45 for holding the resin 40 are provided. Since each of these holding units holds the target article, the transport unit 80 can transport necessary electronic substrates 50 and the like collectively.

  Here, the resin 40 has a tablet form or the like as described above, and can be individually processed in transportation or installation in the resin pot 42. Therefore, as shown in FIG. 7, the resin holding portion 45 can hold and transport the resin 40 that can be grasped as a plurality of numbers.

  The resin holding part 45 is isolated from the electronic substrate holding part 25 and the heat dissipation member holding part 35. The transport unit 80 has a partition wall 81, and the partition wall realizes the above-described isolation. Due to this isolation, the resin 40 held by the resin holding part 45 is hardly affected by the heat from the electronic board holding part 25 and the heat radiating member 35. For this reason, the molten state of the resin 40 or the like hardly changes during the transportation time, and the resin 40 installed in the resin injection portion 4 is diffused into the sealed space 55 without any problem.

(Transportation by transportation department)
The transportation from the storage unit by the transportation unit 80 will be described. FIG. 8 is a schematic diagram showing a transport state by the transport section in Embodiment 2 of the present invention. FIG. 8 shows a state in which the transport unit 80 and elements related thereto are viewed from above. In FIG. 8, the same elements as those described in FIG. 7 and the same elements that can be grasped from the drawings in FIG.

  Outside the resin sealing device 1, an electronic substrate housing portion 59 that houses the electronic substrate 50, a heat radiating member housing portion 69 that houses the heat radiating member 60, and a resin housing portion 49 that houses the resin 40 are provided as necessary. . Here, it is preferable that the resin accommodating portion 49 is separated from the electronic substrate accommodating portion 59 and the heat dissipation member accommodating portion 69. This is because the heat from the electronic substrate 50 or the like is difficult to be transmitted to the resin 40 that is not preferably affected by heat due to the separation.

  The transport unit 80 moves between the resin housing unit 49, the electronic substrate housing unit 59, and the heat dissipation member housing unit 69 to transport the electronic substrate 50 and the like to the upper mold 2 and the like. At this time, the transport unit 80 can move in the X-axis and Y-axis directions as indicated by arrows in FIG. This movement line of the X axis can separate the resin housing portion 49 from other housing portions. In addition, by separating with the movement flow line, the resin 40 is less likely to be affected by heat when a member is picked up from each housing portion during transportation.

  The transport unit 80 picks up a necessary number of electronic substrates 50 from the electronic substrate housing unit 59, picks up a necessary number of heat dissipating members 60 from the heat dissipating member housing unit 69, and a necessary number of resins 40 from the resin housing unit 49. To pick up. As described above, the resin 40 has a form that can be grasped as the number of tablets. That is, it may be grasped as a resin material. In FIG. 8, the transport unit 80 picks up two electronic substrates 50 and the heat radiating member 60, and picks up three resins 40.

  For this reason, the electronic board holding part 25 holds the two electronic boards 50, the heat dissipation member holding part 35 holds the two heat dissipation members 60, and the resin holding part 45 holds the three resins 40. is there. In this state, the transport unit 80 starts transport.

  The transport unit 80 first transports the electronic substrate 50 and the heat dissipation member 60 to a region where the upper mold 2 and the lower mold 3 are opposed to each other. Transportation near the center of FIG. 8 shows this state. At this time, the electronic substrate 50 and the heat dissipation member 60 are transported to the upper mold 2 and the lower mold 3 substantially simultaneously. On the other hand, the resin 40 remains held in the transport unit 80. Since the electronic substrate 50 and the heat radiating member 60 to be sealed are installed in the upper mold 2 and the lower mold 3, the heat influence on the resin 40 can be prevented by being held.

  Next, the transport unit 80 transports the resin 40 to the resin pot 42. Thus, the member required for sealing can be installed in the place where sealing is performed by two steps of transportation. In addition, a member required for sealing can be transported with a single routine.

(Installation)
The transport unit 80 transports the electronic substrate 50 and the like to a place such as the upper mold 2. Following this transportation, the elements provided in the transportation unit 80 install the electronic substrate 50 or the like at a predetermined position such as the upper mold 2.

