CN113053254A - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN113053254A CN113053254A CN202110245859.9A CN202110245859A CN113053254A CN 113053254 A CN113053254 A CN 113053254A CN 202110245859 A CN202110245859 A CN 202110245859A CN 113053254 A CN113053254 A CN 113053254A
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
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Abstract
The application discloses a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises a display substrate, the display substrate is provided with a first display area and a second display area adjacent to the first display area, a first pixel light-emitting unit is arranged in the first display area, and the first pixel light-emitting unit comprises a plurality of Micro LED crystal grains which are arranged on the display substrate in an array mode, so that a small part of area is changed into transparent display, and real comprehensive screen display is realized; a second pixel light-emitting unit different from the first pixel light-emitting unit is arranged in the second display area, so that the cost is reduced, and the overall screen yield is improved; the side face, close to the first display area, of the display substrate is provided with a metal wire, the metal wire is used for binding the Micro LED crystal grains with the flexible circuit board, the problem that the screen boundary is large when a full screen is manufactured is solved, and extremely narrow frames are achieved.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a method for manufacturing the display panel, and a display device including the display panel.
Background
With the popularization of full-screen and the pursuit of body integration by consumers, the cup (camera under panel) technology has become the development focus in the field of medium and small size display. Because the LCD belongs to passive light emitting of whole-face backlight, the optical sensor and the optical display cannot be superposed in space, and the LCD has inherent disadvantages compared with OLED and Micro LED pixel level active light emitting display.
Micro LEDs are considered to be the next generation of display technology due to their physical characteristics of ultra-high brightness, high contrast, fast response time, good tolerance, high transparency, flexibility, etc. Micro LED display has no life problem under high current drive and afterimage problem of long-time display, and can achieve high-brightness display with smaller pixel size, so the Micro LED display is more suitable for being used as transparent display. However, the existing Micro LED mainly depends on an additive manufacturing mode of mass transfer, is lower than the mainstream LCD and OLED technologies in technical maturity, and faces a lot of challenges of high manufacturing cost of crystal grains, low yield of mass transfer, and the like, so that it is difficult to manufacture a complete Micro LED display in a large area by using the Micro LED at the present stage, and a large boundary is generated in the process of binding with a flexible circuit board, resulting in a reduction in screen occupation ratio.
Therefore, improvement is urgently needed to overcome the defects existing at present.
Disclosure of Invention
An object of the application is to provide a display panel and manufacturing method, display device thereof, through adopt Micro LED at the display area that the sensor module corresponds to become transparent display with the sub-region, in order to realize real comprehensive screen display, and walk the line and be used for binding flexible circuit board at the side preparation metal of display substrate, solved the great problem in screen boundary when comprehensive screen is made, realized extremely narrow frame.
The application provides a display panel, which comprises a display substrate, wherein the display substrate is provided with a first display area and a second display area adjacent to the first display area, a first pixel light-emitting unit is arranged in the first display area, and the first pixel light-emitting unit comprises a plurality of Micro LED crystal grains which are arranged on the display substrate in an array manner; a second pixel light-emitting unit is arranged in the second display area, and the second pixel light-emitting unit is different from the first pixel light-emitting unit; the side face, close to the first display area, of the display substrate is provided with a metal wire, and the metal wire is used for binding the Micro LED crystal grains with the flexible circuit board.
Optionally, in some embodiments of the present application, the display panel further includes: the first driving circuit is arranged on the display substrate, is positioned in the first display area or the second display area, and is used for driving the first pixel light-emitting unit; and the second drive circuit is arranged on the display substrate, is positioned in the second display area and is used for driving the second pixel light-emitting unit.
Optionally, in some embodiments of the present application, the display panel further includes an encapsulation layer, the encapsulation layer is disposed on a side of the first pixel light-emitting unit away from the display substrate and covers the first pixel light-emitting unit; the transparency of the encapsulation layer is greater than or equal to 90%; the thickness of the packaging layer is between 10um and 30 um; the flatness of the encapsulation layer is less than or equal to 2 um.
Optionally, in some embodiments of the present application, the second pixel light emitting unit is an LCD display unit; the display substrate is a color film substrate; the display panel also comprises an array substrate, and the array substrate is arranged opposite to the color film substrate; the plurality of Micro LED crystal grains are arranged on the color film substrate.
