CN112086037A - Display panel - Google Patents
Display panel Download PDFInfo
- Publication number
- CN112086037A CN112086037A CN202011022602.9A CN202011022602A CN112086037A CN 112086037 A CN112086037 A CN 112086037A CN 202011022602 A CN202011022602 A CN 202011022602A CN 112086037 A CN112086037 A CN 112086037A
- Authority
- CN
- China
- Prior art keywords
- thin film
- film transistor
- glass substrate
- display panel
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Computer Hardware Design (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a display panel including: the light-emitting diode comprises a glass substrate, a thin film transistor circuit layer, a light blocking layer, a light-emitting unit, a packaging layer, a binding terminal and a PCB board, wherein the glass substrate is used as a bottom plate, the thin film transistor circuit layer is arranged on the glass substrate, and the Mini LED or the Micro LED light-emitting unit is welded on the thin film transistor circuit layer. The pixel driving circuit of the invention adopts an active matrix active driving and an external complement driving framework. And finally, connecting the PCB on the back of the glass substrate through a chip on film.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel.
Background
At present, most of LED display screens adopt a module design structure based on a Printed Circuit Board (PCB) and LED lamp beads and adopt a driving mode of passive driving mode (PM) dynamic scanning, but the structure can not further reduce the distance between LEDs and improve the performance under the condition of low cost benefit; the main reason is that the smaller the space is, the smaller the lamp beads need to be welded on the front surface of the PCB, and the more driver ICs are needed on the back surface of the PCB, which finally results in that the driver ICs on the back surface cannot be arranged, and if the size of the driver ICs is reduced, the cost is increased.
With the rapid development of the current Mini LED, Micro LED and large-size touch, a large-size touch display with active light emission is urgently needed.
Disclosure of Invention
The invention aims to provide a display panel, which combines a Mini LED and a Micro LED in an active driving light-emitting mode.
The present invention provides a display panel including: a glass substrate having a display region and a non-display region; the thin film transistor circuit layer is arranged on the display area of the glass substrate and comprises a pixel driving circuit which is actively driven by an active matrix; the light blocking layer is arranged on the thin film transistor circuit layer and comprises through holes corresponding to the sub-pixels; the light-emitting unit is arranged in the through hole and connected with the thin film transistor circuit layer; the packaging layer is arranged on the light blocking layer and covers the light emitting unit; the PCB is arranged below the glass substrate and is connected to the upper side of the glass substrate through a chip on film.
Further, the light emitting unit includes a Mini LED or a Micro LED.
Further, the display panel further includes: and the binding terminal is arranged on the non-display area of the glass substrate, and the chip on film passes through the binding terminal and the upper side of the glass substrate.
Further, the chip on film includes: an upper transverse portion disposed between the binding terminal and the light blocking layer; a vertical part having one end connected to the upper horizontal part and attached to the right side of the glass substrate; and the lower transverse part is parallel to the upper transverse part and is connected with the other end of the vertical part, and the PCB is arranged on the lower transverse part.
The binding terminal includes: a first upper transverse portion disposed between the non-display region of the glass substrate and the light blocking layer; the first vertical part is arranged on the right side of the glass substrate, and one end of the first vertical part is connected with the first upper transverse part.
Further, the chip on film includes: the second vertical part is attached to the first vertical part and extends upwards to the lower surface of the light blocking layer; and the second lower transverse part is vertically connected with one end of the second vertical part, and the PCB is arranged on the second lower transverse part.
Further, the binding terminal further includes: a first lower lateral portion parallel to the first upper lateral portion and connecting the other end of the first vertical portion; the chip on film is attached to the lower side of the first lower transverse part, and the PCB is arranged on the chip on film.
Further, the chip on film includes: a second upper transverse portion attached to a lower side of the first lower transverse portion; a second vertical portion having one end connected to the second upper lateral portion; the second lower transverse part is parallel to the second upper transverse part and is connected with the other end of the second vertical part, and the PCB is arranged on the second lower transverse part; wherein, the pattern shape of the chip on film comprises a zigzag shape.
