CN111216301B

CN111216301B - Molding die, resin molding device, and method for manufacturing resin molded article

Info

Publication number: CN111216301B
Application number: CN201910939827.1A
Authority: CN
Inventors: 高丈明; 荒木宏祐
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2018-11-26
Filing date: 2019-09-29
Publication date: 2022-04-01
Anticipated expiration: 2039-09-29
Also published as: KR102259427B1; KR20200062023A; JP7018377B2; JP2020082509A; CN111216301A; TW202019657A

Abstract

The invention provides a mold capable of preventing or suppressing the relaxation, wrinkle, etc. of a mold release film. The mold 1000 includes one mold 100 and another mold 200, wherein the one mold 100 is a mold having a cavity 100A formed in a mold surface and a release film 40 adsorbed to the mold surface, the one mold 100 includes one mold pressing member 103, the one mold pressing member 103 is movable in a mold opening/closing direction, the other mold 200 includes another mold pressing member 203, the other mold pressing member 203 is movable in the mold opening/closing direction, and the one mold pressing member 103 and the other mold pressing member 203 can sandwich and hold the release film 40 and apply tension to the release film 40.

Description

Molding die, resin molding device, and method for manufacturing resin molded article

Technical Field

The present invention relates to a mold, a resin molding apparatus, and a method for manufacturing a resin molded product.

Background

In resin molding using a mold, a mold surface of the mold is covered with a release film to perform resin molding. In this case, a mold is provided with a suction groove for suppressing the relaxation, the wrinkle, and the like of the release film (patent document 1).

Prior art documents:

patent document

Patent document 1: japanese laid-open patent publication No. 2000-299334

Disclosure of Invention

Problems to be solved by the invention

The release film may be of various materials and thicknesses. When the types of release films are different, the properties such as thermal expansion coefficient, tensile strength, and tensile elongation may be different. For example, a release film having a large thermal expansion coefficient, tensile elongation, or the like is easily stretched. In the case of using a release film which is easily stretched, there is a possibility that the release film cannot be suppressed from sagging, wrinkling, or the like simply by being sucked to a mold.

Accordingly, an object of the present invention is to provide a molding die, a resin molding apparatus, and a method for producing a resin molded product, which can suppress or prevent the release film from sagging or wrinkling.

Means for solving the problems

In order to achieve the object, the present invention provides a mold for molding a semiconductor device,

comprising a mould and a further mould,

the mold is a mold in which a cavity is formed on the surface of the mold and a release film is adsorbed on the surface of the mold,

the one die includes a die pressing member,

the one die pressing member is movable in the opening and closing direction of the forming die,

the other die comprises another die pressing member,

the other mold pressing member is movable in the mold opening/closing direction,

the release film can be sandwiched and held between the one film pressing member and the other film pressing member, and tension can be applied to the release film.

The resin molding apparatus of the present invention includes the mold of the present invention.

The method for producing a resin molded article of the present invention is a method for producing a resin molded article using the mold of the present invention or the resin molding apparatus of the present invention, and includes:

a mold release film mounting step of mounting a mold release film on the molding die;

a mold release film adsorption step of adsorbing a mold release film on a mold surface of the molding die;

a tension applying step of applying tension to the release film; and

a resin molding step of molding a resin with the mold by the mold die in a state where the mold surface adsorbs the release film,

in the tension applying step, tension is applied to the release film in a state where the release film is sandwiched and held by the one film pressing member and the other film pressing member,

in the resin molding step, resin molding is performed between the mold surface of the one mold and the mold surface of the other mold in a state where the mold release film is adsorbed.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, a mold, a resin molding apparatus, and a method for producing a resin molded article, which can suppress or prevent the relaxation, wrinkle, or the like of a release film, can be provided.

Drawings

FIG. 1 is a sectional view illustrating a structure of a molding die according to the present invention.

Fig. 2 is a sectional view showing a step in an example of a method for producing a resin molded article of the present invention using the mold shown in fig. 1.

Fig. 3 is a sectional view showing another step in the same method of manufacturing the resin molded article as in fig. 2.

Fig. 4 is a sectional view showing a further step in the same method of manufacturing the resin molded article as in fig. 2.

Fig. 5 is a sectional view showing a further step in the same method of manufacturing the resin molded article as in fig. 2.

Fig. 6 is a sectional view showing a further step in the same method of manufacturing the resin molded article as in fig. 2.

Fig. 7 is a sectional view showing a further step in the same method of manufacturing the resin molded article as in fig. 2.

Fig. 8 is a sectional view showing a further step in the same method of manufacturing the resin molded article as in fig. 2.

Fig. 9 is a sectional view showing a further step in the same method of manufacturing the resin molded article as in fig. 2.

Fig. 10 is a sectional view showing a further step in the same method of manufacturing the resin molded article as in fig. 2.

Fig. 11 is a sectional view showing a further step in the same method of manufacturing the resin molded article as in fig. 2.

FIG. 12 is a sectional view showing a step in another example of the structure of the molding die of the present invention and an example of a method for producing a resin molded article using the molding die.

Fig. 13 is a sectional view showing another step in the same method of manufacturing the resin molded article as in fig. 12.

Fig. 14 is a sectional view showing a further step in the same method of manufacturing the resin molded article as in fig. 12.

Fig. 15 is a diagram illustrating a structure of one of the molding dies of the present invention. Fig. 15(a) is a plan view, and fig. 15(b) is a sectional view.

Fig. 16 is a sectional view showing a step in another example of the method for producing a resin molded article according to the present invention.

