KR20200062023A - Molding die, resin molding device and method for manufacturing resin-molded product - Google Patents

Abstract

Provided is a molding die capable of suppressing or preventing sagging, wrinkles or the like of a release film. The molding die (1000) includes one die (100) and the other die (200), wherein the one die (100) is formed with a cavity (100A) on a die surface, a release (40) is adsorbed to the die surface, the one die (100) includes one die film pressing member (103), the one die film pressing member (103) is movable in opening and closing directions of the molding die, the other die (200) includes the other die film pressing member (203), the other die film pressing member (203) is movable in the opening and closing direction of the molding die, the release film (40) is interposed between and support the one die film pressing member (103) and the other die film pressing member (203), and a tension is applied to the release film (40).

Description

Molding die, resin molding apparatus, and manufacturing method of resin molded product{MOLDING DIE, RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN-MOLDED PRODUCT}

The present invention relates to a molding die, a resin molding apparatus and a method for manufacturing a resin molded article.

In resin molding using a molding die, a mold release film may be coated on a die surface to perform resin molding. At this time, in order to suppress sagging, wrinkles, and the like of the release film, an adsorption groove is provided in the molding die (Patent Document 1).

Patent Document 1: Japanese Patent Publication No. 2000-299334

In the release film, there are various release films having different materials and thicknesses. When the type of the release film is different, properties such as thermal expansion coefficient, tensile strength, and tensile stretching may also be different. For example, a release film having a large thermal expansion coefficient, tensile elongation, and the like tends to stretch. When a release film that is easy to stretch is used, there is a concern that sagging, wrinkles, and the like of the release film cannot be suppressed only by adsorption to a molding die.

Accordingly, an object of the present invention is to provide a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product capable of suppressing or preventing sagging, wrinkles, and the like of a release film.

In order to achieve the above object, the molding die of the present invention,

Including one die and the other die,

The one-side die is a die in which a cavity is formed on the die surface, and a release film is adsorbed on the die surface.

The one side die includes a one side die film pressing member,

The one side die film pressing member is movable in the opening direction of the forming die,

The other die includes the other die film pressing member,

The other die film pressing member is movable in the opening and closing direction of the forming die,

The one side die film pressing member and the other side die film pressing member is sandwiched between the release film and supported, it is characterized in that it is possible to apply a tension to the release film.

The resin molding apparatus of the present invention is characterized by including the molding die of the present invention.

Method for producing a resin molded article of the present invention,

As a manufacturing method of a resin molded article performed using the molding die of the present invention or the resin molding apparatus of the present invention,

A release film mounting process for attaching a release film to the forming die;

A release film adsorption process for adsorbing a release film on the die surface of the forming die,

A tension adding process for applying tension to the release film,

In the state in which the release film is adsorbed on the die surface, and includes a resin molding process for molding the resin by the molding die,

In the tension adding step, a tension is applied to the release film in a state where the release film is sandwiched between the one side die film pressing member and the other side die film pressing member, and supported.

In the resin molding step, it is characterized in that resin molding is performed between the die surface of the one die and the die surface of the other die while the release film is adsorbed.

ADVANTAGE OF THE INVENTION According to this invention, the molding die which can suppress or prevent sagging, wrinkles, etc. of a release film, a resin molding apparatus, and the manufacturing method of a resin molded article can be provided.

1 is a cross-sectional view illustrating the configuration of a molding die of the present invention.
2 is a cross-sectional view showing one step in an example according to the method for manufacturing a resin molded article of the present invention using the molding die of FIG. 1.
3 is a cross-sectional view showing another step in the method for manufacturing a resin molded article as in FIG. 2.
4 is a cross-sectional view showing another step in the method for manufacturing a resin molded article as shown in FIG. 2.
5 is a cross-sectional view showing another step in the method of manufacturing a resin molded article as in FIG. 2.
6 is a cross-sectional view showing another step in the method of manufacturing a resin molded article as in FIG. 2.
7 is a cross-sectional view showing still another step in the method for manufacturing a resin molded article as in FIG. 2.
8 is a cross-sectional view showing still another step in the method for manufacturing a resin molded article as in FIG. 2.
9 is a cross-sectional view showing another step in the method for manufacturing a resin molded article as in FIG. 2.
10 is a cross-sectional view showing another step in the method for manufacturing a resin molded article as shown in FIG. 2.
11 is a cross-sectional view showing another step in the method for manufacturing a resin molded article as shown in FIG. 2.
12 is a cross-sectional view showing another example of the configuration of a molding die according to the present invention and one step in an example of a method for manufacturing a resin molded article using the molding die.
13 is a cross-sectional view showing another step in the method for manufacturing a resin molded article as in FIG. 12.
14 is a cross-sectional view showing another step in the method for manufacturing a resin molded article as in FIG. 12.
15 is a view illustrating the configuration of one side die in the forming die of the present invention, (a) is a plan view, (b) is a cross-sectional view.
16 is a cross-sectional view showing one step in still another example of the method for producing a resin molded article of the present invention.
17 is a cross-sectional view showing one step in still another example of the method for producing a resin molded article of the present invention.
18 is a cross-sectional view showing one step in still another example of the method for manufacturing a resin molded article of the present invention.
19A and 19B are cross-sectional views showing another exemplary configuration of the molding die of the present invention.
20 is a plan view showing an example of the configuration of the resin molding apparatus of the present invention.

Hereinafter, the present invention will be described in detail, for example. However, the present invention is not limited by the following description.