Further, the pixel driving circuit includes: the grid electrode of the first thin film transistor is connected with the scanning line, the source electrode of the first thin film transistor is connected with the data line, and the drain electrode of the first thin film transistor is connected with a first node; a gate of the second thin film transistor is connected with the first node, a source of the second thin film transistor is connected with the second node, and a drain of the second thin film transistor is connected with a high-voltage source; a gate of the third thin film transistor is connected with the sensing line, a source of the third thin film transistor is connected with the second node, and a drain of the second thin film transistor is connected with the detection line; one end of the capacitor is connected with the first node, and the other end of the capacitor is connected with the second node; and the anode of the LED is connected with the second node, and the cathode of the LED is grounded.
Further, the binding region of the non-display region is single-side binding or double-side binding.
The invention has the beneficial effects that: the invention provides a display panel, which adopts a glass substrate as a bottom plate, a thin film transistor circuit layer is arranged on the glass substrate, and a Mini LED or Micro LED light-emitting unit is welded on the thin film transistor circuit layer. The pixel driving circuit of the invention adopts an active matrix active driving and an external complement driving framework. And finally, connecting the PCB on the back of the glass substrate through a chip on film.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 is a schematic structural diagram of a display panel provided in embodiment 1 of the present invention.
Fig. 2 is a schematic diagram of a pixel driving circuit according to embodiment 1 of the present invention.
Fig. 3 is a schematic diagram of single-side binding provided in embodiment 1 of the present invention.
Fig. 4 is a schematic diagram of double-side binding according to embodiment 1 of the present invention.
Fig. 5 is a schematic structural diagram of a display panel provided in embodiment 2 of the present invention.
Fig. 6 is a schematic structural diagram of a display panel provided in embodiment 3 of the present invention.
a glass substrate 101; a thin film transistor circuit layer 102; light-blocking layers 103, 103 a;
a light emitting unit 104; an encapsulation layer 105; binding terminals 106, 106a, 106 b;
chip on films 107, 107a, 107 b; PCB boards 108, 108a, 108 b; a display area 110;
a non-display area 120; an upper transverse portion 1071; the vertical portion 1072;
a lower transverse portion 1073; first upper lateral portions 1061a, 1061 b; the first vertical portions 1062a, 1062 b;
the second vertical portion 1072 a; the second lower lateral portion 1073 a; a first lower transverse portion 1063 b;
the second upper transverse portion 1071 b; the second vertical portion 1072 b; the second lower transverse portion 1073 b.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1, embodiment 1 of the present invention provides a display panel 100, including: a glass substrate 101, a thin film transistor circuit layer 102, a light blocking layer 103, a light emitting unit 104, an encapsulation layer 105, a bonding terminal 106, a chip on film 107, and a PCB board 108.
The glass substrate 101 has a display region 110 and a non-display region 120.
The thin film transistor circuit layer 102 is disposed on the display region 110 of the glass substrate 101, and the thin film transistor circuit layer 102 includes a pixel driving circuit, which is an active matrix active driving circuit.
The light blocking layer 103 is disposed on the thin film transistor circuit layer 102. The material of the light blocking layer 103 includes black oil or BM. The light blocking layer 103 includes via holes 1031 corresponding to the display panel sub-pixels.
The light emitting unit 104 is disposed in the through hole 1031 and connected to the thin film transistor circuit layer 102.
The encapsulation layer 105 is disposed on the light blocking layer 103 and covers the light emitting unit 104.
The PCB 108 is disposed below the glass substrate 101, the PCB 108 is connected to the upper side of the glass substrate 101 through the flip chip film 107, and the specific connection position is in the non-display area 120.
The light emitting unit 104 includes a Mini LED or a Micro LED. A window design (i.e., a through hole 1031) is performed on the light blocking layer 103 region corresponding to the light emitting unit 104, and the light emitting unit 104 is soldered on the thin film transistor circuit layer 102.
The bonding terminal 106 is disposed on the non-display area 120 of the glass substrate 101, and the flip chip 107 passes through the bonding terminal 106 and the glass substrate 101.
The chip on film 107 includes: an upper lateral portion 1071, a vertical portion 1072, and a lower lateral portion 1073.
The upper lateral portion 1071 is disposed between the binding terminal 106 and the light blocking layer 103.
One end of the vertical portion 1072 is connected to the upper lateral portion 1071 and attached to the right side of the glass substrate 101.
The lower lateral portion 1073 is parallel to the upper lateral portion 1071 and connected to the other end of the vertical portion 1072, and the PCB 108 is disposed on the lower lateral portion 1073.
