JPH0692076A - Lead frame form for ic card module - Google Patents

Lead frame form for ic card module

Info

Publication number
JPH0692076A
JPH0692076A JP4246547A JP24654792A JPH0692076A JP H0692076 A JPH0692076 A JP H0692076A JP 4246547 A JP4246547 A JP 4246547A JP 24654792 A JP24654792 A JP 24654792A JP H0692076 A JPH0692076 A JP H0692076A
Authority
JP
Japan
Prior art keywords
lead frame
ic card
mold
island
card module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4246547A
Other languages
Japanese (ja)
Inventor
Akinobu Inoue
Harufumi Kobayashi
Tadashi Yamaguchi
明信 井上
治文 小林
忠士 山口
Original Assignee
Oki Electric Ind Co Ltd
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Ind Co Ltd, 沖電気工業株式会社 filed Critical Oki Electric Ind Co Ltd
Priority to JP4246547A priority Critical patent/JPH0692076A/en
Publication of JPH0692076A publication Critical patent/JPH0692076A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE:To improve the adhesion between a lead frame and mold resin for a read/write module used in an IC card so that terminals may not be separated from the mold when the module is bent. CONSTITUTION:In an island 14 and terminals 15 of a lead frame 13, sectional forms of half etching parts 14a of the island end and half etching parts 15a of the terminal ends are made to be oblique which can be pinched by mold resins 17a and 17b.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、ICカードに搭載される読み出し/書き込み等の機能を持つモジュールのリードフレーム形状に関するものである。 The present invention relates to relates to a lead frame shape modules with functions such as read / write, which is mounted on the IC card.

【0002】 [0002]

【従来の技術】図3は、従来のリードフレーム形状を備えたICカードモジュールを示す平面図およびそのA1 BACKGROUND ART FIG. 3 is a plan view and a A1 showing the IC card module having a conventional lead frame shape
−A2断面図である。 -A2 is a cross-sectional view. 図において、1はその詳細な構成を図4に示すように、例えば板厚0.6mmのリードフレームである。 In the figure, 1 is a detailed configuration as shown in FIG. 4, for example, a lead frame having a thickness of 0.6 mm. このリードフレーム1はアイランド2、 The lead frame 1 Island 2,
端子3および外枠4からなっている。 Consists terminal 3 and the outer frame 4. 5はリードフレーム1のアイランド2の下部に、ボンディングシート6を介してボンディングした半導体素子、7は端子3と半導体素子5間をワイヤボンディングしたボンディングワイヤ、8はモールド樹脂封止金型にてモールド樹脂境界線9内を充填したモールド樹脂、10はこのモールド樹脂封止金型のエジェクトピンである。 5 the bottom of the island 2 of the lead frame 1, a semiconductor device was bonded via the bonding sheet 6, 7 bonding wire wire-bonded between terminals 3 and the semiconductor element 5, 8 molded in the mold resin sealing die molding resin filled with a resin boundary 9, 10 is the eject pin of the mold resin sealing die.

