JP2016152305A - Molding mold, resin molding device and resin molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding mold capable of highly efficiently filling different or same resins into a narrow filling space part by performing transfer molding in parallel with compression molding to a plurality of filling space parts.SOLUTION: A first resin Rb is filled into an upper cavity 5b (a first filling space part) that varies a volume thereof by compression molding, and a second resin Ra is filled into a lower cavity 10b (a second filling space part) from a pot 9 by transfer molding. Pressurizing curing is performed in parallel while a predetermined resin pressure is applied to the first resin Rb and the second resin Ra which are melted.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a mold, a resin molding apparatus, and a resin molding method.

  For example, transfer molding or compression molding is used as a method of resin molding a semiconductor chip. The inventor has also developed a TCM (transfer compression mold) molding apparatus as a resin molding method in which a compression molding mechanism is incorporated in the transfer molding apparatus. In this device, when performing transfer molding, the cavity volume is secured sufficiently to encourage filling of the mold resin from the pot to the cavity, and after filling the resin, the cavity volume is compressed to the desired thickness, and finally, The molding resin can be molded back from the cavity to the pot side. Thereby, the problem that the mold resin does not easily flow into the narrow gap between the semiconductor chip and the cavity bottom can be solved only by transfer molding.

  For reference, the present applicant uses the same or different resins to supply the resin in the cavity and the resin in the pot, and clamps the work with a mold to melt the molten resin in the pot into the cavity. A resin molding method by transfer molding has been proposed in which the flow rate of the mold resin is suppressed and the load on the workpiece is reduced by melting and bonding with the resin in the cavity that is fed and melted (see Patent Document 1).

JP 2012-146770 A

However, even with the transfer molding, compression molding, or TCM (transfer compression mold) described above, a resin mold that satisfies the desired molding quality cannot be obtained in the following cases.
That is, when it is necessary to resin mold the same workpiece with a plurality of (for example, two types) mold resins, for example, a semiconductor chip mounted on one surface of the substrate is molded with a normal epoxy resin, and the other surface of the substrate is It is required to be sealed with a heat radiating resin. In this case, it is required to efficiently mold resin with different resin characteristics (fluidity, heating temperature, etc.) and to maintain the molding quality.

  Alternatively, when the entire mold is resin-sealed to fill the gap between the semiconductor chips while underfill molding a work in which a large number of semiconductor chips are flip-chip mounted on a large-sized substrate, There is a possibility that an unfilled area of resin may occur.

  Furthermore, for example, when molding a relatively large work such as ECU, FBGA, MAP, IGBT, etc. that requires a resin amount by transfer molding, the resin flow is large and the movement path is long. Due to the pressure feed, problems such as the flow of the wire of the semiconductor chip mounted on the substrate, which is the workpiece, occur, the terminal of the capacitor etc. bends due to the resin pressure, or the position shifts. Cheap.

  The present invention solves the above-described problems of the prior art, and by parallelly performing transfer molding and compression molding for a plurality of filling spaces, it is possible to efficiently fill different filling resins or the same resin into a narrow filling space. It is an object of the present invention to provide a simple mold and a resin mold apparatus and method capable of maintaining high molding quality by improving the resin filling property of various workpieces.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, in the mold, a plurality of filling spaces connected to a pot formed in one of the pair of molds are formed on either or both of the mold clamping surfaces, and the plurality of fillings are formed. The first resin is supplied onto the workpiece placed at the position corresponding to the space, and the second resin is supplied to the pot of the one mold that has been opened. The workpiece is clamped in between, the first resin is filled into the first filling space having a variable volume by compression molding, and the second resin is transferred from the pot by transfer molding to the second filling space. It is characterized in that pressure curing is performed in parallel while applying a predetermined resin pressure to each of the first resin and the second resin that have been filled in and melted.

  If the above mold is used, different resins or the same can be obtained by parallelly performing transfer molding in which resin pressure is easily applied to a plurality of filling spaces and compression molding that can be molded at any resin pressure and has a small resin flow amount. It is possible to efficiently fill the narrow filling space portion with the resin according to various works.

The first filling space and the second filling space may be formed on different clamp surfaces or the same clamp surface of the pair of molds that clamp the workpiece.
Thus, for example, the first filling space formed on different clamping surfaces of the mold dies is compression molded, and the second filling space is transferred and combined with different molding methods according to various molded products. Resin molding.

The first filling space is formed by a cavity piece and a clamper surrounding the cavity piece, and after the clamper clamps the workpiece in accordance with a clamping operation of the mold, the cavity piece becomes the first filling space. It is preferable to perform compression molding by relatively moving in the direction in which the volume of the portion is reduced.
Thereby, after the clamper clamps the workpiece with the first resin supplied onto the workpiece, the cavity piece presses the first resin by further clamping operation, and the volume of the first filling space portion is reduced. It can be filled by being moved relative to each other and can be compression-molded with an arbitrary resin pressure.

  If the cavity piece forming the first filling space is further provided with a second recess having a depth deeper than that of the first recess, for example, the light emitting element mounted on one surface of the substrate is replaced with the first recess. The resin part is molded with the first resin (transparent resin) filled in the lens, and the lens part can be compression-molded with the first resin (transparent resin) filled in the second recess. Transfer molding can be performed with a second resin (heat dissipating resin) filled in the filling space.

