WO1993001616A1 - Method and mould for the manufacture of an injection moulded electronics module - Google Patents

Method and mould for the manufacture of an injection moulded electronics module Download PDF

Info

Publication number
WO1993001616A1
WO1993001616A1 PCT/FI1992/000214 FI9200214W WO9301616A1 WO 1993001616 A1 WO1993001616 A1 WO 1993001616A1 FI 9200214 W FI9200214 W FI 9200214W WO 9301616 A1 WO9301616 A1 WO 9301616A1
Authority
WO
WIPO (PCT)
Prior art keywords
mould
injection
component
bare
moulded
Prior art date
Application number
PCT/FI1992/000214
Other languages
French (fr)
Inventor
Raimo Rikola
Jaakko Lenkkeri
Tuomo Jaakola
Original Assignee
Valtion Teknillinen Tutkimuskeskus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen Tutkimuskeskus filed Critical Valtion Teknillinen Tutkimuskeskus
Publication of WO1993001616A1 publication Critical patent/WO1993001616A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a method for producing an injection-moulded electronics module, wherein an electronic component, such as a semiconductor chip, a discrete component, or some other component, is posi ⁇ tioned between projections extending between the opposite halves of a mould structure used in the production; and a substrate of e.g. molten or un- polymerized plastic is formed for the electronic com ⁇ ponents in the mould structure by injection molding, transfer moulding or in some other substantially similar manner.
  • the electronics module refers to a structure comprising one or more semiconductor chips or other components and formed on a common substrate made of e.g. poly ⁇ carbonate or other plastic-based material by injection moulding. Each semiconductor chip forms a functional entity of its own, which is connected to the other semiconductor chips and components of the module by means of wiring.
  • the method according to the invention is suit ⁇ able for use e.g. in the production of so-called multichip modules.
  • the multichip module refers to a structure in which several semiconductor chips are connected on the same support structure, i.e. substrate.
  • the substrate acts as a base.
  • the multichip technique avoids the need of packaging each individual semiconductor chip, which allows higher densities in terms of wiring.
  • German (DDR) Patent Specification 0 152 025 discloses a mould in which an elastic body is placed behind the component so as to ensure that the surface of the component, that is, in this specific case, the bare semiconductor chip, will be positioned in level with the surface of the in ection-moulded support structure, i.e. substrate.
  • This technique does not ensure a sufficiently accurate mutual posi ⁇ tioning and mounting of the components, and it is not suitable for the production of multichip modules.
  • the prior art also includes __ New LSI Inter- connection Method for IC-Card by Ohuchi, M., Hongu, A., Saito, M., Iida, A., Yoshida, K. and Odaira, H., IEEE CH2295-0/86/0000-0030 (1986), p. 30-33.
  • This article describes a method for producing IC-cards, in which semiconductor chips are placed into openings made in a polycarbonate substrate and having the same size as the semiconductor chip, whereafter the sub ⁇ strate is subjected to heat treatment and squeezing so as to deform it for fixing the semiconductor chips in position.
  • This method comprises a relatively great number of separate steps, being thus unnecessarily expensive to carry out.
  • the components cannot be set with sufficient accuracy, on account of which wiring to the semiconductor chips has to be made in several steps separately for each semi- conductor chip.
  • a conductive layer is re ⁇ quired to interconnect the separate wirings of the semiconductor chips in order to ensure reliable contacts between the wiring and the components.
  • the object of the present invention is to provide a new method, which avoids the problems and shortcomings of the prior art techniques.
  • the method according to the invention is based on the idea that all measures associated with the positioning of the components and enabling the forma ⁇ tion of an accurate wire pattern are carried out simply in a single step by means of the requisite apparatus solutions.
  • the method according to the invention provides several advantages, including an improvement in the positioning accuracy of the components, as a result of which the wire patterns can be formed in the same plane with sufficiently narrow line widths, as the components are precisely in the right position, and so there is no need to use unnecessary great line widths to ensure contacts. It is not either necessary to connect the components to the wire pattern by wire bonding.
  • the method according to the invention com ⁇ prises fewer steps, and is therefore less expensive and simpler to realize than the prior art methods.
  • the mounting of the components is also more accurate, so that the same exposing mask or the like tool can always be used for forming the wire pattern in a single step for the entire circuit.
  • the invention also relates to a mould for producing an injection-moulded electronics module, comprising at least two opposite portions, and a recess or a similar area defined between said por ⁇ tions for guiding a material to be injection-moulded into a substrate for the components in the mould, the mould further comprising several guide pins or the like projections extending between the mould portions from at least one mould portion towards the other mould portion for keeping the electronic component in position during the injection moulding.
  • the solutions to the problems associated with the posi ⁇ tioning of a bare component are deficient.
  • the component is not positioned as such, that is, bare, but a semi- finished partially connected module is placed between the projections of the mould.
