WO2014185202A1

WO2014185202A1 - Resin moulding device, and resin moulding method

Info

Publication number: WO2014185202A1
Application number: PCT/JP2014/060539
Authority: WO
Inventors: 佐藤　寿; 茂幸東福寺; 川口　誠
Original assignee: アピックヤマダ株式会社
Priority date: 2013-05-13
Filing date: 2014-04-11
Publication date: 2014-11-20
Also published as: KR20160006784A; JP2014222711A; KR102189199B1; CN105228805B; JP6137679B2; CN105228805A

Abstract

The present invention addresses the problem of providing a technique with which transfer moulding and compression moulding can be freely performed in one resin moulding device. A controller (130) is configured so as to be capable of selectively implementing moulding processing for causing transfer moulding to be performed, and moulding processing for causing compression moulding to be performed. Furthermore, the controller (130) is configured such that the selected and set moulding processing is performed on the basis of an external input result. In the transfer-moulding processing, processing is performed in which a transfer-moulding resin is supplied to a pot, and a plunger is used to pump the transfer-moulding resin into a cavity. In the compression-moulding processing, processing is performed in which a compression-moulding resin is supplied to a cavity. A resin supply unit (120) is configured so as to be capable of selectively supplying, to a moulding die, the transfer-moulding resin and the compression-moulding resin, in accordance with the selected moulding processing.

Description

Resin molding apparatus and resin molding method

The present invention relates to a technique effective when applied to a resin molding apparatus and a resin molding method.

For example, in the resin molding process of a semiconductor device, transfer molding in which resin is injected from a pot into a cavity and filled to seal the workpiece, and compression molding in which resin is supplied into the cavity to seal the workpiece are mainly used. It has been. The transfer molding and compression molding are appropriately selected according to the target workpiece, the form of the package to be molded, the resin used, and the like. For example, tablet resin or liquid resin obtained by solidifying granular resin is often used in transfer molding, and liquid resin or granular resin is often used in compression molding. As an apparatus using a liquid resin, Japanese Patent Application Laid-Open No. 2012-101517 (Patent Document 1) includes a resin supply apparatus including a dropping mechanism for dropping the liquid resin, a rotating mechanism for moving the dropping mechanism, and an advance / retreat mechanism. A transfer molding apparatus is described.

JP 2012-101517 A

As described above, the resin mold apparatus (manufactured apparatus for molded product) is provided with optimized configuration of each part as a transfer molding apparatus and a compression molding apparatus for each transfer molding and compression molding in order to increase productivity.

By the way, in a semiconductor manufacturing factory, since a transfer molding device and a compression molding device are selectively used according to product specifications and the like, both are often provided. In this case, it is necessary to install multiple types of equipment in the factory, so the installation area increases, these various maintenance costs increase, and the operation rate decreases because they are selectively used. It can be considered that depreciation takes a long time and adversely affects manufacturing costs.

In addition, as a molded product, transfer molding is performed using a transfer molding device, and then compression molding is performed using a compression molding device. Alternatively, compression molding is performed using a compression molding device and then transfer is performed using the transfer molding device. There are also products that are manufactured by molding. If a resin molding apparatus for each molding method is installed and used for such a molded product, the manufacturing cost of the molded product may increase due to the space required for the installation location or capital investment.

An object of the present invention is to provide a technique capable of performing transfer molding and compression molding in one resin molding apparatus. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

A resin mold apparatus according to an embodiment of the present invention is configured to be capable of holding a resin used for molding and holding the resin used for molding and supplying the mold to the molding die. A resin mold apparatus comprising: a resin supply unit; and a control unit that controls the press unit and the resin supply unit, wherein the press unit is configured to hold the resin supplied to the cavity. And a plunger for pumping the resin in the pot to the cavity, the plunger is configured to be driven, and the control unit performs a molding process and a compression molding for performing transfer molding. And the molding process selected and set based on an external input result is executed. In the transfer molding process, the transfer molding resin is supplied to the pot and the transfer molding resin is pumped to the cavity by the plunger. The compression molding process is compression molding. The resin supply unit selectively performs the transfer molding resin and the compression molding resin in accordance with the selected molding process according to the selected molding process. It can be supplied to the mold. Here, the press portion includes a cavity piece and a clamper surrounding the cavity piece, and includes the mold die in which the cavity piece moves relative to the clamper and the volume of the cavity changes. The resin supply unit includes a resin holding unit that moves between the inside and the outside of the press unit to hold the resin. In the transfer molding process, the resin holding unit holding the transfer molding resin is moved to the pot position. The transfer holding resin is supplied into the pot by the resin holding portion, and in the compression molding process, the resin holding portion holding the compression molding resin is moved to a cavity position or a workpiece position, and the resin The resin for compression molding is supplied to the inside of the cavity or the workpiece carried into the mold by the holding unit. In addition, it is preferable that the said control part is comprised so that one set said shaping | molding process may be performed a set number of times continuously.

According to this, both transfer molding and compression molding can be performed with a simple structure even with an automatic machine. Therefore, the added value of the resin mold apparatus can be improved.

In the resin mold apparatus according to the one embodiment, the clamper includes a runner gate that communicates the cavity and the pot, and the press unit includes an opening / closing mechanism that opens and closes the runner gate. Preferably, the transfer molding process is “open” and the compression molding process is “closed”.

According to this, the molding pressure (resin pressure) can be held by the action of the plunger at the time of transfer molding, and the molding pressure can be held by the action of the cavity piece at the time of compression molding.

In the resin molding apparatus according to the one embodiment, the mold mold includes first and second cavities communicating from one pot, transfer molding is performed in the first cavity, and the second It is preferable that compression molding is performed in the cavity.

According to this, transfer molding and compression molding can be simultaneously performed in one resin molding apparatus.

In the resin molding apparatus according to the one embodiment, in the compression molding process, it is preferable that the resin pressure is adjusted by the plunger in a state where the cavity piece is in a molding position.

According to this, in compression molding, the molding pressure can be adjusted (pressurized or depressurized) by the action of the plunger in addition to the action of the cavity piece.

In the resin molding apparatus according to the embodiment, it is preferable that the resin holding portion is linearly passed through the cavity position and the pot position.

According to this, the resin can be supplied to the cavity (work) or the pot while moving the resin supply portion in the shortest time.

In the resin mold apparatus in the embodiment, the same workpiece is subjected to the compression molding process after the transfer molding process, the same workpiece is subjected to the transfer molding process after the compression molding process, or the same workpiece. On the other hand, it is preferable to laminate the resin on the workpiece by performing at least one of the transfer molding process and the compression molding process a plurality of times.

According to this, various resin molds selected from transfer molding and compression molding can be performed on the same workpiece by using only one resin molding device without using the transfer molding device and the compression molding device. .

Briefly explaining the effects obtained by typical ones of the inventions disclosed in the present application, transfer molding and compression molding can be freely performed in one resin molding apparatus.

It is a schematic block diagram of the resin mold apparatus in 1st Embodiment of this invention. It is a figure for demonstrating operation | movement of the resin supply part in 1st Embodiment of this invention, and shows the case of resin supply for transfer molding. It is a figure for demonstrating operation | movement of the resin supply part in 1st Embodiment of this invention, and shows the case of resin supply for compression molding. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement in 1st Embodiment of this invention. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement in 1st Embodiment of this invention. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement in 2nd Embodiment of this invention. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement in 3rd Embodiment of this invention. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement in 4th Embodiment of this invention. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG.

In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted.

In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise . In addition, repeated descriptions of similar effects obtained from similar configurations may be omitted.