  FIG. 9 is an internal schematic diagram of the transport section according to Embodiment 2 of the present invention. FIG. 9 shows a state where the inside of the transport unit 80 is visible and viewed from the side.

  The transport unit 80 includes an electronic substrate gripping unit 26 that grips the electronic substrate 50 taken out from the electronic substrate holding unit 25 and is installed on the upper mold 2. The transport unit 80 includes a heat radiating member gripping portion 36 that grips the heat radiating member 60 taken out from the heat radiating member holding portion 35 and is installed in the lower mold 3. Further, the transport unit 80 includes a resin gripping unit 46 that grips the resin 40 taken out from the resin holding unit 45 and installs the resin 40 in the resin pot 42.

  As described with reference to FIG. 8, the transport unit 80 transports the held electronic substrate 50 or the like to the upper mold 2 or the like. At this time, it is transported to a region where the upper mold 2 and the like are provided. The transported electronic substrate 50 or the like needs to be installed on the upper mold 2 or the like as described in the first embodiment.

  The electronic board holding part 26 performs an operation of finally installing and fixing the electronic board 50 in the upper mold 2 (the recess 21). As shown in FIG. 9, the electronic board holding unit 26 holds the electronic board 50 and enables stable movement. In gripping, it is also preferable to perform stable gripping by supporting the outer periphery of the electronic substrate 50 on a flat plate.

  The electronic board holding unit 25 includes an electronic board holding unit 26. Since the electronic board holding unit 26 holds the electronic board 50, the electronic board holding unit 25 can The substrate 50 may be held. In this case, the electronic board holding part 26 takes out the electronic board 50 from the electronic board housing part 59 and moves it to the electronic board holding part 25.

  That is, the transport unit 80 includes the electronic substrate gripping unit 26 that can move the position of the gripped electronic substrate 50 so that the electronic substrate 50 can be taken out of the electronic substrate storage unit 59, and the electronic substrate holding unit 25 can Holding, moving and setting to the upper mold 2 can be performed.

  The heat radiating member gripping portion 36 performs an operation of finally installing and fixing the heat radiating member 60 in the lower mold 3 (the concave portion 51 thereof). As shown in FIG. 9, the heat dissipating member gripping part 36 grips the heat dissipating member 60 and enables stable movement. In gripping, it is also preferable to perform stable gripping by supporting the outer periphery of the heat dissipation member 60 on the flat plate.

  The heat radiating member holding portion 35 includes a heat radiating member gripping portion 36. Since the heat radiating member gripping portion 36 is in a state of gripping the heat radiating member 60, the heat radiating member holding portion 35 radiates heat inside the transport portion 80. The member 60 may be held. In this case, the heat radiating member gripping part 36 takes out the heat radiating member 60 from the heat radiating member accommodating part 69 and moves it to the heat radiating member holding part 35.

  That is, the transport unit 80 includes the heat radiating member gripping part 36 that can move the position of the gripped heat radiating member 60 so that the heat radiating member 60 is taken out from the heat radiating member accommodating part 69 and the heat radiating member holding part 35 Holding and moving / setting to the lower mold 3 can be performed.

  The resin member gripping portion 46 also performs the same operation as the heat radiation member gripping portion 36. The resin 40 is taken out from the resin container 49 and held in the resin holder 45. During this holding, the transport unit 80 moves and approaches the resin pot 42. The resin gripping portion 46 is installed by moving the gripped resin 40 to the resin pot 42.

  Here, the resin gripping portion 46 causes the resin holding portion 45 to wait while the electronic substrate 50 and the heat dissipation member 60 are installed. Due to this standby, the resin 40 is not easily affected by the heat of the electronic substrate 50 and the heat dissipation member 60. Of course, the heat of the upper mold 2 and the lower mold 3 is not easily affected.

  The electronic substrate gripping part 26 and the heat dissipation member gripping part 36 install the electronic substrate 50 and the heat dissipation member 60 to be sealed on the upper mold 2 and the lower mold 3 almost simultaneously. That is, the electronic substrate gripping unit 26 installs the electronic substrate 50 to be sealed on the upper mold 2, and in accordance with the timing of this installation, the heat dissipation member gripping unit 36 Install in the lower mold 3.

