FI913357A0 - FOERFARANDE OCH FORM FOER FRAMSTAELLNING AV EN STRAENGSPRUTAD ELEKTRONIKMODUL. - Google Patents

FOERFARANDE OCH FORM FOER FRAMSTAELLNING AV EN STRAENGSPRUTAD ELEKTRONIKMODUL.

Info

Publication number
FI913357A0
FI913357A0 FI913357A FI913357A FI913357A0 FI 913357 A0 FI913357 A0 FI 913357A0 FI 913357 A FI913357 A FI 913357A FI 913357 A FI913357 A FI 913357A FI 913357 A0 FI913357 A0 FI 913357A0
Authority
FI
Finland
Prior art keywords
straengsprutad
elektronikmodul
foer framstaellning
foerfarande och
form foer
Prior art date
Application number
FI913357A
Other languages
Finnish (fi)
Other versions
FI913357A (en
Inventor
Raimo Rikola
Jaakko Lenkkeri
Tuomo Jaakola
Original Assignee
Valtion Teknillinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen filed Critical Valtion Teknillinen
Priority to FI913357A priority Critical patent/FI913357A/en
Publication of FI913357A0 publication Critical patent/FI913357A0/en
Priority to FI923199A priority patent/FI94572C/en
Priority to PCT/FI1992/000214 priority patent/WO1993001616A1/en
Publication of FI913357A publication Critical patent/FI913357A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
FI913357A 1991-07-10 1991-07-10 FOERFARANDE OCH FORM FOER FRAMSTAELLNING AV EN STRAENGSPRUTAD ELEKTRONIKMODUL FI913357A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI913357A FI913357A (en) 1991-07-10 1991-07-10 FOERFARANDE OCH FORM FOER FRAMSTAELLNING AV EN STRAENGSPRUTAD ELEKTRONIKMODUL
FI923199A FI94572C (en) 1991-07-10 1992-07-10 Method and form of manufacturing an injection molded electronics module
PCT/FI1992/000214 WO1993001616A1 (en) 1991-07-10 1992-07-10 Method and mould for the manufacture of an injection moulded electronics module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI913357A FI913357A (en) 1991-07-10 1991-07-10 FOERFARANDE OCH FORM FOER FRAMSTAELLNING AV EN STRAENGSPRUTAD ELEKTRONIKMODUL

Publications (2)

Publication Number Publication Date
FI913357A0 true FI913357A0 (en) 1991-07-10
FI913357A FI913357A (en) 1993-01-11

Family

ID=8532879

Family Applications (1)

Application Number Title Priority Date Filing Date
FI913357A FI913357A (en) 1991-07-10 1991-07-10 FOERFARANDE OCH FORM FOER FRAMSTAELLNING AV EN STRAENGSPRUTAD ELEKTRONIKMODUL

Country Status (2)

Country Link
FI (1) FI913357A (en)
WO (1) WO1993001616A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG98012A1 (en) * 1999-12-23 2003-08-20 Esec Trading Sa Method for making a plastic object, in particular a multimedia card
FR2806343A1 (en) * 2000-03-16 2001-09-21 Markage Encapsulated electronic assemblies use in vehicle, made by single injection molding step, are retained in mold so injected material strikes assembly directly

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD152025A1 (en) * 1980-07-07 1981-11-11 Wolfgang Beck SUBSTRATE FOR PRINTED CIRCUITS WITH INSERTED SEMICONDUCTOR CHIPS
EP0257681A3 (en) * 1986-08-27 1990-02-07 STMicroelectronics S.r.l. Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby
FR2609821B1 (en) * 1987-01-16 1989-03-31 Flonic Sa METHOD FOR REALIZING MEMORY CARDS AND CARDS OBTAINED BY THE IMPLEMENTATION OF SAID METHOD
JP2559834B2 (en) * 1989-01-12 1996-12-04 三菱電機株式会社 IC card
JPH0687484B2 (en) * 1989-04-06 1994-11-02 三菱電機株式会社 IC card module
GB8911607D0 (en) * 1989-05-19 1989-07-05 Emi Plc Thorn A method of encapsulation for electronic devices and devices so encapsulated

Also Published As

Publication number Publication date
FI913357A (en) 1993-01-11
WO1993001616A1 (en) 1993-01-21

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Legal Events

Date Code Title Description
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