475246 A7 B7 五、發明說明（） 本發明關係製造一種塑膠物件之方法’特別是在申請專 利範圍第1項前段所述形式之多媒體卡。 (請先閱讀背面之注意事項再填寫本頁) 例如所謂多媒體卡之塑膠物件’是由在露出其電接觸區 域之一、表面上之平坦塑膠外罩所組成。埋入於塑膠外罩內 部之半導體晶片連接至露出之接觸區。對於此種多媒體卡 之製造，首先將宁導體晶片固定於基板上，並用極細之線 連接至基板。已知對進、步加工形成完整之多媒體卡，已 有不同之各種方法。 關於第一種方法，用印刷雪路板作爲基板。用所謂4求 頂」（Globtop)之方法將塑膠.、覆蓋於已組裝並接線之半導體 晶片上以便保護線路免於機械上之損壞和短路。再者，在 印刷電路板上裝設各種電子零件，例如電容，並且置於鑄 模射出成形之塑膠體之凹陷內，再用黏著劑或以超音波方 法固定於凹陷內。最後，加一標籤於印刷電路板上，使印 刷電路板埋入於塑膠體與標籤之間，而且只有電接觸區域 露出多媒體卡之表面上。 經濟部智慧財產局員工消費合作社印製 另一方法，被局部塗以箔片之金屬的導線架被當做基 板。利用轉移模鑄法，將裝好並已接線之半導體晶片埋於 塑膠包覆之中。模鑄後，已包覆之半導體晶片從導線架衝 出：以此方法，製成一種所謂電子模組爲一種半成品。隨 後’以射出成型法用塑膠材料包封電子模組形成完整之多 媒體卡，這是根據歐洲專利EP399868B1之說明。以此種 射出成形程序，作爲標示用之標籤可以同時施工。對於露 出之接觸區位於半導體晶片旁邊而不在其上方之多媒體 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 A7 B7 1、發明說明（） 卡。此種方法之另項發展已知爲DEI 96 2 5 228，其導線架 之設計在於在射出成形法當中，使露出之接觸區域抵壓靠 在射出模具之壁上。 另一已知方法，用一種撓性印刷電路板作爲基板，並藉 由轉移模鑄法將已裝組並接線之半導體晶片埋入由塑膠所 製成之包覆物內，然後衝出而成平坦之電子模組。電子模 組平坦之一面因而完全由露出之接觸區所遮蓋。其後，電子 模組被置入一射出成形之塑膠體之凹陷內，並用黏著劑固 定於凹陷中。 本發明之目的爲簡化多媒體卡之製造。 本發明包含申請專利範圍第1項所示各項特徵。從各附 屬項可得有利之各具體表現。 本發明提出刪去形成電.子摸組之中間階段而簡化多媒體 卡之製造方法。因此，根據本發明，配備有光裸無保護之 半導體晶片之基板被置於模穴之中，在次一階段，用塑膠 封裝基板而製成多媒體卡之塑膠罩殻。 用塑膠封裝基板，最好用所謂轉移模鑄法進行，此方法 在半導體工業中廣泛用於積體電路之封裝，通常被稱爲轉 移模鑄方法。此種轉移模鑄方法之特徵在於一壓力室中， 待射入塑.膠在壓力和熱之下液化，並被柱寨施壓，經由料 管即，所謂的澆道，進入射入模具之穴孔內。在進入穴孔 之進口，塑膠極度液化（類似於水），因而在數巴（bars)之相 對低的壓力下，可以壓入於穴孔之內。原則上，所有已知 而合於轉移模鑄方法之塑膠均可使用，特別是硬塑性 -4- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ：----r---------------^訂---------線 (請先閱讀背面之注意事項再填寫本頁) 475246 A7 B7 _ 1、發明說明（3) (請先閱讀背面之注意事項再填寫本頁) (Duroplastic)或環氧基塑膠。如果小心選擇穴孔中澆道之 入口位置，即所謂閘口，一方面對於未受保護之線路之損 傷和另一方面對於基板不應有之水平或垂直之偏移均將爲 不可能。轉移模鑄方法之其他優點在於：因爲壓力比較 低，若干塑膠物件可以在同一射出程序中製成，而完成之 塑膠物件自動滿足有用相同塑膠製成1C所要求之品質。 然而基板之塑膠封裝也可以用製造晶片卡之射出成形完 成。如果用此方法，塑膠保持黏稠，因而必須用通常爲 1 〇〇〇巴之高壓壓入模穴內。對於射出成形，利用化學反應 在注射模內硬化之硬性塑膠，如同以冷卻而硬化之熱塑性 塑膠一樣被使用。已知之塑膠例如ABS或PET。 如果以導線架作爲基板來使用，可得多媒體卡或其他塑 膠物件特別簡單的製造方法。然後塑膠物件可以如同習知 之1C 一樣而製成。 以下以圖式爲基礎，詳細說明本發明各具體例。 如所表示： 第1圖置於注射模模穴內之裝備半導體晶片之印刷電路 板之側面7 經濟部智慧財產局員工消費合作社印製 m 胃裊關*射反μ® ; 第置於注射模模穴內之裝有半導體晶片之金屬載體 沖出側面； 第1·$圖成導線架形狀之金屬載體平面圖5 第6圖具有略爲”S”形跤指之金屬載體：和 第7，8圖多媒體卡。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） W46475246 A7 B7 V. Description of the invention () The invention relates to a method for manufacturing a plastic object ', especially a multimedia card in the form described in the first paragraph of the first patent application. (Please read the precautions on the back before filling out this page.) For example, the so-called plastic object of a multimedia card ’consists of a flat plastic cover on the surface that exposes one of its electrical contact areas. The semiconductor chip embedded in the plastic cover is connected to the exposed contact area. For the manufacture of this kind of multimedia card, the conductor wafer is first fixed on the substrate and connected to the substrate with a very thin wire. It is known that there are different methods for processing and forming a complete multimedia card. Regarding the first method, a printed snow board is used as a substrate. The so-called "4 Globtop" method is used to cover the plastic on the assembled and wired semiconductor chip to protect the circuit from mechanical damage and short circuits. Furthermore, various electronic components, such as capacitors, are mounted on the printed circuit board, and placed in a recess of a plastic body formed by injection molding, and then fixed in the recess by an adhesive or an ultrasonic method. Finally, a label is added to the printed circuit board so that the printed circuit board is buried between the plastic body and the label, and only the electrical contact area is exposed on the surface of the multimedia card. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Another method, a metal lead frame partially coated with foil is used as a substrate. Using the transfer molding method, the assembled and wired semiconductor wafer is buried in a plastic cover. After molding, the coated semiconductor wafer is punched out of the lead frame: in this way, a so-called electronic module is manufactured as a semi-finished product. Subsequently, the electronic module is encapsulated with a plastic material by injection molding to form a complete multi-media card, which is based on the description of European Patent EP399868B1. With this injection molding process, the label used for marking can be applied simultaneously. For the multimedia with the exposed contact area next to the semiconductor wafer but not above it, the Chinese paper standard (CNS) A4 (210 X 297 mm) applies. Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. A7 B7. () Card. Another development of this method is known as DEI 96 2 5 228, and its lead frame is designed so that the exposed contact area is pressed against the wall of the injection mold in the injection molding method. Another known method is to use a flexible printed circuit board as a substrate and bury the assembled and wired semiconductor wafers in a cover made of plastic by transfer molding and punch out Flat electronic module. The flat side of the electronic module is therefore completely covered by the exposed contact area. Thereafter, the electronic module is placed in a recess of an injection-molded plastic body, and is fixed in the recess with an adhesive. The object of the present invention is to simplify the manufacture of multimedia cards. The invention includes the features shown in item 1 of the scope of patent application. From the subordinate items, each specific performance can be obtained. The invention proposes to simplify the manufacturing method of the multimedia card by deleting the middle stage of forming the electric sub-group. Therefore, according to the present invention, a substrate equipped with a bare, unprotected semiconductor wafer is placed in a cavity, and in the next stage, the substrate is made of plastic to make a plastic cover for a multimedia card. The plastic packaging substrate is preferably carried out by the so-called transfer molding method, which is widely used in the semiconductor industry for packaging integrated circuits, and is often referred to as the transfer molding method. This transfer molding method is characterized by a pressure chamber, which is to be injected into the plastic. The glue is liquefied under pressure and heat, and is pressured by the column. It enters the injection mold through the material pipe, the so-called runner. Inside the hole. At the entrance to the hole, the plastic is extremely liquefied (similar to water), so it can be pressed into the hole at a relatively low pressure of a few bars. In principle, all plastics that are known and suitable for transfer molding can be used, especially hard plastic. 4- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm): ---- r --------------- ^ Order --------- line (please read the notes on the back before filling this page) 475246 A7 B7 _ 1. Description of the invention ( 3) (Please read the notes on the back before filling in this page) (Duroplastic) or epoxy plastic. If you carefully choose the entrance position of the runner in the hole, the so-called gate, it will be impossible to damage the unprotected lines on the one hand and the horizontal or vertical offset that should not be on the substrate. Another advantage of the transfer molding method is that because the pressure is relatively low, several plastic objects can be made in the same injection process, and the completed plastic objects automatically