Fig. 17 is a sectional view showing a step in another example of the method for producing a resin molded article according to the present invention.

Fig. 18 is a sectional view showing a step in another example of the method for producing a resin molded article according to the present invention.

FIGS. 19(a) and (b) are sectional views showing still another example of the structure of the molding die of the present invention.

FIG. 20 is a plan view showing an example of the structure of the resin molding apparatus according to the present invention.

Detailed Description

Hereinafter, the present invention will be described in detail by way of examples. However, the present invention is not limited to the following description.

In the molding die of the present invention, for example, the one die may be a lower die and the other die may be an upper die. For example, the one die may be an upper die and the other die may be a lower die.

In the molding die of the present invention, for example, the other die may be attached to another die base member, and the other die pressing member may be movable in the molding die opening/closing direction with respect to the other die base member.

In the molding die of the present invention, for example, the one die may include a side member and a bottom member, and the cavity may be formed by a space surrounded by the side member and the bottom member.

The mold of the present invention may further comprise, for example, a 1 st elastic member, and the one mold pressing member may be movable in the mold opening/closing direction by the expansion and contraction of the 1 st elastic member.

The mold of the present invention may further comprise, for example, a 2 nd elastic member, and the other mold pressing member may be moved in the mold opening/closing direction by the expansion and contraction of the 2 nd elastic member.

The mold of the present invention may further comprise, for example, a 1 st elastic member and a 2 nd elastic member, wherein the one mold pressing member is movable in the mold opening/closing direction by expansion and contraction of the 1 st elastic member, the other mold pressing member is movable in the mold opening/closing direction by expansion and contraction of the 2 nd elastic member, and a spring constant of the 2 nd elastic member is larger than a spring constant of the 1 st elastic member. In this case, for example, the one mold may include a side member, a bottom member, and a 3 rd elastic member, the cavity may be formed by a space surrounded by the side member and the bottom member, the 3 rd elastic member may have a spring constant larger than that of the 2 nd elastic member, and the side member may be moved in the mold opening and closing direction by expansion and contraction of the 3 rd elastic member.

In the mold of the present invention, for example, the 1 st elastic member may be replaced with an elastic member having a different length in the mold opening/closing direction.

In the mold of the present invention, for example, the one mold pressing member may be movable in the mold opening/closing direction with respect to the side member.

In the mold of the present invention, for example, the one mold may further include a piping member, the one mold pressing member may include an adsorption hole for adsorbing the release film, and the piping member may include a through hole communicating with the adsorption hole, and the piping member may be movable in the mold opening/closing direction together with the one mold pressing member. In this case, for example, the suction hole may have a groove shape surrounding the entire periphery of the cavity.

In the mold of the present invention, for example, a tensile force can be applied to the release film in a state where the one mold and the other mold are brought close to each other, as compared with a case where the release film is attached to the one mold.

The mold of the present invention may further comprise a driving unit, for example, and the other mold pressing member may be moved in the mold opening/closing direction by the driving unit.

In the method for producing a resin molded product of the present invention, for example, in the tension applying step, tension can be applied to the release film in a state where the one mold and the other mold are brought closer to each other than in the release film attaching step.

The method for producing a resin molded article of the present invention includes the release film mounting step, the release film suction step, the tension applying step, and the resin molding step, as described above, but may include any other steps. The order of performing the steps is not particularly limited, and may be any order.

In the present invention, "resin molding" is not particularly limited, and for example, although a component such as a chip may be resin-encapsulated, only resin molding may be performed without resin encapsulation. Similarly, in the present invention, the "resin molded article" is not particularly limited, and may be, for example, a resin molded article (product, semi-product, or the like) in which a component such as a chip is resin-encapsulated, or a product or semi-product in which only a resin is resin-molded without resin-encapsulation. In the present invention, the "resin molded article" may be a resin molded article (product or semi-product) itself, but may be a resin molded article in the middle of a method for producing a resin molded article. For example, the "resin molded article" may be a resin molded article after the resin molding step and before the mold releasing step.

In the present invention, the "resin molding" may be performed by resin molding one or both surfaces of the object to be molded, for example. However, the present invention is not limited to this, and for example, only resin molding may be performed without using a molding object. Further, for example, although a component such as a chip fixed to one surface or both surfaces of the object to be molded may be resin-molded, only one surface or both surfaces of the object to be molded may be resin-molded without resin-molding the component.

In the present invention, the "object to be molded" is, for example, a substrate.

In the present invention, the method of "resin molding" is not particularly limited as long as it is a method of resin molding using a release film, and may be compression molding, for example, transfer molding, extrusion molding, or the like.

In the present invention, "resin molding" means, for example, a state in which a resin is cured (hardened) to cure the resin molding. The hardness of the cured resin is not particularly limited, and may be, for example, a degree to which the cured resin is not deformed or a degree necessary for protecting a chip encapsulated by the resin, regardless of the magnitude of the hardness. Also, in the present invention, the curing (hardening) of the resin is not limited to a state in which the resin is completely cured (hardened), but may be a state in which it is further curable.

In the present invention, "placing" includes "fixing".

In general, "electronic component" may refer to a chip before resin-packaging and a state in which the chip is resin-packaged, but in the present invention, a case of merely referring to "electronic component" means an electronic component in which the chip is resin-packaged (an electronic component as a finished product) unless otherwise specified. Specifically, the "chip" in the present invention includes, for example, chips of passive elements such as resistors, capacitors, and inductors, semiconductor chips such as diodes, transistors, Integrated Circuits (ICs), and semiconductor elements for power control, and chips such as sensors and filters. In the present invention, the resin-encapsulated component is not limited to a chip, and may be at least one of a chip, a lead, a bump (bump), an electrode, a wiring pattern, and the like, or may include a component that is not in the form of a chip.