  By such almost simultaneous installation, the pair of electronic substrates 50 and the heat radiating member 60 to be sealed in the sealing process are installed at a place necessary for sealing. By being installed at the same time, the efficiency of the sealing work is improved.

  Further, the electronic substrate gripping unit 26 grips and moves the electronic substrate 50 upward. By moving in this state, the electronic substrate 50 can be installed in the recess 21 on the bottom surface of the upper mold 2. The heat radiating member gripping portion 36 grips and moves the heat radiating member 60 downward. By moving in this state, the heat radiating member 60 can be installed in the recess 31 on the upper surface of the lower mold 3.

(Presser part)
The electronic board holding part 26 has an electronic board holding part 27. The electronic substrate holding unit 27 corrects the deflection of the electronic substrate 50 during the period from when the electronic substrate 50 is gripped to when the electronic substrate 50 is installed on the upper mold 2. In particular, the deflection of the electronic substrate 50 is corrected when it is installed in the upper mold 2. The electronic substrate pressing part 27 can maintain the planarity of the electronic substrate 50 by applying a pressure that pushes the electronic substrate 50 upward from the bottom in a plane. By installing the electronic substrate 50 in the state in which the deflection is corrected and the flatness is maintained on the upper mold 2, the electronic substrate 50 reaches the recess 21 without the deflection.

  As described in the first embodiment, the upper mold 2 sucks the electronic substrate 50 upward. By this suction, the electronic substrate 50 installed without bending in the recess 21 is fixed in the recess 21 without causing deflection as it is.

  The heat radiating member gripping portion 36 has a heat radiating member pressing portion 37. The heat radiating member pressing portion 37 corrects the deflection of the heat radiating member 60 during the period from when the heat radiating member 60 is gripped to when it is installed on the lower mold 3. In particular, the deflection of the heat radiating member 60 is corrected when it is installed in the lower mold 3. The heat radiating member pressing portion 37 can maintain the flatness of the heat radiating member 60 by applying a pressure that pushes the heat radiating member 60 from the top to the bottom. The heat radiating member 60 in a state in which the deflection is corrected and the flatness is maintained is installed in the lower mold 3, so that the heat radiating member 60 reaches the concave portion 5 (bottom surface 53) without any deflection.

  As described in the first embodiment, the lower mold 3 sucks the heat radiating member 60 downward. By this suction, the heat radiating member 60 installed without bending in the concave portion 5 (bottom surface 53) is fixed in the concave portion 5 (bottom surface 53) without causing bending as it is.

(Heating section)
It is also preferable that the electronic substrate holding unit 27 further includes an electronic substrate heating unit 28 that heats the electronic substrate 50. The electronic substrate 50 is sealed with resin. At this time, as described in the first embodiment, the resin 40 is attached to the surface of the electronic substrate 50 (the surface facing the heat dissipation member 60). The resin 40 is in a flexible state, and the flexible resin 40 is installed between the electronic substrate 50 and the heat dissipation member 60.

  The resin 40 becomes a resin layer 70 between the electronic substrate 50 and the heat dissipation member 60. At this time, the resin 40 tends to spread between the electronic substrate 50 and the heat dissipation member 60 more flexibly by heat. For this reason, it is suitable for the spread of the resin 40 that the electronic substrate 50 has a heat of room temperature or higher.

  The electronic substrate heating unit 28 heats the gripped electronic substrate 50 using the time for transportation. The electronic board holding part 27 places the electronic board 50 taken out from the electronic board housing part 59 on the upper mold 2. At this time, a certain time is required for movement and installation. Further, the electronic substrate 50 has a flat plate shape. The electronic board holding part 27 is provided so as to fit in a plane with the electronic board 50 on the flat plate. For this reason, the electronic board | substrate holding | suppressing part 27 is equipped with the electronic board | substrate heating part 28, and the electronic board | substrate heating part 28 can heat the electronic substrate 50 whole planarly.

  Here, it is also preferable that the electronic board pressing part 27 also serves as the electronic board heating part 28.

