CN107275232A - Resin molding apparatus and method, fortune deflector roll and resin molding apparatus are with supplying film device - Google Patents

Resin molding apparatus and method, fortune deflector roll and resin molding apparatus are with supplying film device Download PDF

Info

Publication number
CN107275232A
CN107275232A CN201710141418.8A CN201710141418A CN107275232A CN 107275232 A CN107275232 A CN 107275232A CN 201710141418 A CN201710141418 A CN 201710141418A CN 107275232 A CN107275232 A CN 107275232A
Authority
CN
China
Prior art keywords
mould
roller
resin
release membrance
rotary shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710141418.8A
Other languages
Chinese (zh)
Inventor
山田哲也
後藤智行
市桥秀男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of CN107275232A publication Critical patent/CN107275232A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/36—Removing moulded articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/04—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles using movable moulds not applied
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/26—Moulds or cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/38—Heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The present invention provides resin molding apparatus and method, fortune deflector roll and resin molding apparatus with film device is supplied, fold or the flexure produced for reducing in film and be molded with resin.Resin molding apparatus carries out matched moulds to be molded with resin using the shaping mould for being provided with die cavity at least one mould in the first mould and the second mould opposite each other, and to shaping mould, and it possesses：Delivering mechanism, for sending out film between the first mould and the second mould；Spooler, for batching film between the first mould and the second mould；First roller, is arranged on delivering mechanism side；Second roller, is arranged on spooler side；With main cartridge, the one end of at least one rotary shaft in the rotary shaft of the first roller and the rotary shaft of the second roller and the other end are separately installed with multiple main cartridges, in multiple main cartridges, the external diameter of the main cartridge in outside is more than the external diameter of the main cartridge of inner side, and multiple main cartridges can be loaded and unloaded relative to the rotary shaft at respective place.

