KR100895814B1 - Method of manufacturing semiconductor package - Google Patents

Abstract

A method of manufacturing a semiconductor package is disclosed. A method of manufacturing a semiconductor package includes preparing a strip substrate having a first substrate portion on which a unit substrate on which a semiconductor chip is mounted is disposed, and a second substrate portion disposed along a periphery of the first substrate portion. A cavity having a height, connected to the cavity and disposed in the second substrate portion, the first runner having a second height lower than the first height and the second substrate portion disposed in the first runner; Disposing the strip substrate in a mold having a second runner having a third height higher than the second height, the molten molding resin being provided in the cavity through the first runner and the second runner to provide the molding resin with the cavity; Forming a mold in the mold, a tail in the first runner and a curl in the second runner, and removing the curl using the tail.

Description

Manufacturing method of semiconductor package {METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE}

The present invention relates to a method of manufacturing a semiconductor package.

In recent years, with the development of semiconductor manufacturing technology, various kinds of semiconductor packages having semiconductor devices suitable for processing more data in a short time have been developed.

The semiconductor package is manufactured through a semiconductor chip manufacturing process for manufacturing a semiconductor chip including a semiconductor element on a wafer made of high purity silicon, a die sorting process for electrically inspecting the semiconductor chip, and a packaging process for packaging a good semiconductor chip. .

Among these, a package process attaches a semiconductor chip to a strip substrate including a plurality of unit substrates, and molds the semiconductor chip with molten molding resin to manufacture a plurality of semiconductor packages on the strip substrate, and each semiconductor from the strip substrate. A process of individualizing the package.

The process of molding a semiconductor chip with a molding resin according to the prior art generally involves placing a strip substrate in a mold having a cavity and a mold gate into which the molding resin is injected, and then providing a molding resin, such as an epoxy resin, in the mold, thereby providing a semiconductor chip. It is molded by molten molding resin. By the molding process, a molding member surrounding the semiconductor chip corresponding to the cavity and a tail attached to the molding member corresponding to the mold gate are formed on the strip substrate.

In general, a gold bar made of gold is formed on the mold gate and the corresponding strip substrate, and a tail is positioned on the gold bar. The gold bar easily removes the tail from the strip substrate.

However, the number of unit substrates that can be formed in a strip substrate having an area defined by a gold bar disposed on the strip substrate to remove the tail connected to the conventional mold member is reduced, and the manufacturing cost of the strip substrate is greatly increased by the gold bar. It has a problem of being raised.

The object of the present invention is not only to greatly improve the number of unit substrates that can be formed on a strip substrate having a limited area, but also to easily remove the tails attached to the mold member without using a gold bar, thereby greatly reducing the manufacturing cost of the strip substrate. It provides a method for manufacturing a semiconductor package that can be.

A method of manufacturing a semiconductor package according to the present invention includes preparing a strip substrate having a first substrate portion on which a unit substrate on which a semiconductor chip is mounted is disposed, and a second substrate portion disposed along a periphery of the first substrate portion. A cavity having a first height in the substrate portion, a first runner connected to the cavity and disposed in the second substrate portion, the first runner having a second height lower than the first height, and disposed in the second substrate portion; Disposing the strip substrate in a mold having a second runner having a third height higher than the second height and connected to a first runner, wherein the molding resin melted in the cavity through the first runner and the second runner; Providing a forming part in the cavity, a tail part in the first runner and a curl in the second runner, and removing the curl using the tail part. The.

A solder resist film is formed on the surface of the strip substrate, and the solder resist film and the tail portion are in direct contact.

The tail portion disposed between the molding portion and the curl has a uniform thickness.

The thickness of the tail portion disposed between the molding portion and the curl decreases as the closer to the molding portion.

The strip substrate is a method of manufacturing a semiconductor package, characterized in that the length of the width × length has a size of 240mm × 74mm within the fluctuation range ± 10mm.

The strip substrate is formed of 147 unit substrates to which 60 solder balls are attached, and 105 unit substrates to which 84 solder balls are attached.

According to the present invention, the manufacturing method is improved so that curls can be easily removed from the tail portion without the gold bar, thereby producing more semiconductor packages from the strip substrate having a limited area and greatly reducing the manufacturing cost of the semiconductor packages.

Hereinafter, a method of manufacturing a semiconductor package according to embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to the following embodiments, and has a general knowledge in the art. It will be apparent to those skilled in the art that the present invention may be embodied in various other forms without departing from the spirit of the invention.

1 to 7 are plan views, cross-sectional views and photographs showing a method of manufacturing a semiconductor package according to a first embodiment of the present invention.

1 is a cross-sectional view illustrating a strip substrate for manufacturing a semiconductor package. FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1.

1 and 2, a strip substrate 10 is provided to manufacture a semiconductor package. For example, the strip substrate 10 has a rectangular parallelepiped plate shape, and the strip substrate 10 has a size of 240 mm x 74 mm in a width x length of ± 10 mm.