The substrate (also referred to as a frame or an interposer) to be molded by resin molding in the resin molding apparatus or the resin molding method according to the present invention is not particularly limited, and may be, for example, a lead frame, a wiring board, a semiconductor wafer such as a silicon wafer, a ceramic substrate, a metal substrate, or the like, or may be, for example, a circuit board such as a printed circuit board (circuit board). When such a molding object is resin-molded, the resin molding may be particularly referred to as "resin encapsulation". In the present invention, "resin molding" includes "resin encapsulation", and for example, only one surface of the substrate may be resin molded, or both surfaces may be resin molded. The substrate may be a mounting substrate having a chip mounted on one surface or both surfaces thereof, or may be a wiring-only substrate, for example. The mounting method of the chip is not particularly limited, and for example, wire bonding, flip chip bonding, and the like can be exemplified. In the present invention, for example, an electronic component in which a chip is resin-encapsulated can be manufactured by resin-encapsulating one or both surfaces of a mounting substrate.

Further, according to the resin molding apparatus or the resin molding method of the present invention, the use of the resin-molded substrate is not particularly limited. Examples of the use of the substrate include a power control module substrate, a high-frequency module substrate for a mobile communication terminal, an engine control substrate for a transportation device, a motor control substrate, and a drive system control substrate. The shape of the substrate may be any shape and form as long as it can be molded, and for example, a substrate whose plane is regarded as rectangular or circular may be used.

In the present invention, the "resin molded article" is not particularly limited, and may be an electronic component in which a chip is resin-encapsulated by compression molding or the like, for example. The "resin molded article" of the present invention may be an intermediate product used for manufacturing a single or a plurality of electronic components such as a semiconductor product and a circuit module, for example. The "resin molded article" of the present invention is not limited to the electronic component in which the chip is resin-encapsulated and the intermediate product thereof, and may be other resin molded products.

In the present invention, the resin material (resin used for resin molding) is not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. Further, the resin composition may be a composite material partially containing a thermosetting resin or a thermoplastic resin. Examples of the form of the resin to be supplied to the resin sealing apparatus include granular resin, flowable resin, sheet resin, plate resin, and powdery resin.

In the present invention, the "flowable resin" is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. Further, in the present invention, "liquid" means having fluidity at normal temperature (room temperature) and flowing according to a force, and does not relate to the level of fluidity, in other words, the degree of viscosity. That is, in the present invention, the "liquid resin" refers to a resin that has fluidity at normal temperature (room temperature) and flows according to a force. In the present invention, the "molten resin" means a resin that is melted by heating to be in a liquid state or a state having fluidity. The form of the molten resin is not particularly limited, and may be, for example, a form capable of being supplied to a cavity of a mold.

In the present invention, the molding die is not particularly limited, and may be, for example, a metal die, a ceramic die, or the like.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For convenience of explanation, the drawings are schematically illustrated with appropriate omission, exaggeration, and the like.

[ example 1 ]

In the present example, an example of the resin molding apparatus of the present invention, a method for peeling off a release film of the present invention using the same, and an example of a method for producing a resin molded product of the present invention are shown.

An example of the structure of the molding die of the present invention is schematically shown in the cross-sectional view of fig. 1. In the drawings, as described later, base members (upper and lower die base members) to which a mold is attached are also shown. As shown, the molding die 1000 includes a lower die 100 and an upper die 200. The lower die 100 corresponds to "one die" of the present invention, and the upper die 200 corresponds to "the other die" of the present invention. The lower mold 100 is a mold in which a release film is adsorbed on the mold surface, as described later.

The lower mold 100 includes a lower mold side member 101 and a lower mold bottom member 102. The lower mold side member 101 corresponds to a "side member" in "one mold" of the present invention. The lower mold bottom member 102 corresponds to a "bottom member" in "one mold" of the present invention. The lower mold side member 101 is disposed so as to surround the lower mold bottom member 102. A cavity 100A is formed in the mold surface of the lower mold 100 as shown in the figure by a space surrounded by the lower mold side member 101 and the lower mold bottom member 102. The lower mold bottom member 102 is fixed to the upper surface of the lower mold base member 110. Lower die base member 110 corresponds to "one die base member". The lower die side member 101 is connected to the upper surface of the lower die base member 110 via a 3 rd elastic member 101 s. Further, the lower die base member 110 is formed of an upper lower die base upper member 110A (one die base upper member) and a lower die base lower member 110B (one die base lower member). The lower die side member 101 is movable in the mold opening/closing direction (vertical direction on the paper in the figure) by the expansion/contraction of the 3 rd elastic member 101 s. The lower mold base member 110 and the lower mold bottom member 102 have through holes 100B. The through-hole 100B penetrates from the lower surface to the upper surface of the lower mold base member 110, and further penetrates from the lower surface to the side surface of the lower mold bottom member 102. The through hole 100B communicates the gap between the lower mold side member 101 and the lower mold bottom member 102. As described later, the release film can be sucked to the mold surface of the lower mold 100 by suction from the through hole 100B.

