CN113497174A - Small-spacing LED display screen module and manufacturing method thereof - Google Patents
Small-spacing LED display screen module and manufacturing method thereof Download PDFInfo
- Publication number
- CN113497174A CN113497174A CN202010200832.3A CN202010200832A CN113497174A CN 113497174 A CN113497174 A CN 113497174A CN 202010200832 A CN202010200832 A CN 202010200832A CN 113497174 A CN113497174 A CN 113497174A
- Authority
- CN
- China
- Prior art keywords
- display screen
- mini led
- screen module
- pcb substrate
- led display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a small-spacing LED display screen module and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: 1) providing a PCB substrate, and inversely installing the Mini LED chip on the PCB substrate; 2) forming a film pressing layer which is filled between the Mini LED chips on the PCB substrate and covers the Mini LED chips and is used for preventing light mixing between the Mini LED chips; 3) spraying a liquid packaging material above the film pressing layer by adopting a spraying method; 4) and solidifying the liquid packaging material to form the packaging layer. According to the invention, the LED display screen module is immersed into the film pressing material solution to be cured to form the film pressing layer, so that a necessary protection function is provided and light mixing among LEDs is reduced. The invention forms the packaging layer by a spraying method, and can improve the consistency and contrast of ink.
Description
Technical Field
The invention belongs to the field of display screen design and manufacture, and particularly relates to a small-spacing LED display screen module and a manufacturing method thereof.
Background
With the continuous improvement of indoor display application technology, currently used display application products such as projection/DLP/LCD/PDP and the like cannot completely meet the market application requirements. There are also some drawbacks in various aspects that make it impossible to break through the technological development. The LED full-color display screen overcomes the defects of the products, and becomes a first choice for indoor and outdoor large-screen display, such as occasions of command centers, outdoor advertising screens, conference centers and the like.
The manufacturing method of the small-spacing display screen module comprises the following steps: 1. discrete devices (SMDs); 2.4 in 1Mini LED (IMD); chip On Board (COB). At present, the minimum point distance of the LED display screen is 0.9375mm, but the market has wide requirements on the LED display screen with the smaller point distance. Generally, the LED display screen is seamlessly spliced into a large-sized display screen by a certain number of small-sized display screen modules. The picture can be clearer due to the small dot spacing. However, when the dot pitch is smaller than 0.7mm, both the SMD method and the IMD method cannot meet the requirements, and only the COB method can manufacture an LED display screen with a smaller dot pitch.
In the current method for manufacturing the small-spacing LED display screen module by using the COB method, because the black film lamination layer is thick, the film lamination process often causes the deformation of a PCB substrate, the thickness of the film lamination layer is uneven, the ink color consistency is poor, and the contrast is low.
Disclosure of Invention
In view of the above disadvantages of the prior art, an object of the present invention is to provide a small-pitch LED display screen module and a manufacturing method thereof, for solving the problems of poor ink color consistency and low contrast of an LED display screen due to uneven thickness of a pressed film layer, which are caused by deformation of a PCB substrate easily in a film pressing process of an LED display screen module in the prior art.
In order to achieve the above and other related objects, the present invention provides a method for manufacturing a small-pitch LED display screen module, including: 1) providing a PCB substrate, and inversely installing a Mini LED chip on the PCB substrate; 2) forming a film pressing layer which is filled between the Mini LED chips on the PCB substrate and covers the Mini LED chips; 3) spraying a liquid packaging material above the squeeze film layer by adopting a spraying method; 4) and curing the liquid packaging material to form a packaging layer on the laminated film layer.
Optionally, step 1) comprises the steps of: 1-1) transferring the Mini LED chip to the PCB substrate; 1-2) welding the Mini LED chip on the PCB substrate; wherein, the transfer in the step 1-1) comprises one of pick-and-place transfer and thimble alignment transfer; the welding in the step 1-2) comprises one of reflow welding and laser welding.