Description

Resin molding apparatus and method, fortune deflector roll and resin molding apparatus are with supplying film device
Technical field
The present invention relates to a kind of resin used in situation etc. that resin-encapsulated is carried out to shaped like chips electronic device into Type device, resin molding method, fortune deflector roll and resin molding apparatus are with supplying film device.
Background technology
In the past, using resin forming technology and by the hardening resin after resin forming come to the chip on substrate Shape electronic device (following, to be properly called " chip ") carries out resin-encapsulated.Chip includes transistor, integrated circuit (Integrated Circuit：IC), light emitting diode (Light Emitting Diode：The semiconductor chip such as LED).As Substrate, can enumerate semiconductor substrate (Semiconductor Wafer), the printed base plate (PCB of silicon substrate etc.：Printed Circuit Board), lead frame (lead frame), ceramic substrate (ceramics substrate) etc..It is used as resin forming Technology, can enumerate transfer moudling, compression forming methods (compression molding), injection molding (injection molding) method etc..
Sometimes mould release membrance (mold release film) is used when carrying out resin-encapsulated.Mould release membrance prevents hardening resin to be attached directly into On the type face of pattern.In other words, mould release membrance is that resin attachment prevents film.By using mould release membrance, resin-encapsulated has the base of chip Plate (products formed；Encapsulate metacoxal plate) easily from the type emaciated face mould of shaping mould.
It is used as the semiconductive resin packaging system that mold release film will not be made to produce fold, it is known that following semiconductive resin encapsulation Device ([0006] section and Fig. 1 for example, referring to patent document 1~3 figure)：A kind of " semiconductive resin packaging system, using de- Mould film, the mold release film to semiconductor element with mould using resin-encapsulated when carrying out resin-encapsulated, by these resin-encapsulateds Semiconductor element afterwards is from the mold releasability, and the semiconductive resin packaging system is using drum type roller as by the demoulding Film is transported to the roller on the position of the mould to use ".
Patent document 1：Japanese patent application discloses 2004-39823 publications
But, the problem of the existing semiconductive resin packaging system disclosed in patent document 1 has following.Such as patent Shown in Fig. 3 of document 1, flexure when mold release film 1 is sent out can be suppressed by using drum type roller 6,7.According to product, used Material, thickness, the width of mold release film etc. it is different.Therefore, in identical resin encapsulation equipment, it is possible to can not utilize Used mold release film come suppress flexure.At this time, it may be necessary to redesign and make the drum type with shape corresponding with mold release film Roller.
The content of the invention
The present invention is used to solve the above problems, and its object is to provide a kind of resin molding apparatus, resin molding method, fortune Deflector roll and resin molding apparatus are with film device is supplied, and the resin molding apparatus can be readily applied to different multiple films and can drop The fold or the flexure that are produced in low film and be molded with resin.
In order to solve the above problems, resin molding apparatus of the invention is used in the first mould opposite each other and second The shaping mould of die cavity is provided with least one mould in mould, and the shaping mould is carried out matched moulds to be molded with resin, institute Resin molding apparatus is stated to possess：
Delivering mechanism, for sending out film between first mould and second mould；
Spooler, for batching the film between first mould and second mould；
First roller, is arranged on the delivering mechanism side；
Second roller, is arranged on the spooler side；With
Main cartridge, at least one rotary shaft in the rotary shaft of first roller and the rotary shaft of second roller One end and the other end be separately installed with multiple main cartridges,
In multiple main cartridges, the external diameter of the main cartridge in outside is more than the outer of the main cartridge of inner side Footpath,
Multiple main cartridges can be loaded and unloaded relative to the rotary shaft at respective place.
In order to solve the above problems, resin molding method of the invention is used in the first mould opposite each other and second The shaping mould of die cavity is provided with least one mould in mould, and the shaping mould is carried out matched moulds to be molded with resin, institute Stating resin molding method includes：
Using the first roller between first mould and second mould send out film process；With
The process for batching the film between first mould and second mould using the second roller,
Cartridge is used at least one process in the process and the process batched of the submitting, described The one end and the other end of the rotary shaft of first roller and at least one rotary shaft in the rotary shaft of second roller are pacified respectively Equipped with multiple cartridges, in multiple cartridges, the power that the cartridge in outside is applied to the film is more than The cartridge of inner side is applied to the power of the film,
Multiple cartridges can be loaded and unloaded relative to the rotary shaft at respective place.
In order to solve the above problems, fortune deflector roll of the invention is used in resin molding apparatus,
The fortune deflector roll possesses cartridge, is respectively mounted in the one end of the rotary shaft of the fortune deflector roll and the other end There are multiple cartridges,
In multiple cartridges, the external diameter of the cartridge in outside is more than the external diameter of the cartridge of inner side,
Multiple cartridges can be loaded and unloaded relative to the rotary shaft at respective place.
In order to solve the above problems, resin molding apparatus of the invention possesses for film device：
Delivering mechanism, for sending out film；
Spooler, for batching the film；
First roller, is arranged on the delivering mechanism side；
Second roller, is arranged on the spooler side；
Multiple cartridges, at least one rotation in the rotary shaft of first roller and the rotary shaft of second roller The one end of axle and the other end are separately installed with multiple cartridges,
In multiple cartridges, the external diameter of the cartridge in outside is more than the external diameter of the cartridge of inner side,
Multiple cartridges can be loaded and unloaded relative to the rotary shaft at respective place.
In accordance with the invention it is possible to be readily applied to different multiple films and the fold produced in film or flexure can be reduced and entered Row resin forming.
Brief description of the drawings
Fig. 1 is the front view of the structure for the resin molding apparatus (forming unit) for representing embodiment 1.
Fig. 2 is the schematic diagram of mould release membrance feed mechanism for representing to use in the resin molding apparatus of embodiment 1, (a) It is top view, (b) is the line A-A sectional view of (a), and (c) is line B-B sectional view.
Fig. 3 (a)~(c) is represented in the resin molding apparatus of the utilization compression forming methods of embodiment 2, to die cavity Supply the schematic cross sectional views of the process of mould release membrance and resin material.
Fig. 4 (a)~(c) is represented in the resin molding apparatus of the utilization compression forming methods of embodiment 2, to installing Chip on substrate carries out the schematic cross sectional views of the process of resin-encapsulated.
Fig. 5 is that the mould release membrance feed mechanism of embodiment 3 is applied in the resin molding apparatus using transfer moudling Situation schematic cross sectional views.
Fig. 6 be by the variation of the mould release membrance feed mechanism of embodiment 4 be applied to using compression forming methods resin into The schematic cross sectional views of situation in type device.
Fig. 7 is the top view of the summary of the resin molding apparatus for the utilization compression forming methods for representing embodiment 5.
Embodiment
Below, embodiment involved in the present invention is illustrated referring to the drawings.Any width figure in present specification Carry out suitably omitting or exaggerating schematically to draw for ease of understanding.Identical accompanying drawing is used to identical structural element Mark, and suitably omit the description.
[embodiment 1]
Reference picture 1 is illustrated to the structure of the resin encapsulation equipment of embodiment involved in the present invention.In addition, at this In application documents, " resin molding apparatus " refers to the device at least with the function being molded with resin." resin molding apparatus " Also the resin molding apparatus of structure shown in Fig. 1 is included.In addition, " resin molding apparatus " also includes the tree of structure shown in aftermentioned Fig. 7 Fat shaped device 100, it regard the resin molding apparatus 1 of structure shown in Fig. 1 as a part of forming unit 2 of single unit system.
Resin molding apparatus 1 shown in Fig. 1 be using compression forming methods resin molding apparatus or use transfer moudling Resin molding apparatus.Resin molding apparatus 1 has base 3.Four as holding member are fixed with four corners of base 3 Root connecting rod 4.The top board 5 relative with base 3 is fixed with the top of four connecting rods 4 upwardly extended.Base 3 with it is upper Between pressing plate 5, the lower platen 6 relative with top board 5 with base 3 is embedded in four connecting rods 4 respectively.Connecting rod 4 is kept And fixed top board 5, and movably keep lower platen 6.Clamping 7 is fixed with the base 3.Clamping 7 be in order to The mechanism for carrying out matched moulds and die sinking and lifting lower platen 6.As clamping 7, for example, servomotor and ball can be used Combination of the combination of leading screw, hydraulic cylinder and linkage etc..Lower platen 6 is risen or fallen by clamping 7.
Mould 8 is fixed with the lower surface of top board 5.In the underface of upper mould 8, lower mould has been oppositely disposed with upper mould 8 9.Lower mould 9 is fixed on the upper surface of lower platen 6.Upper mould 8 and lower mould 9 construct together one composition pattern 10 (hereinafter referred to as " into Pattern 10 ").The heater (not shown) as heating arrangements is provided with upper mould 8 and lower mould 9.
As shown in figure 1, resin molding apparatus 1 is further equipped with mould release membrance feed mechanism 11.Mould release membrance feed mechanism 11 As for by the way that the mould release membrance 12 of strip is transported between upper mould 8 and lower mould 9 and the type face supply of mould 8 or lower mould 9 upwards Film supplying unit.Mould release membrance feed mechanism 11 is also to supply film device.In the case of the type face supply mould release membrance 12 of downward mould 9, from Type film feed mechanism 11 is arranged on the upper surface of lower platen 6.On the contrary, supplying the situation of mould release membrance 12 in the type face of upward mould 8 Under, mould release membrance feed mechanism 11 is arranged on the lower surface of top board 5.Mould release membrance feed mechanism 11 can be arranged on lower platen 6 Upper surface and the two surfaces of the lower surface of top board 5 on.
Opening and closing direction (Z-direction) of the mould release membrance feed mechanism 11 by drive mechanism (not shown) along mould is lifted.Pass through The lifting of mould release membrance feed mechanism 11 is set mould release membrance 12 is close on the type face of upper mould 8 and lower mould 9.In fig. 1 it is illustrated that downwards The type face of mould 9 supplies the example of mould release membrance 12.
Mould release membrance feed mechanism 1 possesses：Delivering mechanism 13, for the mould release membrance 12 before the use being wound up on spool to be sent Go out between upper mould 8 and lower mould 9；And spooler 14, for by the mould release membrance 12 after used use in resin forming It is wound on spool.The torque (rotary speed) of the motor (not shown) of delivering mechanism 13 is arranged at by control and is arranged at The torque (rotary speed) of the motor (not shown) of spooler 14, (arrow is used to the direct of travel of mould release membrance 12 in figure The direction of expression；Y-direction) apply appropriateness tension force (tensile force) while, mould release membrance 12 is sent out by delivering mechanism 13.
Be provided with outlet roller 15 (the first roller) between delivering mechanism 13 and shaping mould 10, the outlet roller 15 be used for by Mould release membrance 12 before the use that delivering mechanism 13 is sent out applies tension force.It is provided with and batches between shaping mould 10 and spooler 14 Roller 16 (the second roller), the takers-in 16 is applied for the mould release membrance 12 before the resin forming to being transported between upper mould 8 and lower mould 9 Plus tension force.Outlet roller 15 and takers-in 16 apply tension force to mould release membrance 12, and are transported respectively as between upward mould 8 and lower mould 9 The fortune deflector roll of mould release membrance 12 is sent to carry out function.
The resin material with characteristics such as heat resistance, release property, flexibility, extensibilities can be used in mould release membrance 12.For example, root Polytetrafluoroethylene (PTFE) (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE), polyethylene terephthalate can be used according to product (PET), perfluoroethylene-propylene (FEP), polypropylene, polystyrene or polyvinyl chloride etc..The characteristic of mould release membrance 12 is according to resinous wood Material and it is different.