meet the quality required for 1C made of the same plastic. However, the plastic packaging of the substrate can also be completed by injection molding of the chip card. If this method is used, the plastic remains sticky and must be pressed into the cavity with a high pressure, usually 1000 bar. For injection molding, rigid plastics that are hardened in injection molds by chemical reactions are used like thermoplastics that are hardened by cooling. Known plastics such as ABS or PET. If a lead frame is used as the substrate, a particularly simple manufacturing method for a multimedia card or other plastic object can be obtained. Then the plastic object can be made like the conventional 1C. Hereinafter, specific examples of the present invention will be described in detail based on the drawings. As shown: Figure 1 Side of a printed circuit board equipped with semiconductor wafers placed in the cavity of an injection mold. 7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The metal carrier containing the semiconductor wafer in the cavity is punched out of the side; Figure 1 · $ Plane of the metal carrier in the shape of a lead frame; Figure 5; Illustration multimedia card. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) W46
經濟部智慧財產局員工消費合作社印製 五、發明說明（4) 置施例1 此實施例關係一種塑膠物件，例如一種多媒體卡，由有 機材料製成之傳統的印刷電路板作爲基板。 第1圖表示一示意圖，一置於注射模模穴3內，裝有半 導體晶片1之印刷電路板2，模具由其模具下半和上半 4，5形成。半導體晶片1是裸露而無保護者，Μ即题座埋 於球Il/Globtop)亦非於塑膠罩殼之內。印刷電路板2在側 面具有電接觸面6,其面對模具下半4 ,其爲用作/已鬼成 塑膠物件之外在、接觸。接觸區域6爲平坦而與所完成塑膠 物件外表面、舆齊。半導體晶片1之連接點7，即所謂腳 位，是經由導線8連接至印刷電路板2之連接點9。印刷 電路板2之連接點9以傳統方法連接至電接觸區6。印刷 電路板2具有凹口 1 0或連續之鑽孔，於其中嚙合在模具 下半4上所安排固定的或可移動之定位銷1 1。定位銷1 1 是用於設定印刷電路板2於模穴3內，並在用塑膠模製當 中保證其穩定的水平位置。印刷電路板2也可選擇裝備電 子臭件1 2，例如電容。也可以選擇以標籤1 3置於模之上 半5之內，該標籤帶有靜電因而黏著於模具上半5之。在 模穴3內用於塑膠入口 14，亦即閘口之較佳位置，在於印 刷電路板2之上，亦在任何存在之電子吳件12之上，且 於側面遠離線路8。 印刷電路板2置於模具下半4之上之後，關閉注射模， 印刷電路板2與倘若附有之標籤1 3，最好用轉移模鑄方法 製成爲完整之塑膠物件。在印刷電路板之上之進口 1 4之 -6- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 7 . --------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 475246 A7 ___B7___ 五、發明說明（5 ) 安排已證明可成功使塑膠流入模穴、、.3，施加力量於印刷電 路板2使抵向模具下半4，因而壓緊印刷電路..板2於注射 模之壁上。以此方法可使在印刷電路板2和模具下半4之 間可能存在之氣隙在塑膠可以到達印刷電路板2下方1 5 之前會自動消失。 印刷電路板2可以由比較強硬之材料如FR4者構成，或 較佳由撓性材料構成，在壓力下使流入模穴3的塑膠施力 於印刷電路板而整潔配入於模具下半4。在注射塑膠時， 或必須使印刷電路板2之下方1 5爲平坦，或在塑膠穿透 印刷電路板2下方1 5與模具下半4之間由於印刷電路板2 內之曲率而造成穴孔之前，使印刷電路板2之任何曲率消 失。 在半導體晶片1與基板之間，電的連接是由線路8造 成，然而亦可以用突起物產生^在此，半導體晶片是成爲 倒裝片而裝組。在用轉移模鑄方法成形時，在半導體晶片 1與印刷電路板之間的間隙依然存在，並以塑膠塡入：不 須分開「不予塡滿」。 第2圖表示印刷電路板2下方1 5具有接觸區域6以及 兩個凹口 10，該兩凹口與注射模具之定位銷（第1圖）嚙 合。半導體晶片1和電容12’等，位於印刷電路板2之上 方，用虛線表示。印刷電路板2下方1 5成爲將完成之塑 膠物件之一外側：接觸區域6爲對塑膠物件表面之疊積水 平面。 以下各實施例關係一種塑膠物件，尤其是多媒體卡，其 •7- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） '~' . •裝--------訂--- (請先閱讀背面之注音？事項再填寫本頁) 着丨 475246 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（6) 爲以板片形成之金屬載體作爲基板。載體可以形成個別被 沖出件之形狀而被置於注射成形模具之內，用定位銷保持 而模塑成爲塑膠物件。然而，載體最好成爲導線架而供入 於注射成形模具內，於其中模塑成塑膠物件，然後從導線 架之未模塑部件分離出塑膠物件。 實施例2 第3圖表示一金屬載體16,裝有一裸露之半導體晶片 1，其爲在半導體晶片1之組裝和佈線之後，被沖出而與 導線架所剩餘部份分離。在面對半導體晶片1之側面，金 屬載體16被箔片17 —亦叫做帶子所覆蓋。箔片17含有 孔1 8如此以致於半導體晶片1之連接點7可經線路8與 載體16之連接點9連線。金屬載體16含有一晶片島19， 在其上安置半導體晶片1，且其一端之歧指20將含有稍後 完成之塑膠物件所露出之接觸區域6。半導體晶片1用膠 黏於金屬載體16上之箔片17上，或於箔片17之孔內。 模具下半4有一步階21。步階21之高度相當於待隨後 加於射出成形塑膠物件之標籤厚度。載體16之歧指20之 彎曲是以使晶片島19以及接觸區域6落在模具下半4上 而在步階21之兩側。固定的或可收縮之銷22a被安置於 模具上半5上，其在模具上下兩半4和5之閉合狀況中， 壓於步階21相近周圍而抵向模具下半4之升起區域。載 體1 6之彎曲設計最好使由定位銷1 1所設定之載體1 6接 觸區域6壓抵於模具下半4，因而平置於模具下半4上。 另可再選擇使用銷件22b及/或22c，可設想其在晶片島19 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） I ：----------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 475246 A7 B7 _ 五、發明說明（） 區內或在接觸區域6區內壓使載體抵向模具下半4之升起 或下降之區域。以此等手段，可保接觸區域6以及晶片島 1 9平躺於模具下半4上，使在隨後用轉移模鑄時，無塑膠 能夠落在接觸區域6上。以此方法製得之塑膠物件含有一 保留區域，在其上可以加上標籤1 3，而其外側與露出之接 觸區域6等局。 