Optionally, the step 2) of forming the laminate layer includes: 2-1) providing a tank body, laying a release film at the bottom of the tank body, then injecting a liquid film pressing material into the tank body, wherein the main body of the film pressing material comprises one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicon resin, and the film pressing material also comprises one or more of black dye and black carbon powder, and 2-2) downwards immersing the surface of the PCB substrate with the Mini LED chip into the tank body; 2-3) heating and pressurizing to cure the lamination material to form a lamination layer.
Optionally, the main body of the liquid encapsulating material in step 3) includes one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel, and silicone resin, and the liquid encapsulating material further includes one or more of black dye and black carbon powder.
Optionally, in step 3), the viscosity of the liquid encapsulating material is regulated, so that the liquid encapsulating material is uniformly spread on the laminating film layer under the action of gravity.
Optionally, in step 3), the PCB substrate is rotated while spraying, so that the liquid encapsulating material is uniformly spread on the film lamination layer under the centrifugal force.
Optionally, step 3) scraping the liquid encapsulating material back and forth by using a linear tool after the spraying is finished so as to uniformly spread the liquid encapsulating material on the laminating film layer.
Optionally, in step 3), after the spraying is completed, a planar part is provided, a release film is formed on the surface of the planar part, and the planar part is tightly attached to the liquid encapsulating material, so that the liquid encapsulating material is uniformly spread on the press film layer.
Optionally, a surface of the planar part facing the liquid encapsulation material has a predetermined topography, and after the planar part is tightly attached to the liquid encapsulation material, the surface of the liquid encapsulation material forms an optical topography, so that the encapsulation layer has a predetermined optical performance.
The invention also provides a small-spacing LED display screen module, which comprises: a PCB substrate; the Mini LED chip is inversely arranged on the PCB substrate; the laminating layer is filled between the Mini LED chips on the PCB substrate and covers the Mini LED chips; and the packaging layer is positioned on the squeeze film layer.
Optionally, the PCB substrate includes a first surface and a second surface, the first surface has an electrode for connecting with the Mini LED chip, and the second surface has a connecting portion for connecting with a driving chip.
Optionally, the Mini LED chip has a size of no more than 100 microns x 200 microns.
Optionally, the main body of the pressure film layer comprises one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the pressure film layer further comprises one or more of black dye and black carbon powder.
Optionally, the main body of the encapsulation layer includes one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel, and silicone resin, and the encapsulation layer further includes one or more of black dye and black carbon powder.
Optionally, the Mini LED chips include a red Mini LED chip, a green Mini LED chip, and a blue Mini LED chip, and the red Mini LED chip, the green Mini LED chip, and the blue Mini LED chip are arranged in an array.
As described above, the small-pitch LED display screen module and the manufacturing method thereof of the present invention have the following advantages:
according to the invention, the LED display screen module is immersed into the film pressing material solution to be cured to form the film pressing layer, so that a necessary protection function is provided and light mixing among LEDs is reduced.
The invention forms the packaging layer by a spraying method, and can improve the consistency and contrast of ink.
Drawings
Fig. 1 to 4 are schematic structural diagrams showing steps of the method for manufacturing a small-pitch LED display screen module according to the present invention.
Description of the element reference numerals
101 PCB substrate
102 Mini LED chip
103 first electrode
104 second electrode
105 first chip electrode
106 second chip electrode
107 lamination film layer
108 encapsulation layer
201 tank body
202 release film
203 liquid squeeze film material
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structures are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.
In the context of this application, a structure described as having a first feature "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
As shown in fig. 1 to 4, the present embodiment provides a method for manufacturing a small-pitch LED display screen module, where the method includes:
as shown in fig. 1, step 1) is performed to provide a PCB substrate 101, and a Mini LED chip 102 is flip-chip mounted on the PCB substrate 101.