(First embodiment)
First, the resin mold apparatus 100 in this embodiment is demonstrated with reference to FIG. FIG. 1 is a schematic configuration diagram of a resin molding apparatus 100. In the following, a resin molding apparatus 100 as an automatic machine for mass production will be described.

As shown in FIG. 1, the resin molding apparatus 100 includes

press units

110 and 110, a resin supply unit 120, a control unit 130 that controls the press unit 110 and the resin supply unit 120, a work supply unit 140, A thickness measurement unit 150A before molding, a preheating unit 160, a thickness measurement unit 150B after molding, a delegation unit 180, and a workpiece storage unit 190 are provided. These constitute, for example, a resin mold apparatus 100 that can change the arrangement and quantity of units as units that can be recombined.

The resin molding apparatus 100 can freely perform transfer molding and compression molding, and these processes (steps) are controlled by the control unit 130. The control unit 130 is configured to selectively execute a molding process for performing transfer molding and a molding process for performing compression molding, and performs a molding process selected and set based on an external input result. It is configured. In this case, the control unit 130 can execute one set molding process continuously for a set number of times. For example, when the number of workpieces to be transfer-molded is prepared 1,000 and the contents are set, the control unit 130 executes the transfer molding 1000 times. As described above, the control unit 130 can execute the molding process selected as many times as the number of prepared workpieces.

Moreover, the resin mold apparatus 100 includes a conveyance path 200 connected between the units, and a loader 210 and an unloader 220 that move on the conveyance path 200 as a workpiece conveyance unit. The loader 210 moves between the workpiece supply unit 140 and the press unit 110 and conveys the workpiece W. The unloader 220 moves between the press unit 110 and the workpiece storage unit 190 and conveys the workpiece W. The workpiece W will be described as a strip-shaped substrate (including chip components mounted on the substrate), but the workpiece W is a carrier (such as a semiconductor wafer), a carrier that does not have a function as a lead frame or an interposer. It may be.

In addition, an input unit 230 is provided on the front surface of the resin molding apparatus 100 so that an operator can perform input for necessary operation settings and the like. This operator input is an external input result to the control unit 130. For example, the input unit 230 is configured to be able to select a control corresponding to various operations such as a transfer molding mode (molding process) and a compression molding mode, and to be able to set the number of times each molding is performed. The Further, the input unit 230 may be provided with a display unit that displays the input result and the set mode. Note that the input unit 230 is not necessarily provided. In this case, the control unit 130 may perform control by receiving an input result from an external computer connected to the resin molding apparatus 100 via a communication line.

In the workpiece supply unit 140 shown in FIG. 1, a plurality of workpieces W (molded products) before molding are stored in the stocker, and workpieces W are sequentially supplied. The workpiece W supplied from the stocker is placed on the table 141. The workpiece W placed on the table 141 is conveyed by the loader 210 to the thickness measuring unit 150A before molding.

In the thickness measuring section 150A before molding shown in FIG. 1, the thickness of the workpiece W before molding is measured. The thickness measuring unit 150A measures the thickness with a laser-type or contact-type displacement meter, thereby measuring the thickness of the substrate and adjusting the mold so that the substrate can be properly clamped, or measuring the thickness of the chip. It is provided for the control operation of adjusting the resin supply amount. Data measured by the thickness measurement unit 150A is sent to the control unit 130 as thickness data for performing the above-described control. The workpiece W whose thickness has been measured is conveyed to the preheating unit 160 by the loader 210. In addition, when the thickness of each workpiece | work W has a small dispersion | variation, 150 A of thickness measurement parts do not need to be provided.

In the preheating unit 160 shown in FIG. 1, the workpiece W before forming is preheated. The workpiece W is formed by being heated to the molding temperature by the press unit 110, but by being preheated by the preheating unit 160, the heating time in the press unit 110 can be shortened and the production efficiency can be improved. The preheated work W is conveyed to the press unit 110 by the loader 210. In addition, when it is not necessary to shorten the heating time of the workpiece W, the preheating unit 160 may not be provided.

1 is controlled by the control unit 130, and resin molding is performed on the workpiece W before molding. The resin molding apparatus 100 includes a press unit 110A (110) and a press unit 110B (110) that are arranged so as to sandwich the resin supply unit 120 therebetween. As will be described later, the pressing unit 110 can perform both transfer molding and compression molding. In addition, the press part 110 may be one or three or more structures.

1 is controlled by the control unit 130 to supply resin to the press unit 110. The resin supply unit 120 is configured to be able to selectively supply a transfer molding resin and a compression molding resin to the mold according to the selected molding process. The control unit 130 causes the resin supply unit 120 to supply a resin for transfer molding to the pot 33 in the transfer molding process and to supply a resin for compression molding to the cavity in the compression molding process. To do.

Here, the resin supply unit 120 will be described in more detail with reference to FIGS. 2 and 3 are views for explaining the operation of the resin supply unit 120. FIG. 2 shows the case of transfer molding resin supply, and FIG. 3 shows the case of compression molding resin supply. 2 and 3 schematically show a mold die (upper die 31 and lower die 32) provided in the press unit 110, a pot 33, a cavity concave portion 34 that constitutes a cavity at the time of clamping, a plunger 52, and the like. A plurality of pots 33 are arranged in a row in the depth direction on the paper surface at a predetermined interval (pitch) in a line within the parting surface (see FIG. 1). In addition, the cavity recesses 34 and the like are formed symmetrically about each pot 33. As described above, the press unit 110 drives the plunger 52 in a mold die including the pot 33 configured to hold the resin supplied to the cavity and the plunger 52 that pumps the resin in the pot 33 to the cavity. It is configured to be possible.

2 and 3 is configured to be able to hold the resin used for resin molding and supply it to the press unit 110 (mold mold). The resin supply unit 120 includes a resin holding unit 10 that moves between the inside and the outside of the press unit 110 to hold the resin. It is preferable that the resin supply unit 120 includes a plurality of resin holding units 10, and the interval between the resin holding units 10 is variably configured according to the interval between the pots 33, for example. According to this, even when the layout such as the pot arrangement or the cavity arrangement is changed, it can be easily handled by changing the interval (pitch) between the resin holding portions 10.

In the present embodiment, description will be made assuming that the resin supply unit 120 uses a thermosetting liquid resin (for example, a silicone resin or an epoxy resin) for the transfer molding resin and the compression molding resin and supplies the resin. Further, the liquid resin contains an additive such as a filler depending on the object to be molded. For example, a phosphor is contained in a liquid resin used for molding an LED lens, or a white pigment such as titanium oxide or aluminum oxide is contained in a liquid resin used for molding an LED reflector. In this case, a nozzle head 10 configured to be able to hold the liquid resin so as not to flow out is used as the resin holding unit 10. Further, as the resin holding unit 10 for supplying the granular resin, it is also possible to use a configuration in which the granular resin held on the closed shutter that is configured to be opened and closed in the parallel direction can be dropped to supply the resin by opening the shutter. . Further, as the resin holding part 10 made of a plate-like or block-like resin, a structure capable of switching between holding and dropping of the resin by opening and closing the clamp part and capable of supplying the resin can be used.

In the present embodiment, the resin supply unit 120 includes a syringe 11 that encloses a liquid resin in a state where two liquids of a main material and a curing material are mixed, a piston 12 that slides in the syringe 11, and one end connected to the syringe 11. The other end of the tube 13 is a nozzle head 10, and the pinch valve 14 is provided on the nozzle head 10 to push and hold the tube 13 to open and close the nozzle head 10. The tube 13 is bent in the horizontal direction from the syringe 11 extending in the vertical direction to ensure a predetermined distance, and is bent from the horizontal direction to the vertical direction in order to configure the nozzle head 10. The resin supply unit 120 includes a temperature adjustment unit 15 that adjusts the temperature around the tube 13. The temperature adjusting unit 15 can prevent the liquid resin from reacting when the nozzle head 10 is positioned inside the hot press unit 110.