  The first filling space part and the second filling space part are formed on the same mold clamping surface, and the second resin passes through the through hole formed in the work from the pot to the second filling space part. It may be filled. In this case, when the semiconductor chip flip-chip connected to the substrate is resin-molded, the first resin supplied onto the substrate is compressed in the first filling space portion of the component existing around the semiconductor chip. The resin can be molded by molding, and the second resin can be filled into the second filling space through the through hole formed in the substrate from the pot, and underfill molding can be performed by transfer molding. Therefore, by applying an optimal molding method according to the shape of the workpiece and performing parallel processing, even a thin and narrow resin-filled space can be efficiently resin-molded.

The first filling space and the second filling space are formed on different mold clamping surfaces, respectively, and are added to the first filling space as the clamping operation of the mold proceeds. While the pressure space is formed and the decompression space is formed in the second filling portion, the cavity piece is relatively moved in the direction in which the volume of the first filling space portion is reduced, and the first resin is moved to the workpiece. The second filling in which the second resin in the pot is filled with the first resin and the second filling space is filled from the first filling space through the through hole provided in The space portion may be filled.
In this case, for example, a work in which a large number of semiconductor chips are flip-chip mounted on a large substrate is underfill-molded from the first filling space portion to the second filling space portion while the first resin is underfill molded between the semiconductor chips. Since the entire substrate is resin-sealed to the second filling space with the second resin so as to fill the gap, the resin filling property can be improved and the molding quality can be maintained even for a thin and large workpiece.

The mold clamping surface including the first filling space is preferably covered with a release film.
As a result, the mold clamping surface including the first filling space portion to be compression-molded is covered with the release film, so that the first resin does not leak from the gap between the cavity piece and the clamper, and mold maintenance is performed. Work can be reduced.

  In the resin mold apparatus provided with any of the above-described mold dies, the resin filling property can be improved according to various workpieces and high molding quality can be maintained.

  In the resin molding method, a mold mold is prepared in which a plurality of filling space portions connected to a pot formed in one mold are formed on either or both mold clamp surfaces of a pair of molds. A step of supplying a first resin onto a workpiece placed at a position corresponding to the filling space, and supplying the first resin to the pot of the one mold that has been opened. The workpiece is clamped between the one mold and the other mold, the first resin is filled into the first filling space having a variable volume by compression molding, and the second resin is filled. A resin molding step of filling the second filling space portion by transfer molding from the pot and performing pressure curing in parallel while applying a predetermined resin pressure to the melted first resin and second resin, respectively. Characterized by having That.

  The first resin filled with the first resin with variable volume by compression molding, and the second resin filled with the second resin by transfer molding from the pot, respectively, and melted. In addition, since pressure curing is performed in parallel while applying a predetermined resin pressure to each of the second resins, it is possible to improve resin filling properties and molding quality to various workpieces.

  Different resins may be used for the first resin and the second resin. According to this, resin suitable for manufacturing cost and molding quality can be selected and resin-molded according to the product.

It is preferable that the first filling space portion partitioned by the workpiece is filled with the first resin, and the second filling space portion is filled with the second resin, and the heat curing is performed in parallel.
Therefore, different molding methods can be used on both surfaces of the workpiece to improve the resin filling property and efficiently mold the resin. Further, by superposing the workpieces, different or the same workpiece can be resin-molded by one resin mold.

The first filling space portion partitioned by the work is formed while forming a pressurizing space in the first filling space portion and forming a decompression space in the second filling space portion. Resin fills the second filling space through the through hole provided in the workpiece by reducing the volume of the first filling space, and fills the second filling space filled with the first resin. The second resin may be filled and heat curing may be performed in parallel. As a result, underfill molding is performed by the first resin that is compression-molded on the semiconductor chip flip-mounted on one surface of the substrate, and transfer molding is performed between the semiconductor chips by the second resin.
Therefore, it is possible to maintain high molding quality by improving the resin filling property with respect to a thin large-sized workpiece on which a semiconductor chip is flip-chip mounted.

By performing transfer molding and compression molding in parallel for a plurality of filling spaces, it is possible to provide a mold that can efficiently fill a narrow filling space with different resins or the same resin.
In addition, it is possible to provide a resin molding apparatus and method that are equipped with the above mold dies and can improve the resin filling property to various workpieces and maintain high molding quality.

It is a top view which shows the example of a layout structure of the resin mold apparatus. 6 is a cross-sectional view illustrating a molding operation of the mold according to the first embodiment. FIG. It is a metal mold | die sectional view explaining the resin mold operation | movement of the workpiece | work from which a form differs from Example 1. FIG. It is sectional drawing explaining the resin mold operation | movement of the mold metal mold | die which concerns on another example. It is sectional drawing explaining the resin mold operation | movement of the mold metal mold | die which concerns on another example. It is sectional drawing explaining the resin mold operation | movement of the mold metal mold | die which concerns on another example. It is sectional drawing explaining the resin mold operation | movement of the mold metal mold | die which concerns on another example.