In the forming die of the present invention, for example, the one die may be a lower die, and the other die may be an upper die. Further, for example, the one die may be an upper die, and the other die may be a lower die.

In the forming die of the present invention, for example, the other die may be attached to the other die base member, and the other die film pressing member may be movable in the forming die opening and closing direction relative to the other die base member.

In the forming die of the present invention, for example, the one side die may include a side member and a bottom surface member, and the cavity may be formed by a space surrounded by the side member and the bottom surface member.

The molding die of the present invention further includes, for example, a first elastic member, and the one side die film pressing member may be movable in the molding die opening and closing direction by stretching and contracting the first elastic member.

The forming die of the present invention may further include, for example, a second elastic member, and the other die film pressing member may be movable in the opening and closing direction of the forming die by expansion and contraction of the second elastic member.

The molding die of the present invention further includes, for example, a first elastic member and a second elastic member, and the one side die film pressing member is movable in the molding die opening and closing direction by the expansion and contraction of the first elastic member. The other elastic film pressing member may move in the opening and closing direction of the forming die by expansion and contraction of the second elastic member, and the spring constant of the second elastic member may be greater than the spring constant of the first elastic member. In this case, for example, the one side die includes a side member, a bottom surface member, and a third elastic member, and the cavity is formed by a space surrounded by the bottom surface member and the side member, and the third elastic member The spring constant of is greater than the spring constant of the second elastic member, and the side member may be movable in the opening/closing direction of the forming die by expansion and contraction of the third elastic member.

In the molding die of the present invention, for example, the first elastic member may be replaceable with an elastic member having a different length in the opening and closing direction of the molding die.

In the forming die of the present invention, for example, the one side die film pressing member may be movable relative to the side member in the forming die opening and closing direction.

In the forming die of the present invention, for example, the one side die further includes a piping member, the one side die film pressing member has an adsorption hole for adsorbing the release film, and the piping member has a through hole, and the through The ball may be connected to the adsorption hole, and the piping member may be movable in the forming die opening and closing direction together with the one side die film pressing member. In this case, for example, the suction hole may have a groove shape surrounding the entire circumference of the cavity.

The molding die of the present invention may be capable of applying tension to the release film in a state in which the one side die and the other die are closer to each other than when the release film is attached to the one side die, for example.

The molding die of the present invention may further include, for example, a driving unit, and it is possible to move the other die film pressing member in the molding die opening and closing direction using the driving unit.

The method for producing a resin molded article of the present invention may apply tension to the release film in a state in which the one side die and the other die are closer to each other than in the release film mounting step, for example, in the tension adding step.

The method for producing the resin molded article of the present invention is a process including the release film mounting step, the release film adsorption step, the tension adding step, and the resin forming step, as described above, but any other step. You may include. In addition, the order of performing each process is not specifically limited, either, and is arbitrary.

In the present invention,'resin molding' is not particularly limited, and for example, components such as chips may be resin-sealed, but resins may be simply molded without resin-sealing. Similarly, in the present invention, the'resin molded article' is not particularly limited, and may be, for example, a resin molded article (such as a product or a semi-finished product) resin-sealed a component such as a chip, but a product or semi-finished product simply molded without resin sealing. May be In the present invention, the'resin molded body' may be a resin molded article (product or semi-finished product) itself, but may be an intermediate resin molded body in a method for manufacturing a resin molded article. For example, the'resin molded body' may be a resin molded body after the resin molding process and before the mold release process.

In addition, in the present invention,'resin molding' may be, for example, resin molding one or both surfaces of a molding object. However, the present invention is not limited to this, and for example, resin molding may be performed without using a molding object. In addition, for example, components such as chips fixed to one or both surfaces of a molding object may be resin-sealed, but resins may be molded on one or both surfaces of the molding object without resin-sealing the components.

In the present invention, the'molding object' is, for example, a substrate.

The method of'resin molding' in the present invention is not particularly limited as long as it is to perform resin molding using a release film, and may be, for example, compression molding, but may be, for example, transfer molding or extrusion molding.

In the present invention,'resin molding' means, for example, that the resin is cured (solidified) and the cured resin is in a molded state. The hardness of the cured resin is not particularly limited, and may be, for example, the degree to which the cured resin does not deform, or the degree necessary to protect the resin-sealed chip, etc., and does not matter the hardness is large or small. Further, in the present invention, the curing (solidification) of the resin is not limited to a state in which the resin is completely cured (solidification), and may be a state that can be further cured.

In the present invention,'mounted' also includes'fixed'.

Generally, the term'electronic component' refers to a chip before resin sealing, and may refer to a state in which the chip is resin-sealed. However, in the present invention, in the case of simply referring to an'electronic component', the chip is not particularly limited. Refers to this resin-sealed electronic component (electronic component as a finished product). The'chip' in the present invention is specifically, for example, a chip of a passive element such as a resistor, a capacitor, an inductor, a diode, a transistor, an IC (Integrated Circuit), a semiconductor chip such as a semiconductor element for power control, a sensor, or a filter. And the like. In addition, in the present invention, the component to be resin-sealed is not limited to a chip, and may be, for example, at least one of a chip, a wire, a bump, an electrode, a wiring pattern, and the like, and a component other than a chip shape.

