JPH0692076A - Lead frame form for ic card module - Google Patents

Lead frame form for ic card module

Info

Publication number
JPH0692076A
JPH0692076A JP4246547A JP24654792A JPH0692076A JP H0692076 A JPH0692076 A JP H0692076A JP 4246547 A JP4246547 A JP 4246547A JP 24654792 A JP24654792 A JP 24654792A JP H0692076 A JPH0692076 A JP H0692076A
Authority
JP
Japan
Prior art keywords
lead frame
mold
island
mold resin
card module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4246547A
Other languages
Japanese (ja)
Inventor
Akinobu Inoue
明信 井上
Harufumi Kobayashi
治文 小林
Tadashi Yamaguchi
忠士 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP4246547A priority Critical patent/JPH0692076A/en
Publication of JPH0692076A publication Critical patent/JPH0692076A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Credit Cards Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the adhesion between a lead frame and mold resin for a read/write module used in an IC card so that terminals may not be separated from the mold when the module is bent. CONSTITUTION:In an island 14 and terminals 15 of a lead frame 13, sectional forms of half etching parts 14a of the island end and half etching parts 15a of the terminal ends are made to be oblique which can be pinched by mold resins 17a and 17b.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、ＩＣカードに搭載され
る読み出し／書き込み等の機能を持つモジュールのリー
ドフレーム形状に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame shape of a module mounted on an IC card and having functions such as reading / writing.

【０００２】[0002]

【従来の技術】図３は、従来のリードフレーム形状を備
えたＩＣカードモジュールを示す平面図およびそのＡ１
−Ａ２断面図である。図において、１はその詳細な構成
を図４に示すように、例えば板厚０．６ｍｍのリードフ
レームである。このリードフレーム１はアイランド２、
端子３および外枠４からなっている。５はリードフレー
ム１のアイランド２の下部に、ボンディングシート６を
介してボンディングした半導体素子、７は端子３と半導
体素子５間をワイヤボンディングしたボンディングワイ
ヤ、８はモールド樹脂封止金型にてモールド樹脂境界線
９内を充填したモールド樹脂、１０はこのモールド樹脂
封止金型のエジェクトピンである。2. Description of the Related Art FIG. 3 is a plan view showing an IC card module having a conventional lead frame shape and its A1.
-A2 sectional drawing. In the figure, reference numeral 1 is a lead frame having a plate thickness of 0.6 mm, for example, as shown in FIG. This lead frame 1 is an island 2,
It is composed of terminals 3 and an outer frame 4. Reference numeral 5 is a semiconductor element bonded under the island 2 of the lead frame 1 via a bonding sheet 6, 7 is a bonding wire wire-bonded between the terminal 3 and the semiconductor element 5, and 8 is molded by a resin mold. Mold resin 10 filling the resin boundary line 9 is an eject pin of the mold resin sealing die.

【０００３】次に、上記構成のリードフレームの製造工
程を図５（ａ）〜図５（ｃ）を参照して説明したのち、
ＩＣカードモジュールの製造方法を図３（Ａ）および図
３（Ｂ）を参照して説明する。まず、図５（Ａ）に示す
ように、リードフレーム１の母材１ａの表面に、リード
形状として残した部分にレジスト１１を塗布する。そし
て、図５（Ｂ）に示すように、矢印１２の方向からエッ
チングする。そして、図５（Ｃ）に示すように、このレ
ジスト１１を除去することにより、図４に示すリードフ
レーム１を製造することができる。そして、このリード
フレーム１のアイランド２の下部に、半導体素子５をボ
ンディングシート６を介してボンディングする。そし
て、この半導体素子５と端子３間をボンディングワイヤ
７によりボンディングを行なう。そして、モールド樹脂
封止金型にて、モールド樹脂境界線９内をモールド樹脂
８で充填する。そして、モールド樹脂封止金型のエジェ
クトピン１０により金型より突き上げて、取り出したの
ち、個片化し、図示せぬＩＣカード上に実装するもので
ある。Next, a manufacturing process of the lead frame having the above structure will be described with reference to FIGS. 5 (a) to 5 (c).
A method of manufacturing the IC card module will be described with reference to FIGS. 3 (A) and 3 (B). First, as shown in FIG. 5 (A), a resist 11 is applied to the surface of the base material 1a of the lead frame 1 on the portion left as the lead shape. Then, as shown in FIG. 5B, etching is performed from the direction of arrow 12. Then, as shown in FIG. 5C, the lead frame 1 shown in FIG. 4 can be manufactured by removing the resist 11. Then, the semiconductor element 5 is bonded to the lower portion of the island 2 of the lead frame 1 via the bonding sheet 6. Then, the semiconductor element 5 and the terminal 3 are bonded by the bonding wire 7. Then, the inside of the mold resin boundary line 9 is filled with the mold resin 8 using a mold resin sealing die. Then, it is pushed up from the mold by the eject pin 10 of the mold for resin molding and taken out, then separated into individual pieces and mounted on an IC card (not shown).

