FI913357A0 - Foerfarande och form foer framstaellning av en straengsprutad elektronikmodul. - Google Patents
Foerfarande och form foer framstaellning av en straengsprutad elektronikmodul.Info
- Publication number
- FI913357A0 FI913357A0 FI913357A FI913357A FI913357A0 FI 913357 A0 FI913357 A0 FI 913357A0 FI 913357 A FI913357 A FI 913357A FI 913357 A FI913357 A FI 913357A FI 913357 A0 FI913357 A0 FI 913357A0
- Authority
- FI
- Finland
- Prior art keywords
- straengsprutad
- elektronikmodul
- foer framstaellning
- foerfarande och
- form foer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI913357A FI913357A (fi) | 1991-07-10 | 1991-07-10 | Foerfarande och form foer framstaellning av en straengsprutad elektronikmodul |
FI923199A FI94572C (fi) | 1991-07-10 | 1992-07-10 | Menetelmä ja muotti ruiskupuristetun elektroniikkamodulin valmistamiseksi |
PCT/FI1992/000214 WO1993001616A1 (en) | 1991-07-10 | 1992-07-10 | Method and mould for the manufacture of an injection moulded electronics module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI913357A FI913357A (fi) | 1991-07-10 | 1991-07-10 | Foerfarande och form foer framstaellning av en straengsprutad elektronikmodul |
Publications (2)
Publication Number | Publication Date |
---|---|
FI913357A0 true FI913357A0 (fi) | 1991-07-10 |
FI913357A FI913357A (fi) | 1993-01-11 |
Family
ID=8532879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI913357A FI913357A (fi) | 1991-07-10 | 1991-07-10 | Foerfarande och form foer framstaellning av en straengsprutad elektronikmodul |
Country Status (2)
Country | Link |
---|---|
FI (1) | FI913357A (fi) |
WO (1) | WO1993001616A1 (fi) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG98012A1 (en) * | 1999-12-23 | 2003-08-20 | Esec Trading Sa | Method for making a plastic object, in particular a multimedia card |
FR2806343A1 (fr) * | 2000-03-16 | 2001-09-21 | Markage | Procede de protection d'une etiquette electronique par surmoulage |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD152025A1 (de) * | 1980-07-07 | 1981-11-11 | Wolfgang Beck | Substrat fuer gedruckte schaltungen mit eingesetzten halbleiterchips |
EP0257681A3 (en) * | 1986-08-27 | 1990-02-07 | STMicroelectronics S.r.l. | Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby |
FR2609821B1 (fr) * | 1987-01-16 | 1989-03-31 | Flonic Sa | Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede |
JP2559834B2 (ja) * | 1989-01-12 | 1996-12-04 | 三菱電機株式会社 | Icカード |
JPH0687484B2 (ja) * | 1989-04-06 | 1994-11-02 | 三菱電機株式会社 | Icカード用モジュール |
GB8911607D0 (en) * | 1989-05-19 | 1989-07-05 | Emi Plc Thorn | A method of encapsulation for electronic devices and devices so encapsulated |
-
1991
- 1991-07-10 FI FI913357A patent/FI913357A/fi not_active Application Discontinuation
-
1992
- 1992-07-10 WO PCT/FI1992/000214 patent/WO1993001616A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO1993001616A1 (en) | 1993-01-21 |
FI913357A (fi) | 1993-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD | Application lapsed |