Although it does not specifically limit as a board|substrate (it is also called a frame or an interposer) which is a molding object to be resin-molded by the resin molding apparatus or resin molding method of this invention, For example, semiconductor wafers, such as a lead frame, a wiring board, and a silicon wafer , A ceramic substrate, a metal substrate, or the like, or a circuit board such as a printed substrate. When resin molding such an object to be molded, the resin molding is sometimes referred to as'resin sealing'. In the present invention,'resin molding' includes'resin sealing', and for example, only one side of the substrate may be resin-molded, or both sides may be resin-molded. In addition, the board|substrate may be, for example, the mounting board|substrate with which the chip was mounted on one surface or both surfaces, or the board|substrate which comprised only wiring. The chip mounting method is not particularly limited, and examples thereof include wire bonding and flip chip bonding. In the present invention, for example, an electronic component in which a chip is resin-sealed may be manufactured by resin-sealing one or both sides of a mounting substrate.

In addition, the use of the resin molding apparatus of the present invention or the substrate to be resin molded by the resin molding method is not particularly limited. Examples of the substrate include a power control module substrate, a high-frequency module substrate for a portable communication terminal, a motor control substrate used in transportation equipment, a motor control substrate, and a drive system control substrate. The shape of the substrate may be any shape or shape as long as it can be molded. For example, a rectangular or circular substrate may be used when viewed in a plan view.

In the present invention, the'resin molded article' is not particularly limited, but may be, for example, an electronic component in which a chip is resin-sealed by compression molding or the like. In addition, the'resin molded article' in the present invention may be, for example, an intermediate product for manufacturing a single or a plurality of electronic components such as semiconductor products and circuit modules. In addition, the "resin molded article" in the present invention is not limited to an electronic component and an intermediate product in which the chip is resin-sealed, and other resin molded products may be used.

In the present invention, the resin material (resin for resin molding) is not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. Moreover, the composite material which contains a thermosetting resin or a thermoplastic resin in part may be sufficient. As a form of resin supplied to a resin sealing apparatus, granular resin, fluid resin, sheet resin, tablet resin, powder resin, etc. are mentioned, for example.

In addition, the "flowable resin" in the present invention is not particularly limited as long as it is a resin having fluidity, and examples thereof include liquid resin, molten resin, and the like. In addition, in the present invention,'liquid phase' means fluidity at room temperature (room temperature) and flowing by acting on the force, and high and low fluidity, in other words, does not ask for the degree of viscosity. That is, in the present invention,'liquid resin' refers to a resin that has fluidity at room temperature (room temperature) and flows by acting with force. In addition, in the present invention, the term "melt resin" refers to a resin that has been melted by heating to become a liquid and has fluidity. Although the form of a molten resin is not specifically limited, For example, it is a form which can be supplied to the cavity of a molding die, etc.

In the present invention, the molding die is not particularly limited, but may be, for example, a mold or a ceramic die.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. Each drawing has been omitted and exaggerated appropriately for convenience of description, and is schematically drawn.

<Example 1>

In this embodiment, an example of the resin molding apparatus of the present invention, an example of a method of peeling the release film of the present invention using the same, and a method of manufacturing the resin molded article of the present invention are shown.

In the sectional view of Fig. 1, an example of the configuration of the molding die of the present invention is schematically shown. On the other hand, in Fig. 1, as described later, the base member (the upper die base member and the lower die base member) on which the forming die is mounted is also shown. As shown, the forming die 1000 includes a lower die 100 and an upper die 200. The lower die 100 corresponds to the'one side die' of the present invention, and the upper die 200 corresponds to the'other side die' of the present invention. The lower die 100 is a form in which a release film is adsorbed on the die surface, as described later.

The lower die 100 includes a lower die side member 101 and a lower die bottom member 102. The lower die side member 101 corresponds to the'side member' in the'one side die' of the present invention. The lower die bottom member 102 corresponds to the'bottom member' in the'one side die' of the present invention. The lower die side member 101 is arranged to surround the lower die bottom surface member 102. By a space surrounded by the lower die side member 101 and the lower die bottom member 102, a cavity 100A is formed on the die surface of the lower die 100, as shown. The lower die bottom surface member 102 is fixed to the upper surface of the lower die base member 110. The lower die base member 110 corresponds to the'one side die base member'. The lower die side member 101 is connected to the upper surface of the lower die base member 110 by the third elastic member 101s. Meanwhile, the lower die base member 110 is formed of an upper lower die base upper member 110A (one die base upper member) and a lower lower die base lower member 110B (one die base lower member). . By the expansion and contraction of the third elastic member 101s, the lower die side member 101 is movable in the forming die opening/closing direction (up and down direction in the drawing). The lower die base member 110 and the lower die bottom surface member 102 have a through hole 100B. The through hole 100B penetrates from the lower surface of the lower die base member 110 to the upper surface, and also penetrates from the lower surface of the lower die base member 102 to the side surface. The through hole 100B is connected to the gap between the lower die side member 101 and the lower die bottom member 102. As described later, the release film can be adsorbed to the die surface of the lower die 100 by suction from the through hole 100B.