Reference picture 2, on the fortune used in the mould release membrance feed mechanism 11 of the resin molding apparatus 1 of present embodiment Roller (outlet roller 15 and takers-in 16) is sent to illustrate.In fig. 2 it is shown that supplying mould release membrance to the die cavity 17 for being arranged at lower mould 9 12 example.
In mould release membrance feed mechanism 11, outlet roller 15 and takers-in 16 are used as independently up between mould 8 and lower mould 9 The fortune deflector roll for transporting mould release membrance 12 carrys out function.In addition, in the following description, outlet roller 15 and takers-in 16 are added sometimes Transport roller 18 is expressed as together.
Transport roller 18 (outlet roller 15 and takers-in 16) possesses rotary shaft 19 and can load and unload in rotary shaft 19 Multiple cartridges 20.In fig. 2 it is shown that width (the square represented with double dot dash line in Fig. 2 (a) with mould release membrance 12 Shape part) three cartridges 20a, 20b, 20c situation are accordingly separately installed with the both sides of rotary shaft 19.Cartridge 20 are configured to be located at the cartridge 20a of the inner side of rotary shaft 19 minimum outer diameter and positioned at the cartridge in the outside of rotary shaft 19 20c largest outside diameter.Therefore, transport roller 18 is with from central portion towards both ends and external diameter gradually increased stairstepping The stepped rollers of shape.In other words, in transport roller 18, with from central portion towards the interim increased side of both ends and external diameter Formula is provided with cartridge 20a, 20b, 20c.
Transport roller 18 is configured to be provided with multiple cartridges 20 in rotary shaft 19.Aluminium can be used in rotary shaft 19.Tubular The elastomeric elements such as polyurethane rubber, silicon rubber can be used in part 20.Multiple cartridges 20 can be loaded and unloaded relative to rotary shaft 19. Material, hardness, length and external diameter of cartridge 20 etc. can be simply changed.Therefore, it is possible to by changing cartridge 20 It is optimum shape by the Adjusting Shape of transport roller 18.
Reference picture 2, the operation on transporting mould release membrance 12 between upward mould 8 and lower mould 9 is illustrated.Such as Fig. 2 (b) institute Show, using the motor (not shown) for being arranged at spooler 14 and make spooler 14 with torque T1 (rotary speed r1) power Rotate counterclockwise.Meanwhile, using the motor (not shown) for being arranged at delivering mechanism 13 and with torque T2's (rotary speed r2) Power makes delivering mechanism 13 turn clockwise.The torque T1 for being applied to spooler 14 is more than the torque T2 for being applied to delivering mechanism 13 (T1>T2).In other words, the rotary speed r1 of spooler 14 is more than the rotary speed r2 (r1 of delivering mechanism 13>r2).Thus, As shown in Fig. 2 (a), in the state of tension force F1 is applied to the direct of travel of mould release membrance 12 (-Y direction) from delivering mechanism 13 to Shaping mould 10 sends out mould release membrance 12.Therefore, as shown in Fig. 2 (c), the tension force for the direct of travel for being applied to mould release membrance 12 is utilized F1, mould release membrance 12 is transported with the state being close to outlet roller 15 and takers-in 16 (transport roller 18).
In existing resin molding apparatus, it is used as using a diameter of certain cylindric roller (straight roller) of rotary shaft Transport roller.In the case where sending out mould release membrance using cylindric roller, sometimes in the direction parallel with the direct of travel of mould release membrance Upper generation multiple flexed portions (wave) as wave.Particularly, mould release membrance thickness of thin situation and mould release membrance The phenomenon is more protruded in the case that width is wide.If mould release membrance is adsorbed onto into shaping in the state of flexure is produced on mould release membrance Mould, then mould release membrance can produce fold because of flexure.If be molded with resin in the state of fold is produced, fold is transferred On products formed after to resin-encapsulated.Therefore, reduce the fold of mould release membrance and bend critically important.
In the mould release membrance feed mechanism 11 of the resin molding apparatus 1 of present embodiment, by the submitting with stairstepping Roller 15 and takers-in 16 are used as transport roller 18.Transport roller 18 is as from central portion towards both ends, external diameter gradually increases The stepped rollers with stairstepping.Therefore, the displacement (distance of rotation) of transport roller 18 is in central portion and both ends It is different.Closer to the both ends of transport roller 18, then displacement is bigger.This means the circle closer to both ends then transport roller 18 Circular velocity (peripheral speed=diameter × π × revolution) is faster.Thus, as shown in Fig. 2 (a), the volume for constructing transport roller 18 is utilized Axial direction (x direction and-x direction) of the roller 16 along rotary shaft 19 is taken to apply tension force F2 to the direct of travel (-Y direction) of mould release membrance 12. That is, the tension force F2 from the central portion of mould release membrance 12 towards double side acting is applied to mould release membrance 12.Acting on the row of mould release membrance 12 On the basis of the tension force F1 for entering direction, the tension force acted in outward direction from the central portion of mould release membrance 12 is applied to mould release membrance 12 F2.Thus, between outlet roller 15 and takers-in 16, the power pulled laterally is applied to mould release membrance 12 by takers-in 16.Cause This, can reduce the flexure produced in the mould release membrance being transported between mould 8 and lower mould 9.
Equally, between outlet roller 15 and delivering mechanism 13, applied by outlet roller 15 and pull mould release membrance 12 laterally Power.Thus, the flexure of the generation of mould release membrance 12 can be also reduced between outlet roller 15 and delivering mechanism 13.
Using as from central portion towards both ends and external diameter, gradually the increased stepped rollers with stairstepping are used as fortune Roller 18 (outlet roller 15 and takers-in 16) is sent to use.Thereby, it is possible to apply the power pulled laterally to mould release membrance 12.Accordingly, it is capable to It is enough to transport mould release membrance 12 from delivering mechanism 13 to shaping mould 10 in the case of the flexure produced in reducing mould release membrance 12.
In order to reduce the flexure produced in mould release membrance 12, the tension force acted on from the central portion of mould release membrance 12 towards outside is increased F2 is very effective.It is therefore preferable that the big polyurethane rubber of the coefficient of kinetic friction, silicon rubber etc. are used as cartridge 20.In addition, In order to increase the frictional force between transport roller 18 and mould release membrance 12, the surface of preferred pair cartridge 20 and the back side of mould release membrance 12 In at least one side implement Surface Machining.As the concrete example of Surface Machining, the texture processing with pears surface processing etc..By This, can increase the tension force F2 acted on from the central portion of mould release membrance 12 towards outside.
In the present embodiment, resin molding apparatus 1 is following structure, and it possesses：Delivering mechanism 13, for upward mould 8 Film 12 is sent out between lower mould 9；Spooler 14, for batching film 12 between upper mould 8 and lower mould 9；Outlet roller 15, it is quilt It is arranged at the second roller of the side of delivering mechanism 13；Takers-in 16, it is the second roller for being arranged at the side of spooler 14；Be used as master Cartridge 20a, 20b, 20c of cartridge, in the rotary shaft 19 of outlet roller 15 and the rotary shaft 19 of takers-in 16 extremely The one end of a few rotary shaft 19 and the other end are separately installed with multiple main cartridges, cartridge 20a, The external diameter of 20b, 20c China and foreign countries side cartridge is more than the external diameter of inner side cartridge, and cartridge 20a, 20b, 20c are relative to each It can be loaded and unloaded in rotary shaft 19 from described.
According to present embodiment, pass through at least one in the rotary shaft 19 of outlet roller 15 and the rotary shaft 19 of takers-in 16 The one end of individual rotary shaft 19 and the other end are respectively mounted multiple cartridge 20a, 20b, 20c, easily can reduce in film Fold or the flexure of generation and be molded with resin.In addition, by the way that multiple cartridge 20a, 20b, 20c are set to relative to rotation Rotating shaft can be loaded and unloaded, and can be readily applied to different multiple films.
In addition, if being to carry out surface in the way of the surface dynamic friction coefficient for increasing cartridge 20a, 20b, 20c to add The structure of work, then can further reduce the fold produced in film or flexure.
More specifically, according to present embodiment, by installing many in the rotary shaft 19 of outlet roller 15 and takers-in 16 Individual cartridge 20 constructs transport roller 18.Positioned at the cartridge 20a of the inner side of rotary shaft 19 minimum outer diameter and to be located at The mode of the cartridge 20c in the outside of rotary shaft 19 largest outside diameter constructs cartridge 20.Therefore, transport roller 18 have with From central portion towards both ends and external diameter gradually increased stairstepping.Thereby, it is possible to apply mould release membrance 12 from mould release membrance 12 Central portion outward direction effect tension force F2.Due to being applied by using the transport roller 18 with stairstepping to mould release membrance 12 Plus the power pulled laterally, therefore, it is possible to reduce the flexure produced in mould release membrance 12.
According to present embodiment, multiple cartridges 20 are installed in the rotary shaft 19 of transport roller 18 to construct transport roller. Multiple cartridges 20 can be loaded and unloaded relative to rotary shaft 19.The shape of transport roller 18 can be adjusted by changing cartridge 20 Shape.Therefore, can be according to the material of mould release membrance 12, thickness, width etc., by cylindrical portion in order to reduce the generation of fold or flexure Length, quantity, wall thickness of part 20 etc. are set to optimum structure.Furthermore it is possible to by finely tune position of multiple cartridges 20 etc. come Suppress the bending of mould release membrance 12 and advance or tilt traveling.
According to present embodiment, can utilize installed in rotary shaft 19 this easy method of multiple cartridges 20 come Adjust the shape of transport roller 18.Transport roller is remake without the characteristic according to mould release membrance 12.Therefore, it is possible to suppress mould release membrance The cost of feed mechanism 11 (resin molding apparatus 1).
According to present embodiment, outlet roller 15 and takers-in 16 are set to be used as transport roller 18.Not limited to this, can send Go out between mechanism 13 and outlet roller 15 and multiple transport roller with stairstepping are further set.Can be in takers-in 16 with batching Multiple transport roller with stairstepping are further set between mechanism 14.Thereby, it is possible to multiple positions to strip from Type film 12 transports mould release membrance 12 while applying the tension force acted on towards outside.
In the present embodiment, to being provided with the structure of cartridge 20 on outlet roller 15 and takers-in 16 the two rollers It is illustrated.Cartridge 20 is installed on not limited to this or any roller in outlet roller 15 and takers-in 16 Structure.In this case, compared with the structure of cartridge 20 is only installed on outlet roller 15, pacify only on takers-in 16 Structure equipped with cartridge 20 can further reduce the flexure produced in mould release membrance 12.
In Fig. 2 of present embodiment explanation, the cartridge 20c of the largest outside diameter to making both ends outboard end The interval structure consistent with the width of mould release membrance 12 is illustrated.Not limited to this, can also make the cartridge 20c at both ends Outboard end interval it is more wider than the width of mould release membrance 12.As long as in addition, the flexure produced in mould release membrance 12 can be reduced, also may be used So that the interval of the cartridge 20c at both ends outboard end is more shorter than the width of mould release membrance 12.
[embodiment 2]
3~Fig. 4 of reference picture, is partly led on being provided with using 1 pair of resin molding apparatus illustrated in above-mentioned embodiment 1 The process that the substrate of body chip carries out resin-encapsulated is illustrated.In embodiment 2, show to the tree using compression forming methods The example of fat shaped device application mould release membrance feed mechanism 11.
As shown in Fig. 3 (a), first, upper mould 8 and lower mould 9 are set to the state of die sinking.Then, using substrate transveyer Structure (reference picture 7), the substrate 22 that will be for example provided with semiconductor chip 21 (following, be properly called " chip 21 ") is transported to On the assigned position of the lower section of mould 8.Substrate 22 is the encapsulation prebasal plate that chip 21 is provided with positive (being lower surface in figure).Core The electrode of piece 21 and the electrode of substrate 22 are electrically connected such as the closing line 23 by being constituted by gold thread, copper cash.
Then, substrate 22 is made to increase using baseplate conveying mechanism, and by absorption or chuck (not shown) in upper mould 8 Substrate 22 is fixed on type face.Substrate 22 in the way of being provided with the face down of chip 21 to be fixed on the type face of upper mould 8.