  • the object of the present invention is to provide a mould structure which avoids the problems and disadvantages of the prior art.
  • This object is achieved by means of a mould according to the invention, which is character ⁇ ized in that the guide pins are positioned so that the guide pins used for keeping the electronic com ⁇ ponent in position are in direct contact with the electronic component to be positioned as such, i.e. bare.
  • the mould according to the invention enables easy realization of apparatus-level technical solutions, which provide a good end result in terms of the positioning, aligning and mounting of the com ⁇ ponents.
  • Figure 1 is a cross-sectional view of a mould structure as seen in the direction of the plane of a component to be positioned in the mould;
  • Figure 2 is a cross-sectional view of the mould structure within the area of a suction conduit as seen in a direction perpendicular to the plane of the component to be positioned in the mould;
  • Figure 3 is a cross-sectional view of the mould structure within the area of the suction conduit as seen in the direction of the plane of the component to be positioned in the mould;
  • Figure 4 is a schematic top view of an injection-moulded electronics module
  • Figure 5 is a cross-sectional view of an injection-moulded electronics module; and Figure 6 is a partial cross-sectional view of an injection-moulded electronics module.
  • the device used in the method according to the invention is a mould comprising at least two portions of which the upper portion in Figure 1 forms a top portion 1 of the mould and the lower portion forms a bottom portion 2 of the mould.
  • Figure 1 shows the top and the bottom portion of the mould slightly apart from each other.
  • the top portion 1 and the bottom portion 2 of the mould are so shaped that when the mould portions are pressed together a recess 3 or the like space is defined between the top portion 1 and the bottom portion 2.
  • the recess 3 communicates with a conduit 4 through which plastic, such as poly- carbonate, flows into the recess 3, i.e. the space between the mould portions 1 and 2.
  • the plastic structure formed in the recess 3 by the injection moulding acts as a substrate 5 for various electronic components to be mounted thereon, which are represented in Figure 1 by two components, i.e. a semiconductor circuit chip 6 and a chip capacitor 7. Essential is that the components to be mounted are bare and still unconnected.
  • Figure 4 is a schematic top view and Figure 5 a cross-sectional view of an injection-moulded electronics module.
  • Figure 4 shows two electronic components 6 and 7, the substrate 5 of which is formed by an injection-moulded rectangular plastic plate.
  • the substrate 5 also acts as a base for a wire pattern 8 to be formed later on, which wire pattern connects the different components 6 and 7 on the substrate 5 in an appropriate way and enables contacts to be established through contact points 9 outside the substrate 5.
  • Figure 5 further shows the wire pattern 8 formed on the polycarbonate substrate 5 and connected to the electronic component 6.
  • the electronic component 6, 7 of the injection-moulded electronics module such as a semiconductor chip, a discrete component or some other component, is posi ⁇ tioned between the projections 12 extending between the opposite halves 1,2 of the mould structure used in the production.
  • the substrate 5 for the electronic components 6, 7 is formed by injection moulding, transfer moulding or in some other substantially similar way using e.g. molten or unpolymerized plastic.
  • the electronic components are positioned as such, i.e.
  • the projections 12 of the mould structure are util ⁇ ized both to align two or more bare electronic com ⁇ ponents 6,7 with respect to the other bare components 7, 6 and/or the injection-moulded or transfer-moulded component substrate 5, and to keep the bare component 6, 7 in position during the injection moulding pro ⁇ cess.
  • the bare electronic components 6, 7 in the substrate are connected to each other and/or to the other structures after the injection moulding or transfer moulding by forming a wire pattern by means of the same exposing mask or the like means sub ⁇ stantially in a single step in the same plane on the surface of the substrate 5.
  • the bare component 6, 7 to be positioned as such is pressed directly against the inner surface 10 of the mould by vacuum.
  • one or more electronic components 6 and/or 7 are both aligned with respect to the other components 7 and/or 6 and/or with respect to the component substrate 5, and the component 6 as well as the component 7 are kept in position during the injection moulding pro- cess.
  • the wire pattern between the components 6, 7 can be realized by various methods known per se, such as chemical metallization by sputtering or polymer thick-film technique.
  • the components 6 and/or 7 to be positioned on the substrate 5 are connected to each other and/or to the other structures and/or parts by forming a relatively narrow wire pattern substantially in the same plane for all desired components directly in the connection areas of the components.
  • the present-day techniques cannot provide this structure, as previously it has been possible either to produce only a so-called one- chip (non-multichip) structure in the same plane in a single step, or it has been necessary to use un ⁇ necessary great wire widths for ensuring the contact between the components and the wire patterns.
  • the component 6 and/or 7 to be mounted during the injection moulding process is pressed by means of vacuum against the inner sur ⁇ face 10 of the mould through a suction conduit 11 or the like means positioned within the area between the several guide pins 12 surrounding the component 6 and/or 7.