The lower die 100 further includes a lower die film pressing member (one die film pressing member) 103, and a 1 st elastic member 103 s. The lower mold film pressing member 103 is fixed to the side opposite to the upper mold 200 of the portion of the peripheral edge portion of the lower mold side member 101 not in contact with the mold release film by the 1 st elastic member 103 s. The lower film pressing member 103 is movable in the mold opening/closing direction (vertical direction on the paper in the figure) by the expansion and contraction of the 1 st elastic member 103 s. The lower film pressing member 103 is formed of three members, i.e., a lower film pressing upper outer member 103a, a lower film pressing lower member 103b, and a lower film pressing upper inner member 103 c. The lower end of the lower film pressing lower member 103b is connected to the 1 st elastic member 103 s. On the upper surface of the lower film pressing lower member 103b, a lower film pressing upper outer member 103a is fixed on the outer side, and a lower film pressing upper inner member 103c is fixed on the inner side. A gap between the lower film pressing upper outer member 103a and the lower film pressing upper inner member 103c forms a groove-shaped suction hole 100D for sucking the release film. Lower base lower member 110B has through hole 100C penetrating from the upper surface to the lower surface of lower base lower member 110B below suction hole 100D. As described later, the suction holes 100D communicate with the through holes 100C.

The lower mold 100 further has a piping member 104. The piping member 104 is connected to the lower film pressing lower member 103b, and penetrates from the upper end of the 1 st elastic member 103s to the lower end of the lower base upper member 110A. The pipe member 104 is movable in the mold opening/closing direction together with the lower mold pressing member 103. The piping member 104 has a through hole extending from the upper end to the lower end thereof. The upper end of the through hole of the piping member 104 communicates with the suction hole 100D of the lower film pressing member 103. The through hole of the piping member 104 communicates at its lower end with the through hole 100C of the lower die base member 110. As described later, the release film can be adsorbed to the lower film pressing member 103 of the lower mold 100 through the through hole 100C, the through hole of the pipe member 104, and the adsorption hole 100D. That is, the release film can be attached to the lower mold 100 by being adsorbed to the lower mold film pressing member 103. O rings 104O are attached to the lower die pressing member 103 and the lower die base member 110 so as to surround the pipe member 104. The O-ring 104O maintains airtightness around the pipe member 104.

The upper die 200 includes an upper die body 202, an upper die film pressing member (another die film pressing member) 203, and a 2 nd elastic member 203 s. The upper die main body 202 is positioned directly above the lower die bottom surface member 102 and the lower die side surface member 101, and is fixed to the lower surface of the upper die base member 210. The upper die base member 210 corresponds to "another die base member". As described later, the molding object may be fixed to the lower surface of the upper mold body 202. The upper film pressing member 203 is disposed so as to surround the periphery of the upper die main body 202 and be positioned directly above the lower film pressing member 103. The upper film pressing member 203 is attached to the lower end of the upper die base member 210 via a 2 nd elastic member 203 s. The upper mold pressing member 203 is movable in the mold opening/closing direction by the expansion and contraction of the 2 nd elastic member 203 s. As described later, the lower mold film pressing member 103 and the upper mold film pressing member 203 can sandwich and hold the release film, and apply tension to the release film.

In addition, the spring constant of the 2 nd elastic member 203s is larger than that of the 1 st elastic member 103s, and the spring constant of the 3 rd elastic member 101s is larger than that of the 2 nd elastic member 203 s.

The mold 1000 of fig. 1 constitutes a part of a resin molding apparatus. The resin molding apparatus may include any component not shown in the drawings in addition to the mold 1000. Specifically, for example, the resin molding apparatus may include a suction mechanism (e.g., a vacuum pump) for sucking the release film, or may include an outside air blocking member for reducing the pressure inside the mold 1000. Further, other components shown in fig. 20 described later may be included.

Fig. 2 to 11 show an example of a method for producing a resin molded product using the mold 1000 of fig. 1. First, as shown in fig. 2, a substrate (object to be molded) 10 is fixed to the lower surface of the upper mold body 202. The tool for fixing the substrate 10 is not particularly limited. For example, the substrate 10 may be fixed by using a jig (not shown) or the like. Further, through holes may be provided in the upper die main body 202 and the upper die base member 210, and the substrate 10 may be sucked and fixed from the through holes by a suction mechanism (not shown, for example, a vacuum pump) to the lower surface of the upper die main body 202. As shown in the drawing, a chip 11 and a bonding wire 12 are mounted on the lower surface of the substrate 10. However, the structure of the substrate 10 is not limited thereto. For example, any other component may be mounted in addition to or instead of the chip 11 and the bonding wires 12, or any component may not be mounted.

Next, as shown in fig. 3, the release film 40 is conveyed to a position on the mold surface of the lower mold 100 together with the resin material 20a placed thereon. Then, the release film 40 is supplied onto the mold surface of the lower mold 100, and mounting (setting) is performed (release film mounting step). Specifically, as shown in the drawing, the release film 40 is placed on the upper surfaces of the lower mold side member 101 and the lower mold film pressing member 103. The tool and method for placing the resin material 20a on the release film 40 are not particularly limited, and known tools and methods such as a feeder may be used as appropriate. The resin material 20a is a sheet-like resin in the present embodiment, but is not limited thereto, and may be a granular resin, a liquid resin, a plate-like resin, a semisolid fluid resin, or the like.

Next, as indicated by an arrow 100a in fig. 4, the inside of the through hole 100C of the lower die base member 110 is sucked by a suction mechanism (not shown, for example, a vacuum pump). By this suction, the through hole 100C, the through hole of the piping member 104 communicating therewith, and the suction hole 100D are internally depressurized. By this pressure reduction, release film 40 is sucked onto the upper surfaces of lower mold side member 101 and lower mold film pressing member 103.