As shown in fig. 2, the pixel drive circuit (3T1C) includes: a first thin film transistor T1, a second thin film transistor T2, a third thin film transistor T3, a capacitor Cs, and an LED.
The gate of the first thin film transistor T1 is connected to the Scan line Scan, the source of the first thin film transistor T1 is connected to the Data line Data, and the drain of the first thin film transistor T1 is connected to the first node G.
The gate of the second thin film transistor T2 is connected to the first node G, the source of the second thin film transistor T2 is connected to the second node S, and the drain of the second thin film transistor T2 is connected to a high voltage source VDD.
A gate of the third tft T3 is connected to the Sense line Sense, a source of the third tft T3 is connected to the second node S, and a drain of the second tft T3 is connected to the sensing line Vref.
One end of the capacitor Cs is connected with the first node G, and the other end of the capacitor Cs is connected with the second node S;
the anode of the LED is connected with the second node, and the cathode of the LED is grounded.
In embodiment 1, the bonding region of the non-display region 120 is a single-sided bonding (as shown in fig. 3) or a double-sided bonding (as shown in fig. 4), and the structure of the narrow bonding of the chip on film 107(COF) is adopted in embodiment 1.
The invention provides embodiment 1, which adopts a glass substrate 101 as a bottom plate material, a thin film transistor circuit layer 102 is arranged on the glass substrate 101, and a Mini LED or Micro LED light-emitting unit 104 is welded on the thin film transistor circuit layer 102. The pixel driving circuit of the invention adopts an active matrix active driving and an external complement driving framework. And finally, the PCB 108 on the back of the glass substrate 101 is connected through the flip-chip film 107.
The externally compensated driving framework is a pixel compensation circuit and is connected with the detection line Vref.
As shown in fig. 5, an embodiment 2 of the present invention provides a display panel 100a, which is different from the embodiment 1 in that the display panel 100a adopts a COF side bonding structure.
Specifically, the binding terminal 106a includes: a first upper lateral portion 1061a and a first vertical portion 1061 a.
The first upper transverse portion 1061a is disposed between the non-display area 120a of the glass substrate 101 and the light blocking layer 103 a.
The first vertical portion 1061a is disposed at the right side of the glass substrate 101a and has one end connected to the first upper horizontal portion 1061 a.
The chip on film 107a includes: a second vertical portion 1072a and a second lower lateral portion 1073 a.
The second vertical portion 1072a is attached to the first vertical portion 1061a and extends up to the lower surface of the light blocking layer 103 a.
The second lower lateral portion 1073a is vertically connected to one end of the second vertical portion 1072a, and the PCB 108a is disposed on the lower second lower lateral portion 1073 a.
As shown in fig. 6, an embodiment 3 of the invention provides a display panel 100b, which is different from the embodiment 2 in that the display panel 100b adopts a COF back-bonding structure.
Specifically, the binding terminal 106b further includes: the first lower lateral portion 1063 b.
The first lower lateral part 1063b is parallel to the first upper lateral part 1061b and connects the other end of the first vertical part 1062 b.
The flip chip film 107 is attached to the lower side of the first lower lateral portion 1063b, and the PCB board 108b is disposed on the flip chip film 107 b.
Specifically, the chip on film 107b includes: a second upper lateral portion 1071b, a second vertical portion 1072b, and a second lower lateral portion 1073 b.
The second upper transverse portion 1071b is affixed to the underside of the first lower transverse portion 1063 b.
The second vertical portion 1072b has one end connected to the second upper lateral portion 1071 b.
The second lower lateral portion 1073b is parallel to the second upper lateral portion 1071b and connected to the other end of the second vertical portion 1072b, the PCB 108b is disposed on the second lower lateral portion 1073 b;
wherein, the pattern shape of the flip chip 107b includes a zigzag pattern design.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The present invention has been described in detail, and the principle and the implementation of the present invention are explained by applying specific examples, and the description of the above examples is only used to help understanding the technical scheme and the core idea of the present invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A display panel, comprising:
a glass substrate having a display region and a non-display region;
the thin film transistor circuit layer is arranged on the display area of the glass substrate and comprises a pixel driving circuit which is actively driven by an active matrix;
the light blocking layer is arranged on the thin film transistor circuit layer and comprises through holes corresponding to the sub-pixels;
the light-emitting unit is arranged in the through hole and connected with the thin film transistor circuit layer;
the packaging layer is arranged on the light blocking layer and covers the light emitting unit; and
the PCB is arranged below the glass substrate and is connected to the upper side of the glass substrate through a chip on film.
