CN113497174B - Small-spacing LED display screen module and manufacturing method thereof - Google Patents

Small-spacing LED display screen module and manufacturing method thereof Download PDF

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Publication number
CN113497174B
CN113497174B CN202010200832.3A CN202010200832A CN113497174B CN 113497174 B CN113497174 B CN 113497174B CN 202010200832 A CN202010200832 A CN 202010200832A CN 113497174 B CN113497174 B CN 113497174B
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film pressing
mini led
layer
pcb substrate
led display
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CN113497174A (en
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林子钦
庄文荣
孙明
付小朝
黄志强
卢敬权
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Dongguan HCP Technology Co Ltd
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Dongguan HCP Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention provides a small-spacing LED display screen module and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: 1) Providing a PCB substrate, and inversely installing the Mini LED chip on the PCB substrate; 2) Forming a film pressing layer filled between Mini LED chips on the PCB substrate and covering the Mini LED chips, wherein the film pressing layer is used for preventing light mixing between the Mini LED chips; 3) Spraying a liquid packaging material above the film pressing layer by adopting a spraying method; 4) The liquid encapsulation material is cured to form an encapsulation layer. According to the invention, the LED display screen module is immersed in the film pressing material solution to be solidified to form the film pressing layer, so that necessary protection function is provided and light mixing among LEDs is reduced. According to the invention, the packaging layer is formed by a spraying method, so that the consistency and contrast of ink color can be improved.

Description

Small-spacing LED display screen module and manufacturing method thereof
Technical Field
The invention belongs to the field of display screen design and manufacturing, and particularly relates to a small-spacing LED display screen module and a manufacturing method thereof.
Background
With the continuous improvement of indoor display application technology, currently used display application products such as projection/DLP/LCD/PDP and the like cannot completely meet the market application requirements. There are also some drawbacks in various respects that make it impersonating the technological development. The LED full-color display screen overcomes a plurality of defects of the product, and becomes the first choice for occasions such as a command center, an outdoor advertisement screen, a conference center and the like for displaying the indoor and outdoor large screens.
The manufacturing method of the small-space display screen module comprises the following steps: 1. discrete devices (SMDs); 2.4 in 1Mini LED (IMD); chip On Board (COB). At present, the minimum dot spacing of the LED display screen is 0.9375mm, but the market has wide demands for the LED display screen with smaller dot spacing. Generally, an LED display screen is seamlessly spliced into a large-sized display screen by a certain number of small-sized display screen modules. The picture is clearer due to the small point spacing. However, when the dot spacing is smaller than 0.7mm, the SMD and IMD methods cannot meet the requirements, and only the COB method can manufacture the LED display screen with smaller dot spacing.
In the current method for manufacturing the small-space LED display screen module by using the COB method, the black film pressing layer is thicker, so that the film pressing process often causes deformation of the PCB substrate, the thickness of the film pressing layer is uneven, the consistency of ink color is poor, and the contrast is low.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention is directed to a small-pitch LED display module and a manufacturing method thereof, which are used for solving the problems that in the prior art, the PCB substrate is easily deformed during the film pressing process of the LED display module, and the thickness of the film pressing layer is uneven, so that the consistency of ink colors of the LED display is poor and the contrast ratio is low.
To achieve the above and other related objects, the present invention provides a method for manufacturing a small-pitch LED display module, the method comprising the steps of: 1) Providing a PCB substrate, and flip-chip mounting a Mini LED chip on the PCB substrate; 2) Forming a film pressing layer filled between Mini LED chips on the PCB substrate and covering the Mini LED chips; 3) Spraying a liquid packaging material above the film pressing layer by adopting a spraying method; 4) And curing the liquid packaging material to form a packaging layer on the film pressing layer.
Optionally, step 1) comprises the steps of: 1-1) transferring the Mini LED chip onto the PCB substrate; 1-2) welding the Mini LED chip on the PCB substrate; wherein, the transferring in the step 1-1) comprises one of pick-and-place transferring and thimble alignment transferring; the welding in step 1-2) comprises one of reflow welding and laser welding.