【0003】次に、上記構成のリードフレームの製造工程を図5(a)〜図5(c)を参照して説明したのち、 [0003] Next, after explained the manufacturing process of the lead frame having the above structure with reference to FIG. 5 (a) ~ FIG 5 (c),
ICカードモジュールの製造方法を図3(A)および図3(B)を参照して説明する。 The manufacturing method of the IC card module with reference to FIG. 3 (A) and FIG. 3 (B) will be described. まず、図5(A)に示すように、リードフレーム1の母材1aの表面に、リード形状として残した部分にレジスト11を塗布する。 First, as shown in FIG. 5 (A), the surface of the base 1a of the lead frame 1, a resist is applied 11 to the portion left as lead shape. そして、図5(B)に示すように、矢印12の方向からエッチングする。 Then, as shown in FIG. 5 (B), etching from the direction of arrow 12. そして、図5(C)に示すように、このレジスト11を除去することにより、図4に示すリードフレーム1を製造することができる。 Then, as shown in FIG. 5 (C), by removing the resist 11, it is possible to manufacture the lead frame 1 shown in FIG. そして、このリードフレーム1のアイランド2の下部に、半導体素子5をボンディングシート6を介してボンディングする。 Then, the bottom of the island 2 of the lead frame 1 is bonded via the bonding sheet 6 of the semiconductor element 5. そして、この半導体素子5と端子3間をボンディングワイヤ7によりボンディングを行なう。 Then, the bonding between the semiconductor element 5 and the terminals 3 by bonding wires 7. そして、モールド樹脂封止金型にて、モールド樹脂境界線9内をモールド樹脂8で充填する。 Then, in the mold resin sealing mold, filling the mold resin border 9 with the molding resin 8. そして、モールド樹脂封止金型のエジェクトピン10により金型より突き上げて、取り出したのち、個片化し、図示せぬICカード上に実装するものである。 Then, push-up from the mold by a mold resin sealing mold ejection pin 10, after taken out, and singulation is for mounting on an IC card (not shown).

【0004】 [0004]

【発明が解決しようとする課題】しかしながら、上記構成のリードフレーム形状では、アイランド2のハーフエッチング部のアイランド端形状2a(図5(C)参照) [SUMMARY OF THE INVENTION However, in the lead frame shape of the structure, the island end shape 2a of the half-etched portion of the island 2 (see FIG. 5 (C))
および端子3のハーフエッチング部の端子端形状3a And the terminal end shape 3a of the half-etched portion of the terminal 3
(図5(C)参照)がR形状になっているため、リードフレーム1とモールド樹脂8とは密着力のみで保持されている。 For (FIG. 5 (C) see) is in the R configuration, is held only by adhesion to the lead frame 1 and the molding resin 8. このため、(A)モールド成形時、モールド樹脂封止金型内のエジェクトピンにて突き上げる際、モールド樹脂と金型との離型時、モールド樹脂とモールド樹脂封止金型との密着力により、モジュールを反らせ、端子部が剥離してしまうこと、(B)モジュールをICカード上に実装したのち、折り曲げ試験により端子部が剥離し、この剥離により、ワイヤー断線、およびモジュール内へ水分が侵入し、Al腐食などが発生するという問題点があった。 Thus, when (A) molding, when pushed up by the ejection pin in the mold resin sealing mold, upon release of the mold resin and the mold, the adhesion between the mold resin and the mold resin sealing die , deflect module, the terminal portion peels, (B) After mounting the module on the IC card, the terminal portion is peeled off by bending test, this peeling, wire breakage, and moisture intrusion into the module and, there is a problem that such as Al corrosion occurs.

【0005】本発明は、以上述べた端子部の剥離によるワイヤーの断線およびAl腐食という問題点を除去するため、端子部の断面形状を変えることにより、端子とモールド樹脂との剥離をなくすことができる優れた形状を提供することを目的とする。 [0005] The present invention is to eliminate the problem that breakage and Al corrosion of the wire due to peeling of the terminal portion described above, by changing the cross-sectional shape of the terminal portion, to eliminate the peeling between the terminal and the molding resin and to provide a possible excellent shape.

【0006】 [0006]

【課題を解決するための手段】本発明に係るICカードモジュール用リードフレーム形状は、そのアイランド端ハーフエッチング部および端子端ハーフエッチング部の断面形状を、モールド樹脂にて挾持できる傾斜形状にするものである。 Read an IC card module according to the present invention SUMMARY OF THE INVENTION The frame shape, the sectional shape of the island end half-etched portion and the terminal end half etching portion, which the inclined shape capable clamped by the molding resin it is.

【0007】 [0007]

【作用】本発明は、端子部の剥離耐力を大幅に向上することができる。 DETAILED DESCRIPTION OF THE INVENTION The present invention can greatly improve the peel strength of the terminal portion.