Further, an O-ring 104O surrounding the pipe member 104 is disposed in a groove provided in the lower film pressing member 103 and the lower base upper member 110A. As a modification, as shown in the lower left frame of fig. 4, a groove for attaching an O-ring 104O may be provided in the pipe member 104 instead of the grooves of the lower film pressing member 103 and the lower die base member 110.

In the present embodiment, the mold 1000 is preheated and heated at all times by a heater (not shown) provided inside the mold. By the temperature rise by the preliminary heating, the resin material 20A starts to melt from the time of being placed in the cavity 100A together with the release film 40, and becomes a molten resin 20b in the end as described later. In addition, the preheating of the molding die 1000 is performed, for example, before or simultaneously with the mold release film mounting step. Further, the preliminary heating of the molding die may be started after the mold release film mounting step.

In the state of fig. 4, the release film 40 is heated by the lower mold 100 heated up. Therefore, as shown in fig. 5, the release film 40 thermally expands. At this time, slack, wrinkles, and the like appear on the release film 40.

Next, as shown by arrow Xl in fig. 6, lower die 100 is raised. Thereby, as shown in the drawing, the upper film pressing member 203 and the release film 40 are brought into contact with each other. By so doing, the release film 40 is sandwiched and held by the lower and upper

film pressing members

103 and 203.

In this state, as shown by arrow X2 in fig. 7, lower die 100 is further raised. In so doing, compressive forces are applied to the 1 st elastic member 103s, the 2 nd elastic member 203s, and the 3 rd elastic member 101s, respectively. Here, as described above, the spring constant of the 2 nd elastic member 203s is larger than that of the 1 st elastic member 103s, and the spring constant of the 3 rd elastic member 101s is larger than that of the 2 nd elastic member 203 s. Therefore, as shown in fig. 7, the 1 st elastic member 103s having the smallest spring constant contracts. Thereby, as shown in the drawing, the lower film pressing member 103 is pressed downward against the lower die side member 101. Thereby, as shown in the drawing, the release film 40 is pulled downward and a tension is applied (tension applying step). This can suppress the release film 40 from loosening, wrinkling, and the like.

In addition, the 1 st elastic member 103s is provided in a groove of the lower mold side member 101 as shown in the figure. Therefore, when the lower die 100 is further raised as shown in fig. 7, the 1 st elastic member 103s does not contract further if the lower die side member 101 and the lower die film pressing member 103 come into contact with each other. As this modification, a stopper or the like may be provided so that the 1 st elastic member 103s is not lower than a predetermined height (does not contract any further).

Next, as indicated by an arrow 100B in fig. 8, the inside of the lower mold base member 110 of the lower mold and the through hole 100B of the lower mold bottom member 102 is sucked by a suction mechanism (not shown, for example, a vacuum pump) and depressurized. As a result, as shown in the drawing, the release film 40 is adsorbed on the mold surface (cavity surface) of the lower mold 100, and the mold surface of the lower mold 100 is covered with the release film 40. This step is a step of adsorbing release film 40 on the mold surface of lower mold 100, that is, the mold surface of mold 1000, and therefore corresponds to the "release film adsorption step" of the present invention. In the present embodiment, the step of sucking the release film is performed after the step of applying tension to the release film, but as described later, the timing of performing the step of sucking the release film is not limited to this.

Next, as shown by arrow X3 in fig. 9, lower die 100 is further raised. Thereby, the 2 nd elastic member 203s provided at the upper die contracts. When the lower die 100 is further raised, the release film 40 is brought into contact with the substrate 10 and sandwiched between the substrate 10 and the lower die side member 101 as shown in the drawing. This prevents the lower die side member 101 from further rising. Therefore, the 2 nd elastic member 203s does not contract any further. Further, a stopper or the like may be provided so that the 2 nd elastic member 203s does not fall below a predetermined height (does not contract further).

In this state, as shown by arrow X4 in fig. 10, lower die 100 is further raised. In so doing, as shown in the drawing, the 3 rd elastic member 101s connected to the lower mold side member 101 contracts. Thereby, the lower die bottom member 102 is pushed upward with respect to the lower die side member 101 and the upper die body 202. Therefore, the volume of the cavity 100A of the lower mold becomes smaller. At this time, as shown in fig. 10, the resin material 20a is melted to become a molten resin (flowable resin) 20 b. In this state, as shown in the drawing, the lower mold bottom member 102 is pushed upward until the cavity 100A is filled with the molten resin 20 b. Thus, as shown in the drawing, the chip 11 and the bonding wire 12 are immersed in the molten resin 20b, and one surface (surface on which the chip 11 and the bonding wire 12 are mounted) of the substrate 10 is in contact with the molten resin 20 b. Further, a stopper or the like may be provided so that the 3 rd elastic member 101s does not fall below a predetermined height (does not contract further).

Further, the molten resin 20b is cured (hardened) in this state. In so doing, the resin is molded according to the molding die 1000 (resin molding step). The method of solidifying the molten resin 20b is not particularly limited as long as an appropriate method is selected according to the kind of resin and the like. For example, in the case where the molten resin 20b is a thermosetting resin, the mold may be further heated by a heater inside the mold to be cured. Further, for example, in the case where the molten resin 20b is a thermoplastic resin, the heating of the molding die may be stopped, and the molten resin 20b may be solidified by natural cooling or by rapid cooling of the molding die.