The lower die 100 further includes a lower die film pressing member (one die film pressing member 103) and a first elastic member 103s. The lower die film pressing member 103 is fixed to the side opposite to the upper die 200 by a portion of the first elastic member 103s that does not contact the release film at the periphery of the lower die side member 101. have. By the expansion and contraction of the first elastic member 103s, the lower die film pressing member 103 is movable in the forming die opening/closing direction (up and down direction in the drawing). The lower die film pressing member 103 is formed of three members: an upper outer portion 103a of the lower die film pressing member, a lower portion 103b of the lower die film pressing member, and an upper inner portion 103c of the lower die film pressing member. The lower end of the lower die film pressing member lower portion 103b is connected to the first elastic member 103s. On the upper surface of the lower die film pressing member lower portion 103b, the lower die film pressing member upper outer portion 103a is fixed to the outside, and the lower die film pressing member upper inner portion 103c is fixed inside. The gap between the upper outer portion 103a of the lower die film pressing member and the upper inner portion 103c of the lower die film pressing member forms a groove-shaped suction hole 100D that adsorbs the release film. In addition, the lower die base lower member 110B has a through hole 100C penetrating from the upper surface to the lower surface of the lower die base lower member 110B under the adsorption hole 100D. As described later, the adsorption hole 100D and the through hole 100C are connected.

The lower die 100 further has a piping member 104. The piping member 104 is connected to the lower die film pressing member lower part 103b, and penetrates from the upper end of the first elastic member 103s to the lower end of the lower die base upper member 110A. The piping member 104 is movable along the lower die film pressing member 103 in the forming die opening and closing direction. In addition, the piping member 104 has a through hole penetrating from the top to the bottom. The through hole of the piping member 104 is connected to the adsorption hole 100D of the lower die film pressing member 103 at its upper end. The through hole of the piping member 104 is connected to the through hole 100C of the lower die base member 110 at its lower end. As described later, the release film may be adsorbed to the lower die film pressing member 103 of the lower die 100 through the through hole 100C, the through hole of the piping member 104, and the adsorption hole 100D. . That is, the release film can be mounted on the lower die 100 by adsorbing the release film to the lower die film pressing member 103. Moreover, the O-ring 104o is attached to the lower die film pressing member 103 and the lower die base member 110 so as to surround the circumference of the piping member 104, respectively. The airtightness around the piping member 104 is maintained by the O-ring 104o.

The upper die 200 includes an upper die body 202, an upper die film pressing member (the other die film pressing member 203), and a second elastic member 203s. The upper die main body 202 is located directly above the lower die bottom surface member 102 and the lower die side member 101, and is fixed to the lower surface of the upper die base member 210. The upper die base member 210 corresponds to the'other side die base member'. As will be described later, the molded object can be fixed to the lower surface of the upper die body 202. The upper die film pressing member 203 surrounds the upper die body 202 and is disposed to be located directly above the lower die film pressing member 103. The upper die film pressing member 203 is mounted on the lower end of the upper die base member 210 by the second elastic member 203s. By the expansion and contraction of the second elastic member 203s, the upper die film pressing member 203 is movable in the molding die opening and closing direction. As will be described later, it is possible to sandwich the release film between the lower die film pressing member 103 and the upper die film pressing member 203, and to apply tension to the release film.

Meanwhile, the spring constant of the second elastic member 203s is greater than the spring constant of the first elastic member 103s, and the spring constant of the third elastic member 101s is greater than the spring constant of the second elastic member 203s.

In addition, the molding die 1000 of FIG. 1 constitutes a part of the resin molding apparatus. The resin molding apparatus may include, in addition to the molding die 1000, any components not shown. Specifically, for example, the resin molding apparatus may include a suction mechanism (for example, a vacuum pump) or the like to adsorb the release film, or an external air blocking member or the like for reducing the pressure inside the molding die 1000. You may have. Moreover, you may contain the components etc. which are shown in FIG. 20 mentioned later.

2 to 11 show an example of a method for manufacturing a resin molded article using the molding die 1000 of FIG. 1. First, as shown in Fig. 2, the substrate (formed object, 10) is fixed to the lower surface of the upper die body 202. The means for fixing the substrate 10 is not particularly limited. For example, the substrate 10 may be fixed using a clamper (not shown) or the like. Further, a through hole is provided in the upper die main body 202 and the upper die base member 210, and the substrate 10 is upper die by sucking from the through hole by a suction mechanism (not shown, for example, a vacuum pump). The body 202 may be adsorbed and fixed to the lower surface. A chip 11 and a bonding wire 12 are mounted on the lower surface of the substrate 10, as shown. However, the configuration of the substrate 10 is not limited to this. For example, any other member may be mounted in addition to or instead of the chip 11 and the bonding wire 12, or any member may not be mounted.

Next, as shown in FIG. 3, the release film 40 is conveyed to the position on the die surface of the lower die 100 together with the resin material 20a mounted thereon. Then, the release film 40 is supplied on the die surface of the lower die 100 to be mounted (setting) (release film mounting process). Specifically, as shown, the release film 40 is mounted on the upper surfaces of the lower die side member 101 and the lower die film pressing member 103. The means and methods for mounting the resin material 20a on the release film 40 are not particularly limited, and, for example, known means, methods, such as a feeder, may be used as appropriate. The means and method for conveying the release film 40 and the resin material 20a to the position on the die surface of the lower die 100 are not particularly limited, and, for example, known means, methods, etc., such as a loader, are appropriate You can use it. Further, the resin material 20a is a sheet-shaped resin in this embodiment, but is not limited to this, and may be, for example, granular resin, liquid resin, or tablet resin, semi-solid fluid resin, or the like.

Next, as shown by arrow 100a in FIG. 4, the inside of the through hole 100C of the lower die base member 110 is sucked by a suction mechanism (not shown, for example, a vacuum pump, etc.). By this suction, the through hole 100C and the inside of the through hole and the adsorption hole 100D of the piping member 104 connected to it are depressurized. The release film 40 is adsorbed to the upper surfaces of the lower die side member 101 and the lower die film pressing member 103 by this pressure reduction.