Hereinafter, preferred embodiments of a mold, a resin molding apparatus, and a resin molding method according to the present invention will be described in detail with reference to the accompanying drawings.
First, the schematic configuration of the resin molding apparatus will be described with reference to the layout diagram of FIG. A workpiece resin supply unit A that supplies workpieces (resin substrates, lead frames, semiconductor wafers, carriers, etc.) that are molded products and supplies the second resin Ra into the pot, and supplies the first resin Rb onto the workpiece. A resin mounting part B, a press part C provided with a mold, a molded product storage part D for storing a molded product, and the like are provided. Although two press parts C are provided, one may be sufficient and three or more may be provided.
Further, the workpiece resin supply section A, the resin mounting section B, and the press section C are reciprocated between the loader E for loading the workpiece, the press section C, and the molded article storage section D. The unloader F which unloads is carried out (conveyance part).

  A workpiece and a second resin (for example, a resin tablet) and a first resin Rb (a sheet resin placed on the workpiece, etc.) are supplied to a mold die provided in the press section C by a loader E. The first resin Rb may be supplied onto the work carried into the press part C. Further, the press part C is provided with a transfer mechanism that clamps the work W by closing the mold and operates the plunger to pressure-feed molten resin in the pot to the filling space (cavity). Yes. The transfer mechanism is mounted on a movable platen that is driven up and down by a mold clamping mechanism, and includes a uniform pressure unit that moves up and down independently by a drive source different from the mold clamping mechanism. By operating the transfer mechanism, the plunger supported by the uniform pressure unit rises, and the second resin is transferred.

  In FIG. 2A, the schematic configuration of the upper mold 2 and the lower mold 3 constituting the mold 1 will be described. In the following description, the upper mold 2 is described as a fixed mold, and the lower mold 3 that moves toward and away from the upper mold 2 is described as a movable mold. The mold clamping mechanism drives a movable mold and moves up and down by a link mechanism such as a toggle link using a known electric motor as a drive source.

  In the upper mold 2, an upper mold cavity piece 5 is integrally provided on the upper mold base 4. An upper mold clamper 6 is suspended and supported by the upper mold base 4 via a coil spring 7 so as to surround the upper mold cavity piece 5. An upper die cull 6a is engraved at the pot facing portion of the upper die clamper 6. In addition, an inclined surface 6b and a bottom surface 6c are formed around the upper mold cavity piece 5 of the upper mold clamper 6 to form a side surface of the upper mold cavity 5b (first filling space). The bottom surface 6c forms the bottom surface of the cavity together with the lower surface 5a of the upper mold cavity piece 5 that moves relatively (see FIG. 2B). In response to the clamping operation of the mold 1, the upper mold clamper 6 clamps the workpiece W, and then the upper mold cavity piece 5 moves relative to the direction in which the volume of the upper mold cavity 5 b (first filling space) decreases. The compression molding operation is performed. Note that the compression molding operation may be performed by raising and lowering at least one of the upper mold cavity piece 5 and the upper mold clamper 6 by another drive source (motor, hydraulic pressure, etc.).

  Further, the release film 8 is sucked and held on the upper clamp surface including the upper mold 6a and the upper mold cavity 5b of the upper mold 2 (not shown because it is known to provide a suction hole on the suction surface). The release film 8 has heat resistance and is easily peeled from the mold surface, and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, Polypropylene film, polyvinylidine chloride and the like are preferably used. In addition, although it is preferable to use the release film 8 in order to release the resin from the mold surface and prevent resin leakage at the sliding portion, the release film 8 is not necessarily used. In this case, for example, it is preferable to provide a sealing mechanism for preventing resin leakage in order to prevent resin leakage from the gap between the upper mold cavity piece 5 and the upper mold clamper 6, and release of the resin from the mold surface. In order to ensure the above, it is preferable to perform a surface treatment with high mold releasability on the mold surface. As such a surface treatment, for example, a hard Cr plating, TiN coating, DLC coating, or a ceramic layer containing zirconium oxide or yttrium oxide can be used.

  In the lower mold 3, a pot 9 and a lower mold insert 10 are supported by a lower mold chase (not shown). A plunger 11 that is moved up and down by a transfer mechanism is inserted into the pot 9. A lower mold runner gate 10a and a lower mold cavity 10b (second filling space) continuous therewith are engraved on the lower mold clamping surface of the lower mold insert 10. The pot 9 is filled with the second resin Ra (for example, the resin tablet 12), and the melted second resin Ra is pressure-fed by the plunger 11 through the lower mold runner gate 10a to the continuous lower mold cavity 10b. Is done. (See FIG. 2B).

  Here, an example of the resin molding operation will be described. The workpiece W is assumed to have a semiconductor chip T mounted on both sides of the substrate K (for example, wire bonding connection). It is assumed that the workpiece W is supplied with the first resin Rb (for example, sheet resin) on the substrate K in the resin mounting portion B shown in FIG. As the first resin Rb, a solid resin, a granular resin, a liquid resin, or the like may be used in addition to the sheet resin. In the following, the same epoxy resin is used for both the first resin Rb and the second resin Ra.

  As shown in FIG. 2A, the resin tablet 12 (second resin Ra) is supplied to the pot 9 of the lower mold 3 of the mold 1 opened by the loader E (see FIG. 1), and the lower mold cavity The workpiece W supplied with the first resin Rb is placed at a position corresponding to 10b (second filling space). Note that the first resin Rb may be supplied after the workpiece W is placed on the lower mold 3 in the press part C. Further, it is assumed that the release film 8 is sucked and held in advance on the upper mold clamping surface.