The PCB substrate 101 includes a first surface and a second surface, the first surface has an electrode for connecting with the Mini LED chip 102, and the second surface has a connecting portion for connecting with the driving chip. The PCB substrate 101 has an interconnection line inside, which may be a single layer or a multi-layer board, the electrode includes a first electrode 103 and a second electrode 104, the first electrode 103 and the second electrode 104 may be dot electrodes, the first electrode 103 may be a positive electrode or a negative electrode, the second electrode 104 may be a negative electrode or a positive electrode, and polarities of the first electrode 103 and the second electrode 104 are opposite, the first electrode 103 and the second electrode 104 are arranged in a regular array on the PCB substrate 101, the first electrode 103 and the second electrode 104 may be formed in a manufacturing process of the PCB substrate 101 through a photolithography process, or may be formed on the PCB substrate 101 through a solder paste by using a mask, and the first chip electrode 105 and the second chip electrode 106 of the Mini LED chip 102 are butted to the first electrode 103 and the second electrode 104.
Specifically, the method comprises the following steps:
step 1-1), transferring the Mini LED chip 102 to the PCB substrate 101. The Mini LED chip 102 is inversely mounted on the PCB substrate 101, and the transferring includes one of pick-and-place transferring and pin aligning transferring.
The Mini LED chip 102 has a size of no greater than 100 microns by 200 microns, for example, the Mini LED chip 102 may have a size of 100 microns by 200 microns, 100 microns by 150 microns, or less. The Mini LED chip 102 includes a red Mini LED chip, a green Mini LED chip, and a blue Mini LED chip, and the red Mini LED chip, the green Mini LED chip, and the blue Mini LED chip are arranged in an array.
Step, 1-2) welding the Mini LED chip 102 on the PCB substrate 101. Wherein, the welding comprises one of reflow soldering and laser welding.
As shown in fig. 2 to 3, step 2) is then performed to form a squeeze film layer 107 filled between the Mini LED chips 102 on the PCB substrate 101 and covering the Mini LED chips 102 for preventing light mixing between the Mini LED chips 102.
Alternatively, the step 2) of forming the laminate layer 107 includes:
step 2-1), providing a tank body 201, laying a release film 202 at the bottom of the tank body 201, and then injecting a liquid film pressing material 203 into the tank body 201, wherein the film pressing material main body comprises one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicon resin, and the film pressing material further comprises one or more of black dye and black carbon powder. In one embodiment, the main body of the film pressing material is silica gel, black carbon powder is not doped in the silica gel, and the transmittance is more than 95%. In another embodiment, the film-pressing material is doped with carbon powder, and the transmittance is below 50% so as to reduce light mixing among LEDs.
Step 2-2), the side of the PCB substrate 101 with the Mini LED chip 102 is immersed into the tank 201 downwards. For example, the Mini LED chip 102 may be completely immersed in the liquid lamination material 203, and the top surface of the liquid lamination material 203 is flush with the surface of the PCB substrate 101 having the Mini LED chip 102
Step 2-3), heating and pressure-curing the squeeze film material to form a squeeze film layer 107.
In one embodiment, the steps 2-2) and 2-3) are performed in a vacuum environment.
And 2-4) peeling the pressure film layer 107 from the groove body 201 through the release film 202.
Preferably, the amount of the liquid-state lamination material 203 in the tank 201 can be calculated in advance according to requirements, so that the finally cured lamination layer 107 has a required thickness, secondary processing such as thinning processing is avoided, the process efficiency can be effectively improved, and meanwhile, the obtained lamination layer 107 also has high thickness uniformity.
As shown in fig. 4, step 3) is performed next, a liquid encapsulating material is sprayed on the top of the film lamination layer 107 by using a spraying method; and step 4) curing the liquid encapsulating material to form an encapsulating layer 108 on the pressure film layer 107 for protecting the pressure film layer 107.
For example, the main body of the liquid packaging material includes one or more of fluorocarbon resin, epoxy glue, epoxy resin, silicone and silicone resin, and the liquid packaging material further includes one or more of black dye and black carbon powder.
In one embodiment, the liquid encapsulant has a transmittance of 50%, providing an ink background and reducing the brightness of the Mini LED chip 102 to a range acceptable to the human eye.
In one embodiment, step 3) is to uniformly spread the liquid encapsulating material on the film lamination layer 107 under the action of gravity by controlling the viscosity of the liquid encapsulating material.
In another embodiment, step 3) rotates the PCB substrate 101 while spraying, so that the liquid encapsulation material is uniformly spread on the press film layer 107 under the centrifugal force.