On the other hand, the O-ring 104o surrounding the piping member 104 is disposed in a groove provided in the lower die film pressing member 103 and the lower die base upper member 110A. As a modified example, as shown in the lower left square of FIG. 4, instead of the grooves of the lower die film pressing member 103 and the lower die base member 110, the O-ring 104o is mounted on the piping member 104. You may provide a groove for doing so.

Further, in this embodiment, the forming die 1000 is always pre-heated and heated by a heater (not shown) provided therein. By the temperature increase by the preliminary heating, the resin material 20a starts melting from being mounted in the cavity 100A together with the release film 40, and soon becomes the molten resin 20b as will be described later. On the other hand, preliminary heating of the molding die 1000 may be performed, for example, prior to the release film mounting step or at the same time as the release film mounting step. In addition, preheating of the molding die may be started after the release film mounting step.

In the state of FIG. 4, the release film 40 is being heated by the heated lower die 100. Therefore, as shown in FIG. 5, the release film 40 thermally expands. At this time, sag, wrinkles, etc. may occur in the release film 40.

Next, as shown by arrow X1 in FIG. 6, the lower die 100 is raised. Accordingly, as shown, the upper die film pressing member 203 and the release film 40 are brought into contact. By doing so, the release film 40 is sandwiched and supported between the lower die film pressing member 103 and the upper die film pressing member 203.

In that state, as shown by arrow X2 in Fig. 7, the lower die 100 is further raised. Then, a force to shrink is applied to the first elastic member 103s, the second elastic member 203s, and the third elastic member 101s, respectively. Here, as described above, the spring constant of the second elastic member 203s is greater than the spring constant of the first elastic member 103s, and the spring constant of the third elastic member 101s is the second elastic member 203s. Is greater than the spring constant. Therefore, as shown in Fig. 7, the first elastic member 103s having the smallest spring constant is reduced. Accordingly, as shown, the lower die film pressing member 103 is lowered by being pressed relative to the lower die side member 101. Accordingly, as shown, the release film 40 can be pulled downward to apply tension (tension adding process). Accordingly, sagging and wrinkles of the release film 40 can be suppressed.

On the other hand, the 1st elastic member 103s is provided in the groove|channel of the lower die side member 101, as shown. Therefore, when the lower die 100 is further raised as shown in FIG. 7, when the lower die side member 101 and the lower die film pressing member 103 contact, the first elastic member 103s is not reduced any more. . As a modified example, a stopper or the like may be provided so that the first elastic member 103s does not become smaller than or equal to a predetermined height (so that it does not shrink further).

Next, as shown by arrow 100b in FIG. 8, a suction mechanism (not shown, for example, a vacuum) inside the through hole 100B of the lower die base member 110 and the lower die bottom member 102 of the lower die Pump, etc.) to reduce pressure. Accordingly, as shown, the release film 40 is adsorbed on the die surface (cavity surface) of the lower die 100 to cover the die surface of the lower die 100 with the release film 40. Since this process is a process of adsorbing the release film 40 to the die surface of the lower die 100, that is, the die surface of the forming die 1000, it corresponds to the'release film adsorption process' of the present invention. On the other hand, in this embodiment, the release film adsorption step is performed after the tension adding step of applying tension to the release film, but the timing of performing the release film adsorption step is not limited to this, as will be described later.

Next, as indicated by arrow X3 in FIG. 9, the lower die 100 is further raised. Accordingly, the second elastic member 203s provided on the upper die is contracted. When the lower die 100 is further raised, as shown, the release film 40 is brought into contact with the substrate 10 and held by the substrate 10 and the lower die side member 101. As a result, the lower die side member 101 cannot rise any further. Therefore, the second elastic member 203s is no longer contracted. On the other hand, a stopper or the like may be provided so that the second elastic member 203s does not become smaller than or equal to a predetermined height (so that it does not shrink more).

In that state, as indicated by arrow X4 in Fig. 10, the lower die 100 is further raised. Then, as illustrated, the third elastic member 101s connected to the lower die side member 101 contracts. Accordingly, the lower die bottom surface member 102 is pushed up relative to the lower die side member 101 and the upper die body 202. Therefore, the volume of the cavity 100A of the lower die becomes small. Further, at this time, as shown in Fig. 10, the resin material 20a is melted to become a molten resin (flowable resin, 20b). In this state, as shown, the lower die bottom surface member 102 is pushed up until the cavity 100A is filled with molten resin 20b. Accordingly, as shown, while the chip 11 and the bonding wire 12 are immersed in the molten resin 20b, one side of the substrate 10 (the surface on which the chip 11 and the wire 12 are mounted) ) Is brought into contact with the molten resin 20b. On the other hand, a stopper or the like may be provided so that the third elastic member 101s does not become smaller than or equal to a predetermined height (to prevent further reduction).

Further, in that state, the molten resin 20b is cured (solidified). In this way, the resin is molded by the molding die 1000 (resin molding process). The method of solidifying the molten resin 20b is not particularly limited, and an appropriate method may be selected depending on the type of the resin or the like. For example, when the molten resin 20b is a thermosetting resin, the molding die may be further cured by further heating with an internal heater. In addition, for example, when the molten resin 20b is a thermoplastic resin, the molten resin 20b may be cured by stopping heating of the molding die and allowing it to cool or cooling the molding die rapidly.