Optionally, in some embodiments of the present application, the second pixel light emitting unit is an OLED display unit; the display substrate is a glass substrate; the display panel further comprises a glass cover plate, and the glass cover plate is attached to one side, away from the display substrate, of the first pixel light-emitting unit and the second pixel light-emitting unit.
Optionally, in some embodiments of the present application, a sum of orthographic projection areas of the plurality of Micro LED dies on the display substrate is less than or equal to 30% of an area of the first display area.
Correspondingly, the application also provides a manufacturing method of the display panel, which is used for manufacturing the display panel, and the manufacturing method of the display panel comprises the following steps: step S1: providing a display substrate, wherein the display substrate is provided with a first display area and a second display area adjacent to the first display area, and metal wiring is prepared on the side surface of the display substrate close to the first display area; step S2: preparing a first pixel light-emitting unit on one side of the display substrate in the first display area and forming an encapsulation layer to cover the first pixel light-emitting unit; the first pixel light-emitting unit comprises a plurality of Micro LED crystal grains which are arranged on the display substrate in an array manner; step S3: preparing a second pixel light-emitting unit on one side of the display substrate in the second display area; the second pixel light-emitting unit and the first pixel light-emitting unit are positioned on the same side of the display substrate.
Optionally, in some embodiments of the present application, in step S1, the display substrate is a color filter substrate; in step S2, a first driving circuit is further prepared on the display substrate, and the first driving circuit is used for driving the first pixel light-emitting unit; in the step S3, the second pixel light emitting unit is an LCD display unit; the manufacturing method of the display panel further comprises the following steps: step S4: and aligning and attaching the array substrate with one side provided with a second driving circuit to the display substrate, and injecting liquid crystal between the array substrate and the display substrate to form a liquid crystal layer.
Optionally, in some embodiments of the present application, in step S1, the display substrate is a glass substrate; in step S2, a first driving circuit is further prepared on the display substrate, and the first driving circuit is used for driving the first pixel light-emitting unit; in step S3, a second driving circuit is further prepared on the display substrate, and the second driving circuit is used for driving the second pixel light-emitting unit; the second pixel light-emitting unit is an LCD display unit or an OLED display unit; the manufacturing method of the display panel further comprises the following steps: step S4: and providing a glass cover plate, and attaching the glass cover plate to one sides of the first pixel light-emitting unit and the second pixel light-emitting unit far away from the display substrate.
Correspondingly, the present application further provides a display device, including the display panel of any one of the above embodiments, the display device further including: the sensor module is arranged on one side, away from the Micro LED crystal grains, of the display substrate and corresponds to the first display area; the backlight module is arranged on one side of the display substrate, where the sensor module is arranged, and is arranged corresponding to the second display area; and the at least one polaroid is arranged on one side or two sides of the display panel and corresponds to the second display area.
Compare in prior art, this application provides a display panel, makes a brand-new full face screen with LCD or OLED and Micro LED combination, can reduce cost, promotes full face screen yield. Specifically, through adopting the Micro LED to show in the first display area that the sensor module corresponds to become transparent display with a small part region that the sensor module corresponds, thereby realize real comprehensive screen display, the while small size uses the Micro LED to show and can realize mass production under the condition that does not influence the product yield. And metal wiring is manufactured on the side face of the display substrate and used for binding the flexible circuit board, so that the problem that the screen boundary is large when the full screen is manufactured is solved, and the extremely narrow frame is realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic perspective view of a display panel according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a partial structure of a display panel according to an embodiment of the present disclosure;
FIGS. 3A-3E are schematic plan views of various embodiments of a first display area of the present application;
FIG. 4 is a schematic diagram of a Micro LED die according to one embodiment of the present application;
FIG. 5 is a schematic flow chart illustrating the fabrication of the display panel shown in FIG. 2;
FIG. 6 is a schematic diagram of a layer structure of a display panel according to an embodiment of the present disclosure;
FIG. 7 is a schematic flow chart illustrating the fabrication of the display panel shown in FIG. 6;
FIG. 8 is a schematic structural diagram of a display panel according to another embodiment of the present application;
FIG. 9 is a schematic flow chart illustrating the fabrication of the display panel shown in FIG. 8;
fig. 10 is a schematic structural diagram of a display device according to an embodiment of the present application.