The strip substrate 10 includes a first substrate portion FR and a second substrate portion SR.

The area of the first substrate part FR is slightly smaller than the planar area of the strip substrate 10, and the unit substrates 2 on which the semiconductor chips 1 are mounted are arranged in a matrix form on the first substrate part FR. do. The second substrate part SR is disposed along the periphery of the first substrate part FR. The inside of the dotted line MR of FIG. 1 is a molding region molded by the molding member.

3 is a cross-sectional view illustrating a mold for molding the strip substrate of FIG. 2.

The strip substrate 10 on which the semiconductor chip 1 is mounted on the unit substrate 2 is disposed in molds 20 and 30 that perform a molding process of molding the semiconductor chip 1. The molds 20 and 30 consist of an upper mold 20 and a lower mold 30.

The strip substrate 10 is interposed between the upper mold 20 and the lower mold 30, and the upper mold 20 includes a cavity 22, a first runner 24, and a second runner 26. Is formed.

The cavity 22 of the upper mold 20 is formed at a position corresponding to the first substrate portion SR, and forms a space on the semiconductor chip 1 of the unit substrate 2 of the first substrate portion SR. do.

The first runner 24 is disposed on the second substrate part SR, and the first runner 24 is connected to the cavity 22. The first runner 24 serves as a passage through which the molten molding member passes.

The first runner 24 has a second height H2 that is lower than the first height H1 of the cavity 22. In this embodiment, the first runner 24 serving as a connection passage connecting the cavity 22 and the second runner 26 to be described later has a constant height.

The second runner 26 communicates with the first runner 24, and the second runner 26 has a third height H3 higher than the second height H2 of the first runner 24.

The lower mold 30 supports the strip substrate 10, and the lower mold 30 is coupled to the upper mold 20.

Referring again to FIG. 3, after the strip substrate 10 is disposed between the upper mold 20 and the lower mold 30, a molten molding resin is provided through the second runner 26. The molten molding resin is provided to the cavity 22 through the second runner 26, the first runner 24.

FIG. 4 is a cross-sectional view illustrating injection of molding resin into upper and lower molds of FIG. 3, and FIG. 5 is a cross-sectional view illustrating removal of upper and lower molds from FIG. 4.

 3 to 5, the molding resin filled in the second runner 26, the first runner 24, and the cavity 22 is cooled to have a first thickness D1 where it corresponds to the cavity 22. The molding part 42 which has is formed, and the tail part 44 which has a 2nd thickness D2 lower than the 1st thickness D1 is formed in the place corresponding to the 1st runner 24, and the 2nd runner ( Corresponding to 26), curls 46 each having a third thickness D3 higher than the second thickness D2 are formed.

In the present embodiment, since the tail portion 44 formed with the second thickness D2 uniform to the first runner 24 has a relatively lower thickness than the molding portion 42, the conventional curled strip substrate is used. The curl 46 can be easily removed from the tail portion 44 without a gold bar for easy separation from it.

FIG. 6 is a photograph showing the fracture positions of the tail and the curl shown in FIG. 5, and FIG. 7 is a side photograph of the curl removed from the tail.

As described above, since the curl generated during the molding process can be easily removed from the tail portion without the gold bar, it is not necessary to form the gold bar on the strip substrate, thereby additionally forming the unit substrate at the position where the gold bar is to be formed. The cost of forming a gold bar can be greatly reduced.

For example, when using a conventional gold bar, about 120 FBGA packages having about 60 solder balls and about 80 FBGA packages having 84 solder balls can be manufactured from a 240 mm × 74 mm strip substrate having a variation range of ± 10 mm. On the other hand, without the gold bar, 147 FBGA packages with 60 solder balls and 105 FBGA packages with 84 solder balls can be manufactured from a 240 mm x 74 mm strip substrate with a variation of ± 10 mm.

8 to 12 are cross-sectional views and photographs illustrating a method of manufacturing a semiconductor package according to a second embodiment of the present invention. The structure of the strip substrate of the method for manufacturing a semiconductor package according to the second embodiment of the present invention is substantially the same as the structure of the semiconductor package according to the first embodiment described above, and the same reference numerals and names will be given to the same components. And, duplicate description of the same configuration will be omitted.

8 is a cross-sectional view of a mold for molding the strip substrate of FIG. 1.

The strip substrate 10 in which the semiconductor chip 1 is mounted on the unit substrate 2 is disposed in molds 50 and 60 that perform a molding process of molding the semiconductor chip 1. The molds 50 and 60 consist of an upper mold 50 and a lower mold 60.

The strip substrate 10 is interposed between the upper mold 50 and the lower mold 60, and the cavity 52, the first runner 54, and the second runner 56 are formed in the upper mold 50. .

The cavity 52 of the upper mold 50 is formed at a position corresponding to the first substrate portion SR, and forms a space on the semiconductor chip 1 of the unit substrate 2 of the first substrate portion SR. do.