Then, using mould release membrance feed mechanism 11, mould release membrance 12 is transported in the assigned position between upward mould 8 and lower mould 9.It is logical Cross using spooler 14 and delivering mechanism 13, the same of tension force F1 ((a) of reference picture 2) is applied to the direct of travel of mould release membrance 12 When, mould release membrance 12 is sent out by delivering mechanism 13.By applying tension force F1 to mould release membrance 12, mould release membrance 12 is being close to ladder It is transported ((c) of reference picture 2) in the state of on the outlet roller 15 and takers-in 16 of shape.
The outlet roller 15 and takers-in 16 of transport roller 18 ((a) of reference picture 2) are constructed with from central portion towards both ends And external diameter becomes larger.Therefore, the tension force F2 (references from the central portion of mould release membrance 12 towards double side acting are applied to mould release membrance 12 Fig. 2 (a)).In addition to the tension force F1 for acting on direct of travel, also apply outside from the central portion of mould release membrance 12 to mould release membrance 12 The tension force F2 of direction effect.Thus, mould release membrance 12 by the direct of travel of mould release membrance 12 power and the power that pulls laterally it is same When be transported between mould 8 and lower mould 9.Therefore, it is possible to reduce the rule of the flexure produced in mould release membrance 12 and the downward top of mould 9 Transport mould release membrance 12 is put in positioning.
Then, as shown in Fig. 3 (b), mould release membrance 12 is made to be close to lower mould 9 by declining mould release membrance feed mechanism 11 Type face (upper surface) on.In this condition, mould release membrance 12 is not yet supplied in die cavity 17.Because mould release membrance 12 is reducing flexure Generation in the case of be transported to the top of lower mould 9, therefore, it is possible to make mould release membrance 12 in the case where reducing the generation of flexure On the type face for being close to lower mould 9.
Then, using being arranged at the adsorbing mechanism (not shown) of lower mould 9 with along the type face in the type face of lower mould 9 and die cavity 17 Mode adsorbs mould release membrance 12.Due to mould release membrance 12 reduce flexure generation in the case of be close on lower mould 9, therefore, it is possible to The fold reduced due to flexure adsorbs mould release membrance 12 in the case of producing along the type face of die cavity 17.
Then, as shown in Fig. 3 (c), using resin material conveyer (reference picture 7), to the die cavity for being arranged at lower mould 9 The resin material 24 of 17 supply ormal weights.It is liquid that resin material 24, which can be used under the resins such as powdered, graininess, sheet or normal temperature, Resin (fluid resin) of shape etc..Fluid resin is the liquid resin with mobility under normal temperature.Regardless of fluid resin normal The degree of lower the had mobility of temperature.Present embodiment shows to supply granular resin (particulate resins) 24 to be used as tree The example of fat material 24.
Then, as shown in Fig. 4 (a), particulate resins 24 are carried out using the heater (not shown) for being arranged at lower mould 9 Heating.Particulate resins 24 are melted by heating and generate liquid resin 25.Fluid resin is being supplied to make to die cavity 17 In the case of resin material, the fluid resin is in itself equivalent to liquid resin 25.
Then, as shown in Fig. 4 (b), lower platen 6 is made to increase using clamping 7 (reference picture 1).Pass through lower platen 6 Rising, lower mould 9 and mould release membrance feed mechanism 11 rise simultaneously.By the rising of lower platen 6, upper mould 8 and lower mould 9 are by matched moulds. Therefore, die cavity 17 is sealed by upper mould 8 and lower mould 9.In this condition, chip 21 is impregnated into liquid resin 25.
Then, using the die cavity bottom part (not shown) for being arranged at lower mould 9, the liquid resin 25 in die cavity 17 is applied Plus defined resin pressure.By pressurizeing the stipulated time at the specified temperature and hardening liquid resin 25 to form hardening tree Fat 26.Thus, the chip 21 installed on substrate 22 is hardened the resin-encapsulated of resin 26.
Then, as Fig. 4 (c) shown in, formed with substrate 22, chip 21 and hardening resin 26 products formed 27 it Afterwards, decline lower mould 9 and mould release membrance feed mechanism 11 using clamping 7 (reference picture 1).In this condition, upper mould 8 is with Mould 9 is molded.
Then, after the absorption or clamping to the products formed 27 after resin-encapsulated is released, products formed is taken out from upper mould 8 27.Products formed 27 after taking-up is accommodated in by substrate reception portion by baseplate conveying mechanism (reference picture 7).Make institute in resin-encapsulated The mould release membrance 12 used is stripped from lower mould 8, and the mould release membrance 12 after is fetched into outside shaping mould 10 by spooler 14. By process so far, resin-encapsulated is completed.
Then, in units of the region equivalent to final products, to by hardening resin 26 by after the resin-encapsulated of chip 21 Products formed 27 carries out singualtion.In the zone for example comprising a chip 21.By process so far, final products are completed That is the electronic unit through singualtion.
In addition, during matched moulds is carried out to upper mould 8 and lower mould 9, preferably using next pair (not shown) of vacuum device Aspirated and depressurized in die cavity 17.Thereby, it is possible to remain in included in the air in die cavity 17 and liquid resin 25 Bubble etc. be discharged to the outside of shaping mould 10.
In the present embodiment, half-and-half led on the compression forming of the resin molding apparatus 1 by using embodiment 1 The example that body chip mounting substrate carries out resin-encapsulated is illustrated.In the same manner as situation illustrated in embodiment 1, according to Present embodiment, passes through at least one rotary shaft 19 in the rotary shaft 19 of outlet roller 15 and the rotary shaft 19 of takers-in 16 One end and another end are respectively mounted multiple cartridge 20a, 20b, 20c, can be applied on different multiple films, and The fold produced in film or flexure can be reduced and be molded with resin.
More specifically, according to present embodiment, in the resin molding apparatus using compression forming methods, using with rank The transport roller 18 of trapezoidal shape transports mould release membrance 12.Transport roller 18 is as from central portion towards both ends, external diameter becomes larger. Therefore, it is possible to apply the tension force from the central portion of mould release membrance 12 towards double side acting to mould release membrance 12.Apply the row of mould release membrance 12 Enter the power in direction and pull laterally power while, mould release membrance 12 is transported between upper mould 8 and lower mould 9.Therefore, it is possible to subtract Transport mould release membrance 12 in assigned position above the flexure produced in few mould release membrance 12 and downward mould 9.
Because mould release membrance 12 is transported to the assigned position of the lower top of mould 9 in the case where reducing the generation of flexure, therefore In the case where reducing the generation of flexure mould release membrance 12 can be made to be close on the type face of lower mould 9.Because mould release membrance 12 is being reduced On the type face that lower mould 9 is close in the case of the generation of flexure, therefore, it is possible in the case where reducing the generation of fold along die cavity 17 type face absorption mould release membrance 12.It is molded with resin therefore, it is possible to reduce the generation of fold.
[embodiment 3]
Reference picture 5, shows to be applied to the mould release membrance feed mechanism 11 of present embodiment into the resin using transfer moudling Example in shaped device.In addition, the resin molding apparatus of present embodiment mainly changes the resin molding apparatus 1 of embodiment 1 Shaping mould (upper mould 8 and lower mould 9).The resin molding apparatus 1 of basic structure and embodiment 1 is same.
As shown in figure 5, possessing upper mould 28 and lower mould 29 using the resin molding apparatus of transfer moudling.Upper mould 28 and lower mould 29 construct shaping mould in the lump.The barrel 31 for housing resin mass 30 is provided with lower mould 29.Be provided with barrel 31 by Pressure houses the plunger 32 of resin mass 30.Sprue recess 33 and cross gate 34 are provided with upper mould 28, the sprue recess 33 and cross gate 34 be heated the resin channels of liquid resin melted for resin mass 30.It is provided with upper mould 28 Die cavity 37, the die cavity 37 is configured in the assigned position of lower mould 29 for collecting and is provided with the substrate 36 of chip 35 and forms hardening The space of resin.Die cavity 37 is connected with cross gate 34.Chip 35 and substrate 36 are electrically connected by closing line 38.
In Figure 5, mould release membrance feed mechanism 11 is arranged on mould side (lower surface of the top board 5 shown in Fig. 1), will Mould release membrance 12 is supplied on the type face of mould 28.Mould release membrance feed mechanism 11 and the mould release membrance supply machine shown in embodiment 2,3 Structure 11 is identical.
Reference picture 5, on using the resin molding apparatus using transfer moudling come to being provided with semiconductor chip substrate The process for carrying out resin-encapsulated is illustrated.
As shown in figure 5, in the state of by shaping mould (upper mould 28 and lower mould 29) die sinking, using baseplate conveying mechanism (not Diagram), the assigned position configuration of downward mould 29 is provided with the substrate 36 of chip 35.Then, (do not schemed using resin conveyer Show), supply resin mass 30 to the barrel 31 for being arranged at lower mould 29.
Then, using mould release membrance feed mechanism 11, mould release membrance 12 is transported in the assigned position between upward mould 28 and lower mould 29. While applying tension force to the direct of travel of mould release membrance 12, mould release membrance 12 is sent out by delivering mechanism 13.Because transport roller 18 (is sent out Roller 15 and takers-in 16) with becoming big from central portion towards both ends and external diameter, therefore mould release membrance 12 is applied pulled laterally Power while, mould release membrance 12 is transported between upper mould 28 and lower mould 29.Therefore, it is possible to reduce scratching of being produced in mould release membrance 12 Transport mould release membrance 12 in bent and the lower section of mould 28 upwards assigned position.
Then, the type face (lower surface) by making mould release membrance feed mechanism 11 rise and make mould release membrance 12 be close to upper mould 28 On.Because mould release membrance 12 is transported to the lower section of mould 28 in the case where reducing the generation of flexure, therefore, it is possible to reduce from Mould release membrance 12 is set to be close on the type face of mould 28 in the case of the flexure produced in type film 12.
Then, using the adsorbing mechanism (not shown) for being arranged at upper mould 29, with along upper mould 28, sprue recess 33, horizontal pour The mode in the respective type face of road 34, die cavity 37 adsorbs mould release membrance 12.Because mould release membrance 12 is in the case where reducing the generation of flexure It is close on mould 28, therefore, it is possible to which mould release membrance 12 is adsorbed onto into mould in the case where reducing the fold generation due to flexure In 28 entire surface.
Then, matched moulds is carried out to upper mould 28 and lower mould 29 using clamping 7 (reference picture 1).By matched moulds, it will be installed on Chip 35 on substrate 36 is housed in die cavity 37.
Then, by heating the resin mass 30 that is supplied in barrel 31 and melting it and generate liquid resin.Pass through Plunger 32 presses liquid resin, is flowed so as to be injected via resin channels (sprue recess 33 and cross gate 34) to die cavity 37 Property resin.Next, being molded hardening resin by heating liquid resin.Thus, the quilt of chip 35 on substrate 36 Resin-encapsulated.After resin-encapsulated is terminated, molded using 7 pairs of upper moulds 28 of clamping and lower mould 29.After die sinking from Products formed is taken out in lower mould 29.By process so far, resin-encapsulated is completed.
In the present embodiment, on by using the basic structure tree same with the resin molding apparatus of embodiment 1 The Transfer molding of fat shaped device is illustrated to carry out the example of resin-encapsulated to semiconductor chip mounting substrate.With reality Apply content illustrated in mode 1,2 similarly, according to present embodiment, pass through the rotary shaft 19 and takers-in in outlet roller 15 The one end of at least one rotary shaft 19 in 16 rotary shaft 19 and the other end be respectively mounted multiple cartridge 20a, 20b, 20c, can be readily applied on different multiple films, and can reduce the fold produced in film or flexure and carry out resin envelope Dress.
More specifically, according to present embodiment, in the resin molding apparatus using transfer moudling, using with rank The transport roller 18 (outlet roller 15 and takers-in 16) of trapezoidal shape transports mould release membrance 12.Transport roller 18 is with from central portion towards two End and its external diameter become big.Therefore, the tension force from the central portion of mould release membrance 12 towards double side acting is applied to mould release membrance 12.Apply While the power of the direct of travel of mould release membrance 12 and the power pulled laterally, by mould release membrance 12 be transported to upper mould 28 and lower mould 29 it Between.Therefore, it is possible to reduce the assigned position transport mould release membrance 12 of the flexure produced in mould release membrance 12 and the upward lower section of mould 28.