Description of the main reference numerals:
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless otherwise stated, the use of directional terms such as "upper", "lower", "left" and "right" may refer to the actual use or operation of the device, may refer to the drawing direction in the drawings, and may refer to two opposite directions; while "inner" and "outer" are with respect to the outline of the device.
Specifically, referring to fig. 1 to 2, the present application provides a display panel 10, where the display panel 10 includes a display substrate 100, the display substrate 100 has a first display area 110 and a second display area 120 adjacent to the first display area 110; a first pixel light emitting unit 200 is arranged in the first display area 110, and the first pixel light emitting unit 200 includes a plurality of Micro LED dies 210 arranged in an array on the display substrate 100; a second pixel light emitting unit 300 different from the first pixel light emitting unit 200 is disposed in the second display region 120; a metal trace 400 is disposed on a side surface of the display substrate 100 close to the first display area 110, and the metal trace 400 is used for binding the plurality of Micro LED dies 210 with the flexible circuit board 20. Through the adoption of the Micro LED with high transparency in the first display area 110, full-screen display is realized, and the design of metal wiring on the side surface of the display substrate 100 is adopted, so that the boundary width of the display panel 10 can be reduced when the flexible circuit board 20 is bound on the side surface of the display substrate 100, the screen occupation ratio is improved, and the display effect is improved.
Preferably, the second pixel light emitting unit 300 is one of an LCD display unit or an OLED display unit.
As shown in fig. 3A to 3E, the shape of the first display region 110 of the display substrate 100 includes, but is not limited to, a hole shape, a water drop shape, a V-groove shape, a bang shape, and a pill shape. Since the number of the pixels of the first pixel light emitting unit 200 in the first display region 110 is small, the transfer yield of the first pixel light emitting unit 200 can be ensured, and the display effect in the second display region 120 is not affected, so that the display picture of the display panel 10 is more uniform.
In some embodiments of the present application, as shown in fig. 5 and 7, the display panel 10 further includes: a first driving circuit 500 and a second driving circuit 600; the first driving circuit 500 is disposed on the display substrate 100 and disposed in the first display region 110, and of course, may also be disposed in the second display region 120 for driving the first pixel light emitting unit 200; the second driving circuit 600 is disposed on the display substrate 100 and located in the second display region 120, and is used for driving the second pixel light emitting unit 300. Preferably, the first driving circuit 500 is disposed on the display substrate 100 and located in the second display region 110, so as to improve the transparency of the first display region 110. It can be noted by those skilled in the art that when the first driving circuit 500 is located in the second display area 110, any necessary wiring for connecting the plurality of Micro LED dies 210 remains in the first display area.
In some embodiments of the present application, as shown in fig. 5 and 7, the display panel 10 further includes an encapsulation layer 700, where the encapsulation layer 700 is disposed on a side of the first pixel light emitting unit 200 away from the display substrate 100 and covers the first pixel light emitting unit 200. The encapsulation layer 700 is a transparent material, and the transparency of the encapsulation layer is greater than or equal to 90%. Preferably, the extinction coefficient of the transparent material used for the encapsulation layer 700 is close to zero, that is, the light transmittance of the encapsulation layer 700 is close to 100%, which can ensure the brightness of the light penetrating through the encapsulation layer 700, reduce unnecessary loss of the light, and further improve the utilization rate of the backlight. The thickness of the encapsulation layer 700 is between 10um to 30um, for example: 15um, 20um, 25um, etc., but is not limited thereto. This arrangement can ensure the flatness of the encapsulation layer 700, and since the surface of the first pixel light-emitting unit 200 is not flat, there is a certain error inevitably in the preparation process of the encapsulation layer 700, and when the encapsulation layer 700 reaches a certain thickness, the encapsulation layer 700 becomes flat, preferably, the flatness of the encapsulation layer 700 is less than or equal to 2um, for example: the thickness of the encapsulation layer 700 is 20um +/-2 um; on the other hand, unnecessary loss caused by interference of the external environment on the first pixel light emitting unit 200 can be effectively prevented, the first pixel light emitting unit 200 can be effectively protected, and the stability of the first pixel light emitting unit 200 can be improved. The material of the encapsulation layer 700 includes at least one of silicon oxide, silicon nitride, and silicon oxynitride, but is not limited thereto, and may be other materials.