In another embodiment, step 3) uses a linear tool to scrape the liquid encapsulating material back and forth after the spraying is completed, so that the liquid encapsulating material is uniformly spread on the film pressing layer 107.
In another embodiment, step 3) provides a planar component after the spraying, a release film is formed on the surface of the planar component, and the planar component is tightly attached to the liquid encapsulant, so that the liquid encapsulant is uniformly spread on the film pressing layer 107. The surface of the planar part facing the liquid encapsulation material has a predetermined topography, and the surface of the liquid encapsulation material forms an optical topography after the planar part is tightly attached to the liquid encapsulation material, so that the encapsulation layer 108 has a predetermined optical performance.
As shown in fig. 4, this embodiment still provides a booth apart from LED display screen module, booth apart from LED display screen module includes: a PCB substrate 101; a Mini LED chip 102 flip-chip mounted on the PCB substrate 101; a pressure film layer 107 filled between the Mini LED chips 102 on the PCB substrate 101 and covering above the Mini LED chips 102; and an encapsulation layer 108 positioned on the lamination layer 107.
For example, the PCB substrate 101 includes a first surface on which electrodes are formed for connection with the Mini LED chip 102, and a second surface having a connection portion for connection with the driving chip. The PCB substrate 101 has an interconnection line inside, which may be a single layer or a multi-layer board, the electrode includes a first electrode 103 and a second electrode 104, the first electrode 103 and the second electrode 104 may be dot electrodes, the first electrode 103 may be a positive electrode or a negative electrode, the second electrode 104 may be a negative electrode or a positive electrode, and polarities of the first electrode 103 and the second electrode 104 are opposite, the first electrode 103 and the second electrode 104 are arranged in a regular array on the PCB substrate 101, the first electrode 103 and the second electrode 104 may be formed in a manufacturing process of the PCB substrate 101 through a photolithography process, or may be formed on the PCB substrate 101 through a solder paste by using a mask, and the first chip electrode 105 and the second chip electrode 106 of the Mini LED chip 102 are butted to the first electrode 103 and the second electrode 104.
The Mini LED chip 102 has a size of no greater than 100 microns by 200 microns, for example, the Mini LED chip 102 may have a size of 100 microns by 200 microns, 100 microns by 150 microns, or less. The Mini LED chip 102 includes a red Mini LED chip, a green Mini LED chip, and a blue Mini LED chip, and the red Mini LED chip, the green Mini LED chip, and the blue Mini LED chip are arranged in an array.
The main body of the pressure film layer 107 comprises one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicone resin, and the pressure film layer 107 further comprises one or more of black dye and black carbon powder.
The main body of the packaging layer 108 comprises one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicon resin, and the packaging layer 108 further comprises one or more of black dye and black carbon powder.
As described above, the small-pitch LED display screen module and the manufacturing method thereof of the present invention have the following advantages:
according to the invention, the LED display screen module is immersed into the film pressing material solution to be cured to form the film pressing layer, so that a necessary protection function is provided and light mixing among LEDs is reduced.
The invention forms the packaging layer by a spraying method, and can improve the consistency and contrast of ink.
Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (15)
1. A manufacturing method of a small-spacing LED display screen module is characterized by comprising the following steps:
1) providing a PCB substrate, and inversely installing a Mini LED chip on the PCB substrate;
2) forming a film pressing layer which is filled between the Mini LED chips on the PCB substrate and covers the Mini LED chips;
3) spraying a liquid packaging material above the squeeze film layer by adopting a spraying method;
4) and curing the liquid packaging material to form a packaging layer on the laminated film layer.
2. The manufacturing method of the small-spacing LED display screen module according to claim 1, wherein the step 1) comprises the steps of:
1-1) transferring the Mini LED chip to the PCB substrate;
1-2) welding the Mini LED chip on the PCB substrate;
wherein, the transfer in the step 1-1) comprises one of pick-and-place transfer and thimble alignment transfer; the welding in the step 1-2) comprises one of reflow welding and laser welding.
