KR100194361B1 - PCB Clamp Device of Package Molding Mold for BGA Semiconductor Package - Google Patents

Abstract

The present invention relates to a PCB clamp device of a package molding mold for a BGA semiconductor package, wherein the thickness variation of the PCB 41 of the BGA semiconductor package is different, and wire bonding of raw materials having different thickness specifications is completed according to each type of semiconductor package. After the top mold insert (TCI) equipped with the PCB 41, which is supplied to the bottom mold (BM) to the top mold (TM) for molding the package 45 in a predetermined shape from the molding die of the transfer molding apparatus (TS) In the clamp pressurization, the height of the top cavity insert (TCI) and the height of the top cavity insert (TCI) can be adjusted so that the clamp pressure can be appropriately clamped against different thicknesses and deviations of the PCB 41. It includes a clamp control member 20 that can be adjusted, and a fastening member 30 for detachably fixing the top cavity insert (TCI) and the clamp control member 20 according to the imbalanced pressure of the PCB during package molding Prevent the short defect of the wires according to the hand and prevent deformation, the effect of improving the moldability of the package.

Description

PCB Clamp Device of Package Molding Mold for BGA Semiconductor Package

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PCB clamp device of a package molding mold for a BGA semiconductor package. In particular, a printed circuit board (PCB), which is a raw material of a ball grid array (BGA) semiconductor package having a different thickness, is supplied to a package molding mold. Clamp adjustment that adjusts the height of the top cavity insert so that the top cavity insert provided in the top mold can clamp the PCBs with different thickness and different thickness specifications. The present invention relates to a PCB clamp device of a package molding die for a BGA semiconductor package having a member.

In general, BGA semiconductor packages have been developed to complement the function and quality of the high integration limits of Fine Pitch and Pin Grid Arrays. It prevents damage, minimizes the size of the volume, has excellent electrical and thermal properties, excellent package yield, excellent substrate assembly yield, and the expansion of multichip modules and minimizes the cycle from design to production. It has advantages.

Therefore, it is easy to be applied to various electronic peripheral machines required for diversity and miniaturization according to the improved quality reliability of the highly integrated BGA semiconductor package, and it is possible to obtain high value-added products with high price competitiveness.

The BGA semiconductor package includes a lead and a mounting plate in a lead frame on the PCB to have a larger number of highly integrated circuits, a semiconductor chip is attached to the mounting plate, and wires are formed on lands formed on the circuits of the semiconductor chip and the leads of the substrate. Is bonded and bonded to the metal layer of the substrate so that the circuit of the semiconductor chip can be connected to the ball.

In the PCB, a plane layer is provided on both sides of epoxy, an epoxy layer is provided on the outside of the plane layer, and a signal layer is provided on the outside of the epoxy layer. The solder mask (Solder Mask) layer is provided to enable the PCB to be provided in multiple layers of thin thin plates.

Therefore, PCB raw material purchased in the manufacture of BGA semiconductor package has a great variation in PCB thickness due to the difficulty of maintaining flatness in the process of laminating each layer and the application of solder plate layer. It is put into the manufacturing process.

PCB with uneven thickness and flatness is attached with semiconductor chip in die attach process and wire bonding between semiconductor chip and lead in wire bonding process. In order to prevent external exposure and to protect the internal circuit components and functional properties, some form of package molding is performed in the molding process.

In the above molding process, after supplying the PCB on the bottom mold having a cavity capable of molding the package, the bottom mold (BM) is raised to clamp the PCB, and then, the compound material is filled and supplied to complete the package. This completed material was used to obtain a complete BGA semiconductor package by fusing and installing a plurality of solder balls in the solder mask formed on the substrate in the solder ball mounting process.

Referring to the conventional embodiment of the BGA semiconductor package is completed through this process as shown in Figure 10, the top center block (TB) is provided in the center of the lower housing (H) of the top mold (TM), the top center A seating part 10 having recesses is formed in both longitudinal directions of the block TB, and holes 11 are formed in a plurality of upper positions of the seating part 10, and each seating side of the top center block TB is seated. A top cavity insert (TCI) having a fastening hole 12 corresponding to the hole 11 is inserted into the part 10, and a fastening member (cable) is formed in the hole 11 and the fastening hole 12 of the housing H. 30) to allow the top cavity insert (TCI) to be installed on the seating portion 10 formed under the housing (H) of the top mold (TM), the housing (H) of the top mold (TM) The top drive plate DP is provided with a plurality of fastening members B in the upper portion.