As shown in FIG. 3, the length of the tube 13 is different so that the resin supply unit 120 can supply the liquid resin to each of the two workpieces W arranged on the parting surface of the lower mold 32 in the horizontal direction. Two sets of nozzle heads 10 and the like are provided. The distance from the syringe 11 to the nozzle head 10 can be adjusted by adjusting the length of the tube 13. For example, the distance can be adjusted within the range of the tube 13 having an extra length, or a tube having an appropriate length. It can also be adjusted by changing to 13.

In the resin supply unit 120, the liquid resin is pumped from the syringe 11 by the piston 12 and supplied (dropped) from the nozzle head 10. The resin supply unit 120 includes a resin cutting mechanism for cutting the liquid resin by expanding or contracting the distance from the nozzle head 10 to the pot 33 by tilting or raising and lowering the nozzle head 10. It can be performed quickly to reduce the time required for the resin supply process and to prevent contamination in the press part 110 due to resin dripping. Further, in a state of waiting for the resin supply, the liquid resin can be held by being blocked by the pinch valve 14, so that the liquid resin is prevented from dripping, and the inside of the press unit 110 is contaminated by the resin dripping. Can be prevented.

Further, the pinch valve 14 prevents the liquid resin from being deteriorated by touching the outside air, and prevents the air from entering the tube 13. The resin supply unit 120 includes a shutter 16 that moves forward and backward in the horizontal direction below the nozzle head 10. The shutter 16 can prevent the liquid resin from falling while preventing the nozzle head 10 (liquid resin) from being heated from the press section 110.

In addition, the resin supply unit 120 includes a forward / backward drive mechanism for moving the nozzle head 10, the syringe 11 and the like in the horizontal direction (indicated by symbol A in FIGS. 2 and 3) and a rotational movement (indicated by symbol B) in the horizontal plane. A rotation drive mechanism to be shown). The nozzle head 10 can be moved from the outside to the inside of the press unit 110 by the advance / retreat drive mechanism. Further, the nozzle head 10 can be rotated by the rotation drive mechanism so that the nozzle head 10 faces the press part 110A or the press part 110B disposed on both sides of the resin supply part 120 (see FIG. 1).

FIG. 2 shows a state in which the nozzle head 10 with the long tube 13 supplies liquid resin into the pot 33 inside the press section 110A, and the nozzle head 10 with the short tube 13 does not supply resin. FIG. 3 shows a state in which both nozzle heads 10 supply the liquid resin on the two workpieces W inside the press section 110B. In the present embodiment, the nozzle head 10 linearly passes between the work position (cavity position) and the pot position inside the press unit 110. According to this, it is only necessary to move the nozzle head 10 along a predetermined trajectory, and the liquid resin can be supplied to the work W or the pot 33 at the cavity position only by switching the stop position (supply position).

The resin supply unit 120 supplies the two liquids and mixes them immediately before the nozzle head 10 without using the syringe 11 that encloses the liquid resin in a state where the two liquids of the main material and the hardener are mixed. It may be configured to supply from the head 10. Moreover, the structure which provides the dispenser (resin holding | maintenance part) in the loader 210 as the resin supply part 120 may be sufficient. Moreover, the resin supply part 120 can also use the trough used in the case of the hand used in the case of a resin tablet, and granular resin as a resin holding | maintenance part. Alternatively, a dispenser may be incorporated into the mold and supplied directly to the pot 33 or cavity position. Further, the resin can be supplied onto the workpiece W outside the press, and the resin can be supplied to the cavity together with the workpiece W. As described above, the resin supply unit 120 can selectively supply the transfer molding resin and the compression molding resin to the mold according to the processing selected and performed in the transfer molding and the compression molding. Composed. For example, tablet resin, liquid resin, or granular resin is supplied as the transfer molding resin. Moreover, liquid resin, granule resin, sheet resin, etc. are supplied as resin for compression molding. However, as the transfer molding resin and the compression molding resin, the same type of resin may be supplied by switching the supply position and method as described above.

In the thickness measuring section 150B after molding shown in FIG. 1, the thickness of the workpiece W after molding is measured. Thickness measurement unit 150B has the same configuration as thickness measurement unit 150A, and is provided for measuring the thickness of workpiece W after molding and adjusting the amount of resin supplied. Data measured by the thickness measurement unit 150B is sent to the control unit 130 as thickness data. The workpiece W whose thickness has been measured is conveyed to the table 191 by the unloader 220. In addition, when the thickness of each workpiece | work W after shaping | molding has a small dispersion | variation, the thickness measurement part 150B does not need to be provided.

The work W placed on the table 191 is conveyed to the delegation unit 180 by the unloader 220. In the delegation unit 180 shown in FIG. 1, unnecessary resin such as molding cul and molding runner gate is removed from the workpiece W subjected to transfer molding. In the storage unit 190, the workpieces W from which unnecessary resin has been removed are sequentially stored in the stocker. On the other hand, since the unnecessary resin does not need to be removed in the workpiece W that has been compression-molded, the workpiece W is stored in the storage unit 190 through the delegation unit 180.

Next, the press part 110 which is the principal part of the resin mold apparatus 100 in this embodiment is demonstrated with reference to FIG. FIG. 4 is a schematic cross-sectional view of the main part of the resin molding apparatus 100. FIG. 4 also shows a workpiece W in a state of a molded product. In the work W, a chip component 21 (for example, a semiconductor chip) is mounted on a substrate 20 (for example, a wiring substrate) by die bonding, and the substrate 20 and the chip component 21 are electrically connected by a bonding wire 22.

The press unit 110 includes a mold 30 (a pair of an upper mold 31 and a lower mold 32). In the mold 30, a pot 33 is provided in the lower mold 32, and a cavity recess 34 that constitutes a cavity C at the time of clamping is provided in the upper mold 31. In this case, the cavity C is, for example, a MAP (Matrix Array) that collectively seals a region including a plurality of chip components 21 arranged in a matrix.
Package) type rectangular shape suitable for molding. The cavity C and the pot 33 communicate with each other when the mold is closed (see FIG. 5). The mold 30 includes a cavity piece 35 that forms the bottom of the cavity recess 34 and a clamper 36 that surrounds the cavity piece 35 and forms a wall of the cavity recess 34. The cavity piece 35 is relative to the clamper 36. Movement of the cavity C changes the depth (height) of the cavity recess 34 and changes the volume of the cavity C. The mold 30 has a configuration in which a cavity recess 34 and the like are provided symmetrically about a pot 33.

The configuration of the upper mold 31 will be specifically described. In the upper mold 31, a cavity piece 35 constituting a cavity bottom portion is fixedly assembled to a chase 37 (mold chase block). The cavity piece 35 may be positioned on the chase 37 via another block that is rigidly supported, or may be positioned via an elastic member. Moreover, you may position through an elastic member. In this case, when the upper surface of the chip component 21 is exposed by clamping and molding, it is possible to prevent the flash flash by securely clamping while reducing the stress on the chip component 21.

The clamper 36 (movable clamper) is assembled to the chase 37 so as to be movable in the vertical direction via a spring 40 that is an elastic member. The clamper 36 is provided with a plurality of through holes 41 through which the cavity piece 35 is inserted into a single plate-shaped mold. That is, around the cavity piece 35, a clamper 36 that clamps the workpiece W is suspended and supported via the spring 40 (floating support).