The first runner 54 is disposed on the second substrate part SR, and the first runner 54 is connected to the cavity 52. The first runner 54 serves as a passage through which the molten molding resin passes.

The first runner 54 has a height lower than the first height H1 of the cavity 52. In this embodiment, the first runner 54 serving as a connection passage connecting the cavity 52 and the second runner 56 to be described later gradually increases in height toward the cavity 52 from the second runner 56. Is reduced.

The second runner 56 communicates with the first runner 54, and the second runner 56 has a second height H2 higher than the height of the first runner 54.

The lower mold 60 supports the strip substrate 10, and the lower mold 60 is coupled to the upper mold 50.

FIG. 9 is a cross-sectional view illustrating that molten molding resin is provided to the cavity first runner and the second runner of FIG. 8.

Referring to FIG. 9, after the strip substrate 10 is disposed between the upper mold 50 and the lower mold 60, a molten molding resin is provided through the second runner 56. The molten molding resin is provided to the cavity 52 through the second runner 56, the first runner 54.

FIG. 10 is a cross-sectional view illustrating the removal of the upper and lower molds of FIG. 9.

Referring to FIG. 10, the molding resin filled in the second runner 56, the first runner 54, and the cavity 52 is cooled to have a molding part having a first thickness D1 where it corresponds to the cavity 52. Where the 72 is formed, and the corresponding to the first runner 54, the tail portion 74 is formed to decrease the thickness toward the molding portion 72, where the corresponding to the second runner 56 Culls 76 each having a second thickness D2 are formed.

In this embodiment, since the tail portion 74 having a thickness gradually decreasing closer to the molding portion 72 has a relatively lower thickness and a bent portion than the molding portion 72, the conventional curl is removed from the strip substrate. The curl 76 can be easily removed from the tail portion 74 without a gold bar for easy removal.

FIG. 11 is a photograph showing break positions of the tail and the curl shown in FIG. 10, and FIG. 12 is a side photograph of the curl removed from the tail.

As described above, since the curl generated during the molding process can be easily removed from the tail portion without the gold bar, it is not necessary to form the gold bar on the strip substrate, thereby additionally forming the unit substrate at the position where the gold bar is to be formed. The cost of forming a gold bar can be greatly reduced.

For example, when using a conventional gold bar, about 120 FBGA packages having about 60 solder balls and about 80 FBGA packages having 84 solder balls were manufactured from a 240 mm × 74 mm strip substrate having a variation range of ± 10 mm. On the other hand, without the gold bar, 147 FBGA packages with 60 solder balls and 105 FBGA packages with 84 solder balls can be manufactured from a 240 mm x 74 mm strip substrate with a variation of ± 10 mm.

In the detailed description of the present invention described above with reference to the embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary knowledge in the scope of the present invention described in the claims and It will be appreciated that various modifications and variations can be made in the present invention without departing from the scope of the art.

1 is a cross-sectional view illustrating a strip substrate for manufacturing a semiconductor package.

FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1.

3 is a cross-sectional view illustrating a mold for molding the strip substrate of FIG. 2.

FIG. 4 is a cross-sectional view illustrating molding resin injected into upper and lower molds of FIG. 3.

FIG. 5 is a cross-sectional view illustrating the removal of the upper and lower molds from FIG. 4.

FIG. 6 is a photograph illustrating break positions of the tail part and the curl shown in FIG. 5.

7 is a side photograph of the curl removed from the tail portion.

8 is a cross-sectional view of a mold for molding the strip substrate of FIG. 1.

FIG. 9 is a cross-sectional view illustrating that molten molding resin is provided to the cavity first runner and the second runner of FIG. 8.

FIG. 10 is a cross-sectional view illustrating the removal of the upper and lower molds of FIG. 9.

FIG. 11 is a photograph illustrating break positions of the tail part and the curl shown in FIG. 10.

12 is a side photograph of the curl removed from the tail portion.

Claims (4)

Preparing a strip substrate having a first substrate portion on which a unit substrate on which a semiconductor chip is mounted is disposed, and a second substrate portion disposed along a periphery of the first substrate portion; A cavity having a first height in the first substrate portion, a first runner and a second substrate portion connected to the cavity and disposed in the second substrate portion and having a second height lower than the first height; Placing the strip substrate in a mold disposed and connected to the first runner and having a second runner having a third height higher than the first height; Providing a molten molding resin into the cavity through the first runner and the second runner to form a molding portion in the cavity, a tail portion on the second substrate portion corresponding to the first runner, and a curl in the second runner. cull); And And bending the tail portion and the curl to remove the tail portion and the curl from the strip substrate. The method of claim 1, A solder resist film is formed on a surface of the strip substrate, and the solder resist film and the tail portion are in direct contact with each other. The method of claim 1, And the tail portion disposed between the molding portion and the curl has a uniform thickness. The method of claim 1, The thickness of the tail portion disposed between the molding portion and the curl becomes thinner as the closer to the molding portion.

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