  • Figures 1, 2 and 3 show the suction con- duit 11, in which a vacuum is created e.g. by an air compressor means (not shown), which vacuum causes the electronic component 6 and/or 7 to be pressed against the inner surface 10 of the top portion 1 of the mould.
  • the mould according to the invention for producing an injection-moulded electronics module comprises, within the area between the top portion 1 and the bottom portion 2 of the mould, several guide pins or the like means extending from at least one mould portion 1 or 2 towards the other mould portion 2 or 1, the electronic component 6 or 7 being arranged to be positioned between the guide pins.
  • two guide pins are shown around each elec- tronic component 6 and 7 , all indicated by the refer ⁇ ence numeral 12.
  • Figure 1 has been drawn in such a way that no other guide pins are visible as they are behind those shown in the figure.
  • a multichip structure com- prising two chips can be produced in a single step, so that all electronic components, such as the chips 6, the chip capacitors 7, and the like, can be attached to the substrate 5 during the injection moulding.
  • the guide pins 12 are positioned so that the guide pins 12 keeping the electronic component 6, 7 in position are in direct contact with the electronic component 6, 7 to be positioned as such, i.e. bare.
  • the guide pins 12 are attached to the top portion 1 of the mould, but the structure could be mirror-image-like as well, in which case the guide pins 12 would form part of the bottom portion 2 of the mould.
  • one component 6 can be surrounded by e.g.
  • guide pins 12 which accurately define the right position for the component 6.
  • guide pins 12 may be provided on three different sides of the component, as shown in Figure 2. It is also possible to provide a solution comprising a guide pin on every side of the component (not shown).
  • the components 6, 7 are aligned with respect to the other components or structures, such as the wire pattern 8 to be formed subsequently or its designed point of location, in addition to which the components 6, 7 are kept precisely in the right position during the injection moulding or transfer moulding process.
  • Figures 2 and 3 show the same portion of the mould structure, but Figure 2 is shown in a direction perpendicular to the direction of the plane of the component 6, and Figure 3 is shown in the direction of the plane of the component 6 similarly as Figure 1.
  • the guide pins 12 are fixed in guide pin holes 13 or the like provided in at least one mould portion 1 or 2. To fix the guide pins 12, this solution is easy to realize and thus a good solution.
  • the guide pins 12 fitted in the pin holes 13 extend substantially perpendicu- larly away from the plane of the inner surface 10 of the mould portion 1 comprising the guide pins 12 to ⁇ wards the other mould portion 2, and this simple and easily realizable structure ensures that the electronic component 6 and/or 7 stays reliably in position and is set and aligned appropriately.
  • the free ends 14 of the guide pins 12 are arranged to be inserted into counter openings 15 in the other mould portion 1 or 2 when the mould portions 1 and 2 are pressed together, so that the guide pins place in position and align the components 6, 7 and keep them in position even more reliably.
  • the mould comprises a suction conduit 11 such as a suction conduit or the like within an area 16 between several guide pins 12, that is, within an area defined by them; bare com ⁇ ponents can be kept more reliably in position by e.g. a vacuum applied through the suction conduit by pressure means (not shown).
  • a suction conduit 11 such as a suction conduit or the like within an area 16 between several guide pins 12, that is, within an area defined by them; bare com ⁇ ponents can be kept more reliably in position by e.g. a vacuum applied through the suction conduit by pressure means (not shown).
  • the mould comprises, within the area 16 between several guide pins 12, a plane, a raised section or a similar element 17, which is above the plane of the rest of the inner surface 10a and which is arranged to form an area substantially free from the injection-moulding ma ⁇ terial below the electronic component, so that the surface of the component can be passivated.
  • the raised section 17 presses the component 6 or 7 upon it against the mould or its portion 1 and/or 2.
  • the planes 17 supporting the components 6 and 7 from below are formed in the bottom portion 2 of the mould.
  • the mould comprises at least three guide pins 12 in at least one group of three guide pins arranged to define a space for posi- tioning the electronic component 6 or 7.
  • the mould comprises a separate group of guide pins.
  • the group of guide pins supports the electronic component 6, 7 to be posi ⁇ tioned.
  • Figure 6 shows a partial cross-sectional view of an injection-moulded electronics module.
  • the chip 6 positioned in the injection-moulded plastic baseboard 5 is connected by a wiring 8 at its connection points 31. Insulating layers 30 are formed under the wiring 8.
  • the internal connections 31 of the module are made in connection with the fabrica ⁇ tion of the wiring 8 e.g. as a film connection.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The invention relates to a method and a mould for producing an injection-moulded electronics module. The electronic components (6, 7), such as a semiconductor chip, is placed between projections extending between the opposite halves (1, 2) of a mould structure used in the production. In the mould structure, a substrate (5) of plastic is formed by injection moulding for the electronic components (6, 7). The components are positioned between the projections of the opposite halves of the mould structure as such, i.e. bare and free from other structural parts and/or connections, the electric connection of the electronic components so positioned being made only after the injection moulding or transfer moulding.