Because mould release membrance 12 is transported to the lower section of mould 28 in the case where reducing the generation of flexure, therefore, it is possible to subtract Mould release membrance 12 is set to be close on the type face of mould 28 in the case of the generation bent less.Because mould release membrance 12 is reducing the production of flexure It is close in the case of life on the type face of mould 28, therefore, it is possible to adsorb mould release membrance 12 in the case where reducing the generation of fold Onto the entire surface of upper mould 28.It is molded with resin therefore, it is possible to reduce the generation of fold.
[embodiment 4]
Reference picture 6, shows that the mould release membrance used in the resin molding apparatus 1 illustrated in above-mentioned embodiment 1 is supplied The variation of mechanism.Mould release membrance is supplied figure 6 illustrates the type face of the lower mould to the resin molding apparatus using compression forming methods 12 example.
As shown in fig. 6, mould release membrance feed mechanism 39 possesses：Delivering mechanism 13, for by mould release membrance 12 pass out to upper mould 8 with Between lower mould 9；With spooler 14, for batching the mould release membrance 12 during resin-encapsulated after used use.In delivering mechanism Outlet roller 40 (the first roller) is provided between 13 and shaping mould 10 (reference picture 1), the outlet roller 40 is used for by delivering mechanism 13 Mould release membrance 12 before the use of submitting applies tension force.It is respectively arranged between shaping mould 10 and spooler 14：Takers-in 16 (the second roller), tension force is applied for the mould release membrance 12 before the resin forming to being transported between upper mould 8 and lower mould 9；And idler roller 41 (the 3rd rollers), for applying tension force to the mould release membrance 12 after resin forming.
Idler roller 41 is the outlet roller 15 and the same structure of takers-in 16 with illustrating in above-mentioned embodiment 1.Idler roller 41 that it is configured as between takers-in 16 and spooler 14 is opposite with the face contacted with takers-in 16 on mould release membrance 12 Face is contacted.
Outlet roller 40, takers-in 16 and idler roller 41 play work(respectively as the fortune deflector roll in mould release membrance feed mechanism 39 Energy.
Outlet roller 40 possesses rotary shaft 42 and in rotary shaft 42 and (the reference of multiple cartridges 20 that can load and unload Fig. 2).Outlet roller 40 is with from central portion towards both ends and stepped rollers with stairstepping that external diameter becomes larger. Up to the present, outlet roller 40 is identical with the outlet roller 15 illustrated in above-mentioned embodiment 1.In the present embodiment, in rotation The heater 43 for preheating mould release membrance 12 is built-in with axle 42.Therefore, outlet roller 40 is to be built-in with internal heater 43 and tool There is the transport roller of stairstepping.
Be provided with the top of outlet roller 40 using heating wire or lamp etc. as thermal source external heater 44.By being built in Internal heater 43 and external heater 44 in outlet roller 40 preheat mould release membrance 12.It is preferred that external heater 44 is set to pair The whole width of mould release membrance 12 blows the structure of hot blast.
Can be provided between outlet roller 40 and shaping mould 10 remove 12 bands of mould release membrance electrostatic remove electrical equipment (electrostatic Removing device) 45.By using the electrostatic for removing 12 bands of mould release membrance except electrical equipment 45, particle is prevented to be attached on mould release membrance 12.
Reference picture 6, on being illustrated to the operation that resin-encapsulated is carried out using mould release membrance feed mechanism 39.In mould release membrance In feed mechanism 39, the outside using the internal heater 43 being built in outlet roller 40 and the top for being arranged at outlet roller 40 adds Hot device 44, to preheat the mould release membrance 12 before the use sent out by delivering mechanism 13.Make its softening simultaneously by preheating mould release membrance 12 Stretch.Because outlet roller 40 is as from central portion towards both ends, external diameter becomes big, therefore the mould release membrance 12 after stretching, extension is applied While the power pulled laterally, mould release membrance 12 is transported between upward mould 8 and lower mould 9.
Takers-in 16 be with the identical roller of takers-in 16 shown in Fig. 2, become with from central portion towards both ends and external diameter Greatly.Therefore, the tension force acted in outward direction from the central portion of the preheated rear mould release membrance 12 stretched is applied to mould release membrance 12.By This, the mould release membrance 12 of state is transported to the assigned position of the lower top of mould 9 in the case where reducing the generation of flexure after stretching, extension On.
Then, the preheated rear mould release membrance 12 in extended configuration is made to be close on the type face of lower mould 9.Due to mould release membrance 12 Stretched after preheated, thus it is smaller by the hot and degree that further stretch being subject to from the heater for being arranged at lower mould 9.By This, can suppress to produce fold due to the heat from heater.Therefore, it is possible to the fold produced in mould release membrance 12 is reduced In the case of mould release membrance 12 is adsorbed onto on the type face of die cavity 17 and is molded with resin.
Type facial disfigurement of the mould release membrance 12 along die cavity 17 after resin forming.Further, due to from be arranged at lower mould 9 plus The hot influence of hot device disappears, therefore mould release membrance 12 shrinks.Idler roller 41 is as from central portion towards both ends, external diameter becomes big. By the way that idler roller 41 is arranged between takers-in 16 and spooler 14, the mould release membrance 12 after resin forming can be applied to The power that outside is pulled.Thus, the power for being intended to return to original flat condition is applied to the mould release membrance 12 for deforming after-contraction.Accordingly, it is capable to It is enough to reduce the influence brought to the mould release membrance 12 used in follow-up resin-encapsulated.
, can be built-in in takers-in 16 and idler roller 41 in order to relax the deformation and contraction of the mould release membrance after resin forming 12 Heater.Due to heating mould release membrance 12 by being built in the heater in takers-in 16 and idler roller 41, therefore, it is possible to relax The deformation and contraction of mould release membrance 12.Further, since applying the power pulled laterally to mould release membrance 12, therefore it is easier to make mould release membrance 12 return to original flat state.The mould release membrance 12 used in follow-up resin forming is brought therefore, it is possible to further reduce Influence.
Present embodiment be in the film supplying unit (supplying film device) of embodiment 1 the takers-in 16 as the second roller with The structure of the idler roller 41 as the 3rd roller is provided between takers-in 14.According to the structure, it can further reduce in film and produce Raw fold or flexure.
Present embodiment is the structure for being provided with internal heater 43 and external heater 44, the internal heater 43 and outer Portion's heater 44 is that can heat the heater of the mould release membrance on the first roller i.e. outlet roller 40.Furthermore it is possible to be carried out to film As long as the heater of heating is at least one heater in internal heater 43 and external heater 44.According to the knot Structure, due to being preheated to mould release membrance 12, the fold produced during therefore, it is possible to further reduce resin forming in film or flexure.
Alternatively, it is also possible to being following structure：In order to heat the film being located on the second roller i.e. takers-in 16, roller is provided with At least one heater in internal heater and external heater, or be provided with the 3rd roller is idler roller 41 it is built-in plus Hot device.According to the structure, the deformation and contraction of the mould release membrance after resin forming 12 can be relaxed, resin can be further reduced The fold produced during shaping in film or flexure.
More specifically, according to present embodiment, the internal heater being built in the rotary shaft 42 of outlet roller 40 is passed through 43 and be arranged at outlet roller 40 top external heater 44, come to mould release membrance 12 carry out preheating soften it.Due to soft The mould release membrance 12 stretched after change applies the power pulled laterally, therefore, it is possible to reduce what is produced after stretching, extension on the mould release membrance 12 of state Flexure.Because mould release membrance 12 has stretched, therefore pass through be subject to from the heater for being arranged at lower mould 9 hot and the journey further stretched Degree is smaller.Therefore, it is possible to which mould release membrance 12 to be adsorbed onto to the type of die cavity 17 in the case of the fold produced in reducing mould release membrance 12 It is molded with resin on face.
According to present embodiment, idler roller 41 is provided between takers-in 16 and spooler 14.By setting tensioning Roller 41, the power pulled laterally is applied to the mould release membrance 12 after resin forming.After to the type facial disfigurement along die cavity 17 The mould release membrance 12 of contraction applies the power for being intended to return to original flat condition.Due to reduce to used in follow-up resin forming from The influence that type film 12 is brought, therefore, it is possible to economically use mould release membrance 12.Therefore, it is possible to suppress the material using mould release membrance 12 Cost.
In the present embodiment, using the internal heater 43 that is built in outlet roller 40 and it is arranged at the upper of outlet roller 40 The two heaters of the external heater 44 of side, to be heated to mould release membrance 12.Not limited to this, can also use to be built in and send The internal heater 43 gone out in roller 40 or any one heater being arranged in the external heater 44 of the top of outlet roller 40, come Mould release membrance 12 is heated.
In the present embodiment, it is used as outlet roller using the roller for being embedded with multiple cartridges 20 and there is stairstepping 40.In order to improve the heat transfer from the internal heater 43 being built in rotary shaft 42, aluminium can also be used to be used as multiple Cartridge 20.Further, it can also use by cylindric roller that aluminium is constituted and without using the roller with stairstepping.
In the present embodiment, in order that the mould release membrance 12 for deforming and shrinking by resin forming easily return to it is original Flat condition and idler roller 41 is set.In addition, in order that the mould release membrance 12 after resin forming easily returns to original state, can The internal heater in takers-in 16 and idler roller 41.Thereby, it is possible to further relax the change of the mould release membrance 12 after resin forming Shape or contraction.
In addition, the slit additional mechanism providing additional operation that slit is added to mould release membrance 12 can be set between takers-in 16 and idler roller 41. For example, adding multiple slits to mould release membrance 12 using multiple cutting edges such as cutter.By adding multiple slits, energy to mould release membrance 12 It is enough further to relax deformation or contraction after resin forming.
In the present embodiment, on being mounted in any roller in takers-in 16, outlet roller 40 and idler roller 41 The mechanism of cartridge 20 is illustrated.Not limited to this or in takers-in 16, outlet roller 40 and idler roller 41 The structure of cartridge 20 is installed at least one roller.In the case that cartridge 20 is installed in any roller, it can reduce This effect of flexure the sequentially increasing by takers-in 16, idler roller 41 and outlet roller 40 produced in mould release membrance 12.
[embodiment 5]
Reference picture 7, is illustrated to the resin molding apparatus 100 of present embodiment.Resin molding apparatus shown in Fig. 7 100 be the resin molding apparatus using compression forming methods.Resin molding apparatus 100 shown in Fig. 7 possesses will respectively as structure Module 46, three forming modules 47A, 47B, 47C and material supplying module 48 are stored in the substrate supply of element.It is used as structural element Substrate supply stores module 46, forming module 47A, 47B, 47C and material supplying module 48 and is respectively relative to other structures key element It can each other load and unload, and can change.
It is provided with module 46 is stored in substrate supply：Prebasal plate supply unit 50 is encapsulated, for supplying encapsulation prebasal plate 49； Metacoxal plate incorporating section 52 is encapsulated, for storing encapsulation metacoxal plate 51；Substrate-placing portion 53, for delivering encapsulation prebasal plate 49 and envelope Fill metacoxal plate 51；With baseplate conveying mechanism 54, prebasal plate 49 and encapsulation metacoxal plate 51 are encapsulated for transporting.Substrate-placing portion 53 exists Substrate supply is stored moves in module 46 along Y-direction.Baseplate conveying mechanism 54 stores module 46 and each shaping in substrate supply In module 47A, 47B, 47C in X direction, Y-direction and Z-direction movement.Assigned position S1 is that baseplate conveying mechanism 54 is not being operated Standby position under state.