Optionally, step 2) forming the laminated layer includes: 2-1) providing a groove body, paving a release film at the bottom of the groove body, then injecting a liquid film pressing material into the groove body, wherein the film pressing material main body comprises one or more mixtures of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, the film pressing material also comprises one or more of black dye and black carbon powder, and 2-2) immersing one surface of the PCB substrate with a Mini LED chip into the groove body downwards; 2-3) heating and pressurizing to cure the film pressing material to form a film pressing layer.
Optionally, in step 3), the main body of the liquid encapsulating material includes one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the liquid encapsulating material further includes one or more of black dye and black carbon powder.
Optionally, step 3) uniformly spreading the liquid encapsulating material on the film pressing layer under the action of gravity by regulating and controlling the viscosity of the liquid encapsulating material.
Optionally, step 3) rotates the PCB substrate while spraying, so that the liquid encapsulating material is uniformly spread on the film pressing layer under the action of centrifugal force.
Optionally, step 3) scraping the liquid encapsulating material back and forth by using a linear tool after the spraying is completed, so that the liquid encapsulating material is uniformly spread on the film pressing layer.
Optionally, step 3) after the spraying is completed, providing a planar component, forming a release film on the surface of the planar component, and tightly attaching the planar component to the liquid packaging material, so that the liquid packaging material is uniformly spread on the film pressing layer.
Optionally, the surface of the planar component facing the liquid packaging material has a predetermined morphology, and the planar component is tightly attached to the liquid packaging material to form an optical morphology on the surface of the liquid packaging material, so that the packaging layer has a predetermined optical property.
The invention also provides a small-spacing LED display screen module, which comprises: a PCB substrate; the Mini LED chip is flip-chip mounted on the PCB substrate; the film pressing layer is filled between the Mini LED chips on the PCB substrate and covers the Mini LED chips; and the packaging layer is positioned on the film pressing layer.
Optionally, the PCB substrate includes a first surface and a second surface, the first surface has an electrode for connecting with the Mini LED chip, and the second surface has a connection portion for connecting with a driving chip.
Optionally, the Mini LED chip has a size of no greater than 100 microns by 200 microns.
Optionally, the main body of the film pressing layer comprises one or a mixture of a fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the film pressing layer further comprises one or a plurality of black dyes and black carbon powder.
Optionally, the main body of the encapsulation layer includes one or more mixtures of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the encapsulation layer further includes one or more of black dye and black carbon powder.
Optionally, the Mini LED chip includes a red Mini LED chip, a green Mini LED chip and a blue Mini LED chip, and the red Mini LED chip, the green Mini LED chip and the blue Mini LED chip are arranged in an array.
As described above, the small-spacing LED display screen module and the manufacturing method thereof have the following beneficial effects:
according to the invention, the LED display screen module is immersed in the film pressing material solution to be solidified to form the film pressing layer, so that necessary protection function is provided and light mixing among LEDs is reduced.
According to the invention, the packaging layer is formed by a spraying method, so that the consistency and contrast of ink color can be improved.
Drawings
Fig. 1 to fig. 4 are schematic structural views showing steps of a method for manufacturing a small-pitch LED display module according to the present invention.
Description of element reference numerals
101 PCB substrate
102 Mini LED chip
103. First electrode
104. Second electrode
105. First chip electrode
106. Second chip electrode
107. Film pressing layer
108. Encapsulation layer
201. Groove body
202. Release film
203. Liquid film pressing material
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
As described in detail in the embodiments of the present invention, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of explanation, and the schematic drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For ease of description, spatially relative terms such as "under", "below", "beneath", "above", "upper" and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers may also be present.
In the context of this application, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, as well as embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings rather than the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
As shown in fig. 1 to 4, the present embodiment provides a method for manufacturing a small-pitch LED display screen module, the method comprising the steps of:
as shown in fig. 1, step 1) is first performed, a PCB substrate 101 is provided, and a Mini LED chip 102 is flip-chip mounted on the PCB substrate 101.