3. The method for manufacturing the small-spacing LED display screen module according to claim 1, wherein the step 2) of forming the laminated film layer comprises the following steps:
2-1) providing a tank body, laying a release film at the bottom of the tank body, and then injecting a liquid film pressing material into the tank body, wherein the film pressing material main body comprises one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicon resin, and the film pressing material further comprises one or more of black dye and black carbon powder;
2-2) immersing the side of the PCB substrate with the Mini LED chip in the groove body downwards;
2-3) heating and pressurizing to cure the lamination material to form a lamination layer.
4. The method for manufacturing the small-spacing LED display screen module according to claim 1, wherein the main body of the liquid packaging material in the step 3) comprises one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicon resin, and the liquid packaging material further comprises one or more of black dye and black carbon powder.
5. The method for manufacturing the small-spacing LED display screen module according to claim 1, wherein the liquid encapsulating material is uniformly spread on the laminated film layer under the action of gravity in the step 3) by regulating and controlling the viscosity of the liquid encapsulating material.
6. The method for manufacturing the small-spacing LED display screen module according to claim 1, wherein in the step 3), the PCB substrate is rotated while spraying, so that the liquid encapsulating material is uniformly spread on the laminated film layer under the action of centrifugal force.
7. The method for manufacturing the small-spacing LED display screen module according to claim 1, wherein in the step 3), after the spraying is finished, the liquid encapsulating material is scraped back and forth by using a linear tool so as to be uniformly spread on the laminating layer.
8. The method for manufacturing the small-gap LED display screen module according to claim 1, wherein in the step 3), after the spraying is completed, a planar component is provided, a release film is formed on the surface of the planar component, and the planar component is tightly attached to the liquid encapsulating material, so that the liquid encapsulating material is uniformly spread on the pressure film layer.
9. The method of claim 8, wherein the surface of the planar member facing the liquid encapsulant has a predetermined topography, and the surface of the liquid encapsulant forms an optical topography after the planar member is tightly attached to the liquid encapsulant, such that the encapsulant has a predetermined optical property.
10. The utility model provides a booth apart from LED display screen module, its characterized in that, booth apart from LED display screen module includes:
a PCB substrate;
the Mini LED chip is inversely arranged on the PCB substrate;
the laminating layer is filled between the Mini LED chips on the PCB substrate and covers the Mini LED chips;
and the packaging layer is positioned on the squeeze film layer.
11. The small-spacing LED display screen module set according to claim 10, characterized in that: the PCB substrate comprises a first surface and a second surface, the first surface is provided with an electrode and used for being connected with the Mini LED chip, and the second surface is provided with a connecting part and used for being connected with a driving chip.
12. The small-spacing LED display screen module set according to claim 10, characterized in that: the size of the Mini LED chip is not more than 100 microns multiplied by 200 microns.
13. The small-spacing LED display screen module set according to claim 10, characterized in that: the main body of the pressure film layer comprises one or more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicon resin, and the pressure film layer further comprises one or more of black dye and black carbon powder.
14. The small-spacing LED display screen module set according to claim 10, characterized in that: the packaging layer comprises a main body and a packaging layer, wherein the main body of the packaging layer comprises one or a mixture of more of fluorocarbon resin, epoxy glue, epoxy resin, silica gel and silicon resin, and the packaging layer further comprises one or more of black dye and black carbon powder.