Be respectively arranged with each forming module 47A, 47B, 47C resin molding apparatus 1 equivalent to embodiment 1 into Type unit 2 (reference picture 1).The lower mould 9 that can be lifted and the upper mould 8 being oppositely disposed with lower mould 9 are provided with forming unit 2 (reference picture 1).There is forming unit 2 clamping 7 for carrying out matched moulds and die sinking to upper mould 8 and lower mould 9 (to be represented with double dot dash line Circular portion).Upper mould 8 and lower mould 9 can carry out matched moulds and die sinking by relatively moving.It is provided with lower mould 9 Die cavity 17.In the lower mould side (upper surface of lower platen 6；Reference picture 1) be provided with downward mould 9 type face supply strip mould release membrance The mould release membrance feed mechanism 11 of 12 (reference pictures 2).
It is provided with material supplying module 48：X-Y table 55；Resin material accommodation structure 56, for housing regulation The resin material 24 ((c) of reference picture 3) of amount；Resin material injection mechanism 57, for being put into resin material accommodation structure 56 Resin material 24；With resin material conveyer 58, for transporting resin material accommodation structure 56.X-Y table 55 is in material In supplying module 48 in X direction and Y-direction movement.Resin material conveyer 58 is in material supplying module 48 and each shaping mould In block 47A, 47B, 47C in X direction, Y-direction and Z-direction movement.Assigned position H1 is X-Y table 55 under non-mode of operation Standby position.Assigned position M1 is the position standby under non-mode of operation of resin material conveyer 58.
Control unit CTL is provided with module 46 is stored in substrate supply.Control unit CTL be used for control encapsulation prebasal plate 49 and Encapsulate transport, the transport of resin material 24, the transport of mould release membrance 12, the heating of shaping mould 10 and the shaping mould 10 of metacoxal plate 51 Opening and closing etc..In other words, control unit CTL carries out substrate supply and stores module 46, forming module 47A, 47B, 47C and material supply mould The control of each operation in block 48.
Control unit CTL can be arranged in each forming module 47A, 47B, 47C, can also be arranged on material supplying module 48 In.Substrate supply can be stored to module 46 and a forming module 47A integration and machine tool is used as.Material can also be supplied Module 48 and forming module 47C integration and be used as machine tool.In these cases, control unit CTL can be set in machine tool. Substrate supply can be stored to module 46 and the integration of material supplying module 48, and control unit is set in the module through integration CTL.In addition it is also possible to which according to the operation as control object, control unit CTL is configured to the multiple of at least a portion separation Control unit.
Reference picture 7, is illustrated to the operation using resin molding apparatus 100 to carry out resin-encapsulated.First, in substrate Supply is stored in module 46, and encapsulation prebasal plate 49 is sent out from encapsulation prebasal plate supply unit 50 to substrate-placing portion 53.Then, substrate Conveyer 54 moves along -Y direction from assigned position S1 and receives encapsulation prebasal plate 49 from substrate-placing portion 53.Substrate transveyer Structure 54 is back to assigned position S1.
Then, such as baseplate conveying mechanism 54 is moved to forming module 47B assigned position P1 along +X direction.Then, exist In forming module 47B, baseplate conveying mechanism 54 moves along -Y direction and stops at the assigned position C1 of the lower top of mould 9.Then, base Plate conveyer 54 rises encapsulation prebasal plate 49 being fixed on the type face of upper mould 8 ((a) of reference picture 3).Substrate transveyer Structure 54 is back to the assigned position S1 that module 46 is stored in substrate supply.
Then, in forming module 47B, the assigned position between the upward mould 8 of mould release membrance feed mechanism 11 and lower mould 9 is used Transport mould release membrance 12 ((a) of reference picture 3).In this condition, mould release membrance 12 is configured in the case where reducing the generation of flexure On the assigned position of the lower top of mould 9.Then, mould release membrance feed mechanism 11 declines to be close to mould release membrance 12 into the type of lower mould 9 On face.Then, adsorbed using the adsorbing mechanism for being arranged at lower mould 9 and in the way of the type face along the type face of lower mould 9 and die cavity 17 Mould release membrance 12.Mould release membrance 12 is adsorbed on the type face of die cavity 17 (reference picture 3 in the case where reducing the generation of fold (b))。
Then, in material supplying module 48, the resin material accommodation structure 56 that is positioned in X-Y table 55 is made from rule Positioning is put H1 and moved along -Y direction, and the regulation for making resin material accommodation structure 56 stop at below resin material injection mechanism 57 Position.By make X-Y table 55 in X direction and Y-direction transfer, from resin material injection mechanism 57 to resin material house machine Structure 56 puts into the resin material 24 of ormal weight.The X-Y table 55 for being placed with resin material accommodation structure 56 is back to predetermined bits Put H1.
Then, resin material conveyer 58 is moved from assigned position M1 along -Y direction, X-Y work is positioned in receive Resin material accommodation structure 56 on platform 55.Resin material conveyer 58 is back to assigned position M1.
Then, resin material conveyer 58 is moved to forming module 47B assigned position P1 along -X direction.Then, exist In forming module 47B, resin material conveyer 58 moves along -Y direction and stops at the assigned position C1 of the lower top of mould 9.It is logical Crossing declines resin material conveyer 58, and resin material 24 is supplied in die cavity 17 ((c) of reference picture 3).Resin material Conveyer 58 is back to assigned position M1.
Then, in forming module 47B, by melt resin material 24 and generate liquid resin 25 (reference picture 4 (a)).Lower mould 9 is increased by clamping 71, matched moulds ((b) of reference picture 4) is carried out to upper mould 8 and lower mould 9.Passing through After stipulated time, upper mould 8 and lower mould 9 are molded ((c) of reference picture 4).Then, by make baseplate conveying mechanism 54 from The assigned position C1 that the assigned position S1 of module 46 is moved to above lower mould is stored in substrate supply, to receive encapsulation metacoxal plate 51. Then, baseplate conveying mechanism 54 is moved, and delivers encapsulation metacoxal plate 51 to substrate-placing portion 53.Metacoxal plate 51 will be encapsulated from substrate Mounting portion 53 is accommodated in encapsulation metacoxal plate incorporating section 52.In the stage, resin-encapsulated is completed.
In the present embodiment, stored in substrate supply between module 46 and material supplying module 48, in X direction arrangement peace Equipped with three forming modules 47A, 47B, 47C.Substrate supply can also be stored module 46 and material supplying module 48 is set to one Individual module, and one or more forming module 47A are installed in arrangement in X direction on that module.Thus, in the rank of manufacture device In section and device is arranged in the stage after factory, can increase and decrease forming module 47A, 47B ....Can be according to production Mode or output optimize the structure of the resin molding apparatus 1 in each factory.Therefore, it is possible to improve the life in each factory Yield.
In each embodiment, the resin material being made up of thermosetting resin has been used.For example, epoxy resin can be used With silicone resin etc..The resin material being made up of thermoplastic resin can also be used.
In each embodiment, by make mould release membrance feed mechanism down or up and by mould release membrance 12 be close to lower mould or On upper mould.Mould release membrance 12, can be transported near the type face of lower mould or upper mould and only make mould release membrance by absorption by not limited to this 12 are close on the type face of lower mould or upper mould.In this case, the function of lifting mould release membrance feed mechanism can be removed.If Downward mould supplies the situation of mould release membrance 12, then can also be by making lower mould rise the type face to make mould release membrance 12 be close to lower mould On.
In each embodiment, to semiconductor chip carry out resin-encapsulated when used resin molding apparatus and resin into Type method is illustrated.The object of resin-encapsulated can be the core of the active components such as IC chip, transistor chip, LED chip Piece.The object of resin-encapsulated can also be the chip of the passive element of capacitor, inductor etc., can also be the core of active component Chipset of the piece together with the chip hybrid of passive element.The object of resin-encapsulated can be the semiconductor core using semiconductor The non-semiconductor chip of piece or unused semiconductor, can also be that semiconductor chip and non-semiconductor chip hybrid exist Chipset together.Sensor, oscillator or driver etc. can also be included in the object of resin-encapsulated.Set when using hardening , can when fat carries out resin-encapsulated to one or more chips on the substrates such as lead frame, printed base plate or ceramic substrate Using the present invention.Therefore, can also be using the present invention when manufacturing Multi-chip packages, multi-chip module or Mixed LB films etc.. High-frequency signal module, power control module, device control module or LED envelopes are included in the electronic unit manufactured in each embodiment Piece installing etc..
In each embodiment, it is illustrated using exemplified by adhering to the mould release membrance 12 for preventing film as resin.Mould release membrance 12 With the function of making hardening resin 26 be easily stripped from the type surface side of die cavity 17.In addition to mould release membrance 12, used film is also Transfer film can be enumerated.There is transfer film the key element being had by the functional surfaces of the surface construction contacted with liquid resin to transfer Function onto the surface of hardening resin.The key element that functional surfaces on transfer film have, first is to be formed on functional surfaces Shape.Shape includes shape corresponding with minute surface, concaveconvex shape corresponding with pears surface, bumps corresponding with microlens array Shape or concaveconvex shape corresponding with Fresnel prism etc..The key element that the functional surfaces of transfer film have, second is on functional surfaces Layer or film of formation etc..Include the layer comprising pattern and decorative pattern, conductive layer or metal foil etc. in layer or film etc..
In explanation so far, the example that the chip on substrate carries out resin-encapsulated is illustrated.Base Plate includes printed base plate, ceramic substrate, lead frame, semiconductor crystal wafer (semiconductor wafer) etc..The shape of substrate can To be rectangle or square with long side and short side.The shape of substrate can also be such as with otch (notch), Substantial circle as the semiconductor crystal wafer of directional plane (orientation flat) etc..
The present invention can also be applied to be molded in the resin molding apparatus of general synthetic resin or resin molding method.Change Yan Zhi, the invention is not restricted to carry out chip the situation of resin-encapsulated, can also be applied to manufacture using resin forming technology The situation of the optical articles such as mirror, optical module or light guide plate or other synthetic resins (naval stores).In other words, this hair It is bright to be applied to the situation of manufacture synthetic resin.In quality requirement (such as outward appearance product to manufactured naval stores Taste and surface smoothness etc., outward appearance taste are then represented by whetheing there is scar etc. caused by the fold of functional membrane or flexure) it is tight In the case of lattice, the present invention is especially effective.
The present invention is not limited to above-mentioned each embodiment, without departing from the spirit and scope of the invention, can basis Need, it is any and appropriately combined and changed or optionally used.
Description of reference numerals
1st, 100 resin molding apparatus
2 forming units
3 bases
4 connecting rods
5 top boards
6 lower platens
7 clampings
8th, mould (the first mould, the second mould) on 28
9th, 29 times moulds (the second mould, the first mould)
10 shaping moulds
11st, 39 mould release membrance feed mechanism (supplying film device)
12 mould release membrances (film)
13 delivering mechanisms
14 spoolers
15th, 40 outlet rollers (fortune deflector roll, the first roller)
16 takers-ins (fortune deflector roll, the second roller)
17th, 37 die cavity
18 transport roller (fortune deflector roll)
19 rotary shafts
20th, 20a, 20b, 20c cartridge
21st, 35 chips (shaped like chips electronic device)
22nd, 36 substrate
23rd, 38 closing line
24 resin materials
25 liquid resins
26 hardening resins
27 products formeds
30 resin mass
31 barrels
32 plungers
33 sprues
34 cross gates
41 idler rollers (fortune deflector roll, the 3rd roller)
42 rotary shafts
43 internal heaters (heater)
44 external heaters (heater)
45 remove electrical equipment
Module is stored in the supply of 46 substrates
47A, 47B, 47C forming module
48 material supplying modules
49 encapsulation prebasal plates
50 encapsulation prebasal plate supply units
51 encapsulation metacoxal plates
52 encapsulation metacoxal plate incorporating sections
53 substrate-placing portions
54 baseplate conveying mechanisms
55 X-Y tables
56 resin material accommodation structures
57 resin material injection mechanisms
58 resin material conveyers
T1, T2 torque
R1, r2 rotary speed
F1, F2 tension force
CTL control units
S1, H1, M1, P1, C1 assigned position