2. The display panel of claim 1,
the light emitting unit includes a Mini LED or a Micro LED.
3. The display panel of claim 1, further comprising:
and the binding terminal is arranged on the non-display area of the glass substrate, and the chip on film passes through the binding terminal and the upper side of the glass substrate.
4. The display panel of claim 3,
the chip on film includes:
an upper transverse portion disposed between the binding terminal and the light blocking layer;
a vertical part having one end connected to the upper horizontal part and attached to the right side of the glass substrate; and
and the lower transverse part is parallel to the upper transverse part and is connected with the other end of the vertical part, and the PCB is arranged on the lower transverse part.
5. The display panel of claim 3,
the binding terminal includes:
a first upper transverse portion disposed between the non-display region of the glass substrate and the light blocking layer; and
the first vertical part is arranged on the right side of the glass substrate, and one end of the first vertical part is connected with the first upper transverse part.
6. The touch display panel of claim 5,
the chip on film includes:
the second vertical part is attached to the first vertical part and extends upwards to the lower surface of the light blocking layer; and
and the second lower transverse part is vertically connected with one end of the second vertical part, and the PCB is arranged on the second lower transverse part.
7. The display panel of claim 5,
the binding terminal further includes:
a first lower lateral portion parallel to the first upper lateral portion and connecting the other end of the first vertical portion;
the chip on film is attached to the lower side of the first lower transverse part, and the PCB is arranged on the chip on film.
8. The display panel of claim 7,
the chip on film includes:
a second upper transverse portion attached to a lower side of the first lower transverse portion;
a second vertical portion having one end connected to the second upper lateral portion; and
the second lower transverse part is parallel to the second upper transverse part and is connected with the other end of the second vertical part, and the PCB is arranged on the second lower transverse part;
wherein, the pattern shape of the chip on film comprises a zigzag shape.
9. The display panel of claim 1,
the pixel driving circuit includes:
the grid electrode of the first thin film transistor is connected with the scanning line, the source electrode of the first thin film transistor is connected with the data line, and the drain electrode of the first thin film transistor is connected with a first node;
a gate of the second thin film transistor is connected with the first node, a source of the second thin film transistor is connected with a second node, and a drain of the second thin film transistor is connected with a high-voltage source;
a gate of the third thin film transistor is connected with the sensing line, a source of the third thin film transistor is connected with the second node, and a drain of the second thin film transistor is connected with the detection line; and
one end of the capacitor is connected with the first node, and the other end of the capacitor is connected with the second node;
and the anode of the LED is connected with the second node, and the cathode of the LED is grounded.
10. The display panel of claim 1,
and the binding area of the non-display area is single-side binding or double-side binding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011022602.9A CN112086037A (en) | 2020-09-25 | 2020-09-25 | Display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011022602.9A CN112086037A (en) | 2020-09-25 | 2020-09-25 | Display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112086037A true CN112086037A (en) | 2020-12-15 |
Family
ID=73738881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011022602.9A Pending CN112086037A (en) | 2020-09-25 | 2020-09-25 | Display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112086037A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112634826A (en) * | 2021-01-07 | 2021-04-09 | 深圳市华星光电半导体显示技术有限公司 | micro-LED display panel, micro-LED pixel circuit and display device |
| CN112767852A (en) * | 2021-02-26 | 2021-05-07 | Tcl华星光电技术有限公司 | Mini light-emitting diode display panel for transparent display and splicing screen |
| CN113053254A (en) * | 2021-03-05 | 2021-06-29 | 武汉华星光电技术有限公司 | Display panel, manufacturing method thereof and display device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206819717U (en) * | 2017-11-07 | 2017-12-29 | 深圳市华星光电半导体显示技术有限公司 | OLED display |