The PCB substrate 101 includes a first surface and a second surface, the first surface has an electrode for connecting with the Mini LED chip 102, and the second surface has a connection portion for connecting with the driving chip. The Printed Circuit Board (PCB) substrate 101 is internally provided with interconnection lines, which can be a single-layer or multi-layer board, the electrodes comprise a first electrode 103 and a second electrode 104, the first electrode 103 and the second electrode 104 can be dot electrodes, the first electrode 103 can be a positive electrode or a negative electrode, the second electrode 104 can be a negative electrode or a positive electrode, the polarities of the first electrode 103 and the second electrode 104 are opposite, the first electrode 103 and the second electrode 104 are arranged on the PCB substrate 101 in a regular array, the first electrode 103 and the second electrode 104 can be formed in the PCB substrate 101 manufacturing process through a photoetching process, and can also be formed on the PCB substrate 101 through solder paste brushing by utilizing a mask, and the first chip electrode 105 and the second chip electrode 106 of the Mini LED chip 102 are butted on the first electrode 103 and the second electrode 104.
Specifically, the method comprises the following steps:
step 1-1), transferring the Mini LED chip 102 onto the PCB substrate 101. The Mini LED chip 102 is flip-chip mounted on the PCB substrate 101, and the transferring includes one of pick-and-place transferring and thimble alignment transferring.
The Mini LED chip 102 has a size of no greater than 100 microns by 200 microns, for example, the Mini LED chip 102 may have a size of 100 microns by 200 microns, 100 microns by 150 microns, or less. The Mini LED chip 102 includes a red Mini LED chip, a green Mini LED chip, and a blue Mini LED chip, which are arranged in an array.
1-2) welding the Mini LED chip 102 on the PCB substrate 101. Wherein the welding comprises one of reflow welding and laser welding.
As shown in fig. 2 to 3, step 2) is then performed to form a laminated layer 107 filled between Mini LED chips 102 on the PCB substrate 101 and covering the Mini LED chips 102, for preventing light mixing between the Mini LED chips 102.
Optionally, step 2) forming the laminated layer 107 includes:
step 2-1), a groove 201 is provided, a release film 202 is laid at the bottom of the groove 201, and then a liquid film pressing material 203 is injected into the groove 201, wherein the film pressing material comprises one or more mixtures of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the film pressing material further comprises one or more of black dye and black carbon powder. In a specific embodiment, the main body of the film pressing material is silica gel, and black carbon powder is not doped in the silica gel, so that the transmittance is more than 95%. In another embodiment, the film pressing material is doped with carbon powder, and the transmittance is below 50%, so as to reduce light mixing between the LEDs.
Step 2-2), immersing the surface of the PCB substrate 101 with the Mini LED chip 102 downward into the groove 201. For example, the Mini LED chip 102 may be completely immersed in the liquid film-pressing material 203, and the top surface of the liquid film-pressing material 203 is flush with the surface of the PCB substrate 101 having the Mini LED chip 102
Step 2-3), heating and pressurizing to cure the film-pressing material to form the film-pressing layer 107.
In one embodiment, the steps 2-2) and 2-3) are performed in a vacuum environment.
And 2-4), peeling the film pressing layer 107 from the tank 201 through the release film 202.
Preferably, the amount of the liquid film pressing material 203 in the tank 201 can be calculated in advance according to the requirement, so as to ensure that the film pressing layer 107 after final curing has a required thickness, so as to avoid the need of secondary processing, such as thinning processing, etc., and effectively improve the process efficiency, and meanwhile, the obtained film pressing layer 107 has higher thickness uniformity.
As shown in fig. 4, step 3) is performed, and a spraying method is adopted to spray a liquid encapsulation material on the film pressing layer 107; and step 4), solidifying the liquid encapsulation material to form an encapsulation layer 108 on the film pressing layer 107 for protecting the film pressing layer 107.
For example, the main body of the liquid encapsulating material comprises one or a mixture of a fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the liquid encapsulating material further comprises one or a plurality of black dyes and black carbon powder.