In some embodiments of the present application, the sum of the forward projected areas of the plurality of Micro LED dies 210 on the display substrate 100 is less than or equal to 30% of the area of the first display area 110. In other words, the size of the plurality of Micro LED dies 210 occupies at most 30% of the size of the first display area 110, that is, the transparency of the first display area 110 is at least greater than or equal to 70%. The size of the single Micro LED die 210 is between 1un and 100um, and the size of the single first sub-pixel light emitting unit in the first pixel light emitting unit 200 is between 10un and 500um, specifically, the smaller the size ratio of the single Micro LED die 210 to the single first sub-pixel light emitting unit is, the higher the transparency of the first display area 110 is, and when the area of the first pixel light emitting unit 200 is fixed, the smaller the size of the single first sub-pixel light emitting unit is, the higher the pixel density of the first pixel light emitting unit 200 is, the higher the display resolution is. Therefore, the size of the single Micro LED die 210 and the size of the single first sub-pixel light emitting unit can be selected reasonably according to practical situations.
Specifically, referring to fig. 4, in some embodiments of the present application, the light emitting manner of the Micro LED die 210 includes: the electrode surface emits light and the basal surface emits light. As shown in fig. 4, the Micro LED die 210 includes a substrate 211, and a buffer layer 212, an N-type semiconductor layer 213, a light emitting function layer 214 and a P-type semiconductor layer 215 sequentially deposited on the substrate 211, wherein the Micro LED die 210 further includes an N-type electrode 216 and a P-type electrode 217, the N-type electrode 216 is in contact with the N-type semiconductor layer 213, and the P-type electrode 217 is in contact with the P-type semiconductor layer 215. When the Micro LED die 210 emits light on an electrode surface, the light emitted from the light-emitting functional layer 214 is emitted from one side of the N-type electrode 216 and the P-type electrode 217; when the Micro LED die 210 emits light for a substrate surface, the light emitted from the light emitting functional layer 214 is emitted from one side of the substrate 211. Therefore, for the display panels with different structures, the Micro LED dies 210 with different light emitting modes can be adopted. In addition, the Micro LED die 210 in the embodiment of the present application is not limited to the one shown in fig. 4, and may have other structures, which are not described in detail herein.
Specifically, referring to fig. 2 to 5, the present application further provides a manufacturing method of the display panel 10 shown in fig. 2, where the manufacturing method of the display panel 10 includes the following steps:
step S1: providing a display substrate 100 having a first display area 110 and a second display area 120 adjacent to the first display area 110, and preparing a metal trace 400 on a side surface of the display substrate 100 close to the first display area 110;
step S2: preparing a first pixel light emitting unit 200 on one side of the display substrate 110 in the first display region 110 and forming an encapsulation layer 700 to cover the first pixel light emitting unit 200; the first pixel light emitting unit 200 includes a plurality of Micro LED dies 210 arranged in an array on the display substrate 100;
step S3: preparing a second pixel light emitting unit 300 on one side of the display substrate 100 in the second display region 120; the second pixel light emitting unit 300 and the first pixel light emitting unit 200 are located on the same side of the display substrate 100.
Specifically, referring to fig. 6 to 7, in some embodiments of the present application, the display substrate 100 is a color film substrate 101. The display panel 10 includes a color film substrate 101, an array substrate 102, and a liquid crystal layer 103 disposed between the color film substrate 101 and the array substrate 102. The first pixel light emitting unit 200 is disposed on a side of the color film substrate 101 facing the array substrate 102, the first pixel light emitting unit 200 is located in the first display area 110, and the first pixel light emitting unit 200 includes a plurality of Micro LED dies 210 disposed in an array. The first driving circuit 500 is disposed between the color film substrate 101 and the first pixel light emitting unit 200 and located in the first display region 110, and is configured to drive the first pixel light emitting unit 200; the encapsulation layer 700 is disposed on a side of the first pixel light emitting unit 200 away from the color film substrate 101, and covers the first pixel light emitting unit 200; the second pixel light emitting unit 300 is disposed on a side of the color film substrate 101 facing the array substrate 102 and located in the second display region 120. That is, the second pixel light emitting unit 300 and the first pixel light emitting unit 200 are disposed on the same side of the color film substrate 101. The second driving circuit 600 is disposed on the array substrate 102 and in the second display region 120, and is configured to drive the second pixel light emitting unit 300; the liquid crystal layer 103 is disposed between the color film substrate 101 and the array substrate 102, and is at least located in the second display region; a metal trace 400 is disposed on a side surface of the color film substrate 101 close to the first display area 110, and the metal trace 400 is used for binding the plurality of Micro LED dies 210 with the flexible circuit board 20.