Claims (9)

1. a kind of resin molding apparatus, is set using at least one mould in the first mould and the second mould opposite each other There is the shaping mould of die cavity, and the shaping mould carried out matched moulds to be molded with resin,
The resin molding apparatus is characterised by possessing：
Delivering mechanism, for sending out film between first mould and second mould；
Spooler, for batching the film between first mould and second mould；
First roller, is arranged on the delivering mechanism side；
Second roller, is arranged on the spooler side；With
Main cartridge, one of at least one rotary shaft in the rotary shaft of first roller and the rotary shaft of second roller End and the other end are separately installed with multiple main cartridges,
In multiple main cartridges, the external diameter of the main cartridge in outside is more than the external diameter of the main cartridge of inner side,
Multiple main cartridges can be loaded and unloaded relative to the rotary shaft at respective place.
2. resin molding apparatus according to claim 1,
The surface of the main cartridge is carried out Surface Machining to increase the coefficient of kinetic friction.
3. resin molding apparatus according to claim 1,
The heater of the film can be heated by being provided with, and the heater is located in first roller and second roller at least In one roller.
4. resin molding apparatus according to claim 1, possesses：
3rd roller, is arranged between second roller and the spooler；With
Secondary cartridge, multiple secondary tubulars are separately installed with the one end of the rotary shaft of the 3rd roller and the other end Part,
In multiple secondary cartridges, the external diameter of the secondary cartridge in outside is more than the external diameter of the secondary cartridge of inner side,
The rotary shaft that multiple secondary cartridges are respectively relative to the 3rd roller can be loaded and unloaded.
5. the resin molding apparatus according to any one of Claims 1 to 4, possesses：
At least one forming module, the forming module has the shaping mould and the clapper die spotting press of matched moulds is carried out to the shaping mould Structure,
One forming module and other forming modules can be loaded and unloaded.
6. a kind of resin molding method, is set using at least one mould in the first mould and the second mould opposite each other There is the shaping mould of die cavity, and the shaping mould carried out matched moulds to be molded with resin,
The resin molding method is characterised by, including：
Using the first roller between first mould and second mould send out film process；With
The process for batching the film between first mould and second mould using the second roller,
Cartridge is used at least one process in the process and the process batched of the submitting, described first The one end and the other end of the rotary shaft of roller and at least one rotary shaft in the rotary shaft of second roller are separately installed with Multiple cartridges, in multiple cartridges, the cartridge in outside is applied to the power of the film more than inner side Cartridge be applied to the power of the film,
Multiple cartridges can be loaded and unloaded relative to the rotary shaft at respective place.
7. one kind fortune deflector roll, is used in resin molding apparatus, the fortune deflector roll is characterised by：
Possess cartridge, multiple tubulars are separately installed with the one end of the rotary shaft of the fortune deflector roll and the other end Part,
In multiple cartridges, the external diameter of the cartridge in outside is more than the external diameter of the cartridge of inner side,
Multiple cartridges, which are respectively relative to the rotary shaft, to be loaded and unloaded.
8. fortune deflector roll according to claim 7,
The built-in having heaters in the rotary shaft.
9. a kind of resin molding apparatus is with supplying film device, it is characterised in that possess：
Delivering mechanism, for sending out film；
Spooler, for batching the film；
First roller, is arranged on the delivering mechanism side；
Second roller, is arranged on the spooler side；
Multiple cartridges, at least one rotary shaft in the rotary shaft of first roller and the rotary shaft of second roller One end and the other end are separately installed with multiple cartridges,
In multiple cartridges, the external diameter of the cartridge in outside is more than the external diameter of the cartridge of inner side,
Multiple cartridges can be loaded and unloaded relative to the rotary shaft at respective place.
CN201710141418.8A 2016-03-30 2017-03-10 Resin molding apparatus and method, fortune deflector roll and resin molding apparatus are with supplying film device Pending CN107275232A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-067078 2016-03-30
JP2016067078A JP6506717B2 (en) 2016-03-30 2016-03-30 Resin molding apparatus, resin molding method, film transport roller, and film supply apparatus for resin molding apparatus