For this reason, in the relationship between the cavity piece 35 fixed to the chase 37 and the moving clamper 36, the cavity piece 35 moves relative to the clamper 36 due to the expansion and contraction of the spring 40. A cavity recess 34 is formed on the parting surface (clamp surface) of the upper die 31 by the lower surface of the cavity piece 35 and the inner wall surface of the clamper 36 (through hole 41) disposed so as to surround the cavity piece 35. Therefore, in the mold 30, the volume of the cavity recess 34 is changed by the relative movement of the cavity piece 35.

On the parting surface of the clamper 36, a cull 42 and a runner gate 38 are formed in the central portion so as to communicate with the through hole 41, and an air vent (groove) (not shown) is formed from the through hole 41 toward the outside of the mold. Yes. The opening on the lower mold 32 side of the through hole 41 is formed in a shape (concave shape) that matches the shape of the molded product. A through hole 41 is formed at the bottom of the recess.

In this embodiment, the upper die 31 is provided with an opening / closing mechanism 23 that opens and closes the runner gate 38 by a driving mechanism (not shown) in the press unit 110, and the runner gate 38 is moved by the opening / closing mechanism 23 during the transfer molding process. The runner gate 38 is closed by the opening / closing mechanism 23 during the compression molding process. The open / close mechanism 23 has a lower movable pin 24 (movable member) disposed on the lower end (front end) side, a lower movable pin 24 (movable member), an intermediate movable pin 25, and an upper end (rear end) side. The upper movable pin 26 arranged and springs 27 and 28 are provided.

The lower movable pin 24 has a flange-like upper end. The lower movable pin 24 is provided in a stepped through hole formed in the center portion of the clamper 36, and the middle portion and the lower end pass through the small diameter through hole. A spring 27 is provided at the bottom of the large-diameter through hole. A middle portion of the lower movable pin 24 is passed through a coiled spring 27, and a lower peripheral edge of the upper end of the lower movable pin 24 is urged by the spring 27. A spring 28 is provided on the upper end of the lower movable pin 24. The lower end of the middle movable pin 25 is urged by the spring 28. This spring 28 has higher elasticity than the spring 27.

The upper movable pin 26 is connected to a driving mechanism (for example, a cylinder) not shown on the upper end side so as to move up and down. The upper movable pin 26 is provided in a through hole formed in the central portion of the chase 37. The upper movable pin 26 is provided so as to face the lower end of the upper movable pin 26 so as to contact the upper end of the middle movable pin 25. When the opening / closing mechanism 23 is in the “open” state, the upper end of the middle movable pin 25 and the lower end of the upper movable pin 26 are spaced apart.

From this “open” state, the upper movable pin 26 moves downward to come into contact with the middle movable pin 25, and when the upper movable pin 26 moves further downward, the lower movable pin 24 is moved via the spring 28. Is moved downward to compress the spring 27. When the spring 27 is compressed and the lower movable pin 24 enters the runner gate 38, the opening / closing mechanism 23 is in a “closed” state (see FIG. 8). Here, even if the mold is closed when the opening / closing mechanism 23 is in the “closed” state (see FIG. 9), the work W is damaged by biting of the lower movable pin 24 due to the spring 28 being compressed. It has no configuration. Further, a step may be provided in the through hole so that the lower movable pin 24 does not rise above the position of the “open” state. Thereby, it is possible to prevent the occurrence of sliding failure and breakage of the release film 43 due to the resin entering the through hole by the lower movable pin 24 being pushed by the resin pressure.

According to such an opening / closing mechanism 23, it is possible to switch between transfer molding and compression molding using a single mold 30 and perform molding by the action of the plunger 52 at the time of transfer molding. Resin pressure) is held, and the compression pressure is held by the action of the cavity piece 35 during compression molding. Note that the molding pressure may be maintained by the action of the cavity piece 35 also during transfer molding.

It should be noted that when the opening / closing mechanism 23 is configured, a rotation pin that can be rotated in a state where the runner gate 38 is advanced may be used. Specifically, a linear runner groove carved into one end face of the rotating pin on the runner gate 38 side is formed, and this runner groove is connected to the runner gate 38 by the rotation of the rotating pin (communication). The runner gate 38 may be opened and closed as a configuration in which the runner groove is closed without being connected to the runner gate 38 (not communicated).

Further, the opening / closing mechanism 23 may be configured to replace a simple mold member. For example, a mold member (transfer member, compression member) that forms a parting surface at the center of the clamper 36 and is separated from the clamper 36 can be used. The transfer member is formed with a parting surface having a runner gate 38 that communicates the cavity C and the pot 33. The compression member is formed with a flat parting surface that closes the pot 33. Transfer molding and compression molding can be switched by a simple exchanging operation of a mold member such as a transfer member or a compression member (a closing piece for closing the resin path). Thus, the molding pressure is held by the action of the cavity piece 35 during compression molding.

As shown in FIG. 4, a release film 43 is stretched on the upper parting surface including the cavity recess 34. An airtight seal 44 (for example, an O-ring) is provided between the clamper 36 and the chase 37. In addition, a gap 45 between the cavity piece 35 and the clamper 36 communicating with the upper parting surface is formed, and a suction path 46 is formed in the chase 37 so as to communicate with the gap 45. A suction mechanism 47 communicates with the suction path 46. Accordingly, the release film 43 is sucked and held by the suction mechanism unit 47 via the gap 45 and the suction path 46 on the upper parting surface.

The release film 43 has heat resistance that can withstand the heating temperature of the mold 30 and is easily peeled off from the mold surface, and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidyne chloride and the like are preferably used. For example, a long film material is used as the release film 43, and the release film 43 is provided so as to be drawn out from a feeding roll wound up in a roll shape, passed through an upper parting surface, and wound up onto a winding roll.

By using the release film 43, resin leakage from the gap between the cavity piece 35 and the clamper 36 (that is, the outer peripheral portion of the cavity piece 35) can be prevented. Further, resin clogging between the cavity piece 35 and the clamper 36 can be prevented, and the relative movement of the cavity piece 35 with respect to the clamper 36 can be ensured.

In the present embodiment, the case where the release film 43 is provided so as to cover the outer peripheral portion of the cavity piece 35 will be described. However, when the influence of resin leakage is low, the release film 43 may not be provided. . Further, the press part 110 may be configured to include a seal ring that is provided between the cavity piece 35 and the clamper 36 and is provided around the outer periphery of the cavity piece 35 to prevent resin leakage.

Next, the configuration of the lower mold 32 will be specifically described. The lower mold 32, which is a movable type, raises and lowers the lower movable platen on which the chase 50 is placed via a drive transmission mechanism (a link mechanism such as a toggle link or a screw shaft) driven by a drive source (electric motor). The mold is opened and closed by a mold clamping mechanism. In this case, the raising / lowering operation of the lower mold 32 can arbitrarily set the moving speed, the applied pressure, and the like.

A center insert 51 is assembled to the chase 50. A cylindrical pot 33 to which the resin R is supplied is assembled to the center portion of the center insert 51. The upper end surface of the center insert 51 is formed flush with the upper end surface of the pot 33. In the pot 33, there is provided a plunger 52 slidable in the vertical direction by a known transfer driving mechanism. As the plunger 52, a multi-plunger in which the same number is provided on a support block (not shown) corresponding to the plurality of pots 33 is used. An elastic member (not shown) is provided on the support portion of each plunger 52. Each plunger 52 is slightly displaced by the elasticity of the elastic member to release an excessive pressing force, and adapts to the variation in the resin amount of the tablet during holding. Can be done.

On the upper surface of the chase 50, work support portions 53 on which the work W is placed are provided adjacent to both sides of the center insert 51, respectively. Each work support 53 is supported in a floating manner by a spring 55 provided between the upper surface of the chase 50. The workpiece support 53 is located slightly lower than the upper end surfaces of the center insert 51 and the clamper support 54 provided around the workpiece support 53.