As shown in FIG. 2 (B), the lower mold 3 is raised to clamp the work W between the upper mold 2 and the upper mold cavity 5b (first mold) whose volume is variable by compression molding the first resin Rb. The resin tablet 12 (second resin Ra) charged in the pot 9 is melted and melted by the plunger 10 through the upper die 6a and the lower die runner gate 10a. And then filled by transfer molding. The compression molding and transfer molding may be performed after completing the compression molding first, and may be performed while the transfer molding is performed in parallel while performing the compression molding. In this way, for example, the resin pressure is balanced in the upper mold cavity 5b that is the first filling space and the lower mold cavity 10b that is the second filling space disposed above and below the workpiece W. Thus, it is possible to simultaneously perform molding at a plurality of locations while preventing the workpiece W from being bent by the resin pressure.
Then, the resin mold is performed by applying pressure curing while applying the predetermined resin pressure while the upper mold cavity 5b and the lower mold cavity 9b are filled with the melted first resin Rb and second resin Ra.

By using the mold 1 described above, different resins can be obtained by parallelly performing transfer molding in which resin pressure is easily applied to a plurality of filling spaces and compression molding that can be molded at an arbitrary resin pressure and has a small resin flow amount. Alternatively, the same resin can be efficiently filled into a narrow filling space according to various workpieces W.
Moreover, in the resin mold apparatus, the resin filling property can be improved according to various workpieces W, and high molding quality can be maintained.

The workpiece W has been described as having a semiconductor chip mounted on both sides of the substrate (for example, wire bonding connection). However, the workpiece W on which the semiconductor chip is mounted on one surface of the substrate Resin molding may be performed in a state where the mold cavity 5b and the lower mold cavity 9b are respectively stacked on top and bottom so as to face each other. After the resin molding, the two workpieces W can be formed by a single resin molding operation by peeling off the bonded surfaces.
Further, the first resin Rb and the second resin Ra can be used in any form, any composition, and any performance. In this case, as a form of the resin, various forms of resins such as a solid resin, a granular resin, a sheet resin, and a liquid resin can be used in combination. In addition, the resin composition is a combination of types of resin materials such as epoxy resins and silicone resins, and the presence or absence or content of additives such as fillers, phosphors, pigments or dyes contained therein. Can be used. Furthermore, as the performance of the resin, it is possible to use a resin having any performance such as heat dissipation, shielding property, filling property or optical property (for example, transparency) in combination.
Moreover, you may use 1st resin Rb and 2nd resin Ra combining not only different resin but the resin of the same form and performance. Further, the present invention is not limited to batch molding of both surfaces of the workpiece, and a plurality of filling spaces provided on one surface may be resin-molded by different molding methods. Furthermore, even if the semiconductor chip is not mounted on both surfaces of the workpiece W, only one-side mounting may be performed.

Next, a case where a workpiece W according to another example is resin-molded will be described with reference to FIG. The configurations of the mold 1 and the resin molding apparatus are the same as those in FIG.
In FIG. 3A, the first semiconductor chip T1 is wire-bonded connected to the upper surface of the substrate K, which is the workpiece W, and the second semiconductor chip T2 is flip-chip connected to the lower surface. In the workpiece W, the first resin Rb (epoxy resin; liquid resin or the like) is supplied onto the substrate K including the first semiconductor chip T1, and the substrate K is placed on the lower mold 3. The pot 9 is loaded with a second resin Ra (epoxy resin; resin tablet 12 or the like). The mold die 1 is clamped while the second semiconductor chip T2 and the solder bumps BP provided around the second semiconductor chip T2 are in contact with the bottom surface of the cavity of the lower mold cavity 10b.

When the clamping operation of the mold 1 proceeds, the coil spring 7 of the upper mold clamper 6 is compressed and the upper mold cavity piece 5 moves relatively downward, and the bottom face 6c of the upper mold clamper 6 and the upper mold cavity piece. 5, the upper mold cavity 5b is formed, and the first resin Rb is filled in the upper mold cavity 5b. At this time, since the semiconductor chip T1 is resin-molded by compression molding with a small amount of resin flow at an arbitrary resin pressure, high-quality molding can be performed while preventing wire flow and deformation. In this case, since the solder bump BP is in contact with the bottom surface of the cavity in the lower mold cavity 10b, deformation (deflection) of the work W due to the resin pressure of the first resin Rb can be reduced.
Further, the second resin Ra melted in the pot 9 by operating the plunger 11 is pressure-fed to the lower mold cavity 10b through the upper mold cull 6a and the lower mold runner gate 10a to perform mold underfill. At this time, the second resin Ra is caused to flow in an arbitrary direction by transfer molding in the gap between the semiconductor chip T2 and the substrate K, whereby the gap in the thickness direction of the workpiece W (for example, the gap between the semiconductor chip T2 and the substrate K). It is possible to easily fill the gap) with the second resin Ra. For example, in compression molding, the resin flow is minimized and deformation of the wire can be prevented, but it may be difficult to fill the gap between the semiconductor chip T2 and the substrate K. Therefore, in this other example, by selectively using such merits in each molding in accordance with the respective purposes, a multifunctional and high-quality molded product can be efficiently molded.
Substrate mounting components (solder bumps BP, passive components, etc.) other than the semiconductor chip T2 may be sealed after the resin molding. Further, after the resin molding, an exposure process or a rewiring process of the substrate mounting component may be performed to form a high-performance chip in which semiconductor chips are stacked in multiple stages.