  It is also preferable that the heat radiating member pressing portion 37 further includes a heat radiating member heating portion 38 that heats the heat radiating member 60. The heat dissipation member 60 is resin-sealed. At this time, as described in the first embodiment, the resin 40 is attached to the surface of the heat dissipation member 60 (the surface facing the electronic substrate 50). The resin 40 is in a flexible state, and the flexible resin 40 is laminated between the electronic substrate 50 and the heat dissipation member 60.

  The resin 40 becomes a resin layer 70 between the electronic substrate 50 and the heat dissipation member 60. At this time, the resin 40 tends to spread between the electronic substrate 50 and the heat dissipation member 60 more flexibly by heat. For this reason, it is suitable in the spread of this resin 40 that the heat radiating member 60 has the heat | fever more than room temperature.

  The heat radiating member heating unit 38 heats the gripped heat radiating member 60 using the time for transportation. The heat radiating member gripping portion 37 installs the heat radiating member 60 taken out from the heat radiating member accommodating portion 69 in the lower mold 3. At this time, a certain time is required for movement and installation. Moreover, the heat radiating member 60 is flat form. The heat radiating member pressing portion 37 is provided so as to fit in a plane with the heat radiating member 60 on the flat plate. For this reason, since the heat radiating member pressing portion 37 includes the heat radiating member heating portion 38, the heat radiating member heating portion 38 can heat the entire heat radiating member 60 in a planar manner.

  Here, it is also preferable that the heat dissipation member pressing portion 37 also serves as the heat dissipation member heating portion 38.

  The electronic board heating unit 28 and the heat radiation member heating unit 38 only need to have a mechanism for generating heat electronically, such as an electric heating coil. The electronic substrate 50 and the heat radiating member 60 heated by the heating unit using the transportation time (installation time) can realize improvement in accuracy and time reduction in sealing with the resin 40.

  It is also preferable that each of the electronic substrate heating unit 28 and the heat radiation member heating unit 38 can control overheating independently. For example, it is also preferable that the electronic substrate heating unit 28 performs a heating operation while the heat dissipation member heating unit 38 does not perform a heating operation. Alternatively, the temperature at which the electronic substrate heating unit 28 heats the electronic substrate 50 and the temperature at which the heat dissipation member heating unit 38 heats the heat dissipation member 60 may be different.

  Alternatively, the speed at which the electronic board heating unit 28 heats the electronic board 50 and the speed at which the heat dissipation member heating part 38 heats the heat dissipation member 60 may be different. Alternatively, the heating time may be different. In this way, the electronic substrate heating unit 28 and the heat dissipation member heating unit 38 can control heating independently of each other, so that each characteristic (material, Heating suitable for the structure, size, etc. can be performed.

  The resin gripper 46 installs the resin 40 in the resin pot 42 after the pair of sealed electronic substrates 50 and the heat dissipation member 60 are installed. The resin 40 installed in the resin pot 42 is pushed up by the resin pressing portion 41. At this time, the resin 40 is melted inside the resin pot 42 and is transported to the resin injection portion 4 in a molten state.

  Here, after the electronic substrate 50 or the like is installed, the resin 40 is installed in the resin pot 42, so that the electronic substrate holding unit 27 or the like is pressing the electronic substrate 50 or the like against the upper mold 2 or the like. This is because the resin 40 can be prevented from being excessively heated and melted in the resin pot 42 to be deteriorated. This is because the resin 40 is not subjected to unnecessary thermal effects after the electronic substrate 50 or the like is installed.

  As a result, the resin 40 that is heated and melted is injected into the sealed space 5 from the resin injection portion 4 only by waiting for a short time until the sealed space 5 is generated. The ease of resin injection is increased.

  In addition, the resin sealing apparatus demonstrated by Embodiment 1-2 is an example explaining the meaning of this invention, and includes the deformation | transformation and remodeling in the range which does not deviate from the meaning of this invention.