After the solidification of the molten resin 20b is completed, the lower mold 100 is lowered and opened as shown in fig. 11. In the same figure, the molten resin 20b is solidified into the solidified resin 20. In this way, as shown in the drawing, the resin molded product 30 including the substrate 10 and the cured resin 20 can be manufactured. In the resin molded article 30 shown in the same figure, the chip 11 and the bonding wire 12 mounted on one surface of the substrate 10 are resin-sealed (resin-molded) with the cured resin 20. The used release film 40 can be carried out to the outside of the mold 1000 after being peeled from the mold surface of the lower mold 100, for example.

[ example 2 ]

Next, different embodiments of the present invention are shown.

The molding die of the present embodiment and the method for manufacturing the resin molded article of the present embodiment using the same are shown in the step sectional views of fig. 12 to 14.

As shown in fig. 12, the molding die 1000 of the present embodiment is the same as the molding die 1000 of fig. 1 to 11 except that the upper die pressing member has an upper die pressing member 203 α instead of the upper die pressing member 203, the upper die pressing member does not have the 2 nd elastic member 203s, and the driving portion 205 that moves the upper die pressing member 203 α up and down is provided.

The state of fig. 12 is a state in which the release film 40 is sandwiched and held between the lower film pressing member 103 and the upper film pressing member 203 α, as in fig. 6. The steps up to this point can be performed in the same manner as in fig. 2 to 6.

From the state of fig. 12, as indicated by an arrow Y1 of fig. 13, the upper film pressing member 203 α is pressed downward by the driving portion 205. In so doing, as shown in the drawing, the 1 st elastic member 103s contracts, and the lower film pressing member 103 is pressed downward with respect to the lower die side member 101. Thereby, as shown in the drawing, the release film 40 is pulled downward and a tension is applied (tension applying step). This can suppress the release film 40 from loosening, wrinkling, and the like. The tension applying step of fig. 13 can be performed in the same manner as the tension applying step of fig. 7, except that the upper film pressing member 203a is pressed downward by the driving unit 205 instead of the raising of the lower die 100.

The state of fig. 14 is a state in which the lower mold 100 is pushed upward to fill the cavity 100A with the molten resin 20b, and the chip 11 and the bonding wire 12 are immersed in the molten resin 20 b. From the state of fig. 13 to fig. 14, the same procedure as in fig. 8 to 10 can be performed. The other steps in this embodiment can be performed in the same manner as in embodiment 1 (fig. 2 to 11).

In the present invention, the 1 st elastic member is also arbitrary as the 2 nd elastic member. That is, the 1 st elastic member may be provided or not provided that one of the mold pressing members can be moved in the mold opening/closing direction.

In the molding die 1000 according to examples 1 and 2, the shapes of the suction holes 100D in the lower die 100 and the pipe member 104 are not particularly limited. Fig. 15(a) and (b) show an example thereof. Fig. 15(a) is a plan view of the lower mold 100 in examples 1 and 2 (fig. 1 to 14). Fig. 15(b) is a sectional view of the same lower die 100, which is the same as the sectional view of the lower die 100 in fig. 1 to 14. The shape of the suction hole 100D is preferably a groove shape surrounding the entire periphery of the cavity 100A, as shown in the plan view of fig. 15(a), for example. With such a shape, for example, since the suction force of the release film 40 is increased, the release film 40 can be prevented from being loosened and wrinkled. However, in the present invention, the shape of the suction hole of one die and the piping member is not limited to this. For example, the suction holes may be shaped to surround only a portion of the mold cavity rather than the entirety thereof. In fig. 15(a), the suction holes have a 1-groove shape, but the suction holes are not limited to this, and may be divided into a plurality of suction holes, or may have any other shape (for example, a dot shape) instead of the groove shape.

In the present invention, as described above, the release film can be tensioned in a state where the one die and the other die are close to each other, as compared with a case where the release film is attached to the one die. This can further suppress, for example, the release film from sagging and wrinkling. This is explained in further detail below.

Fig. 16 and 17 are cross-sectional views showing the same state as fig. 5 and 6, respectively. Fig. 16 shows a state in which the release film 40 heated by the lower mold 100 heated by the temperature rise is thermally expanded after the release film mounting step (fig. 4) as described with reference to fig. 5. In this state, central portion 40a of release film 40 does not contact lower mold 100, and peripheral portion 40b of release film 40 contacts lower mold 100. Therefore, the central portion 40a receives heat radiation from the lower mold 100, but does not conduct heat by contacting the lower mold 100. In contrast, the peripheral edge portion 40b receives heat from the lower mold 100 in contact therewith by direct heat conduction. Therefore, the central portion 40a is lower in temperature than the peripheral portion 40 b. That is, the temperature of the release film 40 varies depending on the location. In this state, when a tensile force is applied to the release film 40 or the cavity surface is covered with the release film 40, a phenomenon occurs in which a portion having a high temperature is easily stretched and a portion having a low temperature is not easily stretched. In this case, the release film 40 may be loosened or wrinkled.

Therefore, as shown in fig. 17 (fig. 6), after the release film mounting step (fig. 4), the lower mold 100 and the upper mold 200 are brought closer. As a result, as shown in the drawing, the influence of heat radiation from upper die 200 becomes large, and mold release film 40 receives heat radiation H from both lower die 100 and lower die 200. This makes the temperature of the entire release film 40 nearly constant. After this is done, tension may be applied to the film as described with respect to fig. 7. This can suppress, for example, the release film 40 from sagging and wrinkling. In order to further keep the temperature of the entire release film 40 constant, the speed of raising the lower die 100 may be reduced or temporarily stopped, for example, in the vicinity of the position where the release film 40 and the upper die film pressing member 203 are in contact with each other.