  FIG. 3B is a modification of FIG. 3A, and the workpiece W is the same, but the configuration of the mold 1 is different. That is, an elastic body 13 (for example, a sheet of silicon rubber, fluororubber, engineering plastic, or the like that can be elastically deformed and protected at its tip by being pushed into the bottom of the lower mold cavity 10b of the lower mold 3) ) Is laid. Since the surface of the mounting component (solder bump BP or the like) mounted on the lower surface of the workpiece W or the semiconductor chip T2 mounted on the flip chip can be exposed and molded, the post-process after the resin molding can be simplified. When the workpiece W is clamped to the mold 1, it is not only the solder bumps BP and the semiconductor chip T that are exposed to the elastic body 13 but also a substrate connected by the bumps BP.

  Next, another example of a mold and a method for producing a molded product using these will be described with reference to FIGS. Since the configuration of the resin molding apparatus is the same as that in FIG. 2, the configuration of the workpiece W and the mold for molding the workpiece W will be mainly described.

As a workpiece W to be molded by the mold shown in FIG. 4, a plurality of LED chips T (first semiconductor chips) are mounted on the upper surface of the substrate K, and the heat dissipation block BK and the connection terminal bumps BP are mounted on the lower surface of the substrate K. The one on which (mounting component) is mounted is used. In FIG. 4, the upper mold cavity piece 5 that forms the upper mold cavity 5b (first filling space) of the upper mold 2 is deeper than the lower surface 5a (first recess) that forms the first cavity 5b1. A deep second cavity 5b2 (second recess) is further formed. Further, the release film 8 is held by suction on the upper clamp surface including the upper mold cull 6a and the upper mold cavity 5b.
Further, as the first resin Rb filled in the upper mold cavity 5b (first filling space), a transparent resin (which may contain a phosphor) is used, and the first mold Rb filled in the lower mold cavity 10b is used. As the second resin Ra (resin in the pot), for example, an epoxy resin containing a high heat dissipation filler (magnesium oxide or alumina) is used.

  The workpiece W is placed on the lower mold 3 in a state where the heat dissipation block BK and the connection terminal bump BP are in contact with the bottom of the lower mold cavity 10b. Further, when the workpiece W supplied with the transparent resin (first resin Rb) is clamped by the mold 1 on the substrate including the LED chip T, the coil spring 7 of the upper mold clamper 6 is compressed and contracted. The piece 5 moves relatively downward so that the bottom surface 6c of the upper mold clamper 6 and the lower surface 5a of the upper mold cavity piece 5 are flush with each other, thereby forming a first cavity 5b1 and a second cavity 5b2 having a deeper depth. The upper mold cavity 5b thus filled is filled with a transparent resin (first resin Rb). At this time, since the resin amount corresponding to the cavity volume is supplied and the LED chip T is resin-molded by compression molding, molding can be performed with an appropriate resin pressure. In addition, as in this embodiment, when the LED chip T is used, an expensive resin is often used for the first resin Rb filled in the first filling space. According to compression molding, since such an expensive resin is molded without being filled in a cal or runner discarded in the manufacturing process, the molding cost can be reduced.

  Further, the heat radiation resin (second resin Ra) melted in the pot 9 by operating the plunger 11 is pressure-fed to the lower mold cavity 10b through the upper mold cull 6a and the lower mold runner gate 10a to connect the heat radiation block and the connection. Resin molding can be performed around the terminal bumps by transfer molding. In addition, the workpiece | work W is diced for every LED chip T (every 1PK) after resin molding, and is separated into pieces.

  Therefore, the LED chip T mounted on one surface of the workpiece W is resin-molded with the first resin Rb (transparent resin) filled in the first cavity recess 5b1 and filled in the second cavity recess 5b2. The lens part can be compression-molded with one resin Rb (transparent resin), and the second resin Ra (high heat dissipation) in which the other surface of the workpiece W is filled in the lower mold cavity 10b (second filling space). Resin). A protective element such as a chip capacitor that protects the LED chip T may be resin-molded together with the heat dissipation block BK and the connection terminal bump BP on the lower surface side of the workpiece W.

Next, another example of the mold will be described with reference to FIG. Since the configuration of the resin molding apparatus is the same as that in FIG. 2, the configuration of the workpiece W and the mold for molding the workpiece W will be mainly described.
In FIG. 5, the first filling space (first upper mold cavity) and the second filling space (second upper mold cavity) are formed on the same mold clamping surface (upper clamping surface). Yes. Further, the second resin Ra is filled into the second filling space (second upper mold cavity) from the pot 9 through the through hole H formed in the work W.

This will be specifically described below. In the workpiece W, the semiconductor chip T is flip-chip mounted on one surface (upper surface) of the substrate K, and the component CP is mounted around the semiconductor chip T.
In the upper mold 2, a second upper mold cavity piece 5 </ b> B is suspended and supported on the upper mold base 4 by a coil spring 7 </ b> B. It is supported by. An upper mold clamper 6 is suspended and supported by the upper mold base 4 by a coil spring 7A. The first upper mold cavity piece 5 </ b> A is inserted into the through hole of the upper mold clamper 6.

  The first filling space (first upper mold cavity 5b1) is formed by the first upper mold cavity piece 5A (cavity bottom) and the upper mold clamper 6 (cavity side and part of the bottom) surrounding it. Is done. The second filling space (second upper mold cavity 5b2) is formed by the first upper mold cavity piece 5B (cavity bottom) and the upper mold clamper 6 (cavity side part) surrounding it. Further, the release film 8 is adsorbed and held on the upper mold clamping surface including the first upper mold cavity 5b1 and the second upper mold cavity 5b2.