A clamper support portion 54 is provided on the chase 50 adjacent to the work support portion 53 and on the outer peripheral side thereof. The upper end surface of the clamper support portion 54 is formed to be the same height as the upper end surface of the center insert 51. When the workpiece support 53 is pushed down against the biasing force of the spring 55 while the clamper 36 clamps the workpiece W, the clamp surface (parting surface) of the clamper 36 comes into contact with the upper end surface of the clamper support 54. Yes.

By the way, the spring 40 that suspends and supports the clamper 36 has an elastic force larger than that of the spring 55. Specifically, the force applied by the spring 40 to each workpiece W and the workpiece support portion 53 is designed to be sufficiently larger than the force applied by the spring 55. As a result, the lower die 32 is raised when the die is closed, so that the spring 55 can be bent without bending the spring 40. When clamping, the clamp is performed at a uniform height regardless of the plate thickness of the workpiece W. can do. Further, since the clamping force on the workpiece W by the clamper 36 can continue to be applied, resin flash flash can be prevented.

Further, between the work support portion 53 supported by the spring 55 and the chase 50, plate thickness adjustment blocks (taper blocks) 56A and 56B having an interface formed on a tapered surface (inclined surface) are provided so as to overlap each other. (Wedge mechanism 56). Specifically, the plate thickness adjustment blocks 56A and 56B are configured such that the overall thickness is uniform in the depth direction by combining blocks having different thicknesses in the depth direction of the drawing.

One of the plate thickness adjustment blocks 56A and 56B superimposed on the upper and lower stages is configured to be slidable by a drive source such as an air cylinder or a motor. For example, the upper plate thickness adjustment block 56 A may be integrally provided on the lower surface side of the work support portion 53. In this case, the lower plate thickness adjustment block 56B is movably provided.

In this way, the thickness is changed by sliding the plate

thickness adjusting blocks

56A and 56B combined with the inclined surfaces, and the position is fixed by the frictional force at the interface between the plate

thickness adjusting blocks

56A and 56B. Resin pressure or the like is not directly applied to the drive source, and the position of the workpiece support portion 53 can be maintained with higher accuracy compared to a configuration in which the position is fixed by a brake or the like by the drive source. That is, even if the clamper 36 raises the lower mold 32 and the clamper 36 applies a force to push down the workpiece support 53, the chase 50 can support and fix the workpiece support 53 at a predetermined height. Therefore, the clamper 36 pushes down the workpiece support 53 excessively. Thus, the molding thickness can be maintained. For example, when the variation in the thickness of the workpiece W is small and there is no need to adjust the plate thickness like a lead frame, the mold mechanism 30 may not be provided with the wedge mechanism 56 (plate thickness adjusting mechanism). is there.

The mold 30 is provided with a seal portion 57 (for example, an O-ring) for hermetically sealing the parting surface when the mold is closed further outward than the plane position of the air vent. The chase 50 between the air vent and the seal portion 57 is provided with a flow passage 60 for circulating the air discharged from the air vent. The flow passage 60 communicates with a decompression mechanism 61 that decompresses the inside of the cavity C that is blocked from the outside. In addition, when air can be reliably discharged from the air vent, the decompression mechanism 61 may not be provided.

Next, a transfer molding process (control process by the control unit 130) using the resin mold apparatus 100 will be described with reference to FIGS. 4 to 7 are schematic cross-sectional views of the press part 110, which is a main part of the resin molding apparatus 100, for explaining the operation.

In the transfer molding process, the lower movable pin 24 is retracted from the runner gate 38, and the opening / closing mechanism 23 is in the "open" position. The lower mold 32 is moved up and down by a mold clamp drive, and the plunger 52 is moved by a transfer drive. The relative movement of the cavity piece 35 (mold clamp driving) and the movement of the plunger 52 (transfer driving) are controlled by the control unit 130 (see FIG. 1) of the resin molding apparatus 100.

As shown in FIG. 4, in the state where the mold 30 is opened, the release film 43 is adsorbed and held on the upper parting surface. In addition, the workpiece W is loaded (set) into the workpiece support portions 53 arranged on both sides of the center insert 51. Then, the nozzle head 10 holding the transfer molding resin (liquid resin) is moved to the pot position, and the resin R (transfer molding resin) is supplied into the pot 33 by the nozzle head 10.

Subsequently, the lower mold 32 is raised so as to be in the state shown in FIG. 5, the substrate surface of the work W is clamped by the clamper 36, the work support part 53 is pushed down, and the clamper 36 is abutted against the clamper support part 54. Close the mold. By closing the mold, the pot 33, the cull 42, the runner gate 38, and the cavity C (cavity recess 34) communicate with each other. Here, the workpiece W is clamped by the clamper 36 so that the parting surface of the cavity piece 35 is in a retracted position that is retracted by a predetermined thickness from the thickness dimension of the molded product. The volume of the cavity C at this time is larger than the volume of the cavity C where the cavity piece 35 is in the molding position (see FIG. 7).

Also, the plate thickness difference is absorbed and clamped so that the substrate upper surface of the workpiece W and the upper end surfaces of the center insert 51 and the clamper support portion 54 are flush with each other. At this time, even if there is a difference in the thickness of the workpiece W carried on both sides of the center insert 51, the substrate upper surface of the workpiece W can be made to have a uniform height. The molding thickness can be made uniform while preventing flashing of the resin R.

Next, the workpiece W is pressed against the clamper 36 by adjusting the height position of the workpiece support 53 that supports the workpiece W to absorb the variation in workpiece plate thickness. Specifically, a driving source (such as an air cylinder) (not shown) is operated to move the lower plate thickness adjustment block 56B forward or backward by a predetermined amount, for example, so that the upper plate thickness adjustment block 56A is placed on the work support portion 53 on the lower surface. Fix in close contact.

Subsequently, as shown in FIG. 6, the plunger 52 is raised while the workpiece W is clamped by the clamper 36, and the resin R melted in the pot 33 is passed through the cull 42 and the runner gate 38 to the cavity C. Pump into the cavity C by pumping. At this time, since the gap to the parting surface of the cavity piece 35 formed above the chip component 21 mounted on the workpiece W is large, the flow rate of the resin R is suppressed, and the resin R is filled at low speed and low pressure. For this reason, wire flow is prevented and high quality molding is possible.

Subsequently, as shown in FIG. 7, the cavity piece 35 is relatively moved and pushed out of the cavity C so as to reduce the volume of the cavity C in a state where the cavity C is filled with the resin R. The plunger 52 is moved so as to accommodate the resin R toward the pot 33 side.

Specifically, the lower mold 32 is further raised by mold clamping drive. As a result, the clamper 36 is raised by the center insert 51 and the clamper support portion 54 to compress and compress the spring 40, and the relative position of the cavity piece 35 with respect to the clamper 36 corresponds to the molding position (final height). The surplus resin R in the cavity C is pushed out to the pot 33 side so as to be in the normal position. The excess resin R is accommodated on the pot 33 side from the cavity C by lowering the plunger 52 by transfer driving.

Then, in order to hold the inside of the cavity C, the molten resin R is heated and cured while raising the plunger 52 as necessary, and the molded product is almost completed. According to the press part 110 in this embodiment, the cavity piece 35 can be moved by mold clamping drive (press drive) to perform transfer molding.

In this embodiment, the case where the molded product is manufactured by changing the volume of the cavity C has been described. However, the present invention is not limited to this, and the cavity C fixed at the molding position from the beginning, that is, the volume of the cavity C is fixed. Molded articles can also be produced.

Next, a compression molding process (control process by the control unit 130) using the resin mold apparatus 100 will be described with reference to FIGS. 8 to 10 are schematic cross-sectional views of the press unit 110, which is a main part of the resin mold apparatus 100, for explaining the operation.