【０００４】[0004]

【発明が解決しようとする課題】しかしながら、上記構
成のリードフレーム形状では、アイランド２のハーフエ
ッチング部のアイランド端形状２ａ（図５（Ｃ）参照）
および端子３のハーフエッチング部の端子端形状３ａ
（図５（Ｃ）参照）がＲ形状になっているため、リード
フレーム１とモールド樹脂８とは密着力のみで保持され
ている。このため、（Ａ）モールド成形時、モールド樹
脂封止金型内のエジェクトピンにて突き上げる際、モー
ルド樹脂と金型との離型時、モールド樹脂とモールド樹
脂封止金型との密着力により、モジュールを反らせ、端
子部が剥離してしまうこと、（Ｂ）モジュールをＩＣカ
ード上に実装したのち、折り曲げ試験により端子部が剥
離し、この剥離により、ワイヤー断線、およびモジュー
ル内へ水分が侵入し、Ａｌ腐食などが発生するという問
題点があった。However, in the lead frame shape having the above structure, the island end shape 2a of the half-etched portion of the island 2 (see FIG. 5C).
And the terminal end shape 3a of the half-etched portion of the terminal 3
Since the lead frame 1 (see FIG. 5C) has an R shape, the lead frame 1 and the molding resin 8 are held only by the adhesive force. Therefore, (A) during the molding process, when pushing up with the eject pin in the mold resin sealing mold, when the mold resin and the mold are released from each other, due to the adhesive force between the mold resin and the mold resin sealing mold. , The module is warped and the terminal part is peeled off. (B) After the module is mounted on the IC card, the terminal part is peeled off by the bending test, and the wire breakage and moisture intrude into the module due to this peeling. However, there is a problem that Al corrosion occurs.

【０００５】本発明は、以上述べた端子部の剥離による
ワイヤーの断線およびＡｌ腐食という問題点を除去する
ため、端子部の断面形状を変えることにより、端子とモ
ールド樹脂との剥離をなくすことができる優れた形状を
提供することを目的とする。In order to eliminate the above-mentioned problems of wire breakage and Al corrosion due to peeling of the terminal portion, the present invention can eliminate the peeling between the terminal and the mold resin by changing the sectional shape of the terminal portion. The object is to provide an excellent shape that can be obtained.

【０００６】[0006]

【課題を解決するための手段】本発明に係るＩＣカード
モジュール用リードフレーム形状は、そのアイランド端
ハーフエッチング部および端子端ハーフエッチング部の
断面形状を、モールド樹脂にて挾持できる傾斜形状にす
るものである。In the lead frame shape for an IC card module according to the present invention, the sectional shapes of the island end half-etched portion and the terminal end half-etched portion are inclined so that they can be held by a mold resin. Is.

【０００７】[0007]

【作用】本発明は、端子部の剥離耐力を大幅に向上する
ことができる。According to the present invention, the peeling resistance of the terminal portion can be greatly improved.

【０００８】[0008]

【実施例】図１は本発明に係るＩＣカードモジュール用
リードフレーム形状の一実施例を備えたＩＣカードモジ
ュールを示す断面図である。図において、１３はその製
造工程を図２（Ａ）〜図２（Ｅ）に示すリードフレーム
である。このリードフレーム１３はアイランド１４、複
数個の端子１５および外枠１６を備えている。特に、ア
イランド１４のアイランド端ハーフエッチング部１４ａ
および端子１５の端子端ハーフエッチング部１５ａの断
面形状は、モールド樹脂１７にて挾持できるように傾斜
させて形成したものである。具体的には、アイランド端
ハーフエッチング部１４ａおよび端子端ハーフエッチン
グ部１５ａで形成された空間に充填されたモールド樹脂
１７ａと半導体素子５側に充填されたモールド樹脂１７
ｂとによってアイランド１４および複数個の端子１５の
端部を挾持できるように形成される。1 is a sectional view showing an IC card module having an embodiment of the lead frame shape for an IC card module according to the present invention. In the figure, 13 is a lead frame whose manufacturing process is shown in FIGS. 2 (A) to 2 (E). The lead frame 13 includes an island 14, a plurality of terminals 15 and an outer frame 16. In particular, the island edge half-etched portion 14a of the island 14
The cross-sectional shape of the terminal end half-etched portion 15a of the terminal 15 is formed so as to be inclined by the molding resin 17. Specifically, the mold resin 17a filled in the space formed by the island end half-etched portion 14a and the terminal end half-etched portion 15a and the mold resin 17 filled in the semiconductor element 5 side.
It is formed so that the end portions of the island 14 and the plurality of terminals 15 can be held by b.