In this embodiment, please refer to fig. 6 and fig. 7, the method for manufacturing the display panel 10 includes the following steps:
step S1: providing a display substrate 100 having a first display area 110 and a second display area 120 adjacent to the first display area 110, and preparing a metal trace 400 on a side surface of the display substrate 100 close to the first display area 110; the display substrate 100 is a color film substrate 101;
step S2: preparing a first pixel light emitting unit 200 on one side of the display substrate 110 in the first display region 110 and forming an encapsulation layer 700 to cover the first pixel light emitting unit 200; the first pixel light emitting unit 200 includes a plurality of Micro LED dies 210 arranged in an array on the display substrate 100; a first driving circuit 500 is further prepared on the display substrate 100, and the first driving circuit 500 is used for driving the first pixel light emitting unit 200;
step S3: preparing a second pixel light emitting unit 300 on one side of the display substrate 100 in the second display region 120; wherein the second pixel light emitting unit 300 and the first pixel light emitting unit 200 are located on the same side of the display substrate 100; wherein the second pixel light emitting unit 300 is an LCD display unit;
step S4: providing an array substrate 102, wherein a second driving circuit 600 is arranged on one side of the array substrate 102, and aligning and attaching the array substrate 102 and the display substrate 100; after the array substrate 102 and the display substrate 100 are aligned and attached, the second driving circuit 600 is located between the array substrate 102 and the display substrate 100;
step S5: liquid crystal is injected between the array substrate 102 and the display substrate 100 to form a liquid crystal layer 103. It can be understood that in the process of manufacturing the display panel 10, a weak alkaline developing solution should be used for manufacturing the color film substrate 101, and the temperature during high-temperature drying is between 210 ℃ and 230 ℃. The array substrate 102 and the liquid crystal layer 103 are both conventional structures in the art, and the liquid crystal layer 103 is sealed between the color film substrate 101 and the array substrate 102 through a frame sealing adhesive, which is not described in detail herein.
Referring to fig. 8 to 9, in other embodiments of the present application, the display panel 10 includes a display substrate 100, the display substrate 100 has a first display area 110 and a second display area 120 adjacent to the first display area 110, a first pixel light emitting unit 200 is disposed in the first display area 110, and the first pixel light emitting unit 200 includes a plurality of Micro LED dies 210 arranged in an array on the display substrate; a second pixel light emitting unit 300 different from the first pixel light emitting unit 200 is disposed in the second display region 120; a metal trace 400 is disposed on a side surface of the display substrate 100 close to the first display area 110, and the metal trace 400 is used for binding the plurality of Micro LED dies 210 with the flexible circuit board 20. The display panel 10 further includes: a first driving circuit 500 and a second driving circuit 600; the first driving circuit 500 is disposed on the display substrate 100 and located in the first display region 110, and is configured to drive the first pixel light emitting unit 200; the second driving circuit 600 is disposed on the display substrate 100 and located in the second display region 120, and is used for driving the second pixel light emitting unit 300.