In the compression molding process, the lower movable pin 24 (closing pin) enters the gate of the runner gate 38, and the opening / closing mechanism 23 is in the "closed" position. Thereby, the gate of the runner gate 38 can be closed and the resin R can be prevented from flowing out to the side of the cull 42.

As shown in FIG. 8, the release film 43 and the workpiece W are set in a state where the mold 30 is opened. Then, the nozzle head 10 holding the compression molding resin (liquid resin) is moved to each workpiece position (cavity position), and the resin R (compression molding resin) is supplied onto the workpiece W by the nozzle head 10.

Subsequently, as shown in FIG. 9, the lower mold 32 is raised, the substrate surface of the workpiece W is clamped by the clamper 36, the workpiece support 53 is pushed down, and the clamper 36 is abutted against the clamper support 54. Close the mold. Although the cavity C is formed by closing the mold, the cavity C is blocked from the pot 33, the cull 42, and the runner gate 38 by the lower movable pin 24.

Here, the workpiece W is clamped by the clamper 36 so that the cavity bottom surface of the cavity piece 35 is in a retracted position that is retracted by a predetermined thickness from the thickness dimension of the molded product. The volume of the cavity C at this time is larger than the volume of the cavity C where the cavity piece 35 is in the molding position (see FIG. 10). In addition, the plate thickness difference is absorbed and clamped so that the substrate upper surface of the workpiece W and the upper end surfaces of the center insert 51 and the clamper support portion 54 are flush with each other.

Subsequently, the cavity piece 35 is relatively moved so as to reduce the volume of the cavity C while the work W carried into the mold 30 is clamped by the clamper 36 so as to be in the state shown in FIG. The cavity C is filled with the resin R. Specifically, the lower mold 32 is further raised by the mold clamp drive, and the clamper 36 is raised by the center insert 51 and the clamper support portion 54 to compress and compress the spring 40. Thereby, the relative position of the cavity piece 35 with respect to the clamper 36 becomes a molding position (final height position, normal position) corresponding to the thickness dimension of the molded product.

Then, in order to hold the inside of the cavity C, the molten resin R is heated and cured while raising the lower mold 32 again as necessary, and the molded product is almost completed. According to the mold 30 in the present embodiment, the cavity piece 35 can be moved by mold clamping driving (press driving) to perform compression molding.

As described above, the resin mold apparatus 100 includes the mold 30 that changes the volume of the resin supply unit 120 and the cavity C, so that both transfer molding and compression molding can be performed with a simple structure even in an automatic machine. Can be done. Therefore, the added value of the resin mold apparatus can be improved.

That is, transfer molding and compression molding can be freely performed with only one resin molding apparatus 100 according to product specifications and the like. For this reason, it can respond easily to the required production plan. For example, even if the ratio between a product produced by transfer molding and a product produced by compression molding changes, it can be easily handled. In addition, in a semiconductor manufacturing factory that has been made into a clean room, it is only necessary to install this device with the minimum number of devices, and the installation area can be reduced, and various maintenance costs can be greatly reduced. Further, by selectively using one resin molding apparatus 100, it is possible to improve the apparatus operating rate and depreciate it in a short period of time, thereby reducing the manufacturing cost of the product. Furthermore, it becomes easy to deal with a case where a relatively small number of productions are switched.

In order to change the volume of the cavity, the wedge mechanism described in the above plate thickness adjusting mechanism is used to change the height (depth) of the cavity piece, and a mechanism that makes the cavity height variable is used. it can. As another cavity height changing mechanism, a cavity piece is connected to a drive source and is movably assembled to a chase of a mold, and a clamper is fixedly assembled to the chase. The structure which moves a piece relatively may be sufficient. According to this, the volume of the cavity can be changed with a simple structure.

(Second Embodiment)
In the first embodiment, the case where the

press portions

110A and 110B are formed in the same manner (transfer molding or compression molding) has been described. In this embodiment, the LED (Light Emitting Diode) reflector is formed by transfer molding in the press part 110A of one resin molding device 110, and then the LED lens is formed by compression molding in the press part 110B. The case will be described.

Referring to FIG. 11, the press part 110 A that is a main part of the resin mold apparatus 100 in the present embodiment will be described. Moreover, the press part 110B is demonstrated with reference to FIG. 11 and 14 also show the workpiece W in a state of a molded product. In the workpiece W in this embodiment, the chip component 21 is flip-chip mounted on the substrate 20, and the substrate 20 and the chip component 21 are electrically connected by the bumps 22 A.

As shown in FIG. 11, in the press part 110A in this embodiment, the cavity piece 35 is assembled to the chase 37 so as to be movable in the vertical direction via a spring 40A that is an elastic member. That is, the cavity piece 35 is suspended and supported (floating support) via the spring 40A. The cavity piece 35 is provided with a protrusion 35 a that contacts the upper surface of the chip component 21. When the resin molding is performed, the protrusion 35 a comes into contact with the upper surface of the chip component 21, so that it becomes easy to perform mold underfill in which the resin fills the space between the substrate 20 and the chip component 21.

As shown in FIG. 14, in the press part 110B in this embodiment, the cavity piece 35 is assembled to the chase 37 so as to be movable in the vertical direction via a spring 40A that is an elastic member. The cavity piece 35 is provided with a semicircular recess serving as a lens.

Next, a transfer molding process and a compression molding process (control process performed by the control unit 130) using the resin mold apparatus 100 will be described with reference to FIGS. FIG. 11 to FIG. 16 are schematic cross-sectional views of the press part 110, which is a main part of the resin mold apparatus 100, for explaining the operation.

In the transfer molding process, the lower movable pin 24 is retracted from the runner gate 38, and the opening / closing mechanism 23 is in the "open" position. As shown in FIG. 11, the release film 43, the work W, and the resin R are prepared (set) in a state where the mold 30 is opened.

Subsequently, the lower mold 32 is raised and closed so as to be in the state shown in FIG. By closing the mold, the pot 33, the cull 42, the runner gate 38, and the cavity C (cavity recess 34) communicate with each other. Here, the protrusion 35 a of the cavity piece 35 is in contact with the upper surface of the chip component 20, and the work W is clamped by the clamper 36. At this time, since the cavity piece 35 is assembled via the spring 40A, it is possible to prevent the flashing of the resin R on the upper surface of the chip component 20 without increasing the clamping force. Yes.

Subsequently, as shown in FIG. 13, the plunger 52 is raised while the workpiece W is clamped by the clamper 36, and the resin R melted in the pot 33 is passed through the cull 42 and the runner gate 38 to the cavity C. Pump into the cavity C by pumping. At this time, since the upper part of the chip component 21 is blocked by the protrusion 35a, the chip R 21 can be molded without blocking the upper surface (light emitting surface) of the chip component 21 with the resin R that has been pumped.

Then, in order to maintain the pressure in the cavity C, the molten resin R is heated and cured while raising the plunger 52 as necessary, whereby the LED reflector is substantially completed. At this time, the upper surface of the chip component 21 is exposed, and each portion is formed on the outer peripheral portion so that the end surface of the cavity piece 35 is lower than the upper end position of the wall portion of the cavity recess 34 by the clamper 36. The outer peripheral wall portion Ra for preventing resin leakage is formed. The mold underfill may be performed so that the upper surface of the chip component 21 is exposed without forming a recess for each chip component 21 by the cavity piece 35 not provided with the protrusion 35a. Moreover, when there is no influence of resin leakage, the structure which does not form outer peripheral wall part Ra may be sufficient.

Next, in this embodiment, since the same workpiece W is continuously formed in the resin molding apparatus 100, the workpiece W having passed through the press part 110A is carried into the press part 110B after unnecessary resin is removed by the degate part 180. Will be.