實施例3 第4圖表示一具體例，其中標籤13隨後不加至已完成 之射出成形塑膠物件上，但是在模鑄期中，落在模具下半 4之上，模中不再有步階。載體Γ6之歧指20被彎曲如同前 例，且用銷件22a及/或22b及/或22c以保載體16之 接觸區域6在壓力下平躺於模具下半4之上，或使有晶片 島1 9之區域平躺於標籤1 3上。 實施例4 4 此實施例關係先前解釋之兩實施例之另項發展，其中如 第5圖所見之載體1 6尙未從導線架24所餘部份分離，而 仍然用橋25連接至導線架23之框架。載體16之歧指20 亦彎成使接觸區域不與晶片島1 9落於同一平面上。導線 架24之框架含有習知之孔，其爲用於在半導體晶片丨在 組裝或佈線之時，以及在封裝之時，使導線架24定位。 模具上半5，其所界定孔穴之邊緣用虛線表示，具有接受 橋件23之凹位。以此解決方法，銷件22a、22b和22c可 以省略而改由橋件23固定載體16。在封裝之前，標籤13 或可直接置於模具下半，或可先預黏著於載體1 6，如先前 -9- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） " * · ^-----------------訂---------線赢 (請先閱讀背面之注咅2事項再填寫本頁) 4/5246 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 所述之實施例。在封裝後，塑膠物件從導線架24之非模 鑄部份分離。 實施例5 第6圖表示用一沖出所得載體1 6之具體例。晶片島1 9 落在位於注射模具下半4上之標籤1 3之上。歧指20彎成 略爲”S”形，在注射模具閉合時，使接觸區域存在於模具 上半5上。以此方法，載體16被固定鉗夾於模具上、下 兩半之間，而接觸區域則無塑膠。原則上，在模鑄時不需 銷件以固定載體1 6。然而，可作爲一項選擇，各定位銷可 以當作在注射模具被閉合之前用於定位和保持載體1 6，可 在其後被撤除。 另一方面，在模鑄之前，也有可能不使載體1 6從導線 架24之剩餘部份分離，而只能在模鑄之後才可以如此以 使載體1 6在模穴3內之準確定位得以由橋23執行。 正常情形下，用於轉移模鑄方法之塑膠的彈性，尤其是 硬性塑膠或環氧基塑膠，顯然> 如用於射出成型之如ABS 或PET。造成轉移模鑄方法所製多媒體卡難以彎屈，存有 在彎屈負荷時使多媒體卡破裂之危險。大部份受危害生成 開裂都是在邊緣，在該邊緣印刷電路板與塑膠大量接觸， 因爲邊緣對應拉力所發生之應力敏感，例如多媒體卡被彎 屈。以下，有四種方式是被視爲將使多媒體卡破損所需之 力量大爲增加。 第7圖表示一多媒體卡25之表面，具有露出之接觸區 域6，爲依照實施例1所產生。在內部，多媒體卡25具有 -10- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ；-----------------訂---------線 (請先閱讀背面之注咅？事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 475246 A7 __ B7 ___ 五、發明說明（9) 一半導體晶片1，被置於其一側；或以若干個半導體晶片 1置於其位置之一側，用虛線標示。多媒體卡25之表面可 以分爲兩區，在第一區26中的印刷電路板2形成該表面 和在第二區27中的注射塑膠體28形成該表面。根據第一 種方式，印刷電路板2之尺寸爲使在印刷電路板2與塑膠 體28接觸之邊緣29，與當多媒體卡25依其縱向被彎屈時 拉力負荷最大之處3 0，使兩者間之距離D盡可能的大。 根據第二種方式，使形成邊緣29之印刷電路板邊界被設 計成爲彎曲或波浪形線而非直線。以此方式，邊緣29不 再使拉力施於邊緣29，而分佈於較大之區域。作爲第三種 方式者，建議形成印刷電路板2之側界3 1，各自傾斜，使 有塑膠質28之區域27盡可能寬（寬度B)而至邊緣29之程 度。作爲第四種方式者，建議插入各孔33,較佳爲橢圓或 圓形，於印刷電路板2邊界內曲線3 2之區域內，指向多 媒體卡25之中間。以此方式，可局部增加印刷電路板之 彈性，再減少形成開裂之危險。再者，印刷電路板2甚至 優於錨定於塑膠體28者。 第8圖表示另一多媒體卡25之表面，其中有兩個半導 體晶片1 a和lb，其位置以虛線標示。根據本發明，其爲 建議佈置la和lb兩半導體晶片盡可能互相遠離，亦即， 盡可能遠離直線30，其位置爲多媒體卡在縱向所受拉力負 載最大之處。印刷電路板2之邊界是沿多媒體卡縱邊以中 間收窄之曲線形成。由波浪形之邊界可見多媒體卡25中 間有塑膠質28之區域27，亦即直線30之區域，盡可能寬 -11- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） —^-----------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) W246 A7 B7 1、發明說明（1G) 闊。另外，各洞33又可預知在印刷電路板2之中可局部 增進印刷電路板2之彈性。 有曲線或波浪形邊界之印刷電路板之設計，不但可以應 用於多媒體卡，且可用於一般之平坦塑膠物件。在實施例 2至5中作爲基板之金屬載體16也可以以彎曲之邊界形 成，以增進塑膠物件之彎屈負載能力。 符號之說明 經濟部智慧財產局員工消費合作社印製 1 半導體晶片 2 印刷電路板 3 孔穴 4 模具下半 5 模具上半 6 接觸區域 7 連接點 8 電線 9 連接點 10 凹陷 11 鑽孔 12 電子另件 13 標籤 14 入口 15 印刷電路板下方 16 金屬載體 17 箔片 -12- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) ----- 訂---------線· 475246 A7 B7 11 五、發明說明（） 經濟部智慧財產局員工消費合作社印製 18 孔 19 晶片島 20 歧指 21 步階 22 銷件 23 橋 24 導線架 25 多媒體卡 26 區域 27 區域 28 塑膠質 29 邊緣 30 直線 3 1 邊界 32 曲線 33 孔 B 寬度 D 距離 -13 - (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (4) Example 1 This embodiment relates to a plastic object, such as a multimedia card, and a traditional printed circuit board made of organic materials as a substrate. Fig. 1 shows a schematic diagram of a printed circuit board 2 in which a semiconductor wafer 1 is placed in an injection mold cavity 3, and the mold is formed by the lower half and the upper half 4,5 of the mold. The semiconductor wafer 1 is bare and unprotected, and M is the head buried in the ball (Ill / Globtop) or in the plastic cover. The printed circuit board 2 has an electrical contact surface 6 on the side, which faces the lower half 4 of the mold, and is used as / has been formed outside the plastic object to make contact. The contact area 6 is flat and aligned with the outer surface of the finished plastic object. The connection point 7 of the semiconductor wafer 1, which is a so-called pin, is connected to the connection point 9 of the printed circuit board 2 through a wire 8. The connection point 9 of the printed circuit