JP3226015B2 - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JP3226015B2 JP3226015B2 JP16949396A JP16949396A JP3226015B2 JP 3226015 B2 JP3226015 B2 JP 3226015B2 JP 16949396 A JP16949396 A JP 16949396A JP 16949396 A JP16949396 A JP 16949396A JP 3226015 B2 JP3226015 B2 JP 3226015B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- mold resin
- inner leads
- injected
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、リードフレームに
関する。[0001] The present invention relates to a lead frame.
【０００２】[0002]
【従来の技術】半導体装置の組立のために従来から使用
されているリードフレームは、図７に示すように、半導
体チップ搭載部（以下、ダイパッド）１を取り囲むよう
に放射状に配置された複数のインナーリード２を具備し
て構成されるが、インナーリード２先端からダイパッド
1周縁までの距離はほぼ一定であり、インナーリード２
の先端はほぼ直線上に配列される。2. Description of the Related Art As shown in FIG. 7, a lead frame conventionally used for assembling a semiconductor device includes a plurality of radially arranged lead chips surrounding a semiconductor chip mounting portion (hereinafter, die pad) 1. The inner lead 2 is provided.
The distance to one edge is almost constant, and the inner lead 2
Are arranged on a substantially straight line.
【０００３】そして、半導体装置の実装に際しては、こ
のように構成されたリードフレームのパッド部１に、Ａ
ｇペースト等を用いて半導体チップ３を固着し（ダイボ
ンディング工程）、半導体チップ３上面の外周部に設け
られたボンディングパッドとインナーリード１先端をＡ
ｕワイヤやＡｌワイヤでそれぞれ電気的に接続したのち
（ワイヤボンディング工程）、図８に示すように半導体
チップ３やボンディングワイヤ４をモールド樹脂５で樹
脂封止する工程（モールド工程）を経て完成される。と
ころで、半導体チップの高集積化および高密度化に伴
い、これに用いられるリードフレームの多ピン化は進む
一方であり、インナーリード１は更に長く、インナーリ
ード相互間のピッチは更に狭くなってきている。When mounting a semiconductor device, the pad portion 1 of the lead frame thus configured is
g The semiconductor chip 3 is fixed using a paste or the like (die bonding step), and the bonding pad provided on the outer peripheral portion of the upper surface of the semiconductor chip 3 and the tip of the inner lead 1 are fixed to A.
After being electrically connected by a u wire or an Al wire (wire bonding step), the semiconductor chip 3 and the bonding wire 4 are completed with a resin sealing step with a molding resin 5 (molding step) as shown in FIG. You. By the way, as the number of pins of a lead frame used in the semiconductor chip increases with the increase in integration and density of the semiconductor chip, the inner leads 1 are longer and the pitch between the inner leads is becoming narrower. I have.
【０００４】このようなリードフレームに、半導体チッ
プを搭載し、モールド工程により樹脂パッケージで被覆
する場合、モールド工程において注入されるモールド樹
脂の圧力により、ボンディングワイヤが押され、隣接す
るインナーリードに接続されたボンディングワイヤと接
触し、短絡不良を発生しやすいという問題があった。こ
の問題を解決するために、外周を絶縁被覆したボンディ
ングワイヤが考案されており、隣接するワイヤと物理的
に接触しても、短絡不良などを引き起こす事がないよう
に工夫がなされている。When a semiconductor chip is mounted on such a lead frame and covered with a resin package by a molding process, a bonding wire is pressed by the pressure of the molding resin injected in the molding process, and connected to an adjacent inner lead. There is a problem that short-circuit failure is liable to occur due to contact with the bonded bonding wire. In order to solve this problem, a bonding wire whose outer periphery is insulated and insulated has been devised, and a device has been devised so as not to cause a short circuit failure or the like even if it physically contacts an adjacent wire.
【０００５】しかしながら、インナーリードが長くかつ
細くなったことにより、モールド樹脂の注入圧力によっ
てインナーリードが押されて変位しやすく、隣接するイ
ンナーリードに接触するという問題が残されていた。[0005] However, since the inner leads are long and thin, there is a problem that the inner leads are easily pushed and displaced by the injection pressure of the mold resin and come into contact with the adjacent inner leads.
【０００６】[0006]
【発明が解決しようとする課題】このように、半導体装
置の高集積化および高密度化に伴い、インナーリードが
長くかつ細くなったことにより、モールド樹脂の注入圧
力によってインナーリードが押されて変位しやすく、隣
接するインナーリードに接触するという問題がある。As described above, as the inner leads become longer and thinner with the increase in the degree of integration and the density of the semiconductor device, the inner leads are pushed by the injection pressure of the mold resin and displaced. And there is a problem that the inner leads are easily contacted.
【０００７】本発明は、前記実情に鑑みてなされたもの
で、リードフレームの高密度化および微細化に際して
も、モールド樹脂の注入圧力によってインナーリードが
押されて、隣接するインナーリードに接触するというよ
うな問題をなくし、信頼性の高い半導体装置を得ること
のできるリードフレームを提供することを目的とする。The present invention has been made in view of the above-mentioned circumstances. Even when the lead frame is densified and miniaturized, the inner lead is pressed by the injection pressure of the mold resin and comes into contact with the adjacent inner lead. An object of the present invention is to provide a lead frame which can eliminate such a problem and obtain a highly reliable semiconductor device.
【課題を解決するための手段】第１の発明(請求項１に
係る発明)の特徴は、モールド樹脂の注入圧力に影響を
受けやすい位置に配置されるインナーリードを短く設定
し、モールド樹脂注入口から離れるに従って長くなるよ
うに設定したことにある。すなわち、複数のインナーリ
ードが配置される領域のモールド樹脂が注入される領域
に近接する側の半分の領域のうち、少なくともモールド
樹脂が注入される領域に近接する領域において、インナ
ーリードと半導体チップ搭載領域との間隔が、モールド
樹脂が注入される領域から離れるに従って狭くなるよう
に構成している。A feature of the first invention (the invention according to claim 1) is that an inner lead disposed at a position susceptible to the injection pressure of the molding resin is set short, and the molding resin injection molding is performed. That is, it is set to be longer as the distance from the entrance increases. That is, at least a region near the region where the mold resin is injected, of the half of the region where the mold resin is injected in the region where the plurality of inner leads are arranged, is provided with the inner lead and the semiconductor chip mounted. It is configured such that the distance from the region becomes narrower as the distance from the region into which the mold resin is injected.
【０００８】かかる構成により、インナーリードの機械
的強度を確保しつつ、高コストであるボンディングワイ
ヤの使用量の増加を極力抑制することができる。[0008] With this configuration, it is possible to minimize the increase in the amount of expensive bonding wires used while securing the mechanical strength of the inner leads.
【０００９】第２の発明(請求項２に係る発明)の特徴
は、複数のインナーリードが配置される領域のモールド
樹脂が注入される領域に近接する側の半分の領域におい
て、隣接するインナーリードの間隔がモールド樹脂の注
入口近傍において最も広く、モールド樹脂の注入口から
離れるに従って狭くなるように構成したことにある。A feature of the second invention (the invention according to claim 2) is that a plurality of inner leads are arranged in a region adjacent to the inner lead in a half region on the side close to the region where the mold resin is injected. Is the largest in the vicinity of the injection port of the mold resin, and becomes narrower as the distance from the injection port of the mold resin increases.
【００１０】かかる構成により、モールド樹脂の注入圧
力によって、インナーリードが押されても、隣接するイ
ンナーリードと接触することがない。一方、モールド樹
脂の注入圧力の影響が小さい領域に位置するインナーリ
ードに対しては、インナーリード相互間の間隔が狭くな
るように構成しているため、必要以上にパッケージサイ
ズを大きくすることもない。With this configuration, even if the inner lead is pushed by the injection pressure of the mold resin, the inner lead does not come into contact with the adjacent inner lead. On the other hand, for the inner leads located in the region where the influence of the injection pressure of the mold resin is small, the interval between the inner leads is configured to be narrow, so that the package size is not unnecessarily increased. .
【００１１】第３の発明(請求項３に係る発明)の特徴
は、複数のインナーリードが配置される領域のモールド
樹脂が注入される領域に近接する側の半分の領域のう
ち、少なくともモールド樹脂が注入される領域に近接す
る領域において、モールド樹脂の注入口近傍に配置され
るインナーリードを短くかつインナーリード相互間の間
隔が最も広くなるように設定し、モールド樹脂の注入口
から離れるに従って長くかつインナーリード相互間の間
隔が狭くなるように構成したことにある。A feature of the third invention (the invention according to claim 3) is that at least the mold resin is formed in a half of the region where the plurality of inner leads are arranged and which is closer to the region where the mold resin is injected. In the region close to the region where the mold resin is injected, the inner leads arranged near the injection port of the mold resin are set to be short and the distance between the inner leads is set to be the widest, and the distance is increased as the distance from the injection port of the mold resin increases. In addition, the configuration is such that the distance between the inner leads is reduced.
【００１２】かかる構成により、モールド樹脂の注入圧
力によって、インナーリードが押されても、隣接するイ
ンナーリードと接触することがない。一方、モールド樹
脂の注入圧力の影響が小さい領域に位置するインナーリ
ードに対しては、インナーリード相互間の間隔が狭く、
かつインナーリードの長さも長くなるように構成してい
るため、必要以上にパッケージサイズを大きくすること
もない。さらに、インナーリードの機械的強度を確保し
つつ、高コストであるボンディングワイヤの使用量の増
加を極力抑制することができる。With this configuration, even if the inner lead is pushed by the injection pressure of the mold resin, the inner lead does not come into contact with the adjacent inner lead. On the other hand, for the inner leads located in the region where the influence of the injection pressure of the mold resin is small, the interval between the inner leads is small,
In addition, since the length of the inner lead is configured to be long, the package size is not unnecessarily increased. Further, it is possible to minimize the increase in the amount of the expensive bonding wire used while securing the mechanical strength of the inner lead.
【００１３】[0013]
【発明の実施の形態】次に本発明の実施例について図面
を参照しつつ詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the drawings.
【００１４】なおこの実施例で用いられるリ―ドフレ―
ムは、４２アロイをプレス成型して形成されたもので、
図１および図２に示す如く、モールド樹脂の注入口から
離れるに従い、前記インナーリード２（２1、２2、２
3、２4・・・・）と半導体チップ搭載部（以下ダイパッ
ド）１との間隔が狭くなるとともに、インナーリード幅
（ｄ1、ｄ2、ｄ3、ｄ4・・・）および隣接する前記イン
ナーリード間隔 （ｌ1、ｌ2、ｌ3 ・・・）が狭くなる
ように構成したことを特徴とするものである。 ここで
は、ｄ1＞ｄ2＞ｄ3＞ｄ4、ｌ1＞ｌ2＞ｌ3 の関係を満た
すものとする。そして、他の部分については、通常のリ
ードフレームと同様に形成されている。すなわち半導体
チップ３を搭載する正方形のダイパッド１と、このダイ
パッド１を取り囲むように配設せしめられた複数のイン
ナ―リ―ド２と、インナ―リ―ド２を一体的に連結する
ようにダイパッドの各辺に平行となるように配設された
タイバ―（６：図示せず）と、各インナ―リ―ド２に連
結せしめられタイバ―の外側に伸張するアウタ―リ―ド
（７）と、アウターリードの外側端を支持するサイドバ
―（８）と、ダイパッド１を各コーナーから支持するサ
ポ―トバ―（９）とから構成されている。ここで、図２
は図１の要部拡大説明図である。The lead frame used in this embodiment
Is made by pressing 42 alloy.
As shown in FIGS. 1 and 2, the inner leads 2 (21, 22, 2, 2
, And the semiconductor chip mounting portion (hereinafter referred to as die pad) 1 become narrower, and the inner lead widths (d1, d2, d3, d4...) And the adjacent inner lead spacing (l1 , L2, l3...) Are narrowed. Here, it is assumed that the relations d1>d2>d3> d4 and l1>l2> l3 are satisfied. The other parts are formed in the same manner as a normal lead frame. That is, a square die pad 1 on which a semiconductor chip 3 is mounted, a plurality of inner leads 2 disposed so as to surround the die pad 1, and a die pad so as to integrally connect the inner leads 2 to each other. A tie bar (6: not shown) disposed parallel to each side of the tie bar, and an outer lead (7) connected to each inner lead 2 and extending outside the tie bar. And a side bar (8) for supporting the outer end of the outer lead, and a support bar (9) for supporting the die pad 1 from each corner. Here, FIG.
FIG. 2 is an enlarged explanatory view of a main part of FIG. 1.
【００１５】このようなリ―ドフレ―ムを用いて実装せ
しめられる半導体装置は図３に示す如くであり、リ―ド
フレ―ムのダイパッド１上に、半導体チップ３を搭載
し、この半導体チップのボンディングパッドとリ―ドフ
レ―ムのインナ―リ―ド２とを金線あるいはアルミ線の
ボンディングワイヤ４（４1、４2、４3、４4・・・）と
によって結線し、更にこれらをエポシキ樹脂などの樹脂
材料５で封止した後、タイバ―やサイドバ―を切断し、
アウタ―リ―ドを所望の形状に折り曲げて完成せしめら
れる。A semiconductor device mounted using such a lead frame is as shown in FIG. 3. A semiconductor chip 3 is mounted on a die pad 1 of the lead frame. The bonding pad and the inner lead 2 of the lead frame are connected to each other by a bonding wire 4 (41, 42, 43, 44,...) Of a gold wire or an aluminum wire. After sealing with resin material 5, tie bars and side bars are cut,
The outer lead is bent to the desired shape and completed.
【００１６】次に、この金型装置を用いた半導体装置の
樹脂封止方法について説明する。Next, a resin sealing method for a semiconductor device using this mold device will be described.
【００１７】まず、条材をプレス加工することにより図
１に示したようなリードフレームを形成する。打ち抜き
に際しては、順送り金型を用いて形成する。次に、この
ようにして形成したリードフレームに半導体チップを載
置し、ワイヤボンディングを行う。この後このリードフ
レームを図４に示すように封止用金型の上型と下型の間
に挟み、エポキシ樹脂を主成分とする封止用樹脂材料を
１６５℃程度に予熱しておき、モールドゲートＧから投
入する。First, a lead frame as shown in FIG. 1 is formed by pressing a strip material. At the time of punching, it is formed using a progressive die. Next, the semiconductor chip is mounted on the lead frame thus formed, and wire bonding is performed. Thereafter, the lead frame is sandwiched between an upper mold and a lower mold of a sealing mold as shown in FIG. 4, and a sealing resin material mainly composed of epoxy resin is preheated to about 165 ° C. It is charged from the mold gate G.
【００１８】この押し出された樹脂材料は、反作用によ
り、キャビティ領域に円滑に充填され、加圧硬化せしめ
られる。このときの加圧力は８０ｋｇ／ｃｍ2、溶融温
度は１７５℃、硬化時間は２０〜３０秒とする。The extruded resin material is smoothly filled into the cavity region by the reaction, and is cured under pressure. At this time, the pressure is 80 kg / cm 2, the melting temperature is 175 ° C., and the curing time is 20 to 30 seconds.
【００１９】そして硬化しパッケージが形成されると、
金型を開き、取り出す。After curing to form a package,
Open the mold and remove it.
【００２０】このようにして、極めて容易に緻密で信頼
性の高い樹脂封止を行うことができる。樹脂の無駄がな
く、またばりの発生もほとんど皆無である。In this way, it is possible to very easily perform dense and highly reliable resin sealing. There is no waste of resin and almost no burrs are generated.
【００２１】このようにして順次樹脂封止が行われ、ア
ウターリード間隔に相当する間隔で配設された櫛歯状の
パンチを具備したタイバーカット金型を用いて、タイバ
ーの切断を行いこれと同時に、パッケージラインとアウ
ターリードとの間にできる樹脂ばりの除去を行う。The resin sealing is sequentially performed in this manner, and the tie bar is cut using a tie bar cutting mold having a comb-shaped punch provided at intervals corresponding to the outer lead interval. At the same time, resin burrs formed between the package line and the outer leads are removed.
【００２２】なお、前記実施例では、モールド樹脂の注
入部の近傍で、前記インナーリード２（２1、２2、２
3、２4・・・・）と半導体チップ搭載部（以下ダイパッ
ド）１との間隔が次第に狭くなるとともに、インナーリ
ード幅（ｄ1、ｄ2、ｄ3、ｄ4・・・）および隣接する前
記インナーリード間隔 （ｌ1、ｌ2、ｌ3 ・・・）が次
第に狭くなるように構成したが、必ずしもすべてを満た
す必要はなく、、前記インナーリード２（２1、２2、２
3、２4・・・・）と半導体チップ搭載部（以下ダイパッ
ド）１との間隔が次第に狭くなる、インナーリード幅
（ｄ1、ｄ2、ｄ3、ｄ4・・・）が次第に狭くなる、ある
いは隣接する前記インナーリード間隔 （ｌ1、ｌ2、ｌ3
・・・）が次第に狭くなる、これらのいずれかを満た
すようにすれば良い。In the above embodiment, the inner leads 2 (21, 22, 2 and 2) are located near the injection portion of the mold resin.
..., and the distance between the semiconductor chip mounting portion (hereinafter referred to as die pad) 1 gradually decreases, and the inner lead widths (d1, d2, d3, d4 ...) and the adjacent inner lead spacing ( .. are gradually narrowed, but it is not always necessary to satisfy all of them, and the inner leads 2 (21, 22, 2, 2) are not necessarily filled.
..) And the semiconductor chip mounting portion (hereinafter referred to as die pad) 1 become gradually narrower, the inner lead widths (d1, d2, d3, d4...) Become gradually narrower, or the adjacent lead widths become smaller. Inner lead interval (l1, l2, l3
..) Gradually narrows, and any of these may be satisfied.
【００２３】前記実施例では結果としてインナーリード
の先端が、サポートバー９を対角線にもち、該注入方向
を長軸とするひし形をなすように配置したが、前記実施
例に限定されることなく、図５乃至図６に変形例を示す
ようにモールドゲートの近傍においてのみ、インナーリ
ードと前記半導体チップ搭載領域との間隔が、モールド
樹脂が注入される領域から離れるに従って狭くなるよう
にしてもよい。In the above embodiment, as a result, the distal end of the inner lead is arranged so as to have a support bar 9 in a diagonal line and to form a rhombus having the injection direction as a long axis. However, the present invention is not limited to the above embodiment. As shown in a modified example in FIGS. 5 and 6, the distance between the inner lead and the semiconductor chip mounting region may be reduced as the distance from the region where the mold resin is injected is reduced only in the vicinity of the mold gate.
【００２４】また、前記実施例では、パッド部を具備し
たリードフレームについて説明したが、本願発明はこれ
に限定されるものではなく、パッドを具備しないパッド
レスタイプのリードフレームや、ヒートシンクやヒート
スプレッダーを固着する多層タイプのリードフレームに
おいても適用可能である。Further, in the above-described embodiment, the lead frame provided with the pad portion has been described. However, the present invention is not limited to this, and the present invention is not limited to this. The present invention is also applicable to a multilayer type lead frame for fixing the lead frame.
【００２５】[0025]
【発明の効果】以上、説明してきたように、請求項１に
関わる発明によれば、モールドゲートの近傍では、イン
ナーリードが短くなるように構成されているため、モー
ルド樹脂の注入圧力の影響を受け難く、隣接するインナ
ーリードの短絡を招くこともなく、高集積化に際しても
極めて信頼性の高い樹脂封止半導体装置を提供すること
が可能となる。また、請求項２に関わる発明によれば、
モールドゲートの近傍では、インナーリード相互の間隔
が広くなるように構成されているため、モールド樹脂の
注入圧力の影響を受け難く、隣接するインナーリードの
短絡を招くこともなく、高集積化に際しても極めて信頼
性の高い樹脂封止半導体装置を提供することが可能とな
る。さらに、請求項３に関わる発明によれば、モールド
ゲートの近傍では、インナーリードが短くなるとともに
インナーリード相互の間隔が広くなるように構成されて
いるため、モールド樹脂の注入圧力の影響を受け難く、
隣接するインナーリードの短絡を招くこともなく、高集
積化に際しても極めて信頼性の高い樹脂封止半導体装置
を提供することが可能となる。As described above, according to the first aspect of the present invention, since the inner lead is configured to be short in the vicinity of the mold gate, the influence of the injection pressure of the mold resin is reduced. This makes it possible to provide a resin-encapsulated semiconductor device which is hard to receive and does not cause a short circuit between adjacent inner leads, and which is extremely reliable even in high integration. According to the second aspect of the present invention,
In the vicinity of the mold gate, the distance between the inner leads is configured to be wider, so that it is less susceptible to the injection pressure of the mold resin, does not cause a short circuit between adjacent inner leads, and can be used for high integration. An extremely reliable resin-sealed semiconductor device can be provided. Further, according to the third aspect of the present invention, since the inner leads are shortened and the distance between the inner leads is increased in the vicinity of the mold gate, the inner leads are less affected by the injection pressure of the molding resin. ,
It is possible to provide a resin-encapsulated semiconductor device that is extremely reliable even in high integration without causing a short circuit between adjacent inner leads.
【図１】本発明実施例のリードフレームを示す説明図FIG. 1 is an explanatory view showing a lead frame according to an embodiment of the present invention.
【図２】同リードフレームの要部拡大説明図FIG. 2 is an enlarged explanatory view of a main part of the lead frame.
【図３】同リードフレームを用いた半導体装置を示す図FIG. 3 is a diagram showing a semiconductor device using the lead frame.
【図４】同半導体装置の樹脂封止工程を示す図FIG. 4 is a view showing a resin sealing step of the semiconductor device.
【図５】本発明の他の実施例のリードフレームを示す図FIG. 5 is a view showing a lead frame according to another embodiment of the present invention.
【図６】本発明の他の実施例のリードフレームを示す図FIG. 6 is a view showing a lead frame according to another embodiment of the present invention.
【図７】従来例のリードフレームを示す図FIG. 7 is a view showing a conventional lead frame.
【図８】従来例の半導体装置を示す図FIG. 8 is a diagram showing a conventional semiconductor device.
１ ダイパッド ２ インナーリード ３ 半導体チップ ４ ボンディングワイヤ ５ モールド樹脂 ６ タイバー ７ アウタ―リ―ド ８ サイドバ― ９ サポ―トバ― Ｇ モールドゲート DESCRIPTION OF SYMBOLS 1 Die pad 2 Inner lead 3 Semiconductor chip 4 Bonding wire 5 Mold resin 6 Tie bar 7 Outer lead 8 Side bar 9 Support bar G Mold gate
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/50 ──────────────────────────────────────────────────の Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) H01L 23/50
Claims (3)
配置された複数のインナーリードと、前記インナーリー
ドのそれぞれに接続されるアウターリードを備えたリー
ドフレームであって、 前記複数のインナーリードが配置される領域の、モール
ド樹脂が注入される領域に近接する側の半分の領域のう
ち、少なくとも前記モールド樹脂が注入される領域に近
接する領域において、 前記インナーリードと前記半導体チップ搭載領域との間
隔を、モールド樹脂が注入される領域から離れるに従っ
て狭くなるよう設定し、モールド樹脂が注入される領域
に近い前記インナーリードほど長さが短くなるようにし
たことを特徴とするリードフレーム。1. A lead frame comprising: a plurality of inner leads arranged so as to surround a semiconductor chip mounting region; and outer leads connected to the respective inner leads, wherein the plurality of inner leads are arranged. Of the region near the region where the mold resin is injected, at least in the region adjacent to the region where the mold resin is injected, of the half region on the side close to the region where the mold resin is injected, the distance between the inner lead and the semiconductor chip mounting region is A lead frame which is set so as to become narrower as it goes away from a region where the mold resin is injected, and wherein the length of the inner lead nearer the region where the mold resin is injected becomes shorter.
配置された複数のインナーリードと、前記インナーリー
ドのそれぞれに接続されるアウターリードを備えたリー
ドフレームであって、 前記複数のインナーリードが配置される領域の、モール
ド樹脂が注入される領域に近接する側の半分の領域にお
いて、 隣接する前記インナーリードの間隔が、モールド樹脂が
注入される領域から離れるに従って狭くなるようにした
ことを特徴とするリードフレーム。2. A lead frame comprising: a plurality of inner leads arranged so as to surround a semiconductor chip mounting region; and outer leads connected to the respective inner leads, wherein the plurality of inner leads are arranged. In a half of the region adjacent to the region where the mold resin is injected, the interval between the adjacent inner leads is reduced as the distance from the region where the mold resin is injected is reduced. Lead frame.
配置された複数のインナーリードと、前記インナーリー
ドのそれぞれに接続されるアウターリードを備えたリー
ドフレームであって、 前記複数のインナーリードが配置される領域の、モール
ド樹脂が注入される領域に近接する側の半分の領域のう
ち、少なくとも前記モールド樹脂が注入される領域に近
接する領域において、 モールド樹脂が注入される領域から離れるに従い、前記
インナーリードと前記半導体チップ搭載領域との間隔が
狭くなるよう設定してモールド樹脂が注入される領域に
近い前記インナーリードほど長さが短くなるように、か
つ隣接する前記インナーリードの間隔が狭くなるように
したことを特徴とするリードフレーム。3. A lead frame, comprising: a plurality of inner leads arranged to surround a semiconductor chip mounting area; and outer leads connected to each of the inner leads, wherein the plurality of inner leads are arranged. Of the half region on the side adjacent to the region into which the mold resin is injected, at least in the region adjacent to the region into which the mold resin is injected, the inner region is formed as the distance from the region into which the mold resin is injected is increased. The distance between the lead and the semiconductor chip mounting region is set to be small so that the length of the inner lead closer to the region where the mold resin is injected is shorter, and the distance between the adjacent inner leads is smaller. A lead frame, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16949396A JP3226015B2 (en) | 1996-06-28 | 1996-06-28 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16949396A JP3226015B2 (en) | 1996-06-28 | 1996-06-28 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1022441A JPH1022441A (en) | 1998-01-23 |
| JP3226015B2 true JP3226015B2 (en) | 2001-11-05 |
Family
ID=15887555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16949396A Expired - Fee Related JP3226015B2 (en) | 1996-06-28 | 1996-06-28 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3226015B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030053970A (en) * | 2001-12-24 | 2003-07-02 | 동부전자 주식회사 | Lead frame of semiconductor package |
| JP6538602B2 (en) * | 2016-03-25 | 2019-07-03 | 日立オートモティブシステムズ株式会社 | Resin molding |
-
1996
- 1996-06-28 JP JP16949396A patent/JP3226015B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1022441A (en) | 1998-01-23 |
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