In one embodiment, the liquid encapsulant has a transmittance of 50% and provides an ink background and reduces the brightness of the Mini LED chip 102 to a range acceptable to the human eye.
In a specific embodiment, step 3) uniformly spreads the liquid encapsulating material on the lamination layer 107 under the action of gravity by controlling the viscosity of the liquid encapsulating material.
In another embodiment, step 3) rotates the PCB substrate 101 while spraying, so that the liquid encapsulating material is uniformly spread on the lamination layer 107 under the centrifugal force.
In another embodiment, step 3) uses a linear tool to scrape the liquid encapsulating material back and forth after the spraying is completed, so that the liquid encapsulating material is uniformly spread on the lamination layer 107.
In another embodiment, step 3) provides a planar member after the spraying is completed, the surface of the planar member forms a release film, and the planar member is tightly attached to the liquid encapsulating material, so that the liquid encapsulating material is uniformly spread on the film pressing layer 107. The surface of the planar component facing the liquid encapsulation material has a predetermined morphology, and the planar component is tightly attached to the liquid encapsulation material to form an optical morphology on the surface of the liquid encapsulation material, so that the encapsulation layer 108 has a predetermined optical property.
As shown in fig. 4, this embodiment further provides a small-pitch LED display screen module, where the small-pitch LED display screen module includes: a PCB substrate 101; a Mini LED chip 102 flip-chip mounted on the PCB substrate 101; the film pressing layer 107 is filled between the Mini LED chips 102 on the PCB substrate 101 and covers the Mini LED chips 102; and the packaging layer 108 is positioned on the film pressing layer 107.
For example, the PCB substrate 101 includes a first surface formed with electrodes for connection with the Mini LED chip 102 and a second surface having a connection portion for connection with a driving chip. The Printed Circuit Board (PCB) substrate 101 is internally provided with interconnection lines, which can be a single-layer or multi-layer board, the electrodes comprise a first electrode 103 and a second electrode 104, the first electrode 103 and the second electrode 104 can be dot electrodes, the first electrode 103 can be a positive electrode or a negative electrode, the second electrode 104 can be a negative electrode or a positive electrode, the polarities of the first electrode 103 and the second electrode 104 are opposite, the first electrode 103 and the second electrode 104 are arranged on the PCB substrate 101 in a regular array, the first electrode 103 and the second electrode 104 can be formed in the PCB substrate 101 manufacturing process through a photoetching process, and can also be formed on the PCB substrate 101 through solder paste brushing by utilizing a mask, and the first chip electrode 105 and the second chip electrode 106 of the Mini LED chip 102 are butted on the first electrode 103 and the second electrode 104.
The Mini LED chip 102 has a size of no greater than 100 microns by 200 microns, for example, the Mini LED chip 102 may have a size of 100 microns by 200 microns, 100 microns by 150 microns, or less. The Mini LED chip 102 includes a red Mini LED chip, a green Mini LED chip, and a blue Mini LED chip, which are arranged in an array.
The main body of the film pressing layer 107 comprises one or a mixture of a fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the film pressing layer 107 further comprises one or a plurality of black dyes and black carbon powder.
The main body of the encapsulation layer 108 includes one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the encapsulation layer 108 further includes one or more of black dye and black carbon powder.
As described above, the small-spacing LED display screen module and the manufacturing method thereof have the following beneficial effects:
according to the invention, the LED display screen module is immersed in the film pressing material solution to be solidified to form the film pressing layer, so that necessary protection function is provided and light mixing among LEDs is reduced.
According to the invention, the packaging layer is formed by a spraying method, so that the consistency and contrast of ink color can be improved.
Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims (13)

1. The manufacturing method of the small-space LED display screen module is characterized by comprising the following steps of:
1) Providing a PCB substrate, and flip-chip mounting a Mini LED chip on the PCB substrate;
2) Forming a film pressing layer filled between Mini LED chips on the PCB substrate and covering the Mini LED chips;
3) Spraying a liquid packaging material above the film pressing layer by adopting a spraying method; after the spraying is finished, providing a planar part, forming a release film on the surface of the planar part, tightly attaching the planar part and the liquid packaging material, and uniformly spreading the liquid packaging material on the film pressing layer; the surface of the planar component facing the liquid packaging material has a preset morphology, and the planar component is tightly attached to the liquid packaging material to form an optical morphology on the surface of the liquid packaging material, so that the packaging layer has preset optical performance;
4) And curing the liquid packaging material to form a packaging layer on the film pressing layer, wherein the packaging layer is used for providing an ink background and reducing the brightness of the Mini LED chip to a range acceptable by human eyes.
2. The method for manufacturing a small-pitch LED display module according to claim 1, wherein step 1) comprises the steps of:
1-1) transferring the Mini LED chip onto the PCB substrate;
1-2) welding the Mini LED chip on the PCB substrate;
wherein, the transferring in the step 1-1) comprises one of pick-and-place transferring and thimble alignment transferring; the welding in step 1-2) comprises one of reflow welding and laser welding.
3. The method for manufacturing a small-pitch LED display module according to claim 1, wherein step 2) forming the lamination layer comprises:
2-1) providing a groove body, paving a release film at the bottom of the groove body, and then injecting a liquid film pressing material into the groove body, wherein the film pressing material main body comprises one or more mixtures of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the film pressing material also comprises one or more of black dye and black carbon powder;
2-2) immersing the surface of the PCB substrate with the Mini LED chip downwards into the groove body;
2-3) heating and pressurizing to cure the film pressing material to form a film pressing layer.
4. The method of claim 1, wherein in step 3) the main body of the liquid encapsulating material comprises one or more mixtures of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the liquid encapsulating material further comprises one or more of black dye and black carbon powder.
5. The method for manufacturing the small-pitch LED display screen module according to claim 1, wherein in the step 3), the viscosity of the liquid packaging material is regulated, so that the liquid packaging material is uniformly spread on the film pressing layer under the action of gravity.
6. The method for manufacturing the small-pitch LED display screen module according to claim 1, wherein in the step 3), the PCB substrate is rotated while spraying, so that the liquid packaging material is uniformly spread on the film pressing layer under the action of centrifugal force.
7. The method for manufacturing the small-pitch LED display screen module according to claim 1, wherein after the spraying is completed, step 3) uses a linear tool to scrape the liquid packaging material back and forth so as to uniformly spread the liquid packaging material on the film pressing layer.
8. The utility model provides a little interval LED display screen module, its characterized in that, little interval LED display screen module includes:
a PCB substrate;
the Mini LED chip is flip-chip mounted on the PCB substrate;
the film pressing layer is filled between the Mini LED chips on the PCB substrate and covers the Mini LED chips;
the packaging layer is positioned above the film pressing layer and is used for providing an ink background and reducing the brightness of the Mini LED chip to a range acceptable by human eyes; the surface of the packaging layer is provided with an optical appearance.
9. The small-pitch LED display module of claim 8, wherein: the PCB substrate comprises a first surface and a second surface, wherein the first surface is provided with an electrode and is used for being connected with the Mini LED chip, and the second surface is provided with a connecting part and is used for being connected with a driving chip.
10. The small-pitch LED display module of claim 8, wherein: the Mini LED chip has a size not greater than 100 micrometers by 200 micrometers.
11. The small-pitch LED display module of claim 8, wherein: the main body of the film pressing layer comprises one or a mixture of a fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the film pressing layer also comprises one or a plurality of black dyes and black carbon powder.
12. The small-pitch LED display module of claim 8, wherein: the main body of the packaging layer comprises one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the packaging layer also comprises one or more of black dye and black carbon powder.
13. The small-pitch LED display module of claim 8, wherein: the Mini LED chips comprise red Mini LED chips, green Mini LED chips and blue Mini LED chips, and the red Mini LED chips, the green Mini LED chips and the blue Mini LED chips are arranged in an array.
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