Description

Method and mould for the manufacture of an injection moulded electronics module
The invention relates to a method for producing an injection-moulded electronics module, wherein an electronic component, such as a semiconductor chip, a discrete component, or some other component, is posi¬ tioned between projections extending between the opposite halves of a mould structure used in the production; and a substrate of e.g. molten or un- polymerized plastic is formed for the electronic com¬ ponents in the mould structure by injection molding, transfer moulding or in some other substantially similar manner. As used in this connection, the electronics module refers to a structure comprising one or more semiconductor chips or other components and formed on a common substrate made of e.g. poly¬ carbonate or other plastic-based material by injection moulding. Each semiconductor chip forms a functional entity of its own, which is connected to the other semiconductor chips and components of the module by means of wiring.
The method according to the invention is suit¬ able for use e.g. in the production of so-called multichip modules. The multichip module refers to a structure in which several semiconductor chips are connected on the same support structure, i.e. substrate. The substrate, in turn, acts as a base. The multichip technique avoids the need of packaging each individual semiconductor chip, which allows higher densities in terms of wiring.
In the production of injection-moulded electronics modules, problems occur in positioning and aligning the components and keeping them in posi- tion, as a result of which accurate wiring is also problematic.
In the production of injection-moulded electronics modules, the prior art is represented by German (DDR) Patent Specification 0 152 025, which discloses a mould in which an elastic body is placed behind the component so as to ensure that the surface of the component, that is, in this specific case, the bare semiconductor chip, will be positioned in level with the surface of the in ection-moulded support structure, i.e. substrate. This technique, however, does not ensure a sufficiently accurate mutual posi¬ tioning and mounting of the components, and it is not suitable for the production of multichip modules.
The prior art also includes __ New LSI Inter- connection Method for IC-Card by Ohuchi, M., Hongu, A., Saito, M., Iida, A., Yoshida, K. and Odaira, H., IEEE CH2295-0/86/0000-0030 (1986), p. 30-33. This article describes a method for producing IC-cards, in which semiconductor chips are placed into openings made in a polycarbonate substrate and having the same size as the semiconductor chip, whereafter the sub¬ strate is subjected to heat treatment and squeezing so as to deform it for fixing the semiconductor chips in position. This method comprises a relatively great number of separate steps, being thus unnecessarily expensive to carry out. Furthermore, the components cannot be set with sufficient accuracy, on account of which wiring to the semiconductor chips has to be made in several steps separately for each semi- conductor chip. Moreover, a conductive layer is re¬ quired to interconnect the separate wirings of the semiconductor chips in order to ensure reliable contacts between the wiring and the components.
Attempts have been made to solve the problems associated with the positioning of components by using an injection mould comprising two halves with projections, that is, guide pins, extending therebe¬ tween, to improve the positioning accuracy. Such solutions to the problem are known from US Patent Specifications 4,974,120 and 4,888,307, and FR Patent 8700446. These patent documents, however, do not teach the positioning of a bare semiconductor chip or other component, but a semi-finished module is placed between the projections, or the semiconductor chip is attached to a metal wire frame. In view of the ease of manufacture, these techniques are complicated, and they are also unsuitable for the attachment of a bare semiconductor chip or other discrete component as such, that is, bare and without connections. In the above-mentioned patent documents, the connecting of the connection areas of the chip components is made already before the injection molding or transfer moulding.
The object of the present invention is to provide a new method, which avoids the problems and shortcomings of the prior art techniques.
This object is achieved by means of a method according to the invention, which is characterized in that the electronic components are positioned between the projections between the halves of the mould structure as such, i.e. bare and free from other structural parts and/or connections; and that the electric connection of the electronic components so positioned is made only after the injection moulding or transfer moulding.