【０００９】次に、上記構成のリードフレームの製造工
程を図２（Ａ）〜図２（Ｅ）を参照して説明したのち、
ＩＣカードモジュールの製造方法について説明する。ま
ず、図２（Ａ）に示すように、リードフレーム１３の母
材１３ａの両表面に、リード形状として残した部分にレ
ジスト１８を付ける。そして、図２（Ｂ）に示すよう
に、母材１３ａの一方の表面をエッチングする。そし
て、図２（Ｃ）に示すように、母材１３ａのエッチング
した部分に、レジスト１９を付ける。そして、図２
（Ｄ）に示すように、母材１３ａの他の表面をエッチン
グする。そして、図２（Ｅ）に示すように、レジスト１
８および１９を除去することにより、リードフレーム１
３を製造することができる。このようにして、アイラン
ド端ハーフエッチング部１４ａおよび端子端ハーフエッ
チング部１５ａの断面形状は、モールド樹脂１７にて挾
持できるように傾斜させて形成することができる。そし
て、このリードフレーム１３のアイランド１４の下部
に、半導体素子５をボンディングシート６を介してボン
ディングする。そして、この半導体素子５と端子１５間
をボンディングワイヤ７によりボンディングを行なう。
そして、モールド樹脂封止金型にて、モールド樹脂境界
線内をモールド樹脂１７で充填する。そして、モールド
樹脂封止金型のエジェクトピンにより、金型より突き上
げて、取り出したのち、個片化し、図示せぬＩＣカード
上に実装するものである。Next, a manufacturing process of the lead frame having the above structure will be described with reference to FIGS. 2A to 2E, and then,
A method of manufacturing the IC card module will be described. First, as shown in FIG. 2A, a resist 18 is attached to both surfaces of the base material 13a of the lead frame 13 in the portions left as lead shapes. Then, as shown in FIG. 2B, one surface of the base material 13a is etched. Then, as shown in FIG. 2C, a resist 19 is attached to the etched portion of the base material 13a. And FIG.
As shown in (D), the other surface of the base material 13a is etched. Then, as shown in FIG.
By removing 8 and 19, the lead frame 1
3 can be manufactured. In this manner, the cross-sectional shapes of the island end half-etched portion 14a and the terminal end half-etched portion 15a can be formed to be inclined so that they can be held by the mold resin 17. Then, the semiconductor element 5 is bonded to the lower portion of the island 14 of the lead frame 13 via the bonding sheet 6. Then, the semiconductor element 5 and the terminal 15 are bonded by the bonding wire 7.
Then, the inside of the mold resin boundary line is filled with the mold resin 17 in the mold resin sealing die. Then, it is pushed up from the mold by the eject pin of the mold resin-sealed mold, taken out, separated into individual pieces, and mounted on an IC card (not shown).

【００１０】[0010]

【発明の効果】以上詳細に説明したように、本発明に係
るＩＣカードモジュール用リードフレーム形状によれ
ば、アイランド端ハーフエッチング部および端子端ハー
フエッチング部の断面形状を、モールド樹脂にて挾持で
きるように形成したので、端子部の剥離耐力が向上し、
ワイヤー断線やＡｌ腐食の発生を防ぐことができ、品質
を向上することができるなどの効果がある。As described above in detail, according to the lead frame shape for the IC card module according to the present invention, the cross-sectional shape of the island end half-etched portion and the terminal end half-etched portion can be held by the mold resin. Since it is formed like this, the peeling resistance of the terminal part is improved,
It is possible to prevent wire breakage and Al corrosion and improve the quality.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明に係るＩＣカードモジュール用リードフ
レーム形状の一実施例を備えたＩＣカードモジュールを
示す断面図である。FIG. 1 is a sectional view showing an IC card module having an embodiment of a lead frame shape for an IC card module according to the present invention.

【図２】図１のＩＣカードモジュール用リードフレーム
形状の製造工程を示す断面図である。FIG. 2 is a cross-sectional view showing a manufacturing process of the lead frame shape for the IC card module of FIG.