【0008】 [0008]

【実施例】図1は本発明に係るICカードモジュール用リードフレーム形状の一実施例を備えたICカードモジュールを示す断面図である。 DETAILED DESCRIPTION FIG. 1 is a sectional view showing the IC card module with an embodiment of the lead frame shape for an IC card module according to the present invention. 図において、13はその製造工程を図2(A)〜図2(E)に示すリードフレームである。 In the figure, 13 is a lead frame showing the manufacturing process in FIG. 2 (A) ~ FIG 2 (E). このリードフレーム13はアイランド14、複数個の端子15および外枠16を備えている。 The lead frame 13 includes an island 14, a plurality of terminals 15 and outer frame 16. 特に、アイランド14のアイランド端ハーフエッチング部14a In particular, the island end half etching portion 14a of the island 14
および端子15の端子端ハーフエッチング部15aの断面形状は、モールド樹脂17にて挾持できるように傾斜させて形成したものである。 And cross-sectional shape of the terminal end half-etched portion 15a of the terminal 15 is formed by inclined so as to be sandwiched by the molding resin 17. 具体的には、アイランド端ハーフエッチング部14aおよび端子端ハーフエッチング部15aで形成された空間に充填されたモールド樹脂17aと半導体素子5側に充填されたモールド樹脂17 Specifically, it filled in the island end half etching portion 14a and the mold resin 17a which is filled in the space formed by the terminal end half etching portion 15a and the semiconductor element 5 side mold resin 17
bとによってアイランド14および複数個の端子15の端部を挾持できるように形成される。 It is formed so as to be sandwiched the end of the island 14 and a plurality of terminals 15 by and b.

【0009】次に、上記構成のリードフレームの製造工程を図2(A)〜図2(E)を参照して説明したのち、 [0009] Next, after explained the manufacturing process of the lead frame having the above structure with reference to FIG. 2 (A) ~ FIG 2 (E),
ICカードモジュールの製造方法について説明する。 A description will be given of a manufacturing method of the IC card module. まず、図2(A)に示すように、リードフレーム13の母材13aの両表面に、リード形状として残した部分にレジスト18を付ける。 First, as shown in FIG. 2 (A), on both surfaces of the base material 13a of the lead frame 13, attaching a resist 18 to the portion left as lead shape. そして、図2(B)に示すように、母材13aの一方の表面をエッチングする。 Then, as shown in FIG. 2 (B), etching the one surface of the base 13a. そして、図2(C)に示すように、母材13aのエッチングした部分に、レジスト19を付ける。 Then, as shown in FIG. 2 (C), the etched portion of the base pieces 13a, put the resist 19. そして、図2 Then, as shown in FIG. 2
(D)に示すように、母材13aの他の表面をエッチングする。 (D), the etching the other surface of the base 13a. そして、図2(E)に示すように、レジスト1 Then, as shown in FIG. 2 (E), the resist 1
8および19を除去することにより、リードフレーム1 By removing the 8 and 19, the lead frame 1
3を製造することができる。 3 can be manufactured. このようにして、アイランド端ハーフエッチング部14aおよび端子端ハーフエッチング部15aの断面形状は、モールド樹脂17にて挾持できるように傾斜させて形成することができる。 In this way, the cross-sectional shape of the island end half etching portion 14a and the terminal end half etching portion 15a may be formed to be inclined so as to be sandwiched by the molding resin 17. そして、このリードフレーム13のアイランド14の下部に、半導体素子5をボンディングシート6を介してボンディングする。 Then, the bottom of the island 14 of the lead frame 13 is bonded via the bonding sheet 6 of the semiconductor element 5. そして、この半導体素子5と端子15間をボンディングワイヤ7によりボンディングを行なう。 Then, the bonding between the semiconductor element 5 and the terminals 15 by bonding wires 7.
そして、モールド樹脂封止金型にて、モールド樹脂境界線内をモールド樹脂17で充填する。 Then, in the mold resin sealing mold, filling the mold resin border with molding resin 17. そして、モールド樹脂封止金型のエジェクトピンにより、金型より突き上げて、取り出したのち、個片化し、図示せぬICカード上に実装するものである。 Then, a mold resin sealing mold of the ejection pin, push up from the mold, then taken out, into pieces, is intended to be mounted on an IC card (not shown).