board 2 is connected to the electrical contact area 6 in a conventional manner. The printed circuit board 2 has a notch 10 or continuous drilled holes in which fixed or movable positioning pins 11 arranged on the lower half 4 of the mold are engaged. The positioning pins 1 1 are used to set the printed circuit board 2 in the cavity 3 and ensure a stable horizontal position during the molding with plastic. The printed circuit board 2 may optionally be equipped with electronic odor-reducing parts 12, such as a capacitor. You can also choose to place the label 1 3 within the top half 5 of the mold. The label is static and therefore adheres to the top half 5 of the mold. The preferred location for the plastic inlet 14 in the cavity 3, that is, the gate, is above the printed circuit board 2 and also above any existing electronic components 12 and away from the line 8 on the side. After the printed circuit board 2 is placed on the lower half 4 of the mold, the injection mold is closed, and the printed circuit board 2 and the attached label 13 are preferably made into a complete plastic object by transfer molding. Imports on printed circuit boards 1 4 of -6- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 7. -------- Order ------ --- line (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 475246 A7 ___B7___ V. Description of the invention (5) The arrangement has proved that plastic can flow into the mold cavity successfully. 3. Apply force to the printed circuit board 2 so as to abut the lower half 4 of the mold, so press the printed circuit board 2 on the wall of the injection mold. In this way, the air gap that may exist between the printed circuit board 2 and the lower half 4 of the mold will automatically disappear before the plastic can reach the lower part of the printed circuit board 2 1 5. The printed circuit board 2 may be made of a relatively strong material such as FR4, or preferably a flexible material. The plastic flowing into the cavity 3 is pressed under pressure to the printed circuit board and neatly fit into the lower half 4 of the mold. When injecting plastic, either the lower part 15 of the printed circuit board 2 must be flat, or the plastic penetrates the lower part 15 of the printed circuit board 2 and the lower half 4 of the mold due to the curvature in the printed circuit board 2. Before, any curvature of the printed circuit board 2 is made to disappear. The electrical connection between the semiconductor wafer 1 and the substrate is made by the wiring 8. However, it can also be produced by a projection. Here, the semiconductor wafer is assembled as a flip chip. When forming by the transfer molding method, the gap between the semiconductor wafer 1 and the printed circuit board still exists, and is inserted with plastic: it is not necessary to separate the "not full". Fig. 2 shows that the printed circuit board 2 has a contact area 6 and two notches 10 and 15 below, and the two notches are engaged with the positioning pins (Fig. 1) of the injection mold. The semiconductor wafer 1 and the capacitor 12 'are located above the printed circuit board 2 and are indicated by dotted lines. The lower part 15 of the printed circuit board 2 becomes an outer side of one of the plastic objects to be completed: the contact area 6 is a superimposed horizontal plane on the surface of the plastic object. The following embodiments relate to a plastic object, especially a multimedia card. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) '~'. • Packing ------- -Order --- (Please read the phonetic on the back? Matters before filling out this page) by 475246 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (6) The metal carrier formed by sheet metal is used as Substrate. The carrier can be formed into the shape of an individual punched part and placed in an injection molding mold, and held by a positioning pin to be molded into a plastic object. However, the carrier is preferably supplied as a lead frame in an injection molding mold, in which a plastic object is molded, and then the plastic object is separated from an unmolded part of the lead frame. Embodiment 2 Fig. 3 shows a metal carrier 16 containing an exposed semiconductor wafer 1, which is punched out from the remainder of the lead frame after the semiconductor wafer 1 is assembled and wired. On the side facing the semiconductor wafer 1, the metal carrier 16 is covered by a foil 17-also called a tape. The foil 17 contains holes 18 so that the connection point 7 of the semiconductor wafer 1 can be connected to the connection point 9 of the carrier 16 via the line 8. The metal carrier 16 contains a wafer island 19 on which the semiconductor wafer 1 is placed, and the finger 20 at one end thereof will contain a contact area 6 exposed by a plastic object to be completed later. The semiconductor wafer 1 is glued to the foil 17 on the metal carrier 16 or in the hole of the foil 17. There is a step 21 in the lower half 4 of the mold. The height of step 21 is equivalent to the thickness of the label to be subsequently added to the injection-molded plastic object. The discrepancy 20 of the carrier 16 is such that the wafer island 19 and the contact area 6 fall on the lower half 4 of the mold and on both sides of the step 21. The fixed or retractable pin 22a is placed on the upper half 5 of the mold, and in the closed condition of the upper and lower halves 4 and 5 of the mold, it is pressed around the step 21 and abuts against the raised area of the lower half 4 of the mold. The curved design of the carrier 16 is preferably such that the contact area 6 of the carrier 16 set by the positioning pin 11 presses against the lower half 4 of the mold, and therefore lies flat on the lower half 4 of the mold. Another option is to use pins 22b and / or 22c. It can be envisaged that the paper size of this paper is 19, which is applicable to China National Standard (CNS) A4 (210 X 297 mm) I: --------- ------- Order --------- line (please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 475246 A7 B7 _ 5. Description of the invention ( ) In the area or in the contact area 6 area, the carrier is pressed against the raised or lowered area of the lower half 4 of the mold. By these means, the contact area 6 and the wafer island 19 can be laid flat on the lower half 4 of the mold, so that in the subsequent transfer molding, no plastic can fall on the contact area 6. The plastic object produced in this way contains a reserved area on which a label 1 3 can be added, and the outside thereof is exposed to the exposed contact area 6 and the like. Embodiment 3 Figure 4 shows a specific example in which the label 13 is not subsequently added to the completed injection-molded plastic object, but during the molding period, it falls on the lower half 4 of the mold, and there are no steps in the mold. The ambiguity of the carrier Γ6 means that the 20 is bent as in the previous example, and the pins 22a and / or 22b and / or 22c are used to ensure that the contact area 6 of the carrier 16 lies flat on the lower half 4 of the mold under pressure, or the wafer island 1 The area of 9 lies flat on the label 1 3. Embodiment 4 4 This embodiment relates to another development of the two embodiments explained previously, in which the carrier 16 as shown in FIG. 5 is not separated from the rest