As described above, in the method for producing a resin molded article of the present invention, the order of performing the steps is not particularly limited. An example thereof is shown in the step cross-sectional view of fig. 18. The molding die 1000 of fig. 18 is the same as the molding die 1000 of embodiment 1 (fig. 1 to 11). Fig. 18 is a state in which the inside of lower mold base member 110 of lower mold 100 and through hole 100B of lower mold bottom member 102 are sucked and depressurized in the same manner as in fig. 8 after the state of fig. 5. As a result, as shown in the figure, the release film 40 is adsorbed on the mold surface (cavity surface) of the lower mold 100, and the mold surface of the lower mold 100 is covered with the release film 40 (release film adsorbing step). In the method of manufacturing the resin molded article of fig. 2 to 11, as shown in fig. 6 to 8, a tension applying step (fig. 7) is performed after the release film mounting step, and a release film adsorbing step (fig. 8) is performed thereafter. However, as shown in fig. 18, the release film adsorption step may be performed before the tension application step is performed after the release film mounting step. After the release film adsorption step of fig. 18, for example, a tension application step can be performed in the same manner as in fig. 7. The other steps can be performed in the same manner as the method for producing a resin molded article of example 1 (fig. 2 to 11), for example.

In the resin molding apparatus of the present invention, as described above, the tension applied to the release film can be changed by, for example, replacing the 1 st elastic member with an elastic member having a different length in the mold opening/closing direction. An example thereof is shown in the sectional views of fig. 19(a) and (b). The lower die 100 in fig. 19(a) is the same as the lower die 100 in embodiments 1 and 2. The lower die 100 in fig. 19(b) is the same as that in fig. 19(a), except that the 1 st elastic member 103s is replaced with an elastic member having a different height (length in the mold opening/closing direction). Fig. 19(a) is higher than fig. 19(b) in the height of the 1 st elastic member 103 s. As shown in the figure, in the state where the 1 st elastic member 103s is not contracted, the distance between the lower end of the lower film pressing member 103 and the lower die side member 101 is a in fig. 19(a), B in fig. 19(B), and the distance a is larger than the distance B. By changing the height of the 1 st elastic member 103s in this manner, the Tension (Tension) applied to the release film 40 can be changed. Specifically, the upper limit of the length that the 1 st elastic member 103s can contract is equal to the distance between the lower end of the lower film pressing member 103 and the lower die side member 101. Further, this distance is equal to the maximum value of the distance that the lower die side member 101 can be pressed downward. As described above, the distance is a in fig. 19(a), B in fig. 19(B), and the distance in fig. 19(a) is larger. Therefore, fig. 19(a) can apply a larger maximum value of tension to the release film 40 than fig. 19 (b).

In the conventional mold and resin molding apparatus, in order to change the tension applied to the release film in this manner, for example, the depth of the suction groove of the lower mold side member must be changed, and therefore, the entire lower mold side member must be replaced. However, in the present invention, for example, as shown in fig. 19(a) and 19(b), the tension applied to the release film can be changed only by replacing the 1 st elastic member.

[ example 3 ]

Next, still another embodiment of the present invention is shown.

Fig. 20 is a plan view showing an example of the structure of the resin molding apparatus according to the present invention. As shown in the drawing, the resin molding apparatus 5000 includes a molding section 2000, a substrate section (molding object section) 3000, and a resin section 4000. The substrate portion 3000 is disposed adjacent to the molding portion 2000. Resin portion 4000 is disposed adjacent to molding portion 2000 on the opposite side of substrate portion 3000. The molding section 2000 includes a molding die 1000. The molding die 1000 can be the same as the molding die 1000 of embodiment 1 or 2 (fig. 1 to 14), for example. Substrate section 3000 includes a pre-molding substrate supply section 3100, a post-molding substrate discharge section 3200, and a substrate loader (substrate transport mechanism) 3300. Resin portion 4000 includes a release film and resin supply portion 4100, a post-use release film discharge portion 4200, and a resin loader (resin conveyance mechanism) 4300. As shown by arrows in the figure, the substrate loader 3300 can carry out a pre-mold substrate (object to be molded) from the pre-mold substrate supply section 3100 and supply the pre-mold substrate to the mold 1000. The substrate before molding can be the same as the substrate 10 of example 1, for example. Further, the substrate loader 3300 can carry out the molded substrate from the molding die 1000 and store it in the molded substrate discharge unit 3200. The molded substrate can be the same as the resin molded article 30 shown in fig. 11, for example. The release film and the resin material can be carried out from the release film and resin supply unit 4100 by the resin loader 4300 and supplied to the mold 1000. As shown in fig. 4 of example 1, the release film and the resin material are, for example, a release film 40 on which a resin material 20a is placed. The used mold release film can be carried out of the mold 1000 by the resin loader 4300 and stored in the used mold release film discharging unit 4200. The post-use release film may be, for example, a release film that is peeled off from the mold surface of the molding die after completion of resin molding (for example, the state of fig. 11 of embodiment 1).

However, the structure of the resin molding apparatus of the present invention is not limited to fig. 20, and may be any.

The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately combined, modified, or selected and employed as needed within a scope not departing from the gist of the present invention.