【0010】 [0010]

【発明の効果】以上詳細に説明したように、本発明に係るICカードモジュール用リードフレーム形状によれば、アイランド端ハーフエッチング部および端子端ハーフエッチング部の断面形状を、モールド樹脂にて挾持できるように形成したので、端子部の剥離耐力が向上し、 As described above in detail, according to the present invention, according to the lead frame shape for an IC card module according to the present invention, the cross-sectional shape of the island end half-etched portion and the terminal end half etching portion can clamped in a mold resin since the formed so as to improve the peel strength of the terminal portion,
ワイヤー断線やAl腐食の発生を防ぐことができ、品質を向上することができるなどの効果がある。 It is possible to prevent occurrence of wire breakage or Al corrosion, such an effect can be improved quality.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明に係るICカードモジュール用リードフレーム形状の一実施例を備えたICカードモジュールを示す断面図である。 1 is a cross-sectional view showing the IC card module with an embodiment of the lead frame shape for an IC card module according to the present invention.

【図2】図1のICカードモジュール用リードフレーム形状の製造工程を示す断面図である。 It is a cross-sectional view showing the manufacturing process of Figure 2 the lead frame shape for an IC card module in FIG.

【図3】従来のICカードモジュールを示す平面図および断面図である。 3 is a plan view and a sectional view showing a conventional IC card module.

【図4】図3のリードフレームを示す平面図である。 4 is a plan view showing a lead frame of FIG.

【図5】図3のリードフレームの製造工程を示す断面図である。 It is a cross-sectional view showing a manufacturing process of the lead frame of FIG. 5 FIG.

【符号の説明】 DESCRIPTION OF SYMBOLS

5 半導体素子 13 リードフレーム 14 アイランド 15 端子 16 外枠 17 モールド樹脂 18,19 レジスト 5 semiconductor element 13 lead frame 14 island 15 terminal 16 outer frame 17 mold resin 18 and 19 resist

フロントページの続き (51)Int.Cl. 5識別記号 庁内整理番号 FI 技術表示箇所 H01L 23/50 H 9272−4M Front page continued (51) Int.Cl. 5 in identification symbol Agency Docket No. FI art display portion H01L 23/50 H 9272-4M

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 ICカードに搭載され、読み出し/書き込み等の機能を持つモジュールのリードフレーム形状において、 リードフレームのアイランド部および、または端子部のハーフエッチング部の断面形状を、モールド樹脂にて挾持できる傾斜形状にしたことを特徴とするICカードモジュール用リードフレーム形状。 Mounted in claim 1] IC card, pinching the lead frame shape modules with functions such as read / write, the island portion of a lead frame and, or the half-etched portion of the cross-sectional shape of the terminal portion, at the mold resin lead frame shape for an IC card module being characterized in that the inclined shape possible.
JP4246547A 1992-09-16 1992-09-16 Lead frame form for ic card module Pending JPH0692076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4246547A JPH0692076A (en) 1992-09-16 1992-09-16 Lead frame form for ic card module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4246547A JPH0692076A (en) 1992-09-16 1992-09-16 Lead frame form for ic card module

Publications (1)

Publication Number Publication Date
JPH0692076A true JPH0692076A (en) 1994-04-05

Family

ID=17150040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4246547A Pending JPH0692076A (en) 1992-09-16 1992-09-16 Lead frame form for ic card module

Country Status (1)

Country Link
JP (1) JPH0692076A (en)

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US6858919B2 (en) 2000-03-25 2005-02-22 Amkor Technology, Inc. Semiconductor package
US6865446B2 (en) 2001-02-21 2005-03-08 Sony Corporation Robot device and method of controlling robot device operation
US6867071B1 (en) 2002-07-12 2005-03-15 Amkor Technology, Inc. Leadframe including corner leads and semiconductor package using same
US6867483B2 (en) 2000-09-13 2005-03-15 Carsen Semiconductor Sdn. Bhd. Stress-free lead frame
US6885086B1 (en) 2002-03-05 2005-04-26 Amkor Technology, Inc. Reduced copper lead frame for saw-singulated chip package
US6927478B2 (en) 2001-01-15 2005-08-09 Amkor Technology, Inc. Reduced size semiconductor package with stacked dies
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US7288833B2 (en) 2000-09-13 2007-10-30 Carsem (M) Sdn. Bhd. Stress-free lead frame
US7741161B2 (en) 2003-12-31 2010-06-22 Carsem (M) Sdn. Bhd. Method of making integrated circuit package with transparent encapsulant
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US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
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US6867483B2 (en) 2000-09-13 2005-03-15 Carsen Semiconductor Sdn. Bhd. Stress-free lead frame
US7786554B2 (en) 2000-09-13 2010-08-31 Carsem (M) Sdn. Bhd. Stress-free lead frame
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US6605865B2 (en) 2001-03-19 2003-08-12 Amkor Technology, Inc. Semiconductor package with optimized leadframe bonding strength
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US6756658B1 (en) 2001-04-06 2004-06-29 Amkor Technology, Inc. Making two lead surface mounting high power microleadframe semiconductor packages
US6611047B2 (en) 2001-10-12 2003-08-26 Amkor Technology, Inc. Semiconductor package with singulation crease
US6798046B1 (en) 2002-01-22 2004-09-28 Amkor Technology, Inc. Semiconductor package including ring structure connected to leads with vertically downset inner ends
US6885086B1 (en) 2002-03-05 2005-04-26 Amkor Technology, Inc. Reduced copper lead frame for saw-singulated chip package
US6608366B1 (en) 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
US6627977B1 (en) 2002-05-09 2003-09-30 Amkor Technology, Inc. Semiconductor package including isolated ring structure
US6841414B1 (en) 2002-06-19 2005-01-11 Amkor Technology, Inc. Saw and etch singulation method for a chip package
US6867071B1 (en) 2002-07-12 2005-03-15 Amkor Technology, Inc. Leadframe including corner leads and semiconductor package using same
US9871015B1 (en) 2002-11-08 2018-01-16 Amkor Technology, Inc. Wafer level package and fabrication method
US8952522B1 (en) 2002-11-08 2015-02-10 Amkor Technology, Inc. Wafer level package and fabrication method
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US9406645B1 (en) 2002-11-08 2016-08-02 Amkor Technology, Inc. Wafer level package and fabrication method
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US6977431B1 (en) 2003-11-05 2005-12-20 Amkor Technology, Inc. Stackable semiconductor package and manufacturing method thereof
US7741161B2 (en) 2003-12-31 2010-06-22 Carsem (M) Sdn. Bhd. Method of making integrated circuit package with transparent encapsulant
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9978695B1 (en) 2011-01-27 2018-05-22 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US9947623B1 (en) 2011-11-29 2018-04-17 Amkor Technology, Inc. Semiconductor device comprising a conductive pad on a protruding-through electrode
US10410967B1 (en) 2011-11-29 2019-09-10 Amkor Technology, Inc. Electronic device comprising a conductive pad on a protruding-through electrode
US10090228B1 (en) 2012-03-06 2018-10-02 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10014240B1 (en) 2012-03-29 2018-07-03 Amkor Technology, Inc. Embedded component package and fabrication method
JP2014175321A (en) * 2013-03-05 2014-09-22 Nichia Chem Ind Ltd Lead frame and light-emitting device
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method

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