In this embodiment, please refer to fig. 8 and fig. 9 together, the method for manufacturing the display panel 10 includes the following steps:
step S1: providing a display substrate 100 having a first display area 110 and a second display area 120 adjacent to the first display area 110, and preparing a metal trace 400 on a side surface of the display substrate 100 close to the first display area 110; wherein, the display substrate 100 is a glass substrate;
step S2: preparing a first pixel light emitting unit 200 on one side of the display substrate 110 in the first display region 110 and forming an encapsulation layer 700 to cover the first pixel light emitting unit 200; the first pixel light emitting unit 200 includes a plurality of Micro LED dies 210 arranged in an array on the display substrate 100; a first driving circuit 500 is further prepared on the display substrate 100, and the first driving circuit 500 is used for driving the first pixel light emitting unit 200;
step S3: preparing a second pixel light emitting unit 300 on one side of the display substrate 100 in the second display region 120; wherein the second pixel light emitting unit 300 and the first pixel light emitting unit 200 are located on the same side of the display substrate 100; a second driving circuit 600 is further prepared on the display substrate 100, and the second driving circuit 600 is used for driving the second pixel light-emitting unit 300; the second pixel light emitting unit 300 is an LCD display unit or an OLED display unit;
step S4: a glass cover plate 800 is provided, and the glass cover plate 800 is attached to the sides of the first pixel light emitting unit 200 and the second pixel light emitting unit 300 away from the display substrate 100. In this embodiment, the second pixel light emitting unit 300 may be an LCD display unit or an OLED display unit, but is not limited thereto. Specifically, the preparation methods of the LCD display unit and the OLED display unit are conventional methods in the art, and are not described in detail herein. In the preparation method, the preparation processes of the first pixel light-emitting unit 200 and the second pixel light-emitting unit 300 include processes of photoresist coating, mask masking, exposure, development, etching, photoresist stripping and the like, and are not described in detail herein. The metal wire 400 on the side of the display substrate 100 may deposit a metal film layer on the whole side of the edge of the side by using metal evaporation, sputtering, CVD or other methods, and then burn out one wire by using a laser ablation method, or etch out each metal wire on the side of the display substrate 100 by using a photolithographic process; or the metal trace 400 may be fabricated on the side edge of the display substrate 100 by using an imprinting method, and the particular fabrication method of the metal trace 400 on the side edge of the display substrate 100 is not limited in this application, and the fabrication metal of the metal trace 400 is also not limited, for example: copper.
Specifically, referring to fig. 10, the present application further provides a display device 1, including the display panel 10 in the above embodiment, where the display device 1 further includes: the sensor module 30 is disposed on one side of the display substrate 100 and corresponds to the first display region 110. The backlight module 40 is disposed on the display substrate 100 and disposed on the same side as the sensor module 30, and the backlight module 40 corresponds to the second display area 120. It can be understood that, when the second display region is OLED display, the backlight module 40 is not required because the OLED is self-luminous display.
In some embodiments of the present application, a polarizer 50 is disposed on at least one side of the display panel 10, and the polarizer 50 is disposed corresponding to the second display region 120. The polarizer 50 may be disposed on only one side of the display panel 10, or may be disposed on both sides of the display panel, which is not limited in this application.
Compared with the prior art, the display panel 10 provided by the application has the advantages that the LCD or the OLED and the Micro LED are combined to form a brand-new full-face screen, the cost can be reduced, and the yield of the full-face screen is improved. Specifically, the Micro LED is adopted for display in the first display area 110 corresponding to the sensor module 30, so that a small part of the area corresponding to the sensor module 30 is changed into transparent display, real full screen display is realized, and mass production can be realized by using the Micro LED for display in a small area without influencing the yield of products. And the metal wiring 400 is manufactured on the side surface of the display substrate 100 for binding the flexible circuit board 20, so that the problem of large screen boundary in the manufacturing of the full screen is solved, and an extremely narrow frame is realized.
The beneficial effects of the display device 1 provided in the present application are the same as the beneficial effects of the display panel 10 provided in the above embodiments, and are not described herein again. The display device 1 may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, or a navigator, and is preferably a product with a transparent display.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The color film substrate 100, the manufacturing method thereof, and the display device 10 provided in the embodiments of the present application are described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present application, and the description of the embodiments is only used to help understand the method and the core ideas of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A display panel comprises a display substrate, wherein the display substrate is provided with a first display area and a second display area adjacent to the first display area, and the display panel is characterized in that:
a first pixel light-emitting unit is arranged in the first display area and comprises a plurality of Micro LED crystal grains which are arranged on the display substrate in an array manner;
a second pixel light-emitting unit is arranged in the second display area, and the second pixel light-emitting unit is different from the first pixel light-emitting unit;
the side face, close to the first display area, of the display substrate is provided with a metal wire, and the metal wire is used for binding the Micro LED crystal grains with the flexible circuit board.