  The lower mold 3 is formed by engraving a lower mold cull 10 c and a lower mold runner 10 d connected to the lower mold 10 c around the pot 9. In the workpiece W, a substrate through hole KH communicating with the first upper mold cavity 5b1 is formed in the substrate K. The lower mold runner 10d communicates with the second upper mold cavity 5b2 through the substrate through hole KH of the workpiece W. In addition, an air suction path 10e communicates with the lower mold runner 10d, and a reduced pressure space is formed in the second upper mold cavity 5b2.

  Further, when the workpiece W supplied with the first resin Rb on the substrate including the component CP is clamped by the mold 1, air is sucked from the second upper mold cavity 5 b 2 through the substrate through hole KH and the air suction path 10 e. Thus, a decompression space is formed. In the upper mold clamper 6, the second coil spring 7B is pressed and contracted while the substrate is clamped, and the first upper mold cavity piece 5A moves relatively downward, so that the bottom surface of the upper mold clamper 6 and the first upper mold The cavity piece 5A is flush with the lower surface 5 and the first upper mold cavity 5b1 is filled with the first resin Rb, and the component CP is compression-molded with an arbitrary resin pressure.

  The second upper mold cavity piece 5B raises the plunger 11 while the first coil spring 7B is pressed and contracted while being in contact with the semiconductor chip T, and the molten second resin is poured into the pot 9. To the second upper mold cavity 5b2 through the lower mold cull 10c, the lower mold runner 10d connected thereto, and the substrate through hole KH communicating with the lower mold runner 10d. Thereby, the semiconductor chip T is underfill molded by transfer molding.

  As described above, when the workpiece W is resin-molded, the component CP existing around the semiconductor chip T has the first resin Rb supplied onto the substrate K as the first upper mold cavity 5b1 (first filling). The resin is molded by compression molding in the space portion. The second resin Ra melted from the pot 9 is transferred to the second upper mold cavity 5b2 through the lower mold cull 10c, the lower mold runner 10d connected thereto, and the substrate through hole KH communicating with the lower mold runner 10d. Underfill molded. Therefore, by applying the optimal molding method according to the form of the workpiece W, the other members can be compression-molded while underfilling the thin and narrow resin-filled space, and the resin molding can be performed efficiently. Can do.

Next, another example of the mold will be described with reference to FIG. Since the configuration of the resin molding apparatus is the same as that in FIG. 2, the configuration of the workpiece W and the mold for molding the workpiece W will be mainly described.
As the work W, for example, an ECU (Electronic Control Unit) board K used for in-vehicle use is used, and on one surface (upper surface in FIG. 6) which is a part of the ECU board K, a connector portion CN connected to an external connection terminal Is provided. An electronic component (semiconductor chip T) is mounted on the other surface (the lower surface in FIG. 6), which is another part of the ECU substrate K. The connector part CN is accommodated in a first filling space part (upper mold cavity 14b) formed on the upper mold clamping surface of the mold 1 and is resin-molded. As a result, the wiring portion that connects the substrate K and the connector portion CN in a state where the mold is clamped so as to expose the portion provided with the external terminal that is directed to the outside of the substrate K (right side in the drawing) and is connected to the outside. Is resin molded. Further, the electronic component (semiconductor chip T) is accommodated in a second filling space (lower mold cavity 10b) formed on the lower mold clamping surface and resin molded.

  In the upper mold 2, the upper mold cavity piece 5 is integrally supported by the upper mold base 4. An upper mold insert 14 is suspended and supported by the coil spring 15 on the upper mold base 4. The upper mold insert 14 is formed by engraving an upper mold cull 14a and an upper mold cavity 14b. The upper mold cavity 14b is formed by the cavity side part formed in the upper mold insert 14, a part of the cavity bottom part, and the lower surface 5a of the upper mold cavity piece 5 being flush with each other (cavity bottom part). The release film 8 is adsorbed and held on the upper mold clamping surface including the upper mold cull 14a and the upper mold cavity 14b of the upper mold 2. The configuration of the lower mold 3 is the same as that shown in FIG. The lower mold cavity 10b and the upper mold cavity 5b are partitioned by the ECU board K.

  On the lower clamp surface of the lower mold insert 10 constituting the lower mold 3, a lower mold runner gate 10a connected to the upper mold cull 6a and a lower mold cavity 10b connected to the lower mold runner gate 10a are provided.

  In the workpiece W, the first resin Rb (epoxy resin; liquid resin or the like) is supplied to one surface of the substrate K including the connector portion CN, and the substrate K is placed on the lower mold 3. The pot 9 is loaded with a second resin Ra (epoxy resin; resin tablet 12 or the like). The mold 1 is clamped while the semiconductor chip T mounted on the other surface of the substrate K is accommodated in the lower mold cavity 10b.

  When the clamping operation of the mold 1 proceeds, the coil spring 15 of the upper mold insert 14 is compressed and the upper mold cavity piece 5 moves relatively downward to move the bottom surface of the upper mold insert 14 and the upper mold cavity piece 5. The upper mold cavity 14b is formed with the lower surface 5a of the first mold Rb being filled with the first resin Rb. At this time, the connector portion CN is resin-molded by compression molding after adjusting to an arbitrary resin pressure. In this case, it is difficult for the connector portion CN to increase the resin pressure in order to prevent resin leakage to the external terminal surface side.