When curing of the molten resin 20b is completed, as shown in FIG. 11, the lower die 100 is lowered to open the die. In the drawing, the molten resin 20b is cured to become the cured resin 20. In this way, the resin molded article 30 including the substrate 10 and the cured resin 20 can be manufactured as shown. On the other hand, in the resin molded article 30 of the drawing, the chip 11 and the bonding wire 12 mounted on one surface of the substrate 10 are resin-sealed (resin molded) by the cured resin 20. In addition, the used release film 40 may be taken out of the forming die 1000 after being peeled off, for example, from the die surface of the lower die 100.

<Example 2>

Next, another embodiment of the present invention will be described.

12 to 14, the molding die of this embodiment and a method of manufacturing the resin molded article of this embodiment using the same are shown.

As shown in FIG. 12, the forming die 1000 of this embodiment has an upper die film pressing member having an upper die film pressing member 203α in place of the upper die film pressing member 203, and an upper die film pressing member It is the same as the forming die 1000 of FIGS. 1 to 11 except that it does not have the second elastic member 203s and has a driving portion 205 that moves the upper die film pressing member 203α up and down.

The state of FIG. 12 is a state in which the release film 40 is held between the lower die film pressing member 103 and the upper die film pressing member 203α, similarly to FIG. 6. The steps up to this point can be carried out in the same manner as in Figs.

From the state of FIG. 12, as shown by arrow Y1 in FIG. 13, the upper die film pressing member 203α is pushed down by the drive unit 205. Then, as shown, the first elastic member 103s contracts, and the lower die film pressing member 103 is pushed down relative to the lower die side member 101. Accordingly, as shown, the release film 40 can be pulled downward to apply tension (tension adding process). Accordingly, sagging and wrinkles of the release film 40 can be suppressed. The tension adding process in FIG. 13 can be carried out in the same manner as the tension adding process in FIG. 7 except that the upper die film pressing member 203α is pushed down by the driving unit 205 instead of raising the lower die 100. .

The state of FIG. 14 is a state in which the lower die 100 is pushed to fill the cavity 100A with molten resin 20b, and the chip 11 and the bonding wire 12 are immersed in the molten resin 20b. From the state of Fig. 13 to Fig. 14, it can be carried out in the same manner as in Figs. Other steps in this example can be carried out in the same manner as in Example 1 (Figs. 2 to 11).

Meanwhile, in the present invention, like the second elastic member, the first elastic member is also arbitrary. That is, as long as the die film pressing member can be moved in the opening and closing direction of the forming die, the first elastic member may or may not be present.

In addition, in the forming die 1000 of Examples 1 and 2, the shape of the adsorption hole 100D in the lower die 100 and the piping member 104 is not particularly limited. 15(a) and 15(b) show an example. 15A is a plan view of the lower die 100 in Examples 1 and 2 (FIGS. 1 to 14). 15B is a cross-sectional view of the same lower die 100, and is the same as that of the lower die 100 in FIGS. 1-14. The shape of the adsorption hole 100D is preferably a groove shape surrounding the entire area around the cavity 100A, for example, as shown in the plan view of Fig. 15A. With such a shape, for example, since the adsorption force of the release film 40 is increased, sagging, wrinkles, and the like of the release film 40 can be further suppressed. However, the shape of the adsorption hole of one side die and the piping member in the present invention is not limited to this. For example, the shape of the adsorption hole may be a shape that surrounds only a part of the cavity of the forming die rather than the whole. In addition, although the adsorption hole is a single groove shape in Fig. 15A, the present invention is not limited to this, and the suction hole may be divided into a plurality of grooves or any other shape (for example, dot shape) other than the groove shape. do.

In the present invention, as described above, tension may be applied to the release film in a state where one side die and the other die are closer than when the release film is attached to one side die. Accordingly, for example, sag, wrinkles, and the like of the release film can be further suppressed. Hereinafter, this will be described in more detail.

16 and 17 are views showing the same states as in FIGS. 5 and 6, respectively. As shown in FIG. 16, after the release film mounting process (FIG. 4 ), the release film 40 heated by the heated lower die 100 is thermally expanded. In this state, the central portion 40a of the release film 40 is not in contact with the lower die 100, and the peripheral portion 40b of the release film 40 is in contact with the lower die 100. Therefore, the central portion 40a receives radiant heat from the lower die 100, but there is no thermal conduction due to contact with the lower die 100. In contrast, the peripheral portion 40b receives heat by thermal conduction directly from the lower die 100 in contact. For this reason, the temperature of the central portion 40a is lower than that of the peripheral portion 40b. That is, the temperature of the release film 40 is different depending on the part. In this state, when tension is applied to the release film 40 or the release film 40 is coated on the cavity surface, a phenomenon in which a portion having a high temperature increases well and a portion having a low temperature does not increase so much may occur. Then, there is a risk of sagging, wrinkles, etc. occurring in the release film 40.

For this reason, as shown in FIG. 17 (FIG. 6 ), after the release film mounting process (FIG. 4 ), the lower die 100 and the upper die 200 are further approached. Accordingly, as illustrated, the influence of radiant heat from the upper die 200 increases, and the release film 40 receives radiant heat H from both the lower die 100 and the upper die 200. Accordingly, the temperature of the entire release film 40 becomes almost constant. After doing so, tension can be applied to the film as described in FIG. 7. Accordingly, for example, sag, wrinkles, and the like of the release film 40 can be further suppressed. On the other hand, in order to make the temperature of the entire release film 40 more constant, for example, the rise of the lower die 100 at a low speed near the position where the release film 40 and the upper die film pressing member 203 are contacted at a low speed. Or, you may stop once.