The present application claims priority based on japanese application patent application 2018-220061, filed on 26.11.2018, the disclosure of which is incorporated herein by reference in its entirety.

Description of the reference numerals

10 substrate (object to be molded)

11 chip

12 binding wire

20 curing the resin

20a resin material

20b molten resin (flowable resin)

30 resin molded article

40 Release film

40a center portion of mold release film 40

40b peripheral edge part of mold release film 40

100 lower die (one die)

100A die cavity

100B through hole

100C through hole

100D adsorption hole

101 lower die side component (side component)

101s No. 3 elastic member

102 lower die bottom component (bottom component)

103 lower mold pressing component (one mold pressing component)

103a lower mold film pressing upper outer member

103b lower die film pressing lower member

103c lower die film pressing upper inner member

103s 1 st elastic member

104 piping member

104o O type ring

110 lower die base component (one die base component)

110A lower die base upper component (one die base upper component)

110B lower die base lower component (one die base lower component)

200 Upper die (the other die)

202 upper die body

203 upper mold pressing member (the other mold pressing member)

203s 2 nd elastic member

203 α upper mold pressing member (the other mold pressing member)

205 drive part

210 Upper mold base component (Another mold base component)

X1, X2, X3 and X4 are arrows indicating the ascending direction of the lower die 100

Y1 represents an arrow in the descending direction of the upper film pressing member 203 α

100a and 100b show arrows indicating suction (pressure reduction) by the suction mechanism

1000 forming die

2000 molding part

3000 base plate part (object part to be molded)

3100 front substrate supply unit for molding

3200 shaped rear substrate discharge part

3300 substrate loader (substrate transport mechanism)

4000 resin part

4100 mold release film and resin supply unit

4200 after use, releasing part of release film

4300 resin loader (resin carrying mechanism)

5000 resin molding device

Claims

1. A forming die is characterized in that a die body is provided,

comprising a mould and a further mould,

the one die includes a side member, a bottom member and a die pressing member,

the cavity is formed by a space surrounded by the side surface member and the bottom surface member,

the one die pressing member is provided outside the side member and is movable in the opening/closing direction of the molding die,

the other die comprises another die pressing member,

while the mold release film is not adsorbed to the cavity surface of the one mold, the side surface member is relatively moved in the mold opening direction so as to be closer to the other mold than the one mold pressing member while the one mold pressing member and the other mold pressing member are sandwiched and held with the mold release film, and tension is applied to the mold release film.

2. The forming die according to claim 1, wherein the one die is a lower die and the other die is an upper die.

3. The molding die according to claim 1 or 2,

the other die is mounted on the other die base member,

the other mold pressing member is movable relative to the other mold base member in the mold opening/closing direction.

4. The molding die according to claim 1 or 2,

it further comprises a 1 st elastic member,

the first elastic member 1 is configured to be elastically deformable in a mold opening/closing direction.

5. The molding die according to claim 1 or 2,

it further comprises a 2 nd elastic member,

the other mold pressing member is movable in the mold opening/closing direction by the expansion/contraction of the 2 nd elastic member.

6. The molding die according to claim 1 or 2,

further comprising a 1 st elastic member and a 2 nd elastic member,

the first elastic member 1 is extended and contracted to move the one die pressing member in the opening and closing direction of the molding die,

the other mold pressing member is movable in the mold opening/closing direction by the expansion/contraction of the 2 nd elastic member,

the 2 nd elastic member has a spring constant greater than that of the 1 st elastic member.

7. The forming die according to claim 6, wherein,

the one die includes a side member, a bottom member and a 3 rd elastic member,

the 3 rd elastic member has a spring constant greater than that of the 2 nd elastic member,

the side member is movable in the mold opening/closing direction by the expansion/contraction of the 3 rd elastic member.

8. The forming die according to claim 4,

the 1 st elastic member may be replaced with an elastic member having a different length in the mold opening/closing direction.

9. The molding die according to claim 1 or 2,

the one die pressing member is movable in the die opening/closing direction with respect to the side member.

10. The molding die according to claim 1 or 2,

the one die further comprises a piping member,

the one mold pressing member has an adsorption hole to adsorb the release film,

the piping member has a through-hole,

the through hole communicates with the suction hole, and the piping member is movable in the mold opening/closing direction together with the one mold pressing member.

11. The molding die according to claim 10, wherein the suction hole has a groove shape surrounding the entire circumference of the cavity.

12. The molding die according to claim 1 or 2,

the release film may be tensioned in a state where the one die and the other die are brought close to each other, as compared to when the release film is mounted on the one die.

13. The molding die according to claim 1 or 2,

the molding apparatus further includes a driving unit for moving the other mold pressing member in the mold opening/closing direction using the driving unit.

14. A resin molding apparatus characterized by comprising the molding die according to any one of claims 1 to 13.

15. A method for producing a resin molded article by using the molding die according to any one of claims 1 to 13 or the resin molding apparatus according to claim 14, comprising:

a mold release film mounting step of mounting a mold release film on the one mold;

a tension applying step of applying tension to the release film;

a mold release film adsorption step of adsorbing the mold release film in the tension applied state on the cavity surface of the one mold; and

in the tension applying step, the side member is relatively moved in a mold opening direction while the mold release film is held by the one mold pressing member and the other mold pressing member, and tension is applied to the mold release film,

16. The method for producing a resin molded article according to claim 15,

in the tension applying step, tension is applied to the release film in a state where the one die and the other die are brought closer to each other than in the release film attaching step.