  Further, the second resin Ra melted in the pot 9 by raising the plunger 11 is pressure-fed to the lower die cavity 10b through the upper die 6a and the lower die runner gate 10a to perform transfer molding. At this time, the electronic component (semiconductor chip T) can be filled with the second resin Ra while applying an appropriate resin pressure by transfer molding. Then, pressure curing is performed in parallel while applying a predetermined resin pressure to the melted first resin Rb and second resin Ra. In this case, the first filling space portion is separated from the second filling space portion, and the electronic component and the connector portion CN are separately formed by transfer molding and compression molding, so that the first filling space portion is formed. It is possible to perform molding at a resin pressure suitable for each of the second filling space portions while varying the resin pressure. The first resin Rb and the second resin Ra are not limited to the same resin and may be molded using different resins.

Next, another example of the mold will be described with reference to FIG. Since the configuration of the resin molding apparatus is the same as that in FIG. 2, the configuration of the workpiece W and the mold for molding the workpiece W will be mainly described.
As the work W, a semiconductor chip T flip-chip mounted on one surface of the substrate K is used. Further, the substrate K on which the semiconductor chip T is mounted is provided with a substrate through hole KH penetrating the chip mounting surface. The semiconductor chip T is resin-molded while being in contact with the elastic body 13 laid at the bottom of the cavity of the lower mold cavity 10b (second filling space) formed in the lower mold 3.

The structure of the mold 1 is the same as that shown in FIG. 2, but a relief recess (step) 6 d is formed on the substrate contact surface of the upper mold clamper 6 constituting the upper mold 2.
Also, the lower mold insert 10 constituting the lower mold 3 is formed with an air supply path 10f communicating with the upper mold cavity 5b through the escape recess 6d and an air suction path 10e communicating with the lower mold cavity 10b through the escape recess 10g. Has been. With such a configuration, the mold 1 is configured such that a positive pressure (pressure air) can be applied to the upper mold cavity 5b and a negative pressure can be applied to the lower mold cavity 10b to reduce the pressure. .

  In the mold 1 shown in FIG. 7, the first resin Rb (for example, liquid resin) is supplied onto the substrate through hole KH of the substrate K facing the upper mold cavity 5b (first filling space), and the mold is opened. The resin tablet 12 (second resin Ra) is supplied to the pot 9 of the lower mold 3 and the workpiece W is placed on the lower mold 3. The upper mold cavity 5b (first filling space) and the lower mold cavity 10b (second filling space) are formed on different mold clamping surfaces via the workpiece W, respectively. The release film 8 is adsorbed and held on the upper mold clamping surface including the upper mold cavity 5b.

  The air suction operation is started from the air suction passage 10e formed in the lower die insert 10, and the lower die 3 is raised while the compressed air supply operation is started from the air supply passage 10f, and the workpiece is moved between the upper die 2 and the workpiece. When W is clamped, as shown in FIG. 7, a pressurization space is then formed in the upper mold cavity 5b, and a decompression space is formed in the lower mold cavity 10b. Due to such a pressure difference, the first mold Rb is sucked from the upper mold cavity 5b (first filling space) where the first resin Rb is pressurized through the substrate through hole KH provided in the substrate K. The second filling space) is filled. Specifically, underfill is performed in the gap between the semiconductor chip T and the substrate K. Next, after the underfill is properly performed, the state in which the pressure difference is generated is released, and the clamping operation of the mold 1 is advanced. Thus, the upper mold cavity piece 5 is in a state of supporting the upper surface of the substrate K. Subsequently, the resin tablet 12 (second resin Ra) loaded in the pot 9 is melted and is moved by the plunger 10 to the lower mold cavity 10b (second filling space) through the upper mold 6a and the lower mold runner gate 10a. It is pumped and filled by transfer molding. As a result, the second resin Ra is supplied to the outer periphery of the semiconductor chip T underfilled with the first resin Rb, so that the outer periphery of the chip T underfilled with a relatively inexpensive resin can be obtained. Resin molding can be performed.

  Thus, the resin mold is used for the outer periphery of the work W on which the semiconductor chip T is flip-chip mounted with an appropriate resin while minimizing the amount of use of an expensive resin with a small filler size used for underfill. Possible molding can be performed by one resin molding process in one mold 1. Thereby, it can shape | mold efficiently, suppressing the production cost, improving the resin filling property in an underfill, and maintaining high shaping | molding quality.