The bottom mold (BM) is provided below the top mold (TM), and the center of the bottom mold (BM) is a bottom center block (BB) and a bottom center block (BB) having a port (P) and a runner (R). A bottom cavity insert (BCI) having a plurality of cavities (CA) on both sides is provided.

When the top mold (TM) and the bottom mold (BM) is provided in the transfer molding apparatus (TS) and the PCB 41 material provided with the supply unit (In) is supplied on the bottom mold (BM) by the operation of the transfer unit (F) The bottom mold (BM) is raised to enable the cavity molding according to the resin material supply of the compound material in the state in which the PCB 41, which is the BGA semiconductor package material, is clamped.

The top cavity insert (TCI) has a step (t) corresponding to the thickness (t1) of the PCB 41 when pressing the upper surface of the PCB 41 is placed in the bottom mold (BM) and the top center block (TB) The clamping pressing force of the PCB 41 was smoothed by forming the upper side from the lower surface of the housing (H).

However, the top cavity insert (TCI) is fixedly installed in the housing (H) irrespective of the thickness (t) of the PCB 41 to be package-molded to join the top mold (TM) according to the rise of the bottom mold (BM) The pressing force is made to be greatly different according to the thickness deviation and thickness of the PCB 41 is clamped in the time cavity insert (TCI) (BCI).

Therefore, cracks are generated by severely deforming the solder mask layer SL, which is the skin layer of the PCB 41, due to the clamping pressure imbalance applied to the PCB 41.

In addition, deformation of the PCB 41 located in the air vent AV formed of the bottom cavity insert BCI occurs by clamping pressure, thereby connecting the circuit pattern 42 and the semiconductor chip 43 in the PCB 41. As shown in FIG. 11, the wire 44 is severely deformed, and thus, a wire sweeping defect such as a short is generated, and an increase in the internal air pressure of the cavity CA during package molding causes an increase in the runner gate RG. The package 45 of the air vent AV on the opposite side has a defect such as a void or a blister.

The conventional techniques described above are fixed to the top cavity insert provided in the top mold of the BGA semiconductor package while maintaining a stepped distance, so that the pressing force clamped when forming a package of a PCB having a different thickness variation is different on the PCB. As it occurs differently, there were problems such as deformation and crack generation of the PCB due to the clamping pressure imbalance, short circuit of the circuit pattern, wire short, wire sweeping, and molding defects such as voids or blisters of the package.

The present invention has been invented to solve the above conventional problems, the thickness variation is different by providing a clamp adjusting member that can adjust the height of the top cavity insert provided in the transfer molding apparatus for package molding the BGA semiconductor package In addition, it is an object to improve the package formability of the BGA semiconductor package by enabling the clamping pressing force of PCBs having different thicknesses to be appropriately performed.

1 is a schematic structural diagram of a BGA semiconductor package forming system of the present invention;

Figure 2 is an exploded perspective view of the BGA semiconductor package molding die of the present invention.

Figure 3 is a cross-sectional view of the top mold for molding the BGA semiconductor package of the present invention.

Figure 4 is an enlarged view of portion A of Figure 3 of the present invention.

Figure 5 is a perspective view of the clamp adjustment member to adjust the height of the cavity insert installation of the top mold for pressing the PCB according to the PCB thickness of the BGA semiconductor package supplied to the bottom mold of the present invention.

Figure 6 is a mold cross-sectional structure of the state in which the BGA semiconductor package is package-molded by the clamp adjustment member of the present invention.

Figure 7 is a perspective view of the BGA semiconductor package material package completed by the clamp adjustment member of the present invention.

FIG. 8 is an enlarged view of a portion B of FIG. 7 of the present invention, showing a state of a BGA semiconductor package material. FIG.

Figure 9 is a PCB cross-sectional view of a typical BGA semiconductor package.

10 is a cross-sectional view of a conventional molding mold.

Figure 11 is an internal structure of the package-molded BGA semiconductor package in a conventional molding die.

* Explanation of symbols for main parts of the drawings

TS: Transfer Molding Device TM: Top Mold

TCI: Top cavity insert H: Housing

10: settlement 11: hole

12: fastening hole 20: clamp adjustment member

21: through hole 30: fastening member

40: BGA semiconductor package 41: PCB

Hereinafter, the configuration of the present invention will be described.

The thickness of the PCB 41 of the BGA semiconductor package is different, and after completion of wire bonding of raw materials having different thickness specifications according to each kind of semiconductor package, the package 45 is formed in a predetermined form from a molding mold of the transfer molding apparatus TS. In the clamping of the top cavity insert (TCI) provided in the top mold (TM) to the PCB 41 supplied to the bottom mold (BM) for molding,

A top cavity insert (TCI), the height of which can be adjusted to properly clamp pressure against different thicknesses and deviations of the PCB 41, and a clamp adjusting member (20) to adjust the height of the top cavity insert (TCI). ), And a fastening member 30 for detachably fixing the top cavity insert (TCI) and the clamp control member 20.