Subsequently, as shown in FIG. 14, in the compression molding process, the lower movable pin 24 (closing pin) enters the gate of the runner gate 38, and the opening / closing mechanism 23 is in the "closed" position. Further, in a state where the mold 30 is opened, the release film 43, the workpiece W, and the resin R are prepared (set). The resin R has a lower viscosity and higher fluidity than the liquid resin for the reflector, but the outer peripheral wall Ra prevents the resin R from leaking from the workpiece W.

Subsequently, the lower mold 32 is raised and closed so as to be in the state shown in FIG. Although the cavity C is formed by closing the mold, the cavity C is blocked from the pot 33, the cull 42, and the runner gate 38 by the lower movable pin 24.

Subsequently, the cavity piece 35 is relatively moved so as to reduce the volume of the cavity C while the work W carried into the mold 30 is clamped by the clamper 36 so as to be in the state shown in FIG. The cavity C is filled with the resin R. Then, in order to hold the inside of the cavity C, the molten resin R is heated and cured while raising the lower mold 32 as necessary, whereby the LED lens is substantially completed. Thereafter, the workpiece W that has passed through the press unit 110B is stored in the storage unit 190 without removing unnecessary resin by the degate unit 180. Subsequently, the LED package is formed by cutting each chip component 21 into pieces by a cutting device (not shown). Note that the entire region formed by one cavity C may be used as one LED package. In this case, the outer peripheral wall portion Ra can be used as a reflector.

In the present embodiment, the case where the compression molding is continuously formed after the transfer molding in one resin mold apparatus 100 has been described. However, the transfer molding may be continuously molded after the compression molding. For example, after the bonding wire on the substrate is molded by compression molding, the whole including the bonding wire molded by transfer molding can be molded. Specifically, after compression molding while preventing wire flow with a low-viscosity resin, transfer molding with another resin (for example, a resin excellent in high strength, moisture resistance, and electromagnetic shielding) to cover the entire outer periphery Good. In this case, the whole may be covered by matrix molding in compression molding and MAP molding in transfer molding.

Further, according to the resin mold apparatus 100, the resin can be laminated on the work W by performing at least one of transfer molding and compression molding a plurality of times on the same work W. For example, in one resin mold apparatus 100, the RGB phosphor layer of the LED can be laminated and the phosphor layer and the clear layer of the LED can be sequentially formed.

(Third embodiment)
In the first and second embodiments, the case where the same pressing unit 110 performs the same molding (transfer molding or compression molding) has been described. In the present embodiment, a case where different molding is performed in the same press part 110 will be described.

Referring to FIG. 117, a description will be given of the press unit 110 that is a main part of the resin mold apparatus 100 in the present embodiment. In the present embodiment, a mold die 30 is formed that can form an LED reflector by transfer molding and an LED lens by compression molding.

As shown in FIG. 17, in this embodiment, cavity concave portions 34 A and 34 B having different shapes on the left and right around one pot 33 are formed in the mold. The cavity recess 34A has the configuration described with reference to FIG. 11, and becomes a transfer molding cavity CA during clamping (see FIG. 18). Moreover, the cavity 34B is the structure demonstrated with reference to FIG. 14, and becomes the cavity CB for transfer molding at the time of clamping (refer FIG. 18).

Next, a transfer molding process and a compression molding process (control process by the control unit 130) performed simultaneously using the resin mold apparatus 100 will be described with reference to FIGS. 17 to 19 are schematic cross-sectional views of the press part 110, which is a main part of the resin molding apparatus 100, for explaining the operation. In addition, the workpiece | work W in a compression molding process process has passed through the transfer molding process process.

17, on the cavity recess 34A side where the transfer molding process is performed, the lower movable pin 24 is retracted from the runner gate 38, and the opening / closing mechanism 23 is in the "open" position. On the other hand, on the cavity recess 34B side where the compression molding process is performed, the lower movable pin 24 (closing pin) enters the gate of the runner gate 38, and the opening / closing mechanism 23 is in the "closed" position. The cavity recess 34A side may be set to the “open” state and the cavity recess 34B side may be set to the “closed” state using a mold member carved into a desired shape instead of the opening / closing mechanism 23.

As shown in FIG. 17, the release film 43, the workpiece W, and the resin R are prepared (set) while the mold 30 is opened. Here, the nozzle head 10 holding the transfer molding resin supplies the resin R into the pot 33, and the nozzle head 10 holding the compression molding resin supplies the resin R onto the workpiece W.

Subsequently, the lower mold 32 is raised and closed so as to be in the state shown in FIG. By closing the mold, the pot 33, the cull 42, the runner gate 38, and the cavity CA communicate with each other on the cavity CA side. On the other hand, by closing the mold, a cavity CB is formed on the cavity CB side, but this cavity CB is blocked from the pot 33, the cull 42, and the runner gate 38 by the lower movable pin 24.

Subsequently, as shown in FIG. 19, the plunger 52 is raised while the workpiece W is clamped by the clamper 36, and the resin R melted in the pot 33 is passed through the cull 42 and the runner gate 38 to the cavity CA. It is made to pump and it fills in cavity CA. On the other hand, while the workpiece W carried into the mold 30 is clamped by the clamper 36, the cavity piece 35 is relatively moved so as to reduce the volume of the cavity CB, and the cavity CB is filled with the resin R.

Then, the molten resin R is heated and cured while raising the plunger 52 as necessary to hold the inside of the cavity CA, whereby the LED reflector is substantially completed. On the other hand, the molten resin R is heated and cured while raising the lower mold 32 as necessary to maintain the pressure in the cavity CB, whereby the LED lens is substantially completed. In this way, by changing the switching state of the opening / closing mechanism 23 between the left and right of the pot 33, transfer molding and compression molding can be simultaneously performed in one press part 110.

(Fourth embodiment)
In the first, second, and third embodiments, the case where the cavity recess 34 (cavity C) is provided in the upper mold 31 has been described. In the present embodiment, a case where a cavity recess 34 (cavity C) is provided in the lower mold 32 will be described.

The press part 110 which is the principal part of the resin mold apparatus 100 in this embodiment is demonstrated with reference to FIG. The mold 30 according to this embodiment has a configuration in which a cavity recess 34 is provided in the lower mold 32 with the configuration of the above-described embodiment described with reference to FIG. Yes. However, even in the configuration of the present embodiment, an opening / closing mechanism may be provided so that the resin does not flow to the pot 33.

Next, a transfer molding process using the resin mold apparatus 100 (control process by the control unit 130) will be described with reference to FIGS. 20 and 21 are schematic cross-sectional views of the press part 110, which is a main part of the resin mold apparatus 100, for explaining the operation.

As shown in FIG. 20, in a state where the mold 30 is opened, the release film 43 is sucked and held on the lower parting surface. Further, the workpieces W are respectively loaded (set) on the workpiece support portions 53 arranged on both sides of the center insert 51, and are sucked and held by a suction mechanism (not shown). Then, the nozzle head 10 holding the transfer molding resin (liquid resin) is moved to the pot position, and the resin R (transfer molding resin) is supplied into the pot 33 by the nozzle head 10.

When the resin cannot be pushed into the pot 33 like a liquid resin, the recess of the release film 43 of the pot 33 before the resin is supplied is formed by the recess formation by the suction in the pot 33 and the fixing by the outer periphery suction of the pot 33. It may be formed or may be formed by pressing a jig. Moreover, when supplying tablet resin, after fixing the outer periphery of the pot 33 by suction, you may make it accommodate in the pot 33 so that the release film 43 may be extended by pushing in tablet resin.