The method according to the invention is based on the idea that all measures associated with the positioning of the components and enabling the forma¬ tion of an accurate wire pattern are carried out simply in a single step by means of the requisite apparatus solutions.
The method according to the invention provides several advantages, including an improvement in the positioning accuracy of the components, as a result of which the wire patterns can be formed in the same plane with sufficiently narrow line widths, as the components are precisely in the right position, and so there is no need to use unnecessary great line widths to ensure contacts. It is not either necessary to connect the components to the wire pattern by wire bonding. The method according to the invention com¬ prises fewer steps, and is therefore less expensive and simpler to realize than the prior art methods. The mounting of the components is also more accurate, so that the same exposing mask or the like tool can always be used for forming the wire pattern in a single step for the entire circuit.
The invention also relates to a mould for producing an injection-moulded electronics module, comprising at least two opposite portions, and a recess or a similar area defined between said por¬ tions for guiding a material to be injection-moulded into a substrate for the components in the mould, the mould further comprising several guide pins or the like projections extending between the mould portions from at least one mould portion towards the other mould portion for keeping the electronic component in position during the injection moulding.
In the present-day mould structures, the solutions to the problems associated with the posi¬ tioning of a bare component are deficient. In the present moulds used for the production of thin multi¬ chip modules, such as IC-cards, the component is not positioned as such, that is, bare, but a semi- finished partially connected module is placed between the projections of the mould.
On the apparatus level the object of the present invention is to provide a mould structure which avoids the problems and disadvantages of the prior art. This object is achieved by means of a mould according to the invention, which is character¬ ized in that the guide pins are positioned so that the guide pins used for keeping the electronic com¬ ponent in position are in direct contact with the electronic component to be positioned as such, i.e. bare.
The mould according to the invention enables easy realization of apparatus-level technical solutions, which provide a good end result in terms of the positioning, aligning and mounting of the com¬ ponents.
In the following the invention will be described more closely with reference to the attached drawings, in which Figure 1 is a cross-sectional view of a mould structure as seen in the direction of the plane of a component to be positioned in the mould;
Figure 2 is a cross-sectional view of the mould structure within the area of a suction conduit as seen in a direction perpendicular to the plane of the component to be positioned in the mould;
Figure 3 is a cross-sectional view of the mould structure within the area of the suction conduit as seen in the direction of the plane of the component to be positioned in the mould;
Figure 4 is a schematic top view of an injection-moulded electronics module;
Figure 5 is a cross-sectional view of an injection-moulded electronics module; and Figure 6 is a partial cross-sectional view of an injection-moulded electronics module.
As shown in Figure 1, the device used in the method according to the invention is a mould comprising at least two portions of which the upper portion in Figure 1 forms a top portion 1 of the mould and the lower portion forms a bottom portion 2 of the mould. For clarity, Figure 1 shows the top and the bottom portion of the mould slightly apart from each other. The top portion 1 and the bottom portion 2 of the mould are so shaped that when the mould portions are pressed together a recess 3 or the like space is defined between the top portion 1 and the bottom portion 2. The recess 3 communicates with a conduit 4 through which plastic, such as poly- carbonate, flows into the recess 3, i.e. the space between the mould portions 1 and 2. The plastic structure formed in the recess 3 by the injection moulding acts as a substrate 5 for various electronic components to be mounted thereon, which are represented in Figure 1 by two components, i.e. a semiconductor circuit chip 6 and a chip capacitor 7. Essential is that the components to be mounted are bare and still unconnected.