One embodiment of the present invention as described above will be described in detail with reference to the accompanying drawings.

1 is a structural diagram of a transfer molding apparatus TS for forming a package 45 of a BGA semiconductor package 10 of the present invention, and a supply unit In which a PCB 41 of a molded material may be supplied to one side thereof. And the other side is provided with a guide portion (G) and the transport portion (Out) for accommodating the package-shaped product on the other side is provided, and the upper portion (G) of the supply portion (In) of the transfer portion (F) And the bottom of the center of the guide portion (G) is provided with a bottom mold (BM) and the top mold (TM) on the top.

In the supply unit (In), wire-bonded PCB 41 is stacked in a multi-layer, and the transfer unit (F) is sequentially on the bottom mold (BM) through the guide (G) to the PCB 41 in the supply unit (In) In the center bottom mold (BM) to form a cavity 45 for molding a package of a predetermined shape on the PCB 41, the top mold (TM) is supplied to the bottom mold (BM) It is provided with a top cavity insert (TCI) for clamping the PCB 41.

2 is an exploded view of a mold for molding the package 45 in the BGA semiconductor package material of the present invention, and the bottom center block CB and the bottom cavity insert BCI are stored in the center left and right directions of the bottom mold BM. Forming a settled portion (10 ') to be settled into the groove, the center of the settled portion (10') is provided with a bottom center block (BB), both sides of the bottom center block (BB) and a plurality of cavities (CA) and Install bottom cavity insert (BCI) with runner gate (RG) at one corner of each cavity (CA) and air vent (AV) at the other edge, and bottom center block (BB) and each bottom cavity insert (BCI) The left and right both ends of the settled portion (10 ') is fixed to the end block (EB) with a fastening member (B).

The top mold TM provided at the upper portion of the bottom mold BM forms a settling portion 10 having a recess upward in the lower center length direction of the housing H to form a top in the center of the settling portion 10. The center block (TB) is provided, and on both sides of the top center block (TB), the top center block (TB) and the clamp adjusting member 20 are installed therein, the top center block (TB) and the top cavity insert (TCI). Top end block (EB) is installed as a fastening member (B) at both ends of the settlement portion 10), and the top drive plate (DP) is provided at the upper portion of the housing (H).

FIG. 3 is a cross-sectional structural view of the top mold TM according to the present invention, in which the top center block TB is equilibrated with the lower surface of the housing H at the center of the settling portion 10 formed at the lower center of the housing H. It is provided to have one side, and the top cavity insert on both sides of the top center block (TB) so that a step (t) of a predetermined interval can be formed above the bottom surface of the top of the housing (H) and the lower surface of the center block (TB). (TCI) and the clamp adjustment member 20 is installed in a stack.

The clamp adjusting member 20 is provided on the top cavity insert (TCI), a plurality of fastening holes 12 formed on the top of the top cavity insert (TCI) and the hole (11) corresponding to the housing (H) and The through-hole 21 communicating with each other is formed to be fixedly installed by the fastening member 30 fastened at the upper portion of the housing (H).

The clamp adjusting member 20 installed on the top cavity insert TCI clamps the PCB 41 having a different thickness t1 according to the type of BGA semiconductor package 40 placed in the bottom mold BM. To be able to apply a variety of thickness (t2) to be applied.

The top cavity insert (TCI) is the bottom surface and the top of the housing (H) by the thickness (t2) of the PCB 41 so as not to apply excessive pressure to the upper portion of the PCB 41 placed in the bottom mold (BM) As shown in Figure 4 from the lower surface of the center block (TC) is provided with a step (t) of a predetermined interval.

5 is a perspective view of the clamp adjustment member 20 of the present invention, a plurality of through-hole 21 is formed in the rectangular clamp adjustment member 20 to communicate with the hole 21 formed in the housing (H).

The clamp adjusting member 20 is provided with various types of thickness t1 so that clamping pressure of the PCB 41 having different thickness standards can be easily performed according to the type of BGA semiconductor package 40 to be packaged. To use it.

6 is a cross-sectional view of a mold in a state in which a BGA semiconductor package is package-molded by the clamp adjusting member of the present invention, wherein the PCB 41 packaged on the bottom mold BM of the transfer molding apparatus TS is placed. The top mold (TM) is lowered on the upper part and joined to the bottom mold (BM), and the cavity insert (TC) of the top mold (TM) is compounded into the cavity (CA) while the clamping presses the PCB 41. The package 45 is molded by supplying the resin material of the ash.