Subsequently, the lower mold 32 is raised and closed so as to be in the state shown in FIG. By closing the mold, the pot 33, the cull 42, the runner gate 38, and the cavity C communicate with each other. Next, the plunger 52 is lifted while the workpiece W is clamped by the clamper 36, and the resin R melted in the pot 33 is pumped to the cavity C through the cull 42 and the runner gate 38 and filled into the cavity C. Then, the molten resin R is heated and cured while raising the plunger 52 as necessary to hold the inside of the cavity C, whereby the molded product is substantially completed.

Next, a compression molding process (control process performed by the control unit 130) using the resin mold apparatus 100 will be described with reference to FIGS. 22 to 24 are schematic cross-sectional views of the press part 110, which is a main part of the resin molding apparatus 100, for explaining the operation.

22, the release film 43 and the work W are set in a state where the mold 30 is opened. Then, the nozzle head 10 holding the compression molding resin (liquid resin) is moved to the cavity position, and the resin R (compression molding resin) is supplied into the cavity C by the nozzle head 10.

Subsequently, the lower mold 32 is raised and closed so as to be in the state shown in FIG. By closing the mold, the pot 33, the cull 42, the runner gate 38, and the cavity C communicate with each other. Here, the workpiece W is clamped by the clamper 36 so that the parting surface of the cavity piece 35 is positioned at the molded product. At this time, the resin R is pushed out from the cavity C to the pot 33 side.

Next, as shown in FIG. 24, in the state where the cavity piece 35 is in the molding position, the molten resin R is heated and cured while raising the plunger 52 as necessary in order to hold the inside of the cavity C, and the molded product is substantially finished. Complete. According to this, in compression molding, the molding pressure can be adjusted (pressurized or depressurized) by the action of the plunger in addition to the action of the cavity piece. In place of the pot 33 and the plunger 52, a concave dummy cavity may be provided.

As described above, according to the resin molding apparatus 110, transfer molding and compression molding can be performed with only one apparatus in the same manner as the resin molding apparatus 100, and the above-described effects can be achieved. The effect by having been arrange | positioned at a lower mold | type can also be show | played. For example, even a resin having a low viscosity such as a liquid silicone resin can be retained in the cavity recess 34. Further, even a granular resin such as a granular resin can be supplied into the cavity recess 34 without any gap, and the flow of the resin during molding can be minimized to prevent the wire flow.

In each embodiment described above, the cavity C may be disposed in any mold of the upper mold 31 and the lower mold 32. For example, it is good also as a structure which arrange | positions the cavity C of 4th Embodiment in the upper mold | type 31 side. Moreover, the structure by which resin R is extruded to the pot 33 side like 4th Embodiment can also be implemented in other embodiment.

In the above-described embodiment, the configuration example in which transfer molding and compression molding are switched by the opening / closing mechanism 23 has been mainly described. However, by exchanging only a partial configuration of the mold 30, transfer molding and compression molding can be performed. Any one of these moldings may be performed, or any molding may be performed by switching the mold 30 itself. According to this, compression molding can also be performed by switching the mold 30 of the molding apparatus that has already been introduced into the semiconductor manufacturing factory as a transfer molding apparatus.

In addition, it is possible to realize compression molding by adding a resin supply part of resin for compression molding in a transfer molding apparatus already introduced in a semiconductor manufacturing factory. For example, a conventional transfer molding device that has been used in the past often has a tablet resin supply unit. However, a liquid resin supply unit is added to the transfer molding device and the control program is modified. The compression molding can be performed by installing (setting) the molding mold 30 for compression molding on the press 110 (becomes the resin mold apparatus 100). According to this, it is possible to use a transfer molding apparatus that is not used only by partial modification, and it is possible to perform compression molding at a lower cost than when a new compression molding apparatus is introduced. It becomes like this. In other words, in the semiconductor manufacturing factory, the necessary number of production equipment will be introduced according to the amount of demand at that time, but it may not be used after introduction and may be stored dead. It becomes possible to reuse devices that have not been used.

In the above-described embodiment, the configuration example using the resin supply unit 120 illustrated in FIGS. 2 and 3 has been mainly described, but other configurations may be used. For example, the resin supply unit includes a tablet resin supply unit serving as a transfer molding resin supplied to the pot 33 and a liquid resin serving as a compression molding resin supplying the liquid resin supplied to the cavity C to the pot 33. The structure provided with both a supply part may be sufficient. In this case, the loader 210 may supply the tablet resin to the pot 33 and supply the liquid resin to the cavity C. Alternatively, the liquid resin may be supplied onto the workpiece W outside the press unit 110, and the workpiece W may be carried into the mold 30 to be supplied to the cavity C as a result.

Claims

A press section having a mold for performing resin molding on a workpiece; a resin supply section configured to hold a resin used for molding and supply the mold; and the press section and the resin A resin mold apparatus comprising: a control unit that controls the supply unit;
The press unit is configured to be able to drive the plunger in the mold including a pot configured to hold the resin supplied to the cavity and a plunger that pressure-feeds the resin in the pot to the cavity. ,
The control unit is configured to selectively execute a molding process for performing transfer molding and a molding process for performing compression molding, and performs the molding process selected and set based on an external input result. Configured as
In the transfer molding process, a resin for transfer molding is supplied to the pot, and a process for feeding the resin for transfer molding to the cavity by the plunger is executed. In the compression molding process, a resin for compression molding is used. Execute the process to supply to the cavity,
The resin supply unit is configured to be able to selectively supply the transfer molding resin and the compression molding resin to the mold according to the selected molding process. Resin mold equipment.
The resin mold apparatus according to claim 1,
The control unit is configured to continuously execute one of the set molding processes a set number of times.
In the resin mold device according to claim 1 or 2,
The press unit includes a cavity piece and a clamper surrounding the cavity piece, and includes the mold die in which the cavity piece moves relative to the clamper and the volume of the cavity changes.
The resin supply unit includes a resin holding unit that moves between the inside and the outside of the press unit to hold the resin,
In the transfer molding process, the resin holding part holding the transfer molding resin is moved to the pot position, and the resin for molding is supplied into the pot by the resin holding part,
In the compression molding process, the resin holding part holding the resin for compression molding is moved to the cavity position or the work position, and the resin holding part is used for compression molding on the work carried in the cavity or the mold die. A resin molding apparatus, wherein a resin is supplied.
In the resin mold device according to claim 3,
The clamper is formed with a runner gate that communicates the cavity and the pot,
The press section includes an opening / closing mechanism for opening / closing the runner gate,
The resin mold apparatus, wherein the opening / closing mechanism is in an “open” state during a transfer molding process and is in a “closed” state during a compression molding process.
In the resin mold device according to claim 3,
In the compression molding process, the resin pressure is adjusted by the plunger while the cavity piece is in the molding position.
The resin molding apparatus according to claim 3, 4 or 5,
A resin molding apparatus, wherein the resin holding portion is linearly passed through a cavity position and a pot position.
In the resin molding apparatus according to any one of claims 1 to 6,
The mold is formed with first and second cavities communicating from one pot.
The resin mold apparatus, wherein transfer molding is performed in the first cavity and compression molding is performed in the second cavity.
In the resin molding method using the resin molding apparatus according to any one of claims 1 to 7,
A resin molding method, wherein a compression molding process is performed after a transfer molding process on the same workpiece.
In the resin molding method using the resin molding apparatus according to any one of claims 1 to 7,
A resin molding method comprising performing a transfer molding process after a compression molding process on the same workpiece.
In the resin molding method using the resin molding apparatus according to any one of claims 1 to 7,
A resin molding method characterized by laminating a resin on a workpiece by performing at least one of a transfer molding process and a compression molding process a plurality of times on the same workpiece.