In addition, as mentioned above, in the manufacturing method of the resin molded article of this invention, the order which performs each process is not specifically limited. An example is shown in the process sectional view of FIG. The molding die 1000 of FIG. 18 is the same as the molding die 1000 of Example 1 (FIGS. 1-11). 18, after the state of FIG. 5, similarly to FIG. 8, the inside of the through hole 100B of the lower die base member 110 and the lower die bottom member 102 of the lower die 100 is sucked to reduce pressure. It is one state. Accordingly, as shown, the release film 40 is adsorbed on the die surface (cavity surface) of the lower die 100 to cover the die surface of the lower die 100 with the release film 40 (release film). Adsorption process). In the method for producing the resin molded article of Figs. 2 to 11, as shown in Figs. 6 to 8, a tension adding process (Fig. 7) is performed after the release film mounting process, and thereafter the release film adsorption process (Fig. 8) ). However, as shown in FIG. 18, after the release film mounting process, a release film adsorption process may be performed prior to the tension adding process. After the release film adsorption process of Fig. 18 is performed, a tension adding process may be performed as shown in Fig. 7, for example. Other steps can be carried out, for example, as in the manufacturing method of the resin molded article of Example 1 (FIGS. 2 to 11).

In addition, as described above, the resin molding apparatus of the present invention may change the tension applied to the release film by, for example, replacing the first elastic member with an elastic member having a different length in the direction of opening and closing the forming die. An example is shown in the sectional view of FIGS. 19A and 19B. The lower die 100 of FIG. 19(a) is the same as the lower die 100 of Examples 1 and 2. The lower die 100 of Fig. 19B is the same as that of Fig. 19A except that the first elastic member 103s is replaced with an elastic member having a different height (length in the direction of opening and closing the forming die). . 19(a) has a higher height of the first elastic member 103s than that of FIG. 19(b). As shown, in the state in which the first elastic member 103s is not contracted, the distance between the lower end of the lower die film pressing member 103 and the lower die side member 101 is A in FIG. 19A, In Fig. 19B, it is B, and the distance A is larger than the distance B. Thus, the tension (tension) applied to the release film 40 can be changed by changing the height of the first elastic member 103s. Specifically, the upper limit of the length at which the first elastic member 103s can be reduced is the same as the distance between the lower die film pressing member 103 and the lower die side member 101. In addition, this distance is equal to the maximum value of the distance at which the lower die side member 101 can be pushed down. And, as described above, this distance is A in FIG. 19(a), B in FIG. 19(b), and FIG. 19(a) is large. Therefore, the maximum value of the tension that can be applied to the release film 40 in FIG. 19(a) is larger than in FIG. 19(b).

In the conventional molding die and resin molding apparatus, in order to change the tension applied to the release film in this way, for example, since it is necessary to change the depth of the suction groove of the lower die side member, the lower die side member is entirely replaced. There was a need. However, in the present invention, as shown in (a) and (b) of FIG. 19, for example, the tension applied to the release film can be changed only by replacing the first elastic member.

<Example 3>

Next, another embodiment of the present invention will be described.

20 shows an example of the configuration of the resin molding apparatus of the present invention. As illustrated, the resin molding apparatus 5000 includes a molding unit 2000, a substrate unit (forming object unit 3000, and a resin unit 4000). The substrate portion 3000 is disposed adjacent to the molding portion 2000. The resin part 4000 is disposed adjacent to the molding part 2000 on the opposite side to the substrate part 3000. The molding unit 2000 includes a molding die 1000. The molding die 1000 may be the same as the molding die 1000 of Example 1 or 2 (FIGS. 1 to 14), for example. The substrate portion 3000 includes a substrate supply portion 3100 before molding, a substrate discharge portion 3200 after molding, and a substrate loader (substrate transport mechanism 3300). The resin part 4000 includes a release film and a resin supply part 4100, a post-use release film discharge part 4200, and a resin loader (resin transfer mechanism, 4300). As indicated by the arrows in the drawing, the substrate (formation object) before molding can be taken out from the substrate forming unit 3100 before forming by the substrate loader 3300 and supplied to the forming die 1000. The substrate before molding may be the same as the substrate 10 of Example 1, for example. In addition, the substrate after molding can be taken out of the molding die 1000 by the substrate loader 3300 and stored in the substrate discharge portion 3200 after molding. The substrate after molding may be the same as the resin molded article 30 shown in FIG. 11, for example. In addition, the release film and the resin material can be taken out from the release film and the resin supply unit 4100 by the resin loader 4300 and supplied to the molding die 1000. The release film and the resin material may be, for example, a release film 40 on which the resin material 20a is mounted, as shown in FIG. 4 of Example 1. In addition, the release film after use may be taken out from the forming die 1000 by the resin loader 4300 and stored in the release film discharge part 4200 after use. The release film after use may be, for example, a release film peeled from the die surface of the molding die after the resin molding is finished (for example, the state of FIG. 11 of Example 1).

However, the configuration of the resin molding apparatus of the present invention is not limited to FIG. 20 and is arbitrary.

The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately combined, changed, or selected as necessary without departing from the spirit of the present invention.