Figure 4 is a schematic top view and Figure 5 a cross-sectional view of an injection-moulded electronics module. Figure 4 shows two electronic components 6 and 7, the substrate 5 of which is formed by an injection-moulded rectangular plastic plate. The substrate 5 also acts as a base for a wire pattern 8 to be formed later on, which wire pattern connects the different components 6 and 7 on the substrate 5 in an appropriate way and enables contacts to be established through contact points 9 outside the substrate 5. Figure 5 further shows the wire pattern 8 formed on the polycarbonate substrate 5 and connected to the electronic component 6.
In the method according to the invention, the electronic component 6, 7 of the injection-moulded electronics module, such as a semiconductor chip, a discrete component or some other component, is posi¬ tioned between the projections 12 extending between the opposite halves 1,2 of the mould structure used in the production. In the mould structure, the substrate 5 for the electronic components 6, 7 is formed by injection moulding, transfer moulding or in some other substantially similar way using e.g. molten or unpolymerized plastic. According to the invention, the electronic components are positioned as such, i.e. bare and free from other structural parts and/or connections, between the projections 12 extending between the halves of the mould structure, and the electric connection of the electronic com¬ ponents so positioned is made only after the injection moulding or transfer moulding. In the preferred embodiment of the invention, the projections 12 of the mould structure are util¬ ized both to align two or more bare electronic com¬ ponents 6,7 with respect to the other bare components 7, 6 and/or the injection-moulded or transfer-moulded component substrate 5, and to keep the bare component 6, 7 in position during the injection moulding pro¬ cess. Further, in the preferred embodiment of the invention, the bare electronic components 6, 7 in the substrate are connected to each other and/or to the other structures after the injection moulding or transfer moulding by forming a wire pattern by means of the same exposing mask or the like means sub¬ stantially in a single step in the same plane on the surface of the substrate 5. During the injection moulding process, the bare component 6, 7 to be positioned as such is pressed directly against the inner surface 10 of the mould by vacuum.
By means of the mould or its portions 1 and 2, one or more electronic components 6 and/or 7 are both aligned with respect to the other components 7 and/or 6 and/or with respect to the component substrate 5, and the component 6 as well as the component 7 are kept in position during the injection moulding pro- cess.
The wire pattern between the components 6, 7 can be realized by various methods known per se, such as chemical metallization by sputtering or polymer thick-film technique. In the method according to the invention, the components 6 and/or 7 to be positioned on the substrate 5 are connected to each other and/or to the other structures and/or parts by forming a relatively narrow wire pattern substantially in the same plane for all desired components directly in the connection areas of the components. The present-day techniques cannot provide this structure, as previously it has been possible either to produce only a so-called one- chip (non-multichip) structure in the same plane in a single step, or it has been necessary to use un¬ necessary great wire widths for ensuring the contact between the components and the wire patterns.
In one preferred embodiment of the method according to the invention, the component 6 and/or 7 to be mounted during the injection moulding process is pressed by means of vacuum against the inner sur¬ face 10 of the mould through a suction conduit 11 or the like means positioned within the area between the several guide pins 12 surrounding the component 6 and/or 7. Figures 1, 2 and 3 show the suction con- duit 11, in which a vacuum is created e.g. by an air compressor means (not shown), which vacuum causes the electronic component 6 and/or 7 to be pressed against the inner surface 10 of the top portion 1 of the mould.
The mould according to the invention for producing an injection-moulded electronics module comprises, within the area between the top portion 1 and the bottom portion 2 of the mould, several guide pins or the like means extending from at least one mould portion 1 or 2 towards the other mould portion 2 or 1, the electronic component 6 or 7 being arranged to be positioned between the guide pins. In Figure 1, two guide pins are shown around each elec- tronic component 6 and 7 , all indicated by the refer¬ ence numeral 12. Figure 1 has been drawn in such a way that no other guide pins are visible as they are behind those shown in the figure. By means of the mould shown in Figure 1, a multichip structure com- prising two chips can be produced in a single step, so