of the lead frame 24 and is still connected to the lead frame by a bridge 25 23 framework. The index finger 20 of the carrier 16 is also bent so that the contact area does not fall on the same plane as the wafer island 19. The frame of the lead frame 24 contains a conventional hole for positioning the lead frame 24 when the semiconductor wafer is assembled or wired, and when it is packaged. The upper part of the mold 5 is indicated by a dotted line at the edge of the cavity, and has a recess for receiving the bridge 23. With this solution, the pins 22a, 22b, and 22c can be omitted and the carrier 16 can be fixed by the bridge 23 instead. Prior to encapsulation, the label 13 may be placed directly on the lower half of the mold, or it may be pre-adhered to the carrier 16 as previously. -9- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) " * · ^ ----------------- Order --------- Line Win (Please read Note 2 on the back before filling this page) 4 / 5246 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. The embodiment described in the description of the invention (). After encapsulation, the plastic article is separated from the non-molded portion of the lead frame 24. Example 5 Figure 6 shows a specific example of the carrier 16 obtained by punching out. The wafer island 19 falls on a label 1 3 located on the lower half 4 of the injection mold. The index finger 20 is bent into a slightly "S" shape, so that when the injection mold is closed, the contact area exists on the upper half 5 of the mold. In this way, the carrier 16 is clamped between the upper and lower halves of the mold by a fixed jaw, and the contact area is free of plastic. In principle, no pins are needed to fix the carrier 16 during die casting. Alternatively, however, the positioning pins may be used to position and hold the carrier 16 before the injection mold is closed, and may be removed thereafter. On the other hand, it is possible that the carrier 16 is not separated from the rest of the lead frame 24 before the die casting, but only after the die casting so that the carrier 16 can be accurately positioned in the cavity 3 Performed by the bridge 23. Under normal circumstances, the elasticity of plastics used for transfer molding methods, especially rigid plastics or epoxy-based plastics, is obviously > such as for injection molding such as ABS or PET. As a result, it is difficult to bend the multimedia card produced by the transfer molding method, and there is a danger that the multimedia card may be broken under a bending load. Most of the damage caused by cracking are at the edge, where the printed circuit board contacts the plastic a lot, because the edge is sensitive to the stress caused by the tensile force, for example, the multimedia card is flexed. In the following, there are four ways that are considered to greatly increase the force required to break a multimedia card. FIG. 7 shows the surface of a multimedia card 25 with an exposed contact area 6 which is generated according to the first embodiment. Internally, the multimedia card 25 has -10- This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm); ------- line (Please read the note on the back? Matters before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 475246 A7 __ B7 ___ V. Description of the invention (9) A semiconductor wafer 1, It is placed on one side thereof; or a plurality of semiconductor wafers 1 are placed on one side of its position, which are indicated by dotted lines. The surface of the multimedia card 25 can be divided into two areas, the printed circuit board 2 in the first area 26 forming the surface and the injection plastic body 28 in the