15. The small-spacing LED display screen module set according to claim 10, characterized in that: the Mini LED chips comprise red Mini LED chips, green Mini LED chips and blue Mini LED chips, and the red Mini LED chips, the green Mini LED chips and the blue Mini LED chips are arranged in an array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010200832.3A CN113497174B (en) | 2020-03-20 | 2020-03-20 | Small-spacing LED display screen module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010200832.3A CN113497174B (en) | 2020-03-20 | 2020-03-20 | Small-spacing LED display screen module and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113497174A true CN113497174A (en) | 2021-10-12 |
| CN113497174B CN113497174B (en) | 2023-05-23 |
Family
ID=77993974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010200832.3A Active CN113497174B (en) | 2020-03-20 | 2020-03-20 | Small-spacing LED display screen module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113497174B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117456854A (en) * | 2023-12-21 | 2024-01-26 | 元旭半导体科技(无锡)有限公司 | Film pressing method and device of display module and preparation method of display module |
Citations (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011096864A (en) * | 2009-10-30 | 2011-05-12 | Sumitomo Bakelite Co Ltd | Semiconductor device manufacturing method, semiconductor device, electronic component manufacturing method, and electronic component |
| WO2012070612A1 (en) * | 2010-11-25 | 2012-05-31 | 住友ベークライト株式会社 | Method for producing electronic device, electronic device, method for producing electronic device package, electronic device package, and method for producing semiconductor device |
| JP2012114297A (en) * | 2010-11-25 | 2012-06-14 | Sumitomo Bakelite Co Ltd | Manufacturing method of electronic apparatus, electronic apparatus, manufacturing method of electronic apparatus package, and electronic apparatus package |
| CN102593327A (en) * | 2012-03-19 | 2012-07-18 | 连云港陆亿建材有限公司 | Inverted packaging technology for wafer-level LED |
| JP2012227442A (en) * | 2011-04-21 | 2012-11-15 | Sumitomo Bakelite Co Ltd | Semiconductor device manufacturing method and semiconductor device |
| JP2012227441A (en) * | 2011-04-21 | 2012-11-15 | Sumitomo Bakelite Co Ltd | Semiconductor device manufacturing method and semiconductor device |
| JP2012227443A (en) * | 2011-04-21 | 2012-11-15 | Sumitomo Bakelite Co Ltd | Semiconductor device manufacturing method and semiconductor device |
| CN103165039A (en) * | 2013-04-02 | 2013-06-19 | 佛山市国星光电股份有限公司 | High-contrast light-emitting diode (LED) display module and production method thereof |
| JP2013131532A (en) * | 2011-12-20 | 2013-07-04 | Sumitomo Bakelite Co Ltd | Method of manufacturing semiconductor device |
| CN103378271A (en) * | 2012-04-25 | 2013-10-30 | 展晶科技(深圳)有限公司 | Packaging structure of light emitting diode and manufacturing method thereof |
| CN103824848A (en) * | 2014-01-16 | 2014-05-28 | 大连德豪光电科技有限公司 | LED (Light Emitting Diode) display screen and manufacturing method thereof |
| CN103996788A (en) * | 2014-05-21 | 2014-08-20 | 广东威创视讯科技股份有限公司 | LED device for display screen and manufacturing method thereof |
| CN203850334U (en) * | 2014-02-18 | 2014-09-24 | 广州市鸿利光电股份有限公司 | High-power LED package structure |
| WO2017057355A1 (en) * | 2015-09-30 | 2017-04-06 | 富士フイルム株式会社 | Method for producing semiconductor element and method for producing laminate |
| CN107861291A (en) * | 2017-10-24 | 2018-03-30 | 华为技术有限公司 | Backlight module, display screen and terminal |
| CN108231607A (en) * | 2016-11-29 | 2018-06-29 | Pep创新私人有限公司 | Chip packaging method and encapsulating structure |
| CN108352331A (en) * | 2016-02-13 | 2018-07-31 | 东和株式会社 | Resin encapsulation equipment and resin encapsulation method and resin-encapsulated shaping mould |
| CN108400220A (en) * | 2018-04-25 | 2018-08-14 | 江苏稳润光电有限公司 | A kind of encapsulating structure of miniature LED display module |