that all electronic components, such as the chips 6, the chip capacitors 7, and the like, can be attached to the substrate 5 during the injection moulding. It is characteristic of the mould that the guide pins 12 are positioned so that the guide pins 12 keeping the electronic component 6, 7 in position are in direct contact with the electronic component 6, 7 to be positioned as such, i.e. bare. In Figure 1, the guide pins 12 are attached to the top portion 1 of the mould, but the structure could be mirror-image-like as well, in which case the guide pins 12 would form part of the bottom portion 2 of the mould. As shown in Figure 2, one component 6 can be surrounded by e.g. six guide pins, which accurately define the right position for the component 6. To ensure that the component 6 stays in position, there may be provided guide pins 12 on three different sides of the component, as shown in Figure 2. It is also possible to provide a solution comprising a guide pin on every side of the component (not shown).
By means of the guide pins 12 or the like, the components 6, 7 are aligned with respect to the other components or structures, such as the wire pattern 8 to be formed subsequently or its designed point of location, in addition to which the components 6, 7 are kept precisely in the right position during the injection moulding or transfer moulding process. Figures 2 and 3 show the same portion of the mould structure, but Figure 2 is shown in a direction perpendicular to the direction of the plane of the component 6, and Figure 3 is shown in the direction of the plane of the component 6 similarly as Figure 1.
In one preferred embodiment of the mould according to the invention, the guide pins 12 are fixed in guide pin holes 13 or the like provided in at least one mould portion 1 or 2. To fix the guide pins 12, this solution is easy to realize and thus a good solution.
In one preferred embodiment of the mould according to the invention, the guide pins 12 fitted in the pin holes 13 extend substantially perpendicu- larly away from the plane of the inner surface 10 of the mould portion 1 comprising the guide pins 12 to¬ wards the other mould portion 2, and this simple and easily realizable structure ensures that the electronic component 6 and/or 7 stays reliably in position and is set and aligned appropriately. In one preferred embodiment of the mould according to the invention, the free ends 14 of the guide pins 12 are arranged to be inserted into counter openings 15 in the other mould portion 1 or 2 when the mould portions 1 and 2 are pressed together, so that the guide pins place in position and align the components 6, 7 and keep them in position even more reliably.
In one preferred embodiment of the mould according to the invention, the mould comprises a suction conduit 11 such as a suction conduit or the like within an area 16 between several guide pins 12, that is, within an area defined by them; bare com¬ ponents can be kept more reliably in position by e.g. a vacuum applied through the suction conduit by pressure means (not shown).
In one preferred embodiment of the mould according to the invention, the mould comprises, within the area 16 between several guide pins 12, a plane, a raised section or a similar element 17, which is above the plane of the rest of the inner surface 10a and which is arranged to form an area substantially free from the injection-moulding ma¬ terial below the electronic component, so that the surface of the component can be passivated. In addition, the raised section 17 presses the component 6 or 7 upon it against the mould or its portion 1 and/or 2. In Figure 1, the planes 17 supporting the components 6 and 7 from below are formed in the bottom portion 2 of the mould.
In one preferred embodiment of the mould according to the invention, the mould comprises at least three guide pins 12 in at least one group of three guide pins arranged to define a space for posi- tioning the electronic component 6 or 7. For each component to be mounted, the mould comprises a separate group of guide pins. The group of guide pins supports the electronic component 6, 7 to be posi¬ tioned. Figure 6 shows a partial cross-sectional view of an injection-moulded electronics module. In Figure 6, the chip 6 positioned in the injection-moulded plastic baseboard 5 is connected by a wiring 8 at its connection points 31. Insulating layers 30 are formed under the wiring 8. The internal connections 31 of the module are made in connection with the fabrica¬ tion of the wiring 8 e.g. as a film connection.
Even though the invention has been described above with reference to the examples of the attached drawings, it is clear that the invention is not restricted to them, but it can be modified in various ways within the idea disclosed in the attached claims.