【図３】従来のＩＣカードモジュールを示す平面図およ
び断面図である。FIG. 3 is a plan view and a sectional view showing a conventional IC card module.

【図４】図３のリードフレームを示す平面図である。FIG. 4 is a plan view showing the lead frame of FIG.

【図５】図３のリードフレームの製造工程を示す断面図
である。FIG. 5 is a cross-sectional view showing a manufacturing process of the lead frame of FIG.

【符号の説明】[Explanation of symbols]

５ 半導体素子 １３ リードフレーム １４ アイランド １５ 端子 １６ 外枠 １７ モールド樹脂 １８，１９ レジスト 5 Semiconductor Element 13 Lead Frame 14 Island 15 Terminal 16 Outer Frame 17 Mold Resin 18, 19 Resist

フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 23/50 Ｈ 9272−4Ｍ Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI Technical display location H01L 23/50 H 9272-4M

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 ＩＣカードに搭載され、読み出し／書き
込み等の機能を持つモジュールのリードフレーム形状に
おいて、 リードフレームのアイランド部および、または端子部の
ハーフエッチング部の断面形状を、モールド樹脂にて挾
持できる傾斜形状にしたことを特徴とするＩＣカードモ
ジュール用リードフレーム形状。1. In a lead frame shape of a module mounted on an IC card and having functions such as reading / writing, a cross section shape of an island portion of the lead frame and / or a half-etched portion of a terminal portion is held by a mold resin. A lead frame shape for an IC card module, which is characterized by having a slantable shape.
JP4246547A 1992-09-16 1992-09-16 Lead frame form for ic card module Pending JPH0692076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4246547A JPH0692076A (en) 1992-09-16 1992-09-16 Lead frame form for ic card module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4246547A JPH0692076A (en) 1992-09-16 1992-09-16 Lead frame form for ic card module

Publications (1)

Publication Number Publication Date
JPH0692076A true JPH0692076A (en) 1994-04-05

Family

ID=17150040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4246547A Pending JPH0692076A (en) 1992-09-16 1992-09-16 Lead frame form for ic card module

Country Status (1)

Country Link
JP (1) JPH0692076A (en)