DESCRIPTION OF SYMBOLS 1 Resin sealing apparatus 2 Upper type | mold 21 Recess 22 Upper suction part 25 Electronic board holding part 26 Electronic board holding part 27 Electronic board holding | maintenance part 28 Electronic board heating part 3 Lower type | mold 35 Heat radiation member holding part 36 Heat radiation member holding part 37 Heat radiation member Holding part 38 Heat radiating member heating part 4 Resin injecting part 40 Resin 41 Resin pressing part 42 Resin pot 5 Recessed part 51 Opening part 52 Lower suction part 50 Electronic substrate 49 Resin accommodating part 59 Electronic substrate accommodating part 69 Heat radiating member accommodating part 60 Resin layer

Claims (15)

An upper mold for fixing the electronic substrate;
A lower mold for fixing the heat dissipating member paired with the electronic substrate;
A resin injection part for injecting resin into a sealed space formed between the electronic substrate and the heat dissipation member,
The lower mold has a recess for fixing the heat radiating member to its bottom surface,
The electronic substrate closes the opening of the recess,
The heat dissipation member is fixed to the bottom surface of the recess,
The sealing space is formed between the heat dissipation member and the electronic substrate in the recess,
The resin injection unit is a resin sealing device that is injected with the heat dissipation member as a bottom surface and fills the sealing space.   The resin sealing device according to claim 1, wherein the size of the opening of the recess is smaller than the size of the electronic substrate.   The resin sealing device according to claim 1, wherein the bottom surface has a shape such that no gap is generated between the heat radiation member and the heat radiating member fixed to the bottom surface.   4. The resin sealing device according to claim 1, wherein the upper mold further includes an upper suction portion that sucks the electronic substrate upward. 5.   5. The resin sealing device according to claim 1, wherein the lower mold further includes a lower suction portion that sucks the heat radiating member downward.   The resin sealing device according to claim 5, wherein at least one of the upper suction portion and the lower suction portion continues the suction operation even while resin is being injected from the resin injection portion into the sealing space.   The resin sealing device according to claim 1, wherein the resin injection portion is provided on a side surface of the sealing space.   The resin sealing device according to claim 7, wherein a plurality of the resin injection portions are provided on a side surface of the sealing space. A transport unit for transporting at least one of the electronic substrate, the heat dissipation member, and the resin;
The transport section is
An electronic substrate holding part for holding the electronic substrate to be transported;
A heat radiating member holding portion for holding the heat radiating member to be transported;
A resin holding part for holding the resin to be transported,
The resin sealing device according to claim 1, wherein the resin holding part is separated from the electronic substrate holding part and the heat dissipation member holding part. The transport section is
An electronic board gripping part that grips the electronic board taken out from the electronic board holding part and is installed in the upper mold,
Grasping the heat radiating member taken out from the heat radiating member holding part, and installing the heat radiating member gripping part on the lower mold,
Holding the resin taken out from the resin holding unit, and installing the resin holding unit installed in the resin injection unit,
The resin sealing device according to claim 9, wherein the resin gripping unit causes the resin holding unit to wait while the electronic substrate and the heat dissipation member are installed. The electronic board gripping part and the heat dissipation member gripping part are installed on the upper mold and the lower mold, respectively, at approximately the same time, respectively,
The resin sealing device according to claim 10, wherein each of the pair of electronic substrates and the heat radiating member to be sealed is fixed to each of the upper mold and the lower mold substantially simultaneously. The electronic board holding part has an electronic board holding part that corrects the deflection of the electronic board when the electronic board is installed in the upper mold,
The resin sealing device according to claim 10 or 11, wherein the heat radiating member gripping portion includes a heat radiating member pressing portion that corrects the deflection of the heat radiating member when the heat radiating member is installed in the lower mold. The electronic board holding part has an electronic board heating part for heating the electronic board,
The resin sealing device according to claim 12, wherein the heat dissipation member pressing portion includes a heat dissipation member heating portion that heats the heat dissipation member.   Each of the said electronic board | substrate heating part and the said heat radiating member heating part is a resin sealing apparatus of Claim 13 which can control heating independently.   The resin sealing device according to any one of claims 10 to 14, wherein the resin gripping portion installs the resin in the resin injection portion after a pair of the electronic substrates to be sealed and the heat dissipation member are installed. .