The top mold (TM) has a top cavity insert (TCI) is provided with a step (t) of a predetermined interval upward from the lower surface of the housing (H) and the top center block (TB) by the clamp adjusting member (20). There is a clamp pressure of the PCB (41) is not made forcibly.

7 is a perspective view of a semiconductor package 40 in which package molding of the present invention is completed, in which packages 45 are formed in a plurality of integrated circuit units provided on one PCB 41 unit.

FIG. 8 is an enlarged view of a portion B of the present invention, wherein the molding of the package 45 is completed in the top mold (TM) and the bottom mold (BM) provided with the clamp adjusting member 20. FIG. In the state where the clamping force of the PCB 41 is properly made, the wire 44 between the semiconductor chip 43 and each circuit pattern 42 of the finished product is kept even without deformation, thereby obtaining a good product. It is.

This is because the top cavity insert (TCI) of the top mold (TM), which is supplied to the bottom mold (BM) when the package 45 is formed, clamps the PCB 41 most appropriately by adjusting the installation height of the clamp adjusting member 20. By maintaining in a pressurized condition, it prevents wire sweeping defects such as cracks and shorts due to deformation prevention of the PCB 41, and air is supplied by the supply pressure filled in the cavity 45 when the package 45 is formed. It can be easily discharged to the air vent (AV) to prevent the package molding defects, such as voids and blisters of the package 45.

FIG. 9 is a structural diagram illustrating a PCB 41 of a general BGA semiconductor package 45, in which a variation in thickness t1 of a PCB 41, which is a raw material, is configured differently, and the PCB 41 is a bottom mold (BM). After supplying to the upper mold (TM), when the clamping of the top cavity insert (TCI) according to the joining of the top mold (TM) by the clamp adjusting member 20 to the above-mentioned PCB 41 to form a good package 45 and the product Do it.

As described above, the present invention provides a package molding of a BGA semiconductor package by including a clamp adjusting member that can adjust a height of a top cavity insert for clamping and pressing a PCB to a top mold, which is a molding mold of a transfer molding apparatus for package molding a BGA semiconductor package. It prevents wire sweeping defects such as shorts and damages by preventing deformation due to imbalanced pressurization of PCBs, and prevents package defects such as voids and blisters, thereby improving package forming workability of BGA semiconductor packages.

Claims (7)

The thickness of the PCB 41 of the BGA semiconductor package is different, and after completion of wire bonding of raw materials having different thickness specifications according to each kind of semiconductor package, the package 45 is formed in a predetermined form from a molding mold of the transfer molding apparatus TS. When the top cavity insert TCI provided on the top mold TM clamps the PCB 41 which is supplied to the bottom mold BM for molding, the thickness and the deviation of the PCB 41 are different. A top cavity insert (TCI) capable of adjusting the clamp pressure appropriately with respect to the clamp, a clamp adjusting member (20) for adjusting the height of the top cavity insert (TCI), and the top cavity insert (TCI); PCB clamp device of the package molding mold for BGA semiconductor package, characterized in that it comprises a fastening member 30 for fixing the clamp adjusting member 20 detachably. The BGA semiconductor according to claim 1, wherein the top cavity insert (TCI) is installed on a lower surface of the clamp adjusting member (20) installed in the settling portion (10) formed in the housing (H) of the top mold (TM). PCB clamp device of package molding mold for package. The method of claim 1, wherein the clamp adjustment member 20 and the top cavity insert (TCI) is formed by forming a plurality of through holes 21 and fastening holes 12 corresponding to the holes 11 formed in the housing (H) PCB clamp device of the package molding mold for BGA semiconductor package, characterized in that the fixing member 30 is fixed. The lower surface of the cavity insert (CA) installed in the housing (H) mounting portion 10 of the top mold (TM) is the housing (H) and the center block (TB). PCB clamping device of the package molding mold for BGA semiconductor package, characterized in that the step (t) of a predetermined interval is installed to be formed above the lower surface of the. [5] The PCB clamp device of claim 4, wherein the step (t) is formed in the size of the thickness area of the PCB 41 to be packaged. The package for the BGA semiconductor package according to claim 1, wherein the clamp adjustment member 20 is packaged and can be used to replace the clamp to appropriately press the clamp according to the thickness t of the PCB 41. PCB clamp device of molding mold. 7. The BGA according to claim 6, wherein the clamp adjusting member (20) is detachably provided with various types having different thicknesses (t2) so as to correspond to the thickness (t) of the PCB (41). PCB clamp device of package molding mold for semiconductor package.