| CN108877685A (en) * | 2018-07-20 | 2018-11-23 | 深圳市华星光电半导体显示技术有限公司 | A kind of OLED pixel driving circuit and OLED display |
| CN110323231A (en) * | 2019-07-11 | 2019-10-11 | 福州京东方光电科技有限公司 | Array substrate, display panel, display device and preparation method thereof |
| CN110379322A (en) * | 2019-07-15 | 2019-10-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel, display module and display device |
| CN110853572A (en) * | 2019-11-27 | 2020-02-28 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
| CN110880497A (en) * | 2019-11-21 | 2020-03-13 | 东莞市中麒光电技术有限公司 | Small-spacing display screen and manufacturing method thereof |
| CN111048040A (en) * | 2020-01-02 | 2020-04-21 | 深圳市华星光电半导体显示技术有限公司 | Pixel driving circuit voltage compensation method, voltage compensation circuit and display panel |
| CN111081158A (en) * | 2019-12-30 | 2020-04-28 | 深圳市华星光电半导体显示技术有限公司 | Spliced display screen, preparation method thereof and display device |
-
2020
- 2020-09-25 CN CN202011022602.9A patent/CN112086037A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206819717U (en) * | 2017-11-07 | 2017-12-29 | 深圳市华星光电半导体显示技术有限公司 | OLED display |
| CN108877685A (en) * | 2018-07-20 | 2018-11-23 | 深圳市华星光电半导体显示技术有限公司 | A kind of OLED pixel driving circuit and OLED display |
| CN110323231A (en) * | 2019-07-11 | 2019-10-11 | 福州京东方光电科技有限公司 | Array substrate, display panel, display device and preparation method thereof |
| CN110379322A (en) * | 2019-07-15 | 2019-10-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel, display module and display device |
| CN110880497A (en) * | 2019-11-21 | 2020-03-13 | 东莞市中麒光电技术有限公司 | Small-spacing display screen and manufacturing method thereof |
| CN110853572A (en) * | 2019-11-27 | 2020-02-28 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
| CN111081158A (en) * | 2019-12-30 | 2020-04-28 | 深圳市华星光电半导体显示技术有限公司 | Spliced display screen, preparation method thereof and display device |
| CN111048040A (en) * | 2020-01-02 | 2020-04-21 | 深圳市华星光电半导体显示技术有限公司 | Pixel driving circuit voltage compensation method, voltage compensation circuit and display panel |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112634826A (en) * | 2021-01-07 | 2021-04-09 | 深圳市华星光电半导体显示技术有限公司 | micro-LED display panel, micro-LED pixel circuit and display device |
| CN112767852A (en) * | 2021-02-26 | 2021-05-07 | Tcl华星光电技术有限公司 | Mini light-emitting diode display panel for transparent display and splicing screen |
| CN113053254A (en) * | 2021-03-05 | 2021-06-29 | 武汉华星光电技术有限公司 | Display panel, manufacturing method thereof and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112086037A (en) | Display panel | |
| US20210296394A1 (en) | Array substrate and preparation method therefor, and display panel and display device | |
| JP4367346B2 (en) | ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE | |
| KR101484642B1 (en) | Organic light emitting display device | |
| CN111999936A (en) | Backlight module and display device | |
| KR101457683B1 (en) | Liquid Crystal Display | |
| US9406250B2 (en) | Display panel and method of detecting defects thereof | |
| US20070273807A1 (en) | Printed circuit board for flat panel display, flat panel display having the same, and method thereof | |
| US20050253790A1 (en) | Display apparatus and image reading/displaying system incorporating the same | |
| US7982727B2 (en) | Display apparatus | |
| JP2000276068A (en) | Display device and electronic equipment | |
| CN109683363B (en) | Liquid crystal display panel and display device | |
| US9313889B2 (en) | Display apparatus | |
| US10429700B2 (en) | Display module and display device | |
| CN113421906A (en) | Display panel and display device | |
| KR102206411B1 (en) | Display device, electronic device and method of manufacturing display device | |
| US11329259B2 (en) | Display panel comprising capacitor structure between first plate and second plate, and method of fabricating thereof | |
| US20190025629A1 (en) | Display device and smart mobile device | |
| US20070035689A1 (en) | Printed circuit board and liquid crystal display having the same | |
| KR101937743B1 (en) | Backlgiht unit and liquid crystal display device the same | |
| CN114497103A (en) | Splicing display module, preparation method and display device | |
| CN111258141A (en) | Display panel and display device | |
| KR101323456B1 (en) | Liquid crystal display device | |
| US20230269976A1 (en) | Drive substrate, light-emitting panel and display device | |
| TWI276863B (en) | Electrooptical device and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201215 |
|
| RJ01 | Rejection of invention patent application after publication |