second area 27 forming the surface. According to the first method, the size of the printed circuit board 2 is such that the edge 29 at which the printed circuit board 2 contacts the plastic body 28 and the maximum tensile load when the multimedia card 25 is flexed in its longitudinal direction are 30, so The distance D between them is as large as possible. According to the second method, the boundary of the printed circuit board forming the edge 29 is designed to be a curved or wavy line instead of a straight line. In this way, the edges 29 no longer apply a pulling force to the edges 29, but are distributed over a larger area. As a third method, it is suggested to form the side borders 31 of the printed circuit board 2 and incline each of them so that the area 27 with the plastic 28 is as wide as possible (width B) to the extent of the edge 29. As the fourth method, it is recommended to insert each hole 33, preferably an ellipse or a circle, in the area of the curve 32 within the boundary of the printed circuit board 2 and point to the middle of the multimedia card 25. In this way, the flexibility of the printed circuit board can be locally increased, and the risk of crack formation can be reduced. Furthermore, the printed circuit board 2 is even better than those anchored to the plastic body 28. Fig. 8 shows the surface of another multimedia card 25, in which there are two semiconductor chips 1a and 1b, and their positions are indicated by dotted lines. According to the present invention, it is proposed to arrange the two semiconductor wafers la and lb as far away from each other as possible, that is, as far as possible from the straight line 30, and its position is where the multimedia card is subjected to the greatest tensile load in the longitudinal direction. The border of the printed circuit board 2 is formed by a curve narrowed in the middle along the longitudinal side of the multimedia card. The wavy border shows the area 27 of plastic 28 in the middle of the multimedia card 25, that is, the area of the straight line 30, as wide as possible. -11- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) — ^ ----------------- Order --------- line (please read the notes on the back before filling this page) W246 A7 B7 1. Description of the invention (1G) Wide. In addition, it is predicted that the holes 33 can partially improve the elasticity of the printed circuit board 2 in the printed circuit board 2. The design of printed circuit boards with curved or wavy borders can be used not only for multimedia cards, but also for general flat plastic objects. The metal carrier 16 used as the substrate in the embodiments 2 to 5 may also be formed with a curved boundary to improve the bending load capacity of the plastic object. Explanation of Symbols Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 Semiconductor wafer 2 Printed circuit board 3 Holes 4 Lower half of the mold 5 Upper half of the mold 6 Contact area 7 Connection point 8 Wire 9 Connection point 10 Depression 11 Drilling 12 Electronic parts 13 Label 14 Entrance 15 Below the printed circuit board 16 Metal carrier 17 Foil -12- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) ----- Order --------- Line · 475246 A7 B7 11 V. Description of the invention () Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 18 holes 19 Chip islands 20 Discrete 21 steps 22 pins Pieces 23 bridge 24 lead frame 25 multimedia card 26 area 27 area 28 plastic 29 edge 30 straight line 3 1 border 32 curve 33 hole B width D distance -13-(Please read the precautions on the back before filling this page) Paper dimensions Applicable to China National Standard (CNS) A4 (210 X 297 mm)