| CN109244223A (en) * | 2018-11-16 | 2019-01-18 | 深圳市洲明科技股份有限公司 | display screen |
| CN109243313A (en) * | 2018-10-13 | 2019-01-18 | 长春希达电子技术有限公司 | A kind of small spacing LED display panel of high contrast COB encapsulation |
| CN109343273A (en) * | 2018-11-23 | 2019-02-15 | 江苏新广联科技股份有限公司 | A kind of big beam angle Mini LED backlight mould group and preparation method thereof |
| US20190189567A1 (en) * | 2017-12-18 | 2019-06-20 | Intel Corporation | Robust mold integrated substrate |
| CN110176190A (en) * | 2019-06-17 | 2019-08-27 | 深圳市洲明科技股份有限公司 | The preparation method and LED display of LED display module |
| CN110611016A (en) * | 2019-09-07 | 2019-12-24 | 东莞阿尔泰显示技术有限公司 | OCR film packaging process of display module |
| CN110739376A (en) * | 2019-10-23 | 2020-01-31 | 东莞市中晶半导体科技有限公司 | LED chips, display screen module and manufacturing method thereof |
| CN110797450A (en) * | 2019-10-29 | 2020-02-14 | 长春希龙显示技术有限公司 | Surface consistency encapsulation LED display unit based on mould pressing technology |
| CN110880497A (en) * | 2019-11-21 | 2020-03-13 | 东莞市中麒光电技术有限公司 | Small-spacing display screen and manufacturing method thereof |
-
2020
- 2020-03-20 CN CN202010200832.3A patent/CN113497174B/en active Active
Patent Citations (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011096864A (en) * | 2009-10-30 | 2011-05-12 | Sumitomo Bakelite Co Ltd | Semiconductor device manufacturing method, semiconductor device, electronic component manufacturing method, and electronic component |
| WO2012070612A1 (en) * | 2010-11-25 | 2012-05-31 | 住友ベークライト株式会社 | Method for producing electronic device, electronic device, method for producing electronic device package, electronic device package, and method for producing semiconductor device |
| JP2012114297A (en) * | 2010-11-25 | 2012-06-14 | Sumitomo Bakelite Co Ltd | Manufacturing method of electronic apparatus, electronic apparatus, manufacturing method of electronic apparatus package, and electronic apparatus package |
| JP2012227442A (en) * | 2011-04-21 | 2012-11-15 | Sumitomo Bakelite Co Ltd | Semiconductor device manufacturing method and semiconductor device |
| JP2012227441A (en) * | 2011-04-21 | 2012-11-15 | Sumitomo Bakelite Co Ltd | Semiconductor device manufacturing method and semiconductor device |
| JP2012227443A (en) * | 2011-04-21 | 2012-11-15 | Sumitomo Bakelite Co Ltd | Semiconductor device manufacturing method and semiconductor device |
| JP2013131532A (en) * | 2011-12-20 | 2013-07-04 | Sumitomo Bakelite Co Ltd | Method of manufacturing semiconductor device |
| CN102593327A (en) * | 2012-03-19 | 2012-07-18 | 连云港陆亿建材有限公司 | Inverted packaging technology for wafer-level LED |
| CN103378271A (en) * | 2012-04-25 | 2013-10-30 | 展晶科技(深圳)有限公司 | Packaging structure of light emitting diode and manufacturing method thereof |
| CN103165039A (en) * | 2013-04-02 | 2013-06-19 | 佛山市国星光电股份有限公司 | High-contrast light-emitting diode (LED) display module and production method thereof |
| CN103824848A (en) * | 2014-01-16 | 2014-05-28 | 大连德豪光电科技有限公司 | LED (Light Emitting Diode) display screen and manufacturing method thereof |
| CN203850334U (en) * | 2014-02-18 | 2014-09-24 | 广州市鸿利光电股份有限公司 | High-power LED package structure |
| CN103996788A (en) * | 2014-05-21 | 2014-08-20 | 广东威创视讯科技股份有限公司 | LED device for display screen and manufacturing method thereof |
| WO2017057355A1 (en) * | 2015-09-30 | 2017-04-06 | 富士フイルム株式会社 | Method for producing semiconductor element and method for producing laminate |
| CN108352331A (en) * | 2016-02-13 | 2018-07-31 | 东和株式会社 | Resin encapsulation equipment and resin encapsulation method and resin-encapsulated shaping mould |
| CN108231607A (en) * | 2016-11-29 | 2018-06-29 | Pep创新私人有限公司 | Chip packaging method and encapsulating structure |
| CN107861291A (en) * | 2017-10-24 | 2018-03-30 | 华为技术有限公司 | Backlight module, display screen and terminal |
| US20190189567A1 (en) * | 2017-12-18 | 2019-06-20 | Intel Corporation | Robust mold integrated substrate |