As mentioned above, as each Example, although the suitable form and each effect in this invention were demonstrated, this invention can be changed suitably and implemented as needed. For example, the resin supplied to the filling space (the upper mold cavity or the lower mold cavity) of the mold 1 is not limited to the form shown in the above-described embodiments. The workpiece W may be various substrates (resin substrate, ceramic substrate, metal substrate, etc.) on which components such as semiconductor chips, passive components (capacitors, etc.) and wiring structures are mounted. For example, a wafer W used for WLP (Wafer Level Package) molding or a carrier plate used for E-WLP (Embedded Wafer Level Package) affixing a semiconductor chip can be appropriately employed as the workpiece W. As an example of these combinations, a lead frame or a ceramic substrate on which an LED chip is mounted may be used. Also, the workpiece W does not necessarily have to be mounted with a semiconductor chip, and is a plate-like member such as a substrate or a lead frame that forms a resin molded portion such as a stiffener for fixing an LED reflector or a heat sink. There may be. As described above, the workpiece W may be any object used in various resin molding methods, and any workpiece W can obtain the above-described advantageous effects. The workpiece W is not limited to a map-type product in which a plurality of package regions are integrally connected to form one cavity (filling space portion), but a cavity (filling space portion) in which a plurality of independent package regions are connected. It may be a mold used for forming a matrix-type product that constitutes
In the mold 1, the upper mold 2 is a fixed mold and the lower mold 3 is a movable mold. However, the lower mold 3 may be a fixed mold and the upper mold 2 may be a movable mold, or both may be movable molds.

  The combinations of various transfer moldings and compression moldings described in the respective embodiments illustrated in the above-described examples can be used by being replaced or partially added.

A Workpiece resin supply part B Resin mounting part C Press part CP Component CN Connector part D Molded product storage part E Loader F Unloader HB Solder bump K Substrate KH Substrate through hole Rb First resin Ra Second resin T, T1, T2 Semiconductor chip W Workpiece 1 Mold 2 Upper mold 3 Lower mold 4 Upper mold base 5 Upper mold cavity piece 5A First upper mold cavity piece 5B Second upper mold cavity piece 5a Lower surface 5b, 14b Upper mold cavity 5b1 First One upper mold cavity 5b2 Second upper mold cavity 6 Upper mold clamper 6a Upper mold cull 6b Inclined surface 6c Bottom surface 6d, 10g Relief recess 7,15 Coil spring 8 Release film 9 Pot 10 Lower mold insert 10a Lower mold runner gate 10b Lower mold cavite 10c lower die cull 10d under type runner 10e air suction passage 10f air supply passage 11 the plunger 12 resin tablet 13 elastic body 14 upper mold insert 14a the upper mold cull

Claims (12)

Among the pair of molds, a plurality of filling space portions connected to the pot formed in one of the molds are respectively formed on one or both of the mold clamping surfaces, and are placed at positions corresponding to the plurality of filling space portions. The first resin is supplied onto the workpiece to be placed, the second resin is supplied to the pot of the one mold that has been opened, and the work is clamped between the other mold,
The first resin fills the first filling space with variable volume by compression molding, and the second resin fills the second filling space by transfer molding from the pot and melts. A mold mold characterized by performing pressure curing in parallel while applying a predetermined resin pressure to each of the first resin and the second resin.   2. The mold according to claim 1, wherein the first filling space and the second filling space are respectively formed on different clamp surfaces or the same clamp surface of the pair of molds for clamping the workpiece.   The first filling space is formed by a cavity piece and a clamper surrounding the cavity piece, and after the clamper clamps the workpiece in accordance with a clamping operation of the mold, the cavity piece becomes the first filling space. The mold according to claim 1 or 2, wherein the mold is compressed by being relatively moved in a direction in which the volume of the portion is reduced.   The mold according to any one of claims 1 to 3, wherein the cavity piece forming the first filling space is further formed with a second recess having a depth deeper than the first recess.   The first filling space part and the second filling space part are formed on the same mold clamping surface, and the second resin passes through the through hole formed in the work from the pot to the second filling space part. The mold according to any one of claims 1 to 3, which is filled.   The first filling space and the second filling space are formed on different mold clamping surfaces, respectively, and are added to the first filling space as the clamping operation of the mold proceeds. While the pressure space is formed and the decompression space is formed in the second filling portion, the cavity piece is relatively moved in the direction in which the volume of the first filling space portion is reduced, and the first resin is moved to the workpiece. The second filling in which the second resin in the pot is filled with the first resin and the second filling space is filled from the first filling space through the through hole provided in The mold according to any one of claims 1 to 3, wherein the space is filled.   The mold die according to any one of claims 1 to 6, wherein a mold clamping surface including the first filling space is covered with a release film.   A resin mold apparatus comprising the mold according to claim 1. A step of preparing a mold mold in which a plurality of filling space portions connected to a pot formed in one mold among the pair of molds are respectively formed on either or both mold clamp surfaces;
A step in which the first resin is supplied onto the workpiece placed at a position corresponding to the filling space, and the first resin is supplied to the pot of the one mold that has been opened; and
The workpiece is clamped between the one mold and the other mold, and the first resin is filled into the first filling space having a variable volume by compression molding, and the second resin is filled with the second resin. A resin molding step of filling each of the second filling spaces by transfer molding from the pot and performing pressure curing in parallel while applying a predetermined resin pressure to each of the melted first resin and second resin. A resin molding method.   The resin molding method according to claim 9, wherein different resins are used as the first resin and the second resin.   The first filling space portion partitioned by the workpiece is filled with the first resin, and the second filling space portion is filled with the second resin, respectively, and heat curing is performed in parallel. The resin molding method according to claim 10.   The first filling space portion partitioned by the work is formed while forming a pressurizing space in the first filling space portion and forming a decompression space in the second filling space portion. Resin fills the second filling space through the through hole provided in the workpiece by reducing the volume of the first filling space, and fills the second filling space filled with the first resin. The resin molding method according to claim 9 or 10, wherein the second resin is filled and heat curing is performed in parallel.

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