This application claims priority based on Japanese Patent Application No. 2018-220061, filed on November 26, 2018, and uses the entire disclosure herein.

10 Substrate (formed object)
11 chips
12 bonding wire
20 cured resin
20a resin material
20b molten resin (flowable resin)
30 Resin molded products
40 release film
Central portion of 40a release film 40
Periphery of 40b release film 40
100 lower die (one side die)
100A cavity
100B through hole
100C through hole
100D adsorption hole
101 lower die side member (side member)
101s third elastic member
102 Bottom die bottom member (bottom member)
103 lower die film pressing member (one side die film pressing member)
103a lower die film pressing member upper and outer parts
103b lower die film pressing member lower part
103c lower die film pressing member upper and lower side
103s first elastic member
104 Piping member
104o O-ring
110 lower die base member (one side die base member)
110A lower die base upper material (one side die base upper material)
110B lower die base lower member (one die base lower member)
200 upper die (other die)
202 upper die body
203 upper die film pressing member (other side die film pressing member)
203s second elastic member
203α upper die film pressing member (other side die film pressing member)
205 Drive
210 upper die base member (other die base member)
X1, X2, X3, X4 Arrows showing the upward direction of the lower die 100
Arrow indicating the downward direction of the Y1 upper die film pressing member 203α
Arrows showing suction (decompression) by the 100a, 100b suction mechanism
1000 forming dies
2000 molding department
3000 Substrate part (part to be molded)
3100 Board supply before molding
3200 Substrate discharge after molding
3300 board loader (substrate transport mechanism)
4000 resin part
4100 release film and resin supply
4200 release film after use
4300 resin loader (resin transfer mechanism)
5000 resin molding device

Claims (17)

Including one die and the other die,
The one-side die is a die in which a cavity is formed on the die surface, and a release film is adsorbed on the die surface.
The one side die includes a one side die film pressing member,
The one side die film pressing member is movable in the opening direction of the forming die,
The other die includes the other die film pressing member,
The other die film pressing member is movable in the opening and closing direction of the forming die,
A molding die characterized in that the release film is sandwiched between the one side die film pressing member and the other side die film pressing member, and a tension is applied to the release film. According to claim 1,
A molding die in which the one die is a lower die and the other die is an upper die. According to claim 1,
The other die is mounted on the other die base member,
A molding die in which the other die film pressing member is movable relative to the other die base member in a molding die opening and closing direction. According to claim 1,
The one side die includes a side member and a bottom member,
A molding die in which the cavity is formed by a space surrounded by the side member and the bottom member. According to claim 1,
Further comprising a first elastic member,
A molding die in which the one side die film pressing member is movable in the opening/closing direction of the molding die by expansion and contraction of the first elastic member. According to claim 1,
Further comprising a second elastic member,
A molding die in which the other die film pressing member is movable in the opening and closing direction of the molding die by the expansion and contraction of the second elastic member. According to claim 1,
Further comprising a first elastic member and the second elastic member,
The one side die film pressing member is movable in the molding die opening and closing direction by the expansion and contraction of the first elastic member,
Due to the expansion and contraction of the second elastic member, the other die film pressing member is movable in the opening and closing direction of the forming die,
A molding die in which the spring constant of the second elastic member is greater than the spring constant of the first elastic member. The method of claim 7,
The one side die includes a side member, a bottom surface member, and a third elastic member,
The cavity is formed by a space surrounded by the bottom surface member and the side surface member,
The spring constant of the third elastic member is greater than the spring constant of the second elastic member,
A molding die in which the side member is movable in the opening and closing direction of the molding die by expansion and contraction of the third elastic member. The method of claim 5,
A molding die which can exchange the first elastic member with an elastic member having a different length in the opening and closing direction of the molding die. The method of claim 5,
A molding die in which the one side die film pressing member is movable relative to the side member in a molding die opening and closing direction. According to claim 1,
The one side die further includes a piping member,
The one side die film pressing member has an adsorption hole for adsorbing the release film,
The piping member has a through hole,
A forming die in which the through hole is connected to the adsorption hole, and the piping member is movable in the opening direction of the forming die together with the one side die film pressing member. The method of claim 11,
A molding die in which the suction hole is a groove shape surrounding the entire circumference of the cavity. According to claim 1,
A molding die capable of applying tension to the release film in a state where the one side die and the other die are closer than when the release film is mounted on the one side die. According to claim 1,
A molding die further comprising a driving portion, wherein the other die film pressing member can be moved in the molding die opening and closing direction using the driving portion. A resin molding apparatus comprising the molding die according to any one of claims 1 to 14. A method for producing a resin molded article performed using the molding die according to any one of claims 1 to 14 or the resin molding apparatus according to claim 15,
A release film mounting process for attaching a release film to the forming die;
A release film adsorption process for adsorbing a release film on the die surface of the forming die,
A tension adding process for applying tension to the release film,
In the state in which the release film is adsorbed on the die surface, and includes a resin molding process for molding the resin by the molding die,
In the tension adding step, a tension is applied to the release film in a state where the release film is sandwiched between the one side die film pressing member and the other side die film pressing member, and supported.
In the resin molding step, the resin molding is performed between the die surface of the one die and the die surface of the other die in the state where the release film is adsorbed. The method of claim 16,
In the tension adding step, a method of manufacturing a resin molded article that applies tension to the release film in a state where the one side die and the other die are closer to each other than in the release film mounting step.

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