Claims

Claims :
1. A method for producing an injection-moulded electronics module, wherein - an electronic component (6, 7), such as a semiconductor chip, a discrete component, or some other component, is positioned between projections extending between the opposite halves (1, 2) of a mould structure used in the production; and - a substrate (5) of e.g. molten or un- polymerized plastic is formed for the electronic com¬ ponents (6, 7) in the mould structure by injection molding, transfer moulding or in some other substan¬ tially similar manner; c h a r a c t e r i z e d in that the electronic components are positioned between the projections between the halves of the mould structure as such, i.e. bare and free from other structural parts and/or connections; and that the electric connection of the electronic components so positioned is made only after the injection moulding or transfer moulding.
2. A method according to claim 1, c h a r a c ¬ t e r i z e d in that the projections of the mould structure are utilized both to align two or more bare electronic components (6, 7) with respect to the other bare components (7, 6) and/or the injection- moulded or transfer-moulded component substrate (5), and to keep the bare component (6, 7) in position during the injection moulding process.
3. A method according to claim 1 or 2, c h a r¬ a c t e r i z e d in that after the injection mould¬ ing or the transfer moulding the several bare electronic components (6, 7) in the substrate are connected to each other and/or the other structures by forming a wire pattern by means of the same expos- ing mask or the like means substantially in a single step in the same plane on the surface of the sub¬ strate (5).
4. A method according to claim 1, c h a r a c - t e r i z e d in that the bare component (6, 7) to be positioned as such is pressed during the injection moulding process directly against an inner surface (10) of the mould by means of a vacuum.
5. A mould for producing an injection-moulded electronics module, comprising at least two opposite portions (1, 2), and a recess (3) or a similar area defined between said portions (1, 2) for guiding a material to be injection-moulded into a substrate (5) for electronic components (6, 7) in the mould, the mould further comprising several guide pins (12) or the like projections extending between the mould por¬ tions (1, 2) from at least one mould portion (1 or 2) towards the other mould portion (2 or 1) for keeping the component in position during the injection mould- ing, c h a r a c t e r i z e d in that the guide pins are positioned so that the guide pins used for keeping the electronic component in position are in direct contact with the electronic component to be positioned as such, i.e. bare.
6. A mould according to claim 5, c h a r a c ¬ t e r i z e d in that the guide pins (12) are fixed in guide pin holes (13) or the like openings provided in at least one mould portion (1 or 2).
7. A mould according to claim 5 or 6, c h a r - a c t e r i z e d in that the free ends (14) of the guide pins (12) are arranged to be fitted into counter openings (15) in the other mould portion (2, 1) when the mould portions (1, 2) are pressed together.
8. A mould according to claim 5, c h a r a c - t e r i z e d in that the mould comprises, within an area between several guide pins (12), an element (17), such as a plane or a raised section, above the plane of the rest of the inner surface (10a) and arranged to form an area substantially free from the material to be injection-moulded during the injection-moulding process.
PCT/FI1992/000214 1991-07-10 1992-07-10 Method and mould for the manufacture of an injection moulded electronics module WO1993001616A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI913357A FI913357A (en) 1991-07-10 1991-07-10 FOERFARANDE OCH FORM FOER FRAMSTAELLNING AV EN STRAENGSPRUTAD ELEKTRONIKMODUL
FI913357 1991-07-10

Publications (1)

Publication Number Publication Date
WO1993001616A1 true WO1993001616A1 (en) 1993-01-21

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WO (1) WO1993001616A1 (en)

Cited By (2)

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Publication number Priority date Publication date Assignee Title
FR2806343A1 (en) * 2000-03-16 2001-09-21 Markage Encapsulated electronic assemblies use in vehicle, made by single injection molding step, are retained in mold so injected material strikes assembly directly
SG98012A1 (en) * 1999-12-23 2003-08-20 Esec Trading Sa Method for making a plastic object, in particular a multimedia card

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EP0277854A1 (en) * 1987-01-16 1988-08-10 Schlumberger Industries Memory card manufacturing process and cards obtained by this process
US4888307A (en) * 1986-08-27 1989-12-19 Sgs Microelettronica S.P.A. Method for manufacturing plastic encapsulated semiconductor devices
EP0390996A2 (en) * 1989-04-06 1990-10-10 Mitsubishi Denki Kabushiki Kaisha IC card module
EP0398587A2 (en) * 1989-05-19 1990-11-22 THORN EMI plc A method of encapsulation for devices
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DD152025A1 (en) * 1980-07-07 1981-11-11 Wolfgang Beck SUBSTRATE FOR PRINTED CIRCUITS WITH INSERTED SEMICONDUCTOR CHIPS
US4888307A (en) * 1986-08-27 1989-12-19 Sgs Microelettronica S.P.A. Method for manufacturing plastic encapsulated semiconductor devices
EP0277854A1 (en) * 1987-01-16 1988-08-10 Schlumberger Industries Memory card manufacturing process and cards obtained by this process
US4974120A (en) * 1989-01-12 1990-11-27 Mitsubishi Denki Kabushiki Kaisha IC card
EP0390996A2 (en) * 1989-04-06 1990-10-10 Mitsubishi Denki Kabushiki Kaisha IC card module
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG98012A1 (en) * 1999-12-23 2003-08-20 Esec Trading Sa Method for making a plastic object, in particular a multimedia card
FR2806343A1 (en) * 2000-03-16 2001-09-21 Markage Encapsulated electronic assemblies use in vehicle, made by single injection molding step, are retained in mold so injected material strikes assembly directly

Also Published As

Publication number Publication date
FI913357A0 (en) 1991-07-10
FI913357A (en) 1993-01-11

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