2. The display panel of claim 1, wherein: the display panel further includes:
the first driving circuit is arranged on the display substrate, is positioned in the first display area or the second display area, and is used for driving the first pixel light-emitting unit;
and the second drive circuit is arranged on the display substrate, is positioned in the second display area and is used for driving the second pixel light-emitting unit.
3. The display panel of claim 1, wherein: the display panel further comprises an encapsulation layer, wherein the encapsulation layer is arranged on one side of the first pixel light-emitting unit, which is far away from the display substrate, and covers the first pixel light-emitting unit;
the transparency of the encapsulation layer is greater than or equal to 90%; the thickness of the packaging layer is between 10um and 30 um; the flatness of the encapsulation layer is less than or equal to 2 um.
4. The display panel of claim 1, wherein:
the second pixel light-emitting unit is an LCD display unit;
the display substrate is a color film substrate;
the display panel also comprises an array substrate, and the array substrate is arranged opposite to the color film substrate; the plurality of Micro LED crystal grains are arranged on the color film substrate.
5. The display panel of claim 1, wherein:
the second pixel light-emitting unit is an OLED display unit;
the display substrate is a glass substrate;
the display panel further comprises a glass cover plate, and the glass cover plate is attached to one side, away from the display substrate, of the first pixel light-emitting unit and the second pixel light-emitting unit.
6. The display panel of claim 1, wherein: the sum of the orthographic projection areas of the plurality of Micro LED crystal grains on the display substrate is less than or equal to 30% of the area of the first display area.
7. A method for manufacturing a display panel, which is used for manufacturing the display panel according to claim 1, wherein: the manufacturing method of the display panel comprises the following steps:
step S1: providing a display substrate, wherein the display substrate is provided with a first display area and a second display area adjacent to the first display area, and metal wiring is prepared on the side surface of the display substrate close to the first display area;
step S2: preparing a first pixel light-emitting unit on one side of the display substrate in the first display area and forming an encapsulation layer to cover the first pixel light-emitting unit; the first pixel light-emitting unit comprises a plurality of Micro LED crystal grains which are arranged on the display substrate in an array manner;
step S3: preparing a second pixel light-emitting unit on one side of the display substrate in the second display area; the second pixel light-emitting unit and the first pixel light-emitting unit are positioned on the same side of the display substrate.
8. The method for manufacturing a display panel according to claim 7, wherein:
in step S1, the display substrate is a color film substrate;
in step S2, a first driving circuit is further prepared on the display substrate, and the first driving circuit is used for driving the first pixel light-emitting unit;
in the step S3, the second pixel light emitting unit is an LCD display unit;
the manufacturing method of the display panel further comprises the following steps:
step S4: providing an array substrate, wherein a second driving circuit is arranged on one side of the array substrate, and the array substrate and the display substrate are aligned and attached;
step S5: and injecting liquid crystal between the array substrate and the display substrate to form a liquid crystal layer.
9. The method for manufacturing a display panel according to claim 7, wherein:
in step S1, the display substrate is a glass substrate;
in step S2, a first driving circuit is further prepared on the display substrate, and the first driving circuit is used for driving the first pixel light-emitting unit;
in step S3, a second driving circuit is further prepared on the display substrate, and the second driving circuit is used for driving the second pixel light-emitting unit; the second pixel light-emitting unit is an LCD display unit or an OLED display unit;
the manufacturing method of the display panel further comprises the following steps:
step S4: and providing a glass cover plate, and attaching the glass cover plate to one sides of the first pixel light-emitting unit and the second pixel light-emitting unit far away from the display substrate.
10. A display device comprising the display panel according to any one of claims 1 to 6, characterized in that: the display device further includes:
the sensor module is arranged on one side, away from the Micro LED crystal grains, of the display substrate and corresponds to the first display area;
the backlight module is arranged on one side of the display substrate, where the sensor module is arranged, and is arranged corresponding to the second display area;
and the at least one polaroid is arranged on one side or two sides of the display panel and corresponds to the second display area.
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| CN202110245859.9A CN113053254A (en) | 2021-03-05 | 2021-03-05 | Display panel, manufacturing method thereof and display device |
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| CN202110245859.9A CN113053254A (en) | 2021-03-05 | 2021-03-05 | Display panel, manufacturing method thereof and display device |
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