Publications (1)

Publication Number Publication Date
CN107275232A true CN107275232A (en) 2017-10-20

Family

ID=60007632

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710141418.8A Pending CN107275232A (en) 2016-03-30 2017-03-10 Resin molding apparatus and method, fortune deflector roll and resin molding apparatus are with supplying film device

Country Status (4)

Country Link
JP (1) JP6506717B2 (en)
KR (1) KR102026520B1 (en)
CN (1) CN107275232A (en)
TW (1) TWI633001B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110856985A (en) * 2018-08-24 2020-03-03 株式会社斯巴鲁 Composite material shaping device and composite material shaping method
CN112208054A (en) * 2019-07-10 2021-01-12 Ｔｏｗａ株式会社 Resin molding apparatus and method for manufacturing resin molded product
CN112978431A (en) * 2021-02-04 2021-06-18 芯笙半导体科技(上海)有限公司 Destaticizing film processing equipment based on resin molding

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6854784B2 (en) * 2018-01-15 2021-04-07 Ｔｏｗａ株式会社 Resin molding equipment and resin molded product manufacturing method
JP6869304B2 (en) * 2019-09-17 2021-05-12 Ｊｘ金属株式会社 Insert molded product and manufacturing method of insert molded product
JP7230160B1 (en) * 2021-12-01 2023-02-28 Ｔｏｗａ株式会社 RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039823A (en) * 2002-07-03 2004-02-05 Nec Yamagata Ltd Semiconductor resin sealing equipment and its method
CN1959385A (en) * 2005-11-03 2007-05-09 Lg电子株式会社 Checking apparatus and checking method for loading product
JP2013155007A (en) * 2012-01-31 2013-08-15 Toyota Motor Corp Conveyance roller

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06329276A (en) * 1993-05-19 1994-11-29 Matsushita Electric Ind Co Ltd Sheet material feeding device
JP3595793B2 (en) * 2001-12-04 2004-12-02 株式会社サイネックス Resin sealing device
JP4585321B2 (en) * 2005-01-12 2010-11-24 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
KR100609605B1 (en) 2005-03-30 2006-08-08 주식회사지엠피 Laminate
JP2007250681A (en) * 2006-03-14 2007-09-27 Matsushita Electric Ind Co Ltd Semiconductor resin sealing device and supplying method of release film
JP4135769B2 (en) 2006-09-27 2008-08-20 東レ株式会社 Intermittent film forming apparatus and forming method
KR101000776B1 (en) * 2008-07-24 2010-12-15 세크론 주식회사 Apparatus for molding a electronic device
KR101101669B1 (en) * 2009-12-01 2011-12-30 삼성전기주식회사 Device for manufacturing electronic component and method for manufacturing electronic component
JP6143665B2 (en) * 2013-12-26 2017-06-07 Ｔｏｗａ株式会社 Semiconductor sealing method and semiconductor sealing device
JP6298719B2 (en) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039823A (en) * 2002-07-03 2004-02-05 Nec Yamagata Ltd Semiconductor resin sealing equipment and its method
CN1959385A (en) * 2005-11-03 2007-05-09 Lg电子株式会社 Checking apparatus and checking method for loading product
JP2013155007A (en) * 2012-01-31 2013-08-15 Toyota Motor Corp Conveyance roller

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110856985A (en) * 2018-08-24 2020-03-03 株式会社斯巴鲁 Composite material shaping device and composite material shaping method
CN110856985B (en) * 2018-08-24 2022-12-23 株式会社斯巴鲁 Composite material shaping device and composite material shaping method
CN112208054A (en) * 2019-07-10 2021-01-12 Ｔｏｗａ株式会社 Resin molding apparatus and method for manufacturing resin molded product
CN112978431A (en) * 2021-02-04 2021-06-18 芯笙半导体科技(上海)有限公司 Destaticizing film processing equipment based on resin molding

Also Published As

Publication number Publication date
KR20170113022A (en) 2017-10-12
KR102026520B1 (en) 2019-09-27
TWI633001B (en) 2018-08-21
JP2017183443A (en) 2017-10-05
JP6506717B2 (en) 2019-04-24
TW201733769A (en) 2017-10-01

Similar Documents

Publication Publication Date Title
CN107275232A (en) Resin molding apparatus and method, fortune deflector roll and resin molding apparatus are with supplying film device
CN104112679B (en) resin encapsulation equipment and resin encapsulation method
KR102059738B1 (en) Molding die, resin molding apparatus, resin molding method and method for manufacturing resin-molded component
WO2020217703A1 (en) Resin molding device and manufacturing method for resin molded article
CN106426710A (en) Resin molding apparatus and resin molding method and molding die
JP2016068386A (en) Resin molding apparatus and method
KR102158909B1 (en) Resin molding device and method for preparing resin molding product
CN107303706A (en) Resin molding apparatus and resin molding method
CN112208054B (en) Resin molding apparatus and method for manufacturing resin molded product
CN107685412A (en) The manufacture method of shaping mould, resin molding apparatus and synthetic resin
CN111216301B (en) Molding die, resin molding device, and method for manufacturing resin molded article
JP7465829B2 (en) Manufacturing method of resin molded product, molding die and resin molding device
CN109689330B (en) Compression molding device, compression molding method, and method for manufacturing compression molded product
TWI793941B (en) Resin molding apparatus and method for manufacturing a resin molded product
US10639833B2 (en) Molding system with movable mold tool
CN212147208U (en) A encapsulation moulding press for COB encapsulation LED display element
JP2003133345A (en) Apparatus and method of resin encapsulating semiconductor
KR100895814B1 (en) Method of manufacturing semiconductor package
JP2000037745A (en) Method and apparatus for manufacture of thermosetting resin molded product, and mold assembly
JPH05315386A (en) Manufacture of semiconductor device and molding die

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20171020

RJ01 Rejection of invention patent application after publication