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0997868A (en) * 1995-09-28 1997-04-08 Dainippon Printing Co Ltd Lead frame member and its manufacturing method
WO1999067821A1 (en) * 1998-06-24 1999-12-29 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6448633B1 (en) 1998-11-20 2002-09-10 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6455356B1 (en) 1998-10-21 2002-09-24 Amkor Technology Methods for moding a leadframe in plastic integrated circuit devices
US6605865B2 (en) 2001-03-19 2003-08-12 Amkor Technology, Inc. Semiconductor package with optimized leadframe bonding strength
US6608366B1 (en) 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
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US6798046B1 (en) 2002-01-22 2004-09-28 Amkor Technology, Inc. Semiconductor package including ring structure connected to leads with vertically downset inner ends
US6803645B2 (en) 2000-12-29 2004-10-12 Amkor Technology, Inc. Semiconductor package including flip chip
US6833609B1 (en) 1999-11-05 2004-12-21 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6841414B1 (en) 2002-06-19 2005-01-11 Amkor Technology, Inc. Saw and etch singulation method for a chip package
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
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US6867483B2 (en) 2000-09-13 2005-03-15 Carsen Semiconductor Sdn. Bhd. Stress-free lead frame
US6867071B1 (en) 2002-07-12 2005-03-15 Amkor Technology, Inc. Leadframe including corner leads and semiconductor package using same
US6885086B1 (en) 2002-03-05 2005-04-26 Amkor Technology, Inc. Reduced copper lead frame for saw-singulated chip package
US6927478B2 (en) 2001-01-15 2005-08-09 Amkor Technology, Inc. Reduced size semiconductor package with stacked dies
US6977431B1 (en) 2003-11-05 2005-12-20 Amkor Technology, Inc. Stackable semiconductor package and manufacturing method thereof
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US7288833B2 (en) 2000-09-13 2007-10-30 Carsem (M) Sdn. Bhd. Stress-free lead frame
US7741161B2 (en) 2003-12-31 2010-06-22 Carsem (M) Sdn. Bhd. Method of making integrated circuit package with transparent encapsulant
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
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JPH0997868A (en) * 1995-09-28 1997-04-08 Dainippon Printing Co Ltd Lead frame member and its manufacturing method
WO1999067821A1 (en) * 1998-06-24 1999-12-29 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
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US6684496B2 (en) 1998-06-24 2004-02-03 Amkor Technology, Inc. Method of making an integrated circuit package
US6630728B2 (en) 1998-06-24 2003-10-07 Amkor Technology, Inc. Plastic integrated circuit package and leadframe for making the package
US6521987B1 (en) 1998-10-21 2003-02-18 Amkor Technology, Inc. Plastic integrated circuit device package and method for making the package
US6455356B1 (en) 1998-10-21 2002-09-24 Amkor Technology Methods for moding a leadframe in plastic integrated circuit devices
US6448633B1 (en) 1998-11-20 2002-09-10 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6825062B2 (en) 1998-11-20 2004-11-30 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6833609B1 (en) 1999-11-05 2004-12-21 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package
US6858919B2 (en) 2000-03-25 2005-02-22 Amkor Technology, Inc. Semiconductor package
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US7786554B2 (en) 2000-09-13 2010-08-31 Carsem (M) Sdn. Bhd. Stress-free lead frame
US6867483B2 (en) 2000-09-13 2005-03-15 Carsen Semiconductor Sdn. Bhd. Stress-free lead frame
US7288833B2 (en) 2000-09-13 2007-10-30 Carsem (M) Sdn. Bhd. Stress-free lead frame
US6803645B2 (en) 2000-12-29 2004-10-12 Amkor Technology, Inc. Semiconductor package including flip chip
US6927478B2 (en) 2001-01-15 2005-08-09 Amkor Technology, Inc. Reduced size semiconductor package with stacked dies
US6865446B2 (en) 2001-02-21 2005-03-08 Sony Corporation Robot device and method of controlling robot device operation
US6605865B2 (en) 2001-03-19 2003-08-12 Amkor Technology, Inc. Semiconductor package with optimized leadframe bonding strength
US6713322B2 (en) 2001-03-27 2004-03-30 Amkor Technology, Inc. Lead frame for semiconductor package
US6700187B2 (en) 2001-03-27 2004-03-02 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
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US6611047B2 (en) 2001-10-12 2003-08-26 Amkor Technology, Inc. Semiconductor package with singulation crease
US6798046B1 (en) 2002-01-22 2004-09-28 Amkor Technology, Inc. Semiconductor package including ring structure connected to leads with vertically downset inner ends
US6885086B1 (en) 2002-03-05 2005-04-26 Amkor Technology, Inc. Reduced copper lead frame for saw-singulated chip package
US6608366B1 (en) 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
US6627977B1 (en) 2002-05-09 2003-09-30 Amkor Technology, Inc. Semiconductor package including isolated ring structure
US6841414B1 (en) 2002-06-19 2005-01-11 Amkor Technology, Inc. Saw and etch singulation method for a chip package
US6867071B1 (en) 2002-07-12 2005-03-15 Amkor Technology, Inc. Leadframe including corner leads and semiconductor package using same
US9406645B1 (en) 2002-11-08 2016-08-02 Amkor Technology, Inc. Wafer level package and fabrication method
US9871015B1 (en) 2002-11-08 2018-01-16 Amkor Technology, Inc. Wafer level package and fabrication method
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US10665567B1 (en) 2002-11-08 2020-05-26 Amkor Technology, Inc. Wafer level package and fabrication method
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US6977431B1 (en) 2003-11-05 2005-12-20 Amkor Technology, Inc. Stackable semiconductor package and manufacturing method thereof
US7741161B2 (en) 2003-12-31 2010-06-22 Carsem (M) Sdn. Bhd. Method of making integrated circuit package with transparent encapsulant
US11869829B2 (en) 2009-01-05 2024-01-09 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device with through-mold via
US10546833B2 (en) 2009-12-07 2020-01-28 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9978695B1 (en) 2011-01-27 2018-05-22 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US9947623B1 (en) 2011-11-29 2018-04-17 Amkor Technology, Inc. Semiconductor device comprising a conductive pad on a protruding-through electrode
US11043458B2 (en) 2011-11-29 2021-06-22 Amkor Technology Singapore Holding Pte. Ltd. Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode
US10410967B1 (en) 2011-11-29 2019-09-10 Amkor Technology, Inc. Electronic device comprising a conductive pad on a protruding-through electrode
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10090228B1 (en) 2012-03-06 2018-10-02 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10014240B1 (en) 2012-03-29 2018-07-03 Amkor Technology, Inc. Embedded component package and fabrication method
JP2014175321A (en) * 2013-03-05 2014-09-22 Nichia Chem Ind Ltd Lead frame and light-emitting device
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method

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