| CN108400220A (en) * | 2018-04-25 | 2018-08-14 | 江苏稳润光电有限公司 | A kind of encapsulating structure of miniature LED display module |
| CN109243313A (en) * | 2018-10-13 | 2019-01-18 | 长春希达电子技术有限公司 | A kind of small spacing LED display panel of high contrast COB encapsulation |
| CN109244223A (en) * | 2018-11-16 | 2019-01-18 | 深圳市洲明科技股份有限公司 | display screen |
| CN109343273A (en) * | 2018-11-23 | 2019-02-15 | 江苏新广联科技股份有限公司 | A kind of big beam angle Mini LED backlight mould group and preparation method thereof |
| CN110176190A (en) * | 2019-06-17 | 2019-08-27 | 深圳市洲明科技股份有限公司 | The preparation method and LED display of LED display module |
| CN110611016A (en) * | 2019-09-07 | 2019-12-24 | 东莞阿尔泰显示技术有限公司 | OCR film packaging process of display module |
| CN110739376A (en) * | 2019-10-23 | 2020-01-31 | 东莞市中晶半导体科技有限公司 | LED chips, display screen module and manufacturing method thereof |
| CN110797450A (en) * | 2019-10-29 | 2020-02-14 | 长春希龙显示技术有限公司 | Surface consistency encapsulation LED display unit based on mould pressing technology |
| CN110880497A (en) * | 2019-11-21 | 2020-03-13 | 东莞市中麒光电技术有限公司 | Small-spacing display screen and manufacturing method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117456854A (en) * | 2023-12-21 | 2024-01-26 | 元旭半导体科技(无锡)有限公司 | Film pressing method and device of display module and preparation method of display module |
| CN117456854B (en) * | 2023-12-21 | 2024-03-05 | 元旭半导体科技(无锡)有限公司 | Film pressing method and device of display module and preparation method of display module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113497174B (en) | 2023-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110911391B (en) | Small-space display screen module and manufacturing method thereof | |
| CN111599909B (en) | LED display screen module and preparation method thereof | |
| CN110880497B (en) | Small-spacing display screen and manufacturing method thereof | |
| CN211879404U (en) | Display substrate and display device | |
| CN112018226A (en) | LED display module and manufacturing method thereof | |
| CN109830186B (en) | Display panel and method for manufacturing the same | |
| CN113130466A (en) | LED display module and manufacturing method thereof | |
| WO2021190245A1 (en) | Display substrate and manufacturing method therefor, and display apparatus | |
| WO2021017711A1 (en) | Light-emitting device packaging member and display device | |
| CN111781772A (en) | LED backlight source, LED backlight module and preparation method | |
| US20240063360A1 (en) | Drive circuit substrate, led display panel and method of forming the same, and display device | |
| CN203433761U (en) | Light-emitting diode (LED) light-emitting display board | |
| US20020131253A1 (en) | Circuit board and method of manufacturing the same, and display device | |
| CN113497174B (en) | Small-spacing LED display screen module and manufacturing method thereof | |
| CN115394763A (en) | Display module and manufacturing method thereof | |
| CN114284420A (en) | Light emitting unit, manufacturing method thereof and light emitting assembly | |
| CN111341219B (en) | LED display screen module and preparation method thereof | |
| CN113053254A (en) | Display panel, manufacturing method thereof and display device | |
| CN209804709U (en) | Fan-out type LED packaging structure and electronic display screen | |
| CN203433760U (en) | Flexible LED (light-emitting diode) display panel | |
| US11862614B2 (en) | Micro LED display device and manufacturing method thereof | |
| CN113193101B (en) | Display panel and preparation method of barrier type blue light emitting device display | |
| CN111446352B (en) | Manufacturing method of LED display screen module | |
| TW202245245A (en) | Display panel, display backboard and manufacturing method thereof | |
| US20240038940A1 (en) | Transfer substrate used in manufacture of display apparatus, display apparatus, and manufacturing method for display apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |