JP3397741B2 - Substrate positioning mechanism and positioning method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board positioning mechanism and a positioning method for positioning a flexible board in the assembly of electronic parts, and more particularly to a positioning mechanism and a positioning method capable of preventing the board from floating. It is about.

[0002]

2. Description of the Related Art In recent years, a so-called flexible substrate having flexibility has come to be used as a substrate on which electronic components such as semiconductor chips are mounted. This flexible substrate (hereinafter referred to as a substrate) has, for example, a thickness of 0.
05 or 0.075 mm polyimide film,
A desired pattern is formed of copper foil. By the way, when assembling electronic components, it is necessary to position the substrate in each process such as die bonding, wire bonding, resin sealing and the like. conventionally,
The substrate is provided with a plurality of positioning holes, the stage and the die on which the substrate is mounted are provided with positioning pins, and the positioning holes and the positioning pins are engaged with each other to perform positioning.

[0003]

However, according to the conventional positioning described above, the following problems occur as compared with the case where a normal glass epoxy substrate is used. First, when the substrate is heated in each step, a part of the substrate may float from the stage or the mold due to thermal expansion, and in the worst case, the substrate may come off from the positioning pin.
In this case, for example, misalignment of the semiconductor chip in die bonding, wire splash due to the inclination of the semiconductor chip in wire bonding, and deformation of the wire or short circuit due to contact with the upper mold during resin sealing may occur. There is a risk. In order to deal with these problems, it is also practiced to sandwich a substrate in a rigid carrier and position the carrier with respect to a stage or a mold. However, in this case, there is a problem that it is difficult to manufacture the carrier, and it is difficult to cope with automation of the assembly process.

The present invention has been made to solve the above problems, and in the assembly of electronic parts, a board positioning mechanism capable of reliably positioning a flexible board and preventing the board from floating. And a positioning method.

[0005]

To solve the technical problems described above SUMMARY OF THE INVENTION The positioning mechanism of the substrate according to the present invention is formed with a plurality of openings in an assembly of electronic component positioning a flexible substrate And a stage on which the substrate is placed, which is provided on the stage and has a size of being inserted into a part of the plurality of openings and passing through the part of the openings. A tapered tip with a narrow cross section, a cross section of a size that locks to some openings, and a middle section that connects to the tip, and a cross section of a size that passes through some openings A plurality of guide pins each including a base portion that is connected to the intermediate portion, and a plurality of positioning pins that are inserted so as to be fitted into other openings among the plurality of openings, and that are engaged with some of the openings. The middle part to be stopped is the substrate from the stage Easily released from the locking by spaced, and the substrate is elastically deformed around the middle portion in a state where the intermediate portion in a part of the opening are sealed respectively engaged,
In addition, when the base portions of the plurality of guide pins are inserted into the openings, the board is
The horizontal movement of the
And the diameter of the middle part is larger than the diameter of the base part.
The vertical movement of the substrate is restricted by the resulting step
In addition , the positioning pin is inserted into the other opening.

According to this, by inserting the guide pin into a part of the opening, the board is roughly positioned and temporarily fixed, and further, the positioning pin is inserted so as to be fitted into the other opening. By doing so, the substrate is accurately positioned. In addition, even if a force is applied to the substrate in a direction of floating the substrate from the stage due to thermal expansion or the like after the substrate is temporarily fixed, the intermediate portion of the guide pin is locked in a part of the opening, Vertical movement of the board,
That is, floating is suppressed. In addition, the intermediate portion of the guide pin is pressed and locked to the elastically deformed portion of the inner wall of some openings. Therefore, the middle portion of the guide pin is securely locked in part of the opening. In addition, since the guide pin is elastically deformed when the guide pin is inserted into a part of the opening or is pulled out from the part of the opening,
The locking and releasing of the intermediate portion is smoothly performed.

The substrate positioning mechanism according to the present invention is different from the above positioning mechanism in that the plurality of guide pins are provided on the stage which also serves as one of the opposing dies,
And a plurality of positioning pins are respectively provided on the other of the molds facing each other, and at least one of the molds,
A cavity is provided for resin-sealing the substrate by curing the injected molten resin.

According to this, even when a force is applied so as to lift the substrate from the stage in a state where the substrate is accurately positioned on the stage which also serves as one of the molds of the resin sealing device, the substrate is removed from the stage. Floating is suppressed.

In order to solve the above-mentioned technical problems, a board positioning method according to the present invention is a board positioning method for positioning a flexible board having a plurality of openings in the assembly of electronic parts. A part of the plurality of openings has a tapered tip having a cross-section sized to pass through the part of the openings and a tapered tip portion of the plurality of openings. A guide pin consisting of an intermediate part having a cross section and connecting to the tip part and a base part having a cross section of a size passing through a part of the opening and connecting to the intermediate part was inserted respectively, and the substrate was elastically deformed by the intermediate part. And a step of temporarily fixing the substrate and a step of inserting the positioning pins so as to fit the other openings among the plurality of openings and positioning the board in the state where the board is temporarily fixed. Characterize.

According to this, by inserting the guide pin into a part of the opening, the board is elastically deformed and then roughly positioned and temporarily fixed, and the positioning pin is fitted into the other opening. By accurately inserting the board, the board is accurately positioned. Also, after temporarily fixing the substrate,
Even if a force is applied to the substrate from the stage due to thermal expansion, etc., the intermediate part of the guide pin will be locked in a part of the opening, preventing the substrate from floating from the stage. it can. In addition, the middle portion of the guide pin is pressed and locked to the elastically deformed portion of the inner wall of part of the opening. Therefore, the intermediate portion of the guide pin can be reliably locked in part of the opening. Further, when the guide pin is inserted into part of the opening or pulled out from the part of the opening, the substrate is elastically deformed, so that the intermediate portion can be locked and released smoothly.

Further, in the method for positioning a substrate according to the present invention, in the above-mentioned positioning method, in the step of temporarily fixing the substrate, the substrate is horizontally moved by a plurality of guide pins.
The movement is regulated, and it is intermediate between the multiple guide pins.
Due to the larger diameter of the base compared to the diameter of the base.
The twisting step regulates the movement of the substrate in the vertical direction .

According to this, the substrate is provided with a plurality of guide pins.
Horizontal movement is restricted by the base of the
The diameter of the middle part of the id pin is larger than the diameter of the base part.
Due to the step caused by
It is controlled and temporarily fixed.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A substrate positioning mechanism and a substrate positioning method according to a first embodiment of the present invention will be described with reference to the drawings. Figure 1
(1) to (3) are cross-sectional views each showing an operation until the guide pin temporarily fixes the substrate in the positioning mechanism according to the present embodiment.

In FIG. 1, reference numeral 1 indicates, for example, a thickness of 0.0.
It is a flexible substrate in which a desired pattern made of copper foil is formed on a resin film made of polyimide or the like having a thickness of 5 to 0.075 mm. A plurality of guide holes 2 are provided in the substrate 1, have a substantially square shape, and are used for rough positioning of the substrate 1. A plurality of positioning holes 3 are provided on the substrate 1, have a substantially square shape, and are used for accurate positioning of the substrate 1. 4 is a stage on which the substrate 1 is placed. Reference numeral 5 is a clamp member that is provided so as to face the stage 4 and clamps the substrate 1.

A plurality of guide pins 6 are provided on the stage 4 at positions corresponding to the guide holes 2, have a circular cross section, and are inserted into the guide holes 2 to be used for rough positioning of the substrate 1. is there. 7 is provided in the clamp member 5 at a position corresponding to the guide pin 6, and a part of the guide member 6 is provided so that the guide pin 6 does not come into contact with the clamp member 5 when the substrate 1 is clamped by the clamp member 5 on the stage 4. It is a recess that is accommodated. 8
Is a positioning pin that is provided on the clamp member 5, has a circular cross section, and is used for accurate positioning of the substrate 1 by being inserted into the positioning hole 3. The stage 9 is provided at a position corresponding to the positioning pin 8 on the stage 4, and the stage 4 is fixed by the clamp member 5.
This is a recess part of which is housed so that the positioning pin 8 does not come into contact with the stage 4 when the substrate 1 is clamped.

10 to 12 are all part of the guide pin 6. Reference numeral 10 denotes a tip end portion having a diameter smaller than the short side of the guide hole 2 and having a tapered shape with a narrow tip. Reference numeral 11 is an intermediate portion connected to the tip portion 10 and having a diameter equal to or larger than the short side of the guide hole 2. 12 is a guide hole 2
Is a base having a diameter smaller than the short side of the. here,
The maximum value of the diameter of the intermediate portion 11 is preferably about 0.04 mm larger than the short side of the guide hole 2.

The operation of the positioning mechanism according to the present invention will be described below with reference to FIG. First, Fig. 1
As shown in (1), the tip portion 10 of the guide pin 6 is inserted into the guide hole 2 of the board 1 to lower the board 1. Here, even when the substrate 1 is displaced in the horizontal direction, the substrate 1 can be roughly positioned by inserting the tip portion 10 having a narrow tip into the guide hole 2.

Next, as shown in FIG. 1B, the substrate 1 is formed until the intermediate portion 11 of the guide pin 6 is inserted into the guide hole 2.
To lower. Since the substrate 1 is made of a resin film such as polyimide, it is elastically deformed when the intermediate portion 11 is pressed. Therefore, the inner wall of the guide hole 2 is expanded by the intermediate portion 11 and elastically deforms so as to be dented, and the substrate 1 slightly warps upward in the vicinity of the guide hole 2. In this state, the intermediate portion 11 of the guide pin 6 is locked in the guide hole 2 and the guide pin 6 stretches the substrate 1.

Next, as shown in FIG. 1C, the substrate 1 is lowered until the lower surface of the substrate 1 contacts the upper surface of the stage 4. In this state, the substrate 1 has recovered from the elastic deformation around the base portion 12 due to being pressed by the intermediate portion 11. Therefore, in the guide hole 2, the intermediate portion 11 is unlocked from the guide hole 2. The movement of the substrate 1 is restricted by the guide pins 6 and the guide holes 2. That is, the substrate 1 is the intermediate portion 1
The vertical movement is restricted by 1 and the horizontal movement is restricted by the base 12, and the base 12 is temporarily fixed.

Next, the clamp member 5 is lowered from the state shown in FIG. 1 (3) and the positioning pin 8 is fitted into the positioning hole 3 for accurate positioning. Then, when the processing on the stage 4 is completed and the substrate 1 is removed from the stage 4, the substrate 1 is raised. In this case, the inner wall of the guide hole 2 is expanded and elastically deformed by the intermediate portion 11, and the substrate 1 slightly warps downward near the guide hole 2 to smoothly remove the substrate 1 from the stage 4. You can

As described above, according to this embodiment, the board 1 is guided by the guide pin 6 in the guide hole 2.
Is roughly aligned, and the intermediate portion 11 and the base portion 12 of the guide pin 6 regulate the movement of the substrate 1 in the vertical direction and the horizontal direction, respectively, to temporarily fix the substrate 1. After that, using the positioning hole 3 and the positioning pin 8,
Accurately position the substrate 1. Therefore, even when the substrate 1 thermally expands due to the heating in the assembly process, the substrate 1 can be accurately positioned without using the carrier, and the substrate 1 can be prevented from floating from the stage 4.

(Second Embodiment) In a board positioning mechanism according to a second embodiment of the present invention, the operation of a positioning mechanism incorporated in a resin sealing device is related to the operation of the resin sealing device. A description will be given with reference to FIGS. 2 and 3. FIG. 2 shows, in the present embodiment,
It is a perspective view which shows a part of resin sealing device with which the positioning mechanism of FIG. 1 was incorporated.

In FIG. 2, 13 is a lower mold and 14 is a lower mold 1.
3, which is an upper mold provided so as to face 3 and is heated by a heater (not shown). The lower mold 13 and the lower mold 14 together form a resin sealing mold in the resin sealing device. Here, the lower mold 13 functions as a stage on which the substrate 1 is placed, and the upper mold 14 functions as a clamp member that clamps the substrate 1 in a clamped state.
Reference numeral 15 is a semiconductor chip die-bonded to the substrate 1, and 16 is a wire connecting electrodes of the substrate 1 and the semiconductor chip 15 to each other. Reference numeral 17 denotes a sealing region that virtually shows a region where the sealing resin is formed on the substrate 1. Reference numeral 18 denotes an ejector that pushes up the substrate 1 to take out the substrate 1 after resin sealing.

The operation of the positioning mechanism according to this embodiment in the resin sealing device of FIG. 2 will be described with reference to FIGS. 3 and 4. In addition, in FIG. 3 and FIG. 4, compared with FIG.
The state of deformation of the substrate 1 is shown in a simplified manner. Figure 3
(1) to (3) are cross-sectional views taken along the line AA of FIG. 2 showing the steps until the positioning mechanism incorporated in the resin sealing device of FIG. 2 positions and temporarily fixes the substrate. It is a figure.

First, as shown in FIG. 3A, the substrate 1 is lowered so that the tip end portions of the guide pins 6 are inserted into the guide holes 2. Next, as shown in FIG. 3B, the substrate 1 is lowered until the intermediate portion of the guide pin 6 is inserted into the guide hole 2. Here, as described with reference to FIG. 1 (2), the inner wall of the guide hole 2 is elastically deformed so as to be dented by being pressed. Next, as shown in FIG. 3C, the substrate 1 is lowered until the lower surface of the substrate 1 contacts the upper surface of the stage 4. Here, as described with reference to FIG. 1C, the board 1 is temporarily fixed by the guide hole 2 and the guide pin 6 so that movement in the horizontal direction and the vertical direction is restricted.

FIGS. 4 (1) and 4 (2) show steps of the resin encapsulation device of FIG. 2 encapsulating the positioned substrate with resin and taking out the resin-encapsulated substrate from the positioning mechanism. It is sectional drawing respectively shown along the AA line of FIG. Figure 4
In (1) and (2), 18 is an ejector which is provided in the lower mold 13 and projects the resin-sealed substrate 1. Reference numeral 19 is a space provided in the upper mold 14 and is a cavity into which a molten resin such as an epoxy resin is injected via a resin passage (not shown). 20
Is a sealing resin formed by curing the molten resin injected into the cavity 19.

As shown in FIG. 4A, the lower die 13 and the upper die 14 are clamped. In this state, molten resin is injected into the cavity 19 and cured. Next, the lower mold 13 and the upper mold 1
4 and the mold is opened, and the substrate 1 resin-sealed by forming the sealing resin 20 is ejected by the ejector 18. Then, by the transport mechanism (not shown),
The projected substrate 1 is transported to, for example, a tray or the next process.

As described above, according to this embodiment, in the resin sealing device, the positioning hole 3 and the positioning pin 8 are used after the substrate 1 is roughly aligned and temporarily fixed by the guide pin 6. To position the substrate accurately. Therefore, even when the substrate 1 is thermally expanded by the heat received from the mold, the substrate 1 can be accurately positioned without using the carrier, and
It is possible to prevent the substrate 1 from floating from the stage 4.

In this embodiment, the case where the positioning mechanism is incorporated in the resin sealing device has been described. The present invention is not limited to this, and the present invention can be applied to an apparatus used for assembling electronic components by positioning and fixing the substrate 1, for example, an apparatus used for die bonding or wire bonding, an inspection apparatus, or the like. .

In the above description of each embodiment, the case where the guide pin 6 and the positioning pin 8 are provided on separate members facing each other has been described. Not limited to this, the guide pin 6 and the positioning pin 8 are the same member, that is, the stage 4 in FIG. 1 and the lower mold 1 in FIG.
3 may be provided. In this case, the protrusion size of the positioning pin is set to be equal to or slightly lower than that of the base portion 12 of the guide pin 6 shown in FIG. And stage 4
The positioning pin provided on the stage 4 is inserted into the positioning hole 3 with the substrate 1 temporarily fixed in the horizontal direction and the vertical direction by the guide pin 6 provided on the. This makes it possible to accurately position the substrate 1 and prevent the substrate 1 from floating from the stage 4.

[0031]

According to the present invention, by inserting the guide pin into a part of the opening, the positioning pin is fitted into the other opening while the board is roughly positioned and temporarily fixed. Since it is inserted in this way, the substrate is accurately positioned. In addition, even if a force is applied to the substrate in a direction to float the substrate after the substrate is temporarily fixed, the intermediate portion of the guide pin is locked in a part of the opening, so that the substrate does not float. Suppressed. Further, the middle portion of the guide pin is pressed and locked to a portion of the inner wall of some of the openings that is elastically changed. Therefore, the middle part of the guide pin is securely locked, and when the guide pin is inserted into part of the opening or pulled out from the part of the opening, the locking and unlocking of the middle part is smooth. To be done. Therefore, the present invention has an excellent practical effect of providing a substrate positioning mechanism and a positioning method in which the substrate is accurately positioned on the stage and floating of the substrate is suppressed.

[Brief description of drawings]

1 (1) to (3) are cross-sectional views each showing an operation until a guide pin temporarily fixes a substrate in a positioning mechanism according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a part of a resin sealing device in which the positioning mechanism of FIG. 1 is incorporated in the second embodiment of the present invention.

3 (1) to (3) show a process of positioning and temporarily fixing a substrate by a positioning mechanism incorporated in the resin sealing device of FIG. 2 along a line AA of FIG. FIG.

4 (1) and (2) are views showing steps of the resin sealing device of FIG. 2 sealing the positioned substrate with resin and taking out the resin-sealed substrate from the positioning mechanism. 2 A-
It is a sectional view showing each along a line A.

[Explanation of symbols]

1 substrate 2 Guide holes (partial openings) 3 Positioning holes (other openings) 4 stages 5 Clamp member 6 guide pins 7,9 recess 8 Positioning pin 10 Tip 11 Middle part 12 base 13 Lower mold (one side of mold) 14 Upper mold (other side of mold) 15 semiconductor chips 16 wires 17 Sealing area 18 ejector 19 cavities 20 sealing resin

─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H05K 13/04

Claims (4)

(57) [Claims] 1. A substrate positioning mechanism for positioning a flexible substrate having a plurality of openings formed in assembling an electronic component, comprising: a stage on which the substrate is placed; It is inserted into a part of the plurality of openings, and has a tapered tip end having a cross-section sized to pass through the part of the opening and a tapered tip portion, and is locked to the part of the opening. A plurality of guide pins each including a middle portion having a cross section of a certain size and connected to the tip portion, and a base portion having a cross section of a size that passes through the part of the opening, and a base portion connected to the middle portion; And a plurality of positioning pins that are inserted so as to be fitted into the other openings, respectively, and the intermediate portion that is locked in the partial opening is configured to separate the substrate from the stage. Easy to lock And the base portions of the plurality of guide pins are respectively elastically deformed around the intermediate portion in a state where the intermediate portions are locked to the openings. in a state where the opening parts are inserted, the double
The number of guide pins regulates the horizontal movement of the board.
Is controlled by the guide pins of the plurality of guide pins.
Caused by the diameter being larger than the diameter of the base
The vertical movement of the substrate is restricted by the step
At the same time, the positioning pin is inserted into the other opening. 2. The positioning mechanism according to claim 1, wherein the plurality of guide pins are respectively provided on the stage that also serves as one of opposing dies, and the plurality of positioning pins are the other of the opposing dies. And a cavity for resin-sealing the substrate by hardening the molten resin that has been injected, in at least one of the molds. 3. A substrate positioning method for positioning a flexible substrate in which a plurality of openings are formed in the assembly of electronic parts, wherein a part of the plurality of openings is provided in the part of the openings. A tapered tip portion having a cross-section sized to pass through, a middle portion connected to the tip portion having a cross-section sized to be locked in the opening of the part, and the part A step of inserting guide pins each having a cross section having a size passing through the opening and a base portion connected to the intermediate portion, elastically deforming the substrate by the intermediate portion, and then temporarily fixing the substrate; Positioning the substrate by inserting positioning pins so as to fit into other openings of the plurality of openings in a state where the board is temporarily fixed. 4. The positioning method according to claim 3, wherein in the step of temporarily fixing the substrate, the plurality of guide pins are used.
The movement of the board in the horizontal direction is restricted by
The diameter of the intermediate portion of the plurality of guide pins is
Steps caused by being larger than the diameter of the base
A positioning method characterized in that the movement of the substrate in the vertical direction is regulated by a section .